U.S. patent application number 12/674459 was filed with the patent office on 2011-03-03 for organic device and method for manufacturing organic device.
This patent application is currently assigned to OMRON CORPORATION. Invention is credited to Hayami Hosokawa, Yoshitaka Tatara, Naru Yasuda, Naoki Yoshitake.
Application Number | 20110052130 12/674459 |
Document ID | / |
Family ID | 40428767 |
Filed Date | 2011-03-03 |
United States Patent
Application |
20110052130 |
Kind Code |
A1 |
Yoshitake; Naoki ; et
al. |
March 3, 2011 |
ORGANIC DEVICE AND METHOD FOR MANUFACTURING ORGANIC DEVICE
Abstract
An organic device has a substrate made of polymer, and a polymer
layer adhered on the substrate. A crystallization degree of an
adhesive surface with the polymer layer in the substrate is smaller
than a crystallization degree of an interior of the substrate. In a
manufacturing method for manufacturing an organic device including
a substrate made of polymer; and having a polymer layer adhered on
the substrate, the manufacturing method includes performing a low
crystallization process on an adhesive surface with the polymer
layer in the substrate to have a crystallization degree lower than
a crystallization degree of an interior of the substrate.
Inventors: |
Yoshitake; Naoki; ( Nara,
JP) ; Tatara; Yoshitaka; (Shiga, JP) ; Yasuda;
Naru; (Kyoto, JP) ; Hosokawa; Hayami; ( Kyoto,
JP) |
Assignee: |
OMRON CORPORATION
Kyoto-shi, Kyoto
JP
|
Family ID: |
40428767 |
Appl. No.: |
12/674459 |
Filed: |
August 27, 2008 |
PCT Filed: |
August 27, 2008 |
PCT NO: |
PCT/JP2008/065323 |
371 Date: |
February 22, 2010 |
Current U.S.
Class: |
385/130 ;
156/327; 428/413; 428/423.7; 428/447; 428/483 |
Current CPC
Class: |
B29K 2067/00 20130101;
B29C 66/1122 20130101; B29C 66/73774 20130101; B29C 66/91411
20130101; B29K 2023/12 20130101; B29K 2995/0018 20130101; B29C
66/73921 20130101; B29C 66/0244 20130101; B29C 66/71 20130101; B29C
66/71 20130101; B29C 66/71 20130101; B29C 66/71 20130101; Y10T
428/31511 20150401; B29C 66/91645 20130101; B29C 66/71 20130101;
G02B 6/1221 20130101; B29C 66/71 20130101; B29L 2031/3431 20130101;
B29C 66/0242 20130101; B29L 2011/0066 20130101; H04M 1/22 20130101;
B29K 2075/00 20130101; B29K 2079/08 20130101; Y10T 428/31797
20150401; B29K 2995/004 20130101; Y10T 428/31565 20150401; B29C
66/91921 20130101; B29C 65/8207 20130101; G02B 6/43 20130101; H04M
1/026 20130101; B29C 66/71 20130101; G02B 6/138 20130101; B29C
65/02 20130101; B29C 66/71 20130101; B29K 2995/0041 20130101; G02B
6/3604 20130101; Y10T 428/31663 20150401; B29C 66/45 20130101; B29B
13/023 20130101; B29C 66/737 20130101; B29K 2023/12 20130101; B29K
2067/003 20130101; B29K 2067/00 20130101; B29K 2033/08 20130101;
B29K 2023/06 20130101; H04M 1/0214 20130101; B29L 2031/767
20130101; B29C 66/0342 20130101; B29C 65/1406 20130101; B29K
2079/08 20130101; B29K 2023/18 20130101 |
Class at
Publication: |
385/130 ;
428/413; 428/447; 428/483; 428/423.7; 156/327 |
International
Class: |
G02B 6/10 20060101
G02B006/10; B32B 27/08 20060101 B32B027/08; B32B 7/12 20060101
B32B007/12 |
Foreign Application Data
Date |
Code |
Application Number |
Sep 6, 2007 |
JP |
2007-231990 |
Claims
1. An organic device comprising: a substrate made of polymer; and a
polymer layer adhered on the substrate, wherein a crystallization
degree of an adhesive surface with the polymer layer in the
substrate is smaller than a crystallization degree of an interior
of the substrate.
2. The organic device according to claim 1, wherein the
crystallization degree of the adhesive surface with the polymer
layer in the substrate is smaller than a crystallization degree of
a back surface on a side opposite to the adhesive surface of the
substrate.
3. The organic device according to claim 1, wherein the polymer
layer is an optical function layer having an optical function.
4. The organic device according to claim 1, wherein the polymer
layer is a light guide.
5. The organic device according to claim 1, wherein an intermediate
layer is arranged between the substrate and the polymer layer.
6. The organic device according to claim 1, wherein a primer
processing is performed on an adhesive surface with the polymer
layer or the intermediate layer of the substrate.
7. A manufacturing method for manufacturing an organic device
comprising: a substrate made of polymer; and a polymer layer
adhered on the substrate, the manufacturing method comprising:
performing a low crystallization process on an adhesive surface
with the polymer layer in the substrate to have a crystallization
degree lower than a crystallization degree of an interior of the
substrate.
8. The manufacturing method according to claim 7, wherein the
performing the low crystallization process comprises: a heating
stage of heating the substrate to higher than or equal to a
crystallization temperature, and a cooling stage of cooling the
adhesive surface with the polymer layer in the substrate after the
heating stage.
9. The manufacturing method according to claim 8, wherein the
adhesive surface with the polymer layer in the substrate and a back
surface thereof are both heated to higher than or equal to the
crystallization temperature in the heating stage, and both surfaces
are rapidly cooled in the cooling stage.
10. The manufacturing method according to claim 8, wherein at least
a back surface of the adhesive surface with the polymer layer in
the substrate and the back surface is heated to higher than or
equal to the crystallization temperature in the heating stage, and
only the adhesive surface is rapidly cooled in the cooling
stage.
11. An organic device manufactured through the manufacturing method
according to claim 7.
12. The organic device according to claim 2, wherein the polymer
layer is an optical function layer having an optical function.
13. The organic device according to claim 2, wherein the polymer
layer is a light guide.
14. The organic device according to claim 3, wherein the polymer
layer is a light guide.
15. The organic device according to claim 12, wherein the polymer
layer is a light guide.
16. The organic device according to claim 2, wherein an
intermediate layer is arranged between the substrate and the
polymer layer.
17. The organic device according to claim 3, wherein an
intermediate layer is arranged between the substrate and the
polymer layer.
18. The organic device according to claim 4, wherein an
intermediate layer is arranged between the substrate and the
polymer layer.
19. The organic device according to claim 12, wherein an
intermediate layer is arranged between the substrate and the
polymer layer.
20. The organic device according to claim 13, wherein an
intermediate layer is arranged between the substrate and the
polymer layer.
Description
TECHNICAL FIELD
[0001] The present invention relates to an organic device and a
method of manufacturing the organic device.
BACKGROUND ART
[0002] In recent years, optical communication network enabling
large capacity data communication at high speed is expanding. The
optical communication network is assumed to be mounted on a
consumer device in the future. An electrical input/output optical
data transmission cable (optical cable) capable of being used no
different from the present electrical cable is desired for the
application of large capacity data transfer at higher speed, noise
countermeasures, and data transmission between substrates in the
device. In view of flexibility, a light guide is desirably used for
the optical cable.
[0003] The light guide is formed by a core having a large index of
refraction and a clad having a small index of refraction arranged
in contact with the periphery of the core, and propagates the light
signal entered to the core while repeating total-reflection at the
boundary of the core and the clad. The light guide has flexibility
since the core and the clad are made of flexible polymeric
material.
