U.S. patent application number 11/991796 was filed with the patent office on 2010-09-16 for substrate for biochip, biochip, method for manufacturing substrate for biochip and method for manufacturing biochip.
This patent application is currently assigned to YAMATAKE CORPORATION. Invention is credited to Yasuhiro Goshoo, Yasuko Horiguchi, Naohiro Ishikawa, Takaaki Kuroiwa, Daisuke Obara, Kazuko Sasaki, Shinsuke Yamasaki.
Application Number | 20100233429 11/991796 |
Document ID | / |
Family ID | 37864835 |
Filed Date | 2010-09-16 |
United States Patent
Application |
20100233429 |
Kind Code |
A1 |
Goshoo; Yasuhiro ; et
al. |
September 16, 2010 |
Substrate for Biochip, Biochip, Method for Manufacturing Substrate
for Biochip and Method for Manufacturing Biochip
Abstract
A base plate having a surface on which a plurality of hydroxyl
groups can be introduced, a metallic membrane disposed on the base
plate and having a plurality of wells reaching the base plate, and
a crosslinkable polymer membrane disposed on the metallic membrane
are included.
Inventors: |
Goshoo; Yasuhiro; (Tokyo,
JP) ; Kuroiwa; Takaaki; (Tokyo, JP) ;
Ishikawa; Naohiro; (Tokyo, JP) ; Obara; Daisuke;
(Tokyo, JP) ; Yamasaki; Shinsuke; (Tokyo, JP)
; Sasaki; Kazuko; (Tokyo, JP) ; Horiguchi;
Yasuko; (Tokyo, JP) |
Correspondence
Address: |
THE NATH LAW GROUP
112 South West Street
Alexandria
VA
22314
US
|
Assignee: |
YAMATAKE CORPORATION
Tokyo
JP
|
Family ID: |
37864835 |
Appl. No.: |
11/991796 |
Filed: |
September 6, 2006 |
PCT Filed: |
September 6, 2006 |
PCT NO: |
PCT/JP2006/317634 |
371 Date: |
March 11, 2008 |
Current U.S.
Class: |
428/138 ; 216/49;
428/417; 428/418 |
Current CPC
Class: |
G01N 33/54393 20130101;
Y10T 428/31525 20150401; Y10T 428/24331 20150115; B01L 3/5025
20130101; Y10T 428/31529 20150401; G01N 33/54353 20130101; B01L
2300/0636 20130101; G01N 33/54386 20130101 |
Class at
Publication: |
428/138 ;
428/418; 428/417; 216/49 |
International
Class: |
B32B 3/10 20060101
B32B003/10; B32B 27/38 20060101 B32B027/38; B32B 17/10 20060101
B32B017/10; B44C 1/22 20060101 B44C001/22 |
Foreign Application Data
Date |
Code |
Application Number |
Sep 16, 2005 |
JP |
2005-270252 |
Sep 26, 2005 |
JP |
2005-277963 |
Claims
1. A substrate for a biochip comprising: a base plate having a
surface on which a plurality of hydroxyl groups can be introduced;
a metallic membrane disposed on the base plate and having a
plurality of wells reaching the base plate; and a crosslinkable
polymer membrane disposed on the metallic membrane.
2. The substrate for the biochip of claim 1, wherein the base plate
is composed of a silicon oxide.
3. The substrate for the biochip of claim 1, wherein the metallic
membrane is composed of a Titan.
4. The substrate for the biochip of claim 1, wherein the metallic
membrane is composed of a transition metallic oxide.
5. The substrate for the biochip of claim 1, wherein the metallic
membrane is composed of a transition metal nitride.
6. The substrate for the biochip of claim 1, wherein the metallic
membrane is composed of a transition metal carbide.
7. The substrate for the biochip of claim 1, wherein the polymer
membrane is insoluble in an acid solution.
8. The substrate for the biochip of claim 1, wherein the polymer
membrane has a photosensitivity.
9. The substrate for the biochip of claim 1, wherein the polymer
membrane is composed of an epoxy resin.
10. The substrate for the biochip of claim 1, wherein the polymer
membrane is composed of SU8.
11. A biochip comprising: a base plate; a metallic membrane
disposed on the base plate and having a plurality of wells reaching
the base plate; and a plurality of probe biomolecules bonded on a
surface of the base plate exposed from the plurality of wells.
12. The biochip of claim 11, wherein the base plate is composed of
a silicon oxide.
13. The biochip of claim 11, wherein the metallic membrane is
composed of a Titan.
14. The biochip of claim 12, wherein the metallic membrane is
composed of a transition metallic oxide.
15. The biochip of claim 12, wherein the metallic membrane is
composed of a transition metal nitride.
16. The biochip of claim 11, wherein the metallic membrane is
composed of a transition metal carbide.
17. The biochip of claim 16, wherein the plurality of probe
biomolecules are bonded to the surface via a plurality of hydroxyl
groups introduced on the surface.
18. A method for manufacturing a substrate for a biochip including:
a step for preparing a base plate having a surface on which a
plurality of hydroxyl groups can be introduced; a step for forming
a metallic membrane on the base plate; a step for forming a
crosslinkable polymer membrane on the metallic membrane; a step for
selectively removing portions of the polymer membrane; and a step
for delineating a plurality of wells reaching the base plate in the
metallic membrane, by using the polymer membrane of which the
portions were selectively removed as an etching mask.
19. The method for manufacturing the substrate for the biochip of
claim 18, wherein the metallic membrane is composed of a Titan.
20. The method for manufacturing the substrate for the biochip of
claim 18, wherein the metallic membrane is composed of a transition
metallic oxide.
21. The method for manufacturing the substrate for the biochip of
claim 18, wherein the metallic membrane is composed of a transition
metal nitride.
22. The method for manufacturing the substrate for the biochip of
claim 18, wherein the metallic membrane is composed of a transition
metal carbide.
23. The method for manufacturing the substrate for the biochip of
claim 22, wherein the polymer membrane is composed of an epoxy
resin.
24. The method for manufacturing the substrate for the biochip of
claim 18, wherein the polymer membrane is composed of SU8.
25. A method for manufacturing a biochip including: a step for
preparing a base plate; a step for forming a metallic membrane on
the base plate; a step for forming a crosslinkable polymer membrane
on the metallic membrane; a step for selectively removing portions
of the polymer membrane; a step for delineating a plurality of
wells reaching the base plate in the metallic membrane, by using
the polymer membrane of which the portions were selectively removed
as an etching mask; a step for introducing a plurality of hydroxyl
groups on a surface of the base plate exposed from the plurality of
wells; a step for bonding a plurality of probe biomolecules to the
plurality of hydroxyl groups, respectively; and a step for soaking
the metallic membrane and the polymer membrane in an alkaline
solution to peel off the polymer membrane from the metallic
membrane.
26. A method for manufacturing a biochip including: a step for
preparing a substrate for the biochip comprising a base plate, a
metallic membrane disposed on the base plate and having a plurality
of wells reaching the base plate, a crosslinkable polymer membrane
disposed on the metallic membrane, and a plurality of hydroxyl
groups introduced on a surface of the base plate exposed from the
plurality of wells; a step for bonding a plurality of probe
biomolecules to the plurality of hydroxyl groups, respectively; and
a step for soaking the metallic membrane and the polymer membrane
in an alkaline solution to peel off the polymer membrane from the
metallic membrane.
27. The method for manufacturing the biochip of claim 25, wherein
the base plate is composed of a silicon oxide.
28. The method for manufacturing the biochip of claim 26, wherein
the metallic membrane is composed of a Titan.
29. The method for manufacturing the biochip of claim 27, wherein
the metallic membrane is composed of a transition metallic
oxide.
30. The method for manufacturing the biochip of claim 25, wherein
the metallic membrane is composed of a transition metal
nitride.
31. The method for manufacturing the biochip of claim 26, wherein
the metallic membrane is composed of a transition metal
carbide.
32. The method for manufacturing the biochip of claim 25, wherein
the polymer membrane is composed of an epoxy resin.
33. The method for manufacturing the biochip of claim 31, wherein
the polymer membrane is composed of SU8.
34. The method for manufacturing the biochip of claim 25, further
including a step for deprotecting amino groups included in the
plurality of probe biomolecules by the alkaline solution.
35. The method for manufacturing the biochip of claim 34, wherein
the step for peeling off the polymer membrane from the metallic
membrane includes a step for blowing the polymer membrane with an
air.
36. A substrate for a biochip comprising: a base plate having a
surface on which a plurality of hydroxyl groups can be introduced;
and a cover member disposed on the base plate when probe
biomolecules are bonded to the plurality of hydroxyl groups,
respectively, the cover member having a plurality of through holes
to define binding regions where the probe biomolecules are bonded
to the surface of the base plate.
37. A biochip comprising: an optical transparency base plate; a
light shielding film disposed on the base plate and having a
plurality of through holes reaching the base plate; and a plurality
of probe biomolecules bonded to the base plate exposed from each of
the plurality of through holes.
38. The biochip of claim 37, wherein a plurality of wells that open
to the plurality of through holes are delineated in the base
plate.
39. A biochip comprising: an optical transparency base plate; a
light shielding film disposed on a first surface of the base plate
and having a plurality of through holes reaching the first surface;
and a plurality of probe biomolecules bonded to a second surface of
the base plate opposite to the first surface of the base plate.
40. The biochip of claim 39, wherein the base plate is composed of
a silicon oxide.
41. The biochip of claim 39, wherein the plurality of probe
biomolecules are bonded to the base plate via a plurality of
hydroxyl groups introduced on the base plate.
