U.S. patent application number 12/837693 was filed with the patent office on 2010-11-04 for modular probe system.
This patent application is currently assigned to SEMIPROBE LLC. Invention is credited to Mostafa Daoudi, Don Feuerstein, Denis Place.
Application Number | 20100277195 12/837693 |
Document ID | / |
Family ID | 42341883 |
Filed Date | 2010-11-04 |
United States Patent
Application |
20100277195 |
Kind Code |
A1 |
Daoudi; Mostafa ; et
al. |
November 4, 2010 |
Modular Probe System
Abstract
A modular probe system that includes components that are
selected to test different devices-under-test (DUTs) in a number of
different scientific fields. The system includes quick-release
connectors that may be used to releasably secure components of the
modular probe system to one another or to a mounting interface.
These connectors permit quick and easy attachment and detachment of
various components in a manner that permits a user to readily
configure the probe system for each DUT.
Inventors: |
Daoudi; Mostafa; (Essex,
VT) ; Feuerstein; Don; (Southbury, CT) ;
Place; Denis; (Colchester, VT) |
Correspondence
Address: |
DOWNS RACHLIN MARTIN PLLC
199 MAIN STREET, P O BOX 190
BURLINGTON
VT
05402-0190
US
|
Assignee: |
SEMIPROBE LLC
Winooski
VT
|
Family ID: |
42341883 |
Appl. No.: |
12/837693 |
Filed: |
July 16, 2010 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
|
|
12023787 |
Jan 31, 2008 |
7764079 |
|
|
12837693 |
|
|
|
|
60887426 |
Jan 31, 2007 |
|
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Current U.S.
Class: |
324/756.01 |
Current CPC
Class: |
G01R 31/2889 20130101;
G01R 31/31907 20130101 |
Class at
Publication: |
324/756.01 |
International
Class: |
G01R 31/00 20060101
G01R031/00 |
Claims
1. A modular test system for testing a device-under-test (DUT),
said system comprising: a mounting interface; a plurality of
components removably positionable, directly or indirectly, on said
mounting interface, said plurality of components including at least
one probe, wherein said plurality of components together are used
in connection with testing a DUT; and a plurality of quick-release
connectors for releasably securing said plurality of components
together or to said mounting interface by hand or with only hand
tools in under 60 minutes.
2. A modular test system according to claim 1, wherein said
plurality of components include a chuck for supporting a DUT during
testing, a stage for moving said chuck and the DUT, a manipulator
for supporting said at least one probe in selected relationship to
the DUT, and a vision system for generating images of portions of
the DUT.
3. A modular test system according to claim 1, wherein said
plurality of components include a chuck for supporting a DUT during
testing, a material handler for moving the DUT onto and off of said
chuck, and a manipulator for supporting said at least one probe in
selected relationship to the DUT, further wherein at least one of
said chuck, material handler and manipulator include a translation
device for moving said at least one said chuck, material handler
and manipulator, said translation device having manual,
semiautomatic or fully automatic operation.
4. A modular test system according to claim 1, wherein said
plurality of components includes a vision system releasably secured
to said mounting interface, said vision system providing an image
of the DUT.
5. A modular test system according to claim 1, wherein said
translation device moves said DUT in a manual or automatic
mode.
6. A modular test system according to claim 1, wherein said
plurality of quick-release connectors has a release torque that
does not exceed about 50 ft*lbs.
7. A modular test system according to claim 1, wherein said
plurality of quick-release connectors has a release torque that
does not exceed about 20 ft*lbs.
8. A modular test system according to claim 1, wherein said
mounting interface includes a plurality of apertures shaped and
configured to engage with said plurality of quick-release
connectors.
9. A modular test system according to claim 1, wherein said
plurality of components includes a first chuck for supporting a
first DUT used in a first technical field and a second chuck for
supporting a second DUT used in a second technical field that is
different than said first technical field.
10. A method of testing a device-under-test (DUT), said method
comprising: a) providing a testing system having a mounting
interface; b) releasably securing a first plurality of components
used in testing a DUT to said mounting interface; and c) removing
at least some of said first plurality of components from said
mounting interface and releasably securing a second plurality of
components used in testing a DUT to said mounting interface,
wherein said first plurality of components are removed and said
second plurality of components are releasably secured by hand or
using only hand tools in less than about 60 minutes.
