U.S. patent application number 12/545853 was filed with the patent office on 2011-02-24 for manufacturing process of a high efficiency heat dissipating device.
Invention is credited to Shyh-Ming Chen.
Application Number | 20110042226 12/545853 |
Document ID | / |
Family ID | 43604428 |
Filed Date | 2011-02-24 |
United States Patent
Application |
20110042226 |
Kind Code |
A1 |
Chen; Shyh-Ming |
February 24, 2011 |
MANUFACTURING PROCESS OF A HIGH EFFICIENCY HEAT DISSIPATING
DEVICE
Abstract
A manufacturing process of a high efficiency heat dissipating
device includes a plate or cylinder base, and a plurality of fins
assembled to the base. The base and the fins are made of aluminum.
An oxide layer to improve heat radiating are formed to surface of
the base or the fins by an anodizing process. A heat pipe is
additionally arranged to conduct the heat from the base to the
fins. Or, in a heat dissipating device consists of the heat pipe
and the fins, oxide layers are formed to the surfaces of the fins
by the anodizing process. By the above structure, a heat radiating
effect is improved and a visible appearance, an anti-pollution
ability are formed to the heat dissipating device.
Inventors: |
Chen; Shyh-Ming; (Taipei
Hsien, TW) |
Correspondence
Address: |
Shyh-Ming Chen
235 Chung - Ho, Box 8-24
Taipei
235
TW
|
Family ID: |
43604428 |
Appl. No.: |
12/545853 |
Filed: |
August 23, 2009 |
Current U.S.
Class: |
205/324 |
Current CPC
Class: |
H01L 23/3735 20130101;
H01L 2924/0002 20130101; H01L 21/4882 20130101; H01L 23/3672
20130101; H01L 2924/0002 20130101; C25D 11/04 20130101; H01L
2924/00 20130101 |
Class at
Publication: |
205/324 |
International
Class: |
C25D 11/04 20060101
C25D011/04 |
Claims
1. A manufacturing process of a high efficiency heat dissipating
device comprising the step of assembling a plurality of fins to a
base; performing an anodizing process, an oxide layer for improving
a heat radiating effect being formed to a surface of at least one
of the base or the fins.
2. The manufacturing process of a high efficiency heat dissipating
device as claimed in claim 1, wherein at least one of the base and
the fins are made of aluminum; an aluminum oxide layer is formed to
the surface of at least one of the base and the fins by the
anodizing process to improve the heat radiating effect.
3. The manufacturing process of a high efficiency heat dissipating
device as claimed in claim 2, wherein colors and thicknesses of the
oxide layer of the base and the fins are controllable by adjusting
voltages and process time of the anodizing process.
4. The manufacturing process of a high efficiency heat dissipating
device as claimed in claim 2, wherein at least one of the base and
the fins is anodized separately to form the high heat radiating
oxide layer onto the surface thereof; and then tightly combining
the base and the fins together as a finished heat dissipating
device by a combining process.
5. The manufacturing process of a high efficiency heat dissipating
device as claimed in claim 2, wherein the base and the fins are
combined together as a heat dissipating device firstly, and then
the heat dissipating device is anodized to form oxide layers onto
surfaces of the base and the fins.
6. The manufacturing process of a high efficiency heat dissipating
device as claimed in claim 2, comprising the step of arranging one
end of at least one heat pipe tightly to the base, and another end
thereof is arranged to the fins; oxide layers are formed to the
surfaces of the base and the fins by the anodizing process to
improve the heat radiating effect.
7. The manufacturing process of a high efficiency heat dissipating
device as claimed in claim 6, wherein an oxide layer is formed to a
surface of the heat pipe by the anodizing process.
8. The manufacturing process of a high efficiency heat dissipating
device as claimed in claim 2, wherein the base is a plate body with
a shape of one of a rectangle, a circle, a geometrical shape, and
an irregular shape.
9. A manufacturing process of a high efficiency heat dissipating
device comprising steps of: assembling a plurality of fins
assembled to at least one heat pipe; by an anodizing process, an
oxide layer for improving a heat radiating effect being formed to a
surface of at least one of the heat pipe and the fins.
10. The manufacturing process of a high efficiency heat dissipating
device as claimed in claim 9, wherein the fins is made of aluminum;
the oxide layer of aluminum oxide is formed to the surfaces of the
fins to improve the heat radiating effect.
11. The manufacturing process of a high efficiency heat dissipating
device as claimed in claim 10, wherein color and thickness of the
oxide layer of the fins are controllable by adjusting voltages and
process time of the anodizing process.
