U.S. patent application number 12/750526 was filed with the patent office on 2010-09-30 for double sintered thermally stable polycrystalline diamond cutting elements.
Invention is credited to Ronald B. Crockett, Joseph R. Fox, David R. Hall, Ashok Tamang.
Application Number | 20100242375 12/750526 |
Document ID | / |
Family ID | 42782408 |
Filed Date | 2010-09-30 |
United States Patent
Application |
20100242375 |
Kind Code |
A1 |
Hall; David R. ; et
al. |
September 30, 2010 |
Double Sintered Thermally Stable Polycrystalline Diamond Cutting
Elements
Abstract
Embodiments of the invention include a polycrystalline diamond
compact comprising a plurality of double-sintered polycrystalline
diamond segments. The polycrystalline diamond segments are
configured to remain thermally stable at a first temperature. The
polycrystalline diamond segments are positioned upon and bonded to
a transition layer of single-sintered polycrystalline diamond that
is configured to remain thermally stable at a second temperature
lower than the first temperature. The transition layer is
positioned upon and bonded to a substrate. Embodiments of the
invention have improved thermally stability, resulting in fewer
defects during manufacturing and improved longevity in use.
Inventors: |
Hall; David R.; (Provo,
UT) ; Crockett; Ronald B.; (Payson, UT) ; Fox;
Joseph R.; (Spanish Fork, UT) ; Tamang; Ashok;
(Provo, UT) |
Correspondence
Address: |
Holme Roberts & Owen LLP-Client-1
1700 Lincoln Street, Suite 4100
Denver
CO
80203
US
|
Family ID: |
42782408 |
Appl. No.: |
12/750526 |
Filed: |
March 30, 2010 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
|
|
61164770 |
Mar 30, 2009 |
|
|
|
Current U.S.
Class: |
51/307 |
Current CPC
Class: |
B22F 3/14 20130101; E21B
10/5676 20130101; E21B 10/5735 20130101; B24D 99/005 20130101; B22F
7/08 20130101; C22C 26/00 20130101 |
Class at
Publication: |
51/307 |
International
Class: |
E21B 10/46 20060101
E21B010/46; B24D 3/00 20060101 B24D003/00; E21B 10/567 20060101
E21B010/567 |
Claims
1. A polycrystalline diamond compact comprising: a first layer,
said first layer including a plurality of polycrystalline diamond
segments positioned thereupon; said plurality of polycrystalline
diamond segments being separated by an interfacial boundary formed
of an abrasive material; a second layer, said first layer being
bonded to a second layer, said second layer being formed in part
from said abrasive material; and, a substrate, said second layer
being positioned upon and bonded to said substrate.
2. The compact of claim 1, wherein said polycrystalline diamond
segments have a granular structure comprised of polycrystalline
diamond grains and interstices, said interstices being
substantially free of a catalytic material.
3. The compact of claim 2, wherein said interstices include a
non-catalytic material.
4. The compact of claim 3, wherein said non-catalytic material is a
non-metallic material.
5. The compact of claim 1, wherein said polycrystalline diamond
segments have a granular structure comprised substantially of
polycrystalline diamond grains and substantially free of
interstices.
6. The compact of claim 1, wherein said abrasive material comprises
a granular structure comprised of polycrystalline diamond grains
and a catalyst.
7. The compact of claim 1, wherein the second layer further
comprises a substantially conical surface.
8. The compact of claim 1, wherein said first layer is configured
to remain thermally stable at a first temperature and said second
layer is configured to remain thermally stable at a second
temperature lower than said first temperature.
9. A polycrystalline diamond compact comprising: a plurality of
double-sintered polycrystalline diamond segments, said diamond
segments configured to remain thermally stable at a first
temperature; a transition layer of single-sintered polycrystalline
diamond configured to remain thermally stable at a second
temperature lower than said first temperature, said polycrystalline
diamond segments positioned upon and bonded to said transition
layer; and, a substrate, said transition layer positioned upon and
bonded to said substrate.
10. The compact of claim 9, wherein said polycrystalline diamond
segments have a granular structure comprised of polycrystalline
diamond grains and interstices, said interstices being
substantially free of a catalytic material.
11. The compact of claim 10, wherein said interstices include a
non-catalytic material.
12. The compact of claim 11, wherein said non-catalytic material is
a non-metallic material.
13. The compact of claim 9, wherein said polycrystalline diamond
segments have a granular structure comprised substantially of
polycrystalline diamond grains and substantially free of
interstices.
14. The compact of claim 9, wherein said transition layer comprises
a granular structure comprised of polycrystalline diamond grains
and a catalyst.
15. The compact of claim 9, wherein the transition layer further
comprises a substantially conical surface.
16. A method of forming a polycrystalline diamond compact
comprising: providing a canister configured to receive a plurality
of sintered polycrystalline diamond segments and an unsintered
abrasive powder; filling said canister with said unsintered
abrasive powder; positioning said plurality of polycrystalline
diamond segments upon said unsintered abrasive powder, an
interfacial boundary formed of said unsintered abrasive powder
separating each of said plurality of polycrystalline diamond
segments; and applying a temperature and a pressure to said
canister to sinter said unsintered abrasive powder and bond said
polycrystalline diamond segments to said sintered abrasive
powder.
