U.S. patent application number 12/762721 was filed with the patent office on 2010-11-04 for apparatus for depositing organic material and depositing method thereof.
This patent application is currently assigned to SAMSUNG MOBILE DISPLAY CO., LTD.. Invention is credited to Jae-Hong AHN, You-Min CHA, Won-Seok CHO, Min-Jeong HWANG, Tae-Seung KIM, Tae-Wook KIM, Jong-Woo LEE, Jae-Mork PARK, Jae-Wan PARK.
Application Number | 20100279021 12/762721 |
Document ID | / |
Family ID | 42315790 |
Filed Date | 2010-11-04 |
United States Patent
Application |
20100279021 |
Kind Code |
A1 |
PARK; Jae-Wan ; et
al. |
November 4, 2010 |
APPARATUS FOR DEPOSITING ORGANIC MATERIAL AND DEPOSITING METHOD
THEREOF
Abstract
An apparatus for depositing an organic material and a depositing
method thereof, wherein a deposition process is performed with
respect to a second substrate while transfer and alignment
processes are performed with respect to a first substrate in a
chamber, so that loss of an organic material wasted in the transfer
and alignment processes can be reduced, thereby maximizing material
efficiency and minimizing a processing tack time. The apparatus
includes a chamber having an interior divided into a first
substrate deposition area and a second substrate deposition area,
an organic material deposition source transferred to within ones of
the first and second substrate deposition areas to spray particles
of an organic material onto respective ones of first and second
substrates and a first transferring unit to rotate the organic
material deposition source in a first direction from one of the
first and second substrate deposition areas to an other of the
first and second substrate deposition areas.
Inventors: |
PARK; Jae-Wan; (Yongin-city,
KR) ; CHA; You-Min; (Yongin-city, KR) ; CHO;
Won-Seok; (Yongin-city, KR) ; PARK; Jae-Mork;
(Yongin-city, KR) ; AHN; Jae-Hong; (Yongin-city,
KR) ; HWANG; Min-Jeong; (Yongin-city, KR) ;
KIM; Tae-Wook; (Yongin-city, KR) ; LEE; Jong-Woo;
(Yongin-city, KR) ; KIM; Tae-Seung; (Yongin-city,
KR) |
Correspondence
Address: |
ROBERT E. BUSHNELL & LAW FIRM
2029 K STREET NW, SUITE 600
WASHINGTON
DC
20006-1004
US
|
Assignee: |
SAMSUNG MOBILE DISPLAY CO.,
LTD.
Yongin-city
KR
|
Family ID: |
42315790 |
Appl. No.: |
12/762721 |
Filed: |
April 19, 2010 |
Current U.S.
Class: |
427/427.3 ;
118/313 |
Current CPC
Class: |
H01L 51/56 20130101;
C23C 14/56 20130101; B05D 3/0493 20130101; C23C 14/243 20130101;
B05D 1/02 20130101; B05D 1/60 20130101; H01L 51/0008 20130101; C23C
14/12 20130101 |
Class at
Publication: |
427/427.3 ;
118/313 |
International
Class: |
B05D 1/02 20060101
B05D001/02; B05C 5/00 20060101 B05C005/00 |
Foreign Application Data
Date |
Code |
Application Number |
May 4, 2009 |
KR |
10-2009-0038907 |
Feb 5, 2010 |
KR |
10-2010-0010837 |
Claims
1. A deposition apparatus, comprising: a chamber having an interior
divided into a first substrate deposition area and a second
substrate deposition area; an organic material deposition source
transferred to within ones of the first and second substrate
deposition areas to spray particles of an organic material onto
respective ones of first and second substrates; and a first
transferring unit to rotate the organic material deposition source
in a first direction from one of the first and second substrate
deposition areas to an other of the first and second substrate
deposition areas.
2. The apparatus of claim 1, further comprising a second
transferring unit to reciprocate the organic material deposition
source in a second direction within one of the first and second
substrate deposition areas.
3. The apparatus of claim 1, further comprising: a first substrate
aligning unit positioned in the first substrate deposition area to
align the first substrate transferred from an outside; and a second
substrate aligning unit positioned in the second substrate
deposition area to align the second substrate transferred from the
outside.
4. The apparatus of claim 1, wherein the first substrate deposition
area and the second substrate deposition area extend in a second
direction that intersects the first direction.
5. The apparatus of claim 1, wherein the organic material
deposition source is a linear deposition source.
6. The apparatus of claim 1, wherein a body of the chamber is a
polygonal container having a first side adjacent to the first
transferring unit that is longer than a second side opposite the
first side.
7. The apparatus of claim 6, wherein the first and second
substrates enter and exit the chamber through the second side of
the chamber.
8. A method of depositing an organic material, comprising:
transferring a first substrate into a first substrate deposition
area of a chamber and performing an alignment process on the first
substrate; transferring a deposition source to within the first
substrate deposition area to perform a deposition process on the
first substrate after completion of the alignment process on the
first substrate; transferring a second substrate into a second
substrate deposition area of the chamber and performing an
alignment process on the transferred second substrate while the
deposition process on the first substrate is being performed;
transferring the deposition source to the second substrate
deposition area by rotating the deposition source in a first
direction when the deposition process on the first substrate and
the alignment process on the second substrate are completed; and
transferring the deposition source within the second substrate
deposition area to perform the deposition process on the second
substrate.
9. The method of claim 8, further comprising transferring a third
substrate into the first substrate deposition area of the chamber
and performing an alignment process with respect to the third
substrate while performing the deposition process with respect to
the second substrate.
10. An apparatus, comprising: a chamber having an interior divided
into a first substrate deposition area, a standby area, and a
second substrate deposition area; a first substrate aligning unit
positioned in the first substrate deposition area to align a first
substrate transferred from an outside; a second substrate aligning
unit positioned in the second substrate deposition area to align a
second substrate transferred from the outside; at least one organic
material deposition source to spray particles of an organic
material onto ones of the first and second substrates; and a
transferring unit to transfer the organic material deposition
source in a first direction.
