U.S. patent application number 12/507781 was filed with the patent office on 2010-11-25 for heat dissipation device having a fan thereon.
This patent application is currently assigned to FU ZHUN PRECISION INDUSTRY (SHEN ZHEN) CO., LTD.. Invention is credited to LEI CAO, WEI-CHENG NIE, HONG-CHENG YANG.
Application Number | 20100294463 12/507781 |
Document ID | / |
Family ID | 43105058 |
Filed Date | 2010-11-25 |
United States Patent
Application |
20100294463 |
Kind Code |
A1 |
NIE; WEI-CHENG ; et
al. |
November 25, 2010 |
HEAT DISSIPATION DEVICE HAVING A FAN THEREON
Abstract
A heat dissipation device includes a heat sink and a blower. The
heat sink has a base and a plurality of fins formed on the base.
The blower includes a frame and an impeller rotatably secured to
the frame. The frame faces and is secured to the base of the heat
sink to define an airflow passage between the base of the heat sink
and the blower. An airflow inlet is defined through the frame of
the blower. Another airflow inlet is defined through the base of
the heat sink. An airflow produced by the blower passes through the
airflow passage via the airflow inlets and then blows towards
channels defined between the fins of the heat sink.
Inventors: |
NIE; WEI-CHENG; (Shenzhen
City, CN) ; YANG; HONG-CHENG; (Shenzhen City, CN)
; CAO; LEI; (Shenzhen City, CN) |
Correspondence
Address: |
Altis Law Group, Inc.;ATTN: Steven Reiss
288 SOUTH MAYO AVENUE
CITY OF INDUSTRY
CA
91789
US
|
Assignee: |
FU ZHUN PRECISION INDUSTRY (SHEN
ZHEN) CO., LTD.
Shenzhen City
CN
FOXCONN TECHNOLOGY CO., LTD.
Tu-Cheng
TW
|
Family ID: |
43105058 |
Appl. No.: |
12/507781 |
Filed: |
July 22, 2009 |
Current U.S.
Class: |
165/80.3 |
Current CPC
Class: |
H01L 2924/00 20130101;
H01L 23/467 20130101; H01L 2924/0002 20130101; H01L 2924/0002
20130101; G06F 1/20 20130101 |
Class at
Publication: |
165/80.3 |
International
Class: |
F28F 13/00 20060101
F28F013/00 |
Foreign Application Data
Date |
Code |
Application Number |
May 21, 2009 |
CN |
200910302511.8 |
Claims
1. A heat dissipation device comprising: a heat sink comprising a
base and a plurality of fins formed on the base; and a blower
comprising a frame and an impeller rotatably secured to the frame,
the frame directly facing and mounted to the base of the heat sink
to define an airflow passage between the base of the heat sink and
the frame, the frame defining an airflow inlet therethrough;
wherein airflow produced by the blower flows into the airflow
passage via the airflow inlet and blows towards channels defined
between the fins of the heat sink from an outlet of the blower.
2. The heat dissipation device of claim 1, wherein the base of the
heat sink defines another airflow inlet therethrough.
3. The heat dissipation device of claim 2, wherein the frame of the
blower comprises a panel plate and a sidewall extending from a
periphery thereof and engaging the base of the heat sink to secure
the frame to the base of the heat sink.
4. The heat dissipation device of claim 3, wherein the impeller is
located between the panel plate and the base.
5. The heat dissipation device of claim 4, wherein the impeller is
secured to a bottom surface of the panel plate and surrounded by
the sidewall.
6. The heat dissipation device of claim 3, wherein the frame of the
blower comprises a plurality of mounting poles extending from the
sidewall thereof, fasteners extending through the mounting poles of
the frame of the blower and screwing into the base of the heat sink
to mount the blower on the base of the heat sink.
7. The heat dissipation device of claim 6, wherein the base of the
heat sink comprises a plurality of fixing portions in alignment
with the mounting poles of the frame of the blower, the fasteners
extending through the mounting poles and screwing into the fixing
portions of the base of the heat sink.
8. The heat dissipation device of claim 1, wherein the base of the
heat sink corresponding to the fins is inclined downwardly to guide
the airflow of the blower to flow downwardly away from the heat
dissipation device.
9. The heat dissipation device of claim 8, wherein the fins of the
heat sink have gradually decreased lengths from one of two opposite
lateral sides of the base of the heat sink to another of the two
opposite lateral sides.
