U.S. patent application number 12/744669 was filed with the patent office on 2010-09-30 for flat plate type micro heat transport device.
This patent application is currently assigned to Electronics and Telecommunications Research Insti tute. Invention is credited to Gunn Hwang, Seok Hwan Moon.
Application Number | 20100243214 12/744669 |
Document ID | / |
Family ID | 40717868 |
Filed Date | 2010-09-30 |
United States Patent
Application |
20100243214 |
Kind Code |
A1 |
Moon; Seok Hwan ; et
al. |
September 30, 2010 |
FLAT PLATE TYPE MICRO HEAT TRANSPORT DEVICE
Abstract
There is provided a flat plate type micro heat transport device
formed of two plates coupled with each other to be opposite to each
other, each of which includes: a reservoir formed to store a moving
fluid charged via an inlet; a evaporator formed separated from the
reservoir to generate vapor having latent heat by vaporizing the
moving fluid; a vapor flow path formed to be connected to the
evaporator, through which the vapor having latent heat is
transported; a condenser formed to be connected to the vapor flow
path and to condense the vapor having latent heat; and a liquid
flow path formed to be connected to the condenser and the
evaporator and separately from the vapor flow path to transport a
liquid obtained by condensing the vapor. The device may efficiently
control heat with respect to portable electronic devices by
effectively transportring heat generated by a heat source.
Inventors: |
Moon; Seok Hwan; (Daejeon,
KR) ; Hwang; Gunn; (Seoul, KR) |
Correspondence
Address: |
AMPACC Law Group
3500 188th Street S.W., Suite 103
Lynnwood
WA
98037
US
|
Assignee: |
Electronics and Telecommunications
Research Insti tute
Daejeon
KR
|
Family ID: |
40717868 |
Appl. No.: |
12/744669 |
Filed: |
April 21, 2008 |
PCT Filed: |
April 21, 2008 |
PCT NO: |
PCT/KR08/02230 |
371 Date: |
May 25, 2010 |
Current U.S.
Class: |
165/104.26 |
Current CPC
Class: |
H01L 23/427 20130101;
H01L 2924/0002 20130101; F28D 15/046 20130101; H01L 2924/00
20130101; F28D 15/0233 20130101; H01L 2924/0002 20130101 |
Class at
Publication: |
165/104.26 |
International
Class: |
F28D 15/04 20060101
F28D015/04 |
Foreign Application Data
Date |
Code |
Application Number |
Dec 4, 2007 |
KR |
10-2007-0125098 |
Claims
1. A flat plate type micro heat transport device formed of two
plates coupled with each other to be opposite to each other, each
of which comprises: a reservoir formed to store a moving fluid
charged via an inlet; a evaporator formed separated from the
reservoir to generate vapor having latent heat by vaporizing the
moving fluid; a vapor flow path formed to be connected to the
evaporator, through which the vapor having latent heat is
transported; a condenser formed to be connected to the vapor flow
path and to condense the vapor having latent heat; and a liquid
flow path formed to be connected to the condenser and the
evaporator and separately from the vapor flow path to transport a
liquid obtained by condensing the vapor.
2. The device of claim 1, wherein the device has an envelope shape
having an enclosed structure.
3. The device of claim 1, wherein the moving fluid has two-phase
fluid states of a liquid and vapor and is circulated via the
reservoir, the evaporator, and the condenser by using the vapor
flow path and the liquid flow path, which are separately formed,
according to the two-phase fluid states.
4. The device of claim 1, wherein the inlet is formed in the shape
of a hole on a side of the each of the two plates to pour the
moving fluid into the reservoir.
5. The device of claim 1, wherein the vapor flow path is formed in
the shape of a line having a cross-section greater than that of the
liquid flow path.
6. The device of claim 5, wherein the vapor flow path has a groove
having a sparse structure to scatter the liquid obtained by
condensing the vapor.
7. The device of claim 1, wherein the liquid flow path is formed in
the shape of one line on both sides of the vapor flow path,
respectively.
