U.S. patent application number 11/648745 was filed with the patent office on 2011-01-27 for multi-path transceiver layout within a device.
This patent application is currently assigned to BROADCOM CORPORATION. Invention is credited to Ahmadreza (Reza) Rofougaran.
Application Number | 20110021138 11/648745 |
Document ID | / |
Family ID | 43497752 |
Filed Date | 2011-01-27 |
United States Patent
Application |
20110021138 |
Kind Code |
A1 |
Rofougaran; Ahmadreza
(Reza) |
January 27, 2011 |
MULTI-PATH TRANSCEIVER LAYOUT WITHIN A DEVICE
Abstract
A radio transceiver device includes circuitry for radiating
electromagnetic signals at a very high radio frequency both through
space, as well as through wave guides that are formed within a
substrate material. In one embodiment, the substrate comprises a
dielectric substrate formed within a board, for example, a printed
circuit board. In another embodiment of the invention, the wave
guide is formed within a die of an integrated circuit radio
transceiver. A plurality of transceivers with different
functionality is defined. Substrate transceivers are operable to
transmit through the wave guides, while local transceivers are
operable to produce very short range wireless transmissions through
space. A third and final transceiver is a typical wireless
transceiver for communication with remote (non-local to the device)
transceivers.
Inventors: |
Rofougaran; Ahmadreza (Reza);
(Newport Coast, CA) |
Correspondence
Address: |
GARLICK HARRISON & MARKISON
P.O. BOX 160727
AUSTIN
TX
78716-0727
US
|
Assignee: |
BROADCOM CORPORATION
Irvine
CA
|
Family ID: |
43497752 |
Appl. No.: |
11/648745 |
Filed: |
December 30, 2006 |
Current U.S.
Class: |
455/39 ;
455/90.3 |
Current CPC
Class: |
H04B 1/40 20130101 |
Class at
Publication: |
455/39 ;
455/90.3 |
International
Class: |
H04B 1/38 20060101
H04B001/38; H04B 7/24 20060101 H04B007/24 |
Claims
1. A radio transceiver integrated circuit die, comprising: first
and second local transceivers formed upon the integrated circuit
die supporting radio frequency communications with other local
transceivers disposed within a device; and wherein the second local
transceiver is operationally disposed within a specified location
based upon expected multi-path peaks and nulls for transmissions
from the first local transceiver.
2. The integrated circuit die of claim 1 wherein the second local
transceiver is operationally disposed within a specified region
characterized by an expected multi-path peak to support
communications between the first and second local transceivers.
3. The integrated circuit die of claim 2 wherein the first local
transceiver transmits RF signals to the second local transceiver at
a power level that is based upon expected signal strength gains
from the multi-path peak.
4. The integrated circuit die of claim 1 further including a third
local transceiver wherein antennas of each of the first, second and
third local transceivers are each operationally disposed to be in
expected electromagnetic peak in relation to each of the other of
the first, second and third local transceivers.
5. The integrated circuit die of claim 1 further including a third
local transceiver wherein antennas of the first, second and third
local transceivers are each operationally disposed so that the
second antenna is in an expected electromagnetic peak in relation
to antennas of the first and third local transceivers.
6. The integrated circuit die of claim 5 wherein the antenna of the
third local transceiver is operationally disposed to be in an
expected electromagnetic null in relation to the antenna of the
first local transceiver.
7. The integrated circuit die of claim 1 further including a third
local transceiver wherein the second local transceiver is
operationally disposed within a specified region characterized by
an expected multi-path null to support communications between the
second local transceiver and the third local transceiver.
8. The integrated circuit die of claim 7 further including a first
wave guide formed within the integrated circuit die wherein the
first, second and third local transceivers are communicatively
coupled to corresponding antennas operationally disposed to radiate
and receive RF signals transmitted through the first wave
guide.
9. The integrated circuit die of claim 7 further including a second
wave guide to support specified communications.
10. The integrated circuit die of claim 9 wherein the second wave
guide is at least partially formed within the first wave guide of
the integrated circuit die.
11. The integrated circuit die of claim 7 further including a first
intra-device local transceiver operable to generate a wireless RF
transmission at a power level sufficient to reach a second
intra-device local transceiver.
12. The integrated circuit die of claim 11 wherein the second
intra-device local transceiver is formed within the radio
transceiver integrated circuit die.
13. The integrated circuit die of claim 11 wherein the second
intra-device local transceiver is communicatively coupled to one of
the first and second local transceivers.
14. The integrated circuit die of claim 11 wherein the second
intra-device local transceiver is formed within a separate radio
transceiver integrated circuit die operably housed within a device
that houses the first ratio transceiver integrated circuit die.
15. The integrated circuit die of claim 14 wherein the device is a
multi-chip module.
16. A method within an integrated circuit, comprising: generating
radio frequency signals for a first specified local transceiver
disposed within an expected electromagnetic peak of the generated
radio frequency signals; and transmitting the radio frequency
signals from an antenna operationally disposed to communicate
through a wave guide formed within the integrated circuit.
17. The method of claim 16 further including generating wireless
transmissions to a second local transceiver.
18. The method of claim 17 wherein the second local transceiver is
operably disposed within the integrated circuit in a region that is
an expected null for transmissions through the wave guide.
19. The method of claim 16 further including transmitting
communication signals to a second local transceiver through at
least one trace.
20. An integrated circuit die, comprising: at least one
electromagnetic wave guide; a plurality of local transceivers
operationally disposed in defined electromagnetic peaks and nulls
in relation to each other for transmissions through at the least
one wave guide; at least one of an intra-device local transceiver
for local wireless communications and a remote transceiver for
remote wireless communications with remote transceivers
operationally disposed in a device remote to a device housing the
integrated circuit die.
21. The integrated circuit die of claim 20 wherein the intra-device
local transceiver is operable to wirelessly communicate with other
local transceivers operably disposed within different die but
within a same device.
22. The integrated circuit die of claim 21 wherein the other local
transceivers are operably disposed within regions of expected
electromagnetic peaks for signals transmitted by the intra-device
local transceiver.
23. The integrated circuit die for claim 22 wherein the integrated
circuit die is operably disposed in a multi-chip module that houses
different other local transceivers operably disposed within
different die.
Description
BACKGROUND
[0001] 1. Technical Field
[0002] The present invention relates to wireless communications
and, more particularly, to circuitry for wireless
communications.
[0003] 2. Related Art
[0004] Communication systems are known to support wireless and wire
lined communications between wireless and/or wire lined
communication devices. Such communication systems range from
national and/or international cellular telephone systems to the
Internet to point-to-point in-home wireless networks. Each type of
communication system is constructed, and hence operates, in
accordance with one or more communication standards. For instance,
wireless communication systems may operate in accordance with one
or more standards, including, but not limited to, IEEE 802.11,
Bluetooth, advanced mobile phone services (AMPS), digital AMPS,
global system for mobile communications (GSM), code division
multiple access (CDMA), local multi-point distribution systems
(LMDS), multi-channel-multi-point distribution systems (MMDS),
and/or variations thereof.
[0005] Depending on the type of wireless communication system, a
wireless communication device, such as a cellular telephone,
two-way radio, personal digital assistant (PDA), personal computer
(PC), laptop computer, home entertainment equipment, etc.,
communicates directly or indirectly with other wireless
communication devices. For direct communications (also known as
point-to-point communications), the participating wireless
communication devices tune their receivers and transmitters to the
same channel or channels (e.g., one of a plurality of radio
frequency (RF) carriers of the wireless communication system) and
communicate over that channel(s). For indirect wireless
communications, each wireless communication device communicates
directly with an associated base station (e.g., for cellular
services) and/or an associated access point (e.g., for an in-home
or in-building wireless network) via an assigned channel. To
complete a communication connection between the wireless
communication devices, the associated base stations and/or
associated access points communicate with each other directly, via
a system controller, via a public switch telephone network (PSTN),
via the Internet, and/or via some other wide area network.
[0006] Each wireless communication device includes a built-in radio
transceiver (i.e., receiver and transmitter) or is coupled to an
associated radio transceiver (e.g., a station for in-home and/or
in-building wireless communication networks. RF modem, etc.). As is
known, the transmitter includes a data modulation stage, one or
more intermediate frequency stages, and a power amplifier stage.
The data modulation stage converts raw data into baseband signals
in accordance with the particular wireless communication standard.
The one or more intermediate frequency stages mix the baseband
signals with one or more local oscillations to produce RF signals.
The power amplifier stage amplifies the RF signals prior to
transmission via an antenna.
[0007] Typically, the data modulation stage is implemented on a
baseband processor chip, while the intermediate frequency (IF)
stages and power amplifier stage are implemented on a separate
radio processor chip. Historically, radio integrated circuits have
been designed using bi-polar circuitry, allowing for large signal
swings and linear transmitter component behavior. Therefore, many
legacy baseband processors employ analog interfaces that
communicate analog signals to and from the radio processor.
[0008] As integrated circuit die decrease in size while the number
of circuit components increases, chip layout becomes increasingly
difficult and challenging. Amongst other known problems, there is
increasingly greater demand for output pins to a die even though
the die size is decreasing. Similarly, within the die itself, the
challenge of developing internal buses and traces to support high
data rate communications becomes very challenging. A need exists,
therefore, for solutions that support the high data rate
communications and reduce the need for pin-outs and for circuit
traces within the bare die. Moreover, advancements in communication
between ICs collocated within a common device or upon a common
printed circuit board is needed to adequately support the
forth-coming improvements in IC fabrication. Therefore, a need
exists for an integrated circuit antenna structure and wireless
communication applications thereof.
SUMMARY OF THE INVENTION
[0009] The present invention is directed to apparatus and methods
of operation that are further described in the following Brief
Description of the Drawings, the Detailed Description of the
Invention, and the claims. Other features and advantages of the
present invention will become apparent from the following detailed
description of the invention made with reference to the
accompanying drawings.
