U.S. patent application number 12/755860 was filed with the patent office on 2010-08-05 for cleaning member, cleaning method, and device manufacturing method.
Invention is credited to Yuichi SHIBAZAKI.
Application Number | 20100195068 12/755860 |
Document ID | / |
Family ID | 39157309 |
Filed Date | 2010-08-05 |
United States Patent
Application |
20100195068 |
Kind Code |
A1 |
SHIBAZAKI; Yuichi |
August 5, 2010 |
CLEANING MEMBER, CLEANING METHOD, AND DEVICE MANUFACTURING
METHOD
Abstract
A cleaning member is smaller than a substrate for exposure where
exposure light is irradiated, and at least part of a
substrate-holding member that holds a rear face of the substrate
for exposure is held by the substrate-holding member in order to
clean.
Inventors: |
SHIBAZAKI; Yuichi;
(Kumagaya-shi, JP) |
Correspondence
Address: |
STAAS & HALSEY LLP
SUITE 700, 1201 NEW YORK AVENUE, N.W.
WASHINGTON
DC
20005
US
|
Family ID: |
39157309 |
Appl. No.: |
12/755860 |
Filed: |
April 7, 2010 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
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11851864 |
Sep 7, 2007 |
|
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12755860 |
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Current U.S.
Class: |
355/30 ;
134/10 |
Current CPC
Class: |
H01L 21/67051 20130101;
G03F 7/70716 20130101; Y10T 29/49 20150115; G03F 7/70341 20130101;
H01L 21/68735 20130101; H01L 21/6875 20130101 |
Class at
Publication: |
355/30 ;
134/10 |
International
Class: |
G03B 27/52 20060101
G03B027/52; B08B 7/00 20060101 B08B007/00 |
Foreign Application Data
Date |
Code |
Application Number |
Sep 8, 2006 |
JP |
P2006-244271 |
Claims
1. A lithographic apparatus comprising: a substrate table
constructed to hold a substrate; a recess in the substrate table
configured to receive an object; and a cleaning fluid supply device
configured to supply cleaning fluid to at least an outer area of
the recess.
2. The lithographic apparatus of claim 1, further comprising a
reservoir of cleaning fluid.
3. The lithographic apparatus of claim 1, wherein the cleaning
fluid supply device comprises a cleaning fluid inlet into the
recess.
4. The lithographic apparatus of claim 3, wherein a position of the
cleaning fluid inlet is such that flow of cleaning fluid from the
inlet is at least partly radially outwardly relative to a center of
the object.
5. The lithographic apparatus of claim 3, wherein the cleaning
fluid inlet is moveable relative to the substrate table.
6. The lithographic apparatus of claim 5, wherein the cleaning
fluid inlet is in a liquid confinement system configured to at
least partly confine immersion liquid to a space between a
projection system and the substrate table.
7. (canceled)
8. The lithographic apparatus of claim 3, wherein the cleaning
fluid inlet is formed adjacent an end of an elongate member.
9. The lithographic apparatus of claim 8, wherein the elongate
member is a supply pipe.
10. The lithographic apparatus of claim 1, further comprising a
controller configured to activate an underpressure source in a
drain to remove cleaning fluid from the drain.
11. The lithographic apparatus of claim 1, further comprising a
controller configured to control a relative position of at least
part of the cleaning fluid supply device and an outer area of a
drain so that cleaning fluid can be supplied around the whole
periphery of the recess.
12. The lithographic apparatus of claim 1, wherein the apparatus is
an immersion lithographic apparatus and comprises a drain in the
substrate table to receive immersion liquid which leaks, in use,
past an edge of the object into the recess.
13. The lithographic apparatus of claim 12, wherein the drain is in
the outer area of the recess.
14. The lithographic apparatus of claim 12, further comprising a
controller configured to ensure that a continuous flow of cleaning
fluid into the drain is present.
15. The lithographic apparatus of claim 12, wherein the immersion
liquid and cleaning fluid are different fluids.
16. The lithographic apparatus of claim 1, wherein the cleaning
fluid supply device is configured to provide a cleaning fluid which
is comprised of water and at least one component selected from the
following components: a surfactant, a solvent, a detergent, a
liquefied gas or a dissolved gas.
17. (canceled)
18. The lithographic apparatus of claim 16, wherein the dissolved
gas comprises ozone or hydrogen.
19. The lithographic apparatus of claim 1, further comprising an
extraction outlet which is a separate outlet to an outlet of a
drain.
20. The lithographic apparatus of claim 19, wherein the extraction
outlet is formed adjacent an end of an elongate member.
21. The lithographic apparatus of claim 19, wherein the extraction
outlet is moveable relative to the substrate table and/or is part
of a liquid confinement system configured to at least partly
confine immersion liquid between a projection system and the
substrate table.
22. The lithographic apparatus of claim 1, wherein the object is a
substrate.
23. An immersion lithographic apparatus comprising: a substrate
table constructed to hold a substrate; a drain in the substrate
table configured to receive an immersion fluid which leaks, in use,
into a gap between an edge of the substrate table and an object on
the substrate table; and an inlet adjacent an end of an elongate
member configured to supply cleaning fluid to (i) the gap, or (ii)
an inlet to the drain, or (iii) the drain, or (iv) any combination
selected from (i)-(iii).
24. The immersion lithographic apparatus of claim 23, wherein the
inlet is positionable such that flow of cleaning fluid from the
inlet into the drain is at least partly radially outwardly relative
to a center of the object.
25. The immersion lithographic apparatus of claim 23, wherein the
inlet is moveable relative to the substrate table.
26. The immersion lithographic apparatus of claim 25, wherein the
inlet is on a liquid confinement system configured to at least
partly confine immersion liquid to a space between a projection
system and the substrate table.
27. The immersion lithographic apparatus of claim 23, wherein the
elongate member is in the form of a supply pipe.
28. The immersion lithographic apparatus of claim 23, further
comprising an extraction outlet which is a separate outlet to an
outlet of the drain.
29. The immersion lithographic apparatus of claim 28, wherein the
extraction outlet is formed adjacent an end of an elongate
member.
30. The immersion lithographic apparatus of claim 23, wherein the
object is a substrate.
31. A method of cleaning at least a part of a recess in a substrate
table configured to receive an object, the method comprising:
providing a cleaning fluid to at least an outer area of the recess;
and extracting the cleaning fluid from the recess.
32. The method of claim 31, wherein the method is performed when a
substrate is present in the recess on the substrate table.
33. (canceled)
34. The method of claim 31, wherein the substrate table is a
substrate table for an immersion lithographic apparatus and
comprises a drain in the recess to receive immersion liquid which
leaks, in use, past an edge of the object into the recess.
35. The method of claim 34, wherein the cleaning fluid is different
from the immersion liquid.
36. The method of claim 31, wherein the cleaning fluid is provided
to the recess through an inlet.
37. (canceled)
38. The method of claim 36, wherein the inlet is moveable relative
to the substrate table.
39. The method of claim 38, wherein the method is performed within
an immersion lithographic apparatus.
40. A lithographic projection apparatus comprising: a projection
system arranged to project a pattern towards a substrate table; a
liquid supply system arranged to supply a cleaning fluid to a gap
defined between an edge of the substrate table and a substrate when
present; and an inlet configured to remove excess fluid, wherein in
use the inlet is located in the gap and is connected to an under
pressure source so as to remove liquid from the gap.
Description
CROSS REFERENCE TO RELATED APPLICATIONS
[0001] This application is a divisional of U.S. application Ser.
No. 11/851,864, filed Sep. 7, 2007, and claims foreign priority to
Japanese Application No. 2006-244271 filed on Sep. 6, 2006, the
contents of which are hereby incorporated by reference in their
entirety.
BACKGROUND
[0002] 1. Field of the Invention
[0003] The present invention relates to a cleaning member for
cleaning a substrate-holding member that holds a substrate, a
cleaning method, and a device manufacturing method.
[0004] 2. Related Art
[0005] As an exposure apparatus used in a photolithography process,
an immersion exposure apparatus that exposes a substrate via liquid
is conventionally known, and is disclosed, for example, in PCT
International Publication No. WO 99/49504 and Japanese Patent
Application, Publication No. 2004-289127.
[0006] In an immersion exposure apparatus, when liquid infiltrates
into places such as a gap between a substrate and a
substrate-holding member, there is a possibility that part of the
substrate-holding member be polluted by the infiltrating liquid, or
by foreign bodies and impurities that have become mixed in the
liquid. If the substrate-holding member is left in this polluted
state, there are possibilities that it will become unable to
properly hold the substrate, that the substrate it holds will
become polluted, and that pollution will spread. Such problems can
make it impossible to properly expose the substrate.
[0007] A purpose of some aspects of the invention is to provide a
cleaning member and a cleaning method that can properly clean a
substrate-holding member. Another purpose is to provide a method of
manufacturing a device by holding a substrate in a
substrate-holding member that is cleaned in that manner.
SUMMARY
[0008] According to a first aspect of the invention, there is
provided a cleaning member for cleaning at least part of a
substrate-holding member that holds a rear face of a substrate onto
which exposure light is irradiated, the cleaning member being held
by the substrate-holding member, and having an outer diameter that
is smaller than the substrate.
[0009] According to the first aspect of the invention, the
substrate-holding member can be properly cleaned.
[0010] According to a second aspect of the invention, there is
provided a cleaning method of cleaning at least part of the
substrate-holding member by holding the above-described cleaning
member with the substrate-holding member.
[0011] According to the second aspect of the invention, the
substrate-holding member can be properly cleaned.