42. A biochip comprising: an optical transparency base member; a
plurality of probe biomolecules bonded on the base member; and a
light shielding member disposed around the base member.
43. The biochip of claim 42, wherein the base member is composed of
a silicon oxide.
44. The biochip of claim 42, wherein the plurality of probe
biomolecules are bonded to the base member via a plurality of
hydroxyl groups introduced on the base member.
Description
TECHNICAL FIELD
[0001] This invention relates to a technique for detecting a
biomolecule, especially to a substrate for a biochip, the biochip,
a method for manufacturing the substrate for the biochip, and a
method for manufacturing the biochip.
BACKGROUND ART
[0002] "Biochip" is the generic term for devices in which probe
biomolecules that react with to-be-detected target biomolecules in
a specific manner are fixed at predetermined positions on a chip
surface. A deoxyribonucleic acid (DNA) chip that is a typical
example of the biochip is used to detect the types and amounts of
target DNA included in blood or cell extract. The DNA chip has, for
example, a structure in which thousands to tens of thousands of
types of probe DNA, each being single-chain DNA having a known
sequence, are arranged in an array on a substrate such as a glass
slide.
[0003] When a to-be-examined liquid containing fluorescence-marked
target DNA is supplied to the DNA chip, only the target DNA which
has sequences complementary to the sequences of the probe DNA is
bonded to the probe DNA by hydrogen-bonding to form a complementary
double chain. As a result, the parts to which the target DNA is
fixed is fluorescent-colored. By measuring the position and
coloring intensity of the fluorescent-colored parts on the chip,
the types and amounts of the target DNA can be detected. Therefore,
as described in a published Japanese translations of PCT
international publication for patent applications 2002-537869, when
the DNA chip is manufactured, the probe DNA having a predetermined
sequence should be fixed only on a predetermined portion on a
surface of the substrate. However, it is difficult to fix the probe
DNA only in the specific location. Therefore, the target DNA bonded
to the probe DNA fixed in location other than the specific location
becomes background noise in a detection process. It becomes a
factor to decrease a detection accuracy of the DNA chip.
DISCLOSURE OF INVENTION
[0004] By a first aspect of present invention, a substrate for a
biochip comprising a base plate having a surface on which a
plurality of hydroxyl groups can be introduced, a metallic membrane
disposed on the base plate and having a plurality of wells reaching
the base plate, and a crosslinkable polymer membrane disposed on
the metallic membrane is provided.
[0005] By a second aspect of present invention, a biochip
comprising a base plate, a metallic membrane disposed on the base
plate and having a plurality of wells reaching the base plate, and
a plurality of probe biomolecules bonded on a surface of the base
plate exposed from the plurality of wells, is provided.
[0006] By a third aspect of present invention, a method for
manufacturing a substrate for a biochip including a step for
preparing a base plate having a surface on which a plurality of
hydroxyl groups can be introduced, a step for forming a metallic
membrane on the base plate, a step for forming a crosslinkable
polymer membrane on the metallic membrane, a step for selectively
removing portions of the polymer membrane, and a step for
delineating a plurality of wells reaching the base plate in the
metallic membrane, by using the polymer membrane of which the
portions were selectively removed as an etching mask is
provided.
[0007] By a fourth aspect of present invention, a method for
manufacturing a biochip including a step for preparing a base
plate, a step for forming a metallic membrane on the base plate, a
step for forming a crosslinkable polymer membrane on the metallic
membrane, a step for selectively removing portions of the polymer
membrane, a step for delineating a plurality of wells reaching the
base plate in the metallic membrane, by using the polymer membrane
of which the portions were selectively removed as an etching mask,
a step for introducing a plurality of hydroxyl groups on a surface
of the base plate exposed from the plurality of wells, a step for
bonding a plurality of probe biomolecules to the plurality of
hydroxyl groups, respectively, and a step for soaking the metallic
membrane and the polymer membrane in an alkaline solution to peel
off the polymer membrane from the metallic membrane is
provided.
[0008] By a fifth aspect of present invention, a method for
manufacturing a biochip including a step for preparing a substrate
for the biochip comprising a base plate, a metallic membrane
disposed on the base plate and having a plurality of wells reaching
the base plate, a crosslinkable polymer membrane disposed on the
metallic membrane, and a plurality of hydroxyl groups introduced on
a surface of the base plate exposed from the plurality of wells, a
step for bonding a plurality of probe biomolecules to the plurality
of hydroxyl groups, respectively, and a step for soaking the
metallic membrane and the polymer membrane in an alkaline solution
to peel off the polymer membrane from the metallic membrane is
provided.
[0009] By a sixth aspect of present invention, a substrate for a
biochip comprising a base plate having a surface on which a
plurality of hydroxyl groups can be introduced, and a cover member
disposed on the base plate when probe biomolecules are bonded to
the plurality of hydroxyl groups, respectively, the cover member
having a plurality of through holes to define binding regions where
the probe biomolecules are bonded to the surface of the base plate,
is provided.
[0010] By a seventh aspect of present invention, a biochip
comprising an optical transparency base plate, a light shielding
film disposed on the base plate and having a plurality of through
holes reaching the base plate, and a plurality of probe
biomolecules bonded to the base plate exposed from each of the
plurality of through holes is provided.
[0011] By an eighth aspect of present invention, a biochip
comprising an optical transparency base plate, a light shielding
film disposed on a first surface of the base plate and having a
plurality of through holes reaching the first surface, and a
plurality of probe biomolecules bonded to a second surface of the
base plate opposite to the first surface of the base plate is
provided.
[0012] By a ninth aspect of present invention, a biochip comprising
an optical transparency base member, a plurality of probe
biomolecules bonded on the base member, and a light shielding
member disposed around the base member is provided.
BRIEF DESCRIPTION OF DRAWINGS
[0013] FIG. 1 shows a top view of a substrate for a biochip
according to a first embodiment of the present invention.
[0014] FIG. 2 shows a sectional view of the substrate for the
biochip according to the first embodiment of the present
invention.
[0015] FIG. 3 shows chemical formulas of compositions of polymer
membrane according to the first embodiment of the present
invention.
[0016] FIG. 4 shows a first sectional process drawing of the
substrate for the biochip according to the first embodiment of the
present invention.
[0017] FIG. 5 shows a second sectional process drawing of the
substrate for the biochip according to the first embodiment of the
present invention.
[0018] FIG. 6 shows a third sectional process drawing of the
substrate for the biochip according to the first embodiment of the
present invention.
[0019] FIG. 7 shows a top view of a biochip according to a second
embodiment of the present invention.
[0020] FIG. 8 shows a first sectional view of the biochip according
to the second embodiment of the present invention.
[0021] FIG. 9 shows an first enlarged sectional view of the biochip
according to the second embodiment of the present invention.
[0022] FIG. 10 shows a second sectional view of the biochip
according to the second embodiment of the present invention.
[0023] FIG. 11 shows a second enlarged sectional view of the
biochip according to the second embodiment of the present
invention.
[0024] FIG. 12 shows a third enlarged sectional view of the biochip
according to the second embodiment of the present invention.
[0025] FIG. 13 shows a first sectional process drawing of the
biochip according to the second embodiment of the present
invention.
[0026] FIG. 14 shows a second sectional process drawing of the
biochip according to the second embodiment of the present
invention.
[0027] FIG. 15 shows a third sectional process drawing of the
biochip according to the second embodiment of the present
invention.
[0028] FIG. 16 shows a fourth sectional process drawing of the
biochip according to the second embodiment of the present
invention.
[0029] FIG. 17 shows a chemical formula of nucleoside
phosphoramidite according to the second embodiment of the present
invention.
[0030] FIG. 18 shows first chemical formulas of bases of the
nucleosides according to the second embodiment of the present
invention.
[0031] FIG. 19 shows a fifth sectional process drawing of the
biochip according to the second embodiment of the present
invention.
[0032] FIG. 20 shows a sixth sectional process drawing of the
biochip according to the second embodiment of the present
invention.
[0033] FIG. 21 shows a seventh sectional process drawing of the
biochip according to the second embodiment of the present
invention.
[0034] FIG. 22 shows an eighth sectional process drawing of the
biochip according to the second embodiment of the present
invention.
[0035] FIG. 23 shows a ninth sectional process drawing of the
biochip according to the second embodiment of the present
invention.
[0036] FIG. 24 shows a tenth sectional process drawing of the
biochip according to the second embodiment of the present
invention.
[0037] FIG. 25 shows second chemical formulas of the bases of the
nucleosides according to the second embodiment of the present
invention.
[0038] FIG. 26 shows an eleventh sectional process drawing of the
biochip according to the second embodiment of the present
invention.
[0039] FIG. 27 shows a twelfth sectional process drawing of the
biochip according to the second embodiment of the present
invention.
[0040] FIG. 28 shows a first sectional process drawing of the
biochip according to a modification of the second embodiment of the
present invention.
[0041] FIG. 29 shows a second sectional process drawing of the
biochip according to the modification of the second embodiment of
the present invention.
[0042] FIG. 30 shows a top view of the substrate for the biochip
according to a third embodiment of the present invention.
[0043] FIG. 31 shows a sectional view of the substrate for the
biochip according to the third embodiment of the present
invention.
[0044] FIG. 32 shows a top view of the biochip according to a
fourth embodiment of the present invention.
[0045] FIG. 33 shows a first sectional view of the biochip
according to the fourth embodiment of the present invention.
[0046] FIG. 34 shows a second sectional view of the biochip
according to the fourth embodiment of the present invention.
[0047] FIG. 35 shows a first sectional process drawing of the
biochip according to the fourth embodiment of the present
invention.
