U.S. patent application number 12/751751 was filed with the patent office on 2010-12-09 for method and system for a leaky wave antenna on an integrated circuit package.
Invention is credited to Ahmadreza Rofougaran, Maryam Rofougaran.
Application Number | 20100309074 12/751751 |
Document ID | / |
Family ID | 43300218 |
Filed Date | 2010-12-09 |
United States Patent
Application |
20100309074 |
Kind Code |
A1 |
Rofougaran; Ahmadreza ; et
al. |
December 9, 2010 |
METHOD AND SYSTEM FOR A LEAKY WAVE ANTENNA ON AN INTEGRATED CIRCUIT
PACKAGE
Abstract
Methods and systems for a leaky wave antenna LWA on an
integrated circuit (IC) package are disclosed and may include
communicating RF signals using one or more LWAs in a wireless
device. The LWAs may be integrated in metal layers in an IC
package, and a resonant frequency of the LWAs may be dependent on
cavity heights associated with the metal layers. The cavity heights
may be configured utilizing micro-electro-mechanical systems
deflection. The RF signals may include 60 GHz signals. The LWAs may
include microstrip and/or coplanar waveguides where a cavity height
of the LWAs may be dependent on a spacing between conductive lines
in the waveguides. The LWAs may be configured to transmit the
wireless signals at a desired angle from a surface of the IC
package. The IC package may be affixed to a printed circuit board,
and an IC may be flip-chip-bonded to the IC package.
Inventors: |
Rofougaran; Ahmadreza;
(Newport Coast, CA) ; Rofougaran; Maryam; (Rancho
Palos Verdes, CA) |
Correspondence
Address: |
MCANDREWS HELD & MALLOY, LTD
500 WEST MADISON STREET, SUITE 3400
CHICAGO
IL
60661
US
|
Family ID: |
43300218 |
Appl. No.: |
12/751751 |
Filed: |
March 31, 2010 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
|
|
61246618 |
Sep 29, 2009 |
|
|
|
61185245 |
Jun 9, 2009 |
|
|
|
Current U.S.
Class: |
343/772 |
Current CPC
Class: |
G06K 7/10316 20130101;
H01L 2924/13091 20130101; H04B 5/0031 20130101; H01L 2224/32225
20130101; H01Q 19/06 20130101; H01L 2224/16225 20130101; H01Q 13/22
20130101; H01L 2224/73204 20130101; H01Q 13/20 20130101; H04B 7/24
20130101; H01Q 15/0066 20130101; H04B 1/0458 20130101; G01S 13/06
20130101; H01Q 15/23 20130101; H01Q 1/2283 20130101; H01Q 15/006
20130101; H01L 2224/73204 20130101; H01L 2224/16225 20130101; H01L
2224/32225 20130101; H01L 2924/00 20130101; H01L 2924/13091
20130101; H01L 2924/00 20130101 |
Class at
Publication: |
343/772 |
International
Class: |
H01Q 13/20 20060101
H01Q013/20 |
Claims
1. A method for communication, the method comprising: communicating
RF signals using one or more leaky wave antennas in a wireless
device, wherein: said one or more leaky wave antennas are
integrated in metal layers in an integrated circuit package; and a
resonant frequency of said one or more leaky wave antennas is
dependent on one or more cavity heights that is associated with
said metal layers.
2. The method according to claim 1, comprising configuring at least
a portion of said one or more cavity heights utilizing
micro-electro-mechanical systems (MEMS) deflection.
3. The method according to claim 1, comprising configuring at least
a portion of said one or more cavity heights utilizing
micro-electro-mechanical systems (MEMS) deflection.
4. The method according to claim 1, wherein said leaky wave
antennas comprise microstrip waveguides.
5. The method according to claim 4, wherein a cavity height of said
leaky wave antennas is dependent on a spacing between conductive
lines in said microstrip waveguides.
6. The method according to claim 1, wherein said leaky wave
antennas comprise coplanar waveguides.
7. The method according to claim 6, wherein a cavity height of said
leaky wave antennas is dependent on a spacing between conductive
lines in said coplanar waveguides.
8. The method according to claim 1, comprising configuring said
leaky wave antennas to transmit said wireless signals at a desired
angle from a surface of said integrated circuit package.
9. The method according to claim 1, wherein said integrated circuit
package is affixed to a printed circuit board.
10. The method according to claim 1, wherein an integrated circuit
is flip-chip-bonded to said integrated circuit package.
11. A system for enabling communication, the system comprising: an
integrated circuit package for use in a wireless device, said
integrated circuit package comprising one or more leaky wave
antennas, wherein: said one or more leaky wave antennas are
integrated in metal layers in an integrated circuit package; and a
resonant frequency of said one or more leaky wave antennas is
dependent on one or more cavity heights that is associated with
said metal layers.
12. The system according to claim 11, wherein said wireless device
is operable to configure at least a portion of said one or more
cavity heights utilizing micro-electro-mechanical systems (MEMS)
deflection.
13. The system according to claim 11, wherein said wireless device
is operable to configure at least a portion of said one or more
cavity heights utilizing micro-electro-mechanical systems (MEMS)
deflection.
14. The system according to claim 11, wherein said leaky wave
antennas comprise microstrip waveguides.
15. The system according to claim 14, wherein a cavity height of
said leaky wave antennas is dependent on a spacing between
conductive lines in said microstrip waveguides.
16. The system according to claim 11, wherein said leaky wave
antennas comprise coplanar waveguides.
17. The system according to claim 16, wherein a cavity height of
said leaky wave antennas is dependent on a spacing between
conductive lines in said coplanar waveguides.
18. The system according to claim 11, wherein said wireless device
is operable to configure said leaky wave antennas to transmit said
wireless signals at a desired angle from a surface of said
integrated circuit package.
19. The system according to claim 11, wherein said integrated
circuit package is affixed to a printed circuit board.
20. The system according to claim 11, wherein an integrated circuit
is flip-chip-bonded to said integrated circuit package.
Description
CROSS-REFERENCE TO RELATED APPLICATIONS/INCORPORATION BY
REFERENCE
[0001] This application makes reference to, claims the benefit
from, and claims priority to U.S. Provisional Application Ser. No.
61/246,618 filed on Sep. 29, 2009, and U.S. Provisional Application
Ser. No. 61/185,245 filed on Jun. 9, 2009.
