U.S. patent application number 12/842977 was filed with the patent office on 2010-11-25 for bioarray chip reaction apparatus and its manufacture.
This patent application is currently assigned to Affymetrix, INC.. Invention is credited to Donald M. Besemer, Virginia W. Goss, James L. Winkler.
Application Number | 20100298165 12/842977 |
Document ID | / |
Family ID | 22969439 |
Filed Date | 2010-11-25 |
United States Patent
Application |
20100298165 |
Kind Code |
A1 |
Besemer; Donald M. ; et
al. |
November 25, 2010 |
BIOARRAY CHIP REACTION APPARATUS AND ITS MANUFACTURE
Abstract
A body 300 having a cavity 310 for mounting a substrate 120
fabricated with probe sequences at known locations according to the
methods disclosed in U.S. Pat. No. 5,143,854 and PCT WO 92/10092 or
others, is provided. The cavity includes inlets 350 and 360 for
introducing selected fluids into the cavity to contact the probes.
Accordingly, a commercially feasible device for use in high
throughput assay systems is provided.
Inventors: |
Besemer; Donald M.; (Los
Altos Hills, CA) ; Goss; Virginia W.; (Santa Barbara,
CA) ; Winkler; James L.; (Sunnyvale, CA) |
Correspondence
Address: |
AFFYMETRIX, INC;ATTN: CHIEF IP COUNSEL, LEGAL DEPT.
3420 CENTRAL EXPRESSWAY
SANTA CLARA
CA
95051
US
|
Assignee: |
Affymetrix, INC.
Santa Clara
CA
|
Family ID: |
22969439 |
Appl. No.: |
12/842977 |
Filed: |
July 23, 2010 |
Related U.S. Patent Documents
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Application
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Filing Date |
Patent Number |
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12265048 |
Nov 5, 2008 |
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12842977 |
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11378954 |
Mar 20, 2006 |
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12265048 |
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10992043 |
Nov 17, 2004 |
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11378954 |
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10877666 |
Jun 25, 2004 |
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10992043 |
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10976077 |
Oct 27, 2004 |
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10877666 |
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10980454 |
Nov 2, 2004 |
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10976077 |
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10795603 |
Mar 8, 2004 |
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10980454 |
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10789678 |
Feb 27, 2004 |
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10795603 |
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10995882 |
Nov 22, 2004 |
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10789678 |
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Nov 22, 2004 |
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Nov 22, 2004 |
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10996201 |
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Dec 16, 2004 |
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10996291 |
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11259418 |
Oct 26, 2005 |
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11015197 |
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10619224 |
Jul 12, 2003 |
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10992043 |
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10619224 |
Jul 12, 2003 |
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10877666 |
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Current U.S.
Class: |
506/9 ; 506/13;
506/40 |
Current CPC
Class: |
B01J 2219/00725
20130101; B01L 2300/0816 20130101; C40B 70/00 20130101; B01F
13/0059 20130101; B01J 2219/00722 20130101; B01L 2200/025 20130101;
C40B 40/10 20130101; G01N 33/54366 20130101; B01L 3/5027 20130101;
Y10T 436/112499 20150115; B82Y 30/00 20130101; C40B 40/06 20130101;
B01L 2200/0689 20130101; B01L 9/527 20130101; B01J 2219/00531
20130101; Y10S 435/97 20130101; B01J 2219/00612 20130101; Y10S
436/809 20130101; B01J 2219/00371 20130101; B01J 2219/00547
20130101; B01J 2219/00626 20130101; B01J 2219/00662 20130101; B01J
2219/00608 20130101; C12Q 1/6874 20130101; B01J 2219/0059 20130101;
B01J 2219/00605 20130101; B01F 13/08 20130101; B01J 2219/00689
20130101; B01J 2219/00711 20130101; B01J 2219/00659 20130101; B01J
2219/0054 20130101; B01F 13/02 20130101; B01L 2400/0487 20130101;
B01J 2219/00585 20130101; B01J 2219/00695 20130101; B01L 3/502707
20130101; B01J 2219/00527 20130101; B01L 2300/0636 20130101; C40B
40/12 20130101; C40B 60/14 20130101; B01L 3/502715 20130101; B01J
2219/00536 20130101; B01L 2200/027 20130101; B01J 2219/00731
20130101; G01N 2035/00158 20130101; B01L 2300/0877 20130101; B01L
2200/12 20130101; B01J 2219/00596 20130101; B01J 2219/00432
20130101; B01J 19/0046 20130101; G01N 33/543 20130101; B01L
2300/0825 20130101; B01J 2219/00529 20130101; C07H 21/00 20130101;
Y10S 435/973 20130101 |
Class at
Publication: |
506/9 ; 506/13;
506/40 |
International
Class: |
C40B 30/04 20060101
C40B030/04; C40B 40/00 20060101 C40B040/00; C40B 60/14 20060101
C40B060/14 |
Claims
1. An apparatus for detecting an analyte in a test sample
comprising: at least one probe array, wherein the at least one
probe array comprises: a plurality of particles having biological
polymers immobilized on the plurality of particles thereon; a
slide, wherein the plurality of particles are attached to a surface
of the slide; and a barcode for identifying the at least one probe
array on the slide.
2. The apparatus according to claim 1, wherein the different
particles in the plurality of particles have different biological
polymers immobilized thereon.
3. The apparatus according to claim 1, wherein the plurality of
particles are spheres.
4. The apparatus according to claim 1, wherein the slide is
silica.
5. The apparatus according to claim 1, wherein the slide is
glass.
6. The apparatus according to claim 1, wherein the biological
polymers are immobilized on the slide at a density exceeding 400
different biological polymers per cm.sup.2.
7. The apparatus according to claim 6, wherein the biological
polymers are immobilized on the slide at a density exceeding 100
different biological polymers per cm.sup.2.
8. The apparatus according to claim 1, wherein the plurality of
particles forms an ordered arrangement on the surface of the
slide.
9. The apparatus according to claim 8, wherein the ordered
arrangement on the surface is circular.
10. The apparatus according to claim 8, wherein the ordered
arrangement on the surface is rectangular.
11. The apparatus according to claim 1, wherein the at least one
probe array is less than 9 probe arrays.
12. The apparatus according to claim 11, wherein the at least one
probe array is 1 probe array.
13. A package for supporting a probe array, comprising: a plurality
of particles having biological polymers immobilized on the
plurality of particles thereon; a slide, wherein the plurality of
particles are attached to a surface of the slide; and a top piece
and a bottom piece, wherein the top bottom pieces house the first
wafer, creating at least one cavity such that at least one probe
array is in fluid communication with the reaction chamber.
14. The package according to claim 13, further comprising a bar
code associated with the at least one probe array.
15. The package according to claim 14, further comprising at least
one aligning pin and holes to assist in assembling the top piece
and the bottom piece together.
16. The package according to claim 13, further comprising screws to
assemble the top piece, bottom piece and the at least one probe
array together.
17. The package according to claim 13, further comprising clamps to
assemble the top piece, bottom piece and the at least one probe
array together.
18. The package according to claim 13, further comprising at least
one inlet port to introduce a fluid into the cavity.
19. The package according to claim 18, further comprising a septum
to seal the at least one inlet ports.
20. The package according to claim 18, further comprising at least
one channel for fluid transfer between the at least one inlet port
and the cavity.
21. The package according to claim 14, further comprising at least
one gasket to form a liquid tight seal around the cavity between
the top piece and the at least one probe array.
22. The package according to claim 23, wherein the gaskets are
O-rings.
23. The package according to claim 14, wherein the bottom piece
comprises a depression to position the at least one probe
array.
24. A method of using a probe array, comprising: providing at least
one probe array, wherein the at least one probe array comprises: a
plurality of particles having biological polymers immobilized on
the plurality of particles thereon and a slide, wherein the
plurality of particles are attached to a surface of the slide;
providing a housing, wherein the housing comprises a cavity to
accommodate a fluid to be in contact with the slide; placing the
slide into the housing; sealably mounting the slide within the
housing comprising a mounting surface and a fluid cavity, wherein
the fluid cavity comprises at least one inlet port constructed to
permit fluid flow into the cavity through the at least one inlet
port, wherein the sealably mounting act provides the at least one
probe array located inside the cavity; introducing the fluid inside
the cavity to hybridize the at least one probe array on the slide;
performing hybridization, wherein at least some of the polymers
hybridizes to a target; aligning the at least one probe array,
wherein the at least one probe array comprises at least one
alignment feature; and detecting a signal from the at least one
probe array using a scanner.
25. The method according to claim 24, further comprising reading a
bar code associated with the probe array, wherein the slide
comprises a bar code.
26. The method according to claim 24, wherein the inlet port
comprises of a septum sealed port which uses one or more needles to
permit fluid flow into the cavity.
27. The method according to claim 24, further comprising a fluid
mixing step, wherein the cavity is at least partially filled with
the fluid during mixing.
28. The method according to claim 27 wherein the fluid mixing
occurs using the motion of gas relative to fluid in the cavity.
29. The method according to claim 27 wherein said fluid mixing uses
agitation.
30. The method according to claim 27 wherein said agitation uses
vortexing.
31. An apparatus for mixing a fluid, the apparatus comprising: a
pump, wherein a first housing comprises the pump; a probe array; a
substrate, wherein the substrate and the probe array create at
least one cavity for a fluid; at least one bubble disposed within
said chamber, wherein the at least one bubble is moved by using the
pump to move the bubble relative to the fluid to effect mixing the
fluid.
32. The apparatus as in claim 31 wherein the at least one bubble is
formed using a nitrogen gas.
33. The apparatus as in claim 31, wherein, the pump transfers the
fluid from a first container through the cavity and into a second
container.
