U.S. patent application number 12/588817 was filed with the patent office on 2010-12-23 for high-performance heat dissipation substrate with monoparticle layer.
Invention is credited to Shih-Yao Huang.
Application Number | 20100319897 12/588817 |
Document ID | / |
Family ID | 43353276 |
Filed Date | 2010-12-23 |
United States Patent
Application |
20100319897 |
Kind Code |
A1 |
Huang; Shih-Yao |
December 23, 2010 |
High-performance heat dissipation substrate with monoparticle
layer
Abstract
A high-performance heat dissipation substrate with monoparticle
layer, including a surface plate having a first face connected to a
heat source and a second face on which a heat dissipation substrate
is disposed. The heat dissipation substrate is connectable to an
external heat dissipation device. A thermal particle layer is
disposed between the surface plate and the heat dissipation
substrate in the form of a monoparticle layer. The thermal particle
layer includes multiple thermal particles (ceramic materials as
diamond, SiC, AIN, Single Crystal Silicon) arranged immediately
adjacent to each other and partially inlaid in the surface plate
and the heat dissipation substrate. The heat of the heat source can
be transferred from the surface plate through the thermal particle
layer to the heat dissipation substrate and dissipated outward.
Inventors: |
Huang; Shih-Yao; (Liugui
Township, TW) |
Correspondence
Address: |
ROSENBERG, KLEIN & LEE
3458 ELLICOTT CENTER DRIVE-SUITE 101
ELLICOTT CITY
MD
21043
US
|
Family ID: |
43353276 |
Appl. No.: |
12/588817 |
Filed: |
October 29, 2009 |
Current U.S.
Class: |
165/185 |
Current CPC
Class: |
H01L 23/3732 20130101;
F28F 21/02 20130101; F28F 2013/006 20130101; H01L 23/3735 20130101;
F28F 21/04 20130101; H01L 2924/0002 20130101; H01L 2924/0002
20130101; F28D 2021/0029 20130101; H01L 23/3731 20130101; H01L
23/3738 20130101; H01L 2924/00 20130101 |
Class at
Publication: |
165/185 |
International
Class: |
F28F 21/00 20060101
F28F021/00; F28F 21/02 20060101 F28F021/02 |
Foreign Application Data
Date |
Code |
Application Number |
Jun 19, 2009 |
TW |
098120652 |
Claims
1. A high-performance heat dissipation substrate with monoparticle
layer, comprising: a surface plate at least having a first face and
a second face, the first face of the surface plate being connected
to a heat source; a heat dissipation substrate disposed on the
second face of the surface plate and connected to an external heat
dissipation device; and a thermal particle layer including multiple
thermal particles arranged between the surface plate and the heat
dissipation substrate for transferring heat from the surface plate
to the heat dissipation substrate.
2. The high-performance heat dissipation substrate with
monoparticle layer as claimed in claim 1, wherein the thermal
particles are ceramic material particles.
3. The high-performance heat dissipation substrate with
monoparticle layer as claimed in claim 2, wherein the thermal
particles are selected from at lest one of ceramic materials such
as diamond, SiC, AIN, Single Crystal Silicon.
4. The high-performance heat dissipation substrate with
monoparticle layer as claimed in claim 1, wherein the thermal
particles of the thermal particle layer are arranged in an
array.
5. The high-performance heat dissipation substrate with
monoparticle layer as claimed in claim 1, wherein the thermal
particles of the thermal particle layer are arranged in a
non-array.
6. The high-performance heat dissipation substrate with
monoparticle layer as claimed in claim 1, wherein the thermal
particles of the thermal particle layer are arranged in the form of
a monoparticle layer.
7. The high-performance heat dissipation substrate with
monoparticle layer as claimed in claim 1, wherein an adhesive
bonding material is filled between the thermal particles of the
thermal particle layer.
8. The high-performance heat dissipation substrate with
monoparticle layer as claimed in claim 6, wherein an adhesive
bonding material is filled between the thermal particles of the
thermal particle layer.
9. The high-performance heat dissipation substrate with
monoparticle layer as claimed in claim 7, wherein the bonding
material is formed of epoxy or epoxy added with SiC powder.
10. The high-performance heat dissipation substrate with
monoparticle layer as claimed in claim 8, wherein the bonding
material is formed of epoxy or epoxy added with SiC powder.
11. The high-performance heat dissipation substrate with
monoparticle layer as claimed in claim 1, wherein two opposite
sides of the thermal particles are at least partially inlaid in the
surface plate and at least one heat dissipation substrate.
12. The high-performance heat dissipation substrate with
monoparticle layer as claimed in claim 2, wherein two opposite
sides of the thermal particles are at least partially inlaid in the
surface plate and at least one heat dissipation substrate.
