U.S. patent application number 12/534846 was filed with the patent office on 2010-08-05 for heat dissipation device.
This patent application is currently assigned to WISTRON CORPORATION. Invention is credited to Chuan-Yi Liang, Chih-An Liao, Ming-Chang Wu.
Application Number | 20100193162 12/534846 |
Document ID | / |
Family ID | 42396748 |
Filed Date | 2010-08-05 |
United States Patent
Application |
20100193162 |
Kind Code |
A1 |
Liang; Chuan-Yi ; et
al. |
August 5, 2010 |
HEAT DISSIPATION DEVICE
Abstract
A heat dissipation device adapted for dissipating heat generated
by a heat source is provided. The heat dissipation device includes
a base and a heat dissipation fin assembly. The base is disposed on
the heat source. The heat dissipation fin assembly is disposed on
the base and includes a plurality of parallel fins. The heat
dissipation fins assembly has opposite air inlet side and air
outlet side. A turbulence generating structure is formed by at
least a part of the fins or holes at the air inlet or the air
outlet of the heat dissipation fin assembly.
Inventors: |
Liang; Chuan-Yi; (Taipei
Hsien, TW) ; Wu; Ming-Chang; (Taipei Hsien, TW)
; Liao; Chih-An; (Taipei Hsien, TW) |
Correspondence
Address: |
JIANQ CHYUN INTELLECTUAL PROPERTY OFFICE
7 FLOOR-1, NO. 100, ROOSEVELT ROAD, SECTION 2
TAIPEI
100
TW
|
Assignee: |
WISTRON CORPORATION
Taipei Hsien
TW
|
Family ID: |
42396748 |
Appl. No.: |
12/534846 |
Filed: |
August 3, 2009 |
Current U.S.
Class: |
165/104.34 ;
165/121; 165/185 |
Current CPC
Class: |
H01L 23/3672 20130101;
H01L 2924/0002 20130101; F28F 2215/04 20130101; H01L 23/467
20130101; H01L 2924/00 20130101; F28F 3/02 20130101; F28F 13/12
20130101; H01L 2924/0002 20130101 |
Class at
Publication: |
165/104.34 ;
165/185; 165/121 |
International
Class: |
F28F 13/12 20060101
F28F013/12; F28F 7/00 20060101 F28F007/00; F28D 15/00 20060101
F28D015/00 |
Foreign Application Data
Date |
Code |
Application Number |
Feb 5, 2009 |
TW |
98103668 |
Claims
1. A heat dissipation device adapted for dissipating heat of a heat
source, the heat dissipation device comprising: a base adapted to
be disposed on the heat source; and a heat dissipation fin assembly
disposed on the base and comprising a plurality of fins, the heat
dissipation fin assembly having opposite air inlet side and air
outlet side, wherein a turbulence generating structure is formed by
at least a part of the fins or holes at the air inlet side or the
air outlet side.
2. The heat dissipation device according to claim 1, wherein the
fins or holes are disposed on one side of a centerline of the heat
dissipation fin assembly, and the number of the fins or holes
gradually increases in the direction toward or away from the heat
source.
3. The heat dissipation device according to claim 1, wherein the
turbulence generating structure is formed by reducing the size of
at least a part of the fins at the air outlet side.
4. The heat dissipation device according to claim 1, wherein the
turbulence generating structure comprises a plurality of
projections or recesses on surfaces of the fins.
5. The heat dissipation device according to claim 1, wherein the
turbulence generating structure is formed by downwardly bending at
least a part of the fins at the air outlet side.
6. The heat dissipation device according to claim 1, wherein the
fins or holes for forming the turbulence generating structure are
disposed below a middle height line of the heat dissipation fin
assembly and are uniformly distributed.
7. The heat dissipation device according to claim 6, wherein the
turbulence generating structure comprises a plurality of
projections or recesses on surfaces of the fins.
8. The heat dissipation device according to claim 6, wherein the
turbulence generating structure is formed by downwardly bending at
least a part of the fins at the air outlet side.
Description
CROSS-REFERENCE TO RELATED APPLICATION
[0001] This application claims the priority benefit of Taiwan
application serial no. 98103668, filed on Feb. 5, 2009. The
entirety of the above-mentioned patent application is hereby
incorporated by reference herein and made a part of
specification.