11. A method according to claim 10, wherein said removing step
involves removing said first plurality of components and releasably
securing said second plurality by hand or using only hand tools in
less than about 30 minutes.
12. A method according to claim 10, further comprising: performing
a first test on a first DUT following said releasably securing step
b) and before said removing step c); and performing a second test
on a second DUT following said removing step c), wherein said
second DUT is used in a different technical field than said first
DUT.
13. A method according to claim 10, further comprising: performing
a first test on a first DUT following said releasably securing step
b) and before said removing step c); and performing a second test
on a second DUT following said removing step c), wherein said
second DUT has a different size than said first DUT.
14. A method according to claim 10, wherein said removing step c)
involves removing at least some of said first plurality of
components with a torque that does not exceed about 50 ft*lbs and
releasably securing said second plurality of components with a
torque that does not exceed about 50 ft*lbs.
15. A method according to claim 10, wherein said removing step c)
involves removing at least some of said first plurality of
components with a torque that does not exceed about 20 ft*lbs and
releasably securing said second plurality of components with a
torque that does not exceed about 20 ft*lbs.
Description
RELATED APPLICATION DATA
[0001] This application is a divisional of application Ser. No.
12/023,787, filed Jan. 31, 2008, and titled "Modular Probe System,"
which application claims the benefit of priority of U.S.
Provisional Patent Application Ser. No. 60/887,426, filed Jan. 31,
2007, and titled "Modular Probe System and Method," which are
incorporated by reference herein in their entireties.
FIELD OF THE INVENTION
[0002] The present invention generally relates to the field of test
devices. In particular, the present invention is directed to a
modular probe system.
BACKGROUND
[0003] Probe systems are used to analyze, examine, and test devices
in many industries, such as the semiconductor and material science
industries. Probe systems are capital equipment that may range in
price from $15,000 to over $1,000,000. Purchasing capital equipment
is believed to be the second largest expense associated with
operating a semiconductor facility. Conventional probe systems
typically offer no flexibility or upgradeability in terms of size,
materials that can be probed and other capabilities. For example,
if a user desires to probe a larger semiconductor wafer than the
one for which their existing system is designed, that user would
likely need to replace the existing system with a new probe system
or a substantially refurbished system. In addition, if a user wants
to probe materials in two different scientific fields, e.g.,
semiconductor and life sciences, two different probe systems are
generally required. Particularly for smaller businesses, academic
institutions and other organizations with limited capital equipment
budgets, the cost of two probe systems can be prohibitively
expensive. Moreover, new probe systems are often not immediately
available, with delivery times of 8-12 weeks being typical. To
complicate matters, strong disincentives are believed to exist in
the probing industry to deviate from the use of probe systems that
are dedicated to a given test, and are not easy to upgrade or
otherwise change.
[0004] Modular fixturing systems are known in the prior art. These
systems often include a base plate having a plurality of apertures
for receiving various supports for holding a work piece during a
manufacturing operation. The location of the supports is chosen as
a function of the configuration of the work piece to be supported.
Such known fixturing systems are not believed to include all of the
components necessary to perform the manufacturing operation;
rather, the fixturing systems are merely used with such components.
In any event, such known fixturing systems are not used in
connection with precision testing of a device-under-test ("DUT")
through the use of delicate probes, as discussed above.
SUMMARY OF THE DISCLOSURE
[0005] One implementation of the present invention is a modular
test system for testing a device-under-test (DUT). The system
includes a mounting interface; a plurality of components removably
positionable, directly or indirectly, on the mounting interface,
the plurality of components including at least one probe, wherein
the plurality of components together are used in connection with
testing a DUT; and a plurality of quick-release connectors for
releasably securing the plurality of components together or to the
mounting interface by hand or with only hand tools in under 60
minutes.
[0006] Another implementation of the present invention is a probe
system for testing a device-under-test (DUT). The probe system
includes a base having a mounting interface; a first stage
releasably secured to the mounting interface so as to be
replaceable with a second stage in less than 60 minutes with only
hand tools or by hand; a first chuck releasably secured to one of
the first and second stages so as to be replaceable with a second
chuck in less than 60 minutes with only hand tools or by hand,
wherein the first and second chucks are capable of supporting the
DUT; a first manipulator releasably secured proximate one of the
first and second chucks so as to be replaceable with a second
manipulator in less than 60 minutes with only hand tools or by
hand; and a first probe releasably secured to one of the first and
second manipulators so as to receive test information from the DUT
and so as to be replaceable with a second probe in less than 60
minutes with only hand tools or by hand.