8. The device of claim 1, wherein the evaporator is formed in a
two-capillary structure having a shape of groove.
9. The device of claim 8, wherein the groove is formed in a
structure having a cross-section becoming narrow at a point where
the groove and the liquid flow path meet each other.
10. The device of claim 8, wherein the evaporator is formed by
further inserting one of a sintered wick, a fiber wick, a screen
mesh wick, a fine fiber wick, and a woven wire wick.
11. The device of claim 1, wherein the condenser has a serpentine
configuration in the shape of a line.
Description
TECHNICAL FIELD
[0001] The present invention relates to a flat plate type micro
heat transport device, and more particularly, to a flat plate type
micro heat transport device having a thin thickness, which is
driven by vapor-liquid two phase fluid mechanism.
BACKGROUND ART
[0002] Recently, high integration and subminiaturization of various
easily portable electronic communication devices such as notebooks
and sub notebooks are rapidly accelerated. Particularly, personal
mobile electronic communication devices are rapidly miniaturized
and become ultrathin.
[0003] Such electronic communication devices keep controlling heat
by providing a space for heat dissipation therein. However, due to
rapid changes in structures of electronic communication devices,
there are a lot of limitations on sizes in heat control methods
capable of being applied to various devices and it is difficult to
provide a space for heat control.
[0004] As generally applied methods, there is a method in which a
material having an excellent thermal conductivity is designed
suitable for a packaging structure of a device in such a way that
simple heat conduction is performed due to solid. In addition, as
representative methods, there are a fan and heat pipe type and
liquid circulation type.
[0005] The fan and heat pipe type is generally employed in portable
notebooks, in which a vent hole is formed on a chassis portion of a
device and heat transported from a heat source via a heat pipe is
dissipated via the vent hole.
[0006] The liquid circulation type such as liquid cooling is most
traditional, which is not yet applied to portable electronic
communication devices but has a greater ability of heat transport
than other cooling methods.
DISCLOSURE OF INVENTION
Technical Problem
[0007] Such heat control technologies are presently estimated as
more effective technologies capable of being applied to small-sized
portable electronic communication devices. However, as a structure
of electronic packaging is gradually miniaturized and highly
integrated, there is a limitation in such heat control technologies
and it is considered as there will be more limitations in the
future.
[0008] In the case a volume of a packaging structure, particularly,
a thin type structure, it is difficult to have a thin thickness
while heat is transported to a relatively long distance. In the
case of a small heat pipe, due to a limitation on a packaging
structure, when a thickness is compressed to 2 mm or less, heat
transport performance is greatly reduced and it is difficult to
transport heat for a distance more than 50 mm. Since other heat
control technologies include defects in a heat conductivity or
volume thereof, it is difficult to apply the technologies.
[0009] In addition, heat control technologies capable of being
applied to a narrow space gradually meet with limitations.
Representatively, it is required to reduce volumes of heat sinks,
metal blocks, and fan, which are generally used so far. However,
considering that heat dissipation efficiency is improved by simply
providing a broad heat transport area, there are shown problems in
heat design. Accordingly, it is required to effectively dissipate
heat in a narrow and thin space that is limited.
[0010] Accordingly, to solve the described problems, an aspect of
the present invention provides a flat plate type micro heat
transport device having a thin thickness, the device driven by
vapor-liquid two phase fluid mechanism.
Technical Solution
[0011] According to an aspect of the present invention, there is
provided a flat plate type micro heat transport device formed of
two plates coupled with each other to be opposite to each other,
each of which includes: a reservoir formed to store a moving fluid
charged via an inlet; a evaporator formed separated from the
reservoir to generate vapor having latent heat by vaporizing the
moving fluid; a vapor flow path formed to be connected to the
evaporator, through which the vapor having latent heat is
transported; a condenser formed to be connected to the vapor flow
path and to condense the vapor having latent heat; and a liquid
flow path formed to be connected to the condenser and the
evaporator and separately from the vapor flow path to transport a
liquid obtained by condensing the vapor.
