U.S. patent application number 12/706187 was filed with the patent office on 2010-06-10 for enclosure for surveillance hardware.
Invention is credited to Raymond G. Leblond.
Application Number | 20100139290 12/706187 |
Document ID | / |
Family ID | 42229542 |
Filed Date | 2010-06-10 |
United States Patent
Application |
20100139290 |
Kind Code |
A1 |
Leblond; Raymond G. |
June 10, 2010 |
ENCLOSURE FOR SURVEILLANCE HARDWARE
Abstract
The enclosure for surveillance hardware provided herein protects
the hardware from external elements and from damage. The enclosure
may be configured for a node of a peer to peer surveillance
architecture or other devices, and for mobile or other
applications. The enclosure may comprise a sealed component chamber
and an adjacent support chamber. The sealed component chamber may
enclose the components therein in an air or watertight manner. The
support chamber may comprise an airflow system and thermal
conductor which regulates the temperature in the component chamber.
The enclosure may be formed from a multilayer material having
various protective qualities. A controller may be provided to
control operation of the airflow system and thermal conductor in
response to changes in temperature.
Inventors: |
Leblond; Raymond G.;
(Riverside, CA) |
Correspondence
Address: |
WEIDE & MILLER, LTD.
7251 W. LAKE MEAD BLVD., SUITE 530
LAS VEGAS
NV
89128
US
|
Family ID: |
42229542 |
Appl. No.: |
12/706187 |
Filed: |
February 16, 2010 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
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12378867 |
Feb 20, 2009 |
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12706187 |
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12154477 |
May 23, 2008 |
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12378867 |
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Current U.S.
Class: |
62/3.3 ; 454/251;
62/3.6 |
Current CPC
Class: |
H04N 5/232941 20180801;
H04N 5/232 20130101; H04N 5/23299 20180801; F25B 21/02 20130101;
F25B 2321/0212 20130101; H04N 5/23206 20130101; H04N 5/232935
20180801; H04N 5/2252 20130101 |
Class at
Publication: |
62/3.3 ; 454/251;
62/3.6 |
International
Class: |
F25B 21/04 20060101
F25B021/04; F24F 7/007 20060101 F24F007/007; F25B 21/02 20060101
F25B021/02 |
Claims
1. A mobile enclosure comprising: a sealed component chamber
configured to enclose one or more components; one or more vibration
dampening assemblies configured to reduce vibration of at least one
of the one or more components; a thermal conductor having a first
portion within the sealed component chamber and a second portion
outside the sealed component chamber, the first portion configured
to cool the one or more components in the sealed component chamber;
and a thermal dissipater mounted to an exterior portion of the
sealed component chamber, the thermal dissipater connected to the
second portion of the thermal conductor, wherein the thermal
dissipater transfers heat away from the thermal conductor.
2. The enclosure of claim 1, wherein the sealed component chamber
is formed from a multilayer material.
3. The enclosure of claim 1, wherein the thermal conductor is a
Peltier device.
4. The enclosure of claim 3 further comprising a controller
configured to increase power to the thermal conductor to increase
cooling at the first portion of the thermal conductor and
configured to decrease power to the thermal conductor to decrease
cooling at the first portion of the thermal conductor.
5. The enclosure of claim 1, wherein the one or more components are
mounted to at least one of the one or more vibration dampening
assemblies.
6. The enclosure of claim 1 further comprising one or more direct
conduction thermal conductors in contact with at least one of the
one or more components and with the thermal dissipater, wherein the
thermal dissipater transfers heat away from the one or more direct
conduction thermal conductors.
7. The enclosure of claim 1 further comprising an airflow system
adjacent the first portion of the thermal conductor, the airflow
system configured to generate at least one airflow within the
sealed component chamber.
8. The enclosure of claim 1, wherein the second portion of the
thermal conductor is embedded into the thermal dissipater.
9. A mobile enclosure comprising: a thermal conductor having a
cooled portion and a heated portion; a sealed component chamber
configured to enclose one or more components, the cooled portion of
the thermal conductor positioned within the sealed component
chamber; an airflow system adjacent the thermal conductor, the
airflow system configured to circulate air within the sealed
component chamber; a vibration dampening assembly configured to
isolate the sealed component chamber from vibration; a thermal
dissipater external to the sealed component chamber, the thermal
dissipater coupled with the thermal conductor to receive and
dissipate heat from the heated portion of the thermal conductor;
and a power system having one or more outputs to provide processed
power to the one or more components.
10. The mobile enclosure of claim 9 further comprising one or more
thermal isolation materials between the component chamber and the
thermal dissipater.
11. The mobile enclosure of claim 9 further comprising a direct
conduction thermal conductor in contact with at least one of the
one or more components to directly cool the at least one of the one
or more components.
12. The mobile enclosure of claim 9, wherein the component chamber
comprises an opening to accept the heated portion of the thermal
conductor.
13. The mobile enclosure of claim 9 further comprising one or more
external fans mounted to the thermal dissipater, the one or more
external fans configured to break a thermal barrier around the
thermal dissipater.
14. A method for protecting one or more components within a mobile
enclosure comprising: protecting the one or more components within
a sealed component chamber of the mobile enclosure; cooling the
sealed component chamber with a cooled end of a thermal conductor;
generating at least one airflow within the component chamber and
across at least a portion of the cooled end of the thermal
conductor cooling a heated end of the thermal conductor with a
thermal dissipater coupled to the heated end, the thermal
dissipater external to the sealed component chamber; and isolating
at least a portion of the component chamber from heat dissipated by
the thermal dissipater with one or more thermal isolation
materials.
15. The method of claim 14 further comprising: measuring at least
one temperature within the component chamber; increasing power to
the thermal conductor to generate additional cooling at the cooled
end of the thermal conductor if the at least one temperature is
above a first temperature threshold; and decreasing power to the
thermal conductor to reduce cooling at the cooled end of the
thermal conductor if the at least one temperature is below a second
temperature threshold.
16. The method of claim 14 further comprising generating an
external airflow at the thermal dissipater to break a thermal
barrier around the thermal dissipater.
17. The method of claim 14 further comprising directly cooling at
least one of the one or more components with a direct conduction
thermal conductor, the direct conduction thermal conductor in
contact with the at least one of the one or more components.
18. The method of claim 17 further comprising: measuring at least
one temperature of at least one of the one or more components;
increasing power to the direct conduction thermal conductor to
generate additional cooling at a cooled end of the direct
conduction thermal conductor if the at least one temperature is
above a first temperature threshold; and decreasing power to the
direct conduction thermal conductor to reduce cooling at the cooled
end of the direct conduction thermal conductor if the at least one
temperature is below a second temperature threshold.
19. The method of claim 14 further comprising isolating the
component chamber from vibrations from the thermal dissipater with
one or more vibration dampeners.
20. The method of claim 14, wherein the component chamber comprises
a multilayer material including layers selected from the group
consisting of at least one rigid layer and at least one insulating
layer.
Description
CROSS-REFERENCE TO RELATED APPLICATION
[0001] This application is a continuation-in-part of U.S. patent
application Ser. No. 12/378,867, filed Feb. 20, 2009, which is a
continuation-in-part of U.S. patent application Ser. No.
12/154,477, filed May 23, 2008.
BACKGROUND OF THE INVENTION
[0002] 1. Field of the Invention
[0003] The invention relates to surveillance system hardware,
particularly to an enclosure for protecting and supporting
surveillance devices. The invention also relates to enclosures for
surveillance nodes used in peer to peer surveillance
architectures.
[0004] 2. Related Art
[0005] Surveillance is widely utilized in modern society.
Governments, corporations, groups, and even individuals use
surveillance to promote public safety and to deter and prevent
crime as well as for general monitoring.
[0006] Traditional surveillance systems generally provide audio and
video monitoring through an interconnected hierarchical system. For
example, a closed-circuit television (CCTV) system may provide
video monitoring through a set of closed-circuit cameras connected
to a single stand alone aggregation device where the video feeds
from the cameras are sent. The captured information may then be
viewed through the aggregation device such as on one or more video
screens.
[0007] To function properly, a CCTV or other similar traditional
system requires a central controller or device which accepts
signals from cameras and which may also provide control
instructions to the devices. This allows every camera to be
monitored and controlled from a single location. However, this
introduces a single point of failure in that the failure of the
central controller would render the entire surveillance system
inoperative. Thus, such systems are said to be fragile as a failure
of the central controller or the connections between the controller
and the cameras either impairs or completely prevents the
surveillance system from functioning. This fragility is highly
undesirable in a surveillance system especially where public safety
is concerned.
[0008] With the introduction of digital and networked devices,
surveillance cameras could be connected via standard wired or
wireless network connections. This was an improvement in that one
or more standard network connections could be used by capture
devices rather than a specialized, dedicated, or proprietary video
connection. In addition, digital video may be sent across vast
distances through digital networks, such as the Internet, which was
not possible without great expense using traditional CCTV
systems.
[0009] However, network based surveillance systems continue to rely
on a centralized controller to function. The video or other
surveillance information is still aggregated at the centralized
controller which facilitates observation and analysis of the
information gathered. Thus, the single point of failure has
remained through the transition from traditional CCTV and similar
systems to network based surveillance systems.
[0010] It is true that these traditional systems may be configured
to have backup central controllers. While these backup systems
provide increased reliability they do so at increased cost and
often do not provide a seamless transition from the failed
equipment to its associated backup device. In surveillance, any
downtime including downtime associated with switching to a backup
device is highly undesirable.
[0011] Traditional systems are also difficult to update for new
circumstances or environments. For example, moving one or more
cameras to a new location or including additional cameras or other
collection devices requires installation of at least one connection
from each camera or collection device to the central controller.
These connections are often physical connections, such as network
or coaxial cabling, which are difficult to install especially in
existing structures.
[0012] Traditional surveillance devices are also vulnerable to the
elements such as excessive temperatures and physical damage. In
addition, these devices generally are limited to specific operating
environments. Thus, what is desired and disclosed herein is an
enclosure for a peer to peer surveillance architecture that
encloses and protects surveillance devices while expanding their
possible operating environments.
SUMMARY OF THE INVENTION
[0013] A mobile enclosure for surveillance devices or other
electronic devices is described herein. In general, the enclosure
protects the components of a surveillance device from external
elements and damage. The enclosure may regulate the environment
surrounding the components and may be designed to isolate vibration
and other movements to prevent damage to the components. The
enclosure may be configured to have a reduced size well suited for
mobile use. The enclosure may include a power system which provides
ideal or desired power to the components.
[0014] In one embodiment, the mobile enclosure may comprise a
sealed component chamber configured to enclose one or more
components, one or more vibration dampening assemblies configured
to reduce vibration of the one or more components, and a thermal
conductor. The sealed component chamber may be formed from a
multilayer material.
[0015] The thermal conductor may have a first portion within the
sealed component chamber and a second portion outside the sealed
component chamber. The first portion may be configured to cool the
sealed component chamber. An airflow system configured to generate
at least one airflow within the sealed component chamber may be
adjacent the first portion of the thermal conductor. In this manner
the airflow system helps to cool the component chamber.
[0016] The thermal conductor may be configured in various ways. For
example, the thermal conductor may be a Peltier device. The mobile
enclosure may include a controller configured to increase power to
the thermal conductor to increase cooling at the first portion of
the thermal conductor and configured to decrease power to the
thermal conductor to decrease cooling at the first portion of the
thermal conductor.
[0017] A thermal dissipater mounted to an exterior portion of the
sealed component chamber may also be provided. The thermal
dissipater may be connected to the second portion of the thermal
conductor to allow the thermal dissipater to transfer heat away
from the thermal conductor. It is contemplated that the second
portion of the thermal conductor may be embedded into the thermal
dissipater.
[0018] One or more direct conduction thermal conductors may also be
included. The direct conduction thermal conductors may be in
contact with at least one component and the thermal dissipater. In
this manner, individual components may be directly cooled by the
direct conduction thermal conductors.
[0019] The one or more components may be mounted to at least one of
the one or more vibration dampening assemblies to isolate the
components from vibration. The vibration dampening assemblies may
comprise a thermal conductor plate configured to absorb heat from
the one or more components. The one or more components may then be
mounted to the thermal conductor plate to allow heat to be
transferred away from the components and to isolated the components
from vibration.
[0020] In another embodiment the mobile enclosure may comprise a
thermal conductor having a cooled portion and a heated portion, and
a sealed component chamber configured to enclose one or more
components. The cooled portion of the thermal conductor may be
positioned within the sealed component chamber to cool the
component chamber. The component chamber may, but need not always,
have an opening to accept the heated portion of the thermal
conductor. An airflow system may be located adjacent the thermal
conductor to circulate air within the sealed component chamber.
[0021] The mobile enclosure may also comprise a vibration dampening
assembly configured to isolate the sealed component chamber from
vibration, and a thermal dissipater external to the sealed
component chamber. The thermal dissipater may be coupled with the
thermal conductor to receive and dissipate heat from the heated
portion of the thermal conductor. One or more thermal isolation
materials may be located between the component chamber and the
thermal dissipater to prevent dissipated heat from reentering the
component chamber. A power system having one or more outputs may be
used to provide processed power to the one or more components.
[0022] A direct conduction thermal conductor in contact with at
least one of the one or more components to directly cool the at
least one of the components may also be provided. In addition, one
or more external fans mounted to the thermal dissipater may be
included. The one or more external fans may generate airflow to
break any thermal barrier that forms around the thermal
dissipater.
[0023] A method for protecting one or more components within a
mobile enclosure is also provided herein. In one embodiment, the
method may comprise protecting the one or more components within a
component chamber of the mobile enclosure. The component chamber
may comprise a multilayer material including one or more layers
selected from the group consisting of at least one rigid layer and
at least one insulating layer.
[0024] The environment within the component chamber may be
controlled. For example, the sealed component chamber may be cooled
with a cooled end of a thermal conductor. In addition, at least one
airflow may be generated within the component chamber and across at
least a portion of the cooled end of the thermal conductor to cool
the component chamber.
[0025] It is noted that the heated end of the thermal conductor may
be cooled with a thermal dissipater coupled to the heated end. The
thermal dissipater external to the sealed component chamber to
allow heat from the heated end to be dissipated to the outside
environment. At least a portion of the component chamber may be
isolated from heat dissipated by the thermal dissipater with one or
more thermal isolation materials. This prevents dissipated heat
from reentering the component chamber. It is contemplated that an
external airflow may be generated at the thermal dissipater to
break any thermal barrier that should form around the thermal
dissipater.
[0026] The method may also include measuring at least one
temperature within the component chamber, increasing power to the
thermal conductor to generate additional cooling at the cooled end
of the thermal conductor if the at least one temperature is above a
first temperature threshold, and decreasing power to the thermal
conductor to reduce cooling at the cooled end of the thermal
conductor if the at least one temperature is below a second
temperature threshold.
[0027] Protection from vibrations or other movement may be provided
with the method as well. For instance, the component chamber may be
isolated from vibration through one or more external vibration
dampening assemblies, which may be used to mount the component
chamber to an external surface.
[0028] In addition, at least one of the one or more components may
be directly cooled with a direct conduction thermal conductor. To
achieve this direct cooling, the direct conduction thermal
conductor may be contact with the at least one of the components.
The direct conduction thermal conductor may be controlled if
desired. For instance, at least one temperature of at least one of
the components may be measured. Power to the direct conduction
thermal conductor may be increased to generate additional cooling
at a cooled end of the direct conduction thermal conductor if the
at least one temperature is above a first temperature threshold,
and power to the direct conduction thermal conductor may be
decreased to reduce cooling at the cooled end of the direct
conduction thermal conductor if the at least one temperature is
below a second temperature threshold.
[0029] Other systems, methods, features and advantages of the
invention will be or will become apparent to one with skill in the
art upon examination of the following figures and detailed
description. It is intended that all such additional systems,
methods, features and advantages be included within this
description, be within the scope of the invention, and be protected
by the accompanying claims.
BRIEF DESCRIPTION OF THE DRAWINGS
[0030] The components in the figures are not necessarily to scale,
emphasis instead being placed upon illustrating the principles of
the invention. In the figures, like reference numerals designate
corresponding parts throughout the different views.
[0031] FIG. 1 illustrates an exemplary peer to peer surveillance
architecture as it may be deployed.
[0032] FIG. 2A is a block diagram illustrating an exemplary peer to
peer surveillance architecture where each node is connected through
a network.
[0033] FIG. 2B is a block diagram illustrating an exemplary peer to
peer surveillance architecture where each node is connected through
more than one independent network.
[0034] FIG. 3 is a block diagram illustrating an exemplary
node.
[0035] FIG. 4 is a block diagram illustrating an exemplary capture
node.
[0036] FIG. 5 is a block diagram illustrating an exemplary viewing
node.
[0037] FIG. 6 is a block diagram illustrating an exemplary content
storage node.
[0038] FIG. 7 is a block diagram illustrating an exemplary server
node.
[0039] FIG. 8A is a front perspective view of an exemplary
enclosure.
[0040] FIG. 8B is a perspective view of an exemplary multilayer
material of an enclosure.
[0041] FIG. 8C is a rear perspective view of an exemplary
enclosure.
[0042] FIG. 8D is a cross section view of an exemplary
enclosure.
[0043] FIG. 9 is a side interior view of an exemplary
enclosure.
[0044] FIG. 10 is a block diagram illustrating an exemplary control
system.
[0045] FIG. 11A is a top perspective view of exemplary mobile
enclosure.
[0046] FIG. 11B is a bottom perspective view of an exemplary mobile
enclosure.
[0047] FIG. 12A is a perspective view of an exemplary vibration
dampener.
[0048] FIG. 12B is a perspective view of an exemplary vibration
dampening assembly.
[0049] FIG. 12C is a perspective view of various exemplary
vibration dampening assemblies.