[0007] Still another implementation of the present invention is a
method of testing a device-under-test (DUT). The method includes a)
providing a testing system having a mounting interface; b)
releasably securing a first plurality of components used in testing
a DUT to the mounting interface; and c) removing at least some of
the first plurality of components from the mounting interface and
releasably securing a second plurality of components used in
testing a DUT to the mounting interface, wherein the first
plurality of components are removed and the second plurality of
components are releasably secured by hand or using only hand tools
in less than about 60 minutes.
BRIEF DESCRIPTION OF THE DRAWINGS
[0008] For the purpose of illustrating the invention, the drawings
show aspects of one or more embodiments of the invention. However,
it should be understood that the present invention is not limited
to the precise arrangements and instrumentalities shown in the
drawings, wherein:
[0009] FIG. 1 is a schematic top view of a modular probe
system;
[0010] FIG. 2 is a schematic side view of the modular probe system
illustrated in FIG. 1;
[0011] FIG. 3 is across-sectional view of a quick-release connector
for use with a modular probe system, such as the modular probe
system shown in FIGS. 1 and 2;
[0012] FIG. 4 is a flow diagram of an example of a method for using
a modular probe system, such as the modular probe system
illustrated in FIGS. 1 and 2;
[0013] FIGS. 5A-5E are perspective views showing how various
components may be added to and removed from a modular probe
system.
DETAILED DESCRIPTION
[0014] Referring now to the drawings, FIGS. 1 and 2 illustrate an
example of a modular probe system 100 made in accordance with
concepts of the present invention. System 100 is configured to test
a device-under-test (DUT) 103, e.g., diced or undiced semiconductor
chips in a semiconductor wafer, packaged parts, substrates, printed
circuit boards, microscope slides, and optics and optical
components, among others. System 100 is denoted as being "modular"
because it is made up of several components 106 releasably secured
to a base 108. Some or all of components 106 may be quickly and
easily replaced with other components or freely moved around to
other locations. As a result, modular probe system 100 provides a
single platform that can be used to perform different analysis
and/or apply different testing protocols on DUTs from substantially
different scientific fields. For example, system 100 can be first
configured to probe a semiconductor wafer and provide data
regarding its performance, and then can be easily reconfigured to
probe a microscope slide and provide micro-fluidic sampling data
used in biological analysis.
[0015] As discussed above in the Background section, a limitation
of traditional probing systems is that their existing structure
and/or components cannot be changed, i.e., they are dedicated
systems designed to perform just one probing operation on one type
of DUT. As alluded to above, these probing systems typically
require extensive physical modifications to permit them to perform
a different probing operation that is different than the one for
which they were designed, or to perform the same probing operation
on a DUT other than the DUT the system was originally designed to
test. Such changes usually entail moving the entire probing system
to a remanufacturing location remote from the facility where it is
used. Probing system 100 illustrated in FIGS. 1 and 2, on the other
hand, drastically reduces the cost and time associated with
performing such modifications through the use of components 106
that may quickly and easily be removed and replaced, in the field,
with other components. That is, components 106 of system 100 may be
configured to test one aspect of a DUT 103 and then reconfigured to
test another aspect of the DUT. This reconfiguration may be
performed by a user, e.g., a lab technician, by hand or through the
use of conventional hand tools (e.g., a screw driver, a wrench) in
about 15-30 minutes, depending on the type of component 106 being
replaced and other criteria, as discussed more below.
[0016] As noted above, probe system 100 includes a base 108 that
supports components 106. Suitable materials for use in base 108
will be readily apparent to those having ordinary skill in the art,
and include, without limitation, steel, aluminum, marble, slate,
and bronze. While not depicted specifically in the exemplary
probing system of FIG. 1, base 108 may include additional
structural portions, e.g., a frame. These structural portions are
often designed in accordance with specific standards or,
alternatively, are based on the desired application for probing
system 100. For example, some structural portions may be selected
in accordance with a particular level of vibration isolation. Other
structural portions may be selected for applications that use
particular materials (e.g., chemicals), lighting (e.g., UV
lighting), or that require a particularly high level of
electro-static discharge (e.g., rubberized materials).