[0012] The two plates may have the same configuration and the same
size.
[0013] The device may have an envelope shape having an enclosed
structure.
[0014] The moving fluid may have two-phase fluid states of a liquid
and vapor and is circulated via the reservoir, the evaporator, and
the condenser by using the vapor flow path and the liquid flow
path, which are separately formed, according to the two-phase fluid
states.
[0015] The inlet is formed in the shape of a hole on a side of the
each of the two plates to pour the moving fluid into the
reservoir.
[0016] The vapor flow path may be formed in the shape of a line
having a cross-section greater than that of the liquid flow
path.
[0017] The vapor flow path may have a groove having a sparse
structure to scatter the liquid obtained by condensing the
vapor.
[0018] The liquid flow path may be formed in the shape of one line
on both sides of the vapor flow path, respectively.
[0019] The evaporator may be formed in a two-capillary structure
having a shape of groove.
[0020] The groove may be formed in a structure having a
cross-section becoming narrow at a point where the evaporator and
the liquid flow path meet each other.
[0021] The evaporator may be formed by further inserting one of a
sintered wick, a fiber wick, a screen mesh wick, a fine fiber wick,
and a woven wire wick.
[0022] The condenser may have a serpentine configuration in the
shape of a line.
Advantageous Effects
[0023] According to the present invention, there are is provided an
effect of efficiently controlling heat of portable electronic
devices, in which a flat plate type thin structure and vapor and
liquid flow paths, separately formed, are provided, thereby
removing fluid pressure drop caused by friction at an interface
between vapor and a liquid in such a way that it is advantageous to
high-heat flux and heat-transport for a relatively long
distance.
[0024] Also, since a thickness of the flat plate type micro heat
transport device is 2 mm or less, the device is suitable for
subminiature portable electronic devices. Particularly, the device
is very effective when an electronic package structure of a device
is very narrow.
[0025] Due to a structure of coupling two plates having the same
configuration and the same size, it is possible to produce plates
of only one type. Accordingly, it is possible to improve
productivity and reduce manufacturing costs.
BRIEF DESCRIPTION OF THE DRAWINGS
[0026] FIG. 1 is a perspective view illustrating two plates having
the same configuration and size, before being coupled with each
other to form a flat plate type micro heat transport device
according to an exemplary embodiment of the present invention;
[0027] FIG. 2 is a configuration diagram illustrating one of the
two plates forming the flat plate type micro heat transport device
according to an exemplary embodiment of the present invention;
and
[0028] FIG. 3 is a detail drawing illustrating one o the two plates
forming the flat plate type micro heat transport device in FIG. 2,
that is, (a) of FIG. 3 is an enlarged view of A of FIG. 2, in which
a two-capillary structure of a evaporator is shown; (b) of FIG. 3
is a cross-sectional view illustrating the plate of FIG. 2, cut
along a line I-I'; (c) Of FIG. 3 is an enlarged view of C of FIG.
2, in which a condenser having a serpentine configuration in the
shape of a line is shown; and (d) of FIG. 3 is an enlarged view of
B of FIG. 2, in which a sparse groove structure of a vapor flow
path is shown.
BEST MODE FOR CARRYING OUT THE INVENTION
[0029] Hereinafter, exemplary embodiments of the present invention
will now be described in detail with reference to the accompanying
drawings.
[0030] Only, in describing operations of the exemplary embodiments
in detail, when it is considered that a detailed description on
related well-known functions or constitutions unnecessarily may
make essential points of the present invention be unclear, the
detailed description will be omitted.
[0031] Also, in the drawings, the same reference numerals are used
throughout to designate the same or similar components.
[0032] FIG. 1 is a perspective view illustrating separated top and
bottom plates to show an overall structure of a flat plate type
micro heat transport device according to an exemplary embodiment of
the present invention.
