U.S. patent application number 12/783980 was filed with the patent office on 2010-09-09 for manufacturing method for display device, manufacturing apparatus for the same and display device made by the same.
This patent application is currently assigned to Samsung Electronics Co., Ltd.. Invention is credited to Jung-mi Choi, Hoon KIM, Won-Hoe Koo.
Application Number | 20100225223 12/783980 |
Document ID | / |
Family ID | 38873866 |
Filed Date | 2010-09-09 |
United States Patent
Application |
20100225223 |
Kind Code |
A1 |
KIM; Hoon ; et al. |
September 9, 2010 |
MANUFACTURING METHOD FOR DISPLAY DEVICE, MANUFACTURING APPARATUS
FOR THE SAME AND DISPLAY DEVICE MADE BY THE SAME
Abstract
A manufacturing method for manufacturing a display device
includes forming a discontinuous organic layer on at least one of a
cover substrate and an insulating substrate provided with a display
device element, arranging the insulating substrate and the cover
substrate with facing each other for the organic layer to be
interposed therebetween, and assembling the cover substrate and the
insulating substrate by pressing the substrates together.
Inventors: |
KIM; Hoon; (Hwaseong-si,
KR) ; Koo; Won-Hoe; (Suwon-si, KR) ; Choi;
Jung-mi; (Yongin-si, KR) |
Correspondence
Address: |
H.C. PARK & ASSOCIATES, PLC
8500 LEESBURG PIKE, SUITE 7500
VIENNA
VA
22182
US
|
Assignee: |
Samsung Electronics Co.,
Ltd.
Suwon-si
KR
|
Family ID: |
38873866 |
Appl. No.: |
12/783980 |
Filed: |
May 20, 2010 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
|
|
11756861 |
Jun 1, 2007 |
7744719 |
|
|
12783980 |
|
|
|
|
Current U.S.
Class: |
313/317 ;
445/66 |
Current CPC
Class: |
Y10T 428/265 20150115;
H01L 51/5246 20130101 |
Class at
Publication: |
313/317 ;
445/66 |
International
Class: |
H01J 5/00 20060101
H01J005/00; H05B 33/10 20060101 H05B033/10 |
Foreign Application Data
Date |
Code |
Application Number |
Jun 23, 2006 |
KR |
10-2006-0056876 |
Claims
1. A manufacturing apparatus for manufacturing a display device,
comprising: a table to mount a substrate; a mask disposed on the
table; a squeeze to scan from one side of the mask to the other
side of the mask to form a thin layer on the substrate; and a
squeeze driving unit to drive the squeeze, wherein the mask
comprises a plurality of mesh parts separately arranged on the
mask, and a blocking part surrounding the mesh parts.
2. The manufacturing apparatus for manufacturing a display device
of claim 1, wherein the mesh parts are substantially identical in
size and are formed substantially uniformly on the mask.
3. The manufacturing apparatus for manufacturing a display device
of claim 1, wherein the mesh parts comprise first mesh parts formed
at a central portion of the mask and second mesh parts formed
around a periphery of the first mesh parts.
4. The manufacturing apparatus for manufacturing a display device
of claim 3, wherein an interval between the first mesh parts is
greater than an interval between the second mesh parts.
5. The manufacturing apparatus for manufacturing a display device
of claim 3, wherein the first mesh parts comprise first sub mesh
parts and second sub mesh parts smaller than the first sub mesh
parts and placed between the first sub mesh parts.
6. The manufacturing apparatus for manufacturing a display device
of claim 3, wherein the mesh parts extend in parallel with each
other.
7. A display device, comprising: an insulating substrate comprising
a display device element; a cover substrate facing the insulating
substrate; and an organic layer interposed between the insulating
substrate and the cover substrate, wherein the organic layer at a
periphery of the insulating substrate has a thickness different
from a thickness of the organic layer at a central portion of the
insulating substrate.
8. The display device of claim 7, wherein the organic layer at the
periphery of the insulating substrate is thinner than the organic
layer at the central portion of the insulating substrate.
9. The display device according to claim 8, wherein the organic
layer at the periphery of the insulating substrate is between 1
.mu.m and 20 .mu.m thick.
