U.S. patent application number 12/841710 was filed with the patent office on 2011-02-03 for fluid supply apparatus, fluid applying apparatus, and fluid supply method.
This patent application is currently assigned to SONY CORPORATION. Invention is credited to Tsutomu Noda, Akihiko Watanabe.
Application Number | 20110023966 12/841710 |
Document ID | / |
Family ID | 43067251 |
Filed Date | 2011-02-03 |
United States Patent
Application |
20110023966 |
Kind Code |
A1 |
Watanabe; Akihiko ; et
al. |
February 3, 2011 |
FLUID SUPPLY APPARATUS, FLUID APPLYING APPARATUS, AND FLUID SUPPLY
METHOD
Abstract
A fluid supply apparatus includes a piston, a piston support
portion to support the piston, a container support portion capable
of supporting a container in which a fluid is contained, and a
drive mechanism. The drive mechanism drives at least one of the
container support portion and the piston support portion in a
direction in which the piston is inserted into the container at a
time when supply of the fluid is performed and drives at least one
of the container support portion and the piston support portion in
a direction in which the piston is relatively removed from the
container at a time when the supply of the fluid is stopped.
Inventors: |
Watanabe; Akihiko; (Tokyo,
JP) ; Noda; Tsutomu; (Saitama, JP) |
Correspondence
Address: |
SNR DENTON US LLP
P.O. BOX 061080
CHICAGO
IL
60606-1080
US
|
Assignee: |
SONY CORPORATION
Tokyo
JP
|
Family ID: |
43067251 |
Appl. No.: |
12/841710 |
Filed: |
July 22, 2010 |
Current U.S.
Class: |
137/1 ;
137/565.01 |
Current CPC
Class: |
Y10T 137/85978 20150401;
B23K 3/0638 20130101; B41F 15/42 20130101; Y10T 137/0318 20150401;
H05K 3/1233 20130101 |
Class at
Publication: |
137/1 ;
137/565.01 |
International
Class: |
E03B 5/00 20060101
E03B005/00 |
Foreign Application Data
Date |
Code |
Application Number |
Jul 29, 2009 |
JP |
2009-176216 |
Claims
1. A fluid supply apparatus, comprising: a piston; a piston support
portion to support the piston; a container support portion capable
of supporting a container in which a fluid is contained; and a
drive mechanism to drive at least one of the container support
portion and the piston support portion in a direction in which the
piston is inserted into the container at a time when supply of the
fluid is performed and to drive at least one of the container
support portion and the piston support portion in a direction in
which the piston is relatively removed from the container at a time
when the supply of the fluid is stopped.
2. The fluid supply apparatus according to claim 1, wherein the
piston includes a seal member provided at an end portion of the
piston, the seal member having a tapered outer circumferential
surface whose outer circumference is increased in diameter in a
direction in which the piston is inserted.
3. The fluid supply apparatus according to claim 1, wherein the
fluid is solder.
4. A fluid supply method, comprising: discharging, with a use of a
fluid supply apparatus including a piston, a piston support
portion, a container support portion, and a drive mechanism, a
fluid by relatively inserting the piston into a container with the
drive mechanism so that an insertion distance of the piston into
the container is longer than a set insertion distance that is an
insertion distance corresponding to a preset amount of supply of
the fluid, the piston having a through hole, the piston support
portion supporting the piston, the container support portion being
capable of supporting the container in which the fluid is
contained, the drive mechanism being capable of driving at least
one of the container support portion and the piston support portion
so that the piston is inserted into the container to discharge the
fluid from the container through the through hole of the piston;
and driving at least one of the container support portion and the
piston support portion by using the fluid supply apparatus in a
direction in which the piston is relatively removed from the
container with the drive mechanism prior to stop of discharge of
the fluid so that the discharge of the fluid is stopped when an
amount of supply corresponding to the set insertion distance is
obtained.
5. A fluid supply method, comprising: discharging, with a use of a
fluid supply apparatus including a piston having a through hole, a
piston support portion, a container support portion, and a drive
mechanism, a fluid from the container through the through hole of
the piston by driving at least one of the container support portion
and the piston support portion in a direction in which the piston
is inserted into the container, the piston support portion
supporting the piston, the container support portion being capable
of supporting the container in which the fluid is contained, the
drive mechanism being capable of driving at least one of the
container support portion and the piston support portion to
discharge the fluid from the container; and driving at least one of
the container support portion and the piston support portion in a
direction in which the piston is relatively removed from the
container prior to stop of discharge of the fluid.
6. The fluid supply method according to claim 4, wherein the fluid
is solder.
7. A fluid supply apparatus, comprising: a piston having a through
hole; a piston support portion to support the piston; a container
support portion capable of supporting a container in which a fluid
is contained; and a drive mechanism to drive at least one of the
container support portion and the piston support portion so that
the piston is inserted into the container while the container and
the piston are relatively rotated to discharge the fluid from the
container through the through hole of the piston.
8. The fluid supply apparatus according to claim 7, further
comprising: a nozzle having an inside flow path that is
communicated with the through hole; and an opening and closing
mechanism capable of opening and closing the inside flow path.
9. The fluid supply apparatus according to claim 8, wherein the
nozzle includes a discharge end portion including a tapered surface
whose outer circumference is decreased in diameter in a direction
in which the fluid is discharged, and wherein the opening and
closing mechanism closes the inside flow path by pressing the
discharge end portion.
10. The fluid supply apparatus according to claim 9, wherein the
opening and closing mechanism includes a pair of opening and
closing members that presses the nozzle with the nozzle being
sandwiched therebetween, the pair of opening and closing members
each having a pressing end portion and a cutout, the pressing end
portion pressing the nozzle, the cutout being formed at the
pressing end portion.
11. The fluid supply apparatus according to claim 7, wherein the
drive mechanism drives at least one of the container support
portion and the piston support portion so that the piston is
relatively moved in a direction in which the piston is removed from
the container to adjust a discharge amount of the fluid.
12. The fluid supply apparatus according to claim 7, wherein the
piston includes a seal member provided at an end portion of the
piston, the seal member having a tapered outer circumferential
surface whose outer circumference is increased in diameter in a
direction in which the piston is inserted.
13. A fluid applying apparatus, comprising: a fluid supply
apparatus including a piston having a through hole, a piston
support portion to support the piston, a container support portion
capable of supporting a container in which a fluid is contained,
and a drive mechanism to drive at least one of the container
support portion and the piston support portion so that the piston
is inserted into the container while the container and the piston
are relatively rotated to discharge the fluid from the container
through the through hole of the piston; and a squeegee mechanism
capable of applying, to a supply target, the fluid supplied on the
supply target by the fluid supply apparatus.
14. The fluid applying apparatus according to claim 13, further
comprising: a movement mechanism to cause the fluid supply
apparatus and the squeegee mechanism to integrally move.