[0048] FIG. 36 shows a second sectional process drawing of the
biochip according to the fourth embodiment of the present
invention.
[0049] FIG. 37 shows a third sectional process drawing of the
biochip according to the fourth embodiment of the present
invention.
[0050] FIG. 38 shows a fourth sectional process drawing of the
biochip according to the fourth embodiment of the present
invention.
[0051] FIG. 39 shows a fifth sectional process drawing of the
biochip according to the fourth embodiment of the present
invention.
[0052] FIG. 40 shows a sixth sectional process drawing of the
biochip according to the fourth embodiment of the present
invention.
[0053] FIG. 41 shows a third sectional view of the biochip
according to the fourth embodiment of the present invention.
[0054] FIG. 42 shows a first sectional process drawing of the
biochip according to a modification of the fourth embodiment of the
present invention.
[0055] FIG. 43 shows a second sectional process drawing of the
biochip according to the modification of the fourth embodiment of
the present invention.
[0056] FIG. 44 shows a top view of the biochip according to a fifth
embodiment of the present invention.
[0057] FIG. 45 shows a first sectional view of the biochip
according to the fifth embodiment of the present invention.
[0058] FIG. 46 shows a first sectional process drawing of the
biochip according to the fifth embodiment of the present
invention.
[0059] FIG. 47 shows a second sectional process drawing of the
biochip according to the fifth embodiment of the present
invention.
[0060] FIG. 48 shows a second sectional view of the biochip
according to the fifth embodiment of the present invention.
[0061] FIG. 49 shows a third sectional view of the biochip
according to the fifth embodiment of the present invention.
[0062] FIG. 50 shows a top view of the biochip according to a sixth
embodiment of the present invention.
[0063] FIG. 51 shows a first sectional view of the biochip
according to the sixth embodiment of the present invention.
[0064] FIG. 52 shows a first sectional process drawing of the
biochip according to the sixth embodiment of the present
invention.
[0065] FIG. 53 shows a second sectional process drawing of the
biochip according to the sixth embodiment of the present
invention.
[0066] FIG. 54 shows a third sectional process drawing of the
biochip according to the sixth embodiment of the present
invention.
[0067] FIG. 55 shows a fourth sectional process drawing of the
biochip according to the sixth embodiment of the present
invention.
[0068] FIG. 56 shows a second sectional view of the biochip
according to the sixth embodiment of the present invention.
[0069] FIG. 57 shows a top view of the biochip according to other
embodiment of the present invention.
BEST MODE FOR CARRYING OUT THE INVENTION
[0070] Embodiments of the present invention will be described with
reference to the accompanying drawings. It is to be noted that the
same or similar reference numerals are applied to the same or
similar parts. It should be noted that the drawing are typical
ones. Therefore, concrete sizes should be determined by referring
the following description, for example. Also, it is a matter of
course that portions of which relationship between sizes and ratios
of mutual drawings is different are included.
First Embodiment
[0071] With reference to FIG. 1 and FIG. 2 that is a sectional view
taken on line II-II, a substrate for a biochip according to a first
embodiment of the present invention includes a base plate 15 having
a surface on which a plurality of hydroxyl groups (--OH) can be
introduced, and a metallic membrane 13 disposed on the base plate
15, wherein a plurality of wells 41a, 41b, 41c, 41d, 41e, 41f, 41g,
41h, 41i, 42a, 42b, 42c, 42d, 42e, 42f, 42g, 42h, 42i, 43a, 43b,
43c, 43d, 43e, 43f, 43g, 43h, 43i, 44a, 44b, 44c, 44d, 44e, 44f,
44g, 44h, 44i, 45a, 45b, 45c, 45d, 45e, 45f, 45g, 45h, 45i, 46a,
46b, 46c, 46d, 46e, 46f, 46g, 46h, 46i, 47a, 47b, 47c, 47d, 47e,
47f, 47g, 47h, 47i, 48a, 48b, 48c, 48d, 48e, 48f, 48g, 48h, 48i,
49a, 49b, 49c, 49d, 49e, 49f, 49g, 49h, 49i that reach the base
plate 15 are delineated in the metallic membrane 13. The film
thickness of the base plate 15 is 550 micrometers, for example.
Synthetic quarts (SiO.sub.2) and a silicon substrate having a
surface on which a natural oxide film is formed, etc., can be used
for the material of the base plate 15. The film thickness of the
metallic membrane 13 is from 10 nm to 10 micrometers, and
preferably 50 nm, for example. Transition metal such as Titan (Ti),
platinum (Pt), chrome (Cr), niobium (Nb), tantalum (Ta), tungsten
(W), etc., or metal such as aluminum (Al), gold (Au), etc., can be
used for a material of the metallic membrane 13. Especially, Ti is
preferable. In addition, transition metal oxide such as titanium
monoxide (TiO), titanium dioxide (TiO.sub.2) etc., transition metal
nitride such as titanium nitride (TiN), etc., and transition metal
carbide such as titanium carbide (TiC) can be used for the material
of the metallic membrane 13. Also, ITO (Indium Tin Oxide), etc.,
can be used for the material of the metallic membrane 13.
[0072] Further, the substrate for the biochip according to the
first embodiment includes a crosslinkable polymer membrane 11
disposed on the metallic membrane 13. The polymer membrane 11 is
insoluble in an acid solution such as a mixed solution of
hydrofluoric acid (HF), nitric acid (HNO.sub.3), and water
(H.sub.2O). The film thickness is micrometers. An epoxy resin that
is photosensitive to ultraviolet rays cab be used for a material of
the polymer membrane 11. For example, SU-8-3000 series of KAYAKU
MICROCHEM Corp. is preferable. As shown in FIG. 3, the polymer
membrane 11 is composed of a plurality of epoxy resins 111a, 111b,
111c, 111d that are cross-linked to each other.
[0073] When the biochip is manufactured by using the substrate for
the biochip described above and shown in FIG. 1 to FIG. 3, as
mentioned below with reference to FIG. 26, after probe biomolecules
are introduced on a surface of the base plate 15 exposed from the
plurality of wells 41a-41i, 42a-42i, 43a-43i, 44a-44i, 45a-45i,
46a-46i, 47a-47i, 48a-48i, 49a-49i and amino groups in the probe
biomolecules are deprotected by an alkaline solution, it is
possible to easily peel off the polymer membrane 11 from the
metallic membrane 13. Especially, by using the SU-8 as the material
of the polymer membrane 11, it becomes more easily to peel off it
from the metallic membrane 13. After the probe biomolecules are
introduced, the polymer membrane 11 can be easily peeled off from
the metallic membrane 13. Therefore, it is possible to inhibit the
probe biomolecules from being introduced on the surface of metallic
membrane 13. Accordingly, the probe biomolecules are introduced
only on the surface of the base plate 15 exposed from the plurality
of wells 41a-41i, 42a-42i, 43a-43i, 44a-44i, 45a-45i, 46a-46i,
47a-47i, 48a-48i, 49a-49i, and the probe biomolecules do not adhere
to the surface of the metallic membrane 13. Consequently, in a
process for detecting target biomolecules, it is possible to cancel
background noise. By adopting a combination of the polymer membrane
11 and the metallic membrane 13, such phenomenon of easy peel-off
after the probe biomolecules are introduced can be observed.
Therefore, in the substrate for the biochip according to the first
embodiment, the metallic membrane 13 is disposed on the base plate
15, and the polymer membrane 11 is further disposed on the metallic
membrane 13.
[0074] Next, with reference to FIG. 4 to FIG. 6, a method for
manufacturing the substrate for the biochip according to the first
embodiment is described.
[0075] (a) As shown in FIG. 4, the base plate 15 composed of
SiO.sub.2, for example, is prepared and the metallic membrane 13
composed of Ti, for example, is formed on the base plate 15 by
using a sputtering method or a chemical vapor deposition (CVD)
method. After the metallic membrane 13 is formed, the surface is
treated with oxygen (O.sub.2) plasma for 5 minutes. Next, as shown
in FIG. 5, a solution including the photosensitive epoxy resin such
as SU-8-3000, etc., is spin coated on the metallic membrane 13 to
form the polymer membrane 11. As to the condition of spin coating,
it is accelerated to 300 revolutions per minute by taking 5
seconds, and 300 revolutions per minute is maintained for 10
seconds, for example. Further, it is accelerated to 500 revolutions
per minute by taking 5 seconds, and 500 revolutions per minute is
maintained for 15 seconds. Thereafter, it is accelerated to 4500
revolutions per minute by taking 5 seconds, and the 4500
revolutions per minute is maintained for 30 seconds. Finally, the
spin is halted by taking 5 seconds.
[0076] (b) After the polymer membrane 11 is formed, the polymer
membrane 11 is pre-baked. First, the base plate 15 is disposed on a
hot plate set to 65 degrees C. After a lapse of 2 minutes, the hot
plate is set to 80 degrees C. After a lapse of 20 minutes, the hot
plate is set to 95 degrees C. and it is preserved for 15 minutes.
After a lapse of 15 minutes, the hot plate is turned off and it is
preserved for 1 hour. Thereafter, by using a photomask having a
mask pattern corresponding to shapes of the plurality of wells
41a-41i, 42a-42i, 43a-43i, 44a-44i, 45a-45i, 46a-46i, 47a-47i,
48a-48i, 49a-49i shown in FIG. 1, portions of the polymer membrane
11 are selectively exposed to the ultraviolet rays. After the
exposure, post exposure bake (PEB) for the polymer membrane 11 is
performed. Concretely, the base plate 15 is disposed on the hot
plate set to 65 degrees C. After a lapse of 2 minutes, the hot
plate is set to 95 degrees C. and it is preserved for 6 minutes.
