U.S. patent application number 12/488522 was filed with the patent office on 2010-07-22 for heat dissipation module.
This patent application is currently assigned to FOXCONN TECHNOLOGY CO., LTD.. Invention is credited to CHIN-HSIEN CHEN, RUNG-AN CHEN.
Application Number | 20100181049 12/488522 |
Document ID | / |
Family ID | 42336018 |
Filed Date | 2010-07-22 |
United States Patent
Application |
20100181049 |
Kind Code |
A1 |
CHEN; CHIN-HSIEN ; et
al. |
July 22, 2010 |
HEAT DISSIPATION MODULE
Abstract
A heat dissipation module includes a first substrate, a second
substrate spaced from the first substrate, a heat pipe and three
resilient flakes, i.e., a first resilient flake, a second resilient
flake and a third resilient flake. The heat pipe connects with the
first and second substrates. The first resilient flake forms a
securing portion connecting with the first substrate and a locking
portion extending outwardly beyond an outer edge of the first
substrate. The second resilient flake forms a securing portion
connecting with the second substrate and a locking portion
extending outwardly beyond an outer edge of the second substrate.
The third resilient flake includes a locking portion located at a
middle and two securing portion at two opposite ends thereof. The
two securing portions of the third resilient flake connect with the
first and second substrates, respectively.
Inventors: |
CHEN; CHIN-HSIEN; (Tu-Cheng,
TW) ; CHEN; RUNG-AN; (Tu-Cheng, TW) |
Correspondence
Address: |
PCE INDUSTRY, INC.;ATT. Steven Reiss
288 SOUTH MAYO AVENUE
CITY OF INDUSTRY
CA
91789
US
|
Assignee: |
FOXCONN TECHNOLOGY CO.,
LTD.
Tu-Cheng
TW
|
Family ID: |
42336018 |
Appl. No.: |
12/488522 |
Filed: |
June 20, 2009 |
Current U.S.
Class: |
165/104.26 |
Current CPC
Class: |
F28D 15/0275 20130101;
F28D 15/0233 20130101; G06F 1/20 20130101 |
Class at
Publication: |
165/104.26 |
International
Class: |
F28D 15/04 20060101
F28D015/04 |
Foreign Application Data
Date |
Code |
Application Number |
Dec 18, 2008 |
CN |
200810306360.9 |
Claims
1. A heat dissipation module, comprising: a first substrate and a
second substrate being spaced from each other; a heat pipe
thermally connecting with the first substrate and the second
substrate; a first resilient flake forming a securing portion
connecting with the first substrate and a locking portion extending
outwardly beyond an outer edge of the first substrate; a second
resilient flake forming a securing portion connecting with the
second substrate and a locking portion extending outwardly beyond
an outer edge of the second substrate; and a third resilient flake
comprising a locking portion being located at a middle thereof and
two securing portions at two opposite ends thereof, the two
securing portions of the third resilient flake connecting with the
first and second substrates, respectively.
2. The heat dissipation module of claim 1, wherein the heat pipe
includes a condenser section and an opposite evaporator section
connecting with the first and second substrates, two of the three
resilient flakes are located at two opposite lateral sides of the
evaporator section of the heat pipe.
3. The heat dissipation module of claim 2, wherein the first
resilient flake is located at one lateral side of the evaporator
section of the heat pipe, while the second resilient flake is
located at an opposite lateral side of the evaporator section of
the heat pipe.
4. The heat dissipation module of claim 3, wherein the first and
second substrates are substantially rectangular, the evaporator
section of the heat pipe is located on top surfaces of the first
and the second substrates adjacent to sides of the first and second
substrates.
5. The heat dissipation module of claim 1, wherein the third
resilient flake forms an arched portion between each of the
securing portions and the locking portion, the arched portion
connects one end of the locking portion with a corresponding
securing portion of the third resilient flake.
6. The heat dissipation module of claim 5, wherein the locking
portion and the securing portions of the third resilient flake are
coplanar and collinear, the arched portions protrude upwardly with
respect to the securing portions and the locking portion of the
third resilient flake.
