U.S. patent application number 12/455025 was filed with the patent office on 2010-12-02 for system and method of operating an electrical energy storage device or an electrochemical energy generation device using microchannels and high thermal conductivity materials.
This patent application is currently assigned to Searete LLC, a limited liability corporation of the State of Delaware. Invention is credited to Alistair K. Chan, Roderick A. Hyde, Jordin T. Kare, Lowell L. Wood, JR..
Application Number | 20100304257 12/455025 |
Document ID | / |
Family ID | 43220620 |
Filed Date | 2010-12-02 |
United States Patent
Application |
20100304257 |
Kind Code |
A1 |
Chan; Alistair K. ; et
al. |
December 2, 2010 |
System and method of operating an electrical energy storage device
or an electrochemical energy generation device using microchannels
and high thermal conductivity materials
Abstract
A method is generally described which includes operating an
electrical electrochemical energy generation device or an
electrochemical energy generation device. The method includes
providing a housing having an external surface and an internal
surface. The method also includes coupling at least one component
within the housing. At least one component is configured to
generate electrical energy in combination with other components,
chemicals, or materials residing within the housing. The method
includes forming a plurality of microchannels coupled to at least
one of the internal surface of the housing or the at least one
internal components. At least one microchannel is at least
partially formed of a high thermal conductivity material. The high
thermal conductivity material has a high k-value, the high k-value
is greater than approximately 410 W/(m*K). The method further
includes providing a thermal sink coupled to the microchannels. The
thermal sink is configured to transfer heat energy to or from the
microchannels. Further, the method includes flowing a fluid through
the microchannels.
Inventors: |
Chan; Alistair K.;
(Bainbridge Island, WA) ; Hyde; Roderick A.;
(Redmond, WA) ; Kare; Jordin T.; (Seattle, WA)
; Wood, JR.; Lowell L.; (Bellevue, WA) |
Correspondence
Address: |
THE INVENTION SCIENCE FUND;CLARENCE T. TEGREENE
11235 SE 6TH STREET, SUITE 200
BELLEVUE
WA
98004
US
|
Assignee: |
Searete LLC, a limited liability
corporation of the State of Delaware
|
Family ID: |
43220620 |
Appl. No.: |
12/455025 |
Filed: |
May 26, 2009 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
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12455034 |
May 26, 2009 |
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12455025 |
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12455020 |
May 26, 2009 |
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12455034 |
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12455031 |
May 26, 2009 |
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12455020 |
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12455036 |
May 26, 2009 |
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12455031 |
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12455015 |
May 26, 2009 |
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12455036 |
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12455019 |
May 26, 2009 |
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12455015 |
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12455023 |
May 26, 2009 |
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12455019 |
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12455037 |
May 26, 2009 |
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12455023 |
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12455016 |
May 26, 2009 |
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12455037 |
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Current U.S.
Class: |
429/433 ;
429/120; 429/472; 429/479; 429/50; 429/72 |
Current CPC
Class: |
H01M 8/0267 20130101;
H01M 10/6551 20150401; F28D 2015/0225 20130101; F28F 2260/02
20130101; Y02E 60/10 20130101; H01M 8/2475 20130101; Y02E 60/13
20130101; F28F 3/12 20130101; H01M 8/04074 20130101; H01M 8/04365
20130101; H01G 9/0003 20130101; F28F 21/02 20130101; H01M 8/04007
20130101; H01M 8/04559 20130101; H01M 10/656 20150401; H01G 9/08
20130101; H01M 8/04731 20130101; H01M 10/633 20150401; H02J 7/0029
20130101; Y02T 10/70 20130101; F28D 15/00 20130101; H01M 8/04589
20130101; H01M 10/623 20150401; H05K 7/20254 20130101; H01M 8/0258
20130101; H01M 10/613 20150401; H01M 8/04701 20130101; H01M 10/625
20150401; H01M 10/63 20150401; F28F 3/048 20130101; H01M 50/10
20210101; H01M 10/425 20130101; H01M 8/0432 20130101; F28D
2021/0029 20130101; H01G 2/08 20130101; H01G 11/18 20130101; H01M
10/6562 20150401; H01M 10/615 20150401; H01M 10/6567 20150401; H01M
8/04029 20130101; H01M 16/003 20130101; H01G 9/155 20130101; H01M
10/654 20150401; H01M 16/006 20130101; F28F 2013/006 20130101; H01M
4/02 20130101; H01M 4/86 20130101; H01M 10/647 20150401; Y02E 60/50
20130101 |
Class at
Publication: |
429/433 ;
429/120; 429/72; 429/50; 429/472; 429/479 |
International
Class: |
H01M 8/04 20060101
H01M008/04; H01M 10/50 20060101 H01M010/50; H01M 2/00 20060101
H01M002/00 |
Claims
1. An electrical electrochemical energy generation device or an
electrochemical energy generation device, comprising: a housing
having an external surface and an internal surface; at least one
component within the housing, at least one component being
configured to generate electrical energy in combination with at
least one of other components, chemicals, or materials residing
within the housing; a plurality of microchannels coupled to at
least one of the internal surface of the housing or the at least
one internal components, at least one microchannel at least
partially formed of a high thermal conductivity material; and a
thermal sink coupled to the micro-channels, the thermal sink being
configured to transfer heat energy to or from the microchannel
surfaces via the fluid flowing through the microchannels.
2. The electrical electrochemical energy generation device or the
electrochemical energy generation device of claim 1, wherein the
microchannels are formed in a portion of a wall of the housing.
3. The electrical electrochemical energy generation device or the
electrochemical energy generation device of claim 1, wherein the
microchannels are formed in a portion of at least one
component.
4. The electrical electrochemical energy generation device or the
electrochemical energy generation device of claim 1, wherein the
microchannels are formed in a portion of at least one component and
at least one component includes a cathode.
5. The electrical electrochemical energy generation device or the
electrochemical energy generation device of claim 1, wherein the
microchannels are formed in a portion of at least one component and
at least one component includes an anode.
6. The electrical electrochemical energy generation device or the
electrochemical energy generation device of claim 1, wherein the
microchannels are formed in the material including a portion of at
least one component and at least one component includes a catalyst
material.
7. The electrical electrochemical energy generation device or the
electrochemical energy generation device of claim 1, wherein the
microchannels are formed in the material including a portion of at
least one component and at least one component includes a solid
electrolyte material.
8. The electrical electrochemical energy generation device or the
electrochemical energy generation device of claim 1, wherein the
microchannels are formed in a portion of at least one component and
at least one component includes an electrical contact.
9. The electrical electrochemical energy generation device or the
electrochemical energy generation device of claim 1, wherein the
microchannels are formed at least partially in a portion of at
least one component and at least one component includes a current
carrying conductor.
10. The electrical electrochemical energy generation device or the
electrochemical energy generation device of claim 1, wherein the
microchannels are formed at least partially in a portion of at
least one component and at least one component includes a
dielectric.
11. The electrical electrochemical energy generation device or the
electrochemical energy generation device of claim 1, wherein the
microchannels are formed integrally on the internal surface of the
housing.
12. The electrical electrochemical energy generation device or the
electrochemical energy generation device of claim 1, wherein the
microchannels are formed integrally on a surface of at least one
component.
13. The electrical electrochemical energy generation device or the
electrochemical energy generation device of claim 1, wherein the
microchannels are configured to induce laminar flow of the fluid
through at least a portion of the microchannels.
14. The electrical electrochemical energy generation device or the
electrochemical energy generation device of claim 1, wherein at
least one component includes a thermal control component, and the
thermal control component is disposed within the housing.
15. The electrical electrochemical energy generation device or the
electrochemical energy generation device of claim 1, wherein the
fluid includes air.
16. The electrical electrochemical energy generation device or the
electrochemical energy generation device of claim 1, wherein the
fluid includes a gas.
17. The electrical electrochemical energy generation device or the
electrochemical energy generation device of claim 1, wherein the
fluid includes water.
18. The electrical electrochemical energy generation device or the
electrochemical energy generation device of claim 1, wherein the
fluid includes antifreeze.
19. The electrical electrochemical energy generation device or the
electrochemical energy generation device of claim 1, wherein the
fluid includes molten salt.
20. The electrical electrochemical energy generation device or the
electrochemical energy generation device of claim 1, wherein the
fluid includes molten metal.
21. The electrical electrochemical energy generation device or the
electrochemical energy generation device of claim 1, wherein the
fluid includes micro-particles.
22. The electrical electrochemical energy generation device or the
electrochemical energy generation device of claim 1, wherein the
fluid includes a phase change material.
23. The electrical electrochemical energy generation device or the
electrochemical energy generation device of claim 1, wherein the
fluid includes liquid droplets.
24. The electrical electrochemical energy generation device or the
electrochemical energy generation device of claim 1, wherein the
fluid includes solid particles.
25. The electrical electrochemical energy generation device or the
electrochemical energy generation device of claim 1, wherein the
fluid is at least partially circulated by a pump.
26. The electrical electrochemical energy generation device or the
electrochemical energy generation device of claim 1, wherein the
fluid is at least partially circulated by a mechanical pump.
27. The electrical electrochemical energy generation device or the
electrochemical energy generation device of claim 1, wherein the
fluid is at least partially circulated by an electromagnetic (MHD)
pump.
28. The electrical electrochemical energy generation device or the
electrochemical energy generation device of claim 1, wherein the
fluid is at least partially circulated by an electro osmotic
pump.
29. The electrical electrochemical energy generation device or the
electrochemical energy generation device of claim 1, wherein the
fluid is at least partially circulated by convection.
30. The electrical electrochemical energy generation device or the
electrochemical energy generation device of claim 1, wherein the
fluid is at least partially circulated by electroosmosis.
31. The electrical electrochemical energy generation device or the
electrochemical energy generation device of claim 1, wherein the
electrical electrochemical energy generation device includes one or
more electrochemical cells.