[0004] In recent years, in particular, a flexible (similar to
electrical wiring) optical wiring mounted on bendable displays and
smaller and thinner consumer devices is desirably realized with the
light guide. That is, the light guide is desirably a film-form
light guide.
[0005] The number and the importance of the organic device using
polymer including the light guide are increasing year after year.
The organic device includes an optical memory, a liquid crystal
device, and the like. Such organic devices are often formed on a
substrate generally made of polymer.
[0006] In recent years, flexibility is demanded on the organic
device such as the light guide, electronic paper, or flexible solar
battery. In the organic device demanded with flexibility, the
adhesiveness between the substrate and the polymer layer greatly
influences a performance of the organic device.
[0007] In particular, the light guide having flexibility is
expected to be used in a narrow wiring of the electronic device
such as the portable telephone. Thus, the light guide is placed in
an ultra-bent state or an ultra-twisted state depending on the
usage state of the electronic device. An unexpected stress thus
concentrates between the light guide and the substrate, and the
optical characteristics of the light guide are greatly influenced
by stripping, and the like. Enhancement in the adhesiveness between
the substrate and the polymer layer (light guide) is thus an urgent
need in the light guide serving as the organic device.
[0008] In a general organic device, the adhesiveness between the
substrate and the polymer layer is sufficiently ensured by applying
primer on the substrate surface in the technique described in
patent document 1.
[0009] The technique described in patent document 1 is effective as
a means for enhancing the adhesiveness between the substrate and
the polymer layer in a general organic device. However, the
adhesiveness between the substrate and the light guide may not be
sufficiently ensured in the light guide placed under adverse
conditions such as ultra-bent state or ultra-twisted state. Thus,
if the light guide serving as the organic device is manufactured
using the technique described in patent document 1, the optical
characteristics of the light guide may degrade as the light guide
strips from the substrate.
[0010] The influence of the optical characteristics caused by the
stripping of the light guide from the substrate will be described
below.
[0011] In the optical module for light transmitting information
with the light guide as a medium, optical axis alignment of the
light guide and the light emitting element (or light receiving
element) is required on the light incident side end (or light exit
side end) of the light guide. High accuracy is demanded on the
positional relationship of the light emitting element (or light
receiving element) and the light guide to efficiently transmit
information. The optical axis alignment also influences the
coupling loss. The variation in the coupling loss leads to
degradation of the S/N ratio.
[0012] As shown in FIG. 23, the optical axes shift and the coupling
loss increases when the light guide 20 strips from the substrate 1.
As a result, the transmission characteristics of the light guide is
greatly influenced.
[0013] The light guide generally has a configuration of being weak
to local bending. As shown in FIG. 24, the local bending of the
light guide 20 occurs when the light guide 20 strips from the
substrate 1. This local bending increases the reflection angle of
the propagation light in the light guide 20, and the propagation
light leaks to the outside of the light guide. Thus, the loss by
the local bending increases, the coupling loss varies, and the S/N
ratio degrades.
Patent document 1: Japanese Unexamined Patent Publication "Japanese
Unexamined Patent Publication No. 2005-62424 (published Mar. 10,
2005)".
SUMMARY OF THE INVENTION
[0014] One or more embodiments of the present invention provides an
organic device in which a polymer layer is formed on a substrate
made of polymer, where the adhesiveness between the substrate and
the polymer layer can be enhanced, and a method of manufacturing
the organic device.
[0015] Characteristics strong to pulling can be ensured while
ensuring the adhesiveness of the substrate and the polymer layer
even when placed under an adverse condition of ultra-bent state or
ultra-twisted state by causing the adhesive surface of the
substrate with the polymer layer to have a crystallization degree
lower than the interior.
[0016] One or more embodiments of the present invention provides an
organic device including a substrate made of polymer and including
a polymer layer adhered on the substrate, wherein a crystallization
degree of an adhesive surface with the polymer layer in the
substrate is smaller than a crystallization degree of an interior
of the substrate.
[0017] Here, "crystallization degree" refers to the proportion of
the crystallized site in a specific region in the adhesive surface.
In other words, the crystallized site and the non-crystallized site
coexist in the adhesive surface, and the crystallization degree is
the proportion of the crystallized site with respect to the total
of the crystallized site and the non-crystallized site.
[0018] According to the above configuration, the crystallization
degree of the adhesive surface with the polymer layer in the
substrate is smaller than the crystallization degree of the
interior of the substrate, and thus satisfactory adhesiveness
between the substrate and the polymer layer is obtained. Thus,
according to the above configuration, the adhesiveness of the
substrate and the polymer layer can be ensured even when placed
under an adverse condition of ultra-bent state or ultra-twisted
state.
[0019] Furthermore, in the above configuration, the crystallization
degree differs for the adhesive surface with the polymer layer in
the substrate and the interior of the substrate, and thus the
crystallization degree of the interior of the substrate is
maintained large. A structure that is strong to pulling and the
like can be achieved by the above configuration. Therefore,
according to the above configuration, a pulling resistance property
can be enhanced in a structure in which the crystallization degree
of the adhesive surface is low to enhance the adhesiveness,
compared to a structure in which the crystallization degree is the
same for the adhesive surface with the polymer layer in the
substrate and the interior of the substrate, or the crystallization
degree is higher in the adhesive surface than the interior of the
substrate.
[0020] Advantages of one or more embodiments of the present
invention should become apparent from the following
description.
BRIEF DESCRIPTION OF THE DRAWINGS
[0021] FIG. 1 is a cross-sectional view showing a schematic
configuration of an organic device according to one embodiment of
the present invention.
[0022] FIG. 2 is a conceptual view for describing a low
crystallization process in one or more embodiments of the present
invention.
[0023] FIGS. 3(a) and 3(b) are explanatory views for describing the
method of low crystallization process of the substrate in the
organic device of FIG. 1.
[0024] FIG. 4 is a cross-sectional view showing another
configuration of the organic device according to one or more
embodiments of the present invention.
[0025] FIGS. 5(a) to 5(d) are explanatory views for describing the
method of low crystallization process of the substrate in the
organic device of FIG. 4.
[0026] FIG. 6 is a cross-sectional view showing a variant of the
organic device according to one or more embodiments of the present
invention.
[0027] FIG. 7 is a cross-sectional view showing a variant of the
organic device according to one or more embodiments of the present
invention.
[0028] FIG. 8 is a cross-sectional view showing a variant of the
organic device according to one or more embodiments of the present
invention.
[0029] FIG. 9 is a cross-sectional view showing a variant of the
organic device according to one or more embodiments of the present
invention.
[0030] FIGS. 10(a) and 10(b) show a schematic configuration of the
present organic device including a light guide serving as a polymer
layer, where FIG. 10(a) is a cross-sectional view taken at a plane
perpendicular to the light transmitting direction, and FIG. 10(b)
is a cross-sectional view taken at a plane parallel to the light
transmitting direction.
[0031] FIGS. 11(a) to 11(f) are cross-sectional views showing a
fabricating method (duplicating method) of the light guide using a
die.
[0032] FIGS. 12(a) to 12(e) are cross-sectional views showing a
fabricating method of the light guide using the dry etching
method.
[0033] FIG. 13 is a view showing a schematic configuration of the
optical module including the light guide.
[0034] FIG. 14 is a view schematically showing the state of light
transmission in the light guide.
[0035] FIG. 15(a) is a perspective view showing an outer appearance
of a foldable portable telephone including the light guide
according to the present embodiment, 15(b) is a block diagram of a
portion where the light guide is applied in the foldable portable
telephone shown in 15(a), and 15(c) is a perspective plan view of a
hinge portion in the foldable portable telephone shown in
15(a).
[0036] FIG. 16(a) is a perspective view showing an outer appearance
of a printing device including the light guide according to the
present embodiment, 16(b) is a block diagram showing main parts of
the printing device shown in 16(a), and 16(c) and 16(d) are
perspective views showing a curved state of the light guide when
the printer head is moved (driven) in the printing device.
