U.S. patent application number 12/358647 was filed with the patent office on 2010-06-24 for method and apparatus for forming a layered metal structure with an anodized surface.
Invention is credited to John Benjamin Filson, Kenneth J. Silverman, Masashige Tatebe.
Application Number | 20100159273 12/358647 |
Document ID | / |
Family ID | 42266580 |
Filed Date | 2010-06-24 |
United States Patent
Application |
20100159273 |
Kind Code |
A1 |
Filson; John Benjamin ; et
al. |
June 24, 2010 |
Method and Apparatus for Forming a Layered Metal Structure with an
Anodized Surface
Abstract
Methods and apparatus for forming a multi-layered metal
structure that includes an anodized surface are disclosed.
According to one aspect, a housing arrangement can include a
stainless steel layer and at least a first layer. The first layer
can have a first bonding surface and a first exterior surface. The
first bonding surface can be substantially bonded in direct contact
with the stainless steel layer, and the first exterior surface can
be an exterior of the housing arrangement. The first exterior
surface is an anodized surface. In one embodiment, the first layer
can be formed from an anodizable material such as aluminum,
titanium, niobium, or tantalum.
Inventors: |
Filson; John Benjamin; (San
Jose, CA) ; Silverman; Kenneth J.; (San Jose, CA)
; Tatebe; Masashige; (Kakogawa City, JP) |
Correspondence
Address: |
TECHNOLOGY & INNOVATION LAW GROUP, PC
ATTN: 101, 19200 STEVENS CREEK BLVD., SUITE 240
CUPERTINO
CA
95014
US
|
Family ID: |
42266580 |
Appl. No.: |
12/358647 |
Filed: |
January 23, 2009 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
|
|
61140827 |
Dec 24, 2008 |
|
|
|
Current U.S.
Class: |
428/653 ;
205/118 |
Current CPC
Class: |
C25D 5/022 20130101;
B32B 15/012 20130101; Y10T 29/302 20150115; B32B 15/013 20130101;
Y10T 29/49888 20150115; C25D 11/26 20130101; C25D 11/04 20130101;
C25D 7/04 20130101; C25D 11/022 20130101; Y10T 428/12757
20150115 |
Class at
Publication: |
428/653 ;
205/118 |
International
Class: |
B32B 15/01 20060101
B32B015/01; C25D 5/02 20060101 C25D005/02 |
Claims
1. A housing arrangement comprising: a stainless steel layer; and
at least a first layer, the first layer having a first bonding
surface and a first exterior surface, the first bonding surface
being bonded in direct contact with the stainless steel layer, the
first exterior surface being an exterior of the housing
arrangement, wherein the first exterior surface is anodized.
2. The housing arrangement of claim 1 wherein the first layer is
formed from one selected from the group including aluminum,
titanium, niobium, and tantalum.
3. The housing arrangement of claim 1 wherein the first bonding
surface is clad to the stainless steel layer.
4. The housing arrangement of claim 1 wherein the first layer is a
first aluminum layer, and the first exterior surface is a first
anodized aluminum surface.
5. The housing arrangement of claim 4 wherein the first anodized
aluminum surface has a thickness of between approximately 8 microns
and approximately 50 microns.
6. The housing arrangement of claim 4 further including: a second
aluminum layer, the second aluminum layer having a second bonding
surface and an attachment surface, the second bonding surface being
bonded in direct contact with the stainless steel layer such that
the stainless steel layer is sandwiched between the first aluminum
layer and the second aluminum layer, the attachment surface being
arranged to allow structures to be attached thereon.
7. The housing arrangement of claim 6 wherein the structures are
plastic structures and the attachment surface provides a bonding
surface for the plastic structures.
8. The housing arrangement of claim 6 wherein the attachment
surface is at least partially anodized.
9. The housing arrangement of claim 8 wherein the attachment
surface includes aluminum and anodized aluminum.
10. The housing arrangement of claim 1 wherein the stainless steel
layer has a first thickness and the at least first layer has a
thickness that is less than or approximately equal to one half of
the first thickness.