17. The method of claim 16, further comprising positioning a
substrate in said canister, said unsintered abrasive powder being
positioned between said substrate and said sintered polycrystalline
diamond segments.
18. The method of claim 16, further comprising: providing another
canister configured to receive at least a first disc, said first
disc including at least one rib on a front surface of said first
disc; filling said canister with at least diamond powder; placing
said first disc in said canister such that said front surface of
said first disc is in contact with said diamond powder; and,
applying a temperature and a pressure to said canister to sinter
said diamond powder to form said sintered polycrystalline diamond
segments.
19. The method of claim 18, further comprising: removing said
sintered polycrystalline diamond segments from said another
canister; processing said polycrystalline diamond segments to make
said polycrystalline diamond segments more thermally stable than
unprocessed polycrystalline diamond segments.
Description
PRIORITY CLAIM
[0001] This application claims the benefit of and priority from
U.S. Provisional Patent Application No. 61/164,770 filed on Mar.
30, 2009, which is incorporated herein in its entirety for all
purposes by this reference.
FIELD
[0002] Embodiments of the present invention relate generally to the
field of earth boring tools and in particular relates to
polycrystalline diamond cutting elements used on drill bits for
earth boring.
BACKGROUND
[0003] Specialized drill bits are used to drill well-bores,
boreholes, or wells in the earth for a variety of purposes,
including water wells; oil and gas wells; injection wells;
geothermal wells; monitoring wells, mining; and, other similar
operations. These drill bits come in two common types, roller cone
drill bits and fixed cutter drill bits.
[0004] Wells and other holes in the earth are drilled by attaching
or connecting a drill bit to some means of turning the drill bit.
In some instances, such as in some mining applications, the drill
bit is attached directly to a shaft that is turned by a motor,
engine, drive, or other means of providing torque to rotate the
drill bit.
[0005] In other applications, such as oil and gas drilling, the
well may be several thousand feet or more in total depth. In these
circumstances, the drill bit is connected to the surface of the
earth by what is referred to as a drill string and a motor or drive
that rotates the drill bit. The drill string typically comprises
several elements that may include a special down-hole motor
configured to provide additional or, if a surfaces motor or drive
is not provided, the only means of turning the drill bit. Special
logging and directional tools to measure various physical
characteristics of the geological formation being drilled and to
measure the location of the drill bit and drill string may be
employed. Additional drill collars, heavy, thick-walled pipe,
typically provide weight that is used to push the drill bit into
the formation. Finally, drill pipe connects these elements, the
drill bit, down-hole motor, logging tools, and drill collars, to
the surface where a motor or drive mechanism turns the entire drill
string and, consequently, the drill bit, to engage the drill bit
with the geological formation to drill the well-bore deeper.
[0006] As a well is drilled, fluid, typically a water or oil based
fluid referred to as drilling mud is pumped down the drill string
through the drill pipe and any other elements present and through
the drill bit. Other types of drilling fluids are sometimes used,
including air, nitrogen, foams, mists, and other combinations of
gases, but for purposes of this application drilling fluid and/or
drilling mud refers to any type of drilling fluid, including gases.
In other words, drill bits typically have a fluid channel within
the drill bit to allow the drilling mud to pass through the bit and
out one or more jets, ports, or nozzles. The purpose of the
drilling fluid is to cool and lubricate the drill bit, stabilize
the well-bore from collapsing or allowing fluids present in the
geological formation from entering the well-bore, and to carry
fragments or cuttings removed by the drill bit up the annulus and
out of the well-bore. While the drilling fluid typically is pumped
through the inner annulus of the drill string and out of the drill
bit, drilling fluid can be reverse-circulated. That is, the
drilling fluid can be pumped down the annulus (the space between
the exterior of the drill pipe and the wall of the well-bore) of
the well-bore, across the face of the drill bit, and into the inner
fluid channels of the drill bit through the jets or nozzles and up
into the drill string.
[0007] Roller cone drill bits were the most common type of bit used
historically and featured two or more rotating cones with cutting
elements, or teeth, on each cone. Roller cone drill bits typically
have a relatively short period of use as the cutting elements and
support bearings for the roller cones typically wear out and fail
after only 50 hours of drilling use.
[0008] Because of the relatively short life of roller cone bits,
fixed cutter drill bits that employ very durable polycrystalline
diamond (PCD) compact cutters, tungsten carbide cutters, natural or
synthetic diamond, other hard materials, or combinations thereof,
have been developed. These bits are referred to as fixed cutter
bits because they employ cutting elements positioned on one or more
fixed blades in selected locations or randomly distributed. Unlike
roller cone bits that have cutting elements on a cone that rotates,
in addition to the rotation imparted by a motor or drive, fixed
cutter bits do not rotate independently of the rotation imparted by
the motor or drive mechanism. Through varying improvements, the
durability of fixed cutter bits has improved sufficiently to make
them cost effective in terms of time saved during the drilling
process when compared to the higher, up-front cost to manufacture
the fixed cutter bits.
[0009] Typically, a diamond cutter for use in a drill bit having a
geometric size and shape normally characterized by unleached
diamond cutting elements fabricated by assembling a plurality of
polycrystalline diamond compact cutting elements in an array in a
cutting slug that supports the cutting element. A challenge occurs,
however, in bonding the PCD cutting elements to the cutting slug
because the cutting slug--typically a cemented carbide
substrate--has a different material than the PCD cutting elements
and, therefore, has different material properties, such as a
different rate of thermal expansion than the PCD cutting element.
