U.S. patent application number 12/853712 was filed with the patent office on 2011-02-24 for electronic component and manufacturing method thereof.
This patent application is currently assigned to TDK CORPORATION. Invention is credited to Kyung-Ku Choi, Tatsuo Namikawa, Takashi OHTSUKA, Hitoshi Yamaguchi.
Application Number | 20110044011 12/853712 |
Document ID | / |
Family ID | 43605234 |
Filed Date | 2011-02-24 |
United States Patent
Application |
20110044011 |
Kind Code |
A1 |
OHTSUKA; Takashi ; et
al. |
February 24, 2011 |
ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREOF
Abstract
The invention provides an electronic component and a
manufacturing method thereof that can achieve an improved adhesion
strength when the electronic component is solder-mounted onto an
external substrate and can thereby obtain considerably improved
electric properties and reliabilities, etc. An electronic
component, which is a capacitor 1, has: a circuit element 5a formed
on a substrate 2; an electrode layer 5b connected to the circuit
element 5a; passivation layers 6 and 8 that cover the electrode
layer 5b; and terminal electrodes 9a and 9b connected to the
electrode layer 5b via via-conductors Va and Vb formed through the
passivation layers 6 and 8, the terminal electrodes 9a and 9b being
formed to cover the side wall of the passivation layers 6 and 8.
Since the pad electrodes 9a and 9b are formed so as to cover the
passivation layers 6 and 8 across their uppermost surfaces and side
walls, the area of contact between the pad electrodes 9a and 9b and
the solder for solder-mounting increases, and the capacitor 1 can
consequently exhibit an improved adhesion strength.
Inventors: |
OHTSUKA; Takashi; (Tokyo,
JP) ; Choi; Kyung-Ku; (Tokyo, JP) ; Namikawa;
Tatsuo; (Tokyo, JP) ; Yamaguchi; Hitoshi;
(Tokyo, JP) |
Correspondence
Address: |
OLIFF & BERRIDGE, PLC
P.O. BOX 320850
ALEXANDRIA
VA
22320-4850
US
|
Assignee: |
TDK CORPORATION
Tokyo
JP
|
Family ID: |
43605234 |
Appl. No.: |
12/853712 |
Filed: |
August 10, 2010 |
Current U.S.
Class: |
361/728 ;
156/252 |
Current CPC
Class: |
H01L 2924/01005
20130101; H01L 23/3192 20130101; H01L 2924/01074 20130101; H01L
2924/30107 20130101; H01L 2924/09701 20130101; H01L 2924/01041
20130101; H01L 2924/01024 20130101; H01L 2924/01047 20130101; H01L
2924/01027 20130101; H01L 2924/01006 20130101; H01L 2924/0105
20130101; H01L 2924/01022 20130101; H01L 2924/01014 20130101; H01L
2924/01012 20130101; H01L 2924/14 20130101; H01L 2924/01038
20130101; H01L 2924/0104 20130101; H01L 2924/01042 20130101; H01L
2924/01056 20130101; H01L 2924/15788 20130101; H01L 23/3171
20130101; H01L 2224/04042 20130101; H01L 2924/01033 20130101; H01L
2924/01044 20130101; H01L 2924/01073 20130101; H01L 2924/01079
20130101; H01L 2924/01082 20130101; H01L 2924/01078 20130101; H01L
28/40 20130101; H01L 2924/014 20130101; H01L 2924/19041 20130101;
H01L 2924/01013 20130101; H01L 2924/01023 20130101; H01L 2924/01029
20130101; H01L 2924/01046 20130101; Y10T 156/1056 20150115; H01L
28/55 20130101; H01L 2924/01004 20130101; H01L 24/02 20130101; H01L
2924/15788 20130101; H01L 2924/00 20130101 |
Class at
Publication: |
361/728 ;
156/252 |
International
Class: |
H05K 7/00 20060101
H05K007/00; B32B 38/04 20060101 B32B038/04 |
Foreign Application Data
Date |
Code |
Application Number |
Aug 21, 2009 |
JP |
2009-192589 |
Claims
1. An electronic component comprising: a circuit element formed on
a substrate; an electrode layer connected to the circuit element; a
passivation layer that covers the electrode layer; and a terminal
electrode disposed on a top part of the passivation layer and
connected to the electrode layer via a via-conductor formed through
the passivation layer, wherein one end of the terminal electrode is
located on a side wall of the passivation layer.
2. The electronic component according to claim 1, wherein the
terminal electrode is formed such that the terminal electrode
extends from the top part of the passivation layer along the side
wall of the passivation layer and the one end of the terminal
electrode is in contact with the top surface of the substrate-side
end of the passivation layer side wall.
3. The electronic component according to claim 1, wherein the
terminal electrode extends from the top part of the passivation
layer along the side wall of the passivation layer, and also along
an edge portion of the substrate top surface.
4. The electronic component according to claim 3, wherein a part of
the edge portion of the substrate top surface is left
uncovered.
5. The electronic component according to claim 1, wherein the
passivation layer includes: a first passivation layer formed above
the substrate; and a second passivation layer formed on the first
passivation layer and inside the area where the first passivation
layer is formed.
6. The electronic component according to claim 5, wherein the
substrate side surface of the second passivation layer has a
smaller area than the terminal electrode side surface of the second
passivation layer.