[0012] According to a third aspect of the invention, there is
provided a cleaning method of cleaning at least part of a
substrate-holding member that holds a substrate onto which exposure
light is irradiated, the method comprising: holding a cleaning
member with the substrate-holding member, the cleaning member
having substantially the same external shape as the substrate, and
an outer diameter that is smaller than the substrate; and supplying
a liquid that is used for cleaning at least part of the
substrate-holding member.
[0013] According to the third aspect of the invention, the
substrate-holding member can be properly cleaned.
[0014] According to a fourth aspect of the invention, there is
provided a device manufacturing method comprising: cleaning a
substrate-holding member using the cleaning method described above;
holding a substrate by use of the substrate-holding member; and
exposing the substrate held by the substrate-holding member with
exposure light.
[0015] According to the fourth aspect of the invention, by holding
the substrate with a properly cleaned substrate-holding member and
exposing the substrate to light, it is possible to manufacture a
device having a desired performance.
BRIEF DESCRIPTION OF THE DRAWINGS
[0016] FIG. 1 is a view of a general configuration of an exposure
apparatus according to a first embodiment;
[0017] FIG. 2 is a side cross-sectional view of a table according
to the first embodiment;
[0018] FIG. 3 is a plan view of a table during a state of holding a
substrate;
[0019] FIG. 4 is a side cross-sectional view of primary parts of a
table according to the first embodiment;
[0020] FIG. 5 is an explanatory schematic view of an operation of a
table according to the first embodiment;
[0021] FIG. 6 is an explanatory schematic view of an operation of a
table according to the first embodiment;
[0022] FIG. 7 is a view of a cleaning member according to the first
embodiment;
[0023] FIG. 8 is an explanatory schematic view of a cleaning method
according to the first embodiment;
[0024] FIG. 9 is an enlarged view of part of FIG. 8;
[0025] FIG. 10 is an explanatory schematic view of a cleaning
method according to the first embodiment;
[0026] FIG. 11 is an explanatory schematic view of a cleaning
method according to the first embodiment;
[0027] FIG. 12A is a view of a cleaning member according to a
second embodiment;
[0028] FIG. 12B is a view of a cleaning member according to the
second embodiment;
[0029] FIG. 12C is a view of a cleaning member according to the
second embodiment;
[0030] FIG. 13 is an explanatory schematic view of a cleaning
method according to the second embodiment;
[0031] FIG. 14 is an explanatory schematic view of a cleaning
method according to a third embodiment; and
[0032] FIG. 15 is a flowchart of one example of manufacturing steps
of micro device.
DESCRIPTION OF EMBODIMENTS
[0033] While the invention will now be explained with reference to
the drawings, these are not imitative of the invention. In the
explanation below, positional relationships between various members
are explained with reference to an XYZ orthogonal coordinate
system. A predetermined direction in the horizontal plane is deemed
an X-axis direction, a direction orthogonal to the X-axis direction
in the horizontal plane is deemed a Y-axis direction, and a
direction orthogonal to the X-axis direction and the Y-axis
direction (i.e. a vertical direction) is deemed a Z-axis direction.
Rotational (gradient) directions about the X-axis, the Y-axis, and
the Z-axis are respectively deemed .theta.X, .theta.Y, and
.theta.Z.
First Embodiment
[0034] A first embodiment will be explained. FIG. 1 is a view of a
general configuration of an exposure apparatus EX according to a
first embodiment. In FIG. 1, the exposure apparatus EX includes a
movable mask stage 3 that holds a mask M, a movable substrate stage
4 that holds a substrate P for exposure, an illumination system IL
that illuminates the mask M with exposure light EL, a projection
optical system PL that projects an image of a pattern of the mask M
illuminated by the exposure light EL onto the substrate P, a
conveying device 100 that can convey the substrate P with respect
to the substrate stage 4, and a control apparatus 7 that controls
the overall exposure apparatus EX.
[0035] The substrate P for exposure here is used in manufacturing a
device and includes, for example, a substrate made by applying a
photosensitive material (photo resist) to a base material as in the
case of a semiconductor wafer such as a silicon wafer, or a
substrate to which, in addition to a photosensitive material, one
or more various types of films such as a protective film (top coat
film) is applied. The substrate P for exposure is a disk-like
member whose outer shape in the XY horizontal plane is circular.
The mask M includes a reticle where a device pattern projected onto
the substrate P for exposure is formed. While this embodiment uses
a transmission type mask, a non-reflective mask can be used
instead. A transmission type mask is not limited to a binary mask
where a pattern is formed by a light-intercepting film, and also
includes, for example, a halftone type or a phase shift mask such
as spatial frequency modulation type.
[0036] The exposure apparatus EX of this embodiment is an immersion
exposure apparatus using an immersion method that enhances
resolution by substantially shortening the exposure length, and
substantially widens the focal depth. The exposure apparatus EX
includes a nozzle member 70 that is arranged facing a top face of
the substrate P, and can form an immersion space LR between itself
and the top face of the substrate P. The immersion space LR is
filled with a liquid LQ. The nozzle member 70 has a bottom face
that is opposite the top face of the substrate P, and the liquid LQ
can be held between this bottom face and the top face of the
substrate P. The nozzle member 70 holds the liquid LQ between its
bottom face and the top face of the substrate P, enabling the
immersion space LR of the liquid LQ to be formed between the nozzle
member 70 and the substrate P.
[0037] The nozzle member 70 forms the immersion space LR such that
the liquid LQ is filled into an optical path space K of the
exposure light EL on the image plane side (light-emitting side) of
the projection optical system PL, specifically, the optical path
space K of the exposure light EL between a light-emitting face
(bottom face) of a terminal optical element FL nearest the image
plane of the projection optical system PL among a plurality of
optical elements of the projection optical system PL and the
substrate P arranged on the image plane side of the projection
optical system PL. The optical path space K of the exposure light
EL contains an optical path which the exposure light EL travels
along. In this embodiment, water (pure water) is used as the liquid
LQ.
[0038] The exposure apparatus EX uses the nozzle member 70 to form
the immersion space LR at least while an image of the pattern of
the mask M is being projected onto the substrate P. The exposure
apparatus EX forms the immersion space LR such that the optical
path space K of the exposure light EL is filled with the liquid LQ,
and exposes the substrate P by irradiating the exposure light EL
passing through the mask M via the liquid LQ onto the substrate P
held by the substrate stage 4. A pattern image of the mask M is
thereby projected onto the substrate P.
[0039] The exposure apparatus EX of this embodiment utilizes a
local immersion method of forming the immersion space LR between
the nozzle member 70 and the substrate P such that one region on
the substrate P including a projection region AR of the projection
optical system PL is covered by the liquid LQ, at least while the
image of the pattern of the mask M is being projected onto the
substrate P. That is, the nozzle member 70 functions as a liquid
confinement member that confines the liquid LQ on the image plane
side of the projection optical system PL.
[0040] While this embodiment describes a case where the nozzle
member 70 forms the immersion space LR between itself and the top
face of the substrate P, the nozzle member 70 can form the
immersion space LR at the image plane side of the projection
optical system PL between itself and the top face of an object
provided at a position where the exposure light EL can be
irradiated, that is, between itself and the top face of an object
provided at a position opposite the light-emitting face of the
projection optical system PL. For example, the nozzle member 70 can
form the immersion space LR between itself and a top face (plate
member T) of the substrate stage 4, and between itself and a
cleaning member CP explained later.
[0041] The illumination system IL illuminates a predetermined
illumination region on the mask M with exposure light EL having
uniform illuminance distribution. For example, the exposure light
EL emitted from the illumination system IL can be deep ultraviolet
light (DUV) such as bright-lines (g-line, h-line, i-line) emitted
from a mercury lamp and KrF excimer laser light (wavelength 248
nm), vacuum ultraviolet light (VUV) such as ArF excimer laser light
(wavelength 193 nm) and F2 laser light (wavelength 157 nm), and the
like. In this embodiment, ArF excimer laser light is used as the
exposure light EL.
[0042] The mask stage 3 can move in the X-axis, Y-axis, and
.theta.Z directions while holding the mask M by the operation of a
mask stage driving device that includes an actuator such as a
linear motor. Positional information relating to the mask stage 3
(and the mask M) is measured by a laser interferometer 3L. The
laser interferometer 3L measures positional information of the mask
stage 3 using a measuring mirror 3K arranged on the mask stage 3.
The control apparatus 7 drives the mask stage driving device based
on the measurements of the laser interferometer 3L, and controls
the position of the mask M held on the mask stage 3.
[0043] The projection optical system PL projects an image of the
pattern of the mask M onto the substrate P at a predetermined
projection magnification. The projection optical system PL includes
a plurality of optical elements which are held in a lens barrel PK.
The projection optical system PL of this embodiment is a reduction
system with a projection magnification of, for example, 1/4, 1/5,
or 1/8. The projection optical system PL can be any of a reduction
system, an equal system, and a magnification system. In this
embodiment, an optical axis AX of the projection optical system PL
is parallel to the Z-axis direction. The projection optical system
PL can be any of a refractive system that does not include
reflective optical elements, a reflective system that does not
include refractive optical elements, and a catadioptric system that
includes reflective optical elements and refractive optical
elements. The projection optical system PL can form either an
inverted image or an erected image.
[0044] The substrate stage 4 includes a stage body 4B, a table 4T
mounted on the stage body 4B, a first holder HD1 that is fitted to
the table 4T and removably holds the substrate P, a plate member T
that is arranged such as to surround the perimeter of the substrate
P held by the first holder HD1, and a second holder HD2 that is
fitted to the table 4T and removably holds the plate member T.
