U.S. patent application number 12/656361 was filed with the patent office on 2010-06-03 for coupling apparatus, exposure apparatus, and device fabricating method.
This patent application is currently assigned to NIKON CORPORATION. Invention is credited to Kazuya Ono, Yuichi Shibazaki.
Application Number | 20100134771 12/656361 |
Document ID | / |
Family ID | 34067374 |
Filed Date | 2010-06-03 |
United States Patent
Application |
20100134771 |
Kind Code |
A1 |
Ono; Kazuya ; et
al. |
June 3, 2010 |
Coupling apparatus, exposure apparatus, and device fabricating
method
Abstract
A lithographic projection apparatus includes an illumination
system arranged to condition a radiation beam, a support structure
configured to hold a patterning device, the patterning device being
capable of imparting the radiation beam with a pattern, a substrate
table configured to hold a substrate, a projection system arranged
to project the patterned radiation beam onto a target portion of
the substrate, and a liquid supply system configured to at least
partly fill a space between the projection system and the
substrate, with a liquid. The projection system includes a first
part and a second part that are two separate physical parts that
are substantially isolated from each other such that vibrations in
the second part are substantially prevented from being transferred
to the first part. Each part includes an optical element of the
projection system and the first and second parts are not attached
to and movable with the substrate.
Inventors: |
Ono; Kazuya; (Saitama-shi,
JP) ; Shibazaki; Yuichi; (Kumagaya-shi, JP) |
Correspondence
Address: |
OLIFF & BERRIDGE, PLC
P.O. BOX 320850
ALEXANDRIA
VA
22320-4850
US
|
Assignee: |
NIKON CORPORATION
Tokyo
JP
|
Family ID: |
34067374 |
Appl. No.: |
12/656361 |
Filed: |
January 27, 2010 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
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12585498 |
Sep 16, 2009 |
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12656361 |
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11322125 |
Dec 30, 2005 |
7619715 |
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12585498 |
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PCT/JP04/10059 |
Jul 8, 2004 |
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11322125 |
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Current U.S.
Class: |
355/30 |
Current CPC
Class: |
G03F 7/70833 20130101;
G03F 7/70341 20130101 |
Class at
Publication: |
355/30 |
International
Class: |
G03B 27/52 20060101
G03B027/52 |
Foreign Application Data
Date |
Code |
Application Number |
Jul 9, 2003 |
JP |
2003-272615 |
Jul 28, 2003 |
JP |
2003-281182 |
Claims
1. A lithographic projection apparatus comprising: an illumination
system arranged to condition a radiation beam; a support structure
configured to hold a patterning device, the patterning device being
capable of imparting the radiation beam with a pattern; a substrate
table configured to hold a substrate; a projection system arranged
to project the patterned radiation beam onto a target portion of
the substrate, the projection system comprising a first part and a
second part that are two separate physical parts that are
substantially isolated from each other such that vibrations in the
second part are substantially prevented from being transferred to
the first part, wherein each part comprises an optical element of
the projection system and the first and second parts are not
attached to and movable with the substrate; and a liquid supply
system configured to at least partly fill a space between the
projection system and the substrate, with a liquid.
2. The lithographic apparatus according to claim 1, wherein the
parts of the projection system are separated at a location between
two lens elements having a large curvature radius, between two lens
elements where the patterned beam is collimated, or both.
3. The lithographic apparatus according to claim 1, wherein the
projection system is a telecentric lens system and the parts are
separated at a pupil plane of the lens system.
4. The lithographic apparatus according to claim 1, further
comprising: a sensor configured to establish a position between a
first optical element in the first part of the projection system
and a second optical element in the second part of the projection
system; an actuator configured to vary the position between the
first and second optical elements; and a controller configured to
control the actuator on the basis of output from the sensor to
maintain a predetermined position between the first and second
optical elements.
5. The lithographic apparatus according to claim 4, wherein the
position is a distance in the direction substantially parallel to
the direction of the optical axis of the projection system.
6. The lithographic apparatus according to claim 1, further
comprising: an actuator configured to vary the position between the
first and second parts; and a controller configured to control the
actuator to maintain a predetermined relative positioning between
the first and second parts.
7. The lithographic apparatus according to claim 1, wherein the
second part of the projection system is attached to the liquid
supply system.
8. The lithographic apparatus according to claim 1, wherein the
liquid supply system comprises a seal member configured to seal
liquid in at least part of the space between the projection system
and the substrate.
9. The lithographic apparatus according to claim 8, wherein the
seal member further comprises a contactless seal configured to seal
liquid in the space.
10. The lithographic apparatus according to claim 1, wherein the
second part is at least partly supported by a resilient member
connected between the second part and a base frame.
11. The lithographic apparatus according to claim 10, wherein the
base frame is decoupled from a frame to which the first part is
attached.
12. A device manufacturing method, comprising: providing a liquid
to a space between a substrate on a substrate table of a
lithographic apparatus and a first part of a projection system of
the lithographic apparatus, a second part of the projection system
being substantially isolated from the first part such that
vibrations in the second part are substantially prevented from
being transferred to the first part and the first and second parts
are not attached to and movable with the substrate; and projecting
a patterned beam of radiation, using the first and second parts of
the projection system, through the liquid onto a target portion of
a substrate.
13. The method according to claim 12, further comprising:
establishing a position between a first optical element in the
first part of the projection system and a second optical element in
the second part of the projection system; and adjusting the
position of the first optical element, the second optical element,
or both such that the established position is maintained at a
predetermined position.
14. The method according to claim 13, wherein the position is a
distance in the direction substantially parallel to the direction
of the optical axis of the projection system.
15. The method according to claim 12, further comprising adjusting
the relative positioning of the first and second parts of the
projection system to maintain a predetermined relative positioning
between them.
16. The method according to claim 12, wherein the parts of the
projection system are separated at a location between two lens
elements having a large curvature radius, between two lens elements
where the patterned beam is collimated, or both.
17. The method according to claim 12, wherein the projection system
is a telecentric lens system and the parts are separated at a pupil
plane of the lens system.
18. The method according to claim 12, comprising sealing the liquid
in at least part of the space between the projection system and the
substrate using a seal member.
