U.S. patent application number 12/740979 was filed with the patent office on 2010-10-28 for copper alloy material excellent in strength, bending workability and stress relaxation resistance, and method for producing the same.
Invention is credited to Tatsuhiko Eguchi, Kiyoshige Hirose, Hiroshi Kaneko, Kuniteru Mihara.
Application Number | 20100269963 12/740979 |
Document ID | / |
Family ID | 40591167 |
Filed Date | 2010-10-28 |
United States Patent
Application |
20100269963 |
Kind Code |
A1 |
Hirose; Kiyoshige ; et
al. |
October 28, 2010 |
COPPER ALLOY MATERIAL EXCELLENT IN STRENGTH, BENDING WORKABILITY
AND STRESS RELAXATION RESISTANCE, AND METHOD FOR PRODUCING THE
SAME
Abstract
A copper alloy material according to the present invention is
characterized in that the same comprises: Ni between 2.8 mass % and
5.0 mass %; Si between 0.4 mass % and 1.7 mass %; S of which
content is limited to less than 0.005 mass %; and the balance of
the copper alloy material is composed of copper and unavoidable
impurity, wherein a proof stress is stronger than or equal to 800
MPa, and the same is superior in bending workability and in stress
relaxation resistance.
Inventors: |
Hirose; Kiyoshige; (Tokyo,
JP) ; Mihara; Kuniteru; (Tokyo, JP) ; Kaneko;
Hiroshi; (Tokyo, JP) ; Eguchi; Tatsuhiko;
(Tokyo, JP) |
Correspondence
Address: |
BIRCH STEWART KOLASCH & BIRCH
PO BOX 747
FALLS CHURCH
VA
22040-0747
US
|
Family ID: |
40591167 |
Appl. No.: |
12/740979 |
Filed: |
October 31, 2008 |
PCT Filed: |
October 31, 2008 |
PCT NO: |
PCT/JP2008/069977 |
371 Date: |
July 15, 2010 |
Current U.S.
Class: |
148/685 ;
148/412; 148/413; 148/414 |
Current CPC
Class: |
C22C 9/06 20130101; C22F
1/08 20130101 |
Class at
Publication: |
148/685 ;
148/414; 148/412; 148/413 |
International
Class: |
C22F 1/08 20060101
C22F001/08; C22C 9/06 20060101 C22C009/06; C22C 9/02 20060101
C22C009/02; C22C 9/04 20060101 C22C009/04 |
Foreign Application Data
Date |
Code |
Application Number |
Nov 1, 2007 |
JP |
2007-285605 |
Claims
1.-6. (canceled)
7. A copper alloy material, comprising: Ni between 2.8 mass % and
5.0 mass %; Si between 0.4 mass % and 1.7 mass %; S of which
content is limited to less than 0.005 mass %; and the balance of
the copper alloy material is composed of copper and unavoidable
impurity, wherein a proof stress is stronger than or equal to 800
MPa, and the copper alloy material is superior in bending
workability and in stress relaxation resistance.
8. The copper alloy material according to claim 7, further
comprising at least one nature of Mg between 0.01 mass % and 0.20
mass %, Sn between 0.05 mass % and 1.5 mass % and Zn between 0.2
mass % and 1.5 mass %.
9. The copper alloy material according to claim 7, further
comprising at least any one nature or more than or equal to any two
natures in the following (I) to (IV) between 0.005 mass % and 2.0
mass % in total: (I) at least any one nature or more than or equal
to any two natures between 0.005 mass % and 0.3 mass % that is
selected from a group of Sc, Y, Ti, Zr, Hf, V, Mo and Ag; (II) Mn
between 0.01 mass % and 0.5 mass %; (III) Co between 0.05 mass %
and 2.0 mass %; and (IV) Cr between 0.005 mass % and 1.0 mass
%.
10. The copper alloy material according to claim 8, further
comprising at least any one nature or more than or equal to any two
natures in the following (I) to (IV) between 0.005 mass % and 2.0
mass % in total: (I) at least any one nature or more than or equal
to any two natures between 0.005 mass % and 0.3 mass % that is
selected from a group of Sc, Y, Ti, Zr, Hf, V, Mo and Ag; (II) Mn
between 0.01 mass % and 0.5 mass %; (III) Co between 0.05 mass %
and 2.0 mass %; and (IV) Cr between 0.005 mass % and 1.0 mass
%.
11. The copper alloy material according to claim 7, wherein a grain
of matrix size is larger than 0.001 mm but smaller than or equal to
0.025 mm, and a ratio (a/b) between a major axis (a) of a grain of
matrix on a cross section which is parallel to a direction for a
final plastic working and a major axis (b) of said grain of matrix
on said cross section which is at right angles to said direction
for said final plastic working is higher than or equal to 0.8 but
lower than or equal to 1.5.
12. The copper alloy material according to claim 8, wherein a grain
of matrix size is larger than 0.001 mm but smaller than or equal to
0.025 mm, and a ratio (a/b) between a major axis (a) of a grain of
matrix on a cross section which is parallel to a direction for a
final plastic working and a major axis (b) of said grain of matrix
on said cross section which is at right angles to said direction
for said final plastic working is higher than or equal to 0.8 but
lower than or equal to 1.5.
13. The copper alloy material according to claim 9, wherein a grain
of matrix size is larger than 0.001 mm but smaller than or equal to
0.025 mm, and a ratio (a/b) between a major axis (a) of a grain of
matrix on a cross section which is parallel to a direction for a
final plastic working and a major axis (b) of said grain of matrix
on said cross section which is at right angles to said direction
for said final plastic working is higher than or equal to 0.8 but
lower than or equal to 1.5.
14. The copper alloy material according to claim 10, wherein a
grain of matrix size is larger than 0.001 mm but smaller than or
equal to 0.025 mm, and a ratio (a/b) between a major axis (a) of a
grain of matrix on a cross section which is parallel to a direction
for a final plastic working and a major axis (b) of said grain of
matrix on said cross section which is at right angles to said
direction for said final plastic working is higher than or equal to
0.8 but lower than or equal to 1.5.
15. The copper alloy material according to claim 7, wherein a
maximum value of a difference between a proof stress in a rolling
direction and a proof stress in a direction of which has an angle
of 90 degrees against said rolling direction is lower than or equal
to 100 MPa.
16. The copper alloy material according to claim 8, wherein a
maximum value of a difference between a proof stress in a rolling
direction and a proof stress in a direction of which has an angle
of 90 degrees against said rolling direction is lower than or equal
to 100 MPa.
17. The copper alloy material according to claim 9, wherein a
maximum value of a difference between a proof stress in a rolling
direction and a proof stress in a direction of which has an angle
of 90 degrees against said rolling direction is lower than or equal
to 100 MPa.
18. The copper alloy material according to claim 10, wherein a
maximum value of a difference between a proof stress in a rolling
direction and a proof stress in a direction of which has an angle
of 90 degrees against said rolling direction is lower than or equal
to 100 MPa.
19. The copper alloy material according to claim 11, wherein a
maximum value of a difference between a proof stress in a rolling
direction and a proof stress in a direction of which has an angle
of 90 degrees against said rolling direction is lower than or equal
to 100 MPa.