Description
CROSS-REFERENCE TO RELATED APPLICATIONS
[0001] This application is a divisional of U.S. patent application
Ser. No. 11/756,861 filed Jun. 1, 2007 and claims priority from and
the benefit of Korean Patent Application No. 10-2006-0056876, filed
on Jun. 23, 2006, which are both hereby incorporated by reference
for all purposes as if fully set forth herein.
BACKGROUND OF THE INVENTION
[0002] 1. Field of the Invention
[0003] The present invention relates to a manufacturing method for
display device, a manufacturing apparatus for the same, and a
display device made by the same, particularly, to a manufacturing
method that may minimize permeation of oxygen and moisture from a
side surface of a display device, a manufacturing apparatus used
for the display device, and a display device manufactured by the
same.
[0004] 2. Discussion of the Background
[0005] Recently, the organic light emitting diode (OLED) device has
attracted attention and interest in the industry of flat panel
display devices because of its low driving voltage, slim shape,
light weight, and high-speed response.
[0006] An OLED device typically includes a thin film transistor
including a gate electrode, a source electrode, and a drain
electrode; a pixel electrode connected with the thin film
transistor; a wall dividing the pixel electrodes; a light emitting
layer formed on the pixel electrodes disposed on regions between
the walls; and a common electrode formed on the light emitting
layer.
[0007] The light emitting layer is formed of an organic material
and is capable of emitting light. Moisture and oxygen may
deteriorate the light emitting layer and decrease its quality and
life time. In order to prevent the light emitting layer from
deteriorating, the light emitting layer may be encapsulated with a
cover substrate. Further, an organic material such as a sealant
interposed between the insulating substrate and the cover substrate
blocks the permeation of oxygen and moisture.
[0008] However, organic materials such as the sealant have a
relatively high permeation rate of oxygen and moisture. Thus, the
quality and life time of the display device may be decreased if
there is a large gap to be sealed between the two substrates.
SUMMARY OF THE INVENTION
[0009] The invention provides a manufacturing method of a display
device that may minimize the permeation of oxygen and moisture.
[0010] The present invention also provides a manufacturing
apparatus for manufacturing a display device that may minimize the
permeation of oxygen and moisture.
[0011] The present invention also provides a display device that
may minimize the permeation of oxygen and moisture.
[0012] The present invention discloses a manufacturing method for
manufacturing a display device including forming a discontinuous
organic layer on at least one of a cover substrate and an
insulating substrate, with the insulating substrate including a
display device element, arranging the insulating substrate and the
cover substrate to face each other with the discontinuous organic
layer interposed therebetween, and pressing the cover substrate and
the insulating substrate together.
[0013] The present invention also discloses a manufacturing
apparatus for manufacturing a display device including a table to
mount a substrate, a mask disposed on the table, a squeeze to scan
from one side of the mask to the other side of the mask to form a
thin layer on the substrate, and a squeeze driving unit to drive
the squeeze. The mask includes a plurality of mesh parts separately
arranged on the mask, and a blocking part surrounding the mesh
parts.
[0014] The present invention also discloses a display device
including an insulating substrate provided with a display device
element; a cover substrate facing the insulating substrate, and an
organic layer interposed between the insulating substrate and the
cover substrate, the organic layer at a periphery of the insulating
substrate having a thickness different from a thickness at a
central portion of the insulating substrate.
[0015] It is to be understood that both the foregoing general
description and the following detailed description are exemplary
and explanatory and are intended to provide further explanation of
the invention as claimed.
BRIEF DESCRIPTION OF THE DRAWINGS
[0016] The accompanying drawings, which are included to provide a
further understanding of the invention and are incorporated in and
constitute a part of this specification, illustrate embodiments of
the invention, and together with the description serve to explain
the principles of the invention.
[0017] FIG. 1 is a cross sectional view of a display device
according to a first exemplary embodiment of the present
invention.
[0018] FIG. 2A, FIG. 2B, FIG. 2C, FIG. 2D, and FIG. 2E are figures
explaining manufacturing methods for the display device according
to the first exemplary embodiment of the present invention.
