U.S. patent application number 12/398972 was filed with the patent office on 2010-06-10 for heat dissipation device.
This patent application is currently assigned to FU ZHUN PRECISION INDUSTRY (SHEN ZHEN) CO., LTD.. Invention is credited to CHUN-CHI CHEN, GEN-PING DENG, ZHI-SHENG LIAN.
Application Number | 20100139892 12/398972 |
Document ID | / |
Family ID | 42229773 |
Filed Date | 2010-06-10 |
United States Patent
Application |
20100139892 |
Kind Code |
A1 |
LIAN; ZHI-SHENG ; et
al. |
June 10, 2010 |
HEAT DISSIPATION DEVICE
Abstract
A heat dissipation device includes a base, first and second fin
units, two heat pipes, and a fan. The first fin unit is located on
the base, and the second fin unit is located on the first fin unit.
Each fin unit comprises a plurality of parallel fins with a
plurality of channels defined therebetween. Each fin comprises an
inlet section, an outlet section and a neck section interconnecting
the inlet and outlet sections. A height of the neck section reduces
gradually from the inlet section to the outlet section. Each heat
pipe comprises an evaporating portion connecting with the base and
a condensing portion inserting into a corresponding one of the
outlet sections of the first and second fin units. The fan is
located above the base and mounted onto the inlet sections of the
first and second fin units.
Inventors: |
LIAN; ZHI-SHENG; (Shenzhen
City, CN) ; DENG; GEN-PING; (Shenzhen City, CN)
; CHEN; CHUN-CHI; (Tu-Cheng, TW) |
Correspondence
Address: |
PCE INDUSTRY, INC.;ATT. Steven Reiss
288 SOUTH MAYO AVENUE
CITY OF INDUSTRY
CA
91789
US
|
Assignee: |
FU ZHUN PRECISION INDUSTRY (SHEN
ZHEN) CO., LTD.
Shenzhen City,
CN
FOXCONN TECHNOLOGY CO., LTD.
Tu-Cheng,
TW
|
Family ID: |
42229773 |
Appl. No.: |
12/398972 |
Filed: |
March 5, 2009 |
Current U.S.
Class: |
165/104.26 ;
165/121 |
Current CPC
Class: |
H01L 2924/0002 20130101;
H01L 23/427 20130101; H01L 23/3672 20130101; H01L 2924/0002
20130101; H01L 23/4006 20130101; H01L 23/467 20130101; H01L 2924/00
20130101; F28D 15/0275 20130101 |
Class at
Publication: |
165/104.26 ;
165/121 |
International
Class: |
F28D 15/02 20060101
F28D015/02; F28D 21/00 20060101 F28D021/00 |
Foreign Application Data
Date |
Code |
Application Number |
Dec 10, 2008 |
CN |
200810306090.1 |
Claims
1. A heat dissipation device comprising: a base; a fin unit
comprising a plurality of parallel fins arranged on the base with a
plurality of channels defined therebetween, each fin comprising a
main plate perpendicular to the base and two flanges bent from
edges of the main plate, the main plate comprising an inlet
section, an outlet section and a neck section interconnecting the
inlet and outlet sections, a height of the neck section reducing
gradually from the inlet section to the outlet section; and a fan
located on the base and attached to the inlet sections of the fins,
cooling air generated by the fan flowing into the channels via the
inlet sections of the fins and accelerating to flow out from the
outlet sections of the fins after the cooling air flows through the
neck sections of the fins.
2. The heat dissipation device as claimed in claim 1, wherein the
main plate further comprises a bent section extending downwardly
from a free end of the outlet section.
3. The heat dissipation device as claimed in claim 1, wherein the
neck section has a streamline shape.
4. The heat dissipation device as claimed in claim 1, wherein the
inlet sections of the fin unit are attached to the base and the
neck sections and the outlet sections of the fin unit are spaced
from the base.
