U.S. patent application number 12/906762 was filed with the patent office on 2011-02-10 for energy conditioner with tied through electrodes.
Invention is credited to William M. Anthony.
Application Number | 20110032657 12/906762 |
Document ID | / |
Family ID | 36941669 |
Filed Date | 2011-02-10 |
United States Patent
Application |
20110032657 |
Kind Code |
A1 |
Anthony; William M. |
February 10, 2011 |
Energy Conditioner With Tied Through Electrodes
Abstract
The application discloses energy conditioners that include A, B,
and G master electrodes in which the A and B electrodes include
main body electrodes with conductive paths that cross inside the
energy conditioner and which has A and B tabs at one end of the
main body electrodes conductively tied together and A and B tabs at
another end of the main body electrodes conductively tied together,
and the application also discloses novel assemblies of mounting,
contacting, integrating those energy conditioners with conductive
connection structures.
Inventors: |
Anthony; William M.; (Erie,
PA) |
Correspondence
Address: |
Kenneth C. Spafford
708 Smithson Avenue
Erie
PA
16511
US
|
Family ID: |
36941669 |
Appl. No.: |
12/906762 |
Filed: |
October 18, 2010 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
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11817618 |
Aug 31, 2007 |
7817397 |
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PCT/US06/06608 |
Feb 27, 2006 |
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12906762 |
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60661002 |
Mar 14, 2005 |
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60656910 |
Mar 1, 2005 |
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60671107 |
Apr 14, 2005 |
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60674284 |
Apr 25, 2005 |
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Current U.S.
Class: |
361/301.4 |
Current CPC
Class: |
H01G 4/228 20130101;
H01G 4/005 20130101 |
Class at
Publication: |
361/301.4 |
International
Class: |
H01G 4/30 20060101
H01G004/30 |
Claims
1. An energy conditioner with tied through electrodes comprising:
at least a plurality of feed-through electrodes, including a first,
a second, a third, a fourth and a fifth feed-through electrode;
wherein said first feed through electrode further comprises a first
main-body electrode; wherein said second feed-through electrode
further comprises a second main-body electrode; wherein said third
feed-through electrode further comprises a third main-body
electrode; wherein said fourth feed-through electrode further
comprises a fourth main-body electrode; and wherein said fifth
feed-through electrode further comprises a fifth main-body
electrode; wherein said first, second, third, fourth, and fifth
main-body electrodes each further comprise at least two opposing
conductively connected electrode tabs; wherein said first, said
third and said fifth feed-through electrodes are substantially the
same shape, and wherein said second and said fourth feed-through
electrodes are substantially the same shape; wherein said first,
said third and said fifth feed-through electrodes are each larger
than said second feed-through electrode, and wherein said first,
said third and said fifth feed through electrode are each larger
than said fourth feed-through electrode; wherein said second and
said fourth feed-through electrodes sandwich said third
feed-through electrode, and wherein said first and said fifth
feed-through electrodes sandwich said second, said third and said
fourth feed-through electrodes; wherein a dielectric material
separates and conductively isolates each of said feed-through
electrodes from one another; wherein a perimeter portion of said
second main-body electrode and a perimeter portion of said fourth
main-body electrode are in stacked alignment with one another, and
wherein said two opposing conductively connected electrode tabs of
said second main-body electrode and said two opposing conductively
connected electrode tabs of said fourth main-body electrode do not
align over one another; wherein said first feed-through electrode,
said third feed-through electrode, and said fifth feed-through
electrode are in stacked alignment with one another, and wherein
each of said two opposing conductively connected electrode tabs of
said first feed-through electrode, said third feed-through
electrode, and said fifth feed-through electrode align over one
another; a plurality of conductive material portions including a
first, a second, a third and a fourth conductive material portion;
wherein a first tab of said two opposing conductively connected
electrode tabs of each of said first feed-through electrode, third
feed-through electrode, and fifth feed-through electrode are
conductively connected to one another by said first conductive
material portion; wherein a second tab of said two opposing
conductively connected electrode tabs of each of said first
feed-through electrode, third feed-through electrode, and fifth
feed-through electrode are conductively connected to one another by
said second conductive material portion; wherein a first tab of
said two opposing conductively connected electrode tabs of each of
said second feed-through electrode and fourth feed-through
electrode are conductively connected to one another by said third
conductive material portion; wherein a second tab of said two
opposing conductively connected electrode tabs each of said second
feed-through electrode and fourth feed-through electrode are
conductively connected to one another by said fourth conductive
material portion; wherein at least a portion of said first
conductive material portion and least a portion of said second
conductive material portion conductively connect said first
feed-through electrode, said third feed-through electrode, and said
fifth feed-through electrode to one another beyond the side
surfaces of said dielectric material; and wherein at least a
portion of said third conductive material portion and at least a
portion of said fourth conductive material portion conductively
connect said second feed-through electrode and said fourth
feed-through electrode to one another beyond the side surfaces of
said dielectric material.
Description
CROSS REFERENCE TO RELATED APPLICATIONS
[0001] This application is a continuation of Application No.
11/817,618, filed Aug. 31, 2007, which is a U.S. National Stage
Application of International Application PCT/US06/06608, filed Feb.
27, 2006, which claims the benefit of provisional Application No.
60/661,002, filed Mar. 14, 2005, and provisional Application No.
60/656,910, filed Mar. 1, 2005, and provisional Application No.
60/671,107, filed Apr. 14, 2005, and provisional Application No.
60/674,284, filed Apr. 25, 2005.
[0002] The following applications are each incorporated by
reference herein: application Ser. No. 11/817,618, filed Aug. 31,
2007, International Application PCT/US06/06608, filed Feb. 27,
2006, provisional Application No. 60/661,002, filed Mar. 14, 2005,
provisional Application No. 60/656,910, filed Mar. 1, 2005,
provisional Application No. 60/671,107, filed Apr. 14, 2005, and
provisional Application No. 60/674,284, filed Apr. 25, 2005.
FIELD OF USE
[0003] This disclosure relates to energy conditioner
structures.
BACKGROUND
[0004] There is a need for effective noise filtering in electronic
devices. There is also a need for electronic components that reduce
the number of total components and connections to perform
electronic device functions, to reduce cost and improve
reliability.
SUMMARY
[0005] This disclosure addresses the foregoing needs by providing
novel structures including novel conductive layer structures and
arrangements, novel conductive layering sequences, novel energy
conditioners and decoupling capacitors, novel energy conditioner
packaging, novel conductive pad, via, and pad and via combination
configurations, and novel arrangements of decoupling capacitor or
energy conditioner bands with configurations of conductive pad,
via, and pad and via combinations.
[0006] The novel structures of a new embodiment are effective as
decoupling capacitors for power distribution systems (PDS) as well
as effective as energy conditioners for suppressing noise. Certain
embodiments of the novel decoupling capacitors and energy
conditioner structures are discrete components designed for
connection to mounting structure(s) on boards, such as PC boards,
to first level interconnects, and to semiconductor chips, such as
integrated circuits. Other embodiments are designed as integrated
parts of a PC board, first level interconnects, or semiconductor
chips, such as an integrated circuit.
[0007] The term energy conditioner is used herein below to refer to
structures having both decoupling and noise suppression
functions.
[0008] A, B, AND G Master Electrodes:
[0009] The novel energy conditioners all include at least three
internal master electrodes, A, B, and G master electrodes, each of
which includes electrically conductive material. As described in
more detail below, the novel energy conditioners are designed to
provide split and separated routes that facilitate a cross-over of
paths for portions of energy flowing through main body electrodes
of at least two of the three master electrodes. Preferably
cross-over pathways are created by positioning of at least two sets
of complementary tab portions at edges of main body electrodes. The
first set of complementary tab portions are part of main body
electrodes of the A master electrode. The second set of
complementary tab portions are part of main body electrodes of the
B master electrode. A and B tab portions along a first edge of the
structure are conductively tied together. A and B tab portions
along a second edge of the structure are conductively tied
together. Between the two edges, conductive paths in the A master
electrode cross conductive pathways in the B master electrode.
[0010] The conductive ties may be effected by a conductive band
formed onto the side of the energy conditioner, or by conductive
connection of bands each of which is connected to only one of the A
or B electrodes via external solder, conductive paste, or by
conductive connection of bands each of which is connected to only
one of the A or B electrodes via conductive connection of multiple
such bands to the same conductive mounting pad.
[0011] In most embodiments, a majority of the area of the G master
electrode shields a majority of the area of the A master electrode
path from a majority of the area of a B master electrode path.
[0012] Certain embodiments also provide a combination of energy
conditioners and connections to mounting structures of first level
interconnects, such as a PC board, substrates, IC packages, IC
chips, etc., providing at least on the energy conditioner at least
three points of conductive connection to the conductive elements of
a mounting structure, and in which the energy conditioner has at
least three internal master electrodes, A, B, and G.
[0013] An important aspect of certain embodiment is the combination
of energy conditioner external conductive bands, particularly for
(1) energy conditioners having more than three conductive bands and
(2) a mounting structure having no more than four surface mounting
structure conductive elements (conductive pads, conductive lined
via(s) or conductively-filled vias, or the like) to which said
energy conditioner structure mounts, such that two or more of the
conductive bands of the energy conditioner both contact the same
conductive surface mounting structure. This allows the conductive
connection of the bands to the energy conditioner to conductively
tie tabs of the A master electrode to tabs of the B master
electrode. It should be noted that the surface mounting structure
may include additional conductive elements located remote from
where one energy conditioner is mounted in order to mount
additional circuit elements, such as additional energy
conditioners, thereto.