15. A fluid supply method, comprising: supporting a piston and a
container by a piston support portion and a container support
portion, respectively, the piston having a through hole, the
container containing a fluid; and discharging the fluid from the
container through the through hole by driving at least one of the
container support portion and the piston support portion so that
the piston is inserted into the container while the container and
the piston are relatively rotated.
Description
BACKGROUND OF THE INVENTION
[0001] 1. Field of the Invention
[0002] The present invention relates to a fluid supply apparatus, a
fluid applying apparatus, and a fluid supply method for supplying a
fluid such as solder that is to be applied to a printed circuit
board.
[0003] 2. Description of the Related Art
[0004] In the past, there has been known a solder printer that
applies solder paste to a land and the like of a printed circuit
board to form a solder pattern. In the solder printer, a solder
supply apparatus that supplies solder paste is incorporated. Such a
solder supply apparatus is disclosed in Japanese Patent Application
Laid-open No. 2004-306102 (hereinafter, referred to as Patent
Document 1), for example (see, FIG. 2 and the like of Patent
Document 1).
[0005] In the solder supply apparatus disclosed in Patent Document
1, a supply assembly is used. The supply assembly is constituted of
a supply container that contains solder, a supply container member
that stores and fixes the supply container in position, and a
discharge adaptor that is inserted in an opening portion of the
supply container. In addition, to the solder supply apparatus, a
drive mechanism for pressing the supply container member is
provided.
[0006] The supply assembly is mounted on the solder supply
apparatus so that the opening portion side of the supply container
is faced downward. At the time of supplying solder, by the drive
mechanism, the supply container member is pressed and moved to the
discharge adaptor inserted. The discharge adaptor is fixed in
position, so when the supply container member is moved, the
discharge adaptor is caused to enter the supply container fixed by
the supply container member, resulting in application of a pressure
to the solder in the supply container. The discharge adaptor has a
discharge opening. Therefore, the solder subjected to the pressure
is supplied to a printed circuit board and the like through the
discharge opening.
SUMMARY OF THE INVENTION
[0007] In the solder supply apparatus disclosed in Patent Document
1, however, a drive mechanism capable of sufficiently pressing and
moving the supply container member is needed in order to reliably
supply the solder. To serve the need, a large drive mechanism that
is provided with a motor or the like having a large output is used,
which makes it difficult to miniaturize the solder supply
apparatus.
[0008] In view of the above-mentioned circumstances, it is
desirable to provide a fluid supply apparatus, a fluid applying
apparatus, and a fluid supply method capable of realizing the
miniaturization and reliably supplying a fluid.
[0009] According to an embodiment of the present invention, there
is provided a fluid supply apparatus including a piston, a piston
support portion, a container support portion, and a drive
mechanism.
[0010] The piston has a through hole.
[0011] The piston support portion supports the piston.
[0012] The container support portion is capable of supporting a
container in which a fluid is contained.
[0013] The drive mechanism drives at least one of the container
support portion and the piston support portion so that the piston
is inserted into the container while the container and the piston
are relatively rotated to discharge the fluid from the container
through the through hole of the piston.
[0014] In the fluid supply apparatus, the piston is inserted into
the container with the container and the piston being relatively
rotated, resulting in reduction in resistance of the piston with
respect to the container at the time when the piston is inserted.
Thus, for example, even with the small drive mechanism provided
with a small motor whose output is small, the piston can be
reliably inserted into the container, with the result that the
fluid can be positively supplied.
[0015] The drive mechanism may drive at least one of the container
support portion and the piston support portion so that the piston
is relatively moved in a direction in which the piston is removed
from the container to adjust a discharge amount of the fluid.
[0016] When the piston is relatively moved in the direction in
which the container is removed from the container, the pressure
applied to the fluid in the container becomes small. Therefore, the
piston is moved during the discharge of the fluid, and the
discharge of the fluid is stopped as described above, which can
adjust the discharge amount of the fluid. Since the resistance of
the piston with respect to the container at the time when the
piston is moved is small, the piston can be easily moved as
described above.
[0017] The piston may include a seal member provided at an end
portion of the piston. The seal member has a tapered outer
circumferential surface whose outer circumference is increased in
diameter in a direction in which the piston is inserted.
[0018] Since the resistance of the piston with respect to the
container at the time when the piston is inserted is small, the
seal member can be provided at the end portion of the piston. With
the seal member, the fluid in the container can be sufficiently
scraped off and discharged.
[0019] The fluid supply apparatus may further include a nozzle and
an opening and closing mechanism.
[0020] The nozzle has an inside flow path that is communicated with
the through hole.
[0021] The opening and closing mechanism is capable of opening and
closing the inside flow path.
[0022] In the fluid supply apparatus, the fluid is discharged
through the inside flow path of the nozzle. The inside flow path is
closed by the opening and closing mechanism when the fluid is
discharged, thereby making it easier to remove the fluid from the
nozzle. In addition, by closing the inside flow path of the nozzle
at a desired timing, the supply amount of the fluid can be
adjusted.
[0023] The nozzle may include a discharge end portion including a
tapered surface whose outer circumference is decreased in diameter
in a direction in which the fluid is discharged. In this case, the
opening and closing mechanism may close the inside flow path by
pressing the discharge end portion.
[0024] Since the discharge end portion from which the fluid is
discharged has the tapered surface, the fluid is easily separated
from the nozzle when the inside flow path is closed by the opening
and closing mechanism.
[0025] The opening and closing mechanism may include a pair of
opening and closing members.
[0026] The pair of opening and closing members presses the nozzle
with the nozzle being sandwiched therebetween. The pair of opening
and closing members each has a pressing end portion and a cutout.
The pressing end portion presses the nozzle, and the cutout is
formed at the pressing end portion.
[0027] In the fluid supply apparatus, the nozzle is pressed by the
pair of opening and closing members while being sandwiched
therebetween, thereby closing the inside flow path of the nozzle.
At the pressing end portion of each of the pair of the opening and
closing members, the cutout is formed. At the time when the inside
flow path is closed, the deformation of the nozzle is suppressed by
the size of the cutout. The size of the cutout may be set as
appropriate within the range in which the inside flow path is
closed.
[0028] According to another embodiment of the present invention,
there is provided a fluid applying apparatus including a fluid
supply apparatus and a squeegee mechanism.
[0029] The fluid supply apparatus includes a piston, a piston
support portion, a container support portion, and a drive
mechanism.
[0030] The piston has a through hole.
[0031] The piston support portion supports the piston.
[0032] The container support portion is capable of supporting a
container in which a fluid is contained.
[0033] The drive mechanism drives at least one of the container
support portion and the piston support portion so that the piston
is inserted into the container while the container and the piston
are relatively rotated to discharge the fluid from the container
through the through hole of the piston.
[0034] The squeegee mechanism is capable of applying, to a supply
target, the fluid supplied on the supply target by the fluid supply
apparatus.
[0035] The fluid applying apparatus may further include a movement
mechanism.
[0036] The movement mechanism causes the fluid supply apparatus and
the squeegee mechanism to integrally move.