10. The heat dissipation device of claim 9, wherein the fins of the
heat sink define a recessed slot in a top thereof and a guiding
plate covers the fins and has a portion received in the recessed
slot.
11. A heat dissipation device comprising: a heat sink having a base
and a plurality of fins extending upwardly from the base; a blower
covering the base of the heat sink, the blower comprising a frame
facing and mounted to the base of the heat sink and an impeller
rotatably secured to the frame, the frame cooperating with the base
to define an airflow passage between the frame and the base, an
airflow inlet being defined in the frame of the blower; wherein an
airflow produced by the blower passes through the airflow passage
via the airflow inlet and blows towards channels defined between
the fins of the heat sink.
12. The heat dissipation device of claim 11, wherein base of the
heat sink defines another airflow inlet therethrough.
13. The heat dissipation device of claim 12, wherein the base of
the heat sink beneath the fins is inclined downwardly to guide the
airflow to flow downwardly when the airflow leaves the heat
dissipation device.
Description
BACKGROUND
[0001] 1. Technical Field
[0002] The disclosure relates generally to a heat dissipation
device for removing heat from an electronic component mounted on a
periphery card, and particularly to a heat dissipation device
comprising a blower facing a base of a heat sink in contact with
the electronic component to define an airflow passage between the
base of the heat sink and the blower, wherein airflow can pass
through the airflow passage.
[0003] 2. Description of Related Art
[0004] It is well known that during operation computer electronic
devices such as central processing units (CPUs) can generate large
amounts of heat. The heat must be quickly removed from the
electronic device to prevent it from becoming unstable or being
damaged.
[0005] Thus, a heat dissipation device which can quickly remove the
heat from the electronic device is needed. Such a heat dissipation
device is particularly necessary for a periphery card of a
computer, for example, a video graphic array (VGA) card. A
periphery card is usually crowded with other periphery cards
whereby only a limited space is available for an airflow to flow
through a heat sink thereof. The heat dissipation device usually
includes the heat sink and a blower mounted to the heat sink. Since
the periphery card has a limited space, accordingly, the heat sink
is designed to have a flat-shaped base and fins with a limited
height. The blower is desired to guide airflow to pass through the
fins of the heat sink from one side to an opposite side
thereof.
[0006] However, the blower usually includes a fan frame and a cover
covering and mounted to the fan frame. Airflow produced by the
blower only flows along a passage cooperatively defined by the fan
frame and the cover of the blower. That is to say, when the blower
is mounted to the base of the heat sink, the airflow produced by
the blower fails to directly blow towards the base of the heat sink
under the blower, the heat accumulated at the base of the heat sink
under the blower fails to be quickly dissipated.
[0007] What is needed, therefore, is a heat dissipation device
which has a blower to directly blow towards the base of the heat
sink.
BRIEF DESCRIPTION OF THE DRAWINGS
[0008] Other advantages and novel features of the disclosure will
become more apparent from the following detailed description of an
embodiment/embodiments when taken in conjunction with the
accompanying drawings.
[0009] FIG. 1 is an exploded, isometric view of a heat dissipation
device in accordance with an embodiment of the disclosure.
[0010] FIG. 2 is an assembled view of the heat dissipation device
of FIG. 1.
[0011] FIG. 3 is a similar view of FIG. 1, with arrows showing
paths of airflow entering and leaving the heat dissipation
device.
DETAILED DESCRIPTION
[0012] Referring to FIGS. 1-3, a heat dissipation device in
accordance with an embodiment of the disclosure is shown. The heat
dissipation device is mounted to a heat-generating electronic
element (not shown) to dissipate heat from the heat-generating
electronic element. Particularly, the heat-generating electronic
element is a graphic processing unit (GPU) mounted on a periphery
card of a computer, for example, a video graphic array (VGA) card.
The heat dissipation device comprises a heat sink 10, a blower 20
and a guiding plate 30.
[0013] The heat sink 10 is integrally formed by a metal with a good
heat conductivity, such as copper or aluminum. The heat sink 10
comprises a flat base 12. The base 12 comprises three portions: a
first portion located in a middle of the base 12, a second portion
extending forth from an end of the first portion and a third
portion extending rearwards from an opposite end of the first
portion. The first portion of the base 12 has a semicircular shape
with a size corresponding to that of the blower 20, for supporting
the blower 20 thereon. A semicircular first airflow inlet 120 is
defined in the first portion of the base 12. A pair of mounting
poles 16 is formed at two opposite ends of a front side of the
first portion of the base 12, and another mounting pole 16 is
formed on a middle portion of a top surface of the third portion of
the base 12, adjacent to the rear side of the first portion of the
base 12. Each mounting pole 16 defines a mounting hole 160 therein.