[0050] FIG. 13A is a cross section view of an exemplary mobile
enclosure.
[0051] FIG. 13B is a cross section view of an exemplary mobile
enclosure having a support chamber.
[0052] FIG. 13C is a perspective view of an exemplary environmental
control system.
[0053] FIG. 13D is a cross section view of an exemplary
environmental control system.
[0054] FIG. 13E is a bottom perspective view of exemplary external
fans of an environmental control system.
[0055] FIG. 14A is a perspective view of an exemplary surveillance
device within a mobile enclosure.
[0056] FIG. 14B is a side view of an exemplary surveillance device
within a mobile enclosure.
[0057] FIG. 14C is a perspective view of an exemplary direct
conduction thermal conductor within a mobile enclosure.
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS
[0058] In the following description, numerous specific details are
set forth in order to provide a more thorough description of the
present invention. It will be apparent, however, to one skilled in
the art, that the present invention may be practiced without these
specific details. In other instances, well-known features have not
been described in detail so as not to obscure the invention.
[0059] Generally, the peer to peer surveillance architecture
comprises one or more nodes configured to capture, analyze, store,
and present surveillance information. As discussed further below,
surveillance information comprises a wide variety of information
including video and audio. As used herein, peer to peer means that
each node within the surveillance architecture operates such that
it is not dependent on (i.e. does not rely on) its peer nodes. This
allows the surveillance architecture to have no single point of
failure making it extremely robust. The failure of or damage to
individual nodes, components, or communication links cannot cause
the system to function at less than full capacity when a peer to
peer or non-dependent relationship exists between each node and its
peers.
[0060] The surveillance architecture may be configured to balance
requirements and capability. For example, the architecture may be
configured for a high or complete redundancy, but may also be
configured according to particular requirements based on the
necessary functionality, redundancy, and budget considerations.
[0061] As will be described further below, the peer to peer
surveillance architecture generally comprises one or more capture
nodes, server nodes, content storage nodes, and viewing nodes. The
capture nodes generally record or capture surveillance information
and may be configured to capture specific types of information,
such as a camera node which captures video surveillance
information. The captured information may be viewed, stored, or
analyzed by the other nodes, including other capture nodes. The
architecture is able to provide complete redundancy through these
nodes, which are configured to function without depending on any
other node or any single communication link.
[0062] The peer to peer surveillance architecture combines this
redundancy with high adaptability and easy deployment, both of
which are among the advantages over traditional surveillance
systems. This allows collection of surveillance information from a
wide range of target areas and is generally made possible through
various wireless, cellular, and other network technologies, and
allows for stationary and mobile surveillance systems that may be
rapidly deployed virtually anywhere as desired. For example, the
architecture allows capture nodes to be mounted on buildings,
utility poles, in jails, in parks, throughout downtown areas, and
intersections even where there are no physical communication links
such as network or other cables.
[0063] The advantages of the peer to peer surveillance
architecture's reliability and adaptability can be readily seen
with regard to public safety. Surveillance enhances public safety
and security by allowing police and other security agencies or
organizations to monitor citizen safety, specific events,
congestion, and even fight graffiti. In addition, surveillance
serves as a force multiplier, allowing for example, police or
municipalities to expand their coverage without additional
officers. Thus, the architecture's reliability ensures reliable
surveillance for these purposes, and its adaptability allows rapid
deployment to monitor special events, such as but not limited to
sporting events or conventions as well as the ability to quickly
and easily remove surveillance once the event is over.
[0064] The peer to peer surveillance architecture may also provide
analysis of surveillance information. This greatly expands
surveillance capabilities without the need for increased personnel
as well. For example, the architecture may provide automated
license plate recognition, theft detection, and traffic congestion
monitoring. The architecture may provide notifications to users or
to nodes within the architecture when certain events are present or
detected in the surveillance information.
[0065] The peer to peer surveillance architecture will now be
described with regard to FIGS. 1-7. FIG. 1 illustrates an exemplary
embodiment of the surveillance architecture deployed in an urban
setting. In one embodiment, the surveillance architecture comprises
one or more nodes 100 communicating through a network 104 via one
or more communication links 108.
[0066] The network 104 allows communication between one or more
nodes 100 to occur and may be any type of communication network or
path now know or later developed. The network 104 may comprise
various communication links 108 including wired and wireless links
and utilize various communication protocols. In one embodiment, the
network 104 is a packet switched network such as an Internet
Protocol (IP) network. Any packet based communication protocol,
known or later developed, may be used. This includes connection
based protocols such as Transmission Control Protocol (TCP), frame
relay, and Asynchronous Transfer Mode (ATM). This also includes
connectionless protocols such as User Datagram Protocol (UDP). It
is contemplated that the network 104, or a portion of it, may also
be a circuit switched network in one or more embodiments and that
communications between nodes may be encrypted, such as through one
or more Virtual Private Networking (VPN) connections to secure
communications across the network.
[0067] Each node 100 communicates through the network 104 via one
or more communication links 108. The communication links 108 may
each represent one or more independent communication links to a
network 104 thus allowing each node 100 to have redundant
communication links 108. The communication links 108 may be any
communication link capable of carrying data now know or later
developed. For example, the communication link 108 may comprise
electrical, optical, or other cable. The communication link 108 may
utilize physical layer topologies such as but not limited to
Category 5 or 6, SM or MM fiber, DSL and Long Range Ethernet. The
communication link 108 may also be a wireless communication link
such as a cellular or other wireless link. Wireless communication
links 108 may utilize physical layer topologies such as but not
limited to 802.11/b/g, WiMAX, EVDO, GPRS, Long Range Ethernet, and
DSL as well as any other wireless protocol capable of carrying data
now know or later developed. It is contemplated that these wireless
connections or networks may operate across on one or more
frequencies capable of supporting data communication such as
cellular frequencies, the 4.9 GHz public safety frequency, licensed
and unlicensed wireless (e.g. 70 GHz and 90 GHz), 2.4 GHz, and 5.8
GHz, and other microwave and satellite communication frequencies
among others. Wireless connections may also comprise optical
wireless connections, such as a laser or other light based
communication. It is noted that, as described regarding the network
104, any communication protocol now know or later developed whether
packet switched, circuit switched, connection based,
connectionless, or otherwise may be used to facilitate
communication via the communication link 108.
[0068] FIG. 2A is a block diagram illustrating an embodiment of the
peer to peer surveillance architecture where each node is connected
through one network, similar to the above. FIG. 2B is a block
diagram illustrating an embodiment of the surveillance architecture
where each node 100 is connected through more than one independent
network 104. In addition, the networks 104 themselves may be
connected by a communication link 108 as well. Thus, communications
to and from each node 100 may be routed through a single network or
both networks. The communication links 108 from each node 100 to
each network 104 provide redundancy allowing the surveillance
architecture to fully function even if one or more of the
communication links 108 are not operational. In addition, as stated
above, each communication link 108 may comprise one or more
independent connections, as desired, further increasing the
architecture's reliability.
[0069] Of course, a network 104 or networks may be configured in a
multitude of ways as is well known in the art. In one or more
embodiments, the network 104 may be a single switch or router such
as in a local area network, or may include one or more switches,
routers, and other devices, such as a wide area network or the
Internet. It is noted that nodes 100 may also communicate directly
through one another rather than through one or more other devices.
For example, two nodes 100 may have a direct wireless connection
between one another such as an ad hoc 802.11/b/g connection or a
direct cable connection. It is contemplated that the nodes 100 may
communicate with a network through another node in one or more
embodiments.
[0070] In one or more embodiments, each node 100 may be connected
to every other node through a logical connection, such as for
example, nodes connected to one another in an IP or other packet
switched network. Generally, a logical connection may be thought of
as the end to end connection which allows data from a source to
reach its proper destination as it travels across one or more
physical or wireless connections. The term virtual matrix switch as
used herein refers to the logical connections that allow
communication between the nodes 100 of a surveillance system.
[0071] The virtual matrix switch allows surveillance information to
be communicated between individual nodes 100, but also supports
multicasting surveillance information to a plurality or all of the
nodes regardless of the underlying physical or wireless connection
type. When connected through a virtual matrix switch, each node 100
will be in a virtual or logical network with only its peer nodes in
one or more embodiments. To illustrate, in one embodiment, each
node 100 is connected to peer nodes by one or more networks and
communication links. Though these networks and communication links
may be public or private networks and communication links shared by
other devices, the virtual matrix switch provides a virtual or
logical network which only the nodes 100 are part of Communications
within the virtual matrix switch may be encrypted, such as through
GRE tunneling or VPN connections, in some embodiments.
[0072] FIG. 3 illustrates an embodiment of a node 100. In one or
more embodiments, a node 100 may comprise any combination of one or
more processors 304, memory 308, and storage 312 that is capable of
processing, and executing machine readable code from the memory
308, storage 312, or both in one or more embodiments. Generally,
the processor 304 may be any device capable of executing machine
readable code and transmitting and receiving data. The memory 308
and server storage 312 may be any data storage device or devices
capable of storing data. The memory 308 and storage 312 will
typically allow both reading and writing data, however, in some
embodiments at least a portion or all of either the memory 308 or
storage 312 may be read only. It is noted that in some embodiments,
memory 308 or storage 312 alone will be sufficient to store any
data or machine readable code required by the node 100 and that
because of this, not all embodiments will require both memory 308
and storage 312.
[0073] In some embodiments, the machine readable code controls the
operation of the nodes 100. The machine readable code may be one or
more programs such as an operating system running one or more
applications. The machine readable code may also provide
compression and decompression of surveillance information as will
be described below. In one embodiment, the machine readable code is
configured to allow a node 100 to communicate by unicast,
multicast, or broadcast over a virtual matrix switch.
[0074] In one or more embodiments, a node 100 comprises one or more
transceivers 320 configured for two-way communication in that each
transceiver may receive and transmit information or data to one or
more other nodes 100 through one or more communication links 108,
one or more networks 104, or a combination thereof. A transceiver
may be configured to communicate by unicasting, multicasting, or
broadcasting information through one or more wired or wireless
connections. In some embodiments, one or more of the transceivers
320 may only transmit or only receive data. It is contemplated that
a transceiver 320 may also communicate with other external devices
as well as nodes 100.
[0075] In one or more embodiments, the one or more transceivers 320
may be connected to one or more communication links 108. As stated
above, the communication links 108 may be physical or wireless
links and may utilize one or more communication protocols.
[0076] As stated, wireless links in one or more embodiments may
also comprise a cellular link using various communication
protocols. For example, a transceiver 320 may be configured to
communicate through a TDMA, CDMA, FDMA, or other cellular network.
A cellular communication link 108 allows for long range wireless
communication and provides the advantage of network availability
even in remote areas. Though cellular communication links 108 may
have limited bandwidth, the peer to peer surveillance architecture
provides data compression to overcome this limitation as will be
discussed further below. It is contemplated that a wireless
communication link 108 may comprise wireless communication with one
or more satellites and that wireless communication may be
accomplished through one or more antenna 324 if desired. The
antenna 324 may be internal to the node 100 or may be an external
antenna connected to the node 100.
[0077] As stated, each node 100 may have one or more communication
links 108 for redundancy. This may be accomplished by configuring a
node 100 with more than one transceiver 320, or by configuring a
node with a single transceiver capable of having more than one
communication link. Only one communication link 108 is necessary
for communication, thus any additional communication links 108 may
be used to increase available bandwidth such as by simultaneously
utilizing all available communication links 108 to transmit data,
receive data, or both. However, a node 100 may also be configured
to utilize the additional communication links 108 only when the
currently used link or links is damaged or fails. Also, a node 100
may be configured to choose which communication link 108 to use
based on a predetermined order or based on the available bandwidth,
latency, or other characteristic of the links.
[0078] It is contemplated that any combination of communication
links 108 may be used by a single node 100. For example, a node 100
may have an IP communication link 108 through wired Ethernet, a
cellular communication link, and a wireless 802.11 link
simultaneously. One or more of these communication links 108 may be
used simultaneously or may remain unused (i.e. inactive) unless one
or more of the other links is damaged or fails.
[0079] In one embodiment, the nodes 100 communicate through a
communication link 108 using IP based communication. IP networks
are inherently reliable and may be configured to automatically
route data through alternate links based on network congestion or
availability. IP based communication also allows multicasting which
may be used to reduce bandwidth utilization. In addition, a node
100 communicating via IP may communicate to or through any IP based
device or network including the worldwide Internet. This allows
nodes 100 to communicate around the world with very little expense.
Thus, IP networks are well suited for a surveillance application,
however, it is noted that the peer to peer surveillance
architecture may be used with any type of network or communication
protocol.
[0080] In one or more embodiments, a node 100 also comprises a
power source 316. The power source 316 provides power to the node
100 so that it may be used without being connected to an electric
power grid. The power source 316 may be any device capable of
providing sufficient power for a node 100. Such devices include but
are not limited to batteries, solar panels, wind turbines, and
generators or a combination thereof. In one embodiment, a node 100
has a power source 316 comprising one or more batteries and a solar
panel which recharges the batteries. In another embodiment, a
generator is provided which may power to node 100 directly or be
used to recharge any batteries the node may have. The generator or
other power supply may be refueled periodically or as necessary to
provide power. It can thus be seen that a node 100 with a power
source 316 and a wireless communication link 108 may be quickly and
easily deployed virtually anywhere.
[0081] Components of the nodes 100 such as the processor 304,
memory 308, storage 312, or transceivers 320 may communicate with
one another in one or more embodiments. In addition, the power
source 316 component may be configured to communicate power
utilization, power reserves, battery condition, or other
information in one or more embodiments. Components of the nodes 100
also include capture devices, screens, and control interfaces as
will be described further below. It is contemplated that other
devices may be components of a node 100 such as but not limited to
one or more lights or speakers.
[0082] In one or more embodiments, communication between components
takes place through one or more optical, electrical, or wireless
data connections. These connections may allow unidirectional or
bi-directional communication between the components. It is
contemplated that in some embodiments, not every component will be
connected to every other component.
[0083] In one embodiment, only the processor 304 is connected to
the memory 308, storage 312, and one or more transceivers 320. In
another embodiment, some components may be connected to more than
one other component. For example, the one or more transceivers 320
may be connected to the memory 308, storage 312, or both, in
addition to being connected to the processor 304. In this manner,
the one or more transceivers 320 may utilize the memory 308,
storage 312, or both without communicating with the processor 304.
It is contemplated that in some embodiments, one or more components
may communicate within the node through a connection with another
component.
[0084] In some embodiments, the components described above may be
"off the shelf" products from various manufacturers. For example, a
node may be a computer having a processor 304, memory 308, storage
312, and one or more transceivers 320 installed on a motherboard.
In other embodiments, the components may be provided by one or more
independent "off the shelf" products. For example, the processor
304, memory 308, and storage 312 may be a computer or video
processing device connected to an external camera, and one or more
external transceivers 320. The processor 304 may for example be a
stand alone device which accepts video as an input and compresses,
analyzes or otherwise processes the video and outputs the result.
The storage 312 may be comprise one or more stand alone storage
devices such as, for example, a set of hard drives, a RAID array,
or USB or Firewire storage. It is contemplated that there may be
more than one of each component for redundancy. Where more than one
of the same component is included in a node 100, it is contemplated
that each may be used simultaneously or that one or more redundant
components may remain inactive until needed.
[0085] It is contemplated that a node 100 may be located in mild
environments and harsh or extreme environments (e.g. extreme heat,
cold, moisture, or wind). Thus, each node 100 may be configured
with various enclosures or structures capable of supporting its
components. For example, a node 100 used indoors may have an
enclosure as simple as an equipment rack or shelf. Alternatively,
an indoor enclosure may fully enclose the components of a node 100
such as with a metal, plastic, or other rigid cover. A node 100 for
outdoor use may have a more rugged enclosure such as by using
stronger or thicker materials. In addition, some enclosures may
have wind, water, ice, heat or other weather resistance. This may
be accomplished by insulating the enclosure and by including one or
more seals to prevent weather infiltration. Enclosures may include
structures that do not fully enclose a node's components, and may
include structures now known and later developed, such as described
below.
[0086] Generally, an enclosure will be a single continuous rigid
structure which supports all the components of a node 100. A
component of a node 100 will be considered to be supported by the
enclosure as long as the component is ultimately supported by the
enclosure. A component may be supported by the enclosure through
one or more other structures. For example, a component held within
or attached to its own case or support is considered supported by
the enclosure as long as its case or support is attached to the
enclosure.
[0087] Of course, in some embodiments, some components may not be
supported or attached to an enclosure. For example, a camera may be
attached directly to a wall rather than to an enclosure. In
addition, some enclosures may have portions that may be removably
attached to allow for repair or replacement. It is noted that, such
enclosures are still considered to be a single continuous structure
because each removably attached portion will be attached when the
node is in operation. Various embodiments of enclosures will be
described further below.
[0088] Types of nodes will now be described. These nodes may
include the basic components of and may be configured according to
the various embodiments of the nodes 100 described above. In
addition, the following nodes generally include additional
components suited for one or more specific tasks in their various
embodiments.
[0089] FIG. 4 illustrates an embodiment of a capture node 400 of
the peer to peer surveillance system. Generally, a capture node 400
is a node configured to capture surveillance information from one
or more target areas. A target area is generally an area where
useful surveillance information may be gathered, but may be any
area or location. Surveillance information may include video,
audio, or both, as well as information from specific sensors such
as voltage, current, temperature, radiation, motion, or light
sensors. Surveillance information may also include information or
data derived from the above information, or data received from an
external source such as wireless stock ticker, traffic, GPS, or
weather data.
[0090] In one or more embodiments, a capture node 400 may comprise
a processor 304, memory 308, storage 312, power source 316, one or
more transceivers 320, one or more antenna 324, or various
combinations thereof as described above. Regardless of the
configuration, a capture node 400 will generally include one or
more capture devices 404 as one of its components in one or more
embodiments. Once captured, surveillance information may be
transmitted from the capture node 400 via its one or more
transceivers 320.