[0019] FIG. 3 is a cross sectional view of a display device
according to a second exemplary embodiment of the present
invention.
[0020] FIG. 4 explains a manufacturing method for a display device
according to the second exemplary embodiment of the present
invention.
[0021] FIG. 5A, FIG. 5B, FIG. 6, and FIG. 7 explain manufacturing
methods for manufacturing display devices according to third,
fourth, and fifth exemplary embodiments of the present
invention.
[0022] FIG. 8 explains a manufacturing apparatus for the display
device manufactured with the manufacturing method according to the
present invention.
[0023] FIG. 9 is a cross sectional view cut along line IX-IX of
FIG. 8.
[0024] FIG. 10A, FIG. 10B, FIG. 10C, FIG. 10D, and FIG. 10E show
various shapes of masks used in the manufacturing apparatus for the
display device.
DETAILED DESCRIPTION OF THE ILLUSTRATED EMBODIMENTS
[0025] The invention is described more fully hereinafter with
reference to the accompanying drawings, in which embodiments of the
invention are shown. This invention may, however, be embodied in
many different forms and should not be construed as limited to the
embodiments set forth herein. Rather, these embodiments are
provided so that this disclosure will be thorough and complete, and
will fully convey the scope of the invention to those skilled in
the art. In the drawings, the size and relative sizes of layers and
regions may be exaggerated for clarity.
[0026] It will be understood that when an element or layer is
referred to as being "on", "connected to" or "coupled to" another
element or layer, it can be directly on, connected or coupled to
the other element or layer or intervening elements or layers may be
present. In contrast, when an element is referred to as being
"directly on," "directly connected to" or "directly coupled to"
another element or layer, there are no intervening elements or
layers present. Like numbers refer to like elements throughout. As
used herein, the term "and/or" includes any and all combinations of
one or more of the associated listed items.
[0027] Though the case of forming an organic layer 120 on a cover
substrate 110 is explained below for an example, the present
invention is not limited to such a case but can be applied also for
cases like forming an organic layer 120 on an insulating substrate
130 and forming an organic layer 120 on both substrates 130 and
110.
[0028] FIG. 1 is a cross sectional view of a display device
according to a first exemplary embodiment of the present
invention.
[0029] Generally, an OLED 100 may include a self light-emitting
device made of an organic material emitting a light by an applied
electric signal. The function and life time of such an organic
material is vulnerable to moisture and oxygen. Thus, a sealing
method should be able to protect the organic material (organic
light emitting layer) from oxygen and moisture.
[0030] The OLED 100 according to the first exemplary embodiment of
the present invention includes the insulating substrate 130
provided with a display device element 140, the cover substrate 110
facing the insulating substrate 130, and the organic layer 120
interposed between the insulating substrate 130 and the cover
substrate 110.
[0031] The insulating substrate 130 is a transparent substrate and
may include a glass substrate and a plastic substrate. Though not
illustrated, a blocking layer may be formed on an upper surface of
the insulating substrate 130, namely, between the display device
element 140 and the insulating substrate 130. The blocking layer
blocks oxygen and moisture that can permeate the display device
element 140 through the insulating substrate 130 and may be formed
of materials including SiON, SiO.sub.2, SiN.sub.x, and
Al.sub.2O.sub.3. The blocking layer may be formed by methods like
sputtering etc.
[0032] The display device element 140 includes a thin film
transistor T including gate electrode 141, a source electrode 142,
and a drain electrode 143, a pixel electrode 144 connected to the
thin film transistor T, a wall 145 dividing each pixel electrode
144, an organic light emitting layer 146 formed on the pixel
electrode 144 on a region between the walls 145, and a common
electrode 147 formed on the organic light emitting layer 146. The
display device element 140 displays an image corresponding to an
input image signal from an information processing device.
[0033] The cover substrate 110 may be made of a material identical
to the material of the insulating substrate 130. A soda-lime
silicate glass substrate, a boro-silicate glass substrate, a
silicate glass substrate, and a lead glass substrate may be used
for the cover substrate 110. The width of the cover substrate 110
may be between 0.1 mm and 10 mm and more preferably between 1 mm
and 10 mm to prevent the permeation of moisture and oxygen to the
display device element 140 through the cover substrate 110.