34. The apparatus as in claim 31, wherein, the means for moving the
fluid is through agitation.
35. A fluidic station comprising: a base that is adapted to provide
a framework for the fluidics station; a mounting system coupled to
the base, wherein the mounting system is movable between a loading
position and a closed position, the mounting system comprising: a
bottom piece adapted to receive a wafer, wherein a wafer comprises
at least one probe array, wherein the bottom piece is adapted to
receive a top piece positioned above the wafer forming at least one
cavity for fluid to be in contact with the wafer and forming a
package comprising at least an inlet port and an outlet port for
fluid transfer and connecting with at least one cavity; at least
one needle coupled to the base frame, wherein the needle includes a
distal end and side ports above the distal ends; and at least one
fluid source in communication with the at least one needle, wherein
the wafer is insertable into the mounting system when in the
loading position, and wherein the at least one needle is adapted to
transfer liquid into the package through the liquid channels when
in the closed position.
Description
CROSS-REFERENCES TO RELATED APPLICATIONS
[0001] This application is a continuation of U.S. patent
application Ser. No. 10/992,043, filed on Nov. 17, 2004, which is a
continuation of U.S. patent application Ser. No. 10/619,224, filed
Jul. 12, 2003, which is a continuation of U.S. patent application
Ser. No. 10/229,759, filed Aug. 28, 2002, now U.S. Pat. No.
6,733,977, which is a continuation of U.S. patent application Ser.
No. 10/046,623, filed Jan. 14, 2002, now U.S. Pat. No. 6,551,817,
which is a continuation of U.S. patent application Ser. No.
09/907,196, filed Jul. 17, 2001, now U.S. Pat. No. 6,399,365, which
is a continuation of U.S. patent application Ser. No. 09/302,052,
filed Apr. 29, 1999, now U.S. Pat. No. 6,287,850, which is a
continuation of U.S. patent application Ser. No. 08/485,452, filed
Jun. 7, 1995, now U.S. Pat. No. 5,945,334, which is a
continuation-in-part of U.S. patent application Ser. No.
08/255,682, filed Jun. 8, 1994, now abandoned. Each of these
applications is incorporated herein in its entirety by reference
for all purposes.
BACKGROUND OF THE INVENTION
[0002] The present inventions relate to the fabrication and
placement of materials at known locations on a substrate. In
particular, one embodiment of the invention provides a method and
associated apparatus for packaging a substrate having diverse
sequences at known locations on its surface.
[0003] Techniques for forming sequences on a substrate are known.
For example, the sequences may be formed according to the
pioneering techniques disclosed in U.S. Pat. No. 5,143,854 (Pirrung
et al.), PCT WO 92/10092, or U.S. application Ser. No. 08/249,188,
now U.S. Pat. No. 5,571,639, incorporated herein by reference for
all purposes. The prepared substrates will have a wide range of
applications. For example, the substrates may be used for
understanding the structure-activity relationship between different
materials or determining the sequence of an unknown material. The
sequence of such unknown material may be determined by, for
example, a process known as sequencing by hybridization. In one
method of sequencing by hybridization, a sequences of diverse
materials are formed at known locations on the surface of a
substrate. A solution containing one or more targets to be
sequenced is applied to the surface of the substrate. The targets
will bind or hybridize with only complementary sequences on the
substrate.
[0004] The locations at which hybridization occurs can be detected
with appropriate detection systems by labeling the targets with a
fluorescent dye, radioactive isotope, enzyme, or other marker.
Exemplary systems are described in U.S. Pat. No. 5,143,854 (Pirrung
et al.) and U.S. patent application Ser. No. 08/143,312, also
incorporated herein by reference for all purposes. Information
regarding target sequences can be extracted from the data obtained
by such detection systems.
[0005] By combining various available technologies, such as
photolithography and fabrication techniques, substantial progress
has been made in the fabrication and placement of diverse materials
on a substrate. For example, thousands of different sequences may
be fabricated on a single substrate of about 1.28 cm.sup.2 in only
a small fraction of the time required by conventional methods. Such
improvements make these substrates practical for use in various
applications, such as biomedical research, clinical diagnostics,
and other industrial markets, as well as the emerging field of
genomics, which focuses on determining the relationship between
genetic sequences and human physiology.
[0006] As commercialization of such substrates becomes widespread,
an economically feasible and high-throughput device and method for
packaging the substrates are desired.
SUMMARY OF THE INVENTION
[0007] Methods and devices for packaging a substrate having an
array of probes fabricated on its surface are disclosed. In some
embodiments, a body containing a cavity is provided. A substrate
having an array of probes is attached to the cavity using, for
example, an adhesive. The body includes inlets that allow fluids
into and through the cavity. A seal is provided for each inlet to
retain the fluid within the cavity. An opening is formed below the
cavity to receive a temperature controller for controlling the
temperature in the cavity. By forming a sealed thermostatically
controlled chamber in which fluids can easily be introduced, a
practical medium for sequencing by hybridization is provided.
[0008] In other embodiments, the body is formed by acoustically
welding two pieces together. The concept of assembling the body
from two pieces is advantageous. For example, the various features
of the package (i.e., the channels, sealing means, and orientation
means) are formed without requiring complex machining or designing.
Thus, the packages are produced at a relatively low cost.
[0009] In connection with one aspect of the invention, a method for
making the chip package is disclosed. In particular, the method
comprises the steps of first forming a plurality of probe arrays on
a substrate and separating the substrate into a plurality of chips.
Typically, each chip contains at least one probe array. A chip is
then mated to a package having a reaction chamber with fluid
inlets. When mated, the probe array is in fluid communication with
the reaction chamber.
[0010] In a specific embodiment, the present invention provides an
apparatus for packaging a substrate. The present apparatus includes
a substrate having a first surface and a second surface. The first
surface includes a probe array and the second surface is an outer
periphery of the first surface. The present apparatus also includes
a body having a mounting surface, an upper surface, and a cavity
bounded by the mounting surface and the upper surface. The second
surface is attached to the cavity and the first surface is within
the cavity. A cover attached to the mounting surface for defining
an upper boundary to the cavity is also included. The cavity
includes a diffuser and a concentrator. The diffuser and the
concentrator permit laminar fluid flow through the cavity.
[0011] A further understanding of the nature and advantages of the
inventions herein may be realized by reference to the remaining
portions of the specification and the attached drawings.
BRIEF DESCRIPTION OF THE DRAWINGS
[0012] FIG. 1a illustrates a wafer fabricated with a plurality of
probe arrays.
[0013] FIG. 1b illustrates a chip.
[0014] FIG. 2a illustrates a scribe and break device.
[0015] FIG. 2b illustrates the wafer mounted on a pick and place
frame.
[0016] FIGS. 2c-2d illustrate the wafer, as displayed by the scribe
and break device during alignment.
[0017] FIG. 3 illustrates a chip packaging device.
[0018] FIG. 4 illustrates the chip packaging device assembled from
two components.
[0019] FIGS. 5a-5b illustrate the top and bottom view of a top
casing of the chip packaging device.
[0020] FIG. 5c illustrates a different cavity orientation.
[0021] FIG. 6 illustrates a cross sectional view of the packaging
device.
[0022] FIG. 7 illustrates the bottom view of a bottom casing of the
chip packaging device.
[0023] FIGS. 8a-8b illustrate an acoustic welding system.
[0024] FIGS. 9a-9c illustrate the acoustic welding process used in
assembling the chip packaging device.
[0025] FIG. 10 illustrates an adhesive dispensing system used in
attaching the chip to the chip packaging device.
[0026] FIGS. 11, 12a, 12b and 13 illustrate in greater detail the
adhesive dispensing system of FIG. 10.
[0027] FIGS. 14a-14d illustrate the procedure for aligning the
system of FIG. 10.
[0028] FIGS. 15a-15e illustrate images obtained during the
alignment process of FIGS. 14a-14d.
[0029] FIGS. 16a-16b illustrate an alternative embodiment of a
packaging device.
[0030] FIGS. 17a-17b illustrate another embodiment of a packaging
device.
[0031] FIG. 18 illustrates an alternative embodiment for attaching
the chip to the packaging device.
[0032] FIG. 19 illustrates another embodiment for attaching the
chip to the packaging device.
[0033] FIGS. 20a-20b illustrate yet another embodiment for
attaching the chip to the packaging device.
[0034] FIG. 21 illustrates an alternative embodiment for attaching
the chip to the packaging device.
[0035] FIG. 22 illustrates another embodiment for attaching the
chip to the packaging device.
[0036] FIG. 23 illustrates an alternative embodiment for sealing
the cavity on the packaging device.
[0037] FIG. 24 illustrates another alternative embodiment for
sealing the cavity on the packaging device.
[0038] FIG. 25 illustrates yet another embodiment for sealing the
cavity on the packaging device.
[0039] FIGS. 26a-26b illustrate an alternative embodiment for
sealing the cavity on the packaging device.
[0040] FIGS. 27a-27b illustrate an alternative embodiment for
mounting the chip.
[0041] FIG. 28 illustrates an agitation system.
[0042] FIG. 29 illustrates an alternative embodiment of the
agitation system.
[0043] FIG. 30 illustrates another embodiment of the agitation
system.
[0044] FIG. 31 illustrates an alternative embodiment of a chip
packaging device.
[0045] FIG. 32 illustrates side-views of the chip packaging device
of FIG. 31.
[0046] FIGS. 33-35 illustrate in greater detail the chip packaging
device of FIG. 31.
[0047] FIG. 36 illustrates a further alternative embodiment of a
chip packaging device.
