U.S. patent application number 12/432745 was filed with the patent office on 2010-06-17 for heat dissipation device with heat pipe.
This patent application is currently assigned to FU ZHUN PRECISION INDUSTRY (SHEN ZHEN) CO., LTD.. Invention is credited to CHUN-CHI CHEN, SHOU-BIAO XU, SHI-WEN ZHOU.
Application Number | 20100147502 12/432745 |
Document ID | / |
Family ID | 42239145 |
Filed Date | 2010-06-17 |
United States Patent
Application |
20100147502 |
Kind Code |
A1 |
XU; SHOU-BIAO ; et
al. |
June 17, 2010 |
HEAT DISSIPATION DEVICE WITH HEAT PIPE
Abstract
A heat dissipation device includes a heat pipe. The heat pipe
includes an evaporating section connecting with a heat spreader, a
condensing section connecting with a fin assembly, and a connecting
section interconnecting the evaporating section and the condensing
section. The evaporating section of the heat pipe has a diameter
smaller than that of the condensing section.
Inventors: |
XU; SHOU-BIAO; (Shenzhen
City, CN) ; ZHOU; SHI-WEN; (Shenzhen City, CN)
; CHEN; CHUN-CHI; (Tu-Cheng, TW) |
Correspondence
Address: |
PCE INDUSTRY, INC.;ATT. Steven Reiss
288 SOUTH MAYO AVENUE
CITY OF INDUSTRY
CA
91789
US
|
Assignee: |
FU ZHUN PRECISION INDUSTRY (SHEN
ZHEN) CO., LTD.
Shenzhen City
CN
FOXCONN TECHNOLOGY CO., LTD.
Tu-Cheng
TW
|
Family ID: |
42239145 |
Appl. No.: |
12/432745 |
Filed: |
April 29, 2009 |
Current U.S.
Class: |
165/181 |
Current CPC
Class: |
H01L 23/3672 20130101;
F28D 15/0233 20130101; F28D 15/0275 20130101; H01L 2924/0002
20130101; H01L 2924/0002 20130101; H01L 23/467 20130101; H01L
23/427 20130101; F28F 13/08 20130101; F28D 15/0266 20130101; H01L
2924/00 20130101; H01L 23/4006 20130101 |
Class at
Publication: |
165/181 |
International
Class: |
F28F 1/10 20060101
F28F001/10 |
Foreign Application Data
Date |
Code |
Application Number |
Dec 16, 2008 |
CN |
200810306282.2 |
Claims
1. A heat dissipation device, comprising: a fin assembly; a heat
spreader; and a heat pipe comprising an evaporating section, a
condensing section, a connecting section interconnecting the
evaporating section and the condensing section, wherein the
evaporating section of the heat pipe has a diameter smaller than
that of the condensing section, the evaporating section connecting
with the heat spreader, the condensing section connecting with the
fin assembly.
2. The heat dissipation device as claimed in claim 1, wherein the
evaporating section of the heat pipe is perpendicular to the
condensing section.
3. The heat dissipation device as claimed in claim 1, wherein the
evaporating section has a uniform configuration.
4. The heat dissipation device as claimed in claim 1, wherein the
condensing section has a uniform configuration.
5. The heat dissipation device as claimed in claim 1, wherein the
evaporating section and the condensing section is coplanar.
6. The heat dissipation device as claimed in claim 1, wherein the
evaporating section and the condensing section is non-coplanar.
7. The heat dissipation device as claimed in claim 1, wherein the
connecting section of the heat pipe tapers from an end connecting
the condensing section to another end connecting the evaporating
section.
8. The heat dissipation device as claimed in claim 1, wherein the
diameter of the condensing section of the heat pipe is 8 mm, and
that of the evaporating section of the heat pipe is 6 mm.
9. The heat dissipation device as claimed in claim 1, further
comprising a fan mounted in front of the fin assembly and over the
heat spreader for generating an airflow through the fin
assembly.
10. A heat dissipation device, comprising: a heat spreader having a
plurality of ears each being mounted with a fastener; a fin
assembly; and at least one heat pipe comprising an evaporating
section contacting the heat spreader, and a condensing section
contacting the fin assembly, wherein the evaporating section is
smaller than the condensing section.
