U.S. patent application number 12/632769 was filed with the patent office on 2011-02-24 for plate-type heat pipe.
This patent application is currently assigned to FOXCONN TECHNOLOGY CO., LTD.. Invention is credited to CHUEN-SHU HOU.
Application Number | 20110042044 12/632769 |
Document ID | / |
Family ID | 43604357 |
Filed Date | 2011-02-24 |
United States Patent
Application |
20110042044 |
Kind Code |
A1 |
HOU; CHUEN-SHU |
February 24, 2011 |
PLATE-TYPE HEAT PIPE
Abstract
A plate-type heat pipe includes a top cover, a bottom cover, a
first wick structure and a second wick structure. The bottom cover
hermetically contacts with the top cover to form a container. A
plurality of working fluid is contained in the container. The
bottom cover has a heat absorbing plate. The first wick structure
is adhered to inner surfaces of the top and bottom covers. The
second wick structure is sandwiched between the top and bottom
covers. Top and bottom ends of the second wick structure abut
against the inner surface of the top cover and a central portion of
the heat absorbing plate of the bottom cover. An area of the bottom
end is smaller than that of the heat absorbing plate.
Inventors: |
HOU; CHUEN-SHU; (Tu-Cheng,
TW) |
Correspondence
Address: |
Altis Law Group, Inc.;ATTN: Steven Reiss
288 SOUTH MAYO AVENUE
CITY OF INDUSTRY
CA
91789
US
|
Assignee: |
FOXCONN TECHNOLOGY CO.,
LTD.
Tu-Cheng
TW
|
Family ID: |
43604357 |
Appl. No.: |
12/632769 |
Filed: |
December 7, 2009 |
Current U.S.
Class: |
165/104.26 |
Current CPC
Class: |
F28D 15/0233 20130101;
F28D 15/046 20130101 |
Class at
Publication: |
165/104.26 |
International
Class: |
F28D 15/04 20060101
F28D015/04 |
Foreign Application Data
Date |
Code |
Application Number |
Aug 19, 2009 |
CN |
200910305820.0 |
Claims
1. A plate-type heat pipe comprising: a top cover; a bottom cover
hermetically contacting with the top cover to form a container, a
plurality of working fluid contained in the container, the bottom
cover having a heat absorbing plate; a first wick structure adhered
to inner surfaces of the top and bottom covers; and a second wick
structure sandwiched between the top and bottom covers, top and
bottom ends of the second wick structure abutting against the inner
surface of the top cover and the inner surface of the heat
absorbing plate of the bottom cover, respectively; wherein an area
of the bottom end of the second wick structure is smaller than that
of the heat absorbing plate.
2. The plate-type heat pipe as claimed in claim 1, wherein the
second wick structure has a bugle-shaped configuration and a width
of thereof decreases from top to bottom.
3. The plate-type heat pipe as claimed in claim 2, wherein a
through hole is defined in a central portion of the second wick
structure from top to bottom.
4. The plate-type heat pipe as claimed in claim 1, wherein the
second wick structure is cylindrical.
5. The plate-type heat pipe as claimed in claim 4, wherein a
through hole is defined in a central portion of the second wick
structure from top to bottom.
6. The plate-type heat pipe as claimed in claim 1, wherein the
first wick structure has two first wick portions respectively
extending inwardly from two ends of the inner surface of the top
cover to a central portion of the inner surface of the top cover,
inner ends of the two first wick portions spaced from each other
and a second wick portion mounted on the inner surface of the
bottom surface.
7. The plate-type heat pipe as claimed in claim 6, wherein the
bottom cover comprises two extending plates extending outwardly
from opposite ends of the heat absorbing plate and located at above
of the heat absorbing plate, the second wick portion comprises two
first wick section adhered to an inner surface of the heat
absorbing plate and respectively extending inwardly from two ends
of the inner surface of the heat absorbing plate to a central
portion of the inner surface of the heat absorbing plate, inner
ends of the two first wick sections spaced from each other.
8. The plate-type heat pipe as claimed in claim 7, wherein opposite
ends of the second wick structure abut against the central portion
of the inner surface of the top cover and the central portion of
the inner surface of the heat absorbing plate.