DESCRIPTION OF THE SPECIFIC EMBODIMENTS
Contents
[0048] I. Definitions
[0049] II. General
[0050] III. Details of One Embodiment of Invention [0051] a. Chip
Package [0052] b. Assembly of Chip Package [0053] c. Chip
Attachment
[0054] IV. Details on Alternative Embodiments [0055] a. Chip
Package [0056] b. Chip Attachment [0057] c. Fluid Retention [0058]
d. Chip Orientation [0059] e. Parallel Diagnostics
[0060] V. Details of an Agitation System
1. Definitions
[0061] The following terms are intended to have the following
general meanings as they are used herein: [0062] 1. Probe: A probe
is a surface-immobilized molecule that is recognized by a
particular target and is sometimes referred to as a ligand.
Examples of probes that can be investigated by this invention
include, but are not restricted to, agonists and antagonists for
cell membrane receptors, toxins and venoms, viral epitopes,
hormones (e.g., opioid peptides, steroids, etc.), hormone
receptors, peptides, enzymes, enzyme substrates, cofactors, drugs,
lectins, sugars, oligonucleotides or nucleic acids,
oligosaccharides, proteins, and monoclonal antibodies. [0063] 2.
Target: A target is a molecule that has an affinity for a given
probe and is sometimes referred to as a receptor. Targets may be
naturally-occurring or manmade molecules. Also, they can be
employed in their unaltered state or as aggregates with other
species. Targets may be attached, covalently, or noncovalently, to
a binding member, either directly or via a specific binding
substance. Examples of targets which can be employed by this
invention include, but are not restricted to, antibodies, cell
membrane receptors, monoclonal antibodies and antisera reactive
with specific antigenic determinants (such as on viruses, cells or
other materials), drugs, oligonucleotides or nucleic acids,
peptides, cofactors, lectins, sugars, polysaccharides, cells,
cellular membranes, and organelles. Targets are sometimes referred
to in the art as anti-probes or anti-ligands. As the term "targets"
is used herein, no difference in meaning is intended. A "Probe
Target Pair" is formed when two macromolecules have combined
through molecular recognition to form a complex.
II. General
[0064] The present invention provides economical and efficient
packaging devices for a substrate having an array of probes
fabricated thereon. The probe arrays may be fabricated according to
the pioneering techniques disclosed in U.S. Pat. No. 5,143,854
(Pirrung et al.), PCT WO 92/10092, or U.S. application Ser. No.
08/249,188 filed May 24, 1994, already incorporated herein by
reference for all purposes. According to one aspect of the
techniques described therein, a plurality of probe arrays are
immobilized at known locations on a large substrate or wafer.
[0065] FIG. 1a illustrates a wafer 100 on which numerous probe
arrays 110 are fabricated. The wafer 100 may be composed of a wide
range of material, either biological, nonbiological, organic,
inorganic, or a combination of any of these, existing as particles,
strands, precipitates, gels, sheets, tubing, spheres, containers,
capillaries, pads, slices, films, plates, slides, etc. The wafer
may have any convenient shape, such as a disc, square, sphere,
circle, etc. The wafer is preferably flat but may take on a variety
of alternative surface configurations. For example, the wafer may
contain raised or depressed regions on which a sample is located.
The wafer and its surface preferably form a rigid support on which
the sample can be formed. The wafer and its surface are also chosen
to provide appropriate light-absorbing characteristics. For
instance, the wafer may be a polymerized Langmuir Blodgett film,
functionalized glass, Si, Ge, GaAs, GaP, SiO2, SiN4, modified
silicon, or any one of a wide variety of gels or polymers such as
(poly)tetrafluoroethylene, (poly)vinylidenedifluoride, polystyrene,
polycarbonate, or combinations thereof. Other materials with which
the wafer can be composed of will be readily apparent to those
skilled in the art upon review of this disclosure. In a preferred
embodiment, the wafer is flat glass or single-crystal silicon.
[0066] Surfaces on the solid wafer will usually, though not always,
be composed of the same material as the wafer. Thus, the surface
may be composed of any of a wide variety of materials, for example,
polymers, plastics, resins, polysaccharides, silica or silica-based
materials, carbon, metals, inorganic glasses, membranes, or any of
the above-listed wafer materials.
[0067] Wafer 100 includes a plurality of marks 145 that are located
in streets 150 (area adjacent to the probe arrays). Such marks may
be used for aligning the masks during the probe fabrication
process. In effect, the marks identify the location at which each
array 110 is to be fabricated. The probe arrays may be formed in
any geometric shape. In some embodiments, the shape of the array
may be squared to minimize wasted wafer area. After the probe
arrays have been fabricated, the wafer is separated into smaller
units known as chips. The wafer, for example, may be about
5.times.5 inches on which 16 probe arrays, each occupying an area
of about 12.8 cm.sup.2, are fabricated.
[0068] FIG. 1b illustrates a chip that has been separated from the
wafer. As illustrated, chip 120 contains a probe array 110 and a
plurality of alignment marks 145. The marks serve multiple
functions, such as: 1) aligning the masks for fabricating the probe
arrays, 2) aligning the scriber for separating the wafer into
chips, and 3) aligning the chip to the package during the
attachment process. In some embodiments, such chips may be of the
type known as Very Large Scale Immobilized Polymer Synthesis
(VLSIPS.TM.) chips.
[0069] According to a specific embodiment, the chip contains an
array of genetic probes, such as an array of diverse RNA or DNA
probes. In some embodiments, the probe array will be designed to
detect or study a genetic tendency, characteristic, or disease. For
example, the probe array may be designed to detect or identify
genetic diseases such as cystic fibrosis or certain cancers (such
as P53 gene relevant to some cancers), as disclosed in U.S. patent
application Ser. No. 08/143,312, already incorporated by
reference.
[0070] According to one embodiment, the wafer is separated into a
plurality of chips using a technique known as scribe and break.
FIG. 2a illustrates a fully programmable computer controlled scribe
and break device, which in some embodiments is a DX-III Scriber
breaker manufactured by Dynatex International.TM.. As shown, the
device 200 includes a base 205 with a rotation stage 220 on which a
wafer is mounted. The rotation stage includes a vacuum chuck for
fixing the wafer thereon. A stepper motor, which is controlled by
the system, rotates stage 220. Located above the stage is a head
unit 230 that includes a camera 232 and cutter 231. Head unit 230
is mounted on a dual-axis frame. The camera generates an image of
the wafer on video display 210. The video display 210 includes a
cross hair alignment nark 215. The camera, which includes a zoom
lens and a fiber optic light, allows a user to inspect the wafer on
the video display 210. A control panel 240 is located on the base
for operating device 200.
[0071] In operation, a user places a wafer 100 on a frame 210 as
illustrated in FIG. 2b. The surface of frame 210 is composed of a
flexible and sticky material. The tackiness of the frame prevents
the chips from being dispersed and damaged during the breaking
process. Frame 210 may be a pick and place frame or a hoop that is
commonly associated with fabrication of semiconductors. Referring
back to FIG. 2a, a user places the frame with the wafer on the
rotation stage 220. In some embodiments, the frame is held on the
rotation stage by vacuum pressure. The user then aligns the wafer
by examining the image displayed on the video display 210.
[0072] According to one embodiment, wafer alignment is achieved in
two steps. First, using the control panel 240, the user rotates
stage 220. The stage is rotated until streets 150 are aligned with
the cross hair 215 on the display, as illustrated in FIG. 2c. Next,
the user moves the cutter until it is aligned at the center of one
of the streets. This step is performed by aligning horizontal line
216 of the cross hair between alignment marks 145, as shown in FIG.
2d.
[0073] Once the cutter is aligned, the user instructs the device to
scribe the wafer. In some embodiments, various options are
available to the user, such as scribe angle; scribe pressure, and
scribe depth. These parameters will vary depending on the
composition and/or thickness of the wafer. Preferably, the
parameters are set to scribe and break the wafer without causing
any damage thereto or penetrating through the frame. The device
repeatedly scribes the wafer until all the streets in one axis have
been scribed, which in one embodiment is repeated 5 times (a
4.times.4 matrix of probe arrays). The user then rotates the stage
90.degree. to scribe the perpendicular streets.
[0074] Once the wafer has been scribed, the user instructs the
device to break or separate the wafer into chips. Referring back to
FIG. 2a, the device 200 breaks the wafer by striking it beneath the
scribe with an impulse bar located under the rotation table 220.
The shock from the impulse bar fractures the wafer along the
scribe. Since most of the force is dissipated along the scribe,
device 200 is able to produce high breaking forces without exerting
significant forces on the wafer. Thus, the chips are separated
without causing any damage to the wafer. Once separated, the chips
are then packaged. Of course, other more conventional techniques,
such as the sawing technique disclosed in U.S. Pat. No. 4,016,855,
incorporated herein by reference for all purposes, may be
employed.
III. Details of One Embodiment of the Invention
[0075] a. Chip Package
[0076] FIG. 3 illustrates a device for packaging the chips. Package
300 contains a cavity 310 on which a chip is mounted. The package
includes inlets 350 and 360 which communicate with cavity 310.
Fluids are circulated through the cavity via inlets 350 and 360. A
septum, plug, or other seal may be employed to seal the fluids in
the cavity. Alignment holes 330 and 335 may be provided for
alignment purposes. In some embodiments, the package may include a
non-flush edge 320. In some detection systems, the packages may be
inserted into a holder similar to an audio cassette tape. The
asymmetrical design of the package will assure correct package
orientation when inserted into the holder.