7. The heat dissipation module of claim 1, wherein the first and
second substrates are in parallel with each other.
8. The heat dissipation module of claim 7, wherein the third
resilient flake is located at a front side of the first and second
substrates, and the first and second resilient flakes are located
at rear sides of the first and second substrates, respectively.
9. The heat dissipation module of claim 8, wherein the third
resilient flake forms two arched portions each connecting one end
of the locking portion to a corresponding securing portion of the
third resilient flake.
10. A heat dissipation module, comprising: a first substrate and a
second substrate being spaced from each other; a fin unit; a heat
pipe forming an evaporator section connecting with the first
substrate and the second substrate, and a condenser section
connecting with the fin unit; a first resilient flake forming a
securing portion connecting with the first substrate and a locking
portion extending outwardly beyond an outer edge of the first
substrate; a second resilient flake forming a securing portion
connecting with the second substrate and a locking portion
extending outwardly beyond an outer edge of the second substrate;
and a third resilient flake comprising a locking portion being
located at a middle thereof and two securing portions at two
opposite ends thereof, the two securing portions of the third
resilient flake connecting with the first and second substrates,
respectively.
11. The heat dissipation module of claim 10, wherein the first
resilient flake is located at one lateral side of the evaporator
section of the heat pipe, while the second resilient flake is
located at an opposite lateral side of the evaporator section of
the heat pipe.
12. The heat dissipation module of claim 11, wherein the first and
second substrates are substantially rectangular, the evaporator
section of the heat pipe is located on top surfaces of the first
and the second substrates adjacent to sides of the first and second
substrates.
13. The heat dissipation module of claim 10, wherein the third
resilient flake forms two arched portions each connecting one end
of the locking portion to a corresponding securing portion of the
third resilient flake.
Description
BACKGROUND
[0001] 1. Technical Field
[0002] The present disclosure relates to heat dissipation, and
particularly to a heat dissipation module for use in an electrical
device which has a low profile.
[0003] 2. Description of Related Art
[0004] With continuing development of electronic technology,
heat-generating electronic components such as CPUs (central
processing units) are generating more and more heat which requires
immediate dissipation, especially in electronic devices which do
not have enough space therein. Generally, a heat dissipation module
is attached to the CPU to provide such heat dissipation. A
conventional heat dissipation module includes a rectangular
substrate for absorbing heat from the CPU, a fin unit and a heat
pipe thermally connected the substrate to the fin unit. Four fixing
arms extend outwardly from four corners of the substrate,
respectively. Each of the fixing arms defines a through hole at a
distal end thereof. In use of the heat dissipation module, four
screws respectively extends through the through hole of the fixing
arms and engages into a PCB (printed circuit board) on which the
CPU is mounted, for maintaining a contact between the CPU and the
heat dissipation module.
[0005] However, with the computers getting more and more compact,
usually a heat dissipation module is used to dissipate heat for two
electronic components such as a CPU and a GPU (Graphic Processing
Unit) simultaneously. Thus, the heat dissipation module may have
two substrates separated from each other for contacting the CPU and
the GPU, respectively. Each substrate needs four fixing arms to
secure the substrate on the PCB, which increases a size of the
substrates and a manufacturing cost of the substrates. Furthermore,
the PCB should define a lot of mounting holes corresponding to the
through holes of the fixing arms, which greatly reduces a
mechanical intensity of the PCB. Moreover, the process for mounting
the heat dissipation module to the PCB is time-consuming and
inconvenient.
[0006] For the foregoing reasons, therefore, there is a need in the
art for a heat dissipation module which overcomes the
above-mentioned problems.
BRIEF DESCRIPTION OF THE DRAWING
[0007] Many aspects of the embodiments can be better understood
with references to the following drawing. The components in the
drawing are not necessarily drawn to scale, the emphasis instead
being placed upon clearly illustrating the principles of the
present heat dissipation module.
[0008] The only FIGURE is an assembled, isometric view of a heat
dissipation module in accordance with an exemplary embodiment of
this disclosure.
