U.S. patent application number 12/644673 was filed with the patent office on 2010-07-01 for treating apparatus, treating method and recording medium.
This patent application is currently assigned to TOKYO ELECTRON LIMITED. Invention is credited to Tohru IWABAE, Takafumi TSUCHIYA.
Application Number | 20100163077 12/644673 |
Document ID | / |
Family ID | 42283420 |
Filed Date | 2010-07-01 |
United States Patent
Application |
20100163077 |
Kind Code |
A1 |
TSUCHIYA; Takafumi ; et
al. |
July 1, 2010 |
TREATING APPARATUS, TREATING METHOD AND RECORDING MEDIUM
Abstract
Disclosed is a treating apparatus capable of improving the
throughput during successive processing of target objects without a
bad influence on the target objects. The disclosed treating
apparatus includes an extendable liquid treating mechanism, and a
common handling unit for handling one target object and another
target object in order. The treating apparatus includes a recipe
producing unit for producing a recipe having a rinsing liquid
treatment and a common handling. When one common handling for
handling one target object by the common handling unit and another
common handling for handling another target object by the common
handling unit are temporally overlapped with each other, the recipe
producing unit extends the extendable liquid treatment for another
target object, and shifts another common handling to an extent that
the extendable liquid treatment is extended, thereby avoiding the
temporal overlapping of one common handling with another common
handling.
Inventors: |
TSUCHIYA; Takafumi; (Tosu
City, JP) ; IWABAE; Tohru; (Tosu City, JP) |
Correspondence
Address: |
CANTOR COLBURN, LLP
20 Church Street, 22nd Floor
Hartford
CT
06103
US
|
Assignee: |
TOKYO ELECTRON LIMITED
Tokyo
JP
|
Family ID: |
42283420 |
Appl. No.: |
12/644673 |
Filed: |
December 22, 2009 |
Current U.S.
Class: |
134/32 ;
134/133 |
Current CPC
Class: |
B08B 3/00 20130101; B08B
3/08 20130101; H01L 21/67745 20130101; G06Q 10/06 20130101; H01L
21/67276 20130101 |
Class at
Publication: |
134/32 ;
134/133 |
International
Class: |
B08B 3/00 20060101
B08B003/00 |
Foreign Application Data
Date |
Code |
Application Number |
Dec 26, 2008 |
JP |
2008-332795 |
Claims
1. A treating apparatus comprising: an extendable liquid treating
mechanism to treat a target object with a liquid; a common handling
unit to handle one target object and another target object in
order; and a recipe producing unit to produce a recipe having an
extendable liquid treatment to treat the target object by the
extendable liquid treating mechanism, and a common handling to
handle the target object by the common handling unit, wherein when
one common handling to handle one target object by the common
handling unit and another common handling to handle another target
object by the common handling unit are temporally overlapped with
each other, the recipe producing unit extends the extendable liquid
treatment for another target object, and shifts another common
handling to an extent that the extendable liquid treatment is
extended so as to avoid temporal overlapping of one common handling
with another common handling.
2. The treating apparatus as claimed in claim 1, further comprising
a chemical liquid treating mechanism to treat the target object
with a chemical liquid, wherein the recipe producing unit produces
the recipe further comprising a chemical liquid treatment to treat
the target object by the chemical liquid treating mechanism.
3. The treating apparatus as claimed in claim 1, wherein the
extendable liquid treating mechanism has a rinsing liquid treating
mechanism to treat the target object with a rinsing liquid.
4. The treating apparatus as claimed in claim 1, wherein the
extendable liquid treating mechanism has a stripping liquid
treating mechanism to treat the target object with a stripping
liquid.
5. The treating apparatus as claimed in claim 2, wherein the common
handling unit comprises an ozone water supply unit to supply ozone
water to the chemical liquid treating mechanism.
6. The treating apparatus as claimed in claim 3, wherein the common
handling unit comprises an ozone water supply unit to supply ozone
water to the rinsing liquid treating mechanism.
7. The treating apparatus as claimed in claim 3, wherein the common
handling unit comprises a heated DIW supply unit to supply heated
deionized water to the rinsing liquid treating mechanism.
8. The treating apparatus as claimed in claim 1, wherein the common
handling unit comprises a carrying device to move the target
object.
9. The treating apparatus as claimed in claim 1, wherein the
extendable liquid treating mechanism comprises multiple extendable
liquid treating units, and sum of times extended in the multiple
extendable liquid treating units equals to a shifted time of the
common handling.
10. A treating method comprises: an extendable liquid treating to
treat the target object with a liquid by an extendable liquid
treating mechanism; one common handling to handle one target object
by a common handling unit; and another common handling to handle
another target object by the common handling unit, wherein when one
common handling and another common handling are temporally
overlapped with each other, the extendable liquid treating for
another target object is extended and another common handling is
shifted to an extent that the extendable liquid treating is
extended so that temporal overlapping of one common handling with
another common handling is avoided.
11. A recording medium storing a computer program to execute a
treating method in a treating apparatus having an extendable liquid
treating mechanism and a common handling unit, wherein the treating
method comprises an extendable liquid treating to treat the target
object with a liquid by an extendable liquid treating mechanism;
one common handling to handle one target object by a common
handling unit; and another common handling to handle another target
object by the common handling unit, wherein when one common
handling and another common handling are temporally overlapped with
each other, the extendable liquid treating for another target
object is extended and another common handling is shifted to an
extent that the extendable liquid treating is extended so that
temporal overlapping of one common handling with another common
handling is avoided.
Description
[0001] This application is based on and claims priority from
Japanese Patent Application No. 2008-332795, filed on Dec. 26,
2008, with the Japanese Patent Office, the disclosure of which is
incorporated herein in its entirety by reference.
TECHNICAL FIELD
[0002] The present disclosure relates to a treating apparatus for
treating a target object, a treating method using the treating
apparatus, a computer program for executing the treating method,
and a recording medium for storing the computer program.
BACKGROUND
[0003] There has been known a cleaning method of sequentially
dipping multiple wafers (hereinafter, referred to as a wafer set)
as target objects in a chemical liquid reservoir storing a chemical
liquid or a rinsing liquid reservoir storing a rinsing liquid,
thereby removing contaminants adhered to respective wafers. Also,
in order to sequentially dip the wafer set in the chemical liquid
reservoir or the rinsing liquid reservoir, a carrying device is
used. Also, as disclosed in Japanese Laid-Open Patent Publication
No. 2002-118086, such a carrying device functions as a common
handling unit for sequentially handling the wafer set.