[0002] This application also makes reference to: [0003] U.S. patent
application Ser. No. 12/650,212 filed on Dec. 30, 2009; [0004] U.S.
patent application Ser. No. 12/650,295 filed on Dec. 30, 2009;
[0005] U.S. patent application Ser. No. 12/650,277 filed on Dec.
30, 2009; [0006] U.S. patent application Ser. No. 12/650,192 filed
on Dec. 30, 2009; [0007] U.S. patent application Ser. No.
12/650,224 filed on Dec. 30, 2009; [0008] U.S. patent application
Ser. No. 12/650,176 filed on Dec. 30, 2009; [0009] U.S. patent
application Ser. No. 12/650,246 filed on Dec. 30, 2009; [0010] U.S.
patent application Ser. No. 12/650,292 filed on Dec. 30, 2009;
[0011] U.S. patent application Ser. No. 12/650,324 filed on Dec.
30, 2009; [0012] U.S. patent application Ser. No. 12/708,366 filed
on Feb. 18, 2010; [0013] U.S. patent application Ser. No. ______
(Attorney Docket No. 21203US02) filed on even date herewith; [0014]
U.S. patent application Ser. No. ______ (Attorney Docket No.
21206US02) filed on even date herewith; [0015] U.S. patent
application Ser. No. ______ (Attorney Docket No. 21207US02) filed
on even date herewith; [0016] U.S. patent application Ser. No.
______ (Attorney Docket No. 21208US02) filed on even date herewith;
[0017] U.S. patent application Ser. No. ______ (Attorney Docket No.
21209US02) filed on even date herewith; [0018] U.S. patent
application Ser. No. ______ (Attorney Docket No. 21213US02) filed
on even date herewith; [0019] U.S. patent application Ser. No.
______ (Attorney Docket No. 21218US02) filed on even date herewith;
and [0020] U.S. patent application Ser. No. ______ (Attorney Docket
No. 21220US02) filed on even date herewith.
[0021] Each of the above stated applications is hereby incorporated
herein by reference in its entirety.
FEDERALLY SPONSORED RESEARCH OR DEVELOPMENT
[0022] [Not Applicable]
[MICROFICHE/COPYRIGHT REFERENCE]
[0023] [Not Applicable]
FIELD OF THE INVENTION
[0024] Certain embodiments of the invention relate to wireless
communication. More specifically, certain embodiments of the
invention relate to a method and system for a 60 GHz leaky wave
high gain antenna.
BACKGROUND OF THE INVENTION
[0025] Mobile communications have changed the way people
communicate and mobile phones have been transformed from a luxury
item to an essential part of every day life. The use of mobile
phones is today dictated by social situations, rather than hampered
by location or technology. While voice connections fulfill the
basic need to communicate, and mobile voice connections continue to
filter even further into the fabric of every day life, the mobile
Internet is the next step in the mobile communication revolution.
The mobile Internet is poised to become a common source of everyday
information, and easy, versatile mobile access to this data will be
taken for granted.
[0026] As the number of electronic devices enabled for wireline
and/or mobile communications continues to increase, significant
efforts exist with regard to making such devices more power
efficient. For example, a large percentage of communications
devices are mobile wireless devices and thus often operate on
battery power. Additionally, transmit and/or receive circuitry
within such mobile wireless devices often account for a significant
portion of the power consumed within these devices. Moreover, in
some conventional communication systems, transmitters and/or
receivers are often power inefficient in comparison to other blocks
of the portable communication devices. Accordingly, these
transmitters and/or receivers have a significant impact on battery
life for these mobile wireless devices.
[0027] Further limitations and disadvantages of conventional and
traditional approaches will become apparent to one of skill in the
art, through comparison of such systems with the present invention
as set forth in the remainder of the present application with
reference to the drawings.
BRIEF SUMMARY OF THE INVENTION
[0028] A system and/or method for a leaky wave antenna on an
integrated circuit package as shown in and/or described in
connection with at least one of the figures, as set forth more
completely in the claims.
[0029] Various advantages, aspects and novel features of the
present invention, as well as details of an illustrated embodiment
thereof, will be more fully understood from the following
description and drawings.
BRIEF DESCRIPTION OF SEVERAL VIEWS OF THE DRAWINGS
[0030] FIG. 1 is a block diagram of an exemplary wireless system
with leaky wave antennas integrated on an integrated circuit
package, which may be utilized in accordance with an embodiment of
the invention.
[0031] FIG. 2 is a block diagram illustrating an exemplary leaky
wave antenna, in accordance with an embodiment of the
invention.
[0032] FIG. 3 is a block diagram illustrating a plan view of
exemplary partially reflective surfaces, in accordance with an
embodiment of the invention.
[0033] FIG. 4 is a block diagram illustrating an exemplary phase
dependence of a leaky wave antenna, in accordance with an
embodiment of the invention.
[0034] FIG. 5 is a block diagram illustrating exemplary in-phase
and out-of-phase beam shapes for a leaky wave antenna, in
accordance with an embodiment of the invention.
[0035] FIG. 6 is a block diagram illustrating a leaky wave antenna
with variable input impedance feed points, in accordance with an
embodiment of the invention.
[0036] FIG. 7 is a block diagram illustrating a cross-sectional
view of coplanar and microstrip waveguides, in accordance with an
embodiment of the invention.
[0037] FIG. 8 is a diagram illustrating a cross-sectional view of
an integrated circuit package with integrated leaky wave antennas,
in accordance with an embodiment of the invention.
[0038] FIG. 9 is a block diagram illustrating exemplary steps for
communicating via leaky wave antennas integrated in metal layers on
a package, in accordance with an embodiment of the invention.
DETAILED DESCRIPTION OF THE INVENTION
[0039] Certain aspects of the invention may be found in a method
and system for a leaky wave antenna on an integrated circuit
package. Exemplary aspects of the invention may comprise
communicating RF signals using one or more leaky wave antennas in a
wireless device. The leaky wave antennas may be integrated in metal
layers in an integrated circuit package, and a resonant frequency
of the leaky wave antennas may be dependent on one or more cavity
heights associated with the metal layers. At least a portion of the
one or more cavity heights may be configured utilizing
micro-electro-mechanical systems (MEMS) deflection. The RF signals
may comprise 60 GHz signals. The leaky wave antennas may comprise
microstrip waveguides, where a cavity height of the leaky wave
antennas may be dependent on a spacing between conductive lines in
the microstrip waveguides. The leaky wave antennas may comprise
coplanar waveguides where a cavity height of the leaky wave
antennas may be dependent on a spacing between conductive lines in
the coplanar waveguides. The leaky wave antennas may be configured
to transmit the wireless signals at a desired angle from a surface
of the integrated circuit package. The integrated circuit package
may be affixed to a printed circuit board, and an integrated
circuit may be flip-chip-bonded to the integrated circuit
package.