DETAILED DESCRIPTION
[0009] The only FIGURE shows a heat dissipation module 100 in
accordance with an exemplary embodiment of the present disclosure
for dissipating heat from two electronic components (not shown)
mounted on a PCB (not shown). The two electronic components may
include a CPU and a GPU. The heat dissipation module 100 includes a
fin unit 10, a first substrate 20, a second substrate 30 spaced
from the first substrate 20, a heat pipe 40 thermally connecting
the fin unit 10 with the first and second substrates 20, 30, and
three resilient flakes, i.e., a first resilient flake 50, a second
resilient flake 60 and a third resilient flake 70 for mounting the
first and second substrates 20, 30 to the PCB.
[0010] The heat pipe 40 is flat and elongated. The heat pipe 40
includes an evaporator section 41, a condenser section 42 and an
adiabatic section 43 located between the evaporator section 41 and
the condenser section 42. Each of the evaporator section 41 and the
condenser section 42 is linearly shaped. The condenser section 42
is parallel to and located higher than the evaporator section 41.
The adiabatic section 43 extends downwardly and slantwise from one
end of the condenser section 42 towards the evaporator section 41.
The adiabatic section 43 includes an upper end connected with the
condenser section 42 and a lower end connected with the evaporator
section 41.
[0011] The first and second substrates 20, 30 each are
substantially rectangular, and in parallel with each other. Each of
the substrates 20, 30 includes a top surface (not labeled) and a
planar bottom surface 24, 34 opposite to the top surface for
closely contacting the corresponding electronic component. A first
receiving groove 21 is defined in the top surface of the first
substrate 20 and near and parallel to a rear side of the first
substrate 20. A first protruding rib 22 extends upwardly and
perpendicularly from the top surface of the first substrate 20. The
first protruding rib 22 is located at one side of the first
receiving groove 21 that is away from the rear side of the first
substrate 20. A second receiving groove 33 collinear to the first
receiving groove 21 is defined in the top surface of the second
substrate 30, adjacent to a rear side of the second substrate 30.
Each of the first and second receiving grooves 21, 33 is
substantially rectangular, and has a size and a shape corresponding
to the evaporator section 41 of the heat pipe 40 for receiving the
evaporator section 41 therein. A second protruding rib 31 and a
third protruding rib 32 extend upwardly and perpendicularly from
the top surface of the second substrate 30 at two opposite sides of
the second receiving groove 33, respectively. The second protruding
rib 31 is parallel to the third protruding rib 32, and located at
the rear side of the second substrate 30. The third protruding rib
32 is collinear to the first protruding rib 22 of the first
substrate 20.
[0012] The first resilient flake 50 is flat and V-shaped. The first
resilient flake 50 includes a linear securing portion 51 connected
with the first substrate 20 and an elongated locking portion 52
extending horizontally and slantwise from one end of the securing
portion 51 to protrude out of the first substrate 20. The securing
portion 51 of the first resilient flake 50 is located on the top
surface of the first substrate 20, and is parallel to the first
protruding rib 22. The securing portion 51 of the first resilient
flake 50 is arranged between one side of the evaporator section 41
of the heat pipe 40 and the rear side of the first substrate 20,
and extends along the rear side of the first substrate 20. The
locking portion 52 defines a through hole 721 at a distal end away
from the securing portion 51 thereof. The securing portion 51
defines two mounting holes 711 at two opposite ends thereof,
respectively.
[0013] The second resilient flake 60 is flat and linearly shaped.
The second resilient flake 60 includes a linear securing portion 61
connected with the second substrate 60 and a locking portion 62
extending linearly from one end of the securing portion 61 beyond a
right edge of the second substrate 30. The second resilient flake
60 is mounted on the top surface of the second substrate 30, and
located at another side of the evaporator section 41 of the heat
pipe 40 that is away from the rear side of the second substrate 30.
Similarly, the locking portion 62 defines a through hole 721 at a
distal end thereof and the securing portion 61 defines two mounting
holes 711 therein.
[0014] The third resilient flake 70 includes a locking portion 72,
two securing portions 71 and two arched portions 73. The locking
portion 72 is located at a middle of the third resilient flake 70.