[0037] FIG. 17 is a perspective view showing an outer appearance of
a hard disc recording and reproducing device including the light
guide according to the present embodiment.
[0038] FIGS. 18(a) and 18(b) are cross-sectional views showing a
schematic configuration of the organic device applied as an organic
light emitting element.
[0039] FIG. 19 is a cross-sectional view showing a schematic
configuration of the present organic device applied as a liquid
crystal panel cell.
[0040] FIG. 20 is a cross-sectional view showing a schematic
configuration of the present organic device applied as an organic
solar battery.
[0041] FIG. 21 is a cross-sectional view showing a schematic
configuration of the present organic device applied as a micro-lens
serving as the polymer layer.
[0042] FIG. 22 is a cross-sectional view showing a schematic
configuration of the present organic device applied as a print
wiring substrate.
[0043] FIG. 23 is an explanatory view describing the influence of
optical characteristics caused by the stripping of the light guide
from the substrate.
[0044] FIG. 24 is an explanatory view describing the influence of
optical characteristics caused by the stripping of the light guide
from the substrate.
DESCRIPTION OF SYMBOLS
[0045] 1 substrate [0046] 1a adhesive surface [0047] polymer layer
[0048] light guide
DETAILED DESCRIPTION
[0049] In embodiments of the invention, numerous specific details
are set forth in order to provide a more thorough understanding of
the invention. However, it will be apparent to one of ordinary
skill in the art that the invention may be practiced without these
specific details. In other instances, well-known features have not
been described in detail to avoid obscuring the invention. One
embodiment of the present invention will be described below.
[0050] The adhesiveness of the substrate and the polymer layer can
be ensured even when placed under an adverse condition of
ultra-bent state or ultra-twisted state by causing the adhesive
surface of the substrate with the polymer layer to have a
crystallization degree lower than the interior. The organic device
according to one or more embodiments of the present invention is an
organic device including a substrate made of polymer and in which a
polymer layer is adhered to the substrate, where the
crystallization degree of the adhesive surface of the substrate
with the polymer layer is smaller than the crystallization degree
of the interior of the substrate.
[0051] The result of reviewing the relationship between the
adhesiveness of the substrate with the polymer layer and the
crystallization degree of the substrate is shown in table 1. In
this review, the crystallization degree of the substrate is
measured using an X-ray diffraction apparatus. The review is made
using PI (polyimide), PET (polyethylene terephalate), and PP
(polypropylene) for the material of the substrate.
[0052] The adhesive force of the substrate and the polymer layer is
measured by a 90.degree. stripping test. The difference in the
crystallization degree in table 1 shows how much % the
crystallization degree of the adhesive surface of the substrate
reduced through the low crystallization process of causing the
adhesive surface of the substrate with the polymer layer to have
the crystallization degree lower than the interior (difference
between crystallization degree of before low crystallization
process and crystallization degree of after low crystallization
process). An adhesive force enhancement percentage in table 1 shows
how much % the adhesive force enhanced by the low crystallization
process of the substrate, with the adhesive force of the substrate
and the polymer layer measured when the low crystallization process
is not performed defined as 100%.
TABLE-US-00001 TABLE 1 Difference in Adhesive force crystallization
degree enhancement percentage PI 2% 23% PET 2% 62% PP 2% 70%
[0053] As apparent from table 1, the adhesive force with the
polymer layer is enhanced in the substrate where the adhesive
surface with the polymer layer is made lower than the interior by
2% (difference crystallization degree of before low crystallization
process and crystallization degree of after low crystallization
process) through the low crystallization process. In particular, if
the material of the substrate is PET (polyethylene terephalate) or
PP (polypropylene), the adhesive force with the polymer layer is
enhanced by about 60%.
[0054] FIG. 1 is a cross-sectional view showing a schematic
configuration of an organic device of the present embodiment
(hereinafter referred to as present organic device). As shown in
figure, the present organic device includes a substrate 1 made of
polymer, and a polymer layer 2. The polymer layer 2 is adhered on
the substrate 1. In the present organic device, the low
crystallization process of lowering the crystallization degree is
performed on an adhesive surface 1a of the substrate 1 with the
polymer layer 2. The "crystallization degree" herein refers to the
proportion of the crystallized site in a specific region of the
adhesive surface 1a. In other words, the crystallized site and the
non-crystallized site coexist in the adhesive surface 1a, and the
crystallization degree is the proportion of the crystallized site
with respect to the total of the crystallized site and the
non-crystallized site.
[0055] The low crystallization process of lowering the
crystallization degree refers to the process performed on the
substrate surface having a relatively high crystallization degree
to have the crystallization degree lower than the original
crystallization degree. That is, the adhesive surface 1a of the
substrate 1 has lower crystallization degree than the
crystallization degree of before being subjected to the low
crystallization process (i.e., crystallization degree of interior
of substrate 1). Therefore, the crystallization degree of the
adhesive surface 1a of the substrate 1 becomes smaller than the
crystallization degree of the interior of the substrate 1 by
performing the low crystallization process.
[0056] Therefore, in the present organic device, the adhesiveness
of the substrate 1 and the polymer layer 2 is satisfactory since
the low crystallization process is performed on the adhesive
surface 1a of the substrate 1. Thus, according to the present
organic device, the adhesiveness between the substrate 1 and the
polymer layer 2 can be ensured even when placed under an adverse
condition of ultra-bent state or ultra-twisted state.
[0057] Furthermore, in the present organic device, the primer
processing is preferably performed on the adhesive surface 1a of
the substrate 1 with the polymer layer 2. The adhesiveness between
the substrate 1 and the polymer layer 2 further is enhanced by
performing the low crystallization process and also performing the
primer processing on the contacting surface 1a, and an organic
device having higher reliability can be realized.
[0058] The method of manufacturing the present organic device has
characteristics in including a low crystallization step of
performing the low crystallization process of lowering the
crystallization degree to lower than the crystallization degree of
the interior of the substrate 1 with respect to the adhesive
surface 1a of the substrate 1 with the polymer layer 2. The low
crystallization step is implemented by a heating stage of heating
the substrate 1 to higher than or equal to a crystallization
temperature, and a cooling stage of cooling the adhesive surface 1a
after the heating stage. The low crystallization process of the
substrate 1 in the organic device shown in FIG. 1 is implemented by
the heating stage of heating both surfaces of the adhesive surface
1a of the substrate 1 with the polymer layer 2 and the back surface
thereof, to higher than or equal to a crystallization temperature,
and a cooling stage of rapidly cooling both surfaces after the
heating stage.
[0059] FIG. 2 is a conceptual view for describing the low
crystallization process. As shown in the figure, an amorphous state
in which the crystallization degree is reduced is obtained when the
adhesive surfaces 1a of the substrate 1 is heated to higher than or
equal to the crystallization temperature. When rapidly cooled
thereafter, the polymer molecules configuring the adhesive surface
1a of the substrate 1 remain in a state of low crystallization
degree without being relatively regularly lined. That is, the
crystallization degree of the adhesive surface 1a of the substrate
1 is relatively low after the heating, and such low state is
maintained even after rapid cooling. If the adhesive surface 1a of
the substrate 1 is heated to higher than or equal to the
crystallization temperature and then gradually cooled, the polymer
molecules configuring the adhesive surface 1a of the substrate 1
are again regularly lined and a state of high crystallization
degree is obtained.
[0060] The method of the low crystallization process of the
substrate 1 in the organic device shown in FIG. 1 will be described
based on FIGS. 3(a) and 3(b). FIGS. 3(a) and 3(b) are explanatory
views for describing the method of low crystallization process of
the substrate 1 in the organic device of FIG. 1.