11. A method for forming a housing arrangement comprising: directly
bonding at least a first laminant layer to a stainless steel layer;
masking at least one surface of the stainless steel layer that is
not directly bonded to the at least first laminant layer, wherein
masking the at least one surface of the stainless steel layer
includes applying a mask to the at least one surface of the
stainless steel layer; anodizing the at least first laminant layer,
wherein the at least one surface of the stainless steel that is
masked is not anodized, wherein anodizing the at least first
laminant layer causes a surface of the at least first laminant
layer to be anodized; and subsequently removing the mask from the
at least one surface of the stainless steel layer.
12. The method of claim 11 wherein directly bonding the at least
first laminant layer to the stainless steel layer includes cladding
the at least first laminant layer to the stainless steel layer.
13. The method of claim 11 further comprising: removing an area
that masking the at least one surface of the stainless steel layer
prevented the area from being anodized.
14. The method of claim 11 further comprising: directly bonding a
second laminant layer to the stainless steel layer, wherein the
stainless steel layer is disposed between the first laminant layer
and the second laminant layer.
15. The method of claim 11 wherein the at least first laminant
layer is formed from at least one selected from a group including
aluminum, titanium, niobium, and tantalum.
16. The method of claim 11 further comprising: chemically treating
at least a portion of the at least first laminant layer to create
an attachment surface; and attaching at least one structure to the
attachment surface.
17. The method of claim 16 wherein the at least one structure is a
molded structure.
18. A housing wall suitable for use in a portable electronic
device, the housing wall comprising: a first aluminum layer, the
first aluminum layer including a first cladding surface and a first
outer surface; a second aluminum layer, the second aluminum layer
including a second cladding surface and a second outer surface; and
a stainless steel layer, the stainless steel layer being disposed
between the first aluminum layer and the second aluminum layer, the
first aluminum surface and the second aluminum layer being clad to
the stainless steel layer such that the first cladding surface and
the second cladding surface are in contact with the stainless steel
layer, wherein the first outer surface and the second outer surface
are at least partially anodized.
19. The housing wall of claim 18 wherein the second outer surface
having attached thereto at least one part that is to be contained
by the housing wall.
20. The housing wall of claim 18 wherein the first outer surface
has a thickness of between approximately 8 microns and
approximately 50 microns and the second outer surface has a
thickness of between approximately 8 microns and approximately 50
microns.
21. The housing wall of claim 18 wherein the stainless steel layer
has a first thickness, and wherein the first aluminum layer and the
second aluminum layer have a combined thickness that is less than
or approximately equal to one half of the first thickness.
Description
CROSS-REFERENCE TO RELATED APPLICATION
[0001] This application claims priority to U.S. Provisional Patent
Application No. 61/140,827, filed Dec. 24, 2008, and entitled
"Compact Device Housing and Assembly Techniques Therefor," which is
hereby incorporated herein by reference.
BACKGROUND OF THE INVENTION
[0002] 1. Field of the Invention
[0003] The present invention relates to the formation of housings
for use in electronic devices and, more particularly, to forming
cosmetic surfaces on stainless steel housing parts.
[0004] 2. Description of the Related Art
[0005] Many devices, e.g., portable electronic devices such as cell
phones and media players, include housing walls formed from
structurally strong and stiff materials such as stainless steel.
The strength provided by materials such a stainless steel enables
housing walls to protect internal components of portable electronic
devices, and enhances the durability of such devices.
[0006] In some applications, while stainless steel provides
desirable strength characteristics for housing walls, the stainless
steel may not provide acceptable cosmetic characteristics. For
example, a stainless steel surface is often relatively easy to
scratch, and a scratched stainless steel surface may be
unappealing. Although anodizing processes may be used on some
metals in order to effectively provide a scratch-resistant surface,
stainless steel may not be anodized, as rust forms on stainless
steel due to oxidation. Hence, for applications in which cosmetic
appeal is a relatively important feature, the use of stainless
steel may be undesirable.
[0007] Metals such as aluminum may be anodized to prevent
scratching. That is, the surface of some metals, such as aluminum,
may be anodized such that the surface becomes substantially
scratch-resistant. However, aluminum is relatively weak
structurally. Hence, while an aluminum surface may be anodized to
protect the surface from being scratched, the use of aluminum as a
housing may be undesirable due to the lack of structural strength
associated with aluminum.