[0037] The reduction in size of the fluid supply apparatus can be
realized. Therefore, the movement mechanism that causes the fluid
supply apparatus and the squeegee mechanism to integrally move can
be easily realized. The integral movement of the fluid supply
apparatus and the squeegee mechanism can effectively supply the
fluid at the time when the fluid is applied.
[0038] According to another embodiment of the present invention,
there is provided a fluid supply method including supporting a
piston and a container by a piston support portion and a container
support portion, respectively. The piston has a through hole. The
container contains a fluid.
[0039] The fluid is discharged from the container through the
through hole by driving at least one of the container support
portion and the piston support portion so that the piston is
inserted into the container while the container and the piston are
relatively rotated.
[0040] In the solder supply apparatus disclosed in Patent Document
1, however, it takes time for the solder to be discharged from the
tube 54 after being subjected to the pressure. Therefore, a devise
is necessary for adjusting the amount of solder and discharging the
solder.
[0041] According to another embodiment of the present invention,
there is provided a fluid supply apparatus including a piston, a
piston support portion, a container support portion, and a drive
mechanism.
[0042] The piston support portion supports the piston.
[0043] The container support portion is capable of supporting a
container in which a fluid is contained.
[0044] The drive mechanism drives at least one of the container
support portion and the piston support portion in a direction in
which the piston is inserted into the container at a time when
supply of the fluid is performed and drives at least one of the
container support portion and the piston support portion in a
direction in which the piston is relatively removed from the
container at a time when the supply of the fluid is stopped.
[0045] In the fluid supply apparatus, by relatively moving the
piston in the direction in which the piston is removed from the
container, the pressure applied to the fluid in the container is
reduced. Accordingly, for example, the piston is moved during the
discharge of the fluid to stop the discharge of the fluid, thereby
making it possible to adjust the discharge amount of the fluid.
[0046] According to another embodiment of the present invention,
there is provided a fluid supply method including discharging, with
a use of a fluid supply apparatus including a piston, a piston
support portion, a container support portion, and a drive
mechanism, a fluid by relatively inserting the piston into a
container with the drive mechanism so that an insertion distance of
the piston into the container is longer than a set insertion
distance that is an insertion distance corresponding to a preset
amount of supply of the fluid. The piston has a through hole. The
piston support portion supports the piston. The container support
portion is capable of supporting the container in which the fluid
is contained. The drive mechanism is capable of driving at least
one of the container support portion and the piston support portion
so that the piston is inserted into the container to discharge the
fluid from the container through the through hole of the
piston.
[0047] At least one of the container support portion and the piston
support portion is driven by using the fluid supply apparatus in a
direction in which the piston is relatively removed from the
container with the drive mechanism prior to stop of discharge of
the fluid so that the discharge of the fluid is stopped when an
amount of supply corresponding to the set insertion distance is
obtained.
[0048] According to another embodiment of the present invention,
there is provided a fluid supply method including discharging, with
a use of a fluid supply apparatus including a piston having a
through hole, a piston support portion, a container support
portion, and a drive mechanism, a fluid from the container through
the through hole of the piston by driving at least one of the
container support portion and the piston support portion in a
direction in which the piston is inserted into the container. The
piston support portion supports the piston. The container support
portion is capable of supporting the container in which the fluid
is contained.
[0049] The drive mechanism is capable of driving at least one of
the container support portion and the piston support portion to
discharge the fluid from the container.
[0050] At least one of the container support portion and the piston
support portion is driven in a direction in which the piston is
relatively removed from the container prior to stop of discharge of
the fluid.
[0051] As described above, according to the embodiments of the
present invention, the fluid supply apparatus, the fluid applying
apparatus, and the fluid supply method capable of realizing the
miniaturization and capable of reliably supplying the fluid can be
provided.
[0052] These and other objects, features and advantages of the
present invention will become more apparent in light of the
following detailed description of best mode embodiments thereof, as
illustrated in the accompanying drawings.
BRIEF DESCRIPTION OF DRAWINGS
[0053] FIG. 1 is a schematic diagram showing a structure of a fluid
applying apparatus according to an embodiment of the present
invention;
[0054] FIG. 2 is a schematic diagram showing a structure of a
substrate support mechanism shown in FIG. 1;
[0055] FIG. 3 is a schematic perspective view showing a fluid
supply apparatus and a squeegee mechanism according to the
embodiment;
[0056] FIG. 4 is a schematic front view showing the fluid supply
apparatus and the squeegee mechanism shown in FIG. 3;
[0057] FIG. 5 is a schematic side view showing the fluid supply
apparatus and the squeegee mechanism shown in FIG. 3;
[0058] FIG. 6 is a schematic side view showing the fluid supply
apparatus and the squeegee mechanism shown in FIG. 3;
[0059] FIG. 7 is a schematic top view showing the fluid supply
apparatus and the squeegee mechanism shown in FIG. 3;
[0060] FIG. 8 is a schematic cross-sectional view showing a piston
according to the embodiment;
[0061] FIG. 9 are schematic cross-sectional views each showing an
end portion of the piston fixed by a piston support portion, that
is opposite to an end portion on the side of the container;
[0062] FIG. 10 are enlarged schematic views each showing a nozzle
and opening and closing members shown in FIG. 9;
[0063] FIG. 11 is a schematic perspective view showing a squeegee
according to the embodiment;
[0064] FIG. 12 is a schematic top view of the squeegee shown in
FIG. 11 when viewed from above;
[0065] FIG. 13 is a block diagram showing a structure of a control
system of a fluid applying apparatus according to the
embodiment;
[0066] FIG. 14 is a block diagram showing a control system of the
fluid supply apparatus and the squeegee mechanism in the block
diagram shown in FIG. 13;
[0067] FIG. 15 is a flowchart showing an operation of the fluid
applying apparatus according to the embodiment;
[0068] FIG. 16 is a schematic cross-sectional view showing a seal
member and the piston inserted into the container;
[0069] FIG. 17 is a top view schematically showing a motion of
solder when the solder is applied with the squeegee; and
[0070] FIG. 18 is a perspective view showing a modified example of
the drive mechanism of the fluid applying apparatus according to
the embodiment.
DESCRIPTION OF PREFERRED EMBODIMENTS
[0071] Hereinafter, an embodiment of the present invention will be
described with reference to the drawings.
[0072] (Structure of Fluid Applying Apparatus)
[0073] FIG. 1 is a schematic diagram showing a structure of a fluid
applying apparatus according to an embodiment of the present
invention. A fluid applying apparatus 150 is an apparatus for
supplying solder as a fluid to a substrate 2 through a screen 1.
The fluid applying apparatus 150 includes a fluid supply apparatus
100, a squeegee mechanism 170, a fixation mechanism 10 that fixes
the screen 1 in position, and a substrate support mechanism 20 that
supports the substrate 2.
[0074] The fixation mechanism 10 includes a plurality of clamps 11
that hold end portions 3 of the screen 1. The screen 1 is fixed in
position with the plurality of clamps 11. The screen 1 is fixed
below the fluid supply apparatus 100 and the squeegee mechanism 170
so as to be opposed thereto. Further, the screen 1 has a pattern
hole (not shown).
