U.S. patent application number 12/936850 was filed with the patent office on 2011-02-17 for sheet peeling apparatus and sheet peeling method.
This patent application is currently assigned to LINTEC CORPORATION. Invention is credited to Hideaki Kato.
Application Number | 20110036477 12/936850 |
Document ID | / |
Family ID | 41161786 |
Filed Date | 2011-02-17 |
United States Patent
Application |
20110036477 |
Kind Code |
A1 |
Kato; Hideaki |
February 17, 2011 |
SHEET PEELING APPARATUS AND SHEET PEELING METHOD
Abstract
A sheet peeling apparatus 10 includes: a sticking means 14 for
sticking a peeling tape PT by pressing the peeling tape PT onto an
adhesive sheet S; a moving means 15 for moving the peeling tape PT
stuck to the adhesive sheet S and a holding means 11 for holding a
wafer W relative to each other to peel the adhesive sheet S; a
detecting means 17 for detecting the position of the outer
periphery of the adhesive sheet S, and outputting a signal thereof;
an input means 18 for inputting a correction value; a controlling
means 19 for determining a pressing position of the peeling tape PT
to the adhesive sheet S based on the output signal from the
detecting means 17 and the correction value, and controlling the
moving means 15 so as to stick the adhesive sheet S at the pressing
position.
Inventors: |
Kato; Hideaki; (Tokyo,
JP) |
Correspondence
Address: |
WESTERMAN, HATTORI, DANIELS & ADRIAN, LLP
1250 CONNECTICUT AVENUE, NW, SUITE 700
WASHINGTON
DC
20036
US
|
Assignee: |
LINTEC CORPORATION
Itabashi-ku, Tokyo
JP
|
Family ID: |
41161786 |
Appl. No.: |
12/936850 |
Filed: |
March 16, 2009 |
PCT Filed: |
March 16, 2009 |
PCT NO: |
PCT/JP2009/055013 |
371 Date: |
October 7, 2010 |
Current U.S.
Class: |
156/64 ;
156/378 |
Current CPC
Class: |
B65H 35/0013 20130101;
H01L 21/67132 20130101; B65H 2301/44335 20130101; B65G 2207/02
20130101; B65H 29/54 20130101 |
Class at
Publication: |
156/64 ;
156/378 |
International
Class: |
B32B 38/10 20060101
B32B038/10 |
Foreign Application Data
Date |
Code |
Application Number |
Apr 11, 2008 |
JP |
2008-103401 |
Claims
1. A sheet peeling apparatus for sticking a peeling tape to an
adhesive sheet stuck to an adherend, and peeling off the adhesive
sheet from the adherend through the peeling tape, comprising: a
holding means for holding the adherend; a feeding means for feeding
out the peeling tape; a sticking means for sticking the peeling
tape by pressing the peeling tape onto the adhesive sheet; a moving
means for moving the peeling tape stuck to the adhesive sheet and
the holding means relative to each other to peel the adhesive
sheet; a detecting means for detecting the position of the outer
periphery of the adhesive sheet stuck to the adherend, and
outputting a signal thereof; an input means for inputting a
correction value for performing a predetermined control of the
moving means; and a controlling means for determining a pressing
position of the peeling tape to the adhesive sheet based on the
output signal from the detecting means and the correction value
from the input means, and controlling the moving means so as to
perform the sticking at the pressing position.
2. The sheet peeling apparatus according to claim 1, wherein the
correction value is a protrusion amount of the outer periphery of
the adhesive sheet, from the outer periphery of the adherend, and
the controlling means adjusts, by the protrusion amount, the
movement amount of the holding means by the moving means when
determining the pressing position.
3. The sheet peeling apparatus according to claim 1 or 2, wherein
the sticking means has a heating means capable of heating the
peeling tape.