[0061] As shown in FIG. 3(a), the substrate 1 is conveyed in a
substrate conveying direction A by a substrate conveying means. At
an upstream of the substrate conveying direction A, the adhesive
surface 1a and the back surface of the substrate 1 are heated by a
heater 3. The heating temperature by the heater 3 is higher than or
equal to the crystallization temperature. The "crystallization
degree" is the temperature at which the polymer molecules
configuring the substrate 1 start to be regularly lined and
crystallized.
[0062] In the low crystallization process of the substrate 1, the
adhesive surface 1a and the back surface of the substrate 1 are
cooled by a cooler 4 at the downstream of the heater 3 in the
substrate conveying direction A. The adhesive surface 1a and the
back surface of the substrate 1 thus have a crystallization degree
smaller than the crystallization degree obtained after heating.
[0063] The heater 3 and the cooler 4 are installed at the upstream
and the downstream in the substrate conveying direction A,
respectively, and the substrate 1 is conveyed to thereby complete
the substrate 1 subjected to the low crystallization process. In
the low crystallization process, the crystallization degree of the
adhesive surface 1a of the substrate 1 can be reduced through a
simple method of only heating and cooling by the heater 3 and the
cooler 4.
[0064] The shapes of the heater 3 and the cooler 4 are not limited
as long as the adhesive surface 1a of the substrate 1 can be heated
and cooled. For instance, the cooler 4 may be a roll-shape, as
shown in FIG. 3(b). In this case, in particular, the cooler 4 is
preferably made of a material having a relatively high thermal
conductivity. The heat of the substrate 1 generated by heating then
can be rapidly conducted to the cooler 4, and the cooling
efficiency by the cooler 4 can be enhanced.
[0065] The substrate 1 shown in FIG. 1 and FIGS. 3(a) and 3(b) have
a configuration in which the low crystallization process is
performed on both the adhesive surface 1a and the back surface
thereof. However, the substrate in the present organic device is
not limited to such configuration, and merely needs to have a
configuration in which the low crystallization process is performed
on at least the adhesive surface.
[0066] FIG. 4 is a cross-sectional view showing another
configuration of the present organic device. The organic device
shown in FIG. 4 has a configuration in which the crystallization
degree of the adhesive surface 1a of the substrate 1 with respect
to the polymer layer 2 is smaller than the crystallization degree
of the back surface 1b on the side opposite to the adhesive surface
1a of the substrate 1.
[0067] The tensile strength of the substrate 1 generally becomes
weaker as the crystallization degree of the substrate 1 becomes
lower. In the above configuration, the crystallization degree is
different for the adhesive surface 1a and the back surface 1b, and
the crystallization degree of the back surface 1b is maintained
large. Thus, the organic device shown in FIG. 4 has a structure
that is strong to pulling and the like. Therefore, the organic
device shown in FIG. 4 has an effect in that a pulling resistance
property is enhanced.
[0068] FIGS. 5(a) to 5(d) are explanatory views for describing the
method of low crystallization process of the substrate 1 in the
organic device of FIG. 4. The low crystallization process of the
substrate 1 in the organic device of FIG. 4 is realized by heating
at least the adhesive surface 1a of the adhesive surface 1a of the
substrate 1 with the polymer layer 2 and the back surface 1b
thereof to higher than or equal to the crystallization temperature
(heating step), and then performing the cooling step of rapidly
cooling only the adhesive surface 1a.
[0069] First, as shown in FIG. 5(a), only the adhesive surface 1a
of the substrate 1 is heated to higher than or equal to the
crystallization temperature by the heater 3 at the upstream of the
substrate conveying direction A of the substrate 1. The
crystallization degree of the adhesive surface 1a of the substrate
1 is thus relatively low after the heating by the heater 3.
[0070] As shown in FIG. 5(a), the cooler 4 is arranged at the
downstream in the substrate conveying direction than the heater 3,
and is faced to the adhesive surface 1a of the substrate 1. Thus,
in the low crystallization process of the substrate 1, only the
adhesive surface 1a of the substrate 1 is cooled by the cooler 4.
The back surface 1b of the substrate 1 is in a state in which a
relatively high crystallization degree is maintained without being
cooled. The adhesive surface 1a of the substrate 1 has smaller
crystallization degree than the crystallization degree of the back
surface 1b.
[0071] Therefore, the substrate 1 in which the crystallization
degree of the adhesive surface 1a is smaller than the
crystallization degree of the back surface 1b is completed by
installing the heater 3 and heating at least the adhesive surface
1a of the substrate 1, and installing the cooler 4 and cooling only
the adhesive surface 1a of the substrate 1 at the downstream of the
substrate conveying direction A. In the low crystallization
process, the crystallization degree of the adhesive surface 1a can
be made smaller than the crystallization degree of the back surface
1b through a simple method of only heating and cooling with the
heater 3 and the cooler 4.
[0072] When heating with the heater 3, at least the back surface 1b
of the substrate 1 needs to be heated, and both the adhesive
surface 1a and the back surface 1b of the substrate 1 may be heated
by the heater 3, as shown in FIG. 5(b). Furthermore, the adhesive
surface 1a of the of the substrate 1 may be cooled by the cooler 4,
and the back surface 1b of the substrate 1 may be heated by the
heater 4 at the downstream of the substrate conveying direction A,
as shown in FIG. 5(c).
[0073] The shapes of the heater 3 and the cooler 4 are not limited
as long as the adhesive surface 1a of the substrate 1 can be heated
and cooled. For instance, the cooler 4 may be a roll-shape, as
shown in FIG. 5(d). In this case, in particular, the cooler 4 is
preferably made of a material having a relatively high thermal
conductivity.
[0074] The present organic device is not particularly limited as
long as it has a configuration in which the polymer layer is
adhered to the substrate made of polymer. The configurations shown
in FIG. 6 and FIG. 7 may be adopted as a variant of the present
organic device. The organic device shown in FIG. 6 and FIG. 7 has a
configuration in which the polymer layer is surrounded by a
plurality of substrates. The polymer layer is generally weak with
respect to external environment. Since the polymer layer is
protected by the substrate in the organic device shown in FIG. 6
and FIG. 7, an environment resistance property is enhanced and the
reliability as the device is enhanced.
[0075] Specifically, the organic device shown in FIG. 6 is
configured to include two substrates 1 and 1'. The polymer layer 2
is sandwiched by the substrates 1 and 1'. The adhesive surfaces 1a
and 1'a of the substrates 1 and 1' with the polymer layer 2 are
subjected to the low crystallization process. The crystallization
degree of the adhesive surfaces 1a and 1a of the substrate 1 is
thus smaller than the crystallization degree of the interior of the
substrate 1.
[0076] The organic device shown in FIG. 7 is configured to include
four substrates 1 to 1'''. The substrates 1 to 1''' are arranged to
surround the polymer layer 2. The adhesive surfaces 1a to 1''' a of
the substrates 1 to 1''' with the polymer layer 2 are subjected to
the low crystallization process.
[0077] FIG. 8 is a cross-sectional view showing another variant of
the present organic device. The organic device shown in FIG. 8 has
a configuration in which the substrate is sandwiched by two polymer
layers. Specifically, the organic device shown in FIG. 8 is
configured to include the polymer layers 2 and 2'. The substrate 1
is sandwiched by the polymer layers 2 and 2'. In other words, the
back surface 1'b on the opposite side of the adhesive surface 1a
with the polymer layer 2 in the substrate 1 is the adhesive
surfaces with the polymer layer 2'. The adhesive surface 1a and the
back surface 1'b are subjected to the low crystallization process.
Thus, the crystallization degree of the adhesive surface 1a and the
back surface 1'b of the substrate 1 becomes smaller than the
crystallization degree of the interior of the substrate 1. As shown
in FIG. 8, higher density and miniaturization of the organic device
can be realized by using the back surface 1'b of the substrate 1
for the adhesive surface with the polymer layer 2'.