13. The high-performance heat dissipation substrate with
monoparticle layer as claimed in claim 3, wherein two opposite
sides of the thermal particles are at least partially inlaid in the
surface plate and at least one heat dissipation substrate.
14. The high-performance heat dissipation substrate with
monoparticle layer as claimed in claim 6, wherein two opposite
sides of the thermal particles are at least partially inlaid in the
surface plate and at least one heat dissipation substrate.
15. The high-performance heat dissipation substrate with
monoparticle layer as claimed in claim 7, wherein two opposite
sides of the thermal particles are at least partially inlaid in the
surface plate and at least one heat dissipation substrate.
16. The high-performance heat dissipation substrate with
monoparticle layer as claimed in claim 8, wherein two opposite
sides of the thermal particles are at least partially inlaid in the
surface plate and at least one heat dissipation substrate.
17. The high-performance heat dissipation substrate with
monoparticle layer as claimed in claim 9, wherein two opposite
sides of the thermal particles are at least partially inlaid in the
surface plate and at least one heat dissipation substrate.
18. The high-performance heat dissipation substrate with
monoparticle layer as claimed in claim 1, wherein the thermal
particles are arranged immediately adjacent to each other.
19. The high-performance heat dissipation substrate with
monoparticle layer as claimed in claim 2, wherein the thermal
particles are arranged immediately adjacent to each other.
20. The high-performance heat dissipation substrate with
monoparticle layer as claimed in claim 3, wherein the thermal
particles are arranged immediately adjacent to each other.
Description
BACKGROUND OF THE INVENTION
[0001] The present invention relates to a high-performance heat
dissipation substrate with monoparticle layer, and more
particularly to a heat dissipation substrate with higher heat
conduction efficiency and wider application range.
[0002] Following the development and advance of semiconductor
technique, it has become a trend to miniaturize and sophisticate
various semiconductor products. The semiconductor will generate
heat when working. However, the semiconductor itself inherently has
quite small heat dissipation surface. Therefore, a mini-type
high-power semiconductor, such as high-power light-emitting diode
(LED), high-frequency component, high-power transistor component,
etc., is generally provided with an external heat dissipation
component (or radiating fins) with sufficient heat dissipation area
for dissipating the heat. The heat is multistage conducted from the
semiconductor to the external heat dissipation component.
Therefore, heat conduction efficiency of the mini-type
semiconductor (small-size electronic component) is a critical
factor in heat dissipation as a whole.
[0003] Conventionally, a heat conduction layer is disposed between
the semiconductor and the packaging substrate thereof. In early
stage, the heat conduction layer is made of an adhesive material
simply formed of resin or resin doped with ceramic micropowder.
Such heat conduction layer has a very poor thermal conductivity
(lower than 5 W/mk). As a result, the heat dissipation effect
provided by such heat conduction layer is limited and it often
takes place that the heat cannot be dissipated efficiently.
[0004] It is known that diamond particle itself has excellent
thermal conductivity (1000 W/mk). Therefore, some manufacturers
apply diamond material to heat conduction structures of
semiconductor products. It is commonly seen that diamond particles
are ground into diamond micropowder, which is added into resin or
other adhesives as heat conduction material between the
semiconductor heat source and the heat conduction substrate.
However, in such structure, the diamond micropowder is enclosed in
the resin material with very poor thermal conductivity. This
greatly deteriorates heat conduction effect of the diamond
micropowder. Consequently, such structure can hardly achieve
satisfying heat dissipation function. Moreover, the diamond
particles have an extremely high hardness and are hard to grind.
Therefore, it is difficult to grind and process the diamond
particles into diamond microparticle. As a result, the
manufacturing cost is increased. This is inconsistent with economic
benefit.
[0005] U.S. Pat. No. 6,372,628 discloses an insulating diamond-like
carbon film disposed between a heat source and a heat conduction
substrate. Also, Taiwanese Patent Publication No. 200915505
discloses a high-performance heat dissipation packaging substrate
with an insulating diamond-like carbon film. The insulating
diamond-like carbon film serves to transfer the heat generated by
the heat source (semiconductor) to the heat conduction substrate
for dissipating the heat outward. Such diamond-like carbon film has
a thermal conductivity better than that of the conventional
adhesive heat conduction layer formed of resin or resin doped with
ceramic micropowder. However, in practice, the thermal conductivity
of the diamond-like carbon film is lower than the thermal
conductivity of diamond particles. Therefore, such diamond-like
carbon film still can hardly achieve satisfying heat dissipation
effect.