7. A method for manufacturing an electronic component, comprising
the steps of: forming an electrode layer on a substrate; forming a
passivation layer that covers the electrode layer; forming a
via-conductor that extends through the passivation layer; and
disposing a terminal electrode so that the terminal electrode is
connected to the electrode layer via the via-conductor and extends
from a top part of the passivation layer along a side wall of the
passivation layer.
Description
CROSS-REFERENCES TO RELATED APPLICATIONS
[0001] The present application relates to and claims priority from
Japanese Patent Application No. 2009-192589, filed on Aug. 21,
2009, the entire disclosure of which is incorporated herein by
reference.
BACKGROUND
[0002] 1. Field of the Invention
[0003] The present invention relates to an electronic component and
a manufacturing method thereof.
[0004] 2. Description of Related Art
[0005] In recent years, together with the reduction in size of
electronic devices, an increasing number of electronic device
modules have been developed in which electronic components,
including active components such as semiconductor devices, e.g., an
IC chip (bare chip, die), for use in the electronic devices, and
passive components such as a capacitor (condenser), inductor,
thermistor and resistance, are mounted at a considerably higher
density than before.
[0006] Electronic components mounted in such modules have various
terminal electrode configurations, and known examples include the
configuration of a chip resistor shown in Patent Document 1, where
an external electrode is disposed to be connected to an element
electrode of the electronic component and the external electrode is
formed by multilayer plating so that it covers the edge portion of
the top and bottom surfaces as well as the side surface of the
electronic component itself. Another known example is a so-called
Land Grid Array (LGA) configuration where planar pad electrodes are
disposed on a substrate in a grid.
[0007] Patent document 1: Japanese Unexamined Patent Publication
No. 2005-191406
SUMMARY
[0008] When mounting an electronic component having a conventional
terminal electrode configuration as shown in Patent Document 1 onto
an external substrate such as a wiring board by soldering (reflow
soldering), the resulting solder fillet is likely to be in a flared
shape, extending outward from the external electrode of the
electronic component, which has been formed by plating to cover a
large area including the edge portion of the top and bottom
surfaces as well as the side wall of the electronic component, and
occupying a considerably larger area than the area that the element
itself of the electronic component occupies. Accordingly, the area
that is actually needed to mount the electronic component onto the
external substrate (actual mounting area) would be unduly large
relative to the form of the element of the electronic component,
and disposing multiple electronic components more densely with
narrower spaces would be difficult, resulting in limitations to the
much higher density mounting which is demanded for electronic
components.
[0009] Also, if the electronic component having such a terminal
electrode configuration is, for example, a capacitor (condenser),
it has an upper electrode formed on a dielectric layer and an
external electrode formed above them, and these electrodes are
thin-film electrodes occupying a large area, resulting in unwanted
floating inductance or floating capacitance in the circuit
including the electronic component. Furthermore, series resistance
is likely to increase. Accordingly, when the electronic component
is installed in an electronic device, the electric properties or
functions of the electronic device might be deteriorated by an
increase of ESL (equivalent series inductance) or ESR (equivalent
series resistance), which are unwanted parasitic elements for the
capacitor.
[0010] Meanwhile, in an electronic component having the
above-indicated LGA configuration, unlike the terminal electrode
configuration shown in Patent Document 1, a terminal electrode is
not extended (projected) out to the side wall of the substrate of
the electronic component, and thus, the amount of solder used when
soldering the electronic component having the LGA configuration
onto an external substrate is relatively small; however, a solder
fillet is not formed on the side wall of the substrate of the
electronic component, and accordingly, the mounting strength of the
electronic component (mechanical strength of adhesion to the
external substrate) is likely to be considerably low relative to
the case where a solder fillet is formed on the side wall.
Accordingly, depending on the mounting environment, the electronic
component would not be fixed in a desired state and stand straight
up, or tilt in the width-direction without being sufficiently
parallel to the external substrate, resulting in an increasing
possibility of even lower mounting strength of the electronic
component. Moreover, certain misalignment of the electronic
component would occur, and this might deteriorate the electric
properties or functions of the electronic device in which the
electronic component is installed.
[0011] In view of the above, an object of the invention is to
provide an electronic component and a manufacturing method thereof
that can achieve an improved adhesion strength when the electronic
component is solder-mounted onto an external substrate and thereby
considerably improve the electric properties and functions of an
electronic device (product) in which the electronic component is
installed, namely, the reliability of the product, and that can
also improve the yield in the mounting of the electronic component
and thereby achieve increased productivity.
[0012] In order to solve the above-described problems, the
invention provides an electronic component having: a circuit
element formed on a substrate; an electrode layer connected to the
circuit element; a passivation layer (insulating layer) that covers
the electrode layer; and a terminal electrode disposed on a top
part of the passivation layer and connected to the electrode layer
via a via-conductor formed through the passivation layer, wherein
one end of the terminal electrode is located on a side wall of the
passivation layer.
[0013] In the electronic component having the above configuration,
the terminal electrode that is connected to the circuit element
(element electrode of the electronic component) formed on the
substrate is formed so that it extends to the side wall of the
passivation layer and covers at least part of that side wall, and
thus, when soldering the electronic component onto an external
substrate, a solder fillet can be formed to extend outward from the
side wall of the terminal electrode. Accordingly, the area of
contact between the terminal electrode of the electronic component
and the solder for bonding the electronic component to the external
substrate increases, and the adhesion strength of the
solder-mounted electronic component can be improved. Also, since
the adhesion strength of the electronic component can be improved
as above, lifting of one end of the electronic component or
misalignment of the electronic component can be reduced, in other
words, the well-balanced adhesion of the electronic component to
the external substrate can be achieved. Such improvement of the
adhesion balance may be particularly apparent if the electronic
component has a rectangular shape and has terminal electrodes at
both ends in the longitudinal direction.