[0004] In sequentially processing multiple wafer sets, when one
wafer set uses the carrying device (the common handling unit),
another wafer set cannot be carried by the carrying device (the
common handling unit). Thus, a recipe is required to be adjusted in
such a manner that while one wafer set does not use the carrying
device, another wafer set can use the carrying device. However,
depending on the content of the recipe, the time for allowing
another wafer set to use the carrying device cannot be secured. As
a result, the recipe for another wafer set is required to be
largely delayed.
SUMMARY
[0005] According to one embodiment, there is provided a treating
apparatus including an extendable liquid treating mechanism to
treat a target object with a liquid, a common handling unit to
handle one target object and another target object in order, and a
recipe producing unit to produce a recipe having an extendable
liquid treatment for treating the target object by the extendable
liquid treating mechanism and a common handling to handle the
target object by the common handling unit. When one common handling
for handling one target object by the common handling unit and
another common handling for handling another target object by the
common handling unit are temporally overlapped with each other, the
recipe producing unit extends the extendable liquid treatment for
another target object, and shifts another common handling to an
extent that the extendable liquid treatment is extended, thereby
avoiding temporal overlapping of one common handling with another
common handling.
[0006] The foregoing summary is illustrative only and is not
intended to be in any way limiting. In addition to the illustrative
aspects, embodiments, and features described above, further
aspects, embodiments, and features will become apparent by
reference to the drawings and the following detailed
description.
BRIEF DESCRIPTION OF THE DRAWINGS
[0007] FIG. 1 is a schematic view illustrating the configuration of
a treating apparatus according to a first embodiment of the present
disclosure.
[0008] FIG. 2 is a schematic view illustrating a treating method
performed by a treating apparatus according to a first embodiment
of the present disclosure.
[0009] FIG. 3 is a view illustrating a recipe produced by a recipe
producing unit in a treating apparatus according to a first
embodiment of the present disclosure
[0010] FIG. 4 is a schematic view illustrating the configuration of
a treating apparatus according to a second embodiment of the
present disclosure.
[0011] FIG. 5 is a view illustrating a recipe produced by a recipe
producing unit in a treating apparatus according to a second
embodiment of the present disclosure.
[0012] FIG. 6 is a schematic view illustrating the configuration of
a treating apparatus according to a third embodiment of the present
disclosure.
[0013] FIG. 7 is a schematic view illustrating the configuration of
a treating apparatus according to a fourth embodiment of the
present disclosure.
DETAILED DESCRIPTION
[0014] In the following detailed description, reference is made to
the accompanying drawings, which form a part hereof. The
illustrative embodiments described in the detailed description,
drawings, and claims are not meant to be limiting. Other
embodiments may be utilized, and other changes may be made, without
departing from the spirit or scope of the subject matter presented
here.
[0015] The present disclosure provides a treating apparatus, a
treating method, a computer program and a recording medium, which
can improve the throughput during successive processing of target
objects without a bad influence on the target objects.
[0016] According to one embodiment, there is provided a treating
apparatus including an extendable liquid treating mechanism to
treat a target object with a liquid, a common handling unit to
handle one target object and another target object in order, and a
recipe producing unit to produce a recipe having an extendable
liquid treatment to treat the target object by the extendable
liquid treating mechanism and a common handling to handle the
target object by the common handling unit. When one common handling
for handling one target object by the common handling unit and
another common handling for handling another target object by the
common handling unit are temporally overlapped with each other, the
recipe producing unit extends the extendable liquid treatment for
another target object, and shifts another common handling to an
extent that the extendable liquid treatment is extended, thereby
avoiding temporal overlapping of one common handling with another
common handling.
[0017] The treating apparatus may further include a chemical liquid
treating mechanism to treat the target object with a chemical
liquid, wherein the recipe produced by the recipe producing unit
may further include a chemical liquid treatment to treat the target
object by the chemical liquid treating mechanism.
[0018] The extendable liquid treating mechanism may be provided
with a rinsing liquid treating mechanism to treat the target object
with a rinsing liquid.
[0019] The extendable liquid treating mechanism may be provided
with a stripping liquid treating mechanism to treat the target
object with a stripping liquid.
[0020] The common handling unit may be provided with an ozone water
supply unit to supply ozone water to the chemical liquid treating
mechanism.
[0021] The common handling unit may be provided with an ozone water
supply unit to supply ozone water to the rinsing liquid treating
mechanism.
[0022] The common handling unit may be provided with a heated DIW
supply unit to supply heated deionized water to the rinsing liquid
treating mechanism.
[0023] The common handling unit may be provided with a carrying
device to move the target object.
[0024] The extendable liquid treating mechanism may include
multiple extendable liquid treating units, and sum of times
extended in the multiple extendable liquid treating units equals to
a shifted time of the common handling.
[0025] According to another embodiment, there is provided a
treating method that includes an extendable liquid treating to
treat the target object with a liquid by an extendable liquid
treating mechanism, one common handling to handle one target object
by a common handling unit, and another common handling to handle
another target object by the common handling unit. When one common
handling and another common handling are temporally overlapped with
each other, the extendable liquid treating for another target
object is extended and another common handling is shifted to an
extent that the extendable liquid treating is extended so that
temporal overlapping of one common handling with another common
handling is avoided.
[0026] According to another embodiment, there is provided a
computer program to execute a treating method in a treating
apparatus having an extendable liquid treating mechanism and a
common handling unit, wherein the treating method includes an
extendable liquid treating to treat the target object with a liquid
by an extendable liquid treating mechanism, one common handling to
handle one target object by a common handling unit, and another
common handling, after the one common handling, to handle another
target object by the common handling unit. When one common handling
and another common handling are temporally overlapped with each
other, the extendable liquid treating for another target object is
extended and another common handling is shifted to an extent that
the extendable liquid treating is extended so that temporal
overlapping of one common handling with another common handling is
avoided.
[0027] According to another embodiment, there is provided a
recording medium storing a computer program to execute a treating
method in a treating apparatus having an extendable liquid treating
mechanism and a common handling unit, wherein the treating method
includes an extendable liquid treatment to treat the target object
with a liquid by an extendable liquid treating mechanism, one
common handling to handle one target object by a common handling
unit, and another common handling to handle another target object
by the common handling unit. When one common handling and another
common handling are temporally overlapped with each other, the
extendable liquid treatment for another target object is extended,
and another common handling is shifted to an extent that the
extendable liquid treatment is extended, so that temporal
overlapping of one common handling with another common handling is
avoided.