19. The method according to claim 18, wherein sealing the liquid
comprises sealing the liquid in the space using a contactless
seal.
20. The method according to claim 12, comprising at least partly
supporting the second part using a resilient member connected
between the second part and a base frame of the lithographic
apparatus.
21. The method according to claim 20, wherein the base frame is
decoupled from a frame to which the first part is attached.
Description
CROSS-REFERENCE TO RELATED APPLICATIONS
[0001] This is a Division of application Ser. No. 12/585,498 filed
Sep. 16, 2009, which in turn is a division of application Ser. No.
11/322,125 filed Dec. 30, 2005, which in turn is a Continuation of
International Application No. PCT/JP2004/010059, filed Jul. 8,
2004, which claims priority to Japanese Patent Application Nos.
2003-272615 (filed on Jul. 9, 2003) and 2003-281182 (filed on Jul.
28, 2003). The disclosures of the aforementioned applications are
incorporated herein by reference in their entireties.
BACKGROUND OF THE INVENTION
[0002] 1. Field of the Invention
[0003] The present invention relates to a coupling apparatus that
couples two objects, an exposure apparatus that exposes a substrate
via a projection optical system in a state wherein a liquid is
filled between the projection optical system and the substrate, and
a device fabricating method that uses the exposure apparatus.
[0004] 2. Description of Related Art
[0005] Semiconductor devices and liquid crystal display devices are
fabricated by a so-called photolithography technique, wherein a
pattern formed on a mask is transferred onto a photosensitive
substrate. An exposure apparatus used by this photolithographic
process comprises a mask stage that supports the mask, and a
substrate stage that supports the substrate, and transfers the
pattern of the mask onto the substrate via a projection optical
system while successively moving the mask stage and the substrate
stage. There has been demand in recent years for higher resolution
projection optical systems in order to handle the much higher
levels of integration of device patterns. As the exposure
wavelength to be used is shorter, the resolution of the projection
optical system becomes higher. As the numerical aperture of the
projection optical system is larger, the resolution of the
projection optical system becomes higher. Consequently, the
exposure wavelength used in exposure apparatuses has shortened year
by year, and the numerical aperture of projection optical systems
has also increased. Furthermore, the currently mainstream exposure
wavelength is the 248 nm KrF excimer laser, but an even shorter
wavelength 193 nm ArF excimer laser is also being commercialized.
In addition, the depth of focus (DOF) is also important as well as
the resolution when performing an exposure. The following equations
respectively express the resolution R and the depth of focus S.
R=k.sub.1.lamda./NA, (1)
.delta.=.+-.k.sub.2.lamda./NA.sup.2, (2)
[0006] Therein, .lamda. is the exposure wavelength, NA is the
numerical aperture of the projection optical system, and k.sub.1
and k.sub.2 are the process coefficients. Equations (1) and (2)
teach that shortening the exposure wavelength .lamda. increases the
resolution R, and that increasing the numerical aperture NA
decreases the depth of focus .delta..
[0007] If the depth of focus .delta. becomes excessively small,
then it will become difficult to align the surface of the substrate
with the image plane of the projection optical system, and there
will be a risk of insufficient margin of focus during the exposure
operation. Accordingly, a liquid immersion method has been
proposed, as disclosed in, for example, PCT International
Publication No. WO99/49504 (Patent Document 1), as a method to
substantially shorten the exposure wavelength and increase the
depth of focus. In this liquid immersion method, the space between
the lower surface of the projection optical system and the
substrate surface is filled with a liquid such as water or any
organic solvent to utilize the fact that the wavelength of the
exposure light beam in the liquid is 1/n as compared with that in
the air (n represents the refractive index of the liquid, which is
about 1.2 to 1.6 in ordinary cases) so that the resolution is
improved and the depth of focus is magnified about n times.
Furthermore, the contents of the above-mentioned Patent Document 1
are hereby incorporated by reference in its entirety to the extent
permitted by the laws or regulations of the states designated or
elected by the present international patent application.
[0008] Incidentally, there is a possibility that vibrations
produced by the movement of the substrate stage that holds the
substrate, and the like, in the state wherein the liquid is filled
between the end surface (the terminal end surface) of the optical
member on the most substrate side of the projection optical system
and the substrate surface, will transmit to the optical member of
the terminal end thereof via the liquid, and that the pattern image
projected onto the substrate via the projection optical system and
the liquid will unfortunately degrade. In addition, there is a
possibility that changes in the pressure of that liquid will apply
force to the projection optical system, and will fluctuate the
projection optical system, and unfortunately degrade the pattern
image projected onto the substrate.
SUMMARY OF THE INVENTION
[0009] The present invention was created considering such
circumstances, and has a first object to provide an apparatus that
couples two objects so that the vibration of one object does not
transmit to the other object. In addition, the present invention
has a second object to provide an exposure apparatus that can
suppress the degradation of the pattern image when filling a liquid
between a projection optical system and a substrate and performing
an exposure, and a device fabricating method that uses this
exposure apparatus.
[0010] The first aspect of the present invention is an exposure
apparatus that exposes a substrate by filling a liquid between a
projection optical system and the substrate, and projecting a
pattern image onto the substrate via the projection optical system
and the liquid, wherein: the projection optical system includes a
first group having an optical member that contacts the liquid, and
a second group that differs from the first group; the first group
is supported by a first support member; and the second group is
separated from the first group and is supported by a second support
member that is different from the first support member.
[0011] According to the present aspect, because, of the projection
optical system, the first group including the optical member that
contacts the liquid and the second group different therefrom are
isolated and respectively supported by the first support member and
the second support member, the first group and the second group can
be vibrationally isolated. Accordingly, it is possible to prevent
the transmission of vibrations from the first group to the second
group, to prevent degradation of the pattern image, and to
manufacture a device with high pattern accuracy.
[0012] The second aspect of the present invention is an exposure
apparatus that exposes a substrate by filling a liquid between a
projection optical system and the substrate and projecting a
pattern image onto the substrate via the projection optical system
and the liquid, wherein: the projection optical system includes a
first group has an optical member that contacts the liquid, and a
second group that is different from the first group; and a drive
mechanism, which moves the first group, adjusts the position of the
first group with respect to the second group.