BRIEF DESCRIPTION OF THE DRAWINGS
[0010] A better understanding of the present invention can be
obtained when the following detailed description of the preferred
embodiment is considered with the following drawings, in which:
[0011] FIG. 1 is a schematic block diagram illustrating a wireless
communication device that includes a host device and an associated
radio;
[0012] FIG. 2 is a schematic block diagram illustrating a wireless
communication device that includes a host device and an associated
radio;
[0013] FIG. 3 is a functional block diagram of a substrate
configured according to one embodiment of the invention;
[0014] FIG. 4 is a functional block diagram of an alternate
embodiment of a substrate that includes a plurality of embedded
substrate transceivers;
[0015] FIG. 5 is a functional block diagram of a substrate that
includes a plurality of embedded substrate transceivers surrounded
by integrated circuit modules and circuitry according to one
embodiment of the present invention;
[0016] FIG. 6 is a functional block diagram of a substrate that
includes a plurality of transceivers operably disposed to
communicate through wave guides formed within the substrate
according to one embodiment of the present invention;
[0017] FIG. 7 is a flow chart of a method according to one
embodiment of the present invention;
[0018] FIG. 8 is a functional block diagram of a substrate
illustrating three levels of transceivers according to one
embodiment of the present invention;
[0019] FIG. 9 is a functional block diagram of a multi-chip module
formed according to one embodiment of the present invention;
[0020] FIG. 10 is a flow chart of a method for communicating
according to one embodiment of the present invention;
[0021] FIG. 11 is a diagram that illustrates transceiver placement
within a substrate according to one embodiment of the present
invention;
[0022] FIG. 12 is an illustration of an alternate embodiment of a
substrate;
[0023] FIG. 13 is a flow chart that illustrates a method according
to one embodiment of the present invention;
[0024] FIG. 14 is a functional block diagram of an integrated
circuit multi-chip device and associated communications according
to one embodiment of the present invention;
[0025] FIG. 15 is a functional block diagram that illustrates
operation of one embodiment of the present invention utilizing
frequency division multiple access;
[0026] FIG. 16 is a table illustrating an example of assignment
static or permanent assignment of carrier frequencies to specified
communications between intra-device local transceivers, substrate
transceivers, and other transceivers within a specified device;
[0027] FIG. 17 is a functional block diagram of a device housing a
plurality of transceivers and operating according to one embodiment
of the present invention;
[0028] FIG. 18 is a flow chart that illustrates a method for
wireless transmissions in an integrated circuit utilizing frequency
division multiple access according to one embodiment of the
invention;
[0029] FIG. 19 is a functional block diagram that illustrates an
apparatus and corresponding method of wireless communications
within the apparatus for operably avoiding collisions and
interference utilizing a collision avoidance scheme to coordinate
communications according to one embodiment of the invention;
[0030] FIG. 20 is a functional block diagram of a substrate
supporting a plurality of local transceivers operable according to
one embodiment of the invention;
[0031] FIG. 21 illustrates a method for wireless local
transmissions in a device according to one embodiment of the
invention;
[0032] FIG. 22 is a functional block diagram a device that includes
a mesh network formed within a board or integrated circuit
according to one embodiment of the invention;
[0033] FIG. 23 is a flow chart illustrating a method according to
one embodiment of the invention for routing and forwarding
communications amongst local transceivers operating as nodes of a
mesh network all within a single device;
[0034] FIG. 24 illustrates a method for communications within a
device according to one embodiment of the invention in which
communications are transmitted through a mesh network within a
single device;
[0035] FIG. 25 is a functional block diagram of a network operating
according to one embodiment of the present invention; and
[0036] FIG. 26 is a flow chart illustrating a method according to
one embodiment of the invention.
DETAILED DESCRIPTION OF THE DRAWINGS
[0037] FIG. 1 is a functional block diagram illustrating a
communication system that includes circuit devices and network
elements and operation thereof according to one embodiment of the
invention. More specifically, a plurality of network service areas
04, 06 and 08 are a part of a network 10. Network 10 includes a
plurality of base stations or access points (APs) 12-16, a
plurality of wireless communication devices 18-32 and a network
hardware component 34. The wireless communication devices 18-32 may
be laptop computers 18 and 26, personal digital assistants 20 and
30, personal computers 24 and 32 and/or cellular telephones 22 and
28. The details of the wireless communication devices will be
described in greater detail with reference to FIGS. 2-10.
[0038] The base stations or APs 12-16 are operably coupled to the
network hardware component 34 via local area network (LAN)
connections 36, 38 and 40. The network hardware component 34, which
may be a router, switch, bridge, modem, system controller, etc.,
provides a wide area network (WAN) connection 42 for the
communication system 10 to an external network element such as WAN
44. Each of the base stations or access points 12-16 has an
associated antenna or antenna array to communicate with the
wireless communication devices in its area. Typically, the wireless
communication devices 18-32 register with the particular base
station or access points 12-16 to receive services from the
communication system 10. For direct connections (i.e.,
point-to-point communications), wireless communication devices
communicate directly via an allocated channel.
[0039] Typically, base stations are used for cellular telephone
systems and like-type systems, while access points are used for
in-home or in-building wireless networks. Regardless of the
particular type of communication system, each wireless
communication device includes a built-in radio and/or is coupled to
a radio. For purposes of the present specification, each wireless
communication device of FIG. 1 including host devices 18-32, and
base stations or APs 12-16, includes at least one associated radio
transceiver for wireless communications with at least one other
remote transceiver of a wireless communication device as
exemplified in FIG. 1. More generally, a reference to a remote
communication or a remote transceiver refers to a communication or
transceiver that is external to a specified device or transceiver.
As such, each device and communication made in reference to Figure
one is a remote device or communication. The embodiments of the
invention include devices that have a plurality of transceivers
operable to communicate with each other. Such transceivers and
communications are referenced here in this specification as local
transceivers and communications.
[0040] FIG. 2 is a schematic block diagram illustrating a wireless
communication device that includes the host device 18-32 and an
associated radio 60. For cellular telephone hosts, the radio 60 is
a built-in component. For personal digital assistants hosts, laptop
hosts, and/or personal computer hosts, the radio 60 may be built-in
or an externally coupled component.
[0041] As illustrated, the host device 18-32 includes a processing
module 50, memory 52, radio interface 54, input interface 58 and
output interface 56. The processing module 50 and memory 52 execute
the corresponding instructions that are typically done by the host
device. For example, for a cellular telephone host device, the
processing module 50 performs the corresponding communication
functions in accordance with a particular cellular telephone
standard.
[0042] The radio interface 54 allows data to be received from and
sent to the radio 60. For data received from the radio 60 (e.g.,
inbound data), the radio interface 54 provides the data to the
processing module 50 for further processing and/or routing to the
output interface 56. The output interface 56 provides connectivity
to an output display device such as a display, monitor, speakers,
etc., such that the received data may be displayed. The radio
interface 54 also provides data from the processing module 50 to
the radio 60. The processing module 50 may receive the outbound
data from an input device such as a keyboard, keypad, microphone,
etc., via the input interface 58 or generate the data itself. For
data received via the input interface 58, the processing module 50
may perform a corresponding host function on the data and/or route
it to the radio 60 via the radio interface 54.
[0043] Radio 60 includes a host interface 62, a baseband processing
module 100, memory 65, a plurality of radio frequency (RF)
transmitters 106-110, a transmit/receive (T/R) module 114, a
plurality of antennas 81-85, a plurality of RF receivers 118-120,
and a local oscillation module 74. The baseband processing module
100, in combination with operational instructions stored in memory
65, executes digital receiver functions and digital transmitter
functions, respectively. The digital receiver functions include,
but are not limited to, digital intermediate frequency to baseband
conversion, demodulation, constellation demapping, decoding,
de-interleaving, fast Fourier transform, cyclic prefix removal,
space and time decoding, and/or descrambling. The digital
transmitter functions include, but are not limited to, scrambling,
encoding, interleaving, constellation mapping, modulation, inverse
fast Fourier transform, cyclic prefix addition, space and time
encoding, and digital baseband to IF conversion. The baseband
processing module 100 may be implemented using one or more
processing devices. Such a processing device may be a
microprocessor, micro-controller, digital signal processor,
microcomputer, central processing unit, field programmable gate
array, programmable logic device, state machine, logic circuitry,
analog circuitry, digital circuitry, and/or any device that
manipulates signals (analog and/or digital) based on operational
instructions. The memory 65 may be a single memory device or a
plurality of memory devices. Such a memory device may be a
read-only memory, random access memory, volatile memory,
non-volatile memory, static memory, dynamic memory, flash memory,
and/or any device that stores digital information. Note that when
the baseband processing module 100 implements one or more of its
functions via a state machine, analog circuitry, digital circuitry,
and/or logic circuitry, the memory storing the corresponding
operational instructions is embedded with the circuitry comprising
the state machine, analog circuitry, digital circuitry, and/or
logic circuitry.
[0044] In operation, the radio 60 receives outbound data 94 from
the host device via the host interface 62. The baseband processing
module 100 receives the outbound data 94 and, based on a mode
selection signal 102, produces one or more outbound symbol streams
104. The mode selection signal 102 will indicate a particular mode
of operation that is compliant with one or more specific modes of
the various IEEE 802.11 standards. For example, the mode selection
signal 102 may indicate a frequency band of 2.4 GHz, a channel
bandwidth of 20 or 22 MHz and a maximum bit rate of 54
megabits-per-second. In this general category, the mode selection
signal will further indicate a particular rate ranging from 1
megabit-per-second to 54 megabits-per-second. In addition, the mode
selection signal will indicate a particular type of modulation,
which includes, but is not limited to, Barker Code Modulation,
BPSK, QPSK, CCK, 16 QAM and/or 64 QAM. The mode selection signal
102 may also include a code rate, a number of coded bits per
subcarrier (NBPSC), coded bits per OFDM symbol (NCBPS), and/or data
bits per OFDM symbol (NDBPS). The mode selection signal 102 may
also indicate a particular channelization for the corresponding
mode that provides a channel number and corresponding center
frequency. The mode selection signal 102 may further indicate a
power spectral density mask value and a number of antennas to be
initially used for a MIMO communication.
[0045] The baseband processing module 100, based on the mode
selection signal 102 produces one or more outbound symbol streams
104 from the outbound data 94. For example, if the mode selection
signal 102 indicates that a single transmit antenna is being
utilized for the particular mode that has been selected, the
baseband processing module 100 will produce a single outbound
symbol stream 104. Alternatively, if the mode selection signal 102
indicates 2, 3 or 4 antennas, the baseband processing module 100
will produce 2, 3 or 4 outbound symbol streams 104 from the
outbound data 94.