[0040] FIG. 1 is a block diagram of an exemplary wireless system
with leaky wave antennas integrated on an integrated circuit
package, which may be utilized in accordance with an embodiment of
the invention. Referring to FIG. 1, the wireless device 150 may
comprise an antenna 151, a transceiver 152, a baseband processor
154, a processor 156, a system memory 158, a logic block 160, a
chip 162, leaky wave antennas 164, switches 165, an external
headset port 166, and a package 167. The wireless device 150 may
also comprise an analog microphone 168, integrated hands-free (IHF)
stereo speakers 170, a printed circuit board 171, a hearing aid
compatible (HAC) coil 174, a dual digital microphone 176, a
vibration transducer 178, a keypad and/or touchscreen 180, and a
display 182.
[0041] The transceiver 152 may comprise suitable logic, circuitry,
interface(s), and/or code that may be enabled to modulate and
upconvert baseband signals to RF signals for transmission by one or
more antennas, which may be represented generically by the antenna
151. The transceiver 152 may also be enabled to downconvert and
demodulate received RF signals to baseband signals. The RF signals
may be received by one or more antennas, which may be represented
generically by the antenna 151, or the leaky wave antennas 164.
Different wireless systems may use different antennas for
transmission and reception. The transceiver 152 may be enabled to
execute other functions, for example, filtering the baseband and/or
RF signals, and/or amplifying the baseband and/or RF signals.
Although a single transceiver 152 is shown, the invention is not so
limited. Accordingly, the transceiver 152 may be implemented as a
separate transmitter and a separate receiver. In addition, there
may be a plurality of transceivers, transmitters and/or receivers.
In this regard, the plurality of transceivers, transmitters and/or
receivers may enable the wireless device 150 to handle a plurality
of wireless protocols and/or standards including cellular, WLAN and
PAN. Wireless technologies handled by the wireless device 150 may
comprise GSM, CDMA, CDMA2000, WCDMA, GMS, GPRS, EDGE, WIMAX, WLAN,
3GPP, UMTS, BLUETOOTH, and ZigBee, for example.
[0042] The baseband processor 154 may comprise suitable logic,
circuitry, interface(s), and/or code that may be enabled to process
baseband signals for transmission via the transceiver 152 and/or
the baseband signals received from the transceiver 152. The
processor 156 may be any suitable processor or controller such as a
CPU, DSP, ARM, or any type of integrated circuit processor. The
processor 156 may comprise suitable logic, circuitry, and/or code
that may be enabled to control the operations of the transceiver
152 and/or the baseband processor 154. For example, the processor
156 may be utilized to update and/or modify programmable parameters
and/or values in a plurality of components, devices, and/or
processing elements in the transceiver 152 and/or the baseband
processor 154. At least a portion of the programmable parameters
may be stored in the system memory 158.
[0043] Control and/or data information, which may comprise the
programmable parameters, may be transferred from other portions of
the wireless device 150, not shown in FIG. 1, to the processor 156.
Similarly, the processor 156 may be enabled to transfer control
and/or data information, which may include the programmable
parameters, to other portions of the wireless device 150, not shown
in FIG. 1, which may be part of the wireless device 150.
[0044] The processor 156 may utilize the received control and/or
data information, which may comprise the programmable parameters,
to determine an operating mode of the transceiver 152. For example,
the processor 156 may be utilized to select a specific frequency
for a local oscillator, a specific gain for a variable gain
amplifier, configure the local oscillator and/or configure the
variable gain amplifier for operation in accordance with various
embodiments of the invention. Moreover, the specific frequency
selected and/or parameters needed to calculate the specific
frequency, and/or the specific gain value and/or the parameters,
which may be utilized to calculate the specific gain, may be stored
in the system memory 158 via the processor 156, for example. The
information stored in system memory 158 may be transferred to the
transceiver 152 from the system memory 158 via the processor
156.
[0045] The system memory 158 may comprise suitable logic,
circuitry, interface(s), and/or code that may be enabled to store a
plurality of control and/or data information, including parameters
needed to calculate frequencies and/or gain, and/or the frequency
value and/or gain value. The system memory 158 may store at least a
portion of the programmable parameters that may be manipulated by
the processor 156.
[0046] The logic block 160 may comprise suitable logic, circuitry,
interface(s), and/or code that may enable controlling of various
functionalities of the wireless device 150. For example, the logic
block 160 may comprise one or more state machines that may generate
signals to control the transceiver 152 and/or the baseband
processor 154. The logic block 160 may also comprise registers that
may hold data for controlling, for example, the transceiver 152
and/or the baseband processor 154. The logic block 160 may also
generate and/or store status information that may be read by, for
example, the processor 156. Amplifier gains and/or filtering
characteristics, for example, may be controlled by the logic block
160.
[0047] The BT radio/processor 163 may comprise suitable circuitry,
logic, interface(s), and/or code that may enable transmission and
reception of Bluetooth signals. The BT radio/processor 163 may
enable processing and/or handling of BT baseband signals. In this
regard, the BT radio/processor 163 may process or handle BT signals
received and/or BT signals transmitted via a wireless communication
medium. The BT radio/processor 163 may also provide control and/or
feedback information to/from the baseband processor 154 and/or the
processor 156, based on information from the processed BT signals.
