U.S. patent application number 12/379900 was filed with the patent office on 2010-06-17 for heat-dissipating fin.
This patent application is currently assigned to TAI-SOL ELECTRONICS CO., LTD.. Invention is credited to Jun Chen, Yue-Ping Dai, Meng Hung Ko.
Application Number | 20100147493 12/379900 |
Document ID | / |
Family ID | 42239140 |
Filed Date | 2010-06-17 |
United States Patent
Application |
20100147493 |
Kind Code |
A1 |
Dai; Yue-Ping ; et
al. |
June 17, 2010 |
Heat-dissipating fin
Abstract
A heat-dissipating fin includes a sheety main body. The main
body is provided with a high-temperature area located at each of
two sides thereof, an airflow area located at a midsection thereof
for an external airflow to pass through, at least one guide wall
formed at the airflow area and having a front end facing the main
body, and two inclined guide portions each extending rearward
toward one side thereof from a front end thereof. In this way, the
external airflow can be guided to the high-temperature areas of the
fin to reach greater heat-dissipating efficiency.
Inventors: |
Dai; Yue-Ping; (Jiangsu,
CN) ; Ko; Meng Hung; (Taipei County, TW) ;
Chen; Jun; (Sichuan, CN) |
Correspondence
Address: |
BACON & THOMAS, PLLC
625 SLATERS LANE, FOURTH FLOOR
ALEXANDRIA
VA
22314-1176
US
|
Assignee: |
TAI-SOL ELECTRONICS CO.,
LTD.
TAIPEI CITY
TW
|
Family ID: |
42239140 |
Appl. No.: |
12/379900 |
Filed: |
March 4, 2009 |
Current U.S.
Class: |
165/104.26 |
Current CPC
Class: |
F28D 15/0266 20130101;
H01L 23/427 20130101; F28F 1/32 20130101; H01L 2924/0002 20130101;
H01L 23/3672 20130101; F28F 13/06 20130101; H01L 2924/00 20130101;
H01L 2924/0002 20130101 |
Class at
Publication: |
165/104.26 |
International
Class: |
F28D 15/00 20060101
F28D015/00 |
Foreign Application Data
Date |
Code |
Application Number |
Dec 17, 2008 |
TW |
97222662 |
Claims
1. A heat-dissipating fin comprising a sheety main body having two
high-temperature areas, each of which is located at one of two
sides thereof, said main body having an airflow area located at a
midsection thereof for airflow to pass through, said main body
having at least one guide wall located at said airflow area and
having a front end facing a front side of said main body, said at
least one guide wall having two inclined guide portions extending
bilaterally rearward from the front end thereof.
2. The heat-dissipating fin as defined in claim 1, wherein said
main body comprises convexity formed at a center thereof; said
guide wall is located in front of said convexity.
3. The heat-dissipating fin as defined in claim 2, wherein said
convexity is in the form of water drip.
4. The heat-dissipating fin as defined in claim 1, wherein each of
said two inclined guide portions comprises a distal end spaced from
one of two lateral edges of said main body.
5. The heat-dissipating fin as defined in claim 1, wherein said at
least one guide wall comprises a gap formed at a front end
thereof.
6. The heat-dissipating fin as defined in claim 1, wherein said
main body comprises at least two of said guide walls arranged in
tandem, each of said at least two guide walls having a gap formed
at a front end thereof, the gap of said anterior guide wall being
larger than that of said posterior guide wall, said main body
having a rear through hole running through a rear side thereof and
located at the rear most guide wall.
7. The heat-dissipating fin as defined in claim 1, wherein said
main body comprises at least two of said guide walls arranged in
tandem, each of said at least two guide walls having a gap formed
at a front end thereof, the gap of said anterior guide wall being
larger than that of said posterior guide wall.
8. The heat-dissipating fin as defined in claim 1, wherein each of
said two high-temperature areas comprises at least one through hole
provided for a heat pipe to pass through.
9. The heat-dissipating fin as defined in claim 8, wherein said
main body comprises a peripheral sidewall extending vertically
outward from an external edge of each of said through holes.
10. The heat-dissipating fin as defined in claim 1 further
comprising a thermally conductive plate, wherein said thermally
conductive plate is connected with at least one of the two sides of
said main body.
Description
BACKGROUND OF THE INVENTION
[0001] 1. Field of the Invention
[0002] The present invention relates generally to heat-dissipating
apparatuses, and more particularly, to a heat-dissipating fin.
[0003] 2. Description of the Related Art
[0004] A conventional multi-layer heat sink is composed of multiple
fins stacked upon one another, having at least one heat pipe
running through the fins. Each of the fins is flat on the surface
thereof and provided with none of any runners. A cooling fan is
mounted to one side of the fins for generating airflow and enabling
the airflow to pass through the gaps between the fins to blow the
heat on the fins away.