[0028] According to the present disclosure, when one common
handling for handling one target object by a common handling unit
and another common handling for handling another target object by
the common handling unit are temporally overlapped with each other,
the extendable liquid treatment for another target object is
extended, and another common handling is shifted to an extent that
the extendable liquid treatment is extended, thereby avoiding the
temporal overlapping of one common handling with another common
handling. Accordingly, it is possible to improve the throughput
during successive processing of target objects without a bad
influence on the target objects.
First Embodiment
[0029] Hereinafter, a treating apparatus, a treating method, a
computer program, and a recording medium, according to a first
embodiment of the present disclosure, will be described with
reference to drawings. Herein, FIGS. 1 to 3a and 3b are views
illustrating the first embodiment of the present disclosure.
[0030] As shown in FIG. 1, the treating apparatus includes a case
1, a carrier loading/unloading unit (not shown), which is provided
in case 1, for loading and unloading a carrier (not shown) which
houses multiple wafers (hereinafter, referred to as a wafer set), a
carrier stock unit (not shown) for receiving the carrier from the
carrier loading/unloading unit and storing the carrier, a carrier
loading/unloading stage 3 on which the wafer set stored in the
carrier stock unit is moved during the treatment, a first carrying
device 5 for taking the wafer set from carrier loading/unloading
stage 3, and a loader part 21 for receiving the wafer set from
first carrying device 5. From among the components, carrier
loading/unloading stage 3 has a carrier loading door 3a, which is
opened when first carrying device 5 reaches carrier
loading/unloading stage 3, and is closed when first carrying device
5 moves away.
[0031] As shown in FIG. 1, the treating apparatus includes a
chemical liquid treating mechanism having a first chemical liquid
treating unit 30 for treating a wafer with a first chemical liquid,
and a second chemical liquid treating unit 35 for treating the
wafer with a second chemical liquid, and a rinsing liquid treating
mechanism having a first rinsing liquid treating unit 40 for
treating the wafer with a first rinsing liquid, and a second
rinsing liquid treating unit 45 for treating the wafer with a
second rinsing liquid.
[0032] From among the above mentioned components, first chemical
liquid treating unit 30 has a first chemical liquid reservoir 31
storing a first chemical liquid, and a first chemical liquid
elevating device 32 for receiving a wafer set from a second
carrying device 10 described below and carrying the wafer set into
first chemical liquid reservoir 31. Second chemical liquid treating
unit 35 has a second chemical liquid reservoir 36 storing a second
chemical liquid, and a second chemical liquid elevating device 37
for receiving the wafer set from second carrying device 10 and
carrying the wafer set into second chemical liquid reservoir
36.
[0033] First rinsing liquid treating unit 40 has a first rinsing
liquid reservoir 41 storing a first rinsing liquid, and a first
rinsing liquid elevating device 42 for receiving the wafer set from
second carrying device 10 and carrying the wafer set into first
rinsing liquid reservoir 41. Second rinsing liquid treating unit 45
has a second rinsing liquid reservoir 46 storing a second rinsing
liquid, and a second rinsing liquid elevating device 47 for
receiving the wafer set from second carrying device 10 and carrying
the wafer set into second rinsing liquid reservoir 46.
[0034] In the present disclosure, the chemical liquid means an
etching liquid and the like except for the stripping liquid to be
mentioned below. For example, concentrated hydrofluoric acid,
diluted hydrofluoric acid, ammonia-hydrogen peroxide solution
(SC1), hydrochloric acid-hydrogen peroxide solution (SC2) or
phosphoric acid may be used as the chemical liquid. Meanwhile, for
example, deionized water (DIW) or ozone water may be used as the
rinsing liquid. In the present embodiment, diluted hydrofluoric
acid is used as the first chemical liquid, SC1 is used as the
second chemical liquid, and deionized water is used as the first
and second rinsing liquids.
[0035] As shown in FIG. 1, the treating apparatus includes a drying
unit 60 for drying the wafer, which is provided at the position
adjacent to second rinsing liquid treating unit 45, and a carrying
device washing unit 65 for washing second carrying device (carrying
device) 10 described below, which is provided at the position
adjacent to first chemical liquid treating unit 30.
[0036] Drying unit 60 according to the present embodiment, as shown
in FIG. 1, has a third rinsing liquid reservoir 61 storing a third
rinsing liquid (deionized water in the present embodiment), a
drying chamber 63 provided above third rinsing liquid reservoir 61,
a shutter (not shown) openably/closably provided between third
rinsing liquid reservoir 61 and drying chamber 63, and a drying
elevating device 62 which is elevated between third rinsing liquid
reservoir 61 and drying chamber 63. In drying chamber 63, a drying
liquid supply unit (not shown) for supplying a drying liquid, such
as IPA, and an inert gas supply unit (not shown) for supplying
inert gas, such as N.sub.2, are provided.
[0037] As shown in FIG. 1, the treating apparatus includes second
carrying device (carrying device) 10 which lifts up the wafer set
loaded in loader part 21 from loader part 21, and moves the wafer
set between carrying device washing unit 65, first chemical liquid
treating unit 30, first rinsing liquid treating unit 40, second
chemical liquid treating unit 35, second rinsing liquid treating
unit 45 and drying unit 60. In the present embodiment, second
carrying device 10 includes a common handling unit for sequentially
handling one wafer set and another wafer set.
[0038] As shown in FIG. 1, the treating apparatus includes an
unloader part 22 for receiving the wafer set which has been dried
in drying unit 60 from second carrying device 10. The wafer set
loaded in unloader part 22 is lifted up by first carrying device 5
and is carried to carrier loading/unloading stage 3.
[0039] Meanwhile, in the present embodiment, the computer program
for executing the treating method described below is stored in a
recording medium 52 (see FIG. 1). The treating apparatus is
provided with a computer 55 storing recording medium 52, and a
control device 50 for controlling the treating apparatus itself by
receiving a signal from computer 55. Accordingly, when recording
medium 52 is inserted in (or attached to) computer 55, the series
of liquid treating steps described below can be executed in the
treating apparatus by control device 50. In the present disclosure,
recording medium 52 includes CD, DVD, MD, hard disk, RAM, etc.