[0046] Depending on the number of outbound symbol streams 104
produced by the baseband processing module 100, a corresponding
number of the RF transmitters 106-110 will be enabled to convert
the outbound symbol streams 104 into outbound RF signals 112. In
general, each of the RF transmitters 106-110 includes a digital
filter and upsampling module, a digital-to-analog conversion
module, an analog filter module, a frequency up conversion module,
a power amplifier, and a radio frequency bandpass filter. The RF
transmitters 106-110 provide the outbound RF signals 112 to the
transmit/receive module 114, which provides each outbound RF signal
to a corresponding antenna 81-85.
[0047] When the radio 60 is in the receive mode, the
transmit/receive module 114 receives one or more inbound RF signals
116 via the antennas 81-85 and provides them to one or more RF
receivers 118-122. The RF receiver 118-122 converts the inbound RF
signals 116 into a corresponding number of inbound symbol streams
124. The number of inbound symbol streams 124 will correspond to
the particular mode in which the data was received. The baseband
processing module 100 converts the inbound symbol streams 124 into
inbound data 92, which is provided to the host device 18-32 via the
host interface 62.
[0048] As one of average skill in the art will appreciate, the
wireless communication device of FIG. 2 may be implemented using
one or more integrated circuits. For example, the host device may
be implemented on a first integrated circuit, the baseband
processing module 100 and memory 65 may be implemented on a second
integrated circuit, and the remaining components of the radio 60,
less the antennas 81-85, may be implemented on a third integrated
circuit. As an alternate example, the radio 60 may be implemented
on a single integrated circuit. As yet another example, the
processing module 50 of the host device and the baseband processing
module 100 may be a common processing device implemented on a
single integrated circuit. Further, the memory 52 and memory 65 may
be implemented on a single integrated circuit and/or on the same
integrated circuit as the common processing modules of processing
module 50 and the baseband processing module 100.
[0049] FIG. 2 generally illustrates a MIMO transceiver and is
useful to understanding the fundamental blocks of a common
transceiver. It should be understood that any connection shown in
FIG. 2 may be implemented as a physical trace or as a wireless
communication link. Such wireless communication links are supported
by local transceivers (not shown in FIG. 2) that are operable to
transmit through space or through an electromagnetic wave guide
formed within a substrate of a printed circuit board housing the
various die that comprise the MIMO transceiver or within a
substrate of a die (e.g., a dielectric substrate). Illustrations of
circuitry and substrate structures to support such operations are
described in greater detail in the Figures that follow.
[0050] It is generally known that an inverse relationship exists
between frequency and signal wavelength. Because antennas for
radiating radio frequency signals are a function of a signal
wavelength, increasing frequencies result in decreasing wavelengths
which therefore result in decreasing antenna lengths to support
such communications. In future generations of radio frequency
transceivers, the carrier frequency will exceed or be equal to at
least 10 GHz, thereby requiring a relatively small monopole antenna
or dipole antenna. A monopole antenna will typically be equal to a
size that is equal to a one-half wavelength, while a dipole antenna
will be equal to a one-quarter wavelength in size. At 60 GHz, for
example, a full wavelength is 5 millimeters, thus a monopole
antenna size will be approximately equal to 2.5 millimeters and
dipole antenna size will be approximately equal to 1.25
millimeters. With such a small size, the antenna may be implemented
on the printed circuit board of the package and/or on the die
itself. As such, the embodiments of the invention include utilizing
such high frequency RF signals to allow the incorporation of such
small antenna either on a die or on a printed circuit board.
[0051] Printed circuit boards and die often have different layers.
With respect to printed circuit boards, the different layers have
different thickness and different metallization. Within the layers,
dielectric areas may be created for use as electromagnetic wave
guides for high frequency RF signals. Use of such wave guides
provides an added benefit that the signal is isolated from outside
of the printed circuit board. Further, transmission power
requirements are reduced since the radio frequency signals are
conducted through the dielectric in the wave guide and not through
air. Thus, the embodiments of the present invention include very
high frequency RF circuitry, for example, 60 GHz RF circuitry,
which are mounted either on the printed circuit board or on the die
to facilitate corresponding communications.
[0052] FIG. 3 is a functional block diagram of a substrate
configured according to one embodiment of the invention that
includes a dielectric substrate operable as an electromagnetic wave
guide according to one embodiment of the present invention.
Referring to FIG. 3, it may be seen that a substrate 150 includes a
transceiver 154 that is operably disposed to communicate with a
transceiver 158. References herein to substrates generally refer to
any supporting substrate and specifically include printed circuit
boards and other boards that support integrated circuits and other
circuitry. References to substrate also include semiconductor
substrates that are part of integrated circuits and die that
support circuit elements and blocks. Thus, unless specifically
limited herein this specification to a particular application, the
term substrate should be understood to include all such
applications with their varying circuit blocks and elements. Thus,
with reference to substrate 150 of FIG. 3, the substrate 150 may be
a printed circuit board wherein the transceivers may be separate
integrated circuits or die operably disposed thereon.
Alternatively, substrate 150 may be a integrated circuit wherein
the transceivers are transceiver modules that are a part of the
integrated circuit die circuitry.
[0053] In the described embodiment of the invention, transceiver
154 is communicatively coupled to antenna 166, while transceiver
158 is communicatively coupled to antenna 170. The first and second
substrate antennas 166 and 170, respectively, are operably disposed
to transmit and receive radio frequency communication signals
through the substrate region 162 which, in the described
embodiment, is a dielectric substrate region. As may be seen,
antenna 166 is operably disposed upon a top surface of dielectric
substrate 162, while antenna 170 is operably disposed to penetrate
into dielectric substrate 162. Each of these antenna configurations
exemplifies different embodiments for substrate antennas that are
for radiating and receiving radio frequency signals transmitted
through dielectric substrate 162. As may further be seen from
examining FIG. 3, an optional metal layer 174 may be disposed upon
either or both of a top surface and a bottom surface of dielectric
substrate 162. Metal layers 174 are operable to further isolate and
shield the electromagnetic waves transmitted through dielectric
substrate 162 as high frequency RF. The use of such metal layers
174 is especially applicable to embodiments of the invention in
which the substrate comprises a printed circuit board but can
include any structure having a deposited metal layer thereon.
[0054] In operation, transceiver 154 is a very high frequency
transceiver that generates electromagnetic signals having a
frequency that is greater than or equal to 10 GHz. In one specific
embodiment of the invention, the electromagnetic signals are
characterized by a 60 GHz (+/-5 GHz) radio frequency. One
corresponding factor to using such high frequency electromagnetic
signals is that short antenna lengths may be utilized that are
sized small enough to be placed on or within a substrate whether
that substrate is a printed circuit board or a bare die. Thus,
transceiver 154 is operable to radiate through dielectric substrate
162 through antenna 166 for reception by antenna 170 for substrate
transceiver 158. These transceivers are specifically named
substrate transceivers herein to refer to transceivers that have
been designed to communicate through a dielectric substrate, such
as that shown in FIG. 3.
[0055] It should be noted that dielectric substrate 162 is defined
by a bound volume, regardless of whether metal layers 174 are
included, and is the equivalent of an electromagnetic wave guide
and shall be referenced herein as such. In general terms, it is
expected that dielectric substrate 162 will have a reasonably
uniform fabrication to reduce interference within the dielectric
substrate 162. For example, metal components, or other components
within the dielectric substrate, will tend to create multi-path
interference and/or absorb the electromagnetic signals thereby
reducing the effectiveness of the transmission. With a reasonably
uniform or consistent dielectric substrate, however, low power
signal transmissions may be utilized for such short range
communications.
[0056] FIG. 4 is a functional block diagram of an alternate
embodiment of a substrate that includes a plurality of embedded
substrate transceivers. As may be seen, a substrate 180 includes a
dielectric substrate region 184 that includes embedded substrate
transceivers 188 and 192 that are operable to communicate with each
other. As may be seen, substrate transceiver 188 includes a
substrate antenna 196, while substrate transceiver 192 includes a
second substrate antenna 198.
[0057] Substrate transceivers 188 and 192 are operably disposed
within the dielectric substrate 184, as is each of their antennas
196 and 198, respectively, and are operable to transmit the very
high frequency electromagnetic signals through the wave guide,
which is formed by dielectric substrate 184. As described in
relation to FIG. 3, a metal layer is optional but not required.
[0058] Generally, while the metal layer is not required either on
the top or bottom layer of the substrate, the metal is helpful to
isolate the electromagnetic signals contained within the wave guide
to reduce interference of those signals with external circuitry or
the signals from external circuitry to interfere with the
electromagnetic signals transmitted through the wave guide. The
boundary of the dielectric substrate reflects the radio frequency
of electromagnetic signals to keep the signals within the
dielectric substrate 184 and therefore minimize interference with
external circuitry and devices on top of or within the dielectric.
The substrate antennas are sized and placed to radiate only through
the dielectric substrate 184.
[0059] FIG. 5 is a functional block diagram of a substrate that
includes a plurality of substrate transceivers surrounded by
integrated circuit modules and circuitry according to one
embodiment of the present invention. As may be seen, a substrate
200 includes an embedded substrate transceiver 204 that is operable
to communicate with a substrate transceiver 208 by way of substrate
antennas 212 and 216, respectively. While transceiver 204 is
embedded in the dielectric substrate 220, transceiver 208 is
operably disposed on a surface of dielectric substrate 220.
[0060] The electromagnetic signals are transmitted from
transceivers 204 and 208 through the substrate antennas 212 and 216
to radiate through a dielectric substrate 220. In the embodiment
shown, dielectric substrate 220 is bounded by metal layers 222
which further shield the electromagnetic signals transmitted
through the wave guide that is formed by dielectric substrate 220.
The dielectric substrate 220 is surrounded, as may be seen, by IC
modules 224, 228 and 232. In the specific embodiment of substrate
200, one typical application would be a printed circuit board in
which the dielectric substrate is formed within the printed circuit
board which is then layered with metal layer 222 and operably
supports ICs 224, 228 and 232. The metal layer 222 not only is
operable as a shield, but may also be used to conduct signals in
support of IC modules 224, 228 and 232. For exemplary purposes,
transceiver 208 is operable to support communications for IC module
224 while transceiver 204 is operable to support communications for
IC module 228.