[0008] Therefore, what is needed is a method and an apparatus which
enables a relatively strong, cosmetically-appealing housing wall to
be created.
SUMMARY OF THE INVENTION
[0009] The present invention pertains to creating a housing
structure, such as a housing wall, that includes a stainless steel
core and one or more anodized, cosmetic outer surfaces. The present
invention may be implemented in numerous ways, including, but not
limited to, as a method, system, device, or apparatus. Example
embodiments of the present invention are discussed below.
[0010] According to one embodiment of the present invention, a
housing arrangement can include a stainless steel layer and at
least a first layer. The first layer can have a first bonding
surface and a first exterior surface. The first bonding surface can
be substantially bonded in direct contact with the stainless steel
layer, and the first exterior surface can be an exterior of the
housing arrangement. The first exterior surface can be an anodized
surface. In one embodiment, the first layer is formed from an
anodizable material such as aluminum, titanium, niobium, or
tantalum.
[0011] According to another embodiment of the present invention, a
method for forming a housing arrangement can include directly
bonding at least a first laminant layer to a stainless steel layer,
and masking at least one surface of the stainless steel layer that
is not directly bonded to the first laminant layer. Masking the
surface of the stainless steel layer includes applying a mask to
the surface of the stainless steel layer. The method can also
include anodizing the first laminant layer such that the surface of
the stainless steel that is masked is not anodized. Anodizing the
first laminant layer causes a surface of the first laminant layer
to be anodized. The mask is removed from the surface of the
stainless steel layer after the first laminant layer is anodized.
In one embodiment, directly bonding the first laminant layer to the
stainless steel layer includes cladding the first laminant layer to
the stainless steel layer.
[0012] In accordance with still another embodiment of the present
invention, a housing wall that is suitable for use in a portable
electronic device can include a first aluminum layer, a second
aluminum layer, and a stainless steel layer. The first aluminum
layer can include a first cladding surface and a first outer
surface, and the second aluminum layer can include a second
cladding surface and a second outer surface. The stainless steel
layer is disposed between the first aluminum layer and the second
aluminum layer. The first aluminum surface and the second aluminum
layer are clad to the stainless steel layer such that the first
cladding surface and the second cladding surface are in contact
with the stainless steel layer. The first outer surface and the
second outer surface are at least partially anodized.
[0013] Other aspects and advantages of the invention will become
apparent from the following detailed description taken in
conjunction with the accompanying drawings which illustrate, by way
of example, the principles of the invention.
BRIEF DESCRIPTION OF THE DRAWINGS
[0014] The invention will be readily understood by the following
detailed description in conjunction with the accompanying drawings,
in which:
[0015] FIG. 1 is a block diagram representation of a structure
which includes a stainless steel layer on which layers of anodized
material are provided in accordance with an embodiment of the
present invention.
[0016] FIG. 2 is a diagrammatic representation of a general process
of forming a structure which includes a plurality of anodized
layers in accordance with an embodiment of the present
invention.
[0017] FIG. 3 is a process flow diagram which illustrates a method
of forming an overall housing that includes a stainless steel layer
and at least one anodized layer in accordance with an embodiment of
the present invention.
[0018] FIG. 4 is a block diagram representation of relative
thicknesses associated with a three layer housing in accordance
with an embodiment of the present invention.
[0019] FIG. 5 is a block diagram representation of relative
thicknesses associated with a two layer housing in accordance with
an embodiment of the present invention.
[0020] FIG. 6A is a diagrammatic representation of a housing prior
to a mask being placed over an exposed stainless steel surface in
accordance with an embodiment of the present invention.
[0021] FIG. 6B is a diagrammatic representation of a housing on
which a mask has been placed over an exposed stainless steel
surface in accordance with an embodiment of the present
invention.
[0022] FIG. 7A is a diagrammatic cross-sectional representation of
a section of a masked housing in accordance with an embodiment of
the present invention.
[0023] FIG. 7B is a diagrammatic cross-sectional representation of
a section of a masked housing after an anodizing process in
accordance with an embodiment of the present invention.
[0024] FIG. 8 is a diagrammatic top view representation of a
structure that includes an etched anodized layer with an underlying
stainless steel layer in accordance with an embodiment of the
present invention.