[0005] When the aforesaid heat sink is in use, the temperature
distribution on the surface of each of the fins is virtually
nonuniform, e.g. the temperature on each of the fins at where is
close to the heat pipe is higher and lower at where is farther away
from the heat pipe. However, each of the fins is not provided with
any runners, when the airflow enters the gaps between the fins, the
airflow fails to be effectively guided to where the temperature is
higher but directly passes through the gaps. Therefore, the
high-dissipating efficiency of the conventional heat sink needs
improvement.
[0006] The U.S. Patent Pub. No. 2008/0017350 disclosed a heat sink
having a plurality of parallel fins, each of which is provided with
a plurality of protrusions for disturbing the airflow entering the
gaps between the fins and further enhancing the heat-dissipating
efficiency. However, such heat sink does nothing but disturbs the
airflow rather than guiding the airflow up to where the temperature
is higher on the fins.
SUMMARY OF THE INVENTION
[0007] The primary objective of the present invention is to provide
a heat-dissipating fin which can reach greater heat-dissipating
efficiency.
[0008] The foregoing objective of the present invention is attained
by the heat-dissipating fin having a sheety main body. The main
body is provided with a high-temperature area located at each of
two sides thereof, an airflow area located at a midsection thereof
for an external airflow to pass through, at least one guide wall
formed at the airflow area and having a front end facing the main
body, and two inclined guide portions each extending rearward
toward one side thereof from a front end thereof. In this way, the
external airflow can be guided to the high-temperature areas of the
fin to result in more efficient thermal dissipation.
BRIEF DESCRIPTION OF THE DRAWINGS
[0009] FIG. 1 is a perspective view of a first preferred embodiment
of the present invention.
[0010] FIG. 2 is a perspective view of the first preferred
embodiment of the present invention applied to a heat sink.
[0011] FIG. 3 is a top view of the first preferred embodiment of
the present invention, illustrating the path of the airflow.
[0012] FIG. 4 is a perspective view of a second preferred
embodiment of the present invention.
[0013] FIG. 5 is a perspective view of the second preferred
embodiment of the present invention applied to a heat sink.
[0014] FIG. 6 is a perspective view of the second preferred
embodiment of the present invention, illustrating the path of the
airflow.
[0015] FIG. 7 is a top view of a third preferred embodiment of the
present invention, illustrating the path of the airflow.
[0016] FIG. 8 is a top view of a fourth preferred embodiment of the
present invention, illustrating the path of the airflow.
[0017] FIG. 9 is a perspective view of a fifth preferred embodiment
of the present invention applied to a heat sink.
DETAILED DESCRIPTION OF PREFERRED EMBODIMENTS
[0018] Referring to FIG. 1, a heat-dissipating fin 10 constructed
according to a first preferred embodiment of the present invention
includes a sheety main body 11. The sheety main body 11 is provided
with a high-temperature area 12 located at each of two sides
thereof. Each of the high-temperature areas 12 has a plurality of
through holes 121, each of which is provided for a heat pipe 91 to
pass through. The main body 11 is provided with an airflow area 18
located at a midsection thereof for airflow to pass through. The
main body 11 is provided with a peripheral sidewall 13 extending
vertically outward from an external edge of each of the through
holes 121 for a predetermined height. A guide wall 14 having a
predetermined height is formed at the airflow area 18, having a
front end 141 facing a front end of the main body 11. Two inclined
guide portions 142 are formed on the guide wall 14, each extending
rearward toward each of two sides thereof from the front end 141
for a predetermined length. Each of the inclined guide portions 142
has a distal end spaced from one of two lateral edges of the main
body 11 and from the corresponding through hole 121 for a
predetermined distance. The guide wall 14 has a gap 143 formed at
the front end 141.
[0019] Referring to FIG. 2, when the heat-dissipating fin 10 of the
present invention is applied to this embodiment, a lot of the
heat-dissipating fins 10 are mounted upon one another, and a
plurality of heat pipes 91 for transmitting the heat generated by a
heat-generating element (not shown) are inserted through the
through holes 121 to cling to the peripheral sidewalls 13 of the
through holes 121. When the heat-dissipating fin 10 is in use, the
heat pipe 91 is provided with high homogeneous temperature
distribution to transmit the heat of the heat-generating element to
the heat-dissipating fins 10, such that the maximum temperature
happens at the abutment of the main body 11 and the heat pipe 91,
i.e. it happens within the high-temperature area 12. As shown in
FIG. 3, the path and direction of the airflow are indicated by
arc-shaped arrows. When the airflow enters the space on/beneath the
main body 11 from its front side, most of the airflow is bisected
by the front end 141 of the guide wall 14 and then flow bilaterally
sideward and rearward along the inclined guide portions 142; next,
the bisected airflow flows to the neighborhood of the through holes
121 and the heat pipes 91 and then out of the main body 11. In
other words, the airflow on/beneath the fin 10 can be guided to
where the temperature is higher on the main body 11 for efficient
thermal dissipation. Besides, the other part of the airflow flows
through the gap 143 and then out of the main body 11.