32. The electrical electrochemical energy generation device or the
electrochemical energy generation device of claim 1, wherein the
electrical electrochemical energy generation device includes one or
more capacitive storage device.
33-54. (canceled)
55. A method of thermal control of an electrical electrochemical
energy generation device or an electrochemical energy generation
device, comprising: providing a housing having an external surface
and an internal surface; coupling at least one component within the
housing, at least one component being configured to generate
electrical energy in combination with other components, chemicals,
or materials residing within the housing; forming a plurality of
microchannels coupled to at least one of the internal surface of
the housing or the at least one internal components, at least one
microchannel at least partially formed of a high thermal
conductivity material; providing a thermal sink coupled to the
microchannels, the thermal sink being configured to transfer heat
energy to or from the microchannel; and flowing a fluid through the
microchannels.
56. The method of claim 55, wherein the microchannels are formed in
a portion of a wall of the housing.
57. The method of claim 55, wherein the microchannels are formed in
a portion of at least one component.
58. The method of claim 55, wherein the microchannels are formed in
a portion of at least one component and at least one component
includes a cathode.
59. The method of claim 55, wherein the microchannels are formed in
a portion of at least one component and at least one component
includes an anode.
60. The method of claim 55, wherein the microchannels are formed in
the material including a portion of at least one component and at
least one component includes a catalyst material.
61. The method of claim 55, wherein the microchannels are formed in
the material including a portion of at least one component and at
least one component includes a solid electrolyte material.
62. The method of claim 55, wherein the microchannels are formed in
a portion of at least one component and at least one component
includes an electrical contact.
63. The method of claim 55, wherein the microchannels are formed in
a portion of at least one component and at least one component
includes a current carrying conductor.
64. The method of claim 55, wherein the microchannels are formed in
a portion of at least one component and at least one component
includes a dielectric.
65. The method of claim 55, wherein the microchannels are formed at
least partially integrally on the internal surface of the
housing.
66. The method of claim 55, wherein the microchannels are formed at
least partially integrally on a surface of at least one
component.
67. The method of claim 55, wherein the microchannels are
configured to induce laminar flow of the fluid through at least a
portion of the microchannels.
68. The method of claim 55, wherein at least one component includes
a thermal control component, and the thermal control component is
disposed within the housing.
69-94. (canceled)
95. The method of claim 55, wherein the electrical electrochemical
energy generation device or the electrochemical energy generation
device includes a fuel cell and the microchannels are formed in a
portion of at least one component and at least one component
includes an electrode.
96. The method of claim 55, wherein the electrical electrochemical
energy generation device or the electrochemical energy generation
device includes a fuel cell and the microchannels are formed in a
portion of at least one component and at least one component
includes a bipolar structure.
97. The method of claim 55, wherein the electrical electrochemical
energy generation device or the electrochemical energy generation
device includes a fuel cell and the microchannels are formed in a
portion of at least one component and at least one component
includes a solid electrolyte.
98. The method of claim 55, wherein the high thermal conductivity
material is disposed adjacent a portion of a wall of a housing of
the electrical electrochemical energy generation device or the
electrochemical energy generation device.
99. The method of claim 55, wherein the high thermal conductivity
material is disposed adjacent a portion of at least one internal
component of the electrical electrochemical energy generation
device or the electrochemical energy generation device.
100. The method of claim 55, wherein the high thermal conductivity
material is disposed adjacent a portion of at least one internal
component of the electrical electrochemical energy generation
device or the electrochemical energy generation device and the at
least one internal component includes a cathode.
101. The method of claim 55, wherein the high thermal conductivity
material is disposed adjacent a portion of at least one internal
component of the electrical electrochemical energy generation
device or the electrochemical energy generation device and the at
least one internal component includes an anode.
102. The method of claim 55, wherein the high thermal conductivity
material is disposed adjacent the material including a portion of
at least one internal component of the electrical electrochemical
energy generation device or the electrochemical energy generation
device and at least one component includes a catalyst material.
103. The method of claim 55, wherein the high thermal conductivity
material is disposed adjacent the material including a portion of
at least one internal component of the electrical electrochemical
energy generation device or the electrochemical energy generation
device and at least one component includes a solid electrolyte
material.
104. The method of claim 55, wherein the high thermal conductivity
material is disposed adjacent a portion of at least one internal
component of the electrical electrochemical energy generation
device or the electrochemical energy generation device and the at
least one internal component includes an electrical contact.
105. The method of claim 55, wherein the high thermal conductivity
material is disposed adjacent a portion of at least one internal
component of the electrical electrochemical energy generation
device or the electrochemical energy generation device and the at
least one internal component includes a current carrying
conductor.
106. The method of claim 55, wherein the high thermal conductivity
material is disposed adjacent a portion of at least one internal
component of the electrical electrochemical energy generation
device or the electrochemical energy generation device and the at
least one internal component includes a dielectric.
107. The method of claim 55, wherein the high thermal conductivity
material is disposed adjacent an internal surface of a housing of
the electrical electrochemical energy generation device or the
electrochemical energy generation device.
108. (canceled)
Description
CROSS-REFERENCE TO RELATED APPLICATIONS
[0001] The present application is related to and claims the benefit
of the earliest available effective filing date(s) from the
following listed application(s) (the "Related Applications") (e.g.,
claims earliest available priority dates for other than provisional
patent applications or claims benefits under 35 USC .sctn.119(e)
for provisional patent applications, for any and all parent,
grandparent, great-grandparent, etc. applications of the Related
Application(s)).
Related Applications:
[0002] For purposes of the USPTO extra-statutory requirements, the
present application constitutes a continuation-in-part of U.S.
patent application Ser. No. UNKNOWN, entitled SYSTEM AND METHOD OF
ALTERING TEMPERATURE OF AN ELECTRICAL ENERGY STORAGE DEVICE OR AN
ELECTROCHEMICAL ENERGY GENERATION DEVICE USING MICROCHANNELS,
naming Alistair K. Chan, Roderick A. Hyde, Jordin T. Kare and
Lowell L. Wood, Jr. as inventors, filed contemporaneously herewith,
which is currently co-pending, or is an application of which a
currently co-pending application is entitled to the benefit of the
filing date.
[0003] For purposes of the USPTO extra-statutory requirements, the
present application constitutes a continuation-in-part of U.S.
patent application Ser. No. UNKNOWN, entitled METHOD OF OPERATING
AN ELECTRICAL ENERGY STORAGE DEVICE USING MICROCHANNELS DURING
CHARGE AND DISCHARGE, naming Alistair K. Chan, Roderick A. Hyde,
Jordin T. Kare and Lowell L. Wood, Jr. as inventors, filed
contemporaneously herewith, which is currently co-pending, or is an
application of which a currently co-pending application is entitled
to the benefit of the filing date.
[0004] For purposes of the USPTO extra-statutory requirements, the
present application constitutes a continuation-in-part of U.S.
patent application Ser. No. UNKNOWN, entitled SYSTEM AND METHOD OF
ALTERING TEMPERATURE OF AN ELECTRICAL ENERGY STORAGE DEVICE OR AN
ELECTROCHEMICAL ENERGY GENERATION DEVICE USING HIGH THERMAL
CONDUCTIVITY MATERIALS, naming Alistair K. Chan, Roderick A. Hyde,
Jordin T. Kare and Lowell L. Wood, Jr. as inventors, filed
contemporaneously herewith, which is currently co-pending, or is an
application of which a currently co-pending application is entitled
to the benefit of the filing date.
[0005] For purposes of the USPTO extra-statutory requirements, the
present application constitutes a continuation-in-part of U.S.
patent application Ser. No. UNKNOWN, entitled METHOD OF OPERATING
AN ELECTRICAL ENERGY STORAGE DEVICE OR AN ELECTROCHEMICAL ENERGY
GENERATION DEVICE USING HIGH THERMAL CONDUCTIVITY MATERIALS DURING
CHARGE AND DISCHARGE, naming Alistair K. Chan, Roderick A. Hyde,
Jordin T. Kare and Lowell L. Wood, Jr. as inventors, filed
contemporaneously herewith, which is currently co-pending, or is an
application of which a currently co-pending application is entitled
to the benefit of the filing date.
[0006] For purposes of the USPTO extra-statutory requirements, the
present application constitutes a continuation-in-part of U.S.
patent application Ser. No. UNKNOWN, entitled SYSTEM FOR ALTERING
TEMPERATURE OF AN ELECTRICAL ENERGY STORAGE DEVICE OR AN
ELECTROCHEMICAL ENERGY GENERATION DEVICE USING MICROCHANNELS BASED
ON STATES OF THE DEVICE, naming Alistair K. Chan, Roderick A. Hyde,
Jordin T. Kare and Lowell L. Wood, Jr. as inventors, filed
contemporaneously herewith, which is currently co-pending, or is an
application of which a currently co-pending application is entitled
to the benefit of the filing date.
[0007] For purposes of the USPTO extra-statutory requirements, the
present application constitutes a continuation-in-part of U.S.
patent application Ser. No. UNKNOWN, entitled SYSTEM FOR ALTERING
TEMPERATURE OF AN ELECTRICAL ENERGY STORAGE DEVICE OR AN
ELECTROCHEMICAL ENERGY GENERATION DEVICE USING HIGH THERMAL
CONDUCTIVITY MATERIALS BASED ON STATES OF THE DEVICE, naming
Alistair K. Chan, Roderick A. Hyde, Jordin T. Kare and Lowell L.
Wood, Jr. as inventors, filed contemporaneously herewith, which is
currently co-pending, or is an application of which a currently
co-pending application is entitled to the benefit of the filing
date.