BACKGROUND OF THE INVENTION
[0002] 1. Field of the Invention
[0003] The present invention relates generally to a heat
dissipation device, and more particularly to a heat dissipation
device which includes heat dissipation fins designed to generate a
desired heat dissipation airflow field.
[0004] 2. Description of Related Art
[0005] In general, a motherboard inside a computer host includes a
plurality of electronic components mounted thereon. A part of the
electronic components such as a central processing unit (CPU), a
pulse width modulator (PWM) and a north bridge generate a
considerable amount of heat during operation. If the heat cannot be
timely removed such that the heat is continuously accumulated on
the electronic components, the temperature of the electronic
components will gradually rise and exceed their normal operating
temperature. As a result, the electronic components cannot operate
stably, thereby causing a crash of the computer host. In addition,
if the temperature is unduly high, the electronic components may be
damaged, thus causing a permanent failure.
[0006] A conventional heat dissipation device generally includes a
heat dissipation base, a fan, fins, and an airflow guide plate. As
the fan operates, the airflow generated by the fan can enter the
heat dissipation base via an air inlet of the heat dissipation base
and escape through an air outlet of the heat dissipation base to
dissipate the heat of the electronic components. In addition, the
airflow guide plate disposed below the fins can guide a portion of
the airflow toward a surface of the circuit board to dissipate the
heat of the electronic components around the heat dissipation
base.
[0007] However, in this heat dissipation device, the airflow
generated by the fan must be guided by the airflow guide plate
coupled to the heat dissipation base to dissipate the heat of the
electronic components on the surface of the circuit board.
Therefore, the design of the heat dissipation device may be
complicated. Furthermore, extra components are required to assemble
the heat dissipation base and the airflow guide plate, which not
only increases the manufacturing cost of the heat dissipation
device, but also reduces the reliability of the heat dissipation
device due to the manufacturing tolerance or assembly
tolerance.
SUMMARY OF THE INVENTION
[0008] Accordingly, the present invention is directed to a heat
dissipation device which can generate a desired cooling airflow
field to provide an improved performance of dissipating the heat of
a heat source.
[0009] The present invention provides a heat dissipation device
adapted for dissipating heat of a heat source. The heat dissipation
device includes a base and a heat dissipation fin assembly. The
base is adapted to be disposed on the heat source. The heat
dissipation fin assembly is disposed on the base and includes a
plurality of fins. The heat dissipation fin assembly has opposite
air inlet side and air outlet side. A turbulence generating
structure is formed by at least a part of the fins or holes at the
air inlet side or the air outlet side.
[0010] According to one embodiment of the present invention, the
fins or holes are disposed on one side of a centerline of the heat,
dissipation fin assembly, and the number of the fins or holes
gradually increases in the direction toward or away from the heat
source.
[0011] According to one embodiment of the present invention, the
turbulence generating structure is formed by reducing the size of
at least a part of the fins at the air outlet side.
[0012] According to one embodiment of the present invention, the
turbulence generating structure comprises a plurality of
projections or recesses on surfaces of the fins.
[0013] According to one embodiment of the present invention, the
turbulence generating structure is formed by downwardly bending at
least a part of the fins at the air outlet side.
[0014] According to one embodiment of the present invention, the
fins or holes for forming the turbulence generating structure are
disposed below a middle height line of the heat dissipation fin
assembly and are uniformly distributed.
[0015] According to one embodiment of the present invention, the
turbulence generating structure comprises a plurality of
projections or recesses on surfaces of the fins.
[0016] According to one embodiment of the present invention, the
turbulence generating structure is formed by downwardly bending at
least a part of the fins at the air outlet side.
[0017] In view of the foregoing, the turbulence generating
structures can redirect the airflow flowing through the heat
dissipation device, thereby cooling the heat sources below the heat
dissipation device and at the air outlet side. In addition, the
turbulence generating structures can increase the longitudinal
turbulence intensity of the airflow at the air outlet/inlet sides
and change the longitudinal press gradient of the airflow, thus
improving the cooling performance of the heat dissipation
device.
[0018] In order to make the aforementioned and other features and
advantages of the present invention more comprehensible,
embodiments accompanied with figures are described in detail
below.
BRIEF DESCRIPTION OF THE DRAWINGS
[0019] FIG. 1 illustrates one embodiment of the heat dissipation
device disposed on a circuit board.
[0020] FIG. 2 is a top view of the heat dissipation device disposed
on the circuit board of FIG. 1.