[0033] Referring to FIG. 1, the flat plate type micro heat
transport device is formed in an envelope shape having an enclosed
structure including top and bottom plates 100 and 200 having the
same configuration and the same size, which are coupled with each
other. The flat plate type micro heat transport device has a
thickness of 2 mm or less, which is very thin.
[0034] When pouring a moving fluid into the flat plate type micro
heat transport device formed of the envelope having the enclosed
structure, heat exchange is performed by phase-change heat
transport.
[0035] That is, the flat plate type micro heat transport device
according to an exemplary embodiment of the present invention may
be manufactured by simply connecting the two plates having an
internal structure generating fluid mechanism of two phases such as
a liquid and vapor. Also, since a evaporator having a capillary
structure generating the liquid-vapor two phase fluid mechanism,
vapor and liquid flow paths, a condenser, and a reservoir are
installed in one plate, a structure thereof is very simple and has
competitive manufacturing costs.
[0036] A detailed configuration of each of the two plates forming
the flat plate type micro heat transport device will be described
with reference to FIG. 2.
[0037] FIG. 2 is a configuration diagram illustrating one of the
two plates forming the envelope having the enclosed structure
formed by coupling the two plates 100 and 200 of FIG. 1. In this
case, since the two plates 100 and 200 have the same configuration
and the same size, respectively, the configuration of the plate 100
will be described.
[0038] Referring to FIG. 2, the plate 100 includes an inlet 110
formed in the shape of a hole on a side of the envelope, through
which a moving fluid flows, a reservoir 120 storing the moving
fluid flowing through the inlet 110, a evaporator 130 having a
two-capillary structure, which vaporizes the moving fluid into
vapor having latent heat, a vapor flow path 140 formed in the shape
of a line to transport the vapor, a condenser 150 having a
serpentine configuration in the shape of a line to quickly condense
the vapor transported via the vapor flow path 140, and a liquid
flow path 160 formed in the shape of a line to transport a liquid
obtained by condensing the vapor at the condenser 150 to the
evaporator 130.
[0039] On the other hand, in the present embodiment, though the
flat plate type micro heat transport device is formed of one
envelope formed by coupling two plates, each of the two plates
includes a evaporator, a condenser, vapor and liquid flow paths,
and a reservoir, thereby independently circulating a moving fluid
by phase change operation mechanism. Accordingly, since the two
plates have the same configuration and the same size, it is
possible to reduce manufacturing costs thereof.
[0040] The flat plate type micro heat transport device may have a
thickness and a length capable of being adaptively controlled
according to heat density of electronic devices. Positions of a
evaporator and a condenser and courses of liquid and vapor flow
paths may be also freely designed. Accordingly, application thereof
is very great. That is, there are provided various shapes according
to various internal packaging structures of portable electronic
communication devices.
[0041] The detailed configuration of the plate 100, shown in FIG.
2, will be described in detail with reference to (a) to (d) of FIG.
3.
[0042] (a) of FIG. 3A is an enlarged view of A of FIG. 2, in which
the two-capillary structure of the evaporator 130 is shown; (b) of
FIG. 3 is a cross-sectional view illustrating the plate 100, cut
along a line I-I' as shown in FIG. 2; (c) of FIG. 3 is an enlarged
view of C of FIG. 2, in which the condenser 150 having the
serpentine configuration in the shape of a line is shown; and (d)
of FIG. 3 is an enlarged view of B of FIG. 2, in which a sparse
groove structure of the vapor flow path 140 is shown.
[0043] Referring to (a) of FIG. 3, the evaporator 130 is separated
from the reservoir 120 at a certain interval, vaporizes the moving
fluid transported through the liquid flow path 160, and includes
the two-capillary structure having grooves 131. The grooves 131 may
reduce loads of capillary force, thereby improving heat transport
performance.
[0044] The grooves 131 formed in the evaporator 130 may be designed
as a structure in which a cross-section suddenly becomes narrow at
both sides where the grooves 131 meet the liquid flow path 160. As
designed like above, it is possible to prevent a backflow of vapor
bubbles generated in the grooves 131 in the evaporator 130.