[0013] According to the present aspect, because, of the projection
optical system, the first group including the optical member that
contacts the liquid can be positioned at a desired position with
respect to the second group different from the first group, it is
possible to prevent degradation of the pattern image, and to
manufacture a high-precision device, even if liquid is filled
between the projection optical system and the substrate.
[0014] The third aspect of the present invention is a coupling
apparatus that couples a first object and a second object,
including: a parallel link mechanism that couples the first object
and the second object; and a vibration isolating mechanism that is
built in the parallel link mechanism so that vibrations of one of
the first object and the second object do not transmit to the
other.
[0015] According to the present aspect, by coupling the first
object and the second object using the parallel link mechanism in
which the vibration isolating mechanism is built, it is possible to
prevent the transmission of the vibrations (fluctuations) of the
one object to the other object. In addition, by driving the
parallel link mechanism, it is possible to maintain and adjust the
relative position between the first object and the second
object.
[0016] The fourth aspect of the present invention is an exposure
apparatus that exposes a substrate by filling a liquid in at least
one part between a projection optical system and the substrate, and
projecting a pattern image onto the substrate via the projection
optical system and the liquid, wherein: the projection optical
system includes a first group having at least an optical member
that contacts the liquid, and a second group disposed between the
first group and the pattern; and the exposure apparatus includes: a
first holding member that holds the first group; a second holding
member that holds the second group isolated from the first holding
member; and a frame member that supports the first holding member
and the second holding member.
[0017] According to the present aspect, because the first group
including the optical member that contacts the liquid and the
second group different therefrom are isolated and respectively
supported by the first holding member and the second holding
member, it is possible to vibrationally isolate the first group and
the second group. Accordingly, it is possible to prevent the
transmission of vibrations, caused by the liquid, from the first
holding member holding the first group to the second holding member
holding the second group, to prevent degradation of the pattern
image, and to manufacture a device with high pattern accuracy.
[0018] In addition, if, for example, the reference mirror (fixed
minor) of the interferometer system for measuring the position
information of the substrate stage is affixed to the second holding
member, by preventing the transmission of the vibrations to the
second holding member, the measurement of the position information
of the substrate stage and the position control of the substrate
stage based on that measurement result can be performed with good
accuracy.
[0019] The fifth aspect of the present invention is an exposure
apparatus that exposes a substrate by irradiating the substrate
with an exposure light via a projection optical system and a
liquid, wherein: the projection optical system includes a first
group having an optical member that contacts the liquid, and a
second group disposed between the first group and a pattern; and
the exposure apparatus includes: a first holding member that holds
the first group; a second holding member that holds the second
group isolated from the first holding member; a frame member for
supporting the first holding member; and a linking mechanism
including a vibration isolating mechanism for controlling the
vibrations of at least one of the first holding member and the
frame member, and that links the first holding member and the frame
member.
[0020] According to the present aspect, because the first group
including the optical member that contacts the liquid and the
second group different therefrom are isolated and respectively
supported by the first holding member and the second holding
member, it is possible to vibrationally isolate the first group and
the second group. Accordingly, it is possible to prevent the
transmission of vibrations, caused by, for example, the liquid,
from the first holding member holding the first group to the second
holding member holding the second group, to prevent degradation of
the pattern image, and to manufacture a device with high pattern
accuracy.
[0021] The sixth aspect of the present invention is an exposure
apparatus that exposes a substrate by irradiating the substrate
with an exposure light via a projection optical system and a
liquid, including: a liquid immersion mechanism that forms an
immersion area at only one part on the substrate during exposure of
the substrate; wherein, the projection optical system includes a
first group having an optical member that contacts the liquid, and
a second group disposed between the first group and a pattern; and
the first group and the second group are supported vibrationally
isolated.
[0022] According to the present aspect, because the first group
including the optical member that contacts the liquid and the
second group different therefrom are supported vibrationally
isolated, it is possible to prevent the transmission of vibrations,
caused by, for example, the liquid, from the first group to the
second group, to prevent degradation of the pattern image, and to
manufacture a device with high pattern accuracy.
[0023] In addition, the seventh aspect of the present invention is
a device fabricating method, wherein an exposure apparatus as
recited above is used.
BRIEF DESCRIPTION OF THE DRAWINGS
[0024] FIG. 1 is a schematic block diagram showing the first
embodiment of an exposure apparatus of the present invention.
[0025] FIG. 2 shows the positional relationship between a tip
portion of a projection optical system, a liquid supply apparatus,
and a liquid recovery apparatus.
[0026] FIG. 3 shows an exemplary arrangement of supply nozzles and
recovery nozzles.
[0027] FIG. 4 is a schematic diagram showing the first embodiment
of a support structure of the projection optical system.
[0028] FIG. 5 is a schematic diagram showing one example of a
support structure of a first group.
[0029] FIG. 6 is a schematic diagram showing the second embodiment
of the support structure of the projection optical system.
[0030] FIG. 7 is a schematic block diagram showing the second
embodiment of the exposure apparatus of the present invention.
[0031] FIG. 8 shows the positional relationship between the tip
portion of the projection optical system, a liquid supply
mechanism, and a liquid recovery mechanism.
[0032] FIG. 9 shows an exemplary arrangement of the supply nozzles
and the recovery nozzles.
[0033] FIG. 10 is a schematic oblique view showing a coupling
apparatus.
[0034] FIG. 11 is a cross sectional view of a link part that
constitutes the coupling apparatus.
[0035] FIG. 12 is a schematic block diagram showing a measuring
means that measures the position information of the first
group.
[0036] FIG. 13 depicts one example of an interferometer.
[0037] FIG. 14 is a schematic view for explaining the features of
the double pass interferometer depicted in FIG. 13.
[0038] FIG. 15 is a schematic view of the optical path of the
interferometer.
[0039] FIG. 16 shows another embodiment of the measuring means that
measures the position information of the first group.
[0040] FIG. 17 is a flow chart showing one example of the processes
for manufacturing a semiconductor device.