5. The heat dissipation device as claimed in claim 1, further
comprising an additional fin unit located on the fin unit, the
additional fin unit comprising a plurality of parallel fins with a
plurality of channels defined therebetween, each fin of the
additional fin unit comprising a main plate perpendicular to the
base and two flanges bent from edges of the main plate, the main
plate of the each fin of the additional fin unit comprising an
inlet section, an outlet section and a neck section interconnecting
the inlet and outlet sections of the each fin of the additional fin
unit, a height of the neck section of the each fin of the
additional fin unit reducing gradually from the inlet section to
the outlet section of the each fin of the additional fin unit.
6. The heat dissipation device as claimed in claim 5, wherein the
inlet sections of the additional fin unit are attached to the inlet
sections of the fin unit, the neck sections and the outlet sections
of the additional fin unit and the fin unit are spaced from each
other.
7. The heat dissipation device as claimed in claim 6, wherein the
outlet sections of the additional fin unit and the fin unit are
parallel to each other, and a distance between the neck sections of
the additional fin unit and the fin unit increases gradually from
the inlet sections to the outlet sections.
8. The heat dissipation device as claimed in claim 7, further
comprising two heat pipes connecting the base, the fin unit and the
additional fin unit.
9. The heat dissipation device as claimed in claim 8, wherein the
heat pipes are U-shaped and each comprise an evaporating portion
connecting to the base, a condensing portion and a middle portion
interconnecting the evaporating portion and the condensing portion,
the condensing portion of each heat pipe inserting into a
corresponding one of the fin unit and the additional fin unit.
10. The heat dissipation device as claimed in claim 9, wherein two
grooves are defined in the base, the evaporating portions of the
heat pipes being received in the two grooves, and a hole is defined
in each of the outlet sections of the fins of the fin unit and the
additional fin unit, the condensing portions of the heat pipes
being inserted in the holes, respectively.
11. The heat dissipation device as claimed in claim 10, wherein the
evaporating portion of one of the heat pipes is attached to a
bottom of the inlet sections of the fin unit, and the condensing
portion of the one of the heat pipes inserts into the outlet
sections of the additional fin unit.
12. The heat dissipation device as claimed in claim 5, wherein each
of the main plates of the additional fin unit further comprises a
bent section extending downwardly from a free end of the outlet
section of the each of the main plates of the additional fin
unit.
13. A heat dissipation device comprising: a base; a first fin unit
and a second fin unit, the first fin unit located on the base, the
second fin unit located on the first fin unit, each of the first
and second fin units comprising a plurality of parallel fins with a
plurality of channels defined therebetween, each fin comprising an
inlet section, an outlet section and a neck section interconnecting
the inlet and outlet sections, a height of the inlet section being
larger than that of the outlet section, a height of the neck
section reducing gradually from the inlet section to the outlet
section; two heat pipes each comprising an evaporating portion
connecting with the base, and a condensing portion inserting into a
corresponding one of the outlet sections of the first and second
fin units; and a fan located above the base and mounted to the
inlet sections of the first and second fin units.
14. The heat dissipation device as claimed in claim 13, wherein
each fin of the first and second fin units further comprises a bent
section extending downwardly from a free end of the outlet section
thereof.
15. The heat dissipation device as claimed in claim 13, wherein the
inlet sections of the first fin unit are attached to the base, the
neck sections and outlet sections of the first fin unit are spaced
from the base.
16. The heat dissipation device as claimed in claim 13, wherein the
inlet sections of the second fin unit are attached to the inlet
sections of the first fin unit, and the neck sections and outlet
sections of the first and second fin units are spaced from each
other.
17. The heat dissipation device as claimed in claim 16, wherein the
outlet sections of the first and second fin units are parallel to
each other, and a distance between the neck sections of the first
and second fin units increases gradually from the inlet sections to
the outlet sections.