[0008] For purposes of the USPTO extra-statutory requirements, the
present application constitutes a continuation-in-part of U.S.
patent application Ser. No. UNKNOWN, entitled SYSTEM FOR OPERATING
AN ELECTRICAL ENERGY STORAGE DEVICE OR AN ELECTROCHEMICAL ENERGY
GENERATION DEVICE USING MICROCHANNELS BASED ON MOBILE DEVICE STATES
AND VEHICLE STATES, naming Alistair K. Chan, Roderick A. Hyde,
Jordin T. Kare and Lowell L. Wood, Jr. as inventors, filed
contemporaneously herewith, which is currently co-pending, or is an
application of which a currently co-pending application is entitled
to the benefit of the filing date.
[0009] For purposes of the USPTO extra-statutory requirements, the
present application constitutes a continuation-in-part of U.S.
patent application Ser. No. UNKNOWN, entitled SYSTEM AND METHOD OF
OPERATING AN ELECTRICAL ENERGY STORAGE DEVICE OR AN ELECTROCHEMICAL
ENERGY GENERATION DEVICE USING THERMAL CONDUCTIVITY MATERIALS BASED
ON MOBILE DEVICE STATES AND VEHICLE STATES, naming Alistair K.
Chan, Roderick A. Hyde, Jordin T. Kare and Lowell L. Wood, Jr. as
inventors, filed contemporaneously herewith, which is currently
co-pending, or is an application of which a currently co-pending
application is entitled to the benefit of the filing date.
[0010] For purposes of the USPTO extra-statutory requirements, the
present application constitutes a continuation-in-part of U.S.
patent application Ser. No. UNKNOWN, entitled SYSTEM AND METHOD OF
OPERATING AN ELECTRICAL ENERGY STORAGE DEVICE OR AN ELECTROCHEMICAL
ENERGY GENERATION DEVICE, DURING CHARGE OR DISCHARGE USING
MICROCHANNELS AND HIGH THERMAL CONDUCTIVITY MATERIALS, naming
Alistair K. Chan, Roderick A. Hyde, Jordin T. Kare and Lowell L.
Wood, Jr. as inventors, filed contemporaneously herewith, which is
currently co-pending, or is an application of which a currently
co-pending application is entitled to the benefit of the filing
date.
[0011] The United States Patent Office (USPTO) has published a
notice to the effect that the USPTO's computer programs require
that patent applicants reference both a serial number and indicate
whether an application is a continuation or continuation-in-part.
Stephen G. Kunin, Benefit of Prior-Filed Application, USPTO
Official Gazette Mar. 18, 2003, available at
http://www.uspto.gov/web/offices/com/sol/og/2003/week11/patbene.htm.
The present Applicant Entity (hereinafter "Applicant") has provided
above a specific reference to the application(s) from which
priority is being claimed as recited by statute. Applicant
understands that the statute is unambiguous in its specific
reference language and does not require either a serial number or
any characterization, such as "continuation" or
"continuation-in-part," for claiming priority to U.S. patent
applications. Notwithstanding the foregoing, Applicant understands
that the USPTO's computer programs have certain data entry
requirements, and hence Applicant is designating the present
application as a continuation-in-part of its parent applications as
set forth above, but expressly points out that such designations
are not to be construed in any way as any type of commentary and/or
admission as to whether or not the present application contains any
new matter in addition to the matter of its parent
application(s).
[0012] All subject matter of the Related Applications and of any
and all parent, grandparent, great-grandparent, etc. applications
of the Related Applications is incorporated herein by reference to
the extent such subject matter is not inconsistent herewith.
BACKGROUND
[0013] The description herein generally relates to the field of
microchannel and high thermal conductivity material thermal control
systems for electrical electrochemical energy generation devices or
electrochemical energy generation devices. Microchannel cooling has
been conventionally applied to devices such as integrated circuit
devices. However, microchannel and high thermal conductivity
material cooling has limited application in cooling of electrical
electrochemical energy generation devices or electrochemical energy
generation devices . . . .
[0014] Conventionally, there is a need for advantageous structures
and methods for thermal control of electrical electrochemical
energy generation devices or electrochemical energy generation
devices by the use of microchannels and high thermal conductivity
materials and the like in a variety of structures and in a variety
of usage.
SUMMARY
[0015] In one aspect, a method of thermal control of an electrical
electrochemical energy generation device or an electrochemical
energy generation device includes providing a housing having an
external surface and an internal surface. The method also includes
coupling at least one component within the housing. At least one
component is configured to generate electrical energy in
combination with other components, chemicals, or materials residing
within the housing. The method includes forming a plurality of
microchannels coupled to at least one of the internal surface of
the housing or the at least one internal components. At least one
microchannel is at least partially formed of a high thermal
conductivity material. The high thermal conductivity material has a
high k-value, the high k-value is greater than approximately 410
W/(m*K). The method further includes providing a thermal sink
coupled to the microchannels. The thermal sink is configured to
transfer heat energy to or from the microchannels. Further, the
method includes flowing a fluid through the microchannels.
[0016] In addition to the foregoing, other method aspects are
described in the claims, drawings, and text forming a part of the
present disclosure.
[0017] In one or more various aspects, related systems include but
are not limited to circuitry and/or programming for effecting the
herein-referenced method aspects; the circuitry and/or programming
can be virtually any combination of hardware, software, and/or
firmware configured to effect the herein-referenced method aspects
depending upon the design choices of the system designer. Also
various structural elements may be employed depending on design
choices of the system designer.
[0018] In one aspect, an electrical electrochemical energy
generation device or an electrochemical energy generation device
includes a housing having an external surface and an internal
surface. The device also includes at least one component within the
housing. At least one component is configured to generate
electrical energy in combination with at least one of other
components, chemicals, or materials residing within the housing. A
plurality of microchannels is coupled to at least one of the
internal surface of the housing or the at least one internal
components. At least one microchannel is at least partially formed
of a high thermal conductivity material. The high thermal
conductivity material has a high k-value. The high k-value is
greater than approximately 410 W/(m*K). A thermal sink is coupled
to the micro-channels. The thermal sink is configured to transfer
heat energy to or from the microchannel surfaces via the fluid
flowing through the microchannels.
[0019] In addition to the foregoing, other system aspects are
described in the claims, drawings, and text forming a part of the
present disclosure.
[0020] In addition to the foregoing, various other method and/or
system and/or program product aspects are set forth and described
in the teachings such as text (e.g., claims and/or detailed
description) and/or drawings of the present disclosure.
[0021] The foregoing is a summary and thus contains, by necessity,
simplifications, generalizations and omissions of detail;
consequently, those skilled in the art will appreciate that the
summary is illustrative only and is NOT intended to be in any way
limiting. Other aspects, features, and advantages of the devices
and/or processes and/or other subject matter described herein will
become apparent in the teachings set forth herein.
BRIEF DESCRIPTION OF THE FIGURES
[0022] The foregoing summary is illustrative only and is not
intended to be in any way limiting. In addition to the illustrative
aspects, embodiments, and features described above, further
aspects, embodiments, and features will become apparent by
reference to the drawings and the following detailed description,
of which:
[0023] FIG. 1 is an exemplary microchannel temperature alteration
system associated with an electrical energy storage device or an
electrochemical energy generation device;
[0024] FIG. 2 is an exemplary depiction of a cross section and
cutaway of a plurality of microchannels;
[0025] FIG. 3 is an exemplary process diagram for altering
temperature of an electrical energy storage device or an
electrochemical energy generation device;
[0026] FIG. 4 is an exemplary process diagram for altering
temperature of an electrical energy storage device or an
electrochemical energy generation device;
[0027] FIG. 5 is an exemplary process diagram for altering
temperature of an electrical energy storage device or an
electrochemical energy generation device while discharging;
[0028] FIG. 6 is an exemplary process diagram for altering
temperature of an electrical energy storage device or an
electrochemical energy generation device during discharging;
[0029] FIG. 7 is an exemplary process diagram for altering
temperature of an electrical energy storage device during
charging;
[0030] FIG. 8 is an exemplary process diagram for altering
temperature of an electrical energy storage device during
charging;
[0031] FIG. 9 is an exemplary process diagram for altering
temperature of an electrical energy storage device during
charging;
[0032] FIG. 10 is an exemplary high thermal conductivity material
altering temperature of device associated with an electrical energy
storage device or an electrochemical energy generation device;
[0033] FIG. 11 is an exemplary process diagram for altering
temperature of an electrical energy storage device or an
electrochemical energy generation device using high thermal
conductivity materials;
[0034] FIG. 12 is an exemplary process diagram for altering
temperature of an electrical energy storage device or an
electrochemical energy generation device using high thermal
conductivity materials during discharge;
[0035] FIG. 13 is an exemplary process diagram of an electrical
energy storage device or an electrochemical energy generation
device using high thermal conductivity materials during
discharging;
[0036] FIG. 14 is an exemplary process diagram for altering
temperature of an electrical energy storage device for an
electrochemical energy generation device during discharging;
[0037] FIG. 15 is an exemplary process diagram for an electrical
energy storage device using high thermal conductivity materials
during charging; and
[0038] FIG. 16 is an exemplary process diagram for altering
temperature of an electrical energy storage device using high
thermal conductivity materials during charging.
[0039] FIG. 17 is an exemplary block diagram of a microchannel
manifold system.
DETAILED DESCRIPTION
[0040] In the following detailed description, reference is made to
the accompanying drawings, which form a part hereof. In the
drawings, similar symbols typically identify similar components,
unless context dictates otherwise. The illustrative embodiments
described in the detailed description, drawings, and claims are not
meant to be limiting. Other embodiments may be utilized, and other
changes may be made, without departing from the spirit or scope of
the subject matter presented here. Those having skill in the art
will recognize that the state of the art has progressed to the
point where there is little distinction left between hardware and
software implementations of aspects of systems; the use of hardware
or software is generally (but not always, in that in certain
contexts the choice between hardware and software can become
significant) a design choice representing cost vs. efficiency
tradeoffs. Those having skill in the art will appreciate that there
are various vehicles by which processes and/or systems and/or other
technologies described herein can be effected (e.g., hardware,
software, and/or firmware), and that the preferred vehicle will
vary with the context in which the processes and/or systems and/or
other technologies are deployed. For example, if an implementer
determines that speed and accuracy are paramount, the implementer
may opt for a mainly hardware and/or firmware vehicle;
alternatively, if flexibility is paramount, the implementer may opt
for a mainly software implementation; or, yet again alternatively,
the implementer may opt for some combination of hardware, software,
and/or firmware. Hence, there are several possible vehicles by
which the processes and/or devices and/or other technologies
described herein may be effected, none of which is inherently
superior to the other in that any vehicle to be utilized is a
choice dependent upon the context in which the vehicle will be
deployed and the specific concerns (e.g., speed, flexibility, or
predictability) of the implementer, any of which may vary. Those
skilled in the art will recognize that optical aspects of
implementations will typically employ optically-oriented hardware,
software, and or firmware.