[0091] A capture device 400 is a device configured to receive,
record, or otherwise capture surveillance information. The capture
device 404 may be integrated with one or more components of the
capture node 400 in one or more embodiments. For example, the
capture device 404 may be a video capture board. The capture device
404 may also be a stand alone device in some embodiments. For
example, the capture device 404 may be a camera connected to the
processor 304 of the capture node 400. It is contemplated that the
capture device 404 may be movable (e.g. a pan, tilt, and zoom
camera) to focus on specific events or areas periodically, in
response to an event, or as desired.
[0092] As stated, there is a wide variety of surveillance
information, and thus, a similarly wide variety of capture devices
404 are contemplated. To illustrate, the capture device 404 may
also comprise one or more cameras, microphones, temperature
sensors, radiation detectors, motion detectors. In addition, the
capture device 404 may be a data input such as for receiving
telemetry from other devices. For example, the capture device 404
may be a radio receiver configured to receive traffic, weather,
GPS, or even stock ticker information. The capture device 404 may
be a voltage or current sensor such as for detecting voltage or
current usage or for detecting a completed circuit such as in
contact sensors for security systems.
[0093] In one embodiment, the capture node 400 is configured to
capture video surveillance information. As such, the capture node
400 has a capture device 404 comprising a video camera. The camera
may be fixed or may have point, tilt, and zoom capability and may
provide a video stream of a target area. Pan, tilt, and zoom
cameras may be moved to focus on different areas as desired or
according to a predetermined surveillance plan. In addition, such a
capture node 400 may be programmed to automatically focus its
camera (or other capture device) on an area in response to an event
or notification or be remotely controlled such as through an
external device or node in communication with the capture node
400.
[0094] In one or more embodiments, a capture node 400 may compress
the surveillance information it is transmitting such as to save
storage space, to save bandwidth for multiple streams of
information, or to allow transmission of data across low bandwidth
communication links. In one embodiment, a capture device 404 sends
surveillance information to a processor 304 in the capture node
400. It is noted that the processor 304 may process the
surveillance information in a number of ways. For example, the
processor 304 may analyze the information, as will be discussed
further below, or may compress the information.
[0095] In one or more embodiments, compression may occur through a
compression algorithm or software comprising machine readable code
stored on the memory 308, storage 312, or both. Any compression
algorithm, now known or later developed, that can be executed by
the processor 304 may be used. Some examples of compression
algorithms for various types of data include: H.261, H.264, G.711,
ZIP, LZIW, JPG, MPEG-1, MPEG-2, and MPEG-4. It is noted that the
compression algorithm used will depend on the type of information
to be compressed and the desired data rate, quality, or both of
surveillance information after compression.
[0096] With regard to video surveillance, compression/decompression
algorithms or software known as a video codec, may be used to
accept analog video and then digitize, compress, and packetize it
so it may be sent to its destination. Video compression and
decompression requires significant hardware and software
capabilities. In a worst case situation, where a video scene has
simultaneous background and foreground scene complexity (e.g.
shapes and patterns that are dissimilar in color, texture, shape,
hue, etc. . . . ) and simultaneous 3-axis camera movement (e.g.
pan, tilt and zoom all at the same time), along with 3-axis target
movement (e.g. a suspect or vehicle moving at or away from the
camera at a diagonal), the codec may be required to process as much
as 6,400,000,000 instruction sets per second or more. Traditional
security industry codecs will drop frames or produce DCT (Discrete
Cosine Transfer) blockiness, or both, when subjected to such harsh
conditions because traditional codec simply cannot process the
instructions quickly enough.
[0097] Furthermore, conversion from analog to digital is done in
"real time" where massive amounts of analog data are converted to
digital in real time. If the information cannot be processed
quickly enough, some of the data is thrown away (e.g. dropped
frames) during the compression process. The difference between the
theoretical real time transformation and the actual transformation
(the time delta) is called latency. A respectable latency (from the
capture of video to its subsequent viewing) for 4 CIF images at 30
frames per second is under 180 milliseconds. If compression drops
frames or introduces blockiness, the surveillance information is
largely worthless.
[0098] Thus, in one or more embodiments, a capture node 400 may
include an ASIC (Application Specific Integrated Circuit) to meet
the video compression requirements defined above. For example one
or some of the processors 304 of a capture node 400 may be ASICs
designed to compress video according to one or more types of
compression as discussed above. For example, the ASIC may compress
(and/or decompress) video according to one or more video codecs. It
is contemplated that video and other surveillance information may
be compressed and decompressed through one or more ASICs and that
other nodes, besides capture nodes 400, may utilize ASICs in one or
more embodiments. It is contemplated that compression and/or
decompression of surveillance information may be performed, as
described herein, on any node of the peer to peer surveillance
architecture.
[0099] Each capture node 400 may transmit multiple streams of video
or other surveillance information, and each stream's network
utilization may be managed differently. For example, a capture node
400 may set a first stream to 1 Mbps and UDP multicast, a second
stream may be set for 256 kbps and unicast, and so on. The network
utilization of each stream of surveillance information may be set
based on network capabilities (e.g. available bandwidth) or other
conditions such as the monetary cost of transmitting surveillance
information over particular communication links. It is noted that
other nodes 100 of the peer to peer surveillance architecture may
transmit multiple streams of surveillance information as well.
[0100] In some embodiments, the capture node 400 may be configured
to store captured surveillance information in addition to or
instead of transmitting it. The surveillance information may be
compressed prior to its storage and may be written to the capture
node's 400 storage 312, such as magnetic, optical, or flash media,
if desired. Various forms of storage 312 may be utilized as will be
described further with regard to the content storage nodes of the
peer to peer surveillance architecture. A capture node 400 may
transmit live surveillance information, stored surveillance
information, or both alone or simultaneously, if desired.
[0101] It is contemplated that capture nodes 400 may be configured
to analyze surveillance information and provide one or more
notifications if a particular event is detected. For example, a
capture node 400 may be configured to execute analysis software.
This software may execute on one or more processors 304 of the
capture node 400. Analysis of surveillance information and
notifications are described further below with regard to the server
nodes of the peer to peer surveillance architecture.
[0102] In one embodiment, the capture node 400 may be a cellular
node. In this embodiment, at least one transceiver 320 is
configured to communicate through a cellular communication link or
network. Cellular connections may have reduced or limited bandwidth
and thus compression may be used to compress surveillance
information before it is transmitted. Of course, where there is
sufficient bandwidth, uncompressed surveillance information may be
transmitted.
[0103] Video surveillance information from will generally be
compressed prior to transmission over a cellular connection due to
its higher bandwidth requirements. As stated above, video
compression may require significant processing power to provide
video with a high frame rate, no artifacts, and no dropped frames.
This is especially so on reduced bandwidth connections such as
cellular connections. Thus, though not required in all embodiments,
it is contemplated that a cellular capture node 400 or other node
having a cellular transceiver may include an ASIC configured to
compress video suitable for transmission over a cellular
connection.
[0104] It is noted that a cellular transceiver 320 may communicate
to other nodes 100 through the virtual matrix switch described
above if desired. Thus, captured surveillance information may be
unicast, multicast, or broadcast to other nodes 100 through a
cellular connection. This is advantageous in a cellular connection
(or other reduced bandwidth connections) because multicast or
broadcast transmissions allow multiple or all the nodes 100 to
receive the same surveillance information from a single
transmission stream.
[0105] A cellular capture node 400, or other node having a cellular
transceiver, also has the advantage of being capable of having
network connectivity in remote locations because its cellular
transceiver 320 may communicate over long distances wirelessly.
Thus, it is contemplated that some embodiments of a cellular node
may include one or more power sources 316 to allow the cellular
capture node to operate without any wired connections. The cellular
node may then be quickly and easily deployed nearly anywhere by
simply placing it where it can capture surveillance information
from one or more desired target areas.
[0106] FIG. 5 illustrates an embodiment of a viewing node 500.
Generally, a viewing node 500 is used to view live and stored
surveillance information as well as control playback of live or
stored surveillance information. A viewing node 500 may also be
used to select the surveillance information to be viewed as well as
various representations or arrangements of the surveillance
information. For example, the desired live or stored video
surveillance from one or more nodes may be selected and viewed on
the viewing node 500. In addition, the viewing node 500 may display
other surveillance information in a table, graph, pie chart, text,
or other arrangement.
[0107] It is contemplated that a viewing node 500 may also display
or emit various alarms or warnings. For example, audible warnings,
email alerts, and notifications of network or capture node failures
may be presented visually or audibly via a viewing node 500. These
alarms or warnings may result from one or more notifications
transmitted by other nodes 100, as described below, and received by
the viewing node 500.
[0108] In one or more embodiments, a viewing node 500 may comprise
a processor 304, memory 308, storage 312, power source 316, one or
more transceivers 320, one or more antenna 324, or various
combinations thereof as described above. In addition, the viewing
node 500 is a node and thus may comprise any configuration
described above with regard to FIG. 3. A viewing node 500 may
include one or more screens 504, control interfaces 508, or both as
components in one or more embodiments. It is contemplated that a
viewing node may be a personal computer (PC), smart phone (e.g.
BlackBerry, iPhone), or personal media player in one or more
embodiments. As these devices are nearly ubiquitous, a further
advantage of the invention is that surveillance information from
any node may be viewed virtually anywhere.
[0109] The screen 504 may be a high resolution color display such
as a computer monitor or LCD screen. Any type of screen 504 may be
used with the viewing node 500. This includes but is not limited to
television monitors, black and white monitors, plasma and LCD
screens, and projectors.
[0110] In some embodiments, surveillance information from other
nodes 100 is displayed on a screen 504 in a viewing pane 512
comprising a portion of the screen. As stated, the nodes 100 may be
various combinations of capture, server, storage, and other nodes
described herein. It is contemplated that there may be one or more
viewing panes 512 displayed on a screen 504 and that each viewing
pane 512 may display surveillance information from one or more
nodes 100. A user may be provided a list of nodes 100 and be
allowed to select which node or nodes he or she wishes to view.
[0111] In one embodiment, the viewing panes 512 are displayed in
various layouts such as 2.times.2, 3.times.3, 4.times.4, and
5.times.5. In other embodiments, the viewing panes 512 may be
displayed according to a custom layout, such as shown in FIG. 5.
For example, important viewing panes 512 may be displayed larger
than other viewing panes. The viewing panes 512 to view may be
selected from a list, map, or hierarchy of all available viewing
panes. In addition, viewing panes 512 may be assigned to one or
more groups and entire groups of viewing panes may be selected for
viewing simply by selecting the desired group. This may be used to
view surveillance information from an entire site or salvo of nodes
100.
[0112] In one or more embodiments, surveillance information will be
received by the viewing node 500 through one or more transceivers
320 connected to one or more communication links 108. It is noted
that each viewing node 500 may also transmit data such as to
initiate communications with other nodes 100, request surveillance
information, and control capture node cameras or other capture
devices. The viewing node 500 may also output or export
surveillance information so that it may be recorded by an external
device. For example, video surveillance information may be exported
to a video file, or may be output to a VCR, DVD, or other recording
device or media for recording. It is contemplated that surveillance
information may be exported to industry standard formats and be
watermarked or signed to ensure its authenticity. Other nodes may
also export surveillance information.
[0113] As stated, surveillance information may be uncompressed or
compressed. Where the surveillance information is compressed, the
viewing node 500 may decompress the surveillance information before
it is viewed. This may occur by the processor 304 executing one or
more decompression algorithms on the incoming surveillance
information.
[0114] Of course, the proper decompression algorithm must be
determined and such determination may occur by a handshake
communication where one node notifies another of the algorithm it
is using to compress information. The proper algorithm may also be
determined by a node analyzing the incoming surveillance
information. In some embodiments, a node may present the
compression types it is capable of decompressing and the source
node may select a compression algorithm accordingly. In essence,
nodes may agree on which compression algorithm to use. It is
contemplated that the communication of any type of surveillance
information between any nodes of the peer to peer surveillance
architecture may be facilitated by the handshake communication.
[0115] In addition to viewing panes 512, a viewing node 500 may
display surveillance information on a timeline. In this manner,
surveillance information is generally displayed according to the
time it was captured or recorded. The timeline may have a
resolution from one second to one month, but this range of
resolution may be increased or decreased in one or more
embodiments. The timeline provides the advantage of allowing
surveillance information to be viewed together with the time it was
capture or corresponding to other times. In this manner, more than
one stream or type of surveillance information may be viewed such
that any surveillance information for a particular time may be
viewed together. For example, a video may be viewed synchronized
with telemetry information, audio, or even other video. The
timeline may be scrolled across the screen 504, or set to a
specific start time, end time, or both.
[0116] In one or more embodiments, a viewing node 500 may include
one or more control interface 508. A control interface 508 has the
advantage of specific buttons, switches, or other controls not
commonly found on a keyboard or mouse. In one embodiment, a control
interface 508 may have media player type controls such as play,
pause, fast forward, rewind, single frame advance or reverse, slow
motion forward or reverse play, and stop. In addition a jog shuttle
may be provided in some embodiments. The jog shuttle may be a
circular knob which, when turned, allows fine control of the speed
of the forward or reverse playback of surveillance information.
[0117] The playback or display of surveillance information on each
viewing pane 512 may be individually controlled by the control
interface 508. In addition, the controls may be used to control
other aspects of viewing such as the volume of audio, or the
magnification (i.e. zoom) of video. In one or more embodiments,
signals comprising instructions to control the display of
surveillance information, are generated from the operation of the
control interface 508 and received by control interface's attached
node.
[0118] In one embodiment, one or more of the viewing panes 512 is
used to view video surveillance information. In this embodiment,
available video surveillance information may be selected for
viewing. The video surveillance information may be listed for
selection with a text or other label, a thumbnail, or both. Each
list item corresponds to the surveillance information provided by a
particular node 100 or nodes. For example, a list item labeled
"Building 10 Northeast Corner" may correspond to a capture or other
node on the northeast corner of Building 10. Based on this, a user
may then choose one or more videos for viewing as he or she
desires. It is noted that other types of surveillance information
may be similarly listed for selection with a text or other label,
thumbnail, summary, or combination thereof.
[0119] In one or more embodiments, a viewing node 500 may be
configured to store the last 30 seconds of surveillance information
received by the viewing node on its storage 312, memory 308, or
both. For example, the last 30 seconds of live video surveillance
may be stored so that a user may easily review the last 30 seconds
of events. In some embodiments, this storage of video or other
surveillance information is temporary and may be more or less than
30 seconds if desired.
[0120] FIG. 6 illustrates an embodiment of a content storage node
600. Generally, a content storage node 600 is configured to store
surveillance information captured or transmitted from other nodes
100, and to transmit stored surveillance information to other
nodes. These other nodes 100 may be any type of node including but
not limited to capture nodes, viewing nodes, or even other storage
nodes.
[0121] In one or more embodiments, a content storage node 600 may
comprise a processor 304, memory 308, storage 312, power source
316, one or more transceivers 320, one or more antenna 324, or
various combinations thereof as described above. Generally, content
storage nodes 600 will include storage 312 to store the
surveillance information received from other nodes 100.
[0122] The storage 312 in one or more embodiments is one or more
hard drives. The hard drives may be configured in a RAID
configuration, such as RAID 1 or RAID 5, in one or more
embodiments. Of course various forms of storage 312 may be used.
For example, the storage 312 may be internal or removable optical,
magnetic, or flash media. In some embodiments, the storage 312 may
be written to only once such as with DVD-R or CD-R technology. In
other embodiments, the storage 312 may allow repeated reading and
writing such as with a hard drive or other magnetic media.
[0123] A content storage node 600 is capable of storing both
compressed and uncompressed surveillance information. For example,
the content storage node 600 may receive compressed video from
another node 100. Where compressed surveillance information is
received it may be directly stored or, if desired, the content
storage node 600 may decompress the information before it is
stored. In addition, uncompressed surveillance information received
by the content storage node 600 may be directly stored or
compressed before it is stored. Compression will generally occur
through one or more compression or decompression algorithms
executed on the processor 304 as described herein. In addition,
content storage nodes 600 may also go through a handshaking process
with other nodes as described above. In this manner, the content
storage nodes 600 may agree upon a compression/decompression
algorithm for a particular transmission of surveillance
information.
[0124] A content storage node 600 may be configured to transmit
stored surveillance information in one or more embodiments.
Surveillance information may be transmitted in compressed or
uncompressed form regardless of how it has been stored. In
addition, it is contemplated that surveillance information stored
according to one type of compression may be recompressed with
another type of compression prior to its transmission. This is
advantageous in that it allows surveillance information to be
compressed with another type of compression that may have reduced
bandwidth requirements. In addition, some nodes may not support all
compression types. Thus, the content storage node 600 may
recompress surveillance information according to a compression type
supported by the nodes it is communicating with. Of course,
compressed surveillance information may be decompressed and
transmitted as uncompressed surveillance information.
[0125] One advantage of a content storage node 600 is that
surveillance information may be stored in multiple physical
locations. For example, a capture node may transmit surveillance
information to a plurality of content storage nodes 600 in various
locations. In this manner, the surveillance information is
preserved even if one or more of the content storage nodes 600 is
damaged or destroyed. Similarly, surveillance information may be
retrieved from multiple physical locations. For example, if
connectivity to a geographic region, building, office, or other
physical location is reduced or unavailable, the desired
surveillance information may be retrieved from a content storage
node 600 in a different physical location.
[0126] FIG. 7 illustrates an embodiment of a server node 700.
Generally, a server node 700 is configured to provide services
related to authenticating access to and analyzing surveillance
information. The server node 700 may be configured to authenticate
requests for or access to surveillance information, analyze live or
stored surveillance information, or both.