4. A sheet peeling method for sticking a peeling tape to an
adhesive sheet stuck to an adherend, and peeling off the adhesive
sheet from the adherend through the peeling tape, comprising steps
of: holding the adherend by a holding means; detecting a position
of the outer periphery of the adhesive sheet stuck to the adherend;
determining a pressing position of the peeling tape to the adhesive
sheet based on the detected position of the outer periphery thereof
and a correction value inputted by an input means; feeding out the
peeling tape; sticking the peeling tape at the determined pressing
position; and peeling the adhesive sheet by a relative movement of
the peeling tape stuck to the adhesive sheet and the holding
means.
5. The sheet peeling method according to claim 4, wherein the
correction value is a protrusion amount of the outer periphery of
the adhesive sheet, from the outer periphery of the adherend, and
the movement amount of the holding means is adjusted by the
protrusion amount when determining the pressing position.
Description
FIELD OF THE INVENTION
[0001] The present invention relates to a sheet peeling apparatus
and a sheet peeling method, more particularly to a sheet peeling
apparatus and a sheet peeling method suitable for adhering a
peeling tape to an adhesive sheet stuck to an adherend, and peeling
off the adhesive sheet through the peeling tape.
BACKGROUND OF THE ART
[0002] Semiconductor wafers (hereinafter, simply referred to as
"wafer") are stuck with a protective adhesive sheet on the circuit
surface thereof. After the wafers are subjected to various
processes such as a rear face grinding process, the adhesive sheet
is peeled. A peeling apparatus for such adhesive sheet is disclosed
in e.g. Patent Document 1. In the document, a wafer is integrated
with a ring frame through a mounting tape in order to ensure
handleability thereof. A process of peeling off an adhesive sheet
from the wafer is carried out by sticking a peeling tape to the
outer periphery side of the adhesive sheet before moving the
peeling tape relative to a table for supporting the wafer together
with the ring frame.
Patent Document 1: Japanese Patent Application Laid-Open No.
2007-43047
SUMMARY OF THE INVENTION
Problems to be Solved by the Invention
[0003] However, in such arrangement, there arises such a
disadvantage that when sticking the peeling tape, the adhesive
sheet protruded outside the outer periphery of the wafer tends to
adhere to the mounting tape. In particularly, as shown in FIG. 6,
in the case of the wafer being chamfered so as to have the outer
circumference thereof with a curved surface R, when the wafer W is
subjected to rear face grinding after cutting the adhesive sheet S
along the outer edge of the wafer, a protrusion H as described
above increases, so that the above disadvantage becomes
significant. This results in adhering the adhesive sheet to the
mounting tape. In such a state, when the adhesive sheet is peeled
off, there arises such a disadvantage that the mounting tape is
pulled out by the peeling tape, thereby causing damage to the
wafer.
[0004] In general, it is preferable that a sticking position of the
peeling tape to the adhesive sheet is as close to the outer
periphery of the wafer as possible, in order to make peeling off of
the adhesive sheet easy in the early stage of the peeling.
Therefore, it is considered to detect the position of the outer
periphery of the adhesive sheet by using a sensor, and to control
the detected position as the sticking position of the peeling tape.
However, in this case, when the adhesive sheet is protruded outside
the outer periphery of the wafer, such protruded part adheres to
the mounting tape, and therefore there arises a disadvantage as
described above. Accordingly, the advent of a sheet peeling
apparatus and a sheet peeling method have been desired which are
capable of preventing the adhesive sheet protruded outside it from
adhering to another part, while the position of the peeling tape is
brought close to the outer periphery of the wafer.
OBJECT OF THE INVENTION
[0005] The present invention has been made in view of the desire.
It is an object of the present invention to provide a sheet peeling
apparatus and a sheet peeling method capable of peeling off an
adhesive sheet, by sticking a peeling tape, while preventing an
adhesive tape protruded outside the outer periphery of an adherend
from adhering to another part.