The differences in material properties can cause thermal stresses
that lead the PCD cutting element to crack, delaminate, or
otherwise become weakened and/or damaged at the interface between
the cutting slug and the PCD cutting element.
[0010] Thus, there exists a need for a PCD cutting element that is,
at least in part, has improved thermal compatibility with the
underlying cutting slug.
[0011] Further, there is a need for a PCD cutting element that has
improved bonding to a cutting slug as compared to the prior
art.
[0012] In addition, there is a need for a PCD manufacturing process
that improves the yield of usable PCD cutting elements coupled to
cutting slugs that reduces the probability that the PCD cutting
elements break and/or crack during a double sintering process.
SUMMARY
[0013] Various features and embodiments of the invention disclosed
herein provide robust and durable PCD cutting elements coupled to a
cutting slug. In addition, methods of coupling a PCD cutting
elements to a cutting slug are also disclosed.
[0014] Embodiments of the invention include a first layer
comprising at least one polycrystalline diamond segment positioned
upon a second layer or transition layer. In those embodiments that
include a plurality of PCD segments, a first PCD segment is
positioned proximate a second PCD segment and separated therefrom
by an interfacial boundary. The interfacial boundary optionally is
non-planar relative to the first and/or the second PCD segment.
Optionally, the interfacial boundary includes an abrasive material.
Optionally, the interfacial boundary is contiguous with and formed
of the same material as the second layer. In some embodiments, the
first layer remains thermally stable at a higher temperature than
the temperature below which the second table remains thermally
stable. In some embodiments, the second layer is coupled to a
substrate or cutting slug.
[0015] Embodiments of the PCD segments include those that have been
processed to provide a granular structure comprising interstices
with a reduced number of metallic catalysts. Other embodiments of
the PCD segments include those that have been processed to provide
a granular structure that include interstices infiltrated with a
material that remains thermally stable at a higher temperature than
the temperature below which the metallic catalysts remain thermally
stable. Other embodiments of the granular structure of the PCD
segments comprise interstices that include one or more non-metallic
catalysts. Yet other embodiments of the granular structure of the
PCD segments comprise substantially fully dense diamond, i.e., a
granular structure being substantially free of voids and/or
interstices with or without other materials within any remaining
interstices.
[0016] Other embodiments of the invention include a body of
abrasive material coupled to a substrate. The body includes a
substantially pointed or conical shaped cutting surface. The body
optionally includes one or more PCD segments coupled to and exposed
in the conical cutting surface.
[0017] A method of forming a PCD cutting elements coupled to a
cutting slug includes providing a canister or other container
configured to receive a plurality of thermally stable pre-sintered
polycrystalline diamond segments. The canister is filled with
grains of polycrystalline diamond and, optionally, a catalytic
material. The polycrystalline diamond segments are positioned upon
the grains of polycrystalline diamond such that an interfacial
boundary is formed from the grains of polycrystalline diamond to
separate each of the plurality of polycrystalline diamond segments.
A press than applies a temperature and a pressure to the container
to sinter the grains of polycrystalline diamond and bond the
polycrystalline diamond segments to the sintered grains of
polycrystalline diamond.
[0018] As used herein, "at least one," "one or more," and "and/or"
are open-ended expressions that are both conjunctive and
disjunctive in operation. For example, each of the expressions "at
least one of A, B and C," "at least one of A, B, or C," "one or
more of A, B, and C," "one or more of A, B, or C" and "A, B, and/or
C" means A alone, B alone, C alone, A and B together, A and C
together, B and C together, or A, B and C together.
[0019] Various embodiments of the present inventions are set forth
in the attached figures and in the Detailed Description as provided
herein and as embodied by the claims. It should be understood,
however, that this Summary does not contain all of the aspects and
embodiments of the one or more present inventions, is not meant to
be limiting or restrictive in any manner, and that the invention(s)
as disclosed herein is/are and will be understood by those of
ordinary skill in the art to encompass obvious improvements and
modifications thereto.
[0020] Additional advantages of the present invention will become
readily apparent from the following discussion, particularly when
taken together with the accompanying drawings.