[0061] FIG. 6 is a functional block diagram of a substrate that
includes a plurality of transceivers operably disposed to
communicate through wave guides formed within the substrate
according to one embodiment of the present invention. As may be
seen, a substrate 250 includes a plurality of transceivers 252,
254, 256, 258, 260, and 262. Each transceiver 252-262 has
associated circuitry not shown here and can be operably disposed
within the dielectric or on top of the dielectric with an
associated antenna protruding into the dielectric. As may be seen,
the substrate 250 includes a plurality of wave guides formed within
for conducting specific communications between specified
transceivers. For example, a wave guide 264 is operably disposed to
support communications between transceivers 252 and 254. Similarly,
wave guides 266 support communications between transceivers 254,
256, 262, 260, and 258, as shown.
[0062] Some other noteworthy configurations may also be noticed.
For example, a wave guide 268 supports transmissions from
transceiver 252 to transceivers 258 and 260. Alternatively, each of
the transceivers 258 and 260 may transmit only to transmitter 252
through wave guide 268 because of the shape of wave guide 268. An
additional configuration according to one embodiment of the
invention, may be seen with wave guides 270 and 272. As may be
seen, wave guide 270 overlaps wave guide 272 wherein wave guide 270
supports communications between transceivers 260 and 256, while
wave guide 272 supports communications between transceivers 254 and
262. At least in this example, the wave guides 270 and 272 are
overlapping but isolated from each other to prevent the
electromagnetic radiation therein from interfering with
electromagnetic radiation of the other wave guide.
[0063] In general, it may be seen that the wave guides shown within
substrate 250 support a plurality of directional communications
between associated transceivers. In the embodiment of FIG. 6, the
substrate may be either a board, such as a printed circuit board,
or an integrated circuit wherein each transceiver is a transceiver
block or module within the integrated circuit. In this embodiment
of the invention, the wave guides are formed of a dielectric
substrate material and are bounded to contain and isolate the
electromagnetic signals transmitted therein. Further, as described
in previous embodiments, the frequency of the electromagnetic
signals is a very high radio frequency in the order of tens of GHz.
In one specific embodiment, the frequency is equal to 60 GHz (+/-5
GHz). One aspect of this embodiment of the invention is that a
transceiver may communicate to an intended transceiver by way of
another transceiver. For example, if transceiver 252 seeks to
deliver a communication to transceiver 256, transceiver 252 has the
option of transmitting the communication signals by way of wave
guides 264 and 266 through transceiver 254 or, alternatively, by
wave guides 268 and 270 through transceiver 260.
[0064] FIG. 7 is a flow chart of a method according to one
embodiment of the present invention. The method includes initially
generating a very high radio frequency signal of at least 10 GHz
(step 280). In one embodiment of the invention, the very high radio
frequency signal is a 60 GHz (+/-5 GHz) signal. Thereafter the
method includes transmitting the very high radio frequency signal
from a substrate antenna coupled to a substrate transceiver at a
very low power (step 284). Because the electromagnetic radiation of
the signal is being radiated through a substrate instead of through
space, lower power is required. Moreover, because the substrate is
operable as a wave guide with little or no interference, even less
power is required because power is not required to overcome
significant interference. Thereafter the method includes receiving
the very high radio frequency signal at a second substrate antenna
coupled to a second substrate transceiver (step 288). Finally, the
method includes producing the signal received from the substrate
antenna to logic or a processor for further processing (step 292).
Generally, the method of FIG. 7 relates to the transmission of
electromagnetic signals through a substrate of a printed circuit
board, a board that houses integrated circuits or die, or even
through an integrated circuit substrate material. In general, the
substrate is formed of a dielectric material and is operable as a
wave guide.
[0065] FIG. 8 is a functional block diagram of a substrate 300
illustrating three levels of transceivers according to one
embodiment of the present invention. As may be seen, a substrate
transceiver 302 is operably disposed upon a surface of a dielectric
substrate to communicate with a substrate transceiver 304 through
dielectric substrate 308. Substrate transceiver 304 is further
operable to communicate with substrate transceiver 312 that also is
operably disposed upon a surface of dielectric substrate 308. As
may be seen, substrate transceiver 304 is embedded within
dielectric substrate 308. To reduce or eliminate interference
between communication signals between substrate transceivers 312
and 304, in relation to communications between substrate
transceivers 302 and 304, a dielectric substrate 316 that is
isolated by an isolating boundary 322 is used to conduct the
communications between substrate transceiver 312 and substrate
transceiver 304. In one embodiment of the invention, the isolating
boundary is formed of metal.
[0066] In an alternate embodiment, the isolating boundary is merely
a different type of dielectric or other material that generates a
boundary to operably reflect electromagnetic radiation away from
the dielectric substrate surface containing the electromagnetic
signal. As such, the isolating boundaries within the dielectric,
here within dielectric substrate 308, are used to define the volume
of dielectric substrate illustrated as dielectric substrate 316 to
create a wave guide between substrate transceiver 304 and substrate
transceiver 312. In yet another alternate embodiment, rather than
creating isolated wave guides within the primary dielectric
substrate, here dielectric substrate 308, directional antennas may
be used to reduce or eliminate interference between signals going
to different substrate transceivers. For example, if each substrate
transceiver shown utilized directional antennas, then, with proper
placement and alignment of substrate antennas, interference may be
substantially reduced thereby avoiding the need for the creation of
isolating boundaries that define a plurality of wave guides within
a dielectric substrate.
[0067] Continuing to examine FIG. 8, it may be seen that a remote
communication transceiver 324 is operably disposed to communicate
with substrate transceiver 302, while an intra-system local
transceiver 328 is operably disposed to communicate with substrate
transceiver 312. In the described embodiment of the invention, the
intra-system or intra-device transceiver 328 is a local transceiver
for short range local wireless communications through space with
other local intra-device transceivers 328. References to "local"
are made to indication a device that is operable to generate
wireless transmissions that are not intended for transceivers
external to the device that houses the local transceiver.
[0068] In one embodiment, a low efficiency antenna may be used for
communications between local intra-device transceivers and between
substrate transceivers. Because the required transmission distance
is very minimal since the transmissions are to local transceivers
located on the same board, integrated circuit or device, local low
efficient antenna structures may be utilized. Moreover by using a
very high radio frequency that is at least 10 GHz, and, in one
embodiment, by utilizing a frequency band of approximately 55 GHz
to 65 GHz, such low efficiency antenna structures have
electromagnetic properties that support operation within the
desired high frequency band.
[0069] Remote communication transceiver 324, on the other hand, is
for communicating with remote transceivers external to the device
that houses substrate 300. Thus, for example, if intra-device
transceiver 328 were to receive a short range wireless
communication from another local intra-device transceiver,
intra-device transceiver 328 could operably conduct the received
signals to substrate transceiver 312 which would then be operable
to conduct the signals through dielectric substrate 316 to
substrate transceiver 304 which, in turn, could radiate the signals
to substrate transceiver 302 for delivery to remote communication
transceiver 324. Network/Device transceiver 324 could then transmit
the communication signals in the form of electromagnetic radiation
to a remote wireless transceiver.
[0070] It should be understood that the described operation herein
is but one exemplary embodiment that corresponds to the block
diagram of FIG. 8. Alternatively, such communication signals may be
relayed through more or less substrate transceivers to conduct the
communication signals from one location to another. For example, in
one alternate embodiment, only substrate transceivers 312 and 302
would be used for such communications to deliver signals from
intra-device transceiver 328 to remote communication transceiver
324 or vice versa.
[0071] More generally, as may be seen, the block diagram of FIG. 8
illustrates three levels of transceivers. First, substrate
transceivers are used for radiating electromagnetic signals at a
very high frequency through a dielectric substrate which may be
formed in a board that houses integrated circuits or die, in a
printed circuit board, or even within a substrate of an integrated
circuit. A second level of transceiver is the intra-device local
transceiver, such as intra-device transceiver 328, for generating
very short range wireless communication signals through space to
other local intra-device transceivers. As described before, such
local transceivers are for local communications all contained
within a specified device. Finally, the third level of transceiver
is the remote communication transceiver 324 which is a remote
transceiver for wireless communications with remote devices
external to the device housing substrate 300 in each of these
transceivers.
[0072] FIG. 9 is a functional block diagram of a multi-chip module
formed according to one embodiment of the present invention. As may
be seen, a multi-chip module 330 includes a plurality of die that
each includes a plurality of substrate transceivers, and at least
one intra-device local transceiver. Moreover, at least one of the
die includes a remote communication transceiver for communications
with remote devices. While a multi-chip module is not required to
include a remote communication transceiver for communications with
other remote devices, the embodiment shown in FIG. 9 does include
such a remote communication transceiver.
[0073] As may be seen, each die is separated from an adjacent die
by a spacer. As such, in the illustrated embodiment, a plurality of
four die are included, which four die are operably separated by
three spacers. Each of the four die includes two substrate
transceivers that are operable to communicate through a dielectric
substrate operable as a wave guide. Additionally, at least one
substrate transceiver is communicatively coupled to an intra-device
transceiver for radiating wireless communication signals through
space to another intra-device local transceiver within the
multi-chip module of FIG. 9.
[0074] In one embodiment of the invention, at least one
intra-device local transceiver is operable to generate transmission
signals at a power level sufficient to reach another intra-device
transceiver within a device, but not outside of the multi-chip
module. The antennas for the substrate transceivers are not shown
for simplicity but they may be formed as described elsewhere here
in this specification.
[0075] As may further be seen, each of the intra-device local
transceivers includes a shown antenna for the local wireless
transmissions through space. In the described embodiment of the
invention, the wireless communications within the multi-chip module
of FIG. 9 are at least 10 GHz in frequency and, in one embodiment,
are approximately equal to 60 GHz. The remote transceiver, as
shown, may operate at approximately the same frequency or a
different frequency according to design preferences and according
to the intended remote devices with which the multi-chip module of
FIG. 9 is to communicate.
[0076] Continuing to refer to FIG. 9, it should be understood that
each of the embodiments shown previously for substrates and
substrate transceivers may be utilized here in the multi-chip
module of FIG. 9. Accordingly, a given substrate may have more than
two substrate transceivers which substrate transceivers may be
operably disposed on top of the substrate or within the substrate.