11. The apparatus of claim 10, further comprising: a deposition
source holding unit to hold the organic material deposition source;
and an angle limiting plate arranged on an upper outer wall of the
deposition source holding unit.
12. The apparatus of claim 10, wherein the first substrate
deposition area, the standby area, and the second substrate
deposition area are arranged in a line extending in the first
direction.
13. A method of depositing an organic material, comprising:
positioning a deposition source in a standby area of a chamber
while a first substrate is transferred from an outside into a first
substrate deposition area of the chamber and while an alignment
process is being performed on the first substrate; performing a
deposition process with respect to the first substrate by
transferring the deposition source positioned in the standby area
of the chamber into the first substrate deposition area after the
alignment process with respect to the first substrate is completed;
transferring a second substrate from an outside into a second
substrate deposition area and performing an alignment process with
respect to the second substrate; transferring the deposition source
from the first substrate deposition area back to the standby area
of the chamber after the deposition process with respect to the
first substrate is completed; and performing a deposition process
with respect to the second substrate by transferring the deposition
source positioned in the standby area of the chamber into the
second substrate deposition area after the alignment process with
respect to the second substrate is completed.
14. The method of claim 13, wherein the alignment process with
respect to the second substrate is performed while the deposition
process is being performed with respect to the first substrate.
15. The method of claim 13, further comprising: transferring the
first substrate from the first substrate deposition area of the
chamber to the outside upon completion of the deposition process on
the first substrate; and transferring a third substrate into the
first substrate deposition area of the chamber from the
outside.
16. A deposition system, comprising: a plurality of organic
material deposition apparatuses; a transfer chamber to commonly
connect the plurality of organic material deposition apparatuses;
and a load lock chamber to load and/or unload substrates inserted
into the organic material deposition apparatuses through the
transfer chamber, wherein the plurality of organic material
deposition apparatuses comprises a first organic material
deposition apparatus to perform a deposition process with respect
to at least two substrates and to perform transfer and an alignment
processes of at least one of the at least two substrates while
performing the deposition process with respect to an other of the
at least two substrates.
17. The system of claim 16, wherein the plurality of organic
material deposition apparatuses further comprises a second organic
material deposition apparatus to sequentially perform a transfer
process, an alignment process, and a deposition process with
respect to a single substrate.
18. The system of claim 16, wherein the first organic material
deposition apparatus comprises: a chamber having an interior
divided into a first substrate deposition area and a second
substrate deposition area; an organic material deposition source
transferred to within ones of the first and second substrate
deposition areas to spray particles of an organic material onto
respective ones of first and second substrates; and a transferring
unit to rotate the organic material deposition source in a first
direction from one of the first and second substrate deposition
areas to an other of the first and second substrate deposition
areas.
19. The system of claim 18, wherein the chamber is a polygonal
container having a first side adjacent to the first transferring
unit that is longer than a second side opposite the first side.
20. The system of claim 19, wherein the first and second substrates
enter and exit the chamber through the second side of the chamber.
Description
CLAIM OF PRIORITY
[0001] This application makes reference to, incorporates the same
herein, and claims all benefits accruing under 35 U.S.C. .sctn.119
from applications earlier filed in the Korean Intellectual Property
Office on 4 May 2009 and there duly assigned Serial No.
10-2009-0038907 and on 5 Feb. 2010 and there duly assigned Serial
No. 10-2010-0010837, respectively.
BACKGROUND OF THE INVENTION
[0002] 1. Field of the Invention
[0003] An aspect of the present invention relates to an apparatus
for depositing an organic material and a depositing method thereof
that can perform a deposition process with respect to a second
substrate while performing transfer and alignment processes with
respect to a first substrate in the same chamber.
[0004] 2. Description of the Related Art
[0005] An organic light emitting display device has come into the
spotlight as a next generation self-emissive display device because
of wide viewing angle, excellent contrast and fast response speed
characteristics. An organic light emitting diode included in the
organic light emitting display device includes first and second
electrodes (anode and cathode electrodes) facing each other and an
intermediate layer formed between the electrodes. The intermediate
layer may include various layers, e.g., a hole injection layer, a
hole transport layer, an emission layer, an electron transport
layer, or an electron injection layer. In the organic light
emitting diode element, such intermediate layers are organic thin
films formed of an organic material.
SUMMARY OF THE INVENTION
[0006] Accordingly, there are provided an apparatus for depositing
an organic material and a deposition method thereof, wherein a
deposition process is performed with respect to a second substrate
while transfer and alignment processes are performed with respect
to a first substrate in a same chamber, so that loss of an organic
material during the transfer and alignment processes can be
reduced, thereby maximizing material efficiency and minimizing a
processing tack time.
[0007] In addition, there is provided an organic material
deposition system having more processing chambers arranged in a
same space than that of earlier organic material deposition
systems, the processing chambers being arranged in a direction
where a deposition source moves for the deposition performance with
respect to respective substrates is different from a direction
where the deposition moves for the deposition of another substrate,
so that the size of a chamber is optimized and space use is
maximized.
[0008] According to an aspect of the present invention, there is
provided a deposition apparatus that includes a chamber having an
interior divided into a first substrate deposition area and a
second substrate deposition area, an organic material deposition
source transferred to within ones of the first and second substrate
deposition areas to spray particles of an organic material onto
respective ones of first and second substrates and first
transferring unit to rotate the organic material deposition source
in a first direction from one of the first and second substrate
deposition areas to an other of the first and second substrate
deposition areas. The deposition apparatus may also include a
second transferring unit to reciprocate the organic material
deposition source in a second direction within one of the first and
second substrate deposition area. The deposition apparatus may also
include a first substrate aligning unit positioned in the first
substrate deposition area to align the first substrate transferred
from an outside and a second substrate aligning unit positioned in
the second substrate deposition area to align the second substrate
transferred from the outside.