BRIEF DESCRIPTION OF THE DRAWINGS
[0021] To further clarify the above and other advantages and
features of the one or more present inventions, reference to
specific embodiments thereof are illustrated in the appended
drawings. The drawings depict only exemplary embodiments and are
therefore not to be considered limiting. One or more embodiments
will be described and explained with additional specificity and
detail through the use of the accompanying drawings in which:
[0022] FIG. 1 is an isometric view of an embodiment of a PCD
compact cutting element;
[0023] FIG. 2 is a microscopic level view of an embodiment of a
granular structure of a PCD segment;
[0024] FIG. 3 is a microscopic level view of another embodiment of
a granular structure of a PCD segment;
[0025] FIG. 4 is an isometric view of an embodiment of a metallic
carbide disc for use in embodiments of methods of making a PCD
segment;
[0026] FIG. 5 is an isometric view of another embodiment of a
metallic carbide disc for use in embodiments of methods of making a
PCD segment;
[0027] FIG. 6A is a cross-sectional view of an embodiment of a
canister for use in embodiments of methods of making a PCD
segment;
[0028] FIG. 6B is a cross-sectional view of an embodiment of a
canister for use in embodiments of methods of making a PCD
compact;
[0029] FIG. 7 is an orthogonal view of an embodiment of a PCD
cutting element;
[0030] FIG. 8 is an orthogonal diagram of another embodiment of a
PCD cutting element;
[0031] FIG. 9 is an orthogonal diagram of another embodiment of a
PCD cutting element;
[0032] FIG. 10 is an orthogonal diagram of another embodiment of a
PCD cutting element;
[0033] FIG. 11 is an orthogonal diagram of another embodiment of a
PCD cutting element;
[0034] FIG. 12 is an orthogonal diagram of another embodiment of a
PCD cutting element;
[0035] FIG. 13 is an orthogonal diagram of another embodiment of a
PCD cutting element;
[0036] FIG. 14 is an orthogonal diagram of another embodiment of a
PCD cutting element;
[0037] FIG. 15 is a cross-sectional view of an embodiment of a PCD
cutting element;
[0038] FIG. 16 is a cross-sectional view of another embodiment of a
PCD cutting element;
[0039] FIG. 17 is a cross-sectional view of another embodiment of a
PCD cutting element;
[0040] FIG. 18 is a cross-sectional view of another embodiment of a
PCD cutting element;
[0041] FIG. 19 is a cross-sectional view of another embodiment of a
PCD cutting element;
[0042] FIG. 20 is a cross-sectional view of another embodiment of a
PCD cutting element;
[0043] FIG. 21 is an isometric view of an embodiment of a rotary
drag bit that includes an embodiment of a PCD compact cutting
element in a close-up view;
[0044] FIG. 22 is an isometric view of an embodiment of a PCD
compact cutting element that includes a transition layer with a
conical surface;
[0045] FIG. 23 is an isometric view of another embodiment of a
rotary drag bit that includes an embodiment of a PCD compact
cutting element that includes a conical surface in a close-up
view;
[0046] FIG. 24 is an orthogonal view of another embodiment of a PCD
cutting element;
[0047] FIG. 25 is an orthogonal view of another embodiment of a PCD
cutting element; and,
[0048] FIG. 26 is an orthogonal view of another embodiment of a PCD
cutting element;
[0049] The drawings are not necessarily to scale.
DETAILED DESCRIPTION
[0050] FIG. 1 shows an isometric view of an embodiment of a
polycrystalline diamond (PCD) compact 101. The PCD compact 101
includes a first table or layer 105 formed of a plurality of PCD
segments 110 that, optionally, are sintered and/or preformed, as
will be described in further detail below. The PCD segments 110
optionally are leached diamond, natural diamond, synthetic diamond,
highly pressurized diamond, calcium carbonate sintered diamond,
combinations thereof, and similar materials and for purposes of the
claims a PCD segment and/or polycrystalline diamond encompasses all
these materials and those that fall within the scope of this
disclosure. In addition, the PCD segments 110 optionally are
thermally stable as will be described in further detail below. In
the embodiment of the PCD compact 101 illustrated in FIG. 1, the
first layer 105 has a diameter of 130. Of course, one of skill in
the art will appreciate that the first layer 105 can optionally
have different dimensions and different shapes, including ovoid,
half-circle, square, and other such shapes, and that all of these
embodiments fall within the scope of the disclosure.
[0051] The plurality of PCD segments 110 are separated by an
interfacial boundary 150 between each of the plurality of PCD
segments 110. Optionally, the interfacial boundaries 150 comprises
an abrasive material selected from a group that includes, but is
not limited to, tungsten carbide, cubic boron nitride, thermally
stable polycrystalline diamond, polycrystalline diamond, and the
like. The interfacial boundaries 150 optionally are non-linear
and/or non-planar relative to adjacent PCD segments 110.
Optionally, the non-linear and/or non-planar quality of the
interfacial boundary 150 creates an interlocking feature--best seen
as interlocking feature 760 in FIG. 7 and interlocking feature 960
in FIG. 9--between the diamond segments 110, thereby reducing the
likelihood that adjacent PCD segments 110 will move relative to
each other and, therefore, reducing the likelihood of a PCD segment
110 being torn and/or damaged and/or removed undesirably from the
PCD compact 101 during use.
[0052] The PCD compact 101 also includes a second table or layer
115, also referred to as a transition layer 115. The PCD segments
110 are positioned upon and bonded to the second layer 115. The
second layer 115 optionally comprises an abrasive material selected
from a group that includes, but is not limited to, tungsten
carbide, cubic boron nitride, thermally stable polycrystalline
diamond, polycrystalline diamond, and the like. The embodiment of
the PCD compact 101 illustrates a second layer 115 that includes
sintered PCD grains 120 that is optionally interspersed with a
metallic catalyst. Optionally, the second layer 115 is contiguous
with and comprises the same material as the interfacial boundary
150. In the embodiment of the PCD compact 101 illustrated in FIG.
1, the second layer 115 has a diameter of 135 that is the same,
within manufacturing tolerances, as the diameter 130 of the first
layer 105. Of course, one of skill in the art will appreciate that
the second layer 115 can optionally have different dimensions and
different shapes, including ovoid, half-circle, square, and other
such shapes, including dimensions and shapes different from the
first layer 105, and that all of these embodiments fall within the
scope of the disclosure.