9. The plate-type heat pipe as claimed in claim 7, wherein the
first wick section is thinner than the second wick section.
10. The plate-type heat pipe as claimed in claim 7, wherein the
bottom cover further comprises two sidewalls extending upwardly
from the two extending plates and support the top cover, two third
wick sections extending outwardly from the two second wick sections
full with two corners defined by the sidewalls and the extending
plates of the bottom cover.
11. The plate-type heat pipe as claimed in claim 10, wherein a
cross section of the third section is triangle and thickness of the
third section decreases from a central portion to opposite ends.
Description
BACKGROUND
[0001] 1. Technical Field
[0002] The present disclosure relates to heat pipes and, more
particularly, to a plate-type heat pipe having a good heat
dissipation efficiency and a stable and reliable performance.
[0003] 2. Description of Related Art
[0004] Generally, plate-type heat pipes efficiently dissipate heat
from heat-generating components such as a central processing unit
(CPU) of a computer. A conventional plate-type heat pipe comprises
a container, a continuous wick structure adhered to an inner
surface of the container, and a working fluid contained in the
container. Because a space between electronic components is narrow,
the plate-type heat pipe is thin. When a bottom of the container
absorbs heat of the electronic component, the working fluid located
at a lower portion of the container is vaporized and moves to an
upper portion of the container; at the upper portion of the
container, the vaporized working fluid is cooled to a condensed
working fluid. However, during the vaporized working fluid rushing
up to the upper portion of the container, the vaporized working
fluid may impact and disperse the condensed working fluid. Thus, a
speed of the condensed working fluid flowing back to the bottom of
the container decreases. The plate-type heat pipe is prone to be
dried.
[0005] What is needed, therefore, is a plate-type heat pipe having
a good heat dissipation efficiency and a stable performance.
BRIEF DESCRIPTION OF THE DRAWINGS
[0006] FIG. 1 is a cross-section view of a plate-type heat pipe in
accordance with a first embodiment of the present disclosure.
[0007] FIG. 2 is a cross-section view of a second wick structure of
a plate-type heat pipe in accordance with a second embodiment of
the present disclosure.
[0008] FIG. 3 is a cross-section view of a second wick structure of
a plate-type heat pipe in accordance with a third embodiment of the
present disclosure.
[0009] FIG. 4 is a cross-section view of a second wick structure of
a plate-type heat pipe in accordance with a fourth embodiment of
the present disclosure.
DETAILED DESCRIPTION
[0010] Referring to FIG. 1, it illustrates a plate-type heat pipe
in accordance with a first embodiment of the present disclosure.
The plate-type heat pipe comprises a bottom cover 10, a top cover
30, a continuous first wick structure 50, and a second wick
structure 70. The bottom cover 10 and the top cover 30 form a
hermetical container. A plurality of working fluid is contained in
the container. The first wick structure 50 is adhered to an inner
surface of the container. Opposite ends of the second wick
structure 70 abut against the top cover 30 and the bottom cover
10.
[0011] The bottom cover 10 has a bowl-shaped configuration and is a
metallic sheet. The bottom cover 10 comprises a bottom plate 11 and
two sidewalls 13 extending perpendicularly and upwardly from
opposite ends of the bottom plate 11. The bottom plate 11 comprises
an elongated heat absorbing plate 113 and two extending plates 115
extending outwardly from opposite ends of the heat absorbing plate
113. The heat absorbing plate 113 is below the extending plates
115. The sidewalls 13 extend perpendicularly and upwardly from the
extending plates 115. The top cover 30 is flat and hermetically
contacts with the sidewalls 13. The continuous first wick structure
50 is adhered to inner surfaces of the bottom cover 10 and the top
cover 30.