The BT radio/processor 163 may communicate information and/or data
from the processed BT signals to the processor 156 and/or to the
system memory 158. Moreover, the BT radio/processor 163 may receive
information from the processor 156 and/or the system memory 158,
which may be processed and transmitted via the wireless
communication medium a Bluetooth headset, for example
[0048] The CODEC 172 may comprise suitable circuitry, logic,
interface(s), and/or code that may process audio signals received
from and/or communicated to input/output devices. The input devices
may be within or communicatively coupled to the wireless device
150, and may comprise the analog microphone 168, the stereo
speakers 170, the hearing aid compatible (HAC) coil 174, the dual
digital microphone 176, and the vibration transducer 178, for
example. The CODEC 172 may be operable to up-convert and/or
down-convert signal frequencies to desired frequencies for
processing and/or transmission via an output device. The CODEC 172
may enable utilizing a plurality of digital audio inputs, such as
16 or 18-bit inputs, for example. The CODEC 172 may also enable
utilizing a plurality of data sampling rate inputs. For example,
the CODEC 172 may accept digital audio signals at sampling rates
such as 8 kHz, 11.025 kHz, 12 kHz, 16 kHz, 22.05 kHz, 24 kHz, 32
kHz, 44.1 kHz, and/or 48 kHz. The CODEC 172 may also support mixing
of a plurality of audio sources. For example, the CODEC 172 may
support audio sources such as general audio, polyphonic ringer,
I.sup.2S FM audio, vibration driving signals, and voice. In this
regard, the general audio and polyphonic ringer sources may support
the plurality of sampling rates that the audio CODEC 172 is enabled
to accept, while the voice source may support a portion of the
plurality of sampling rates, such as 8 kHz and 16 kHz, for
example.
[0049] The chip 162 may comprise an integrated circuit with
multiple functional blocks integrated within, such as the
transceiver 152, the processor 156, the baseband processor 154, the
BT radio/processor 163, and the CODEC 172. The number of functional
blocks integrated in the chip 162 is not limited to the number
shown in FIG. 1. Accordingly, any number of blocks may be
integrated on the chip 162 depending on chip space and wireless
device 150 requirements, for example. The chip 162 may be flip-chip
bonded, for example, to the package 167, as described further with
respect to FIG. 8.
[0050] The leaky wave antennas 164 may comprise a resonant cavity
with a highly reflective surface and a lower reflectivity surface,
and may be integrated in and/or on the package 167. The lower
reflectivity surface may allow the resonant mode to "leak" out of
the cavity. The lower reflectivity surface of the leaky wave
antennas 164 may be configured with slots in a metal surface, or a
pattern of metal patches, as described further in FIGS. 2 and 3.
The physical dimensions of the leaky wave antennas 164 may be
configured to optimize bandwidth of transmission and/or the beam
pattern radiated. By integrating the leaky wave antennas 164 on the
package 167, the dimensions of the leaky wave antennas 164 may not
be limited by the size of the chip 162.
[0051] In an exemplary embodiment of the invention, the leaky wave
antennas 164 may comprise a plurality of leaky wave antennas
integrated in and/or on the package 167. The leaky wave antennas
164 may be operable to transmit and/or receive wireless signals at
or near 60 GHz, for example, due to the cavity length of the
devices being on the order of millimeters. The leaky wave antennas
164 may be configured to transmit at different frequencies by
integrating leaky wave antennas with different cavity height in the
package 167.
[0052] The switches 165 may comprise switches such as CMOS or MEMS
switches that may be operable to switch different antennas of the
leaky wave antennas 164 to the transceiver 152 and/or switch
elements in and/or out of the leaky wave antennas 164, such as the
patches and slots described in FIG. 3.
[0053] The external headset port 166 may comprise a physical
connection for an external headset to be communicatively coupled to
the wireless device 150. The analog microphone 168 may comprise
suitable circuitry, logic, interface(s), and/or code that may
detect sound waves and convert them to electrical signals via a
piezoelectric effect, for example. The electrical signals generated
by the analog microphone 168 may comprise analog signals that may
require analog to digital conversion before processing.
[0054] The package 167 may comprise a ceramic package, a printed
circuit board, or other support structure for the chip 162 and
other components of the wireless device 150. In this regard, the
chip 162 may be bonded to the package 167. The package 167 may
comprise insulating and conductive material, for example, and may
provide isolation between electrical components mounted on the
package 167.
[0055] The stereo speakers 170 may comprise a pair of speakers that
may be operable to generate audio signals from electrical signals
received from the CODEC 172. The HAC coil 174 may comprise suitable
circuitry, logic, and/or code that may enable communication between
the wireless device 150 and a T-coil in a hearing aid, for example.
In this manner, electrical audio signals may be communicated to a
user that utilizes a hearing aid, without the need for generating
sound signals via a speaker, such as the stereo speakers 170, and
converting the generated sound signals back to electrical signals
in a hearing aid, and subsequently back into amplified sound
signals in the user's ear, for example.
[0056] The dual digital microphone 176 may comprise suitable
circuitry, logic, interface(s), and/or code that may be operable to
detect sound waves and convert them to electrical signals. The
electrical signals generated by the dual digital microphone 176 may
comprise digital signals, and thus may not require analog to
digital conversion prior to digital processing in the CODEC 172.
The dual digital microphone 176 may enable beamforming
capabilities, for example.
[0057] The vibration transducer 178 may comprise suitable
circuitry, logic, interface(s), and/or code that may enable
notification of an incoming call, alerts and/or message to the
wireless device 150 without the use of sound. The vibration
transducer may generate vibrations that may be in synch with, for
example, audio signals such as speech or music.
[0058] In operation, control and/or data information, which may
comprise the programmable parameters, may be transferred from other
portions of the wireless device 150, not shown in FIG. 1, to the
processor 156. Similarly, the processor 156 may be enabled to
transfer control and/or data information, which may include the
programmable parameters, to other portions of the wireless device
150, not shown in FIG. 1, which may be part of the wireless device
150.
[0059] The processor 156 may utilize the received control and/or
data information, which may comprise the programmable parameters,
to determine an operating mode of the transceiver 152. For example,
the processor 156 may be utilized to select a specific frequency
for a local oscillator, a specific gain for a variable gain
amplifier, configure the local oscillator and/or configure the
variable gain amplifier for operation in accordance with various
embodiments of the invention. Moreover, the specific frequency
selected and/or parameters needed to calculate the specific
frequency, and/or the specific gain value and/or the parameters,
which may be utilized to calculate the specific gain, may be stored
in the system memory 158 via the processor 156, for example. The
information stored in system memory 158 may be transferred to the
transceiver 152 from the system memory 158 via the processor
156.
[0060] The CODEC 172 in the wireless device 150 may communicate
with the processor 156 in order to transfer audio data and control
signals. Control registers for the CODEC 172 may reside within the
processor 156. The processor 156 may exchange audio signals and
control information via the system memory 158. The CODEC 172 may
up-convert and/or down-convert the frequencies of multiple audio
sources for processing at a desired sampling rate.