DETAILED DESCRIPTION OF THE INVENTION
[0041] The following explains the exposure apparatus and a device
fabricating method of the present invention, referencing the
drawings. However, the present invention is not limited to the
embodiments below; for example, the constituent elements of these
embodiments may be suitably combined.
First Embodiment of the Exposure Apparatus
[0042] FIG. 1 is a schematic block diagram that depicts the first
embodiment of the exposure apparatus according to the present
invention.
[0043] In FIG. 1, the exposure apparatus EX includes a mask stage
MST that supports a mask M; a substrate stage PST that supports a
substrate P; an illumination optical system IL that illuminates
with an exposure light EL the mask M supported by the mask stage
MST; a projection optical system PL that projects and exposes an
image of a pattern of the mask M illuminated by the exposure light
EL onto the substrate P supported by the substrate stage PST; and a
control apparatus CONT that collectively controls the overall
operation of the exposure apparatus EX.
[0044] Here, as an example, the present embodiment explains a case
of using, as the exposure apparatus EX, a scanning type exposure
apparatus (a so-called scanning stepper) that, while synchronously
moving the mask M and the substrate P in mutually different
directions (opposite directions) in the scanning direction, exposes
the substrate P with the pattern formed on the mask M. In the
following explanation, the direction that coincides with an optical
axis AX of the projection optical system PL is the Z axial
direction, the direction in which the mask M and the substrate P
synchronously move in the plane perpendicular to the Z axial
direction (the scanning direction) is the X axial direction, and
the direction perpendicular to the Z axial direction and the X
axial direction (the non-scanning direction) is the Y axial
direction. In addition, the rotational (inclined) directions around
the X, Y, and Z axes are the .theta.X, .theta.Y, and .theta.Z
directions, respectively. Furthermore, "substrate" herein includes
one in which a semiconductor wafer is coated with a photoresist,
and "mask" includes a reticle wherein is formed a device pattern
that is reduction projected onto the substrate.
[0045] The exposure apparatus EX of the present embodiment is a
liquid immersion type exposure apparatus that applies the liquid
immersion method to substantially shorten the exposure wavelength,
improve the resolution, as well as substantially increase the depth
of focus, and includes a liquid supply apparatus 1 that supplies a
liquid 50 onto the substrate P, and a liquid recovery apparatus 2
that recovers the liquid 50 on the substrate P. At least during the
transfer of the pattern image of the mask M onto the substrate P,
the exposure apparatus EX forms the immersion area, by the liquid
50 supplied from the liquid supply apparatus 1, at one part on the
substrate P that includes a projection area of the projection
optical system PL. Specifically, the exposure apparatus EX exposes
the substrate P by locally filling the liquid 50 between a tip
surface (lowest surface) 7 of an optical element 60 of the tip
portion of the projection optical system PL and the surface of the
substrate P; and then projecting the pattern image of the mask M
onto the substrate P via the liquid 50 between this projection
optical system PL and the substrate P, and via the projection
optical system PL.
[0046] The illumination optical system IL illuminates with the
exposure light EL the mask M supported by the mask stage MST, and
includes: an exposure light source; an optical integrator that
uniformizes the intensity of the luminous flux emitted from the
exposure light source; a condenser lens that condenses the exposure
light EL from the optical integrator; a relay lens system; and a
variable field stop that sets to a slit shape an illumination
region on the mask M illuminated by the exposure light EL; and the
like. The illumination optical system IL illuminates the
predetermined illumination region on the mask M with the exposure
light EL, having a uniform illumination intensity distribution.
Examples of light used as the exposure light EL emitted from the
illumination optical system IL include: deep ultraviolet light (DUV
light), such as bright lines (g, h, and i lines) in the ultraviolet
region emitted from a mercury lamp for example, and KrF excimer
laser light (248 nm wavelength); and vacuum ultraviolet light (VUV
light), such as ArF excimer laser light (193 nm wavelength) and F,
laser light (157 nm wavelength). ArF excimer laser light is used in
the present embodiment.
[0047] The mask stage MST supports the mask M, and is two
dimensionally movable in the plane perpendicular to the optical
axis AX of the projection optical system PL, i.e., in the XY plane,
and is finely rotatable in the OZ direction. A mask stage drive
apparatus MSTD, such as a linear motor, drives the mask stage MST.
The control apparatus CONT controls the mask stage drive apparatus
MSTD. A laser interferometer measures in real time the position, in
the two dimensional direction, and the rotational angle of the mask
M on the mask stage MST, and outputs the measurement results to the
control apparatus CONT. The control apparatus CONT drives the mask
stage drive apparatus MSTD based on the measurement results of the
laser interferometer, thereby positioning the mask M, which is
supported by the mask stage MST.
[0048] The projection optical system PL projection-exposes the
pattern of the mask M onto the substrate P with a predetermined
projection magnification .beta., and includes a plurality of
optical elements (lenses), and these optical elements are supported
by a lens barrel PK. In the present embodiment, the projection
optical system PL is a reduction system having a projection
magnification .beta. of, for example, 1/4 or 1/5. Furthermore, the
projection optical system PL may be either a unity magnification
system or an enlargement system.
[0049] The projection optical system PL includes: the optical
element (first group) 60 disposed on the tip side (the substrate P
side) thereof and having an optical member that contacts the liquid
50; and a projection optical system main body (second group) MPL
that includes a plurality of optical elements disposed between the
optical element 60 and the mask M. The lens barrel PK supports the
projection optical system main body MPL, and the optical element 60
is supported separated from the lens barrel PK. The details of the
support structure of the optical element 60 and the projection
optical system main body MPL will be discussed later. Furthermore,
in the present embodiment, the optical element 60 that constitutes
the first group consists of one optical member (lens).
[0050] The substrate stage PST supports the substrate P, and
includes: a Z stage 51 that holds the substrate P via a substrate
holder, and an XY stage 52 that supports the Z stage 51. A stage
base 53 supports the substrate stage PST includes the Z stage 51
and the XY stage 52. A substrate stage drive apparatus PSTD, such
as a linear motor, drives the substrate stage PST. The control
apparatus CONT controls the substrate stage drive apparatus PSTD.