[0077] FIG. 4 illustrates one embodiment of the package. As shown
in FIG. 4, the chip package is manufactured by mating two
substantially complementary casings 410 and 420 to form finished
assembly 300. Preferably, casings 410 and 420 are made from
injection molded plastic. Injection molding enables the casings to
be formed inexpensively. Also, assembling the package from two
parts simplifies the construction of various features, such as the
internal channels for introducing fluids into the cavity. As a
result, the packages may be manufactured at a relatively low
cost.
[0078] FIGS. 5a-5b show the top casing 410 in greater detail. FIG.
5a shows a top view and FIG. 5b shows a bottom view. Referring to
FIG. 5a, top casing 410 includes an external planar surface 501
having a cavity 310 therein. In some embodiments, the surface area
of casing 410 sufficiently accommodates the cavity. Preferably, the
top casing is of sufficient size to accommodate identification
labels or bar codes in addition to the cavity. In a specific
embodiment, the top casing is about 1.5'' wide, 2'' long, and 0.2''
high.
[0079] Cavity 310 is usually, though not always, located
substantially at the center of surface 501. The cavity may have any
conceivable size, shape, or orientation. Preferably, the cavity is
slightly smaller than the surface area of the chip to be placed
thereon and has a volume sufficient to perform hybridization. In
one embodiment, the cavity may be about 0.58'' wide, 0.58'' long,
and 0.2'' deep.
[0080] Cavity 310 may include inlets 350 and 360. Selected fluids
are introduced into and out of the cavity via the inlets. In some
embodiments, the inlets are located at opposite ends of the cavity.
This configuration improves fluid circulation and regulation of
bubble formation in the cavity. The bubbles agitate the fluid,
increasing the hybridization rate between the targets and
complementary probe sequences. In one embodiment, the inlets are
located at the top and bottom end of the cavity when the package is
oriented vertically such as at the opposite corners of the cavity.
Locating the inlet at the highest and lowest positions in the
cavity facilitates the removal of bubbles from the cavity.
[0081] FIG. 5c illustrates an alternative embodiment in which
cavity 310 is oriented such that the edges of the cavity 310 and
the casing 410 are non-parallel. This configuration allows inlets
350 and 360 to be situated at the absolute highest and lowest
locations in the cavity when the package is vertically oriented. As
a result, bubbles or fluid droplets are prevented from being
potentially trapped in the cavity.
[0082] Referring back to FIG. 5a, a depression 550 surrounds the
cavity. In some embodiments, a ridge 560 may be provided at the
edge of the depression so as to form a trough. The ridge serves to
support the chip above the cavity. To attach the chip to the
package, an adhesive may be deposited in the trough. This
configuration promotes efficient use of chip surface area, thus
increasing the number of chips yielded from a wafer.
[0083] Top casing 410 includes alignment holes 330 and 335. In some
embodiments, holes 330 and 335 are different in size to ensure
correct orientation of the package when mounted on an alignment
table. Alternatively, the holes may have different shapes to
achieve this objective. Optionally, the holes taper radially inward
from surface 501 toward 502 to reduce the friction against
alignment pins while still maintaining adequate contact to prevent
slippage.
[0084] Referring to FIG. 5b, channels 551 and 561 are optionally
formed on internal surface 502. Channels 551 and 561 communicate
with inlets 350 and 360 respectively. A depression 590 is formed
below cavity. According to some embodiments, the shape of
depression 590 is symmetrical to the cavity with exception to
corners 595 and 596, which accommodate the inlets. The depth of
depression 590 may be, for example, about 0.7''. As a result, the
bottom wall of the cavity is about 0.05'' thick. Depression 590 may
receive a temperature controller to monitor and maintain the cavity
at the desired temperature. By separating the temperature
controller and cavity with a minimum amount of material, the
temperature within the cavity may be controlled more efficiently
and accurately. Alternatively, channels may be formed on surface
502 for circulating air or water to control the temperature within
the cavity.
[0085] In some embodiments, certain portions 595 of internal
surface 502 may be eliminated or cored without interfering with the
structural integrity of the package when assembled. Coring the
casing reduces the wall thickness, causing less heat to be retained
during the injection molding process; potential shrinkage or
warpage of the casing is significantly reduced. Also, coring
decreases the time required to cool the casing during the
manufacturing process. Thus, manufacturing efficiency is
improved.
[0086] In one embodiment, the top casing and bottom casing are
mated together using a technique known as acoustic or ultrasonic
welding. Accordingly, "energy directors" 510 are provided. Energy
directors are raised ridges or points, preferably v-shaped, that
are used in an acoustic welding process. The energy directors are
strategically located, for example, to seal the channels without
interfering with other features of the package and to provide an
adequate bond between the two casings. Alternatively, the casings
may be mated together by screws, glue, clips, or other mating
techniques.
[0087] FIG. 6 shows a cross sectional view of the cavity 310 with
chip 120 mounted thereon in detail. As shown, a depression 550 is
formed around cavity 310. The depression includes a ridge 560 which
supports chip 120. The ridge and the depression create a trough
around cavity 310. In some embodiments, the trough is sufficiently
large to receive an adhesive 630 for attaching the chip to the
package. In one embodiment, the trough is about 0.08'' wide and
0.06'' deep. When mounted, the edge of the chip protrudes slightly
beyond ridge 550, but without contacting side 625 of the
depression. This configuration permits the adhesive to be dispensed
onto the trough and provides adequate surface area for the adhesive
to attach chip 120 to the package.
[0088] According to some embodiments, the back surface 130 of chip
120 is at least flush or below the plane formed by surface 501 of
casing 410. As a result, chip 120 is shielded by surface 501 from
potential damage. This configuration also allows the packages to be
easily stored with minimal storage area since the surfaces are
substantially flat.
[0089] Optionally, the bottom of the cavity includes a light
absorptive material, such as a glass filter or carbon dye, to
prevent impinging light from being scattered or reflected during
imaging by detection systems. This feature improves the
signal-to-noise ratio of such systems by significantly reducing the
potential imaging of undesired reflected light.
[0090] FIG. 7 shows the internal surface of bottom casing 420 in
greater detail. As shown, the bottom casing 420 is substantially
planar and contains an opening 760 therein. Preferably, the casing
420 is slightly wider or slightly longer than the top casing. In
one embodiment, casing 420 is about 1.6'' wide, 2.0'' long, and
0.1'' deep, which creates a non-flush edge on the finish assembly.
As previously mentioned, this design ensures that the package is
correctly oriented when mounted onto the detection systems.
[0091] In some embodiments, opening 760 is spatially located at
about the depression below the cavity. The opening also has
substantially the same geometric configuration as the depression to
allow the temperature controller to contact as much of the bottom
of the cavity as possible.
[0092] Internal surface 701 of casing 420 includes depressions 730
and 740. A port 731 is located in depression 730 and a port 741 is
located in depression 740. Ports 731 and 741 communicate with
channels on the top casing (350 and 360 in FIG. 5b) when the
package is assembled. A seal 790, which may be a septum composed of
rubber, teflon/rubber laminate, or other sealing material is
provided for each depression. The septum may be of the type
commonly used to seal and reseal vessels when a needle is inserted
into the septum for addition/removal of fluids. The septums, when
seated in the depressions, extend slightly above surface, which in
some embodiments is about 0.01''.
[0093] This design causes casings 410 and 420 to exert pressure on
the septum, forming a seal between the ports and the channels. The
seal is maintained even after fluid is injected into the cavity
since the pressure immediately forces the septum to reseal itself
after the needle or other fluid injecting means is removed from the
port. Thus, an efficient and economical seal for retaining fluid in
the cavity is provided.
[0094] Also, casing 420 includes the complementary half alignment
holes 330 and 335, each tapering radially inward from the external
surface. Further, certain areas 765 on internal surface 701 may be
cored, as similar to the internal surface of the top casing.
[0095] FIG. 31 is a simplified illustration of an alternative
embodiment of a chip packaging device 3100 according to the
present, invention. The chip packaging device includes a plurality
of casings 3200, 3300, and 3400. The casings may be defined as a
top casing 3200, a middle casing 3300, and a bottom casing 3400.
The casings are made of known plastic materials such as ABS
plastic, polyvinylchloride, polyethylene, products sold under the
trademarks TEFLON.TM. and KALREZ.TM. and the like, among others.
Preferably, the casings can be made by way of injection molding and
the like. Assembling the chip packaging device from three casings
simplifies construction for the fabrication of internal channels
and the like, and can also be made at a relatively low cost.
[0096] Support structures (or alignment holes) exist at selected
locations of the chip packing device. The support structures can be
used to mount or position the chip packaging device to an
apparatus, e.g., scanner or the like. In an embodiment, the top
casing 3200 includes support structures 3201 and 3203 on each side
of a center opening 3209. The middle casing 3300 includes similar
support structures 3313 and 3315 which are complementary to the
support structures 3201 and 3203, respectively, in the top casing.
The bottom casing also includes similar support structures 3403 and
3401, respectively, which are complementary to the support
structures in the top casing and the middle casing. As shown, each
of the support structures on each side of the center opening align
with each other. Each support structure is, for example, an
aperture through the casing. The aperture includes an outer
periphery defined by a geometrical shape which may be round,
rectangular, trapezoidal, hexagonal, or the like.
[0097] The present chip packaging device assembles with use of
complementary alignment pins and bores on the casings. By way of
alignment pins (not shown), the top casing aligns with and inserts
into alignment bores 3301, 3303 in the middle casing 3300.
Alternatively, the middle casing can have alignment pins or the
like and the top casing has the alignment bores or the like. The
bottom casing includes alignment pins 3407 and 3409 which align to
and insert into alignment bores (not shown) in bottom portions of
the middle casing. The use of alignment bores and pins provide for
ease in assembly of the chip carrier. Upon assembly, the alignment
bores and pins on the casings prevent the casings from moving
laterally relative to each other.