[0061] The leaky wave antennas 164 may be operable to transmit
and/or receive wireless signals to and from the package 167,
respectively. Resonant cavities may be configured between
reflective surfaces in and/or on the package 167 so that signals
may be transmitted and/or received from any location on the package
167 without requiring large areas needed for conventional antennas
and associated circuitry.
[0062] The frequency of the transmission and/or reception may be
determined by the cavity height of the leaky wave antennas 164.
Accordingly, the reflective surfaces may be integrated at different
heights in the package, thereby configuring leaky wave antennas
with different resonant frequencies in the package 167.
[0063] In an exemplary embodiment of the invention, the resonant
cavity frequency of the leaky wave antennas 164 may be configured
by tuning the cavity height using MEMS actuation. Accordingly, a
bias voltage may be applied such that one or both of the reflective
surfaces of the leaky wave antennas 164 may be deflected by the
applied potential. In this manner, the cavity height, and thus the
resonant frequency of the cavity, may be configured. Similarly, the
patterns of slots and/or patches in the partially reflected surface
may be configured by the switches 165.
[0064] The leaky wave antennas 164 may be operable to transmit
and/or receive signals to and from the package 167. In this manner,
high frequency traces to an external antenna, such as the antenna
151, may be reduced and/or eliminated for higher frequency signals.
By communicating a signal to be transmitted from the chip 162 to
the leaky wave antennas 164 through bump bonds coupling the chip
162 to the package 167, high frequency traces may be further
reduced.
[0065] Different frequency signals may be transmitted and/or
received by the leaky wave antennas 164 by selectively coupling the
transceiver 152 to leaky wave antennas with different cavity
heights. For example, a leaky wave antenna with reflective surfaces
on the top and the bottom of the package 167 may have the largest
cavity height, and thus provide the lowest resonant frequency.
Conversely, a leaky wave antenna with a reflective surface on the
surface of the package 167 and another reflective surface just
below the surface of the package 167, may provide a higher resonant
frequency. The selective coupling may be enabled by the switches
165 and/or CMOS devices in the chip 162.
[0066] FIG. 2 is a block diagram illustrating an exemplary leaky
wave antenna, in accordance with an embodiment of the invention.
Referring to FIG. 2, there is shown the leaky wave antennas 164
comprising a partially reflective surface 201A, a reflective
surface 201B, and a feed point 203. The space between the partially
reflective surface 201A and the reflective surface 201B may be
filled with dielectric material, for example, and the height, h,
between the partially reflective surface 201A and the reflective
surface 201B may be utilized to configure the frequency of
transmission of the leaky wave antennas 164. In another embodiment
of the invention, an air gap may be integrated in the space between
the partially reflective surface 201A and the reflective surface
201B to enable MEMS actuation. There is also shown
(micro-electromechanical systems) MEMS bias voltages, +V.sub.MEMS
and -V.sub.MEMS.
[0067] The feed point 203 may comprise an input terminal for
applying an input voltage to the leaky wave antennas 164. The
invention is not limited to a single feed point 203, as there may
be any amount of feed points for different phases of signal or a
plurality of signal sources, for example, to be applied to the
leaky wave antennas 164.
[0068] In an embodiment of the invention, the height, h, may be
one-half the wavelength of the desired transmitted mode from the
leaky wave antennas 164. In this manner, the phase of an
electromagnetic mode that traverses the cavity twice may be
coherent with the input signal at the feed point 203, thereby
configuring a resonant cavity known as a Fabry-Perot cavity. The
magnitude of the resonant mode may decay exponentially in the
lateral direction from the feed point 203, thereby reducing or
eliminating the need for confinement structures to the sides of the
leaky wave antennas 164. The input impedance of the leaky wave
antennas 164 may be configured by the vertical placement of the
feed point 203, as described further in FIG. 6.
[0069] In operation, a signal to be transmitted via a power
amplifier in the transceiver 152 may be communicated to the feed
point 203 of the leaky wave antennas 164 with a frequency f. The
cavity height, h, may be configured to correlate to one half the
wavelength of a harmonic of the signal of frequency f. The signal
may traverse the height of the cavity and may be reflected by the
partially reflective surface 201A, and then traverse the height
back to the reflective surface 201B. Since the wave will have
travelled a distance corresponding to a full wavelength,
constructive interference may result and a resonant mode may
thereby be established.
[0070] Leaky wave antennas may enable the configuration of high
gain antennas without the need for a large array of antennas which
require a complex feed network and suffer from loss due to feed
lines. The leaky wave antennas 164 may be operable to transmit
and/or receive wireless signals via conductive layers in and/or on
the package 167. In this manner, the resonant frequency of the
cavity may cover a wider range due to the larger size of the
package 167, compared to the chip 162, without requiring large
areas needed for conventional antennas and associated
circuitry.
[0071] In an exemplary embodiment of the invention, the frequency
of transmission and/or reception of the leaky wave antennas 164 may
be configured by selecting one of the leaky wave antennas 164 with
the appropriate cavity height for the desired frequency.
[0072] In another embodiment of the invention, the cavity height,
h, may be configured by MEMS actuation. For example, the bias
voltages +V.sub.MEMS and -V.sub.MEMS may deflect one or both of the
reflective surfaces 201A and 201B compared to zero bias, thereby
configuring the resonant frequency of the cavity.
[0073] FIG. 3 is a block diagram illustrating a plan view of
exemplary partially reflective surfaces, in accordance with an
embodiment of the invention. Referring to FIG. 3, there is shown a
partially reflective surface 300 comprising periodic slots in a
metal surface, and a partially reflective surface 320 comprising
periodic metal patches. The partially reflective surfaces 300/320
may comprise different embodiments of the partially reflective
surface 201A described with respect to FIG. 2.
[0074] The spacing, dimensions, shape, and orientation of the slots
and/or patches in the partially reflective surfaces 300/320 may be
utilized to configure the bandwidth, and thus Q-factor, of the
resonant cavity defined by the partially reflective surfaces
300/320 and a reflective surface, such as the reflective surface
201B, described with respect to FIG. 2. The partially reflective
surfaces 300/320 may thus comprise frequency selective surfaces due
to the narrow bandwidth of signals that may leak out of the
structure as configured by the slots and/or patches.