[0127] In one or more embodiments, a server node 700 may comprise a
processor 304, memory 308, storage 312, power source 316, one or
more transceivers 320, one or more antenna 324, or various
combinations thereof as described above. In addition, the server
node 700 is a node and thus may comprise any configuration
described above with regard to FIG. 3.
[0128] In one embodiment, the server node 700 provides
authentication capability. The server node 700 may use commercial
software to accomplish this, such as Active Directory
authentication in Microsoft Windows. Of course, the server node 700
does not have to utilize Active Directory as it is contemplated
that any system, now known or later developed, where one or more
user or other access accounts may be managed and authenticated
through one or more server nodes 700 may be used with the peer to
peer surveillance architecture.
[0129] In a peer to peer configuration, the server node 700 may
validate a user's or a device's credentials and allow or deny
access to the peer to peer surveillance architecture accordingly.
In one or more embodiments, this may occur by the server node 700
returning a key or code which allows access to other nodes 100 of
the surveillance architecture. Each node may be configured to
respond only to one or more particular keys. It is contemplated
that, in one or more embodiments, the keys may be generated through
use of digital signatures, encryption, hashing algorithms, or both,
now known or later developed, such as in a public key
infrastructure.
[0130] The server node 700 may also be used to manage user or other
access accounts such as by assigning access privileges or
restrictions to a user other account or to a group of accounts. The
privileges or restrictions may be set on the server node 700 to
vary depending on the particular node 100 or group of nodes being
accessed.
[0131] In embodiments of the peer to peer surveillance architecture
where authentication is required for access, it is contemplated
that a plurality of server nodes 700 providing authentication
services may be used for redundancy. These server nodes 700 may be
deployed in different physical locations to increase reliability as
described above. It is contemplated that changes to user or other
accounts may occur through any server node 700 which then may
update other server nodes within the surveillance architecture
accordingly.
[0132] In one embodiment each node 100 may be configured with one
or more access codes or usernames and passwords which allow access
to a node if correctly presented to the node. This embodiment does
not require a server node 700 as each node 100 may authenticate
access requests itself. One or more server nodes 700 may be
utilized to manage user or other access accounts for each node 100
in this embodiment however.
[0133] One advantage of authentication is that each user or device
may have their own accounts. This allows different access levels
depending on the user or device and prevents the entire peer to
peer surveillance architecture from being compromised if one or
more access codes are revealed. Access codes may be changed as
desired to further enhance the security of the surveillance
architecture. Though this may be implemented at each node 100, use
of one or more server nodes 700 providing authentication services
has several advantages. One advantage is that accounts and access
codes may be created, modified, or deleted at any server node 700.
Each server node 700 may synchronize account and access code
information to provide full redundancy for the authentication
services.
[0134] Another advantage is that the server nodes 700 may be
configured to log and audit access requests or other authentication
activities. All user and system activity may be collected in the
audit log along with the time at which the activity occurred. For
example, a user's viewing of live or recorded surveillance
information may be logged in the audit log. In this manner, a
security audit may be performed on the peer to peer surveillance
architecture to ensure its integrity. The audit log may be mirrored
or copied to other server nodes 700, content storage nodes, or
other nodes having storage for redundancy.
[0135] Server node based authentication is particularly useful in
large surveillance architectures, such as city-wide surveillance
architectures with hundreds to thousands of users and nodes.
Managing access to individual nodes 100 may occur at each node,
such as by setting up user or device accounts on each node.
However, it is much easier to manage access to the nodes 100,
especially in large surveillance architectures, from the one or
more server nodes 700.
[0136] In one or more embodiments, a server node 700 may be
configured to provide analysis of surveillance information it
receives. This analysis will generally be performed through
analysis software or machine readable code executing on one or more
processors 304. With regard to video surveillance information, a
server node 700 may accept an incoming video stream to detect one
or more events such as by analyzing the video to detect or
recognize motion, images or particular events. In addition, the
server node 700 may have software capable of creating virtual
tripwires, detecting objects that have been left behind by one or
more subjects. Any analysis software may be used, and thus a
variety of analysis may be performed including license plate and
facial recognition. Software requiring specific video formats may
be utilized as well because the server node 700 may request video
of a specific format, such as a specific video format or
compression type, from the other nodes 100. In addition, it is
contemplated that the server node 700 may convert incoming video to
a format usable by the analysis software if necessary.
[0137] The server nodes 700 may also provide analysis of other
surveillance information to detect particular events therein. For
example, weather information may be collected by various capture
nodes and analyzed to track temperatures, wind speed, humidity, or
other data for a geographic area. Each server node 700 may be
configured to perform one or more analysis services of other server
nodes 700. In this way, redundancy is provided for any analysis
service used by the peer to peer surveillance architecture. In
addition, one or more server nodes 700 may work together to analyze
a particular stream or set of surveillance information. The results
of the analysis of surveillance information may be stored on the
server node 700, content storage nodes, or even other nodes.
[0138] In one or more embodiments, users may setup triggers which
are activated when particular events are detected. For example, one
or more server nodes 700 may be configured to notify one or more
users when a particular event is detected. Notification may occur
by email, phone, text messaging, on screen dialogs, sounds, or
other methods. It is noted that each server node 700 may provide
different analysis services and have different triggers and
notification settings. One or more content storage nodes may be
configured with analysis, triggering, and notification capabilities
as well, in one or more embodiments.
[0139] In addition to notifying users, other nodes may be notified
when particular events occur. For example, capture nodes with
cameras may be notified to zoom in or focus on an area when a
virtual tripwire is tripped or when a particular event is detected.
Notification of another node may occur by one node communicating a
notification message including information regarding an event to
another node. The detection of an event includes recognizing
animate or inanimate objects and may trigger further analysis by
the same or one or more other server nodes 700. It is noted that
any node may provide notification, such as for example, a node
providing a notification of a communication link failure, or
hardware or software failure.
[0140] It is contemplated that the peer to peer surveillance
architecture may include one or more hybrid nodes in some
embodiments. A hybrid node may combine components of the types of
nodes described above. For example, in one embodiment, a capture
node may include storage as described with regard to a content
storage node, or vice versa. In other embodiments, the capture node
may include a screen for viewing captured surveillance information,
or may provide authentication services, analysis services, or both.
In yet another embodiment, a viewing node may be configured to
provide analysis services. The above listing of exemplary hybrid
nodes is not intended to be exhaustive or limiting, as a wide
variety of hybrid nodes may be formed from the components of the
nodes disclosed herein.
[0141] As stated, peer to peer means that each node within the
surveillance architecture operates independent from (i.e. does not
rely on) its peer nodes. In traditional surveillance systems, a
central control device or controller aggregates incoming
surveillance information and, if so configured, also sends control
instructions to its connected capture devices. This creates a
single point of failure because each capture device relies on a
single central controller in order to function. This also limits
the number of capture devices and simultaneous users to the
capacity of the control device. In contrast, the peer to peer
surveillance architecture does not rely on any central control
device as each node is independent.
[0142] To illustrate, failure to receive video surveillance from a
surveillance camera can be due to various causes. For example, the
cable from the camera may be damaged, the device receiving video
surveillance may malfunction, or the camera itself may be
malfunctioning. In a traditional system with central control, any
one of these problems prevents the capture and use of surveillance
information because the central controller is not receiving any
surveillance information.
[0143] With the peer to peer surveillance architecture herein:
where there is a damaged cable, a capture node may utilize one or
more redundant communication links; where a viewing node is
malfunctioning, a user may simply use another viewing node; and
where the capture node is malfunctioning a redundant capture node
at the same location may be used. As stated, a viewing node may be
a PC, smart phone, or personal media player in one or more
embodiments, and thus, switching to another viewing node is easily
accomplished within the peer to peer surveillance architecture.
[0144] Furthermore, capture nodes may store the surveillance
information they capture or transmit to other nodes for analysis,
storage or both. Thus, in the unlikely event that a user cannot
view surveillance information through a viewing node, the captured
surveillance information is not lost. Though the user is
temporarily unable to view the surveillance information, he or she
may still be notified by one or more server nodes analyzing the
information for particular occurrences, and the information may be
stored for later review by the user.
[0145] It is noted again that, users and viewing nodes (and any
other node) may be in different geographic locations and use more
than one completely independent network to communicate. Thus, the
failure of a cable or even an entire network in one or more
locations does not prevent the peer to peer surveillance
architecture from operating. For example, a single node may have a
cable Internet connection, a cellular connection, and an ISDN
connection.
[0146] The nodes themselves may have redundant components. For
example, a capture node may have more than one camera or other
capture device, or a content storage node may be configured with a
RAID storage array. It is contemplated that a node may be
configured such that each component has a backup or redundant
counterpart. Such redundancy is not available in traditional
systems.
[0147] A highly available surveillance system includes devices that
have a high Mean Time Between Failure (MTBF), and Mean Time Between
Critical Failure (MTBCF). As discussed above, the peer to peer
relationship between nodes ensures no loss of service during a
node, communication, or network failure. However, after a failure
and until the failed node, communication link, or network is fully
operational the peer to peer surveillance architecture may be
operating under less than optimal conditions. For example,
redundant communication links may have less bandwidth and more
latency, or be more expensive. Also, where there already has been a
failure, an additional failure may result in loss of surveillance
capability. Thus, the peer to peer surveillance architecture
provides another advantage in that it has a low Mean Time To Repair
(MTTR) in one or more embodiments.
[0148] As an initial matter, the nodes themselves may be configured
with components having a high MTBF and MTBCF to reduce failures and
the need for repairs. Various node configurations, protective
components, and enclosures may be used to protect node components
from environmental threats which may lower a component's MTBF or
MTBCF, such as high or low temperatures, power surges, lightning,
and humidity.
[0149] In addition, nodes may be configured to allow access by
qualified technical or other personnel. This access to a node is
highly advantageous in maintaining and repairing individual nodes.
In one or more embodiments, operating information including
information regarding hardware and software abnormalities or
failures may be stored by the nodes. This information can be used
to prevent node failures, such as by allowing preventative
maintenance to occur, as well as to optimize node performance. It
is contemplated that the nodes may have internal diagnostics and
may allow technicians or other personnel to access operating
information, change hardware or software settings, or run
diagnostics through a diagnostic connection with the node. The
diagnostic connection may be authenticated and occur through one or
more communication links, networks, or a combination thereof as
discussed above.
[0150] The diagnostic connection allows quick diagnosis over a
remote or direct connection to reduce a node's MTTR. Repairs, such
as changing hardware or software settings may be implemented
through the diagnostic connection as well. Where replacement
hardware is necessary, the diagnostic connection may be used to
quickly identify what hardware to be replaced.
[0151] It is noted that, because the nodes are independent, a
repair may occur simply by replacing a damaged node with a new one.
While the new node is in place, the damaged node may be diagnosed
and repaired. It is contemplated that configuration settings for a
node may be saved external to the node or exported from the node
and imported into a similarly configured node to allow for rapid
replacement of individual nodes.
[0152] In one or more embodiments, diagnosis of software or
hardware issues may occur through one or more diagnostic routines
or programs. Generally, these routines or programs input data into
one or more of a node's components and confirm that the
corresponding output from the components is as expected or within
an acceptable range for a properly functioning component.
[0153] The peer to peer surveillance architecture has another
advantage in that maintenance updates or upgrades may be performed
without impacting the overall surveillance architecture. This is
because each node may be individually updated or upgraded without
interrupting the operation of any other node. It is noted that, in
contrast to an unplanned failure, updates and upgrades may be
planned in advance so as to occur when operation of a particular
node is not crucial. Updates include firmware or other software
updates for a node's components, and may include replacement of
components with new revisions of the same. Upgrades generally may
be thought of as software or hardware replacements that increase
the node's or a particular component's capabilities or capacity,
reduce power consumption, or provide other benefits.
[0154] As stated various enclosures may be used to support and/or
protect the components of various nodes of the peer to peer
surveillance architecture. In one embodiment, enclosures may be
configured to protect node components from natural, man-made and
other hazards that could damage a node. For example, an enclosure
may provide protection from water, humidity, wind, temperature,
fire, radiation, electromagnetic interference, high voltage,
physical damage or a combination thereof. In one or more
embodiments, an enclosure may protect the components therein by
providing a physical barrier to one or more hazards. It is noted
that the enclosure is generally described herein with regard to a
surveillance node. However, it is contemplated that the enclosure
may be used with and benefit other surveillance hardware or
devices.
[0155] An enclosure may also provide an environmentally controlled
operating environment for a node's components. For example, an
enclosure may control humidity, temperature, dust or other
particulate concentrations, or a combination thereof for the
components of a node. This is advantageous in that it provides an
operating environment suited to the components. To illustrate, in
one embodiment, the enclosure controls the temperature within a
node to prevent temperatures that are excessively cold or
excessively hot for the node's components.
[0156] FIG. 8A illustrates an exemplary embodiment of an enclosure
804 for a node 100. As shown, the enclosure 804 is rectangular in
shape. It will be understood that the enclosure 804 may be various
shapes in one or more embodiments. For example, the enclosure 804
may be square, round, rounded, or comprise a combination of various
shapes. An enclosure 804 may also be various sizes. In one or more
embodiments, the size of an enclosure 804 may be determined based
on the components to be stored therein. The embodiment shown also
includes a dome 808 for a camera. It is noted that a dome 808 may
not be provided in embodiments without cameras.
[0157] The structure of an enclosure 804 may be formed from various
materials. Typically, the enclosure 804 will be a rigid structure
to allow the enclosure to support a node's components. For example,
the enclosure 804 may be formed from one or more metals, alloys,
plastics, carbon fiber, or a combination thereof. It will be
understood that other suitable rigid materials may be used as
well.
[0158] In addition, an enclosure 804 may be formed from materials
configured or selected to protect a node's components. For example,
one or more rigid materials, such as those described above, may be
used to protect components from physical hazards such as but not
limited to water, humidity, dust and other particulates, physical
impact or force, or a combination thereof. It is contemplated that
the enclosure 804 may be configured to withstand significant
physical impacts in some embodiments. For example, the enclosure
804 may be bullet proof/resistant. In addition, an enclosure 804
may be formed from materials, such as metallic or insulating
materials, that protect the components from other hazards such as
but not limited to radiation, temperature, electromagnetic
interference, and electrical charges.
[0159] In one or more embodiments, the enclosure 804 may be formed
from a multi-layered material. A cross section of such a
multi-layered material is illustrated in FIG. 8B. It is
contemplated that an enclosure 804 may be formed from various
rigid, insulating, protective and other layers of material. Each
layer may have the same or a different thickness. It will be
understood that the thickness of a layer may be selected based on
the desired protective characteristics, rigidity, or both. For
example, a thicker metal layer may provide increased rigidity. The
exemplary embodiment of FIG. 8B illustrates an enclosure formed
from a multi-layered material comprising a coating layer 816, an
aluminum layer 820, an insulating layer 824, and a foil layer
828.
[0160] It will be understood that each layer of material may be
included in an enclosure for one or more protective, insulating, or
other characteristics of the material. In the exemplary embodiment
of FIG. 8, the coating layer 816 may provide protection from UV
light, provide some thermal insulation from external sources of
heat, or both. The coating layer 816 may also protect other layers
from oxidation and be various colors. It is contemplated that the
coating layer 816 may be various paints or other coatings in one or
more embodiments.
[0161] The aluminum layer 820 may provide electromagnetic shielding
as well as provide a rigid physical structure to support components
of a node and to protect such components from physical damage. The
insulating layer 824 may be foam or other insulation that helps
regulate temperature within the enclosure. Finally, the foil layer
828 may provide thermal insulation, electromagnetic shielding, or
both.
[0162] It is noted that various portions, such as the chambers that
will be described below, of an enclosure 804 may be formed from
different layers, materials, or both. To illustrate, the enclosure
804 shown is formed from a two-layered material in one portion and
a four-layer material in another portion. This is advantageous
because it allows the enclosure 804 to provide protection suited to
particular components. For example, certain components may not
require as much or any thermal, electromagnetic, or other
protection and thus the portion or portions of the enclosure 804
where these components are located may be formed from different
materials or layers than other portions of the enclosure. This also
prevents waste of materials because a layer of material may only be
included when needed.
[0163] As illustrated in FIGS. 8A and 8D, an enclosure 804 may
comprise one or more chambers. In general, the chambers allow one
or more components of the nodes to be stored and protected therein.
In one or more embodiments, one or more chambers may be sealed such
that they are air tight, water tight, or both. This is advantageous
in that a sealed chamber fully encloses the components therein and
prevents infiltration of water, moisture, and dust and other
particles. In addition, a sealed chamber allows a temperature range
to be more easily maintained within the chamber because air of
various temperatures cannot infiltrate the chamber. Each chamber
may be formed from the same or different single or multi-layer
materials.
[0164] As illustrated in FIG. 8C, a chamber may have one or more
openings to allow electrical, optical, or other connectors 840 to
accept an external connection. If desired (or required such as in
the case of a sealed chamber), the connectors 840 may have a sealed
bulkhead to prevent air, moisture, water, dust or other particles,
or a combination thereof from infiltrating a chamber through the
connectors. In general, a sealed bulkhead allows a portion of an
electrical, optical, or other conductor or connection to be
externally accessible while preventing air or water infiltration by
sealing the space around the conductor or connection. For example,
in an electrical connector, any space around each electrical lead
may be sealed or blocked by a portion of the connector such as the
body of a connector.
[0165] In one or more embodiments, a chamber may also have one or
more removable portions 812 to allow access to the components or
parts within a chamber. It is contemplated that a removable portion
812 may be taken off a chamber to allow a technician or other
person to access the inside of a chamber. This is advantageous in
that such access allows components or parts to be repaired,
replaced, updated, upgraded, removed, reinstalled, and the like.
This also allows the inside of a chamber to be cleaned if needed or
desired.