[0045] Air bearings 4A support the stage body 4B with respect to a
top face (guide face) of a base member BP in a state of non-contact
therewith. The top face of the base member BP is substantially
parallel to the XY plane, and the substrate stage 4 can move in the
XY direction on the base member BP.
[0046] A substrate stage driving device includes an actuator such
as a linear motor, and the substrate stage 4 can move above the
base member BP while the first holder HD1 is holding the substrate
P. The substrate stage driving device includes a first driving
system that can move the table 4T mounted on the stage body 4B in
the X-axis, the Y-axis, and the .theta.Z direction, and a second
driving system that can move the table 4T with respect to the stage
body 4B in the Z-axis, .theta.X, and .theta.Y directions, by moving
the stage body 43 on the base member BP along the X-axis, the
Y-axis, and the .theta.Z direction.
[0047] The first driving system includes an actuator such as a
linear motor, and can move the stage body 4B in the X-axis, the
Y-axis, and the .theta.Z direction. The second driving system is
provided between the stage body 4B and the table 4T, and includes,
for example, actuators 4V such as voice coil motors, and a
measuring device (e.g. an encoder; not shown) for measuring the
drive amount of each actuator. The table 4T is supported on the
stage body 4B by at least three actuators 4V. Each of the actuators
4V can drive the table 4T independently in the Z-axis direction
with respect to the stage body 48, and the control apparatus 7
drives the table 4T in the Z-axis, the .theta.X, and the .theta.Y
directions with respect to the stage body 4B by adjusting the drive
amounts of the three actuators 4V. Thus the substrate stage driving
device including the first and second driving systems can move the
table 4T of the substrate stage 4 in six degrees of freedom
(X-axis, Y-axis, Z-axis, .theta.X, .theta.Y, and .theta.Z
directions). By controlling the substrate stage driving device, the
control unit 7 can control the position relating to the
six-degree-of-freedom directions of the top face of the substrate
for exposure P held by the first holder HD1 of the table 4T.
[0048] Positional information of the table 4T (substrate P) of the
substrate stage 4 is measured by a laser interferometer 4L. The
laser interferometer 4L uses a measuring mirror 4K fitted to the
table 4T to measure positional information of the table 4T in the
X-axis, the Y-axis, and the .theta.Z direction. Surface positional
information (positional information relating to the Z-axis,
.theta.X, and .theta.Y directions) of the top face of the substrate
P held by the first holder HD1 of the table 4T is detected by a
focus/leveling detection system (not shown). Based on measurements
taken by the laser interferometer 4L and the detected result of the
focus-leveling detection system, the control apparatus 7 drives the
substrate stage driving device, and controls the position of the
substrate P held by the first holder HD1.
[0049] The nozzle member 70 includes a liquid supply port 12 that
can supply the liquid LQ, and a liquid collection port 22 that can
collect the liquid LQ. A porous member (mesh) is provided at the
liquid collection port 22. The liquid supply port 12 is connected
via a supply flowpath formed inside the nozzle member 70, and a
supply pipe 13, to a liquid supplying device 11 that can deliver
the liquid LQ. The liquid collection port 22 is connected via a
collection flowpath formed inside the nozzle member 70, and a
collection pipe 23, to a liquid collecting device 21 that can
collect the liquid LQ.
[0050] The liquid supplying device 11 can deliver clean,
temperature-adjusted liquid LQ. The liquid collecting device 21
includes a vacuum system and the like, and can collect the liquid
LQ. Operations of the liquid supplying device 11 and the liquid
collecting device 21 are controlled by the control apparatus 7.
Liquid LQ delivered from the liquid supplying device 11 flows along
the supply pipe 13 and the supply flowpath of the nozzle member 70,
and is supplied from the liquid supply port 12 into the optical
path space K of the exposure light EL. Liquid LQ that is collected
from the liquid collection port 22 by driving the liquid collecting
device 21 flows along the collection flowpath of the nozzle member
70, passes along the collection pipe 23, and is collected by the
liquid collecting device 21. The control apparatus 7 controls the
operation of supplying liquid from the liquid supply port 12 in
parallel with the operation of collecting liquid from the liquid
collection port 22, and forms the immersion space LR of the liquid
LQ such that the optical path space K of the exposure light EL
between the terminal optical element FL and the substrate P is
filled with the liquid LQ. Incidentally, the configuration of the
nozzle member 70 is not limited to that described above, it being
possible to use, for example, a member disclosed in Japanese Patent
Application, Publication No. 2004-289127 (corresponding U.S. Pat.
No. 7,199,858).
[0051] In this embodiment, the exposure apparatus EX includes a
detecting device 26 that can detect the quality (water quality) of
the liquid LQ collected from the liquid collection port 22. The
detecting device 26 includes, for example, a TOC gauge for
measuring total organic carbon in the liquid LQ, a particle counter
for measuring foreign bodies including tiny particles and air
bubbles, and the like, and can detect pollution or contamination
state of the liquid LQ collected from the liquid collection port
22.
[0052] Subsequently, the table 4T according to this embodiment will
be explained with reference to FIGS. 1 to 4. FIG. 2 is a side
cross-sectional view of the table 4T when the first holder HD1 is
holding the substrate P, FIG. 3 is a plan view taken from above the
table 4T when the first holder HD1 is holding the substrate P, and
FIG. 4 is a side cross-sectional view of an enlarged part of the
first holder HD1.
[0053] The table 4T includes a base 30, the first holder HD1 that
is fitted to the base 30 and removably holds the substrate P, and
the second holder HD2 that is fitted to the base 30 and removably
holds the plate member T. The plate member T held by the second
holder HD2 is disposed such as to surround the perimeter of the
substrate P held by the first holder HD1.
[0054] The first holder HD1 will be explained. As shown in FIGS. 2
to 4, the first holder HD1 includes a first peripheral wall 33 that
is formed on the base 30 and has a first top face 33A that is
opposite a perimeter region of a rear face of the substrate P held
by the first holder HD1, a second peripheral wall 34 that is formed
on the base 30, has a second top face 34A that is opposite the rear
face of the substrate P held by the first holder HD1, and is
disposed such as to surround the first peripheral wall 33, and
first supporting members 81 that are disposed at the inner side
(medial side) of the first peripheral wall 33 and supports the rear
face of the substrate P. The first supporting members 81 are formed
on a top face of the base 30 at the inner side of the first
peripheral wall 33.
[0055] Furthermore, the first holder HD1 includes a third
peripheral wall 31 that is formed on the base 30, has a third top
face 31 A that is opposite the rear face of the substrate P, and is
disposed such as to surround a first space 41 between the substrate
P held by the first holder HD1 and the base 30, and a fourth
peripheral wall 32 that is formed on the base 30, has a fourth top
face 32A that is opposite the rear face of the substrate P held by
the first holder HD1, and is disposed such as to surround the third
peripheral wall 31. The first peripheral wall 33 is disposed such
as to surround the fourth peripheral wall 32.
[0056] The first holder HD1 also includes a first suction hole 63
that is formed at the outer side of the first peripheral wall 33
and can suck fluid (at least one of fluid and ga), and a second
suction hole 61 that is formed at the inner side (medial side) of
the first peripheral wall 33 and can suck fluid (at least one of
fluid and gas). The first suction hole 63 and the second suction
hole 61 are each formed on the top face of the base 30.
[0057] In this embodiment, the first suction hole 63 is formed
between the first peripheral wall 33 and the second peripheral wall
34, and can suck fluid from a fourth space 44 between the first
peripheral wall 33 and the second peripheral wall 34. The second
suction hole 61 is formed between the first peripheral wall 33 and
the fourth peripheral wall 32, and can suck fluid from a third
space 43 between the first peripheral wall 33 and the fourth
peripheral wall 32.
[0058] The first holder HD1 also includes a flow port 60 that
enables gas to be supplied to a second space 42 between the third
peripheral wall 31 and the fourth peripheral wall 32. The flow port
60 is formed on the top face of the base 30.
[0059] The third peripheral wall 31 is formed in a ring-shape
substantially similar to the external shape of the substrate P. The
third top face 31A of the third peripheral wall 31 is arranged such
that it is opposite a region that is relatively at the outer side
of the rear face of the substrate P held by the first holder HD1.
The first space 41 is formed on the rear face side of the substrate
P held by the first holder HD1, and is surrounded by the rear face
of the substrate P, the third peripheral wall 31, and the base
30.
[0060] The fourth peripheral wall 32 is formed in a ring-shape
substantially similar to the external shape of the substrate P, and
runs along the third peripheral wall 31 at a predetermined distance
thereto. The fourth top face 32A of the fourth peripheral wall 32
is arranged such as to be opposite a region that is relatively at
the outer side of the rear face of the substrate P held by the
first holder HD1. The second space 42 is formed on the rear face
side of the substrate P held by the first holder HD1, and is
surrounded by the rear face of the substrate P, the third
peripheral wall 31, the fourth peripheral wall 32, and the base
30.
[0061] The first peripheral wall 33 is formed in a ring-shape
substantially similar to the external shape of the substrate P, and
runs along the fourth peripheral wall 32 at a predetermined
distance thereto. The first top face 33A of the first peripheral
wall 33 is arranged such as to be opposite a peripheral region of
the rear face of the substrate P held by the first holder HD1. The
third space 43 is formed on the rear face side of the substrate P
held by the first holder HD1, and is surrounded by the rear face of
the substrate P, the fourth peripheral wall 32, the first
peripheral wall 33, and the base 30.