20. The copper alloy material according to claim 12, wherein a
maximum value of a difference between a proof stress in a rolling
direction and a proof stress in a direction of which has an angle
of 90 degrees against said rolling direction is lower than or equal
to 100 MPa.
21. The copper alloy material according to claim 13, wherein a
maximum value of a difference between a proof stress in a rolling
direction and a proof stress in a direction of which has an angle
of 90 degrees against said rolling direction is lower than or equal
to 100 MPa.
22. The copper alloy material according to claim 14, wherein a
maximum value of a difference between a proof stress in a rolling
direction and a proof stress in a direction of which has an angle
of 90 degrees against said rolling direction is lower than or equal
to 100 MPa.
23. A method for producing the copper alloy material according to
any of claims 7 to 22, comprising the steps of: performing a
processing in order to obtain a solution heat treated
recrystallized structure in a plate of a copper alloy; and
performing thereafter a series of processing of a cold rolling as a
first term and then an aging treatment, and then another cold
rolling as a second term and then a low temperature annealing,
wherein following formulas (1) to (3) are satisfied, in a case
where a variation of a proof stress after said low temperature
annealing is defined to be .DELTA.total (MPa) that is based on a
proof stress immediately before said cold rolling as said first
term, where a variation of a proof stress before and after said
cold rolling as said first term is defined to be .DELTA.C1 (MPa),
and where a variation of a proof stress before and after said cold
rolling as said second term is defined to be .DELTA.C2 (MPa):
0.1.ltoreq..DELTA.C1/.DELTA.total.ltoreq.0.35 (1);
0.ltoreq..DELTA.C2/.DELTA.total.ltoreq.0.35 (2);
0.1.ltoreq.(.DELTA.C1+.DELTA.C2)/.DELTA.total.ltoreq.0.45 (3).
Description
TECHNICAL FIELD
[0001] The present invention relates to a copper alloy material and
a method for producing the same.
BACKGROUND ART
[0002] Conventionally, as a material for a usage of an electrical
apparatus and of an electronic equipment in general, not only a
material of iron system but also a material of copper system that
is superior in electrical conduction property and in thermal
conduction property, such as a phosphor bronze, a red brass, a
brass, or the like, is made use as widely. In recent years, a
demand is increased for a packaging in smaller size of the
electrical apparatus and of the electronic equipment, to be
lightened, and then to be high density mounted that is accompanied
by those. And hence various kinds of properties are required as
well for the material of copper system that is to be applied to
these. And then as a major property it is able to give an example
of such as a mechanical property, an electrical conductivity, a
stress relaxation resistance, a bending workability, or the like.
Moreover, in order to satisfy the demand of obtaining a smaller in
size of a component and part in recent years an improvement of a
tensile strength and of the bending workability is required as
strongly among the above mentioned properties.
[0003] Further, a spring property becomes to be important in order
to maintain a contact pressure at a contact member of a spring
after performing a molding into a shape of a connector. And then
therefore not only the tensile strength but also a proof stress
that is a limit of an elastic deformation zone is required to be
higher for a material which is to be made use.
[0004] Still further, as a material for a usage of an electronic
component and part for which a demand of a higher strength is high
in particular, a high strength beryllium copper (an alloy as
pursuant to the JIS-C1720) has been made use. And then this alloy
has the tensile strength of stronger than or equal to 815 MPa as
pursuant to the 1/2HM Temper and of stronger than or equal to 910
MPa as pursuant to the HM Temper for a mill-hardened material for
which it is not necessary to perform an aging heat treatment after
performing a press molding process, and the same is superior in
bending workability as well. In the meantime however, the metal of
beryllium is harmful for a human body. And then a material for
substituting is desired in accordance with a consideration of a
processing of production and thereof for an environment as
well.
[0005] And hence an alloy of Cu--Ni--Si system becomes to be made
use as the material for substituting, that is superior in a balance
between the strength and the electrical conductivity. Still
further, the alloy of Cu--Ni--Si system is an alloy of a
precipitation type in which a precipitate is to be formed and then
the same is to be hardened, that is comprised of Ni and Si, and
then an ability to harden is higher as extremely.
[0006] In the meantime however, in accordance with the alloy of
Cu--Ni--Si system the higher the tensile strength and the proof
stress become to be, the more difficult to maintain the bending
workability. Still further, there is a problem of which the stress
relaxation resistance becomes to be deteriorated in a case where a
higher processing rate is introduced for a material in order to
obtain the strength. Still further, there are other problems of
which such as the grain of matrix becomes to be larger and then the
material becomes to have an anisotropy of the strength or the
bending workability becomes to be deteriorated or the like in a
case where a solution heat treatment is performed at a temperature
as higher in order to increase a precipitation amount of
Ni.sub.2Si. And then therefore an alloy of Cu--Ni--Si system is
required, that is superior in the proof stress, in the bending
workability and in the stress relaxation resistance, and that has
the anisotropy of the strength to be smaller as well. And then as
mentioning with being based on a specific standard for a material
to be required as equivalent to the high strength beryllium copper
(the alloy as pursuant to the JIS-C1720), a standard is required by
which a material has a proof stress of higher than or equal to 800
MPa, and any crack will not be occurred even in a bending test of
which a ratio between a bending radius and a plate thickness is
lower than or equal to 1.0 in a case where a (W) bending of 90
degrees is performed.
[0007] In conjunction with such a Corson alloy, a high strength
copper alloy of which the strength and the bending workability are
improved is proposed in such as the following patent documents from
1 to 3 or the like. However, in accordance with those heretofore
known inventions any material has not yet been developed, which is
superior in the proof stress, in the bending workability and in the
stress relaxation resistance, and which satisfy to have the
anisotropy of the strength to be smaller as well at the same time,
that are mentioned above.
[0008] [Patent Document 1] Japanese Patent No. 3520046
[0009] [Patent Document 2] Japanese Patent Application Publication
No. 2006-283107
[0010] [Patent Document 3] Japanese Patent Application Publication
No. 2006-219733
DISCLOSURE OF THE INVENTION
[0011] With having regard to the problems that are described above,
an objective of the present invention is to provide a copper alloy
material that has the strength as higher and that is superior in
the bending workability and in the stress relaxation resistance,
and to provide a method for producing such a copper alloy
material.
[0012] Here, the present inventors have studied regarding a copper
alloy material which is to be suitable for a usage of an electrical
apparatus and of an electronic equipment. And then it becomes able
to complete the invention of the copper alloy material that has the
strength as higher and that is superior in the bending workability
and in the stress relaxation resistance, by performing a control of
a composition of the copper alloy. Moreover, the present inventors
found out as well that it becomes able to obtain a copper alloy
material which has an anisotropy to be smaller in addition to the
above description, by performing a control of a grain of matrix
size and of a shape of a grain of matrix in a structure of the
copper alloy, and by performing a control of a hardening amount at
a period of a manufacturing process.
[0013] And then in accordance with the present invention it becomes
able to obtain the aspects that will be described in detail
below.
[0014] 1. A copper alloy material, comprising:
[0015] Ni between 2.8 mass % and 5.0 mass %;
[0016] Si between 0.4 mass % and 1.7 mass %;
[0017] S of which content is limited to less than 0.005 mass %;
and
[0018] the balance of the copper alloy material is composed of
copper and unavoidable impurity,
wherein a proof stress is stronger than or equal to 800 MPa, and
the copper alloy material is superior in bending workability and in
stress relaxation resistance.