18. The heat dissipation device as claimed in claim 13, wherein the
evaporating portion of one of the heat pipes is attached to a
bottom of the inlet sections of the first fin unit, and the
condensing portion of the one of the heat pipes inserts into the
outlet sections of the second fin unit.
19. A heat dissipation device comprising: a base; at least one fin
unit arranged on the base and comprising a plurality of fins
perpendicular to the base, with a plurality of channels defined
therebetween, each fin comprising an inlet section, an outlet
section, a neck section interconnecting the inlet and outlet
sections, and a bent section extending downwardly from a free end
of the outlet section, a height of the neck section reducing
gradually from the inlet section to the outlet section; at least
one heat pipe comprising an evaporating portion connecting with the
base and a condensing portion inserting into the outlet sections of
the fins; and a fan located on the base and mounted onto the inlet
sections of the fins, cooling air generated by the fan flowing into
the channels of the at least one fin unit via the inlet sections of
the fins, speeding up at the neck sections, and consequently
accelerating to flow out from the channels via the outlet sections
and the bent sections of the fins.
20. The heat dissipation device as claimed in claim 19, wherein the
inlet sections of the at least one fin unit are attached to the
base, the neck sections, the outlet sections and the bent sections
of the at least one fin unit are spaced from the base.
Description
BACKGROUND OF THE INVENTION
[0001] 1. Field of the Invention
[0002] The present disclosure relates to heat dissipation devices
used in association with electronic components and, more
particularly, to a heat dissipation device having fins with a
specially designed configuration which can enhance heat dissipation
efficiency thereof.
[0003] 2. Description of Related Art
[0004] Computer electronic components, such as central processing
units (CPUs), generate large amounts of heat during normal
operation. If the heat is not properly dissipated, it can adversely
affect operational stability of the electronic components and
damage associated electronic devices. A heat dissipation device is
often attached to a top surface of a CPU to dissipate heat
therefrom.
[0005] Conventionally, a heat dissipation device includes a base
and a plurality of fins arranged on the base. The fins are
rectangular and parallel to each other with parallel channels
defined therebetween. A cooling fan is generally located at a
lateral side of the base and the fins to provide cooling air to
flow through the channels of the fins, thereby increasing cooling
efficiency of the heat dissipation device. However, a height of the
channels is invariable, whereby the speed of the cooling air at an
inlet and an outlet of the channels is invariable. The invariable
speed of the cooling air, which can not accelerate to dissipate the
heat absorbed by the fins, limits the heat dissipation efficiency
of the heat dissipation device.
[0006] What is needed, therefore, is an improved heat dissipation
device which can overcome the described disadvantages.
BRIEF DESCRIPTION OF THE DRAWINGS
[0007] Many aspects of the present apparatus can be better
understood with reference to the following drawings. The components
in the drawings are not necessarily drawn to scale, the emphasis
instead being placed upon clearly illustrating the principles of
the present apparatus. Moreover, in the drawings, like reference
numerals designate corresponding parts throughout the several
views.
[0008] FIG. 1 is an exploded, isometric view of a heat dissipation
device in accordance with an embodiment of the disclosure, with an
electronic component.
[0009] FIG. 2 is an assembled, isometric view of the heat
dissipation device in FIG. 1.
[0010] FIG. 3 is a side view of the heat dissipation device in FIG.
2.
DETAILED DESCRIPTION OF THE INVENTION
[0011] Referring to FIGS. 1-2, a heat dissipation device in
accordance with an embodiment of the disclosure comprises a base
10, a first fin unit 20 and a second fin units 30 arranged on the
base 10, two heat pipes 40, 50 connecting the base 10 and the first
and second fin units 20, 30, and a fan 60 located on the base 10
and mounted onto a front end of the first and second fin units 20,
30.
[0012] The base 10 is a substantially rectangular plate. The base
10 is made of heat conductive material such as copper or aluminum.