[0017] System 100 may also include a mounting interface 109 that is
disposed on base 108, or, in an alternative implementation, is
built into base 108. Mounting interface 109 is generally sized to
receive a number of components 106 at any given time. Preferably,
but not necessarily, mounting interface 109 has a surface area of
about 1 ft.sup.2 to about 24 ft.sup.2, although intended
application and other factors will dictate the actual surface area
chosen. When disposed on base 108, mounting interface 19 may be
made from a variety of materials, such as those materials discussed
in connection with base 108 above.
[0018] Mounting interface 109 is configured so that components 106
may be releasably secured thereto. To achieve this function,
mounting interface 109 includes a plurality of apertures 110, e.g.,
threaded holes, that are sized and configured to receive
quick-release connectors, discussed more below. Apertures 110 may
be evenly distributed over mounting interface 109. Alternatively,
apertures 110 may be located in groups of various numbers and/or
patterns. For convenience of illustration, only a few apertures 110
are illustrated in FIG. 1; in most cases, the entire surface of
mounting interface 109, or a significant portion thereof, will
include apertures 110. When used with other quick-release
connectors, such as the exemplary connectors discussed below,
mounting interface 109 may include other types of apertures,
surfaces, and/or materials, as desired.
[0019] In the example of probing system 100 illustrated in FIGS. 1
and 2, components 106 may include one or more manipulators 113 that
receive one or more conventional probes 112. Probes 112 for use in
testing a semiconductor chip, for example, are typically
electrically conductive pins and/or projections that are designed
to stimulate a particular portion of the semiconductor wafer and
receive the response. Probes 112 used in other scientific fields
may include, but are not limited to, HF/Microwave probes, DC
probes, multi-contact wedges, probe cards, micro-fluidic sampling
probes, micro-fluidic applicators, refractory probes for optics, as
desired. These may be selected based on the application, e.g., the
DUT 103 to be tested and/or the corresponding scientific field.
Preferably, but not necessarily, probes 112 are releasably
connected to manipulators 113 in a manner so as to permit them to
quickly and easily added and removed from system 100. This feature
improves changeover of system 100 from one type of test to another
on a given DUT 103, or from one DUT to another DUT, as desired.
[0020] Although they may be included as an optional component 106
in system 100, manipulators 113 are typically of the kind that
adjust the location of probes 112 in relation to DUT 103.
Manipulators 113, for instance, may be configured to translate
probe 112 in precise increments, e.g, micro-meter (.mu.m) or
nano-meter (Nm). They may be manual, e.g., mechanical or fluid
drive, semiautomatic, e.g., motorized without encoder feedback or
fully automatic, e.g., programmable with encoder feedback.
Manipulators 112 may also include a manipulator arm (not shown).
Typical manipulator arms support probe 112 in a manner that
positions the probe in desired testing relationship with DUT 103.
Exemplary manipulator arms include, for example, DC arms,
HF/Microwave arms, coaxial/triaxial arms, high current/high voltage
arms, inker arms, contact sense arms, adjustable arms, picoprobe
arms and others.
[0021] Components 106 may also include a support platen 115 that
receives manipulators 113 and/or probes 112. Generally, support
platen 115 is constructed of conductive or non-conductive materials
chosen to support manipulators 113, manipulator arms, and probes
112 with the desired precision, stability and other requirements
needed for the DUT 103 being tested. For example, support platen
115 may be made of steel or aluminum. In one implementation, platen
115 has a platen surface 118 with a surface area from about 1
ft.sup.2 to about 4 ft.sup.2. Platen surface 118 includes a
plurality of mounting positions 121. Each mounting position 121 is
designed to receive a manipulator 113, manipulator arm, and/or
probe 112. As discussed in more detail below, some or all of
mounting positions 121 can be formed in a manner that enhances the
flexibility of set-up for probe system 100.