[0019] 2. The copper alloy material according to the aspect 1,
further comprising at least one nature of Mg between 0.01 mass %
and 0.20 mass %, Sn between 0.05 mass % and 1.5 mass % and Zn
between 0.2 mass % and 1.5 mass %.
[0020] 3. The copper alloy material according to the aspect 1 or
2,
further comprising at least any one nature or more than or equal to
any two natures in the following (I) to (IV) between 0.005 mass %
and 2.0 mass % in total:
[0021] (I) at least any one nature or more than or equal to any two
natures between 0.005 mass % and 0.3 mass % that is selected from a
group of Sc, Y, Ti, Zr, Hf, V, Mo and Ag;
[0022] (II) Mn between 0.01 mass % and 0.5 mass %;
[0023] (III) Co between 0.05 mass % and 2.0 mass %; and
[0024] (IV) Cr between 0.005 mass % and 1.0 mass %.
[0025] 4. The copper alloy material according to any of the aspects
1 to 3,
wherein a grain of matrix size is larger than 0.001 mm but smaller
than or equal to 0.025 mm, and a ratio (a/b) between a major axis
(a) of a grain of matrix on a cross section which is parallel to a
direction for a final plastic working and a major axis (b) of the
grain of matrix on the cross section which is at right angles to
the direction for the final plastic working is higher than or equal
to 0.8 but lower than or equal to 1.5.
[0026] 5. The copper alloy material according to any of the aspects
1 to 4,
wherein a maximum value of a difference between a proof stress in a
rolling direction (which is equivalent as normally to the direction
for the final plastic working) and a proof stress in a direction of
which has an angle of 90 degrees against the rolling direction is
lower than or equal to 100 MPa.
[0027] 6. A method for producing the copper alloy material
according to any of the aspects 1 to 5, comprising the steps
of:
[0028] performing a processing in order to obtain a solution heat
treated recrystallized structure in a plate of a copper alloy;
and
[0029] performing thereafter a series of processing of a cold
rolling as a first term and then an aging treatment, and then
another cold rolling as a second term and then a low temperature
annealing,
[0030] wherein following formulas (1) to (3) are satisfied, in a
case where a variation of a proof stress after the low temperature
annealing is defined to be .DELTA.total (MPa) that is based on a
proof stress immediately before the cold rolling as the first term,
where a variation of a proof stress before and after the cold
rolling as the first term is defined to be .DELTA.C1 (MPa), and
where a variation of a proof stress before and after the cold
rolling as the second term is defined to be .DELTA.C2 (MPa):
0.1.ltoreq..DELTA.C1/.DELTA.total.ltoreq.0.35 (1);
0.ltoreq..DELTA.C2/.DELTA.total.ltoreq.0.35 (2);
0.1.ltoreq.(.DELTA.C1+.DELTA.C2)/.DELTA.total.ltoreq.0.45 (3);
in which the proof stress means a 0.2% proof stress.
[0031] The above and other aspects and advantages according to the
present invention will be further clarified by the following
description, with reference to the drawings to be attached as
properly therefor.
BRIEF DESCRIPTION OF THE DRAWINGS
[0032] FIG. 1 is an explanatory drawing showing an evaluation
method of a grain of matrix size and of a shape of a grain of
matrix which is specified in accordance with the present
invention.
BEST MODE FOR CARRYING OUT THE INVENTION
[0033] A desired embodiment regarding a composition and an alloy
structure of a copper alloy material in accordance with the present
invention will be described in detail below. Moreover, the copper
alloy material in accordance with the present invention means a
copper alloy which has a specified shape, such as a plate material,
a bar material, a wire rod, or the like.
[0034] In the first instance, it becomes able to form an Ni.sub.2Si
phase as mainly and then it becomes able to perform an improvement
of the strength and of the electrical conductivity in a case where
an aging treatment is performed for the Ni and the Si in a copper
alloy. And then it is desirable for a content of the Ni to be
between 2.8 mass % and 5.0 mass %, or it is further preferable for
the same to be between 3.0 mass % and 4.8 mass %. Moreover, aground
to be specified in such a manner is because there becomes to be
occurred the problems of which it is not able to obtain the
strength as equivalent to or stronger than that of the high
strength beryllium copper (the alloy as pursuant to the JIS-C1720)
in a case where an added amount is less than 2.8 mass %, and in the
meantime, in a case where the same is more than 5.0 mass % a
formation of a chemical compound that is not to contribute to the
improvement of the strength at a period of performing a casting or
at a period of performing a hot working, and then not only that it
is not able to obtain the strength which corresponds to the added
amount, but also that a hot workability becomes to be worsened and
then the same becomes to effect as negatively.
[0035] Next, it is desirable for a content of the Si to be between
0.4 mass % and 1.7 mass %, and then it is further preferable for
the same to be between 0.6 mass % and 1.3 mass %. Moreover, aground
to be specified in such a manner is because that it is not able to
obtain the improvement of the strength as sufficiently by making
use of the aging treatment, and then that it is not able to obtain
the strength which is equivalent to or more than that of the alloy
which is pursuant to the JIS-C1720 in a case where an amount of Si
is less than 0.4 mass %, and in the meantime, that in a case where
the content of the Si is more than 1.7 mass % it becomes a cause of
a decrease in the electrical conductivity in addition to an
occurrence of the problems that is similar to the case where the
amount of Ni is excessive.
[0036] Further, Ni and Si form the Ni.sub.2Si phase as mainly. And
then therefore there is an optimal ratio between Ni and Si in order
to perform the improvement of the strength. And then a ratio
(Ni/Si) between the Ni (mass %) and the Si (mass %) is determined
to be 4.2 in a case where the Ni.sub.2Si phase is formed regarding
the amount of the Si. Furthermore, it is desirable to perform a
control of the (Ni/Si) to be between 3.0 and 6.0 with the above
mentioned value to be a central value, and then it is further
preferable to perform the control of the (Ni/Si) to be between 3.8
and 4.6.
[0037] And in the meantime, S is contained with a very small amount
in a copper alloy in general. And then in a case where the amount
is more than or equal to 0.005 mass % the same becomes a cause of
worsening the hot workability. And then therefore it is required to
specify the content to be less than 0.005 mass %. Or, it is further
preferable for the same to be less than 0.002 mass % in
particular.
[0038] Moreover, it is desirable to perform an addition of Mg into
the copper alloy. And then it is desirable for the amount to be
between 0.01 mass % and 0.20 mass %. Further, due to Mg it becomes
able to perform an improvement of a stress relaxation property as
extremely, in the meantime however, the same effects as negatively
to the bending workability. Furthermore, it is necessary for an
amount of the Mg to be more than or equal to 0.01 mass % in order
to perform the improvement of the stress relaxation property, and
then the more the amount is, the better the improvement becomes to
be. And in the meantime however, in a case where the amount is more
than 0.20 mass % it becomes unable to satisfy a required property
of the bending workability. And hence it is further preferable for
the amount to be between 0.05 mass % and 0.15 mass %.