[0014] Inside each energy conditioner, the A, B and G master
electrodes are conductively isolated from one another. Tabs of the
A and B master electrodes may be conductively tied together by
manufacturing processes that adds conductive termination structure
located and attached to the outer surface of an energy conditioner.
This will create a configuration wherein the G master electrode is
conductively isolated from both the A master electrode and the B
master electrode, and the A master electrode and the B master
electrode are conductively connected at the conductive termination
structure.
[0015] A-G and B-G Overlap Regions
[0016] Preferably, the A, B, and G master electrodes each include
at least one main body electrode. Each main body electrode has
major surfaces, and the major surfaces of all of the main body
electrodes are substantially parallel with one another. Moreover,
substantial portions of the A main body electrodes and G main body
electrodes overlap one another. Moreover, substantial portions of
the B main body electrodes and G main body electrodes overlap one
another.
[0017] Preferably, each main body electrode of any one master
electrode has the shape of a layer.
[0018] Each main body electrode of the A, B, and G master
electrodes has an area for each of its major surfaces. Preferably,
the area of the major surfaces of the main body electrodes of the A
and B master electrodes is less than or equal to the area of the
major surfaces of the main bodies of the G master electrodes.
[0019] Preferably, each main body electrode has the shape of a
layer. Although the main body electrodes need not be layers, the
description below refers to the A, B and G main body electrodes as
the preferred structure of layers, A, B, and G layers, for
convenience. However, the inventors contemplate that the more
general main body concept may be substituted wherever reference
appears to layers of any one of the A, B, and G master
electrodes.
[0020] A, B Layer Tab Portions
[0021] The A master electrode layers, also called A layers, are
defined as layers with generally the same shape as one another.
[0022] The B master electrode layers, also called B layers, are
defined as layers with generally the same shape as one another.
[0023] A layers each have at least two tab portions and a main body
portion. Preferably the tab portions of the A layers are relatively
small compared to the non-tab main body portion of the A layers.
The tab portions of the A layers are those portions of the A layers
that extend beyond perimeter portion(s) of G main-body layers.
[0024] B layers each have at least two tab portions and a main body
portion. Preferably the tab portions of the B layers are relatively
small compared to the non-tab main body portions. The tab portions
of the B layers are those portions of the B layers that extend
beyond perimeter portion(s) of G main-body layers. Preferably, the
tab portions extend in the plane of the layer.
[0025] Preferably, the tab portions of the A layers do not overlap
the tab portions of the B layers in the dimensions of the plane in
which the layers extend. Preferably, in the direction of the planes
of the major surfaces of the A and B layers, there is a non-zero
distance separating tab portions of A layers adjacent tab portions
of B layers.
[0026] Preferably, tab portions of the A layers that are adjacent
tab portions of the B layers, are separated there from by a
non-zero distance.
[0027] The G master electrode has at least one G many body
electrode. Preferably, the G main body electrodes are in the form
of G main body layers.
[0028] Preferably, one or more G main body layers extends in the
plane defined by a major surface beyond the perimeter of the
main-body portions of A and B layers (and any other layers).
Alternatively, the main bodies of the G layers may be co-extensive
with the main bodies of the A and B layers.
[0029] The G layer also has at least first and second tab portions.
Preferably, the first and second tabs of the G layer are relatively
small compared to the area in which the G layer overlaps either the
A layer or the B layer.
[0030] Preferably, the tab portions of the A and B layers (and tabs
of any other layers) extend beyond the perimeter of the main bodies
of the G layers.
[0031] There is a setback relationship between the extension of the
G layers and the separation of the layers defined by setback=VD/HD
(vertical distance divided by horizontal distance). HD is a
distance in the plane of the major surfaces between a point on the
perimeter of the main body of any one G main-body electrode and the
closes point on the perimeter of the main body of any one A or B
main-body electrode.
[0032] VD is the shortest distance separating a G main body layer
from an A or B main body layer.
[0033] Preferably, the setback ratio, VD//HD may be as low as zero
or as high as 200. Setback may attain any real, fractional, or
integer value there between, such as 0.5, 1, 1.233, 2, 3, 3.5,
etc.
[0034] Main-Body Overlap Regions
[0035] Preferably, in the region of main body overlap with the G
layers, the layers of the A, B, and G master electrodes do not
directly contact one another (A main bodies do not contact each
other or main bodies of B and G), and there is no conductive path
in the overlapped region connecting any structure of the A, B, and
G master electrodes to one another. Alternatively, A main bodies
may be interconnected to one another in the overlap region, and/or
B main bodies may be interconnected to one another in the overlap
region, and/or G main bodies may be interconnected to one another
in the overlap region.
[0036] Tying of A and B Master Electrodes
[0037] The energy conditioner is designed so that (1) a first tab
of a layer of the A master electrode (A layer) and a first tab of a
layer of the B master electrode (B layer) can be electrically
connected by a portion of a conductive path at a location outside
the overlapped regions of the main bodies and (2) a second tab of
the same A layer and a second tab of the same B layer can be
electrically connected to one another at a location outside the
overlapped regions of the main bodies. An outer electrode terminal
is one such example of a connection that is outside the overlapped
region.
[0038] The conductively connecting of various tabs of different
conductive layers which provides a conductive path between tabs
which does not pass through the overlapped regions is referred to
herein as tying. For example, conductive connection of the first
tab of the A layer and the first tab of the B layer, as just
describe, are tied together.
[0039] An A conductive path in the A layer extends from the first
tab of the A layer through the region in which the A layer overlaps
with the G master electrode to the second tab of the A layer. These
tabs are in a position offset, relative to one another. The off set
position of a tab pair allows energy to transverse the electrode
layer in a non-direct manner. For example in FIG. 1A tab 2 is
located on the opposite side and offset tab 11. For energy entering
from tab 2 of electrode layer 1 of FIG. 1A, it must angles across
to egress tab 11.
[0040] Also, a B conductive path in the B layer extends from the
first tab of the B layer through the region in which the B layer
overlaps with the G master electrode to the second tab of the B
layer. Like FIG. 1A above, these tabs 21 and 22 of FIG. 1B are in a
position offset, relative to one another. The off set position of a
tab pair allows energy to transverse the electrode layer in a
non-direct manner. For example in FIG. 1B tab 21 is located on the
opposite side and offset tab 22. For energy entering from tab 21 of
electrode layer of FIG. 1b, it must angles across to egress tab
22.
[0041] In almost all embodiments, the complementary positioning of
A and B electrode layers and their tabs allows for an A conductive
path that overlaps with a B conductive path, such that the A and B
conductive paths inside the energy conditioner cross over one
another. Preferably, all A conductive paths in the A layer overlap
any B conductive path in the B layer, such that all A and B
conductive paths inside the energy conditioner cross over one
another.
[0042] As a result of the conductive tying of the adjacent first
tabs of the A and B layer to one another, and the cross over of A
and B paths, energy passing through the A layer inside the
conditioner must cross over the B layer, and vice versa. By
conductive tying of the adjacent second tabs of the A and B layer,
the configuration creates a balanced, tied structure. In addition,
the tying results in uniform distribution of energy flow between
the A layer and the B layer.
[0043] Preferably in many instances, the contacting elements from
the main bodies of the A, B, and G master electrodes to the circuit
board, first level interconnect, or semiconductor conductive
pathways are as wide as can be designed without shorting or arcing
to one another, to provide relatively low impedance, particularly a
relatively low ESR and ESL.
[0044] Moreover, ESR can be affected, as needed, based upon size
and shape of certain elements. Wider tabs at the points of coupling
to outer bands will decrease component ESR to provide relatively
low impedance for an energized circuit, particularly a relatively
low contribution to the overall circuit ESL.
[0045] For example, for FIG. 4H, the wider outer band terminals
generally provide lower internal resistance than narrower outer
band terminals. For another example, compare FIG. 4A to FIG. 4L, in
which the relatively wider cap shaped bands in FIG. 4L,
corresponding in shape to cap shaped bands 401A, 402A in FIG. 4A,
provide relatively lower resistance, assuming the same band
thickness and band material resistivity. Thus, novel energy
conditioners can be designed with tradeoffs between relative ESR
and ESL of pathways with circuit design specifications of system
impedance in mind.
[0046] Embodiments may have multiple A master electrode layers and
multiple B master electrode layers. In embodiments having multiple
A and B layers, preferably all first tabs are designed to be tied
to one another and all second tabs are designed to be tied to one
another. However, each A or B layer may have additional tabs, such
as third tabs and fourth tabs (or more tabs) and in these
embodiments, all third tabs are designed to be tied to one another
and all fourth tabs are designed to be tied to one another. In the
more than two tabs per layer embodiments, each set of at least two
tabs tied together are designed to provide cross over in the manner
defined above.
[0047] In embodiments having more than type A and B layers, such as
A, B, C, and D layers, pairs of type of layers, such as the A, B
pair and the C, D pair, are designed to provide crossover and
tying.
[0048] The first tabs of layers of each G master electrode are
conductively connected to one another, either by a conductive band,
almost any conductive material, or a shapeable conductive material
which serves as an outer electrode terminal. By way of the now
attached electrode terminal, the first tabs of layers of each G
master electrode are conductively connected to a conductive element
of the mounting structure (of a PC board, first level interconnect,
or semiconductor chip) or equivalent structure inside a first level
interconnect or semiconductor chip, such as conductively filled
vias, conductive pads, conductive lines, or the like. Conductive
material for example, such as but not limited to solder, solder
paste, shapeable conductive material, reflow solder compounds,
conductive adhesives may also electrical connect the electrode
terminal that connects the first tabs of the G master electrode to
a conductive mounting structure or conductive mounting surface. The
second tabs of each G master electrode are similarly conductively
connected to one another and to a mounting surface or the
equivalent as the first tabs of each G master electrode were just
described.