By driving the Z stage 51, the position in the Z axial direction
(the focus position) and in the .theta.X and .theta.Y directions of
the substrate P held on the Z stage 51 is controlled. In addition,
by driving the XY stage 52, the position of the substrate P in the
XY direction (the position in a direction substantially parallel to
the image plane of the projection optical system PL) is controlled.
In other words, the Z stage 51 controls the focus position and the
inclination angle of the substrate P and aligns the surface of the
substrate P with the image plane of the projection optical system
PL by an auto focus system and an auto leveling system; further,
the XY stage 52 positions the substrate P in the X axial direction
and Y axial direction. It goes without saying that the Z stage and
the XY stage may be integrally provided.
[0051] A movable mirror 54 that moves integrally with the substrate
stage PST is provided on the substrate stage PST (the Z stage 51).
In addition, a laser interferometer 55 is provided at a position
opposing the movable minor 54. The laser interferometer 55 measures
in real time the position in the two dimensional direction and the
rotational angle of the substrate P on the substrate stage PST, and
outputs the measurement results to the control apparatus CONT. The
control apparatus CONT drives the substrate stage drive apparatus
PSTD based on the measurement results of the laser interferometer
55, thereby positioning the substrate P supported on the substrate
stage PST.
[0052] The exposure apparatus EX includes: the liquid supply
apparatus 1 that supplies the predetermined liquid 50 into a space
56 between the tip surface (tip surface of optical element 60) 7 of
the projection optical system PL and the substrate P; and the
liquid recovery apparatus 2 that recovers the liquid 50 from the
space 56. The liquid supply apparatus 1 is for the purpose of
filling the liquid 50 in at least one part between the projection
optical system PL and the substrate P, and has a tank that stores
the liquid 50, a pressurizing pump, and the like. One end of a
supply pipe 3 is connected to the liquid supply apparatus 1, and a
supply nozzle 4 is connected to the other end of the supply pipe 3.
The liquid supply apparatus 1 supplies the liquid 50 into the space
56 via the supply pipe 3 and the supply nozzle 4.
[0053] The liquid recovery apparatus 2 has a suction pump, the tank
that stores the recovered liquid 50, and the like. One end of a
recovery pipe 6 is connected to the liquid recovery apparatus 2,
and a recovery nozzle 5 is connected to the other end part of the
recovery pipe 6. The liquid recovery apparatus 2 recovers the
liquid 50 from the space 56 via the recovery nozzle 5 and the
recovery pipe 6. When filling the liquid 50 into the space 56, the
control apparatus CONT drives the liquid supply apparatus 1,
supplies a predetermined amount of the liquid 50 per unit of time
into the space 56 via the supply pipe 3 and the supply nozzle 4,
and also drives the liquid recovery apparatus 2 and recovers from
the space 56 a predetermined amount of the liquid 50 per unit of
time via the recovery nozzle 5 and the recovery pipe 6. Thereby,
the liquid 50 is disposed in the space 56 between the tip surface 7
of the projection optical system PL and the substrate P.
[0054] In the present embodiment, pure water is used as the liquid
50. Pure water is capable of transmitting not only ArF excimer
laser light, but also the exposure light EL if set to deep
ultraviolet light (DUV light), such as the bright lines (g, h, and
i lines) in the ultraviolet region emitted from, for example, a
mercury lamp, and KrF excimer laser light (248 nm wavelength).
[0055] FIG. 2 is a front view that depicts the lower portion of the
projection optical system PL of the exposure apparatus EX, the
liquid supply apparatus 1, the liquid recovery apparatus 2, and the
like. A tip portion 60A of the optical element 60 at the lowest end
of the projection optical system PL in FIG. 2 is formed to have
rectangular shape which is long in the Y axial direction (the
non-scanning direction), leaving just the portion needed in the
scanning direction. During scanning exposure, the pattern image of
one part of the mask M is projected onto the rectangular projection
area directly below the tip portion 60A, and, synchronized to the
movement of the mask M at a speed V in the -X direction (or the +X
direction) with respect to the projection optical system PL, the
substrate P moves at a speed .beta.V (where .beta. is the
projection magnification) in the +X direction (or the -X direction)
via the XY stage 52. Further, after the exposure of one shot region
is completed, the next shot region moves to the scanning start
position by stepping the substrate P, and the exposure process is
subsequently performed sequentially for each shot region by the
step-and-scan system. In the present embodiment, the liquid 50
flows parallel to and in the same direction as the movement
direction of the substrate P.
[0056] FIG. 3 depicts the positional relationship between the tip
portion 60A of the lens 60 of the projection optical system PL, the
supply nozzles 4 (4A-4C) that supply the liquid 50 in the X axial
direction, and the recovery nozzles 5 (5A, 5B) that recover the
liquid 50. In FIG. 3, the tip portion 60A of the lens 60 is a
rectangular shape that is long in the Y axial direction; further,
the three supply nozzles 4A-4C are disposed on the +X side and the
two recovery nozzles 5A, 5B are disposed on the X side so that the
tip portion 60A of the lens 60 of the projection optical system PL
is interposed therebetween in the X axial direction. Further, the
supply nozzles 4A-4C are connected to the liquid supply apparatus 1
via the supply pipe 3, and the recovery nozzles 5A, 5B are
connected to the liquid recovery apparatus 2 via the recovery pipe
6. In addition, supply nozzles 8A-8C and recovery nozzles 9A, 9B
are disposed substantially 180.degree. rotated from the supply
nozzles 4A-4C and the recovery nozzles 5A, 5B. The supply nozzles
4A-4C and the recovery nozzles 9A, 9B are alternately arrayed in
the Y axial direction, the supply nozzles 8A-8C and the recovery
nozzles 5A, 5B are alternately arrayed in the Y axial direction,
the supply nozzles 8A-8C are connected to the liquid supply
apparatus 1 via a supply pipe 10, and the recovery nozzles 9A, 9B
are connected to the liquid recovery apparatus 2 via a recovery
pipe 11.
[0057] FIG. 4 is a schematic diagram for explaining the support
structure of the projection optical system PL.