[0039] Moreover, it is desirable to perform an addition of Sn into
the copper alloy. And then it is desirable for the amount to be
between 0.05 mass % and 1.5 mass %. Further, due to the Sn with
relating to Mg together it becomes able to perform the further
improvement of the stress relaxation property, however, the
advantage is not so large with comparing to that according to the
Mg. And then in a case where the Sn is less than 0.05 mass % it is
not able to obtain the advantage as sufficiently. In the meantime
however, in a case where the amount is more than 1.5 mass % the
electrical conductivity becomes to be decreased as excessively. And
hence it is further preferable for the amount to be between 0.1
mass % and 0.7 mass %.
[0040] Moreover, it is desirable to perform an addition of Zn into
the copper alloy. And then it is desirable for the amount to be
between 0.2 mass % and 1.5 mass %. Further, due to the Zn it
becomes able to perform an improvement of the bending workability
with a little amount of degrees. And then by specifying the amount
of the Zn to be between 0.2 mass % and 1.5 mass % it becomes able
to obtain the bending workability that corresponds the standard of
which there is no problem for a practical use even in a case where
it is to be performed an addition of Mg with 0.20 mass % at the
maximum. Furthermore, due to the Zn it becomes able to perform an
improvement of such as a property of adherence or a property of
migration or the like regarding such as a plating of Sn or a
plating of solder or the like. In the meantime however, in a case
where the amount of the Zn is less than 0.2 mass % it is not able
to obtain the advantage as sufficiently, and in the meantime, in a
case where the amount is more than 1.5 mass % the electrical
conductivity becomes to be decreased. And hence it is further
preferable for the amount to be between 0.3 mass % and 1.0 mass
%.
[0041] Moreover, it is able to perform an addition of any one
nature or more than or equal to any two natures into the copper
alloy, that is selected from a group of Sc, Y, Ti, Zr, Hf, V, Mo
and Ag with an amount between 0.005 mass % and 0.3 mass % in total.
Further, any of Sc, Y, Ti, Zr, Hf, V and Mo forms a chemical
compound with Si. And then it is able to obtain an advantage by
which it becomes able to prevent a grain of matrix size from
becoming coarse. Still further, it is possible to perform the
addition with the amount of the addition to be within the above
mentioned range by which the property of such as the strength or of
the electrical conductivity or the like will not be worsened.
[0042] And in the meantime, due to the Ag it becomes able to
perform the improvement of a heat resistance and of the strength.
Still further, it becomes able to prevent the grain of matrix from
becoming coarse, and it becomes able to perform the improvement of
the bending workability at the same time. In the meantime however,
in a case where the amount of the Ag is less than 0.005 mass % it
is not able to obtain the advantage as sufficiently. And in the
meantime, in a case of performing the addition of more than 0.3
mass % it becomes a cause of a high cost of production, though
there is no effect as negatively to be given to the properties. And
then therefore it is desirable for the content of the Ag to be
within the above mentioned range from a point of view of those.
[0043] Still further, due to the Mn it becomes able to obtain an
advantage to perform an improvement of a hot workability. And then
therefore it is effective to perform the addition of the amount
between 0.01 mass % and 0.5 mass % that is a degree so as not to
deteriorate the electrical conductivity.
[0044] Still further, due to the Co that forms a chemical compound
with the Si which is similar to that according to Ni it becomes
able to obtain a function to perform an improvement of the
strength. And then therefore it is desirable to contain Co with the
amount between 0.05 mass % and 2.0 mass %. In the meantime however,
in a case where the content is less than 0.05 mass % it is not able
to obtain the advantage as sufficiently. And in the meantime, in a
case where the amount is more than 2.0 mass % a body to be
crystallized separately and a precipitate become to exist even
after performing the solution heat treatment that will not
individually correspond to the strength. And hence the bending
workability becomes to be deteriorated.
[0045] Still further, the Cr becomes to be precipitated as finely
into the copper and then the same becomes to contribute to the
improvement of the strength. Still further, the same becomes to
form a chemical compound with the Si or with the Ni and the Si
together, and then it becomes able to obtain an advantage to
prevent the grain of matrix size from becoming coarse, that is
similar to the above mentioned group of Sc, Y, Ti, Zr, Hf, V and
Mo. In the meantime however, in a case where the amount is less
than 0.05 mass % it is not able to obtain the advantage as
sufficiently. And in the meantime, in a case where the amount is
more than 1.0 mass % the bending workability becomes to be
deteriorated.
[0046] Furthermore, in a case of performing an addition of more
than or equal to any two natures that are selected from the above
mentioned group of Sc, Y, Ti, Zr, Hf, V, Mo, Ag, Mn, Co and Cr the
amount is to be specified within a range between 0.005 mass % and
2.0 mass % in total with corresponding to a required property.
[0047] In accordance with the present invention it is desirable to
specify a grain of matrix size and a shape of a grain of matrix in
order to realize the properties of the copper alloy material which
has the above mentioned composition. And then in accordance with
the present invention it is desirable for the above mentioned grain
of matrix size to be larger than 0.001 mm, but to be smaller than
or equal to 0.025 mm. Or, it is further preferable for the same to
be larger than 0.001 mm, but to be smaller than or equal to 0.015
mm. In the meantime however, in a case where the grain of matrix
size is smaller as excessively it becomes easier for a
recrystallized structure to be a mixed grain (a structure in which
grains of matrix exist together that have a different size from
each other), and hence the bending workability and also the stress
relaxation property become to be worsened. And in the meantime, in
a case where the grain of matrix size is larger as excessively the
bending workability becomes to be effected as negatively. Moreover,
in the case where the grain of matrix size is larger the matter
becomes a cause of increasing a difference of the strength between
a vertical direction of rolling and a parallel direction thereof.
Further, the above mentioned grain of matrix size is determined to
be a value which is measured with being pursuant to the JIS-H0501
(the method of cutting).
[0048] Still further, the shape of the grain of matrix in
accordance with the present invention indicates a ratio (a/b)
between a major axis (a) of the grain of matrix on a cross section
which is parallel to a direction for a final plastic working and a
major axis (b) of the grain of matrix on the cross section which is
at right angles to the direction for the final plastic working. And
then in accordance with the present invention it is desirable for
the ratio (a/b) to be higher than or equal to 0.8 but lower than or
equal to 1.5. Or, it is further preferable for the same to be
between 1.0 and 1.3. In the meantime however, in a case where the
above mentioned ratio (a/b) is higher as excessively the stress
relaxation property becomes to be worsened. Still further, in a
case where the above mentioned ratio (a/b) is lower as excessively
the stress relaxation property becomes to be worsened either. And
hence it is desirable for the same to be higher than or equal to
0.8.
[0049] Still further, in accordance with the present invention it
is desirable to specify a maximum value of a difference between a
proof stress in a rolling direction (which is equivalent as
normally to the above mentioned direction for the final plastic
working) and a proof stress in a direction of which has an angle of
90 degrees against the rolling direction to be lower than or equal
to 100 MPa. The ground is because there becomes to be occurred a
problem of such as that in a case where the value is higher than
100 MPa it becomes difficult to perform a designing of a connector
or to perform a setting of a metallic mold at a time of performing
the bend working, or a contact pressure strength of the connector
is not to satisfy the property due to a difference from a designed
value, or the like. Furthermore, it is further preferable for the
maximum value of the difference between the above mentioned each of
the values to be lower than or equal to 50 MPa. And in the
meantime, there is no limitation in particular regarding a lower
limit of this difference, however, it is regarded that there is
almost no difference of the proof stresses that individually
correspond to each of the directions if the same is equivalent to
approximately 5 MPa as normally.