[0009] The first substrate deposition area and the second substrate
deposition area may extend in a second direction that intersects
the first direction. The organic material deposition source may be
a linear deposition source. A body of the chamber may be a
polygonal container having a first side adjacent to the first
transferring unit that is longer than a second side opposite the
first side. The first and second substrates may enter and exit the
chamber through the second side of the chamber.
[0010] According to another aspect of the present invention, there
is provided a method of depositing an organic material, which
includes transferring a first substrate into a first substrate
deposition area of a chamber and performing an alignment process on
the first substrate, transferring a deposition source to within the
first substrate deposition area to perform a deposition process on
the first substrate after completion of the alignment process on
the first substrate, transferring a second substrate into a second
substrate deposition area of the chamber and performing an
alignment process on the transferred second substrate while the
deposition process on the first substrate is being performed,
transferring the deposition source to the second substrate
deposition area by rotating the deposition source in a first
direction when the deposition process on the first substrate and
the alignment process on the second substrate are completed and
transferring the deposition source within the second substrate
deposition area to perform the deposition process on the second
substrate. The method may also include transferring a third
substrate into the first substrate deposition area of the chamber
and performing an alignment process with respect to the third
substrate while performing the deposition process with respect to
the second substrate.
[0011] According to still another aspect of the present invention,
there is provided an apparatus, which includes a chamber having an
interior divided into a first substrate deposition area, a standby
area, and a second substrate deposition area, a first substrate
aligning unit positioned in the first substrate deposition area to
align a first substrate transferred from an outside, a second
substrate aligning unit positioned in the second substrate
deposition area to align a second substrate transferred from the
outside, at least one organic material deposition source to spray
particles of an organic material onto ones of the first and second
substrates and a transferring unit to transfer the organic material
deposition source in a first direction. The apparatus may also
include a deposition source holding unit to hold the organic
material deposition source and an angle limiting plate arranged on
an upper outer wall of the deposition source holding unit. The
first substrate deposition area, the standby area, and the second
substrate deposition area may be arranged in a line extending in
the first direction.
[0012] According to still another aspect of the present invention,
there is provided a method of depositing an organic material, which
includes positioning a deposition source in a standby area of a
chamber while a first substrate is transferred from an outside into
a first substrate deposition area of the chamber and while an
alignment process is being performed on the first substrate,
performing a deposition process with respect to the first substrate
by transferring the deposition source positioned in the standby
area of the chamber into the first substrate deposition area after
the alignment process with respect to the first substrate is
completed, transferring a second substrate from an outside into a
second substrate deposition area and performing an alignment
process with respect to the second substrate, transferring the
deposition source from the first substrate deposition area back to
the standby area of the chamber after the deposition process with
respect to the first substrate is completed and performing a
deposition process with respect to the second substrate by
transferring the deposition source positioned in the standby area
of the chamber into the second substrate deposition area after the
alignment process with respect to the second substrate is
completed. The alignment process with respect to the second
substrate may be performed while the deposition process is being
performed with respect to the first substrate. The method may also
include transferring the first substrate from the first substrate
deposition area of the chamber to the outside upon completion of
the deposition process on the first substrate and transferring a
third substrate into the first substrate deposition area of the
chamber from the outside.
[0013] According to still another aspect of the present invention,
there is provided a deposition system, which includes a plurality
of organic material deposition apparatuses, a transfer chamber to
commonly connect the plurality of organic material deposition
apparatuses and a load lock chamber to load and/or unload
substrates inserted into the organic material deposition
apparatuses through the transfer chamber, wherein the plurality of
organic material deposition apparatuses comprises a first organic
material deposition apparatus to perform a deposition process with
respect to at least two substrates and to perform transfer and an
alignment processes of at least one of the at least two substrates
while performing the deposition process with respect to an other of
the at least two substrates. The plurality of organic material
deposition apparatuses may further include a second organic
material deposition apparatus to sequentially perform a transfer
process, an alignment process, and a deposition process with
respect to a single substrate.
[0014] The first organic material deposition apparatus may include
a chamber having an interior divided into a first substrate
deposition area and a second substrate deposition area, an organic
material deposition source transferred to within ones of the first
and second substrate deposition areas to spray particles of an
organic material onto respective ones of first and second
substrates and a transferring unit to rotate the organic material
deposition source in a first direction from one of the first and
second substrate deposition areas to an other of the first and
second substrate deposition areas. The chamber may be a polygonal
container having a first side adjacent to the first transferring
unit that is longer than a second side opposite the first side. The
first and second substrates may enter and exit the chamber through
the second side of the chamber.
BRIEF DESCRIPTION OF THE DRAWINGS
[0015] A more complete appreciation of the invention and many of
the attendant advantages thereof, will be readily apparent as the
same becomes better understood by reference to the following
detailed description when considered in conjunction with the
accompanying drawings in which like reference symbols indicate the
same or similar components, wherein:
[0016] FIG. 1 is a cross-sectional view schematically illustrating
the configuration of an apparatus for depositing an organic
material according to a first embodiment of the present
invention;
[0017] FIGS. 2A to 2D are views illustrating a method of depositing
an organic material according to the first embodiment of the
present invention using the apparatus of FIG. 1;
[0018] FIG. 3 is a view illustrating an apparatus for depositing an
organic material according to a second embodiment of the present
invention;
[0019] FIGS. 4A to 4D are views illustrating a method of depositing
an organic material according to the second embodiment of the
present invention using the apparatus of FIG. 3; and
[0020] FIG. 5 is a block diagram schematically of an organic
material deposition system according to a third embodiment of the
present invention that includes an organic material deposition
apparatus according to the second embodiment of the present
invention.