12. A manufacturing process of a high efficiency heat dissipating
device comprising the steps of assembling a plurality of fins
assembled to an outer surface of a cylindrical base; and by an
anodizing process, an oxide layer being formed to a surface of at
least one of the base and the fins to improve a heat radiating
effect.
13. The manufacturing process of a high efficiency heat dissipating
device as claimed in claim 12, wherein at least one of the base and
the fins are made of aluminum; by the anodizing process, the oxide
layer of aluminum oxide are formed to the surface of at least one
of the base and the fins to improve the heat radiating effect.
14. The manufacturing process of a high efficiency heat dissipating
device as claimed in claim 13, wherein colors and thickness of the
oxide layer of at least one of the base and the fins are
controllable by adjusting voltages and process time of the
anodizing process.
15. The manufacturing process of a high efficiency heat dissipating
device as claimed in claim 13, wherein the oxide layer is formed to
the surface of at least one of the cylindrical base and fins to
improve the heat radiating effect; and then the base and the fins
are tightly combined together by a combining process.
16. The manufacturing process of a high efficiency heat dissipating
device as claimed in claim 13, wherein the base and the fins are
tightly combined together to be as a heat dissipating device by a
combining process; by anodizing the heat dissipating device, oxide
layers are formed to the base and the fins.
17. The manufacturing process of a high efficiency heat dissipating
device as claimed in claim 13, wherein a carrier is arranged to one
of an end or an inside of the base for being installed by a heat
source.
18. The manufacturing process of a high efficiency heat dissipating
device as claimed in claim 17, wherein the oxide layer is formed to
a surface of the carrier by the anodizing process to improve the
heat radiating effect.
19. The manufacturing process of a high efficiency heat dissipating
device as claimed in claim 13, wherein the base and the fins being
formed integrally; the oxide layer is formed to at least one of the
base and the fins by the anodizing process to improve the heat
radiating effect.
20. The manufacturing process of a high efficiency heat dissipating
device as claimed in claim 19, wherein a carrier is arranged to one
of an end or an inside of the base for being installed by a heat
source.
Description
FIELD OF THE PRESENT INVENTION
[0001] The present invention relates to manufacturing process of a
high efficiency heat dissipating device, and particular to a heat
dissipating device applied to a computer or an electronic
component. By an anodizing process, a heat radiating effect is
improved as well as an outer visible appearance and an
anti-pollution ability.
DESCRIPTION OF THE PRIOR ART
[0002] A prior heat dissipating device for a computer or electronic
component consists of a base attached to a heat source and fins
assembled to the base, or further consists of a heat pipe connected
to the base and the fins so as to conduct the heat from the base to
the fins by directly or indirectly contact to the heat source. To
improve a heat dissipation, heat dissipating device vendors spend
lots of effort on components and structure of the heat dissipating
device. The thermal conduction through a material is defined in the
following formula:
Q=-KA*.DELTA.T/.DELTA.X
The Q is heat flow, the K is a thermal conductivity, the A is a
cross section area of conducting surface, the .DELTA.T is
temperature difference, and the .DELTA.X is conducting distance
between the two temperatures. Therefore, more fins are assembled to
the base, more area are added to radiate thermal energy. By
changing the material of the base or the fins to aluminum or
copper, the higher thermal conductivity thereof will also help.
Moreover, by arranging a fan beside the heat dissipating device to
lower the temperature of the fins will also raise the temperature
difference so as to raise the heat flow.
[0003] However, by increasing the fins or air flow by the fan to
raise the heat flow will meet a limit. That means the heat flow is
limited for a heat dissipating device with a specification within a
certain interval. The operating frequency of the computer and the
electronic component are getting fast, and more heat generated
usually exceed heat dissipating device's limit. The operation
temperature of the computer and electronic component become higher
so that the function and lifetime are damaged. Some vendors use
water-cooling system or Thermo-Electric Heat dissipating device
(TEC) to overcome the problem, but the water-cooling system is
large-scaling, high cost, and having a water condensing and leakage
problem. The TEC is a semiconductor-base heat dissipating device.
In accordance with the Peltier Effect, heat energy will be
conducted from a heat absorbing end of the TEC to another end which
is a heat dissipating end. According to the First Law of
Thermodynamics-Conservation of Energy, the heat energy is only
transferred to another side of the TEC for dissipating by another
heat dissipating device. Thus, the heat dissipating effect is not
good and also the cost is high. The higher operating temperature of
the electronic component caused by the TEC will further lower the
temperature difference and the heat flow as well.
SUMMARY OF THE PRESENT INVENTION
[0004] Accordingly, the primary object of the present invention is
to provide a manufacturing process of a high efficiency heat
dissipating device. Without changing the specification of the heat
dissipating device or using auxiliary water-cooling system or TEC,
the heat conduction will be improved for meeting the needs of
higher efficiency and heat-generating devices.