[0050] Next, a desired method for producing the copper alloy
material in accordance with the present invention is embodied by
such as the follows or the like. And then a schematic manufacturing
process as desired for the copper alloy material in accordance with
the present invention comprises the following steps of:
[0051] performing a processing of casting;
[0052] performing a processing of hot rolling;
[0053] performing a processing of dough rolling (a cold rolling as
normally);
[0054] performing a processing of a solution heat treatment;
[0055] performing a processing of a cold rolling as a first term
(rolling (1));
[0056] performing a processing of an;
[0057] performing a processing of another cold rolling as a second
term (rolling (2)); and
[0058] performing a processing of a low temperature annealing.
[0059] And then in accordance with the present invention a method
for producing the same is desired, that satisfy the following
formulas from (1) to (3), in a case where a variation of a proof
stress after the low temperature annealing is defined to be
.DELTA.total (MPa) that is varied from a proof stress immediately
before the rolling (1) that is after obtaining the recrystallized
structure by performing the solution heat treatment, where a
variation of a proof stress before and after the rolling (1) is
defined to be .DELTA.C1 (MPa), and where a variation of a proof
stress before and after the rolling (2) is defined to be .DELTA.C2
(MPa), for the material that is to be produced by the above
mentioned steps of the casting.fwdarw.the hot rolling.fwdarw.the
dough rolling.fwdarw.the solution heat treatment.fwdarw.the rolling
(1).fwdarw.the aging treatment.fwdarw.the rolling (2) the low
temperature annealing:
0.1.ltoreq..DELTA.C1/.DELTA.total.ltoreq.0.35 (1);
0.ltoreq..DELTA.C2/.DELTA.total.ltoreq.0.35 (2);
0.1.ltoreq.(.DELTA.C1+.DELTA.C2)/.DELTA.total.ltoreq.0.45 (3);
in which each of these variations of the proof stress is calculated
with making use of a proof stress in an LD direction (a direction
that is parallel to the rolling direction) which is evaluated with
being pursuant to the JIS that will be described later.
[0060] And then the ground that it is desirable to perform the
control of the variation of the proof stress at each of the
processes is because the variation of the proof stress, and more
specifically the variation of the proof stress at the cold rolling
has a correlation with an amount of strain which is introduced into
the material. Moreover, such as the proof stress of a material, the
bending workability, the stress relaxation resistance, and the like
depend on the amount of strain which is introduced into the
material. And then in a case where the amount of strain is larger
the bending workability and the stress relaxation resistance become
to be deteriorated. In the meantime however, the amount of strain
which is to be introduced into a material depends on a state of
solution and precipitation of a mother phase of copper. And then
therefore there is not performed a unified interpretation regarding
an evaluation by making use of such as a conventional rate of
rolling or the like in a case where a composition and a state of
precipitation are different.
[0061] Here, the present inventors perform a standardization of the
variation of the proof stress at the period of performing the cold
rolling by making use of a total variation of the proof stress
after performing the low temperature annealing varied from that
immediately after performing the solution heat treatment. And then
by performing a control of this standardized value to be within a
range of the specification, it is found out that it becomes able to
produce a copper alloy material that has the strength as higher,
and that is superior in the bending workability and in the stress
relaxation resistance with comparing to the conventional
materials.
[0062] Further, in accordance with the present invention the
casting is designed to be performed by making use of such as a
general DC method or the like. Still further, it is desirable for
the hot rolling to perform the rolling at a temperature between
700.degree. C. and 1000.degree. C. immediately after performing a
homogenization treatment of an ingot at a temperature between
850.degree. C. and 1000.degree. C. with an amount of time between
0.5 hour and six hours, and then thereafter it is desirable to
perform a water cooling in order to prevent from a precipitation at
a period of performing the cooling. Still further, after performing
the hot rolling and then after performing a facing of an oxide film
layer the dough rolling is designed to be performed. And then the
rolling is designed to be performed regarding this dough rolling in
order to obtain a plate thickness by which it becomes able to
obtain a predetermined processing rate at the rolling (1) and at
the rolling (2). Furthermore, it becomes able to obtain a sample
material which has a plate shape by making use of the above
mentioned hot rolling and the dough rolling.
[0063] Next, it is desirable for the solution heat treatment to be
performed at a substantial temperature of a material between
800.degree. C. and 1000.degree. C., to be maintained thereafter
with an amount of time approximately between three seconds and
sixty seconds, and to be cooled down thereafter with a cooling rate
of faster than or equal to 15.degree. C. per second in order to
prevent from the precipitation. (Or, it is further preferable for
the same to be faster than or equal to 30.degree. C. per second.
And in the meantime, there is no limitation in particular regarding
an upper limit, however, it is desirable for the same to be slower
than or equal to 150.degree. C. per second.) In the meantime
however, in a case where the temperature of the solution heat
treatment is lower as excessively it is not able to obtain a sound
recrystallized structure. And hence there become to have the
problems of such as that the same becomes a cause to effect as
negatively to the bending workability, and that each of the amount
of the solution of the Ni and the Si becomes to be insufficient,
and then that the amount of the precipitation of the Ni.sub.2Si
becomes to be insufficient at the period of performing the aging
treatment, and hence that it is not able to obtain the proof stress
as sufficiently, or the like. And in the meantime, in a case where
the temperature of the solution heat treatment is higher as
excessively the recrystallized grain size becomes to be coarse. And
hence the same becomes a cause of the decrease in the strength, of
a coming out of the anisotropy, and of the deterioration of the
bending workability.
[0064] Next, the rolling (1) is designed to be performed in order
to perform an improvement of the tensile strength and of the proof
stress at the period of performing the aging treatment. And then a
dislocation is to be introduced into the mother phase of the copper
alloy at the period of performing the rolling (1). Moreover, a part
of those dislocations becomes to function as a site for generating
a heterogeneous core of the Ni.sub.2Si at the period of performing
the aging treatment which is the next process. And then the same
becomes an assistant for the Ni.sub.2Si to be formed as densely and
as finely. Further, the higher the increased amount of the proof
stress (.DELTA.C1) is enhanced due to performing the rolling (1),
the further the strength of the aging becomes to be improved as
well. And then therefore it is desirable for the same to be
introduced. In the meantime however, in a case where the .DELTA.C1
is higher as excessively the effect due to the improvement of the
strength of the aging cannot help but become to be saturated.
Furthermore, the same becomes to be a cause of a deterioration of
the bending workability. And then therefore
(.DELTA.C1/.DELTA.total) is designed to be specified as more than
or equal to 0.1 but less than or equal to 0.35.