DETAILED DESCRIPTION OF THE INVENTION
[0021] In the following detailed description, only certain
exemplary embodiments of the present invention have been shown and
described, simply by way of illustration. As those skilled in the
art would realize, the described embodiments may be modified in
various different ways, all without departing from the spirit or
scope of the present invention. Accordingly, the drawings and
description are to be regarded as illustrative in nature and not
restrictive. In addition, when an element is referred to as being
"on" another element, it can be directly on the another element or
be indirectly on the another element with one or more intervening
elements interposed therebetween. Also, when an element is referred
to as being "connected to" another element, it can be directly
connected to the another element or be indirectly connected to the
another element with one or more intervening elements interposed
therebetween. Hereinafter, like reference numerals refer to like
elements.
[0022] An organic light emitting display device has come into the
spotlight as a next generation self-emissive display device because
of wide viewing angle, excellent contrast and fast response speed
characteristics. An organic light emitting diode included in the
organic light emitting display device includes first and second
electrodes (anode and cathode electrodes) facing each other and an
intermediate layer arranged between the electrodes. The
intermediate layer may include various layers, e.g., a hole
injection layer, a hole transport layer, an emission layer, an
electron transport layer, and/or an electron injection layer. In
the organic light emitting diode element, such intermediate layers
are organic thin films made out of an organic material.
[0023] In the process of manufacturing an organic light emitting
diode element having the aforementioned configuration, organic thin
films and electrodes including a hole injection layer, a hole
transport layer, an emission layer, an electron transport layer, an
electron injection layer and the like may be formed on a substrate
through a deposition method using a deposition apparatus.
[0024] In the deposition method, after loading a substrate into a
vacuum chamber, a thin film is formed by heating a container
containing an organic material to be deposited and then evaporating
or sublimating the organic material in the container. An organic
thin film is deposited on the substrate by aligning a shadow mask
pattern having an opening with a desired shape in front of the
substrate and then evaporating or sublimating the organic
material.
[0025] Before such a deposition process is performed, a process of
transferring a substrate into a chamber, a process of precisely
aligning a shadow mask to the substrate, and the like are
necessarily performed. According to earlier deposition apparatus
and method, the deposition process is impossible during the
substrate transfer and mask alignment processes. Further, the
substrate transfer and mask alignment processes are separated from
the deposition process. Therefore, a processing tack time may be
increased.
[0026] In addition, according to earlier deposition apparatus and
method, the organic material is continuously evaporated or
sublimated from a deposition source during the substrate transfer
and mask alignment processes. Therefore, the organic material may
be wasted.
[0027] Turning now to FIG. 1, FIG. 1 is a cross-sectional view
schematically illustrating the configuration of an apparatus for
depositing an organic material according to a first embodiment of
the present invention. Referring to FIG. 1, the apparatus for
depositing an organic material according to the first embodiment of
the present invention includes a chamber 100 having an interior
divided into a first substrate deposition area, a standby area and
a second substrate deposition area, a first substrate aligning unit
200 positioned in the first substrate deposition area to align a
first substrate 110 transferred from the outside, a second
substrate aligning unit 210 positioned in the second substrate
deposition area to align a second substrate 110' transferred from
the outside, at least one organic material deposition source 300
for spraying particles of the deposition material onto the first
and second substrates 110 and 110', a deposition source holding
unit 400 for holding the organic material deposition source 300,
and a transferring unit 500 for transferring the deposition source
holding unit in a first direction (for example, a horizontal
direction). As illustrated in FIG. 1, the first substrate
deposition area, the standby area, and the second substrate
deposition area are arranged in a line in the first direction.
[0028] Here, a vacuum state is maintained within the chamber 100 by
a vacuum pump (not shown). Two organic material deposition sources
300 are held in the deposition source holding unit 400 in the first
embodiment of FIG. 1, and an angle limiting plate 410 is formed on
the upper outer wall of the deposition source holding unit 400.
Accordingly, the angle limiting plate 410 functions to limit the
spraying direction of the organic material sprayed from the organic
material deposition source 300.
[0029] The transferring unit 500 functions to transfer the
deposition source holding unit 400 in the first direction (in a
horizontal direction). The transferring unit 500 controls the
deposition source holding unit 400 to be initially positioned in
the standby area of the chamber 100. Then, when the alignment of
the first substrate 110 is completed by the first substrate
aligning unit 200, the transferring unit 500 transfers the
deposition source holding unit 400 to the first substrate
deposition area to perform a deposition process on the first
substrate 110.
[0030] Thereafter, when the alignment of the second substrate 110'
is completed by the second substrate aligning unit 210, the
transferring unit 500 transfers the deposition source holding unit
400 to the second substrate deposition area to perform a deposition
process on the second substrate 110'.
[0031] That is, transfer and alignment processes are performed with
respect to the second substrate 110' while a deposition process is
being performed with respect to the first substrate 110.
Conversely, transfer and alignment processes are performed with
respect to the first substrate 110 while a deposition process is
being performed with respect to the second substrate 110'.
Accordingly, a processing tack time can be considerably reduced and
the amount of waste of organic material is also reduced, so that
material efficiency can be maximized.
[0032] The transferring unit 500 is preferably implemented so that
the use of the transferring unit 500 can be suitable in the chamber
100 maintained in the vacuum state, and that the transfer speed of
the organic material deposition source 300 can be controlled
depending on processing conditions. The transferring unit 500 may
include a ball screw (not shown), a motor (not shown) for rotating
the ball screw, and a guide (not shown) for guiding the deposition
source holding unit 400, however this description is provided only
for illustrative purposes. In another embodiment, the transferring
unit 500 may be implemented so that the organic material deposition
source 300 can be driven at a constant speed using a linear motor
(not shown).
[0033] In addition, a mask pattern 120 for determining the shape of
the organic material to be deposited is positioned at the front
sides of the first and second substrates 110 and 110', i.e.,
between the organic material deposition source 300 and the first
and second substrates 110 and 110'. Accordingly, the organic
material evaporated from the organic material deposition source 300
is deposited onto the first and second substrates 110 and 110'
while passing through the mask pattern 120, so that an organic film
with a predetermined shape is formed on the first and second
substrates 110 and 110'.