[0014] Furthermore, since one end of the terminal electrode is
located at a certain part on the side wall of the passivation
layer, the area of the solder fillet bonded to the electronic
component can be reduced compared to the case where the terminal
electrode is configured as a conventional side-face terminal formed
by plating, and as a result, it is possible to dispose multiple
electronic components more densely with narrower spaces, and
contribute to high-density mounting by the reduction of the actual
mounting area of each electronic component. Also, the manufacturing
process can be simplified compared to the case of forming a
conventional side-face terminal by plating. Furthermore, since such
a conventional side-face terminal is not formed, unnecessary
floating inductance or floating capacitance can be prevented (or
reduced) in the circuit including the electronic component. In
addition, although the conventional method that applies plating to
the edge portion of the electronic component needs to process
individual electronic components piece by piece (component by
component), the electronic component according to the invention can
be formed by a process of forming a plurality of element structures
for the electronic components on a single substrate, forming
terminal electrodes for each component, and thereafter dividing the
substrate into each component by dicing, etc., and accordingly, the
invention is also advantageous in that the electronic component
itself can be manufactured with significantly improved
productivity.
[0015] Furthermore, since a solder fillet is formed when the
terminal electrode of the electronic component is bonded to the
external substrate as described above, a self-alignment effect can
be obtained, in other words, even if the electronic component is
placed on the external substrate at a position off the desired
mounting position, the electronic component can move by itself to
the determined position due to the surface tension of the solder
melted in the soldering.
[0016] In the above-described electronic component, it is
preferable that the terminal electrode is formed such that it
extends from the top part of the passivation layer along the side
wall of the passivation layer, and that one end of the terminal
electrode is in contact with (the top surface of) the
substrate-side end of the passivation layer side wall. With this
configuration, since the terminal electrode is formed to cover the
entire surface of the passivation layer side wall, the area of
contact between the terminal electrode of the electronic component
and the solder for bonding the electronic component to the external
substrate increases even more, and as a result, the adhesion
strength of the solder-mounted electronic component can be even
further improved.
[0017] It is also preferable that the one end of the terminal
electrode reaches the substrate (if a dielectric layer is formed on
the side of the substrate where a lower electrode is formed, the
one end reaches the dielectric layer), and further extends along
the lower electrode side surface of the substrate toward the edge
portion of the substrate surface. With this configuration, since
the terminal electrode is disposed extending beyond the side wall
of the passivation layer toward the edge portion of the substrate,
the area of contact between the terminal electrode of the
electronic component and the solder for bonding the electronic
component to the external substrate increases even more (the outer
end wall of the solder fillet bonded to the terminal electrode is
expanded outward), and as a result, the adhesion strength of the
solder-mounted electronic component can be even further
improved.
[0018] Also, if a part of the edge portion of the substrate top
surface is left uncovered, in other words, if the edge portion of
the substrate top surface (the top surface of the edge portion of
the substrate) is not completely covered by the terminal electrode
and exposed, this exposed portion (the exposed surface may be the
surface of the passivation layer, or may be the surface of the
substrate, as described above) acts as a so-called solder stopper
in the soldering, and as a result, undesirable spread of solder can
be reduced. Furthermore, in the case where a plurality of element
structures for the electronic components is formed on one
substrate, the above exposed portion can be used to ensure a margin
for alignment errors in dicing.
[0019] Also, the passivation layer may be configured to include a
first passivation layer formed on/above the substrate and a second
passivation layer formed on/above the first passivation layer
inside the area where the first passivation layer is formed; in
other words, configured such that the second passivation layer is
formed on the first passivation layer in a step-like form. In that
case, the substrate-side surface of the second passivation layer
(the boundary surface between the first and second passivation
layers) is preferably smaller than the terminal electrode-side
surface of the second passivation layer (the surface of the second
passivation layer opposite from the first passivation layer).
[0020] In the above configuration, since the first and second
passivation layers are in a step-like form and the terminal
electrode is formed to cover the side wall of the passivation layer
including such step-like first and second passivation layers, the
boundary area where the passivation layer and the terminal
electrode are in contact with each other increases compared to the
case where the passivation layer does not have a step-like form.
Accordingly, the passivation layer, particularly the second
passivation layer can be closely adhered to the terminal electrode
with improved strength, and thus, separation of the passivation
layer and the terminal electrode can be prevented (or reduced).
[0021] In the above, more specifically, the side wall of the second
passivation layer may be inclined, in other words, the side wall of
the second passivation layer may be tapered toward the first
passivation layer. With this configuration, when the terminal
electrode is formed to cover the second passivation layer and
extend along the inclined surface of the second passivation layer,
the terminal electrode has, around the boundary area between the
first and second passivation layers, a wedge-like cross section
wedging into the passivation layer, and accordingly, as a result of
the anchoring effect produced by the above-configured second
passivation layer and terminal electrode, the passivation layer and
the terminal electrode can be closely adhered to one another with
even further improved strength.