[0065] Next, due to the aging treatment it becomes able to disperse
and then to precipitate the chemical compound of the Ni.sub.2Si as
uniformly into the mother phase of copper, and then it becomes able
to perform the improvement of the strength and of the electrical
conductivity. Moreover, it is desirable to perform the same with
making use of a furnace of a batch type, and then it is desirable
to maintain a material at a substantial temperature between
350.degree. C. and 600.degree. C. with an amount of time between
0.5 hour and twelve hours. In the meantime however, in a case where
the aging temperature is lower as excessively it becomes to be
required a longer period of time in order to obtain an amount of
the precipitation of the Ni.sub.2Si. And hence it becomes a cause
of a higher cost of production. Otherwise, each of the proof stress
and the electrical conductivity is not to be sufficient. And in the
meantime, in a case where the aging temperature is higher as
excessively an Ni.sub.2Si becomes to be formed as coarsely. And
hence it is not able to obtain the proof stress as
sufficiently.
[0066] Next, the rolling (2) is designed to be performed in order
to obtain an improvement of the proof stress. And then in a case
where the proof stress after performing the aging is sufficient it
may be not necessary to introduce the rolling (2). In the meantime
however, in a case where the increased amount of the proof stress
(.DELTA.C2) due to performing the rolling (2) is higher as
excessively the bending workability becomes to be deteriorated. And
hence the same becomes to be a cause of a deterioration of the
stress relaxation resistance. And then therefore
(.DELTA.C2/.DELTA.total) is designed to be specified as more than
or equal to zero but less than or equal to 0.35.
[0067] And in the meantime, in a case where a total amount of the
amounts of strain that are to be introduced into the material is
higher as excessively the bending workability becomes to be
deteriorated, and the stress relaxation resistance becomes to be
deteriorated as well. And then therefore a standardized value of a
total amount of strain ((.DELTA.C1+.DELTA.C2)/.DELTA.total) is
designed to be specified as more than or equal to 0.1 but less than
or equal to 0.45.
[0068] Next, the low temperature annealing is designed to be
performed in order to recover an extensibility, the bending
workability and a threshold limit value of a spring with
maintaining the strength as a certain amount of degrees. In the
meantime however, in a case where the substantial temperature is
higher as excessively a recrystallization becomes to be occurred.
And hence the same becomes to be a cause of the decrease in the
proof stress. And then therefore it is desirable to perform the
annealing at the substantial temperature between 300.degree. C. and
600.degree. C. with an amount of time between five seconds and
sixty seconds as a shorter period of time. In the meantime however,
in a case where the temperature of the low temperature annealing is
lower as excessively the recovery of the extensibility, of the
bending workability and of the threshold limit value of the spring
is not to be sufficient. And in the meantime, in a case where the
temperature of the low temperature annealing is higher as
excessively the same becomes to be a cause of the decrease in the
strength.
[0069] And thus the copper alloy material of the Cu--Ni--Si system
in accordance with the present invention becomes to be a copper
alloy material, that has the strength as higher, and that is
superior in the bending workability and in the stress relaxation
resistance at the same time. And hence the same becomes to be
suitable for such as a lead frame, a connector, a terminal
material, a relay, a switch, or the like for a usage of an
electrical apparatus and of an electronic equipment.
EXAMPLES
[0070] The present invention will be described in detailed below,
with being based on Examples and Comparative examples. However, the
present invention will not be limited to any one of these.
[0071] Here, each of the copper alloy materials which is made use
for the corresponding Examples and for the Comparative examples in
accordance with the present invention is formed of a copper alloy
(No. 1 to 30) which has a chemical composition (the balance is Cu)
that is shown in the following Table 1, respectively. Moreover,
each of those copper alloys is dissolved by making use of a high
frequency melting furnace, and then the same is casted into an
ingot thereafter to have a dimension of a thickness of 30 mm and a
width of 120 mm and a length of 150 mm by making use of the DC
method. Next, each of those ingots are heated up to approximately
950.degree. C., and then the same is maintained at this temperature
with an amount of time for one hour approximately, and then the hot
rolling is performed thereafter for the same to have the thickness
to be 12 mm, and then thereafter the cooling is performed for the
same as promptly.
[0072] And then at this time, regarding the Comparative example No.
24 because the amount of the Ni is more than the specified amount,
regarding the Comparative example No. 25 because the amount of the
S is more than the specified amount, regarding the Comparative
example No. 26 because the amount of the Si is more than the
specified amount, regarding the Comparative example No. 28 because
the amount of the Cr is more than the specified amount, regarding
the Comparative examples No. 29 and 30 because the amount of the
Zr, of the Ti, of the Hf, of the V, of the Mo and of the Y is more
than the corresponding specified amount respectively, a crack is
occurred at the period of performing the hot rolling, and then the
following processes are stopped, respectively.
[0073] Next, the oxide film layer is removed by cutting both faces
with 1.5 mm for each. And then thereafter the same is processed to
have a thickness to be between 0.16 mm and 0.50 mm by performing
the cold rolling (dough rolling). And then at this time, regarding
the Comparative example No. 27 because the amount of the Sn is more
than the corresponding specified amount, a copper crack is occurred
at the period of performing the cold rolling, and then the
following processes are stopped. And then thereafter the solution
heat treatment is performed for the same at a temperature between
800.degree. C. and 950.degree. C. with an amount of time for
approximately thirty seconds. And then immediately thereafter the
cooling is performed for the same with the cooling rate of faster
than or equal to 15.degree. C. per second.
[0074] Next, the rolling (1) is performed for each of the samples
with various value of rolling rates (a draft: percent) that are
individually lower than or equal to fifty percent. And then
thereafter the aging treatment is performed in an ambient
atmosphere of an inert gas at a temperature of approximately
500.degree. C. with an amount of time for approximately two hours.
And then thereafter the rolling (2) which is a final plastic
working is performed for the same with various value of rolling
rates (the draft: percent), and hence each of the final plate
thicknesses is adjusted to be 0.15 mm. And then each of the copper
alloy plates are obtained which corresponds to each of the numbers,
for which the low temperature annealing treatment is performed at a
temperature between 400.degree. C. and 600.degree. C. with an
amount of time for approximately thirty seconds after performing
the rolling (2), wherein regarding each of the No. 1-1 to 1-11 and
each of the No. 2-1 to No. 2-3 a different heat treatment is
performed under a different rolling condition within the range that
is described above for the corresponding alloy which has the
composition in accordance with the above mentioned Example No. 1 or
with the Example No. 2 respectively. And then with making use of
each of these copper alloy plate materials various kinds of
characteristic evaluations are performed.
[0075] Regarding each No. of the copper alloy plates which is
produced in accordance with the corresponding Examples and the
Comparative examples there are examined the following: (a) the
grain of matrix size, (b) the shape of the grain of matrix, (c) the
proof stress in a parallel direction to the rolling and in a
vertical direction, (d) the electrical conductivity, (e) the
W-bendability of 90 degrees, and (f) the stress relaxation
property.
[0076] Regarding (a) the grain of matrix size, and (b) the shape of
the grain of matrix the grain of matrix size is measured by making
use of the method of cutting which is specified in accordance with
JIS (the JIS-H0501). And then with being based on this value a
calculation is performed.