[0078] FIG. 9 is a cross-sectional view showing another further
variant of the present organic device. The organic device shown in
FIG. 9 has a configuration in which an intermediate layer 6 is
arranged between the substrate 1 and the polymer layer 2. The
adhesiveness of the substrate 1 and the polymer layer 2 can be
enhanced by arranging the intermediate layer 6.
[0079] The material of the intermediate layer 6 is not particularly
limited as long as it is a material that satisfies the adhesive
force between the intermediate layer 6 and the substrate 1 and the
adhesive force between the intermediate layer 6 and the polymer
layer 2>the adhesive force between the substrate 1 and the
polymer layer 2 (equation 1), and may be a heat curable resin or UV
curable resin.
[0080] From equation 1, the material of the intermediate layer 6
can be appropriately set according to the characteristics of the
materials of the substrate 1 and the polymer layer 2. For instance,
if the material of the substrate 1 is PI (polyimide) and the
material of the polymer layer 2 is acryl resin, the material of the
intermediate layer 6 is preferably silane modified epoxy resin. If
the material of the substrate 1 is PET (polyethylene terephalate)
and the material of the polymer layer 2 is acryl resin, the
material of the intermediate layer 6 is preferably polyester resin,
acryl resin, or urethane resin. If the material of the resin 1 is
PP (polypropylene) and the material of the polymer layer 2 is acryl
resin, the material of the intermediate layer 6 is preferably
polyethylene imine resin, polybutadiene resin, or urethane
resin.
[0081] (Regarding Organic Device to which One or More Embodiments
of the Present Invention is Applicable)
[0082] An organic device in which the polymer layer is an optical
function layer having an optical function is preferable as an
organic device to which one or more embodiments of the present is
applicable. The optical function layer includes a light guide, a
diffraction element, an electronic paper, and the like.
[0083] Flexibility of the device is particularly demanded on the
organic device in which such optical function layer is adhered to
the substrate. Thus, the adhesiveness of the optical function layer
and the substrate is directly related to the characteristics and
the reliability of the device. Therefore, through application of
one or more embodiments of the present invention to the organic
device including the optical function layer, the adhesiveness of
the substrate and the optical function layer is enhanced, and a
flexible optical function device (organic device) excelling in
characteristics and reliability can be realized.
[0084] The organic device to which one or more embodiments of the
invention can be applied will be specifically described below.
[0085] (1.1) Organic Device Serving as Light Guide
[0086] The present organic device may be an organic device in which
a light guide serving as the optical function layer is adhered to
the substrate made of polymer. First, the light guide and the
optical module including the light guide will be described
below.
[0087] (Configuration of Organic Device Serving as Light Guide)
FIGS. 10(a) and 10(b) show a schematic configuration of the present
organic device including a light guide 20 serving as a polymer
layer, where FIG. 10(a) is a cross-sectional view taken at a plane
perpendicular to the light transmitting direction, and FIG. 10(b)
is a cross-sectional view taken at a plane parallel to the light
transmitting direction. The light guide 20 has a configuration
including a column-shaped core 20a having the light transmission
direction as the axis, and a clad 20b arranged to surround the
periphery of the core 20a. The core 20a and the clad 20b are made
of material having translucency, and the index of refraction of the
core 20a is higher than the index of refraction of the clad 20b.
The light signal that entered the core 20a is transmitted in the
light transmission direction by repeating total reflection inside
the core 20a. In FIGS. 10(a) and 10(b), the longitudinal direction
(optical axis direction) of the light guide 20 is the X-axis
direction and the normal direction of the adhesive surface 1a of
the substrate 1 is the Y-axis direction at the vicinity of the end
of the light guide 20.
[0088] Glass, plastic, and the like can be used for the material
for forming the core 20a and the clad 20b, but a flexible material
having an elasticity of lower than or equal to 1000 MPa is
preferable to configure the light guide 20 having sufficient
flexibility. The material for configuring the light guide 20
includes resin material such as acryl series, epoxy series,
urethane series, and silicone series. The clad 20b may be
configured by gas such as air. Furthermore, similar effects are
obtained by using the clad 20b under a liquid atmosphere having a
smaller index of refraction than the core 20a.
[0089] Furthermore, as shown in FIG. 10(b), the end face of the
light guide 20 is not perpendicular to the light transmitting
direction, and is diagonally cut to form a light path conversion
mirror surface 20d. Specifically, the end face of the light guide
20 is inclined to be perpendicular to the XY plane and to form an
angle .theta. (.theta.<)90.degree. with respect to the
X-axis.
[0090] Thus, the signal light transmitted through the core 20a is
reflected at the light path conversion mirror surface 20d on the
light exit side of the light guide 20, and exit towards the optical
element from the light path conversion mirror surface 20d with the
advancing direction changed.
[0091] The inclined angle .theta. of the optical path changing
mirror surface 20d is normally set to 45.degree. so that the
alignment of the optical path changing mirror surface 20d and the
optical element is facilitated. The optical path changing mirror
may be obtained by externally attaching a mirror to the end of the
light guide 20.
[0092] The present organic device has a configuration in which the
light guide 20 is adhered to the substrate 1 made of polymer. The
low crystallization process is performed on the adhesive surface 1a
with the light guide 20 of the substrate 1. Thus, adhesiveness
between the substrate 1 and the light guide 20 can be sufficiently
ensured even under adverse conditions of ultra-bent state and
ultra-twisted state.
[0093] The film light guide is applied under a specific environment
of ultra-bent R=1 mmtwist 270.degree.. According to such
configuration, the separation between the substrate 1 and the light
guide 20 can be prevented even if stress concentrates under a usage
environment specific to the film light guide. Furthermore, the
separation between the substrate 1 and the light guide 20 can be
prevented even with respect to the reliability test specific to the
light guide of R=1 mm bendability resistance for one hundred
thousand times or 85.degree. C. 85RH % and leaving for 200 hours,
and hence a light guide having high reliability can be
realized.
[0094] For instance, if the present organic device serving as the
light guide is applied to the portable telephone, the light guide
can be installed in an area where ultra-bend and ultra-twist occurs
such as the hinge portion or a microscopic narrow portion of the
portable telephone. An effect in that the light transmission at the
area where ultra-bent and ultra-twist occurs becomes satisfactory
is obtained.
[0095] (Manufacturing Method of Organic Device Serving as Light
Guide)
[0096] The manufacturing method of the light guide includes the
following two manufacturing methods. One or more embodiments of the
present invention is applicable to all four manufacturing methods.
The manufacturing method of the present organic device serving as
the light guide will be specifically described below.
[0097] FIGS. 11(a) to 11(f) are cross-sectional views showing a
fabricating method (duplicating method) of the light guide using a
die. First, as shown in FIG. 11(a), the substrate 1 in which the
low crystallization process is performed on the adhesive surface 1a
with the light guide 20 is prepared.
[0098] As shown in FIG. 11(b), a resin B made up of ultraviolet
curable resin or heat curable resin is dropped onto the adhesive
surfaces 1a of the substrate 1. The resin B is a material that
configures the clad 20b of the light guide 20.
[0099] As shown in FIG. 11(c), the resin B is held down with a die
30 so that the resin B spreads between the die 30 and the substrate
1. As shown in FIG. 11(d), the resin B is curved by ultraviolet ray
irradiation or heating to form a lower clad layer 20'b. Thereafter,
as shown in FIG. 11(d), the resin B is cured by ultraviolet ray
irradiation or heating and the die 30 is separated from the lower
clad layer 20'b.
[0100] The die 30 is formed with a projecting portion 30a. The
resin B is held down with the die 30 so that the projecting portion
30a contacts the resin B. Thus, after the resin B is cured, a core
groove 20e formed by the projecting portion 30a is formed in the
formed lower clad layer 20'b. The material that configures the core
20a is filled and cured in the core groove 20e, thereby forming the
core 20a (see FIG. 11(e)).