[0034] The organic layer 120 is interposed between two substrates
110 and 130. The organic layer 120 covers the display device
element 140 and is responsible for protecting the organic light
emitting layer 146 from moisture and oxygen and coupling the
insulating substrate 130 to the cover substrate 110. The organic
layer 120 may be formed of a sealant including acryl resin and
epoxy resin.
[0035] The OLED 100 manufactured by a method according to the first
exemplary embodiment of the present invention has a short distance
D1 between the two substrates 110 and 130. More specifically, the
distance D1 between the two substrates 110 and 130 may be in a
range of 1 .mu.m to 20 .mu.m.
[0036] FIG. 2A, FIG. 2B, FIG. 2C, FIG. 2D, and FIG. 2E explain the
method of manufacturing the display device according to the first
exemplary embodiment of the present invention.
[0037] The method of manufacturing the OLED 100 (refer to FIG. 1)
according to the first exemplary embodiment of the present
invention, as illustrated in FIG. 2A, uniformly forms a
discontinuous organic layer including a plurality of organic layers
120a on the front surface of the cover substrate 110 spaced apart
at equal intervals. Here, the organic layers 120a are responsible
for protecting the light emitting layer 146 (refer to FIG. 1) from
moisture and oxygen and for coupling the insulating substrate 130
to the cover substrate 110. The organic layers 120a may be formed
of a sealant including acryl resin and epoxy resin.
[0038] The methods for uniformly forming the plurality of organic
layers 120a on the front surface of the cover substrate 110 may
include screen printing, roll printing, slit coating, etc. Screen
printing is a method using a mask formed with a pattern
corresponding to a pattern of the organic layers 120a to be formed;
roll printing is a method using a roll formed with a groove filled
with the organic material to be transferred to the cover substrate
110 by rolling the roller; and slit coating is a method using a
slit coater to form the organic layers 120a on the cover substrate
110.
[0039] The organic layers 120a according to the first exemplary
embodiment of the present invention are substantially identical in
size. The thickness D2 of the organic layers 120a is between 3
.mu.m and 20 .mu.m, and the area thereof is equal to or larger than
1 .mu.m.sup.2. Forming the organic layers 120a with a thickness D2
equal to or less than 3 .mu.m may be difficult, and the organic
layers 120a of such thickness are too thin to be effective
adhesives. If the thickness D2 of the organic layers 120a is equal
to or larger than 20 .mu.m, the cover substrate 110 and the
insulating substrate 130 are too far apart, and the amount of
oxygen and moisture permeating the two substrates 110 and 130
increases. Though the area of the organic layers 120a may be large
or small depending on the size of the cover substrate 110, it may
be difficult to form their area smaller than 1 .mu.m.sup.2. An
interval r1 between the organic layers 120a is proportional to the
area of organic layers 120a and the pressure applied when
assembling the two substrates 110 and 130. Specifically, as the
area of the organic layers 120a and the pressure increase,
spreading of the organic layers 120a in a direction parallel to the
substrates 110 and 130 increases, so that the interval r1 between
the organic layers 120 may be set larger. The thickness D2, the
area, and the interval r1 of the organic layers 120a should be
determined so there is no open space in the organic layer 120 once
the two substrates 110 and 130 are assembled.
[0040] After forming the substantially uniform organic layers 120a
on the cover substrate 110, as shown in FIG. 2B, the cover
substrate 110 and the insulating substrate 130 are arranged facing
each other with the organic layers 120a between them. Alignment
keys (not shown) may be provided on the cover substrate 110 and the
insulating substrate 130 for aligning the two substrates 110 and
130. The arrangement and alignment of the two substrates 110 and
130 may be performed in a vacuum chamber. The vacuum chamber
minimizes permeation of air between two substrates 110 and 130 and
decreases residual air or voids in the organic layer 120.