[0062] In this embodiment, the diameter (outer diameter) of the
outer rim of the first top face 33A of the first peripheral wall 33
is smaller than the outer diameter of the substrate P. The
peripheral region of the substrate P overhangs to the outer side of
the outer rim of the first top face 33A by a predetermined amount.
In the explanation below, the region, of the substrate P held by
the first holder HD1, that overhangs to the outer side from the
peripheral rim of the first top face 33A is, where appropriate,
termed "overhang region H1" (see FIG. 4).
[0063] The second peripheral wall 34 is formed in a ring-shape
substantially similar to the external shape of the substrate P, and
runs along the first peripheral wall 33 at a predetermined distance
thereto. The second top face 34A of the second peripheral wall 34
is arranged such as to be opposite the overhang region H1 of the
rear face of the substrate R The fourth space 44 is formed on the
rear face side of the substrate P held by the first holder HD1, and
is surrounded by the overhang region H1 of the rear face of the
substrate P, the first peripheral wall 33, the second peripheral
wall 34, and the base 30.
[0064] In this embodiment, the first, second, third, and fourth
peripheral walls are substantially concentric. The first holder HD1
holds the substrate P such that the center of the first space 41
substantially matches the center of the rear face of the substrate
P.
[0065] As shown in FIG. 4, in this embodiment, a first gap G1 of,
for example, approximately 2 to 10 .mu.m is provided between the
rear face of the substrate P held by the first holder HD1 and the
third top face 31A of the third peripheral wall 31. A second gap G2
of, for example, approximately 2 to 10 .mu.m is provided between
the rear face of the substrate P held by the first holder HD1 and
the fourth top face 32A of the fourth peripheral wall 32. The first
peripheral wall 33 contacts the rear face of the substrate P held
by the first holder HD1 and the first top face 33A of the first
peripheral wall 33. Also, a fourth gap G4 of, for example,
approximately 1 to 10 .mu.m is provided between the rear face of
the substrate P held by the first holder HD1 and the second top
face 34A of the second peripheral wall 34.
[0066] The flow port 60 is connected to an outside space
(atmospheric space) via a flowpath 60R. The flow port 60 connects
to the second space 42. That is, the second space 42 opens to the
atmosphere via the flow port 60 and the flowpath 60R connected to
the flow port 60. In this embodiment, a plurality of the flow ports
60 are provided at predetermined intervals such as to surround the
third peripheral wall 31 on the base 30 between the third
peripheral wall 31 and the fourth peripheral wall 32.
[0067] The second suction hole 61 is connected via a flowpath 61R
to a sucking device including a vacuum system and the like. The
second suction hole 61 is also connected to the third space 43. By
driving the sucking device connected to the second suction hole 61,
the control apparatus 7 can suck fluid from the third space 43
through the second suction hole 61. In this embodiment, a plurality
of the second suction holes 61 are provided at predetermined
intervals such as to surround the fourth peripheral wall 32 on the
base 30 between the fourth peripheral wall 32 and the first
peripheral wall 33.
[0068] The first suction hole 63 is connected via a flowpath 63R to
a sucking device including a vacuum system and the like. The second
suction hole 61 is also connected to the fourth space 44. By
driving the sucking device connected to the first suction hole 63,
the control apparatus 7 can suck fluid from the fourth space 44
through the first suction hole 63. In this embodiment, a plurality
of the first suction holes 63 are provided at predetermined
intervals such as to surround the first peripheral wall 33 on the
base 30 between the first peripheral wall 33 and the second
peripheral wall 34.
[0069] The first supporting members 81 are pin-like protruding
members formed on the top face of the base 30, and are arranged at
a plurality of predetermined positions on the top face of the base
30. In this embodiment, a plurality of the first supporting members
81 are arranged on the top face of the base 30 at the inner side
(medial side) of the first peripheral wall 33. A plurality of the
first supporting members 81 are also arranged on the base 30 in the
first space 41 and the third space 43.
[0070] A plurality of third suction holes 62 are provided in the
base 30 of the first space 41 and the third space 43, and suck
fluid (mainly gas) in order to obtain negative pressure in those
spaces. In the first space 41, the third suction holes 62 are
formed at a plurality of predetermined positions other than in the
first supporting members 81. In the third space 43, the third
suction holes 62 are provided at positions further away from the
fourth peripheral wall 32 than the second suction holes 61.
[0071] The third suction hole 62 is connected via a flowpath 62R to
a sucking device including a vacuum system and the like. The third
suction hole 62 is also connected to the first space 41 and the
third space 43. By driving the sucking device connected to the
third suction hole 62, the control apparatus 7 can suck fluid from
spaces surrounded by the substrate P, the first peripheral wall 33,
and the base 30 (specifically, the first space 41 and the third
space 43). The control apparatus 7 uses the third suction holes 62
to suck fluid (mainly gas) from the spaces surrounded by the rear
face of the substrate P, the first peripheral wall 33, and the base
30, and creates negative pressure in those spaces, whereby the rear
face of the substrate P is held by suction to the first supporting
members 81. By canceling the suction operation of the third suction
holes 62, the control apparatus 7 can release the substrate P from
the first holder HD1. Thus in this embodiment, the first holder HD1
removably holds the substrate P. The first holder HD1 includes what
is termed a pin-chuck mechanism.
[0072] Subsequently, the plate member T and the second holder HD2
that removably holds the plate member T will be explained. The
plate member T is a separate member from the table 4T, and is
removably fitted to the base 30. A hole TH for disposing the
substrate P is substantially circular, and is provided in the
center of the plate member T. The plate member T held by the second
holder HD2 is disposed such as to surround the substrate P held by
the first holder HD1. In this embodiment, the top face of the plate
member T held by the second holder HD2 is made flat, such that it
is substantially the same height as (or flush with) the top face of
the substrate P held by the first holder HD1.
[0073] There is a fifth gap G5 of approximately 0.1 to 1.0 mm
between the edge (side face) of the outer side of the substrate P
held by the first holder HD1 and the edge (inside face) of the
inner side of the plate member T held by the second holder HD2. The
external shape of the plate member T is rectangular in the XY
plane, and in this embodiment is substantially the same as the
external shape of the base 30. The plate member T is has liquid
repellency, and is made from, for example, a fluorine resin such as
polytetrafluoroethylene (Teflon {Registered Trademark}) or a
material having liquid repellency such as acrylic resin.
[0074] The second holder HD2 includes a fifth peripheral wall 35
that is formed on the base 30, has a fifth top face 35A that is
opposite the rear face of the plate member T held by the second
holder HD2, and surrounds the second peripheral wall 34, a sixth
peripheral wall 36 that is formed on the base 30, has a sixth top
face 36A that is opposite the rear face of the plate member T held
by the second holder HD2, and surrounds the fifth peripheral wall
35, and a second supporting member 82 that is formed on the base 30
between the fifth peripheral wall 35 and the sixth peripheral wall
36, and supports the rear face of the plate member T.
[0075] The fifth top face 35A of the fifth peripheral wall 35 is
provided such that it is opposite the inner rim region (inside edge
region) of the plate member T near the hole TH. The sixth top face
36A of the sixth peripheral wall 36 is provided such that it is
opposite the outer rim region (outside edge region) of the plate
member T. A fifth space 45 is provided on the rear face side of the
plate member T held by the second holder HD2, and is surrounded by
the rear face of the plate member T, the fifth peripheral wall 35,
the sixth peripheral wall 36, and the base 30. By creating negative
pressure in this fifth space 45, the plate member T is supported on
the second supporting members 82 of the second holder HD2.
[0076] In this embodiment, the fifth peripheral wall 35 is formed
such that the rear face of the plate member T supported by the
second supporting member 82 contacts the fifth top face 35A, and
the sixth peripheral wall 36 is formed such that the rear face of
the plate member T supported by the second supporting member 82
contacts the sixth top face 36A.
[0077] The second supporting member 82 is a pin-shaped protruding
member formed on the top face of the base 30, a plurality of second
supporting members 82 being provided at predetermined positions on
the top face of the base 30 between the fifth peripheral wall 35
and the sixth peripheral wall 36.
[0078] A fourth suction hole 64 is provided in the top face of the
base 30 of the fifth space 45, and sucks fluid (mainly gas) in
order to achieve negative pressure in the fifth space 45. The
fourth suction hole 64 is for holding the plate member T by
suction. In the fifth space 45, the fourth suction holes 64 are
provided at a plurality of predetermined positions other than in
the second supporting member 82.
[0079] The fourth suction hole 64 is connected via a flowpath 64R
to a sucking device including a vacuum system and the like. The
fourth suction hole 64 is also connected to the fifth space 45. By
driving the sucking device connected to the fourth suction hole 64,
the control apparatus 7 can suck fluid from the fifth space 45
through the fourth suction hole 64. The control apparatus 7 uses
the fourth suction hole 64 to suck fluid (mainly gas) from the
fifth space 45 surrounded by the rear face of the plate member T,
the fifth peripheral wall 35, the sixth peripheral wall 36, and the
base 30, creating negative pressure in the fifth space 45, and
thereby holding the plate member T on the second supporting members
82 by suction. By canceling the suction operation of the fourth
suction holes 64, the control apparatus 7 can release the plate
member T from the second holder HD2. Thus in this embodiment, the
second holder HD2 removably holds the plate member T. The second
holder HD2 includes what is termed a pin-chuck mechanism.
