U.S. patent application number 12/489455 was filed with the patent office on 2010-11-18 for heat dissipation device.
This patent application is currently assigned to HONG FU JIN PRECISION INDUSTRY (ShenZhen) CO., LTD. Invention is credited to Ming-Ke Chen, Zhen-Xing Ye.
Application Number | 20100288470 12/489455 |
Document ID | / |
Family ID | 43067571 |
Filed Date | 2010-11-18 |
United States Patent
Application |
20100288470 |
Kind Code |
A1 |
Chen; Ming-Ke ; et
al. |
November 18, 2010 |
HEAT DISSIPATION DEVICE
Abstract
A heat dissipation device includes a plate, a protrusion to
divide a top of the plate into a number of mounting areas, and a
number of heat sinks selectively received on the number of mounting
areas.
Inventors: |
Chen; Ming-Ke; (Shenzhen
City, CN) ; Ye; Zhen-Xing; (Shenzhen City,
CN) |
Correspondence
Address: |
Altis Law Group, Inc.;ATTN: Steven Reiss
288 SOUTH MAYO AVENUE
CITY OF INDUSTRY
CA
91789
US
|
Assignee: |
HONG FU JIN PRECISION INDUSTRY
(ShenZhen) CO., LTD
Shenzhen City
CN
HON HAI PRECISION INDUSTRY CO., LTD
Tu- Cheng
TW
|
Family ID: |
43067571 |
Appl. No.: |
12/489455 |
Filed: |
June 23, 2009 |
Current U.S.
Class: |
165/80.3 |
Current CPC
Class: |
H01L 23/367 20130101;
H01L 2924/0002 20130101; H01L 2924/00 20130101; H01L 23/4093
20130101; H01L 2924/0002 20130101 |
Class at
Publication: |
165/80.3 |
International
Class: |
F28F 13/00 20060101
F28F013/00 |
Foreign Application Data
Date |
Code |
Application Number |
May 18, 2009 |
CN |
200910302402.6 |
Claims
1. A heat dissipation device comprising: a plate; a protrusion
protruding from a top of the plate to divide the top of the plate
into a plurality of mounting areas; and a plurality of heat sinks
separately and selectively mounted to the plurality of mounting
areas of the plate.
2. The heat dissipation device of claim 1, wherein each of the
plurality of heat sinks comprises a base and a plurality of fins
extending from the base.
3. The heat dissipation device of claim 2, wherein a fixing hole is
defined in the base of each of the plurality of heat sinks, a
locking hole is defined in each of the mounting areas,
corresponding to the fixing hole, and a fastener passes through the
fixing hole of a heat sink to engage the locking hole of a
corresponding mounting area, to fix the heat sink onto the
plate.
4. The heat dissipation device of claim 2, wherein a shape of the
base of each of the heat sinks is same as that of the corresponding
mounting area of the plate.
5. The heat dissipation device of claim 2, wherein heights of the
plurality of fins of each heat sink differ from those of the
plurality of fins of another heat sink.
6. The heat dissipation device of claim 1, wherein the protrusion
is cross-shaped to divide the top of the plate into four mounting
areas to selectively receive four heat sinks on the plate.
7. The heat dissipation device of claim 6, further comprising a
clip, wherein two pairs of tabs extend perpendicular from the
protrusion, and two tabs each pair of tabs are opposite to each
other, with a latching portion formed between the tabs to hold the
clip.
Description
BACKGROUND
[0001] 1. Technical Field
[0002] The present disclosure relates to heat dissipation devices,
and particularly to a heat dissipation device for cooling an
electronic component of a circuit board.
[0003] 2. Description of Related Art
[0004] Heat dissipation devices are popularly used in electronic
devices, such as computers or servers. Usually, a bridge chip in a
computer or a server uses a heat dissipation device for increased
heat conduction. If the performance of the heat dissipation device
is not good, the bridge chip may be overheated and damaged.
Therefore, good heat dissipation is critical for the electronic
device.
[0005] However, different bridge chips usually require different
heat dissipation devices for increasing heat conduction. Locations,
space, and heat dissipation requirements of the heat dissipation
devices for different bridge chips are different. As a result,
application of different heat dissipation devices for different
bridge chips is costly and time-consuming.