[0058] Furthermore, to simplify the explanation, the liquid 50, the
liquid supply apparatus 1, the liquid recovery apparatus 2, and the
like, are omitted from FIG. 4. In FIG. 4, the exposure apparatus EX
includes a main frame 42 that supports the projection optical
system main body MPL, and a base frame 43 that supports the main
frame 42 and the substrate stage PST (the Z stage 51 and the XY
stage 52). A flange 41 is provided at the outer circumference of
the lens barrel PK that holds the projection optical system main
body MPL, and the main frame (second support member) 42 supports
the projection optical system main body MPL via this flange 41.
[0059] A vibration isolating apparatus 44 is disposed between the
main frame 42 and the base frame 43, and the vibration isolating
apparatus 44 isolates the main frame 42 from the base frame 43 so
that vibrations of the base frame 43 do not transmit to the main
frame 42 that holds the projection optical system main body MPL.
The base frame 43 is installed substantially horizontally on the
floor surface of the clean room via foot parts 45.
[0060] The stage base (first base member) 53 is supported on the
base frame (second base member) 43 via a vibration isolating
apparatus 46. This vibration isolating apparatus 46 isolates the
base frame 43 from the stage base 53 so that vibrations of the base
frame 43 do not transmit to the stage base 53, and so that
vibrations of the stage base 53 do not transmit to the base frame
43.
[0061] The substrate stage PST is supported on the stage base 53 in
a non-contact manner using air bearings, and the like, and the
substrate stage PST is two dimensionally movable on the stage base
53 using linear motors (not shown). A support frame (first support
member) 47 is provided on the stage base 53, and the support frame
47 supports a casing (lens cell) 61 that holds the optical element
60. Thus, the support frame 47 that holds the optical element 60
(casing 61) and the main frame 42 that supports the projection
optical system main body MPL are isolated via the vibration
isolating apparatuses 44, 46 so that vibrations do not mutually
transmit.
[0062] Furthermore, in the configuration depicted in FIG. 4, a
vibration isolating apparatus the same as the vibration isolating
apparatuses 44, 46 may be provided between the support frame 47 and
the stage base 53, and an elastic member, such as rubber, may be
disposed so that vibrations that do transmit between the support
frame 47 and the stage base 53 are attenuated.
[0063] FIG. 5 is an enlarged view of the vicinity of the optical
element 60 of the projection optical system PL.
[0064] A voice coil motor (drive mechanism) 48 is disposed between
the support frame 47 and the casing 61 that holds the optical
element 60, the support frame 47 supports the casing 61 via the
voice coil motor 48 in a non-contact manner, and the optical
element 60 held by the casing 61 is movable in the Z axial
direction by driving the voice coil motor 48. In addition, the main
frame 42 is provided with an interferometer (measuring apparatus)
71 that receives reflected light from a measuring mirror 49a
affixed to the casing 61 and from a measuring mirror 49b affixed to
the lens barrel PK, and measures the spacing between the projection
optical system main body MPL and the optical element 60. Three
voice coil motors 48 are disposed between the casing 61 and the
support frame 47 at, for example, 120.degree. intervals from one
another, and are constituted so that they can each move
independently, so that they can move in the Z axial direction, and
so that they can incline with respect to the projection optical
system MPL. Based on the measurement result of the interferometer
71, the voice coil motor 48 is controlled so that the predetermined
positional relationship (predetermined spacing) between the
projection optical system main body MPL and the optical element 60
is maintained.
[0065] The following explains the procedure for using the exposure
apparatus EX discussed above to expose the pattern of the mask M
onto the substrate P.
[0066] After the mask M is loaded on the mask stage MST and the
substrate P is loaded on the substrate stage PST, the control
apparatus CONT drives the liquid supply apparatus 1, and starts the
operation to supply liquid to the space 56. Further, if scanning
exposure is performed by moving the substrate P in the scanning
direction (the -X direction) depicted by an arrow Xa (refer to FIG.
3), then the liquid supply apparatus 1 and the liquid recovery
apparatus 2 use the supply pipe 3, the supply nozzles 4A-4C, the
recovery pipe 6, and the recovery nozzles 5A, 5B to supply and
recover the liquid 50. Namely, when the substrate P moves in the -X
direction, the liquid 50 is supplied between the projection optical
system PL and the substrate P from the liquid supply apparatus 1
via the supply pipe 3 and the supply nozzles 4 (4A-4C), the liquid
50 is also recovered by the liquid recovery apparatus 2 via the
recovery nozzles 5 (5A, 5B) and the recovery pipe 6, and the liquid
50 thereby flows in the -X direction so that it fills between the
optical element 60 and the substrate P. On the other hand, if
scanning exposure is performed by moving the substrate P in the
scanning direction (the +X direction) depicted by an arrow Xb, then
the liquid supply apparatus 1 and the liquid recovery apparatus 2
use the supply pipe 10, the supply nozzles 8A-8C, the recovery pipe
11, and the recovery nozzles 9A, 9B to supply and recover the
liquid 50. Namely, when the substrate P moves in the +X direction,
the liquid 50 is supplied between the projection optical system PL
and the substrate P by the liquid supply apparatus 1 via the supply
pipe 10 and the supply nozzles 8 (8A-8C), the liquid 50 is also
recovered by the liquid recovery apparatus 2 via the recovery
nozzles 9 (9A, 9B) and the recovery pipe 11, and the liquid 50
thereby flows in the +X direction so that it fills between the
optical element 60 and the substrate P. In this case, the liquid 50
can be easily supplied into the space 56, even if the supplied
energy of the liquid supply apparatus 1 is small, because the
liquid 50 supplied, for example, from the liquid supply apparatus 1
via the supply nozzles 4 flows so that it is drawn into the space
56 as the substrate P moves in the -X direction. Further, even if
the substrate P is scanned in either the +X direction or the -X
direction by switching the direction in which the liquid 50 flows
in accordance with the scanning direction, the liquid 50 can be
filled between the tip surface 7 of the optical element 60 and the
substrate P, and a high resolution and large depth of focus can
thereby be obtained.
[0067] Here, a cooling apparatus may be provided that cools a coil
part of the voice coil motor 48 to set a predetermined temperature.
In that case, water may be used as the refrigerant for that cooling
apparatus, which may be shared with part of the temperature
regulating apparatus that sets the liquid 50 to a predetermined
temperature.