[0075] FIG. 2 is a schematic diagram showing a structure of the
substrate support mechanism 20. The support mechanism 20 includes a
stage mechanism 21 and a stage movement mechanism 22 that moves the
stage mechanism 21. The stage mechanism 21 includes a conveyor belt
23 and an adsorption block mechanism 24 capable of being moved up
and down. The adsorption block mechanism 24 supports the substrate
2 that is conveyed by the conveyor belt 23 and causes the substrate
2 to move above the conveyor belt 23.
[0076] The stage movement mechanism 22 includes a movement unit 25
that moves the stage mechanism 21 in a surface direction of the
substrate 2 (X direction and Y direction in FIG. 2) and rotates the
stage mechanism 21 about the Z axis in FIG. 2. In addition, the
stage movement mechanism 22 includes an air cylinder 26. The air
cylinder 26 moves the stage mechanism 21 in a vertical direction (Z
direction). Further, the stage movement mechanism 22 includes a
plurality of stoppers 27 provided in the perimeter of the movement
unit 25.
[0077] As shown in FIG. 1, the fluid applying apparatus 150
includes a camera portion 4 and a cleaning unit 5. The camera
portion 4 and the cleaning unit 5 are capable of being moved along
guide rails 6. The camera portion 4 recognizes an alignment mark
(not shown) given on the substrate 2 in order to position the
substrate 2. The cleaning unit 5 is provided with cleaning paper 7,
with which a lower surface (surface on the substrate 2 side) of the
screen 1 is subjected to cleaning.
[0078] (Structure of Fluid Supply Apparatus)
[0079] FIG. 3 is a schematic perspective view showing the fluid
supply apparatus 100 and the squeegee mechanism 170 according to
this embodiment. FIGS. 4 to 7 are a front view (FIG. 4), side views
(FIGS. 5 and 6), and a top view (FIG. 7) schematically showing the
fluid supply apparatus 100 and the squeegee mechanism 170 shown in
FIG. 3.
[0080] The fluid supply apparatus 100 includes a container support
portion 104, a piston support portion 102, and a drive mechanism
103 that drives the container support portion 104 and the piston
support portion 102.
[0081] Like the supply apparatus disclosed in Patent Document 1,
the container support portion 104 is capable of holding
commercially available solder and a container (see, container 30
shown in FIG. 16) in which the solder is contained. Specifically,
the container support portion 104 is formed to have a shape that
covers the bottom surface (surface of an upper portion in the
figure) and the side surface of the container. The container
support portion 104 is disposed below a support block 101 so as to
be rotatable with respect to the support block 101.
[0082] The container and the container support portion 104 each
have an opening on one side. The container is fixed in position by
a ring-shaped fixation member 105 provided at the opening of the
container support portion 104. By rotating the container support
portion 104, the container is integrally rotated with the container
support portion 104. The container support portion 104 is supported
by the support block 101 so that the opening of the container is
faced downward (toward the side on which the substrate 2 is
disposed). The container support portion 104 is formed so as to fit
to the shape of the container, and is made of metal such as
aluminum, stainless steel, and iron.
[0083] The piston support portion 102 is fixed on a piston support
block 112 that is opposed to the support block 101 from below. To
the piston support portion 102, a piston 106 capable of being
inserted into the container is fixed.
[0084] FIG. 8 is a schematic cross-sectional view showing the
piston 106. The piston 106 has a through hole 106d that is extended
in a direction in which the piston 106 is inserted (Z direction in
FIG. 8). The through hole 106d serves as a flow path of the solder.
The through hole 106d is formed to be positioned at approximately
the center of an end surface 109 of the piston 106 that is inserted
into the container.
[0085] To an end portion 106a of the piston 106 which is inserted
into the container, a seal member 107 is provided so as to surround
the end portion 106a. The seal member 107 is fitted in the
container. The end portion 106a of the piston 106 is capable of
being detached from a piston main body 106b and is screwed with a
screw 108 provided to a screw hole 106c in the piston main body
106b. The seal member 107 is fixed by being sandwiched between the
piston main body 106b and the end portion 106a.
[0086] As shown in FIG. 8, the seal member 107 has a tapered outer
circumferential surface 110 whose outer circumference is increased
in diameter in a direction in which the piston 106 is fitted (Z
direction). As the seal member 107, a material having elasticity
such as urethane and silicon is used. As the piston 106, a metal
such as aluminum, stainless steel, and iron is used. The piston 106
and the seal member 107 are formed so as to fit to the shape of the
container. It should be noted that an O ring or the like may be
used as the seal member 107. Further, in this embodiment, although
the end surface 109 of the piston 106 is flat, the end surface 109
may have a concave shape inclined toward the through hole 106d that
is formed at approximately the center of the end surface 109.
[0087] FIGS. 9A and 9B are schematic cross-sectional views each
showing an end portion 111 on the side opposite to the end portion
106a of the piston 106 fixed to the piston support portion 102. The
end portion 111 on the side opposite to the end portion 106a has a
tube shape. The inside of the tube-shaped end portion 111 functions
as a part of the through hole 106d. The piston support portion 102
has a through hole (not shown) through which the end portion 111
passes.
[0088] To the end portion 111, a nozzle 113 made of silicon rubber
or the like is attached. The inside flow path of the nozzle 113 is
communicated with the through hole 106d.
[0089] Through the through hole 106d of the piston 106 and the
inside flow path of the nozzle 113, the solder in the container is
discharged to the outside.
[0090] As shown in FIGS. 9A and 9B, below the piston support block
112, an opening and closing mechanism 114 that sandwiches the
nozzle 113 is provided. The opening and closing mechanism 114 is
constituted of a pair of opening and closing members 115a and 115b
and air cylinders 120a and 120b connected to the opening and
closing members 115a and 115b, respectively. The opening and
closing members 115a and 115b are closed by the air cylinders 120a
and 120b, and the nozzle 113 is pressed as shown in FIG. 9B. As a
result, the inside flow path of the nozzle 113 is closed.
[0091] By closing the inside flow path of the nozzle 113 as
described above when the solder is discharged from the nozzle 113,
the solder discharged is easily removed from the nozzle 113. In
addition, by closing the inside flow path of the nozzle 113 at a
desired timing, the amount of supply of the solder can be adjusted.
Further, for example, the inside flow path is closed during a time
period when the solder is not discharged, thereby making it
possible to prevent air from getting into the container. Thus, it
is possible to prevent the solder from being oxidized. It is also
possible to prevent a foreign matter from getting into the
container.
[0092] FIGS. 10A and 10B are enlarged schematic views each showing
the nozzle 113 and the opening and closing members 115a and 115b.