[0041] Then, as illustrated in FIG. 2C, a predetermined pressure is
applied to the two substrates 110 and 130. The pressure is
calculated considering the density, area, thickness D2, and
interval r1 of the organic layers 120a. Applying pressure spreads
the organic layers 120a in a direction parallel to the substrates
110 and 130, and accordingly the distance D1 between two substrates
110 and 130 becomes smaller than the thickness D2 of the organic
layers 120a.
[0042] As illustrated in FIG. 2D, the pressure spreads the organic
layers 120a in a radial direction parallel to the substrate 110 and
gradually fills up the open space between the organic layers 120a.
Here, the pressure is applied until there is no open space between
the organic layers 120a.
[0043] As illustrated in FIG. 2E, after filling up the open space
between the organic layers 120a, the organic layer 120 is cured by
applying heat and/or light. Through curing of the organic layer
120, the two substrates 110 and 130 are coupled to each other.
According to the exemplary embodiment, the coupling of the two
substrates 130 and 110 and the curing of the organic layer 120 are
performed in a vacuum chamber. For a different exemplary
embodiment, the curing of the organic layer 120 may be performed
outside of a vacuum chamber.
[0044] As mentioned above, the organic layers 120a are formed to
spread and fill up the space between the organic layers 120a to
effectively coat the organic layer 120 on the whole front surface
and minimize the distance D1 between the two substrates 110 and
130. Accordingly, the amount of oxygen and moisture that can
permeate through the two substrates 110 and 130 may be minimized.
It may also reduce a manufacturing cost by reducing the necessary
amount of the organic layer 120.
[0045] Hereinafter, a display device according to a second
exemplary embodiment of the present invention is explained
referring to FIG. 3. Only different parts from the first exemplary
embodiment are selected and explained, and the same components are
denoted with the same reference numerals of the first exemplary
embodiment.
[0046] FIG. 3 is a cross sectional view of a display device
according to the second exemplary embodiment of the present
invention. A cover substrate 110, an insulating substrate 130, and
the display device element 140 are identical to those of the
display device according to the first exemplary embodiment.
[0047] The thickness of an organic layer 120 on the center of the
insulating substrate 130 is different from that on the periphery of
the insulating substrate 130. Specifically, the organic layer 120
on the periphery of the insulating substrate 130 is formed with a
thickness D3, which is less than a thickness D4 of the organic
layer 120 formed at the center of the insulating substrate 130.
Here, the thickness D3 of the organic layer 120 on the periphery of
the insulating substrate 130 may be between 1 .mu.m and 20
.mu.m.
[0048] Hereinafter, the second exemplary embodiment of the present
invention is explained referring to FIG. 4. In the second exemplary
embodiment, a characteristic part different from the first
exemplary embodiment is selectively explained, and the omitted
explanation may follow the first exemplary embodiment. The same
components are denoted with the same reference numerals of the
first exemplary embodiment.
[0049] FIG. 4 is a figure explaining the manufacturing method for
the display device according to the second exemplary embodiment of
the present invention. As illustrated in FIG. 4, a pattern form of
the organic layers 120a according to the second exemplary
embodiment is different from that of the first exemplary
embodiment. The organic layers 120a according to the second
exemplary embodiment include first organic layers 121 on a central
portion of the cover substrate 110 and second organic layers 122 on
the cover substrate 110 and substantially surrounding the first
organic layers 121. The first organic layers 121 have a larger area
than the second organic layers 122, and an interval r2 between
first organic layers 121 is greater than an interval r3 between
second organic layers 122. The intervals r2 and r3 are made
different due to the different spreading degrees of the first and
second organic layers 121 and 122. If the first and second organic
layers 121 and 122 are formed by screen printing, the first organic
layers 121 are formed thicker than the second organic layers 122.
Thus, for the same pressure applied to the two substrates 110 and
130, the first organic layers 121 spread more readily than the
second organic layers 122. Although the first organic layers 121
spread wider than the second organic layers 122 when pressing the
substrates 110 and 130 together, the first organic layers 121 are
thicker than the second organic layers 122 and make an OLED 100
(see FIG. 3) with a structure of a thickness D3 (see FIG. 3) around
the periphery of the assembled two substrates 110 and 130 that is
less than a thickness D4 (see FIG. 3) at the center of the two
substrates 110 and 130.
