U.S. patent application number 12/904444 was filed with the patent office on 2011-02-03 for thermal management of batteries using synthetic jets.
This patent application is currently assigned to Nuventix Inc.. Invention is credited to Ari Glezer, Raghavendran Mahalingam.
Application Number | 20110026218 12/904444 |
Document ID | / |
Family ID | 38173995 |
Filed Date | 2011-02-03 |
United States Patent
Application |
20110026218 |
Kind Code |
A1 |
Mahalingam; Raghavendran ;
et al. |
February 3, 2011 |
THERMAL MANAGEMENT OF BATTERIES USING SYNTHETIC JETS
Abstract
A thermally managed power source (201) is provided herein which
comprises a first battery module (203), and a first synthetic jet
ejector (215) disposed on a surface of said first battery module
and being adapted to direct a plurality of synthetic jets along a
surface (211) of said first battery module.
Inventors: |
Mahalingam; Raghavendran;
(Austin, TX) ; Glezer; Ari; (Atlanta, GA) |
Correspondence
Address: |
John A. Fortkort;Fortkort & Houston P.C.
Building 1, Suite 500, 9442 N. Capital of Texas Hwy
Austin
TX
78759
US
|
Assignee: |
Nuventix Inc.
|
Family ID: |
38173995 |
Appl. No.: |
12/904444 |
Filed: |
October 14, 2010 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
|
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11641473 |
Dec 19, 2006 |
|
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12904444 |
|
|
|
|
60753074 |
Dec 21, 2005 |
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Current U.S.
Class: |
361/679.46 ;
361/701; 429/120 |
Current CPC
Class: |
H01M 10/42 20130101;
H01M 10/4207 20130101; H01M 10/651 20150401; Y02E 60/10 20130101;
H01M 10/613 20150401; H01M 10/6569 20150401; H01M 10/6556 20150401;
H01M 10/6566 20150401; H01M 10/623 20150401; F28D 2021/0029
20130101; H01M 10/656 20150401; H02J 7/0042 20130101; F28F 2250/08
20130101 |
Class at
Publication: |
361/679.46 ;
429/120; 361/701 |
International
Class: |
H01M 10/50 20060101
H01M010/50; G06F 1/20 20060101 G06F001/20; H05K 7/20 20060101
H05K007/20 |
Claims
1. A power source, comprising: a first battery module; and a first
synthetic jet ejector adapted to direct a plurality of synthetic
jets along a surface of said first battery module.
2. The power source of claim 1, wherein said first synthetic jet
ejector is disposed on a surface of said first battery module.
3. The power source of claim 1, wherein said first synthetic jet
ejector has a rounded edge which protrudes past the plane of a
major surface of said first battery module, and wherein said first
synthetic jet ejector is adapted to direct a plurality of synthetic
jets along said major surface.
4. The power source of claim 3, wherein said first synthetic jet
ejector has a plurality of apertures disposed along said rounded
edge.
5. The power source of claim 4, wherein said plurality of apertures
are disposed adjacent to said major surface.
6. The power source of claim 1, wherein said first synthetic jet
ejector has first and second rounded edges which protrude past the
planes of first and second major surfaces of said first battery
module, and wherein said first synthetic jet ejector is adapted to
direct a plurality of synthetic jets along said first and second
major surfaces.
7. The power source of claim 6, wherein said first synthetic jet
ejector has a plurality of apertures disposed along each of said
first and second rounded edges.
8. The power source of claim 1, further comprising a second battery
module and a second synthetic jet ejector disposed on a surface of
said second battery module, said second synthetic jet ejector being
adapted to direct a plurality of synthetic jets along a surface of
said second battery module.
9. The power source of claim 8, wherein said first and second
battery modules are disposed adjacent to, and spaced apart from,
each other.
10. The power source of claim 9, wherein each of said first and
second synthetic jet ejectors has a first edge which protrudes past
a first major surface of said first and second battery modules,
respectively, and wherein said first edges of said first and second
synthetic jet ejectors constrict the flow of fluid between said
first and second battery modules.
11. The power source of claim 10, wherein said first edges of said
first and second synthetic jet ejectors are adjacent to each
other.
12. The power source of claim 10, wherein each of said first edges
of said first and second synthetic jet ejectors are equipped with a
first set of apertures.
13. The power source of claim 12, wherein each of said first edges
of said first and second synthetic jet ejectors are rounded.