After a lapse of 6 minutes, the hot plate is turned off and it is
preserved for 1 hour. Thereafter, the polymer membrane 11 is
developed by using a SU-8 developer solution, for example. Since
the polymer membrane 11 has photosensitivity, the portions of the
polymer membrane 11 are selectively removed, as shown in FIG.
6.
[0077] (c) By using the polymer membrane 11 of which the portions
were selectively removed as an etching mask, portions of the
metallic membrane 13 are selectively removed by isotopic wet
etching. The mixture solution of hydrofluoric acid (HF), nitric
acid (HNO.sub.3), and water (H.sub.2O), for example, can be used
for the etching solution. By the selective removal, each of the
plurality of wells 41a-41i, 42a-42i, 43a-43i, 44a-44i, 45a-45i,
46a-46i, 47a-47i, 48a-48i, 49a-49i, shown in FIG. 2, are formed and
the method for manufacturing the substrate for the biochip
according to the first embodiment is completed.
[0078] By adopting the method for manufacturing the substrate for
the biochip according to the first embodiment described above, the
crosslinkable polymer membrane 11 composed of SU-8-3000, etc., has
strong solvent resistance against the etching solution. Therefore,
there is no need to remove the polymer membrane 11 after the wet
etching and to form a new protective film on the metallic membrane
13. Consequently, the polymer membrane 11 can be used as the
etching mask for delineating each of the plurality of wells
41a-41i, 42a-42i, 43a-43i, 44a-44i, 45a-45i, 46a-46i, 47a-47i,
48a-48i, 49a-49i and can be utilized for a protective film of the
metallic membrane 13 after the etching process. It should be noted
that O.sub.2 plasma process after formation of the metallic
membrane 13 can be eliminated.
Second Embodiment
[0079] With reference to FIG. 7 and FIG. 8 that is a sectional view
taken on line VIII-VIII, the biochip according to a second
embodiment of the present invention includes the base plate 15, and
the metallic membrane 13 disposed on the base plate 15, wherein the
plurality of wells 41a, 41b, 41c, 41d, 41e, 41f, 41g, 41h, 41i,
42a, 42b, 42c, 42d, 42e, 42f, 42g, 42h, 42i, 43a, 43b, 43c, 43d,
43e, 43f, 43g, 43h, 43i, 44a, 44b, 44c, 44d, 44e, 44f, 44g, 44h,
44i, 45a, 45b, 45c, 45d, 45e, 45f, 45g, 45h, 45i, 46a, 46b, 46c,
46d, 46e, 46f, 46g, 46h, 46i, 47a, 47b, 47c, 47d, 47e, 47f, 47g,
47h, 47i, 48a, 48b, 48c, 48d, 48e, 48f, 48g, 48h, 48i, 49a, 49b,
49c, 49d, 49e, 49f, 49g, 49h, 49i that reach the base plate 15 are
delineated in the metallic membrane 13. Each film thickness and
each material of the base plate 15 and the metallic membrane 13 are
similar to the substrate for the biochip shown in FIG. 1. So, an
explanation is omitted.
[0080] With reference to FIG. 8, the biochip according to the
second embodiment further includes a plurality of biomaterial films
91a, 91b, 91c, 91d, 91e, 91f, 91g, 91h, 91i disposed on the surface
of the base plate 15 exposed from the plurality of wells 41a-41i,
respectively. In each of the plurality of biomaterial films
91a-91i, each functional group of a plurality of probe biomolecules
such as a plurality of DNAs, a plurality of ribonucleic acids
(RNAs), a plurality of peptide nucleic acids (PNAs), a plurality of
proteins, etc., is covalently bonded to the hydroxyl group (--OH)
on the surface of the base plate, as shown in FIG. 9. In the case
where the probe biomolecules are DNAs, RNAs, or PNAs, each sequence
is designed to be complementary to a target biomolecule.
[0081] It should be noted that the second embodiment is not limited
to directly disposing each of the plurality of biomaterial films
91a-91i on the surface of the base plate 15. In the case shown in
FIG. 10, silane coupling films 81a, 81b, 81c, 81d, 81e, 81f, 81g,
81h, 81i are disposed on the portions of the surface of the base
plate 15 exposed from the plurality of wells 41a-41i, respectively.
In each of the silane coupling films 81a-81i, as shown in FIG. 11,
each methyl group (--CH.sub.3) or each ethyl group
(--C.sub.2H.sub.5) of a plurality of silane coupling agents is
chemically bounded to the hydroxyl group (--OH) on the surface of
the base plate 15 by acid-base reaction.
[0082] 3-Glycidoxypropyltrimethoxysilane,
3-Glycidoxypropylmethyldiethoxysilane,
3-Glycidoxypropyltriethoxysilane,
N-(2-Aminoethyl)-3-Aminopropylmethyldimethoxysilane,
N-(2-Aminoethyl)-3-Aminopropyltrimethoxysilane,
N-(2-Aminoethyl)-3-Aminopropyltriethoxysilane,
3-Aminopropyltrimethoxysilane, 3-Aminopropyltriethoxysilane, etc.,
can be used for each of the plurality of silane coupling
agents.
[0083] The biomaterial films 91a, 91b, 91c, 91d, 91e, 91f, 91g,
91h, 91i are disposed on the silane coupling films 81a-81i,
respectively. In each of the plurality of biomaterial films
91a-91i, each phosphoramidite derivative introduced in the
plurality of probe biomolecules is covalently bonded to each epoxy
group of the silane coupling agents in the silane coupling films
81a-81i, by hydrolysis reaction.
[0084] Alternatively, the silane coupling agent and the probe
biomolecule may bond via cross linker. For example, a functional
group such as amino group (--NH.sub.2) of lysine (Lys), carboxyl
group (--COOH) of aspartic acid (Asp) and glutamic acid (Glu),
phenolic group (--C.sub.6H.sub.4(OH)) of tyrosine (Tyr), imidazole
group (--C.sub.3H.sub.3N.sub.2) of histidine (His), thiol group
(--SH) of cysteine (Cys), etc., included in the protein such as a
receptor, ligand, antagonist, antibody, antigen, etc., may be
bonded to the amino group or the epoxy group of the silane coupling
agent by the cross linker. In the case shown in FIG. 12, the amino
group (--NH.sub.2) of the silane coupling agent and each amino
group (--NH.sub.2) of the antibodies 95a, 95b, 95c are bonded by a
Disuccinimidyl suberate (DSS) that is the cross linker reacting to
the amino groups (--NH.sub.2) at both terminals.
[0085] In addition, Bis[Sulfosuccinimidyl]suberate (BS.sup.3),
Dimethyl suberimidate HCl DMS), Disuccinimidyl glutarate (DSG),
Loman's Reagent, 3,3'-Dithiobis [sulfosuccinimidyl propionate]
(DTSSP), and Ethylene glycol bis[succinimidylsuccinate] (EGS) that
react to the amino groups at both terminals, and
1-Ethyl-3-[3-Dimethylaminopropyl]carbodiimide Hydrochloride (EDC)
that react to the amino group and the carboxyl group can be used
for the cross linker.
[0086] In addition, m-Maleimidobenzyl-N-hydroxysuccinimide ester
(MBS), Succinimidyl 4-[N-maleimidomethyl]-cyclohexane-1-carboxylate
(SMCC), Succinimidyl 4-[p-maleimidophenyl]-buthrate (SMPB),
N-Succinimidyl 3-[2-pyridyldithio]propionate (SPDP),
N-[.gamma.-Maleimidobutyloxy]sulfosuccinimide ester (Sulfo-GMBS),
Sulfosuccinimidyl 6-[3' (2-pyridyldithio)-propionamide]hexanoate
(Sulfo-LC-SPDP), m-Maleimidebenzoyl-N-hydroroxysulfo-succinimide
ester (Sulfo-MBS), Sulfosuccinimidyl 4
[N-maleimidomethyl]-cyclohexane-1-carboxylate (Sulfo-SMCC), and
Sulfosuccinimidy 4-[p-maleimidophenyl]-butyrate (Sulfo-SMPB) that
react to the amino group and the thiol group can also be used as
the cross linker. It should be noted that each sectional view of
the other plurality of wells 42a-42i, 43a-43i, 44a-44i, 45a-45i,
46a-46i, 47a-47i, 48a-48i, 49a-49i shown in FIG. 7 is similar to
FIG. 8 to FIG. 12. So, an explanation is omitted.
[0087] Next, with reference to FIG. 13 to FIG. 27, a method for
manufacturing the biochip according to the second embodiment is
described.
[0088] (a) First, the substrate for the biochip shown in FIG. 1 and
FIG. 2 is prepared. Next, the substrate for the biochip is left in
a stirred sodium hydroxide (NaOH) solution at room temperature for
2 hours. Here, the NaOH solution is a solution obtained by mixing
98g of NaOH, 294 ml of distilled water, and 392 ml of ethanol. By
leaving it in the NaOH solution, the plurality of hydroxyl groups
(--OH) are introduced on the surface of base plate 15 exposed from
each of the wells 41a-41i, as shown in FIG. 13. It should be noted
that the hydroxyl groups (--OH) may also be introduced by using a
UV ozone cleaner, for example.