[0025] FIG. 9 is a block diagram representation of a layered
structure that includes a stainless steel layer and an aluminum
layer which includes an anodized aluminum portion in accordance
with an embodiment of the present invention.
DETAILED DESCRIPTION OF THE INVENTION
[0026] Example embodiments of the present invention are discussed
below with reference to the various figures. However, those skilled
in the art will readily appreciate that the detailed description
given herein with respect to these figures is for explanatory
purposes, as the invention extends beyond these embodiments.
[0027] The strength associated with stainless steel is generally
desirable in the formation of housing walls for portable electronic
devices including, but not limited to including, mobile phones
(e.g., cell phones), portable digital assistants and digital media
players. The stiffness associated with stainless steel is also
desirable. However, the cosmetic properties of stainless steel are
often lacking. To provide a cosmetic surface for a housing that
effectively derives its strength from a stainless steel layer, an
anodizable material may be clad to at least one surface of the
stainless steel layer and then anodized. In one embodiment, a
housing may include a stainless steel core that is substantially
sandwiched between two layers of anodized material, e.g., anodized
aluminum, which have a relatively high bond strength. The layers of
anodized material effectively form cosmetic surfaces for the
housing, while the stainless steel core provides structural
strength, as well as stiffness, for the housing.
[0028] Referring initially to FIG. 1, a structure 100 which
includes a stainless steel layer that is sandwiched between layers
of anodized material will be described in accordance with an
embodiment of the present invention. The structure 100, which may
be a wall that is a part of a housing for a portable electronic
device, includes a layer of stainless steel 104. Layer of stainless
steel 104, which is effectively a core, has layers of anodized
material 108a, 108b laminated thereon. In general, layer of
stainless steel 104 and layers of anodized material 108a, 108b are
bonded such that structure 100 is effectively a three-layer metal
sandwiched arrangement.
[0029] A structure such as structure 100 which includes a stainless
steel layer and at least one anodized metal layer may be formed
such that an anodizing process occurs after the stainless steel
layer is bonded to an anodizable, but still substantially
unanodized, metal layer. FIG. 2 is a diagrammatic representation of
a general process of forming a structure which includes a plurality
of anodized layers in accordance with an embodiment of the present
invention. A stainless steel layer 204 is subjected to a laminating
process which allows layers of material 208a, 208b to be laminated
onto stainless steel layer 204. The laminating process typically
bonds material 208a, 208b substantially directly to stainless steel
layer 204.
[0030] Layers of material 208a, 208b are generally formed from
anodizable metals, i.e., metals which may be anodized. In one
embodiment, layers of material 208a, 208b may be aluminum,
titanium, niobium, or tantalum layers.
[0031] A laminating process may be substantially any process which
allows layers of material 208a, 208b to be bonded to stainless
steel layer 204 without the use of an intermediate bonding agent.
That is, a laminating process may be arranged to allow layers of
material 208a, 208b to be bonded directly to stainless steel layer
204. A laminating process may, for example, be a cladding process.
As will be understood by those skilled in the art, a cladding is
the bonding of metals substantially without an intermediate bonding
agent and substantially without remelting the metals. Cladding may
take a variety of different forms including, but not limited to
including, standard cladding in which layers of material 208a, 208b
and stainless steel layer 204 are pressed together with roller
under high pressure, or fine cladding in which layers of material
208a, 208b and stainless steel layer 204 are placed in a vacuum and
rolled together after a chemical process is performed.
[0032] A masking process is used, after layers of material 208a,
208b are laminated onto stainless steel layer 204, to apply masks
212 to cover substantially all exposed areas of stainless steel
layer 204. The exposed areas are generally areas of stainless steel
204 which are not in contact with layers of material 208a, 208b.
Masks 212 serves to prevent areas of stainless steel layer 204 from
oxidizing during an anodizing process arranged to anodize layers of
material 208a, 208b to form layers of anodized material 208a',
208b'. After an anodizing process is completed and layers of
anodized material 208a', 208b' are formed, masks 212 may be removed
using a de-masking process.