[0021] FIG. 3 illustrates one embodiment of the heat dissipation
fin assembly disposed on the circuit board.
[0022] FIG. 4 illustrates a profile of the airflow field at the air
outlet side of the heat dissipation fin assembly of FIG. 3.
[0023] FIG. 5 illustrates an alternative embodiment of a heat
dissipation fin assembly disposed on a circuit board.
[0024] FIG. 6 illustrates a profile of the airflow field at the air
outlet side of the heat dissipation fin assembly of FIG. 5.
[0025] FIG. 7 illustrates another embodiment of a heat dissipation
fin assembly disposed on a circuit board.
[0026] FIG. 8 illustrates another embodiment of a heat dissipation
fin assembly disposed on a circuit board.
[0027] FIG. 9 illustrates still another embodiment of a heat
dissipation fin assembly disposed on a circuit board.
DESCRIPTION OF THE EMBODIMENTS
[0028] FIG. 1 illustrates one embodiment of the heat dissipation
device disposed on a circuit board. FIG. 2 is a top view of the
heat dissipation device disposed on the circuit board of FIG. 1.
Referring to FIGS. 1 and 2, the heat dissipation device 100
includes a base 110, a heat dissipation fin assembly 120, and a fan
130. The base 110 is disposed on the circuit board 10 over a heat
source 190. In the present embodiment, for example, the circuit
board 10 may be a motherboard and the heat source 190 may be a
central processing unit (CPU).
[0029] The heat dissipation fin assembly 120 is disposed on the
base 110 and includes a plurality of parallel fins 120a. The heat
dissipation fin assembly 120 has an air inlet side 122 and an air
outlet side 124 opposite to the air inlet side 122. The fan 130 is
disposed at the air inlet side 122. As the fan 130 rotates, the fan
130 drives an airflow to enter the heat dissipation fin assembly
120 from the air inlet side 122 and escape the heat dissipation fin
assembly 120 through the air outlet side 124. In addition, in the
present embodiment, a turbulence generating structure 126 is formed
at the air outlet side 124 of the heat dissipation fin assembly 120
in order to control a field of the airflow through the heat
dissipation fin assembly 120. Therefore, when the airflow flows
through-the air outlet side 124 of the heat dissipation fin
assembly 120, it flows through the turbulence generating structure
126 at the same time.
[0030] FIG. 3 illustrates one embodiment of the heat dissipation
fin assembly disposed on the circuit board. FIG. 4 illustrates a
profile of the airflow field at the air outlet side of the heat
dissipation fin assembly of FIG. 3. Referring to FIGS. 3 and 4, the
turbulence generating structure 226 is formed on a part of the fins
220a at the air outlet side 224. In the present embodiment, a part
of the fins 220a have the same configuration, and the rest of the
fins 220a form the turbulence generating structure 226. More
specifically, in the present embodiment, the turbulence generating
structure 226 is formed by reducing the size of the part of the
fins 220a at the air outlet side 224. The turbulent generating
structure 226 can change a longitudinal turbulence intensity as
well as a longitudinal pressure gradient of the airflow at the air
outlet side. Thus, the airflow flowing through the turbulence
generating structure can be disturbed to form the airflow field
profile shown in FIG. 4.
[0031] In addition, in the present embodiment, the fins 220a used
for forming the turbulence generating structure 226 are disposed
adjacent the circuit board 20 and have their size gradually
decreased in the direction toward the circuit board 20. As such,
when the airflow leaves the heat dissipation fin assembly 220
through the air outlet side 224, a higher longitudinal turbulence
intensity can be formed at the air outlet side 224 and the
longitudinal press gradient can be changed under the influence of
the turbulence generating structure 226. As a result, the airflow
can be guided toward the surface of the circuit board 20, thereby
effectively dissipating the heat of the heat source 290 on the
circuit board 20 and other components around the heat source
290.
[0032] FIG. 5 illustrates an alternative embodiment of a heat
dissipation fin assembly disposed on a circuit board. FIG. 6
illustrates a profile of the airflow field at the air outlet side
of the heat dissipation fin assembly of FIG. 5. Referring to FIGS.
5 and 6, the heat dissipation fin assembly 320 of the present
embodiment includes a turbulence generating structure 326 formed on
a part of the fins 320a at the air outlet side 224. More
specifically, the turbulence generating structure 326 includes a
plurality of holes through the surfaces of the fins 320a. In the
present embodiment, the holes 326a are formed, for example, by
stamping the fins 320a, and the number of the holes 326a in each
fin gradually increases in the direction toward the circuit board
30.