[0040] Control device 50 includes a recipe producing unit 51 for
producing a recipe having loader loading steps a1, b1, and c1,
first chemical liquid carrying steps a2, b2, and c2, first chemical
liquid treating steps a3, b3, and c3, first rinsing liquid carrying
steps a4, b4, and c4, first rinsing liquid treating steps a5, b5,
and c5, second chemical liquid carrying steps a6, b6, and c6,
second chemical liquid treating steps a7, b7, and c7, second
rinsing liquid carrying steps a8, b8, and c8, second rinsing liquid
treating steps a9, b9, and c9, drying carrying steps a12, b10, and
c10, third rinsing liquid treating steps all, b11, and c11, drying
treating steps a12, b12, and c12, and unloader loading steps a13,
b13, and c13 (see FIGS. 1, 3a, and 3b).
[0041] Hereinafter, the operation of the present embodiment having
the above described configuration will be described.
[0042] First, first carrying device 5 reaches carrier
loading/unloading stage 3, and thereby carrier loading door 3a is
placed in an open state. Then, a wafer set (for example, 25 wafers)
loaded in carrier loading/unloading stage 3 is taken by first
carrying device 5, and carrier loading door 3a is placed in a
closed state (see FIG. 1).
[0043] Then, first carrying device 5 rotates toward loader part 21
by 90.degree. while rotating the wafer set in such a manner that
wafer surfaces can be vertically placed. Thereafter, the wafer set
with vertically placed surfaces is loaded in loader part 21 (see
FIG. 1).
[0044] Then, the above described steps are repeatedly carried out
so as to further load multiple wafers, for example, 25 wafers in
loader part 21. Herein, the previously loaded wafer and the wafer
to be sequentially loaded are loaded in a nested manner, thereby
forming a wafer set with a half pitch of wafers received in the
carrier (loader loading steps a1, b1, and c1; see FIGS. 3a and
3b).
[0045] Then, a wafer set (one target object) including multiple
wafers, for example, 50 wafers is lifted up from loader part 21 by
second carrying device 10 and then is carried into first chemical
liquid treating unit 30 (first chemical liquid carrying steps a2,
b2, and c2; see FIGS. 2(1), 3a, and 3b). Further, in first chemical
liquid treating unit 30, the wafer set is taken from second
carrying device 10 by first chemical liquid elevating device 32 and
is carried into first chemical liquid reservoir 31 (see FIG. 1).
Accordingly, the wafer set is treated with diluted hydrofluoric
acid as the first chemical liquid (first chemical liquid treating
steps a3, b3, and c3; see FIGS. 3a and 3b).
[0046] Then, the wafer set is lifted up by first chemical liquid
elevating device 32 and is unloaded from the inside of first
chemical liquid reservoir 31. Further, the wafer set is taken from
first chemical liquid elevating device 32 by second carrying device
10 and is carried into first rinsing liquid treating unit 40 (first
rinsing liquid carrying steps a4, b4, and c4; see FIGS. 2(2) and
3a, and 3b).
[0047] Then, in first rinsing liquid treating unit 40, the wafer
set is taken from second carrying device 10 by first rinsing liquid
elevating device 42 and is carried into first rinsing liquid
reservoir 41 (see FIG. 1). Accordingly, the wafer set is treated
with deionized water as the first rinsing liquid (first rinsing
liquid treating steps a5, b5, and c5; see FIGS. 3a, and 3b).
[0048] Then, the wafer set is lifted up by first rinsing liquid
elevating device 42 and is unloaded from the inside of first
rinsing liquid reservoir 41. Further, the wafer set is taken from
first rinsing liquid elevating device 42 by second carrying device
10 and is carried into second chemical liquid treating unit 35
(second chemical liquid carrying steps a6, b6, and c6; see FIGS.
2(3) and 3a, and 3b).
[0049] Then, in second chemical liquid treating unit 35, the wafer
set is taken from second carrying device 10 by second chemical
liquid elevating device 37 and is carried into second chemical
liquid reservoir 36. Accordingly, the wafer set is treated with SC1
as the second chemical liquid (second chemical liquid treating
steps a7, b7, and c7; see FIGS. 3a, and 3b).
[0050] Then, the wafer set is lifted up by second chemical liquid
elevating device 37 and is unloaded from the inside of second
chemical liquid reservoir 36.
[0051] Further, the wafer set is taken from second chemical liquid
elevating device 37 by second carrying device 10 and is carried
into second rinsing liquid treating unit 45 (second rinsing liquid
carrying steps a8, b8, and c8; see FIGS. 2(4) and 3a, and 3b).
[0052] Then, in second rinsing liquid treating unit 45, the wafer
set is taken from second carrying device 10 by second rinsing
liquid elevating device 47 and is carried into second rinsing
liquid reservoir 46. Accordingly, the wafer set is treated with
deionized water as the second rinsing liquid (second rinsing liquid
treating steps a9, b9, and c9; see FIGS. 3a, and 3b).
[0053] Then, the wafer set is lifted up by second rinsing liquid
elevating device 47 and is unloaded from the inside of second
rinsing liquid reservoir 46. Further, the wafer set is taken from
second rinsing liquid elevating device 47 by second carrying device
10 and is carried into drying unit 60 (drying carrying steps a10,
b10, and c10; see FIGS. 2(5) and 3a, and 3b).
[0054] Then, in drying unit 60, the wafer set is taken from second
carrying device 10 by drying elevating device 62 and is carried
into third rinsing liquid reservoir 61. Accordingly, the wafer set
is treated with deionized water as the third rinsing liquid (third
rinsing liquid treating steps).
[0055] Then, the wafer set is lifted up by drying elevating device
62. Further, after a drying liquid, such as IPA, is supplied to the
lifted-up wafer set, inert gas, such as N.sub.2, is supplied to the
wafer set, thereby drying the wafer set (a drying step). In the
present embodiment, hereinafter, the above described third rinsing
liquid treating step plus the drying step is referred to as a
drying treating step a11, b11, and c11 (see FIGS. 3a and 3b).
[0056] Then, the wafer set is taken from drying elevating device 62
by second carrying device 10, and the taken wafer set is carried to
unloader part 22 (unloader carrying steps a12, b12, and c12), and
is loaded in unloader part 22 (unloader loading steps a13, b13, and
c13; see FIGS. 2(6) and 3a, and 3b). Thereafter, the wafer set is
lifted up by first carrying device 5 and is carried to carrier
loading/unloading stage 3. Meanwhile, when the wafer set is
transferred to unloader part 22 from second carrying device 10,
second carrying device 10 is moved to loader part 21 (see FIG.
2(7)).
[0057] The above described series of steps are also performed on a
next target wafer set (another target object). In order to increase
the throughput, the step for treating the first target wafer set
(one target object), and the step for treating the next target
wafer set (another target object) are carried out at intervals.