[0012] The first wick structure 50 comprises two first wick
portions 51 adhered to the inner surface of the top cover 30 and a
second wick portion 53 adhered to the inner surface of the bottom
cover 10. The two first wick portions 51 respectively extend
inwardly from two ends of the inner surface of the top cover 30 to
a central portion of the inner surface of the top cover, inner ends
of the two first wick portions 51 space from each other. The second
wick portion 53 comprises two first wick sections 531, two second
wick sections 533 and two third wick sections 535. The two first
wick sections 531 are adhered to an inner surface of the heat
absorbing plate 113 and respectively extend inwardly from two ends
of the inner surface of the heat absorbing plate 113 to a central
portion of the inner surface of the heat absorbing plate 113; inner
ends of the two first wick sections 531 space from each other. The
second wick sections 533 are adhered to inner surfaces of the
extending plates 115. The third sections 535 are adhered to corners
defined by the sidewalls 13 and the extending plates 115. The third
wick sections 535 full with the corners. A thickness of the first
wick section 531 is thinner than that of the second wick section
533. Thus, the working fluid contained in the first wick section
531 is vaporized from the first wick section 531 easily. A
thickness of the third section 535 is larger than that of the
second section 353. A cross-section of the third section 535 is a
triangle and the thickness of the third section 535 decreases from
a central portion to opposite ends.
[0013] The second wick structure 70 is located at a central portion
of the plate-type heat pipe and opposite ends thereof abut against
the central portion of the inner surface of the top cover 30 and
the central portion of the inner surface of the heat absorbing
plate 113 of the bottom plate 11 of the bottom cover 10. The second
wick structure 70 has a bugle-shaped configuration and a width of
the second wick structure 70 decreases from top to bottom. The
second wick structure 70 communicates with the first wick structure
50. An area of a bottom end of the second wick structure 70 which
contacts with the heat absorbing plate 113 is smaller than that of
the heat absorbing plate 113.
[0014] When the plate-type heat pipe is used, the work fluid is
vaporized. The vaporized work fluid rushes up to a top portion of
the plate-type heat pipe and rushes to opposite ends of the
plate-type heat pipe. The vaporized work fluid can not arrived at
the corners formed by the sidewalls 13 and the extending plates 115
of the bottom plate 11 of the bottom cover 10 and the central
portion of the plate-type heat pipe. The third wick sections 535 of
the first wick structure 50 full with the corners to guide the
condensed working fluid of opposite ends of the first wick
structure 50 back to the heat absorbing plate 113 quickly. The
second wick structure 70 fulls with the central portion of the
plate-type heat pipe to guide the condensed working fluid of a
central portion of the first wick structure 50 back to the heat
absorbing plate 113 quickly and don't change a path of the
vaporized work fluid.
[0015] Referring to FIG. 2, it illustrates a second wick structure
70a of a plate-type heat pipe of a second embodiment of the present
disclosure. A difference between the second wick structures 70, 70a
is that a through hole 71 is defined at a central portion of the
wick structure 70a from top to bottom. The through hole 71
communicates the central portion of the inner surface of the top
cover 30 and the central portion of the inner surface of the heat
absorbing plate 113 of the bottom plate 11. The through hole 71 has
a bugle-shaped configuration and a width thereof decreases from top
to bottom.
[0016] Referring to FIG. 3, it illustrates a second wick structure
70b of a plate-type heat pipe of a third embodiment of the present
disclosure. A difference between the second wick structures 70, 70b
is that the second wick structure 70b is cylindrical.
[0017] Referring to FIG. 4, it illustrates a second wick structure
70c of a plate-type heat pipe of a fourth embodiment of the present
disclosure. A difference between the second wick structures 70b,
70c is that a through hole 73 is defined in a central portion of
the second wick structure 70b from top to bottom. A cross section
of the through hole 73 is rectangular. The through hole 73
communicates the central portion of the inner surface of the top
cover 30 and the central portion of the inner surface of the heat
absorbing plate 113 of the bottom plate 11.
[0018] It is to be understood, however, that even though numerous
characteristics and advantages of the disclosure have been set
forth in the foregoing description, together with details of the
structure and function of the disclosure, the disclosure is
illustrative only, and changes may be made in detail, especially in
matters of shape, size, and arrangement of parts within the
principles of the disclosure to the full extent indicated by the
broad general meaning of the terms in which the appended claims are
expressed.
* * * * *