[0034] Meanwhile, the organic material deposition source 300
contains within an organic material to be deposited on the first
and second substrates 110 and 110' and heats the received organic
material to evaporate the organic material. Then, the organic
material deposition source 300 sprays the evaporated organic
material onto the first and second substrates 110 and 110' so that
an organic film is formed on the first and second substrates 100
and 110'. The organic material deposition source 300 may be
implemented as a linear deposition source or a point deposition
source.
[0035] It is to be appreciated that it is difficult for the point
deposition source to perform the depositions of the organic
material on a large area. For the deposition of the organic
material on the large area, several point deposition sources must
be arranged. When many point sources are used, it is difficult to
control the plurality of point deposition sources. Accordingly, in
the embodiment of the present invention, the organic deposition
source 300 is preferably implemented as a linear deposition
source.
[0036] Turning now to FIGS. 2A through 2D, FIGS. 2A through 2D are
views illustrating a method of depositing an organic material
according to a first embodiment of the present invention, which is
performed by the apparatus for depositing an organic material as
illustrated in FIG. 1. As illustrated in FIG. 2A, after the first
substrate 110 is transferred into the chamber 100 and before the
alignment process is completed on the first substrate 110, the
deposition source holding unit 400 holding the organic material
deposition source 300 is positioned in the standby area, which is a
central area of the chamber 100. To transfer a substrate into the
chamber 100, a robot arm (see FIG. 5) and a transfer chamber (see
FIG. 5) are connected to the chamber 100 of a cluster type
deposition.
[0037] The organic deposition source 300 keeps evaporating and
spraying the organic material, even when being positioned in the
standby area. However, when the organic material deposition source
300 is positioned in the standby area, organic material is not
being deposited on either of the first or the second substrate 110
or 110'. Therefore, while first or second substrate 110 or 110' is
being aligned, the angle limiting plate 410 provided on the upper
outer wall of the deposition source holding unit 400 blocks the
evaporated organic material from reaching either of the first or
second substrate 110 or 110'.
[0038] That is, in the embodiment of the present invention, the
angle limiting plate 410 is provided on the upper outer wall of the
deposition source holding unit 400 so that a barrier layer provided
in earlier deposition apparatuses is no longer necessary. The
barrier layer is provided in earlier deposition apparatuses and is
formed between the substrate and the organic material deposition
source to prevent the organic material from being depositing on the
substrate while the alignment process of the substrate is being
performed.
[0039] When the alignment on the first substrate 110 is completed
by the first substrate aligning unit 200, the deposition source
holding unit 400 positioned in the standby area of the chamber 100
as illustrated in FIG. 2A is transferred to the first substrate
deposition area as illustrated in FIG. 2B so that the first
substrate 110 faces the organic material deposition source 300 so
that the deposition process can be performed on the first substrate
110. As illustrated in FIG. 2B, in the first embodiment, deposition
source 300 moves in the same first direction within the first
substrate deposition area during the deposition onto the first
substrate 110.
[0040] However, in the embodiment of the present invention, the
second substrate 110' is transferred to the second substrate
deposition area of the chamber from an outside and the alignment
process of the transferred second substrate 110' is performed by
the second substrate aligning unit 210 while the deposition process
with respect to the first substrate 110 is carried out. That is,
the transfer and the alignment processes of the second substrate
110' are performed simultaneously with the deposition process with
respect to the first substrate 110.
[0041] Next, when the deposition process with respect to the first
substrate 110 is completed, the source holding unit 400 is
transferred back into the standby area of the chamber 100 by
transfer unit 500 as illustrated in FIG. 2C, and the first
substrate 110 is removed from the chamber 100. The removal of first
substrate 110 is implemented by the robot arm provided in the
transfer chamber as described above and as illustrated in FIG.
5.
[0042] When the alignment with respect to the second substrate 110'
is completed, the deposition source holding unit 400 positioned in
the standby area of the chamber 100 is transferred to the second
substrate deposition area as illustrated in FIG. 2D by the transfer
unit 500 and the deposition process is performed within the second
substrate deposition area. In this embodiment, deposition is
performed on second substrate 110' while a new third substrate is
transferred into the chamber and into the first substrate
deposition area and is aligned by the first substrate aligning unit
200. While organic material is being deposited onto second
substrate 110', deposition source is moved in the same direction
(i.e., the first direction) as when moved from ones of the standby
area and the first and second substrate deposition areas. As will
be described later in the second embodiment of FIGS. 3 through 4D,
this is not the most efficient use of space as the chamber 100
according to the first embodiment must be designed to extend an
extra large distance in the first direction when the direction of
translation of the deposition source in between depositions is the
same as direction of movement of the deposition source 300 during a
deposition.
[0043] When the deposition process with respect to the second
substrate 110' is completed, the deposition source holding unit 400
is transferred again back to the standby area of the chamber 100 by
the transfer unit 500 as illustrated in FIG. 2A and the second
substrate 110' is removed from the chamber and a new fourth
substrate is transferred into the chamber and to the second
substrate deposition area.
[0044] According to the method in accordance with the first
embodiment of the present invention, the deposition process with
respect to the second substrate 110' is performed while the
transfer and the alignment processes with respect to the first
substrate 110 are performed in the same chamber so that waste of
organic material is reduced and throughput can be increased,
thereby maximizing material efficiency and minimizing a processing
tack time.
[0045] However, in the first embodiment of the present invention as
illustrated in FIGS. 1 through 2D, since the direction that the
deposition source 300 moves during a deposition process is the same
as the direction that the deposition source 300 moves when going
from the first substrate deposition area to the second substrate
deposition area (or from the second substrate deposition area to
the first substrate deposition area) to perform the deposition with
respect to another substrate, the width of the chamber 100 must be
increased in the direction that the deposition process is performed
(the first direction).