[0166] As can be seen in FIGS. 8A and 8C, the removable portion 812
may be a panel, door, or similar structure. The removable portion
812 may be secured to a chamber in various ways. For example, one
or more fasteners, such as but not limited to screws, clips,
clamps, pins, hook and loop, magnets, or a combination thereof may
be used to secure the removable portion 812. In some embodiments,
the removable portion 812 may be completely removable. For example,
the removable portion 812 of FIG. 8A may be completely disconnected
from an enclosure 804 by removing the screws. In other embodiments,
the removable portion 812 may be partially removable. For example,
the removable portion may be secured to an enclosure 804 by one or
more hinges, slides, hooks, or the like.
[0167] The removable portion 812 may be formed from the same single
or multi-layer material as its chamber. This allows the removable
portion 812 to have the same protective characteristics as the
remainder of the chamber. For example, the removable portion 812
may have the same or similar electromagnetic, heat, or other
shielding as its chamber. In this manner, when the removable
portion 812 is fastened or secured to the chamber, the components
or parts within the chamber are protected as though the chamber did
not have an opening. It is noted that the removable portion 812 may
form an air or watertight seal in embodiments having sealed
chambers. It will be understood that one or more gaskets or other
seals may be used to form such a seal between a removable portion
812 and a chamber. If desired, one or more connectors may be
secured to a removable portion 812 of a chamber.
[0168] In the embodiment of FIG. 8A, the enclosure 804 comprises
two chambers, a component chamber 832 and a support chamber 836. In
one or more embodiments, the component chamber 832 may contain
components of the nodes as described above while the support
chamber 836 may contain parts for regulating or controlling
environmental factors within an enclosure 804, or portions thereof.
The support chamber 836 may also provide power and other resources
necessary to allow node components to operate properly.
[0169] As the cross section view of FIG. 8D shows, the support
chamber 836 may be formed from a different multi-layer material
than the component chamber 832. In the exemplary embodiment of FIG.
8D, the support chamber 836 is formed from a multi-layer material
comprising a UV coating layer 816 and an aluminum layer 820 while
the component chamber is formed from a multi-layer material
comprising a UV coating layer, an aluminum layer, an insulating
layer 824, and a foil layer 828. As can be seen, the support
chamber 836 comprises vents 848 to allow the passage of air, while
the component chamber 832 is sealed.
[0170] It is noted that an enclosure 804 may also provide one or
more mounts 844, as shown in FIG. 8C, to allow the enclosure to be
attached or secured to a wall, pole, or other structure. It is
contemplated that various mounts 844 may be provided for various
mounting applications.
[0171] The support chamber 836 will now be described with regard to
FIG. 9. FIG. 9 is a cross section view of an exemplary support
chamber 836 having parts for regulating or controlling the
environment in and providing power to one or more component
chambers 832 or other chambers.
[0172] Power may be provided via a power supply 920 within the
support chamber 836. In one or more embodiments, a power supply 920
accepts power and converts it such as by raising or lowering the
voltage/amperage so that it is usable by the components or parts.
The power supply 920 may also convert AC power to DC power and vice
versa in some embodiments. It is contemplated that the power supply
920 may accept a wide range of input voltages and convert the same
to usable voltages. In one embodiment, the input voltage acceptable
to the power supply 920 is between 90-270VAC. The power supply 920
may be configured to operate in a wide range of environmental
conditions such as in extremely cold or extremely hot environments,
or in between.
[0173] The power supply 920 will typically, but not always, receive
power from an external source such as a power grid. In embodiments
where a node includes a power source for generating its own power,
the features described above may be incorporated into the node's
power source. Alternatively or in addition, a power supply 920 may
be connected to a node's power source. It is noted that a nodes'
power source may be located in a support chamber 836 in one or more
embodiments.
[0174] The power supply 920 may be secured within a support chamber
836 in various ways. As shown in FIG. 9, the power supply 920 is
mounted to a power supply mount 960 having a rigid structure which
raises the power supply above the bottom of the support chamber
836. This allows cooling airflow to reach more of the power
supply's surfaces to better cool the power supply. Of course, a
power supply 920 may be secured in various other ways. For example,
a power supply 920 may be secured directly to a portion of the
support chamber 836 by one or more fasteners or structures.
[0175] The support chamber 836 and parts therein may be configured
to control the environment of another chamber, such as a component
chamber 832. In one or more embodiments, the environment may be
controlled through various environmental control devices which
control temperature, humidity, particulate concentration, or other
characteristics of the air or other gas within an enclosure. For
example, fans, refrigeration or other cooling devices, heating
elements, heatsinks, thermal conductors, dehumidifiers, or a
combination thereof may be used control the environment within an
enclosure. This is advantageous because sealed component chamber or
other chamber may require a temperature controlled environment in
one or more embodiments to prevent excessively hot or excessively
cold temperatures from hindering operation of, damaging, or
destroying components of a node. It is noted that the environment
within the support chamber 836 may also be controlled by the
support chamber in one or more embodiments.
[0176] In the exemplary embodiment of FIG. 9, the support chamber
836 comprises an airflow system and a thermal conductor 916 to
control the environment of one or more chambers. In general, the
thermal conductor 916 is a component which transfers heat from
another chamber by conducting heat away from the other chamber.
This allows the thermal conductor 916 to cool the other chamber. In
general, the airflow system generates airflow to cool the thermal
conductor 916. The airflow helps dissipate heat from the thermal
conductor 916 allowing the thermal conductor to transfer heat more
quickly.
[0177] The thermal conductor 916 may be configured in various ways.
In one embodiment, the thermal conductor 916 may have a first
portion for absorbing heat and a second portion for dissipating
heat. Typically, the portion for absorbing heat will be in physical
contact with the chamber the thermal conductor 916 is cooling. For
example, the thermal conductor 916 may be in physical contact with
a component chamber 832 to cool the component chamber. In one or
more embodiments, the portion for absorbing heat may protrude into
the chamber that is to be cooled, such as shown in FIG. 9. In this
manner, heat may be absorbed from the chamber to cool the
chamber.
[0178] To allow the thermal conductor 916 to protrude into a
chamber, it is contemplated that a chamber, or a portion thereof,
may have one or more openings. The chamber may form a seal around
the thermal conductor if desired. In this manner, a sealed chamber
can remain sealed even though the thermal conductor 916 is
protruding into the chamber. In one embodiment, an opening large
enough to accept a thermal conductor 916 may be provided. In other
embodiments one or more openings large enough to accept one or more
portions of a thermal conductor may be provided. For example, a
thermal conductor 916 may be in two (or more) sections with a first
section being in the support chamber 836 and a second section in
another chamber. The sections may be connected through one or more
openings in a chamber by one or more fasteners such as screws or
the like, one or more heat conducting materials, one or more heat
pipes, or other members.
[0179] The thermal conductor 916 may be formed from materials, now
known or later developed, which conduct heat. Typically, the
materials with advantageous heat conducting properties will be
used. For example, rigid materials, such as copper, aluminum, gold,
steel, other metals, or a combination thereof may be used to form a
thermal conductor 916. A thermal conductor 916 may include one or
more heat dissipation fins, such as those found on heat sinks, at
various locations to dissipate heat, absorb heat, or both. In
addition, a thermal conductor 916 may include elements for liquid
cooling. For example, the thermal conductor 916 may have one or
more channels for liquid coolants. In one embodiment, the thermal
conductor 916 includes one or more liquid filled heat pipes to
transfer heat through the thermal conductor.
[0180] In one or more embodiments, the thermal conductor 916 may
comprise an active or powered element for transferring heat from
another chamber or to cool another chamber. For example, the
thermal conductor 916 may comprise a Peltier device in one or more
embodiments. Typically, the Peltier device will be oriented such
that its cooler side is facing, in contact with, or inside the
chamber to be cooled while its hotter side is within the support
chamber 836. In this manner, heat may be absorbed by the cool side
and dissipated in the support chamber 836. In addition, the cooler
side of the Peltier device may be used to cool the support chamber
836 while the Peltier's hotter side is cooled by the support
chamber 836. It will be understood that embodiments utilizing a
Peltier device may include the dissipation fins, liquid cooling
structures, heat pipes, heat sinks, or a combination thereof as
described above. It is contemplated that the Peltier device may
have one or more fans attached to its cool side to move cooled air
within a chamber thereby cooling the components within such
chamber.
[0181] As stated, the thermal conductor 916 (as well as other
parts) may be cooled by the airflow system. The airflow system may
be configured to ensure to reduce or eliminate degenerative
airflows within a chamber. Generally, degenerative airflow is
airflow that prevents the airflow system from accomplishing the
desired results. Usually, degenerative airflows are created during
an exception or problem condition. For example, a fan failure when
two exhaust fans are used in parallel creates degenerative airflow
because airflows may cycle from the failed fan to the operating
exhaust fan directly without reaching the rest of a chamber or
enclosure. In one embodiment, as will be described below, the
airflow system utilizes fans positioned in series to prevent such
an occurrence.
[0182] In general, the airflow system generates airflow between an
air inlet 928 and an air outlet 932 of a support chamber 836. The
inlet 928 and outlet 932 may comprise one or more openings, such as
louvered or un-louvered vents 848, in the support chamber to allow
the passage of air. In one embodiment, the inlet 928 and outlet 932
may be sized to regulate the air pressure within the support
chamber 836. For example, the inlet 928 may be sized larger than
the outlet 932 to allow more air to flow into the support chamber
836 than out. In this manner, a pressure head may be formed to
ensure positive airflow within the support chamber 836. The
positive airflow provides cooling and reduces or prevents a buildup
of airborne particles inside the support chamber 836.
[0183] Airflow may be generated by various devices. For example,
one or more fans, blowers, electrostatic air movers, or the like
may be used to generate airflow. In one embodiment, the airflow
system comprises a fan assembly 924 that generates airflow between
the air inlet 928 and the air outlet 932. The fan assembly 924
itself may be configured in various ways. As shown in FIG. 9 for
example, the fan assembly 924 comprises two fans 904 which are
positioned in series by a spacer 912. In this configuration, the
fans 904 are aligned in series by their axis of rotation.
Typically, both fans 904 will spin in the same direction to
generate airflow in the same direction. This allows each fan 904 to
provide the same direction of airflow in case one fan fails.
[0184] Positioning of the fans 904 in series also ensures that no
degenerative airflows are created by the failure of a fan. As can
be seen, the failure of one fan 904 does not provide an alternate
route through which a degenerative airflow can flow. This is
because another fan 904 is positioned to prevent such degenerative
airflow.
[0185] The spacer 912 may be configured as an open hollow structure
having two open ends to which fans 904 may be attached. The spacer
912 may be sized such that the fans 904 are spaced apart to prevent
shock waves from the fans' blades from negatively impacting the
performance of the fans. For example, the spacer 912 may be sized
based on the length, width, or other characteristic of a fan's
blades to reduce or eliminate the impact of shock waves on fan
performance. In one embodiment, the spacer 912 may provide an
airtight seal between fans 904. This ensures airflow is directed
where desired. Spacing and sealing of the fans also ensures that
the desired amount of backpressure (i.e. resistance to airflow)
within the support chamber is maintained.
[0186] One benefit of a plurality of fans 904 is that failure of a
single fan does not cause the entire airflow system to fail as one
or more other fans may continue to move air. Of course, a single
fan 904 or more than two fans may be used in some embodiments.
Where a plurality of fans 904 are provided, the fans may be
arranged such that they are aligned in series with one another, to
ensure that a fan failure does not cause a degenerative airflow
path. The positioning of fans in series causes the airflow
generated by each fan 904 to be substantially in the same direction
allowing one or more of the fans to provide the same direction of
airflow in the event of a fan failure. A spacer 912 may be used to
space a plurality of fans apart to compensate for shock waves such
as described above. It is noted that the spacers 912 may be
configured to form a seal to one or more fans 904. In this manner,
airflow is efficiently directed between fans 904 because the
airflow cannot be diverted through openings between a spacer 912
and a fan 904.
[0187] In one or more embodiments, the fan assembly 924 may be
supported within a support chamber 836 by one or more mounts 908.
The fan assembly 924 may also be supported by the support chamber
836 or a portion thereof as well. For example, a portion of the fan
assembly 924 may be secured the wall or other portion of a support
chamber 836 by one or more fasteners, welds, clips, or the like. In
these embodiments, a mount 908 may not be required.
[0188] The one or more mounts 908 may also be configured to form a
seal around the fan assembly 924 in some embodiments. For example,
one or more mounts 908 may seal a fan assembly 924 to the walls of
a support chamber 836 in one or more embodiments. As shown in FIG.
9, the mounts 908 form a seal such that air from the inlet 928 must
pass through the fan assembly 924 before moving further into the
support chamber 836. This is advantageous in that it prevents
unwanted airflows which may reduce the cooling efficiency of the
airflow system. For example, without a seal around the fan assembly
924, air from within the support chamber rather than from the inlet
928 may be moved by the fan assembly. This may reduce the cooling
efficiency of the airflow system because heated air may be recycled
rather than exhausted out of an air outlet 932.
[0189] The airflow system may also comprise one or more baffles 936
in some embodiments. The baffles 936 may be configured to create
turbulence as desired in the airflow created by the airflow system.
As shown in FIG. 9, a baffle 936 extends upward from the bottom of
the support chamber 836 near the outlet 932.
[0190] In operation, the airflow system generates airflow to cool
parts of the support chamber 836 such as the thermal conductor 916.
As shown by the arrows of FIG. 9, the generated airflow flows
around and, in some cases, through the thermal conductor 916
allowing the thermal conductor to better dissipate heat by pushing
heat out of the support chamber's air outlet 932. It will be
understood that other parts in the support chamber 836 may be
cooled by the airflow system. For example, the power supply 920 may
be cooled by the airflow from the airflow system. It is noted that
the arrows indicating airflow are exemplary and that various other
airflows may be provided according to the invention.
[0191] FIG. 9 also illustrates how components and capture devices
of a node may be arranged within a component chamber 832. In the
embodiment shown, the capture device is a camera 948 which captures
images through a dome 808. The other components 956 may be various
devices such as one or more processors and transceivers which make
up a node, as described above. For example, the component chamber
832 may have one or more microprocessors, cellular transceivers,
and wireless 802.11 transceivers therein.
[0192] The components 956 may be mounted within a component chamber
832 in various ways. As shown, the components 956 are attached to
cards 948. The cards 948 provide the advantage of allowing cards
948 and their attached components 956 to be quickly and easily
removed and installed. In one embodiment, the cards 948 slide into
guides 944 having a channel configured to accept the edge of a
card. In this manner, cards 948 may slide into place. Once in
place, the cards 948 may be secured by a locking pin 952 or other
fastener if desired. In one embodiment, the locking pin passes
through an opening of a guide 944 and a card 948 to secure the card
in place. It is contemplated that the locking pin 952 may also
secured a card frictionally. In this case, the card itself may not
provide an opening.
[0193] The component chamber 832 itself may include one or more
fans 904 in some embodiments. The fans 904 may be configured to
provide additional airflow within the component chamber 832 if
desired. Generally, this additional airflow allows for more
efficient temperature regulation within the component chamber 832.
The fans 904 may be pointed in different directions to circulate
air within the component chamber 832. In the embodiment of FIG. 9
for example, the fans may be pointed in opposite directions to
generate a generally circular airflow within the component chamber
as illustrated by the arrows. Of course other airflows may be
provided according to the invention. It can be seen that the
airflow transfers heat to and/or is cooled by the thermal conductor
916 as it contacts the thermal conductor. In this manner, the
temperature within the component chamber 832 may be controlled.
[0194] It is contemplated that the environmental control features
of the support chamber 836 may be controlled by a control system in
one or more embodiments. For instance, the control system may
control operation of the fan assembly 924, thermal conductor 916,
power supply 920, and other parts of the support chamber 836.
[0195] FIG. 10 illustrates a block diagram of an embodiment of a
control system. As shown, the control system comprises a controller
1004 and one or more sensors 1008. As will be described further
below, the sensors 1008 may be various devices capable of detecting
environmental or other conditions inside a chamber or enclosure or
outside a chamber or enclosure. The controller 1004 may connected,
such as by an electrical, optical, or wireless connection, to the
sensors 1008. The controller 1004 may also be connected to parts of
the support chamber 836 as well to allow the controller to control
their operation. As shown in FIG. 10, the controller 1004 is
connected to the fans 904 of an airflow system and a power supply
920 to control their operation. It will be understood that the
controller 1004 may be connected to airflow systems comprising
devices other than fans in one or more embodiments.
[0196] The controller 1004 may be a microprocessor,
microcontroller, or other circuit in one or more embodiments. The
controller 1004 may be hardwired to control parts of a support
chamber 836 or may execute machine readable code from a memory to
do the same. It is contemplated that the controller 1004 may also
control cooling or other temperature control devices within a
component chamber as well.
[0197] In one embodiment, the controller 1004 receives sensor
information from the one or more sensors 1008 and controls parts of
a support chamber 836 accordingly. The controller 1004 may also
receive operating information from such parts as well. As used
herein, sensor information will refer to information generated from
a sensor. As used herein, operating information will refer to
information regarding the operational characteristics of a part of
the support chamber 836. For example, operating information may
include the current temperature, voltage, fan speed, status, and
any error conditions for a component or part. The controller 1004
will generally be configured to ensure that the support chamber's
temperature is within range of equipment specifications prior to
applying external power. In some embodiments, the controller may
directly receive external power and not be dependent upon the
support's chamber power system to operate.
[0198] The sensors 1008 will generally be configured to detect
various environmental conditions and send sensor information
comprising the same to the processor. For example, the sensors 1008
may detect temperature, humidity, and airborne particulate
concentration. One or more sensors 1008 may be located in various
chambers or even outside the enclosure to detect environmental
conditions. In addition, sensors 1008 may be located on or near
various components or parts of a node to detect their
temperature.