[0049] In any specific embodiment in which there exist more than
one A layer and more than one B layer, preferably the first tabs of
the A layers are aligned in the direction perpendicular to the
plane defined by any of the major surfaces. Preferably, the second
tabs of A layers are similarly aligned (although the first set of
tabs of the A layers are off-set in alignment to the second set of
tabs of the A layers). The first tabs of the B layers are similarly
aligned, and the second tabs of the B layers are similarly aligned
with the first set of tabs of the B layers are off-set in alignment
to the second set of tabs of the B layers). This arrangement also
allows first tabs of both A & B layer(s) to be adjacent to one
another yet separated by a gap before the application of an outer
electrode terminal completes tying of the adjacent A and B tabs to
one another.
[0050] The layers of the A, B, and G master electrodes are
separated from one another by one or more conductively insulating
materials, including for example, almost any type of dielectric
material possible, such as but not limited to X5R, X7R, NPO,
Metal-oxide Varistor material, air, ferrite, un-doped
semiconductor, etc.
[0051] One significant aspect of the novel energy conditioners is
that they can be inserted into a single path in a circuit, such as
a line from a source of power to active circuitry wherein, inside
the conditioner, the single pathway is split into at least two
pathways (an A main body pathway and a B main body pathway) wherein
the two internal pathways cross over one another. A second
significant aspect of the novel energy conditioners is the ability
to allow for an internal cross over of energy utilizing the A and B
main body pathways that will occur in a region in which the A main
bodies are shielded by the G master electrode from the B main
bodies when energized.
[0052] A third significant aspect of the novel energy conditioners
is that the pathway through the A and B master electrodes from the
first tabs to the second tabs is substantially perpendicular to the
pathway between the first tabs to the second tabs of the G master
electrode. One way to define this relationship is that a first line
from the first A tab to said second B tab crosses a second line
from the first G tab to the second G tab at a crossing angle of at
least 45 degrees, or at least 70 degrees, or at least 80 degrees,
and preferably about 90 degrees. In context, about 90 degrees
represents the fact that directions of the first and second line
segments in any embodiment depend upon the starting point along the
width of the tab regions where those lines terminate.
[0053] Generic Structural Designs for Tying:
[0054] There are many generic alternative designs for tying, some
of which are detailed, as follows.
[0055] In a first alternative design, the energy conditioner
includes a first conductive band and a second conductive band. The
first conductive band and the second conductive band do not
physically contact one another, and they each have a surface
forming part of the external surface of the energy conditioner. The
first conductive band is conductively contacted to the first tab of
the A layer and to the first tab of the B layer to tie the first
tabs together and (2) the second conductive band is conductively
contacted to a second tab of the A layer and to a second tab of the
B layer to tie the second tabs together.
[0056] In a second alternative design, tabs are tied directly to a
circuit connection without the intermediate conductive terminals.
For example, one such design has no first or second conductive
band, per se. These structures are designed with tabs of the A
layer and the B layer so that, when the energy conditioner is in
place for mounting on a mounting structure or mounting surface of a
structure, solder, conductive paste or other shapeable conductive
material can be placed to conductively connect and tie the first
tabs of the A and B layers to one another and also to the mounting
structure or mounting surface of a structure. Similarly, for the
second tabs of the A and B layers. Similarly, tab connections of
the respective G tabs may be conductively connected to another
conductive structure, a conductive structure not conductively
connected to any of the A and B connections.
[0057] In a third alternative design, the A, B, and G layers are
formed as an integral part of a semiconductor chip, such as in
integrated circuit, or as an integral part of a first level
interconnect, and conductively filled vias or the like replace the
aforementioned conductive bands or terminals, but directly
conductively coupled with solder, conductive paste, or other
shapeable conductive material. In this alternative, the equivalent
to the elements of the mounting structure are conductive
connections of tabs and/or internal via portions within a device to
outer conductive pathways extending away in any direction from the
integral energy conditioner structure. These conductive pathways
may be deposited conductive material, or conductive semiconductor
pathways, and may extend in any direction away from the energy
conditioner structure.
[0058] Certain embodiments have more than three external conductive
bands in which each band is not in physical contact with any other
band. Preferred embodiments of these novel energy conditioners have
the conductive bands configured such that all the conductive bands
may be connected to three planar-shaped conductive areas forming
part of the mounting structure. These planar conductive terminals
may be conductive pads, vias, or pad and via-in-pad combinations.
The mounting structure may be a surface of a first level
interconnect, and the pads and vias of the mounting structure may
be part of the surface of the first level interconnect.
Alternatively, mounting structure may be a surface of a
semiconductor chip, such as an integrated circuit, and the pads and
vias may be part of the surface of the semiconductor chip. A
surface can be at any angle, not just horizontal and parallel to
the earth or horizon, rather it can be on any surface location
operable for attachment.
[0059] The term "plate" herein generally is used to simplify
explanation by defining a combination of a dielectric under layer
with none, one, or more than one distinct conductive over layers.
However, the relevant structure is the sequence of conductive
layers separated by dielectric material. The hidden surface of the
structures referred as plates in the following figures represents a
dielectric surface; that is, dielectric material vertically
separating the defined conductive layers from one another. In
discrete energy conditioner component embodiments, the structure
are often formed by layering dielectric precursor material (green
material) with conductive layer precursor material (conductive
paste or the like), firing that layered structure at temperatures
sufficient to convert the dielectric precursor to a desired
structurally rigid dielectric material and to convert the
conductive precursor layer to a high relatively conductivity (low
resistivity) conductive layer. However, embodiments formed in
interconnects and semiconductor structures would use different
techniques, including conventional lithographic techniques, to
fabricate equivalent or corresponding structures to those shown in
the figures. Importantly, the conductive bands and solder
connections for stacked layers discussed herein below would in many
cases be replaced by an array of conductively filled or lined vias
selectively connecting conductive layers of the same master
electrode to one another. Preferably, those vias would be spaced to
selectively contact the tab regions of the A, B, and G layers
discussed herein.
BRIEF DESCRIPTION OF THE DRAWINGS
[0060] FIG. 1A is a plan view of a novel layer of an A master
electrode of a novel energy conditioner;
[0061] FIG. 1B is a plan view of a novel layer of a B master
electrode of a novel energy conditioner;
[0062] FIG. 1C is a plan view of a novel layer of a G master
electrode of a novel energy conditioner;
[0063] FIG. 1D is a plan view of a layer of dielectric material, D,
often used in the novel energy conditioners disclosed herein;
[0064] FIG. 2 is a plan view (plan view meaning a view of the plane
defined by the major surfaces) showing layers 1 and 20 (layer 1 is
at least a portion of A master electrode and layer 20 is at least a
portion of B master electrode) in an overlapped relationship in
which they typically exist in novel energy conditioners disclosed
herein;
[0065] FIG. 3A is a plan view showing an arrangement 300 of
shapeable conductive material for both tying together tabs of A and
B master electrodes of the novel energy conditioners disclosed
herein and conductively connecting A, B and G master electrodes to
conductive elements of surface mounting structure by solder,
conductive material, re-flow solder material, conductive
adhesive;
[0066] FIG. 3B is a plan view showing an arrangement of a set of
conductive elements for tying together tabs of A and B master
electrodes and conductively connecting to one another tabs of G
master electrodes of the novel energy conditioners disclosed
herein;
[0067] FIG. 3C is a plan view of the set of conductive elements of
FIG. 3B and also shapeable conductive material for connecting the
members of that set of conductive elements to conductive elements
of the mounting structure;
[0068] FIG. 3D is a plan view of an alternative set of conductive
elements to the conductive elements shown in FIG. 3C and shapeable
conductive material for connecting that alternative set of
conductive elements to conductive elements of the mounting
structure;
[0069] FIGS. 4A-F and 4H-L are each a perspective view showing
outer surface of novel energy conditioners having different
configurations of external conductive bands;
[0070] FIG. 5A is a schematic view of a sequence of stacked
conductive layers of novel energy conditioners disclosed herein, in
which the stack is exploded along a vertical axis and each layer is
then rotated 90 degrees about its horizontal axis, in order to show
the shape of the major surface of each layer and the stacking
alignment of the layers;
[0071] FIG. 5B is the same type of schematic view as FIG. 5A,
showing the same three conductive layers, and also shows an
additional dielectric layer on the top of the stack;
[0072] FIG. 5C is the same type of schematic view as FIG. 5A,
showing a set of four conductive layers of novel energy
conditioners disclosed herein;
[0073] FIG. 5D is the same type of schematic view as FIG. 5A,
showing a set of five conductive layers of novel energy
conditioners disclosed herein;
[0074] FIG. 5E is the same type of schematic view as FIG. 5A,
showing a set of seven conductive layers of novel energy
conditioners disclosed herein;
[0075] FIG. 5E is the same type of schematic view as FIG. 5A,
showing a set of nine conductive layers of novel energy
conditioners disclosed herein;
[0076] FIG. 6 is a plan view of certain conductive elements and a
bottom dielectric layer of an embodiment of a novel energy
conditioner 600;
[0077] FIG. 7. is a plan view of certain conductive elements and a
bottom dielectric layer of an embodiment of a novel energy
conditioner 700 that has a reverse aspect compared to the FIG. 6
embodiments;
[0078] FIG. 8A-L are plan views each showing arrangements of
conductive elements of a mounting structure, including conductive
pad and/or via structure to which novel discrete component energy
conditioners disclosed herein may be mounted;
[0079] FIG. 9 is a schematic view showing a novel combination of a
novel energy conditioner on an arrangement of mounting structure
elements including conductive pads and vias, with one via per
pad;
[0080] FIG. 10 is a schematic view showing a novel combination of a
novel energy conditioner on an arrangement of mounting structure
elements including conductive pads and vias, with two vias per
pad;
[0081] FIG. 11 is a schematic view showing a novel combination of a
novel energy conditioner on an arrangement of mounting structure
elements including conductive pads and vias, with two vias per pad
and a central pad that extends further than the outer two pads such
that the central pad can contact conductive terminals on left and
right hand side of the energy conditioner;
[0082] FIG. 12 is a schematic assembly view of a novel energy
conditioner and an arrangement of mounting structure elements
corresponding to FIG. 3A, illustrating use of shapeable conductive
material, such as solder, to contact both (1) tabs and (2) mounting
structure elements, such as pads and conductively filled or lined
vias;
[0083] FIG. 13 is a schematic assembly view of a novel energy
conditioner and an arrangement of mounting structure elements
corresponding to FIGS. 3B and 3C, illustrating use of shapeable
conductive material, such as solder, to conductively connect (1)
the conductive elements for tying together tabs of A and B master
electrodes and conductively connecting tabs of G master electrodes
to one another to (2) the conductive elements of a mounting
structure, such as pads and conductively filled or lined vias;
[0084] FIG. 14 shows one circuit diagram schematically illustrating
electrical connection of energy conditioner 600 or 700. 304B and
302B may connect in parallel with a line running from a source of
power to a load, and 301B' and 303B' may connect in parallel with a
line connecting to a circuit or system ground;
[0085] FIG. 27 is an exploded view of a set of two plates of a
novel energy conditioner in which the plates have been displaced
vertically in the page;
[0086] FIG. 28 is a perspective view of an exterior surface of a
novel energy conditioner including the stack of two plates shown in
FIG. 27;
[0087] FIG. 31 is an exploded view of a set of two plates of a
novel energy conditioner in which the plates have been displaced
vertically in the page;
[0088] FIG. 32 is a perspective view of an exterior surface of a
novel energy conditioner including the stack of two plates shown in
FIG. 31;
[0089] FIG. 33 is a partial schematic of circuit two for use with
an energy conditioner having A, B, and G master electrodes; and
[0090] FIG. 34 is a partial schematic of a circuit six for use with
an energy conditioner having A, B, and G master electrodes.