[0046] That is, since the deposition source 300 is transferred in
the same first direction (horizontal direction) as the deposition
performance direction when the deposition source 300 is transferred
to perform the deposition on the second substrate 110' after the
deposition with respect to the first substrate 110 is completed,
the chamber length must be increased about two times in the first
direction (horizontal direction) to allow for the deposition with
respect to the first and second substrates 110 and 110'.
[0047] Therefore, in the second embodiment of the present
invention, the direction that the deposition source moves during a
deposition is different from the direction that the deposition
source is moved to get from one substrate deposition area to
another. By designing the chamber as such according to the second
embodiment of the present invention, the size and shape of the
chamber results in optimum space efficiency and the above-mentioned
problem will be solved.
[0048] Turning now to FIG. 3, FIG. 3 is a view illustrating an
apparatus for depositing an organic material according to a second
embodiment of the present invention. However, since the shadow mask
and the deposition source are identical to those in the first
embodiment of the present invention as illustrated in FIG. 1, their
descriptions will be omitted and same elements are assigned with
same reference numerals for illustrative purposes.
[0049] Referring to FIG. 3, an apparatus for depositing an organic
material according to the second embodiment of the present
invention includes a chamber 600 having an interior divided into a
first substrate deposition area A and a second substrate deposition
area B, a first substrate aligning unit 200 positioned in the first
substrate deposition area A to align a first substrate 110
transferred from the outside, a second substrate aligning unit 210
positioned in the second substrate deposition area B to align a
second substrate 110' transferred from the outside, at least one
organic material deposition source 300 for spraying particles of
the organic material onto the first and second substrates 110 and
110', a deposition source holding unit 400 for holding the organic
material deposition source 300, a first transferring unit 510 for
rotating the organic material deposition source in a first
direction to move the organic material deposition source 300 from
one of a first and second substrate deposition area to another of a
first and second deposition area, and a second transferring unit
520 for transferring the deposition source holding unit 400 in a
second direction within one of the first and second substrate
deposition areas.
[0050] Here, a vacuum state is maintained within the chamber 600 by
a vacuum pump (not shown). The transfer and carrying of the
substrate into the chamber 600 are implemented by a robot arm (see
FIG. 5) provided in a transfer chamber (see FIG. 5) connected to
the chamber 600 of a cluster type deposition system.
[0051] The first substrate deposition area A and the second
substrate deposition are B, as illustrated, are arranged almost in
parallel to each other near the second direction, wherein the
deposition of the substrates performed in the respective deposition
areas A and B is performed by which the deposition source holding
unit 400 holding the deposition source 300 is reciprocated in the
second direction by the second transferring unit 520.
[0052] When deposition on the first substrate 110 is completed in
the first substrate deposition area A, the deposition source
holding unit 400 is rotated in the first direction by the first
transferring unit 510 so that it is positioned within the second
substrate deposition area B, and then the deposition source holding
unit 400 is reciprocated in the second direction by the second
transferring unit 520 during the deposition on the second substrate
110'.
[0053] Similarly, when the deposition of the second substrate 110'
is completed in the second substrate deposition area B, the
deposition source holding unit 400 is rotated in the first
direction by the first transferring unit 510 so that it is
positioned within the first substrate deposition area A, and then
the deposition source holding unit 400 is reciprocated in the
second direction by the second transferring unit 520 during
deposition on a newly entered third substrate.
[0054] The first and second transferring units 510 and 520 are
preferably implemented so that the use of the first and second
transferring units 510 and 520 can be suitable in the chamber 600
maintained in the vacuum state, and that the transfer speed of the
organic material deposition source 300 can be controlled depending
on processing conditions. The first and second transferring units
510 and 520 may include holders 512 and 522 for holding each
substrate, a ball screw (not shown), a motor (not shown) for
rotating the ball screw, and a guide (not shown) for guiding the
deposition source holding unit 400, however, this description is
provided only for illustrative purposes. In another variation, the
transferring units 510 and 520 may be implemented so that the
organic material deposition source 300 can be driven at a constant
speed using a linear motor (not shown).
[0055] In the first embodiment described with reference to FIGS. 1
through 2D, since the deposition source is transferred to perform
the deposition of the respective substrates in the chamber in the
same direction (horizontal direction) as the direction the
deposition source is transferred when being moved from one
substrate deposition area to the other, the width of the chamber
must be increased about two times in the first direction that the
deposition source moves. However, in the embodiment as illustrated
in FIG. 3, the direction that the deposition source is transferred
to perform the deposition of the respective substrates (second
direction) is different from the direction that the deposition
source 300 is transferred to move from one substrate deposition
area to the other (first direction), so that the size and shape of
chamber 600 of the second embodiment of the present invention is
more space efficient than the process chamber 100 of the first
embodiment of the present invention.
[0056] However, to this end, in the embodiment as illustrated in
FIG. 3, the body of the chamber 600 is implemented as a polygonal
container having a length L1 on a first side 102 longer than a
length L2 on a second side 104 such that the first transferring
unit 510 can be rotated in the first direction and accordingly, the
increase of the width of the chamber 600 can be minimized. Although
the body of the chamber 600 is depicted as a polygonal container in
the embodiment as illustrated in FIG. 3, this is provided only for
illustrative purposes. The body of the chamber can instead be
implemented as a pentagonal container in which the first side 102
is bent.
[0057] In this case, the first side 102 is adjacent to the first
transferring unit 510 and the second side 104 is opposite to the
first side 102, wherein the transfer and the carrying of the
substrates into and out of chamber 600 are performed on the second
side 104. As a result, the second side 104 has an opening (not
shown) such that the transfer and the carrying of the substrates
can be performed.