14. The power source of claim 1, further comprising a heat
exchanger disposed adjacent to said first battery module, wherein
said heat exchanger has a plurality of channels defined therein,
and wherein said synthetic jet ejector is adapted to direct a
synthetic jet into each of said plurality of channels.
15. The power source of claim 14, wherein said heat exchanger has
at least 8 channels.
16. The power source of claim 14, wherein said heat exchanger has
at least 16 channels.
17. An electronic device incorporating the power source of claim
14, wherein said heat exchanger is incorporated into the chassis of
the electronic device, and wherein the electronic device is
selected from the group consisting of handheld electronic devices
and laptop computers.
18. The power source of claim 14, wherein the flow of fluid through
the channels of said heat exchanger occurs at a rate of at least
2.5 CFM.
19. The power source of claim 14, wherein the heat exchanger
comprises a first, thermally conductive portion which is in thermal
contact with said first battery module, and a second thermally
insulative portion which is spaced apart from said first battery
module.
20. The power source of claim 1, wherein said first synthetic jet
ejector is disposed on a surface of said first battery module.
21-25. (canceled)
Description
CROSS-REFERENCE TO RELATED APPLICATION
[0001] This application claims the benefit of priority from U.S.
application Ser. No. 11/641,473, filed Dec. 19, 2006, now pending,
having the same title, and having the same inventors, and which is
incorporated herein by reference in its entirety; which claims
priority to U.S. Provisional Application No. 60/753,074, filed Dec.
21, 2005, having the same title and having the same inventors, and
which is incorporated herein by reference in its entirety.
FIELD OF THE DISCLOSURE
[0002] The present disclosure relates generally to thermal
management systems, and more specifically to thermal management
systems adapted for use in cooling battery modules disposed in
laptop computers and other portable or handheld electronic
devices.
BACKGROUND OF THE DISCLOSURE
[0003] The thermal management of laptop computers and other
portable or handheld electronic devices has become increasingly
challenging as these devices have become more powerful, while at
the same time decreasing in size and weight. In particular,
acceptable thermal management solutions for these devices are
subject to stringent size and weight constraints, and yet must
dissipate a sufficient amount of thermal energy to maintain the
components and external surfaces of the device within suitable
operating and ergonomic temperature ranges, respectively.
[0004] Battery modules have emerged as a particularly challenging
component of electronic devices from a thermal management
perspective. As portable and hand-held devices have become more
powerful, battery modules are required to provide increasing power
loads, and have also become more compact. Consequently, battery
modules have evolved into increasingly intense hot spots within
such devices.
[0005] Unfortunately, the placement of battery modules in laptops
and handheld devices frequently makes them inaccessible to
conventional thermal management schemes that rely on global forced
air flow through the device. In particular, the battery module is
often sealed off from other components of the device to protect
those components in the event of battery leakage. Moreover, since
the operation of batteries is typically exothermic, it is necessary
to shield the components of a device from the heat generated by the
battery module. On the other hand, conventional thermal management
systems that rely on convection currents generally provide an
insufficient level of heat dissipation to be suitable for this
application.
[0006] The use of fan-based systems is a common global thermal
management solution for desk top computers and other large
electronic devices. However, the use of fans is precluded in many
portable or handheld electronic devices due to the size and weight
constraints noted above, and is also unfavorable from an acoustical
perspective. Moreover, even in larger portable electronic devices
such as laptops where these constraints are less stringent and
where small fan units can be utilized to provide global cooling,
these units generally provide insufficient heat dissipation for
battery modules and other intense hotspots within the device.
BRIEF DESCRIPTION OF THE DRAWINGS
[0007] FIG. 1 is an illustration of a prior art thermal management
system based on the use of synthetic jet ejectors;
[0008] FIG. 2 is a front view of a battery module equipped with a
thermal management system of the type described herein;
[0009] FIG. 3 is a side view of the device of FIG. 2;
[0010] FIG. 4 is an illustration of a case having two channels
defined therein;
[0011] FIG. 5 is an illustration of a case having four channels
defined therein;
[0012] FIG. 6 is an illustration of a case having eight channels
defined therein;
[0013] FIG. 7 is an illustration of a case having sixteen channels
defined therein;
[0014] FIG. 8 is a graph of case temperature as a function of
channel width;
[0015] FIG. 9 is a graph of flow rate (CFM) as a function of heat
transfer coefficient;
[0016] FIG. 10 is a graph of pressure drop as a function of channel
width;
[0017] FIG. 11 is a graph of case weight as a function of channel
width;
[0018] FIG. 12 is a graph of case temperature as a function of
conductivity;
[0019] FIG. 13 is a graph of case weight as a function of
material;
[0020] FIG. 14 is an illustration of a battery module equipped with
a thermal management system of the type described herein;
[0021] FIG. 15 is an illustration of an assembly of battery modules
of the type depicted in FIG. 14;
[0022] FIG. 16 is an illustration of a battery module equipped with
a thermal management system of the type described herein;
[0023] FIG. 17 is an illustration of a battery module equipped with
a thermal management system of the type described herein; and
[0024] FIG. 18 is an illustration of a battery charger equipped
with a thermal management system of the type depicted herein.