[0041] Microchannels used to cool integrated circuits have been
understood since the early 1980s and disclosed in research
published by professors Dr. David Tuckerman and Dr. Fabian Pease.
Pease published research showing that microchannels etched into
silicon may provide densities as high as 1000 W per square
centimeter. Such microchannel structures have been shown to be put
into practical use by cooling integrated circuits, such as those
described in U.S. Pat. Nos. 4,541,040; 7,156,159; 7,185,697; and
U.S. Patent Application Publication No. 2006/0231233 all of which
are herein incorporated by reference. However, practical
application to thermal control of electrical energy storage devices
and electrochemical energy generation devices has not been
accomplished or suggested. Such microchannel structures may
particularly be suited for removing heat from such devices
especially in the case of ultrahigh power density batteries or
other electrical storage devices, for example hyper capacitors, or
electrochemical energy generation devices such as, but not limited
to fuel cells. Microchannel coolers and passive high thermal
conductivity materials, such as, but not limited to diamond films,
micro heat pipes, microchannel plates, etc., may be used to aid in
thermal control of ultra-high performance nano structured
batteries, and the like, which will generate high thermal loads and
high thermal power densities, particularly during rapid charging,
and/or during rapid discharging. Such devices may be exemplified by
the electrical energy storage device as described in U.S. Published
Patent Application No. 2008/0044725, which is herein incorporated
by reference. The reference also describes some of the demands
which may be fulfilled by such high power density electrical energy
storage devices.
[0042] Efficiency of microstructure microchannel heat collectors
and thermal sinks, maybe attributed to the heat generated by the
energy storage or electrochemical energy generation devices
travelling a relatively small distance from the heat generation
point in the electrical energy storage device, or electrochemical
energy generation device, where the heat is generated and
transferred through the walls of the microchannel. Also, the heat
from the walls of the microchannel conducts a very small distance
into the fluid before the heat energy is carried away to a thermal
sink, such as a radiator, or the like. Because of the structure of
the microchannels where the height of the microchannel is typically
much greater than the width, it may be incorporated into various
portions internally of the electrical energy storage device or the
electrochemical energy generation device. For example, the
microchannel thermal control structures may be incorporated into
the anode, or the cathode of a battery or electrochemical energy
generation device. Further, the microchannel structures may be
integrated into walls of the housing of an electrical energy
storage device or an electrochemical energy generation device.
Further, the microchannel structures may be incorporated into other
portions internally of the electrical energy storage device or
electrochemical energy generation device.
[0043] One of the advantages of using the microchannel structures
is that turbulent flow within the channels is not necessary to
increase heat transfer efficiency. Microchannel structures neither
require nor create turbulent flow. Conventional macrochannels
require turbulence to increase cooling efficiency otherwise the
fluid flowing in the middle of the channel stays relatively cool.
Turbulent flow within the fluid channel mixes the hot fluid next to
the wall of the channel with the cooler fluid in the middle of the
channel. However, such turbulence and mixing decreases the
efficiency of cooling. Microchannels, instead, have the advantage
that the heat transfer coefficient "h" is inversely proportional to
the width of the channel. As "h" decreases efficiency increases. A
very narrow channel completely heats a very thin layer of fluid as
it travels through the collector.
[0044] A compact thermal control system for electrical energy
storage devices and electrochemical energy generation devices which
may be used in applications such as, but not limited to mobile
devices, electric vehicles, hybrid electric vehicles, etc. maybe
based on micro heat exchangers having microchannel heat collectors
or heat collectors at least partially formed of high thermal
conductivity materials. Such microchannel heat collectors may be
machined or fabricated in silicon or other metals, or other
materials including high thermal conductivity materials and use
active pumps systems or passive systems including, but not limited
to electro osmotic pumps or other pumps, etc. A system such as this
may be a hermetically closed system that may be arranged in a
modular fashion in which a portion of microchannels or a portion of
a high thermal conductivity material heat collector is disposed
within the housing of the electrical energy storage device or the
electrochemical energy generation device. Other configurations may
be such that the microchannels or other heat collector are
incorporated or machined directly into portions of the electrical
energy storage device or electrochemical energy generation device.
Such microchannel heat exchangers, and such systems as described,
may be formed as extremely compact and power efficient systems such
that the total system offers increased performance characteristics
heat pipes, vapor chambers, and other heat transfer devices which
are conventionally used for removing heat from similar types of
electrical energy storage devices and electrochemical energy
generation devices.
[0045] Referring now to FIG. 1, a thermal control system 100 for an
electrical energy storage device or an electrochemical energy
generation device 110 is depicted. Electrical energy storage device
or electrochemical energy generation device 110 may include, but is
not limited to any of a variety of batteries or electrochemical
cells such as, but not limited to lithium based batteries, lithium
ion batteries, lithium ion nano phosphate batteries, lithium sulfur
batteries, lithium ion polymer batteries, sodium sulfur batteries,
etc. In fact, such thermal control technology could be applied to
any typical type of electro-chemical cell in existence today or to
be developed. Further, other types of electrical energy storage
devices may be used in place of battery 110 such as, capacitor
devices including, but not limited to capacitive storage devices,
inductive storage devices, electrolytic capacitors, hyper
capacitors (as described in U.S. Published Patent Application No.
2004/0071944 and U.S. Pat. No. 7,428,137 both of which are herein
incorporated by reference), polyvinylidene fluoride (PVDF) based
capacitors carbon nanotube based capacitors, other conductive
polymer based capacitors, carbon aerogel based capacitors, etc.
Further still, energy storage or electrochemical energy generation
device 110 may be representative of a fuel cell (as described in
U.S. Published Patent Application No. 2009/0068521 which is herein
incorporated by reference), or other electrochemical energy
generation devices which may be known, or developed.
[0046] Electrical energy storage device or electrochemical energy
generation device 110 includes a housing 112 having a housing wall
with an interior wall surface 114 and exterior wall surface 112.
Interior wall surface 114 of housing 112 may be filled with an
electrolyte 124 or other material depending on the structure of
either the electrical energy storage device or the electrochemical
energy generation device 110. Electrical energy storage device or
electrochemical energy generation device 110 may include, a cathode
120 coupled to a positive terminal 127 by a conductor 126. In an
exemplary embodiment, load 120 may include a number of microchannel
structures 132. Microchannel structures 132 may be integrated into
cathode 120 or alternatively may be overlaid or coupled to cathode
120 such that heat emanating from cathode 120 may be collected by
the microchannel structures 132. Such microchannel structures 132
may be formed by any of a variety of methods including etching,
micromachining, and the like. Various materials for forming cathode
120 may be used, as is well known in the art depending on the type
of electrical energy storage device or electrochemical energy
generation device 110. A fluid connection 136 is coupled to
microchannels 132. Fluid connections 136 are coupled to a thermal
sink 138 through a pump 140. Such a thermal sink 138 may be a
radiator or other form of heatsink. A pump 140 may also be coupled
to a fluid circuit 136 in order to move fluid through microchannels
132. In one embodiment, a pump is used. In alternative embodiments,
the fluid may be moved by osmotic pressure or the like without use
of a pump 140. Similar to cathode 120, an anode 122 is electrically
coupled to a negative terminal 129 of electrical energy storage
device or electrochemical energy generation device 110 by a
conductor 128. Similar to cathode 120, anode 122 may also include a
microchannel structure 130 integrated into, overlaid, or coupled to
anode 122. Microchannel structure 130 is fluidly coupled, by a
fluid connection 134, to thermal sink 138 in much the same way that
fluid connection 136 is coupled to thermal sink 138.
[0047] In an exemplary embodiment, a load or a charge source 120 is
electrically coupled to positive terminal 127 and negative terminal
129 of electrical energy storage device or electrochemical energy
generation device 110. Load 120 may be any of a variety of possible
devices using energy from electrical energy storage device or
electrochemical energy generation device 110. Charge source 120 may
be any type of charging device that is used to charge electrical
energy storage device 110. During charging, or during discharging
by use of a load, large amounts of heat may be generated within
electrical energy storage device or electrochemical energy
generation device 110. Accordingly, it may be advantageous to use a
microchannel thermal control system as described. In one exemplary
embodiment, a controller 160 may be coupled to pump 140. Controller
160 may be any of a variety of controllers control devices, etc.
for controlling the speed of pump 140. For example, pump 140 may be
coupled to a sensor 162 which detects characteristics of electrical
energy storage device or electrochemical energy generation device
110. Sensor 162 may be located at any of a variety of locations
associated with electrical energy storage device or electrochemical
energy generation device 110. Alternatively, controller 160 may be
coupled to load or charge source 120 to detect characteristics of
the usage of load or charge source 120. Controller 160 may be used
to control pump 140 based on a variety of factors including, but
not limited to a current draw, a current discharge, voltage,
various states of the device using energy from electrical energy
storage device or electrochemical energy generation device 110, or
variable various states of a vehicle using electrical energy
storage device or electrochemical energy generation device 110, or
further states of the charge source 120.
[0048] In accordance with an exemplary embodiment, it may be
desirable to cool the electrical energy storage device or the
electrochemical energy generation device in anticipation of a heat
generating event, such as discharge or energy demand or charging.