[0098] A center opening 3209 in the top casing overlies a center
portion 3317 of the middle casing 3300. The center portion 3317 of
the middle casing includes an inner annular region (or cavity
edges) with a bottom portion which is preferably a flat bottom
portion. The flat bottom portion of the middle, casing and portions
of the bottom casing including edges define a cavity 3405. A chip
is placed overlying an underlying portion of the cavity 3407.
[0099] Optionally, a temperature control mechanism such as a
heater, a cooler, or a combination thereof is disposed into the
center opening against the bottom portion of the middle casing. The
temperature control mechanism can be any suitable thermally
controlled element such as a resistive element, a temperature
controlled block or mass, thermoelectric modules, or the like. The
temperature control mechanism transfers heat via conduction to the
bottom center portion, which transfers heat to, for example, fluid
in the cavity or the chip. Alternatively, the temperature control
mechanism sinks heat away from, for example, fluid in the cavity or
the chip through the bottom center portion. The temperature control
mechanism maintains a selected temperature in the cavity. The
temperature control mechanism also includes a temperature detection
device such as a thermocouple which provides signals corresponding
to temperature readings. A controller receives the signals
corresponding to the temperature readings, and adjusts power output
to the temperature control mechanism to maintain the selected
temperature.
[0100] The top casing 3200 also includes channels 3205 and 3207 for
fluid transfer. The channels 3205 and 3207 communicate with annular
regions 3309 and 3311, respectively, on the middle casing 3300 for
fluid transfer. A septum, a plug, an o-ring, a gasket, or the like
via annular regions 3309 and 3311 seals fluids within the top
casing channels 3205 and 3207 and the middle casing. The bottom
casing includes channels 3411 and 3413 in communication with
channels 3307 and 3305, respectively. A septum, a plug, an o-ring,
a gasket, or the like seals the fluids within the bottom casing
channels 3411 and 3413 and the middle casing channels 3305 and
3307.
[0101] The chip packaging device provides an even distribution of
fluid (or fluid flow) through the cavity over a top surface (or
inner or active surface) of the chip. For example, a selected fluid
enters channel 3207, flows through channel 3307, changes direction
and flows through channel 3411, and evenly distributes into the
cavity 3405 over the top surface of the chip. As previously noted,
the cavity is defined by the flat bottom portion and cavity edges.
A selected fluid exits the cavity by way of channel 3413, channel
3305, and channel 3205. The fluid flow over the top surface of the
chip is preferably laminar, but may also be turbulent, a
combination thereof or the like. By way of the present chip
packaging device, a substantial portion of turbulent flow remains
at an upper portion of the channel 3411, and does not enter the
cavity.
[0102] Preferably, a selected fluid enters the cavity by way of
channel 3205, channel 3305, and channel 3413. The selected fluid
exits the cavity through channel 3411, channel 3307, and channel
3207. In a preferred embodiment, the fluid flows against the
direction of gravity through the cavity. Of course, other fluid
flow routes may also be employed depending upon the particular
application.
[0103] FIG. 32 illustrates an assembled chip packaging device 3100
according to the present invention. As shown are a top-view 3200, a
side-view 3500, a bottom-view 3400, and a front-view 3600 of the
assembled chip packaging device 3100. The assembled chip packaging
device 3100 includes the bottom casing 3400, the middle casing
3300, and the top casing 3200.
[0104] The top-view 3200 of the top casing includes alignment
structures 3205, 3215 surrounding opening 3209. The opening 3209
includes a bevelled annular region 3211 surrounding the periphery
of the channel 3209. The alignment bores 3203 and 3201 also include
bevelled annular regions 3213 and 3215, respectively. A bevelled
annular region 3217, 3221 also surrounds each fluid channel 3205,
3207 to assist with fluid flow therethrough.
[0105] The bottom-view 3400 of the bottom casing includes alignment
structures 3401, 3403 surrounding the cavity 3405. The cavity
includes a flat bottom peripheral portion 3415, a bevelled portion
3417 extending from the flat bottom peripheral portion, and a flat
upper portion 3419 surrounding the bevelled portion. The chip
includes an outer periphery which rests against the flat bottom
peripheral portion 3415. The bevelled portion aligns the chip onto
the flat bottom peripheral portion 3415. Similar to the previous
embodiments, the top casing extends outside 3421 the middle and
bottom casings.
[0106] The cavity 3405 is preferably located at a center of the
bottom casing, but may also be at other locations. The cavity may
be round, square, rectangular, or any other shape, and orientation.
The cavity is preferably smaller than the surface area of the chip
to be placed thereon, and has a volume sufficient to perform
hybridization and the like. In one embodiment, the cavity includes
dimensions such as a length of about 0.6 inch, a width of about 0.6
inch and a depth of about 0.07 inch.
[0107] In a preferred embodiment, the bottom casing with selected
cavity dimensions may be removed from the middle and top casings,
and replaced with another bottom casing with different cavity
dimensions. This allows a user to attach a chip having a different
size or shape by changing the bottom casing, thereby providing ease
in using different chip sizes, shapes, and the like. Of course, the
size, shape, and orientation of the cavity will depend upon the
particular application.
[0108] FIGS. 33-35 illustrate in greater detail the chip packaging
device of FIG. 31. FIG. 33 illustrates simplified top-view 3260 and
bottom-view 3250 diagrams of the top casing 3200. As shown, the
reference numerals refer to the same elements as the top casing of
FIG. 31. FIG. 34 illustrates a simplified top-view 3350 and
bottom-view 3360 diagrams of the middle casing 3300. As shown, the
reference numerals refer to the same elements as the middle casing
of FIG. 31. In addition, the bottom-view of the casing includes a
substantially smooth and planar bottom surface 3361. A portion of
the bottom surface defines an upper portion of the cavity. But the
bottom surface can also be textured, ridged, or the like to create
turbulence or a selected fluid flow through the cavity. The bottom
surface is preferably a hydrophobic surface which enhances laminar
flow through the cavity. Of course, the type of bottom surface
depends upon the particular application.
[0109] FIG. 35 illustrates simplified top-view 3460 and bottom-view
3450 diagrams of the bottom casing 3400. As shown, the reference
numerals refer to the same elements as the bottom casing of FIG.
31. In an embodiment, fluid from channel 3305 changes direction at
an upper portion 3431 of the channel and flows to a lower portion
3433 of the channel. Fluid evenly distributes from the lower
portion 3433 via a fluid distribution point 3435. The distributed
fluid evenly passes over a slanted edge (or bevelled edge) 3437
which drops fluid evenly to a top surface of the chip in the
cavity. By way of slanted edge 3427 which slopes up to a fluid
concentration point 3425, fluid leaves the cavity and enters the
channel 3411. In particular, fluid leaves the cavity and enters a
lower portion 3423 of the channel, flows through the channel, and
changes directions at an upper portion 3421 of the channel. Each
channel includes a length L and a width W. The distribution point
and the concentration point are positioned at a distance away from
the cavity to substantially prevent turbulence from forming in the
cavity, and in particular over the top surface of the chip. The
channels are each angled at an angle .THETA. ranging from about 2
degrees to about 90 degrees, but is preferably about 5 degrees to
about 45 degrees. The angle enhances an even distribution of
laminar flow into the cavity. Of course, the exact angle, channel
shape, and dimensions depend upon the particular application.
[0110] FIG. 36 illustrates a simplified cross-sectional view of an
alternative embodiment 3600 of the chip packaging device. The chip
packaging device includes the three casings 3200, 3300, and 3400 of
the previous embodiment, and also includes hollow pins, needles, or
the like 3601 and 3603. Each of the pins transfers a selected fluid
to and from the cavity 3405. Preferably, each pin 3601 includes an
external opening 3609, a tubular region 3611, an inner opening
3607, a pointed tip 3605, and other elements. The pin is made from
a suitable material such as a glass, a stainless steel or any other
high quality material to transfer fluids to and from the cavity
3405.
[0111] In a preferred embodiment, each pin is inserted into its
channel region 3205 or 3207. A point on the pin tip pierces
through, for example, a septum at an annular region 3309 or 3311. A
selected fluid travels through pin 3603 (through channel 3205 and
at least a portion of 3305), enters the upper region of channel
3413, and into the cavity 3405. The selected fluid travels from the
cavity, through pin 3601, and to the external apparatus.
[0112] Alternatively, the selected fluid enters the cavity via pin
3601 and exits the cavity via pin 3603. The selected fluid may also
enter the cavity via pin and exit the cavity through the channels
without use of a pin. The selected fluid may further enter the
cavity through the channels without use of a pin and exit through a
pin. Of course, the particular pin used and fluid flow will depend
upon the application.
[0113] It should be noted that the even distribution of fluid flow
through the cavity prevents "hot spots" from occurring in the
cavity. For example, the even distribution of fluid through the
cavity by way of the previous embodiment substantially prevents
fluid from becoming substantially turbulent at certain locations.
This prevents "hot spots" caused by such turbulent fluid. The hot
spots are often caused by higher chemical activity or exothermic
reactions and the like by way of turbulence in such certain
locations.
[0114] b. Assembly of Chip Package
[0115] According to one embodiment, the top and bottom casing are
attached by a technique known as ultrasonic or acoustic welding.
FIG. 8a is a schematic diagram of acoustic welding system used for
assembling the package. In some embodiments, the welding system 800
is a HS Dialog ultrasonic welder manufactured by Herrmann
Ultrasonics Inc. System 800 includes a platform 850 mounted on base
810. Platform 850 accommodates the top and bottom casings during
the assembling process.