[0022] Components 106 may further include a platen mount 124 that
supports platen 118. Like support platen 115 discussed above, each
platen mount 124 is preferably constructed of conductive or
non-conductive materials suited to support platen 115 (as well as
manipulator 113, manipulator arm, and probes 112). Platen mount 124
includes an upper surface to which support platen 115 may be
attached, directly or indirectly, and a bottom surface that rests,
directly or indirectly, on mounting interface 109 and may be
releasably attached thereto, as described more below. Optionally,
system 100 may include a translation device (not shown) positioned
between support platen 115 and platen mount 124 that permits
support platen 115 to be moved in one or more directions, such as
an x-direction, a y-direction, a z-direction, and/or a
.theta.-direction relative to stationary platen mount 124. This
translation device may provide coarse and fine adjustment of probe
112 relative to DUT 103, and may be manual, e.g., mechanical or
fluid drive, semiautomatic, e.g., motorized without encoder
feedback or fully-automatic, e.g., programmable with encoder
feedback. Once in its preferred location, support platen 115 and/or
platen mount 124 may include a locking feature that secures the
support platen to the platen mount and prevents any relative motion
between the two.
[0023] In one implementation, probe system 100 includes
quick-release connectors 133, e.g., connectors 133A-H, that
releasably secure manipulators 112, platen mount 124 and other
components 106 discussed in more detail below to one another and/or
to mounting interface 109, as the case may be. In some cases it may
be desirable to permanently mount certain components 106 to
mounting interface 109 and releasably secure other components to
the mounting interface. In other case, it will be desirable to
releasably secure all components 106 to mounting interface 109
using quick-release connectors 133.
[0024] Quick-release connectors 133 may be designed to permit a
user to operate the connectors by hand or by using simple hand
tools. The design of connectors 133 may, if desired, be selected to
amplify the force applied by a user in a manner that permits a
component 106 to be securely attached to and easily removed from
probing system 100. Such features also permit components 106 to be
moved from one location to another within probing system 100, as
desired.
[0025] FIG. 3 illustrates one example of a quick-release connector
133. Here, the exemplary connector 133 is a threaded connector that
includes a threaded shaft 136 and a large head 138 attached to the
shaft, with the head being sized configured for comfortable and
secure receipt in the hand of a user. When connectors 133 with a
threaded shaft 136 will be used in probe system 100, at least some
of the apertures 110 in mounting interface 109 have a diameter and
thread pitch corresponding with that of threaded shaft 136. This
arrangement permits connectors 133 to be releasably threadedly
engaged with mounting interface 109. The thread pitch for apertures
110 and threaded shaft 136, and the size and configuration of head
138 may be selected so that a typical user of probe system 100 can
grasp the head, by hand, and secure a component 106 to mounting
interface 109 by applying a torque of about 1 ft*lbs to about 50
ft*lbs, as desired. In an alternative configuration, a nut (not
shown) may be used in lieu of large head 138 to secure connector
133 in aperture 110. With this alternative configuration, a user
may tighten connector 133 using conventional hand tools such as a
ratchet or wrench by applying a torque of about 1 ft*lbs to about
50 ft*lbs, as desired. In one implementation, connectors 133 may be
tightened or loosened with application of about 20 ft*lbs of
torque.
[0026] Quick-release connectors 133 may have other designs,
including, but are not limited to, bolt-down connectors, magnetic
interconnections, vacuum-based interconnections, securable pegs,
and other implementations capable of securing components 106 to
each other and/or to mounting interface 109, as the case may be. A
more detailed discussion of the use of quick-release connectors 133
will be provided along with a discussion of a preferred method of
changing probing system 100 from one configuration to another in
connection with FIG. 4, below. Before proceeding with that
description, however, other components 106 of probing system 100
will be described in more detail first.
[0027] Components 106 may further include a vision system 151 that
can be used to view and/or examine DUT 103. A variety of suitable
devices for use as vision systems 151 are known in the art.
Exemplary devices include, but are not limited to, an infrared (IR)
microscope, a compound microscope, a stereo-zoom microscope, a
camera, a polarizer/analyzer, a closed-circuit television (CCTV)
camera, a CCD-based or other pattern recognition system, and other
devices that provide images of DUT 103. It may be desirable, for
instance, to include in system 100 a microscope that can be used to
visually verify the position of probes 112 as they relate to the
tested portion of DUT 103, and to view the DUT.