The two securing portions 71 are located at two opposite ends of
the third resilient flake 70, respectively. The two arched portions
73 each connect one end of the locking portion 72 to a
corresponding securing portion 71. The locking portion 72 and the
securing portions 71 of the third resilient flake 70 are coplanar
and collinear. The arched portions 73 each protrude upwardly with
respect to the locking portion 72 and the securing portions 71. The
third resilient flake 70 is mounted on the top surfaces of the
first and second substrates 20, 30, and located adjacent to a front
lateral side of the first and second substrates 20, 30. The locking
portion 72 of the third resilient flake 70 is located between the
first and second substrates 20, 30 and spaced from the first and
second substrates 20, 30. The securing portions 71 of the third
resilient flake 70 are located on the top surfaces of the first and
second substrates 20, 30, respectively. Each of the securing
portions 71 of the third resilient flakes 70 defines two mounting
holes 711 therein. The locking portion 72 of the resilient flakes
70 defines a through hole 721 therein.
[0015] The fin unit 10 is substantially rectangular. The fin unit
10 is located adjacent to the first substrate 20. The fin unit 10
defines an elongated slot at an upper portion for extension of the
condenser section 42 of the heat pipe 40 therein.
[0016] In assembly of the heat dissipation module 100, the
condenser section 42 of the heat pipe 40 is received in the slot of
the fin unit 10 and connected thereto via soldering. The evaporator
section 41 of the heat pipe 40 is located on the top surfaces of
the first and second substrates 20, 30 and received in the first
and second receiving grooves 21, 33. The protruding ribs 22, 32, 31
abut against two opposite sides of the evaporator section 41,
respectively. Fasteners such as screws (not shown) are provided to
extend through the mounting holes 711 of the securing portions 51,
61, 71 of the resilient flakes 50, 60, 70 and engage into holes
defined in the substrates 20, 30 to attach the resilient flakes 50,
60, 70 to the first and second substrates 20, 30, respectively. In
assembling the heat dissipation module 100 to the electronic
components on the PCB, another plurality of screws are provided to
extend through the through holes 721 of the locking portions 52,
62, 72 of the resilient flakes 50, 60, 70 and engage into the PCB,
to thereby connect the first, second and third resilient flakes 50,
60, 70 to the PCB. Thus, the first and second substrates 20, 30 of
the heat dissipation module 100 are respectively attached to the
electronic components on the PCB.
[0017] As described above, the heat dissipation module 100 only
uses three resilient flakes 50, 60, 70 for mounting, and each of
the resilient flakes 50, 60, 70 only needs one screw for connecting
with the PCB; thus the cost of the heat dissipation module 100 is
relatively low, and assembly of the heat dissipation module 100 to
the PCB is simple and quick. In addition, the PCB only defines
three mounting holes corresponding to the mounting holes 721 of the
locking portions 52, 62, 72 of the resilient flakes 50, 60, 70,
which reduces a risk of damage of the PCB and improves the easiness
in designing the layout of the PCB. Furthermore, since the locking
portion 72 is located amid the securing portions 71 which are
connected to the first and second substrates 20, 30, respectively,
the force exerted on the locking portion 72 is uniformly
distributed to the first and second substrates 20, 30, whereby the
first and second substrate 20, 30 each can engage with the
corresponding electronic component with a substantially equal
normal force. Moreover, when the locking portion 72 of the third
resilient flake 70 is pressed downwardly, the arched portions 73
generate deformation to provide elastic force to press the first
and second substrates 20, 30 downwardly, thereby ensuring the first
and second substrates 20, 30 to have intimate engagements with the
electronic components.
[0018] It is to be understood, however, that even though numerous
characteristics and advantages of the disclosure have been set
forth in the foregoing description, together with details of the
structure and function of the embodiments, the disclosure is
illustrative only, and changes may be made in detail, especially in
matters of shape, size, and arrangement of parts within the
principles of the invention to the full extent indicated by the
broad general meaning of the terms in which the appended claims are
expressed.
* * * * *