[0053] The second table 115 is bonded to a substrate 125 made from,
for example, a metallic material. For example, the substrate 125
can be made from a metallic material selected from the group that
includes, but is not limited to, tungsten carbide, titanium
carbide, tungsten molybdenum carbide, tantalum carbide,
combinations thereof, and other similar materials. In the
embodiment of the PCD compact 101 illustrated in FIG. 1, the
substrate 125 has a diameter of 140 that is the same, within
manufacturing tolerances, as the diameter 130 of the first layer
105 and the diameter 135 of the second layer 115. Of course, one of
skill in the art will appreciate that the substrate 125 can
optionally have different dimensions and different shapes,
including ovoid, half-circle, square, and other such shapes,
including dimensions and shapes different from the first layer 105
and/or the second layer 115, and that all of these embodiments fall
within the scope of the disclosure.
[0054] As noted, the PCD segments 110 typically are formed by
sintering powdered diamond, and, optionally, various catalysts,
typically metallic powders mixed with the diamond powder. The
catalysts, typically metallic materials, such as cobalt and other
similar metallic materials, act as a catalyst to reduce the
temperature and/or the pressure at which the sintering process
occurs and/or speeds the reaction by which the diamond grains and
any other materials crystallize and form a granular structure. The
diamond powder and any catalysts and/or other materials are placed
in a canister or form that is compressed under a pressure and a
temperature sufficient to sinter and crystallize the diamond powder
and any other materials into a solid PCD segment.
[0055] Referring to FIG. 3, a sintered PCD granular structure 300
comprises polycrystalline diamond grains or crystals 301 and a
catalyzing material 310 dispersed between the polycrystalline
diamond grains or crystals 301. Optionally, the catalyzing material
310 is selected from a group of metallic materials, including, but
not limited to, cobalt, nickel, iron, ruthenium, rhodium,
palladium, platinum, chromium, manganese, tantalum, osmium,
iridium, and combinations thereof.
[0056] Cobalt and other catalysts, however, typically result in a
PCD granular structure that typically suffers from thermal
degradation at temperatures (typically around from about 650
degrees Celsius to about 700 degrees Celsius) that the PCD granular
structure can be exposed to during normal use. That is, the PCD
granular structure exhibits increased tendencies to fail, crack,
chip, delaminate, or otherwise wear more quickly during use at
normal operating temperatures, leading to premature wear and
reduced life.
[0057] To address the side-effect the catalysts 310 have on the
thermal stability of the PCD granular structure 300, the PCD
segments (such as segments 110 in FIG. 1) are processed after they
have been sintered to reduce the amount of catalyst 310 present in
the PCD granular structure 300 or remove the catalyst 310, either
from the entire PCD segment or at least to a depth at which the PCD
segment is heated through the transfer of heat generated during use
less than the temperature at which the PCD granular structure
begins to exhibit decreased thermal stability. Typically, the
catalysts are removed via leaching and/or acid etching with acids
that react with the catalysts and/or other known methods, leaving a
PCD segment that is said to be thermally stable, typically referred
to as thermally stable polycrystalline (TSP).
[0058] Illustrated in FIG. 2 is an idealized microscopic level view
of a sintered PCD granular structure 200 that has been processed to
remove the catalyst (e.g., catalyst 220 in FIG. 3), thereby leaving
voids 220 and PCD grains 201, as discussed above. That is, the
thermally stable PCD segments 110 of FIG. 1 optionally have been
processed in such a way to improve the thermal stability of the PCD
segments 110 relative to PCD segments that have not undergone such
processing. Improved thermal stability means that the diamond
segments remain stable, e.g., do not exhibit increased tendencies
to fail, crack, chip, delaminate, or otherwise wear more quickly
during use at higher temperatures than these failure modes would
otherwise manifest themselves.
[0059] The PCD grains 201 typically are submicron in size,
providing dimensional context for the FIGS. 2 and 3, typically from
about 1 micron to about 50 microns and, more preferably, from about
5 microns to about 35 microns and, more preferably still, from
about 7 microns to about 25 microns. In some embodiments, the PCD
granular structure is processed to provide PCD grains 201 large
enough such that the PCD grains 201 do not easily oxidize and burn
up when subjected to the heat caused by friction during use.
[0060] Optionally, the PCD granular structure 200 is then subjected
to additional processing, such as another sintering process (i.e.,
double sintering) to cause the PCD grains 201 to grow and expand
into the interstices or voids 220, leaving PCD granular structure
that is substantially diamond dense. That is, the PCD granular
structure 200 comprises at least 90% PCD grains 201.
[0061] In other embodiments, the PCD granular structure 200 is
sintered while in contact with non-catalytic materials, i.e., those
materials that typically do not catalyze or cause the PCD granular
structure to change crystal structure (e.g., from diamond to
graphite) and/or lower the temperature at which the PCD granular
structure 200 and PCD grains 201 begin to become thermally
unstable. For example, a non-metallic catalyst 210 that is
thermally stable, e.g., one having a coefficient of thermal
expansion similar to that of the PCD grains 201 can be placed in
contact with the PCD granular structure 201 during the sintering
process, thereby causing the non-metallic catalyst 210 to
infiltrate and/or grow within one or more of the interstices or
voids 220. The non-metallic catalyst 210 can be selected from a
group that includes, but is not limited to, silicon, silicon
carbide, boron, carbonates, hydroxide, hydride, hydrate,
phosphorus-oxide, phosphoric acid, carbonate, lanthanide, actinide,
phosphate hydrate, hydrogen phosphate, phosphorus carbonate,
combinations thereof, and other similar materials.