Means for Solving Problems
[0006] In order to achieve the above object, the present invention
adopts such an arrangement that a sheet peeling apparatus for
sticking a peeling tape to an adhesive sheet stuck to an adherend,
and peeling off the adhesive sheet from the adherend through the
peeling tape, includes:
[0007] a holding means for holding the adherend; a feeding means
for feeding out the peeling tape; a sticking means for sticking the
peeling tape by pressing the peeling tape onto the adhesive sheet;
a moving means for moving the peeling tape stuck to the adhesive
sheet and the holding means relative to each other to peel the
adhesive sheet; a detecting means for detecting the position of the
outer periphery of the adhesive sheet stuck to the adherend, and
outputting a signal thereof; an input means for inputting a
correction value for performing a predetermined control of the
moving means; and a controlling means for determining a pressing
position of the peeling tape to the adhesive sheet based on the
output signal from the detecting means and the correction value
from the input means, and controlling the moving means so as to
perform the sticking at the pressing position.
[0008] Preferably, in the present invention, the correction value
is a protrusion amount of the outer periphery of the adhesive
sheet, from the outer periphery of the adherend, and
[0009] the controlling means adjusts, by the protrusion amount, the
movement amount of the holding means by the moving means when
determining the pressing position.
[0010] Also, such an arrangement is preferably adopted that the
sticking means has a heating means capable of heating the peeling
tape.
[0011] Further, a peeling method of the present invention adapts a
sheet peeling method for sticking a peeling tape to an adhesive
sheet stuck to an adherend, and peeling off the adhesive sheet from
the adherend through the peeling tape, including steps of:
[0012] holding the adherend by a holding means;
[0013] detecting a position of the outer periphery of the adhesive
sheet stuck to the adherend;
[0014] determining a pressing position of the peeling tape to the
adhesive sheet based on the detected position of the outer
periphery thereof and a correction value inputted by an input
means;
[0015] feeding out the peeling tape;
[0016] sticking the peeling tape at the determined pressing
position; and
[0017] peeling the adhesive sheet by a relative movement of the
peeling tape stuck to the adhesive sheet and the holding means.
[0018] Furthermore, in the peeling method of the present invention,
preferably, the correction value is a protrusion amount of the
outer periphery of the adhesive sheet, from the outer periphery of
the adherend, and
[0019] the movement amount of the holding means is adjusted by the
protrusion amount when determining the pressing position.
EFFECT OF THE INVENTION
[0020] According to the present invention, the adhesive sheet can
be stuck by correcting the pressing position of the peeling tape
with respect to the position of the outer periphery of the detected
adhesive sheet. Thus, even when the adhesive tape is protruded
outside the outer periphery of the adherend, it is possible to
prevent the pressed adhesive sheet from adhering to the mounting
tape or the like. Therefore, the adhesive sheet can be peeled off
without any difficulty. Further, it is possible to avoid causing
damage to the adherend such as the wafer due to the mounting tape
and the like being pulled by such peeling operation. In addition,
the pressing position of the peeling tape can be brought close to
the outer periphery of the adherend, so that peeling can be carried
out smoothly in the early stage of the peeling.
BRIEF DESCRIPTION OF THE DRAWINGS
[0021] FIG. 1 is a front view schematically showing a sheet peeling
apparatus in accordance with an embodiment.
[0022] FIG. 2 is an explanatory view of a pinch roller.
[0023] FIG. 3 is an explanatory view showing a state that a
detecting means detects the outer periphery of an adhesive
sheet.
[0024] FIG. 4 is an explanatory view showing a state that a
sticking means sticks a peeling tape.
[0025] FIG. 5 is an explanatory view showing a state that the
adhesive sheet is being peeled off.
[0026] FIG. 6 is an explanatory view showing a state that a wafer
is subjected to a rear face grinding and thus a protrusion is
formed.
EXPLANATION OF REFERENCE NUMERALS
[0027] 10: sheet peeling apparatus [0028] 11: holding means [0029]
12: feeding means [0030] 14: sticking means [0031] 15: moving means
[0032] 17: detecting means [0033] 18: input means [0034] 19:
controlling means [0035] 34A: heater (heating means) [0036] PT:
peeling tape [0037] S: adhesive sheet [0038] W: semiconductor wafer
(adherend)
DESCRIPTION OF THE PREFERRED EMBODIMENTS
[0039] Hereinafter, embodiments of the present invention will be
described with reference to the drawings.