Similarly, the antennas for such substrate transceivers, namely the
substrate antennas, may be operably disposed upon a surfaces
substrate or to at least partially, if not fully, penetrate the
substrate for the radiation of electromagnetic signals therein.
Moreover, a plurality of wave guides may be formed within the
substrate to direct the electromagnetic signals therein from one
desired substrate transceiver antenna to another desired substrate
transceiver antenna.
[0077] In operation, for exemplary purposes, one substrate
transceiver of a die may use the substrate to generate
communication signals to another substrate transceiver for delivery
to an intra-device local transceiver for subsequent radiation
through space to yet another substrate and, more specifically, to
an intra-device local transceiver operably disposed upon another
substrate. As will be described in greater detail below, a specific
addressing scheme may be used to direct communications to a
specific intra-device local transceiver for further processing. For
example, if a communication signal is intended to be transmitted to
a remote device, such communication signal processing will occur to
result in a remote transceiver receiving the communication signals
by way of one or more substrates, substrate transceivers, and
intra-device local transceivers.
[0078] Continuing to refer to FIG. 9, it should be noted that in
addition to transmitting signals through a substrate at a lower
power level, the power level for wireless transmissions between
intra-device local transceivers may also be at a lower power level.
Moreover, higher levels of modulation may be used based on the type
of transmission. For example, for transmissions through a wave
guide in a substrate, the highest orders of modulation may be used.
For example, a signal may be modulated as a 128 QAM signal or as a
256 QAM signal. Alternatively, for intra-device local transceiver
transmissions, the modulation may still be high, e.g., 64 QAM or
128 QAM, but not necessarily the highest levels of modulation.
Finally, for transmissions from a remote transceiver to a remote
device, more traditional modulation levels, such as QPSK or 8 PSK
may be utilized according to expected interference conditions for
the device.
[0079] In one embodiment of the invention, at least one die is a
flash memory chip that is collocated within the same device that a
processor. The intra-device transceivers are operable to establish
a high data rate communication channel to function as a memory bus.
As such, no traces or lines are required to be routed from the
flash memory die to the processor die. Thus, the leads shown in
FIG. 9 represent power lines to provide operating power for each of
the die. At least some of the die, therefore, use wireless data
links to reduce pin out and trace routing requirements. Continuing
to refer to FIG. 9, other application specific devices may be
included. For example, one die may include logic that is dedicated
for other functions or purposes.
[0080] One aspect of the embodiment of FIGS. 8 and 9 is that a
remote device may, by communicating through the remote
communication transceiver and then through the intra-device and/or
substrate transceivers within a device or integrated circuit,
access any specified circuit module within the device to
communicate with the device. Thus, in one embodiment, a remote
tester is operable to communicate through the remote communication
transceiver of the device housing the substrate of FIG. 8 or the
multi-chip module of FIG. 9 and then through communicatively
coupled intra-device transceivers to test any or all of the circuit
modules within. Alternatively, a remote device may use the remote
communication transceiver and intra-device and/or substrate local
transceivers to access any resource within a device. For example, a
remote device may access a memory device, a processor or a
specialized application (e.g. a sensor) through such a series of
communication links. A further explanation of these concepts may
also be seen in reference to FIGS. 25 and 26.
[0081] FIG. 10 is a flow chart of a method for communicating
according to one embodiment of the present invention. The method
includes generating a first radio frequency signal for reception by
a local transceiver operably disposed within a same die (step 340).
A second step includes generating a second RF signal for reception
by a local transceiver operably disposed within a same device (step
344). Finally, the method includes generating a third RF signal for
reception by a remote transceiver external to the same device based
upon one of the first and second RF signals (step 348).
[0082] In one embodiment of the present invention, the first,
second and third RF signals are generated at different frequency
ranges. For example, the first radio frequency signals may be
generated at 60 GHz, while the second RF signals are generated at
30 GHz, while the third RF signals are generated at 2.4 GHz.
Alternatively, in one embodiment of the invention, the first,
second and third RF signals are all generated at a very high and
substantially similar frequency. For example, each might be
generated as a 60 GHz (+/-5 GHz) signal. It is understood that
these frequencies refer to the carrier frequency and may be
adjusted slightly to define specific channels of communication
using frequency division multiple access-type techniques. More
generally, however, at least the first and second RF signals are
generated at a frequency that is at least as high as 10 GHz.
[0083] FIG. 11 is a diagram that illustrates transceiver placement
within a substrate according to one embodiment of the present
invention. As may be seen, a substrate 350 includes a plurality of
transceivers 354, 358, 362, 366 and 370, that are operably disposed
in specified locations in relation to each other to support
intended communications there between. More specifically, the
transceivers 354-370 are placed within peak areas and null areas
according to whether communication links are desired between the
respective transceivers. The white areas within the concentric
areas illustrate subtractive signal components operable to form a
signal null, while the shaded areas illustrate additive signal
components operable to form a signal peak.
[0084] More specifically, it may be seen that transceiver 354 is
within a peak area of its own transmissions, which peak area is
shown generally at 374. Additionally, a peak area may be seen at
378. Null areas are shown at 382 and 386. Peak areas 374 and 378
and null areas 382 and 386 are in relation to transceiver 354. Each
transceiver, of course, has its own relative peak and null areas
that form about its transmission antenna. One aspect of the
illustration of FIG. 11 is that transceivers are placed within peak
and null areas in relation to each other according to whether
communication links are desired between the respective
transceivers.
[0085] One aspect of the embodiment of FIG. 11 is that a device may
change frequencies to obtain a corresponding null and peak pattern
to communicate with specified transceivers.
[0086] Thus, if transceiver 354 wishes to communicate with
transceiver 366 (which is in a null region for the frequency that
generates the null and peak patterns shown in FIG. 11), transceiver
354 is operable to change to a new frequency that produces a peak
pattern at the location of transceiver 366. As such, if a dynamic
frequency assignment scheme is used, frequencies may desirably be
changed to support desired communications.
[0087] FIG. 12 is an illustration of an alternate embodiment of a
substrate 350 that includes the same circuit elements as in FIG. 11
but also includes a plurality of embedded wave guides between each
of the transceivers to conduct specific communications there
between. As may be seen, transceiver 354 is operable to communicate
with transceiver 358 over a dedicated wave guide 402. Similarly,
transceiver 354 is operable to communicate with transceiver 362
over a dedicated waveguide 406. Thus, with respect to transceiver
362, peak area 394 and null area 398 are shown within isolated
substrate 390.
[0088] Wave guide 390 couples communications between transceivers
362 and 370. While the corresponding multi-path peaks and nulls of
FIG. 11 are duplicated here in FIG. 12 for transceiver 354, it
should be understood that the electromagnetic signals are being
conducted between the transceivers through the corresponding wave
guides in one embodiment of the invention. Also, it should be
observed that the actual peak and null regions within the contained
wave guides are probably different than that for the general
substrate 350 but, absent more specific information, are shown to
correspond herein. One of average skill in the art may determine
what the corresponding peak and null regions of the isolated wave
guides 402, 406 and 390 will be for purposes of communications that
take advantage of such wave guide operational characteristics.
[0089] FIG. 13 is a flow chart that illustrates a method according
to one embodiment of the present invention. The method includes
initially generating radio frequency signals for a first specified
local transceiver disposed within an expected electromagnetic peak
of the generated radio frequency signals (step 400). The expected
electromagnetic peak is a multi-path peak where multi-path signals
are additive. The signals that are generated are then transmitted
from an antenna that is operationally disposed to communicate
through a wave guide formed within a substrate (step 404). The
substrate may be that of a board, such as a printed circuit board,
or of a die, such as an integrated circuit die.
[0090] The method also includes generating wireless transmissions
to a second local transceiver through either the same or a
different and isolated wave guide (step 408). Optionally, the
method of FIG. 13 includes transmitting communication signals to a
second local transceiver through at least one trace (step 412). As
may be seen, transmissions are not specifically limited to
electromagnetic signal radiations through space or a wave guide or,
more generally, through a substrate material such as a dielectric
substrate.
[0091] FIG. 14 is a functional block diagram of an integrated
circuit multi-chip device and associated communications according
to one embodiment of the present invention. As may be seen, a
device 450 includes a plurality of circuit boards 454, 458, 462 and
466, that each houses a plurality of die. The die may be packaged
or integrated thereon. The device of FIG. 14 may represent a device
having a plurality of printed circuit boards, or alternatively, a
multi-chip module having a plurality of integrated circuit die
separated by spacers. As may be seen, board 454 includes
transceivers 470, 474, and 478 that are operable to communicate
with each other by way of local transceivers. In one embodiment of
the invention, the local transceivers are substrate transceivers
that generate electromagnetic radiations through wave guides within
board 454.
[0092] As stated before, board 454 may be a board such as a printed
circuit board that includes a dielectric substrate operable as a
wave guide, or may be an integrated circuit that includes a
dielectric wave guide for conducting the electromagnetic radiation.
Alternatively, the transceivers 470, 474, and 478, may communicate
by way of intra-device local transceivers that transmit through
space but only for short distances. In one embodiment of the
invention, the local intra-device transceivers are 60 GHz
transceivers having very short wavelength and very short range,
especially when a low power is used for the transmission. In the
embodiment shown, power would be selected that would be adequate
for the electromagnetic radiation to cover the desired distances
but not necessarily to expand a significant distance beyond.
[0093] As may also be seen, transceiver 470 is operable to
communicate with a transceiver 482 that is operably disposed on
board 458 and with a transceiver 486 that is operably disposed on
board 458. In this case, local intra-device wireless transceivers
for transmitting through space are required since transceivers 482
and 486 are placed on a different or integrated circuit die.
Similarly, transceiver 478 is operable to communicate with
transceiver 490 that is operably disposed on board 466. As before,
transceiver 478 and transceiver 490 communicate utilizing local
intra-device wireless transceivers. As may also be seen, a local
intra-device transceiver 494 on board 462 is operable to
communicate with a local intra-device transceiver 498 that further
includes an associated remote transceiver 502 for communicating
with remote devices. As may be seen, remote transceiver 502 and
local transceiver 498 are operatively coupled. Thus, it is through
transceiver 502 that device 450 communicates with external remote
devices.