SUMMARY OF THE DISCLOSURE
[0025] In one aspect, a thermally managed power source is provided
herein. The power source comprises a first battery module, and a
first synthetic jet ejector adapted to direct a plurality of
synthetic jets along a surface of said first battery module.
[0026] In another aspect, a battery charger is provided which
comprises (a) a base having a synthetic jet ejector disposed
therein; (b) a platform supported on said base; and (c) a charging
station incorporated into said platform, said charging station
having a first major surface which is adapted to receive and charge
at least one battery; wherein said charging station is powered by
electrical circuitry disposed in said base, and wherein said
synthetic jet ejector is adapted to direct a plurality of synthetic
jets along a surface of said base.
[0027] These and other aspects of the present disclosure are
described in greater detail below.
DETAILED DESCRIPTION
[0028] More recently, thermal management systems have been
developed which are based on synthetic jet ejectors. These systems
are more energy efficient than comparable fan-based systems, and
have the ability to provide localized spot cooling. Systems of this
type, an example of which is depicted in FIG. 1, are described in
greater detail in U.S. Pat. No. 6,588,497 (Glezer et al.).
[0029] The system depicted in FIG. 1 utilizes an air-cooled heat
transfer module 101 which is based on a ducted heat ejector (DHE)
concept. The module utilizes a thermally conductive, high aspect
ratio duct 103 that is thermally coupled to one or more IC packages
105. Heat is removed from the IC packages 105 by thermal conduction
into the duct shell 107, where it is subsequently transferred to
the air moving through the duct. The air flow within the duct 103
is induced through internal forced convection by a pair of low form
factor synthetic jet ejectors 109 which are integrated into the
duct shell 107. In addition to inducing air flow, the turbulent jet
produced by the synthetic jet ejector 109 enables highly efficient
convective heat transfer and heat transport at low volume flow
rates through small scale motions near the heated surfaces, while
also inducing vigorous mixing of the core flow within the duct.
[0030] While systems of the type depicted in FIG. 1 have many
unique advantages, there is nonetheless a need in the art for
thermal management systems that are adapted to address the
particular needs of battery modules. These and other needs are met
by the devices and methodologies disclosed herein.
[0031] It has now been found that the aforementioned needs can be
met through the provision of one or more synthetic jet ejectors in
combination with a battery module. The synthetic jet ejectors may
be utilized in combination with various channeling techniques that
ensure adequate heat dissipation, a low form factor, and acceptable
mass, while maintaining the external surfaces of a device
incorporating the battery module within an ergonomically acceptable
range. The use of synthetic ejectors in combination with various
channeling techniques may be used to further ensure that the
components of the battery module are maintained at a proper
operating temperature. The means by which these objectives may be
accomplished are described in greater detail below.
[0032] FIGS. 2-3 illustrate a first particular, non-limiting
embodiment of a thermal management system in accordance with the
teachings herein which is suitable for use in dissipating heat from
a battery module. The system 201 depicted therein comprises a
battery module 203 which contains one or more batteries 205. A heat
exchanger 207 is provided which is adjacent to the batteries 205
and/or battery module 203 and which contains one or more conduits
209 for the flow of a fluid therethrough. The heat exchanger 207
may form part of the battery module 203, or may be a component of a
device which incorporates the battery module 203. Thus, for
example, the heat exchanger 207 may be a portion of (or may be
embedded into) the casing of a laptop computer or handheld
electronic device which is adjacent to the battery module 203.
[0033] Preferably, the heat exchanger 207 comprises an interior
component 211 which is thermally conductive and which is in thermal
contact with the battery module 203 and/or the batteries 205, and
an exterior component 213 which is thermally non-conductive. The
interior component 211 may comprise, for example, aluminum, copper,
graphite, or other materials (including various metal alloys and
metal filled polymeric compositions) having suitable thermal
conductivity, while the exterior surface may comprise, for example,
various thermally insulating plastics and other thermally
non-conductive materials as are known to the art.