[0101] As shown in FIG. 11(f), the resin B is dropped and spread
with a stamper on the lower clad layer 20'b and the core 20a. The
resin B is then cured to form an upper clad layer 20''b.
[0102] Through the procedures shown in FIGS. 11(a) to 11(f), the
light guide 20 including the core 20a, and the clad 20b (lower clad
layer 20'b and upper clad layer 20''b) surrounding the core 20a is
completed. The fabricating method (duplicating method) of the light
guide using the die shown in FIGS. 11(a) to 11(f) enables a great
number of duplicated articles to be fabricated from one die, and
the fabricating procedure is also simple. Thus, the productivity of
the light guide can be enhanced and lower cost can be realized.
Furthermore, even with a core of a shape where highly accurate
microscopic patterns and formations are difficult, the core can be
stably formed by manufacturing the die once.
[0103] FIGS. 12(a) to 12(e) are cross-sectional views showing a
fabricating method of the light guide using the dry etching method.
First, as shown in FIG. 12(a), the substrate in which the low
crystallization process is performed on the adhesive surface 1a
with the light guide 20 is prepared. A layer configured by a resin
B, which is a material of the clad 20b, and a layer configured by a
resin A, which is a material of the core 20A, are formed in such
order on the adhesive surfaces 1a of the substrate 1.
[0104] As shown in FIG. 12(b), a resist R is formed on the layer
configured by the resin A, and the resist R is covered and exposed
by a photomask F. After developing the resist R (after FIG. 12(c),
reactive ion etching (RIE) is performed until reaching the layer
configured by the resin B to form the core 20a (FIG. 12(d)).
Thereafter, the resist R is removed and the layer configured by the
resin B is formed, as shown in FIG. 12(e), to thereby complete the
light guide.
[0105] One or more embodiments of the present invention is
applicable to the manufacturing methods of the light guide shown in
FIGS. 11(a) to 11(f) and FIGS. 12(a) to 12(e). However, the
application of one or more embodiments of the present invention is
not limited to such two manufacturing methods, and is applicable as
long as it is a manufacturing method including a step of forming a
polymer layer serving as the light guide on the substrate surface.
One or more embodiments of the present invention is also applicable
to the manufacturing method of the light guide using direct
exposure method or photo-bleaching method.
[0106] (Configuration of Optical Module Including Light Guide)
[0107] FIG. 13 shows a schematic configuration of an optical module
100 including the light guide 20. As shown in the figure, the
optical module 100 includes a light transmission processing unit
102, a light reception processing unit 103, and the light guide
20.
[0108] The light transmission processing unit 102 has a
configuration including a light emitting drive portion 105 and a
light emitting portion (optical element) 106. The light emitting
drive portion 105 drives the light emission of the light emitting
portion 106 based on an electrical signal inputted from the
outside. The light emitting drive portion 105 is configured by a
light emission drive IC (Integrated Circuit). Although not shown in
the figure, the light emitting drive portion 105 includes an
electrical connecting part with respect to an electrical wiring for
transmitting the electrical signal from the outside.
[0109] The light emitting portion 106 emits light based on a drive
control by the light emitting drive portion 105. The light emitting
portion 106 is configured by a light emitting element such as VCSEL
(Vertical Cavity-Surface Emitting Laser). A light incident side end
of the light guide 20 is irradiated with the light emitted from the
light emitting portion 106 as a light signal
[0110] The light reception processing unit 103 has a configuration
including an amplifier 107 and a light receiving portion (optical
element) 108. The light receiving portion 108 receives the light
serving as a light signal exit from a light exit side end of the
light guide 20, and outputs an electrical signal through
photoelectric conversion. The light receiving portion 108 is
configured by a light receiving element such as PD
(Photo-Diode).
[0111] The amplifier 107 amplifies the electric signal outputted
from the light receiving portion 108 and outputs the same to the
outside. The amplifier 107 is configured by amplification IC, for
example. Although not shown, the amplifier 107 includes an
electrical connecting part with respect to the electrical wiring
for transmitting the electrical signal to the outside.
[0112] The light guide 20 is a medium for transmitting the light
exit from the light emitting portion 106 to the light receiving
portion 108.
[0113] FIG. 14 schematically shows the state of light transmission
in the light guide 20. As shown in the figure, the light guide 20
is configured by a column-shaped member having flexibility. A light
incident surface 21 is arranged at the light incident side end of
the light guide 20, and a light exit surface 22 is arranged at the
light exit side end.
[0114] The light exit from the light emitting portion 106 enters
from a direction perpendicular to the light transmission direction
of the light guide 20 with respect to the light incident side end
of the light guide 20. The incident light advances through the
light guide 20 by being reflected at the light incident surface 21.
The light that advances through the light guide 20 and reaches the
light exit side end is reflected at the light exit surface 22 and
exits in a direction perpendicular to the light transmission
direction of the light guide 20. The light receiving portion 108 is
irradiated with the exit light, and photoelectric conversion is
performed in the light receiving portion 108.
[0115] According to such configuration, the light emitting portion
106 serving as a light source can be arranged in a transverse
direction with respect to the light transmitting direction with
respect to the light guide 20. Thus, if the light guide 20 needs to
be arranged parallel to the mounting substrate surface for mounting
the light emitting portion 106 and the like, the light emitting
portion 106 is to be installed between the light guide 20 and the
mounting substrate surface so as to emit light in the normal
direction of the mounting substrate surface. With such
configuration, the mounting becomes easier than the configuration
of installing the light emitting portion 106 so as to emit light
parallel to the mounting substrate surface, and the configuration
is also more compact. This is because the general configuration of
the light emitting portion 106 has a size in the direction
perpendicular to the direction of emitting light greater than the
size in the direction of emitting light. Furthermore, application
can be made to the configuration of using a plane mounting light
emitting element in which the electrode and the light emitting
portion are in the same plane.
[0116] The optical module 100 of the present embodiment has a
configuration in which the signal light propagated through the
light guide 20 is reflected by the light exit surface 21 and guided
to the light receiving portion 108 (i.e., configuration of using
the light exit surface 22 as the reflection surface for changing
the optical path), but the configuration of the optical module 100
is not limited to such a configuration, and may be any
configuration as long as the signal light exit from the light exit
surface 22 can be received by the light receiving portion 108. For
instance, the light guide 20 may have a configuration in which the
light exit surface 22 does not function as the reflection surface,
and the signal light may exit in the light transmission direction
from the light exit surface 22. In this case, the light receiving
portion 108 is arranged such that the light receiving surface is in
a direction perpendicular to the substrate surface (i.e., direction
perpendicular to the light transmission direction) so as to receive
the signal light exit in the light transmission direction from the
light exit surface 22.
Application Example
[0117] The optical module 100 of the present embodiment can be
applied to the following application examples.
[0118] First, as a first application example, use can be made at a
hinge portion in a foldable electronic device such as a foldable
portable telephone, a foldable PHS (Personal Handyphone System), a
foldable PDA (Personal Digital Assistant), and a foldable notebook
computer.
[0119] FIGS. 15(a) to (c) show an example in which the light guide
20 is applied to a foldable portable telephone 40. In other words,
FIG. 15(a) is a perspective view showing an outer appearance of the
foldable portable telephone 40 incorporating the light guide
20.
[0120] FIG. 15(b) is a block diagram of a portion where the light
guide 20 is applied in the foldable portable telephone 40 shown in
FIG. 15(a). As shown in the figure, a control unit 41 arranged on a
body 40a side in the foldable portable telephone 40, an external
memory 42, a camera (digital camera) 43, and a display unit (liquid
crystal display) 44 arranged on a lid (drive portion) 40b side
rotatably arranged at one end of the body with the hinge portion as
a shaft are connected by the light guide 20.