As shown in FIG. 10A, a discharge end portion 116 of the nozzle 113
(portion surrounded by a dashed-dotted line of FIG. 10A) from which
the solder is discharged has a tapered surface 116a whose outer
circumference has a diameter decreased in a direction in which the
solder is discharged (in the negative Z direction). The opening and
closing members 115a and 115b press a part P (outer circumferential
side surface) immediately above the tapered surface 116a, thereby
making it easier to remove the solder from the nozzle 113.
[0093] This may be because the contact area of the nozzle 113 with
the solder is reduced by forming the tapered surface 116a.
[0094] FIG. 10B shows the pair of the opening and closing members
115a and 115b when viewed from below. In the figure, the nozzle 113
and the inside flow path 116b are shown between the opening and
closing members 115a and 115b. As shown in FIG. 10B, on pressing
end potions 119a and 119b of the opening and closing members 115a
and 115b, cutouts 120a and 120b are formed, respectively. The
pressing end portions 119a and 119b press the nozzle 113.
[0095] Therefore, when the opening and closing members 115a and
115b press the nozzle 113 (see, FIG. 9B), the nozzle 113 can be
suppressed from being deformed by the sizes of the cutouts 120a and
120b. With this structure, it is possible to prevent the nozzle 113
from being deteriorated and damaged. In addition, it is also
possible to prevent plastic deformation of the nozzle 113 pressed
repeatedly by the opening and closing members 115a and 115b, which
can avoid the case where the inside flow path 116b is not secured
even in a state where the opening and closing members 115a and 115b
are opened.
[0096] The sizes of the cutouts 120a and 120b may be arbitrarily
set within a range in which the inside flow path 116b is closed
when the nozzle 113 is pressed. In FIG. 10B, the shape of the
cutouts 120a and 120b is set to be rectangle, but is not limited
thereto. The shape of the cutouts may be set to a circular arc or
an ellipsoidal arc.
[0097] In addition, as shown in FIGS. 3 to 6, on the side surface
of the piston 106, a planar portion 106e is formed. The planner
portion has a planner surface. The planar portion 106e is
irradiated with laser light or the like, and reflected light is
detected. As a result, whether the piston 106 is properly disposed
can be checked. Further, the planar portion 106e makes it easier to
carry the piston 106.
[0098] It should be noted that in FIGS. 3 to 6, the state where the
piston 106 and the seal member 107 are not fitted into the
container is shown in order to make the piston 106 and the seal
member 107 more visible. In this state, the container support
portion 104 and the piston support portion 102 are driven, and the
piston 106 may be fitted into the container. Alternatively, the
piston 106 is fitted into the container stored in the container
support portion 104, and in this state, the container support
portion 104 and the piston 106 may be disposed on the support block
101 and the piston support portion 102, respectively.
[0099] The drive mechanism 103 includes a motor 122, a driving
pulley 123, and two driven pulleys. The driving pulley 123 is
provided to a rotation shaft of the motor 122. The two driven
pulleys are connected to the driving pulley 123 through a belt 124.
The two driven pulleys are constituted of a rotary drive pulley 125
and a vertical drive pulley 126. The motor 122 is disposed below a
support plate 132 and supported by the supported plate 132. The
support plate 132 is fixed to the support block 101 directly or
indirectly. A drive shaft (not shown) of the motor 122 is connected
to the driving pulley 123 while penetrating the support plate
132.
[0100] As shown in FIGS. 3 to 6, the driving pulley 123 is disposed
on the support plate 132. The rotary drive pulley 125 and the
vertical drive pulley 126 are disposed on the support block 101.
The rotary drive pulley 125 is disposed above the container support
portion 104, and a rotation shaft 127 of the rotary drive pulley
125 is connected to the container support portion 104. The vertical
drive pulley 126 is disposed behind the rotary drive pulley 125.
The cogs of the vertical drive pulley 126 and the cogs of the
rotary drive pulley 125 are engaged with each other. In addition,
between the driving pulley 123 and the rotary drive pulley 125, a
tension member 128 that prevents the slack of the belt 124 is
provided.
[0101] As the rotation shaft of the vertical drive pulley 126, a
lead screw 129 is mounted. The upper end of the lead screw 129 is
fixed to a frame 130. To the lower portion of the frame 130, for
example, two guide shafts 131 are connected in a vertical
direction. To the two guide shafts 131, the drive mechanism 103,
the support plate 132, the support block 101, and the container are
integrally provided through an attachment portion so as to be
vertically movable. That is, when the vertical drive pulley 126 is
rotated, the drive mechanism 103, the support plate 132, the
support block 101, and the container are integrally moved with
respect to the frame 130 in the vertical direction. Thus, the drive
mechanism 103, the support plate 132, the support block 101, and
the container are integrally moved with respect to the piston 106
in the vertical direction. As the lead screw 129, for example, a
trapezoidal screw or a ball screw may be used.
[0102] As shown in FIGS. 3 to 7, the squeegee mechanism 170 in this
embodiment is provided to the lower portion of the fluid supply
apparatus 100 and is capable of being moved integrally with the
fluid supply apparatus 100 along guide rails 28 shown in FIG. 1.
The fluid supply apparatus 100 and the squeegee mechanism 170 are
connected to the guide rails 28 by a connection member 121 provided
on the back surface side thereof.
[0103] The squeegee mechanism 170 includes a pair of squeegees 171
and 172. To the squeegees 171 and 172, air cylinders 173 and 174
are connected, respectively. By the air cylinders 173 and 174, the
squeegees 171 and 172 are movable in the vertical direction. The
squeegees 171 and 172 have the similar structure, so the squeegee
171 will be described as a representative.
[0104] FIG. 11 is a schematic perspective view showing the squeegee
171. The squeegee 171 includes an attachment portion 175, a main
squeegee 171a, and a pair of sub-squeegees 171b. The attachment
portion 175 is attached to the squeegee mechanism 170. The pair of
the sub-squeegees 171b is provided on both ends of the main
squeegee 171a. The main squeegee 171a and the sub-squeegees 171b
are connected through spring members 176. The sub-squeegees 171b
are movable vertically with respect to the main squeegee 171a. A
squeegee surface 177a of the main squeegee 171a that is brought
into contact with the screen 1 is inclined with respect to the
screen 1 by a predetermined angle. Further, squeegee surfaces 177b
of the pair of sub-squeegees 171b are also inclined with respect to
the screen 1 by a predetermined angle.
[0105] FIG. 12 is a schematic top view showing the squeegee 171
viewed from above. In FIG. 12, the squeegee surfaces 177a and 177b
are shown as the main squeegee 171a and the sub-squeegees 171b as a
matter of convenience for explanation. As shown in FIG. 12, the
pair of sub-squeegees 171b is inclined by a predetermined angle
.alpha. with respect to the extending direction of the main
squeegee 171a. Further, outer ends 178b of the sub-squeegees 171b
are positioned outside both ends 178a of the main squeegee 171a. In
addition, inner ends 179b of the sub-squeegees 171b are positioned
inside the both ends 178a of the main squeegees 171a.
[0106] To the fluid supply apparatus 100 or the squeegee mechanism
170, a rolling diameter detection sensor (not shown) is provided.