BRIEF DESCRIPTION OF THE DRAWINGS
[0022] FIG. 1 is a perspective view illustrating the configuration
of a capacitor, which is a preferred embodiment of the electronic
component according to the invention.
[0023] FIG. 2 is a plan view of the capacitor 1 shown in FIG.
1,
[0024] FIG. 3 is a cross-sectional view along the line in FIG.
2.
[0025] FIG. 4 is a cross-sectional view along the line IV-IV in
FIG. 2.
[0026] FIG. 5 is a cross-sectional view along the line V-V in FIG.
2.
[0027] FIGS. 6A-6C are process charts showing the steps for
manufacturing a capacitor 1.
[0028] FIGS. 7A-7C are process charts showing the steps for
manufacturing a capacitor 1.
[0029] FIGS. 8A-8B are process charts showing the steps for
manufacturing a capacitor 1.
[0030] FIGS. 9A-9B are process charts showing the steps for
manufacturing a capacitor 1.
[0031] FIGS. 10A-10B are process charts showing the steps for
manufacturing a capacitor 1.
[0032] FIGS. 11A-11C are process charts showing the steps for
manufacturing a capacitor 1.
[0033] FIGS. 12A-12B are process charts showing the steps for
manufacturing a capacitor 1.
[0034] FIG. 13 is a table T1 showing, in a capacitor manufactured
by a conventional method, how frequency characteristics of the
capacitor vary depending on whether the capacitor has a tilt or
not.
[0035] FIG. 14 is a cross-sectional view of a capacitor 10
according to a second embodiment of the invention.
[0036] FIG. 15 is a perspective view of a capacitor 100 according
to a third embodiment of the invention.
[0037] FIG. 16 is a plan view of the capacitor 100 shown in FIG.
15.
[0038] FIG. 17 is a table T2 showing the result of evaluation of a
capacitor 100 according to the third embodiment and a conventional
capacitor, in terms of inclination.
DETAILED DESCRIPTION OF PREFERRED EMBODIMENTS
[0039] Embodiments of the invention will be described below with
reference to the attached drawings. In the drawings, the same
components are given the same reference numerals, and any
repetitive description will be omitted. The positional
relationship, such as top and bottom, left and right, etc., is as
shown in the drawings unless otherwise specified. The dimensional
ratios are not limited to those shown in the drawings. The below
embodiments are just examples for describing the invention, and the
invention is not limited to those embodiments. The invention can be
modified in various ways without departing from the gist of the
invention.
First Embodiment
[0040] FIG. 1 is a perspective view illustrating the configuration
of a capacitor 1, which is a preferred embodiment of the electronic
component according to the invention, and FIG. 2 is a plan view of
the capacitor 1 shown in FIG. 1. FIGS. 3, 4 and 5 are
cross-sectional views along the lines III-III, IV-IV and V-V,
respectively, in FIG. 2.
[0041] The capacitor 1 is formed by building up, on a substrate 2
having a rectangular shape in a plan view, the following
components: a lower electrode 3; a dielectric layer 4; a first
electrode 5a (circuit element); a first electrode 5b (electrode
layer); a first passivation layer 6 (passivation layer); a second
electrode 7 (electrode layer); a second passivation layer 8
(passivation layer); and pad electrodes 9a and 9b (terminal
electrode), in this order. There are no particular limitations on
the material of the substrate 2, and the substrate 2 may be a metal
substrate, a ceramics substrate formed of alumina, etc., a glass
ceramics substrate, a glass substrate, a monocrystal substrate
formed of sapphire, MgO, SrTiO, etc., or a semiconductor substrate
formed of Si, SiGe, etc. Substrates that are chemically and
thermally stable, cause less stress and easily keep the substrate
surface smooth are used preferably. The thickness of the substrate
2 may arbitrarily be determined as required.
[0042] The lower electrode 3 is disposed on the substrate 2 in an
area inside the periphery of the substrate 2, and formed of, for
example, a single metal such as Ni, Ti, Cu, Au, Pt, Ag, Sn, Cr, Co,
W, Pd, Mo, Ta, Ru, or Nb, or a complex metal such as an alloy
containing the above metals.
[0043] The dielectric layer 4 is a thin film layer formed to cover
the top surface and the side wall of the lower electrode 3, as well
as a part of the top surface of the substrate 2 outside the lower
electrode 3. The edge (end) portion of the dielectric layer 4 may
or may not reach the edge (end) portion of the substrate 2 top
surface. There are no particular limitations on the film material
for the dielectric layer 4, and examples include high dielectric
ceramic materials, such as PbTiO.sub.3, Pb(Zr, Ti)O.sub.3(PZT),
PbNb.sub.2O.sub.3, Pb(Mg, Nb)O.sub.3(PMN), BaTiO.sub.3, (Ba,
Sr)TiO.sub.3(BST), CaTiO.sub.3, ZrO.sub.2, HfO.sub.2, TiO.sub.2,
Ta.sub.2O.sub.6, Bi.sub.4Ti.sub.4O.sub.12,
SrBi.sub.2Ta.sub.2O.sub.9, Al.sub.2O.sub.3, Si.sub.3N.sub.4 or
SiO.sub.2.