[0005] A secondary object of the present invention is to provide a
manufacturing process of forming an oxide layer to a surface of the
heat dissipating device by an anodizing process so that the heat
dissipating device is durable, antioxidative, anti-polluted, and
colorful.
[0006] To achieve above objects, the present invention provides the
oxide layer to surfaces of the base and/or the fins by the
anodizing process. The oxide layer has a higher energy radiating
effect so that the heat is easier to be dissipated. After the
temperature of the heat dissipating device is lowered, a
temperature difference will improve the heat conduction from the
heat source to the heat dissipating device. By the temperature
gradient and interaction between, the contact temperature of the
heat dissipating device will be lowered and the heat will be
efficiently dissipated.
BRIEF DESCRIPTION OF THE DRAWINGS
[0007] FIG. 1 is a pictorial drawing of a heat dissipating device
assembled by a base and fins according to the present
invention.
[0008] FIG. 2 is a manufacturing flow chart of an embodiment of the
present invention.
[0009] FIG. 2A is another manufacturing flow chart of an embodiment
of the present invention.
[0010] FIG. 2B is one another manufacturing flow chart of an
embodiment of the present invention.
[0011] FIG. 3 is one another manufacturing flow chart of an
embodiment of the present invention.
[0012] FIG. 4 is a pictorial drawing showing an embodiment with
heat pipe of the present invention.
[0013] FIG. 5 is a pictorial drawing showing another embodiment
with heat pipe of the present invention.
[0014] FIG. 6 is a schematic view showing an oxide layer formed to
surfaces of the base and the fin.
[0015] FIG. 7 is an exploded view of an embodiment of the present
invention.
[0016] FIG. 8 is an assembly drawing of an embodiment of the
present invention shown in FIG. 7.
[0017] FIG. 9 is an exploded view of another embodiment of the
present invention.
[0018] FIG. 10 is an assembly drawing of another embodiment of the
present invention shown in FIG. 9.
DETAILED DESCRIPTION OF THE INVENTION
[0019] In order that those skilled in the art can further
understand the present invention, a description will be provided in
the following in details. However, these descriptions and the
appended drawings are only used to cause those skilled in the art
to understand the objects, features, and characteristics of the
present invention, but not to be used to confine the scope and
spirit of the present invention defined in the appended claims.
[0020] A manufacturing process of a high efficiency heat
dissipating device is illustrated in FIG. 1. The heat dissipating
device 10 includes a base 20, the base 20 has a side of a shape of
a rectangle, a circle, a geometrical shape, or irregular shape
contacted to a heat source. The heat source is not confined to
integrated circuits, chips, or Light Emitting Diode modules.
Another side of the base 20 is tightly combined with a plurality of
fins 30 by welding, pressing, or heat pipe gluing. Heat from the
heat source is thus conducted to the fins 30 for dissipating. The
present invention has a main object which is to raise a unit heat
radiation rate of the heat dissipating device 10.
[0021] In accordance with the Stefan-Boltzmann Law, a total energy
radiated per unit surface area of a black body is proportional to
the black body's absolute temperature:
Qb=A.sigma.T.sup.4.
The A is surface area, and the .sigma. is the Stefan-Boltzmann
constant. Qb is the total energy radiated from the black body.
However, the emissivity of a material is the ratio of energy
radiated of the material to that of a black body:
.epsilon.=Q/A/(Q/A)b
The Q/A is a total energy radiated per unit surface area of the
material, while the (Q/A)b is a total energy radiated per unit
surface area of a black body under the same temperature. A black
body would have an .epsilon.=1, while any other material would have
an .epsilon.<1. Therefore, a Non-black body would have a energy
radiated Q=.sigma.A.epsilon.T.sup.4. To improve the energy
radiating effect of a material, increasing a surface area A or
changing the .sigma. can be done.
[0022] The present invention is to anodize one or both of the
aluminum base 20 and fins 30 so as to form aluminum oxide layers to
the surfaces thereof (referring to FIGS. 2, 3, and 6). The .sigma.
of a polished aluminum is 0.04, while the .sigma. of the aluminum
oxide is 0.8. Obviously, in accordance of the energy radiated
formula mentioned above, the base 20 and fins 30 with the aluminum
oxide surface will have a better energy dissipating effect.
[0023] Furthermore, by adjusting the voltages and processing time
of the anodizing process of the base 20 and the fins 30, different
color and thickness of oxide layer 40 can be controllable formed to
the base 20 and the fins 30 so as to form a visible appearance
thereto and an anti-pollution ability.