Preferably, the base 10 is made of copper, which has a better heat
conductivity than aluminum. Two parallel grooves 12 are defined in
a top surface of the base 10. A bottom surface of the base 10 is
for contacting an electronic component 100 such as a CPU received
in an electronic system such as a computer (not shown) and mounted
on a printed circuit board (not shown). Four through holes 14 are
defined at four corners of the base 10.
[0013] The heat dissipation device further comprises two locking
members 16 engaging with the base 10 to secure the heat dissipation
device to the printed circuit board (not shown) on which the
electronic component 100 is mounted, so that the base 10 can have
an intimate contact with the electronic component 100.
Specifically, two through holes 160 are defined in each of the
locking members 16 corresponding to the through holes 14 of the
base 10. Four screws 17 engage into the through holes 160, 14 to
thereby combine the base 10 and the locking members 16 together.
Four fasteners 18 extend through ends of the locking members 16 to
secure the locking members 16 to the printed circuit board.
[0014] The first fin unit 20 is arranged on the top surface of the
base 10. The second fin unit 30 is arranged on the first fin unit
20. The first and second fin units 20, 30 have the same
configuration. Each of the first and second fin units 20, 30
comprises a plurality of parallel fins 22 combined together. Each
fin 22 comprises a vertical main plate 220 perpendicular to the
base 10 and two flanges 221 extending from bottom and top edges of
the main plate 220, respectively. The flanges 221 of a fin 22 abut
against the main plate 220 of an adjacent fin 22 so as to form a
channel 24 between the two adjacent fins 22. The fins 22 of the
first and second fin units 20, 30 are combined together by engaging
structures (not labeled) formed between adjacent fins 22.
[0015] Also referring to FIG. 3, each of the main plates 220
comprises an inlet section 222, an outlet section 226, a neck
section 224 interconnecting the inlet and outlet sections 222, 226,
and a bent section 228 extending downwardly from a free end of the
outlet section 226. A height of the inlet section 222 is larger
than that of the outlet section 226. A height of the neck section
224 reduces gradually from the inlet section 222 to the outlet
section 226. Specifically, the neck section 224 has a streamline
shape. Preferably, the height of the inlet section 222 is 36
millimeters (mm), and the height of the outlet section 226 is 14
mm.
[0016] The fins 22 are configured as such a manner that the
channels 24 defined therebetween have a variable height. That is,
the height of the channels 24 at the inlet sections 222 of the fins
22 is larger than that at the outlet sections 226 of the fins 22,
and the height of the channels 24 at the neck sections 224 reduces
gradually from the inlet sections 222 to the outlet sections 226 of
the fins 22. The channels 24 at the bent sections 228 are slantwise
to a horizontal line and oriented downwardly to the printed circuit
board. A hole 223 is defined in a center of the outlet section 226
of each of the fins 22. The holes 223 of the fins 22 of the first
and second fin units 20, 30 cooperate to define two passages for
parts of the heat pipes 40, 50 to extend therethrough,
respectively.
[0017] A configuration of the heat pipe 40 is similar to that of
the heat pipe 50, and both have a substantially U shape. The heat
pipe 40 comprises a horizontal evaporating portion 41, a middle
portion 42 extending upwardly and slantwise from an end of the
evaporating portion 41, and a condensing portion 43 extending
horizontally from an end of the middle portion 42 remote from the
evaporating section 41. The evaporating portion 41 and the
condensing portion 43 are parallel to each other. The heat pipe 50
comprises a horizontal evaporating portion 51, a middle portion 52
extending upwardly and slantwise from an end of the evaporating
portion 51, and a condensing portion 53 extending horizontally from
an end of the middle portion 52 remote from the evaporating portion
51. The middle portion 52 is longer than the middle portion 42,
whereby the condensing portion 53 is located above the condensing
portion 43. The evaporating portions 41, 51 of the heat pipes 40,
50 are flattened and received in the two grooves 12 of the base 10.
The condensing portions 43, 53 of the heat pipes 40, 50 are round
and insert into the holes 223 of the first and second fin units 20,
30, respectively.