[0044] The first electrode 5 is a thin film electrode formed to
cover the top surface of the dielectric layer 4. The first
electrode 5 is formed so that it covers the top surface of the
lower electrode 3 at the center thereof and also covers the top
surface of the lower electrode 3 via the dielectric layer 4 at the
edge portion. Accordingly, the center of the first electrode 5 is
electrically connected to the lower electrode 3, creating a
configuration where electric current flows between the lower
electrode 3 and the center of the first electrode 5. As with the
lower electrode 3, the first electrode 5 may be formed of, for
example, a single metal such as Ni, Cu, Au, Pt, Ag, Sn, Cr, Co, W,
Pd, Mo, Ta, Ru or Nb, or a complex metal such as an alloy
containing the above metals.
[0045] The first passivation layer 6 is formed on the first
electrode 5 so that it covers not only the corners of the first
electrode 5, but also the corners on the top surface of the
dielectric layer 4 as well as the side wall. The material of the
first passivation layer 6 is not particularly limited, and examples
of the material include inorganic insulating materials such as
Al.sub.2O.sub.3, SiO.sub.2, or SiN, and organic insulating
materials such as resins including polyimide and epoxy.
[0046] The second electrode 7 is formed on the first passivation
layer 6 and it also covers the first electrode 5. As with the lower
electrode 3 and the first electrode 5, the second electrode 7 may
be formed of, for example, a single metal such as Ni, Cu, Au, Pt,
Ag, Sn, Cr, Co, W, Pd, Mo, Ta, Ru or Nb, or a complex metal such as
an alloy containing the above metals.
[0047] The second passivation layer 8 is formed as the upper layer
of the second electrode 7, so that it covers the corners of the
second electrode 7. As with the first passivation layer 6, the
material of the second passivation layer 8 is not particularly
limited, and examples of the material include inorganic materials
such as Al.sub.2O.sub.3, SiO.sub.2, or SiN, and insulating
materials such as resins including polyimide and epoxy.
[0048] The pad electrodes 9 formed as the upper layer of the second
passivation layer 8 are disposed at both ends of the capacitor 1,
and connected to lower electrode 3 via a via-conductor Vb that
fills an opening formed through the second passivation layer 8, a
via-conductor Va that fills an opening formed through the first
passivation layer 6, and the first electrode 5. The materials of
the via-conductors Va and Vb and the pad electrodes 9 are not
particularly limited, and as with the lower electrode 3, the first
electrode 5 and the second electrode 7, they may be formed of, for
example, a single metal such as Ni, Cu, Au, Pt, Ag, Sn, Cr, Co, W,
Pd, Mo, Ta, Ru or Nb, or a complex metal such as an alloy
containing the above metals.
[0049] Next, one example of the method for manufacturing a
capacitor 1 of the above configuration will be described below.
FIGS. 6-12 are process charts showing the steps for manufacturing
the capacitor 1.
[0050] First, a substrate 2 is prepared, and the surface is
planarized by polishing, for example, CMP. Actually, a plurality of
element structures for capacitors 1 (for example, a fine structure
of line/space=several .mu.m/several .mu.m), is formed on a single
substrate 2, and lastly, the substrate is cut element by element
into individual pieces (individual components) to obtain a
plurality of capacitors 1, but the drawings referred to in the
below description show the portion corresponding to the element
structure for one capacitor 1.
[0051] Formation of Lower Electrode
[0052] A lower electrode 3 is formed on the above substrate 2 by
photolithography and plating. More specifically, for example, a
base conductor layer 3a having a film thickness of around 0.01-1
.mu.m is first formed on the substrate 2 as a seed layer by
sputtering or non-electrolytic plating (FIG. 6A). Next, a
photoresist film is deposited on the base conductor layer 3a, and
processed by photolithography to form a resist mask M1 at the
portion not corresponding to the lower electrode 3 (FIG. 6B).
[0053] After that, using the formed resist mask M1 as a plating
mask, the exposed portion of the base conductor layer is
selectively electroplated (electrolytically plated) so that an
electroplate conductor layer 3b for the formation of the lower
electrode has been electrodeposited with a desired thickness. By
removing the resist mask M1 and the base conductor layer 3a outside
the electroplate conductor layer 3b (the base conductor layer 3a on
which the electroplate conductor layer 3b has not been formed), a
conductor layer 3 used as the lower electrode is obtained (FIG.
6C). In FIG. 6C, this conductor layer is given the same reference
numeral as the lower electrode 3.
[0054] Formation of Dielectric Layer
[0055] Next, a dielectric layer 4 is formed so that it covers the
edge portion of the lower electrode 3 top surface as well as the
side wall and also covers a part of the top surface of the
substrate 2 outside the lower electrode 3. More specifically, the
dielectric layer 4 is first formed on the entire surface of the
lower electrode 3 and the exposed portion of the substrate 2 by PVD
such as sputtering, CVD, ALD, or a solution method, etc., to have a
thickness of around 0.01-1 .mu.m (FIG. 7A). After that, a
photoresist film is deposited as a resist mask M2 on the resulting
dielectric layer 4, except the portion corresponding to the center
of the lower electrode 3 (FIG. 7B). By using this resist mask M2 as
an etch mask, a part of the dielectric layer 4 is removed by
etching to form an opening 4a, and the resist mask M2 is thereafter
removed, thereby obtaining the dielectric layer 4 having the
opening 4a (FIG. 7C).