By cooling in advance of the heat generating event, the thermal
control system may be better enabled to keep up with the cooling
demands. It is in a sense a "head start" for the cooling system. In
an exemplary embodiment the "head start" may be determined by a
processor which may be enabled with programming to monitor systems
and make determinations as to when energy may be demanded or
charging may occur. In other exemplary embodiments, the "head
start" may be done in accordance with a schedule or in accordance
with other preset or predetermined times.
[0049] Referring now to FIG. 2, a perspective cross-section of an
exemplary cathode 120 is depicted. The cross section of FIG. 2
depicts microchannels 132 built into or integrated into cathode
120. Microchannels 132 are sealed fluid conduits having a top
portion 133 shown partially cut-away. Microchannels 132 are not
shown in a scaled depiction because microchannels 132
conventionally are of extremely small width, on the order of, but
not limited to the width of a human hair. The height of
microchannels 132 may be much greater than the width to achieve
efficient laminar flow thermal control. The high aspect ratio of
the microchannels increases the total surface area of the
microchannel structures touching the fluid flow. The width of the
microchannels 132 may be on the order of 10 .mu.m, but is not
limited thereto. FIG. 2 depicts a single configuration of
microchannels 132 in which the microchannels are arranged
side-by-side and fluid may flow through all the microchannels in
parallel or may flow in a serial manner back and forth (serpentine)
through each of the microchannels to complete a fluid circuit. Many
other configurations of microchannels may also be conceived without
departing from the scope of the disclosure and of the invention as
claimed herein.
[0050] Referring now to FIG. 17, an alternative configuration of a
microchannel thermal control system 1700 includes more than one of
substrates 1710 which support microchannels 1720. Substrates 1710
may be integrated into or otherwise coupled to any of the
electrical energy storage device or electrochemical energy
generation device components as discussed. Microchannels 1720 may
be of a parallel or any other configuration in which fluid may flow
from an inlet manifold 1730 to an outlet manifold 1740. Such flow
may proceed through any of the more than one sets of microchannels
through microchannel inlets 1750 and through microchannel outlets
1760. In yet another configuration each of the sets of
microchannels may include one or more interconnections 1770 and
1780 between the sets of microchannels. Providing such a structure
has many advantages including, but not limited to performance
characteristics, manufacturing characteristics, and application
characteristics, as desired.
[0051] In one exemplary embodiment, electrical energy storage
device or electrochemical energy generation device 110 is an
electrical energy storage device that has a housing 112. The
housing may have an external and internal surface, the internal
surface being depicted as surface 114. Many components reside
within the housing including, in some instances, the anode 122 and
the cathode 120. Further, other chemicals or materials may also
reside within the housing including an electrolyte 124, or other
materials or chemicals as needed to generate electricity or to
store energy. In one exemplary embodiment a plurality of
microchannels is coupled to at least one of the internal surface
114 of the housing or at least one of the internal components such
as, but not limited to cathode 120 and anode 122. A thermal sink
138 is coupled to the microchannels fluid connection 136. The
thermal sink 138 is configured to transfer heat to or from fluid
flowing through microchannels 132. In one exemplary embodiment,
microchannels may be formed in a portion of a wall of the housing
114. Also, microchannels may be formed in a portion of any of the
components residing within housing 112. In another exemplary
embodiment, microchannels may be formed in a portion of a catalyst
which may be disposed within housing 112. Further still,
microchannels may be formed in electrical contacts, a current
carrying conductor, a dialectic, etc. Also, microchannels may be
formed integrally to any of these components or housings, or may be
overlaid or disposed on or coupled to any of these components or
housings. It may be advantageous to couple the microchannels to
areas or components where the most heat is generated or
collects.
[0052] In an exemplary embodiment, the fluid flowing through
microchannels 132 may include any of a variety of fluids. Such
fluids may include air, gas, water, antifreeze, molten salt, molten
metal, micro-particles, liquid droplets, solid particles, etc. (see
e.g. US 2006/0231233). Also, in an exemplary embodiment, the fluid
may be at least partially circulated by any of a variety of devices
including, a pump, a mechanical pump, electromagnetic (MHD) pump,
electroosmotic pump, etc. The fluid may be circulated in any of a
variety of ways including, by convection, by electroosmosis, etc.
Further, in accordance with an exemplary embodiment, the electrical
energy storage device may include one or more electrochemical
cells, capacitive storage devices, inductive storage devices,
electrolytic capacitors, supercapacitors, hypercapacitors,
polyvinylidpue fluoride (PVDF) based capacitors, and various
batteries, including, but not limited to lithium based batteries,
lithium batteries, lithium ion batteries, lithium ion nanophosphate
batteries, lithium sulfur batteries, lithium ion polymer batteries,
etc.
[0053] In accordance with another exemplary embodiment, electrical
energy storage device or electrochemical energy generation device
110 is a fuel cell. The fuel cell may include a housing having an
external surface and an internal surface 114. At least one
component resides within the housing. At least one component is
configured to generate electrical power in combination with at
least one other components, chemicals, or materials residing within
the housing. In one embodiment, such components may include, but
are not limited to cathode 120 and anode 122. A plurality of
microchannels 132 may be coupled to the least one of the internal
surface of the housing or the at least one internal components. A
thermal sink 138, is coupled to the microchannels. Thermal sink 138
is configured to transfer heat to or from fluid flowing through the
microchannels. In one exemplary embodiment, the microchannels are
formed in a portion of a wall of the housing or at least one
component residing within the housing. Similar to the electrical
energy storage device configuration, many of the same components
may reside within the housing and may include microchannels.
Further, any other components which may be unique to a fuel cell,
compared to the electrical energy storage device depicted in FIG.
1, may also include microchannels to cool such components.
[0054] Referring now to FIG. 3, a process 300 is depicted for
controlling temperature of an electrical energy storage device or
electrochemical energy generation device. Process 300 includes
providing an electrical energy storage device or an electrochemical
energy generation device with a housing (process 310). Process 300
also includes coupling an electrical energy storage device or
electrochemical energy generation device components within the
housing (process 320). Microchannels are formed in a surface of the
electrical energy storage device or the electrochemical energy
generation device components (process 330). A fluid is then flowed
through the microchannels to provide thermal control to the
components and to the overall electrical energy storage device or
electrochemical energy generation device (process 340).
[0055] Referring now to FIG. 4, a process 400 of using electrical
energy storage device or an electrochemical energy generation
device is depicted. Process 400 includes coupling a load to draw
current from the electrical energy storage device or the
electrochemical energy generation device (process 410). The
electrical energy storage device or the electrochemical energy
generation device has a housing with an external surface and an
internal surface. Process 400 also includes generating electricity
by the electrical energy storage device or the electrochemical
energy generation device using at least one component within the
housing. The least one component is configured to generate
electrical energy in combination with other components, chemicals,
or materials residing within the housing (process 420). The
electrical energy storage device is then cooled by transferring
heat to fluid flowing through the microchannels coupled to at least
one of the internal surface of the housing or at least one of the
components (process 430). Heat is then rejected from the thermal
sink that is coupled to the microchannels. The thermal sink is
configured to transfer heat energy from the microchannels and is
configured to receive a fluid flowing through the microchannels
(process 440).
[0056] In accordance with another exemplary embodiment, a process
of providing power for an electrical energy storage device or an
electrochemical energy generation device includes providing an
electrical energy storage device or an electrochemical energy
generation device having a housing and including internal
components within the housing. The process also includes providing
a microchannel fluid thermal control system integrated into at
least one of the interior of the housing or the internal
components. Further, the process includes configuring the
electrical energy storage device or electrochemical energy
generation device for a platform for at least partially discharging
the electrical energy storage device or the electrochemical energy
generation device and using electrical energy from the electrical
energy storage device.
[0057] In accordance with yet another exemplary embodiment, a
process of providing power from an electrical energy storage device
or an electrochemical energy generation device includes receiving
the electrical energy storage device or the electrochemical energy
generation device housing and including internal components within
the housing. The process also includes receiving a microchannel
fluid thermal control system integrated into at least one of the
interior of the housing or the internal components. Further, the
process includes discharging power at least partially from the
electrical energy storage device or the electrochemical energy
generation device. The electrical energy storage device or the
electrochemical energy generation device is configured for a
platform for discharging the electrical energy storage device or
the electrochemical energy generation device and using the
electrical energy from the electrical energy storage device.
[0058] Another exemplary process includes charging an electrical
energy storage device. The electrical energy storage device is
configured to receive electrical current to charge the electrical
energy storage device. The electrical energy storage device
includes a housing having an external surface and an internal
surface. The process for charging the electrical energy storage
device also may include configuring at least one component within
the housing. The least one component being configured to generate
electrical energy during a discharge phase in combination with
other complements, chemicals, or materials residing within the
housing. At least one component is configured to receive electrical
charge during a charge phase. The exemplary process also includes
providing a plurality of microchannels coupled to a least one out
of the internal surface of the housing or the least one internal
components to receive a heat generated during the charge phase and
providing a fluid within the microchannels. A thermal sink is also
provided to collect heat from the fluid coupled to the
microchannels. The thermal sink is configured to transfer heat
energy to or from the fluid flowing through the microchannels and
the thermal sink.
[0059] A method of charging a electrical energy storage device also
includes placing the electrical energy storage device to draw
current from a charging source. The electrical energy storage
device includes a housing having an external surface and an
internal surface. The process includes receiving electricity by at
least one component within the housing. At least one component is
configured to receive electrical energy in combination with other
components chemicals, or materials residing within the housing. The
process also includes thermal control of the electrical energy
storage device by transferring heat to a plurality of microchannels
coupled to a least one of the internal surface of the housing or
the at least one internal components. Further, the process includes
transferring collected heat through the thermal sink coupled to the
microchannels. The thermal sink is configured to transfer heat
energy to or from the microchannels and receive a fluid through the
microchannels in the thermal sink.