[0034] As seen in FIG. 3, the heat exchanger 207 is preferably
constructed with a plurality of segregated conduits 209 or channels
that are in fluidic communication with a synthetic jet ejector 215.
The synthetic jet ejector 215 is preferably adapted to direct at
least one synthetic jet into each channel 209. The use of focused
synthetic jets in this application is found to have several
advantages.
[0035] First of all, the flow rates of fluid achievable through the
channels 209 with conventional global circulation systems is
typically much lower than the rates achievable through the use of
synthetic jets, due to the pressure drop created by the channel
walls. This problem worsens as the cross-sectional channel
dimensions become increasingly smaller. Indeed, at the dimensions
typically imposed on thermal management systems by size constraints
in portable or handheld electronic devices, the pressure drop is
severe enough that these systems typically cannot provide adequate
heat dissipation. The use of focused jets to direct a stream of
fluid into the channels overcomes this problem by reducing this
pressure drop, and hence facilitates increased entrainment of the
flow of fluid into the channels.
[0036] The use of focused jets in the thermal management systems
described herein also significantly improves the efficiency of the
heat transfer process. Under conditions in which the fluid is in a
non-boiling state, the flow augmentation provided by the use of
synthetic jet ejectors increases the rate of local heat transfer in
the channel structure, thus resulting in higher heat removal. Under
conditions in which the fluid is in a boiling state (as may be the
case, for example, if low boiling liquid coolants are utilized in
the channels 209), these jets induce the rapid ejection of vapor
bubbles formed during the boiling process. This rapid ejection
dissipates the insulating vapor layer that would otherwise form
along the surfaces of the channels, and hence delays the onset of
critical heat flux. In some applications, the synthetic jets may
also be utilized to create beneficial nucleation sites to enhance
the boiling process.
[0037] One skilled in the art will also appreciate that the
channels 209 in the devices of FIGS. 2-3 may take a variety of
forms. For example, although the channels 209 are depicted as being
essentially rectangular in cross-section in the embodiment shown
therein, in other embodiments, they may be elliptical, circular,
square, hexagonal, polygonal, or irregular in cross-section. Also,
in some embodiments, the channels may be formed as an open-celled
material. In various embodiments, the channels may also be
convoluted to increase the residence time of fluid in the
channels.
[0038] The number of channels in the heat exchanger 207 may also
vary. The optimal choice for a particular application may depend,
for example, on such factors as the space available, the amount of
heat to be dissipated, and other such factors. Some possible
examples are depicted in FIGS. 4-7. Thus, in the device 301
depicted in FIG. 4, the heat exchanger is segregated into 2
channels 303, each having a width of about 45 mm. In the device 321
depicted in FIG. 5, the heat exchanger is segregated into 4
channels 323, each having a width of about 22 mm. In the device 341
depicted in FIG. 6, the heat exchanger is segregated into 8
channels 343, each having a width of about 11 mm. In the device 361
depicted in FIG. 7, the heat exchanger is segregated into 16
channels 363, each having a width of about 5 mm. In each of the
particular embodiments depicted in FIGS. 4-7, the channels have a
height of about 3 mm, though one skilled in the art will appreciate
that this dimension may vary from one embodiment to another and may
be application specific.
[0039] The effect of channel width (and therefore the number of
channels) on heat dissipation is illustrated in FIG. 8. The graph
shown therein is based on the results of mathematical modeling
studies performed on cases for laptop computers, with the cases
having the structures depicted in FIGS. 4-7. The model assumed a
fixed heat transfer coefficient of 25 W/m.sup.2K, and that the
total power to be dissipated was 18 W, which corresponds to a
typical device operation of about 90 W.
[0040] As seen therein, case temperature drops significantly with
an increase in the number of channels, and a corresponding decrease
in channel width. Thus, with two channels (each having a width of
about 45 mm), the exterior case temperature reached about
80.degree. C. Increasing the number of channels to 4 (and
correspondingly decreasing the channel width to about 22 mm)
lowered the exterior case temperature to about 74.degree. C.
Further increasing the number of channels to 8 (and correspondingly
decreasing the channel width to about 11 mm) lowered the exterior
case temperature to about 70.degree. C. Finally, increasing the
number of channels to 16 (and correspondingly decreasing the
channel width to about 5 mm) lowered the exterior case temperature
to about 66.degree. C. It is to be noted here that these results
are achievable, in part, by the unique ability of synthetic jets to
compensate for the increase in flow resistance that would otherwise
attend a reduction in channel dimensions.