[0116] An acoustic horn 860 is mounted on a frame above platform
850. The horn translates vertically (toward and away from platform
850) on the frame by air pressure.
[0117] The horn is connected to a frequency generator 870, which in
some embodiments is a 20 KHz generator manufactured by Herrmann
Ultrasonics Inc. System 800 is controlled by a controller 880,
which, for example, may be a Dialog 2012 manufactured by Herrmann
Ultrasonics Inc. Controller 880 may be configured to accept
commands from a digital computer system 890. Computer 890 may be
any appropriately programmed digital computer of the type that is
well known to those skilled in the art such as a Gateway 486DX
operating at 33 MHz.
[0118] FIG. 8b illustrates platform 850 in greater detail. The
platform 850 is substantially planar and includes alignment pins
851 and 852. Alignment pins 851 and 852 are used to align both the
top and bottom casings during the welding process. In some
embodiments, a pad 890, which may be composed of silicone rubber or
other energy absorbing material, is located on platform 850 to
prevent damage to the package during assembly.
[0119] FIG. 9a illustrates the acoustic welding system in
operation. As shown, bottom casing 420, having a septum 790 seated
in each depression, is mounted onto platform table 850 and held in
place by alignment pins. Top casing 410 is then aligned above the
bottom casing with alignment pins. The system then commences the
welding process by lowering horn 860 until it contacts the top
surface of casing 410.
[0120] FIG. 9b illustrates the casing and horn in detail. As shown,
the horn 860 presses against top casing 410, thereby forcing energy
directors 510 to interface with bottom casing 420. The system then
activates the frequency generator, causing the welding horn to
vibrate.
[0121] FIG. 9c illustrates in detail the energy directors during
the welding process. As shown in step 9001, welding horn 860 forces
energy directors 510 against bottom casing 420. At step 9002, the
system vibrates the welding horn, which in some embodiments is at
20 KHz. The energy generated by the horn melts the energy
directors. Simultaneously, the horn translates downward against the
package. At step 9003, the pressure exerted by the horn causes the
energy directors to fuse with the bottom casing. At step 9004, the
welding process is completed when the horn reaches its weld depth,
for example, of about 0.01''. Of course, the various welding
parameters may be varied, according to the composition of the
materials used, to achieve optimum results.
[0122] c. Chip Attachment
[0123] According to some embodiments, an ultraviolet cured adhesive
attaches the chip to the package. FIG. 10 schematically illustrates
an adhesive dispensing system used in attaching the chip. The
dispensing system 1000 includes an attachment table 1040 to
accommodate the package during the attachment process. A chip
alignment table 1050 for aligning the chip is located adjacent to
attachment table 1040. A head unit 1030 for dispensing the adhesive
is located above tables 1040 and 1050. The head unit 1030 also
includes a camera that generates an output to video display 1070.
Video display 1070, in some embodiments, includes a cross hair
alignment mark 1071. The head unit is mounted on a dual-axis (x-y)
frame for positioning during alignment and attachment of the chip.
The operation of the dispensing system is controlled by a computer
1060, which in some embodiments may be Gateway 486DX operating at
33 MHz.
[0124] FIG. 11 illustrates the attachment table in greater detail.
The attachment table 1040 has a substantially flat platform 1110
supported by a plurality of legs 1105. Alignment pins 1115 and
1116, which secure the package during the attachment process, are
located on the surface of platform 1110.
[0125] Optionally, a needle 1120 is provided. Needle 1120 includes
a channel 1121 and is connected to a vacuum pump. In operation, the
needle is inserted into one of the ports of the package in order to
generate a vacuum in the cavity. The vacuum pressure secures the
chip to the package during the attachment process.
[0126] FIG. 12a shows table 1050 in greater detail. Table 1050
includes a substantially flat platform 1210 having a depression
1240 for holding a chip. In some embodiments, a port 1241 is
provided in depression 1240. Port 1241 is connected to a vacuum
pump which creates a vacuum in the depression for immobilizing the
chip therein. Platform 1210 is mounted on a combination linear
rotary stage 1246, which in some embodiments may be a model 26LR
manufactured by DARDAL, and a single axis translation stage 1245,
which may be a model CR2226HSE2 manufactured by DARDAL.
[0127] FIG. 12b illustrates depression 1240 in greater detail. As
shown, a ledge 1241 surrounds the depression 1240. Ledge 1241
supports the chip when it is placed above depression 1240. Since
the chips are placed over the depression with the probes facing the
table, this design protects the probes from being potentially
damaged during alignment.
[0128] FIG. 13 illustrates the head unit 1030 in greater detail. As
shown, the head unit 1030 includes a camera assembly 1320 that
generates an output to a video display. A light 1360 is provided to
enable the camera to focus and image an object of interest. The
head unit also includes an ultraviolet light 1350 for curing the
adhesive, a vacuum pickup 1330 for moving chip during the
attachment process, and an adhesive dispenser 1340.
[0129] In operation, a chip package is placed onto table 1040. As
previously described, the alignment pins on the table immobilize
the package. The user begins the chip attachment process by
calibrating the head unit. This may be done by moving the camera
above the package and aligning it with a mark on the package, as
shown in FIG. 14a. For convenience, one of the alignment pins may
be used as an alignment mark. FIG. 14b illustrates a typical image
1440 generated by the camera during this step. As shown, the bead
unit is not aligned with pin 1480. To align the head unit, the user
translates it in both the x and y direction until pin 1480 is
located at the intersection 1477 of the cross hair on the video
display, as illustrated in FIG. 14c.
[0130] Next, the chip is inserted into the depression on the chip
alignment table. FIG. 14c is a flow chart indicating the steps for
aligning the chip. At step 1410, the system positions the camera
(bead unit) above one of the chip's alignment marks. The camera
images the alignment mark on the video display. At this point, the
mark is normally misaligned (i.e., the mark is not located at the
intersection of the cross hair alignment mark). At step 1420, the
user adjusts the chip alignment table in both the x and y direction
until the mark is substantially located at the intersection of the
cross hair. Since no rotational adjustments were made, the mark may
be misaligned angularly.
[0131] At step 1430, the user instructs the system to move the
camera above a second alignment mark, which usually is at an
opposite corner of the chip. Again, an image of the alignment mark
is displayed. At this stage, the alignment mark is probably
misaligned in the x, y, and angular directions. At step 1440, the
user adjusts the rotational stage, x-stage, and y-stage, if
necessary, to align the mark with the cross hair on the video
display. In instances where the rotational stage has been rotated,
the first alignment mark will become slightly misaligned. To
compensate for this shift, the user repeats the alignment process
beginning at step 1450 until both marks are aligned. Of course,
image processing techniques may be applied for automated head unit
and chip alignment.
[0132] FIG. 15a is an example of an image displayed by the video
screen during step 1410. As shown, the first alignment mark (lower
left corner of the chip) is not aligned with the cross hair
marking. FIG. 15b exemplifies an image of the first alignment mark
after adjustments were made by the user. FIG. 15c illustrates a
typical image displayed by video screen during step 1430. As
illustrated, the second alignment mark (upper right corner of the
chip) is misaligned in the x, y, and angular directions. FIG. 15d
illustrates an image of the second mark following initial
adjustments by the user at step 1440. FIG. 15e illustrates the
orientation of the second alignment mark after the chip has been
aligned.
[0133] Once the chip is aligned, the vacuum holding the chip on the
attachment table is released. Thereafter, the pickup on the bead
unit removes the chip from the table and aligns it on the cavity of
the package. In some embodiments, the chip is mated to the pickup
by a vacuum.
[0134] Optionally, the user may check to ensure that the chip is
correctly aligned on the cavity by examining the chip's alignment
marks with the camera. If the chip is out of position, the chip is
removed and realigned on the alignment table. If the chip is
correctly positioned, the system deposits an adhesive by moving the
dispenser along the trough surrounding the cavity. In some
embodiments, the vacuum is released before depositing the adhesive
in the trough. This step is merely precautionary and implemented to
ensure that the vacuum does not cause any adhesive to seep into the
cavity. Once the adhesive is deposited, the system reexamines the
chip to determine if the adhesive had moved the chip out of
position. If the chip is still aligned, the head unit locates the
ultraviolet light above the adhesive and cures it for a time
sufficient to harden the adhesive, which in one embodiment is about
10 seconds. Otherwise, the chip is realigned.
[0135] Upon completion, the chip package will have a variety of
uses. For example, the chip package will be useful in sequencing
genetic material by hybridization. In sequencing by hybridization,
the chip package is mounted on a hybridization station where it is
connected to a fluid delivery system. Such system is connected to
the package by inserting needles into the ports and puncturing the
septums therein. In this manner, various fluids are introduced into
the cavity for contacting the probes during the hybridization
process.
[0136] Usually, hybridization is performed by first exposing the
sample with a prehybridization solution. Next, the sample is
incubated under binding conditions with a solution containing
targets for a suitable binding period. Binding conditions will vary
depending on the application and are selected in accordance with
the general binding methods known including those referred to in:
Maniatis et al., Molecular Cloning: A Laboratory Manual (1989), 2nd
Ed., Cold Spring Harbor, N.Y. and Berger and Kimmel, Methods in
Enzymology, Volume 152, Guide to Molecular Cloning Techniques
(1987), Academic Press, Inc., San Diego, Calif.; Young and Davis
(1983) Proc. Natl. Acad. Sci. (U.S.A.) 80: 1194, which are
incorporated herein by reference. In some embodiments, the solution
may contain about 1 molar of salt and about 1 to 50 nanomolar of
targets. Optionally, the fluid delivery system includes an agitator
to improve mixing in the cavity, which shortens the incubation
period. Finally, the sample is washed with a buffer, which may be
6.times. SSPE buffer, to remove the unbound targets. In some
embodiments, the cavity is filled with the buffer after washing the
sample.