[0080] A sixth space 46 is surrounded by the overhang region H1 of
the rear face of the substrate P and the second peripheral wall 34,
the fifth peripheral wall 35, and the base 30, and is connected via
an outside space (atmospheric space) to the fifth gap G5 formed
between the substrate P and the plate member T.
[0081] The fourth space 44 is connected to the outside space via
the fourth gap G4 and the fifth gap G5. That is, the fourth and
fifth gaps G4 and G5 enable fluid to flow between the fourth space
44 and the outside space.
[0082] A sixth gap G6 of approximately 1 mm is provided between the
outer side face of the first peripheral wall 33 and the inner side
face of the second peripheral wall 34, and a seventh gap G7 of
approximately 1 mm is provided between the outer side face of the
second peripheral wall 34 and the inner side face of the fifth
peripheral wall 35.
[0083] Subsequently, an operation of the table 4T having the
configuration described above and a main operation of the overall
exposure apparatus EX will be explained.
[0084] The control apparatus 7 uses the conveying device 100 to
load a substrate P for exposure processing onto the first holder
HD1 of the table 4T at a substrate replacement position (loading
position). By using the third suction hole 62 to achieve negative
pressure in the space surrounded by the first peripheral wall 33,
the control apparatus 7 makes the first supporting members 81 hold
the substrate P by suction. Before the substrate P is held by the
first holder HD1, the plate member T is held by the second holder
HD2.
[0085] In this embodiment, after loading the substrate P onto the
first holder HD1, the control apparatus 7 starts a suction
operation of the second suction hole 61. Furthermore in this
embodiment, the control apparatus 7 does not execute a suction
operation using the first suction hole 63 during immersion exposure
of the substrate P.
[0086] To perform immersion exposure of the substrate P held by the
first holder HD1, the control apparatus 7 uses the nozzle member 70
to form the immersion space LR between the nozzle member 70 and the
substrate P. The control apparatus 7 then exposes the substrate P
held by the first holder HD1 of the table 4T via the liquid LQ in
the immersion space LR.
[0087] For example, when immersion-exposing a peripheral region of
the top face of the substrate P, part of the immersion space LR is
formed between the plate member T on the outer side of the
substrate P and the nozzle member 70. That is, the immersion space
LR of the liquid LQ is formed over the fifth gap G5. In this
embodiment, since the fifth gap G5 is small, the surface tension of
the liquid LQ prevents the liquid LQ from infiltrating the fifth
gap G5. The liquid repellency of the plate member T also prevent
the liquid LQ from infiltrating the fifth gap G5.
[0088] Even if the liquid LQ infiltrates the fifth gap G5 due to a
change in pressure and the like of the liquid LQ in the immersion
space LR, and liquid LQ that infiltrates the sixth space 46 via the
fifth gap G5 then infiltrates the fourth space 44 via the fourth
gap G4, since the rear face of the substrate P is contacting (is
coherent with) the first top face 33A of the first peripheral wall
33, infiltration of the liquid LQ to the inner side of the first
peripheral wall 33 is prevented.
[0089] In this embodiment, when at least the immersion space LR is
formed, the suction operation of the second suction hole 61 is
being executed, and, as shown schematically in FIG. 5, a flow of
gas F2 is created from the second space 42 via the second gap G2
toward the third space 43. Therefore, even if, for some reason, a
gap is formed between the rear face of the substrate P and the
first top face 33A of the first peripheral wall 33, and liquid LQ
infiltrates between the rear face of the substrate P and the first
top face 33A of the first peripheral wall 33, and to the inner side
of the first peripheral wall 33, the flow of gas F2 prevents the
liquid LQ from infiltrating any further to the inner side than the
fourth peripheral wall 32.
[0090] The size of the second gap G2 is optimized, and the third
space 43 is kept at a desired pressure (negative pressure state).
Therefore, the suction holding operation of the substrate P
performed by the first holder HD1 is not obstructed. Similarly, the
size of the first gap G1 is optimized, and the suction holding
operation of the substrate P performed by the first holder HD1 is
not obstructed.
[0091] After the immersion exposure of the substrate P ends and the
immersion space LR on the substrate P and the plate member T is
removed, the control apparatus 7 starts a suction operation using
the first suction hole 63 while the first holder HD1 is still
holding the substrate P. As shown schematically in FIG. 6, this
suction operation of the first suction hole 63 creates a flow of
gas F3 from the outside space, across the fifth gap G5, toward the
first suction hole 63. The first suction hole 63 thereby collects
liquid LQ stuck in the overhang region H1 of the rear face of the
substrate P, liquid LQ in the fourth space 44, etc.
[0092] After stopping all suction operations by the first suction
hole 63, the second suction hole 61, and the third suction hole 62,
the control apparatus 7 uses a substrate-lifting mechanism such as
a lift-pin (not shown) to lift the substrate P with respect to the
first holder HD1, and, at the substrate replacement position,
unloads the substrate P from the first holder HD1 using the
conveying device 100.
[0093] As described above, there is a possibility that a part of
the table 4T, such as the first peripheral wall 33 and the second
peripheral wall 34, or the fifth peripheral wall 35, will contact
the liquid LQ that has infiltrated the fifth gap G5, and that the
part of the table 4T that contacts the liquid LQ will be polluted
or contaminated by it. When part of the substance of the substrate
P (e.g. part of the photosensitive material, or a topcoat film
covering the photosensitive material, or both) is eluted by contact
with the liquid LQ, or peels away and becomes mixed with it, there
is a possibility that liquid LQ containing that substance will
infiltrate the fifth gap G5. In that case, since the liquid LQ
containing the substance contacts the first peripheral wall 33, the
second peripheral wall 34, and so on, they will be polluted or
contaminated by the substance (e.g. part of the photosensitive
material) contained in the liquid LQ. Substances that pollute or
contaminate the first peripheral wall 33, the second peripheral
wall 34, and so on are not limited to those in the liquid LQ, and
also include, for example, substances (foreign bodies) floating in
the space where the exposure apparatus EX is provided.
[0094] In the following explanation, a substance that pollutes or
contaminates part of the table 4T such as the first peripheral wall
33 and the second peripheral wall 34, or the fifth peripheral wall
35, is termed, where appropriate, `polluting substance`.
[0095] When at least part of the table 4T holding the substrate P
(e.g. the first peripheral wall 33 and the second peripheral wall
34) is left in a polluted or contaminated state, there is a
possibility that the table 4T will become unable to properly hold
the substrate P, and that the substrate P held by the table 4T will
itself become polluted or contaminated, leading to increased
pollution or contamination. For example, if the polluting substance
is left in a state of being stuck to the first top face 33A of the
first peripheral wall 33, there is a possibility that the rear face
of the substrate P will not properly contact (be coherent with) the
first top face 33A of the first peripheral wall 33, and that the
table 4T will become unable to properly hold the substrate P. If
there is poor contact (coherence) between the rear face of the
substrate P and the first top face 33A of the first peripheral wall
33, there is also a possibility that a large amount of the liquid
LQ will infiltrate to the inner side of the first peripheral wall
33, and that the liquid LQ will stick to the rear face of the
substrate P. When a large amount of the liquid LQ infiltrates to
the inner side of the first peripheral wall 33, there is a
possibility that this will affect the substrate-holding operation
of the table 4T. Furthermore, when the liquid LQ sticks to the rear
face of the substrate P, there is a possibility that the conveying
device 100 that unloads the substrate P from the table 4T will
become wet and/or contaminated. If the polluting substance is left
sticking to the top face of the table 4T between the first
peripheral wall 33 and the second peripheral wall 34, or the top
face of the table 4T between the second peripheral wall 34 and the
fifth peripheral wall 35, there is a possibility that the polluting
substance will pass across the fifth gap G5 and infiltrate the
immersion space LR formed on at least one of the top side of the
substrate P and the top side of the plate member T, whereby the
exposure precision may be affected and the top faces of the
substrate P and the plate member T may become polluted or
contaminated.
[0096] Accordingly in this embodiment, the table 4T is cleaned
using a cleaning member CP. A cleaning method according to this
embodiment will be explained.
[0097] FIG. 7 is a schematic view of a cleaning member CP according
to this embodiment. The cleaning member CP is used in cleaning at
least part of the table 4T that holds the rear face of the
substrate P where the exposure light EL is irradiated, and is held
by the first holder HD1 of the table 4T.
[0098] In this embodiment, the cleaning member CP is a plate-like
member having substantially the same external shape as the
substrate P while being smaller than it. As already mentioned, the
external shape of the substrate P is circular in the XY plane, and
so is the external shape of the cleaning member CP. That is, the
shape of the cleaning member CP in the XY plane resembles that of
the substrate P. In this embodiment, the cleaning member CP is a
disk-like member having substantially the same thickness as the
substrate P.
[0099] As described above, the first peripheral wall 33 has
substantially the same external shape as the substrate P.
Therefore, the cleaning member CP has substantially the same
external shape as the first peripheral wall 33, similar to the
substrate P.
[0100] In the explanation below, the cleaning member CP is
abbreviated as `substrate CP` where appropriate.
[0101] The top face and rear face of the substrate CP have liquid
repellency. In this embodiment, the substrate CP is made from a
fluorine resin such as polytetrafluoroethylene (Teflon {Registered
Trademark}) or a material having liquid repellency such as acrylic
resin. The substrate CP can be made from metal, or from the same
material as the base (semiconductor wafer) of the substrate P, its
top face and rear face each being covered with a wetting material
such as fluorine resin.
[0102] FIG. 8 is a schematic view of a state where the substrate CP
is used to clean the table 4T. FIG. 9 is an enlargement of FIG. 8.