[0024] Moreover, the anodizing and assembling of the base 20, fins
30 of the present invention can be performed by the following
orders. One is to anodize the base 20 and the fins 30 separately to
form high energy radiating oxide layers 40 onto surfaces thereof
(referring to FIGS. 2, 2A, and 2B), and then to tightly combine the
base 20 and the fins 30 as a finished heat dissipating device 10.
The other way (referring to FIG. 3) is to combine the base 20 and
the fins 30 as a heat dissipating device 10 first, and then to
anodize the heat dissipating device 10 to form oxide layers 40 onto
surfaces of the base 20 and the fins 30 to increase the energy
radiating effect.
[0025] Referring to FIG. 4, a heat pipe 50 is tightly arranged to
the base 20 with one end of the heat pipe 50 and another end
thereof to the fins 30 to improve the heat conduction. Also, high
energy radiating oxide layers 40 are formed onto surfaces of the
base 20, fins 30 and selectively onto a surface of the heat pipe 50
by the anodizing process.
[0026] Another embodiment of the heat dissipating device of the
present invention having at least one heat pipe 50 is illustrated
in FIG. 5. One end of the at least one heat pipe 50 is arranged to
a plurality of fins 30 and another end thereof is arranged to a
base 20, or directly attached to a heat source 60. Oxide layers 40
of aluminum oxide are formed onto surfaces of the fins 30 and the
heat pipe 50 to improve the energy radiating effect. By adjusting
the voltages and processing time of the anodizing process,
different color and thickness of oxide layer 40 can be formed to
the fins 30.
[0027] Therefore, according to the present invention, the base 20,
fins 30, and the heat pipe 50 are applied to a heat dissipating
device by the needs. By the anodizing process, oxide layers 40 are
formed to the surfaces (as shown in FIG. 6). By adjusting the
voltages and processing time of the anodizing process, different
color and thickness of oxide layer 40 can be formed so as to form a
visible appearance thereto and an anti-pollution ability. After the
temperature of the heat dissipating device 10 is lowered, a
temperature difference will improve the heat conduction from the
heat source to the heat dissipating device 10. By the temperature
gradient and interaction between, the contact temperature of the
heat dissipating device 10 will be lowered and the heat will be
efficiently dissipated.
[0028] With reference to FIGS. 7 and 8, an exploded drawing and an
assembly drawing of another embodiment of the present invention are
illustrated. A heat dissipating device 10a have a cylindrical base
20a and a plurality of fins 30a assembled to an outer surface of
the cylindrical base 20a. The base 20a and/or the fins 30a are made
of aluminum. By the anodizing process, high energy radiating oxide
layers 40a are formed to the surfaces of the base 20a and/or the
fins 30a. By adjusting the voltages and processing time of the
anodizing process, color and thickness of oxide layer 40a can be
adjusted.
[0029] The assembling of the base 20a, fins 30a of the present
invention can be performed by the following orders. One is to
anodize the base 20a and/or the fins 30a separately to form high
energy radiating oxide layers 40a onto surfaces thereof, and then
to tightly combine the base 20a and the fins 30a as a finished heat
dissipating device 10a by a combining process. The other way is to
combine the base 20a and the fins 30a as a heat dissipating device
10a first, and then to anodize the heat dissipating device 10a to
form oxide layers 40a onto surfaces of the base 20a and the fins
30a to increase the energy radiating effect.
[0030] Additionally, a carrier 70a is arranged to an end or an
inside of the base 20a for being installed by a heat source. By the
anodizing process, the high energy radiating oxide layer 40a is
formed to a surface of the carrier 70a to improve the energy
radiating effect.
[0031] With reference to FIGS. 9, and 10, an exploded drawing and
an assembly drawing of one another embodiment of the present
invention are illustrated. A heat dissipating device 10c have a
cylindrical base 20c and a plurality of fins 30c assembled to an
outer surface of the cylindrical base 20c. The base 20c and the
fins 30c are integral made of aluminum. By the anodizing process,
high energy radiating oxide layers 40c are formed to the surfaces
of the base 20c and/or the fins 30c. Additionally, a carrier 70c is
arranged to an end or an inside of the base 20c for being installed
by a heat source. By the anodizing process, the high energy
radiating oxide layer 40c is formed to a surface of the carrier 70c
to improve the energy radiating effect.
[0032] The present invention is thus described, it will be obvious
that the same may be varied in many ways. Such variations are not
to be regarded as a departure from the spirit and scope of the
present invention, and all such modifications as would be obvious
to one skilled in the art are intended to be included within the
scope of the following claims.
* * * * *