[0060] Further still, a method of charging an electrical energy
storage device is disclosed. The method includes receiving the
electrical energy storage device including a housing and including
internal components within the housing. The process also includes
integrating a microchannel fluid thermal control system into at
least one of the interior housing or the internal components.
Further, the method includes receiving current by the electrical
energy storage device, from a charging source.
[0061] Referring now to FIG. 5, a process 500 for thermal control
of an electrical energy storage device during discharge is
depicted. Process 500 includes providing an electrical energy
storage device (process 510). Process 500 also includes integrating
a microchannel fluid thermal control system into the interior of
the electrical energy storage device (process 520). Process 500
further includes configuring the electrical energy storage device
for discharging electricity (process 530).
[0062] Referring now to FIG. 6, a process for discharging power
from a power from an electrical energy storage device or an
electrochemical energy generation device is depicted process 600
includes receiving an electrical energy storage device or an
electrochemical energy generation device (process 610). Process 600
also includes receiving a microchannel fluid thermal control system
that is integrated into the interior of the electrical energy
storage device or the electrochemical energy generation device
(process 620). Further, process 600 includes discharging power from
the electrical energy storage device or the electrochemical energy
generation device to a load using the stored or generated
electrical energy (process 630). Using the microchannel thermal
control system heat is then discharged from the electrical energy
storage device or electrochemical energy generation device (process
640).
[0063] Referring now to FIG. 7, a process 700 for thermal control
of an electrical energy storage device while charging is depicted.
Process 700 includes configuring an electrical energy storage
device to receive electrical charge current (process 710). The
charge current is used to charge the electrical energy storage
device, the electrical energy storage device capable of receiving a
high power density current thereby causing heating of the
electrical energy storage device and components of the electrical
energy storage device. Process 700 also includes configuring
interior components of the electrical energy storage device to
generate electricity (process 720). Further, process 700 includes
providing a plurality of microchannels into the interior of a
housing of the electrical energy storage device (process 730). The
interior of the housing may include interior surfaces of the
housing as well as components within the housing. Further still,
process 700 includes providing a radiative structure or a thermal
sink that is used to collect heat from the fluids flowing through
the microchannels (process 740).
[0064] Referring now to FIG. 8, a process 800 is depicted for
thermal control of an electrical energy storage device during
charging. Process 800 includes placing the electrical energy
storage device in a situation to draw current from a charging
source (process 810). Process 800 also includes receiving
electricity by at least one component of the electrical energy
storage device (process 820). Because heat is generated within the
electrical energy storage device during the charging process,
process 800 also includes thermal control of the electrical energy
storage device by transferring heat to microchannels which are
configured within housing of the electrical energy storage device
(process 830). Heat is then rejected via a radiator or other
thermal sink structure from the microchannels by transferring heat
from the microchannel to the fluid flowing through the
microchannels and to the thermal sink (process 840).
[0065] Referring now to FIG. 9, a process 900 is depicted for
thermal control of an electrical energy storage device during
charging. Process 900 includes receiving an electrical energy
storage device in a situation whereby the electrical energy storage
device may be charged (process 910). Process 900 also includes
receiving a microchannel fluid thermal control system is integrated
into the electrical energy storage device (process 920). Such a
microchannel fluid thermal control system that may be one that is
applied directly to components within the housing of the electrical
energy storage device or may be one that is integrated into the
housing of the electrical energy storage device or components
within the housing of the electrical energy storage device. Process
900 also includes receiving current by the electrical energy
storage device from the charging source (process 930).
[0066] Referring now to FIG. 10, a system 1000 for thermal control
of an electrical energy storage device or an electrochemical energy
generation device is depicted. Electrical energy storage device or
electrochemical energy generation device 1000 may include a housing
1010 having an outer surface 1012 and an inner surface 1014. Within
housing 1010 may be a plurality of components, chemicals,
materials, etc. For example, a cathode 1020 may be coupled to a
positive terminal 1027 by a conductive connection 1026. Cathode
1020 may have a surface 1022. Surface 1022 may be overlaid with or
be integrated into cathode 1020 a high thermal conductivity
material 1023 that is in thermal communication with the fluid
circuit 1036. High thermal conductivity material 1023 may have a
high k-value. The high k-value may be greater than approximately
410 W/(m*K). Fluid circuit 1036 may be used to circulate fluid to
conduct heat away from cathode 1020 via the high thermal
conductivity of the material 1023. In electrical energy storage
devices and electrochemical energy generation devices that are
charged or discharged rapidly or that manage a high power density,
efficient thermal control is needed to maintain desired
temperature. The use of high thermal conductivity materials as
applied, allows efficient rejection of heat to maintain desired
temperatures. Thermal circuit 1036 is coupled to a thermal sink
1038 and optionally through a pump, 1040. Pump 1040 helps move
fluid through circuit 1036. Similarly, an anode 1030 may reside
within housing 1010 having a high thermal conductivity material
1033 coupled to or integrated into surface 1032. A fluid circuit
1034 is in thermal communication with material 1033. Fluid circuit
1034 is coupled to thermal sink 1038 optionally through a pump
1040. Anode 1030 is electrically coupled to a negative terminal
1029 through conductive connection 1028. Positive terminal 1027 and
negative terminal 1029 may be coupled to a load or charge source
1070. In an exemplary embodiment a controller 1060 may be coupled
to any of a variety of mechanisms within system 1000 including, but
not limited to, pump 1040 for controlling the rate of fluid flow
within circuits 1036 and 1038, for example. Controller 1060 may be
coupled to any of a variety of sensors including, but not limited
to a current sensor 1062 which may be in a variety of locations
including, but not limited to at terminal 1027. Many other types of
sensors may also be used including, but not limited to temperature
sensors, voltage sensors, flow sensors, chemical concentration
sensors, and the like. The use of high thermal conductivity
materials to aid the rejection of heat within the interior of an
electrical energy storage device or an electrochemical energy
generation device may be beneficial to provide adequate thermal
control of such devices during rapid charging or rapid discharging,
etc.
[0067] In various exemplary embodiments, the electrical energy
storage device or the electrochemical energy generation device
includes high thermal conductivity materials which include but are
not limited to diamond and diamond based materials, diamond films,
diamond composites (such as diamond-loaded copper or diamond-loaded
aluminum), carbon fibers (including graphite fiber composites, as
may exist in combination with materials in a matrix such as
aluminum, Silicon Carbide (SiC), or various polymers),
carbon-carbon materials (such as carbon fibers in a carbon matrix),
carbon nanotubes, carbon aerogels and the like. Further, the high
thermal conductivity materials may be formed into micro heat pipes,
and other structures which will be beneficial to increase thermal
conductivity. Such materials are exemplified in the following
references: (1) information found at
http://www.nsf.gov/awardsearch/showAward.do?AwardNumber=0750177 as
of Apr. 30, 2009, (2) "Applications for ultrahigh thermal
conductivity graphite fibers," T. F. Fleming, W. C. Riley, Proc.
SPIE, Vol. 1997, 136 (1993) DOI:10.1117/12.163796, Online
Publication Date: 14 Jan. 2005; "Vapor grown carbon fiber
reinforced aluminum composites with very high thermal
conductivity," Jyh-Ming Ting, Max L. Lake J. Mater. Res. V. 10 #2
pp. 247-250 DOI: 10.1557/JMR.1995.0247 and (3) "New low-CTE
ultrahigh-thermal-conductivity materials for lidar laser diode
packaging," C. Zweben Proc. SPIE, Vol. 5887, 58870D (2005) DOI:
10.1117/12.620175.
[0068] Referring now to FIG. 11, a method 1100 of thermal control
of an electrical energy storage device or an electrochemical energy
generation device is depicted. The method includes providing a
housing which may have an external surface and an internal surface
(process 1110). The method also includes coupling at least one
component within the housing. At least one component is configured
to generate electrical power in combination with other components,
chemicals, or materials which may be residing within the housing
(process 1120). Further, the method includes forming a plurality of
thermal control structures of a high thermal conductivity material
which is coupled to at least one of the internal surface of the
housing or the least one internal components. The high thermal
conductive material may have a high k-value, the high k-value being
greater than approximately 410 W/(m*K) (process 1130). Further
still, the method includes flowing a fluid adjacent the high
thermal conductivity material to remove heat from the high thermal
conductivity material (process 1140).
[0069] In another exemplary embodiment, the thermal sink may be
formed at least partially of a high thermal conductivity material
as described above. Such a structure may be used in a method of
thermal control of an electrical energy storage device or an
electrochemical energy generation device. Such a method may include
providing a housing having an external surface and an internal
surface. The method may also include coupling at least one
component within the housing, at least one component being
configured to generate electrical power in combination with other
components, chemicals, or materials residing within the housing.
Further, the method of thermal control may include forming a
plurality of thermal control structures coupled to at least one of
the internal surface of the housing or the at least one internal
components. The method further includes flowing a fluid adjacent a
plurality of thermal control structures and transferring heat to or
from a thermal sink. The thermal sink is formed at least partially
of a high thermal conductive material having a high k-value. The
high k-value may be greater than approximately 410 W/(m*K).
[0070] Referring now to FIG. 12, a process of thermal control of an
electrical energy storage device or an electrochemical energy
generation device 1200 is depicted. Process 1200 may include
placing an electrical load to draw current from the electrical
energy storage device or the electrochemical energy generation
device (process 1210). Process 1200 may also include thermal
control of the electrical energy storage device or electrochemical
energy generation device by transferring heat to thermal control
structures which are formed of a high k-value material (process
1220). Further, process 1200 includes flowing fluid adjacent the
high k-value material to remove heat therefrom (process 1230).