[0137] Thereafter, the package may be aligned on a detection or
imaging system, such as those disclosed in U.S. Pat. No. 5,143,854
(Pirrung et al.) or U.S. patent application Ser. No. 08/495,889
(Attorney Docket Number 11509-117), already incorporated herein by
reference for all purposes. Such detection systems may take
advantage of the package's asymmetry (i.e., non-flush edge) by
employing a holder to match the shape of the package specifically.
Thus, the package is assured of being properly oriented and aligned
for scanning. The imaging systems are capable of qualitatively
analyzing the reaction between the probes and targets. Based on
this analysis, sequence information of the targets is
extracted.
IV. Details on Alternative Embodiments
[0138] a. Chip Package Orientation
[0139] FIGS. 16a-16b illustrate an alternative embodiment of the
package. FIG. 16a shows a top view and FIG. 16b shows a bottom
view. As shown in FIG. 16a, a cavity 1620 is located on a top
surface 1610 of the package body 1600. The body includes alignment
holes 1621 and 1622 that are used, for example, in mating the chip
to the package. Optionally, a plurality of ridges 1690 is located
at end 1660 of the body. The friction created by ridges 1690 allows
the package to be handled easily without slippage.
[0140] The body also includes two substantially parallel edges 1630
and 1640. As shown, edge 1640 is narrowed at end 1665 to create an
uneven edge 1645. The asymmetrical design of the body facilitates
correct orientation when mounted onto detection systems. For
example, detection systems may contain a holder, similar to that of
an audio cassette tape, in which end 1665 is inserted.
[0141] Referring to FIG. 16b, ports 1670 and 1671 communicate with
cavity 1620. A seal is provided for each port to retain fluids in
the cavity. Similar to the top surface, the bottom surface may
optionally include a plurality of ridges 1690 at end 1660.
[0142] FIGS. 17a-17b illustrate an alternative embodiment of the
package. FIG. 17a shows a top view and FIG. 17b shows a bottom
view. Referring to FIG. 17a, a cavity 1720 is located on a top
surface 1710 of the package body 1700. The body may be formed in
the shape of a disk with two substantially parallel edges 1730 and
1740. Alignment holes 1721 and 1722, which may be different in size
or shape, are located on the body. In some embodiments, the package
is inserted like an audio cassette tape into detection systems in a
direction parallel to edges 1730 and 1740. Edges 1730 and 1740 and
alignment holes prevent the package from being inserted incorrectly
into the detection systems.
[0143] As shown in FIG. 17b, ports 1730 and 1740 are located on the
bottom surface 1715 of the package. Ports 1730 and 1740 communicate
with cavity 1720 and each include a seal 1780 for sealing fluids in
the cavity.
[0144] b. Chip Attachment
[0145] FIG. 18 illustrates an alternative embodiment for attaching
the chip to the package. As shown, two concentric ledges 1810 and
1820 surround the perimeter of cavity 310. Ledge 1820 supports the
chip 120 when mounted above cavity 310. Ledge 1810, which extends
beyond chip 120, receives an adhesive 1860 such as ultraviolet
cured silicone, cement, or other adhesive for attaching the chip
thereto.
[0146] FIG. 19 illustrates another embodiment for attaching the
chip to the package. According to this embodiment, a ledge 1910 is
formed around cavity 310. Preferably, the ledge is sufficiently
large to accommodate an adhesive 1920 such as an adhesive film,
adhesive layer, tape, or any other adhesive layer. Chip 120
attaches to the package when it contacts the adhesive film.
[0147] FIG. 20a illustrates yet another embodiment for attaching a
chip to the package. As shown, a clamp 2010, such as a frame having
a plurality of fingers 2015, attaches the chip to the package. FIG.
20b illustrates a cross sectional view. A ridge 2020 on surface 501
surrounds cavity 310. The ridge includes a ledge 2025 upon which
chip 120 rests. Optionally, a gasket or a seal 2070 is located
between the ledge and chip to ensure a tight seal around cavity
310. Clamp 2010 is attached to side 2040 of ridge 2020 and surface
501. In some embodiments, clamp 2010 is acoustically welded to the
body. Accordingly, clamp 2010 includes energy directors 2050
located at its bottom. Alternatively, screws, clips, adhesives, or
other attachment techniques may be used to mate clamp 2010 to the
package. When mated, fingers 2015 secure chip 120 to the
package.
[0148] FIG. 21 illustrates an alternative embodiment for attaching
the chip to the package. A ridge 2110, having a notch 2115 at or
near the top of ridge 2110, encompasses the cavity 310. Chip 120 is
wedged and held into position by notch 2115. Thereafter, a process
known as heat staking is used to mount the chip. Heat staking
includes applying heat and force at side 2111 of ridge, thus
forcing ridge tightly against or around chip 120.
[0149] FIG. 22 shows another embodiment of attaching a chip onto a
package. As shown, a channel 2250 surrounds cavity 310. A notch
2240 for receiving the chip 120 is formed along or near the top of
the cavity 310. In some embodiments, a gasket or seal 2270 is
placed at the bottom of the notch to ensure a tight seal when the
chip is attached. Once the chip is located at the notch, a
V-shaped, wedge 2260 is inserted into channel 2250. The wedge
forces the body to press against chip's edges and seal 2260, thus
mating the chip to the package. This process is known as
compression sealing.
[0150] Other techniques such as insert molding, wave soldering,
surface diffusion, laser welding, shrink wrap, o-ring seal, surface
etching, or heat staking from the top may also be employed.
[0151] c. Fluid Retention
[0152] FIG. 23 shows an alternative embodiment of package that
employs check valves to seal the inlets. As shown, depressions 2305
and 2315 communicate with cavity 310 through inlets 350 and 360.
Check valves 2310 and 2320, which in some embodiments may be
duck-billed check valves, are seated in depressions 2305 and 2315.
To introduce a fluid into the cavity, a needle is inserted into the
check valve. When the needle is removed, the check valve reseals
itself to prevent leakage of the fluid.
[0153] FIG. 24 illustrates another package that uses reusable tape
for sealing the cavity 310. As shown, a tape 2400 is located above
inlets 350 and 360. Preferably, end 2430 of tape is permanently
fixed to surface 2480 while end 2410 remains unattached. The mid
section 2420 of the tape is comprised of non-permanent adhesive.
This design allows inlets to be conveniently sealed or unsealed
without completely separating the tape from the package.
[0154] FIG. 25 illustrates yet another embodiment of the package
that uses plugs to retain fluids within the cavity. As shown,
depressions 2520 and 2530 communicate with cavity 310 via inlets
350 and 360. A plug 2510, which in some embodiment may be composed
of rubber or other sealing material, is mated to each of the
depressions. Plugs 2510 are easily inserted or removed for sealing
and unsealing the cavity during the hybridization process.
[0155] FIG. 26a illustrates a package utilizing sliding seals for
retaining fluids within the cavity. The seals are positioned in
slots 2610 that are located above the inlets. The slots act as
runners for guiding the seals to and from the inlets. FIG. 26b
illustrates the seal in greater detail. Seal 2640, which may be
composed of rubber, teflon rubber, or other sealing material, is
mated to each slot 2610. The seal includes a handle 2650 which
extends through the slot. Optionally, the bottom of the seal
includes an annular protrusion 2645 to ensure mating with inlet
350. The inlet is sealed or unsealed by positioning the seal
appropriately along the slot. Alternatively, spring loaded balls,
rotary ball valves, plug valves, or other fluid retention
techniques may be employed.
[0156] d. Chip Orientation
[0157] FIGS. 27a-27b illustrate an alternative embodiment of the
package. FIG. 27a illustrates a top view and FIG. 27b shows a cross
sectional view. As shown, package 2700 includes a cavity 2710 on a
surface 2705. A chip 2790 having an army of probes 2795 on surface
2791 is mated to the bottom of cavity 2710 with an adhesive 2741.
The adhesive, for example, may be silicone, adhesive tape, or other
adhesive. Alternatively, clips or other mounting techniques may be
employed. Optionally, the bottom of the cavity may include a
depression in which a chip is seated.
[0158] This configuration provides several advantages such as: 1)
permitting the use of any type of substrate (i.e., non-transparent
or non-translucent), 2) yielding more chips per wafer since the
chip does not require an edge for mounting, and 3) allowing chips
of various sizes or multiple chips to be mated to the package.
[0159] A cover 2770 is mated to the package for sealing the cavity.
Preferably, cover 2770 is composed of a transparent or translucent
material such as glass, acrylic, or other material that is
penetrable by light. Cover 2270 may be mated to surface 2705 with
an adhesive 2772, which in some embodiments may be silicone,
adhesive film, or other adhesive. Optionally, a depression may be
formed around the cavity such that surface 2271 of the cover is at
least flush with surface 2705. Alternatively, the cover may be
mated to surface 2705 according to any of the chip attachment
techniques described herein.
[0160] Inlets 2750 and 2751 are provided and communicate with
cavity 2710. Selected fluids are circulated through the cavity via
inlets 2750 and 2751. To seal the fluids in the cavity, a septum,
plug, or other seal may be employed. In alternative embodiments,
any of the fluid retention techniques described herein may be
utilized.
[0161] e. Parallel Hybridization and Diagnostics
[0162] In an alternative embodiment, the body is configured with a
plurality of cavities. The cavities, for example, may be in a
96-well micro-titre format. In some embodiments, a chip is mounted
individually to each cavity according to the methods described
above. Alternatively, the probe arrays may be formed on the wafer
in a format matching that of the cavities. Accordingly, separating
the wafer is not necessary before attaching the probe arrays to the
package. This format provides significant increased throughput by
enabling parallel testing of a plurality of samples.