[0089] (b) For example, the silane coupling agent having the epoxy
group as the functional group such as
3-Glycidoxypropylmethyldiethoxysilane
3-Glycidoxypropyltriethoxysilane, etc., or the silane coupling
agent having the amine as the functional group such as
N-(2-Aminoethyl)-3-Aminopropyltriethoxysilane,
3-Aminopropyltrimethoxysilane, 3-Aminopropyltriethoxysilane, etc.,
is dropped on the surface of the base plate 15 exposed from each of
the wells 41a-41i shown in FIG. 2 to form each of the silane
coupling films 81a, 81b, 81c, 81d, 81e, 81f, 81g, 81h, 81i shown in
FIG. 14. For example, when the silane coupling agent having the
epoxy group is dropped under 15 degrees C. condition, the plurality
of epoxy groups are introduced on the surface of the base plate 15,
as shown in FIG. 15. In the case where the metallic membrane 13
shown in FIG. 14 is opaque, it becomes easy to determine the
locations of wells 41a-41i, when the silane coupling agent is
dropped.
[0090] (c) Unreacted hydroxyl groups (--OH) remaining on the
surface of the base plate 15 is acetylated to be capped by
treatment with acetic anhydride and 1-methylimidazole
(tetrahydrofuran solution). Next, as shown in FIG. 16, the epoxy
groups of the silane coupling agent introduced on the surface of
the base plate 15 is hydrolyzed and the hydroxyl groups (--OH) are
introduced in each of the silane coupling films 81a-81i.
[0091] (d) As shown in FIG. 17, a nucleoside of which 5' terminal
is protected by Dimethoxytrityl (DMTr) group and a trivalent
phosphoramidite derivative is substituted for hydroxyl group of 3'
terminal is prepared as a first base. Here, as shown in FIG. 18,
amino group of adenine (A) and cytosine (C) included in the
nucleoside is protected by the benzoyl group, and amino group of
guanine (G) is protected by the isobutyl group. Next, the
nucleoside as the first base is dropped onto each of the silane
coupling films 81a-81i shown in FIG. 14. By the dropping,
phosphoric cyanoethyl amidite derivative of the nucleoside as the
first base is bonded to the hydroxyl group (--OH) of the silane
coupling agent, as shown in FIG. 19, by using the base catalyst,
for example.
[0092] (e) The unreacted hydroxyl groups (--OH) of the silane
coupling agents are acetylated by treatment with acetic anhydride
and 1-methylimidazole (tetrahydrofuran solution) and bondings to
the nucleosides from a second base onward are inhibited. Next,
Dimethoxytrityl (DMTr) groups of the nucleosides as the first bases
are deprotected by a 3% trichloroacetic acid/dichloromethane acid
solution and 5' hydroxyl groups (--OH) are introduced in the
nucleosides as the first bases, as shown in FIG. 20.
[0093] (f) The nucleosides as the second bases of which trivalent
phosphoramidite derivatives are substituted for the 3' terminal
hydroxyl groups are dropped onto the silane coupling films 81a-81i,
and as shown in FIG. 21, the phosphoric cyanoethyl amidite
derivatives of the nucleosides as the second bases are bonded to
the 5' hydroxyl groups (--OH) of the nucleosides as the first bases
by condensation reaction, with base catalyst, for example. Then,
unreacted 5' hydroxyl groups (--OH) of the nucleosides as the first
bases are acetylated to be capped by treatment with acetic
anhydride and tetrahydrofuran solution.
[0094] (g) Phosphite triester bonds formed by the condensation
reaction are oxidized with iodine and water (pyridine-containing
tetrahydrofuran solution) and they change to more stable phosphoric
triester bonds, as shown in FIG. 22. Thereafter, Dimethoxytrityl
(DMTr) groups of the second bases are removed. Then, the
condensation reactions to the nucleoside phosphoramidites are
repeated until the desired DNA chain length is obtained, as shown
in FIG. 23, and the plurality of biomaterial films 91a-91i shown in
FIG. 10 are formed.
[0095] (h) After the DNA is elongated, an alkaline solution
treatment is performed. Here, the base plate 15 is sunk in the
alkaline solution such as ammonia water (NH.sub.4OH) at 55 degrees
C. for 30 minutes so that the polymer membrane 11 is soaking. It
should be noted that the weight percent concentration is 40% at the
preparation time. By the alkaline solution treatment, as shown in
FIG. 24, cyanoethyl protecting groups are detached. Also, bases
such as adenine (A), cytosine (C), and guanine (G) are deprotected
as shown in FIG. 25. Further, by the alkaline solution treatment,
adhesion force between the metallic membrane 13 and the polymer
membrane 11 is diminished. Thereafter, the base plate 15 is took
out from the NH.sub.4OH water, and the lateral side 115 of the
polymer membrane 11 shown in FIG. 26 is blown by gas such as air by
using an air gun, for example, to peel off the polymer membrane 11
from the metallic membrane 13. Finally, the end terminal
Dimethoxytrityl (DMTr) groups are deprotected, as shown in FIG. 27,
and the method for manufacturing the biochip according to the
second embodiment is completed.
[0096] In an earlier method for manufacturing the biochip, there
was no technique for protecting the membrane having the plurality
of wells by the polymer membrane during formation of the
biomaterial film and then easily peeling off the polymer membrane
from the membrane having the plurality of wells. Therefore, if the
biomaterial film was formed without protecting the membrane having
the plurality of wells, the silane coupling agents were bonded to
the surface of the membrane having the plurality of wells, and the
probe biomolecules were bonded to the silane coupling agents.
Consequently, there was a problem that the fluorescently-labeled
target biomolecules also bonded to the surface of the membrane
having the plurality of wells and it became the background noise
during the detection process. Especially in a micro amount assay, a
technique for enhancing contrast in fluorescent assay by trapping
the target biomolecules only on the surface of the substrate
exposed from each of the plurality of wells and inhibiting the
target biomolecule from being trapped on the surface of membrane
having the wells was desired.
[0097] However, by the method for manufacturing the biochip
according to the second embodiment, as shown in FIG. 13 to FIG. 27,
the metallic membrane 13 is protected by the polymer membrane 11
during the formation of the plurality of biomaterial films 91a-91i,
and the polymer membrane 11 is peeled off from the metallic
membrane 13 after the formation of the plurality of biomaterial
films 91a-91i. Therefore, the probe biomolecules are not introduced
onto the metallic membrane 13. Consequently, the target
biomolecules are not bonded on the metallic membrane 13.
Accordingly, by using the biochip according to the second
embodiment, it is possible to detect species and concentration of
the target biomolecule with considerable accuracy, for example,
since the background noise does not generat in the process for
detecting the biomolecule. Further, in the process for synthesis of
DNA shown in FIG. 17 to FIG. 25, it is possible to secure each
depth of the plurality of wells 42a-49i, since the polymer membrane
11 is disposed on the metallic membrane 13. Therefore, it is
possible to drop sufficient synthesis reagents for synthesis of DNA
into each of the plurality of wells 42a-49i. Further, it is
possible to easily peel off the polymer membrane 11 from the
metallic membrane 13 by immersing it in the NH.sub.4OH water used
for the desorption of cyanoethyl protecting group and the
deprotection of adenine (A), cytosine (C), guanine (G), for
example. Therefore, it is not necessary to prepare a specific
stripping solution to peel off the polymer membrane 11. Also, it is
not necessary to immerse the polymer membrane 11 into the specific
stripping solution. Therefore, it is not feared that the probe
biomolecules in the plurality of biomaterial films 91a-91i are
damaged. The phenomenon of easy peeling off of the polymer membrane
11 can be specifically seen only when the polymer membrane 11 is
formed on the metallic membrane 13. In earlier, there was no method
for manufacturing the biochip including the formation of the
polymer membrane 11 as the protecting film on the metallic membrane
13. Especially, in the case where the polymer membrane 11 is
composed of SU-8-3000 and the metallic membrane 13 is composed of
Ti, favorable peel-off is obtained. Though the method including
forming the plurality of biomaterial films 91a-91i after the silane
coupling films 81a-81i are formed on the base plate 15 exposed from
each of the plurality of wells 42a-42i, 43a-43i, 44a-44i, 45a-45i,
46a-46i, 47a-47i, 48a-48i, 49a-49i shown in FIG. 13 to FIG. 27 is
explained, the probe biomolecules can be bonded to the plurality of
hydroxyl groups (--OH) shown in FIG. 13 without using the silane
coupling films 81a-81i.
[0098] (Modification of the Second Embodiment)
[0099] It is possible to synthesize the probe DNAs having different
base sequences in each of the plurality of wells 41a-41i, 42a-42i,
43a-43i, 44a-44i, 45a-45i, 46a-46i, 47a-47i, 48a-48i, 49a-49i,
shown in FIG. 7. A method for synthesizing the probe DNAs having
the different base sequences in each of the plurality of wells
41a-41i, 42a-42i, 43a-43i, 44a-44i, 45a-45i, 46a-46i, 47a-47i,
48a-48i, 49a-49i is described below.
[0100] (a) As shown in FIG. 14, after each of the silane coupling
films 81a-81i is formed, the epoxy groups of the silane coupling
agents included in each of the silane coupling films 81a-81i are
hydrolyzed and the hydroxyl groups (--OH) are introduced in each of
the silane coupling films 81a-81i. Thereafter, the 5 bases of
nucleosides having thymines (T) are bonded to the silane coupling
agent in series. Next, as shown in FIG. 28, buried resins are
embedded in the wells 41d, 41e, 41f to form block layer 130a, 130b,
130c. Polyhydroxy styrene (PHS) having 20,000 of average molecular
weight dissolved in Dimethylsulfoxide (DMSO) at 5% of ratio by
weight can be used as a material of the buried resin.