[0040] FIG. 1 is a front view schematically showing a sheet peeling
apparatus according to an embodiment. In this figure, a sheet
peeling apparatus 10 comprises: a holding means 11 comprising a
table for holding a wafer W as an adherend by sucking the wafer W
on the upper face thereof; a feeding means 12 for feeding out a
strip of a peeling tape PT to be adhered to a protective adhesive
sheet S which is stuck to a circuit surface (upper surface) of the
wafer W; a sticking means 14 for sticking a lead end side of the
peeling tape PT to the outer periphery side of the adhesive sheet
S; a moving means 15 for moving the holding means 11 in the right
and left directions in FIG. 1, the moving means 15 comprising a
linear motor 15A and a slider 15B thereof; a detecting means 17
capable of detecting a position of the outer periphery of the
adhesive sheet S; an input means 18 for inputting a correction
value described below; and a controlling means 19 for performing a
predetermined control of the holding means 11, the feeding means
12, the sticking means 14, and the moving means 15.
[0041] The wafer W is placed inside an opening of a ring frame RF.
The wafer W is integrated with the ring frame RF through a mounting
tape MT stuck to the opposite surface (lower surface) of the
circuit surface, and held by the holding means 11 in such
integrated state. Further, in the embodiment, the outer periphery
of the adhesive sheet S is protruded outside the outer periphery of
the wafer W because the wafer W is made extremely thin, as
mentioned above (see FIG. 6).
[0042] The feeding means 12 comprises: a support shaft 21 for
supporting the wound peeling tape PT; a plurality of guide rollers
22 around which the peeling tape PT is laid; a drive roller 26
rotatably provided through a motor M1; a pinch roller 27 for
pinching the peeling tape PT between the drive roller 26 and the
pinch roller 27: a chuck 28 comprising upper and lower chucks 28A,
28B, the chuck 28 being provided on the left side of the drive
roller 26 and the pinch roller 27, and capable of being moved
closer to/away from each other in a vertical direction. Note that
the chuck 28 is arranged to be movable in the right and left
directions in FIG. 1 through a drive unit (not shown).
[0043] The support shaft 21 is rotatably supported by a frame F
through a motor M2. As shown in FIG. 2, the pinch roller 27 is
divided into three portions, and mounted on a rotary shaft 27B to
form clearances 27A. Each clearance 27A is arranged such that a
substantially horizontally-oriented shaft-shaped guide member 30
can pass through the clearance. Each guide member 30 is provided so
as to move forward and backward through a cylinder 31, so as to
appear on the left side of the drive roller 26 and the pinch roller
27 in FIG. 1. Thus, the guide member 30, as indicated in the
dashed-two dotted lines in FIG. 1, can support the peeling tape PT
fed out to the left side of the drive roller 26 and the pinch
roller 27 from below, and guide a lead end region thereof to a
position at which the chuck 28 can grasp the region.
[0044] The sticking means 14 comprises: a linear motor 33; and a
pressing head 34 having a heater 34A, as a heating means, which is
provided so as to move forward and backward in a vertical direction
by the linear motor 33. By pressing and heating, with the pressing
head 34, the peeling tape PT fed out on the upper surface side of
the adhesive sheet S by the chuck 28, the sticking means 14 is
configured to weld the peeling tape PT to the adhesive sheet S to
bond them.
[0045] A tape cutting means 36 is provided on the right side of the
sticking means 14. The tape cutting means 36 comprises a cutter
blade 37, a cutting cylinder 38 for moving the cutter blade 37 in a
direction perpendicular to the paper surface in FIG. 1, and a
vertical cylinder 39 for moving the cutting cylinder 38 in a
vertical direction in FIG. 1.
[0046] The detecting means 17 comprises a sensor provided in the
lower section of the frame F on the right side of the pinch roller
27. The detecting means 17 is arranged to detect a position of the
outer periphery of the adhesive sheet S passing directly under the
detecting means 17 while the wafer is moved by the moving means 15,
and be able to output a position signal which corresponds to the
detected position to the controlling means 19.