[0068] In addition, the interferometer 71 continuously monitors the
spacing between the lens barrel PK that holds the projection
optical system main body MPL and the casing 61 that holds the
optical element 60; if the spacing changes due to, for example,
vibrations of the substrate stage PST and/or a pressure change in
the liquid 50, then, based on the measurement result from the
interferometer 71, the voice coil motor 48 moves the optical
element 60 held by the casing 61, thereby maintaining the spacing
(positional relationship) between the projection optical system
main body MPL and the optical element 60 in a predetermined
state.
[0069] Thus, in the present embodiment, the main frame 42 that
supports the projection optical system main body MPL and the
support frame 47 that holds the optical element 60 are
vibrationally isolated, and it is therefore possible to prevent
vibrations transmitted to the optical element 60 from being
transmitted to the projection optical system main body MPL. In
addition, because the optical element 60 is supported by the
support frame 47 via the voice coil motor 48 in a non-contact
manner, thereby protected against vibrations from the support frame
47, the position in the X axial and Y axial directions is stable,
and the position in the Z axial direction is also controlled by the
voice coil motor 48; therefore, the optical element 60 can be
positioned in a predetermined state with respect to the projection
optical system main body MPL. Accordingly, even if performing an
immersion exposure by filling the liquid 50 between the optical
element 60 of the projection optical system PL and the substrate P,
the desired pattern image can be formed on the substrate P without
causing any degradation of the pattern image. In addition, if the
lens barrel PK is provided with a reference mirror used with the
interferometer 55 to monitor the substrate stage PST as well as
with an interferometer (not shown) to monitor the mask stage MST,
then vibrations of the optical element 60 do not transmit to the
lens barrel PK, and it is therefore possible to prevent measurement
errors in each of the interferometers.
[0070] Furthermore, a plurality of measuring mirrors may be
provided respectively for the projection optical system main body
MPL and the casing 61, and the spacing between the projection
optical system main body MPL and the casing 61, as well as their
relative inclination and their relative position in the X axial
direction and the Y axial direction, may also be measured. In
addition, based on those measurement results, the voice coil motor
48 may, for example, incline the optical element 60, move the
optical element 60 in the X axial direction and/or the Y axial
direction. In addition, the present embodiment is constituted to
move the optical element 60, but may be constituted to Move the
projection optical system main body MPL. In addition, if the
projection state (imaging state) of the pattern image projected on
the substrate P changes due to fluctuations in the optical element
60, then a part of the plurality of optical members that constitute
the projection optical system main body MPL may be moved so as to
compensate for changes in the projection state.
[0071] Furthermore, in the first embodiment discussed above, the
interferometer system (49a, 49b, 71) is used as the measuring
apparatus, but a measuring apparatus employing another system may
be used provided that it can measure the positional relationship
between the projection optical system main body MPL and the optical
element 60 with a predetermined accuracy. For example, instead of
the interferometer system discussed above, it is acceptable to use
a measuring apparatus that optically measures the relative position
information of measurement marks disposed respectively on the lens
barrel PK and the casing 61.
[0072] FIG. 6 is a schematic diagram that depicts another
embodiment of the support structure of the projection optical
system.
[0073] The present embodiment differs from the embodiment of the
support structure of the projection optical system explained
referencing FIG. 14 on the point that a support frame 47' that
supports the casing 61 that holds the optical element 60 is affixed
to the base frame 43. In the present embodiment as well, the main
frame 42 that supports the projection optical system main body MPL
and the support frame 47' that holds the optical element 60 are
vibrationally isolated, and vibrations transmitted to the optical
element 60 thereby do not transmit to the projection optical system
main body MPL, and the positional relationship between the
projection optical system main body MPL and the optical element 60
is also maintained in a predetermined state; therefore, the desired
pattern image can be formed on the substrate P without causing
degradation of the pattern image, even if performing an immersion
exposure by filling the liquid 50 between the optical element 60 of
the projection optical system PL and the substrate P.
[0074] Furthermore, if the projection optical system main body MPL
and the optical element 60 are vibrationally isolated, then the
respective support member (frame) is not limited to the embodiments
discussed above.
[0075] In addition, in the abovementioned embodiments, the casing
61 is constituted so that it holds only one optical element 60, but
may hold a plurality of optical elements that includes the optical
element 60. In addition, in embodiments discussed above, the
projection optical system PL is divided into two groups: the
optical element 60, and the projection optical system main body MPL
between the mask M and the optical element 60; however, it may be
separated into three or more groups, and the relative position of
the first group, including the optical element 60, and the groups
not adjacent to that first group may be maintained in a
predetermined state.
[0076] The above embodiments are not particularly limited to the
nozzle configurations discussed above, e.g., the liquid 50 may be
supplied and recovered by two pairs of nozzles on the long sides of
the tip part 60A. Furthermore, in this case, the supply nozzles and
the recovery nozzles may be disposed so that they are arrayed
vertically in order to enable the supply and recovery of the liquid
50 from either the +X direction or the -X direction.
Second Embodiment of the Exposure Apparatus
[0077] FIG. 7 is a schematic block diagram that depicts the second
embodiment of the exposure apparatus according to the present
invention.
[0078] In FIG. 7, an exposure apparatus EX2 includes a mask stage
MST2 that supports a mask M2, a substrate stage PST2 that supports
a substrate P2, an illumination optical system IL2 that illuminates
the mask M2 supported by the mask stage MST2 with exposure light
EL2, a projection optical system PL2 that projects and exposes the
pattern image of the mask M2 illuminated by the exposure light EL2
onto the substrate P2 supported by the substrate stage PST2, and a
control apparatus CONT2 that performs overall control of the
operation of the entire exposure apparatus EX2. Furthermore, the
exposure apparatus EX2 includes a main column 103 that supports the
mask stage MST2 and the projection optical system PL2. The main
column 103 is installed on the base plate 104 which is placed
horizontally upon the floor surface. An upper side step part (upper
side support part) 103A and a lower side step part (lower side
support part) 103B that protrude inwardly are formed in the main
column 103.