[0018] The fan 60 is mounted onto the inlet sections 222 of the
first and second fin units 20, 30 by two fan holders 65.
[0019] Please referring to FIGS. 2 and 3, in assembly, the locking
members 16 are engaged with the base 10. The evaporating portions
41, 51 of the heat pipes 40, 50 are respectively received in the
two grooves 12 of the base 12. Tops of the evaporating portions 41,
51 and the top surface of the base 12 are coplanar. The first fin
unit 20 is located on the base 12. Bottoms of the inlet sections
222 of the first fin unit 20 are attached to the base 12 and the
evaporating portion 51 of the heat pipe 50. The neck sections 224,
the outlet sections 226 and the bent sections 228 of the first fin
unit 20 are spaced from the base 12. The condensing portion 43 of
the heat pipe 40 inserts into the holes 223 of the first fin unit
20. The second fin unit 30 is located on the first fin unit 20,
with bottoms of the inlet sections 222 thereof attached to tops of
the inlet sections 222 of the first fin unit 20. The condensing
portion 53 of the heat pipe 50 inserts into the holes 223 of the
second fin unit 30. A distance between the neck sections 224 of the
first and second fin units 20, 30 increases gradually from the
inlet sections 222 to the outlet sections 226, since the height of
the neck sections 224 reduces gradually from the inlet sections 222
to the outlet sections 226. The outlet sections 226 of the first
and second fin units 20, 30 are spaced from and parallel to each
other. Finally, the fan 60 is mounted onto the inlet sections 222
of the first and second fin units 20, 30 by the fan holders 65, and
faces towards the channels 24.
[0020] In use, heat generated by the electronic component 100 is
absorbed by the base 12 and then transferred by the heat pipes 40,
50 to the first and second fin units 20, 30, and dissipated to
ambient air at last. Cooling air generated by the fan 60 can flow
through the channels 24 of the first and second fin units 20, 30 to
accelerate the heat dissipation of the first and second fin units
20, 30. It is noted that, since the height of the neck sections 224
of the first and second fin units 20, 30 reduces gradually, and the
height of the outlet sections 226 is smaller than that of the inlet
sections 222, the cooling air can speed up at the neck sections 224
and accelerate to flow out from the outlet sections 226 and the
bent sections 228. Compared with the conventional heat dissipation
device having the same fan 60, the cooling air can flow out of the
present heat dissipation device more rapidly, due to the neck
configuration of the neck sections 224 of the fin units 20, 30.
Therefore, heat absorbed in the base 10 and the fin units 20, 30
can be dissipated to ambient areas more rapidly, thereby insuring
that the electronic component 100 can always have a temperature
within its normal working range.
[0021] Furthermore, since the bent sections 228 are oriented
downwardly to the printed circuit board, cooling air flowing out
therefrom can cool other heat sources mounted on the printed
circuit board. Therefore, the cooling air generated by the fan 60
is well exploited. It is understood that the bent angle of the bent
sections 228 can be varied from the disclosed embodiment, so long
as the cooling air can be guided downwardly to cool other heat
sources mounted on the printed circuit board.
[0022] Moreover, the fins 22 of the first and second fin units 20,
30 each are formed by cutting a part of a rectangular fin away
therefrom to have the neck configuration. Thus, the fins 22 of the
fin units 20, 30 need less material, in comparison with the
conventional fin unit constructed by the rectangular fin, while
have better heat dissipating effectiveness. Thus, the cost of raw
materials of the heat dissipation device in accordance with the
present disclosure is lower than the conventional heat dissipation
device.
[0023] It is believed that the present disclosure and its
advantages will be understood from the foregoing description, and
it will be apparent that various changes may be made thereto
without departing from the spirit and scope of the disclosure or
sacrificing all of its material advantages, the examples
hereinbefore described merely being preferred or exemplary
embodiments of the disclosure.
* * * * *