When cleaning the table 4T, the control apparatus 7 uses the
conveying device 100 to load the substrate CP onto the first holder
HD1 of the table 4T. Since the substrate CP is a plate-like member
having substantially the same thickness and substantially the same
external shape as the substrate P, the conveying device 100 can
smoothly convey the substrate CP. The conveying device that conveys
the substrate P can be another device (member) separate from the
conveying device that conveys the substrate CP.
[0103] The control apparatus 7 controls the table 4T and makes it
hold the substrate CP on the table 4T, that was loaded onto the
table 4T by the conveying device 100. In this embodiment, the
substrate CP has an outer diameter that is smaller than the
diameter of the outer rim of the first top face 33A of the first
peripheral wall 33, and is held by the table 4T such as to expose
at least part of the first top face 33A of the first peripheral
wall 33 that is fitted to the table 4T such that it is opposite the
peripheral region of the rear face of the substrate P.
[0104] Since the substrate CP has an outer diameter that is smaller
than the diameter of the outer rim of the first top face 33A of the
first peripheral wall 33, and has substantially the same external
shape as the first peripheral wall 33, by holding the substrate CP
on the table 4T such that the center of the space surrounded by the
first peripheral wall 33 matches the center of the rear face of the
substrate CP, the substrate CP can be held by the table 4T such as
to expose at least part of the first top face 33A of the first
peripheral wall 33.
[0105] In this embodiment, the substrate CP has an outer diameter
that is smaller than the diameter of the outer rim of the first top
face 33A of the first peripheral wall 33, and larger than the
diameter of the inner rim of the first top face 33A of the first
peripheral wall 33. Therefore, part of the rear face of the
substrate CP can contact part of the first top face 33A of the
first peripheral wall 33.
[0106] When the first holder HD1 holds the substrate CP, an eighth
gap G8 is formed between the outside edge (side face) of the
substrate CP held by the first holder HD1 and the inside edge
(inner side face) of the plate member T held by the second holder
HD2, this eighth gap G8 being larger than the fifth gap G5 formed
between the outside edge of the substrate P held by the first
holder HD1 and the inside edge of the plate member T.
[0107] A cleaning operation of the table 4T is performed using
liquid. With the substrate CP in a state of being held by the first
holder HD1, the control apparatus 7 supplies a liquid for cleaning
to at least part of the table 4T. The liquid is supplied at least
to the eighth gap G8.
[0108] In this embodiment, the liquid LQ (water) for exposure is
used as the liquid for cleaning. To execute a cleaning operation of
the table 4T, the control apparatus 7 moves the table 4T holding
the substrate CP such that at least part of the table 4T is
opposite the nozzle member 70, and forms the immersion space LR of
the liquid LQ between the substrate CP and the table 4T (plate
member T) and the nozzle member 70.
[0109] In this embodiment, the control apparatus 7 performs at
least parts of the liquid supply operation from the liquid supply
port 12 and the liquid collection operation from the liquid
collection port 22 in parallel, whereby the immersion space LR of
the liquid LQ is formed between the substrate CP and the table 4T
(plate member T) and the nozzle member 70.
[0110] As shown in FIGS. 8 and 9, the control apparatus 7 controls
the relative position of the table 4T with respect to the nozzle
member 70 such that at least part of the immersion space LR is
formed above the eighth gap G8. As described above, since the
substrate CP is smaller than the substrate P, some of the liquid LQ
easily infiltrates from the eighth gap G8 between the edge of the
substrate CP and the plate member T, and contacts a region of part
of the table 4T. The region that contacts the liquid LQ includes
the top face of the table 4T (base 30) between the first peripheral
wall 33 and the second peripheral wall 34, and at least part of the
first top face 33A of the first peripheral wall 33. The region that
contacts the liquid LQ also includes the top face of the table 4T
between the second peripheral wall 34 and the fifth peripheral wall
35, and at least part of the second top face 34A of the second
peripheral wall 34.
[0111] By contacting the liquid LQ, the region of part of the table
4T that the liquid LQ contacts is cleaned by that liquid LQ. That
is, a polluting substance that sticks or is adhered to a region of
part of the table 4T, such as the first peripheral wall 33 and the
second peripheral wall 34, is stripped away (removed) from the
surface of the table 4T by the liquid LQ in the immersion space LR.
In this embodiment, the liquid supply operation from the liquid
supply port 12 and the liquid collection operation from the liquid
collection port 22 are performed in parallel, whereby clean liquid
LQ from the liquid supply port 12 can be continuously supplied to a
region of part of the table 4T where there is a possibility that a
polluting substance will stick, and the clean liquid LQ that is
supplied can properly remove the polluting substance. The removed
polluting substance is immediately collected into the liquid
collection port 22.
[0112] While using the nozzle member 70 to form the immersion space
LR, the control apparatus 7 uses the first suction hole 63 to suck
at least some of the liquid LQ. That is, in this embodiment, the
control apparatus 7 performs the operation of supplying liquid from
the liquid supply port 12 in parallel with the operation of
collecting liquid using the liquid collection port 22, and with the
operation of collecting liquid using the first suction hole 63
(suction operation). Since the liquid collection port 22 of the
nozzle member 70 is arranged at a position opposite the surface of
the table 4T above the table 4T, there is a possibility that, for
example, a polluting substance that is removed from the surface of
the table 4T and floats in the liquid LQ will not be able to
smoothly reach the liquid collection port 22 due to the effect of
gravity. By executing the operation of collecting liquid using the
first suction hole 63 disposed on one part of the table 4T (the top
face of the base 30), the control apparatus 7 can collect the
polluting substance that could not be collected by the liquid
collection port 22.
[0113] During the cleaning operation using the liquid LQ, the
control apparatus 7 executes a suction operation using the second
suction hole 61. By executing this suction operation using the
second suction hole 61, since a flow of gas F2 is created from the
second space 42 via the second gap G2 toward the third space 43 as
described above, even if the liquid LQ infiltrates between the rear
face of the substrate CP and the first top face 33A of the first
peripheral wall 33 to the inner side of the first peripheral wall
33, this infiltrated liquid LQ can be collected by the second
suction hole 61, and, in addition, the flow of gas F2 that is
created can prevent the liquid LQ from infiltrating any further to
the inner side than the fourth peripheral wall 32.
[0114] Where necessary, the control apparatus 7 irradiates the
exposure light EL having photochemical cleaning function to the
table 4T while using the liquid LQ to perform the cleaning
operation of the table 4T. That is, while using the nozzle member
70 to form the immersion space LR over the eighth gap G8, the
control apparatus 7 uses the projection optical system PL to
irradiates the exposure light EL onto part of the table 4T such as
the first peripheral wall 33 and the second peripheral wall 34, or
the fifth peripheral wall 35, etc. Since this embodiment uses ArF
excimer laser light, which is infrared light having photochemical
cleaning function, as the exposure light EL, the region of the
table 4T that is irradiated with the exposure light EL is
photochemically cleaned. By irradiation of the infrared exposure
light EL, a polluting substance (organic substance) sticking to the
surface of the table 4T is removed by oxidative degradation.
Incidentally, light having photochemical cleaning function can be
irradiated onto the table 4T from another light-generating device
separate to the illumination system IL (light source for exposure
light).
[0115] In this embodiment, the control apparatus 7 performs the
operation of supplying liquid from the liquid supply port 12 in
parallel with at least part of the operation of collecting liquid
in the liquid collection port 22, while relatively moving the
nozzle member 70 and the table 4T holding the substrate P.
[0116] For example, as indicated by arrow yl in FIG. 10, the
control apparatus 7 performs the operation of supplying liquid from
the liquid supply port 12 in parallel with at least part of the
operation of collecting liquid in the liquid collection port 22,
while moving the table 4T holding the substrate P with respect to
the nozzle member 70 such that the immersion space LR moves along
the ring-shaped eighth gap G8 (the edge of the substrate CP). This
enables a wide area of the table 4T to be cleaned.
[0117] After the cleaning operation using the substrate CP ends,
the control apparatus 7 stops operation of supplying liquid from
the liquid supply port 12 of the nozzle member 70, and in addition,
executes the suction operation from the liquid collection port 22,
the first suction hole 63, and the second suction hole 61, whereby,
as shown schematically in FIG. 11, the immersion space LR is
eliminated from the substrate CP and the table 4T (plate member T).
The control apparatus 7 stops the operation of collecting liquid
from the liquid collection port 22, continues the suction operation
of the first suction hole 63 and the second suction hole 61 for a
predetermined time. By executing the suction operation of the first
suction hole 63, liquid LQ remaining on the surface and the like of
the table 4T between the first peripheral wall 33 and the second
peripheral wall 34 can be collected into the first suction hole 63,
and the liquid LQ can be prevented from remaining on the surface of
the table 4T between the first peripheral wall 33 and the second
peripheral wall 34. By executing the suction operation of the
second suction hole 61, even if the liquid LQ infiltrates to the
inner side of the first peripheral wall 33, this infiltrated liquid
LQ can be collected by the second suction hole 61.
[0118] After stopping all suction operations of the first suction
hole 63, the second suction hole 61, and the third suction hole 62,
the control apparatus 7 uses a substrate-lifting mechanism such as
a lift-pin (not shown) to lift the substrate CP with respect to the
first holder HD1, and uses the conveying device 100 (or another
conveying device) to unload the substrate CP from the first holder
HD1 at the substrate replacement position.
[0119] The cleaned table 4T then holds a new substrate P. The
exposure light EL irradiates onto the substrate P held on the table
4T to expose the substrate P.