DETAILED DESCRIPTION
[0091] The same reference numerals are used to refer to identical
or similar elements throughout the drawings.
[0092] FIGS. 1A to 1C show conductive layers or main body
electrodes 1, 20, 40 that are stacked above one another in the
sequence 1, 40, 20 in novel energy conditioner devices disclosed
herein. Additional conductive main body electrodes may be present
in the stack. In some cases, alternate configurations of stacked
electrodes may comprise patterns of A and/or B layers following
stacking sequences where multiple A and B layers can be stacked
above or below one another in a random or patterned sequence to one
another with or without an interposing shielding layer placed
in-between an A layer and A layer, or an A layer and a B layer, or
a B layer and a B layer. Any dielectric material may be used, such
as formed into a dielectric layer 60 of FIG. 1D, to separate the
main bodies of the main body electrodes from one another.
[0093] FIG. 1A shows a novel layer 1 of master electrode A of a
novel energy conditioner.
[0094] Layer 1 includes first tab 2 protruding up from left hand
side body portion 9 and delimited by first tab side surfaces 3, 4,
and first tab outer surface 2a. First tab 2's side surface 4 and
layer 1's side surface 6 optionally define surface region 5
interfacing between tab elements 4 and 6. Optionally, and as shown,
surface region 5 is concave. Surface regions also together, define
a perimeter of an electrode layer.
[0095] Layer 1 also includes second tab 11 protruding from right
hand side body portion 10 and delimited by second tab side surfaces
12, 13, and second tab outer surface 11a. Second tab 11's side
surface (unnumbered) and layer 1 side surface 8 may define an
intervening surface region, which may be concave.
[0096] Tabs 2, 11 are preferably the same size and shape. However,
tab 2 may be longer, such as twice as long as tab 11. Preferably,
tabs 2 and 11 each extend less than one half the length (in the
direction parallel to side surface 7) of layer 1. In a left to
right or right to left view, the width of tabs 2 and 11 may extend
less than one third, less than one fourth, or less than one tenth
the length (right to left or left to right) of layer 1.
[0097] Second tab 11 projects out from layer 1 lower surface by a
tab width equal to the extent of tab side surface 12. Preferably,
tabs 2 and 11 have the same tab portion width in terms of
projection beyond a main-body side surface or perimeter. However,
either tab may be wider (right to left or left to right) than the
other.
[0098] Tab inner side surfaces 3, 12 are preferably the same length
(right to left or left to right). However, tab inner side surfaces
3, 12 may be different lengths and/or widths. Similarly, tab outer
surfaces 2a, 11a may be of the same or different lengths, ranging
from a fraction of the width of layer 1 (that is, the distance
between side surfaces 6, 8) up to half the width of layer 1. The
corners of layer 1 are shown to be rounded. However, they need not
be rounded. Layer 1 side surfaces 8, 7, 6, 2A, 11A are shown as
linear. However, they could be arced or have other minor variations
from linear.
[0099] Layer 1 is, by definition, generally planar. However, a main
body electrode is an alternative to layer 1. A main body electrode
need not be planar. For example, a main body electrode could have
contoured surfaces, such as arc, partial cylinders, or the like. In
addition, a main body surface might have a thickness that varies
from point to point along its major surface. Layer 1 comprises
conductive material, preferably metal, such as copper, nickel, or
other relatively low resistance metals. In other cases, material
may be combined with conductive material to add resistance to the
electrode.
[0100] FIG. 1B shows a novel layer 20 of master electrode B of a
novel energy conditioner. Layer 20 is similar in shape to layer 1.
In contrast to layer 1, layer 20 has first tab 21 above body
portion 23, in other words, above the opposite side of the body of
the layer as first tab portion 2 in layer 1. Similarly, layer 20
has second tab 22 below left side body portion 24, again, on the
opposite side as the corresponding second tab 11 of layer 1.
[0101] First tab 21 is delimited by outer first tab surface 24A,
and second tab 22 is delimited by outer second tab surface 29.
Layer 20 is delimited by layer 20 side surfaces 25, 26, upper side
surface 27, lower side surface 28, as well as tab side surfaces
24A, 29. Preferably, second tabs 22 and 11 have the same size and
shape, and first tabs 2 and 21 have the same size and shape.
Preferably, layers 1 and 20 are mirror images of one another about
a vertical axis running down the center of each layer.
[0102] In the preferred embodiments of energy conditioners
contemplated herein, layers 1, 20 may range in thickness from a
several tens of angstroms in certain integrated semiconductor
embodiments to hundreds of microns in discrete device component
embodiments. Electrode layers may be all of the same general
thickness as manufacturing process allow, or the may be of a
varying thickness, either pre-defined and in a positioned desired
or randomly. Preferred embodiments have major surface areas of
layers 1, 20 from a few microns to several square centimeters. It
should be noted that various layering of electrodes may be enhanced
by a process that allows for increased conductivity versus an
similar layer of the same conductive material that did not receive
a conductivity enhancement. FIG. 1C. shows novel conductive layer
40 of a G master electrode including a main body portion 47, left
side tab 43, and right side tab 44. Left side tab 43 is delimited
by side surfaces 45, 46, and end surface 43a. Preferably, right
side tab 44 is sized and shaped similarly to left side tab 43.
However, one of tab 43, 44 may longer and/or wider than the other
tab. Tabs 43, 44 may be the same width as main body portion 47.
Side surfaces 41, 42, 43A, 44A, 44B, 44C, (all 44's not shown), 45,
46 combine to form a perimeter of electrode or conductive layer 40.
These similar side-surface elements of conductive layers 1 and 20
do so as well.
[0103] The main body of conductive layer 40 is partially delimited
by top and bottom side surfaces 41, 42. Preferably, the distance
between left side tab 43's upper and lower side surfaces 45, 46, is
a substantial fraction of the distance between main body side top
and bottom surfaces 41, 42, preferably at least fifty percent, more
preferably at least 70 percent, most preferably about 100 percent.
In some embodiments, the tabs of the G master electrode are wider
than the main body, in which case the ratio of distance between
left side tab 43's upper and lower side surfaces 45, 46 to the
distance between main body side top and bottom surfaces 41, 42 is
greater than one, such as between 1.1 and 1.5, and may exceed 5,
referred to herein as flared tabs.
[0104] Preferably, conductive layer 40 preferably has a main-body
portion that is larger than the main-body portions of layers 1 and
20 and thus extends beyond the main-body portions perimeters of
layers 1 and 20 with the exceptions of the tabs of layers 1 and 20.
Internal electrodes, main bodies, or layers, such as 1, 20, 40, may
comprise any metal materials such as (but not limited to) nickel,
nickel alloy, copper, or copper alloy, palladium alloys, or any
other conductive material and/or combination of materials,
semi-conductive materials, and combinations thereof.
[0105] FIG. 1D shows dielectric layer 60 having dielectric layer
upper side surface 61, dielectric layer lower side surface 63,
dielectric layer left side surface 62, and dielectric body right
side surface 64. Corners, like corner 65, may be rounded.
Preferably, dielectric layer 60 contains no apertures, forming a
continuous sheet. However, alternate embodiments include
apertures.