[0094] In one embodiment of the present invention, each of the
boards 454, 458, 462, and 466, are substantially leadless boards
that primarily provide structural support for bare die and
integrated circuits. In this embodiment, the chip-to-chip
communications occur through wave guides that are operably disposed
between the various integrated circuit or bare die, or through
space through local wireless intra-device transceivers.
Alternatively, if each board 454-466 represents a printed circuit
board, then the wireless communications, whether through a
substrate or through space, augment and supplement any
communications that occur through traces and lead lines on the
printed circuit board.
[0095] One aspect of the embodiment of device 450 shown in FIG. 14
is that of interference occurring between each of the wireless
transceivers. While transmissions through a wave guide by way of a
dielectric substrate may isolate such transmissions from other
wireless transmissions, there still exist a substantial number of
wireless transmissions through space that could interfere with
other wireless transmissions all within device 450. Accordingly,
one aspect of the present invention includes a device that uses
frequency division multiple access for reducing interference within
device 450.
[0096] FIG. 15 is a functional block diagram that illustrates
operation of one embodiment of the present invention utilizing
frequency division multiple access for communication within a
device. As may be seen in the embodiment of FIG. 15, a device 500
includes intra-device local transceiver A is operable to
communicate with intra-device local transceiver B and C utilizing
f.sub.1 and f.sub.2 carrier frequencies. Similarly, intra-device
local transceivers B and C communicate using f.sub.3 carrier
frequency. Intra-device local transceiver B also communicates with
intra-device local transceiver D and E utilizing f.sub.4 and
f.sub.5 carrier frequencies. Intra-device local transceiver D
communicates with intra-device local transceiver E using f.sub.6
carrier frequency. Because of space diversity (including range
differentiation), some of these frequencies may be reused as
determined by a designer. Accordingly, as may be seen, f.sub.1
carrier frequency may be used between intra-device local
transceivers C and E, as well as C and G. While f.sub.7 carrier
frequency is used for communications between intra-device local
transceivers C and F, f.sub.8 carrier frequency may be used for
communications between intra-device local transceivers E and F, as
well as D and G. Finally, intra-device local transceivers F and G
are operable to communicate using f.sub.2 carrier frequency. As may
be seen, therefore, f.sub.1, f.sub.2, and f.sub.8 carrier frequency
signals have been reused in the frequency plan of the embodiment of
FIG. 15.
[0097] Another aspect of the topology of FIG. 15 is that within the
various die or transceivers, according to application, substrate
transceivers exist that also use a specified carrier frequency for
transmissions through the dielectric substrate wave guides. Here in
FIG. 15, such carrier frequency is referred to simply as f.sub.s.
It should be understood that f.sub.s can be any one of f.sub.1
through f.sub.8 in addition to being yet a different carrier
frequency f.sub.9 (not shown in FIG. 15).
[0098] As described before in this specification, the substrate
transceivers are operable to conduct wireless transmissions through
a substrate forming a wave guide to couple to circuit portions.
Thus, referring back to FIG. 15, for transmissions that are
delivered to intra-device local transceiver D for delivery to
remote transceiver H, a pair of local substrate transceivers are
utilized to deliver the communication signals received by
intra-device local transceiver D to remote transceiver H for
propagation as electromagnetic signals through space to another
remote transceiver.
[0099] Generally, in the frequency plan that is utilized for the
embodiment of FIG. 15, the transceivers are statically arranged in
relation to each other. As such, concepts of roaming and other such
known problems do not exist. Therefore, the carrier frequencies, in
one embodiment, are permanently or statically assigned for specific
communications between named transceivers. Thus, referring to FIG.
16 now, a table is shown that provides an example of the assignment
static or permanent assignment of carrier frequencies to specified
communications between intra-device local transceivers, substrate
transceivers, and other transceivers within a specified device. For
example, f.sub.1 carrier frequency is assigned to communications
between transceivers A and B.
[0100] A carrier frequency is assigned for each communication link
between a specified pair of transceivers. As described in relation
to FIG. 15, space diversity will dictate what carrier frequencies
may be reused if desired in one embodiment of the invention. As may
also be seen, the embodiment of FIG. 16 provides for specific and
new carrier frequency assignments for communications between
specific substrate transceivers, such as substrate transceiver M
and substrate transceiver N and substrate transceiver M with
substrate transceiver O. This specific example is beneficial, for
example, in an embodiment having three or more substrate
transceivers within a single substrate, whether that single
substrate is an integrated circuit or a printed circuit board. As
such, instead of using isolated wave guides as described in
previous embodiments, frequency diversity is used to reduce
interference.
[0101] Referring back to FIG. 15, it may be seen that a plurality
of dashed lines are shown operatively coupling the plurality of
intra-device local transceivers. For example, one common set of
dashed lines couples transceivers A, B and C. On the other hand,
dashed lines are used to couple transceivers C and G, C and F, and
G and F. Each of these dashed lines shown in FIG. 15 represents a
potential lead or trace that is used for carrying low bandwidth
data and supporting signaling and power. Thus, the wireless
transmissions are used to augment or add to communications that may
be had by physical traces. This is especially relevant for those
embodiments in which the multiple transceivers are operably
disposed on one or more printed circuit boards.
[0102] One aspect of such a system design is that the wireless
transmissions may be utilized for higher bandwidth communications
within a device. For example, for such short range wireless
transmissions where interference is less of a problem, higher order
modulation techniques and types may be utilized. Thus, referring
back to FIG. 16, exemplary assignments of frequency modulation
types may be had for the specified communications. For example, for
wireless communication links between transceivers A, B, C, D, E, F
and G, either 128 QAM or 64 QAM is specified for the corresponding
communication link as the frequency modulation type. However, for
the communication link between intra-device local transceivers G
and D, 8 QAM is specified as the frequency modulation type to
reflect a greater distance and, potentially, more interference in
the signal path. On the other hand, for the wireless communication
links between substrate transceivers, the highest order modulation
known, namely 256 QAM, is shown as being assigned since the
wireless transmissions are through a substrate wave guide that has
little to no interference and is power efficient. It should be
understood that the assigned frequency modulation types for the
various communication links are exemplary and may be modified
according to actual expected circuit conditions and as is
identified by test. One aspect that is noteworthy, however, of this
embodiment, is that frequency subcarriers and frequency modulation
types, optionally, may be statically assigned for specified
wireless communication links.
[0103] FIG. 17 is a functional block diagram of a device 550
housing a plurality of transceivers and operating according to one
embodiment of the present invention. Referring to FIG. 17, a pair
of substrates 554 and 558 are shown which each include a plurality
of substrates disposed thereon, which substrates further include a
plurality of transceivers disposed thereon. More specifically,
substrate 554 includes substrates 562, 566 and 570, disposed
thereon. Substrate 562 includes transceivers 574 and 578 disposed
thereon, while substrate 566 includes transceivers 582 and 586
disposed thereon. Finally, substrate 570 includes transceivers 590
and 594 disposed thereon. Similarly, substrate 558 includes
substrates 606, 610 and 614.
[0104] Substrate 606 includes transceivers 618 and 622, while
substrate 610 includes transceivers 626 and 630 disposed thereon.
Finally, substrate 614 includes transceivers 634 and 638 disposed
thereon. Operationally, there are many aspects that are noteworthy
in the embodiments of FIG. 17. First of all, transceivers 574 and
578 are operable to communicate through substrate 562 or through
space utilizing assigned carrier frequency f.sub.2. While not
specifically shown, transceivers 574 and 578 may comprise stacked
transceivers, as described before, or may merely include a
plurality of transceiver circuit components that support wireless
communications through space, as well as through the substrate 562.
Similarly, substrate 566 includes substrate transceivers 582 and
586 that are operable to communicate through substrate 566 using
carrier frequency f.sub.3, while substrate 570 includes
transceivers 596 and 594 that are operable to communicate through
substrate 570 using carrier frequency f.sub.s.
[0105] As may also be seen, transceiver 590 of substrate 570 and
transceiver 578 of substrate 562 are operable to communicate over a
wireless communication link radiated through space (as opposed to
through a substrate). On the other hand, substrate 562 and
substrate 566 each include substrate transceivers 598 and 602 that
are operable to communicate through substrate 554. As such, layered
substrate communications may be seen in addition to wireless
localized communications through space. As may also be seen,
transceiver 578 of substrate 562 is operable to communicate with
transceiver 634 of substrate 614 which is disposed on top of
substrate 558. Similarly, transceiver 634 is operable to wirelessly
communicate by radiating electromagnetic signals through space with
transceiver 622 which is operably disposed on substrate 606.
Transceivers 622 and 618 are operable to communicate through
substrate 606, while transceivers 626 and 630 are operable to
communicate through substrate 610. Finally, transceiver 634 is
operable to communicate through substrate 614 with transceiver
638.
[0106] While not shown herein, it is understood that any one of
these transceivers may communicate with the other transceivers and
may include or be replaced by a remote transceiver for
communicating with other remote devices through traditional
wireless communication links. With respect to a frequency plan, as
may be seen, a frequency f.sub.1 is assigned for the communication
link between transceivers 578 and 634, while carrier frequency
f.sub.2 is assigned for transmissions between transceivers 574 and
578. Carrier frequency f.sub.3 is assigned for transmissions
between transceivers 578 and 590, as well as 622 and 634. Here,
space diversity, as well as assigned power levels, is used to keep
the two assignments of carrier frequency f.sub.3 from interfering
with each other and creating collisions.
[0107] As another aspect of the present embodiment of the
invention, the carrier frequencies may also be assigned
dynamically. Such a dynamic assignment may be done by evaluating
and detecting existing carrier frequencies and then assigning new
and unused carrier frequencies. Such an approach may include, for
example, frequency detection reporting amongst the various
transceivers to enable the logic for any associated transceiver to
determine what frequency to dynamically assign for a pending
communication. The considerations associated with making such
dynamic frequency assignments includes the power level of the
transmission, whether the transmission is with a local intra-device
transceiver or with a remote transceiver, and whether the detected
signal is from another local intra-device transceiver or from a
remote transceiver.