[0058] Hereinafter, the method of depositing an organic material
performed by the apparatus illustrated in FIG. 3 will be described
in detail with reference to FIGS. 4A to 4D. Referring to FIG. 4A, a
first substrate 110 is transferred into the chamber 600 through an
opening (not shown) formed in the second side 104 of the body of
the chamber 100. Then, an alignment process is performed by the
first substrate aligning unit 200. Then, the deposition source
holding unit 400 is reciprocated in the second direction within the
first substrate deposition area A by the second transferring unit
520 positioned in the first substrate deposition area A so that the
deposition process on the first substrate 110 can be performed.
[0059] During the deposition process with respect to the first
substrate 110, the second substrate 110' is transferred into the
chamber 600 through the opening (not shown) formed in the second
side 104 and as illustrated in FIG. 4B, and an alignment process is
performed by the second substrate aligning unit 210.
[0060] At this time, the first substrate aligning unit 200 and the
second substrate aligning unit 210 are respectively positioned in
the first substrate deposition area A and the second substrate
deposition area B, and since configuration thereof is identical to
that as illustrated in FIG. 1, the description will be omitted.
That is, in the embodiment of the present invention, the transfer
and the alignment process of the second substrate 110' are
performed simultaneously and within the same chamber 600 as the
deposition of organic material onto the first substrate 110.
[0061] When the deposition process on the first substrate 110 and
the alignment process on the second substrate 110' are completed,
the deposition source holding unit 400, as illustrated in FIG. 4C,
is rotated in the first direction by the first transferring unit
510 so that it is positioned within the second substrate deposition
area B. At this time, the first substrate 110, upon which the
deposition process is completed, is removed from chamber 600 and a
new first substrate 110 (hereinafter a third substrate) enters the
first substrate deposition area A of the chamber 600 for alignment.
Because the deposition source holding unit 400 containing the
organic material deposition source 300 is rotated from the first
substrate deposition area A to the second substrate deposition area
B by the first transferring unit 510 in a first direction that is
essentially orthogonal to the second direction, the width of the
chamber 600 can be remarkably reduced in comparison to the chamber
100 of the first embodiment of FIGS. 1 through 2D.
[0062] That is, as illustrated in FIGS. 3 through 4D, in the second
embodiment of the present invention, the chamber 600 is implemented
as a polygonal container having the length L1 on the first side 102
longer than the length L2 on the second side 104 to enable the
deposition source holding unit 400 and the organic material
deposition source 300 to be rotated so that spatial use can be
maximized.
[0063] After the deposition source holding unit 400 is positioned
in the second substrate deposition are B as illustrated in FIG. 4D,
the source holding unit 400 reciprocates in the second direction
within the second substrate deposition area B so that the
deposition process on the second substrate 110' can be
performed.
[0064] In addition, the alignment process of the third substrate
that is newly transferred into the chamber 600 is performed by the
first substrate aligning unit 200 positioned in the first substrate
deposition area A simultaneous with the deposition process on the
second substrate 110' in the second substrate deposition area B
being carried out. That is, in the second embodiment of the present
invention, the transfer and the alignment processes of the new
first substrate 110 (aka third substrate) are performed in the same
chamber 600 and at the same time that the deposition process on the
second substrate 110' is being performed. When the deposition
process on the second substrate 110' is completed, the process
sequence as illustrated in FIGS. 4A through 4D are repeated and the
deposition and alignment processes of the respective substrates are
performed.
[0065] Turning now to FIG. 5, FIG. 5 is a block diagram
schematically illustrating an organic material deposition system 10
including an organic material deposition apparatus according to a
third embodiment of the present invention. The organic material
deposition system 10 as illustrated in FIG. 5 is provided with
process chambers 600a and 600b analogous in design to process
chamber 600 of FIG. 3. Specifically, the body of chambers 600a and
600b of FIG. 5 include a polygonal container having a first side
longer than a second side to maximize the spatial use so that more
process chambers can be provided in a limited space environment
such as the cluster system 10 of FIG. 5.
[0066] Referring to FIG. 5, the system 10 for depositing an organic
material according to the third embodiment of the present invention
is implemented as a cluster type system including a plurality of
process chambers 600a, 600b, 700a and 700b for performing the
deposition process of an organic material, a transfer chamber 20
for commonly connecting each of process chambers 600a, 600b, 700a
and 700b, and load lock chambers 30 and 32 for loading and/or
unloading substrates 110, 110', and 110'' inserted into the process
chambers through the transfer chamber. A shadow mask unit 40 may be
further provided at a side of the transfer chamber 20 to be used
during the deposition process in the process chambers 600a, 600b,
700a and 700b.
[0067] The process chambers 600a, 600b, 700a and 700b are organic
material deposition apparatuses where the deposition process of an
organic material is performed and include process chambers 600a and
600b that each perform a deposition process on at least two
substrates and process chambers 700a and 700b that perform a
deposition process on a single substrate. That is, in the third
embodiment of FIG. 5, first and second process chambers 600a and
600b each perform the deposition process of two substrates and are
implemented such that the deposition process is performed with
respect to one substrate while transfer and alignment processes on
the other substrate are being performed. In this case, the first
and second process chambers 600a and 600b are implemented as in the
second embodiment of the organic material deposition apparatus as
described with reference to FIGS. 3 through 4D. The third and
fourth process chambers 700a and 700b sequentially perform the
alignment and deposition process of a single substrate,
respectively.
[0068] In the cluster type deposition system according to the third
embodiment of the present invention, the first and second process
chambers 600a and 600b are implemented as a polygonal container
having first and second sides with different lengths so that space
occupied by the first and second process chambers 600a and 600b can
be remarkably reduced and the third and fourth process chambers
700a and 700b can be further provided. In addition, deposition
yield is considerably improved over earlier deposition systems.
[0069] The respective process chambers 600a, 600b, 700a and 700b
may deposit additional organic materials on the substrate
respectively or may deposit a same organic material on the
substrate. For example, in the embodiment of FIG. 5, a first
organic material is deposited in the first and third process
chambers 600a and 700a and a second organic material is deposited
in the second and fourth process chambers 600b and 700b.