[0106] Dielectric layer 60 and all other dielectric layers in the
contemplated embodiments of novel energy conditioners have
thicknesses from a few angstroms to tens of microns, may comprise
glass, ceramic, polycrystalline, amorphous, and crystalline forms
of matter. Some useful commercial dielectrics are named to X7R,
X5R, COG, NPO, MOV (metal oxide varistor). Capacitance between two
conductive bodies increases as the inverse of their separation
distance. Therefore, it is desirable to have relatively thin
dielectric layers in structures designed to provide significant
capacitance. As of 2003, mass production of 0402 sized 2.2 uF
Multi-Layer Ceramic Capacitors (MLCC), as well as 0603 sized 10 uF
components, both of which are the most widely used MLCC types in
the industry. Higher values of capacitance in these and other
standard EIA packages are expected.
[0107] In discrete component embodiments, conductive layers, like
layers 1, 20, 40, are interleaved with dielectric material, like
dielectric layer 60, forming a stack of layers. In these
embodiments, preferably dielectric layer 60 and conductive layers
1, 20, 40, have dimensions such that each one of conductive layers
1, 20, 40, can be positioned above dielectric layer 60 such that
the perimeter of the main bodies of the conductive layers reside
within the perimeter of dielectric layer 60, and tab outer side
surfaces of the conductive layers are aligned with the portions of
the perimeter of dielectric layer 60. In addition, in these
embodiments, the main body portions of the 1, 20 layers may be
substantially of the same size and shape as one another. It fully
contemplated that main-body portions of layer types, such as 1 and
20, may vary in a size and shape relationship to one another or
groupings of such.
[0108] FIG. 2 shows in plan view a novel arrangement of layers 1
and 20. This arrangement is how layers 1 and 20 are arranged
relative to one another in energy conditioner embodiments disclose
herein. FIG. 2 shows body portions 9, 10 of layer 1 aligned with
body portions 24, 26 of layer 20, and each one of tabs 2, 11, 21,
22 projecting away from the body portions, in plan view, at
non-overlapped regions. FIG. 2 shows the outer side surfaces of
tabs 2, 21 are aligned with one another, and the outer side
surfaces of tabs 22, 11 are aligned with one another.
[0109] FIG. 2 also defines a gap of separation between adjacent
tabs. A first gap 199A is created between tabs 2 and 21 by the
stacking arrangement of layers 1 and 20, and a second gap 199B
created between tabs 22 and 11 created by the stacking arrangement
of layers 1 and 20. These gaps 199A and 199B clearly show that in
order for adjacent tabs (2 and 21) and (22 and 11) to be
conductively connected to one another, an additional conductive
material portion such as a terminal electrode like a 302A and 302B
of FIG. 3B will be needed to span the gaps to create a tying
configuration. It should also be noted that when stacked with
layers having main-body portions like layer 40, each main-body
portion of layers 1 and 20 are found to be smaller than a main-body
portion of layer 40 and will appear to be inset with the exception
of each respective tabs of layers 1 and 20.
[0110] FIG. 2 illustrates the preferred arrangement of layers 1,
20, relative to one another, to illustrate that tabs 2, 21 can be
easily conductively connected by additional structure extending
there between, and that tabs 22, 11 similarly be connected. In the
novel energy conditioner devices disclosed herein, a conductive
layer 40 exists between layers 1, 20. As assembled or fabricated,
preferably the top and bottom surfaces 41, 42, of the main body
portion 47 of the master G electrode extend at least as far as the
side surfaces of the main body portions of layers 1, 20. More
preferably, in an assembly or fabrication, upper surface 40 extend
further up than main body portions of layers 1, 20, and lower
surface 42 extends further down than main body portions of layers
1, 20.
[0111] As described with respect to FIG. 5, the novel energy
conditioners may have varying sequences of conductive layers
including layers 1, 20, and 40. These varying sequence of layers
are contemplated as internal structure for all structures shown in
and discussed with respect to FIGS. 3-4 and 6-17. In addition,
while it is preferred to have a layer 40 in-between a stacking of
layer 1 and 20, alternative embodiments are fully contemplated such
as were layers 1 and 20 do not have an interposed layer 40 between
layer 1 and 20 somewhere in a stacking sequence. Arrangements of a
layer 40 is inserted during a stacking sequence at a predetermined
interval relative to the sequence of layers 1 and 20 is fully
contemplated, as are stacking arrangements of a layer 40 is
inserted during a stacking sequence at a random interval relative
to the sequence of layers 1 and 20.
[0112] Moreover, the specific shapes of the conductive layers 1,
20, and 40 are exemplary, except for the existence of tabs
generally overlapped as shown in FIG. 2. Thus, the layers shown in
FIGS. 1A-1C may for example, include additional tabs concave side
edged, convex side edges, major surfaces that are not flat, such as
curved or wavy.
[0113] In addition, layers shown in FIGS. 1A-1B may be varied to
include cavities or insets adjacent the inner sides edges of tabs,
for example to further define a path of current flow within the
corresponding main body portions. The cavities may be varying
shapes, such as straight, arc, sinuous, or "L" shaped.
[0114] FIGS. 3A-3D show various arrangements of conductive
materials and portions and conductive plates or layers to
conductively directly connect all tabs of layers of the A, B and G
master electrodes that are on the same side of the energy
conditioner as one another, to each other, and to conductively
connect each side of the energy conditioner to a mounting
structure. FIGS. 3A-3D do not show a mounting structure.
[0115] FIG. 3A shows arrangement 300, which is a set of four
conductive attachment material portions 301A, 302A, 303A, and 304A.
This material may be a solder, a solder paste, or any conductive
adhesive material, re-flow solder material or compounds that
attach, for example. These conductive elements are usually variable
in amount applied and may vary. These materials are usually applied
during a mounting process, such as when a device is mounted to a
conductive structure as part of a system such as a PCB board for
example. The conductive attachment material portions are arranged
so that: conductive material region 302A conductively contacts
first tabs 2 and 21 to one another; conductive material region 304A
conductively contacts second tabs 11 and 22 to one another;
conductive material region 301A connects conductive tabs 43 (when
the G master electrode includes more than one layer like layer 40)
to one another; and conductive material region 303A connects
conductive tabs 44 (when the G master electrode includes more than
one layer like layer 40) to one another. In addition, conductive
material regions 301A, 302A, 303A, 304A may contact to conductive
elements of a mounting structure, such as the structures shown in
FIG. 8A-8L.
[0116] FIG. 3B shows a set of four applied conductive elements
301B, 302B, 303B, 304B, such as terminals or conductive electrode
material that are applied to a body of the device before any final
attachment of a device into a system. Conductive elements 301B,
302B, 303B, 304B, are arranged so that each one will face and
contact to the outer side surfaces of the tabs of layers 1, 20, and
40. If elements 301B, 302B, 303B, 304B are electrode terminals made
of conductive material, they may need to be conductively connected
to outer side surfaces of the tabs of layers 1, 20, and 40 by
intervening shapeable conductive material, such as solder.
[0117] FIG. 3C shows conductive elements 301B, 302B, 303B, 304B as
in FIG. 3B, and also conductive attachment material portions 311,
312, 313, 314. Conductive attachment material portions may be used
to conductively connect conductive elements 301B, 302B, 303B, 304B
to elements of a mounting structure, such as the structures shown
in FIG. 8A-8L.
[0118] FIG. 3D is similar to FIG. 3C, showing conductive attachment
material portions 311, 312, 313, 314 and conductive elements 301B
and 303B.
[0119] FIG. 3D is different from FIG. 3C in that it includes
conductive elements 302B1 and 302B2 in place of 302B. Referring
back to FIGS. 1A and 2, conductive element 302B1 is conductively
connected to first tab 2 of layer 1. Conductive element 302B2 is
conductively connected to first tab 21 of layer 20. In FIG. 3D,
shapeable conductive material 312 serves the additional function of
conductively connecting conductive elements 302B1 to 302B2, and
likewise conductively connecting conductive elements 304B1 to
304B2.
[0120] Both the conductive attachment material portions and the
conductive elements 302 may be formed from materials referred to as
conductive paste, conductive glue, conductive solder material.
These materials may comprise any metal material such as (but not
limited to) nickel, nickel alloy, copper, or copper alloy, or any
other conductive material that can facilitate electrical/conductive
connection. The manufacturing processes for applying and connecting
shapeable conductive material and/or conductive elements to tabs or
other conductive elements can include applying them to surfaces,
hardening them, or providing their desirable conductive properties
by one or more of spraying, painting, soldering, such as reflux
soldering, wave soldering, and high temperature firing. It should
be noted that the conductive elements, such as 301B to 304B, may be
formed from the same or similar material shapeable conductive
materials, such as elements 301A to 304A, referred to in FIGS.
3A-3D. A difference being that material referred to as conductive
attachment material portions have an additional function of
conductively connecting to a conductive structure or conductive
surface on which a novel energy conditioner resides.
[0121] FIGS. 4A-F and 4H-L show outer surfaces of novel energy
conditioners having different configurations of external conductive
bands or terminals. These outer conductive bands generally
correspond in function to the elements 301B, 302B, 303B, and 304B
of FIG. 3B or elements 301B, 302B1, 302B2, 303B, 304B1, and 304B2
in FIG. 3D. That is, the outer conductive bands are the elements
that provide conductive connection of tabs on the same side as one
another (FIG. 3B) or conductive connection at least of vertically
aligned tabs (FIG. 3D).
[0122] Moreover, each one of the band structures shown in FIGS.
4A-F and 4H-L are compatible with and can connect to the various
arrangements and combinations of elements of surface mounting
structure shown in FIGS. 8A-8L, as described below.