The rolling diameter detection sensor measures a rolling diameter
at the time when the solder supplied to the screen is applied. The
rolling diameter detection sensor irradiates the solder with, for
example, laser light or an ultrasonic wave, and detects the light
or the ultrasonic wave reflected on the surface of the solder,
thereby determining a curvature radius of the surface of the solder
that is subjected to the rolling. The rolling diameter detection
sensor may be disposed at any position, as long as the rolling
diameter detection sensor is capable of measuring the rolling
diameter. For example, the rolling diameter detection sensor may be
provided integrally with the squeegee 171, thereby measuring the
rolling diameter of the solder applied with the squeegee 172.
[0107] Further, to the fluid supply apparatus 100 or the squeegee
mechanism 170, a solder temperature detection sensor (not shown) is
provided. The solder temperature detection sensor measures the
temperature of the surface of the solder that is subjected to the
rolling. The solder temperature detection sensor detects an
infrared ray radiated from the surface of the solder that is
subjected to the rolling, thereby measuring the temperature of the
surface of the solder. As the solder temperature detection sensor,
a non-contact thermistor, a non-contact thermopile that is
constituted of a plurality of thermocouples, or the like is used.
The solder temperature detection sensor may be disposed at any
position, as long as the solder temperature detection sensor can
detect the temperature of the surface of the solder. For example,
the solder temperature detection sensor may be provided at the same
position as the rolling diameter detection sensor.
[0108] (Control System of Fluid Applying Apparatus)
[0109] FIG. 13 is a block diagram showing the structure of a
control system of the fluid applying apparatus 150. FIG. 14 is a
block diagram showing a control system of the fluid supply
apparatus 100 and the squeegee mechanism 170 in the block diagram
shown in FIG. 13.
[0110] As shown in FIGS. 13 and 14, the drives of the stage
mechanism 21, the stage movement mechanism 22, the camera portion
4, the fluid supply apparatus 100, and the squeegee mechanism 170
are controlled by a controller 133.
[0111] Further, in this embodiment, the controller 133 also
controls a temperature adjustment unit 134 that adjusts the room
temperature in which the fluid applying apparatus 150 is
installed.
[0112] It should be noted that FIG. 14 shows a temperature adjustor
135 that is provided to the temperature adjustment unit 134. The
temperature adjustor 135 is controlled by the controller 133, and
thus the room temperature is adjusted.
[0113] For example, the controller 133 and drivers of the
respective portions may be implemented by hardware or by both of
software and hardware. Typically, examples of the hardware include
a CPU (central processing unit), an MPU (micro processing unit), a
RAM (random access memory), a ROM (read only memory), a DSP
(digital signal processor), an FPGA (field programmable gate
array), an ASIC (application specific integrated circuit), an NIC
(network interface card), and a WNIC (wireless NIC). Various
programs that constitute the software are stored in a ROM or
another storage device. The controller 133 may be provided in the
fluid applying apparatus 150 or may be provided in an apparatus
different from the fluid applying apparatus 150. In the case where
the controller 133 is provided in another apparatus, the apparatus
may be caused to output a control signal to the fluid applying
apparatus 150 through wired or wireless connection.
[0114] (Operation of Fluid Applying Apparatus)
[0115] A description will be given on an operation of the fluid
applying apparatus 150 according to this embodiment.
[0116] First, the operation of the fluid supply apparatus 100 that
supplies the solder onto the screen 1 will be described. Then, the
overall operation of the fluid applying apparatus 150 will be
described.
[0117] (Operation of Fluid Supply Apparatus)
[0118] From the controller 133, a control signal to supply the
solder is output to the driver of the motor 122 shown in FIGS. 3 to
7, and the motor 122 is rotated. As a result, the driving pulley
123 is rotated, and the vertical drive pulley 126 is also rotated
in conjunction with the rotation of the driving pulley 123, thereby
moving the container downward. Thus, the piston 106 is relatively
moved upward in the container. In conjunction with the rotation of
the driving pulley 123, the rotary drive pulley 125 is also
rotated. Therefore, the container moved downward is moved downward
while being rotated by the rotary drive pulley 125. Accordingly,
the piston 106 is moved upward while relatively rotating in the
container. As a result, the solder in the container is subjected to
the pressure, and the solder is supplied through the through hole
106d of the piston 106. The solder is supplied between the
squeegees 171 and 172 of the squeegee mechanism 170 shown in FIG.
2.
[0119] In addition, the piston 106 is inserted into the container
while the container and the piston 106 are relatively rotated,
which reduces a resistance of the piston 106 with respect to the
container. Therefore, for example, even when a small motor whose
output is small is used as the motor 122, the piston 106 can be
reliably inserted into the container. As a result, the drive
mechanism 103 can be miniaturized, and the solder can be reliably
supplied.
[0120] Further, in this embodiment, it is possible to use the
container as it is without transferring the solder to another
container. Thus, the workability at the time of applying the fluid
is improved. In addition, if the solder is transferred, the solder
adhered to a paddle or the like that is used for the transfer is
discarded. However, in this embodiment, the discarding of the
solder is not caused, which can reduce the amount of waste of the
solder.
[0121] FIG. 16 is a schematic cross-sectional view showing the
piston 106 and the seal member 107 that are inserted into the
container. Generally, the inner shape of the container 30 is
structured so that an opening area thereof is made to be smaller
toward the bottom thereof. That is, as the piston 106 is inserted,
the diameter of the inside of the container 30 is gradually made to
be smaller.
[0122] The seal member 107 provided on the end portion 106a of the
piston 106 has the outer circumferential surface 110 having a
tapered shape. The outer circumferential surface 110 has
elasticity, and is therefore deformed so as to fit to the inner
shape of the container 30 whose diameter becomes smaller. With this
structure, a solder 31 in the container 30 can be sufficiently
scraped off and discharged.
[0123] When the seal member 107 as described above is provided, the
resistance of the piston 106 with respect to the container 30 may
be increased in some cases. In the fluid supply apparatus 100
according to this embodiment, however, the seal member 107 as
described above can be provided on the end portion 106a of the
piston 106, because the resistance of the piston 106 with respect
to the container 30 is small.
[0124] When the control signal for stopping the supply of the
solder is output to the driver of the motor 122 from the controller
133, the driver of the motor 122 drives the motor 122 to rotate in
a direction reverse to the above-mentioned direction. The driving
pulley 123 is also rotated in the reverse direction. In conjunction
with this, the vertical drive pulley 126 and the rotary drive
pulley 125 are also rotated. Thus, the piston 106 is moved in the
direction of being removed from the container while the piston 106
and the container are relatively rotated in the direction reverse
to the above-mentioned direction. When the piston 106 is moved in
the direction of being removed from the container, the pressure
applied to the solder in the container becomes smaller.
[0125] It takes time for the solder to be discharged through the
nozzle 113 after the solder is subjected to the pressure. In view
of this, for example, a distance by which the piston 106 is
inserted is set to be longer, and the motor 122 is rotated in the
reverse direction at the timing at which the discharge of the
solder is stopped when a desired supply amount thereof is
obtained.