11. The heat dissipation device as claimed in claim 10, wherein the
at least one heat pipe further comprises a connecting section
interconnecting the evaporating section and the condensing section,
the connecting section of the at least one heat pipe tapering from
an end connecting the condensing section to another end connecting
the evaporating section.
12. The heat dissipation device as claimed in claim 10, wherein the
heat spreader comprises a bottom plate and a top plate above the
bottom plate, the bottom plate defining a first groove in a top
thereof, the top plate defining a second groove in a bottom
thereof, the first and second grooves cooperatively forming a
channel receiving the evaporating section of the at least one heat
pipe.
13. The heat dissipation device as claimed in claim 12, wherein the
top plate comprises a rectangular body, the plurality of ears
extending from corners of the rectangular body.
14. The heat dissipation device as claimed in claim 10, further
comprising a fan mounted on one side of the fin assembly.
15. The heat dissipation device as claimed in claim 14, further
comprising a fixing bracket, the fixing bracket comprising a
mounting portion and a positioning portion bent from a side of the
mounting portion, the fan being mounted on the mounting portion,
the positioning portion engaging in a slit defined in another side
of the fin assembly.
Description
BACKGROUND
[0001] 1. Technical Field
[0002] The disclosure relates to a heat dissipation device and,
more particularly, to a heat dissipation device incorporating heat
pipes for removing heat from an electronic device.
[0003] 2. Description of Related Art
[0004] As computer technology continues to advance, electronic
components such as central processing units (CPUs) of computers are
being made to provide faster operational speeds and greater
functional capabilities. When a CPU operates at a high speed in a
computer enclosure, its temperature greatly increases. It is
desirable to dissipate the heat quickly, for example by using a
heat dissipation device attached to the CPU in the enclosure. This
allows the CPU and other electronic components in the enclosure to
function within their normal operating temperature ranges, thereby
assuring the quality of data management, storage and transfer.
[0005] A typical heat dissipation device comprises a base
contacting an electronic component, a fin assembly disposed on the
base and a heat pipe connecting the base and the fin assembly. The
fin assembly comprises a plurality of fins connected together. The
base absorbs heat from the electronic component and directly
transfers the heat to the fins through the heat pipe. By the
provision of the heat pipe, heat dissipation efficiency of the heat
dissipation device is improved.
[0006] However, since most parts of the heat pipe of the
conventional heat dissipation device are even in diameters, which
results in more material is used for forming the evaporating
portion of the heat pipe when the evaporating portion can have a
smaller diameter. Furthermore, the evaporating portion of the heat
pipe, which has the same diameter as that of the condensing
portion, sometimes may hinder the applicability of the heat pipe to
dissipate heat from an electronic component which is miniature.
[0007] What is needed, therefore, is a heat dissipation device
which can overcome the limitations described.
BRIEF DESCRIPTION OF THE DRAWINGS
[0008] Many aspects of the present embodiments can be better
understood with reference to the following drawings. The components
in the drawings are not necessarily drawn to scale, the emphasis
instead being placed upon clearly illustrating the principles of
the present embodiments. Moreover, in the drawings, like reference
numerals designate corresponding parts throughout the several
views.
[0009] FIG. 1 is an isometric, assembled view of a heat dissipation
device in accordance with one embodiment of the disclosure.
[0010] FIG. 2 is an isometric, exploded view of the heat
dissipation device of FIG. 1.
DETAILED DESCRIPTION
[0011] FIG. 1 shows a heat dissipation device in accordance with an
embodiment of the disclosure. The heat dissipation device
dissipates heat generated by an electronic device (not shown). The
heat dissipation device comprises a heat spreader 10, a fin
assembly 20 above the heat spreader 10, three heat pipes 30
thermally connecting the heat spreader 10 with the fin assembly 20,
a fan 40 and two fixing brackets 50 fixing the fan 40 to the fin
assembly 20.