[0121] FIG. 15(c) is a perspective plan view of the hinge portion
(portion surrounded with a broken line) in FIG. 15(a). As shown in
the figure, the light guide 20 is wrapped around a supporting rod
at the hinge portion and bent to thereby connect the control unit
arranged on the body side, and the external memory 42, the camera
43, and the display unit 44 arranged on the lid side.
[0122] High speed and large capacity communication can be realized
in a limited space by applying the light guide 20 to the foldable
electronic device. Therefore, it is particularly suitable in
devices where high speed and large capacity data communication is
necessary and miniaturization is demanded such as the foldable
liquid crystal display.
[0123] As a second application example, the light guide 20 is
applied to a device having a drive portion such as a printer head
in a printing device (electronic device) and a reading unit in a
hard disk recording and reproducing device.
[0124] FIGS. 16(a) to (c) show an example in which the light guide
20 is applied to a printing device 50. FIG. 16(a) is a perspective
view showing an outer appearance of the printing device 50. As
shown in FIG. 9(a), the printing device 50 includes a printer head
51 for performing printing on a paper 52 while moving in a width
direction of a paper 52, where one end of the light guide 20 is
connected to the printer head 51.
[0125] FIG. 16(b) is a block diagram of a portion where the light
guide 20 is applied in the printing device 50. As shown in the
figure, one end of the light guide 20 is connected to the printer
head 51, and the other end is connected to a body side substrate in
the printing device 50. The body side substrate includes control
means etc. for controlling the operation of each unit of the
printing device 50, and the like.
[0126] FIG. 16(c) and FIG. 16(d) are perspective views showing a
curved state of the light guide 20 when the printer head 51 is
moved (driven) in the printing device 50. As shown in the figures,
when the light guide 20 is applied to the drive portion such as the
printer head 51, the curved state of the light guide 20 changes by
the drive of the printer head 51 and each position of the light
guide 20 repeatedly curves.
[0127] Therefore, the optical module 100 according to the present
embodiment is suited for such a drive portion. High speed and large
capacity communication using the drive portion can be realized by
applying the optical module 100 to such drive portions.
[0128] FIG. 17 shows an example in which the light guide 20 is
applied to a hard disk recording and reproducing device 60.
[0129] As shown in the figure, the hard disk recording and
reproducing device 60 includes a disk (hard disk) 61, a head
(read/write head) 62, a substrate introducing portion 63, a drive
portion (drive motor) 64, and the light guide 20.
[0130] The drive portion 64 drives the head 62 along a radial
direction of the disk 61. The head 62 reads the information
recorded on the disk 61 and writes information on the disk 61. The
head 62 is connected to the substrate introducing portion 63 by way
of the light guide 20, and propagates the information read from the
disk 61 to the substrate introducing portion 63 as a light signal
and receives the light signal of the information to write to the
disk 61 propagated from the substrate introducing portion 63.
[0131] Therefore, high speed and large capacity communication can
be realized by applying the light guide 20 to the drive portion
such as the head 62 in the hard disk recording and reproducing
device 60.
[0132] (1.2) Organic Device Serving as Organic Light Emitting
Element or Liquid Crystal Panel Cell
[0133] FIGS. 18(a) and 18(b) are cross-sectional views showing a
schematic configuration of the present organic device applied as an
organic light emitting element. As shown in FIG. 18(a), an organic
light emitting element 110 includes a stacked structure in which a
polymer layer 111 configured by a conductive polymer and a light
emitting layer 112 are stacked in order on a substrate 1. As shown
in FIG. 18(b), the organic light emitting element 110 has a stacked
structure in which a buffer layer 113, an electrode layer 114, and
a light emitting layer 112 are stacked in order on the substrate 1.
In the organic light emitting element applied with one or more
embodiments of the present invention, the low crystallization
process is performed on the adhesive surface 1a of the substrate 1
in the stacked structure shown in FIGS. 18(a) and 18(b).
[0134] FIG. 19 is a cross-sectional view showing a schematic
configuration of the present organic device applied as a liquid
crystal panel cell. As shown in the figure, the liquid crystal
panel cell 120 has a configuration in which a liquid crystal layer
123 is sandwiched by the substrate 1 and the color filter 124. A
polymer layer 121 configured by a conductive polymer and an
orientation film 122 are formed in order on the substrate 1 towards
the liquid crystal layer 123. A polymer layer 125 configured by a
conductive polymer and an orientation film 126 are formed in order
on the color filter 124 towards the liquid crystal layer 123. In
the liquid crystal panel cell, the low crystallization process is
performed on the adhesive surface 1a with the polymer layer 121 in
the substrate 1.
[0135] Since the low crystallization process is performed on the
adhesive surface 1a of the substrate 1, the adhesiveness of the
polymer layer and the substrate is enhanced. According to such
configuration, the stripping of the substrate and the polymer layer
by the concentration of stress at the time of bend and twist can be
prevented and the anti-bendability is also enhanced. The stripping
of the substrate and the polymer layer due to heat generation in
the device operation can also be prevented.
[0136] In particular, when one or more embodiments of the present
invention is applied to the organic light emitting element or the
liquid crystal panel cell, the organic light emitting element or
the liquid crystal panel cell can be installed at areas where
bending and twisting are required such as a curved portion in a
flexible display.
[0137] (1.3) Organic Device Serving as Organic Solar Battery
[0138] FIG. 20 is a cross-sectional view showing a schematic
configuration of the present organic device applied as an organic
solar battery. As shown in the figure, an organic solar battery 130
includes two opposing substrates 1, 1', and has a configuration in
which an electrolyte layer 132 is sandwiched by the two substrates
1, 1'. The electrolyte solution configuring the electrolyte layer
132 contains titanium oxide (TiO.sub.2) and pigment.
[0139] Polymer layers 131, 131' configured by a conductive polymer
are formed on the surface on the electrolyte layer 132 side in the
substrates 1, 1'. The low crystallization process is performed on
the adhesive surfaces 1a, 1a' with the polymer layers 131, 131' in
the substrates 1, 1'.
[0140] In this configuration as well, the adhesiveness of the
substrates 1, 1' and the polymer layers 131, 131' is enhanced. In
particular, when one or more embodiments of the present invention
is applied to the organic solar battery, the organic solar battery
cell can be installed at areas where bending and twisting are
required such as a curved portion of a curtain, blinder, and the
like.
[0141] (1.4) Organic Device Serving as Micro-Lens
[0142] FIG. 21 is a cross-sectional view showing a schematic
configuration of the present organic device applied as a micro-lens
serving as the polymer layer. As shown in the figure, the present
organic device has a configuration in which a micro-lens 141
serving as a polymer layer is formed. The low crystallization
process is performed on the adhesive surfaces 1a with the
micro-lens 141 in the substrate 1.
[0143] The adhesiveness of the substrate 1 and the micro-lens 141
thus is enhanced. When applied as the micro-lens serving as the
polymer layer, the micro-lens can be used at areas where bending
and twisting are required.
[0144] The organic device shown in FIG. 21 is preferably
manufactured in the following procedures. In other words, (i)
prepare the substrate 1 performed with the low crystallization
process, and (ii) apply and cure the polymer that becomes the
material of the micro-lens 141 by inkjet on the adhesive surface 1a
of the substrate 1.
[0145] Through the use of the inkjet method, the organic device can
be more easily manufactured. The photomask does not need to be used
to form the micro-lens 141. Thus, resin such as resist (necessary
when using photomask) does not need to be used, and the micro-lens
can be manufactured at low cost.
[0146] (1.5) Organic Device Serving Print Wiring Substrate
[0147] FIG. 22 is a cross-sectional view showing a schematic
configuration of the present organic device applied as a print
wiring substrate. As shown in the figure, a print wiring substrate
150 has a configuration in which a wiring layer 151 made of
conductive polymer is printed on the substrate 1. The low
crystallization process is performed on the adhesive surfaces 1a
with the wiring layer 151 in the substrate 1.