V. Details of an Agitation System
[0163] FIG. 28 illustrates an agitation system in detail. As shown,
the agitation system 2800 includes two liquid containers 2810 and
2820, which in the some embodiments are about 10 milliliters each.
Container 2810 communicates with port 350 via tube 2850 and
container 2820 communicates with port 360 via tube 2860. An inlet
port 2812 and a vent port 2811 are located at or near the top of
container 2810. Container 2820 also includes an inlet port 2822 and
a vent 2821 at or near its top. Port 2812 of container 2810 and
port 2822 of container 2820 are both connected to a valve assembly
2828 via valves 2840 and 2841. An agitator 2801, which may be a
nitrogen gas (N.sub.2) or other gas, is connected to valve assembly
2828 by fitting 2851. Valves 2840 and 2841 regulate the flow of
N.sub.2 into their respective containers. In some embodiments,
additional containers (not shown) may be provided, similar to
container 2810, for introducing a buffer and/or other fluid into
the cavity.
[0164] In operation, a fluid is placed into container 2810. The
fluid, for example, may contain targets that are to be hybridized
with probes on the chip. Container 2810 is sealed by closing port
2811 while container 2820 is vented by opening port 2821. Next,
N.sub.2 is injected into container 2810, forcing the fluid through
tube 2850, cavity 310, and finally into container 2820. The bubbles
formed by the N.sub.2 agitate the fluid as it circulates through
the system. When the amount of fluid in container 2810 nears empty,
the system reverses the flow of the fluid by closing valve 2840 and
port 2821 and opening valve 2841 and port 2811. This cycle is
repeated until the reaction between the probes and targets is
completed.
[0165] In some applications, foaming may occur when N.sub.2
interacts with the fluid. Foaming potentially inhibits the flow of
the fluid through the system. To alleviate this problem, a
detergent such as CTAB may be added to the fluid. In one
embodiment, the amount of CTAB added is about 1 millimolar.
Additionally, the CTAB affects the probes and targets positively by
increasing the rate at which they bind, thus decreasing the
reaction time required.
[0166] The system described in FIG. 28 may be operated in an
alternative manner. According to this technique, back pressure
formed in the second container is used to reverse the flow of the
solution. In operation, the fluid is placed in container 2810 and
both ports 2811 and 2821 are closed. As N.sub.2 is injected into
container 2810, the fluid is forced through tube 2850, cavity 310,
and finally into container 2820. Because the vent port in container
2820 is closed, the pressure therein begins to build as the volume
of fluid and N.sub.2 increases. When the amount of fluid in
container 2810 nears empty, the flow of N.sub.2 into container 2810
is terminated by closing valve 2840. Next, the circulatory system
is vented by opening port 2811 of container 2810. As a result, the
pressure in container 2820 forces the solution back through the
system toward container 2810. In one embodiment, the system is
injected with N.sub.2 for about 3 seconds and vented for about 3
seconds. This cycle is repeated until hybridization between the
probes and targets is completed.
[0167] FIG. 29 illustrates an alternative embodiment of the
agitation system. System 2900 includes a vortexer 2910 on which the
chip package 300 is mounted. A container 2930 for holding the fluid
communicates with inlet 350 via tube 2950. A valve 2935 may be
provided to control the flow of solution into the cavity. In some
embodiments, circulator 2901, which may be a N.sub.2 source or
other gas source, is connected to container 2930. Alternatively, a
pump or other fluid transfer device may be employed. The flow of
N.sub.2 into container 2930 is regulated by a valve 2936.
Circulator 2901 is also connected to inlet tube 2950 via a valve
2902.
[0168] A waste container 2920 communicates with port 360 via outlet
tube 2955. In one embodiment, a liquid sensor 2940 may be provided
for sensing the presence of liquid in outlet tube 2955. Access to
the waste container may be controlled by a valve 2921. Optionally,
additional containers (not shown), similar to container 2930, may
be employed for introducing a buffer or other fluid into the
cavity.
[0169] The system is initialized by closing all valves and filling
container 2930 with, for example, a fluid containing targets. Next,
valves 2936, 2935, and 2921 are opened. This allows N.sub.2 to
enter container 2930 which forces the fluid to flow through tube
2950 and into the cavity. When the cavity is filled, valves 2935,
2936, and 2921 are closed to seal the fluid in the cavity. Next,
the vortexer is activated to vibrate the chip package, similar to a
paint mixer. In some embodiments, the vortexer may vibrate the
package at about 3000 cycles per minute. The motion mixes the
targets in the fluid, shortening the incubation period. In some
embodiments, the vortexer rotates the chip package until
hybridization is completed. Upon completion, valve 2902 and 2955
are opened to allow N.sub.2 into the cavity. The N.sub.2 empties
the fluid into waste container 2920. Subsequently, the cavity may
be filled with a buffer or other fluid.
[0170] FIG. 30 illustrates an alternative embodiment in which the
agitation system is partially integrated into the chip package. As
shown, chip package 300 includes a cavity 310 on which the chip is
mounted. Cavity 310 is provided with inlets 360 and 350. The
package also includes chambers 3010 and 3020. A port 3021 is
provided in chamber 3010 and is connected to inlet 360 by a channel
3025.
[0171] Chamber 3010 is equipped with ports 3011 and 3012. Port 3012
communicates with inlet 350 through a channel 3015. Channel 3015 is
provided with a waste port 3016 that communicates with a fluid
disposal system 3500 via a tube 3501. A valve 3502 regulates the
flow of fluids into the disposal system. In some embodiments, the
disposal system includes a waste container 3510 and fluid recovery
container 3520 which are connected to tube 3501. A valve 3530 is
provided to direct the flow of fluids into either the waste
container or recovery container.
[0172] Port 3011 is coupled to a fluid delivery system 3600 through
a tube 3601. Fluids flowing into chamber 3010 from the fluid
delivery system are regulated by a valve 3602. The fluid delivery
system includes fluid containers 3610 and 3620 that are
interconnected with a tube 3690. Container 3610, which may hold a
fluid containing targets, includes ports 3616 and 3615. Port 3616
is connected to tube 3690. A valve 3612 controls the flow of the
fluid out of container 3610. A circulator 3605, which may be a
N.sub.2 source, is connected to port 3615 of container 3610.
Alternatively, any type of gas, pump or other fluid transfer device
may be employed. The flow of N.sub.2 into container 3610 is
controlled by a valve 3618. A valve 3619 may also be provided to
vent container 3610.
[0173] Container 3620, which may hold a buffer, is provided with
ports 3625 and 3626. Circulator 3605 is connected to port 3625. A
valve 3621 is provided to control the flow of N.sub.2 into
container 3620. Port 3626 is connected to tube 3690 via a valve
3622. Valve 3622 regulates the flow of the buffer out of container
3620. Optionally, additional containers (not shown), similar to
container 3620, may be configured for introducing other fluids into
the cavity. A valve 3690 connects circulator 3605 to tube 3690 for
controlling the flow of N.sub.2 directly into the package. A valve
3652 is provided for venting the fluid delivery system.
[0174] In the initial operating state, all valves are shut. To
start the hybridization process, a fluid containing targets is
introduced into chamber 3010 by opening valves 3602, 3612 and 3618.
This injects N.sub.2 into container 3610 which forces the fluid to
flow through 3601 and into chamber 3010. When chamber 3010 is
filled, valves 3612 and 3618 are closed. Next, valve 3642 is
opened, allowing N.sub.2 to flow directly into chamber 3010. The
N.sub.2 agitates and circulates the fluid into cavity 310 and out
to chamber 3020. As the volume of fluid and N.sub.2 in chamber 3020
increase, likewise does the pressure therein. When chamber 3020
approaches its capacity, valve 3642 is closed to stop the fluid
flow. Thereafter, the system is vented by opening valve 3652.
Venting the system allows the back pressure in chamber 3020 to
reverse the flow of fluids back into chamber 3010. When chamber
3010 is filled, valve 3652 is closed and valve 3642 is opened to
reverse the fluid flow. This cycle is repeated until hybridization
is completed.
[0175] When hybridization is completed, the system may be drained.
This procedure depends on which chamber the fluid is located in. If
the fluid is located in chamber 3020, then valve 3502 is opened,
while valve 3530 is positioned to direct the fluid into the
appropriate container (recovery or waste). The pressure in chamber
3020 forces the fluid through port 3016, tube 3501, and into the
disposal system. If the fluid is in chamber 3010, then valve 3502
and 3642 are opened. As a result, N.sub.2 forces the fluid in
chamber 3010 through port 3501 and into the disposal system.
[0176] Once the system is emptied, all valves are closed. A buffer
or other fluid may be introduced into the cavity. For example, the
cavity may be filled with a buffer by opening valves 3602, 3621,
and 3622. This injects N.sub.2 into container 3620 which forces the
buffer therein to flow through the system until it fills cavity
310. In the alternative, ultrasonic radiation, heat, magnetic
beads, or other agitation techniques may be employed.
[0177] The present inventions provide commercially feasible devices
for packaging a probe chip. It is to be understood that the above
description is intended to be illustrative and not restrictive.
Many embodiments will be apparent to those skilled in the art upon
reviewing the above description. Merely as an example, the package
may be molded or machined from a single piece of material instead
of two. Also, other asymmetrical designs may be employed to orient
the package onto the detection systems.
[0178] The scope of the invention should, therefore, be determined
not with reference to the above description, but instead should be
determined with reference to the appended claims along with their
full scope of equivalents.
* * * * *