[0062] In yet other embodiments, the PCD granular structure 200 is
sintered with one or more thermally stable materials 215,
including, but not limited to, cobalt silicide, titanium, niobium,
molybdenum, tungsten, tantalum, combinations thereof, and other
similar materials. A benefit of these thermally stable materials
215 is that they tend to act to make the PCD granular structure 200
less brittle under impact loads.
[0063] Prior art PCD compacts typically had a PCD segment bonded
directly to a substrate. This arrangement caused difficulties
during manufacturing and use because, among other problems, the
coefficient of thermal expansion differed, sometimes greatly,
between the substrate and the PCD segment. During manufacturing, in
which the PCD segment was to be bonded to the substrate, the
different rates of thermal expansion often resulted in PCD segments
that cracked due to the thermal stresses created at the interface
of the substrate and the PCD segment as the substrate and PCD
segment expanded and contracted at different rates while heating
and cooling. Similar results occurred during use in which the PCD
segment would be subjected to direct heating caused by friction,
whereas the substrate is heated primarily through heat transferred
by conduction through the PCD segment and to the substrate.
[0064] A benefit of the second layer or transition layer 115 is
that it solves the previously unresolved problem of bonding a PCD
segment to a substrate that has a different coefficient of thermal
expansion. That is, embodiments of PCD compacts of the invention
have improved thermal stability, improved bonding of the PCD
segments to a substrate, improved reliability, and other benefits
as described herein and one having skill in the art will understand
by reading the disclosure.
[0065] Embodiments of methods of making first the PCD segments 110
are first discussed. As noted above, PCD segments 110 are formed by
sintering diamond powder or other similar material and, optionally,
a catalyst. Illustrated in FIGS. 4 and 5 are discs 405, 410, that
are provided. The discs 405, 410 optionally formed of a metallic
carbide, such as those materials discussed above. The discs 405 and
410 are used to shape the PCD segments 110. The discs 405, 410
include one or more areas 415 in which the PCD segments 110 are
formed, the areas 415 being separated by one or more ribs 420 on a
front surface 409 of the discs 405, 410. The ribs 420 may be
straight, non-liner, curvilinear, non-planar, combinations thereof,
and the like. (It should be noted that shape and location of the
ribs 420 is a mirror of the shape and location of the interfacial
boundary 150 of the PCD compact 101 discussed above. Thus, the ribs
420 can optionally be of any shape and any dimension contemplated
for the interfacial boundaries.) In addition, the ribs 420 separate
the PCD segments 110 from coming into contact with each other
during the manufacturing process.
[0066] Embodiments of the method making PCD include providing a
canister or can 601 as seen in FIG. 6A. At least one disc or a
first disc 405 is placed within the canister 601 and each area 415
of the disc 405 is filled with, for example, diamond powder 650
(and any catalysts and other materials, which are considered
present in the discussion of the diamond powder 650), as discussed
above, that will be sintered to form the PCD segment 110, as
discussed above. In those instances in which a plurality of discs
405 are placed into the canister 601 so as to form a plurality of
PCD segments 110, optionally another disc 630 separates each disc
405 from the diamond powder 650 proximate to a back surface 407 of
each disc 405. The disc 630 optionally is made of niobium and/or
similar such materials, which prevents, at least to some degree,
the flow of diamond powder 650 and the growth of crystallized
diamond grains into the back surface 407 of the disc 405 during
sintering. The number of discs 405 positioned in the canister 601
and, consequently, the number of PCD segments 110 produced, is a
function, in part, of the thickness 655 of the layer of diamond
powder 650 and the thickness 408 of the discs 405. Of course, the
thickness 655 of the diamond powder 650 and the thickness 408 of
the disc 405 optionally can be varied in the same canister 601,
thus producing PCD segments of different dimensions in one
manufacturing batch. Further, as one having skill in the art will
appreciate, the quantity of PCD segments 110 produced is a
function, in part, on the configuration and number of ribs 420 on
each disc 405. Further, different discs 405 with different
configurations of ribs 420 can be used in a given canister 601,
thus further affecting the yield of PCD segments 110.
[0067] Prior to placing the lid 660 on the canister 601 and sealing
the canister 601, the diamond powder 650 may be tamped down or
compacted with an applied pressure low enough to avoid breakage of
any of the discs 405 and 630. Optionally, the canister 650 is
heated to reduce or eliminate some or all of any impurities present
in the diamond powder 650 and elsewhere in the canister 601 before
sealing the canister 601. Typically, the lid 660 is sealed to the
canister 601 through welding, such as laser welding and other known
methods. In some embodiments of the present invention, the canister
is sealed using a process described in U.S. Pat. No. 7,575,425 to
Hall et al., which is herein incorporated by reference for all that
it contains.
[0068] After the canister 601 is sealed, it is placed within a salt
form (not shown). One or more salt forms are then stacked and
placed on an anvil of a high-temperature, high-pressure press (not
shown). The press applies a pressure and a temperature sufficiently
high to cause the diamond powder 650 (and any catalysts and other
materials) to sinter. During the sintering process, the diamond
powder 650 typically reduces in volume as it becomes solid.