A plurality of fins 14 are integrally formed on a top surface of
the second portion of the base 12. The fins 14 have a gradually
increased lengths from a left lateral side to a right lateral side
of the second portion of the base 12, wherein the fins 14 are
located at a position and occupy a size corresponding to those of
an outlet of the blower 20. Each fin 14 defines a recessed edge at
a top thereof and all recessed edges of all the fins 14
cooperatively define a recessed slot 140 in a top of the fins 14.
The front side 142 of the second portion of the base 12 under the
fins 14 is inclined downwardly in respect to the first portion of
the base 12, wherein airflow from the outlet of the blower 20
blowing towards channels defined between the fins 14 can be guided
to downwardly blow other heat-generating electronic elements
mounted on the periphery card and adjacent to the front side of the
base 12 of the heat sink 10.
[0014] The blower 20 comprises a frame 22 and an impeller 24. The
frame 22 comprises a panel plate 220 and a lateral sidewall 222
downwardly and vertically extending from an edge side of the panel
plate 220. The impeller 24 is rotatably secured to an inner surface
of the panel plate 220 of the frame 22. A plurality of second
airflow inlets 2200 are defined in the panel plate 220,
corresponding to the first airflow inlet 120 of the base 12 of the
heat sink 10. Three fixing portions 224 horizontal and outwardly
extend from the lateral sidewall 222 and are evenly located along a
periphery of the frame 22 of the blower 20, corresponding to the
mounting poles 16 of the base 12 of the heat sink 10. Each fixing
portion 224 defines a through hole 2240 therein, in alignment with
the mounting hole 160 of a corresponding mounting pole 16 of the
base 12 of the heat sink 10, for receiving a fastener 90 extending
therethrough. The fasteners 90 extend through the through holes
2240 of the fixing portions 224 of the frame 22 of the blower 20
and screw into the mounting holes 160 of the mounting poles 16 to
mount the frame 22 of the blower 20 on the first portion of the
base 12 of the heat sink 10, wherein the base 12 of the heat sink
10 and the frame 22 of the blower 20 cooperatively define an
airflow passage along a length direction of the base 12 of the heat
sink 10 and the outlet of the blower 20 faces the channels defined
between the fins 14 of the heat sink 10.
[0015] The guiding plate 30 has a size corresponding to that of a
top surface of the fins 14 of the heat sink 10. The guiding plate
30 comprises a main body 32 and a recessed portion 34 extending
outwardly and downwardly from a front side of the main body 32. The
guiding plate 30 covers the top surface of the fins 14 with the
recessed portion 34 being received in the recessed slot 140 to
guide the airflow from the outlet of the blower 20 to downwardly
flow to the channels defined between the fins 14 of the heat sink
10.
[0016] In operation, cooled airflow flows into the airflow passage
between the frame 22 of the blower 20 and the base 12 of the heat
sink 10 via the first and second airflow inlets 120, 2200, wherein
the cooled airflow can directly blow a top surface of the base 12
of the heat sink 10, so heat generated by the heat-generating
electronic element attached on a bottom of the base 12 of the heat
sink 10 can be effectively taken away.
[0017] By provision of the frame 22 of the blower 20 engaging the
base 12 of the heat sink 10, the blower 20 not only can directly
blow the base 12 of the heat sink 10, but also saves a cover
covering the frame 22 to define the airflow passage, whereby the
cost of the blower 20 is decreased. In addition, the base 12 of the
heat sink 10 defines the first airflow inlet 120 therethrough,
wherein the cooled airflow flowing into the airflow passage via the
first airflow inlet 120 can cause air around the heat-generating
electronic element to flow through the heat-generating electronic
element; thus, the heat generated by the heat-generating electronic
element can be taken away as quickly as possible. Heat accumulated
at the base 12 of the heat sink 10 under the blower 20 can be
quickly dissipated.
[0018] It is to be understood, however, that even though numerous
characteristics and advantages of the present embodiments have been
set forth in the foregoing description, together with details of
the structures and functions of the embodiments, the disclosure is
illustrative only, and changes may be made in detail, especially in
matters of shape, size, and arrangement of parts within the
principles of the invention to the full extent indicated by the
broad general meaning of the terms in which the appended claims are
expressed.
* * * * *