[0070] The substrate on which the deposition process of the first
organic material is completed in the first process chamber 600a is
transferred to the second process chamber 600b and then the second
organic material is further deposited. Similarly, the substrate on
which the deposition of the first organic material is completed in
the third process chamber 700a is transferred to the fourth process
chamber 700b and the second organic material is further deposited
in the fourth process chamber 700b.
[0071] The transfer chamber 20 is connected to the above-mentioned
process chambers 600a, 600b, 700a and 700b, the load lock chambers
30 and 32, and the shadow mask unit 40 through side wall regions of
the transfer chamber 20. In this case, penetration portions 24 are
provided to allow the substrate to enter and exit in the respective
side wall regions.
[0072] That is, the transfer chamber 20 includes a body 22 having a
transferring space for substrate transfer and a pair of robot arms
26 and 26' provided in the body 22. The pair of robot arms 26 and
26' transfers the substrate provided in the load lock chamber 30 to
one of the process chambers 600a, 600b, 700a and 700b or transfers
and carries the substrate on which the first deposition is
performed by process chamber 600a or 700a to another process
chamber 600b or 700b or the load lock chamber 32. The load lock
chambers 30 and 32, as described above, loads and/or unloads the
substrates 110, 110', and 110'' inserted into the process
chamber.
[0073] In the third embodiment of the present invention, at least
two robot arms 26 and 26' are provided in the body 22 of the
transfer chamber 20 so that the second substrate 110' can be
transferred to the process chamber 600a or 600b while the
deposition process of the first substrate 110 is being carried
out.
[0074] Operation of the organic material deposition system 10
according to the third embodiment of the present invention will be
described in brief as follows. First, when a plurality of
substrates are transferred from an external carrier apparatus (not
shown) to the first load lock chamber 30, the first load lock
chamber 30 loads the transferred substrates.
[0075] When the loading of the substrates is completed, a door (not
shown) of the first load lock chamber 30 is closed and the first
load lock chamber 30 is vacuumed. After that, the first robot arm
26 of the transfer chamber 20 transfers the first substrate 110
among the substrates to the first process chamber 600a through the
transfer chamber 20. In this case, processes in the first process
chamber 600a and the second process chamber 600b are identical to
the deposition process performed by the organic material deposition
apparatus of the chamber 600 of FIGS. 3 through 4D, and will be
described in brief as follows.
[0076] The first substrate 110 transferred to the first process
chamber 600a is aligned in the first process chamber 600a. When the
alignment process is completed, the deposition process on the first
substrate 110 is performed. That is, the first organic material is
deposited on the first substrate 110.
[0077] The second substrate 110', among the plurality of substrates
loaded in the first load lock chamber 30, is transferred by the
second robot arm 26' to the first process chamber 600a at the same
time that the first organic material is being deposited onto the
first substrate 110 in the first process chamber 600a. That is,
when the deposition process on the first substrate 100 is being
carried out in the first process chamber 600a, the transfer and the
alignment processes of the second substrate 110' are performed in
the first process chamber 600a. The deposition process on the
second substrate 110' is performed after the alignment process is
completed.
[0078] The first substrate 110, on which the deposition process is
completed, is transferred to the second process chamber 600b by the
first robot arm 26. Accordingly, the first substrate 110 is aligned
in the second process chamber 600b and the deposition of the second
organic material onto the first substrate 110 is carried out upon
completion of the alignment process of first substrate 110 in
process chamber 600b.
[0079] After the first substrate 110 enters the second process
chamber 600b, the second substrate 110', upon which the deposition
process is completed in the first process chamber 600a, is
transferred by the second robot arm 26' from the first process
chamber 600a to the second process chamber 600b during the
deposition process of the second organic material onto the first
substrate 110 within the second process chamber 600b.
[0080] That is, the transfer and the alignment processes of the
second substrate 110' are performed in the second process chamber
600b at the same time that the deposition process of the second
organic layer is being carried out on the first substrate 110
within the second process chamber 600b.
[0081] By doing so, when the deposition processes of the first and
second organic materials on the first and second substrates 110 and
110' are completed, the first and second substrates 110 and 110'
are continuously transferred to the second load lock chamber 32 by
the robot arm 26 or 26' and are unloaded respectively.
[0082] While the first and second substrates 110 and 110' are being
processed in process chambers 600a and 600b, process chambers 700a
and 700b can process third substrate 100''. This begins with the
first or second robot arm 26 or 26' transferring the third
substrate 110'' among the substrates loaded in the first load lock
chamber 30 to the third process chamber 700a through the transfer
chamber 20. After that, the third substrate 110'' is aligned in the
third process chamber 700a. When the alignment process is
completed, the deposition process of the first organic material on
the third substrate 110'' is carried out. When the deposition
process of the third substrate 110'' is completed, a robot arm 26
or 26' transfers the third substrate 110'' to the fourth process
chamber 700b, and the third substrate 110'' is aligned within the
fourth process chamber 700b. When the alignment process is
completed, a second organic material is deposited onto the third
substrate 110''. After that, when the deposition processes of the
first and second organic materials on the third substrate 110'' are
completed, the third substrate 110'' is transferred to the second
load lock chamber 32 and is unloaded by a robot arm 26 or 26'.
[0083] At this time, the deposition processes of the third
substrate 110'', that is, the deposition processes performed in the
third and fourth process chambers 700a and 700b, may be performed
simultaneously with the deposition processes on the first and
second substrates 110 and 110'.
[0084] Consequently, according to the organic material deposition
system 10 in accordance with the third embodiment of the present
invention, the deposition processes with respect to three
substrates can be performed at the same time so that standby time
in the respective process chambers can be reduced and productivity
and throughput can be increased and maximized.
[0085] While the present invention has been described in connection
with certain exemplary embodiments, it is to be understood that the
invention is not limited to the disclosed embodiments, but, on the
contrary, is intended to cover various modifications and equivalent
arrangements included within the spirit and scope of the appended
claims, and equivalents thereof.
* * * * *