[0123] FIG. 4A shows energy conditioner 400 having external
conductive bands 401A, 402A, 403A, 404A. Band 401 is shaped like a
cap, extending on 5 adjacent sides (2 sides shown, 3 sides hidden);
band 404 is shaped like a "U" extending along conditioner side
surface 405A to conditioner top surface 406A and to conditioner
bottom surface (hidden). Each band is physically separated from one
another by dielectric 407A.
[0124] In one embodiment including the FIG. 4A bands, internal to
conditioner 400, first tabs 2, 21 (of A and B master electrodes),
may connect to band 401A, second tabs 22, 11 (of A and B master
electrodes) may connect to band 402A, and tabs 43, 44 (of G master
electrode) may connect respectively to bands 403A, 404A.
[0125] In a second embodiment including the FIG. 4A bands, internal
to conditioner 400, first tabs 2, 21, (of A and B master
electrodes), may connect to band 403A, second tabs 22, 11 (of A and
B master electrodes) may connect to band 404A, and tabs 43, 44 (of
G master electrode) may connect respectively to bands 401A, 402A,
respectively. Note that, in this embodiment, tabs of the A and B
master electrodes may be displaced slightly from the left and right
hand sides by regions like region 5 in FIG. 1A, so that the A and B
electrodes do not conductively contact the bands 401A, 402A. In
addition, in this embodiment, the bands 403A, 404A, may be extend
further than shown between side surfaces 408A, 409A so that they
contact a large fraction of the length of outer or side surfaces of
tabs of layers 1, 20, such as outer side surface 2a.
[0126] FIGS. 4B and 4C show conductive band arrangements similar to
FIG. 4A in which similar internal connection to tabs of the A, B,
and G layers are made. FIGS. 4B and 4C have a central band 410B,
410C, extending on the top or on the top and bottom surfaces of the
energy conditioner, conductively connecting bands 404B, and 404C to
one another with one or two paths that are external to the G master
electrode's structure.
[0127] In one alternative in which central band 410B conductively
connects to the G master electrode, and central band 410B forms a
ring around the energy conditioner, top and bottom layers, like
layers 40, of the G master electrode are not included in the
layered structure, since their function is provided by the top and
bottom portions of the ring 410B.
[0128] In one alternative, A and B tabs connect to 410B. In this
case, an enhancement of (lowering of) the impedance profile because
of a larger conductive area will be observed. FIG. 4E shows band
402 split into bands 402E1 and 402E2, corresponding generally to
the split conductive elements 302B1 and 302B2 of FIG. 3D. In one
embodiment, bands 402E1, 402E2 internally conductively contact to
first tabs 2, 21, respectively. In another embodiment, bands 402E1,
402E2 both internally conductively contact to different portions of
tab 44 of the master G electrode of FIG. 1C.
[0129] FIG. 4H shows a structure with a reverse aspect, in so far
as the bands are concerned, compared to FIG. 4A. That is, the bands
having the capped shape reside on the relatively longer sides in
FIG. 4H and on the relatively shorter sides in FIG. 4A. These
relatively wider capped shaped bands enable a relatively low ESR.
Certain applications may require a specified ESR along certain
lines. The FIG. 4A and 4H reversed aspects and their different ESR
values provide one design mechanism to control ESR to desired
values. Lower ESR when combined with a mounting structure can
produce an ultra-low ESL measurement for the combination of the
inner electrodes with respective tabs, terminal electrodes,
conductive attachment material, mounting structure and arranged
vias as compared to other devices.
[0130] FIG. 4J corresponds closely to the contact arrangement shown
in FIG. 3D wherein bands 404J1 and 404J2 correspond to conductive
elements 304B1, 304B2. In one embodiment of FIG. 4J, first tabs 2,
21, each internally connect respectively to bands 404J1, 404J2. In
another embodiment, first tabs 2, 21 both internally connect to
along end 409J to band 402J.
[0131] FIG. 4L show three side bands, bands 404L1, 404L2, and
404L3. It also shows side band 402L. Various embodiments having
this band arrangement have: band 404L2 connected to tab 44 the G
master electrode, band 404L3 and 404L2 connected to second tab 11
of the A master electrode, and band 404L2 and 404L1 connected to
second tab 22 of the B master electrode. That is, tabs of A and B
main body electrodes each connect to more than one tab and both
connect to the central tab 404L2.
[0132] In one FIG. 4L alternative, second tab 11 may connect to two
of the three bands 404L1, 404L2 and/or 404L3 and second tab 22
connect only to the remaining band. In embodiments in which one tab
connects to more than one band, the outer side surface of the tab
at locations where the tab does not oppose or connect to a band may
be recessed from the side surface of the energy conditioner. The
outer side surface of the tab in the recessed regions may be
covered by dielectric material thereby preventing this region of
the tab from being exposed on a side of the energy conditioner.
[0133] In another FIG. 4L alternative, second tabs 11, 22 may both
only connect to the central band 404L2, and all other bands may
connect only to the tabs of layers 40 of the G master electrode. In
this embodiment, the tabs of the G master electrode are extended to
extend from end portions of top and bottom surfaces 41, 42 of layer
40 so that the extended portions of the tabs may internally contact
bands 404L1, 404L3. In this embodiment, layer 40's tabs also
internally connect to the conductive band on end 402L.
[0134] The foregoing exemplary descriptions of embodiments for some
of FIGS. 4A-F and 4H-L shows that second tabs 11, 22, for example,
can be adjacent any one of the four side surfaces of any one of the
FIG. 4A-F and 4H-L band structures, and all alternative connections
of second tabs 11, 22 to bands along the adjacent side are
contemplated. The size and shape of tabs may vary to provide a
longer and more aligned interface between the outer side surface of
the corresponding tab and the opposing inner side of the
corresponding conductive band or bands.
[0135] Each of these outer band structures constitute part of at
least one of the master electrodes. Each band may connect to one of
the A, B, and G master electrode, or to both the A and B master
electrodes.
[0136] Preferably, there is at least two bands for each pair of
master electrodes, such as the A and B master electrode pair.
[0137] The energy conditioners shown in FIGS. 4A-F and 4H-L may
have the substantially the same length in two dimensions or three
dimension, such that they have a length to width ratio of
substantially 1 and a height to width ratio of substantially 1.
[0138] Preferably, preferably no more than two of the six surfaces
of the energy conditioners shown in FIGS. 4A-F and 4H-L have the
same area. In some embodiments, however, 4 of the six surfaces do
have the same area, such is FIG. 4D.
[0139] The bands forming a cap as shown by element 401A in FIG. 4A
may be replaced by bands covering only 4,3, or two of the surfaces
covered by band 401A. Similarly, bands shown covering only one
surface may be extended around adjacent surfaces, partially as
shown by band 404A in FIG. 4A, or completely as shown by band 410B
in FIG. 4B. The straight edges of the bands may be replaced by
curves, of various shapes, the corners and edges of the bands may
be rounded, or flared, include cavities or protrusions. In
addition, conductively floating bands, bands not connected to a
master electrode, may be disposed on dielectric surfaces of the
energy conditioners as additional shielding.
[0140] FIGS. 5A-5F shows some of the contemplated conductive layer
stacking sequences of the novel energy conditioners. Layers or main
bodies of the A, B, and G master electrodes are referred to with
respect to FIGS. 5A-5F below for convenience as merely A, B, or G
respectively. FIG. 5A corresponds to the layers 1, 20, and 40 of
the A, B, and G master electrodes shown in FIGS. 1A-1C in the
sequence A, G, B.
[0141] FIG. 5B shows the sequence from top to bottom dielectric
layer, A, G, B. FIG. 5B illustrates that the top (and bottom)
conductive layers are preferably covered by dielectric.
[0142] FIG. 5C shows the sequence from top to bottom: A, G, B,
G.
[0143] FIG. 5D shows the sequence from top to bottom: G, A, G, B,
G.
[0144] FIG. 5E shows the sequence from top to bottom: G, G, A, G,
B, G, G.
[0145] FIG. 5F shows the sequence from top to bottom: A, G, G, A,
G, A, G, B, G.
[0146] All of the sequences of layers include a G layer, one A
layer above the G layer, and one B layer below the G layer.
[0147] None of the sequences include an A, B with no intervening G
there between. However as stated earlier there are situations where
such a stacking is fully contemplated. For example, another
stacking might have a sequence from top to bottom may have amongst
its stacking: A, G, B, G, A, B, A, G, B, G, A, B and so on.
[0148] FIG. 6 shows novel energy conditioner 600 having sides 610,
620, 630, 640. FIG. 6 shows a sequence of stacked layers from top
to bottom of 1, 40, 20, 60 (A, G, B, dielectric). Dielectric layers
above dielectric layer 60 are not shown for convenience in order to
show and describe relevant structural features of the conductive
layers and elements.
[0149] FIG. 6 shows conductive elements 304B, 302B, tying the first
tabs together, and tying the second tabs together. FIG. 6 show
first tabs 2, 21 of the master A and B electrodes both contacting
conductive element 304B, second tabs 11, 22, second tabs 11, 22
contacting conductive element 302B. FIG. 6 shows conductive
elements 301B', 303B' contacting respectively to tabs 44, 43 of the
G master electrode.
[0150] FIG. 6 shows generally annular region 48 of G master
electrode's layer 40 extending on all sides beyond the edges of the
main body portions of the layers 1, 20 of the A and B master
electrodes. FIG. 6 shows annular region 48 of the G master
electrode contained within the footprint of dielectric layer 60
such that the only regions of the G master electrode adjacent side
surfaces of dielectric layers are the outer edge side surfaces of
the G master electrode tabs 43, 44.