[0058] In the following detailed description, for illustrative
purposes, a step performed on the first target wafer set (first
wafer set) is referred to as a pre-step, a step performed on the
second target wafer set (second wafer set) is referred to as a
mid-step, and a step performed on the third target wafer set (third
wafer set) is referred to as a post-step.
[0059] In other words, for the first wafer set, a loader loading
pre-step a1, a first chemical liquid carrying pre-step a2, a first
chemical liquid treating pre-step a3, a first rinsing liquid
carrying pre-step a4, a first rinsing liquid treating pre-step a5,
a second chemical liquid carrying pre-step a6, a second chemical
liquid treating pre-step a7, a second rinsing liquid carrying
pre-step a8, a second rinsing liquid treating pre-step a9, a drying
carrying pre-step a10, a drying treating pre-step all, an unloader
carrying pre-step a12, and an unloader loading pre-step a13 are
sequentially carried out.
[0060] Also, for the second wafer set, a loader loading mid-step
b1, a first chemical liquid carrying mid-step b2, a first chemical
liquid treating mid-step b3, a first rinsing liquid carrying
mid-step b4, a first rinsing liquid treating mid-step b5, a second
chemical liquid carrying mid-step b6, a second chemical liquid
treating mid-step b7, a second rinsing liquid carrying mid-step b8,
a second rinsing liquid treating mid-step b9, a drying carrying
mid-step b10, a drying treating mid-step b11, an unloader carrying
mid-step b12, and an unloader loading mid-step b13 are sequentially
carried out.
[0061] Also, for the third wafer set, a loader loading post-step
c1, a first chemical liquid carrying post-step c2, a first chemical
liquid treating post-step c3, a first rinsing liquid carrying
post-step c4, a first rinsing liquid treating post-step c5, a
second chemical liquid carrying post-step c6, a second chemical
liquid treating post-step c7, a second rinsing liquid carrying
post-step c8, a second rinsing liquid treating post-step c9, a
drying carrying post-step c10, a drying treating post-step c11, an
unloader carrying post-step c12, and an unloader loading post-step
c13 are sequentially carried out.
[0062] When recipe producing unit 51 combines pre-determined
recipes without shifting or extending the steps in such a manner
that the use times of the common member, in particular, second
carrying device 10, are not overlapped with each other, the result
as shown in FIG. 3a is obtained.
[0063] Herein, first, the recipe for the first wafer set is
determined. Then, for the second wafer set, the recipe is
determined in such a manner that the carrying pre-steps a2, a4, a6,
a8, a10, and a12 (hereinafter, referred to as the carrying
pre-steps (a2-a12)) and the carrying mid-steps b2, b4, b6, b8, b10,
and b12 (hereinafter, referred to as the carrying mid-steps
(b2-b12)) are not temporally overlapped with each other. Finally,
for the third wafer set, the recipe is determined in such a manner
that the carrying pre-steps (a2-a12), the carrying mid-steps
(b2-b12), and the carrying post-steps c2, c4, c6, c8, c10, and c12
(hereinafter, referred to as the carrying post-steps (c2-c12)) are
not temporally overlapped with each other.
[0064] As described above, in the aspect shown in FIG. 3a, the
steps included in the recipe are not shifted or extended while the
entire recipe of the third wafer set is temporally shifted to the
last stage. Thus, the processing time for the third wafer set is
highly delayed, thereby reducing the throughput in successive
processing of wafer sets.
[0065] In relation to this, when one carrying step for handling one
target object by second carrying device 10 and another carrying
step for handling another target object by second carrying device
10 are temporally overlapped with each other, recipe producing unit
51 according to the present embodiment extends the rinsing liquid
treating step for another target object, and shifts other carrying
steps temporally following the rinsing liquid treating step to an
extent that the rinsing liquid treating step is extended, thereby
avoiding the temporal overlapping of one carrying step with another
carrying step.
[0066] More specifically, in accordance with the aspect as shown in
FIG. 3b, recipe producing unit 51, firstly, determines a recipe for
the first wafer set.
[0067] Then, recipe producing unit 51 determines a recipe for the
second wafer set in such a manner that the carrying pre-steps
a2-a12 and the carrying mid-steps b2-b12 are not temporally
overlapped with each other. Herein, when the time for the
processing step for the second wafer set is shortened to avoid the
overlapping of the carrying mid-steps b6, b8, b10, and b12
following the first rinsing liquid treating mid-step b5, the first
rinsing liquid treating mid-step b5 is extended, and the carrying
mid-steps b6, b8, b10, and b12 are shifted.
[0068] Also, when the carrying mid-steps b10 and b12 whose
overlapping is avoided are performed after the second rinsing
liquid treating mid-step b9, the second rinsing liquid treating
mid-step b9, instead of the first rinsing liquid treating mid-step
b5, may be extended, or both the first rinsing liquid treating
mid-step b5 and the second rinsing liquid treating mid-step b9 may
be extended. Herein, when both the first rinsing liquid treating
mid-step b5 and the second rinsing liquid treating mid-step b9 are
extended, the sum of the extended times of the first rinsing liquid
treating mid-step b5 and the second rinsing liquid treating
mid-step b9 equals to the shifted times of the carrying mid-steps
b6, b8, b10, and b12.
[0069] In relation to this, in the present embodiment, since the
processing time for the second wafer set may be shortened by
avoiding the overlapping of the carrying mid-steps b6, b8, b10, and
b12 following the first rinsing liquid treating mid-step b5, recipe
producing unit 51 produces a recipe which is determined to not
temporally overlap the carrying pre-steps a2-a12 and the carrying
mid-steps b2-b12 with each other without shift or extension of the
steps included in the recipe.
[0070] Then, recipe producing unit 51 determines a recipe for the
third wafer set in such a manner that the carrying pre-steps
a2-a12, the carrying mid-steps b2-b12, and the carrying post-steps
c2-c12 are not temporally overlapped with each other. Herein, when
the time for the processing step for the third wafer set is
shortened to avoid the overlapping of the carrying post-steps c6,
c8, c10, and c12 following the first rinsing liquid treating
post-step c5, the first rinsing liquid treating post-step c5 is
extended, and the carrying post-steps c6, c8, c10, and c12 are
shifted.