[0199] Based on the sensor information, the controller 1004 may
adjust the operation of one or more parts of the support chamber
836. For example, the controller 1004 may adjust the speed of the
fans 904 in a fan assembly 924, the cooling provided by the thermal
conductor 916, or both to maintain a temperature or temperature
range. In one embodiment, the controller 1004 may also increase or
decrease fan speed, cooling (such as provided by a Peltier device),
or both to maintain a temperature or temperature range inside a
component chamber.
[0200] In an embodiment where the thermal conductor 916 comprises a
powered element, such as a Peltier device, the controller may
activate and deactivate the Peltier based on temperature
information within the support chamber, the component chamber or
both. For instance, if the temperature of a component chamber or
device therein is below a certain threshold the controller 1004 may
deactivate a thermal conductor 916 by turning off or removing power
from the thermal conductor. Where the temperature is above a
certain threshold, the controller 1004 may activate the thermal
conductor 916 by turning on or providing power to the thermal
conductor. Since there is a temperature difference between the
outside and inside of a sealed component chamber, the heat given
off by the chamber's components ensure components in the sealed
chamber will operate in a predetermined temperature range as
balanced by the cooling provided by a thermal conductor 916, such
as a Peltier device.
[0201] The controller 1004 may also adjust operation of a power
supply 920 or power isolation system in one or more embodiments.
For example, the controller 1004 may turn off power to one or more
components or parts where their temperature, as determined by one
or more sensors 1008, is high enough or low enough to damage or
destroy the components or parts. The controller 1004 may also turn
off one, some, or all the components of an component chamber if
temperatures within the component chamber would damage or destroy
the components therein.
[0202] The controller 1004 may also respond to operating
information from one or more parts of a support chamber 836. For
example, the controller 1004 may detect the speed of one or more
fans 904 and increase or decrease fan speed to maintain a desired
temperature. In addition, the controller 1004 may activate or
increase speed of one or more fans 904 in response to operating
information indicating the failure of one or more other fans. This
allows the airflow system to continue to operate even though one or
more fans 904 have failed. In the event a fan assembly 924
completely fails, or insufficient airflow is being provided, the
controller 1004 may cause the power supply 920 to turn off one or
more components of a node to prevent damage. Likewise, the
controller may respond to operating information from the thermal
conductor 916. For example, if the thermal conductor 916 is not
operating normally, the controller 1004 may increase the fan speed
of one or more fans 904 to compensate. In addition, the controller
1004 may increase cooling provided by the thermal conductor 916,
such as a thermal conductor including a Peltier device, in response
to abnormal operation of a fan assembly 924. It is noted that
operating information may also be received by other components or
parts within an enclosure. For example, the status of one or more
capture devices, transceivers, and other components may be
received.
[0203] The control system may include or be connected to a
transceiver 1012 in one or more embodiments to communicate with
remote devices, such as through a network or other connection. As
described above, a transceiver may allow wired or wireless
communication. The controller 1004 may utilize the transceiver 1012
to communicate status information regarding functional or
environmental aspects of the system. For example, the controller
1004 may communicate fan speed(s), temperatures, humidity, error
conditions, and other information to a remote device. In this
manner, the operation of the control system and the node itself may
be monitored/diagnosed remotely. It is contemplated that the
controller 1004 may also receive instructions or updates via the
transceiver 1012. For example, firmware, software, or configuration
updates may be received. In addition, instructions such as power
on, power off, reset, or reboot instructions may be received.
[0204] The control system may also include or be connected to a
heating element 1016 in one or more embodiments which generates
heat to warm a chamber, component, or part therein. For example, a
heating element 1016 may be used to warm a support or component
chamber or their respective parts/components. The heating element
1016 is beneficial especially in cold environments to ensure that
components or parts of a node are not damaged or destroyed by cold.
In one or more embodiments, the heating element 1016 may be used to
warm up components or parts of a node prior to turning them on.
This prevents damage to the components or parts caused by starting
them in a cold or very cold temperature. Once the components or
parts are on, they may generate their own heat and the heating
element 1016 may be shut off.
[0205] Alternatively, the heating element 1016 may remain on to
warm the components or parts if necessary. Placement of a heating
element 1016 may be determined on environmental conditions and
operating conditions of the components or parts. In one or more
embodiments, a heating element 1016 will be placed next to or in
contact with the component or part to be warmed. The heating
element 1016 may be any device, now known or later developed,
configured to generate heat as described herein. Typically, the
heating element 1016 will be an electrical heating element.
[0206] In one embodiment, the controller 1004 may utilize sensor
information or operating information to determine when and a
heating element 1016 should be activated. The controller 1004 may
also control the amount of heat generated by the heating element
1016. When turning on a node, it is contemplated that the
controller 1004 may delay turning on one or more components or
parts until their temperatures are above a certain threshold. For
example, the controller 1004 may prevent power from being supplied
through the power supply to a component or part if temperatures are
too low. This prevents the components or parts from being damaged.
At any time, the controller 1004 may also turn off power from the
power supply if temperatures are too low. Alternatively, or in
addition, the controller 1004 may activate a heating element 1016
if temperatures are too low.
[0207] It is contemplated that the enclosure may be configured for
mobile applications in one or more embodiments. For instance a
mobile enclosure may both protect and support surveillance
components or devices such as described above. In addition, the
mobile enclosure may include aspects to provide such protection and
support suited for situations or environments where surveillance
device are mobile or moved around. Further, as described herein,
the mobile enclosure may be sealed to provide a desirable or
optimized environment for electronic or other surveillance
hardware/components.
[0208] Mobile surveillance is highly desirable in that it provides
an additional perspective or view point from which surveillance
information (e.g. images, sounds, videos) may be captured. As its
name implies, mobile surveillance also may be moved to various
locations quickly and easily. In addition, in some cases, mobile
surveillance may be the only surveillance available. For example, a
video camera in a police car or other vehicle may be the only
surveillance available during a traffic stop or the like.
[0209] Use of surveillance devices in mobile applications may
require specialized hardware, such as ruggedized hardware or the
like, to help ensure that the surveillance devices perform as
desired, are reliable, and are not damaged when used or moved in
mobile applications. Depending on the use, some of the motions
encountered by mobile surveillance devices may be jarring and
disrupt or damage the surveillance gathering capability of the
devices. This is highly undesirable especially where the disruption
or damage causes crucial surveillance to not be captured and
recorded. In addition, mobile use typically requires smaller sized
equipment. In small or confined spaces, heat dissipation must be
controlled to prevent damage to hardware components. Moreover, it
is important to provide reliable power sources while reducing power
utilization in mobile applications.
[0210] As will be described further below, the mobile enclosure
herein has unique characteristics that can be used to address these
issues. For example, in one or more embodiments, the mobile
enclosure provides multi-stage vibration dampening to reduce or
eliminate physical shocks or motions to surveillance device
components, a tuned environmental control system to control the
environment within the enclosure, and a reconstituted power
isolation system to provide reliable power while reducing power
requirements. Of course, various embodiments of the mobile
enclosure may include one or more of these features depending on
the mobile application or as desired. It will be understood that
these features may also be used or implemented in non-mobile or
fixed enclosures as well in some embodiments.
[0211] FIGS. 11A-11B illustrate an exemplary mobile enclosure 1104
that may be used for mobile applications. As can be seen, the
mobile enclosure 1104 may be rectangular in shape. Of course, other
shapes may be used. The mobile enclosure 1104 may also be a variety
of sizes. Typically, the mobile enclosure 1104 will have a smaller
size than that of fixed or immobile embodiments. This allows the
enclosure 1104 to be mounted within or to vehicles or other mobile
platforms and allows the enclosure to be easily moved.
[0212] The mobile enclosure 1104 may comprise one or more chambers
which hold or enclose various components. These chambers may be
formed from a variety of materials. For instance, as described
above, one or more chambers of the mobile enclosure 1104 may have a
structure comprising one or more materials in some embodiments. In
other embodiments, the chambers of the mobile enclosure 1104 may
comprise a multi-layer material such as described and illustrated
in FIG. 8B. The chambers may be formed from a single or multi-layer
material depending on the amount or type of protection the chamber
or enclosure is designed to provide.
[0213] As with the above-described enclosures, the chambers may be
sealed to prevent infiltration of physical objects, dust, water,
moisture, contaminants, electromagnetic or other radiation, heat,
cold, or other undesirable elements into the mobile enclosure where
they may be harmful to internal hardware. The chambers or the
mobile enclosure 1104 itself may also be configured to withstand
physical impacts.
[0214] As will be described further below, in multi-chamber
embodiments, the mobile enclosure 1104 may have one or more support
chambers, one or more component chambers, or both. In some
embodiments, the mobile enclosure 1104 may have a single chamber
design. For example, the mobile enclosure 1104 may only have a
component chamber. This is advantageous in that it reduces the size
of the enclosure 1104 for mobile uses. Of course, the mobile
enclosure 1104 may also have a support chamber in some
embodiments.
[0215] To allow connectors 840 of various types to be accessible,
the mobile enclosure 1104 may comprise one or more openings. In
some embodiments, the connectors 840 may extend outward from the
enclosure to allow for easier access. In other embodiments, the
connectors 840 may be flush with or inset into the enclosure 1104.
As described above, the connectors 840 may be sealed such that they
are water or weather proof/resistant. In this manner, the internal
components of the mobile enclosure 1104 can be protected from
moisture, dust, or other undesirable elements which would otherwise
enter the enclosure. Moreover, the seal also allows the enclosure
1104 to better control the environment within the enclosure by
limiting outside air infiltration that may bring undesirable
temperature changes, humidity, or the like into the enclosure.
[0216] As can be seen a variety of connectors 840 may be provided.
In the embodiment shown, various power, network, antenna, audio,
video, and console connectors 840 are provided. Of course,
additional or fewer connectors 840 may be provided in one or more
embodiments. The enclosure 1104 also includes a power indicator
1112 to notify users that the surveillance device is on. Of course,
other information such as error states or status may be conveyed by
the power indicator 1112 as well.
[0217] The vibration dampening system will now be described. In
general, the vibration dampening system reduces or eliminates
physical shocks, movements, vibrations, or a combination thereof.
In one or more embodiments, the vibration dampening system may be
configured as a multi-stage system where multiple independent
dampening assemblies are used to reduce or eliminate shock,
movement, and/or vibration. In other embodiments, a single-stage
system having a single dampening assembly may be utilized.
Vibration dampening may occur by isolating movement or vibration of
one portion of the enclosure from other portions of the enclosure.
This may be accomplished with a variety of vibration absorbing
materials, structures, or both as will now be described.
[0218] As shown in FIGS. 11A-11B, the mobile enclosure 1104 may be
mounted to a surface or other structure by one or more mounts 1116.
For instance, the mount 1116 may be an "L" shaped bracket attached
to the enclosure 1104. The mount 1116 may include one or more
openings 1120 to allow for attachment to another structure or
surface. It will be understood that a mount 1116 may attach to
another structure or surface in a variety of ways. For example, one
or more clips, clamps, screws, or the like may be used to attach
the mount 1116.
[0219] In one or more embodiments, the one or more mounts 1116 may
provide vibration dampening in addition to attaching the mobile
enclosure 1104 to a structure or surface. This may be accomplished
through one or more vibration isolators 1204. In general, a
vibration isolator 1204 prevents direct physical contact between
two structures while allowing the structures to be held in place
relative to one another. In this manner, transfer of vibration may
be reduced or eliminated by the vibration isolator 1204 while
holding various structures of the enclosure 1104 in place.
[0220] FIG. 12A illustrates an exemplary vibration isolator 1204.
As can be seen, the vibration isolator 1204 comprises a dampener
1208 and an attachment member 1212. The dampener 1208 may be a
flexible or resilient material to absorb vibration. In this manner,
vibration (or other movement) of one structure is at least
partially absorbed by the dampener 1208 before it reaches the other
structure. A dampener 1208 may be used to mount individual
components of a surveillance device or multiple components, as will
be described below.
[0221] The dampener 1208 may be constructed from a variety of
materials. Typically the material or materials used will be
flexible or resilient to allow the dampener 1208 to absorb
vibration or motion. For example, the dampener 1208 may be rubber
or plastic in some embodiments. It is contemplated that the
dampener 1208 may be more rigid or less rigid depending on the
amount of vibration or movement expected to be encountered. In one
embodiment, dampeners 1208 reduced rigidity may be used where there
is an increased or high level of vibration, while more rigid
dampeners may be used where there is a reduced or low level of
vibration.
[0222] As can be seen in FIG. 12B, a first portion of the dampener
engages a first structure, while a second portion of the dampener
engages a second structure. This prevents direct physical contact
between the two structures and allows vibration or movement of one
structure to be isolated from that of another structure. In FIG.
12B, an outer portion of the dampener engages the mobile enclosure
1104 while an inner portion engages the mount 1116. When held in
place by the attachment member 1212, the enclosure 1104 and mount
1116 contact the dampener 1208 but not one another.
[0223] In some embodiments, the dampener 1208 may include an
opening to allow the attachment member 1212 to pass therethrough.
This allows the attachment member 1212 to contact the enclosure
1104 and thus hold the mount 1116 in place relative to the
enclosure. As shown in FIG. 12B for instance, the attachment member
1212 comprises a screw which is screwed into the enclosure 1104
through an opening in the mount 1116 and the dampener 1208. As the
screw is tightened, the head of the screw holds the mount 1116 in
contact with the dampener 1208 and in place relative to the
enclosure 1104.
[0224] In one or more embodiments, a multi-stage or multi-part
vibration dampening system may be employed. For example, as shown
in FIG. 12C, the mobile enclosure 1104 may have one or more
vibration dampening assemblies 1216A, 1216B, 1216C where vibration
may be absorbed to prevent transfer of the vibration to electronic
or other components within the enclosure. In the embodiment of FIG.
12C, a 3-stage vibration dampening system is used, with each
"stage" (i.e., dampening assembly) being used to absorb some of the
vibration or movement at various areas or sections of the enclosure
1104. It will be understood that fewer or additional stages or
parts of the enclosure 1104 may include vibration dampening in one
or more embodiments. For example, it is contemplated that
individual electronic components may be attached to a dampening
assembly if desired.
[0225] A dampening assembly may be configured in a variety of ways.
Typically, the dampening assembly will include a support structure
to which various hardware components may be mounted, and one or
more dampening materials or structures (e.g., vibration isolators
or dampeners) which allows the dampening assembly to be attached or
mounted to the enclosure in a manner that reduces or prevents the
transfer of vibration to or from the assembly. In this way, the
hardware components mounted to the dampening assembly's support
structure are protected from vibration. It is noted that the
support structure may be a rigid structure, such as a plate,
bracket, or the like. In addition, the support structure may be
another component of the mobile enclosure or surveillance device.
For example, as will be described below, a support structure may be
a heat dissipater or thermal conductor plate of the mobile
enclosure 1104 to which various hardware components may be mounted.
The dampeners may be temperature specific.
[0226] A first stage dampening assembly 1216A may be provided as a
structure for attaching the enclosure 1104 to a surface. For
example, as shown, the mounts 1116 (i.e., support structures) are
attached to the enclosure 1104 via a plurality of vibration
isolators 1204. It is noted that vibration isolators 1204 may
alternatively or additionally be used to attach the mounts 1116 to
a surface. As can be seen, the first stage dampening may be
"external" to the enclosure. This is beneficial in that such
dampening may be used to prevent or reduce vibration or movement of
the entire enclosure 1104. Thus, all components of a surveillance
device may be protected in this manner.
[0227] As will be described further below, in one or more
embodiments, one or more components of the enclosure 1104 (such as
an environmental control system) may be mounted externally or at
least partially external to the enclosure. For instance, a
component may be mounted externally to or extend outward from a
chamber, such as a component or support chamber, of the enclosure
1104. Though such components may only be partially external to a
chamber (i.e., a portion of the component may extend into a
chamber), they will be referred to herein as external
components.
[0228] Vibration dampening may be employed with regard to external
components in one or more embodiments. This is beneficial because
vibration or other movement is reduced or eliminated relative to
such components. In general, a vibration dampening material or
structure may be used to accomplish this dampening.
[0229] To illustrate, FIG. 12C shows second stage dampening
assembly 1216B used to mount a heat dissipater 1220 at the bottom
of the enclosure 1104. As can be seen, the heat dissipater 1220 has
been mounted with one or more vibration isolators 1204. In this
manner, vibration or other movement is not transferred from the
enclosure to the heat dissipater 1220, and vice versa. It is noted
that in some embodiments, the enclosure or an external component
may include mechanical parts which generate vibration, such as fans
and the like. For example, the heat dissipater 1220 shown has a fan
assembly 924 (attached via a thermal conductor 916) which may
generate vibration or movement. The vibration dampening of external
components is highly beneficial in that it isolates both vibration
from the environment as well as vibration from a component of the
enclosure.
[0230] The enclosure 1104 may also include internal dampening as
will now be described. In general, such dampening may be
accomplished by mounting interior components or sections to the
enclosure 1104 with one or more dampening structures or materials,
such as the dampeners 1208 described above. For example, in FIG.
12C, a third stage dampening assembly 1216C is shown at the top of
the enclosure 1104 and used to mount a thermal conductor plate
within the enclosure.
[0231] In this embodiment, it can be seen that the thermal
conductor plate 1224 forms a support structure of the third stage
dampening assembly 1216C. As shown, the thermal conductor plate
1224 is mounted by vibration isolators 1204, and various hardware
components are in turn mounted to the thermal conductor plate. In
this manner, the third stage dampening assembly 1216C prevents or
reduces vibration for various internal components of a surveillance
device.