[0056] Formation of First Electrode
[0057] Next, a conductor layer 5 used as a first electrode is
formed on the top surface of the dielectric layer 4 and the exposed
portion of the lower electrode 3 shown in FIG. 8, by plating or
CVD, etc. The conductor layer 5 for the first electrode is formed
inside (not to extend beyond) the mounting area of the conductor
layer 3 for the lower electrode. More specifically, for example, a
base conductor layer 5a having a film thickness of around 0.01-1
.mu.m is first formed on the dielectric layer 4 as a seed layer by
sputtering or non-electrolytic plating. After that, a resist mask
M3 is disposed on the base conductor layer 5a (FIG. 8A).
Subsequently, the exposed portion of the base conductor layer 5a,
in other words, the base conductor layer 5a formed on the lower
electrode 3 and not covered with the resist mask M3, is selectively
electroplated (electrolytically plated) so that an electroplate
conductor layer for the formation of the first electrode has been
electrodeposited with a desired thickness. After that, by removing
the resist mask M3 and the base conductor layer outside the
electroplate conductor layer, the conductor layer 5 used as the
first electrode is obtained (FIG. 8B). In FIG. 8B, this conductor
layer is given the same reference numeral as the first electrode
5.
[0058] Formation of First Passivation Layer
[0059] Next, in order to form a first passivation layer 6 so that
it covers the edge portion of the first electrode 5, the top
surface of the dielectric layer 4 formed on the lower electrode 3,
the dielectric layer 4 formed on the side wail of the lower
electrode 3, and the dielectric layer 4 formed on the substrate 2,
for example, an uncured photo-curable resin is applied (FIG. 9A).
After that, a metal mask M4 is placed over the portion where the
first passivation layer 6 is not to be formed, and in this state,
patterning is carried out by photolithography, thereby forming the
first passivation layer 6 that covers the edge portion of the first
electrode 5, the top surface of the dielectric layer 4 formed on
the lower electrode 3, the dielectric layer 4 formed on the side
wall of the lower electrode 3, and the dielectric layer 4 formed on
the substrate 2 (FIG. 9B).
[0060] Formation of Second Electrode
[0061] Next, a conductor layer 7 used as a second electrode is
formed on the top surface of the above-obtained first passivation
layer 6 and the top surface of the first electrode 5 shown in FIG.
10, by plating or CVD, etc. More specifically, a base conductor
layer 7a having a film thickness of around 0.01-1 .mu.m is first
formed on the first passivation layer 6 and the dielectric layer 4
as a seed layer by sputtering or non-electrolytic plating. After
that, a resist mask M5 is disposed on the base conductor layer 7a
(FIG. 10A). Subsequently, the top surface of the base conductor
layer 7a which has not been covered with the resist mask M5 is
selectively electroplated (electrolytically plated) so that an
electroplate conductor layer for the formation of the second
electrode has been electrodeposited with a desired thickness. After
that, by removing the resist mask M5 and the base conductor layer
outside the electroplate conductor layer, the conductor layer 7
used as the second electrode, and a via-conductor connecting the
second electrode 7 and the first electrode 5, are obtained (FIG.
10B). In FIG. 10B, this conductor layer is given the same reference
numeral as the second electrode 7.
[0062] Formation of Second Passivation layer
[0063] Next, a second passivation layer 8 for covering the second
electrode 7 is formed. More specifically, in order that the
mounting area of the second passivation layer 8 is, in a plan view,
inside the mounting area of the first passivation layer 6, for
example, an uncured photo-curable resin is applied to the top
surface of the second electrode 7, the top surface of the first
passivation layer 6 and the top surface of the dielectric layer 4
(FIG. 11A). After that, a metal mask M6 is placed over the portion
where the second passivation layer 8 is not to be formed, and in
this state, patterning is carried out by photolithography, thereby
forming a resin layer 8a used as the second passivation layer on
the top surface of the second electrode 7 and on the top surface of
the first passivation layer 6 outside the second electrode 7 (FIG.
11B). Here, by adjusting the conditions of the photolithography,
such as exposure and focusing conditions, the second passivation
layer can be formed such that one side wall 8t of the resin layer
8a inclines in a tapered form from the top surface (the pad
electrode 9 side) to the bottom surface (the first passivation
layer 6 side) of the resin layer 8a, as shown in FIG. 11C.
[0064] Formation of Pad Electrode
[0065] Next, a pad electrode 9 is formed to cover the second
passivation layer 8, the top surface of the first passivation layer
6 formed outside the second passivation layer 8 as well as the side
wall, and the top surface of the dielectric layer 4 formed outside
the first passivation layer. More specifically, a base conductor
layer 9g having a film thickness of around 0.01-1 .mu.m is formed
by sputtering or non-electrolytic plating as a seed layer on the
second passivation layer 8, the top surface of the first
passivation layer 6 formed outside the second passivation layer 8
as well as the side wall, and the top surface of the dielectric
layer 4 formed outside the first passivation layer. After that, a
resist mask M7 is placed at the edge portion of the substrate 2, on
the dielectric layer 4 formed outside the first passivation layer
6, so as to ensure a margin to be used when obtaining each
capacitor 1 by dicing (FIG. 12A).
[0066] After that, the exposed portions of the base conductor layer
9g, the exposed portions being on the second passivation layer 8,
the top surface of the first passivation layer 6 formed outside the
second passivation layer 8 as well as the side wall, and the top
surface of the dielectric layer 4 formed outside the first
passivation layer 6 and not covered with the resist mask M7, are
selectively electroplated (electrolytically plated), so that an
electroplate conductor layer for the formation of the pad electrode
has been electrodeposited with a desired thickness. After that, by
removing the resist mask M7 and the base conductor layer formed
outside the electroplate conductor layer, a conductor layer 9 used
as the pad electrode is obtained together with a via-conductor Vb
connecting the pad electrode 9 and the second electrode 7 (FIG.