[0069] Once the sintering process is complete and the canister 601
is removed from both the press and the salt form, the diamond
powder 650 will have become the sintered PCD segments 110. An
advantage of the ribs 420 of the discs 405 is that the separate PCD
segments 110 are easily separable from the discs 420, thus
eliminating a step of cutting the PCD segments 110 out a solid
cylinder of polycrystalline diamond with an electron discharge
machining (EDM), a process that typically is time consuming and
expensive. The separated PCD segments 110 are now ready for any
post-sintering treatment such as leaching and/or acid baths, and
other such treatments to improve the thermal stability of the PCD
segments 110 as discussed above.
[0070] Embodiments of the method further include forming PCD
compacts, such as those illustrated in FIG. 1, to combine PCD
segments 110 with an unsintered abrasive powder or material that
will form the second or transition layer 115 and a substrate 125.
One or more PCD segments 2610 are placed in a canister 2601,
similar to the canister 601, as illustrated in FIG. 6B. Unsintered
abrasive material 2620, such as diamond powder, by way of example,
is placed in the canister in between--at the interfacial boundary
2650--and on top of the PCD segments 2610 that typically have been
processed to improve the thermal stability of the PCD segments
2610, as discussed above. As noted above, the unsintered abrasive
material optionally includes metallic catalysts and/or non-metallic
catalysts and/or other thermally stable materials as discussed
above.
[0071] The substrate 2625 is placed on top of the unsintered
abrasive material 2620. Prior to placing the lid 2660 on the
canister 2601 and sealing the canister 2601, the unsintered
abrasive material 2620 may be tamped down or compacted with an
applied pressure low enough to avoid breakage of any of the PCD
segments 2610. Optionally, the canister 2601 is heated to reduce or
eliminate some or all of any impurities present in the unsintered
abrasive material 2620 and elsewhere in the canister 2601 before
sealing the canister 2601. Typically, the lid 2660 is sealed to the
canister 2601 through welding, such as laser welding and other
known methods. In some embodiments of the present invention, the
canister is sealed using a process described in U.S. Pat. No.
7,575,425 to Hall et al. After the canister 2601 is sealed, it is
placed within a salt form (not shown). One or more salt forms are
then stacked and placed on an anvil of a high-temperature,
high-pressure press (not shown). The press applies a pressure and a
temperature sufficiently high to cause the unsintered abrasive
material 2620 (and any catalysts and other materials) to sinter.
During the sintering process, the abrasive material 2620 typically
reduces in volume as it becomes solid. In addition, the PCD
segments 2610 undergo a second, or double, sintering process, by
which the PCD grains grow and/or other non-metallic catalysts
and/or other thermally stable materials are incorporated and
sintered into the PCD segments as discussed above.
[0072] During the sintering process, the abrasive material 2620
forms both a mechanical and a chemical bond or attachment with the
PCD segments 2610 at the interfacial boundary 2650 and at a lower
surface 2611. For example, the PCD segments 2610 would exhibit, in
part, growth of PCD grains 201 (FIG. 2) into the interstices and
voids 220 (FIG. 2) across and into a transition zone 2621 of the
now sintered abrasive material 2620. In so doing, a solid, rigid
diamond layer at the transition zone 2621 forms a mechanical bond
between the sintered layer of abrasive material 2620 and the PCD
segments 2610, reducing any residual stress concentrations that may
otherwise occur. Further, the abrasive material 2620 may reduce in
volume as it sinters, provided further space into which PCD grains
may grow during the sintering process, further improving the
mechanical bond. It should be noted that while the grain size of
the PCD grains and the sintered abrasive material can vary
substantially, a grain size that is similar between the PCD grains
and the sintered abrasive material can improve and provide a more
uniform bond between the two materials as compared to the bond that
occurs when the grain sizes are dissimilar.
[0073] Another benefit is that whereas the PCD segments
2610--typically processed to be thermally stable--and the substrate
2625 typically have coefficients of thermal expansion that are
quite different, as discussed above, the layer of sintered abrasive
material 2620 acts as a transition layer, and is typically selected
and prepared to have a coefficient of thermal expansion somewhere
between that of the PCD segments 2610 and the substrate 2625. In so
doing, the gradient of thermal stresses is changed gradually
throughout the PCD compact rather than having a sharp transition at
each interface. That is, a first layer of PCD segments 2610 is
configured to remain thermally stable at a first temperature and a
second layer or transition layer 2620 is configured to remain
thermally stable at a second temperature lower than the first
temperature.
[0074] Disclosed in FIGS. 7-14 are various, non-limiting
embodiments of PCD compacts comprising PCD segments of various
shapes and the interfacial boundaries between each PCD segment.
[0075] For example, the PCD compact 710 includes two PCD segments
710 and a single interfacial boundary 750 that is non-linear and
non-planar and includes interlocking features 760, such as the
illustrated dimples.
[0076] As illustrated in FIGS. 7-14, the PCD segments 710, 810,
910, 1010, 1110, 1210, 1310, and 1410 can be a variety of shapes,
including, but not limited to, circular, square, hexagonal or a
polygonal working surface. The PCD segments 710, 810, 910, 1010,
1110, 1210, 1310, and 1410 can be arranged symmetrically or
asymmetrically around the PCD compacts 701, 801, 901, 1001, 1101,
1201, 1301, and 1401. Further, the PCD segments can be oriented
relative to the direction of work so that the PCD segments perform
the majority of the work as compared to the abrasive material.