[0075] The spacing between the patches and/or slots may be related
to wavelength of the signal transmitted and/or received, which may
be somewhat similar to beamforming with multiple antennas. The
length of the slots and/or patches may be several times larger than
the wavelength of the transmitted and/or received signal or less,
for example, since the leakage from the slots and/or regions
surround the patches may add up, similar to beamforming with
multiple antennas.
[0076] In an embodiment of the invention, the slots/patches may be
configured via CMOS and/or micro-electromechanical system (MEMS)
switches, such as the switches 165 described with respect to FIG.
1, to tune the Q of the resonant cavity. The slots and/or patches
may be configured in conductive layers in and/or on the package 167
and may be shorted together or switched open utilizing the switches
165. In this manner, RF signals, such as 60 GHz signals, for
example, may be transmitted from various locations without the need
for additional circuitry and conventional antennas with their
associated circuitry that require valuable chip space.
[0077] In another embodiment of the invention, the slots or patches
may be configured in conductive layers in a vertical plane of the
chip 162, the package 167, and/or the printed circuit board 171,
thereby enabling the communication of wireless signals in a
horizontal direction in the structure.
[0078] In another embodiment of the invention, the partially
reflective surfaces 300/320 may be integrated in and/or on the
package 167. In this manner, different frequency signal may be
transmitted and/or received. Accordingly, a partially reflective
surface 300/320 integrated within the package 167 and a reflective
surface 201B may transmit and/or receive signals at a higher
frequency signal than from a resonant cavity defined by a partially
reflective surface 300/320 on surface of the package 167 and a
reflective surface 201B on the other surface of the package
167.
[0079] FIG. 4 is a block diagram illustrating an exemplary phase
dependence of a leaky wave antenna, in accordance with an
embodiment of the invention. Referring to FIG. 4, there is shown a
leaky wave antenna comprising the partially reflective surface
201A, the reflective surface 201B, and the feed point 203. In-phase
condition 400 illustrates the relative beam shape transmitted by
the leaky wave antenna 164 when the frequency of the signal
communicated to the feed point 203 matches that of the resonant
cavity as defined by the cavity height, h, and the dielectric
constant of the material between the reflective surfaces.
[0080] Similarly, out-of-phase condition 420 illustrates the
relative beam shape transmitted by the leaky wave antenna 164 when
the frequency of the signal communicated to the feed point 203 does
not match that of the resonant cavity. The resulting beam shape may
be conical, as opposed to a single main vertical node. These are
illustrated further with respect to FIG. 5. The leaky wave antennas
164 may be integrated at various heights in the package 167,
thereby providing a plurality of transmission and reception sites
in the package 167 with varying resonant frequency.
[0081] By configuring the leaky wave antennas for in-phase and
out-of-phase conditions, signals possessing different
characteristics may be directed out of the package 167 in desired
directions. In an exemplary embodiment of the invention, the angle
at which signals may be transmitted by a leaky wave antenna may be
dynamically controlled so that signal may be directed to desired
receiving leaky wave antennas. In another embodiment of the
invention, the leaky wave antennas 164 may be operable to receive
RF signals, such as 60 GHz signals, for example. The direction in
which the signals are received may be configured by the in-phase
and out-of-phase conditions.
[0082] FIG. 5 is a block diagram illustrating exemplary in-phase
and out-of-phase beam shapes for a leaky wave antenna, in
accordance with an embodiment of the invention. Referring to FIG.
5, there is shown a plot 500 of transmitted signal beam shape
versus angle, .THETA., for the in-phase and out-of-phase conditions
for a leaky wave antenna.
[0083] The In-phase curve in the plot 500 may correlate to the case
where the frequency of the signal communicated to a leaky wave
antenna matches the resonant frequency of the cavity. In this
manner, a single vertical main node may result. In instances where
the frequency of the signal at the feed point is not at the
resonant frequency, a double, or conical-shaped node may be
generated as shown by the Out-of-phase curve in the plot 500. By
configuring the leaky wave antennas for in-phase and out-of-phase
conditions, signals may be directed out of the chip 162, the
package 167, and/or the printed circuit board 171 in desired
directions. p In another embodiment of the invention, the leaky
wave antennas 164 may be operable to receive wireless signals, and
may be configured to receive from a desired direction via the
in-phase and out-of-phase configurations.
[0084] FIG. 6 is a block diagram illustrating a leaky wave antenna
with variable input impedance feed points, in accordance with an
embodiment of the invention. Referring to FIG. 6, there is shown a
leaky wave antenna 600 comprising the partially reflective surface
201A and the reflective surface 201B. There is also shown feed
points 601A-601C. The feed points 601A-601C may be located at
different positions along the height, h, of the cavity thereby
configuring different impedance points for the leaky wave
antenna.
[0085] In this manner, a leaky wave antenna may be utilized to
couple to a plurality of power amplifiers, low-noise amplifiers,
and/or other circuitry with varying output or input impedances.
Similarly, by integrating leaky wave antennas in conductive layers
in the package 167, the impedance of the leaky wave antenna may be
matched to the power amplifier or low-noise amplifier without
impedance variations that may result with conventional antennas and
their proximity or distance to associated driver electronics.
Similarly, by integrating reflective and partially reflective
surfaces with varying cavity heights and varying feed points, leaky
wave antennas with different impedances and resonant frequencies
may be enabled.
[0086] FIG. 7 is a block diagram illustrating a cross-sectional
view of coplanar and microstrip waveguide, in accordance with an
embodiment of the invention. Referring to FIG. 7, there is shown a
microstrip waveguide 720 and a coplanar waveguide 730. The
microstrip waveguide 720 may comprise signal conductive lines 723,
a ground plane 725, a gap 711A, an insulating layer 727 and a
substrate 729. The coplanar waveguide 730 may comprise signal
conductive lines 731 and 733, a gap 711B, the insulating layer 727,
and the package 167.
[0087] The signal conductive lines 723, 731, and 733 may comprise
metal traces deposited in and/or on the insulating layer 727. In
another embodiment of the invention, the signal conductive lines
723, 731, and 733 may comprise poly-silicon or other conductive
material. The separation and the voltage potential between the
signal conductive line 723 and the ground plane 725 may determine
the electric field generated therein. In addition, the dielectric
constant of the insulating layer 727 may also determine the
electric field between the signal conductive line 723 and the
ground plane 725.