[0041] FIG. 9 is a graph of flow rate (in cubic feet per minute
(CFM)) as a function of heat transfer coefficient for a heat
exchanger of the type depicted in FIGS. 2-3. As seen therein, in
order to attain a desired thermal objective, the flow rate of fluid
through the heat exchanger will typically have to increase as the
heat transfer coefficient increases. It is thus desirable in many
applications to use materials such as metals and graphite which
have high thermal conductivities for the interior segment 211 (see
FIG. 2) of the heat exchanger.
[0042] FIG. 10 is a graph of pressure drop as a function of channel
width for a heat exchanger of the type depicted in FIGS. 2-3. As
seen therein, pressure decreases significantly with channel width.
Thus, for a device of the type depicted in FIG. 4 which has two
channels (each having a width of about 45 mm), the channel pressure
is about 10 N/m.sup.2. For a device of the type depicted in FIG. 5
which has four channels (each having a width of about 22 mm), the
channel pressure is about 60 N/m.sup.2. For a device of the type
depicted in FIG. 6 which has eight channels (each having a width of
about 11 mm), the channel pressure is about 70 N/m.sup.2. For a
device of the type depicted in FIG. 7 which has sixteen channels
(each having a width of about 5 mm), the channel pressure is about
60 N/m.sup.2. Hence, the need for flow augmentation of the type
provided by synthetic jets becomes more critical as the number of
channels increases and channel width decreases. One skilled in the
art will appreciate that the optimum channel dimensions for a
particular application may thus be chosen with consideration of the
amount of heat to be dissipated, the flow augmentation available
with the synthetic jet ejector, the heat transfer coefficient of
the material of the heat exchanger, and other such factors.
[0043] FIG. 11 illustrates the effect of channel width on the
weight of a device for a particular embodiment of the heat
exchanger of the type depicted in FIGS. 2-3. Thus, for en exemplary
heat exchanger having the configuration depicted in FIG. 4 (which
has two channels, each having a width of about 45 mm), the weight
of the device is about 20 g. For an exemplary heat exchanger of the
type depicted in FIG. 5 (which has four channels, each having a
width of about 22 mm), the weight of the device is about 22 g. For
en exemplary heat exchanger of the type depicted in FIG. 6 (which
has eight channels, each having a width of about 11 mm), the weight
of the device is about 24 g. For an exemplary heat exchanger of the
type depicted in FIG. 7 (which has sixteen channels, each having a
width of about 5 mm), the weight of the device is about 30 g. It is
thus seen that, with respect to the device depicted in FIGS. 2-3,
there is a weight penalty associated with increasing the number of
channels, due in part to the increased number of channel
partitions. In designing a heat exchanger for a particular
application, this weight penalty must be considered in light of the
other benefits and drawbacks attendant to an increase in the number
of channels.
[0044] FIG. 12 illustrates the effect of thermal conductivity of
the case material on the case temperature. As seen therein, the use
of case materials such as aluminum, copper or graphite in the
interior component 211 (see FIG. 2) of the case allows the exterior
case temperature to be maintained at about 70.degree. C. (assuming
a 4-channel heat exchanger of the type depicted in FIG. 5), which
is well within ergonomically acceptable ranges for many
applications. By contrast, the use of thermally insulating
materials such as non-thermally conductive plastics increases the
exterior case temperature about two-fold to 140.degree. C.
[0045] FIG. 13 illustrates the effect of materials choice on the
weight of the case. As seen therein, plastics (i.e., ABS) provide
the most light-weight construction at about 8 grams. The use of
graphite increases the weight of the casing to about 17 g, while
the use of aluminum increases the weight to about 20 g. For
comparison, a copper construction would yield a casing that weighs
about 70 g. It should be noted that the foregoing assumes that the
entire casing is made of the noted material. However, one skilled
in the art will appreciate that the advantages of thermal
conductivity (and the previously noted reduction in exterior casing
temperatures) and lighter weight casings can be achieved by making
the casing with a two-component or multi-component construction of
the type depicted in FIGS. 2-3. In such a construction, only the
interior component 211 is required to be thermally conductive, thus
significantly reducing the weight penalty associated with the use
of heavier, thermally conductive materials.