[0050] FIG. 5A and FIG. 5B are figures explaining manufacturing
methods for manufacturing display devices according to a third
exemplary embodiment of the present invention.
[0051] As illustrated in FIG. 5A, in the third exemplary embodiment
a pattern of the organic layers 120a are different from those of
the first and the second exemplary embodiments. The first organic
layers 121 includes first sub organic layers 121a and second sub
organic layers 121b disposed between the first sub organic layers
121a. More specifically, the second sub organic layers 121b have a
smaller area than the first sub organic layers 121a and are
substantially surrounded by four adjacent first sub organic layers
121a. That is, the second sub organic layers 121b are each
positioned at a center of four neighboring first sub organic layers
121a. The reason for providing the second sub organic layers 121b
is as follows. As illustrated in FIG. 5B, the first sub organic
layers 121a spreading in a rectangular shape during an assembling
process may leave an open space between the first sub organic
layers 121a because of the distance from each first sub organic
layer 121a to a center region `a` of four neighboring first sub
organic layers 121a. This defect may reduce the reliability of the
product. To solve this problem, a smaller second sub organic layer
121b is formed at the center region `a` of the neighboring four
first sub organic layers 121a, and the first organic layers 121 may
be formed without any open space.
[0052] FIG. 6 and FIG. 7 are figures explaining manufacturing
methods for manufacturing display devices according to fourth and
fifth exemplary embodiments of the present invention.
[0053] The fourth exemplary embodiment is, as illustrated in FIG.
6, obtained by changing a position of the second sub organic layers
121b in the third exemplary embodiment. More specifically, the
second sub organic layers 121b are disposed between horizontally
adjacent first sub organic layers 121a. On the other hand, the
second sub organic layers 121b may be disposed between vertically
adjacent first sub organic layers 121a.
[0054] In a fifth exemplary embodiment as illustrated in FIG. 7, a
plurality of organic layers 120a (continuously) extend in one
direction and are spaced apart a predetermined interval from one
another. The organic layers 120a are arranged parallel to each
other.
[0055] Hereinafter, a manufacturing apparatus used for the present
manufacturing method of the present invention is explained. More
specifically, a screen printing apparatus is explained.
[0056] FIG. 8 is a figure explaining a manufacturing apparatus for
the display device manufactured with the manufacturing method
according to the present invention, FIG. 9 is a cross sectional
view cut along line IX-IX of FIG. 8, and FIG. 10A, FIG. 10B, FIG.
10C, FIG. 10D, and FIG. 10E show various shapes of masks used in
the manufacturing apparatus for the display device.
[0057] A screen printing apparatus 200 according to an exemplary
embodiment of the present invention includes a table 210 mounted
with a substrate 10, a mask 220 disposed on the table 210, a mask
holder 230 supporting at least one edge of the mask 220 and
separating the mask 220 from the table 210, a squeeze 240 scanning
on the mask 220, and a squeeze driving unit 250 to drive the
squeeze 240.
[0058] The substrate 10 is arranged on the table 210. Here, the
substrate 10 may include the cover substrate 110 (see FIG. 1) or
the insulating substrate 130 (see FIG. 1).
[0059] The mask 220 is disposed on the table 210. The mask 220
includes mesh parts 221 corresponding to the substrate 10, a
blocking part 225 surrounding the mesh parts 221, and a mask frame
227 provided at at least one edge of the blocking part 225 and used
in holding the mask 220.
[0060] The mesh parts 221 are spaced apart from one another. The
mesh parts 221 of approximately rectangular shapes as illustrated
in FIG. 10A have substantially identical areas and are formed
substantially uniformly on the front surface of the mask 220. The
mask 220 of FIG. 10A is for forming a pattern of the organic layers
120 (see FIG. 2A) according to the first exemplary embodiment.
[0061] On the other hand, the mesh parts 221 as illustrated in FIG.