[0077] As noted, the interfacial boundaries 750, 950, and others
can include comprise interlocking features. The interfacial
boundaries 950 includes a series of steps 960. The interlocking
features 750, 850, 950, 1050, 1150, 1250, 1350, and 1450 optionally
include also comprise complementary projections and recesses. For
example, PCD compact 1201 in FIG. 12 includes a PCD segment 1210
that has a interfacial boundary 1250 that is a plurality of oval
openings.
[0078] Disclosed in FIGS. 15-20 are cross-sections of various,
non-limiting embodiments of PCD compacts 1501, 1601, 1701, 1801,
1901, and 2001. Each of the PCD compacts 1501, 1601, 1701, 1801,
1901, and 2001 include a plurality of PCD segments 1510, 1610,
1710, 1810, 1910, and 2010, respectively, with an interfacial
boundary 1550, 1650, 1750, 1850, 1950, and 2050 separating them,
respectively. The transition layers 1515, 1615, 1715, 1815, 1925,
and 2015 are bonded at lower surface 1511, 1611, 1711, 1811, 1911,
and 2011 to the PCD segments 1510, 1610, 1710, 1810, 1910, and
2010. Likewise, the transition layers 1515, 1615, 1715, 1815, 1925,
and 2015 are bonded at upper surfaces 1524, 1624, 1724, 1824, 1924
and 2024 to the substrates 1525, 1625, 1725, 1825, 1925, and 2025,
respectively. The lower surfaces 1511, 1611, 1711, 1811, 1911, and
2011 and the upper surfaces 1524, 1624, 1724, 1824, 1924 and 2024
optionally are non-linear and/or non-planar and/or include
interlocking features, such as protrusions and steps.
[0079] FIG. 21 shows an embodiment of a drag bit 2800 that includes
a plurality of PCD compacts or shear cutters 2801 as described
above. The shear cutters 2801 are attached to blades 2880 that each
extend from a head 2890 of the drag bit 2800 for cutting against
the subterranean formation being drilled.
[0080] FIG. 22 discloses an embodiment of a PCD compact or pointed
cutting element 3101 that includes PCD segments 3110 arranged about
the PCD compact or cutting element 3101. The PCD segments 3110 can
be arranged symmetrically or asymmetrically about the PCD compact
3101 as required for a particular application. A sintered abrasive
material 3120 having a conical surface 3123 supports the PCD
segments 3110 that, in turn, is supported by a substrate 3125.
[0081] FIG. 23 shows an embodiment of another drag bit 3100 that
includes a plurality of pointed PCD compacts or cutting elements
3101. The PCD compacts 3101 may be pressed or machined into the
desired shape or configuration. In other embodiments, the PCD
compact 3101 may be used in road milling, pavement resurfacing,
mining, and trenching applications.
[0082] Disclosed in FIGS. 24-26 are various, non-limiting
embodiments of arrangements of the PCD segments 2410, 2510, and
2710 around conical or pointed PCD compacts 2401, 2501, and 2701,
that are analogous to the PCD segments 3110 and the conical PCD
compacts 3101 in FIGS. 22 and 23. The PCD segments 2410, 2510, and
2710 can be of various shapes and sizes, non-limiting examples of
which include, but are not limited to, rectangular, trapezoidal,
square, hexagonal or triangular shape and disposed within or
exposed in the conical surface, such as conical surface 3123 in
FIG. 22, as noted. The interfacial boundaries 2450, 2550, and 2750
can be formed of a sintered abrasive material.
[0083] Whereas the present invention has been described in
particular relation to the drawings attached hereto, it should be
understood that other and further modifications apart from those
shown or suggested herein, may be made within the scope and spirit
of the present invention.
[0084] The present invention, in various embodiments, includes
providing devices and processes in the absence of items not
depicted and/or described herein or in various embodiments hereof,
including in the absence of such items as may have been used in
previous devices or processes, e.g., for improving performance,
achieving ease and/or reducing cost of implementation.
[0085] The foregoing discussion of the invention has been presented
for purposes of illustration and description. The foregoing is not
intended to limit the invention to the form or forms disclosed
herein. In the foregoing Detailed Description for example, various
features of the invention are grouped together in one or more
embodiments for the purpose of streamlining the disclosure. This
method of disclosure is not to be interpreted as reflecting an
intention that the claimed invention requires more features than
are expressly recited in each claim. Rather, as the following
claims reflect, inventive aspects lie in less than all features of
a single foregoing disclosed embodiment. Thus, the following claims
are hereby incorporated into this Detailed Description, with each
claim standing on its own as a separate preferred embodiment of the
invention.
[0086] Moreover, though the description of the invention has
included description of one or more embodiments and certain
variations and modifications, other variations and modifications
are within the scope of the invention, e.g., as may be within the
skill and knowledge of those in the art, after understanding the
present disclosure. It is intended to obtain rights which include
alternative embodiments to the extent permitted, including
alternate, interchangeable and/or equivalent structures, functions,
ranges or steps to those claimed, whether or not such alternate,
interchangeable and/or equivalent structures, functions, ranges or
steps are disclosed herein, and without intending to publicly
dedicate any patentable subject matter.
* * * * *