[0101] (b) Dimethoxytrityl (DMTr) groups of the nucleosides in each
of the wells 41a, 41b, 41c, 41g, 41h, 41i where the buried resins
were not embedded are deprotected by the 3% trichloroacetic
acid/dichloromethane acid solution. Thereafter, the block layers
130a, 130b, 130c are removed by solvent. Next, new nucleosides of
which 3' terminal hydroxyl groups are changed to trivalent
phosphoramidite derivatives are dropped into the wells 41a-41i. The
new nucleosides react and are bonded only to 5' hydroxyl groups
(--OH) of the nucleosides of which Dimethoxytrityl (DMTr) groups
were deprotected in the wells 41a, 41b, 41c, 41g, 41h, 41i.
[0102] (c) The wells 41a, 41b, 41c, 41g, 41h, 41i shown in FIG. 14
are embedded with buried resins, as shown in FIG. 29, to form block
layers 131a, 131b, 131c, 131d, 131e, 131f. Next, Dimethoxytrityl
(DMTr) groups of the nucleosides in each of the wells 41d, 41e, 41f
where the buried resins were not embedded are deprotected by the 3%
trichloroacetic acid/dichloromethane acid solution. Then, the block
layers 131a, 131b, 131c, 131d, 131e, 131f are removed by the
solvent. Thereafter, new nucleosides of which 3' terminal hydroxyl
groups are changed to trivalent phosphoramidite derivative are
dropped in the wells 41a-41i. The new nucleosides react and are
bonded to 5' hydroxyl groups (--OH) of nucleosides of which
Dimethoxytrityl (DMTr) groups were deprotected in the wells 41d,
41e, 41f.
[0103] (d) Thereafter, embedding the buried resin in at least any
one of the wells 41a-41i, deprotection of Dimethoxytrityl (DMTr)
group, removal of the buried resin, and polymerization reaction of
the nucleosides are repeated and the probe DNAs having the
different base sequences in each of the plurality of wells 41a-41i,
42a-42i, 43a-43i, 44a-44i, 45a-45i, 46a-46i, 47a-47i, 48a-48i,
49a-49i are synthesized.
[0104] In the process of DNA synthesis shown in FIG. 28 and FIG.
29, it is possible to secure each depth of the plurality of wells
42a-49i, since the polymer membrane 11 is disposed on the metallic
membrane 13. Therefore, it becomes easy to embed the buried resin
in each of the plurality of wells 42a-49i.
Third Embodiment
[0105] With reference to FIG. 30 and FIG. 31 that is a sectional
view taken on line XXXI-XXXI, a substrate for a biochip according
to a third embodiment includes the base plate 15 having the surface
on which the plurality of hydroxyl groups can be introduced, and a
cover member 211 disposed on the base plate 15 when the probe
biomolecules are bonded to the plurality of hydroxyl groups, and
having a plurality of through holes 141a, 141b, 141c, 141d, 141e,
141f, 141g, 141h, 141i, 142a, 142b, 142c, 142d, 142e, 142f, 142g,
142h, 142i, 143a, 143b, 143c, 143d, 143e, 143f, 143g, 143h, 143i,
144a, 144b, 144c, 144d, 144e, 144f, 144g, 144h, 144i, 145a, 145b,
145c, 145d, 145e, 145f, 145g, 145h, 145i, 146a, 146b, 146c, 146d,
146e, 146f, 146g, 146h, 146i, 147a, 147b, 147c, 147d, 147e, 147f,
147g, 147h, 147i, 148a, 148b, 148c, 148d, 148e, 148f, 148g, 148h,
148i, 149a, 149b, 149c, 149d, 149e, 149f, 149g, 149h, 14'9i
defining biding areas of the probe biomolecules on the surface of
base plate 15.
[0106] During the probe biomolecules are introduced on the surface
of the base plate 15 exposed from each of the plurality of through
holes 141a-149i, the cover member 211 is close contact with the
upper surface of base plate 15. A material having an anti peeling
property against the nucleic acid synthetic agents such as the
resin like SU-8, etc., silicon (Si) rubber, and Poly-dimethyl
siloxane (PDMS) can be used as the material of the cover member
211. The method for introducing the probe biomolecules onto the
surface of the base plate 15 is similar to the method explained
with FIG. 15 to FIG. 25. Therefore, an explanation is omitted.
After the probe biomolecules are introduced onto the base plate 15
exposed from each of the plurality of through holes 141a-149i, the
cover member 211 is removed from the base plate 15. After the cover
member 211 is removed from the base plate 15, the probe
biomolecules are introduced only on the portions of the base plate
15 exposed form the plurality of through holes 141a-149i and the
probe biomolecules are not introduced on other portions. Therefore,
the target biomolecules are bonded to the portions of the base
plate 15 exposed form the plurality of through holes 141a-149i and
are not bonded to other portions. Consequently, in the process for
detecting the target biomolecules, it is possible to cancel the
background noise generated by the target biomolecules
nonspecifically bonded to the surface of the base plate 15. It
should be noted that the metallic membrane may be disposed between
the base plate 15 and the cover member 211 as explained in the
first and second embodiments.
Fourth Embodiment
[0107] With reference to FIG. 32 and FIG. 33 that is a sectional
view taken on line XXXIII-XXXIII, a biochip according to a fourth
embodiment of the present invention includes an optical
transparency base plate 15 having a surface on which the plurality
of hydroxyl groups (--OH) can be introduced, and a light shielding
film 113 disposed on the base plate 15 and having a plurality of
through holes 241a, 241b, 241c, 241d, 241e, 241f, 241g, 241h, 241i,
242a, 242b, 242c, 242d, 242e, 242f, 242g, 242h, 242i, 243a, 243b,
243c, 243d, 243e, 243f, 243g, 243h, 243i, 244a, 244b, 244c, 244d,
244e, 244f, 244g, 244h, 244i, 245a, 245b, 245c, 245d, 245e, 245f,
245g, 245h, 245i, 246a, 246b, 246c, 246d, 246e, 246f, 246g, 246h,
246i, 247a, 247b, 247c, 247d, 247e, 247f, 247g, 247h, 247i, 248a,
248b, 248c, 248d, 248e, 248f, 248g, 248h, 248i, 249a, 249b, 249c,
249d, 249e, 249f, 249g, 249h, 249i that reach the base plate 15.
The transition metal such as Titan (Ti), platinum (Pt)), chrome
(Cr), niobium (Nb), tantalum (Ta), tungsten (W), etc., and the
metal such as aluminum (Al), gold (Au), etc., can be used for the
material of the light shielding film 113. In addition, the
transition metallic oxide such as titanium monoxide (TiO), titanium
dioxide (TiO.sub.2), etc., and the transition metal nitride such as
titanium nitride (TiN), etc., and the transition metal carbide such
as titanium carbide (TiC), etc., can be used as the material of
light shielding film 113, for example. Each diameter of the
plurality of through holes 241a-249i is above 300 micrometers.
[0108] Further, as shown in FIG. 33, the biochip according to
fourth embodiment includes a plurality of biomaterial films 91a,
91b, 91c, 91d, 91e, 91f, 91g, 91h, 91i disposed on the surface of
the base plate 15 exposed from the plurality of through holes
241a-241i, respectively. In each of the plurality of biomaterial
films 91a-91i, each functional group of the plurality of probe
biomolecules such as the plurality of DNAs, the plurality of RNAs,
the plurality of PNAs, the plurality of proteins, etc., is
covalently bonded to the hydroxyl group (--OH) on the surface of
the base plate 15, as explained with FIG. 9.
[0109] It should be noted that the fourth embodiment is not limited
to the displacement where the plurality of biomaterial films
91a-91i directly displaced on the surface of the base plate 15,
respectively. In a case shown in FIG. 34, silane coupling films
81a, 81b, 81c, 81d, 81e, 81f, 81g, 81h, 81i are disposed on the
surface of the portions of the base plate 15 exposed from the
plurality of through holes 241a-241i, respectively. In each of the
silane coupling films 81a-81i, as explained with FIG. 11, each
methyl group (--CH.sub.3) or each ethyl group (--C.sub.2H.sub.5) of
the plurality of silane coupling agents is chemically bonded to the
hydroxyl group (--OH) on the surface of the base plate 15 by the
acid-base reaction. Alternatively, the silane coupling agent and
the probe biomolecule may be coupled via the cross linker. Here,
each sectional view of the plurality of through holes 242a-242i,
243a-243i, 244a-244i, 245a-245i, 246a-246i, 247a-247i, 248a-248i,
249a-249i shown in FIG. 32 is similar to FIG. 33, so an explanation
is omitted.
[0110] As described above, in the biochip according to the fourth
embodiment shown in FIG. 32 to FIG. 34, each of the plurality of
biomaterial films 91a-91i is disposed on the optical transparency
base plate 15 like a spot. Further, the light shielding film 113 is
disposed around each of the plurality of biomaterial films 91a-91i.
When an assay is performed with the biochip according to the fourth
embodiment, the target biomolecules labeled with biotins are
dropped into the plurality of biomaterial films 91a-91i,
respectively. After the biochip is left for the time period
required for interactions between the target biomolecules and the
probe biomolecules, the biochip is washed to remove the unreacted
target biomolecules. Then, a solution including streptavidins
labeled with Horseradish Peroxidase (HRP) is dropped into each of
the plurality of biomaterial films 91a-91i. After it is stilly left
for 1 hour at room temperature, the biochip is washed to remove the
unreacted streptavidin. After the washing, a solution including
Tetramethyl benzidine (TMB) is dropped into each of the plurality
of biomaterial films 91a-91i. When the target biomolecules are
trapped in each of the plurality of biomaterial films 91a-91i,
colors of TMB come out by the HRP of target biomolecule. Therefore,
by emitting illuminating light from the back side opposite to the
surface of the base plate 15 displaced with the light shielding
film 113, it is possible to easily confirm whether the chromogenic
reaction occurs in each of the plurality of biomaterial films
91a-91i by the transmitted light through the base plate 15, since
the light shielding film 113 enhances the contrast. In addition, by
setting each diameter of the plurality of through holes 241a-249i
above 300 micrometers, it is possible to confirm whether the
chromogenic reaction occurs in each of the plurality of biomaterial
films 91a-91i by the naked eye.