[0088] The insulating layer 727 may comprise SiO.sub.2 or other
insulating material that may provide a high resistance layer
between the signal conductive line 723 and the ground plane 725. In
addition, the electric field between the signal conductive line 723
and the ground plane 725 is dependent on the dielectric constant of
the insulating layer 727.
[0089] The thickness and the dielectric constant of the insulating
layer 727 may determine the electric field strength generated by
the applied signal. The resonant cavity thickness of a leaky wave
antenna may be dependent on the spacing between the signal
conductive line 723 and the ground plane 725, or the signal
conductive lines 731 and 733, for example. In an exemplary
embodiment of the invention, the insulating layer 727 may be
removed in localized regions in the microstrip waveguide 720 and
the coplanar waveguide 730 to configure the gaps 711A and 711B,
thereby allowing for MEMS deflection of the conductive layers and
configuring of the height of the resonant cavity.
[0090] The signal conductive lines 731 and 733, and the signal
conductive line 723 and the ground plane 725 may define resonant
cavities for leaky wave antennas. Each layer may comprise a
reflective surface or a partially reflective surface depending on
the pattern of conductive material. For example, a partially
reflective surface may be configured by alternating conductive and
insulating material in a 1-dimensional or 2-dimensional pattern. In
this manner, signals may be directed out of, or received into, a
surface of the package 167, as illustrated with the microstrip
waveguide 720. In another embodiment of the invention, signals may
be communicated in the horizontal plane of the package 167
utilizing the coplanar waveguide 730.
[0091] The package 167 may provide mechanical support for the
microstrip waveguide 720, the coplanar waveguide 730, and other
devices that may be integrated within as well as to the chip 162
bonded to the package 167. In another embodiment of the invention,
the package 167 may comprise Si, GaAs, sapphire, InP, GaO, ZnO,
CdTe, CdZnTe, ceramics, polytetrafluoroethylene, and/or
Al.sub.2O.sub.3, for example, or any other substrate material that
may be suitable for integrating microstrip structures.
[0092] In operation, a bias and/or a signal voltage may be applied
across the signal conductive line 723 and the ground plane 725,
and/or the signal conductive lines 731 and 733. The thickness of a
leaky wave antenna resonant cavity may be dependent on the distance
between the conductive lines in the microstrip waveguide 720 and/or
the coplanar transmission waveguide 730.
[0093] In addition to DC bias, ground, and/or digital signals
communicated electrically by the microstrip waveguide 720 and/or
the coplanar waveguide 730, a high frequency signal to be
transmitted or received, such as a 60 GHz RF signal, may be
communicated to or from the signal conductive lines 723, 731, and
733, and the ground plane 725. The signal to be communicated
electrically may be at a frequency that is lower than the resonant
frequency of the cavity formed in the microstrip waveguide 720
and/or the coplanar waveguide 730. In this manner, the conductive
lines on the package 167 may transmit and/or receive 60 GHz signals
as well as supply DC bias, JTAG signals, and/or communicate lower
frequency digital signals, for example.
[0094] FIG. 8 is a diagram illustrating a cross-sectional view of
an integrated circuit package with integrated leaky wave antennas,
in accordance with an embodiment of the invention. Referring to
FIG. 8, there is shown the package 167, metal layers 801A-801F,
solder balls 803, an insulating layer 805, and thermal epoxy 807.
The chip 162 and the printed circuit board 171 may be as described
previously.
[0095] The chip 162, or integrated circuit, may comprise one or
more components and/or systems within the wireless system 150. The
chip 162 may be bump-bonded or flip-chip bonded to the package 167
utilizing the solder balls 803. In this manner, wire bonds
connecting the chip 162 to the package 167 may be eliminated,
thereby reducing and/or eliminating uncontrollable stray
inductances due to wire bonds, for example. In addition, the
thermal conductance out of the chip 162 may be greatly improved
utilizing the solder balls 803 and the thermal epoxy 807. The
thermal epoxy 807 may be electrically insulating but thermally
conductive to allow for thermal energy to be conducted out of the
chip 162 to the much larger thermal mass of the package 167.
[0096] The metal layers 801A-801F may comprise deposited metal
layers utilized to delineate leaky wave antennas in and/or on the
package 167. The metal layers 801A-801F may be utilized to
communicate signals between regions of the chip 162 to external
devices via leaky wave antennas integrated in and/or on the package
167. In an embodiment of the invention, the spacing between pairs
of metal layers, for example 801A and 801B, 801C and 801D, and 801E
and 801F, may define a resonant cavity of a leaky wave antenna with
cavity heights h.sub.1, h.sub.2, and h.sub.3. In this regard, a
partially reflective surface, as shown in FIGS. 2 and 3, for
example, may enable the resonant electromagnetic mode in the cavity
to leak out from that surface. In this manner, leaky wave antennas
may be operable to communicate wireless signals to and/or from the
chip 162, the package 167, and/or the printed circuit board 171,
and/or to external devices.
[0097] The metal layers 801A-801F may comprise a coplanar and/or a
microstrip structure as described with respect to FIG. 7. The
insulating layer 805 may comprise a layer of resistive material
that may provide electrical isolation between the metal layers 801A
and other layers and/or devices in the package 167.
[0098] The number of metal layers are not limited to the number of
metal layers 801A-801F shown in FIG. 8. Accordingly, there may be
any number of layers embedded within and/or on the package 167,
depending on the number of leaky wave antennas, traces, waveguides
and other devices fabricated within and/or on the package 167.
[0099] The solder balls 803 may comprise spherical balls of metal
to provide electrical, thermal and physical contact between the
chip 162, the package 167, and/or the printed circuit board 171. In
making the contact with the solder balls 803, the chip 162 and/or
the package 167 may be pressed with enough force to squash the
metal spheres somewhat, and may be performed at an elevated
temperature to provide suitable electrical resistance and physical
bond strength. The thermal epoxy 807 may fill the volume between
the solder balls 803 and may provide a high thermal conductance
path for heat transfer out of the chip 162.
[0100] In operation, the chip 162 may comprise an RF front end,
such as the RF transceiver 152, described with respect to FIG. 1,
and may be utilized to transmit and/or receive RF signals, at 60
GHz, for example. The chip 162 may be electrically coupled to the
package 167. In instances where high frequency signals, 60 GHz or
greater, for example, may be communicated from blocks or sections
in the chip 162, leaky wave antennas may be utilized. Accordingly,
the leaky wave antennas comprising the metal layers 801A-801F
integrated on or within the package 167 may be enabled to
communicate signals from regions or sections within the chip
162.
