U.S. patent application number 12/511184 was filed with the patent office on 2011-02-03 for heat-dissipating fins, large-area heat sink having such heat-dissipating fins and method for manufacturing the same.
Invention is credited to Chih-Hung Cheng, Ken Hsu, Chen-Hsiang Lin, Kuo-Len Lin.
Application Number | 20110024087 12/511184 |
Document ID | / |
Family ID | 43525888 |
Filed Date | 2011-02-03 |
United States Patent
Application |
20110024087 |
Kind Code |
A1 |
Lin; Kuo-Len ; et
al. |
February 3, 2011 |
HEAT-DISSIPATING FINS, LARGE-AREA HEAT SINK HAVING SUCH
HEAT-DISSIPATING FINS AND METHOD FOR MANUFACTURING THE SAME
Abstract
The present invention relates to a heat sink of a large area, in
which a heat-dissipating body is further provided in its limited
space. The method for manufacturing a fin includes the steps of
providing a fin, cutting the fin to form a foldable piece thereon,
folding back the foldable piece to be overlapped on the fin and
form an accommodating hole, and punching the folded piece and the
fin to form two overlapped through-holes. The fin, the
heat-dissipating body and heat pipes are assembled together to
obtain the heat sink. Since the fins and the heat-dissipating body
dissipate the heat of the heat-generating element simultaneously,
the heat-dissipating efficiency of the heat sink can be
improved.
Inventors: |
Lin; Kuo-Len; (Wugu
Township, TW) ; Lin; Chen-Hsiang; (Wugu Township,
TW) ; Hsu; Ken; (Wugu Township, TW) ; Cheng;
Chih-Hung; (Wugu Township, TW) |
Correspondence
Address: |
HDLS Patent & Trademark Services
P.O. BOX 220746
CHANTILLY
VA
20153-0746
US
|
Family ID: |
43525888 |
Appl. No.: |
12/511184 |
Filed: |
July 29, 2009 |
Current U.S.
Class: |
165/104.26 ;
165/182; 29/890.046 |
Current CPC
Class: |
H01L 23/3672 20130101;
B23P 15/26 20130101; F28D 15/0266 20130101; Y10T 29/49378 20150115;
F28F 1/32 20130101; H01L 23/467 20130101; F28D 15/02 20130101; B23P
2700/10 20130101; H01L 23/427 20130101; F28D 15/0275 20130101; H01L
2924/0002 20130101; H01L 2924/00 20130101; Y10T 29/49368 20150115;
H01L 2924/0002 20130101; Y10T 29/49377 20150115; Y10T 29/4938
20150115 |
Class at
Publication: |
165/104.26 ;
165/182; 29/890.046 |
International
Class: |
F28D 15/02 20060101
F28D015/02; B23P 15/26 20060101 B23P015/26 |
Claims
1. A method for manufacturing a heat sink of a large area,
comprising the steps of: a) providing a plurality of fins and a
heat pipe; b) cutting each of the fins to form a plurality of
cutting lines on each fin, the cutting lines forming at least one
foldable piece; c) folding back the foldable piece to be overlapped
on the fin, thereby forming an accommodating hole on the fin; d)
punching the fin and the folded piece to form two overlapped
through-holes; e) penetrating the two through-holes of the fin and
the folded piece by the heat pipe; and f) penetrating other fins by
the heat pipe according to the step e).
2. The method for manufacturing a heat sink of a large area
according to claim 1, wherein in the step b), the cutting lines
form a U shape on each of the fins to form a foldable piece on the
fin.
3. The method for manufacturing a heat sink of a large area
according to claim 1, wherein in the step b), the cutting lines
form an H shape on each of the fins to form two foldable pieces on
the fin.
4. The method for manufacturing a heat sink of a large area
according to claim 1, wherein a hollow airflow channel is formed
between the folded piece and the fin in the step c).
5. The method for manufacturing a heat sink of a large area
according to claim 1, wherein the step d) is performed after the
step c), the foldable piece is folded back to be overlapped on the
fin in the step c), and the fin and the folded piece overlapped on
the fin are punched in the step d).
6. The method for manufacturing a heat sink of a large area
according to claim 1, wherein the step d) is performed before the
step c), the fin and the foldable piece are punched in the step d)
to form two overlapped through-holes, the foldable piece is folded
back to be overlapped on the fin in the step c), thereby
overlapping the two through-holes.
7. The method for manufacturing a heat sink of a large area
according to claim 1, further comprising, between the step d) and
the step e), a step d') of pressing peripheries of the two
through-holes to form two overlapped flanges on the peripheries of
the two through-holes.