[0071] Also, when the carrying post-steps c10 and c12 whose
overlapping is avoided are performed after the second rinsing
liquid treating post-step, the second rinsing liquid treating
post-step c9, instead of the first rinsing liquid treating
post-step c5, may be extended, or both the first rinsing liquid
treating post-step c5 and the second rinsing liquid treating
post-step c9 may be extended. Herein, when the first rinsing liquid
treating post-step c5 and the second rinsing liquid treating
post-step c9 are extended, the sum of the extended times of the
first rinsing liquid treating post-step c5 and the second rinsing
liquid treating post-step c9 equals to the shifted times of the
carrying steps.
[0072] In the present embodiment, since the processing time for the
third wafer set may be shortened by avoiding the overlapping of the
carrying post-steps c6, c8, c10, and c12 following the first
rinsing liquid treating post-step c5, recipe producing unit 51
produces a recipe, as shown in FIG. 3b, which extends the first
rinsing liquid treating post-step c5 to the extent of E1 and avoids
the overlapping of the second chemical liquid carrying post-step c6
with the steps following the second chemical liquid carrying
post-step c6.
[0073] Accordingly, according to the present embodiment, compared
to the case where the entire recipe of the third wafer set is
temporally shifted to the last stage (see FIG. 3a), it is possible
to improve the throughput in successive processing of wafer sets
(see FIG. 3b).
[0074] In other words, since the combination of predetermined
recipes without shift or extension of steps included in the recipes
cannot help generating an overlapped portion in the carrying steps
a2-a12, b2-b12, and c2-c12, the later overlapping of entire recipes
needs to be avoided, and thus the throughput gets poorer when
successive processing of wafer sets is performed. Compared to this,
the carrying steps a2-a12, b2-b12, and c2-c12 included in the
recipes are appropriately shifted in the present embodiment, and
thus the time not used by second carrying device 10 can be
effectively used, thereby improving the throughput in successive
processing of wafer sets.
[0075] Also, in the present disclosure, since a rinsing liquid
treating step is set as the extended step, more specifically, the
first rinsing liquid treating post-step c5, it is possible to
prevent the extension's bad influence on the wafer. For example,
when the time of the chemical liquid treating steps c3 and c7 is
extended, there is a concern that each wafer may be over-etched by
the chemical liquid. However, when the wafers are dipped in the
rinsing liquid for a time longer than a prearranged time, each
wafer is not subject to such a bad influence.
[0076] Although the present embodiment was described with reference
to the rinsing liquid treating units 40 and 45 for supplying the
rinsing liquid, the present disclosure is not limited thereto.
Instead of the rinsing liquid treating units 40 and 45, a POU
reservoir for supplying the rinsing liquid after the supply of the
chemical liquid may be used. In the case of such a POU reservoir,
since the wafer is finally treated with the rinsing liquid, there
is no concern regarding over-etching.
[0077] Also, in the above described aspect, second carrying device
10 may be appropriately washed by carrying device washing unit
65.
[0078] In other words, second carrying device 10 moves between the
first chemical liquid carrying steps a2, b2, and c2 (see FIG. 2(1))
and the first rinsing liquid carrying steps a4, b4, and c4 (see
FIG. 2(2)), between the first rinsing liquid carrying steps a4, b4,
and c4 (see FIG. 2(2)) and the second chemical liquid carrying
steps a6, b6, and c6 (see FIG. 2 (3)), between the second chemical
liquid carrying steps a6, b6, and c6 (see FIG. 2 (3)) and the
second rinsing liquid carrying steps a8, b8, and c8 (see FIG. 2
(4)), between the second rinsing liquid carrying steps a8, b8, and
c8 (see FIG. 2 (4)) and the drying carrying steps a10, b10, and c10
(see FIG. 2(5)), between the drying carrying steps a10, b10, and
c10 (see FIG. 2(5)) and the unloader loading steps a13, b13, and
c13 (see FIG. 2 (6)), and between the unloader loading steps a13,
b13, and c13 (see FIG. 2 (6)) and the step for moving the wafer set
to loader part 21 (see FIG. 2 (7)). Second carrying device 10
appropriately moves to carrying device washing unit 65, if
necessary. After being washed in carrying device washing unit 65,
second carrying device 10 may be returned to its original
position.
[0079] Also, although in the above description, the first rinsing
liquid treating steps a5, b5, and c5, and the second rinsing liquid
treating steps a9, b9, and c9 are extended, the present disclosure
is not limited thereto. For example, in another aspect, both or one
of the third rinsing liquid treating step and the drying step may
be extended. Especially, in the case of extending the drying step,
in consideration of the influence on the wafer set, it is
preferable to extend the step of supplying inert gas, such as
N.sub.2, instead of the step of supplying a drying liquid, such as
IPA.
Second Embodiment
[0080] Hereinafter, the second embodiment of the present disclosure
will be described with reference to FIGS. 4, 5a, and 5b. The
treating apparatus according to the second embodiment, as shown in
FIGS. 4, 5a, and 5b, further includes an ozone water supply unit 71
for supplying ozone water to first rinsing liquid treating unit 40
and second rinsing liquid treating unit 45. Ozone water supply unit
71, like second carrying device 10, functions as a common handling
unit. Other configurations are almost the same as those of the
first embodiment shown in FIGS. 1 to 3a and 3b.
[0081] In the second embodiment shown in FIGS. 4, 5a, and 5b, the
same parts as those in the first embodiment shown in FIGS. 1 to 3a
and 3b are denoted by the same numerals, and their detailed
description is omitted.
[0082] In the present embodiment, during both the wafer processing
in first rinsing liquid treating unit 40 and the wafer processing
in second rinsing liquid treating unit 45, ozone water supply unit
71 is used. Thus, not only the carrying steps a2-a12, b2-b12, and
c2-c12, but also the first rinsing liquid treating steps a5, b5,
and c5 and the second rinsing liquid treating steps a9, b9, and c9
are adjusted to be not temporally overlapped (see a9', b9', and c9'
indicated by dotted lines in FIGS. 5a and 5b).
[0083] When recipe producing unit 51 combines pre-determined
recipes without shifting or extending the steps in such a manner
that the use times of the common member (in particular, second
carrying device 10, first rinsing liquid treating unit 40, and
second rinsing liquid treating unit 45) are not overlapped with
each other, the result as shown in FIG. 5a is obtained.
[0084] Herein, first, the recipe for the first wafer set is
determined. Then, for the second wafer set, the recipe is
determined in such a manner that the carrying steps a2-a12 and
b2-b12 are not temporally overlapped with each other and the first
rinsing liquid treating steps a5 and b5 and the second rinsing
liquid treating steps a9 and b9 are not temporally overlapped with
each other. Finally, for the third wafer set, the recipe is
determined in such a manner that the carrying steps a2-a12, b2-b12,
and c2-c12 are not temporally overlapped with each other and the
first rinsing liquid treating steps a5, b5, and c5, and the second
rinsing liquid treating steps a9, b9, and c9 are not temporally
overlapped with each other.