12B). This conductor layer 9 used as the pad electrode is formed so
as to cover not only the uppermost surface of the substrate 2 but
also the side walls of the first passivation layer 6 and the second
passivation layer 8, and also so as to reach the top surface of the
dielectric layer 4 formed on the substrate 2. In FIG. 12B, the
above conductor layer is given the same reference numeral as the
pad electrode 9.
[0067] After that, although not shown in the drawings, if
necessary, for example, a passivation layer for assigning an
identification number for the capacitor 1 is formed between the pad
electrodes 9 and in the same layer as the pad electrodes 9. The
substrate 2 is thereafter cut (diced) at a specific portion between
the capacitors 1. As a result, individual pieces of the capacitors
1 as shown in FIG. 1 are obtained.
[0068] In the above-described manufacturing process of the
capacitor 1, since the first passivation layer 6 and the second
passivation layer 8 are formed in a step-like structure, the first
passivation layer 6 and the second passivation layer 8 are each in
contact with the pad electrode 9 which is a conductor layer in an
increased area. As a result, separation of the first passivation
layer 6 and the pad electrode 9, or separation of the second
passivation layer 8 and the pad electrode 9 can be prevented
(reduced). Moreover, since the side end (side wall 8t) of the
second passivation layer 8 is formed to incline in a tapered form
from the pad electrode 9 toward the first passivation layer 6, the
second passivation layer 8 and the pad electrode 9, the pad
electrode 9 having a shape corresponding to the shape of the side
wall, exhibit anchoring effects, resulting in the separation of the
second passivation layer 8 and the pad electrode 9 being further
prevented (reduced).
[0069] Also, the pad electrode 9 is formed such that it covers the
side walls of the first passivation layer 6 and the second
passivation layer 8 and extends outward from the first passivation
layer 6 and the second passivation layer 8. In other words, the pad
electrode 9 is formed on not only the top surface but also the side
wall. Accordingly, a solder fillet is formed on the side wall of
the pad electrode 9 as well, and thus in contact with the pad
electrode 9 in an increased area, resulting in the improved
adhesion strength of the solder-mounted capacitor 1. Furthermore,
while the dielectric layer 4 is exposed at the edge portion of the
substrate 2, the dielectric layer is covered with the pad electrode
9 except for the exposed portion, in other words, the pad electrode
9 is formed to extend to the top surface of the dielectric layer 4
outside the first passivation layer 6. Since the pad electrode 9 is
formed such that the edge portion of the substrate 2 is exposed,
the exposed edge portion of the substrate 2 acts as a solder
stopper and provides a margin for alignment errors in dicing.
[0070] In addition, as a result of the measurement using capacitors
manufactured by a conventional method, regarding how their
frequency characteristics vary depending on whether they have
certain tilt or not, the inventors of the present invention found
that if the capacitors have certain tilt in the height (thickness)
direction (or in width direction), their ESL (equivalent series
inductance) values increase and the capacitor performance
deteriorates, as shown in FIG. 13. However, the capacitor 1
according to this embodiment is formed such that the longitudinal
ends of the capacitor 1 are held by the pad electrodes 9, and this
allows the well-balanced adhesion of the capacitor 1, and reduces
any increase in the ESL (equivalent series inductance) value of the
mounted capacitor 1. As a result, high-density mounting is enabled,
and furthermore, the productivity and reliability of electronic
devices (products) in which the capacitor 1 is installed can be
increased considerably.
Second Embodiment
[0071] FIG. 14 is a cross-sectional view showing the configuration
of a capacitor 10 according to a second embodiment of the
invention. As shown in FIG. 14, the capacitor 10 has the same
configuration as the capacitor 1 of the above-described first
embodiment, except that the second passivation layer 8' is formed
such that the side wall 8t' has no inclination and the pad
electrodes 9c and 9d are formed to cover the side wall 8t' of the
second passivation layer 8', the top surface of the second
electrode 7 outside the second passivation layer 8' as well as the
side wall, the top surface of the first passivation layer 6 outside
the second electrode 7 as well as the side wall, and the top
surface of the dielectric layer 4 outside the first passivation
layer 6.
[0072] In the capacitor 10 according to this embodiment, although
the pad electrodes 9c and 9d do not cover the top surface of the
second passivation layer 8', which is different from the
above-described capacitor 1 of the first embodiment, the pad
electrodes 9c and 9d extend from the side wall 8t' of the second
passivation layer 8' to the top surface of the dielectric layer 4,
and thus, separation of the first passivation layer 6 and the pad
electrodes 9c and 9d, or separation of the second passivation layer
8' and the pad electrodes 9c and 9d can be effectively prevented
(or reduced). Furthermore, since a solder fillet is formed on the
side wall of the pad electrodes 9c and 9d when the capacitor is
solder-mounted, the contact area of the solder with the pad
electrodes 9c and 9d increases, resulting in the solder-mounted
capacitor 10 exhibiting improved adhesion strength. In addition,
since the pad electrodes 9c and 9d are formed so that the edge
portion of the substrate 2 is exposed, the corners defined by the
dielectric layer 4 and the pad electrodes 9c and 9d act as a solder
stopper.