[0020] Referring to FIGS. 4-6, a heat-dissipating fin 20
constructed according to a second preferred embodiment of the
present invention is similar to that of the first embodiment of the
present invention, having the following difference. The main body
21 includes a convexity 26, which is formed at a center of the
airflow area 28 and convex downward in this embodiment. The guide
wall 24 is formed to surround the convexity 26 and the distal ends
of the two inclined guide portions 242 are connected at a front end
of the convexity 26, thus being in the form of water drip.
[0021] The operative manner of the second embodiment of the present
invention is identical to the first embodiment. In effect, the
airflow guided to the bilateral sides converge while flowing to the
rear side of the guide wall 24, such that the whole airflow
guidance is more efficient to reduce the noise and to help the
airflow be exhausted outside from the rear side.
[0022] Referring to FIG. 7, a heat-dissipating fin 30 constructed
according to a third preferred embodiment of the present invention
is similar to that of the first embodiment of the present
invention, having the following difference. The main body 31
includes two guide walls 34, one of which is located in front of
the other. Each of the two guide walls 34 is provided with a gap
343 formed at a front end thereof. The gap of the front guide wall
34 is larger than that of the rear guide wall 34. The main body 31
is further provided with at least one rear through hole 321 located
behind the gap 343 of the rear guide wall 34.
[0023] The operative status of the third embodiment is similar to
that of the first embodiment, having the following difference. The
airflow enters the space on/beneath the main body 31 and then
encounters the front guide wall 34, a first part of the airflow is
guided by the inclined guide portions 342 to flow bilaterally
rearward along the inclined guide portions 342, and the other
second part of the airflow passes through the gap 343 of the front
guide wall 34. Next, when the second part of the airflow encounters
the rear guide wall 34, some of the second part of the airflow is
guided by the rear guide wall 34 to flow rearward along the
inclined guide portion 342 and the other of the second part of the
airflow passes through the gap 343 of the rear guide wall 34 to
flow to the neighborhood of the rear through hole 321, i.e. the
heat pipe. The design that the gap 343 of the front guide wall 34
is larger than that of the rear guide wall 34 allows more air to
flow to the rear side of the main body 31, thus facilitating
efficient thermal dissipation at the rear side of the main body 31.
Therefore, the airflow can likewise be guided to the corresponding
high-temperature location on the heat-dissipating fin to reach more
heat-dissipating efficiency.
[0024] Referring to FIG. 8, a heat-dissipating fin 40 constructed
according to a fourth preferred embodiment of the present invention
is similar to that of the first embodiment of the present
invention, having the following difference.
[0025] The main body 41 includes three guide walls 44 arranged in
tandem and located at the airflow area 48. The rearmost guide wall
44 is not provided with any gap, and the other two guide walls 44
each are provided with a gap 443 formed at a front end thereof. The
gap of the rear guide wall 44 is larger than that of the front
guide wall 44.
[0026] The operative status of the fourth embodiment is similar to
the third embodiment, having the following difference. The rearmost
guide wall 44 does not have any gap, such that the airflow is
directly guided bilaterally rearward along the rear most guide wall
4 to flow out of the main body 41 while flowing to the rearmost
guide wall. Therefore, the airflow can likewise be guided to the
corresponding high-temperature location on the heat-dissipating fin
to bring more efficient thermal dissipation.
[0027] Referring to FIG. 9, a heat-dissipating fin 50 constructed
according to a fifth preferred embodiment of the present invention
is similar to that of the first embodiment of the present
invention, having the following difference.
[0028] Each of two thermally conductive plates 57 is connected with
one of the two sides of the main body 51 for connection with a
heat-generating element (not shown) and with at least one heat pipe
91. The heat generated by the heat-generating element can be
conducted to the two sides of the main body 51, enabling the
maximum temperature to be located in the neighborhood that the main
body 51 contacts the two thermally conductive plates 57, i.e. the
maximum temperature happens within the high-temperature area 52.
The guide wall 54 guides the airflow to the high-temperature areas
52 located at the two sides of the main body 51 to reach more
heat-dissipating efficiency. Therefore, the airflow can likewise be
guided to the corresponding high-temperature location on the
heat-dissipating fin to bring more efficient thermal
dissipation.
[0029] In conclusion, when the airflow enters, the present
invention can guide the airflow to the high-temperature areas on
the heat-dissipating fin in such a way that the airflow takes more
heat out to reach more heat-dissipating efficiency.
[0030] Although the present invention has been described with
respect to specific preferred embodiments thereof, it is no way
limited to the details of the illustrated structures but changes
and modifications may be made within the scope of the appended
claims.
* * * * *