[0033] With reference to FIG. 3, a process 301 of forming an
overall housing that includes a stainless steel layer and at least
one anodized layer will be described in accordance with an
embodiment of the present invention. A process 301 of forming an
overall housing begins at step 305 in which stainless steel which
is to be used to from a housing shell is obtained. The stainless
steel may be in the form of a stainless steel sheet.
[0034] After the stainless steel is obtained, a laminant material
is clad or otherwise substantially directly bonded to at least one
surface of the stainless steel in step 309. By way of example, if
the stainless steel is in the form of a stainless steel sheet, a
laminant material such as aluminum may be clad to at least one side
of the stainless steel sheet. In one embodiment, aluminum such as
Al 1100 or Al 5052 may be clad to both sides of a stainless steel
sheet to form a sandwich structure or a 3-layer metal arrangement.
For ease of discussion, a sandwich structure will be described as
being formed when a laminant material is clad or substantially
directly bonded to the stainless steel.
[0035] Once the sandwich structure is formed, the sandwich
structure is cut and/or shaped as appropriate in step 313 to form a
housing shell. A draw-forming process may be used with respect to
the sandwich structure such that the housing shell is formed. Once
a housing shell is formed, a portion of the laminant material may
optionally be chemically treated and/or subjected to an overmolding
process in step 317 to create a bonding surface. By way of example,
a surface of the housing shell which is intended to form an
interior surface of an electronic device may be treated and/or
overmolded to provide a bonding surface that allows structures
(e.g., internal structures) to be attached. The structures may be
plastic structures. In one embodiment, the bonding surface may be
either a location onto which plastic may be molded, or an
attachment point onto which components may be attached, e.g.,
screwed or otherwise fastened. If a bonding surface is created,
then structures may be attached to the bonding surface in optional
step 321. It should be appreciated that the molded structures which
are attached in optional step 321 are typically able to withstand
an anodizing process.
[0036] In step 325, the surfaces of stainless steel which are
exposed, e.g., not in substantially direct contact with the
laminant material, are masked in step 325. A mask is arranged to
essentially create a water-tight seal which covers surfaces of the
stainless steel, and may generally either be reusable or
disposable. A disposable mask is arranged to be used approximately
one time. A reusable mask may be formed from a masking material
such as silicone rubber or ethylene propylene diene M-class (EPDM)
rubber, and may be arranged to be slipped over the exposed surfaces
of stainless steel. A disposable mask may be formed from a masking
material such as polyvinyl chloride (PVC) or polypropelene (PP),
and/or may be arranged to be substantially painted onto or molded
onto the exposed surfaces of stainless steel. It should be
appreciated that in masking the exposed surface of stainless steel,
part of the laminant material may be party covered by or overlapped
by a mask.
[0037] From step 325, process flow moves to step 329 in which the
laminant material is anodized. Any suitable anodizing process may
generally be used to anodize the laminant material. For instance,
the sandwich structure may be placed in an electrolyte bath as a
part of an anodizing process. The anodizing process creates
anodized surfaces on the laminant material. The anodized surfaces
are created on the laminant material, e.g., aluminum, in the
presence of the stainless steel layer. It should be understood,
however, that because stainless steel layer is either bonded to the
laminant material or masked, substantially only surfaces of
laminant material are exposed during an anodizing process.
[0038] Once the laminant material is anodized, masks previously
positioned over exposed surfaces of stainless steel are removed in
step 333. Then, in step 337, any areas of the laminant material
which remain unanodized, e.g., because the areas were substantially
covered by the mask, are removed. In one embodiment, steps 333 and
337 may be substantially combined into the same step. Methods which
may be used to remove the areas of laminant material include, but
are not limited to including, shearing methods and cutting methods.
The cutting methods can, for example, include water jet cutting
methods and laser cutting methods. The process of forming an
overall housing may be completed after any laminant material which
remains unanodized is removed.