[0108] FIG. 18 is a flow chart that illustrates a method for
wireless transmissions in an integrated circuit utilizing frequency
division multiple access according to one embodiment of the
invention. The method includes, in a first local transceiver,
generating and transmitting communication signals to a second local
transceiver utilizing a first specified carrier frequency (step
650). The method further includes, in the first local transceiver,
transmitting to a third local transceiver utilizing a second
specified carrier frequency wherein the second local transceiver is
operably disposed either within the integrated circuit or within a
device housing the integrated circuit (step 654).
[0109] References to local transceivers are specifically to
transceivers that are operably disposed within the same integrated
circuit, printed circuit board or device. As such, the
communication signals utilizing the frequency diversity are signals
that are specifically intended for local transceivers and are, in
most embodiments, low power high frequency radio frequency signals.
Typical frequencies for these local communications are at least 10
GHz. In one specific embodiment, the signals are characterized by a
60 GHz carrier frequency.
[0110] These high frequency wireless transmissions may comprise
electromagnetic radiations through space or through a substrate,
and more particularly, through a wave guide formed by a dielectric
substrate formed within a die of an integrated circuit or within a
board (including but not limited to printed circuit boards). Thus,
the method further includes transmitting from a fourth local
transceiver operably coupled to the first local transceiver through
a wave guide formed within the substrate to a fifth local
transceiver operably disposed to communicate through the substrate
(step 658).
[0111] In one embodiment of the invention, the fourth local
transceiver utilizes a permanently assigned carrier frequency for
the transmissions through the wave guide. In a different embodiment
of the invention, the fourth local transceiver utilizes a
determined carrier frequency for the transmissions through the wave
guide, wherein the determined carrier frequency is chosen to match
a carrier frequency being transmitted by the first local
transceiver. This approach advantageously reduces a frequency
conversion step.
[0112] With respect to the carrier frequencies for the
electromagnetic radiations to other local transceivers through
space, the first and second carrier frequencies are statically and
permanently assigned in one embodiment. In an alternate embodiment,
the first and second carrier frequencies are dynamically assigned
based upon detected carrier frequencies. Utilizing dynamically
assigned carrier frequencies is advantageous in that interference
may further be reduced or eliminated by using frequency diversity
to reduce the likelihood of collisions or interference. A
disadvantage, however, is that more overhead is required in that
this embodiment includes logic for the transmission of identified
carrier frequencies or channels amongst the local transceivers to
coordinate frequency selection.
[0113] FIG. 19 is a functional block diagram that illustrates an
apparatus and corresponding method of wireless communications
within the apparatus for operably avoiding collisions and
interference utilizing a collision avoidance scheme to coordinate
communications according to one embodiment of the invention. More
specifically, a plurality of local transceivers for local
communications and at least one remote transceiver for remote
communications operably installed on an integrated circuit or
device board having a plurality of integrated circuit local
transceivers are shown.
[0114] The collision avoidance scheme is utilized for
communications comprising very high radio frequency signals equal
to or greater than 10 GHz in frequency for local transceiver
communications amongst local transceivers operably disposed within
the same device and even within the same supporting substrate.
Referring to FIG. 19, a plurality of local transceivers are shown
that are operable to generate wireless communication signals to
other local transceivers located on the same board or integrated
circuit or with local transceivers on a proximate board (not shown
here in FIG. 19) within the same device.
[0115] In addition to the example of FIG. 19, one may refer to
other Figures of the present specification for support therefor.
For example, FIGS. 9, 14 and 17 illustrate a plurality of
boards/integrated circuits (collectively "supporting substrates")
that each contain local transceivers operable to wirelessly
communicate with other local wireless transceivers. In one
embodiment, at least one supporting substrate (board, printed
circuit board or integrated circuit die) is operable to support
transceiver circuitry that includes one or more transceivers
thereon. For the embodiments of the invention, at least three local
transceivers are operably disposed across one or more supporting
substrates, which supporting substrates may be boards that merely
hold and provide power to integrated circuits, printed circuit
boards that support the integrated circuits as well as additional
circuitry, or integrated circuits that include radio
transceivers.
[0116] For exemplary purposes, the embodiment of FIG. 19 includes
first and second supporting substrates 700 and 704 for supporting
circuitry including transceiver circuitry. A first radio
transceiver integrated circuit 708 is supported by substrate 700,
while a second, third and fourth radio transceiver integrated
circuit die 712, 716 and 720, respectively, are operably disposed
upon and supported by the second supporting substrate 704.
[0117] At least one intra-device local transceiver is formed upon
each of the first, second, third and fourth radio transceiver
integrated circuit die 708-720 and is operable to support wireless
communications with at least one other of the intra-device local
transceivers formed upon the first, second, third and fourth radio
transceiver integrated circuit die 708-720.
[0118] The first and second intra-device local transceivers are
operable to wirelessly communicate with intra-device local
transceivers utilizing a specified collision avoidance scheme. More
specifically, in the embodiment of FIG. 19, the collision avoidance
scheme comprises a carrier sense multiple access scheme wherein
each of the first and second intra-device local transceivers is
operable to transmit a request-to-send signal and does not transmit
until it receives a clear-to-send response from the intended
receiver. Thus, each local transceiver, in this embodiment, is
operable to transmit a request-to-send signal to a specific local
transceiver that is a target of a pending communication (the
receiver of the communication) prior to initiating a data
transmission or communication. For example, the embodiment of FIG.
19 shows a first local transceiver 724 transmitting a
request-to-send signal 728 to a second local transceiver 732.
Additionally, each local transceiver is further operable to respond
to a received request-to-send signal by transmitting a
clear-to-send signal if there is no indication that a channel is in
use. Thus, in the example of FIG. 19, local transceiver 732
generates a clear-to-send signal 736 to local transceiver 724.
[0119] As another aspect of the embodiment of FIG. 19, each local
transceiver that receives the clear-to-send signal 736 is operable
to set a timer to inhibit transmissions for a specified period.
Thus, even though clear-to-send signal 736 was transmitted by local
transceiver 732 to local transceiver 724, each local transceiver
that detects clear-to-send signal 736 is operable to inhibit or
delay future transmissions for a specified period.
[0120] In the example of FIG. 19, local transceiver 732 is further
operable to broadcast the clear-to-send signal 736 to all local
transceivers in range to reduce the likelihood of collisions. Thus,
local transceiver 732 transmits (by way of associate substrate
transceivers) the clear-to-send signal 736 to a local transceiver
740 that is also formed upon die 712.
[0121] As may also be seen, a local transceiver 744 is operable to
detect clear-to-send signal 736 and to forward the clear-to-send
signal 736 to each local transceiver on the same die 720 by way of
local transceivers. In the example shown, local transceiver 744
sends clear-to-send signal 736 to a transceiver 748 by way of
substrate transceivers within die 720.
[0122] In one embodiment, the request-to-send signal is only
generated for data packets that exceed a specified size. As another
aspect of the embodiments of the present invention, any local
transceiver that detects a clear-to-send signal response sets a
timer and delays any transmissions on the channel used to transmit
the clear-to-send signal for a specified period. In yet another
embodiment of the invention, a local transceiver merely listens for
activity on a specified channel and transmits if no communications
are detected.
[0123] The collision avoidance scheme in a different embodiment is
a master/slave scheme similar to that used in personal area
networks including Bluetooth.TM. protocol or standard devices. As
such, a local transceiver is operable to control a communication as
a master or to participate as directed in the role of a slave in
the master/slave protocol communications. Further, the local
transceiver is operable to operate as a master for one
communication while operating as a slave in a different but
concurrent communication.
[0124] FIG. 20 is a functional block diagram of a substrate
supporting a plurality of local transceivers operable according to
one embodiment of the invention. A supporting board 750 is operable
to support a plurality of integrated circuit radio transceivers. In
the described embodiment, the transceivers are intra-device local
transceivers that are operable to communicate with each other
utilizing a very high radio frequency (at least 10 GHz). The
supporting substrate may be any type of supporting board including
a printed circuit board or even an integrated circuit that includes
(supports) a plurality of local transceivers (intra-device
transceivers). In the embodiment shown, the primary collision
avoidance scheme is a master/slave implementation to control
communications to avoid conflict and/or collisions. As may be seen,
for the present operations, a local transceiver 754 (intra-device
transceiver) is operable to control communications as a master for
communications with transceivers 758, 762, 766 and 770. Transceiver
770, which is a slave for communications with transceiver 754, is a
master for communications with transceiver 774.
[0125] While the primary collision avoidance scheme shown here in
FIG. 20 is a master/slave scheme, it should be understood that a
collision avoidance system as described in relation to FIG. 19 that
includes the transmission of request-to-send and clear-to-send
signals may also be implemented. In an embodiment of the invention
in which the substrate is a board, such as a printed circuit board,
the embodiment may further include a plurality of transceivers
within an integrated circuit that is supported by the board. Thus,
for example, if an integrated circuit 776 comprises an integrated
circuit that includes intra-device transceiver 766 and a remote
communication transceiver 778 in addition to a plurality of
substrate transceivers 782, 786 and 790, a collision avoidance
scheme is also implemented for communications within the integrated
circuit 776, then either the same type of a different type of
collision avoidance scheme may be implemented.
[0126] For example, a master/slave scheme is used for intra-device
transceivers while a carrier sense scheme is used to avoid
collisions within integrated circuit 776. Moreover, such schemes
may be assigned for other communications including board-to-board
(a local intra-device transceiver on a first board to a local
intra-device transceiver on a second board). Moreover, any known
collision avoidance scheme may also be used by remote
communications transceiver 778 for remote communications
(communications with remote devices). Use of carrier sense and
master/slave schemes are particularly advantageous for
communications that are not separated through frequency diversity
(FDMA transmissions), space diversity (directional antennas), or
even code diversity if a code division multiple access (CDMA)
scheme is utilized to avoid collisions between intra-device local
transceivers.
[0127] FIG. 21 illustrates a method for wireless local
transmissions in a device according to one embodiment of the
invention. The method includes, in a first local transceiver,
transmitting to a second local transceiver a request-to-send signal
(step 800). The method further includes, in the first local
transceiver, receiving a clear-to-send signal generated by a second
local transceiver in response to the request-to-send signal (step
804). After receiving the clear-to-send signal, the method includes
determining to transmit a data packet to the second local
transceiver (step 808) wherein the second local transceiver is
operably disposed either within the integrated circuit or within a
device housing the integrated circuit.