10B include first mesh parts 222 at a central portion of the mask
220 and second mesh parts 223 formed along the periphery of the
first mesh parts 222. The first mesh parts 222 have a larger area
than the second mesh parts 223. An interval t1 between first mesh
parts 222 is greater than an interval t2 between second mesh parts
223. The mask 220 of FIG. 10B is for forming a pattern of the
organic layers 120a (see FIG. 4) according to the second exemplary
embodiment.
[0062] For another exemplary embodiment, as illustrated in FIG.
10C, the mesh parts 221 include first mesh parts 222 at a central
portion of the mask 220 and second mesh parts 223 formed along the
periphery of the first mesh parts 222. The first mesh parts 222
include first sub mesh parts 222a and second sub mesh parts 222b,
which have a smaller area than the first sub mesh parts 222a and
are interposed between the first sub mesh parts 222a. The first sub
mesh parts 222 have a larger area than the second mesh parts 223,
and the second sub mesh parts 222b have a smaller area than the
second mesh parts 223. More specifically, the second sub mesh parts
222b are substantially surrounded by four adjacent first sub mesh
parts 222a. Namely, the second sub mesh parts 222b are interposed
at the center of four adjacent first sub mesh parts 222a. The mask
220 of FIG. 10C is for forming a pattern of the organic layers 120a
(see FIG. 5A) according to the third exemplary embodiment.
[0063] For another exemplary embodiment, as illustrated in FIG.
10D, second sub mesh parts 222b are provided between horizontally
adjacent first sub mesh parts 222a. In FIG. 10D, the second mesh
parts 222b of FIG. 10C are in a different position. Though not
illustrated, the second sub mesh parts 222b may be provided between
vertically adjacent first sub mesh parts 222a. The mask 220 of FIG.
10D is for forming a pattern of the organic layers 120a (see FIG.
6) according to the fourth exemplary embodiment.
[0064] For another exemplary embodiment, plural mesh parts 221 are
spaced apart a predetermined distance and extend parallel to one
another. The mask 220 of FIG. 10E is for forming a pattern of the
organic layers 120a (see FIG. 7) according to the fifth exemplary
embodiment.
[0065] The mesh parts 221 may be provided in various shapes other
than a rectangle such as circles, ovals, and polygons including
diamonds.
[0066] The blocking part 225 may be made of flexible materials
including plastics and is attached at a periphery part of the mesh
parts 221 to keep the mesh parts 221 from sagging. The blocking
part 225 moves up and down with the mesh parts 221 by pressure of
the squeeze 240. The mask frame 227 mounted on the mask holder 230
supports and keeps the mask 220 from shaking during an operation of
the squeeze 240.
[0067] The mask holders 230 are provided at both ends of the screen
printing apparatus. The mask holder 230 keeps the mask 220 from
moving during the operation of the squeeze 240 and keeps the mask
220 a predetermined distance apart from the substrate 10.
[0068] The squeeze 240 scans the mask 220 and forms the organic
layers 120a by filling the mesh parts 221 with an organic material.
In detail, the squeeze 240 moves in a rectilinear path on the mask
220 from a first blocking part 225a at one edge of the mask 220 to
a second blocking part 225b at the other edge of the mask 220 and
fills up the mesh parts 221 with an organic material 125
accumulated on the first blocking part 225a at the edge. At the
same time, the squeeze 240 pressures the mesh parts 221 toward the
substrate 10 and accordingly forms the organic layers 120a of a
predetermined thickness.
[0069] The squeeze driving unit 250 drives the squeeze 240 to move
in horizontal and vertical directions.
[0070] As apparent from the above description, the present
invention provides the manufacturing method for the display device
that may minimize a permeation of oxygen and moisture.
[0071] The present invention also provides the manufacturing
apparatus for manufacturing the display device that may minimize
the permeation of oxygen and moisture.
[0072] Further, the present invention provides the display device
that may minimize the permeation of oxygen and moisture.
[0073] It will be apparent to those skilled in the art that various
modifications and variation can be made in the present invention
without departing from the spirit or scope of the invention. Thus,
it is intended that the present invention cover the modifications
and variations of this invention provided they come within the
scope of the appended claims and their equivalents.
* * * * *