SUMMARY OF THE INVENTION
[0006] It is therefore a primary object of the present invention to
provide a high-performance heat dissipation substrate with
monoparticle layer formed with ceramic materials. The heat
dissipation substrate has excellent thermal conductivity and is
able to efficiently transfer heat generated by a heat source to a
heat dissipation device for dissipating the heat outward.
[0007] It is a further object of the present invention to provide
the above high-performance heat dissipation substrate, which can be
more easily processed than the conventional heat conduction
structure made of the same material. Therefore, the manufacturing
cost is lowered and the competitive ability is promoted.
[0008] To achieve the above and other objects, the high-performance
heat dissipation substrate with monoparticle layer of the present
invention includes: a surface plate at least having a first face
and a second face, the first face of the surface plate being
connected to a heat source; a heat dissipation substrate disposed
on the second face of the surface plate and connected to an
external heat dissipation device; and a thermal particle layer
including multiple thermal particles (such as particles formed with
ceramic material) arranged between the surface plate and the heat
dissipation substrate for transferring heat from the surface plate
to the heat dissipation substrate.
[0009] In the above heat dissipation substrate, the thermal
particles of the thermal particle layer are arranged in an array or
a non-array.
[0010] In the above heat dissipation substrate, an adhesive bonding
material is filled between the thermal particles of the thermal
particle layer.
[0011] The present invention can be best understood through the
following description and accompanying drawings wherein:
BRIEF DESCRIPTION OF THE DRAWINGS
[0012] FIG. 1 is a perspective exploded view of the present
invention;
[0013] FIG. 2 is a sectional assembled view of the present
invention; and
[0014] FIG. 3 is an enlarged view of a part of the present
invention.
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS
[0015] Please refer to FIGS. 1 to 3. The present invention includes
a surface plate 1, a heat dissipation substrate 2 and a thermal
particle layer 3. The surface plate 1 is a sheet member having a
first face and a second face. The first face of the surface plate 1
is connected to a heat source 4 (such as a semiconductor or a
heat-generating component). The heat dissipation substrate 2 is
disposed on the second face of the surface plate 1. The heat
dissipation substrate 2 has larger heat dissipation area itself.
Alternatively, the heat dissipation substrate 2 is connected to an
external heat dissipation device (such as radiating fins or the
like). The thermal particle layer 3 is disposed between the surface
plate 1 and the heat dissipation substrate 2 in the form of a
monoparticle layer. The thermal particle layer 3 includes multiple
thermal particles 31 (such as particles formed with ceramic
material diamond, SiC, AIN, Single Crystal Silicon) arranged
immediately adjacent to each other (in an array or non-array). The
thermal particles 31 are partially inlaid in the surface plate 1 or
the heat dissipation substrate 2 so as to firmly and tightly
connect and contact therewith by a large area. Accordingly, the
heat can be efficiently transferred from the surface plate 1
through the thermal particle layer 3 to the heat dissipation
substrate 2. An adhesive bonding material 32 is filled between the
thermal particles 31 of the thermal particle layer 3. The main
composition of the bonding material 32 is pure epoxy or epoxy added
with SiC powder. The bonding material 32 not only serves to bond
the thermal particles 31 to each other, but also is able to enhance
connection strength between the surface plate 1 and the heat
dissipation substrate 2.
[0016] In the above structure, the thermal particles 31 have an
excellent thermal conductivity themselves and are extremely hard.
Therefore, in the case that the surface plate 1 and the heat
dissipation substrate 2 are pressed toward each other, at least
some parts of the thermal particles 31, especially the sharp
sections thereof, will thrust into the surface of the surface plate
1 or the heat dissipation substrate 2, which is generally made of
metal material. Accordingly, the thermal particles 31 can firmly
and tightly connect and contact with the surface plate 1 and the
heat dissipation substrate 2 by larger area to reduce thermal
resistance between the contact sections. Therefore, the heat
generated by the heat source 4 can be uniformly distributed over
the surface plate 1 and efficiently transferred through the thermal
particles 31 of the thermal particle layer 3 to the heat
dissipation substrate 2. The heat dissipation substrate 2 then
conducts the heat to the radiating fins or the like heat
dissipation structures to dissipate the heat. In comparison with
the prior art, the present invention achieves better heat
dissipation effect and is easier to process. Therefore, the
manufacturing cost is reduced and the competitive ability is
promoted.
[0017] In conclusion, the processing procedure of the
high-performance heat dissipation substrate with monoparticle layer
of the present invention is simplified. In addition, the heat
conduction effect of the heat dissipation substrate of the present
invention is enhanced.
[0018] The above embodiments are only used to illustrate the
present invention, not intended to limit the scope thereof. Many
modifications of the above embodiments can be made without
departing from the spirit of the present invention.
* * * * *