[0012] Also referring to FIG. 2, the heat spreader 10 is made of
metal such as aluminum, copper or an alloy thereof. The heat
spreader 10 includes a bottom plate 12 and a top plate 14 above the
bottom plate 12. The bottom plate 12 defines three parallel, spaced
first grooves 122 in a top thereof. The top plate 14 includes a
rectangular body 142 and four ears 144 extending outwardly from
four corners of the body 142. The body 142 defines three parallel,
spaced second grooves 146 in a bottom thereof, corresponding to the
first grooves 122. The four ears 144 each define a through hole 148
adjacent to a distal end thereof. Four fasteners 149 extend through
the through holes 148 and are fastened on the ears 144.
[0013] The fin assembly 20 comprises a plurality of spaced and
parallel fins. The fins each are made of metal such as aluminum,
copper or an alloy thereof. Two slits 22 are defined in the two
opposite lateral sides of the fin assembly 20 and located adjacent
a front face thereof. Three through holes 24 are defined vertically
through the fin assembly 20 receiving the heat pipes 30.
[0014] The heat pipes 30 each have an L-shaped configuration and
comprise an evaporating section 32, a condensing section 34, an
arced connecting section 36 interconnecting the evaporating section
32 and the condensing section 34. The evaporating sections 32 of
the heat pipes 30 are accommodated in channels cooperatively formed
by the first and second grooves 122, 146 of the heat spreader 10.
The condensing sections 34 of the heat pipes 30 are received in the
through holes 24 of the fin assembly 20 and thermally connect the
fin assembly 20. The evaporating section 32 of each heat pipe 30 is
uniform and has a diameter smaller than that of the condensing
section 34 which also has a uniform configuration. The diameter of
the connecting section 36 of each heat pipe 30 gradually decreases
from a first end connecting with the condensing section 34 to a
second end connecting with the evaporating section 32. In other
words, the connecting section 36 tapers from the first end
connecting with the condensing section 34 to the second end
connecting with the evaporating section 32. In this embodiment, the
diameter of the condensing section 34 of each heat pipe 30 is 8 mm,
and the diameter of the evaporating section 32 of each heat pipe 30
is 6 mm. The evaporating section 32 of each heat pipe 30 is
perpendicular to the condensing section 34. The evaporating section
32 and the condensing section 34 of the heat pipe 30 located in a
middle of the fin assembly 20 are coplanar, and the evaporating
section 32 and the condensing section 34 of each heat pipe 30
located near the lateral side of the fin assembly 20 are
non-coplanar.
[0015] The fan 40 includes a rectangular frame 42 and an impeller
44 received in the frame 42. The frame 42 defines four orifices 420
in four corners thereof.
[0016] The two fixing brackets 50 each include a mounting portion
52 and a positioning portion 54 bent from a side of the mounting
portion 52. The mounting portion 52 defines an arced cutout 522 in
another side thereof remote from the positioning portion 54. The
mounting portion 52 defines two threaded holes 520 in two opposite
ends thereof, corresponding to the orifices 420 of the fan 40.
[0017] In assembly, the top plate 14 of the heat spreader 10
engages the bottom plate 12 so that the first grooves 122 of the
bottom plate 12 and the second grooves 146 of the top plate 14
cooperatively form the channels receiving the evaporating sections
32 of the heat pipes 30. The condensing sections 34 of the heat
pipes 30 are received in the through holes 24 of the fin assembly
20. The positioning portion 54 of each fixing bracket 50 engages in
a corresponding slit 22 of the fin assembly 20. Screws (not shown)
extend through the orifices 420 in the fan 40 and engage in the
threaded holes 520 of the mounting portions 52, thereby securely
mounting the fan 40 on the fixing brackets 50.
[0018] In use, the evaporating sections 32 of the heat pipes 30 can
rapidly transmit the heat absorbed by the heat spreader 10 to the
condensing sections 34 of the heat pipes 30. Since the evaporating
sections 32 are smaller than the condensing sections 34, material
for manufacturing the heat pipes 30 is reduced; thus, the material
cost is reduced accordingly. Meanwhile, the smaller evaporating
sections 32 match a smaller heat spreader 10, which also saves
material and improves feasibility and applicability of the heat
spreader 10 in a limited space such as a computer enclosure.
[0019] It is believed that the disclosure and its advantages will
be understood from the foregoing description, and it will be
apparent that various changes may be made thereto without departing
from the spirit and scope of the invention or sacrificing all of
its material advantages, the examples hereinbefore described merely
being preferred or exemplary embodiments of the invention.
* * * * *