BRIEF DESCRIPTION OF THE DRAWINGS
[0006] FIG. 1 is an exploded, isometric view of a heat dissipation
device in accordance with an embodiment.
[0007] FIG. 2 is a partially assembled view of FIG. 1.
[0008] FIG. 3 is an assembled view of FIG. 1.
DETAILED DESCRIPTION
[0009] Referring to FIG. 1, an exemplary embodiment of a heat
dissipation device includes a square plate 10 to be located on a
top of an electronic element, such as a bridge chip of a circuit
board. Four heat sinks 20 mounted on the plate 10 to absorb heat
from the electronic element. A clip 40 made of resilient material
to fix the plate 10 on the circuit board, and four fasteners 50,
such as four screws, to mount the heat sinks 20 to the plate
10.
[0010] Each heat sink 20 includes a base 21 and a plurality of
parallel fins 23 extending perpendicular from the base 21. A fixing
hole 212 is defined in a center of the base 21. In one embodiment,
the bases 21 of the heat sinks 20 are the same, while heights of
the plurality of fins 23 of each heat sink 20 differ. Size of the
base 21 and height of the plurality of fins 23 of each heat sink 20
can be predetermined according to need. The number of the heat
sinks 20 can be selected according to heat dissipation requirement
of the electronic element.
[0011] A cross-shaped protrusion 12 protrudes from a center of a
top of the plate 10, to divide the top of the plate 10 into four
mounting areas 14, each for a single heat sink 20. Sizes of the
mounting areas 14 are the same. A locking hole 142 is defined in a
center of each mounting area 14, corresponding to the fixing hole
212 of a corresponding heat sink 20. Two pairs of tabs 144 extend
perpendicular from the protrusion 12. Two of each pair of tabs 144
are opposite to each other. A latching portion 122 is formed
between the tabs of each pair of tabs 144. In other embodiments,
the plate 10 may be divided into three mounting areas by the
protrusion 12 of another shape.
[0012] The clip 40 includes a positioning portion 42, two resisting
portions 44 extending in opposite directions from opposite ends of
the positioning portion 42, and two clasping portions 46 extending
from distal ends of the resisting portions 44 respectively, away
from the positioning portion 42. The resisting portions 44 are
fixed in the latching portions 122, to resist the protrusion 12 of
the plate 10.
[0013] Referring to FIGS. 2 and 3, in use, when power for the
electronic element is low, a few heat sinks 20, such as a heat sink
20 can be mounted on a corresponding mounting area 14 of the plate
10. A fastener 50 passes through the fixing hole 212 of the heat
sink 20 to engage the locking hole 142 of the mounting area 14 to
fix the heat sink 20 to the plate 10. When power for the electronic
element is high, an increased number of the heat sinks 20, such as
four, can be mounted on the mounting areas 14 of the plate 10,
respectively. Four fasteners 50 pass through the corresponding
fixing holes 212 of the heat sinks 20 to engage the corresponding
locking holes 142 of the mounting areas 14 to fix the four heat
sinks 20 to the plate 10. The clasping portions 46 of the clip 40
engage the circuit board to fix the heat dissipation device to the
circuit board.
[0014] The heat sinks 20 can be selectively mounted on the plate
10, and the number and shapes of the heat sinks 20 can be selected
according to heat dissipation requirement for different chips. The
plate 10 is divided into a plurality of mounting areas by the
protrusion 12, for fixing a plurality of the heat sinks 20 on the
plate 10. The heat dissipation device can satisfy different heat
dissipation requirements for different chips of the circuit board.
Therefore, the heat dissipation device is cost and time saving.
[0015] The foregoing description of the exemplary embodiments of
the disclosure has been presented only for the purposes of
illustration and description and is not intended to be exhaustive
or to limit the disclosure to the precise forms disclosed. Many
modifications and variations are possible in light of the above
teaching. The embodiments were chosen and described in order to
explain the principles of the disclosure and their practical
application so as to enable others skilled in the art to utilize
the disclosure and various embodiments and with various
modifications as are suited to the particular use contemplated.
Alternately embodiments will become apparent to those skilled in
the art to which the present disclosure pertains without departing
from its spirit and scope. Accordingly, the scope of the present
disclosure is defined by the appended claims rather than the
foregoing description and the exemplary embodiments described
therein.
* * * * *