[0232] Though illustrated with internal and external vibration
dampening, it is contemplated that, in some embodiments, only
internal vibration dampening will be provided, while in other
embodiments, only external vibration dampening may be provided. For
example, in one embodiment, the mobile enclosure 1104 may utilize
only an external dampening assembly such as the bracket-type
assembly described above. In this and similar embodiments, internal
structures and components may be rigidly mounted, such as by one or
more standard fasteners (e.g., screws, rivets, clips, welds, etc. .
. . ).
[0233] Like the enclosures described above, the mobile enclosure
1104 may also provide environmental control and protection for
hardware components via an environmental control system. For
instance, the mobile enclosure 1104 may control the temperature,
humidity, or other environmental characteristic within the
enclosure. As stated, this is beneficial in that it allows the
hardware components to operate at a desired or optimized
temperature which may be determined based on the specifications of
the components.
[0234] In mobile embodiments, a reduced size may be highly
advantageous in that smaller sized enclosures are more easily
installed and moved in mobile applications. The size reduction may
be accomplished in various ways. For example, a reduced sized
support chamber may be used to reduce the size of the mobile
enclosure 1104. In these embodiments, the environmental control
components or system of the support chamber may be configured to
operate within a support chamber of reduced size, such as a form
fitting support chamber. In other embodiments, the environmental
control components or system may be configured to operate without
the need to be enclosed in a support chamber to further reduce the
size of the mobile enclosure 1104.
[0235] FIG. 13A illustrates an exemplary mobile enclosure 1104
comprising a component chamber 832 coupled with an environmental
control system 1304. As can be seen, the component chamber 832
provides an enclosed compartment for one or more hardware
components. The environmental control system 1304 shown generally
provides environmental control, such as temperature control,
without the need for a support chamber.
[0236] The environmental control system 1304 may be configured in a
variety of ways. In one or more embodiments, the environmental
control system 1304 may comprise a thermal dissipater 1220, a
thermal conductor 916, a fan assembly 924, or a combination
thereof. It will be understood that the environmental control
system 1304 may comprises more than one of each of these
components. In addition, it will be understood that more than one
environmental control system 1304 may be used with a mobile
enclosure 1104. For example, an environmental control system 1304
may be used at the top and bottom of the mobile enclosure 1104.
[0237] As can be seen, the thermal conductor 916 may extend from
the thermal dissipater 1220 to the component chamber 832. In some
embodiments, the thermal conductor 916 may extend a distance into
the component chamber 832. In such embodiments, an opening in the
component chamber 832 may be provided, or the thermal conductor 916
may comprise one or more sections, one of which is located in the
component chamber. In any case, it is contemplated that the
component chamber 832 may maintain its seal, such as described
above, despite the presence of the thermal conductor 916 within the
chamber.
[0238] In general, the thermal conductor 916 transfers heat away
from the component chamber by conducting the heat away from the
component chamber. The thermal conductor 916 may be configured in a
variety of ways, as has been described above. In one embodiment,
the thermal conductor 916 may comprise or be configured as a
Peltier device with its cooled side oriented towards, in contact
with, or inside the component chamber 832. One advantage of a
Peltier device is that it may be tuned to particular environments
and conditions. For instance, a controller or the like of the
enclosure 1104 may control the output of the Peltier device based
on current environmental or other conditions, as may be detected by
one or more sensors or the like. This optimizes the operation of
the environmental control system 1304 and allows reduced power
consumption and thermal loss, which is highly advantageous in
mobile applications where power may be a limited resource.
[0239] In general, the thermal dissipater 1220 transfers thermal
energy (i.e., heat) from a source to the environment. In this
manner, heat from the mobile enclosure 1104 may be dissipated with
the thermal dissipater 1220. The heat source may be various
components within the enclosure 1104. In one embodiment, one heat
source (or the only heat source) for the thermal dissipater 1220
may be the thermal conductor 916. For example, the thermal
conductor 916 may absorb heat from the component chamber 832 and
transfer the heat to the thermal dissipater 1220 in one or more
embodiments. In embodiments where the thermal conductor 916
includes a Peltier device, the hot or heated end of the Peltier
device may be in contact with the thermal dissipater 1220 to allow
dissipation of the heat generated by the Peltier device.
[0240] It is noted that, as shown in FIG. 13A, a portion of the
thermal conductor 916 may be embedded in the thermal dissipater
1220 in some embodiments. Embedding a portion of the thermal
conductor 916 into the thermal dissipater 1220 is advantageous in
that it increases the contact surface area between the thermal
conductor and the thermal dissipater. This increases the amount of
heat that can be transferred. The thermal conductor 916 need not be
embedded in all embodiments however. It is contemplated that the
environmental control system 1304 may operate with the thermal
conductor 916 in contact with the thermal dissipater 1220, rather
than embedded in the dissipater.
[0241] An airflow system may be coupled with the thermal conductor
916 in one or more embodiments. For example, as shown, the mobile
enclosure 1104 includes a fan assembly 924 adjacent to the thermal
conductor 916 to provide at least one airflow within the component
chamber 832. The location of the fan assembly 924 may vary. In the
embodiment shown, the fan assembly 924 is near or attached to the
thermal conductor 916 to draw cooled air from the thermal conductor
and move the cooled air within the component chamber 832. The air
flow(s) generated by the fan assembly 924 help ensure the desired
amount of cooling is provided to various components within the
enclosure 1104. It is noted that, like some thermal conductors 916,
the operation of the airflow system (e.g., fan assembly) may be
adjusted to suit various conditions. For example, airflow may be
reduced, by a controller or the like, for cooler temperatures
inside or outside of the mobile enclosure 1104, and/or may be
increased for warmer temperatures inside or outside the enclosure.
This provides optimized operation with reduced energy consumption,
which is highly advantageous for mobile applications where power
may be a limited resource.
[0242] It is noted that a support chamber 836 may be provided in
some embodiments, such as shown in FIG. 13B. As can be seen, the
support chamber 836 may enclose the environmental control system
1304 or a portion thereof. The support chamber 836 may be
configured in various ways, such as described above, and may
include various structures such as baffles, vents, seals, and the
like to control airflow within the support chamber.
[0243] For example, the support chamber 836 may comprise one or
more vents 848 to allow the movement of air through the support
chamber. This allows heat from the heat dissipater 1220 to be
dissipated into the environment. In some embodiments, an airflow
system may be provided in the support chamber 836 to assist with
heat dissipation by increasing airflow to the heat dissipater 1220.
For instance, a fan assembly 924 such as shown in FIG. 13B may be
provided to increase airflow. The fans of the fan assembly 924 or
the fan assembly 924 itself may be sealed to the walls of the
support chamber 836 in one or more embodiments.
[0244] The environmental control system will now be described in
further detail with regard to FIGS. 13C-13D. FIG. 13C provides a
perspective view of an exemplary environmental control system 1304
while FIG. 13D provides a cross sectional view. As shown, the
environmental control system 1304 comprises a heat dissipater 1220
configured as a heat dissipation plate 1308 having one or more
dissipation fins 1316 to increase its surface area and aid in
transferring heat from the heat dissipater.
[0245] Though shown as a planar structure, it is contemplated that
the heat dissipater 1220 may be various shapes and various sizes.
For example, the heat dissipater 1220 may incorporate one or more
bends or curves that may be used to allow the heat dissipater to
conform to or wrap around the exterior of a mobile enclosure 1104.
This allows the heat dissipater 1220 to have an increased size
which improves its ability to dissipate heat into the environment.
It is noted that in some embodiments, some or all of the heat
dissipater 1220 may not be in direct contact with the mobile
enclosure 1104 to further prevent heat from the heat dissipater
from re-entering the mobile enclosure. For example, the heat
dissipater 1220 may be sized or shaped such that there is a gap
between the exterior of the mobile enclosure and the heat
dissipater.
[0246] The heat dissipater 1220 may also comprise one or more
thermal isolation materials 1312 to prevent heat from being
dissipated back into or towards the component chamber. In general,
the thermal isolation materials 1312 reflect heat away from the
component chamber. In one or more embodiments, the thermal
isolation materials 1312 may be planar in shape, or may be one or
more coatings applied to the heat dissipater 1220. Thus, the
thermal isolation materials 1312 may be in a sheet or layer type
configuration.
[0247] The thermal isolation materials 1312 may be a variety of
insulating materials and/or structures. For example, the thermal
isolation materials 1312 may comprise foam, honeycomb structures,
natural and synthetic materials, Delrin (Trademark of DuPont), and
the like.
[0248] As can be seen from FIG. 13D, the thermal isolation
materials 1312 may have an opening 1344 to allow a thermal
conductor 916 to directly contact the thermal dissipater 1220. In
this manner, heat from the thermal conductor 916 may be efficiently
transferred to the thermal dissipater 1220.
[0249] FIG. 13D also shows multiple layers of thermal isolation
materials 1312A, 1312B, 1312C. It is noted that only a single layer
may be provided in some embodiments. In multiple layer embodiments,
the layers may comprise different materials, if desired. For
example, a first layer of isolation material 1312A may be lower
density material, such as low density insulation, while a second
layer of isolation material 1312B may be a higher density material,
such as high density insulation. A third layer of isolation
material 1312C may be a thermal reflection material, such as a foil
layer or coating. Of course, more layers than shown in FIG. 13D may
be provided in one or more embodiments.
[0250] In FIGS. 13C-13D, the thermal isolation materials 1312 are
shown as part of the environmental control system 1304. It is noted
however, that in one or more embodiments, the isolation materials
may not be provided. Alternatively, the isolation materials may be
part of a support chamber, or a portion of the support chamber may
perform the function of the isolation materials. For example,
referring to FIG. 13A, the support chamber may comprise a
multi-layer material which has an opening to allow a thermal
conductor 916 to pass through a wall of the support chamber. As
discussed, the multi-layer material of the support chamber may
provide insulation or other thermal isolation. In this manner, the
multi-layer material adjacent the thermal dissipater 1220 may
perform the function of the thermal isolation materials. Of course,
both the multi-layer material and thermal isolation materials may
be used in one or more embodiments.
[0251] Thermal isolation of the heat dissipater 1220 is highly
advantageous in that it guides thermal energy or heat from its
source to the heat dissipater 1220. In this manner, the heat is
directed away from the component chamber 836 and to the heat
dissipater 1220 where it may be released to the environment.
Referring to FIG. 13D for example, the heat from the thermal
conductor 916 is directed to the heat dissipater 1220 through
direct physical contact with the heat dissipater. The thermal
isolation materials 1312A, 1312B, 1312C which surround the
connection between the thermal conductor 916 and the heat
dissipater 1220 help prevent heat from escaping into the component
chamber.
[0252] The connection between the heat dissipater 1220 and thermal
conductor 916 will now be described. In general, the heat
dissipater 1220 and thermal conductor 916 will be connected by
direct physical contact. One or more compounds, such as thermal
grease, may be used to increase the efficiency of heat transfer at
the connection point, if desired.
[0253] As described above, a thermal conductor 916 may absorb or
receive heat at one end and transfer or release the heat at another
end. As illustrated in FIG. 13D for example, the thermal conductor
916 may comprise a receiving end 1324 and a release end 1328. In
embodiments where the thermal conductor 916 is configured as a
Peltier device, the receiving end 1324 may be a cooled end or plate
while the release end 1328 may be the heated end or plate of the
Peltier device.
[0254] The release end 1328 may be in direct contact with the heat
dissipater 1220 in one or more embodiments. Alternatively, a heat
transfer element 1336 may be used to connect the release end 1328
with the heat dissipater 1220. This is beneficial in that it allows
the release end 1328 to be a further distance away from the heat
dissipater 1220. For example, there may be several layers of
thermal isolation material 1312 and/or a chamber wall that may need
to be spanned in order for the release end 1328 to contact the heat
dissipater 1220. This is also beneficial in that it allows the
receiving end 1324 to be positioned closer to a component chamber
or even within the component chamber.
[0255] In general, the heat transfer element 1336 will be formed
from materials which conduct heat efficiently. For example, one or
more metals may be used to form a heat transfer element. The heat
transfer element 1336 may also be various structures. For example,
the heat transfer element 1336 may be a heat pipe in some
embodiments. It will be understood that a single heat transfer
element 1336 may be used such as shown in FIG. 13D, or multiple
heat transfer elements 1336 may be used. It is noted that in one or
more embodiments, the heat transfer element 1336 may be integrally
formed with the heat dissipater 1220, the thermal conductor 916, or
both. Thermal grease or other compounds may be used to aid the
transfer of heat to and from the heat transfer element 1336.
[0256] The environmental control system 1304 may also comprise a
cold transfer element 1340 in one or more embodiments. The cold
transfer element 1340 may be mounted to the thermal conductor 916,
such as at the receiving end 1324 or cooled end of the thermal
conductor. As shown in FIGS. 13C-13D, the cold transfer element
1340 may be a structure of increased surface area, such as the
finned structure shown. Also, the cold transfer element 1340 or a
portion thereof may be within the component chamber. This allows
the cold transfer element to efficiently cool surrounding air
and/or components.
[0257] In one or more embodiments, the cold transfer element 1340
may have an enclosing or surrounding structure 1332 to guide
airflow around the cold transfer element. In this manner, airflow
from a fan assembly 924 or other source may be directed over or
around the cold transfer element 1340. This is beneficial in that
it increases the rate at which cooling may occur. It is noted the
surrounding structure 1332 may not be required and thus not
provided in one or more embodiments.
[0258] To illustrate, in embodiments where the thermal conductor
916 is configured as a Peltier device, the cold transfer element
1340 may be attached to and cooled by the cooled end of the Peltier
device. The larger surface area of the cold transfer element 1340
transfers "cooling" from the Peltier device to the component
chamber. It is noted that the cold transfer element 1340 may be
formed from one or more materials suited for this transfer. For
example, the cold transfer element 1340 may be formed from one or
more metals. A fan assembly 924 may then be used to draw cooled air
surrounding the cold transfer element 1340 and distribute the
cooled air within the component chamber.
[0259] Other configurations may be used as well. For example, the
cold transfer element 1340 may be in contact with a wall of the
component chamber rather than inside the component chamber. In
another example, a cold transfer element 1340 may not be provided
because cooled air may be draw directly from the thermal conductor
916. In yet another example, the cold transfer element 1340 may be
integrally formed at the cooled end (or receiving end 1324) of the
thermal conductor 916.
[0260] It is noted that in embodiments where the thermal conductor
is not a Peltier device, the cold transfer element 1340 may absorb
heat from the component chamber and transfer it to the heat
dissipater, as discussed above. This is because the increased
surface area of the cold transfer element 1340 will also allow heat
to be efficiently absorbed. Of course, heat may be absorbed
directly by the receiving end 1324 of the thermal conductor and
thus a cold transfer element 1340 need not be provided in these
embodiments.
[0261] The environmental control system may comprise additional
elements in one or more embodiments. In general, these elements
will be used to control environmental conditions within a component
chamber, such as temperature. For example, the environmental
control system may include one or more baffles, guides, or
additional fans/fan assemblies to guide/provide air flow within the
component chamber. The environmental control system may also
include a control system, such as described with regard to FIG. 10,
to control its operation. One or more sensors may be provided to
complete a feedback loop to control the internal environment of the
mobile enclosure.
[0262] As another example, one or more external fans may be
included in one or more embodiments, such as shown in FIG. 13E. In
some situations a thermal barrier created by the heat transfer
process may form around the heat dissipater 1220. This reduces the
ability for the heat dissipater 1220 to transfer heat to the
environment. The external fans 1348 may be used to break the
thermal barrier by generating air flow. As shown in FIG. 13E, there
may be redundant external fans 1348 in case one fan is damaged. It
is noted that some embodiments may only include a single external
fan 1348.
[0263] It is contemplated that only a small amount of air flow may
be necessary. For example, 1 to 2 CFM may be enough to break a
thermal barrier. Thus, the external fans 1348 (or other airflow
generator) may be small in size, quiet in operation, and/or have
low power utilization. It will be understood that larger CFMs may
be generated in some embodiments, to break various thermal
barriers. By breaking any thermal barrier surrounding the heat
dissipater 1220 and allowing the heat dissipater to operate
efficiently, the external fans 1348 increase the temperature range
in which the environmental control system can provide a desired
environment within an enclosure.
[0264] The external fans 1348 may be configured to run continuously
or to start and stop depending on environmental conditions. For
example, the external fans 1348 may run when a thermal barrier is
detected, such as by detecting increased temperatures at the heat
dissipater 1220. When or if the thermal barrier dissipates, the
external fans 1348 may then stop. To illustrate, in high humidity
situations where it is more difficult for thermal barriers to form,
the external fans 1348 may cease their operation. It is
contemplated that the external fans 1348 may be controlled by a
control system. One or more sensors of the control system may be
used to detect conditions which would start, stop, increase, or
decrease the operation of the external fans 1348. It is noted that
in high humidity environments, external fans 1348 may run only
occasionally, if at all. Thus, in some embodiments, external fans
1348 may not be required or provided.
[0265] External fans 1348 may be mounted in a variety of ways. FIG.
13E illustrates one such mounting. As can be seen one or more
portions of the dissipation fins 1316 may be removed to provide a
space for the external fans 1348. In this manner, the external fans
1348 may be inset to break any thermal barrier surrounding the heat
dissipater 1220. The external fans 1348 may alternatively be
mounted to the dissipation fins 1316 in one or more embodiments.
The external fans 1348 may be secured by one or more mounts 1356,
fasteners 1360 or both. As can be seen, the mounts 1356 may be
configured to create a space to allow the air intake of the
external fans 1348 to take in air. In some embodiments, a
protective cage 1352 may be provided to protect the external fans
1348 while allowing airflow.
[0266] Referring back to FIG. 12C, in one or more embodiments, the
environmental control system may also include one or more thermal
conductor plates 1224 to absorb heat from hardware components
within the component chamber 832. This allows the hardware
components to operate at a lower or controlled temperature. In
addition, a thermal conductor plate will typically have an
increased surface area to allow for dissipation of the heat.