[0126] As a result, the time period necessary for the discharge of
the solder can be reduced. As described above, the motor 122 is
driven to move the piston 106 in the vertical direction, thereby
making it possible to adjust the amount of the discharge of the
solder. As described above, since the resistance of the piston 106
with respect to the container at the time when the piston 106 is
moved is small, the piston 106 can be easily moved in the
above-mentioned manner.
[0127] In addition, when the controller 133 outputs the control
signal for stopping the supply of the solder to the driver of the
opening and closing mechanism 114, the opening and closing
mechanism 114 is driven. Then, the nozzle 113 is sandwiched between
the pair of opening and closing members 115a and 115b (see, FIGS.
9A and 9B) at a desired timing, thereby closing the inside flow
path of the nozzle 113. As a result, the solder discharged is
removed from the nozzle 113.
[0128] The overall operation of the fluid applying apparatus 150
will be described. FIG. 15 is a flowchart showing the operation of
the fluid applying apparatus 150.
[0129] The stage movement mechanism 22 is driven, and the stage
movement mechanism 22 moves the stage mechanism 21 to a substrate
conveying portion 29 that is provided on the camera portion 4 side
shown in FIG. 2. The conveyor belt 23 of the stage mechanism 21 is
driven, thereby conveying the substrate 2 from the substrate
conveying portion 29 to the conveyor belt 23. After that, the stage
movement mechanism 22 moves the stage mechanism 21 up to a
predetermined position, and the substrate 2 is moved to a position
above the adsorption block mechanism 24 with the conveyor belt 23
(Step 101).
[0130] The adsorption block mechanism 24 is moved upward to hold
the substrate 2. The adsorption block mechanism 24 is connected to
a vacuum pump (not shown). When the vacuum pump is operated, the
adsorption block mechanism 24 adsorbs and holds the substrate 2.
The substrate 2 is held up by the adsorption block mechanism 24 to
an upper level as compared to the conveyor belt 23. At this time,
the substrate 2 is fixed in position by a substrate fixation
portion (not shown) and is pressed by the adsorption block
mechanism 24, with the result that the flexure or deflection of the
substrate 2 may be corrected.
[0131] The camera portion 4 is moved above the substrate 2 held by
the adsorption block mechanism 24 and recognizes an alignment mark
of the substrate 2 (Step 102). The positional information of the
alignment mark is transmitted to the controller 133, and the stage
movement mechanism 22 corrects the position of the stage mechanism
21 based on the positional information. When the position of the
stage mechanism 21 is corrected, the air cylinder 26 of the stage
movement mechanism 22 is caused to operate, thereby moving the
stage mechanism 21 upward.
[0132] The stoppers 27 of the stage movement mechanism 22 are
brought into contact with the stage mechanism 21, and the stage
mechanism 21 is stopped at the position where the substrate 2 is in
contact with the lower surface of the screen 1 (Step 103).
[0133] In this embodiment, the stage mechanism 21 is moved so that
the substrate 2 is in contact with the lower surface of the screen
1. However, the stage mechanism 21 may be moved so that the
substrate 2 is disposed to be apart from the screen 1. In this
case, for example, by providing a needle nozzle or the like on the
lower surface of the screen 1, the solder can be supplied onto the
substrate on which parts are mounted through the needle nozzle.
[0134] The controller 133 drives the air cylinders 173 and 174, to
move one of the squeegees 171 and 172 upward and bring the other
one into contact with the screen 1. Subsequently, the fluid supply
apparatus 100 and the squeegee mechanism 170, the drives of which
are controlled by the controller 133, are integrally moved. As a
result, the solder is applied to the screen 1, and a predetermined
solder pattern is printed on the substrate 2 (Step 104).
[0135] At a time when the squeegee mechanism 170 is moved from the
right side to the left side in FIG. 2, the squeegee 172 is moved
upward, and the squeegee 171 is brought into contact with the
screen 1. Then, the solder is applied with the squeegee 171. At a
time when the squeegee mechanism 170 is moved from the left side to
the right side in FIG. 2, the squeegee 171 is moved upward, and the
squeegee 172 is moved downward and brought into contact with the
screen 1. The solder is applied with the squeegee 172.
[0136] FIG. 17 is a top view schematically showing the motion of
the solder when the solder is applied with the squeegee 171. When
the squeegee 171 is moved in the direction indicated by the
broken-line arrow of FIG. 17, in the state of being subjected to
the rolling in the same direction, the solder is moved on the
screen 1 with the main squeegee 171a. At this time, the solder may
get outside of the both ends 178a of the main squeegee 171a (in the
direction indicated by the solid-line arrow of FIG. 17). However,
the pair of sub-squeegees 171b is provided to the both ends 178a of
the main squeegee 171a.
[0137] The sub-squeegees 171b collect the solder that has got
outside of the both ends 178a toward the center of the back surface
side of the main squeegee 171a. The solder collected is applied on
the screen 1 with the squeegee 172 opposite to the squeegee 171
when the movement direction of the squeegee mechanism 170 is
reversed, for example. With this structure, the solder that has got
outside of the main squeegee 171a can be effectively reused, which
can reduce the waste of the solder.
[0138] Further, in this embodiment, the fluid supply apparatus 100
can be miniaturized. Therefore, as described above, it is possible
to easily realize the movement mechanism that causes the fluid
supply apparatus 100 and the squeegee mechanism 170 to be
integrally moved.
[0139] The integral movement of the fluid supply apparatus 100 and
the squeegee mechanism 170 can cause the solder to be effectively
supplied at the time of applying the solder. In addition, the
solder can be supplied between the squeegees 171 and 172, and thus
can be effectively applied without setting the stroke of the
squeegee mechanism 170 to be large.
[0140] In the fluid applying apparatus 150 according to this
embodiment, the temperature of the room in which the fluid applying
apparatus 150 is provided is adjusted by the temperature adjustment
unit 134 (Step 105). As shown in FIG. 14, the solder temperature
detection sensor 136 measures the temperature of the surface of the
solder, and transmits the temperature information to the controller
133. When the controller 133 judges that the room temperature is
high based on the temperature information received, the controller
133 outputs an air-cooling command to the temperature adjustor 135,
thereby lowering the room temperature (Step 106). When it is judged
that the room temperature is normal, the room temperature is not
adjusted. In this way, the temperature of the surface of the solder
is monitored, to adjust the room temperature depending on the
temperature of the surface of the solder, which is raised due to
the rolling. As a result, more precise control on the temperature
of the solder can be carried out.
[0141] In addition, at the time when the solder is printed, the
rolling diameter detection sensor 137 measures the rolling diameter
(Step 107). When the rolling diameter measured is lower than a
preset standard, the information is transmitted to the controller
133 as the rolling diameter information. Thus, the rolling diameter
of the solder at the time when the solder is printed is monitored.
During the applying of the solder, the rolling diameter detection
sensor 137 may measure the rolling diameter of the solder at all
times or at a predetermined timing.