[0077] And then measured cross sections regarding the above
mentioned grain of matrix size are individually defined here to be
a cross section (A) which is parallel to the direction for the
final cold rolling that is shown in FIG. 1 (the direction for the
final plastic working), and to be a cross section (B) which is at
right angles to the direction for the final cold rolling. Moreover,
in accordance with the above mentioned cross section (A) a diameter
of a grain of matrix (1) is measured in the two directions of the
direction as parallel to the direction for the final cold rolling
and of the direction at right angles thereto.
[0078] And then a measured value as larger is defined here to be a
major axis (a), and in the meantime, the other value as smaller is
defined here to be a minor axis. Further, in accordance with the
above mentioned cross section (B) a diameter of a grain of matrix
(2) is measured in the two directions of the direction as parallel
to a normal direction for a rolled surface and of a direction is at
right angles to the normal line for the rolled surface. And then a
measured value as larger is defined here to be a major axis (b),
and in the meantime the other value as smaller is defined here to
be another minor axis.
[0079] Still further, regarding the above mentioned grain of matrix
size a photograph of a structure of the above mentioned copper
alloy plate is taken by making use of a scanning electron
microscope with a magnification of 1000 times. And then a line
segment is drawn with a length of 200 mm on the photograph. Still
further, the number of the grain of matrix s (n) is counted, that
are cut by the above mentioned line segment. And hence the same is
evaluated by making use of the formula of (200 [mm]/(n) times
1000). Still further, in a case where the number of the grain of
matrix s that are cut by the above mentioned line segment is less
than twenty a photograph is taken with a magnification of 500
times. And then the number of the grain of matrix s (n) is counted,
that are cut by the a line segment which has a length of 200 mm.
And hence the same is evaluated by making use of the formula of
(200 [mm]/(n) times 500).
[0080] Still further, regarding the grain of matrix size a mean
value of each of the major axes and each of the minor axes which is
evaluated with making use of the cross section (A) and the (B) is
shown with being rounded off to a multiple of 0.005 mm.
Furthermore, the shape of the grain of matrix is shown with making
use of a value (a/b) of which the major axis (a) of the above
mentioned cross section (A) is divided by the major axis (b) of the
above mentioned cross section (B).
[0081] Next, regarding (c) the proof stress a test piece of the
number fifth which is described in the JIS-Z2201 is made use, and
then the value is evaluated with being pursuant to the JIS-Z2241.
Moreover, a test is performed in a parallel direction (a
longitudinal direction: LD) and in a vertical direction (a
transverse direction: TD) to the direction for the rolling (that
are individually equivalent to the direction for the above
mentioned rolling (1) and for the rolling (2)).
[0082] Next, (d) the electrical conductivity is evaluated with
being pursuant to the JIS-H0505. Moreover, regarding the electrical
conductivity 25% IACS (international annealed copper standard) of
an electrical conductivity of a high strength beryllium copper (an
alloy as pursuant to the JIS-C1720) is set to be a standard. And
then a value which is higher than or equal to 30% IACS is defined
here to be EXCELLENT, and in the meantime, a value which is higher
than 25% IACS but lower than 30% IACS is defined here to be GOOD,
and in the meantime, a value which is lower than or equal to 25%
IACS is defined here to be NO GOOD.
[0083] Next, regarding (e) the bending workability a treatment
device for bending to 90 degrees is made use by which a bended
radius at an inner side becomes to be 0.15 mm. And then a (W)
bending test of 90 degrees is performed by which a ratio between
the bended radius and the plate thickness (R/t) becomes to be 1.0.
And hence a judgment is performed, in which for a sample in which
no crack becomes to be occurred at all at a bended part is defined
here to be GOOD, and for a sample in which any crack becomes to be
occurred is defined here to be NO GOOD.
[0084] Next, regarding (f) the stress relaxation resistance the
cantilever block method is adopted which is the standard
specification in accordance with Electronic Material Association of
Japan (EMAS-3003). And then a load stress is set up for a maximum
stress on a surface to become eighty percent of the proof stress.
Moreover, a sample is maintained in a constant temperature bath at
approximately 150.degree. C. with an amount of time for 1000 hours
approximately. And then a stress relaxation rate (S. R. R. (%)) is
evaluated. Further, regarding the stress relaxation resistance a
sample of which the stress relaxation rate is lower than or equal
to 10 percent is defined here to be EXCELLENT, and in the meantime,
a sample of which the same is higher than 10 percent but lower than
15 percent is defined here to be GOOD, and in the meantime, a
sample of which the same is higher than or equal to 15 percent is
defined here to be NO GOOD.
[0085] And thus each of the evaluated results from the No. 1
through 23 will be shown as the Examples and the Comparative
examples in the following Table 2, respectively.
TABLE-US-00001 TABLE 1 No. Ni (mass %) Si (mass %) Mg (mass %) Sn
(mass %) Zn (mass %) S (mass %) THE OTHERS (mass %) EXAMPLES 1 3.73
0.89 0.11 0.16 0.48 0.001 Cr: 0.19 2 3.02 0.73 0.09 0.16 0.50 0.001
Cr: 0.15 3 3.26 0.78 0.10 0.15 0.49 0.001 Cr: 0.20 4 4.27 1.01 0.10
0.15 0.50 0.001 Cr: 0.19 5 2.83 0.67 0.09 0.15 0.49 0.001 Cr: 0.20
6 4.96 1.19 0.10 0.14 0.50 0.001 Cr: 0.21 7 3.04 0.52 0.10 0.15
0.49 0.001 Cr: 0.17 8 4.95 1.68 0.11 0.15 0.50 0.001 Cr: 0.20 9
3.15 0.75 0.14 -- -- 0.001 -- 10 3.77 0.88 0.11 -- -- 0.001 Mn:
0.12 11 3.27 0.78 0.10 -- -- 0.001 Co: 0.12 12 3.26 0.77 0.10 0.14
0.49 0.001 Ag: 0.05 13 3.26 0.77 0.09 0.15 0.45 0.001 Co: 0.19 14
3.75 0.91 0.10 0.14 0.51 0.001 Cr: 0.87 15 3.25 0.77 0.15 0.14 0.47
0.001 Zr: 0.006, Ti: 0.005, Hf: 0.005 16 3.25 0.77 0.15 0.15 0.49
0.001 Sc: 0.005, Y: 0.01 17 3.24 0.76 0.13 0.15 0.50 0.001 V:
0.007, Mo: 0.005 COMPARATIVE 18 2.31 0.56 0.10 0.14 0.48 0.001
EXAMPLES 19 3.01 0.32 0.15 0.13 0.52 0.001 20 3.26 0.77 0.23 0.15
0.49 0.001 21 3.25 0.76 0.11 0.14 0.53 0.001 Mn.0.7 22 3.26 0.77