8. The method for manufacturing a heat sink of a large area
according to claim 7, wherein the flange of the through-hole of the
fin is adhered to an outer wall of the heat pipe in the step
f).
9. The method for manufacturing a heat sink of a large area
according to claim 1, further comprising a step h) of providing a
heat-conducting base, the heat pipe being inserted into the
heat-conducting base.
10. A heat sink of a large area, comprising; a heat pipe; and a
plurality of fins parallel to each other and arranged at intervals,
the heat pipe penetrating the fins, the fin being provided with a
foldable piece, the foldable piece being folded back to be
overlapped on the fin, thereby forming an accommodating hole on the
fin, the folded piece and the fin being provided with two
overlapped through-holes, the heat pipe penetrating the two
through-holes of the fin.
11. The heat sink of a large area according to claim 10, wherein
peripheries of the two through-holes are provided with two
overlapped flanges.
12. The heat sink of a large area according to claim 10, wherein a
hollow airflow channel is formed between the folded piece and the
fin.
13. The heat sink of a large area according to claim 10, further
comprising a heat-dissipating body, the heat-dissipating body being
disposed in the accommodating holes of the fins.
14. A heat-dissipating fin being provided with a foldable piece,
the foldable piece being folded back to be overlapped on the fin,
the fin being formed with an accommodating hole, the folded piece
and the fin are provided with two overlapped through-holes.
15. The heat-dissipating fin according to claim 14, wherein a
hollow airflow channel is formed between the folded piece and the
fin.
16. The heat-dissipating fin according to claim 14, wherein
peripheries of the two through-holes are provided with two
overlapped flanges.
17. The method for manufacturing a heat sink of a large area
according to claim 1, further comprising a step g) of providing a
heat-dissipating body, the heat-dissipating body being accommodated
in the accommodating hole of the fin.
18. The heat sink of a large area according to claim 11, wherein
the flange of the fin is adhered to an outer wall of the heat pipe
tightly.
19. The heat sink of a large area according to claim 10, further
comprising a heat-conducting base, the heat-conducting base
allowing the heat pipe to be inserted therein
Description
BACKGROUND OF THE INVENTION
[0001] 1. Field of the Invention
[0002] The present invention relates to a heat sink, and in
particular to a heat sink of a large area.
[0003] 2. Description of Prior Art
[0004] Electronic elements will generate heat during their
operations. Especially, with the advancement of the science and
technology, the functions and performance of an electronic product
are enhanced substantially. As a result, the heat generated by the
electronic product also increases to a much larger extent. In view
of this, most of the electronic elements are provided with a heat
sink to control its working temperature and maintain its normal
operation. It is a well-known heat sink including a stack of
heat-dissipating fins and heat pipes penetrating the stack of
heat-dissipating fins.
[0005] Please refer to FIG. 1, which is a schematic view showing
the conventional combination of heat pipes and heat-dissipating
fins. The heat sink la comprises a heat-conducting base 10a, two
U-shaped heat pipes 20a and a plurality of fins 30a. The
heat-conducting base 10a is provided with a plurality of grooves
11a. The two U-shaped heat pipes 20a are inserted into the grooves
11a. The heat pipe 20a penetrates through-holes of the plurality of
fins 30a. With this arrangement, the heat-conducting base 10a is
adhered to a heat-generating element. The heat sink 1a can conduct
the heat generated by the heat-generating electronic element
quickly.
[0006] In the above structure, the heat is conducted from the heat
pipe 20a to the fins 30a. Then, the fins 30a dissipate the heat
quickly to the outside. However, the heat pipes 20a cannot conduct
the heat uniformly throughout the fins 30a, so that the portions
away from the heat pipe 10a are poor in heat-dissipating
efficiency. Moreover, with the continuous improvement in the
performance of electronic elements, the heat generated by the
electronic elements is increased accordingly. Thus, the
heat-dissipating efficiency of the heat sink also has to be
improved. Due to the limited volume of the current electronic
product, it is an important issue to increase the heat-dissipating
area of the heat sink la as large as possible in order to increase
the heat-dissipating efficiency.
[0007] Therefore, in order to solve the above-mentioned problems,
the present Inventor proposes a reasonable and novel structure
based on his deliberate research and expert experiences.
SUMMARY OF THE INVENTION
[0008] The present invention is to provide a fin and a heat sink of
a large area. A heat-dissipating body is further provided in a
limited space, so that the fins and the heat-dissipating body can
dissipate the heat of a heat-generating element. In this way, the
heat-dissipating efficiency can be enhanced.