[0142] Upon completion of the printing of the solder on the
substrate 2, first, the stage movement mechanism 22 moves the stage
mechanism 21 downward, and the substrate 2 is placed on the
conveyor belt 23 of the stage mechanism 21.
[0143] The substrate 2 is moved with the conveyor belt 23, and the
stage mechanism 21 is moved toward a substrate discharging portion
32 provided on the cleaning portion 5 side shown in FIG. 2 with the
stage movement mechanism 22.
[0144] The substrate 2 is moved from the conveyor belt 23 to the
substrate discharging portion 32, and the substrate discharging
portion 32 discharges the substrate 2 to the outside of the fluid
applying apparatus 150 (Step 108).
[0145] In this embodiment, at the time when the substrate 2 is
discharged in Step 108, the solder is supplied based on the rolling
diameter information transmitted to the controller 133 (Step 109).
As shown in FIG. 14, the controller 133 that has received the
rolling diameter information judges that the amount of the solder
on the screen 1 is insufficient, and issues a solder supply command
to the motor 122, to cause the solder to be supplied (Step 110). In
the case where the rolling diameter information is not transmitted
from the rolling diameter detection sensor 137, it is judged that
the necessary amount of the solder is supplied on the screen 1, and
the solder is not additionally supplied.
[0146] As described above, the rolling diameter of the solder is
monitored, and the necessary amount of the solder is supplied on
the screen 1, thereby keeping the rolling diameter of the solder
constant. As a result, the amount of the solder filled in a pattern
hole in the screen 1 is stabilized, improving the printing quality
of the solder. Further, in this embodiment, since the solder is
supplied not when the solder is being printed on the substrate 2
but when the substrate is discharged, the operation time can be
saved.
[0147] As shown in FIG. 15, when the amount of the solder on the
screen 1 is judged to be insufficient, and the solder is supplied,
the motor 122 detects the amount of the solder in the container
(Step 111). Since the amount of the solder in the container is
determined in accordance with the amount of insertion of the piston
106 into the container, the amount of the insertion of the piston
106 is detected as the solder amount information. The amount of the
insertion of the piston 106 is detected using the motor 122 such as
a servomotor, on the basis of information of an encoder value or a
pulse number of the motor 122. Based on the solder amount
information, the motor 122 transmits a container exchange signal to
the controller 133 as shown in FIG. 14.
[0148] In Step 112, in the case where the controller 133 receives
the container exchange signal and judges that the amount of the
solder in the container is insufficient, the fact is notified by
using a buzzer, a display, or the like. As a result, after the
substrate 2 is conveyed, the container is manually exchanged (Step
113). In the case where the container exchange signal is not
transmitted from the motor 122, it is judged that the sufficient
amount of the solder remains in the container, and thus the
notification using the buzzer, the display, or the like is not
performed.
[0149] It should be noted that the processes of Steps 101 to 109
are performed on the program for operating the fluid applying
apparatus 150, and after the rolling diameter is judged to be
insufficient in Step 109, the fluid supply apparatus 100 supplies
the solder for the first time.
[0150] In this embodiment, the supply of the solder is
automatically performed by the drive mechanism 103, and the
exchange of the container is manually performed. Therefore, the
fluid applying apparatus 150 is stopped mainly when the container
is exchanged, and is not stopped when the solder is supplied. Thus,
the operation time of the fluid applying apparatus 150 is saved. In
addition, the inside of the fluid applying apparatus 150 is exposed
to the outside mainly only when the container is exchanged, so it
is possible to suppress foreign matters from adhering to the screen
1 or the substrate 2.
[0151] In this embodiment, the solder is used as the fluid.
[0152] Alternatively, flux, ACP (anisotropic conductive paste), NCP
(non-conductive paste), or conductive paste made of copper or the
like may be used as the fluid.
MODIFIED EXAMPLE
[0153] The present invention is not limited to the above
embodiment, and can be variously changed without departing from the
gist of the present invention.
[0154] For example, FIG. 18 is a perspective view showing a
modified example of the drive mechanism 103 of the fluid applying
apparatus 150. In the drive mechanism 103, the rotary drive pulley
125 and the driving pulley 123 provided to the rotary shaft of the
motor are connected with each other through the belt 124. The
rotary drive pulley 125 is constituted of a first pulley 125a and a
second pulley 125b. The first pulley 125a and the driving pulley
123 are connected with each other through the belt 124. With this
structure, the driving pulley 123 and the rotary drive pulley 125
are rotated in conjunction with each other.
[0155] The first pulley 125a and the second pulley 125b share a
rotary shaft 127, and the rotary shaft 127 is connected to the
container support portion 104. The cogs of the second pulley 125b
and the cogs of the vertical drive pulley 126 are engaged with each
other, so the rotary drive pulley 125 and the vertical drive pulley
126 are rotated in conjunction with each other. The vertical drive
pulley 126 is rotated about the lead screw 129 as the rotation
shaft.
[0156] The structures of the pulleys 123, 125, and 126 may be
arbitrarily set, as long as the pulleys 123, 125, and 126 are
rotated by the motor in conjunction with one another as described
above. Further, the numbers of pulleys and motors used as the drive
mechanism 103 are not limited. In this embodiment, only one motor
rotates the pulleys 123, 125, and 126, which is advantageous for
the miniaturization of the drive mechanism 103.
[0157] Alternatively, as the drive mechanism 103, a plurality of
gears may be used instead of the belt drive as described above.
[0158] In the above embodiment, the container support portion and
the container are rotated. Alternatively, the container support
portion may be fixed to the support block so as not to rotate, and
the piston supported by the piston support portion may be rotated.
With the use of the fluid supply apparatus having such a structure,
the same effect as the above embodiment can also be obtained.
[0159] In addition, a discharge sensor that detects the discharge
of the solder from the container may be provided to the fluid
supply apparatus and the squeegee mechanism. For example, a laser
emitting portion is provided to the squeegee 171 shown in FIG. 4,
and a laser entering portion is provided to the squeegee 172. Then,
the laser light irradiation is performed between the squeegees 171
and 172, thereby detecting the discharge of the solder.
[0160] In a container commercially available, air may be contained,
for example. In the case where the container is mounted on a fluid
supply apparatus for the first time, even if the motor is rotated,
air is just discharged, which may prevent the solder from being
discharged. In view of this, when the container is mounted for the
first time, the motor is rotated at a predetermined position on the
screen, and the discharge sensor confirms the discharge of the
solder. Accordingly, when the fluid supply apparatus is operated,
the solder is reliably supplied.
[0161] As a modified example of the fluid applying apparatus 150
described above, the structure including a squeegee block may be
used. By the fluid supply apparatus 100, the solder is supplied to
the squeegee block.
[0162] The present application contains subject matter related to
that disclosed in Japanese Priority Patent Application JP
2009-176216 filed in the Japan Patent Office on Jul. 29, 2009, the
entire content of which is hereby incorporated by reference.
* * * * *