Third Embodiment
[0073] FIG. 15 is a perspective view illustrating the configuration
of a capacitor 100 according to a third embodiment of the
invention, and FIG. 16 is a plan view of the capacitor 100 shown in
FIG. 15. As shown in the above drawings, the capacitor 100 has the
same configuration as the capacitor 1 in the above-described first
embodiment, except that the pad electrodes 9e and 9f are each
formed to have an I-shape (or H-shape) in a plan view.
[0074] The shape of the pad electrodes 9e and 9f of this embodiment
is obtained by cutting out a part of the pad electrodes 9a and 9b
of the first embodiment, which are formed at both ends of the
capacitor 1. More specifically, the pad electrodes 9e and 9f each
have a cutout on the side along the width-direction of the
capacitor 100 toward the center of the capacitor 100, while the
corners of the pad electrodes 9e and 9f are left uncut.
[0075] As a result, the pad electrodes 9e and 9f have corners
defined by a long side 9l along the longitudinal direction of the
capacitor 100 and a short side 9s along the width direction of the
capacitor 100. In general, the capacitor 100 has a substantially
rectangular shape, and thus, the tension stress of solder is larger
on the short side 2s than the long side 2l of the substrate 2.
Accordingly, stress is applied to the capacitor 100 in its width
direction, resulting in the capacitor being likely to tilt in the
width direction. In this embodiment, however, since the pad
electrodes 9e and 9f are formed by making a cutout in the pad
electrodes 9a and 9b, so that the pad electrodes 9e and 9f each
have long sides 9l in the longitudinal direction of the capacitor
100 and short sides 9s in the width direction of the capacitor 100,
the difference in tension stress of solder between the long side 2l
and the short side 2s of the substrate 2 can be reduced, and
accordingly, tilt of the capacitor 100 can be further prevented (or
reduced).
[0076] When the inventors of the present invention examined the
capacitor 100 manufactured by the above-described method and a
capacitor manufactured by a conventional method, by measuring the
tilt of both capacitors when they are mounted on an external
substrate, it was found that the capacitor 100 of this embodiment
exhibited no tilt when mounted, as shown in FIG. 17. In this
examination, a capacitor of the LGA configuration where pad
electrodes are formed on the uppermost surface of the substrate in
a grid was used as a capacitor manufactured by a conventional
method.
[0077] FIG. 17 is a table T2 showing the evaluation of the
capacitor 100 of this embodiment and a capacitor of the LGA
configuration in terms of tilt, when ten pieces of the respective
capacitors were mounted on an external substrate by applying melted
solder to the pad electrodes of the respective capacitors.
[0078] In the case of the capacitors manufactured by a conventional
method, tilt was found in ten (all) of the mounted capacitors,
which means there was a 0% mounting rate. On the other hand, in the
case of the capacitors 100 of this embodiment, no tilt was found in
the ten capacitors mounted, which means there was a 100% mounting
rate.
[0079] As stated above, the capacitor 100 of this embodiment can
bring about the same effects as the above-described first
embodiment. Furthermore, since the pad electrodes 9e and 9f are
formed by making a cutout in the pad electrodes 9a and 9b of the
first embodiment, so that the sides 91 formed in the longitudinal
direction of the capacitor 100 are longer than the sides 9s formed
in the width direction of the capacitor 100, the tension stress of
solder applied to the two sides (long side 2l and short side 2s) of
the substrate 2 can be well balanced. As a result, the
well-balanced adhesion of the capacitor 100 can be ensured when the
capacitor 100 is solder-mounted, and tilt of the capacitor 100 can
be further prevented (or reduced).
[0080] Although the above embodiments are based on the premise that
the pad electrodes of the capacitor are formed not to reach the
edge portion of the substrate 2 in order to ensure a margin for
dicing, the pad electrodes may be formed to reach the edge portion
of the substrate so that the pad electrodes and the passivation
layers can be closely adhered with increased strength. Also, the
types of electronic components are not limited to capacitors, and
may be passive components such as inductors, thermistors or
resistance, or active components such as IC chips.
[0081] As described above, according to the electronic component of
the invention and the manufacturing method thereof, it is possible
to improve the adhesion strength of the electronic component when
it is solder-mounted onto an external substrate, and thus obtain
products with considerably increased reliability and productivity.
Accordingly, the invention can be widely and effectively utilized
in appliances, apparatuses, systems and devices which have an
electronic component embedded therein, in particular, those that
require smaller sizes and higher performance, and can also be
utilized in the production, manufacturing, etc., thereof.
[0082] Although the electronic component of the invention is
manufactured by the same steps as those of electronic components of
the LGA configuration, the terminal electrode of the electronic
component, which corresponds to the pad electrode of the LGA
configuration, is formed to cover the uppermost surface of the
substrate and at least part of the side wall of the substrate, and
thus, a solder fillet is formed on the side wall of the terminal
electrode as well when solder-mounting the electronic component
onto an external substrate. Accordingly, the adhesion strength of
the solder-mounted electronic component can be improved. Also,
since the invention can bring about effects such as improving the
adhesion strength of the electronic component as described above,
the electric properties and functions of an electronic device
(product) in which the electronic component is installed, in other
words, the reliability of the product, can be considerably
improved. Furthermore, the yield in the mounting of electronic
components can be improved, which leads to the improved
productivity.
* * * * *