[0111] Next, with reference to FIG. 35 to FIG. 40, the method for
manufacturing the biochip according to fourth embodiment is
described.
[0112] (a) As shown in FIG. 35, the base plate 15 composed of
SiO.sub.2, for example, is prepared and the light shielding film
113 composed of Ti, for example, is formed on the base plate 15 by
using the sputtering method or the CVD method, for example. After
the light shielding film 113 is formed, the surface is treated with
O.sub.2 plasma for 5 minutes. Next, as shown in FIG. 36, the
solution including the photosensitive epoxy resin such as SU-8-3000
series is spin-coated on the light shielding film 113 to form the
polymer membrane 11. After the polymer membrane 11 is formed,
prebake is performed for the polymer membrane 11. Thereafter, by
using a photomask having a mask pattern corresponding to each shape
of the plurality of through holes 241a-241i, 242a-242i, 243a-243i,
244a-244i, 245a-245i, 246a-246i, 247a-247i, 248a-248i, 249a-249i
shown in FIG. 32, portions of the polymer membrane 11 are
selectively exposed to the ultraviolet rays. After the exposure,
the PEB process is performed for the polymer membrane 11.
Thereafter, the polymer membrane 11 is developed with SU-8
developer solution, for example, to selectively remove the portions
of the polymer membrane 11, as shown in FIG. 37.
[0113] (b) By using the polymer membrane 11 of which the portions
are selectively removed as an etching mask, portions of the light
shielding film 113 are selectively removed by isotropic wet
etching. By the selective removal, each of the plurality of through
holes 241a-241i, 242a-242i, 243a-243i, 244a-244i, 245a-245i,
246a-246i, 247a-247i, 248a-248i, 249a-249i is formed as shown in
FIG. 38. Then, the base plate 15 is left in the stirred sodium
hydroxide (NaOH) solution at room temperature for 2 hours and the
plurality of hydroxyl groups (--OH) are introduced on the surface
of the base plate 15 exposed from each of the through holes
241a-241i, as explained with FIG. 13.
[0114] (c) For example, the silane coupling reagent of which
functional group has amine is dropped onto the surface of the base
plate 15 exposed from each of the through holes 241a-241i, shown in
FIG. 38, to form each of the silane coupling films 81a, 81b, 81c,
81d, 81e, 81f, 81g, 81h, 81i shown in FIG. 39. When the silane
coupling agent having the epoxy group is dropped under 15 degrees
C. condition, for example, the plurality of epoxy groups are
introduced on the surface of the base plate 15, as explained with
FIG. 15. It should be noted that the locations of the through holes
241a-241i can be easily identified when the silane coupling agent
is dropped, because of the contrast between the optical
transparency base plate 15 and the light shielding film 113 shown
in FIG. 39.
[0115] (d) The unreacted hydroxyl groups (--OH) remaining on the
surface of the base plate 15 are acetylated to be capped. Next, as
explained with FIG. 16, the epoxy groups of the silane coupling
agents introduced onto the surface of the base plate 15 are
hydrolyzed to introduce the hydroxyl groups (--OH) in each of the
silane coupling films 81a-81i. Thereafter, by the method similar to
the explanation of FIG. 17 to FIG. 23, the plurality of biomaterial
films 91a-91i shown in FIG. 34 are formed. The base plate 15 is
sunk in the alkaline solution so that the polymer membrane 11 is
soaking. As explained with FIG. 24, the cyanoethyl protecting
groups bonded to the phosphate group are detached. Also, the bases
such as adenine (A), cytosine (C), guanine (G), etc., are
deprotected, as explained with FIG. 25. In addition, by the
treatment with the alkaline solution, adhesive strength between the
light shielding film 113 and the polymer membrane 11 is decreased.
Thereafter, the base plate 15 is took out from the NH.sub.4OH
solution. And, the lateral side 115 of the polymer membrane 11
shown in FIG. 40 is blown by gas such as air by using the air gun,
for example, to peel off the polymer membrane 11 from the light
shielding film 113. Finally, the terminal Dimethoxytrityl (DMTr)
groups are deprotected, as explained with FIG. 27 and the method
for manufacturing the biochip according to the fourth embodiment is
completed.
[0116] It should be noted that the method for manufacturing the
biochip according to the fourth embodiment is not limited to this.
For example, it is explained that the light shielding film is
formed on the base plate 15 shown in FIG. 35 by using the
sputtering method or the CVD method. However, the light shielding
film 113 having the plurality of through holes 241a-249i may be
formed on the base plate 15, by using UV-curable black screen
printing ink, for example. Alternatively, the light shielding film
113 having the through holes 241a-249i may be prepared in advance,
and it may be pasted on the base plate 15 by a bonding agent, for
example. Again, the material of the light shielding film 113 is not
limited to metals. Resins or insoluble papers also can be used, for
example. In addition, the light shielding film may be formed by
using an ink-jet printer, for example. Also, as shown in FIG. 41,
the base plate 15 of the biochip according to the fourth embodiment
may have a plurality of wells 51a, 51b, 51c, 51d, 51e, 51f, 51g,
51h, 51i that open to the plurality of through holes 241a-241i of
the light shielding film 113, respectively. The plurality of
biomaterial films 91a-91i are disposed at each bottom of the
plurality of wells 51a-51i. When the biochip shown in FIG. 41 is
manufactured, the plurality of through holes 241a-241i are formed
in the light shielding film 113, as shown in FIG. 38, and then, the
base plate 15 may be selectively removed by the dry etching method
by using the light shielding film 113 as the etching mask, for
example. In the case where it is desired to secure the volume of
the specimen solution, for example, the plurality of wells 51a-51i
are formed.
[0117] (Modification of the Fourth Embodiment)
[0118] It is possible to synthesize the probe DNAs having the
different base sequences on the surface of the base plate 15, shown
in FIG. 32, exposed from the plurality of through holes 241a-241i,
242a-242i, 243a-243i, 244a-244i, 245a-245i, 246a-246i, 247a-247i,
248a-248i, 249a-249i, respectively. A method for synthesizing the
probe DNAs having the different base sequences in the plurality of
through holes 241a-241i, 242a-242i, 243a-243i, 244a-244i,
245a-245i, 246a-246i, 247a-247i, 248a-248i, 249a-249i,
respectively, is described below.
[0119] (a) As shown in FIG. 39, after each of the silane coupling
films 81a-81i is formed, the epoxy groups of the silane coupling
agents included in each of the silane coupling films 81a-81i are
hydrolyzed to introduce the hydroxyl groups (--OH) in each of the
silane coupling films 81a-81i. Thereafter, the 5 bases of
nucleosides having thymines (T) are bonded to the silane coupling
agent in series. Next, the buried resins are embedded into the
through holes 241d, 241e, 241f, as shown in FIG. 42, to form the
block layers 130a, 130b, 130c.
[0120] (b) Dimethoxytrityl (DMTr) groups of the nucleosides in each
of the through holes 241a, 241b, 241c, 241g, 241h, 241i where the
buried resins were not embedded are deprotected by the 3%
trichloroacetic acid/dichloromethane acid solution. Thereafter, the
block layers 130a, 130b, 130c are removed by the solvent. Next, new
nucleosides of which 3' terminal hydroxyl groups are changed to the
trivalent phosphoramidite derivatives are dropped into the through
holes 241a-241i, and the new nucleosides only react and are bonded
to the 5' hydroxyl groups (--OH) of the nucleosides of which
Dimethoxytrityl (DMTr) groups were deprotected.
[0121] (c) As shown in FIG. 43, the buried resins are embedded in
the through hole 241a, 241b, 241c, 241g, 241h, 241i shown in FIG.
39 to form the block layers 131a, 131b, 131c, 131d, 131e, 131f.
Next, Dimethoxytrityl (DMTr) groups of the nucleosides in each of
the through holes 241d, 241e, 241f where the buried resins were not
embedded are deprotected by the 3% trichloroacetic
acid/dichloromethane acid solution, and the block layers 131a,
131b, 131c, 131d, 131e, 131f are removed by the solvent.
Thereafter, when new nucleosides of which 3' terminal hydroxyl
groups were changed to the trivalent phosphoramidite derivatives
are dropped in the through holes 241a-241i, the new nucleosides
only react and are bonded to the 5' hydroxyl groups (--OH) of the
nucleosides of which Dimethoxytrityl (DMTr) groups were deprotected
in the through holes 241d, 241e, 241f.
[0122] (d) Thereafter, embedding the buried resin in any of the
through holes 241a-241i, deprotction of the Dimethoxytrityl (DMTr)
group, removal of the buried resins, and polymerization reaction of
the nucleosides are repeated, and the probe DNAs having the
different base sequences in the plurality of through holes
241a-241i, 242a-242i, 243a-243i, 244a-244i, 245a-245i, 246a-246i,
247a-247i, 248a-248i, 249a-249i are synthesized.