Accordingly, there is no need to manufacture an additional
structure.
[0045] In the evaporator 130, an additional wick such as a sintered
wick, a fiber wick, a screen mesh wick, a fine fiber wick, and a
woven wire wick may be further inserted.
[0046] (b) of FIG. 3 is a cross-sectional view illustrating the
plate 100, cut along a line I-I' as shown in FIG. 2. Referring to
(b) of FIG. 3, when coupling the two plates 100 with 200 having the
configuration shown in (a) of FIG. 3, as top and bottom plates, a
broad vapor space is provided in the middle of the evaporator 130
having the two-capillary structure.
[0047] That is, the evaporator 130 of each of the two plates 100
and 200 has two-capillary structure, thereby providing a vapor
space in addition to the grooves 131 generating the capillary
force. Also, the envelope is formed by coupling the two plates 100
and 200 having the same configuration, to be opposite to each
other, thereby providing an overall vapor space formed of the vapor
spaces of the evaporator 130 included in each of the plates 100 and
200.
[0048] Referring to (c) of FIG. 3, the condenser 150 has a
serpentine configuration in the shape of a line, which provides an
increased contact area, thereby quickly dissipating heat of the
vapor having latent heat, transported from the evaporator 130, and
condensing the vapor.
[0049] Referring to (d) of FIG. 3, the vapor flow path 120 is
formed in a center portion of the flat plate type micro heat
transport device, in the shape of one line connected to the
evaporator 130 and the condenser 150 to transport the vapor having
latent heat from the evaporator 130 to the condenser 150.
[0050] Due to the thin thickness of the flat plate type micro heat
transport device, the vapor generated at the evaporator 130 may be
condensed at the vapor flow path 140 before being transported to
the condenser 150. To prevent this, grooves 141 having a sparse
structure is formed to disperse a condensed liquid at the vapor
flow path 140.
[0051] Also, the liquid flow path 160 is formed in one pair of
lines on both sides of the vapor flow path 120 to circulate the
moving fluid passing through the evaporator 130 via the condenser
150 to the evaporator 130.
[0052] In this case, in the present embodiment, one or two liquid
flow paths may be employed. When there are two liquid flow paths,
capillary force of a evaporator, which may be relatively smaller,
may be complemented, thereby improving heat transport performance
of the overall flat plate type heat transport device. That is, the
number of the liquid flow path in the present embodiment may be,
but not limited to, one.
[0053] A cooling process at the flat plate type micro heat
transport device shown in FIGS. 1 to 3 will be described. The
inside of the flat plate type micro heat transport device is made
to be vacuous and is filled with a moving fluid via the inlet 110.
Heat transported from a heating source (not shown) to the
evaporator 130 vaporizes the moving fluid into vapor having latent
heat. The vapor having latent heat is transported to the condenser
150 via the vapor flow path 140 by a pressure difference.
[0054] The condenser 150 dissipates heat of the vapor having latent
heat and condenses the vapor into a liquid. The liquid is
transported to the evaporator 130 via the liquid flow path 160.
[0055] As described above, when heat flows into the evaporator 130,
a circulation process is repeated, in which the heat is transported
to the condenser 150, in the form of vapor having latent heat, is
condensed at the condenser 150, and returns to the evaporator
130.
[0056] In this case, different from conventional heat pipes in
which vapor and a liquid flow in the same path, in the form of a
counter flow, in the present embodiment, vapor and a liquid flow
using different flow paths, respectively, such as the vapor flow
path 140 and the liquid flow path 160. Accordingly, since there is
no a pressure drop due to frictional resistance at an interface
between the vapor and the liquid, the flat plate type micro heat
transport device may have a relatively more excellent heat
transport ability than the conventional heat pipes.
[0057] While the present invention has been shown and described in
connection with the exemplary embodiments, it will be apparent to
those skilled in the art that modifications and variations can be
made without departing from the spirit and scope of the invention
as defined by the appended claims.
* * * * *