Moreover, the thermal conductor plate itself absorbs heat from the
hardware components. The thermal conductor plate 1224 may then be
cooled to allow it to continuously absorb and transfer heat from
the hardware components.
[0267] To illustrate, in FIG. 12C, a thermal conductor plate 1224
is at the top of the component chamber 832. As can be seen, a
number of components have been mounted to the thermal conductor
plate 1224. The heat generated by these components may be
transferred to the thermal conductor plate 1224. The thermal
conductor plate 1224 may then be cooled by the thermal conductor
916, the airflow system (e.g., fan assembly 924), or both, allowing
the thermal conductor plate 1224 to continue to transfer and absorb
heat from the hardware components.
[0268] Though shown with a single thermal conductor plate 1224, it
will be understood that additional plates may be provided. For
example, thermal conductor plates 1224 may be at the sides or
center of a component chamber 832. In addition, thermal conductor
plates 1224 need not be planar in all embodiments and may
incorporate one or more bends or openings of various shapes. This
is advantageous in that the size of a thermal conductor plate 1224
may be maximized (improving cooling performance) while still
allowing the thermal conductor plate to fit within the mobile
enclosure 1104.
[0269] It is contemplated that the hardware component(s) may be
attached to the thermal conductor plate 1224 such that heat may be
efficiently transferred to the plate. For example, there may be a
direct physical connection between the thermal conductor plate 1224
and one or more hardware components. In addition or alternatively,
a heat transfer element (such as described above with regard to
FIG. 13D) may be used to facilitate transfer of heat from the
hardware components.
[0270] The thermal conductor plate 1224 may be formed from one or
more materials, such as one or more metals, that readily absorb and
transfer heat. The thermal conductor plate 1224 may be of
relatively large size (as compared to the hardware components for
example), thus allowing the thermal conductor plate 1224 to absorb
a relatively large amount of thermal energy. In addition, the size
of the thermal conductor plate 1224 increases its surface area
which allows the thermal conductor plate to be more easily cooled.
It is contemplated that the thermal conductor plate 1224 may have
one or more fins or the like to further increase its surface area
to improve cooling.
[0271] In one or more embodiments, all hardware components within a
component chamber 832 (aside from those of the environmental
control system) that generate heat may be attached to one or more
thermal conductor plates 1224. Given the tight confines of some
mobile enclosures 1104, this attachment or connection to the
thermal conductor plate(s) 1224 is highly advantageous in
maintaining an ideal or desired temperature for the hardware
components. Of course, in some embodiments, only some of the
hardware components may be attached to a thermal conductor plate
1224.
[0272] Referring to FIG. 12C, the mobile enclosure may include a
power isolation system 1228 in one or more embodiments. In general,
the power isolation system 1228 provides optimized or desired
voltage and/or current levels to hardware components of the mobile
enclosure. The power isolation system 1228 may insulate hardware
components from dirty power, ripple and noise, and other power
fluctuations that may cause unreliable system performance. In one
or more embodiments, the power isolation system 1228 receives input
power from a power source and provides optimal or desired power
output for one or more hardware components.
[0273] For example, in one embodiment, the power isolation system
1228 may operate on an input voltage range of 8-16VDC and provide
one or more output voltages. The output voltages may be set
according to optimal operating voltage(s) for the hardware
components. In general, an optimal operating voltage will be one
that allows a component to operate normally while minimizing power
consumption. For example, one or more of the output voltages may be
16 VDC. At 16VDC, current draw is minimized for typical hardware
components, thus reducing power consumption which is highly
advantageous especially in mobile applications where power may be a
limited resource.
[0274] The power isolation system 1228 may be configured in a
variety of ways. In general, the power isolation system 1228 will
comprise an input to accept power and one or more outputs to
provide processed power to one or more hardware components. Each
output may be independently turned on, turned off, or otherwise
regulated. For example, in one embodiment, the power isolation
system 1228 may provide voltage isolation from an input voltage for
one or more encoders, video processors, computing devices, cellular
modems/transceivers, network communication devices (e.g. bridges,
switches, routers), audio devices, or other components within a
mobile enclosure. As discussed herein, the power isolation system
1228 may accept a wide range of input power. In one embodiment for
example, support for a DC input voltage range 8VDC-16VDC may be
provided.
[0275] The power isolation system 1228 may comprise various
electronic components to process the power and provide optimized
power to the hardware components. For instance, it is contemplated
that the power isolation system 1228 may comprise a control system,
such as described herein, or the like, to perform these functions.
The power isolation system 1228 may also or alternatively be
controlled by a control system of the mobile enclosure. This allows
the power isolation system 1228 to utilize sensor information from
one or more sensors connected to the control system, in regulating
power.
[0276] For example, in extremely cold environments power may first
be provided to heat one or more components or the mobile enclosure
generally. Once a desired operating temperature is reached, power
may be provided to activate the components. Temperature sensors may
monitor multiple areas of and/or components in a mobile enclosure.
In this way, the power outputs may be independently controlled
based on detailed sensor information.
[0277] In one embodiment, the power isolation system 1228 may be on
one or more printed circuit boards that are isolated or remote from
other hardware components. It is contemplated that various power
sources, such as those described above, may be used to provide the
input power. For example, power isolation system 1228 may be
powered by one or more batteries, an external power source (such as
a vehicle), or the like. Various combinations of power sources may
also be used. For example, one or more solar panels and batteries
may be used to power the power isolation system 1228.
[0278] The power isolation system 1228 will typically be mounted
within the mobile enclosure 1104, though it is contemplated that
the power isolation system may be mounted externally or remote from
the enclosure in some embodiments. As can be seen from FIG. 12C,
the power isolation system 1228 may be mounted away from other
hardware components. In this manner, any heat generated by the
power isolation system 1228 is isolated from the hardware
components. Of course, the power isolation system 1228 may be
mounted among the hardware components. It is contemplated that one
or more heat transfer elements may be used to transfer heat from
the power isolation system 1228 to the heat dissipater 1220, a
thermal conductor plate 1224, or other structure, to help cool the
power isolation system. However, it is noted that the power
isolation system 1228 may be configured to not require cooling
assistance in one or more embodiments.
[0279] As stated above, the enclosures herein may be used for
various electronic devices. One such device discussed herein is a
surveillance device. For example, the enclosures herein may be used
for surveillance devices or nodes of different types and
configurations. For instance, FIGS. 14A-14B illustrate an exemplary
surveillance node in a mobile enclosure 1104 that may be used for
audio and/or video surveillance. Though referred to in the
following as a node, it will be understood that surveillance or
other electronic devices of various types may use the mobile
enclosure 1104.
[0280] FIG. 14A is a perspective view show exemplary components of
the surveillance node 100 in an exemplary arrangement within a
mobile enclosure 1104. FIG. 14B is a side view providing another
point of view of the surveillance node 100. As can be seen, the
mobile enclosure 1104 may be relatively compact for easy
installation, transport, and use in mobile applications. The mobile
enclosure 1104 may have relatively tight internal confines to
accomplish such reduction in size. As illustrated for example,
there is a small amount of space between the components and the
mobile enclosure 1104. Of course, as stated, the enclosures herein
may be various sizes.
[0281] As stated, a node may comprise various combinations of
processors, memory devices, storage devices, transceivers, and
other devices. In the embodiment shown, the surveillance node 100
comprises a video processor 1404, a hardware codec 1408, and a
cellular transceiver 1412. The video processor 1404 may generally
be configured as a network video recorder in one or more
embodiments, though the video processor 1404 may have capabilities
in addition to video recording. For example, the video processor
1404 may be used to receive video and/or audio input and convert
the input to a format usable by the hardware codec 1408.
[0282] The video processor 1404 may be configured in various ways.
In one embodiment, the video processor 1404 may include or utilize
one or more memory devices and/or storage devices in performing its
function. For example, videos may be stored on a memory or storage
device by the video processor 1404.
[0283] In one embodiment, the video processor 1404 may execute one
or more applications or algorithms, such as to perform video
analysis or event detection. In some embodiments, the video
processor 1404 may be a computing device and may run an operating
system, such as Windows (trademark of Microsoft Corporation) for
example to support such applications. A computing device is
beneficial in that it allows a variety of peripherals to be used by
the video processor. For example, the video processor 1404 may have
a GPS receiver connected thereto used to detect the current
location of the mobile enclosure. The location information may be
associated with captured video or used as a factor in video
analysis/event detection.
[0284] In general, the hardware codec 1408 will be used to compress
video such that it may be transmitted over communication links of
various bandwidths. In the case of a cellular link, the video may
be compressed to reduce bandwidth requirements. It is contemplated
that the video processor 1404 may also or alternatively be used to
compress video. In these embodiments, a separate hardware codec
1408 may not be provided. In addition, the video processor 1404 may
perform analysis on an audio/video stream such as to detect one or
more events or triggers, such as described above.
[0285] To communicate with other devices, the video processor 1404,
hardware codec 1408, or both may be coupled with the cellular
transceiver 1412. This allows communication over one or more
cellular communication links. Of course, various transceivers may
be used to communicate over a variety of communication links, as
discussed above. The cellular transceiver 1412 (or other
transceiver) may also be configured as a network router in one or
more embodiments. In this manner, data from the video processor
1404, hardware codec 1408, or other component may be routed to
various destinations as desired. In addition, incoming data may
also be routed to specific components of the surveillance node 100
as desired.
[0286] The transceiver may also be configured as a network switch
in some embodiments. This is beneficial because the transceiver may
then be connected to one or more other devices internal and
external to the mobile enclosure 1104. For example, internally, the
video processor 1404, hardware codec 1408, one or more controllers,
or other hardware components, may all be given access to one
another and access to external devices through a switched
connection provided by the transceiver. Externally, the switch
functionality allows other surveillance nodes or devices to connect
a surveillance node 100. This allows communication links as well as
data and resources to be shared between the nodes/devices.
[0287] It will be understood that the switch, router, or both of a
transceiver may be provided by separate components. For example,
the mobile enclosure 1104 may include a distinct router and switch
or a combination switch/router apart from its transceiver. In
addition, it is noted that other components may also be installed
within the mobile enclosure 1104. For example, location detection
components, such as GPS receivers, triangulating receivers, and the
like may be supported by the mobile enclosure 1104.
[0288] In operation, these hardware components will typically
generate heat. The mobile enclosure 1104 is designed to control the
environment to allow reliable operation of the components. To
illustrate, in the embodiment shown, the hardware components have
been mounted to a thermal conductor plate 1224. In this manner,
heat from the hardware components may be absorbed or transferred to
a thermal conductor plate 1224 which relieves some of the heat from
the components. The thermal conductor plate 1224 as well as the
hardware components themselves may also be cooled by the operation
of a thermal conductor 916 and airflow system comprising a fan
assembly 924, as described above. The heat from the thermal
conductor 916 is transferred to a heat dissipater 1220 where it is
dissipated or released into the environment. Simultaneously, the
hardware components are protected from various hazards by a
component chamber 832 of the mobile enclosure 1104 which may have
one or more layers of insulating or protecting materials. Moreover,
the hardware components are protected from vibration and other
movements by one or more vibration dampening assemblies 1216 within
and/or external to the mobile enclosure 1104.
[0289] In some cases, the video processor 1404, hardware encoder
1408, or other component may require additional cooling. For
instance, these components may generate additional heat when
recording/compressing video. In addition, some video processors
1404 or hardware encoders 1408 may generate substantial heat during
operation as a function of their design. In these situations, it is
contemplated that the environmental control system may provide
additional cooling to these components, such as by utilizing one or
more additional thermal conductors 916.
[0290] FIG. 14C illustrates one such embodiment having multiple
thermal conductors 916,1420. As illustrated, the first thermal
conductor 916 is located beneath a cold transfer element 1340 and
the second thermal conductor 1420 is beneath an video processor
1404. Though the second thermal conductor 1420 may be physically
similar or identical to other thermal conductors described herein,
the second thermal conductor will be referred to herein as a direct
conduction thermal conductor 1420 because it will typically be
configured to cool particular hardware components. Because the
first thermal conductor 916 may be configured to cool the air (or
other gas) in the mobile enclosure, it may be referred to as a
convection thermal conductor.
[0291] For instance, in FIG. 14C, the direct conduction thermal
conductor 1420 has been mounted in contact with a component, namely
the video processor 1404. In this manner, the direct conduction
thermal conductor 1420 may directly cool the component, such as by
transferring heat away from the component or actively cooling the
component. The direct conduction thermal conductor 1420 may also be
in contact with the heat dissipater 1220 allowing heat from the
component to be dissipated to the environment, such as described
above. Though shown associated with a particular component, namely
the video processor 1404, it will be understood that direct
conduction thermal conductors 1420 may be used with other
components, and that additional direct conduction thermal
conductors may be used.
[0292] It is contemplated that the direct conduction thermal
conductor 1420 may be positioned near or at the heat source(s) of a
component if desired. For example, in FIG. 14C, the direct
conduction thermal conductor 1420 has been centrally located
relative to the video processor 1404 to better cool the video
processor. In addition, in some embodiments, multiple direct
conduction thermal conductors 1420 may be used to cool a single
component. It is noted that one or more heat transfer elements may
be used to form a connection between the component and the direct
conduction thermal conductor 1420 in some embodiments.
[0293] In this way, the direct conduction thermal conductor 1420
may remove thermal energy directly from a component within the
mobile node. Thermal energy may be transferred to the thermal
dissipater, thus cooling the component. Moreover, as stated, a
small amount of airflow over the external heat sync generated by
various means may be used to break the thermal barrier, to release
thermal energy.
[0294] As shown in FIG. 14C, the direct conduction thermal
conductor 1420 has been mounted such that its top surface is flush
with that of the heat dissipater 1220. This is advantageous in that
it allows a component to contact the heat dissipater 1220 as well
as the direct conduction thermal conductor 1420. In this way, heat
may be transferred to both the heat dissipater 1220 and the direct
conduction thermal conductor 1420. For example, in FIG. 14C, it can
be seen that the video processor 1404 has a large contact area with
both the heat dissipater 1220 and the direct conduction thermal
conductor 1420.
[0295] In embodiments where the direct conduction thermal conductor
1420 requires electrical or other connections, it is contemplated
that one or more channels 1416 may be made in the heat dissipater
1220 (or other mounting structure). This allows the direct
conduction thermal conductor 1420 to be flush mounted and connected
via one or more connections. For example, the direct conduction
thermal conductor 1420 may comprise a Peltier device and the one or
more channels 1416 may be used to provide an electrical connection
to the Peltier device. In addition or alternatively, the direct
conduction thermal conductor 1420 may be controlled by a control
system such as the control system described herein
[0296] In these embodiments, the connection between the direct
conduction thermal conductor 1420 and a control system may occur
through the one or more channels 1416. Moreover, the one or more
channels 1416 may serve as a conduit for connections to one or more
sensors of the control system, such as to receive information that
may be used to control the direct conduction thermal conductor
1420. For example, sensor information may be received through
cables running through the one or more channels 1416. The control
system may utilize this information to turn off, increase, or
decrease power cooling provided by a direct conduction thermal
conductor 1420. For example, sensors may detect the temperature of
the video processor 1404, hardware codec 1408, cellular transceiver
1412, heat dissipater 1220, other components, or a combination
thereof to allow control of their associated direct conduction
thermal conductors 1420 (and/or other thermal conductors).
[0297] The direct conduction thermal conductor 1420 need not be
flush mounted in all cases. For example, the direct conduction
thermal conductor 1420 may extend from a surface, such as the
surface of a heat dissipater 1220. As another example, the direct
conduction thermal conductor 1420 may be inset within a surface,
such as the surface of a heat dissipater 1220. Typically, the
direct conduction thermal conductor 1420 may be mounted such that
its receiving end can contact a component to cool the component. Of
course, as stated, one or more heat transfer elements may also be
used to create this contact.
[0298] It is noted that in some environments, such as exceedingly
cold environments, it may be necessary to delay applying power to a
component because immediate application of power may damage the
component. It is contemplated that the direct conduction thermal
conductor 1420 may be configured to preheat the component to a
suitable operating temperature before the component is provided
power. For example, a direct conduction thermal conductor 1420 (or
other thermal conductor) comprising a Peltier device may be used to
heat a component such as by reversing the polarity of the
electricity provided to the Peltier device. Once a suitable
operating temperature is achieved, power may then be applied to the
devices within the mobile node. Of course, various heating elements
may be used to warm or heat a component, such as described above.
In addition, the control system may determine when to apply heat
and when to apply power, as also discussed above.
[0299] Thus, as can be seen, a convection thermal conductor may be
used to control or normalize the temperature generally within the
mobile enclosure. A direct conduction thermal conductor may be used
to control or normalize the temperature of one or more components
within the mobile enclosure. The combination of conduction and
convection thermal conductors allows a surveillance or other device
within the mobile enclosure to operate in a wide range of
environmental conditions, including those having large temperature
variations.
[0300] Reliability and availability are key factors in surveillance
especially when surveillance is adopted for mission critical
aspects of ensuring public safety. The enclosures described herein
provide a controlled environment for a node's components to achieve
high reliability, uptime, and availability. This also reduces
monetary and other costs associated with downtime, repair, or both.
In fact, it is specifically contemplated that one or more
embodiments of the enclosure may include design features or
configurations that comply with NEBS (Network Equipment Building
Standards) Level 3 standards for reliability. For example, an
airflow system having backup fans or the like, as described above,
may be included to comply with NEBS Level 3. Such compliance
ensures an extremely high level of equipment sturdiness and
disaster-tolerance.
[0301] While various embodiments of the invention have been
described, it will be apparent to those of ordinary skill in the
art that many more embodiments and implementations are possible
that are within the scope of this invention. In addition, the
various features, elements, and embodiments described herein may be
claimed or combined in any combination or arrangement.
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