0.10 0.16 1.86 0.001 23 3.25 0.77 -- -- -- 0.001 Co: 2.1 24 5.52
1.68 0.10 0.15 0.52 0.001 25 3.26 0.77 0.10 0.16 0.50 0.007 26 3.27
2.02 0.11 0.15 0.48 0.001 27 3.25 0.77 0.10 1.90 0.40 0.001 28 3.25
0.76 0.12 -- -- 0.001 Cr: 1.5 29 3.23 0.76 0.09 0.14 0.50 0.001 Zr:
0.20, Ti: 0.10, Hf: 0.10 30 3.24 0.77 0.09 0.15 0.50 0.001 V: 0.20,
Mo: 0.10, Y: 0.20
TABLE-US-00002 TABLE 2 PROOF STRESS GRAIN OF ELECTRICAL
W-BENDABILITY STRESS (MPa) MATRIX SIZE .DELTA.C1/ .DELTA.C2/
(.DELTA.C1 + .DELTA.C2)/ CONDUCTIVITY OF RELAXATION No. LD TD (mm)
a/b .DELTA.total .DELTA.total .DELTA.total (% IACS) 90 DEGREES RATE
(%) EXAMPLES 1-1 810 805 0.005 1.0 0.13 0.13 0.26 33 GOOD 7 1-2 882
890 0.005 1.2 0.12 0.23 0.35 33 GOOD 8 1-3 893 897 0.005 1.3 0.13
0.28 0.41 33 GOOD 8 1-4 812 810 0.005 1.1 0.34 0.00 0.34 33 GOOD 7
1-5 830 823 0.005 1.2 0.30 0.06 0.36 33 GOOD 8 1-6 900 903 0.005
1.3 0.27 0.15 0.42 33 GOOD 9 2-1 821 826 0.005 1.2 0.15 0.22 0.37
36 GOOD 10 2-2 833 838 0.005 1.3 0.28 0.16 0.44 36 GOOD 10 3 812
805 0.005 1.2 0.31 0.11 0.42 34 GOOD 9 4 873 857 0.005 1.0 0.14
0.13 0.27 30 GOOD 7 5 811 811 0.005 1.3 0.28 0.15 0.43 38 GOOD 10 6
906 889 0.005 1.0 0.12 0.14 0.26 28 GOOD 6 7 804 814 0.005 1.3 0.26
0.14 0.40 38 GOOD 10 8 902 897 0.005 1.0 0.27 0.14 0.41 26 GOOD 6 9
811 818 0.010 1.3 0.28 0.13 0.41 44 GOOD 11 10 814 815 0.010 1.2
0.11 0.22 0.33 34 GOOD 7 11 822 817 0.005 1.2 0.30 0.11 0.41 33
GOOD 9 12 814 808 0.005 1.2 0.29 0.12 0.41 34 GOOD 9 13 836 827
0.005 1.1 0.30 0.13 0.43 32 GOOD 8 14 828 817 0.005 1.2 0.29 0.13
0.42 31 GOOD 9 15 816 811 0.005 1.2 0.28 0.11 0.39 32 GOOD 9 16 819
809 0.005 1.2 0.29 0.12 0.41 32 GOOD 9 17 814 806 0.005 1.2 0.30
0.13 0.43 32 GOOD 8 COMPAR- 1-7 765 753 0.005 1.0 0 0.18 0.18 33
GOOD 8 ATIVE 1-8 895 938 0.005 2.1 0 0.38 0.38 33 NO GOOD 15
EXAMPLES 1-9 920 948 0.005 1.6 0.10 0.41 0.51 33 NO GOOD 17 1-10
957 964 0.005 2.2 0.26 0.27 0.53 33 NO GOOD 23 1-11 803 687 0.030
1.1 0.13 0.15 0.28 32 NO GOOD 8 2-3 826 836 0.005 2.0 0 0.40 0.40
35 NO GOOD 22 18 754 752 0.005 1.9 0.27 0.16 0.43 41 GOOD 20 19 746
738 0.005 1.3 0.26 0.15 0.41 37 GOOD 10 20 815 803 0.005 1.3 0.30
0.12 0.42 31 NO GOOD 9 21 817 810 0.005 1.3 0.25 0.14 0.39 25 GOOD
11 22 819 815 0.005 1.3 0.24 0.16 0.40 24 GOOD 10 23 789 768 0.005
1.3 0.23 0.18 0.41 31 NO GOOD 9
[0086] Regarding the No. 1-1 to 1-6, 2-1, 2-2, and from 3 through
17 that are individually shown in the Examples each of the copper
alloys has the strength to be higher, has the bending workability
to be good, and the same is superior in the stress relaxation
resistance, respectively. Moreover, the anisotropy of the same is
smaller, respectively.
[0087] On the contrary however, in accordance with the No. 1-7 as
the Comparative example the proof stress becomes to be lower
because the value of the (.DELTA.C1/.DELTA.total) is smaller than
that in accordance with the specification. And in the meantime, in
accordance with the No. 1-8 and the 2-3 as the Comparative examples
the bending workability and the stress relaxation resistance become
to be deteriorated because the value of the
(.DELTA.C2/.DELTA.total) is larger than that in accordance with the
specification. And in the meantime, in accordance with the No. 1-9
as the Comparative example the bending workability and the stress
relaxation resistance become to be deteriorated because the value
of the (.DELTA.C2/.DELTA.total) and of the
((.DELTA.C1+.DELTA.C2)/.DELTA.total) is larger than that in
accordance with the specification, respectively. And in the
meantime, in accordance with the No. 1-10 as the Comparative
example the bending workability and the stress relaxation
resistance become to be deteriorated because the value of the (a/b)
and of the ((.DELTA.C1+.DELTA.C2)/.DELTA.total) is larger than that
in accordance with the specification, respectively. And in the
meantime, in accordance with the No. 1-11 as the Comparative
example the anisotropy of the proof stress becomes to be appeared
and also the bending workability becomes to be deteriorated,
because the grain of matrix size is larger than that in accordance
with the specification.
[0088] And, in accordance with the No. 18 as the Comparative
example the proof stress becomes to be lower because the Ni
concentration is lower than that in accordance with the
specification. And in the meantime, in accordance with the No. 19
as the Comparative example the proof stress becomes to be lower
either because the Si concentration is lower than that in
accordance with the specification. Moreover, in accordance with the
No. 18 as the Comparative example the stress relaxation resistance
becomes to be inferior. And in the meantime, in accordance with the
No. 20 as the Comparative example the bending workability becomes
to be deteriorated because the Mg concentration is higher than that
in accordance with the specification. And in the meantime, in
accordance with the No. and the 22 as the Comparative examples the
electrical conductivity becomes to be decreased because the
concentration of the Mn and of the Zn is higher than that in
accordance with the specification, respectively. And in the
meantime, in accordance with the No. 23 as the Comparative example
the proof stress becomes to be worsened and also the bending
workability becomes to be deteriorated, because the Co
concentration is higher than that in accordance with the
specification.
INDUSTRIAL APPLICABILITY
[0089] The copper alloy material in accordance with the present
invention becomes to be desirable for a material of such as a
terminal, a connector, a switch, or the like.
[0090] Moreover, the method for producing the copper alloy material
in accordance with the present invention becomes to be desirable as
the method for producing the above mentioned copper alloy
material.
[0091] Thus, the present invention is described above with the
embodiment, however, the present invention will not to be limited
to every detail of the description as far as a designation in
particular, and then it should be interpreted widely without
departing from the spirit and scope of the present invention as
disclosed in the attached claims.
[0092] Furthermore, the present invention claims the priority based
on Japanese Patent Application Publication No. 2007-285605, that is
patent applied in Japan on the first day of November, 2007, and the
entire contents of which are expressly incorporated herein by
reference as a part of the description of the present
specification.
* * * * *