[0085] As described above, in the aspect shown in FIG. 5a, the
steps included in the recipe are not shifted or extended while the
entire recipe of the third wafer set is temporally shifted to the
last stage. Thus, the processing time for the third wafer set is
highly delayed, thereby reducing the throughput in successive
processing of wafer sets.
[0086] In relation to this, when one carrying step for handling one
target object by second carrying device 10 and another carrying
step for handling another target object by second carrying device
10 are temporally overlapped with each other, or when one first
rinsing liquid treating step and one second rinsing liquid treating
step for handling one target object by ozone water supply unit 71
and another first rinsing liquid treating step and another second
rinsing liquid treating step for handling another target object by
ozone water supply unit 71 are temporally overlapped with each
other, recipe producing unit 51 according to the present embodiment
extends the rinsing liquid treating step for another target object,
and shifts other carrying steps temporally following the rinsing
liquid treating step to an extent that the rinsing liquid treating
step is extended, thereby avoiding the temporal overlapping of
carrying steps and the temporal overlapping of the first rinsing
liquid treating step with the second rinsing liquid treating
step.
[0087] More specifically, in accordance with the aspect as shown in
FIG. 5b, recipe producing unit 51, firstly, determines a recipe for
the first wafer set.
[0088] Then, recipe producing unit 51 determines a recipe for the
second wafer set in such a manner that the carrying steps a2-a12
and b2-b12 are not temporally overlapped with each other and the
first rinsing liquid treating steps a5 and b5 and the second
rinsing liquid treating steps a9 and b9 are not temporally
overlapped with each other. Herein, when the time for the
processing step for the second wafer set is shortened to avoid the
overlapping of the carrying mid-steps following the first rinsing
liquid treating mid-step b5, the first rinsing liquid treating
mid-step b5 is extended, and the carrying mid-steps b6, b8, b10,
and b12 are shifted.
[0089] Also, when the carrying mid-steps b10 and b12 whose
overlapping is avoided are performed after the second rinsing
liquid treating mid-step b9, the second rinsing liquid treating
mid-step b9, instead of the first rinsing liquid treating mid-step
b5, may be extended, or both the first rinsing liquid treating
mid-step b5 and the second rinsing liquid treating mid-step b9 may
be extended. Herein, when both the first rinsing liquid treating
mid-step b5 and the second rinsing liquid treating mid-step b9 are
extended, the sum of the extended times of the first rinsing liquid
treating mid-step b5 and the second rinsing liquid treating
mid-step b9 equals to the shifted times of the carrying steps.
[0090] In the present embodiment, since the processing time for the
second wafer set may be shortened by avoiding the overlapping of
the carrying post-steps c6, c8, c10, and c12 following the first
rinsing liquid treating post-step c5, recipe producing unit 51
produces a recipe, as shown in FIG. 5b, which extends the first
rinsing liquid treating post-step c5 to the extent of E2, and
avoids the overlapping of the second chemical liquid carrying
post-step c6 with the steps following the second chemical liquid
carrying post-step c6.
[0091] Then, recipe producing unit 51 determines a recipe for the
third wafer set in such a manner that the carrying steps a2-a12,
b2-b12, and c2-c12 are not temporally overlapped with each other
and the first rinsing liquid treating steps a5, b5, and c5, and the
second rinsing liquid treating steps b9, b9, and c9 are not
temporally overlapped with each other. Herein, when the time for
the processing step for the third wafer set is shortened to avoid
the overlapping of the carrying post-steps c6, c8, c10, and c12
following the first rinsing liquid treating post-step c5, the first
rinsing liquid treating post-step c5 is extended and the carrying
post-steps c6, c8, c10, and c12 are shifted.
[0092] Also, when the carrying post-steps c10 and c12 whose
overlapping is avoided are performed after the second rinsing
liquid treating post-step c9, the second rinsing liquid treating
post-step c9, instead of the first rinsing liquid treating
post-step c5, may be extended, or both the first rinsing liquid
treating post-step c5 and the second rinsing liquid treating
post-step c9 may be extended. Herein, when the first rinsing liquid
treating post-step c5 and the second rinsing liquid treating
post-step c9 are extended, the sum of the extended times of the
first rinsing liquid treating post-step c5 and the second rinsing
liquid treating post-step c9 equals to the shifted times of the
carrying steps.
[0093] In relation to this, in the present embodiment, since the
processing time for the third wafer set is not shortened by
avoiding the overlapping of the carrying post-steps c6, c8, c10,
and c12 following the rinsing liquid treating post-steps c5 and c9,
compared to the case when the overlapping is not avoided, recipe
producing unit 51 produces a recipe which is determined in such a
manner that the carrying steps a2-a12, b2-b12, and c2-c12 are not
temporally overlapped with each other and the first rinsing liquid
treating steps a5, b5, and c5, and the second rinsing liquid
treating steps a9, b9, and c9 are not temporally overlapped with
each other without shift or extension of the steps included in the
recipe.
[0094] As described above, in the present embodiment, since the
processing on the second wafer set can be performed temporally
ahead while avoiding the overlapping of steps, it is possible to
improve the throughput in successive processing of wafer sets (see
FIGS. 5a and 5b). Also, in the present embodiment, since a rinsing
liquid treating step is set as the extended step, it is possible to
prevent the extension's bad influence on the wafer.
[0095] In the above described aspect of the present embodiment,
although ozone water supply unit 71 is used during both the wafer
processing in first rinsing liquid treating unit 40 and the wafer
processing in second rinsing liquid treating unit 45, the present
disclosure is not limited thereto. For example, in another aspect,
during all of the wafer processing in first rinsing liquid treating
unit 40, the wafer processing in second rinsing liquid treating
unit 45, and the wafer processing in the third rinsing liquid
treating unit 61, ozone water supply unit 71 may be used.
[0096] In this case, in order to avoid the temporal overlapping of
the second carrying steps a2-a12, b2-b12, and c2-c12 with each
other, and the temporal overlapping of the first rinsing liquid
treating steps a5, b5, and c5, the second rinsing liquid treating
steps a9, b9, and c9, and the third rinsing liquid treating steps
with each other, the rinsing liquid treating mid-steps b5 and b9
are extended, thereby avoiding the overlapping of the carrying
mid-steps b6, b8, b10, and b12, or the rinsing liquid treating
post-steps c5, and c9 are extended, thereby avoiding the
overlapping of the carrying post-steps c6, c8, c10, and c12.