[0046] FIG. 14 illustrates a second, non-limiting embodiment of a
thermal management system of the type disclosed herein which is
suitable for use in dissipating heat from a battery module. The
system 401 comprises a battery module 403 which contains one or
more batteries. Rather than utilizing a channeling scheme as is the
case with the device of FIGS. 2-3, in this embodiment, a synthetic
jet ejector 405 is mounted on one end of the battery module 403 and
is adapted to direct a plurality of synthetic jets along one or
more surfaces of the battery module 403, as indicated by the first
set of arrows 407. A series of apertures 409 or nozzles are
provided on a surface of the synthetic jet ejector 405 adjacent to
each major surface of the battery module 403 for this purpose. As
indicated by the second set of arrows 411 in FIG. 14, the synthetic
jets created by the synthetic jet ejector 405 cause entrainment of
the ambient fluid, thus improving the efficiency of heat transfer
from the surfaces of the battery module 403 to the ambient
environment.
[0047] As shown in FIG. 15, battery modules 403 of the type
depicted in FIG. 14 may be assembled in parallel. One advantage of
this type of arrangement is that the resulting entrainment of the
ambient fluid, indicated in FIG. 15 by arrows 413, results in a
turbulent flow of the fluid medium through the space between
adjacent battery modules 403, thus resulting in a more efficient
transfer of heat between the surfaces of the battery modules 403
and the ambient environment.
[0048] FIG. 16 illustrates another possible, non-limiting
embodiment of a thermally managed battery module made in accordance
with the teachings herein. The device 501 depicted therein
comprises a casing 503 which contains a battery module 505 and
associated circuitry 507. The battery module 505 has a synthetic
jet actuator 509 mounted on a surface thereof. The casing 503 may
contain one or more vents to permit fluid flow between the interior
and exterior of the casing 503.
[0049] FIG. 17 illustrates yet another possible, non-limiting
embodiment of a thermally managed battery module made in accordance
with the teachings herein. The device 531 depicted therein, which
is similar in many respects to the device depicted in FIG. 16,
comprises a casing 533 which contains a battery module 535 and
associated circuitry 537. In contrast to the device depicted in
FIG. 16, however, the device depicted in FIG. 17 utilizes a
channeling scheme 539 similar to that depicted in FIGS. 2-3, in
conjunction with a surface mounted synthetic jet actuator 541, to
create a flow of fluid over the surfaces of the battery module 535,
thereby maintaining the battery modules within a desired
temperature range.
[0050] While much of the discussion above has focused on the
thermal management of battery modules, one skilled in the art will
appreciate that the teachings disclosed herein are not limited to
battery modules, but are applicable to the thermal management of a
wide variety of devices. Thus, for example, FIG. 18 illustrates one
particular, non-limiting embodiment of the application of a
synthetic jet ejector of the type disclosed herein to a battery
charger 601. The battery charger 601 comprises a platform 603 which
has an upper surface 605 that has a series of ports therein (not
shown), each of which is adapted to accept a battery 607 or battery
pack for charging. The base 609 of the battery charger 601 contains
a power supply which is in electrical communication with the ports
defined in the upper surface 605 of the platform 603.
[0051] The base 609 is equipped with a planar surface for
supporting the battery charger on a substrate. The platform 603 is
preferably supported at an angle to the planar surface. Preferably,
this angle is within the range of about 15.degree. to about
75.degree., and more preferably, this angle is within the range of
about 30.degree. to about 60.degree..
[0052] In the particular embodiment of the battery charger depicted
in FIG. 18, significant heating occurs during the normal charge and
discharge cycles attendant to the operation of the device such
that, if no thermal management measures are taken, the temperature
of the (typically aluminum) front surface 611 of the base 609 is
about 68.degree. C., which is well above the critical limit of
55.degree. C. dictated by end-user ergonomics. Moreover, the device
is found to lose capacity when the temperature of this component
exceeds 65.degree. C.
[0053] The base 609 of the device includes a base plate 613. The
base plate contains a synthetic jet ejector that is adapted to
eject a plurality of synthetic jets (indicated by the larger
arrows) along the front surface 611 of the base 609. The formation
of the synthetic jets causes entrainment of the ambient fluid
(indicated by the smaller arrows). Operation of the synthetic jet
ejector is found to reduce the temperature of the front surface 611
of the base 609 such that it is in an ergonomically acceptable
range.
[0054] The above description of the present invention is
illustrative, and is not intended to be limiting. It will thus be
appreciated that various additions, substitutions and modifications
may be made to the above described embodiments without departing
from the scope of the present invention. Accordingly, the scope of
the present invention should be construed in reference to the
appended claims.
* * * * *