[0101] Heat from the chip 162 may be conducted to the package 167
via the thermal epoxy 807 and the solder balls 803. In an
embodiment of the invention, the metal layers 801A-801F may be
configured at different heights in the package 167 enabling the
configuration of leaky wave antennas with different resonant
frequencies.
[0102] The leaky wave antennas comprising the metal layers
801A-801F may be configured by adjusting the spacing between the
pairs of metal layers comprising a resonant cavity, and may be
configurable via MEMS actuation, as described with respect to FIG.
2. Accordingly, the cavity height of a leaky wave antenna may be
defined by a MEMS switch such that applying a bias may increase or
decrease the spacing, thereby further configuring the resonant
frequency of the leaky wave antenna. In addition, the slots and/or
patches in the metal layer comprising a partially reflective
surface for the leaky wave antenna, may be configured via one or
more switches, which may alter the Q-factor of the cavity. In this
manner, the communication parameters of leaky wave antennas
integrated into the package 167 may be configured for a plurality
of applications.
[0103] The integration of leaky wave antennas in the package 167,
may result in the reduction of stray impedances when compared to
wire-bonded connections to devices on printed circuit boards as in
conventional systems, particularly for higher frequencies, such as
60 GHz. In this manner, volume requirements may be reduced and
performance may be improved due to lower losses and accurate
control of impedances via switches in the chip 162 or on the
package 167, for example.
[0104] FIG. 9 is a block diagram illustrating exemplary steps for
communicating via leaky wave antennas integrated in metal layers on
a package, in accordance with an embodiment of the invention.
Referring to FIG. 9, in step 903 after start step 901, one or more
leaky wave antennas integrated in metal layers on a package may be
configured for a desired frequency via MEMS deflection or by
selection of a leaky wave with an appropriate cavity height in the
package, for example, or may adjust the Q of the cavity via
shorting and/or opening slots or patches in the partially
reflective surface. In step 905, high frequency signals may be
communicated to the leaky wave antennas via the traces in the
package and bump bonds that couple the chip to the package. In step
907, the high frequency signals may be transmitted. In step 909, in
instances where the wireless device 150 is to be powered down, the
exemplary steps may proceed to end step 911. In step 909, in
instances where the wireless device 150 is not to be powered down,
the exemplary steps may proceed to step 903 to configure the leaky
wave antenna at a desired frequency.
[0105] In an embodiment of the invention, a method and system are
disclosed for communicating RF signals using one or more leaky wave
antennas 164, 400, 420, and/or 600 in a wireless device 150. The
leaky wave antennas 164, 400, 420, and/or 600 may be integrated in
metal layers 801A-801F in an integrated circuit package 167, and a
resonant frequency of the leaky wave antennas 164, 400, 420, and/or
600 may be configured dependent on one or more cavity heights
h.sub.1, h.sub.2, and h.sub.3 associated with the metal layers
801A-801F. At least a portion of the one or more cavity heights
h.sub.1, h.sub.2, and h.sub.3 may be configured utilizing
micro-electro-mechanical systems (MEMS) deflection. The RF signals
may comprise 60 GHz signals. The leaky wave antennas 164, 400, 420,
and/or 600 may comprise microstrip waveguides 720 where a cavity
height of the leaky wave antennas may be dependent on a spacing
between conductive lines 723 and 725 in the microstrip waveguides
720. The leaky wave antennas 164, 400, 420, and/or 600 may comprise
coplanar waveguides 730 where a cavity height of the leaky wave
antennas 164, 400, 420, and/or 600 may be dependent on a spacing
between conductive lines 731 and 733 in the coplanar waveguides
730. The leaky wave antennas 164, 400, 420, and/or 600 may be
configured to transmit the wireless signals at a desired angle from
a surface of the package 167. The integrated circuit package 167
may be affixed to a printed circuit board 171, and an integrated
circuit 162 may be flip-chip-bonded to the integrated circuit
package 167.
[0106] Another embodiment of the invention may provide a machine
and/or computer readable storage and/or medium, having stored
thereon, a machine code and/or a computer program having at least
one code section executable by a machine and/or a computer, thereby
causing the machine and/or computer to perform the steps as
described herein for a leaky wave antenna on an integrated circuit
package.
[0107] Accordingly, aspects of the invention may be realized in
hardware, software, firmware or a combination thereof. The
invention may be realized in a centralized fashion in at least one
computer system or in a distributed fashion where different
elements are spread across several interconnected computer systems.
Any kind of computer system or other apparatus adapted for carrying
out the methods described herein is suited. A typical combination
of hardware, software and firmware may be a general-purpose
computer system with a computer program that, when being loaded and
executed, controls the computer system such that it carries out the
methods described herein.
[0108] One embodiment of the present invention may be implemented
as a board level product, as a single chip, application specific
integrated circuit (ASIC), or with varying levels integrated on a
single chip with other portions of the system as separate
components. The degree of integration of the system will primarily
be determined by speed and cost considerations. Because of the
sophisticated nature of modern processors, it is possible to
utilize a commercially available processor, which may be
implemented external to an ASIC implementation of the present
system. Alternatively, if the processor is available as an ASIC
core or logic block, then the commercially available processor may
be implemented as part of an ASIC device with various functions
implemented as firmware.
[0109] The present invention may also be embedded in a computer
program product, which comprises all the features enabling the
implementation of the methods described herein, and which when
loaded in a computer system is able to carry out these methods.
Computer program in the present context may mean, for example, any
expression, in any language, code or notation, of a set of
instructions intended to cause a system having an information
processing capability to perform a particular function either
directly or after either or both of the following: a) conversion to
another language, code or notation; b) reproduction in a different
material form. However, other meanings of computer program within
the understanding of those skilled in the art are also contemplated
by the present invention.
[0110] While the invention has been described with reference to
certain embodiments, it will be understood by those skilled in the
art that various changes may be made and equivalents may be
substituted without departing from the scope of the present
invention. In addition, many modifications may be made to adapt a
particular situation or material to the teachings of the present
invention without departing from its scope. Therefore, it is
intended that the present invention not be limited to the
particular embodiments disclosed, but that the present invention
will include all embodiments falling within the scope of the
appended claims.
* * * * *