[0009] The present invention is to provide a method for
manufacturing a heat sink of a large area, which includes the steps
of: a) providing a plurality of fins and a heat pipe; b) cutting
each of the fins to form a plurality of cutting lines on the fin,
the cutting lines forming at least one foldable piece; c) folding
the foldable piece back to be overlapped on the fin, thereby
forming an accommodating hole on the fin; d) punching the fin and
the folded piece to form two overlapped through-holes; e)
penetrating the two through-holes of the fin and the folded piece
by the heat pipe; and f) penetrating other fins by the heat pipe
according to the step e).
[0010] The present invention provides a heat sink of a large area,
which includes a heat pipe and a plurality of fins. The fins are
parallel to each other and arranged at intervals. The heat pipe
penetrates the fins. Each of the fins is provided with a foldable
piece. The foldable piece is folded back to be overlapped on the
fin. The fin is formed with an accommodating hole. The folded piece
and the fin are provided with two overlapped through-holes. The
heat pipe penetrates the two through-holes of the fins.
[0011] The present invention provides a heat-dissipating fin. The
fin is provided with a foldable piece. The foldable piece is folded
back to be overlapped on the fin, thereby forming an accommodating
hole on the fin. The folded piece and the fin are provided with two
overlapped through-holes.
[0012] In comparison with prior art, since the fin of the present
invention is provided with a folded piece and an accommodating
hole, in case of a limited space, the present invention does not
need additional space for arranging the fins. Not only the heat
sink has a plurality of fins, but also a heat-dissipating body can
be further disposed in the accommodating holes of the fins. The
heat sink of the present invention has a larger heat-dissipating
area than that in prior art. Since the fins and the
heat-dissipating body dissipate the heat of the heat-generating
element simultaneously, the heat-dissipating efficiency of the heat
sink can be increased. Thus, the practicability of the present
invention can be increased.
BRIEF DESCRIPTION OF THE DRAWINGS
[0013] FIG. 1 is a schematic view showing the conventional
combination of heat pipes and heat-dissipating fins;
[0014] FIG. 2 is a flow chart showing the method for manufacturing
the heat sink of a large area according to the present
invention;
[0015] FIG. 3 is an assembled view showing the heat sink of a large
area according to the present invention;
[0016] FIG. 4A is a view showing the action for cutting the fin of
the present invention;
[0017] FIG. 4B is a view showing the action for folding back the
foldable piece of the fin according to the present invention;
[0018] FIG. 4C is a view showing the action for punching the fin
and the folded piece according to the present invention;
[0019] FIG. 4D is a view showing the action for pressing the fin
and the folded piece according to the present invention;
[0020] FIG. 5 is a perspective view showing the external appearance
of the heat sink of the present invention;
[0021] FIG. 6 is a longitudinal cross-sectional view showing the
heat sink of the present invention;
[0022] FIG. 7 is a transverse cross-sectional view showing the heat
sink of the present invention;
[0023] FIG. 8 is a schematic view showing the operating state of
the heat sink of the present invention; and
[0024] FIG. 9 is a view showing the heat sink according to the
second embodiment of the present invention.
DETAILED DESCRIPTION OF THE INVENTION
[0025] The characteristics and technical contents of the present
invention will be described with reference to the accompanying
drawings. However, the drawings are illustrative only but not used
to limit the present invention.
[0026] Please refer to FIGS. 2 and 3. FIG. 2 is a flow chart
showing the method for manufacturing the heat sink of a large area
according to the present invention, and FIG. 3 is an assembled view
showing the heat sink of a large area according to the present
invention. First, a heat pipe 10, a heat-conducting base 20, a
heat-dissipating body 30 and a plurality of fins 40 are provided
(step 100). The heat pipe 10 penetrates the heat-conducting base
20.
[0027] In the present embodiment, there are three heat pipes 10
each formed into a U shape, but the number of the heat pipes 10 is
not limited thereto. The bottom surface of the heat-conducting base
20 is provided with three grooves 21 to correspond to the number of
the heat pipes 10. The three heat pipes 10 are inserted into the
grooves 21. The heat-dissipating body 30 is an aluminum-extruded
fin which has a base 31 and a plurality of extending pieces 32
extending upwards from the base 31. The extending pieces 32 are
parallel to each other and arranged at intervals. A channel 300 is
formed between any two extending pieces 32. Further, the fins 40
are penetrated by the heat pipe 10.