[0028] As with the other components of system 100 discussed above,
vision system 151 may be releaseably secured to mounting interface
109, e.g., using one or more quick-release connectors 133. This
arrangement permits a user to quickly change from a first vision
system 151 to a second vision system, or permits the vision system
to be moved from a first position to a second position. To
facilitate mounting and operation of the vision system 151, the
latter may include, for example, stand alone booms, posts or
bridges, a bread board boom, vision movement stages with or without
vision lift, and other devices.
[0029] Components 106 include a chuck 154 and a stage 157 that
supports and, optionally, can be used to position the chuck. Chuck
154 is shaped and configured based on the size and configuration of
DUT 103. For example, when DUT 103 is a semiconductor wafer as
illustrated in FIGS. 1 and 2, chuck 154 includes a support surface
160 that supports the semiconductor wafer. Support surface 160 is
generally a flat surface formed of a suitable structural material,
e.g., aluminum, steel, plastic. In some examples, support surface
160 and chuck 154 may be configured to secure the semiconductor
wafer with a vacuum or mechanical clamping. Other implementations
of system 100 may require other configurations of chuck 154. For
example, when used in the life science field, chuck 154 may be
shaped and configured to receive a liquid. In other examples, chuck
154 may be configured to receive a printed circuit board, substrate
or packaged part, a high temperature crucible, a specimen slide, as
desired.
[0030] It may be desirable to provide a stage 157 that allows chuck
154 to be adjusted in order to place DUT 103 in a selected position
for analysis and examination. Such adjustments may accommodate
differences in the height and/or thickness of the variety of chucks
154 discussed above. For example, stage 157 may be manipulated in a
variety of directions, e.g., an x-direction, a y-direction, a
z-direction, and/or a .theta.-direction. Like other components 106
of modular probe system 100, stage 157 is configured to be
releasably secured to mounting interface 109 via connectors, e.g.,
quick-release connectors 133. Using these connectors, modular probe
system 100 can be configured to include a stage 157 that operates
manually, e.g., using a mechanical or fluid drive,
semiautomatically, e.g., using a motorized device without encoder
feedback or fully-automatically, e.g., one that is programmable
with encoder feedback
[0031] Components 106 may optionally include a DUT handler 163
(FIG. 2) that semiautomatically or automatically moves DUTs 103
onto, and removes the DUTs from, chuck 154. Of course, DUTs 103 may
be manually positioned on chuck 154. Typically, but not
necessarily, DUT handler 163 interacts with stage 157, probes 112
and/or vision system 151 in connection with its transport of DUT
103. Again, like other components 106 in probe system 100, DUT
handler 163 may be releasably secured to mounting interface 109
using quick-release connectors, e.g., connectors 133.
[0032] Components 106 may further include a controller 166 (FIG. 1)
connected to probes 112 to receive test information detected by the
probes. Controller 166, like other components 106, may be
releasably secured to mounting interface 109 using quick-release
connectors 133. Controller 166 can be any sensing device that is
able to measure an entity and returns a result that the operator
can use to determine if the DUT is good, bad or marginal.
Controller 166 can be used to measure, but is not limited to
measuring, current, voltage, resistance, capacitance, HF/Microwave,
pressure, optical, fluidic measurement systems.
[0033] FIG. 4 illustrates the steps of a method 300 for configuring
a modular probe system, such as modular probe system 100 of FIG. 1.
Method 300, at step 305, involves positioning a probe system in a
testing environment. As discussed above, a feature of a modular
probe system 100 made in accordance with concepts of the present
invention is that it does not need to be moved from its testing
environment for upgrades, modifications, and other changes. Rather,
it requires a substantially one-time set-up. Such set-up may
include placing the probe system in the test environment, leveling
the platform in accordance with pre-determined standards, securing
the platform to the floor or other portion of the test environment,
and other steps used in setting up similar test and probe
equipment.
[0034] Method 300 includes, at step 307, determining the requisite
components 106, e.g., probes 112, vision systems 151, chucks 154,
necessary to perform the desired test for DUT 103. As discussed
above, modular probe system 100 may be configured to perform a wide
variety of tests, on a wide variety of DUTs 103, in an wide array
of scientific fields.
[0035] Method 300 further includes, at step 309, positioning each
of the selected components 106 in probe system 100 in a manner that
permits a user to test one or more properties of a DUT 103.