[0148] The adhesiveness between the substrate 1 and the wiring
layer 151 can be sufficiently ensured even under adverse conditions
of ultra-bent state and ultra-twisted state. The stripping between
the substrate 1 and the wiring layer 151 due to concentration of
stress at the time of bend and twist can be prevented.
[0149] Thus, when the present organic device serving as the print
wiring substrate is applied to a portable telephone, the print
wiring substrate can be installed at areas where ultra-bend and
ultra-twist occur such as the hinge portion or the microscopic
narrow portion of the portable telephone. The organic electric
transmission at areas where ultra-bend and ultra-twist occur thus
becomes satisfactory.
[0150] The present invention is not limited to the embodiments
described above, and various modifications may be made within the
scope of the Claims. In other words, the embodiments obtained by
combining the technical means appropriately changed within the
scope of the Claims are also encompassed in the technical scope of
the invention.
[0151] In the organic device according to one or more embodiments
of the present invention, as described above, the crystallization
degree of the adhesive surface with the polymer layer in the
substrate is smaller than a crystallization degree of a back
surface on a side opposite to the adhesive surface of the
substrate.
[0152] The manufacturing method of the organic device according to
one or more embodiments of the present invention includes a low
crystallization step of performing the low crystallization process,
which is for lowering the crystallization degree to lower than the
crystallization degree of the interior of the substrate, on the
adhesive surface with the polymer layer in the substrate.
[0153] In the above configuration, the crystallization degree of
the adhesive surface with the polymer layer in the substrate is
smaller than the crystallization degree of the interior in the
substrate, and thus the adhesiveness of the substrate and the
polymer layer becomes satisfactory. Thus, the adhesiveness of the
substrate and the polymer layer can be ensured even when placed in
an adverse condition of ultra-bent state or ultra-twisted
state.
[0154] Further, in the organic device according to one or more
embodiments of the present invention, it is preferable that the
crystallization degree of the adhesive surface with the polymer
layer in the substrate is smaller than a crystallization degree of
a back surface on a side opposite to the adhesive surface of the
substrate.
[0155] According to the above configuration, the adhesiveness is
further enhanced between the polymer layer and the substrate.
[0156] Further, in the organic device according to one or more
embodiments of the present invention, the polymer layer is an
optical function layer having an optical function.
[0157] The organic device in which the optical function layer is
adhered to the substrate is particularly demanded flexibility of
the device. Thus, the adhesiveness between the optical function
layer and the substrate is directly related to the characteristics
and the reliability of the device. Therefore, the adhesiveness of
the substrate and the optical function layer is enhanced by
applying one or more embodiments of the invention to the organic
device including the optical function layer, and a flexible optical
function device (organic device) excelling in characteristics and
reliability can be realized.
[0158] Particularly, in the organic device according to one or more
embodiments of the present invention, the polymer layer is a light
guide.
[0159] The adhesiveness between the substrate and the light guide
can be sufficiently ensured even under an adverse condition of
ultra-bent state and ultra-twisted state. The stripping between the
substrate and the light thus can be prevented even if the stress
concentrates under a light guide specific usage environment.
[0160] Further, in the organic device according to one or more
embodiments of the present invention, an intermediate layer is
arranged between the substrate and the polymer layer.
[0161] According to the above configuration, the adhesiveness
between the substrate and the polymer layer further is enhanced
since an intermediate layer is arranged between the substrate and
the polymer layer.
[0162] Furthermore, in the organic device according to one or more
embodiments of the present invention, a primer processing is
performed on an adhesive surface with the polymer layer or the
intermediate layer of the substrate.
[0163] The adhesiveness between the substrate and the polymer layer
is further enhanced by performing the primer processing on the
contacting surface, and an organic device having higher reliability
can be realized.
[0164] One or more embodiments of the present invention provides a
manufacturing method of an organic device including a substrate
made of polymer and having a polymer layer adhered on the
substrate, the manufacturing method including the step of:
performing low crystallization process on an adhesive surface with
the polymer layer in the substrate to have a crystallization degree
lower than a crystallization degree of an interior of the
substrate.
[0165] The "low crystallization process" refers to the process
performed with respect to the substrate surface having a relatively
high crystallization degree so that the crystallization degree
becomes lower than the original crystallization degree.
[0166] According to the above configuration, an organic device in
which the adhesiveness between the substrate and the polymer layer
can be enhanced can be manufactured since the organic device
includes the low crystallization step of performing the low
crystallization process, which is for lowering the crystallization
degree to lower than the crystallization degree in the interior of
the substrate, on the adhesive surface with the polymer layer in
the substrate.
[0167] In the manufacturing method of the organic device according
to one or more embodiments of the present invention, the low
crystallization step includes, heating stage of heating the
substrate to higher than or equal to a crystallization temperature,
and cooling stage of cooling the adhesive surface with the polymer
layer in the substrate after the heating stage.
[0168] The "crystallization temperature" refers to the temperature
at which the polymer molecules configuring the substrate start to
regularly line and crystallize. According to the above
configuration, the low crystallization step includes a heating step
of heating the substrate to higher than or equal to the
crystallization temperature and a cooling step of cooling the
adhesive surface with the polymer layer in the substrate after the
heating step, and thus the polymer molecules configuring the
adhesive surface of the substrate remain in a state of low
crystallization degree without being relatively regularly lined if
the adhesive surface of the substrate is rapidly cooled after the
substrate is heated to higher than or equal to the crystallization
temperature. That is, the crystallization degree of the adhesive
surface of the substrate is relatively low after heating, and is
maintained in such low state even after rapid cooling. Thus, an
organic device in which the adhesiveness of the polymer layer and
the substrate is enhanced can be realized by adhering the polymer
layer to the adhesive surface.
[0169] In the manufacturing method of the organic device according
to one or more embodiments of the present invention, the adhesive
surface with the polymer layer in the substrate and a back surface
thereof are both heated to higher than or equal to the
crystallization temperature in the heating stage, and both surfaces
are rapidly cooled in the cooling stage.
[0170] Thus, the low crystallization process can be performed on
both surfaces of the adhesive surface and the back surface, of the
substrate.
[0171] In the manufacturing method of the organic device according
to one or more embodiments of the present invention, at least a
back surface of the adhesive surface with the polymer layer in the
substrate and the back surface is heated to higher than or equal to
the crystallization temperature in the heating stage, and only the
adhesive surface is rapidly cooled in the cooling stage.
[0172] A substrate, in which the crystallization degree of the
adhesive surface and the crystallization degree of the back surface
differ, thus can be realized.
[0173] One or more embodiments of the present invention provides an
organic device manufactured through the manufacturing method of the
organic device.
[0174] An organic device in which the adhesiveness between the
substrate and the polymer layer can be enhanced thus can be
realized.
[0175] Specific embodiments and examples described in above are
provided merely to clarify the technical contents of the present
invention and should not be interpreted in a narrow sense limiting
only to such specific examples, and it should be recognized that
embodiments obtained by appropriately combining the technical means
disclosed in the different embodiments within the spirit of the
invention and the scope of the accompanied Claims are also
encompassed in the technical scope of the invention.
[0176] The organic module according to one or more embodiments of
the present invention can enhance the adhesiveness of the substrate
and the polymer layer, and thus is applicable to a flexible optical
wiring serving as an in-device wiring mounted in a small and thin
commercial-off-the-shelf device.
[0177] While the invention has been described with respect to a
limited number of embodiments, those skilled in the art, having
benefit of this disclosure, will appreciate that other embodiments
can be devised which do not depart from the scope of the invention
as disclosed herein. Accordingly, the scope of the invention should
be limited only by the attached claims.
* * * * *