[0033] As such, the airflow flows through the holes 326a before
escaping the heat dissipation fin assembly 320 through the air
outlet side 324, and then flows toward the surface of the circuit
board 30. The turbulence generating structure 326 can redirect the
airflow, increase the longitudinal turbulence intensity as well as
change the longitudinal press gradient, thereby improving the heat
dissipation performance of the heat dissipation fin assembly
320.
[0034] FIG. 7 illustrates another embodiment of a heat dissipation
fin assembly disposed on a circuit board. Referring to FIG. 7, the
heat dissipation fin assembly 420 of the present embodiment is
different from the above-described heat dissipation fin assembly
320 in that the holes 426a are disposed at one side of a centerline
of the heat dissipation fin assembly 420 and the number of the
holes 426a in each fin gradually decreases in the direction toward
the circuit board 40. In other words, in the present embodiment,
the holes 426a are disposed at one side of the centerline of the
heat dissipation fin assembly 420 and the number of the holes 426
in each fin gradually increases along the direction away from the
heat source 490.
[0035] FIG. 8 illustrates another embodiment of a heat dissipation
fin assembly disposed on a circuit board. Referring to FIG. 8, the
heat dissipation fin assembly 520 of the present embodiment is
different from the above-described heat dissipation fin assembly
420 in that the holes 526a are disposed at one side of a centerline
of the heat dissipation fin assembly 520 and the number of the
holes 526a in each fin maintains the same in the direction toward
the circuit board 50.
[0036] FIG. 9 illustrates still another embodiment of a heat
dissipation fin assembly disposed on a circuit board. Referring to
FIG. 9, the heat dissipation fin assembly 620 of the present
embodiment is different from the above-described heat dissipation
fin assembly 320 in that the turbulence generating structure 626
includes a plurality of bending portions 626a on the surface of the
fins 620a. In the present embodiment, the bending portions 626a are
formed by and downwardly bending at least a part of the fins 620a
at the air outlet side, such as by stamping portions of the fins
downwardly, and the number of the bending portions on each fin
gradually decreases in the direction toward the circuit board 60.
In an alternative embodiment, these bending portions 626a can also
be replaced with projections.
[0037] The foregoing embodiments describe various turbulence
generating structures that are formed by changing the size of the
fins or forming projections on the fins or holes in the fins.
However, these embodiments should not be used to limit the scope of
the present invention. It should be noted that location and
distribution of the turbulence generating structures on the fins,
and the number and shape of the turbulence generating structures
can be varied to meet actual requirements.
[0038] As to the location of the turbulence generating structures
on the fins, the turbulence generating structure are only formed on
a part of the fins and in locations adjacent the motherboard in the
foregoing embodiments. It should be understood, however, that the
turbulence generating structure can be formed on all fins or fins
in other positions without departing the spirit and scope of the
present invention.
[0039] As to the projections on or the holes in the fins that are
used to form the turbulence generating structures, the number,
shape or distribution of the projections or holes can be varied
according to actual requirements. More specifically, the number or
size of the projections or holes is not limited to any particular
embodiments described herein, and the holes can also be replaced
with recesses. In addition, different than the above-described
distribution of the projections or holes that the number of the
projections or holes gradually decreases or increases in the
direction toward the motherboard, the projections or holes can be
distributed in another manner according to actual requirements of
the airflow field.
[0040] In summary, the turbulence generating structures can
redirect the airflow flowing through the heat dissipation device,
thereby cooling the heat sources below the heat dissipation device
and at the air outlet side. In addition, the turbulence generating
structures can increase the longitudinal turbulence intensity and
change the longitudinal press gradient of the airflow at the air
outlet side, thus improving the cooling performance of the heat
dissipation device. The heat dissipation device of the present
invention can eliminate the guide plate, thereby reducing the
manufacturing cost. At the same time, because the guide plate is
not needed, the design of the heat dissipation device can be
simplified and the heat dissipation device can thus have an
improved reliability.
[0041] It will be apparent to those skilled in the art that various
modifications and variations can be made to the structure of the
present invention without departing from the scope or spirit of the
invention. In view of the foregoing, it is intended that the
present invention cover modifications and variations of this
invention provided they fall within the scope of the following
claims and their equivalents.
* * * * *