[0128] In one embodiment of the invention, the step of transmitting
the request-to-send signal occurs only when the data packet to be
transmitted exceeds a specified size. Finally, the method includes
receiving a clear-to-send signal from a third local transceiver and
determining to delay any further transmissions for a specified
period (step 812). Generally, the method described in relation to
FIG. 21 is a carrier sense scheme. Along these lines, variations to
carrier sense schemes may be implemented. For example, in one
alternate embodiment, a detection of a request-to-send type of
signal may trigger a timer in each local transceiver that detects
the request-to-send type of signal to delay transmissions to avoid
a conflict. In yet another embodiment, a local transceiver merely
initiates a communication if no other communications are detected
on a specified communication channel.
[0129] FIG. 22 is a functional block diagram a device that includes
a mesh network formed within a board or integrated circuit
according to one embodiment of the invention. Referring to FIG. 22,
each of the local transceivers supported by a substrate 820 is
operable as a node in a board level mesh network for routing
communication signals from one local transceiver to another that is
out of range for very short range transmissions at a very high
radio frequency. More specifically, a network formed within a
device that includes local transceivers A, B, C, D, E, F, G and H
is operable to relay communications as a node based mesh network
for defining multiple paths between any two local transceivers. In
the embodiment shown, each of the local transceivers comprises a
very high radio frequency transceiver for communications with local
intra-device transceivers all within the same device. In one
embodiment, the very high frequency local transceivers communicate
at frequencies that equal at least 10 GHz. In one specific
embodiment, the very high RF signal is a 60 GHz signal. The
described embodiments of the invention include local transceivers
that are operable to radiate electromagnetic signals at a low power
to reduce interference with remote devices external to the device
housing the board or integrated circuit (collectively "substrate")
of FIG. 22.
[0130] The plurality of local transceivers of FIG. 22 operably form
a mesh network of nodes that evaluate transceiver loading as well
as communication link loading. Thus, each of the local transceivers
A-H is operable to transmit, receive and process loading
information to other local transceivers within the same device.
Moreover, each is operable to make a next hop (transmit to a next
intermediary node or local transceiver for forwarding towards the
final destination node or local transceiver) and routing decisions
based upon the loading information in relation to destination
information (e.g., a final destination for a communication).
[0131] FIG. 23 is a flow chart illustrating a method according to
one embodiment of the invention for routing and forwarding
communications amongst local transceivers operating as nodes of a
mesh network all within a single device. The method includes
initially generating, in a first local transceiver of an integrated
circuit, a wireless communication signal for a specified second
local transceiver and inserting one of an address or an ID of the
second local transceiver in the wireless communication signal (step
830). As a part of transmitting the communication to the second
transceiver, the method includes determining whether to transmit
the wireless communication signal to a third local transceiver for
forwarding the communication towards the second local transceiver
either directly or to a fourth local transceiver for further
forwarding (step 834). The next step thus includes sending the
communication to the third local transceiver through a wireless
communication link (step 838). The third local transceiver may be
operably disposed (located) on a different board, a different
integrated circuit on the same board, or even on the same
integrated circuit. If on the same integrated circuit or board, the
method optionally includes transmitting the communication within a
wave guide formed within same integrated circuit or board or
supporting substrate (step 842). The method further includes
receiving loading information for loading of at least one
communication link or at least one local transceiver (step 846).
Thus, the method includes making routing and next hop
determinations based upon the received loading information (step
850).
[0132] A given local transceiver of FIG. 22 is therefore operable
to perform any combination or subset of the steps of FIG. 23 in
addition to other steps to support operation as a node within a
mesh network. More specifically, a first local transceiver is
operable to forward, communications as nodes in a mesh network
wherein each node forms a communication link with at least one
other node to forward communications. Communications received at
the first local transceiver from a second local transceiver located
on the same substrate may be forwarded to a third local transceiver
located on the same substrate. The first local transceiver is
further operable to establish a communication link with at least
one local transceiver operably disposed on a separate substrate
whether the separate substrate is a different integrated circuit
operably disposed on the same board or a different integrated
circuit operably disposed on a different board.
[0133] Each local transceiver, for example, the first and second
local transceivers, is operable to select a downstream local
transceiver for receiving a communication based upon loading.
Loading is evaluated for at least one of an integrated circuit or a
communication link. Each originating local transceiver is further
operable to specify a final destination address for a communication
and to make transmission decisions based upon the final destination
address in addition to specifying a destination address for a next
destination of a communication (the next hop) and to make
transmission decisions based upon a final destination address.
Finally, it should be noted that the mesh communication paths may
be determined statically or dynamically. Thus, evaluating loading
condition is one embodiment in which the routing is determined
dynamically. In an alternate embodiment, however, communication
routing may also be determined statically on a permanent basis.
[0134] FIG. 24 illustrates a method for communications within a
device according to one embodiment of the invention in which
communications are transmitted through a mesh network within a
single device. The method includes evaluating loading information
of at least one of a local transceiver or of a communication link
between two local transceivers (step 860) and determining a next
hop destination node comprising a local transceiver within the
device (step 864). Thereafter, the method includes transmitting a
communication to the next hop destination node, which communication
includes a final destination address of a local transceiver (step
868). Generally, determining the next hop destination node is based
upon loading information and upon the final destination of the
communication. For a given route for a communication, communication
links may result between local transceivers operably disposed on
the same substrate, between local transceivers on the different
integrated circuits operably disposed on the same substrate,
between local transceivers on the different integrated circuits
operably disposed on the same board, and between local transceivers
on the different integrated circuits operably disposed on different
substrates. A method optionally includes utilizing at least one
communication link between local transceivers operably coupled by
way of a wave guide formed within a substrate supporting the local
transceivers (step 872).
[0135] FIG. 25 is a functional block diagram of a network operating
according to one embodiment of the present invention. A network 900
includes a plurality of devices 904, 908 and 912 that are operable
to communicate using remote communication transceivers 916. These
communications may be using any known communication protocol or
standard including 802.11, Bluetooth, CDMA, GSM, TDMA, etc. The
frequency for such communications may also be any known radio
frequency for the specified communication protocol being used and
specifically includes 900 MHz, 1800 MHz, 2.4 GHz, 60 GHz, etc.
[0136] Within each of the devices 904-912, intra-device local
transceivers 920 communicate with each other at very high radio
frequencies that are at least 10 GHz to provide access to a
specific circuit module within the device. For example,
intra-device local transceivers 920 may be utilized to provide
access to memory 924 or processor 928 of device 904, to processors
932 and 936 of device 908, or to processor 940 and sensor 944 of
device 912. Additionally, where available, access may also be
provide through substrate communications using substrate
transceivers 948. In the described embodiments, the substrate
processors operate at very high radio frequencies of at least 10
GHz.
[0137] Within each device, the frequencies used may be statically
or dynamically assigned as described herein this specification.
Further, mesh networking concepts described herein this
specification may be used to conduct communications through out a
device to provide access to a specified circuit module.
Additionally, the described collision avoidance techniques may be
utilized including use of a clear-to-send approach or a
master/slave approach to reduce interference and collisions.
[0138] As one application of all of the described embodiments, a
tester may access any given circuit block or element using any
combination of the remote communication transceivers 916, the
intra-device local transceivers 920 or the substrate transceivers
948. As another application, such inter-device and intra-device
communications may be used for resource sharing. Thus, for example,
a large memory device may be placed in one location while a
specialty application device and a computing device are placed in
other locations. Such wireless communications thus support remote
access to computing power of the computing device, to memory of the
memory device or to the specific sensor of the specialty
application device. While FIG. 25 illustrates distinct devices
904-912, it should be understood that some of these devices may
also represent printed circuit boards or supporting boards housing
a plurality of integrated circuit blocks that provide specified
functions. For example a remote device 904 may communicate through
the remote communication transceivers with two printed circuit
boards 908 and 912 within a common device.
[0139] FIG. 26 is a flow chart illustrating the use of a plurality
of wireless transceivers to provide access to a specified circuit
block according to one embodiment of the invention. The method
includes establishing a first communication link between remote
communication transceivers (step 950), establishing a second
communication link between either intra-device communication
transceivers or substrate transceivers to establish a link to a
specified circuit block (step 954), and communicating with the
specified circuit block to gain access to a function provided by
the specified circuit block (step 958). These steps include
coupling the first and second communication links and, as
necessary, translating communication protocols from a first to a
second protocol and translating frequencies from a first frequency
to a second frequency. As such, a remote device may access a
specified circuit block to achieve the benefit of a function of the
specified circuit block or to obtain data or to test one or more
circuit blocks.
[0140] As one of ordinary skill in the art will appreciate, the
term "substantially" or "approximately", as may be used herein,
provides an industry-accepted tolerance to its corresponding term
and/or relativity between items. Such an industry-accepted
tolerance ranges from less than one percent to twenty percent and
corresponds to, but is not limited to, component values, integrated
circuit process variations, temperature variations, rise and fall
times, and/or thermal noise. Such relativity between items ranges
from a difference of a few percent to magnitude differences. As one
of ordinary skill in the art will further appreciate, the term
"operably coupled", as may be used herein, includes direct coupling
and indirect coupling via another component, element, circuit, or
module where, for indirect coupling, the intervening component,
element, circuit, or module does not modify the information of a
signal but may adjust its current level, voltage level, and/or
power level. As one of ordinary skill in the art will also
appreciate, inferred coupling (i.e., where one element is coupled
to another element by inference) includes direct and indirect
coupling between two elements in the same manner as "operably
coupled".
[0141] While the invention is susceptible to various modifications
and alternative forms, specific embodiments thereof have been shown
by way of example in the drawings and detailed description. It
should be understood, however, that the drawings and detailed
description thereto are not intended to limit the invention to the
particular form disclosed, but, on the contrary, the invention is
to cover all modifications, equivalents and alternatives falling
within the spirit and scope of the present invention as defined by
the claims. Moreover, the various embodiments illustrated in the
Figures may be partially combined to create embodiments not
specifically described but considered to be part of the invention.
For example, specific aspects of any one embodiment may be combined
with another aspect of another embodiment or even with another
embodiment in its entirety to create a new embodiment that is a
part of the inventive concepts disclosed herein this specification.
As may be seen, the described embodiments may be modified in many
different ways without departing from the scope or teachings of the
invention.
* * * * *