[0047] The input means 18 comprises a touch panel and the like
which is connected electrically to the controlling means 19. The
input means 18 can input a correction value of the movement amount
of the holding means 11 by the moving means 15, and operating
conditions and data of each means controlled through the
controlling means 19; and can output them to the controlling means
19.
[0048] The controlling means 19 includes the following functions:
inputting the position signal by detected and outputted by the
detecting means 17; storing data such as the correction value
inputted by the input means 18; determining a pressing position of
the peeling tape PT onto the adhesive sheet S based on an output
signal from the detecting means 17 and the correction value from
the input means 18; and controlling the movement amount of the
moving means 15 and a timing of pressing of the sticking means 14
so that the peeling tape PT is stuck at the pressing position.
[0049] Next, a method for peeling an adhesive sheet S using the
sheet peeling apparatus 10 will be now described.
[0050] Initially, the peeling tape PT pulled out of the support
shaft 21 is laid around each guide roller 22, and then the lead end
side of the peeling tape PT is passed between the drive roller 26
and the pinch roller 27. A protrusion amount H of the outer
periphery of the adhesive sheet S from the outer periphery of the
wafer W (see FIG. 3) is inputted as the correction value through
the input means 18. Moreover, a horizontal distance H1 from the
detecting means 17 to the pressing head 34 (see FIG. 4) is stored
in advance in the controlling means 19. Note that the protrusion
amount H can be computed from a relation between a cut radius of
the adhesive sheet S and a grinding amount of the wafer W.
[0051] Firstly, the wafer W integrated with the ring frame RF is
held on the upper surface of the holding means 11 through a
conveying means (not shown). Then, as indicated in the dashed-two
dotted lines in FIG. 3, the holding means 11 is moved through the
moving means 15 such that the outer periphery on the right side of
the adhesive sheet S in FIG. 1 is located on the right side of the
detecting means 17. Then, the holding means 11 is moved to left
while the detecting means 17 performs a sensing. An indicated with
a solid line in FIG. 3, when the right outer periphery of the
adhesive sheet S has moved to a position directly under the
detecting means 17, the detecting means 17 detects such right outer
periphery, and outputs a coordinate thereof as a signal to the
controlling means 19.
[0052] Secondly, the controlling means 19 determines a movement
distance H2 of the holding means 11 by means of the following
equation (1) to control the moving means 15,
Movement distance H2=Horizontal distance H1-Protrusion amount H
(1)
where the movement distance H2 is a distance from a position at
which the detecting means 17 detects the right outer periphery of
the adhesive sheet S to a position at which the holding means 11 is
stopped and stands by to press the peeling tape PT with the
pressing head 34.
[0053] Based on this, the movement amount of the holding means 11
by the moving means 15 is adjusted to be displaced by the
protrusion amount H relative to the horizontal distance H1, so that
the pressing position of the peeling tape PT is determined.
[0054] The motor M1 is activated to rotate the drive roller 26, so
that the peeling tape PT having a predetermined length is fed out
on the left side of the drive roller 26 and the pinch roller 27.
Subsequently, the cylinder 31 is activated to move forward the
guide member 30 to a position indicated in the dashed-two dotted
lines in FIG. 1, and a driving means (not show) is activated to
position the guide member 30 and the peeling tape PT between upper
and lower chucks 28A, 28B. Then, the guide member 30 retreats, and
upper and lower chucks 28A, 28B approach each other to grasp the
peeling tape PT. After that, the peeling tape PT is pulled out by
moving the chuck 28 to left, and the peeling tape PT is positioned
below the pressing head 34.
[0055] Then, as shown in FIG. 4, the pressing head 34 heated by the
heater 34A is moved downward with the linear motor 33, and presses
the peeling tape PT on the adhesive sheet S while heating it to
stick the peeling tape PT to the adhesive sheet S. At this time,
since the step for setting a sticking position as mentioned above
is performed, the adhesive sheet S is not adhered to the mounting
tape MT by being pressed with the pressing head 34, and the
sticking position of the peeling tape PT can be brought to the
outer periphery of the wafer W as close as possible.