Fifth Embodiment
[0123] With reference to FIG. 44 and FIG. 45 that is a sectional
view taken on line XLV-XLV, a biochip according to a fifth
embodiment includes an optical transparency base plate 15, a light
shielding film 113 disposed on a first surface 10 of the base plate
15 and having a plurality of through holes 241a, 241b, 241c, 241d,
241e, 241f, 241g, 241h, 241i that reach the first surface 10, and a
plurality of biomaterial films 91a, 91b, 91c, 91d, 91e, 91f, 91g,
91h, 91i, 92a, 92b, 92c, 92d, 92e, 92f, 92g, 92h, 92i, 93a, 93b,
93c, 93d, 93e, 93f, 93g, 93h, 93i, 94a, 94b, 94c, 94d, 94e, 94f,
94g, 94h, 94i, 95a, 95b, 95c, 95d, 95e, 95f, 95g, 95h, 95i, 96a,
96b, 96c, 96d, 96e, 96f, 96g, 96h, 96i, 97a, 97b, 97c, 97d, 97e,
97f, 97g, 97h, 97i, 98a, 98b, 98c, 98d, 98e, 98f, 98g, 98h, 98i,
99a, 99b, 99c, 99d, 99e, 99f, 99g, 99h, 99i having a plurality of
probe biomolecules, respectively, that are bonded to a second
surface 20 of the base plate 15 opposite to the first surface 10 of
the base plate 15. Each enlarged sectional view of the plurality of
biomaterial films 91a-99i is similar to FIG. 9, so an explanation
is omitted. Also, as shown in FIG. 11 and FIG. 12, the plurality of
probe biomolecules may be bonded to the base plate 15 via the
silane coupling agent or the cross linking agent, for example.
After a specimen solution including the biotin labeled target
biomolecules is dropped into each of the plurality of biomaterial
films 91a-99i shown in FIG. 44 and FIG. 45, a solution including
HRP labeled streptavidin is dropped into each of the plurality of
biomaterial films 91a-99i. After it is stilly left and washed, a
solution including TMP is dropped into each of the plurality of
biomaterial films 91a-91i. Here, if the target biomolecules are
trapped in each of the plurality of biomaterial films 91a-91i, the
colors of TMB come out by the HRP of the target biomolecule.
Therefore, when the illuminating light is emitted from the first
surface 10, it is possible to easily confirm whether the
chromogenic reaction occurs by the transmitted light incident on
the base plate 15 from the through holes 241a-241i.
[0124] Next, a method for manufacturing the biochip according to
the fifth embodiment is described. By using the method explained
with FIG. 35 to FIG. 38, the light shielding film 113 having the
plurality of through holes 241a-241i are formed on the first
surface 10 of the base plate 15. In FIG. 46, a polymer membrane 311
having a plurality of openings is formed on the second surface of
the base plate 15, by using a lithography method, for example.
Here, locations of the plurality of formed openings of the polymer
membrane 311 confront locations of the plurality of formed through
holes 241a-241i of the light shielding film 113, respectively. In
FIG. 47, the plurality of biomaterial films 91a-91i are formed on
the second surface 20 of the base plate 15 exposed from the
plurality of openings of the polymer membrane 311, respectively.
Thereafter, the polymer membrane 311 is peeled off from the second
surface 20 and the biochip according to the fifth embodiment is
achieved.
[0125] It should be noted that the shape of the biochip according
to the fifth embodiment is not limited to FIG. 45. For example, as
shown in FIG. 48, wells 61a, 61b, 61c, 61d, 61e, 61f, 61g, 61h, 61i
may be delineated in the base plate 15, and the plurality of
biomaterial films 91a-99i may be disposed on the bottoms of the
wells 61a-61i, respectively. Alternatively, a biomaterial film 191
may be disposed on the second surface 20, as shown in FIG. 49. When
the illuminating light is emitted from the first surface 10 of the
base plate 15, the light shielding film 113 restricts regions where
the illuminating light penetrates. Therefore, even if the
biomaterial film 191 are evenly disposed on the second surface 20,
the contrast between presence and absence of chromogenic reaction
becomes clear.
Sixth Embodiment
[0126] With reference to FIG. 50 and FIG. 51 that is a sectional
view taken on line LI-LI, a biochip according to a sixth embodiment
includes a plurality of optical transparency base members 215a,
215b, 215c, 215d, 215e, 215f, 215g, 215h, 215i, a plurality of
biomaterial films 291a, 291b, 291c, 291d, 291e, 291f, 291g, 291h,
291i having a plurality of probe biomolecules bonded to the
plurality of base members 215a-215i, respectively, and a light
shielding member 213 disposed around each of the base members
215a-215i. SiO.sub.2 can be used as a material of each of the
plurality of base members 215a-215i, for example. The metals and
the resins can be used as a material of the light shielding member
213, for example. Also, the base members are disposed on the
bottoms of the plurality of biomaterial films 292a, 292b, 292c,
292d, 292e, 292f, 292g, 292h, 292i, 293a, 293b, 293c, 293d, 293e,
293f, 293g, 293h, 293i, 294a, 294b, 294c, 294d, 294e, 294f, 294g,
294h, 294i, 295a, 295b, 295c, 295d, 295e, 295f, 295g, 295h, 295i,
296a, 296b, 296c, 296d, 296e, 296f, 296g, 296h, 296i, 297a, 297b,
297c, 297d, 297e, 297f, 297g, 297h, 297i, 298a, 298b, 298c, 298d,
298e, 298f, 298g, 298h, 298i, 299a, 299b, 299c, 299d, 299e, 299f,
299g, 299h, 299i, shown in FIG. 50, respectively. Each enlarged
sectional view of the plurality of biomaterial films 291a-299i is
similar to the enlarged sectional view of the biomaterial film 91a
shown in FIG. 9. So, an explanation is omitted. As a matter of
course, the plurality of probe biomolecules may be bonded to the
plurality of base members 215a-215i via the silane coupling agents
or the cross coupling agents, respectively, as shown in FIG. 11 and
FIG. 12, for example. After the specimen solution including the
biotin labeled target biomolecules is dropped onto each of the
plurality of biomaterial films 291a-299i shown in FIG. 50 and FIG.
51, the solution including HRP labeled streptavidin is dropped onto
each of the plurality of biomaterial films 291a-291i. After it is
stilly left and washed, the solution including TMP is dropped into
each of the plurality of biomaterial films 291a-291i. In the case
where the target biomolecules are trapped in each of the plurality
of biomaterial films 291a-291i, the colors of TMB come out by the
HRP of the target biomolecule. Therefore, when the illuminating
light is emitted from the side where the plurality of biomaterial
films 291a-299i are not disposed, it is possible to easily confirm
the presence or absence of the chromogenic reaction, because of the
contrast between the transmitted light of the illuminating light
incident on each of the plurality of base members 215a-215i and the
light shielding member 213.
[0127] Next, a method for manufacturing the biochip according to
the sixth embodiment is described. First, as shown in FIG. 52, the
light shielding member 213 having the plurality of through holes
71a, 71b, 71c, 71d, 71e, 71f, 71g, 71h, 71i is prepared. In FIG.
53, the plurality of base members 215a-215i are inserted into the
plurality of through holes 71a-71i, respectively. In FIG. 54, the
polymer membrane 311 having the plurality of openings exposing the
plurality of base members 215a-215i is formed on the light
shielding member 213, by the lithography method. In FIG. 55, the
plurality of biomaterial films 91a-91i are formed on the plurality
of base members 215a-215i, respectively. Thereafter, the polymer
membrane 311 is removed and the biochip according to the sixth
embodiment is achieved.
[0128] It should be noted that the shape of the biochip according
to the sixth embodiment is not limited to FIG. 51. For example, as
shown in FIG. 56, each thickness of the plurality of base members
215a-215i may be different from the thickness of the light
shielding member 213. By setting the thickness of the light
shielding member 213 thicker than each thickness of the plurality
of base members 215a-215i, a plurality of wells of which side walls
are the light shielding member 213 and bottoms are the surfaces of
the plurality of base members 215a-215i, respectively, are
provided. The biomaterial films 291a, 291b, 291c, 291d, 291e, 291f,
291g, 291h, 291i may be disposed on the bottoms of the plurality of
wells, respectively.
Other Embodiment
[0129] Although the invention has been described above by reference
to the embodiment of the present invention, the present invention
is not limited to the embodiment described above. Modifications and
variations of the embodiment described above will occur to those
skilled in the art, in the light of the above teachings. For
example, as shown in FIG. 57, by delineating grooves 120a, 120b,
120c, 120d between the plurality of wells 41a-41i, 42a-42i,
43a-43i, 44a-44i, 45a-45i, 46a-46i, 47a-47i, 48a-48i, 49a-49i in
the metallic membrane 13, it becomes easy to determine the
locations where the plurality of wells 41a-41i, 42a-42i, 43a-43i,
44a-44i, 45a-45i, 46a-46i, 47a-47i, 48a-48i, 49a-49i are present,
by naked eye. In addition, by delineating the grooves 120a-120d in
the metallic membrane 13, it becomes easy to peel off the polymer
membrane 11 from the metallic membrane 13 in the process for
manufacturing the biochip. As described above, the present
invention includes many variations of embodiments that are not
described here. Therefore, the scope of the invention is defined
with reference to the following claims that are appropriate from
this disclosure.
INDUSTRIAL APPLICABILITY
[0130] The substrate for the biochip, the biochip, the method for
manufacturing the substrate for the biochip, the method for
manufacturing the biochip according to the present invention can be
utilized in a healthcare industry, a household industry, and a
cosmetic industry, for example.
* * * * *