[0071] Referring now to FIG. 13, a method 1300 for providing power
from an electrical energy storage device or an electrochemical
energy generation device includes providing the electrical energy
storage device or the electrochemical energy generation device. The
electrical energy storage device or the electrochemical energy
generation device includes a housing and includes internal
components within the housing (process 1310). Process 1300 also
includes thermal control of the electrical energy storage device or
the electrochemical energy generation device by transferring heat
to thermal control structures which are formed of high k-value
material (process 1320). Further, process 1300 includes flowing
fluid adjacent the high k-value material (process 1330). Further
still, process 1300 includes configuring the electrical energy
storage device or the electrochemical energy generation device for
a platform for discharging the electrical energy storage device or
the electrochemical energy generation device (process 1340).
[0072] Referring now to FIG. 14, a method 1400 of providing power
from an electrical energy storage device or an electrochemical
energy generation device includes providing the electrical energy
storage device or the electrochemical energy generation device with
a housing and with internal components within the housing (process
1410). The method also includes thermal control of the electrical
energy storage device or the electrochemical energy generation
device by transferring heat to a plurality of thermal control of
structures formed of high k-value material (process 1420). Further,
the method includes flowing fluid adjacent the high k-value
materials (process 1430). Further still, process 1400 includes
configuring the electrical energy storage device or the
electrochemical energy generation device for a platform for
discharging the electrical energy storage device or the
electrochemical energy generation device and using the electrical
energy from the electrical energy storage device or the
electrochemical energy generation device (process 1400).
[0073] Referring now to FIG. 15, a method 1500 of charging an
electrical energy storage device may include configuring the
electrical energy storage device to receive electrical current to
charge the electrical energy storage device (process 1510). The
electrical energy storage device may include a housing having an
external surface and an internal surface. The method may also
include configuring at least one component within the housing. The
least one component is configured to generate electrical energy,
during a discharge phase, in combination with other components
chemicals or materials residing within housing and at least one
component configured to receive electrical charge during a charge
phase (process 1520). A plurality of thermal control structures are
provided of a high thermal conductivity material coupled to at
least one of the internal surface of the housing or the least one
internal components (process 1520). The high thermal conductivity
material may have a high k-value the high k-value is greater than
approximately 410 W/(m*K). The thermal conductivity material is
configured to receive heat generated during the charge phase
(process 1530). A thermal sink is provided to transfer heat to or
from the fluid coupled to the high thermal conductivity material
(process 1540). A thermal sink is configured to transfer heat
energy to or from the fluid flowing through the high thermal
conductivity material and the thermal sink.
[0074] Referring now to FIG. 16, a method 1600 of charging an
electrical energy storage device includes placing the electrical
energy storage device in a situation to draw charge current
(process 1600). Process 1600 also includes thermal control of the
electrical energy storage device by transferring heat to a
plurality of thermal control structures formed of high thermal
conductivity material and flowing fluid thereby (process 1620).
Process 1600 also includes rejecting heat from the fluid through a
radiative structure or a thermal sink (process 1630).
[0075] In another exemplary embodiment, structures, systems, and
processes described above may also be applied to structures,
systems, and processes which use microchannel thermal control for
thermal control of electrical energy storage devices or
electrochemical energy generation devices and base such thermal
control on current (or other states of the electrical energy
storage device or electrochemical energy generation device, such as
(but not limited to voltage, power, temperature, charge state,
etc.) that is either delivered to or from the electrical energy
storage device or the electrochemical energy generation device. The
current may be sensed by a variety of sensors and controlled by a
pump that controls the rate of fluid flow using any of a variety of
control algorithms and controllers. Such control algorithms may
include but are not limited to classical control, feedback control,
nonlinear control, adaptive control, etc. The control algorithms
may also include state estimator's, adaptive control algorithms,
Kalman filters, models of the electrical energy storage device or
the electrochemical energy generation device. The pump may be
controlled is any of a variety of ways including increased flow as
current draw increase, flow may be increased linearly as current
draw increase, flow may be decreased as current draw decreased,
flow may be decreased nonlinearly as current draw decreases, flow
may be increased linearly as current draw increases, flow may be
decreased nonlinearly as current draw decreases, or flow may be
increased nonlinearly as current draw increases and flow may be
decreased linearly as current draw decreases. Further, other
possibilities are equally applicable depending on the design
specifications and desired responses.
[0076] In another exemplary embodiment, structures, systems, and
processes described above may also be applied to structures,
systems, and processes which use high thermal conductivity
materials and for thermal control of electrical energy storage
devices or electrochemical energy generation devices and base such
thermal control on a state or states of a mobile device which the
electrical energy storage device or electrochemical energy
generation device is powering. The current may be sensed by a
variety of sensors or by software which determines the state of the
mobile device and a pump is controlled that controls the rate of
fluid flow using any of a variety of control algorithms and
controllers. Such control algorithms may include but are not
limited to classical control, feedback control, nonlinear control,
adaptive control, etc. The control algorithms may also include
state estimator's, adaptive control algorithms, Kalman filters,
models of the electrical energy storage device or the
electrochemical energy generation device, etc.
[0077] The mobile device states on which fluid flow may be based
may include any of a variety of states including but not limited to
brightness, processing speed, processing demands, processor tasks,
display brightness, hard disk state, hard disk speed, hard disk
usage, wireless communication state, etc. Such a mobile device may
include any of a variety of mobile electronic devices including,
but not limited to, a computer, a laptop computer, a mobile phone,
a global positioning system (GPS) unit, a power tool, etc. Further,
other possibilities are equally applicable depending on the
performance characteristics desired.
[0078] For example, in accordance with an exemplary embodiment, the
mobile device may be a laptop computer having a battery pack that
is cooled by a microchannel thermal control system. The
microchannel thermal control system may include a pump or other
device that controls the rate of fluid flow through the
microchannels and thus the rate of thermal control. Because current
demands may cause heating of the battery pack due to increased
processing speed, increased processing tasks, increased hard disk
speed, increased hard disk usage, etc. As discussed above, the
demands for thermal control therefore increase. The control system
is configured to detect or determine the state of the mobile device
and make adjustments to the rate of thermal control by altering the
rate of flow through the microchannel system thermal control based
on mobile device states may be applied in the context of
microchannel-based thermal control, high thermal conductivity
material-based thermal control systems, and further microchannel
and high thermal conductivity material thermal control systems.
[0079] The use of such a system in which control of fluid flow is
based on mobile device states may be applied to a thermal control
system which uses microchannels. Similarly, the system may be
applied to an electrochemical energy generation device or
electrical energy storage device that uses thermal and high thermal
conduct to the materials in conjunction with a fluid thermal
control system. Further, the control system described in which
thermal control is based on mobile device states may also be
applied to a system which uses a combination of microchannel
thermal control and high thermal conductivity to the materials.
[0080] In another particular exemplary embodiment, the fluid
thermal control system described above may be applied to electrical
energy storage devices and energy to generation devices that are
used in vehicle systems. In such a system a fluid pump may be
coupled to a microchannel thermal control system of the electrical
energy storage device or the electrochemical energy generation
device. The electrical energy storage device or the electrochemical
energy generation device may be configured to provide electrical
energy to the drivetrain of the vehicle or in powering other
equipment in the vehicle. A processor is configured to determine at
least one of the states of the vehicle. A vehicle sensor may be
coupled to the processor and may be configured to sense at least
one vehicle characteristic. A controller is used with a control
algorithm and maybe configured to control the functioning of the
pump as a function of at least one vehicle state.
[0081] In accordance with an exemplary embodiment, the vehicle
states may include but are not limited to engine speed, engine
torque, engine acceleration, engine temperature, terrain grade,
vehicle acceleration, vehicle speed, etc. Also, the concept and
control system may be applied to any of a variety of vehicles
including, but not limited to, a computer integrated into a
vehicle, a truck, a boat, a bus, train, an automobile, etc. In
other exemplary embodiments, a variety of sensors may be used
including but not limited to current sensors, voltage sensors,
temperature sensors, speed sensors, accelerometers, orientation
sensors, attitude sensors, etc. The methods of applying thermal
control based on vehicle states may be applied in the context of
microchannel-based thermal control, high thermal conductivity
material-based thermal control systems, and further microchannel
and high thermal conductivity material thermal control systems.
[0082] In another exemplary embodiment, an electrical energy
storage device or electrochemical energy generation device includes
a housing having an external surface and an internal surface.
Components may reside within the housing. The components are
configured to generate electrical energy in combination with at
least one of other components, chemicals, or materials residing
within the housing. A plurality of microchannels may be fashioned
to at least one of the internal surface of the housing or the at
least one internal components. The plurality of microchannels may
be divided into at least two sets of microchannels although any
number of sets may be used. The two sets, for example, may be
separated by at least one valve. A controller is configured to
provide control signals to the valve. The valve may be configured
to control fluid flow in at least two sets of microchannel such
that fluid could flow through either set of microchannels or both
sets simultaneously. The control signals are based on thermal
control demand. For example, the thermal control demand may be of
the overall system, or the thermal control demand may be localized.
A thermal sink is coupled to the microchannels. The thermal sink is
configured to transfer heat energy to or from the microchannel
surfaces via the fluid flowing through the microchannel and the
sinks. In such an embodiment, the thermal control demands may be
met by controlling the action of opening or closing of the valves
such that fluid may selectively flow through various sets of
microchannel to provide needed localized thermal control.