[0039] When a sandwich structure is formed, the thickness of the
anodized layers are generally a function of the thickness of a
core, e.g., stainless steel, layer. FIG. 4 is a block diagram
representation of relative thicknesses associated with a
three-layer metal structure, e.g., a housing, in accordance with an
embodiment of the present invention. A structure 400 includes a
core stainless steel layer 404 sandwiched between layers of
anodized material 408a, 408b. Stainless steel layer 404 has a
thickness D, while layer of anodized material 408a has a thickness
H1 and layer of anodized material 408b has a thickness H2. In the
described embodiment, the sum of thickness H1 and thickness H2 is
less than or approximately equal to half of thickness D. By way of
example, thickness D may be approximately 0.35 millimeters (mm),
thickness H1 may be approximately 0.05 mm, and thickness H2 may be
approximately 0.10 mm. It should be appreciated, however, that the
sum of thickness H1 and thickness H2 is not limited to being less
than or approximately equal to half of thickness D. For instance,
thickness H1 and thickness H2 may each be in the range of between
approximately 8 microns and approximately 100 microns. In one
embodiment, thickness H1 and thickness H2 are generally greater
than approximately 30 microns if anodized material 408a, 408b is
anodized aluminum.
[0040] In general, the absolute value of the thicknesses may vary
greatly depending on the properties desired in structure 400. The
overall thickness of structure 400 may be between approximately
0.30 mm and approximately 2.0 mm, although the overall thickness
may generally vary widely. That is, the sum of thickness H1,
thickness H2, and thickness D may be between approximately 0.30 mm
and approximately 2.0 mm.
[0041] Referring next to FIG. 5, the relative thicknesses of layers
included in a two-layer metal structure, e.g., a housing in which
only one surface of stainless steel is covered by a laminant
material such as aluminum, will be described in accordance with an
embodiment of the present invention. A housing 500 includes a core
stainless steel layer 504 and a layer of anodized material 508.
Stainless steel layer 504 has a thickness D, and layer of anodized
material 508 has a thickness H3. Thickness H3 is typically less
than or approximately equal to half of D. It should be appreciated,
however, that thickness H3 is not limited to being less than or
approximately equal to half of D.
[0042] As described above, a three-layer or two-layer metal
structure may included areas of exposed stainless steel, or areas
in which stainless steel is not substantially covered by a laminant
material. Such areas are generally masked prior to an anodizing
process to protect the areas of exposed stainless steel from
oxidizing or rusting. In one embodiment, an edge of a housing
formed from a three-layer metal assembly may be masked with a
masking material such that substantially only laminant material, as
for example aluminum, is exposed. FIG. 6A is a diagrammatic
representation of a housing on which a mask is to be placed, and
FIG. 6B is a diagrammatic representation of the same housing after
a mask has been placed over an exposed stainless steel surface in
accordance with an embodiment of the present invention. A housing
620 may be a housing that is to be a part of an overall assembly,
as for example a bottom of a cell phone assembly. As shown in FIG.
6B, a mask 624 is applied to a top edge of housing 620.
[0043] A mask, such as mask 624, may partially overlap or cover
areas of laminant material. FIG. 7A is a diagrammatic
cross-sectional representation of a section of a masked housing in
which a mask partially overlaps areas of laminant material
accordance with an embodiment of the present invention. A housing
720 includes a stainless steel core 704 that is sandwiched between
layers of laminant material 708a, 708b. It should be appreciated
that layers of laminant material 708a, 708b are generally layers of
anodizable material, e.g., aluminum.
[0044] A mask 724 is arranged over a surface 726 of stainless steel
core 704 which is not in contact with layers of laminant material
708a, 708b. Mask 724 is typically formed from a complaint material
which does not react to acid solutions used in an anodizing
process, and protects surface 726 from oxidizing during the
anodizing process.
[0045] Often, the application of mask 724 is such that layers of
laminant material 708a, 708b are partly covered by mask 724. As
such, the parts of layers of laminant material 708a, 708b which are
party covered by mask 724 may be prevented from being anodized
during an anodizing process. FIG. 7B is a diagrammatic
cross-sectional representation of housing 720 after an anodizing
process in accordance with an embodiment of the present invention.
After an anodizing process, layers of laminant material 708a, 708b
are effectively anodized, with the exception of areas 728 which
remain substantially unanodized. Areas 728 are unanodized due to
mask 724 overlying areas 728. Mask 724 effectively prevents
solutions, as for example acid solutions, used in an anodizing
process from coming into contact with areas 728.