[0151] FIG. 6. also shows a gap 601A between the edges of tabs 11
and 22 and a corresponding gap 601B between edges of tabs 2, 21.
The existence of gap 601A, 601B results in all paths in layer 1
between the tabs of layer 1 crossing all paths in layer 20 between
the tabs of layer 20. Conductive element 301B' includes side
portion 602 602' on side 610, and conductive element 301B' may
include corresponding top and bottom portions (not shown) on top
and bottom surfaces of energy conditioner 600. Side portion 602
602' of conductive element 301B' does not extend along the side far
enough to contact second tab 11. However, corresponding top and
bottom portions of conductive element 301B' can extend further
along the top and the bottom of energy conditioner 600, since no
portion of conductive layers 1, 20 of the A or B master electrodes
resides on the top and bottom of energy conditioner 600.
[0152] Energy conditioner 600 has side surfaces 610, 620, towards
which tabs 2, 21, 11, 22 of the A and B master electrodes project,
longer than side surfaces 630, 640 towards which tabs 43, 44 of the
G master electrode project.
[0153] The ratio of a length of a side of an energy conditioner
having tabs for the A and B master electrodes to a length of a side
of energy conditioner 600 having tabs for the G master electrode is
defined herein as an energy conditioner aspect ratio. The energy
conditioner aspect ratio of energy conditioner 600 is greater than
one.
[0154] In energy conditioner 600, sides 610, 620 to which tabs of
the A and B master electrodes attach are longer than side 630, 640
to which tabs of the G master electrodes attach. In alternatives to
the FIG. 6 embodiment, gaps 601A, 601B do not exist, such as when
there is partial overlap of A, B electrodes. However, this type of
configuration is believed to be less effective (but still
effective) in conditioning energy than when there is no partial
overlap. In alternatives to the FIG. 6 embodiment, gap 601A may
exist, but gap 601B may not exist due to different sized and shaped
tabs on opposite sides of the A and B master electrodes. This
alternative also specifically applies to embodiments with more than
A and B master electrodes, such as embodiment with more than 4
sides.
[0155] FIG. 7 shows energy conditioner 700, which has a reversed
aspect ratio compared to the aspect ratio of energy conditioner
600. The aspect ratio of energy conditioner 700 is less than one.
In FIG. 7, sides 630, 640 to which tabs of the A and B master
electrodes attach are shorter than sides 610, 620 to which tabs of
the G master electrode attach. Energy conditioner 700 defines gap
601A between the edges of tabs 11, 22, and gap 601B between the
edges of tabs 21, 2.
[0156] Layer 40 extends beyond the perimeter of layers 1, 20 a
distance 710. Tab 43 of layer 40 extends beyond the perimeter of
layers 1, 20 a distance 720, which includes the distance 710 and
the extension length of tab 43 toward side surface 620. Preferably,
distance 710 is greater than zero, more preferably at least 1, 2,
5, 10, or 20 times the distance separating layer 40 from the
closest main body or layer of the A or B master electrodes.
[0157] Conductive layers 1, 20 of FIG. 7 are shaped differently
from conductive layers 1, 20 of FIG. 1 in that the tab portions
reside on the shorter sides of these layers.
[0158] FIG. 8A-L each show one arrangement of conductive elements
of mounting structure for mounting a single one of the novel
discrete energy conditioners. These arrangements are also referred
to as land patterns. The mounting structure may be a surface of a
PC board, the surface of a first level interconnect, or the surface
of a semiconductor chip, including for example an ASIC, FPGA, CPU,
memory chip, transceiver chip, computer on a chip, or the like. The
mounting structure comprises portions of the mounting surface to
which a discrete component may be mechanically mounted and
electrically connected. The mounting structure includes conductive
pad and/or via structure. The via structure may be filled or lined
with conductive material. The via structure may include a
dielectric block preventing DC current transmission. Many of the
mounting structures to which novel energy conditioners relate
include vias extending perpendicular to layering, and conductive
pathways defined in the plane of the layers. In PC board and some
first level interconnects, the vias connect to conductive lines
that extend to some other mounting structure on the boards or
interconnects or to embedded passive circuitry such as embedded
capacitors, inductors, resistors, and antennas. In semiconductor
chips, the conductive lines in at least some instances extend to an
active circuit component formed in the chip, such as a diode,
transistor, memory cell, or the like.
[0159] FIG. 8A shows an arrangement 800A of mounting structure
including a set of three generally rectangular shaped conductive
pads 801, 802, 803. Conductive pads 801, 802, 803, have relatively
long sides (unnumbered) and relatively short sides. The relatively
short sides are labeled 801A, 802A, and 803A. Relatively short
sides 801A, 802A, 803A are aligned with one another such that a
straight line segment could contact substantially all of short
sides 801A, 802A, and 803A. Conductive pad 801 contains vias 801V1,
801V2. Conductive pad 802 contains vias 802V1, 802V2. Conductive
pad 803 contains vias 803V1, 803V2. Vias 801V1, 802V1, and 803V1
are aligned such that a single line segment could intersect them.
Vias 801V2, 802V2, and 803V2 are aligned such that a single line
segment could intersect them. It should be noted that, while many
drawings shown such as FIGS. 9, 10, 11, 12, 13 depict placement of
a device over a via or vias, the drawings are representative of the
numbers of vias and pads with a device rather than true location of
via(s) relative to a device structure.
[0160] Arrangements depicted disclose vias that tap various
conductive layers located beyond the device attachment to a mounted
conductive structure, such as power in (from an energy source)
and/or power return (such as an energy return back to a source
and/or a ground).
[0161] In an alternative to arrangement 800A, pads may have
different sizes, lengths, or widths from one another. For example,
pad 802 may be shorter than pads 801, 803.
[0162] In another alternative to arrangement 800A, outer pads 801,
803 may have a different shape than central pad 802. For example,
outer pads 801, 803 may include convex central regions and/or
flared end regions. For example, outer pads 801, 803 may be the
same length as one another but shorter or longer than central pad
802.
[0163] In another alternative to arrangement 800A, certain vias may
have a diameter larger than the width or length of the pad to which
they are attached such that the via is not entirely contained
within the footprint of a conductive pad. For example, a via
diameter may be equal to a width of a conductive pad, 1.5, 2, or 3
times larger or smaller than a width of the conductive pad.
[0164] In another alternative to arrangement 800A, certain vias may
have different cross-sectional diameters from one. For example,
cross-section diameters of vias connecting to the central pad 802
may be 1/3, 2, 1, 1.5, 2, or 3 times larger or smaller than the
cross-sectional diameter of vias connecting to outer pads 801,
803.
[0165] In another alternative to arrangement 800A, vias 802V1,
802V2 may be spaced from one another by more than or less than the
spacing between vias 801V1, 801V2 and the spacing between 803V1,
803V2.
[0166] In another alternative to arrangement 800A, each conductive
pad may contain one, two, three, or more vias. For example, each
conductive pad 801, 802, 803 may contain a single via. For example,
pads 801 and 803 may contain 2 or 3 vias and pad 802 may contain
one via. For example, pads 801 and 802 may contain 1 via and pad
802 may contain 2 or 3 vias.
[0167] In another alternative to arrangement 800A, the pads may not
exist in which case just conductive vias exist in one of the
foregoing arrangements. For example, two parallel rows of three
vias.
[0168] In another alternative to arrangement 800A, some pads may
have connected vias and some may not. For example, central pad 802
may contain 1, 2, 3, or more vias and outer pads 801, 803 may
contain no vias. For example, central pad 802 may contain no vias
and each outer pad 801, 803, may contain 1, 2, 3, or more vias.
[0169] In another alternative to arrangement 800A, the
cross-sections of vias may not be circular, such as elliptical,
elongated, or irregular.
[0170] FIGS. 8B-8L show various arrangements of the alternatives
discussed above.
[0171] FIG. 8B shows arrangement 800B of mounting structure having
vias of pad 802 more widely spaces than vias of pads 801, 803.
[0172] FIG. 8C shows arrangement 800C of mounting structure having
vias having elongated cross-sections.
[0173] FIG. 8D shows arrangement 800D of mounting structure having
a single via in each one of pads 801, 802, 803.
[0174] FIG. 8E shows arrangement 800E of mounting structure having
pads 801 and 803 each having one centrally located via.
[0175] FIG. 8F shows arrangement 800F of mounting structure having
pads 801, 802,803 having no vias.
[0176] FIG. 8G shows arrangement 800G of mounting structure having
pads 801, 802, 803 each having three vias, each via in each pad
aligned with one via in each one of the other two pads. FIG. 8H
shows arrangement 800H of mounting structure having single via pads
in which the central pad 802 is short than the outer pads 801,
803.
[0177] FIG. 8I shows arrangement 800I of mounting structure having
outer pads 801, 803 longer than central pad 802, the outer pads
each having two vias and central pad 802 having one via. FIG. 8J
shows arrangement 800J of mounting structure having three pairs of
vias, and no pads.
[0178] FIG. 8K shows arrangement 800K of mounting structure having
outer pads 801, 803 having two vias and central pad 802 having
three vias.
[0179] FIG. 8L shows arrangement 800L of mounting structure having
central pad 802 having one via and outer pads 801, 803 having no
vias.
[0180] Preferably, vias in each pad are spaced symmetrically on
either side of the center of the pad. Preferably, the arrangement
of vias is symmetric about the center point of central pad 802. The
only constraint on variations of pads and vias combinations, sizes,
and shapes in that the resulting arrangement must be configured to
provide electrical or conductive contact to the A, B, and G
electrodes of a discrete component novel energy conditioner. Thus,
all of the various features of the alternative arrangements
described above are compatible with one another, and the inventors
contemplate all possible mix and match combinations.