[0028] Please refer to FIGS. 4A to 4D, which show the method for
manufacturing the fin 40. First, a tool (not shown) is used to cut
the fin 40 (step 200) so as to form a plurality of cutting lines 41
on the fin 40. The cutting lines 41 form at least one foldable
piece 42 on the fin 40. For example, if the cutting lines 41 forms
a U shape, one foldable piece 42 can be formed on the fin 41. If
the cutting lines 41 formed an H shape, both sides of the fin 40
can generate a foldable piece 42 respectively.
[0029] Please refer to FIG. 4B. Then, the foldable piece 42 is
folded back, so that the folded piece 42 can be overlapped on the
fin 40. A hollow airflow channel 420 is formed between the folded
piece 42 and the fin 40. The hollow airflow channel 420 allows
airflow to flow through to take away the heat. As a result, the fin
40 is formed with an accommodating hole 400 (step 300). Then, the
fin 40 and the folded piece 42 are punched to form two overlapped
through-holes 401, 402 (step 400). In the present embodiment, the
step 400 is performed after the step 300. That is, in the present
embodiment, the fin 40 and the folded piece 42 overlapped on the
fin 40 are punched at the same time. Alternatively, the step 400
can be performed before the step 300. That is, in the step 400, the
fin 40 and the foldable piece 42 are first punched to form two
overlapped through-holes 401, 402. Then, the step 300 is performed.
The foldable piece 42 is folded back to be overlapped on the fin
40, so that the two through-holes 401, 402 are overlapped. Then, a
tool 50 is used to press the peripheries of the two through-holes
401, 421. In this way, the peripheries of the two through-holes
401, 421 are formed with two overlapped flanges 402, 422.
[0030] The two through-holes 401, 422 of the fin 40 and the folded
piece 42 are aligned with the heat pipe 10, so that the fin 40 and
the folded piece 42 can be penetrated by the heat pipe 10 (step
500). The base 31 of the heat-dissipating body 30 is disposed on
the top surface of the heat-conducting base 20 and is accommodated
in the accommodating hole 400 of the fin 40.
[0031] Please refer to FIGS. 5 to 7. FIG. 5 is a perspective view
showing the external appearance of the heat sink of the present
invention. FIG. 6 and FIG. 7 are cross-sectional views of the
present invention respectively. Following the above steps, other
fins can be penetrated by the heat pipe 10 (step 600), thereby
completing a heat sink 1. It can be seen that the flange 402 of the
through-hole 401 of the fin 40 is adhered to an outer wall of the
heat pipe 10 tightly (excluding a narrowed section 101 of the heat
pipe 10). Most of the extending pieces 32 of the heat-dissipating
body 30 are accommodated in the accommodating holes 400 of a stack
of fins 40. In addition, the channels 300 of the heat-dissipating
body 20 are in communication with each other.
[0032] Please refer to FIG. 8, which is a schematic view showing
the operating state of the heat sink of a large area according to
the present invention. When the heat sink 1 is used to dissipate
the heat of a heat-generating electronic element 60, the
heat-conducting base 20 and the bottom section of the heat pipe 10
are adhered to the surface of the heat-generating electronic
element 60. The heat generated by the heat-generating electronic
element 60 is conducted to the heat-conducting base 20 and the heat
pipe 10. The heat is further conducted to the fins 40 by means of
the heat pipe 10. On the other hand, the heat conducted to the
heat-conducting base 20 is further conducted to the
heat-dissipating body 30. As a result, the extending pieces 32
dissipate the heat into the channels 300 that are in communication
with each other. The fins 40 and the heat-dissipating body 30 are
used to dissipate the heat of the heat-generating electronic
element 60 at the same time to the outside. In this way, the
temperature of the heat-generating electronic element 60 can be
reduced, and the accumulation of heat on the heat-generating
electronic element 60 can be prevented. Thus, the heat-dissipating
efficiency of the heat sink 1 is increased.
[0033] Please refer to FIG. 9, which is a view showing the heat
sink of a large area according to the second embodiment of the
present invention. The present embodiment is substantially the same
as the first embodiment. The difference between the present
embodiment and the first embodiment is described as follows. The
heat sink 1' is not provided with a heat-conducting base. The fins
40' are penetrated by a flat heat pipe 10'. Each of the fins 40' is
provided with two foldable pieces 42' and an accommodating hole
400' is formed between the two foldable pieces 42'. A
heat-dissipating body 30' is also accommodated in the accommodating
hole 400'.
[0034] Although the present invention has been described with
reference to the foregoing preferred embodiments, it will be
understood that the invention is not limited to the details
thereof. Various equivalent variations and modifications can still
occur to those skilled in this art in view of the teachings of the
present invention. Thus, all such variations and equivalent
modifications are also embraced within the scope of the invention
as defined in the appended claims.
* * * * *