Preferably, each device can be positioned using one or more
quick-release connectors, such as quick-release connectors 133
discussed above. Typically, this will take a user no longer than
15-30 minutes with or without hand tools.
[0036] Next, method 300 includes, at step 311, performing the
desired test on DUT 103.
[0037] Method 300 includes, at step 313, determining whether
components 103 need to be changed to test a different property of
the DUT, to test a different DUT, and/or to test a different DUT in
a different scientific field. As discussed above, modular probe
system 100 discussed herein is designed to provide a flexible test
platform. That is, modular probe system can be set up (using
requisite components, probes, and vision system) for a first test
property on a first DUT in a first scientific field. It can then be
reconfigured to test a second test property on a second DUT in a
second scientific field in just a few minutes. For example, if the
first DUT is a semiconductor wafer, then components 106 are
configured in a manner that permits testing of a first electrical
test property on the wafer. Then, when a second electrical test on
the wafer is to be, performed, components 106 can be moved,
adjusted, or otherwise reconfigured to test the second test
property. Next, when a biological test is to be performed on a
sample on a microscope slide, then components 106 can be removed,
changed, added, or otherwise placed in a configuration suited to
perform the biological test.
[0038] If it is determined at step 313 that components 106 need to
be changed, then the method returns to step 309. If, on the other
hand, it is determined at step 313 that no change in components 106
is needed, then the method ends at step 315.
[0039] FIGS. 5A-E illustrate examples of how a modular probe
system, i.e., probe system 400, may be differently configured using
a method, such as method 300 discussed above. In a first
configuration, as shown in FIG. 5A, system 400 includes a base 408
having a mounting interface 409 with a plurality of apertures
410.
[0040] Next, as shown in FIG. 5B, components 406 are added. These
components 406 include a two-part stage 457 having a Z-stage 457A
and a theta stage 457B, which are releasably connected to mounting
interface 409 using one or more quick-release connectors 433, only
one of which is shown for convenience of illustration. In the
present example, stage 457 includes two adjustable moving plates
458. Preferably, plates 458 may be configured to receive a chuck
(not shown) or DUT (not shown). They often can be actuated in a
manner that permits it to receive chucks and/or DUTs of various
sizes, shapes, and overall configurations.
[0041] Turning next to FIG. 5C, probe system 400 is shown with a
collection of components 406 that differs from the collection
illustrated in FIG. 5B. This second configuration includes, for
example, components 406 selected to test a different DUT 103 than
the DUT being tested in the probe system 400 shown in FIG. 5B, in a
different scientific field. Accordingly, stage 457, which could be
used to support a semiconductor wafer, for example, is removed and
is replaced with a second stage 457, which, for example, may be
used to support a life science DUT 103 (not shown). Other
components 406 may also be added, such as adjustable height
instrumentation and optics mounting plates 470, manipulator 472,
and tool-support posts 474. Components 406 illustrated in FIG. 5C
may be releasably secured to mounting interface using quick-release
connectors 433. Typically, the change-over from the set-up shown in
FIG. 5B to the set-up shown in FIG. 5C does not exceed about 30
minutes, and can be performed by a user without tools, or,
alternatively, with hand tools. More generally, the change-over may
take from about 10 minutes to about 45 minutes.
[0042] Referring to FIG. 5D, yet another configuration of probe
system 400 is illustrated. Here, several tool-support posts 474 are
releasably secured to mounting interface 409 via tool-less mounting
plates 476. A support platen 415 is then mounted on posts 474, all
by hand or with simple hand tools. A plurality of quick-release
connectors 433, only one of which is shown for convenience of
illustration, are used to secure the various components 406 to
mounting interface 409.
[0043] Turning next to FIG. 5E, the change in configuration of
components 406 illustrated in FIG. 5D continues in FIG. 5E. Probes
412 and manipulators 413 are secured to support platen 415 using
quick-release connectors 433, vision system 451 is added, and a
tool-less mounting bridge 480 is provided. Typically, about 15-30
minutes is required to add the components 406 illustrated in FIG.
5E to the components 406 illustrated in FIG. 5D.
[0044] Exemplary embodiments have been disclosed above and
illustrated in the accompanying drawings. It will be understood by
those skilled in the art that various changes, omissions and
additions may be made to that which is specifically disclosed
herein without departing from the spirit and scope of the present
invention.
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