[0181] Preferably, the combination of novel energy conditioner and
surface mounting structure provides (1) a first in electrical or
conductive contact to at least one and more preferably all
conductive bands connected to one side of the A and B master
electrodes, (2) a second in electrical or conductive contact to at
least one and preferably all conductive bands connected to the
opposite side of the A and B master electrodes, and (3) a third
element in electrical or conductive contact to at least one and
preferably all bands connected to both of the opposite ends of the
G master electrode. The foregoing reference to electrical contact
includes situations where DC current is blocked, such as where a
dielectric cap or layer exists somewhere along a via. FIGS. 9-13
each schematically show a combination of a novel energy conditioner
in operable location on arrangement of conductive mounting
structure elements.
[0182] FIG. 9 shows a novel arrangement of an energy conditioner
and mounting structure. FIG. 9 shows a novel energy conditioner
700', similar to energy conditioner 700 of FIG. 7, on mounting
structure arrangement 800D. Energy conditioner 700' differs from
energy conditioner 700 in that energy conditioner 700' lacks
conductive elements 302B, 304B.
[0183] FIG. 9 shows conductive element 303B' (the conductive
structure which ties together first tabs of the A and B master
electrodes) above conductive pad 801, conductive element 301B' (the
conductive structure which ties together second tabs of A and B
master electrodes) above conductive pad 803. Conductive element
303B' can be conductively connected to pad 801, and conductive
element 301B' can be conductively connected to pad 803, via use of
shapeable conductive material, physical contact, or welding.
[0184] FIG. 9 also shows both conductive elements 302B, 304B (the
conductive elements that connect to tabs of the G master electrode)
above regions of conductive pad 802. In this spatial relationship,
shapeable conductive material can be applied to connect to tabs 43,
44 of the G master electrode to conductive pad 802.
[0185] In FIG. 9, three conductive pads, pads 801, 802, 803,
connect to all external electrode contacts, of energy conditioner
700'. Pad 802 connects to both tabs 43, 44, on opposite sides of
the G master electrode.
[0186] FIG. 9 shows central conductive pad 802 wider and having
larger surface area than either outer conductive pad 801, 803.
[0187] FIG. 10 shows a novel energy conditioner, such as energy
conditioner 700 of FIG. 7, above mounting structure arrangement
800A of FIG. 8A. Conductive elements or bands 303B', 301B' reside
respectively above outer pads 801, 803. Conductive elements 302B,
304B (which connect respectively to tabs 43, 44, on opposite sides
of the G master electrode) reside above inner pad 802. Conductive
structure residing above each such pad can be conductively
connected to that pad.
[0188] FIG. 11 shows a novel energy conditioner, such as energy
conditioner 600, arranged above mounting structure arrangement
800A'. Mounting structure arrangement 800A' is a modified version
of arrangement 800A of FIG. 8A, in which central pad 802 is
extended. However, mounting structure arrangement 800A' has central
pad 802 extending horizontally beyond the horizontal extent of
outer pads 801, 803, and extending horizontally far enough to
underlay conductive elements 301B', 303B' at sides 630, 640. In
addition, neither outer pad 801, 803 extends far underlay and
contact conductive elements 301B', 303B' at sides 630, 640.
[0189] FIG. 12 is a schematic assembly of the arrangement of
shapeable conductive material arrangement 300 of FIG. 3A, energy
conditioner 600', and mounting structure arrangement 800A of FIG.
8A. Energy conditioner 600' is similar to energy conditioner 600 of
FIG. 6. However, energy conditioner 600' does not have conductive
elements 302B, 304B tying tabs together. Instead, energy
conditioner 600' has split conductive elements 302B1 and 302B2,
each of which connects to one set of stacked tabs of the A or B
master electrode.
[0190] FIG. 12 schematically shows shapeable conductive material
302A tying tabs contacting split conductive elements 302B1 and
302B2 together, and also conductively contacting pad 302. FIG. 12
also shows shapeable conductive material 304A tying tabs contacting
split conductive elements 304B1 and 304B2 together, and also
conductively contacting pad 302.
[0191] FIG. 13 is a schematic assembly of the arrangement of
shapeable conductive material arrangement 300 of FIG. 3A, energy
conditioner 600 of FIG. 6, and mounting structure arrangement 800A
of FIG. 8A. In FIG. 13, shapeable conductive does not tie any
electrode tabs. Instead, shapeable conductive material only
conductively connects conductive elements, such as bands, to
conductive pads 301, 302, 303.
[0192] FIG. 14 shows one circuit diagram schematically illustrating
electrical connection of energy conditioner 600 or 700. 304 and
302B may connect in parallel with a line running from a source of
power to a load, and 301B' and 303B' may connect in parallel with a
line connecting to a circuit or system ground.
[0193] FIGS. 27, 28, 31, and 32 are views of energy conditioners
including conductive layers on three planes and various external
structures.
[0194] FIG. 27 shows stack 27A including plates 2500A and 2700B.
Plate 2700B differs from plate 2500B in that the tabs G1T1 and G1T2
of layer G1 are in the LS and RS as opposed to the US and LLS.
[0195] FIG. 28 schematically shows an energy conditioner defined by
one arrangement of (1) stack 27A and (2) external structure 3A of
FIG. 3A. Tabs A1T1 and B1T1 contact the internal surface of
conductive band C3, tabs A1T2 and B1T2 contact the internal surface
of conductive band C1, tab G1T1 contacts the internal surface of
conductive band C2, and tab G1T2 contacts the internal surface of
conductive band C4. In this energy conditioner, the A and B master
electrodes are conductively tied together at the edges of the tabs
by conductive bands C1, C3.
[0196] FIG. 31 shows stack 31A including plates 2500A and 2500B.
Stack 31A also includes a second plate 2500C having the same
layered pattern as plate 2500A and on an opposite side of plate
2500A relative to plate 2500B. Plate 2500C has conductive layers A2
and B2 having tabs aligned with corresponding tabs of plate 2500A,
including tab A2T1, A2T2, B2T1, and B2T2.
[0197] FIG. 32 schematically shows an energy conditioner defined by
one arrangement of (1) stack 31A and (2) external structure 3A of
FIG. 3A. In this structure, tabs for conductive layers of the same
master electrode are aligned in the stack and contact conductive
band structure. For example, tabs A1T1 and A2T1 are aligned and
contact the internal surface of conductive band C1. Alternatively,
for FIG. 31, plate 2500C may be replaced by a plate having a
conductive pattern that is a mirror image of the conductive pattern
on plate 2500A, the mirror defined by a vertical line passing
through the center of conductive plate 2500A. In this alternative,
conductive tabs A1T1 and B2T2, for example, are vertically aligned
and conductively connected by contacts to the inner surface of
conductive band C1.
[0198] FIGS. 33 and 34 show circuits including an energy
conditioner having A, B, and G master electrodes, which relate to
the special properties of such conditioners. The inventors have
determined that connection of the G master electrode at least two
points, preferably at two points on opposite sides from one
another, provides significant advantages. This is in spite of the
fact that the G master electrode is a single conductive structure
wherein location of connection would not be relevant in a lumped
circuit representation. Circuit diagrams rely upon a lumped circuit
model for accuracy of representation. In order to represent this
geometric requirement relating to distributed circuit design in
lumped circuit figures, the inventors schematically represent the
energy conditioners as devices having at least 3 terminal device,
with A, B, G terminals. More terminals may exist for each master
electrode, and additional master electrodes may be integrated into
the same component. The inventors have also determined that
relative locations of A, B, and G electrode terminals relative to
the A, B, and G master electrode structures, may affect performance
of the energy conditioners. FIG. 33-34 therefore show circuits
peculiar to this type of energy conditioner.
[0199] In FIGS. 33-34, external terminal A conductively connects to
the A master electrode, external terminal B conductively connects
to the B master electrode, external terminal G1 conductively
connects to the G master electrode. More specifically as used in
FIGS. 7-12, embodiments having at least 2 G external terminals,
such as a G1 and G2, a first side of the G master electrode, and
external terminal G2 conductively connects to a different side of
the G master electrode.
[0200] FIGS. 33-34 each show conditioner 700, and external
terminals A, B, G1, and G2. The G master electrodes is represented
by portions 702, 705, and the A and B master electrodes are
represented respective by flat plate elements 703, 703. Internal to
conditioner 700, the G master electrode is spaced between or acts
to shield the effects of charge buildup on the A master electrode
from the B master electrode. This is schematically represented by
the portion 702 of the G master electrode extending between the
flat plate elements 703, 704 of the A and B master electrodes. G
master electrode portion 705 schematically represents shielding by
the G master electrode of the A and B master electrodes relative to
space outside conditioner 700.
[0201] FIG. 33 shows a circuit 2 configuration for a conditioner
700 having A, B, and G master electrodes. External terminal A is
tied to node AS on path S, external terminal B is tied to node BS
also on path S, external terminal G1 is tied to node G1R on path R,
and external terminal G2 is tied to node G2R also on path P. Arrows
above and below conductive paths between SOURCE S of electrical
power and LOAD L indicate that current flows in a loop.
[0202] FIG. 34 shows a circuit 6 configuration wherein external
terminal A is tied to a node on path R, external terminal B is tied
to a node on path R, and external terminals G1 and G2 are tied to
nodes on path S.
[0203] The foregoing embodiments provide only exemplary
descriptions of the novel energy conditioners and assemblies.
Obvious modifications and alternatives are within the scope
contemplated by the inventors. The following claims define the
novel concepts discussed above.
* * * * *