[0046] In one embodiment, areas 728 may be removed from housing 720
using a shearing or cutting process. Mask 724 may also be removed
from housing 720 using the same shearing or cutting process used to
remove areas 728.
[0047] In one embodiment, a layer of anodized metal may be etched
such that the underlying stainless steel layer is at least
partially exposed. The layer of anodized metal may be machined or
etched to expose the stainless steel layer for welding purposes,
e.g., when features are to be welded to the stainless steel layer.
FIG. 8 is a diagrammatic top view representation of a structure
that includes an etched anodized layer with an underlying stainless
steel layer in accordance with an embodiment of the present
invention. A structure 800 includes a layer of anodized material
808, which may be a layer of anodized aluminum. Areas of layer of
anodized material 808 may be etched or otherwise removed such that
underlying portions of a stainless steel layer 804 are exposed.
[0048] After an anodizing process is performed on an anodizable
material which is bonded, e.g., clad, to stainless steel, portions
of the anodizable material may remain unanodized. In other words, a
top surface of the anodizable material may be anodized, while other
parts of the anodizable material are not anodized. If the
anodizable material is aluminum, after an anodizing process, a top
surface may be anodized aluminum while underlying areas are
unanodized aluminum. FIG. 9 is a block diagram representation of a
layered structure that includes a stainless steel layer and an
aluminum layer which includes an anodized aluminum portion in
accordance with an embodiment of the present invention. A structure
900 includes a stainless steel layer 904 and at least one anodized
material layer 908. In the described embodiment, anodized material
layer 908 is composed of aluminum. After an anodizing process,
anodized material layer 908 is such that it includes anodized
aluminum 910a and unanodized aluminum 910b. Typically, anodized
aluminum 910a forms a top surface of anodized material layer 908,
while unanodized aluminum 910b is bonded to stainless steel layer
904.
[0049] Although only a few embodiments of the present invention
have been described, it should be understood that the present
invention may be embodied in many other specific forms without
departing from the spirit or the scope of the present invention. By
way of example, while a structure which includes a stainless steel
layer and at least one anodized layer has been described as being
used for a housing wall, such a structure is not limited to being
used as a housing wall. A structure which includes a stainless
steel layer and one or more anodized layers bonded therethrough may
generally be used in substantially any application in which the
strength associated with stainless steel and the cosmetic appeal of
an anodized layer are desired.
[0050] While laminant layers have been described as being clad to a
stainless steel layer, laminant layers are not limited to being
clad to a stainless steel layer. In other words, a housing wall is
not limited to including a stainless steel layer that provides
strength. Instead of including a stainless steel core, for
instance, a three-layer metal sandwiched arrangement may include
substantially any core to which a laminant layer may be clad or
otherwise bonded prior to an anodizing process.
[0051] As shown in FIG. 8, an anodized layer may be etched to
expose an underlying stainless steel layer. For instance, an
anodized aluminum layer may be etched to expose the stainless to
which the anodized aluminum layer is clad. It should be appreciated
that an anodized aluminum layer may also be etched to expose an
unanodized aluminum which underlies the anodized aluminum
layer.
[0052] The operations associated with the various methods of the
present invention may vary widely. Steps may be added, removed,
altered, combined, and reordered without departing from the spirit
or the scope of the present invention. By way of example, if a mask
used to prevent stainless steel from oxidizing during an anodizing
process is a disposable mask, the steps of removing a mask and
removing areas of laminant material which were not anodized due to
being covered by the mask may be combined into a singled step. In
other words, a shearing or cutting process used to remove areas of
laminant material which were not anodized may also remove a mask
that effectively prevented the areas of laminant material from
being anodized.
[0053] In one embodiment, plastic may effectively be overmolded on
a bonding face after that face has been anodized. That is, molded
structures may be attached to an anodized bonding surface in some
instances. Anodizing may be removed in selected areas, e.g., using
laser etching, to form a surface onto which a molded structure may
be attached using a process such as a nano molding process.
[0054] The many features and advantages of the present invention
are apparent from the written description. Further, since numerous
modifications and changes will readily occur to those skilled in
the art, the invention should not be limited to the exact
construction and operation as illustrated and described. Hence, all
suitable modifications and equivalents may be resorted to as
falling within the scope of the invention.
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