[0120] As described above, by using the substrate CP, the table 4T
can be cleaned smoothly and properly. This can suppress
deterioration in exposure precision caused by a polluting substance
sticking to the table 4T, and enable the substrate P to be properly
irradiated with exposure light EL.
[0121] In this embodiment, since the first top face 33A of the
first peripheral wall 33 can be cleaned intensively by arranging
the substrate CP such that the first top face 33A of the first
peripheral wall 33 is opened, the table 4T including the first
peripheral wall 33 can properly hold the substrate P and enable it
to be irradiated with the exposure light EL.
[0122] Furthermore, since this embodiment makes it possible to
intensively clean the first peripheral wall 33 and the second
peripheral wall 34, or the fifth peripheral wall 35 and the like
that form spaces (the fourth space 44 and the sixth space 46) which
can be connected to an outside space via the eighth gap G8,
polluting substances sticking to the first peripheral wall 33 and
the second peripheral wall 34, or the fifth peripheral wall 35, and
the like, can be prevented from being released into the outside
space and into the immersion space LR.
[0123] In this embodiment, instead of cleaning all regions of the
table 4T (the first holder HD1), local regions are cleaned
intensively, thereby preventing the cleaning operation from taking
a long time and becoming complex, and enabling the cleaning
operation to be executed smoothly, properly, and within a short
time.
[0124] In this embodiment, since the top face and rear face of the
substrate CP that contacts the liquid LQ have liquid repellency,
the liquid LQ can be prevented from infiltrating between the rear
face of the substrate CP and the first peripheral wall 33 to the
inner side of the first peripheral wall 33. Also, after the
cleaning operation using the liquid LQ ends, the liquid LQ
contacting the substrate CP can be smoothly collected, and the
liquid LQ can be prevented from remaining on the top face, the rear
face, and the like of the substrate CP.
Second Embodiment
[0125] Subsequently, a second embodiment will be explained. In this
embodiment, constituent parts which are the same or similar to
those of the embodiment described above are represented by same
reference codes and are not repetitiously explained.
[0126] While in the first embodiment, as shown schematically in
FIG. 12A, the substrate CP has an outer diameter that is smaller
than the diameter of the outer rim of the first top face 33A of the
first peripheral wall 33 and larger than the diameter of the inner
rim of the first top face 33A of the first peripheral wall 33, as
shown in FIG. 12B, it can have an outer diameter that is larger
than the outer rim of the first top face 33A of the first
peripheral wall 33. In this case, although the first top face 33A
of the first peripheral wall 33 is not opened, since an eighth gap
G8' between the substrate CP and the plate member T is larger than
the fifth gap G5 between the substrate P and the plate member T,
the liquid LQ for cleaning can be supplied into a space between the
first peripheral wall 33 and the second peripheral wall 34, and
part of the table 4T can be cleaned by using the liquid LQ supplied
into that space.
[0127] As shown in FIG. 12C, the substrate CP can have an outer
diameter that is smaller than the diameter of the inner rim of the
first top face 33A of the first peripheral wall 33. In this case,
as shown in FIG. 13, since the liquid LQ for cleaning can be made
to contact almost all regions of the first top face 33A of the
first peripheral wall 33, the first top face 33A of the first
peripheral wall 33 can be cleaned properly.
[0128] In other words, the outer diameter of the substrate CP can
be determined in accordance with the region (space) of the table 4T
that is to be cleaned, and it is possible to use, for example, a
substrate whose outer diameter is 2.0 mm to 20.0 mm smaller than
the stipulated outer diameter of the substrate P (in the case of a
circular substrate, a circular substrate whose radius is 1.0 to
10.0 mm smaller than the stipulated radius).
Third Embodiment
[0129] Subsequently, a third embodiment will be explained. FIG. 14
is a view of the vicinity of a nozzle member 70 according to a
third embodiment. In this embodiment, the nozzle member 70 includes
a liquid ejection hole 90 capable of ejecting liquid LQ in the
immersion space LR, the liquid LQ being ejected from the liquid
spray hole 90 in the immersion space LR, thereby forming a rapid
flow of liquid LQ in the immersion space LR. The rapid flow of
liquid LQ acts upon the surface of the table 4T. This assists the
removal of polluting substances that stick to the surface of the
table 4T.
[0130] In the first to third embodiments, the cleaning operation
using the substrate CP can, for example, be executed each time a
predetermined number of substrates P are processed, for each lot,
at predetermined time intervals, etc.
[0131] As described above, the exposure apparatus EX includes the
detecting device 26 that can detect the quality (water quality) of
the liquid LQ for exposure collected from the liquid collection
port 22. Since this detecting device 26 can detect the pollution or
contamination state of the liquid LQ for exposure collected by the
liquid collection port 22, the control apparatus 7 can execute the
cleaning operation using the substrate CP when the control
apparatus 7 determines, based on the detection result of the
detecting device 26, that the liquid LQ for exposure collected by
the liquid collection port 22 is polluted or contaminated. Since
the pollution or contamination state of the liquid LQ collected by
the liquid collection port 22 changes in accordance with the
pollution or contamination state of the table 4T, the control
apparatus 7 can use the detecting device 26 to detect the polluted
or contaminated state of the liquid LQ collected by the liquid
collection port 22, and determine (estimate) the polluted or
contaminated state of the table 4T based on that detection result.
When, based on the detection result of the detecting device 26, the
control apparatus 7 determines that the pollution or contamination
state of the table 4T is not within a permissible range, it
executes the cleaning operation without starting the next exposure
operation.
[0132] After exposing an image of a pattern onto the substrate P, a
predetermined measuring device can be used to measure the shape of
the pattern formed on the substrate P, and the cleaning operation
using the substrate CP can then be executed in accordance with the
measurement. For example, when the control apparatus 7 determines,
based on the measurement of the pattern shape, that a defect of the
pattern is not within a permissible range, the control apparatus 7
determines that the polluted or contaminated state of the table 4T
is not within a permissible range, and executes the cleaning
operation. Alternatively, the first holder HD1 can be made to hold
a dummy substrate whose surface has a high degree of flatness, and
the shape (flatness) of the surface of the dummy substrate is
detected with an oblique incidence type focus/leveling detection
system, or such like; when it is determined that the flatness
deficiency is not within a permissible range, the control apparatus
7 determines that the pollution or contamination state of the table
4T is not within the permissible range, and executes the cleaning
operation.
[0133] While in the embodiments described above, to clean the table
4T, the control apparatus 7 performs the operations of supplying
liquid from the liquid supply port 12, collecting liquid in the
liquid collection port 22, and collecting liquid in the first
suction hole 63 (suction operation) in parallel, the suction
operation of the first suction hole 63 can be stopped during the
cleaning operation. By not executing the suction operation of the
first suction hole 63 during the cleaning operation, and executing
the suction operation using the first suction hole 63 after the
cleaning operation ends, the liquid LQ can be prevented from
remaining on the surface of the table 4T between the first
peripheral wall 33 and the second peripheral wall 34.
Alternatively, the operation of collecting liquid in the liquid
collection port 22 can be stopped during the cleaning
operation.
[0134] While in the embodiments described above, the control
apparatus 7 executes the suction operation using the second suction
hole 61 during the cleaning operation of the table 4T, the suction
operation using the second suction hole 61 can be stopped during
the cleaning operation. By not executing the suction operation
using the second suction hole 61 during the cleaning operation, and
executing the suction operation using the second suction hole 61
after the cleaning operation ends, liquid LQ that has infiltrated
to the inner side of the first peripheral wall 33 can be collected
in the second suction hole 61.
[0135] While the embodiments described above use the liquid LQ for
exposure as the liquid for cleaning, a different liquid other than
the liquid LQ can be used instead. For example, an alcohol-type
liquid such as ethanol and methanol, or a liquid containing a
surfactant, can be used as the liquid for cleaning. Also, so-called
functional water that is formed by dissolving a predetermined gas
in water, such as ozone water made by dissolving ozone gas in water
and hydrogen water made by dissolving hydrogen in water, can be
used as the liquid for cleaning.
[0136] A vibrating device can also be used to apply vibrations
(e.g. ultrasound waves) to the cleaning liquid.
[0137] While in each of the embodiments described above, the table
4T is cleaned using the nozzle member 70 that forms the immersion
region LR when exposing the substrate P, a special nozzle member
for cleaning can be provided; a cleaning operation of the table 4T
can then be executed by holding the liquid for cleaning between the
substrate CP and the plate member T, and the nozzle member.
[0138] While in each of the embodiments described above, the
removable plate member T forms a flat section around the substrate
P, the flat section around the substrate P can be formed by a
member formed in a single piece with the base 30. That is, the
configuration of the table 4T is not limited to that described
above, it being possible to use various configurations for the
table 4T, provided that the substrate P to be exposed by immersion
can be held properly.
[0139] While in each of the embodiments described above, the member
CP is a plate-like member having substantially the same external
shape as the substrate P and substantially the same thickness as
the substrate P, the member CP need not be plate-like, and its
external shape and thickness can be different from that of the
substrate P, provided only that, when held by the table 4T (first
holder HD1), a region desired to be cleaned, such as at least part
of the first top face 33A of the first peripheral wall 33, can be
opened and made to contact the cleaning liquid. Furthermore, while
in each of the embodiments described above, the top face and rear
face of the member CP have liquid repellency with respect to the
cleaning liquid, regions with liquid repellency can be formed on
parts of the member CP where necessary, and, provided that the
table 4T can be cleaned and the cleaning liquid can be collected
smoothly, regions with liquid repellency need not be formed on the
member CP at all.