[0083] The foregoing detailed description has set forth various
embodiments of the devices and/or processes via the use of block
diagrams, flowcharts, and/or examples. Insofar as such block
diagrams, flowcharts, and/or examples contain one or more functions
and/or operations, it will be understood by those within the art
that each function and/or operation within such block diagrams,
flowcharts, or examples can be implemented, individually and/or
collectively, by a wide range of hardware, software, firmware, or
virtually any combination thereof. In one embodiment, several
portions of the subject matter described herein may be implemented
via Application Specific Integrated Circuits (ASICs), Field
Programmable Gate Arrays (FPGAs), digital signal processors (DSPs),
or other integrated formats. However, those skilled in the art will
recognize that some aspects of the embodiments disclosed herein, in
whole or in part, can be equivalently implemented in integrated
circuits, as one or more computer programs running on one or more
computers (e.g., as one or more programs running on one or more
computer systems), as one or more programs running on one or more
processors (e.g., as one or more programs running on one or more
microprocessors), as firmware, or as virtually any combination
thereof, and that designing the circuitry and/or writing the code
for the software and or firmware would be well within the skill of
one of skill in the art in light of this disclosure. In addition,
those skilled in the art will appreciate that the mechanisms of the
subject matter described herein are capable of being distributed as
a program product in a variety of forms, and that an illustrative
embodiment of the subject matter described herein applies
regardless of the particular type of signal bearing medium used to
actually carry out the distribution. Examples of a signal bearing
medium include, but are not limited to, the following: a recordable
type medium such as a floppy disk, a hard disk drive, a Compact
Disc (CD), a Digital Video Disk (DVD), a digital tape, a computer
memory, etc.; and a transmission type medium such as a digital
and/or an analog communication medium (e.g., a fiber optic cable, a
waveguide, a wired communications link, a wireless communication
link, etc.). Further, those skilled in the art will recognize that
the mechanical structures disclosed are exemplary structures and
many other forms and materials may be employed in constructing such
structures.
[0084] In a general sense, those skilled in the art will recognize
that the various embodiments described herein can be implemented,
individually and/or collectively, by various types of
electro-mechanical systems having a wide range of electrical
components such as hardware, software, firmware, or virtually any
combination thereof; and a wide range of components that may impart
mechanical force or motion such as rigid bodies, spring or
torsional bodies, hydraulics, and electro-magnetically actuated
devices, or virtually any combination thereof. Consequently, as
used herein "electro-mechanical system" includes, but is not
limited to, electrical circuitry operably coupled with a transducer
(e.g., an actuator, a motor, a piezoelectric crystal, etc.),
electrical circuitry having at least one discrete electrical
circuit, electrical circuitry having at least one integrated
circuit, electrical circuitry having at least one application
specific integrated circuit, electrical circuitry forming a general
purpose computing device configured by a computer program (e.g., a
general purpose computer configured by a computer program which at
least partially carries out processes and/or devices described
herein, or a microprocessor configured by a computer program which
at least partially carries out processes and/or devices described
herein), electrical circuitry forming a memory device (e.g., forms
of random access memory), electrical circuitry forming a
communications device (e.g., a modem, communications switch, or
optical-electrical equipment), and any non-electrical analog
thereto, such as optical or other analogs. Those skilled in the art
will also appreciate that examples of electro-mechanical systems
include but are not limited to a variety of consumer electronics
systems, as well as other systems such as motorized transport
systems, factory automation systems, security systems, and
communication/computing systems. Those skilled in the art will
recognize that electro-mechanical as used herein is not necessarily
limited to a system that has both electrical and mechanical
actuation except as context may dictate otherwise.
[0085] In a general sense, those skilled in the art will recognize
that the various aspects described herein which can be implemented,
individually and/or collectively, by a wide range of hardware,
software, firmware, or any combination thereof can be viewed as
being composed of various types of "electrical circuitry."
Consequently, as used herein "electrical circuitry" includes, but
is not limited to, electrical circuitry having at least one
discrete electrical circuit, electrical circuitry having at least
one integrated circuit, electrical circuitry having at least one
application specific integrated circuit, electrical circuitry
forming a general purpose computing device configured by a computer
program (e.g., a general purpose computer configured by a computer
program which at least partially carries out processes and/or
devices described herein, or a microprocessor configured by a
computer program which at least partially carries out processes
and/or devices described herein), electrical circuitry forming a
memory device (e.g., forms of random access memory), and/or
electrical circuitry forming a communications device (e.g., a
modem, communications switch, or optical-electrical equipment).
Those having skill in the art will recognize that the subject
matter described herein may be implemented in an analog or digital
fashion or some combination thereof.
[0086] Those skilled in the art will recognize that it is common
within the art to implement devices and/or processes and/or systems
in the fashion(s) set forth herein, and thereafter use engineering
and/or business practices to integrate such implemented devices
and/or processes and/or systems into more comprehensive devices
and/or processes and/or systems. That is, at least a portion of the
devices and/or processes and/or systems described herein can be
integrated into other devices and/or processes and/or systems via a
reasonable amount of experimentation. Those having skill in the art
will recognize that examples of such other devices and/or processes
and/or systems might include--as appropriate to context and
application--all or part of devices and/or processes and/or systems
of (a) an air conveyance (e.g., an airplane, rocket, hovercraft,
helicopter, etc.), (b) a ground conveyance (e.g., a car, truck,
locomotive, tank, armored personnel carrier, etc.), (c) a building
(e.g., a home, warehouse, office, etc.), (d) an appliance (e.g., a
refrigerator, a washing machine, a dryer, etc.), (e) a
communications system (e.g., a networked system, a telephone
system, a Voice over IP system, etc.), (f) a business entity (e.g.,
an Internet Service Provider (ISP) entity such as Comcast Cable,
Quest, Southwestern Bell, etc.), or (g) a wired/wireless services
entity such as Sprint, Cingular, Nextel, etc.), etc.
[0087] One skilled in the art will recognize that the herein
described components (e.g., steps), devices, and objects and the
discussion accompanying them are used as examples for the sake of
conceptual clarity and that various configuration modifications are
within the skill of those in the art. Consequently, as used herein,
the specific exemplars set forth and the accompanying discussion
are intended to be representative of their more general classes. In
general, use of any specific exemplar herein is also intended to be
representative of its class, and the non-inclusion of such specific
components (e.g., steps), devices, and objects herein should not be
taken as indicating that limitation is desired.
[0088] With respect to the use of substantially any plural and/or
singular terms herein, those having skill in the art can translate
from the plural to the singular and/or from the singular to the
plural as is appropriate to the context and/or application. The
various singular/plural permutations are not expressly set forth
herein for sake of clarity.
[0089] The herein described subject matter sometimes illustrates
different components contained within, or connected with, different
other components. It is to be understood that such depicted
architectures are merely exemplary, and that in fact many other
architectures can be implemented which achieve the same
functionality. In a conceptual sense, any arrangement of components
to achieve the same functionality is effectively "associated" such
that the desired functionality is achieved. Hence, any two
components herein combined to achieve a particular functionality
can be seen as "associated with" each other such that the desired
functionality is achieved, irrespective of architectures or
intermedial components. Likewise, any two components so associated
can also be viewed as being "operably connected", or "operably
coupled", to each other to achieve the desired functionality, and
any two components capable of being so associated can also be
viewed as being "operably couplable", to each other to achieve the
desired functionality. Specific examples of operably couplable
include but are not limited to physically mateable and/or
physically interacting components and/or wirelessly interactable
and/or wirelessly interacting components and/or logically
interacting and/or logically interactable components.
[0090] While particular aspects of the present subject matter
described herein have been shown and described, it will be apparent
to those skilled in the art that, based upon the teachings herein,
changes and modifications may be made without departing from the
subject matter described herein and its broader aspects and,
therefore, the appended claims are to encompass within their scope
all such changes and modifications as are within the true spirit
and scope of the subject matter described herein. Furthermore, it
is to be understood that the invention is defined by the appended
claims. It will be understood by those within the art that, in
general, terms used herein, and especially in the appended claims
(e.g., bodies of the appended claims) are generally intended as
"open" terms (e.g., the term "including" should be interpreted as
"including but not limited to," the term "having" should be
interpreted as "having at least," the term "includes" should be
interpreted as "includes but is not limited to," etc.). It will be
further understood by those within the art that if a specific
number of an introduced claim recitation is intended, such an
intent will be explicitly recited in the claim, and in the absence
of such recitation no such intent is present. For example, as an
aid to understanding, the following appended claims may contain
usage of the introductory phrases "at least one" and "one or more"
to introduce claim recitations. However, the use of such phrases
should not be construed to imply that the introduction of a claim
recitation by the indefinite articles "a" or "an" limits any
particular claim containing such introduced claim recitation to
inventions containing only one such recitation, even when the same
claim includes the introductory phrases "one or more" or "at least
one" and indefinite articles such as "a" or "an" (e.g., "a" and/or
"an" should typically be interpreted to mean "at least one" or "one
or more"); the same holds true for the use of definite articles
used to introduce claim recitations. In addition, even if a
specific number of an introduced claim recitation is explicitly
recited, those skilled in the art will recognize that such
recitation should typically be interpreted to mean at least the
recited number (e.g., the bare recitation of "two recitations,"
without other modifiers, typically means at least two recitations,
or two or more recitations). Furthermore, in those instances where
a convention analogous to "at least one of A, B, and C, etc." is
used, in general such a construction is intended in the sense one
having skill in the art would understand the convention (e.g., "a
system having at least one of A, B, and C" would include but not be
limited to systems that have A alone, B alone, C alone, A and B
together, A and C together, B and C together, and/or A, B, and C
together, etc.). In those instances where a convention analogous to
"at least one of A, B, or C, etc." is used, in general such a
construction is intended in the sense one having skill in the art
would understand the convention (e.g., "a system having at least
one of A, B, or C" would include but not be limited to systems that
have A alone, B alone, C alone, A and B together, A and C together,
B and C together, and/or A, B, and C together, etc.). It will be
further understood by those within the art that virtually any
disjunctive word and/or phrase presenting two or more alternative
terms, whether in the description, claims, or drawings, should be
understood to contemplate the possibilities of including one of the
terms, either of the terms, or both terms. For example, the phrase
"A or B" will be understood to include the possibilities of "A" or
"B" or "A and B."
[0091] While various aspects and embodiments have been disclosed
herein, other aspects and embodiments will be apparent to those
skilled in the art. The various aspects and embodiments disclosed
herein are for purposes of illustration and are not intended to be
limiting, with the true scope and spirit being indicated by the
following claims.
* * * * *
References