[0056] After the peeling tape PT is stuck to the adhesive sheet S,
the grasp of the peeling tape PT by the chuck 28 is released, and
the motor M1 locks the rotation of the drive roller 26. Then, as
shown in FIG. 5, the supporting means 11 is moved to right through
the moving means 15 such that the peeling tape PT stuck to the
adhesive sheet S and the holding means 11 are moved relative to
each other in the right and left directions in FIG. 5. Thus, the
adhesive sheet S is folded on the wafer W, so that the adhesive
sheet S is peeled off from the right outer periphery in FIG. 5. At
this time, since setting the sticking position of the peeling tape
PT as mentioned above, the mounting tape MT is not pulled by the
peeling tape PT, and therefore there arises no trouble such as
causing damage to the wafer W.
[0057] When peeling off of the adhesive sheet S is finished, the
adhesive sheet S stuck to the peeling tape PT hangs on the left
side of the drive roller 26 and the pinch roller 27. In such a
state, the guide member 30 is moved forward and the cylinders 38,
39 are activated to cut the peeling tape PT on the guide member 30.
Then, the holding means 11 returns to the left position. The wafer
W with ring frame RF is conveyed in place by the conveying means
(not shown), and a new wafer W with the ring frame RF is
transferred onto the holding means 11. From this time, the above
operations are performed likewise.
[0058] Therefore, according to this embodiment, the pressing head
34, can press the peeling tape PT on the outer periphery of the
wafer W. Even when the outer periphery of the adhesive sheet S is
protruded outside the outer periphery of the wafer W, the protruded
adhesive sheet S can be prevented from being pressed. Thus, the
adhesive sheet S can be avoided from adhering to the mounting tape
MT, and can be prevented from causing damage to the wafer W when
peeled.
[0059] The best arrangement and method and the like for carrying
out the present invention have been disclosed so far. However, the
present invention is not limited to the above.
[0060] That is, the present invention has been illustrated and
described mainly about a specific embodiment. However, it is
possible for those skilled in the art to add various modifications,
if necessary, to the above-described embodiment with respect to the
shape, position and/or disposition without departing from the
technical spirit and the range of the object of the present
invention.
[0061] Accordingly, it is to be understood that the descriptions
limited in the shape and the like disclosed above are meant to be
merely illustrative and explanatory to facilitate understanding of
the present invention and not to limit the invention. Therefore,
descriptions by names of the elements by removing a part or all of
the limitations such as about the shape shall be included in the
present invention.
[0062] For example, a calculating method for determining the
pressing position of the pressing head 34 in the controlling means
19 is not limited to the above equation (1), but may be modified
variously as long as the pressing position is calculated based on
the output signal from the detecting means 17 and the correction
value from the input means 18, and the adhesive sheet S protruded
outside can be prevented from adhering to other portion while the
pressing position is brought close to the outer periphery of the
wafer W. In particular, by setting the correction value from the
input means 18 to the movement distance H2, the pressing position
of the peeling tape PT by the pressing head 34 may be determined
base on the movement distance H2 and the output signal from the
detecting means 17.
[0063] Also, the adherends in the present invention are not limited
to semiconductor wafers, but may include other adherends such as
glass plates, steel plates, or resin plates, and semiconductor
wafers may be silicon wafers or compound wafers.
[0064] Further, the peeling tape PT may adopt a pressure-sensitive
adhesive tape other than a heat-sensitive adhesive tape.
[0065] Furthermore, the relative movement between the peeling tape
PT and the holding means 11 may be adapted as follows: the peeling
tape PT is moved to left in FIG. 5 while the holding means 11 is
stopped, or both are moved away from each other.
[0066] Still furthermore, the sensor constituting the detecting
means 17 may be a phototube, an area sensor, a camera, or the
like.
[0067] Yet still furthermore, the controlling means 19 may include
a sequencer, personal computer, and the like.
* * * * *