[0140] While the projection optical system of each of the
embodiments described above uses liquid to fill the optical space
at the image plane (emission-face) side of the terminal optical
element, it is also acceptable to use a projection optical system
that fills liquid in an optical space on a physical face (incidence
face) side of a terminal optical element, as disclosed in PCT
International Publication No. WO 2004/019128.
[0141] While water is used as the liquid LQ for exposure in each of
the embodiments described above, a liquid other than water can be
used. For example, the liquid LQ for exposure can be
perfluoropolyether (PFPE), a fluorinated fluid such as fluorinated
oil, and cedar oil. A liquid having a refractive index of
approximately 1.6 to 1.8 can be used as the liquid LQ.
[0142] The optical elements of the projection optical system PL
that contact the liquid LQ (such as the final optical element FL)
can be formed from, for example, quartz (silica), or a
single-crystal fluoride compound such as calcium fluoride
(fluorite), barium fluoride, strontium fluoride, lithium fluoride,
and sodium fluoride. Moreover, the terminal optical element can be
made from a material whose refractive index is higher than quartz
and fluorite (e.g. 1.6 or higher). For example, it is possible to
use sapphire, germanium dioxide, and the like as disclosed in PCT
International Publication No. WO 2005/059617, or potassium chloride
(refractive index=1.75) and the like as disclosed in PCT
International Publication No. WO 2005/059618. Moreover, a thin film
having affinity for the liquid and/or a dissolution-preventing
function can be formed over all of part (including at least the
face that contacts the liquid) of the surface of the terminal
optical element. While quartz has high compatibility with liquid
and does not require a dissolution-preventing film, for fluorite,
at least a dissolution-preventing film can be formed. Examples of
liquids with a higher refractive index than pure water (e.g. 1.5 or
higher) are predetermined liquids having a C--H bond or an O--H
bond such as isopropanol, which has a refractive index of
approximately 1.50, and glycerol (glycerin) which has a refractive
index of approximately 1.61, predetermined liquids (organic
solvents) such as hexane, heptane, and decane, or decalin
(decahydronaphthalene) which has a refractive index of
approximately 1.60. Furthermore, the liquid can be a mixture of two
or more types of liquids selected from those listed above, or an
additive (mixture) formed by adding at least one of the above to
pure water. Moreover, the liquid can be an additive (mixture)
formed by adding acid or a base such as H.sup.+, C.sup.+, K.sup.+,
Cl.sup.-, SO.sub.4.sup.2-, and PO.sub.4.sup.2- to pure water, or an
additive (mixture) formed by adding tiny particles of Al oxide and
the like to pure water. It is preferable to use a liquid that has a
low light-absorption coefficient, low temperature-dependency, and
is stable with regard to photosensitive material (topcoat film or
reflection-preventing film) applied to the surface of the substrate
and/or the projection optical system. A topcoat film and the like
for protecting the photosensitive material and the base material
from the liquid can be applied to the substrate.
[0143] The substrate P of the embodiments described above is not
limited to a semiconductor wafer for manufacturing a semiconductor
device, it being possible to use a glass substrate for display
device, a ceramic wafer for thin-film magnetic head, or an original
plate (synthetic quartz, silicon wafer) for a reticle or a mask
used in an exposure apparatus, a film member, and so on. The shape
of the substrate is not limited to a disk, and can be rectangular
or another shape.
[0144] As for the exposure apparatus EX, in addition to a scanning
exposure apparatus using a step-and-scan method (scanning stepper)
that scans the pattern of a mask M while synchronously moving the
mask M and the substrate P, the invention can also be applied in a
projection exposure apparatus using a step-and-repeat method
(stepper) that exposes the pattern of the mask M in one shot while
the mask M and the substrate P are stationary, and then
sequentially moves the substrate P.
[0145] In exposure using the step-and-repeat method, it is
acceptable to perform one-shot exposure in which, while a first
pattern and the substrate P are substantially stationary, a
projection optical system is used in transferring a compressed
image of the first pattern to the substrate P; then, while a second
pattern and the substrate P are substantially stationary, the
projection optical system is used in partially superimposing a
compressed image of the second pattern over the first pattern
(switching method one-shot exposure apparatus).
[0146] As another type of switching method exposure apparatus, the
invention can also be applied in an exposure apparatus using a
step-and-switch method, where at least two patterns are transferred
in partial superimposition onto the substrate P, and the substrate
P is moved sequentially.
[0147] The invention can also be applied in multi-stage
(twin-stage) exposure apparatuses including a plurality of
substrate stages as disclosed in Japanese Patent Application,
Publication No. H10-163099, Japanese Patent Application,
Publication No. H10-214782 (corresponding U.S. Pat. Nos. 6,341,007,
6,400,441, 6,549,269, and 6,590,634), Published Japanese
Translation No. 2000-505958 of the PCT International Application
(corresponding U.S. Pat. No. 5,969,441), and the like.
[0148] Moreover, the invention can be applied in an exposure
apparatus including a substrate stage that holds a substrate, and a
measuring stage which a reference member which reference marks are
formed on and/or various types of sensors are mounted on, as for
example disclosed in Japanese Patent Application, Publication No.
H11-135400, Japanese Patent Application, Publication No.
2000-164504 (corresponding U.S. Pat. No. 6,897,963), and the
like.
[0149] While each of the above embodiments describes an example of
an exposure apparatus including the projection optical system PL,
the invention can also be applied in a exposure apparatus and an
exposure method that do not use the projection optical system PL.
When not using the projection optical system PL, exposure light is
irradiated to the substrate via an optical member such as a lens,
and an immersion space is formed in a predetermined space between
the optical member and the substrate.
[0150] The type of the exposure apparatus EX is not limited to one
for manufacturing semiconductor elements that exposures a
semiconductor element pattern onto a substrate P, the invention
being applicable in a wide range of exposure apparatuses such as an
exposure apparatus for manufacturing a liquid crystal display
element, an exposure apparatus for manufacturing a display, or an
exposure apparatus for manufacturing a thin-film magnetic head, a
charge coupled device (CCD), a micro machine, a
micro-electromechanical system (MEMS), a DNA chip, a reticle, a
mask, etc.
[0151] While each of the embodiments described above uses a
light-transmitting mask where a predetermined light-intercepting
pattern (or a phase pattern, a light-extinction pattern) is formed
on a light-transmitting substrate, instead of this mask, it is
possible to use an electronic mask that forms a transmitting
pattern, a reflecting pattern, or a light-generating pattern, based
on electronic data of a pattern to be exposed (also known as a
variable-mold mask, including for example a digital micro-mirror
device (DMD) which is one type of non-light-generating type image
display element {also known as a spatial light modulator [SLM]},
etc.), such as disclosed in, for example, U.S. Pat. No. 6,778,257.
An exposure apparatus using a DMD is disclosed in, for example,
U.S. Pat. No. 6,778,257.
[0152] The invention can also be applied in an exposure apparatus
(lithography system) that exposes a line and space pattern on a
substrate P by forming an interference fringe on the substrate P,
as disclosed in PCT International Publication No. WO
2001/035168.
[0153] The invention can also be applied in an exposure apparatus
that synthesizes patterns of two masks using a projection optical
system, and performs simultaneous double exposure of one shot
region on a substrate in one scanning exposure operation, as
disclosed, for example, in Published Japanese Translation No.
2004-519850 (corresponding U.S. Pat. No. 6,611,316) of the PCT
International Application. It can also be applied in an exposure
apparatus using a proximity method, a mirror projection aligner,
and so on.
[0154] As far as is permitted, the disclosures in all of the
Japanese Patent Publications and U.S. Patents related to exposure
apparatuses and the like cited in the above respective embodiments
and modified examples, are incorporated herein by reference.
[0155] As described above, the exposure apparatuses EX of the
embodiments are manufactured by assembling various types of
subsystems including various constituent elements such as to have
predetermined mechanical precision, electrical precision, and
optical precision. To ensure these types of precision, adjustments
for achieving optical precision in the various optical systems,
adjustments for achieving mechanical precision in the various
mechanisms, and adjustments for achieving electrical precision in
the various electrical systems, are carried out before and after
assembly. A step of assembly from the various subsystems to the
exposure apparatus includes performing mechanical connection,
interconnection of electrical circuits, piping connection of air
pressure circuits, and so on, between the various subsystems. The
subsystems themselves are, of course, assembled individually prior
to this step of assembling them to the exposure apparatus. When the
step of assembling the various subsystems to the exposure apparatus
ends, general adjustments are made to ensure the various types of
precision of the overall exposure apparatus. Preferably, the
exposure apparatus is manufactured in a clean room where the
temperature, level of cleanliness, and so on, are controlled.
[0156] As shown in FIG. 15, a microdevice such as a semiconductor
device is manufactured by performing a step 201 of designing
functions and performance of a microdevice, a step 202 of
manufacturing a mask (reticle) based on the design step, a step 203
of manufacturing a substrate that constitutes a base of the device,
a substrate-processing step 204 including, in compliance with the
embodiments described above, a substrate process (exposure process)
of exposing the pattern of a mask onto a substrate and developing
the exposed substrate, a device assembly step 205 (including work
processes such as a dicing step, a bonding step, a packaging step,
etc.), a test step 206, and so on.
[0157] According to the some aspects of the invention, a
substrate-holding member can be properly cleaned. Therefore, a
substrate properly held by the substrate-holding member can be
properly exposed to light.
* * * * *