[0097] Also, the ozone water may be used by mixing with the
chemical liquid. In this case, the rinsing liquid treating
mid-steps b5 and b9 are extended to avoid the overlapping of the
carrying mid-steps b6, b8, b10, and b12, or the rinsing liquid
treating post-steps c5, and c9 are extended to avoid the
overlapping of the carrying post-steps c6, c8, c10, and c12, in
such a manner that the first chemical liquid treating steps a3, b3,
and c3 are not temporally overlapped with each other (when first
chemical liquid treating unit 30 uses the ozone water), the second
chemical liquid treating steps a7, b7, and c7 are not temporally
overlapped with each other (when second chemical liquid treating
unit 35 uses the ozone water), or the first chemical liquid
treating steps a3, b3, and c3 and the second chemical liquid
treating steps a7, b7, and c7 are not temporally overlapped with
each other (when both first chemical liquid treating unit 30 and
second chemical liquid treating unit 35 use the ozone water).
Third Embodiment
[0098] Hereinafter, the third embodiment of the present disclosure
will be described with reference to FIG. 6. The treating apparatus
according to the third embodiment, as shown in FIG. 6, includes a
heated DIW supply unit 72 for supplying heated deionized water to
first rinsing liquid treating unit 40 and second rinsing liquid
treating unit 45, instead of ozone water supply unit 71 for
supplying the ozone water to first rinsing liquid treating unit 40
and second rinsing liquid treating unit 45. Heated DIW supply unit
72, like second carrying device 10, functions as a common handling
unit. Other configurations are almost the same as those of the
second embodiment shown in FIGS. 4 and 5.
[0099] In the third embodiment shown in FIG. 6. the same parts as
those in the first embodiment shown in FIGS. 1 to 3a and 3b and the
second embodiment shown in FIGS. 4 and 5 are denoted by the same
numerals, and their detailed description is omitted.
[0100] In the present embodiment, during both the wafer processing
in first rinsing liquid treating unit 40 and the wafer processing
in second rinsing liquid treating unit 45, heated DIW supply unit
72 is used. Thus, like the second embodiment, not only the carrying
steps a2-a12, b2-b12, and c2-c12, but also the first rinsing liquid
treating steps a5, b5, and c5 and the second rinsing liquid
treating steps a9, b9, and c9 are adjusted to be not temporally
overlapped.
[0101] Accordingly, in the present embodiment, the same effects as
those described in the second embodiment can be achieved, and a bad
influence on the wafer is not caused. Also, it is possible to
improve the throughput in successive processing of wafer sets.
Fourth Embodiment
[0102] Hereinafter, the fourth embodiment of the present disclosure
will be described with reference to FIG. 7. The treating apparatus
according to the third embodiment, shown in FIG. 7, further
includes a stripping liquid treating mechanism 80 for treating a
wafer set with a stripping liquid. In the present embodiment,
stripping liquid treating mechanism 80, together with the rinsing
liquid treating units 40 and 45, constitutes an extendable liquid
treating mechanism. Other configurations are almost the same as
those of the first embodiment shown in FIGS. 1 to 3a and 3b.
[0103] In the fourth embodiment shown in FIG. 7. the same parts as
those in the first embodiment shown in FIGS. 1 to 3a and 3b are
denoted by the same numerals, and their detailed description is
omitted.
[0104] In the present embodiment, between the loader loading steps
a1, b1, and c1 in which multiple wafer sets are loaded on loader
part 21 and the first chemical liquid carrying steps a2, b2, and c2
in which a wafer set lifted up from loader part 21 are carried to
first chemical liquid treating unit 30, the wafer set is treated
with the stripping liquid by stripping liquid treating mechanism 80
(a stripping liquid treating step). Stripping liquid treating
mechanism 80 has a stripping liquid reservoir 81 storing the
stripping liquid, and a stripping liquid elevating device 82 for
receiving the wafer set from second carrying device 10 and carrying
the wafer set into stripping liquid reservoir 81.
[0105] In such a stripping liquid, since the object to be stripped
is predetermined, there is no concern that wafers are over-etched
even when the wafers are dipped in the stripping liquid for a time
longer than a prearranged time. Thus, not only in rinsing liquid
treating units 40 and 45, but also in stripping liquid treating
mechanism 80, the processing steps can be extended.
[0106] Accordingly, when one carrying step for handling one target
object by second carrying device 10 and another carrying step for
handling another target object by second carrying device 10 are
temporally overlapped with each other, recipe producing unit 51
extends the stripping liquid treating step for another target
object and shifts other carrying steps temporally following the
stripping liquid treating step to an extent that the stripping
liquid treating step is extended, or extends the rinsing liquid
treating step and shifts other carrying steps temporally following
the rinsing liquid treating step to an extent that the rinsing
liquid treating step is extended, thereby avoiding the temporal
overlapping of one carrying step with another carrying step.
[0107] Therefore, in the present embodiment, since there is no bad
influence on the wafer, it is possible to improve the throughput in
successive processing of wafer sets. Also, in the present
embodiment, there is an advantage that since the stripping liquid
treating step is carried out prior to the first chemical liquid
carrying step, the number of carrying step objects capable of being
shifted is more than that of the first embodiment. In other words,
in the first embodiment, the carrying steps capable of being
shifted are the carrying steps after the second chemical liquid
carrying steps a6 and b6, while in the present embodiment, the
carrying steps capable of being shifted are the carrying steps
after the first chemical liquid carrying step b2 and c2.
Accordingly, since the first chemical liquid carrying steps b2 and
c2 and the first rinsing liquid carrying steps b4 and c4 can be
shifted, the present embodiment is more advantageous than the first
embodiment.
[0108] As the stripping liquid for the present embodiment, for
example, SPM (a mixed liquid of H.sub.2SO.sub.4 and H.sub.2O.sub.2)
or SPOM (a mixed liquid of H.sub.2SO.sub.4 and O.sub.3) may be
used.
[0109] From the foregoing, it will be appreciated that various
embodiments of the present disclosure have been described herein
for purposes of illustration, and that various modifications may be
made without departing from the scope and spirit of the present
disclosure. Accordingly, the various embodiments disclosed herein
are not intended to be limiting, with the true scope and spirit
being indicated by the following claims.
* * * * *