[0079] The exposure apparatus EX2 of the present embodiment is a
liquid immersion type exposure apparatus that applies the liquid
immersion method to substantially shorten the exposure wavelength,
improve the resolution, as well as substantially increase the depth
of focus, and includes a liquid supply mechanism 110 that supplies
a liquid 101 onto the substrate P2, and a liquid recovery mechanism
120 that recovers the liquid 101 on the substrate P2. At least
during the transfer of the pattern image of the mask M2 onto the
substrate P2, the exposure apparatus EX2 forms an immersion area
AR2, by the liquid 101 supplied from the liquid supply mechanism
110, at one part on the substrate P2 that includes a projection
area AR1 of the projection optical system PL2. Specifically, the
exposure apparatus EX2 exposes the substrate P2 by locally filling
the liquid 101 between an optical member (optical element) 102 of
the tip part (terminal end part) of the projection optical system
PL2 and the surface of the substrate P2; and then projecting the
pattern image of the mask M2 onto the substrate P2 via the liquid
101 between the projection optical system PL2 and the substrate P2,
and via the projection optical system PL2.
[0080] As an example, the present embodiment explains a case of
using, as the exposure apparatus EX2, a scanning type exposure
apparatus (a so-called scanning stepper) that, while synchronously
moving the mask M2 and the substrate P2 in mutually different
directions (opposite directions) in the scanning direction, exposes
the substrate P2 with the pattern formed on the mask M2. In the
following explanation, the direction that coincides with an optical
axis AX2 of the projection optical system PL2 is the Z axial
direction, the direction in which the mask M2 and the substrate P2
synchronously move in the plane perpendicular to the Z axial
direction (the scanning direction) is the X axial direction, and
the direction perpendicular to the Z axial direction and the X
axial direction (the non-scanning direction) is the Y axial
direction. In addition, the rotational (inclined) directions around
the X, Y, and Z axes are the .theta.X, .theta.Y, and .theta.Z
directions, respectively. Furthermore, "substrate" herein includes
one in which a semiconductor wafer is coated with a photoresist,
which is a photosensitive material, and "mask" includes a reticle
wherein is formed a device pattern that is reduction projected onto
the substrate.
[0081] The illumination optical system IL2 is supported by a
support column 105 fixed to the upper part of the main column 103.
The illumination optical system IL2 illuminates with the exposure
light EL2 the mask M2 supported by the mask stage MST2, and
includes: an exposure light source; an optical integrator that
uniformizes the intensity of the luminous flux emitted from the
exposure light source; a condenser lens that condenses the exposure
light EL2 from the optical integrator; a relay lens system; a
variable field stop that sets to a slit shape an illumination
region on the mask M2 illuminated by the exposure light EL2; and
the like. The illumination optical system IL2 illuminates the
predetermined illumination region on the mask M2 with the exposure
light EL2, having a uniform illumination intensity distribution.
Examples of light used as the exposure light EL2 emitted from the
illumination optical system IL2 include: deep ultraviolet light
(DUV light), such as bright lines (g, h, and i lines) in the
ultraviolet region emitted from a mercury lamp for example, and KrF
excimer laser light (248 nm wavelength); and vacuum ultraviolet
light (VUV light), such as ArF excimer laser light (193 nm
wavelength) and F.sub.2 laser light (157 nm wavelength). ArF
excimer laser light is used in the present embodiment.
[0082] In the present embodiment, pure water is used as the liquid
101. Pure water is capable of transmitting not only ArF excimer
laser light, but also deep ultraviolet light (DUV light), such as
the bright lines (g, h, and i lines) in the ultraviolet region
emitted from, for example, a mercury lamp, and KrF excimer laser
light (248 nm wavelength).
[0083] The mask stage MST2 supports the mask M2, and includes an
aperture 134A at its center part through which passes the pattern
image of the mask M2. A mask base plate 131 is supported on the
upper side step part 103A of the main column 103 via a vibration
isolating unit 106. An aperture 134B through which passes the
pattern image of the mask M2 is also formed at the center part of
the mask base plate 131. A plurality of gas bearings (air bearings)
132, which are non-contact bearings, is provided at the lower
surface of the mask stage MST2. The mask stage MST2 is supported by
the air bearings 132 in a non-contact manner with respect to an
upper surface (guide surface) 131A of the mask base plate 131, and
is two dimensionally movable by the mask stage drive mechanism,
such as a linear motor, within a plane perpendicular to the optical
axis AX2 of the projection optical system PL2, i.e., within the XY
plane, and is finely rotatable about the .theta.Z direction. A
movable minor 135 is provided at a predetermined position on the +X
side on the mask stage MST2. In addition, a laser interferometer
136 is provided at a position opposing the movable minor 135.
Likewise, although not shown, a movable minor is also provided on
the +Y side on the mask stage MST2, and a laser interferometer is
provided at a position opposing thereto. The laser interferometer
136 measures in real time the position, in the two dimensional
direction, and the rotational angle in the .theta.Z direction
(depending on the case, also including the rotational angles in the
.theta.X, .theta.Y directions) of the mask M2 on the mask stage
MST2, and outputs the measurement results to the control apparatus
CONT2. The control apparatus CONT2 drives the mask stage drive
mechanism based on the measurement results of the laser
interferometer 136, thereby positioning the mask M2, which is
supported by the mask stage MST2.
[0084] The projection optical system PL2 projects and exposes the
pattern of the mask M2 onto the substrate P2 with a predetermined
projection magnification .beta.. In the present embodiment, the
projection optical system PL2 is a reduction system having a
projection magnification .beta. of for example, 1/4 or 1/5.
Furthermore, the projection optical system PL2 may be either a
unity magnification system or an enlargement system. The projection
optical system PL2 includes: the optical element (first group) 102
disposed on the terminal side (the substrate P2 side) thereof and
that contacts the liquid 101; and an optical group (second group)
MPL2 that includes a plurality of optical elements disposed between
the optical member 102 and the mask M2 having a pattern.
Furthermore, in the present embodiment, the first group has only
the optical member 102, i.e., only one lens element (optical
element). A metal lens cell (first holding member) LS2 holds the
lens element 102. The lens cell LS2 is made of metal, and a spring
mechanism (not shown) is interposed between the lens cell LS2 and
the lens element 102. Further, a lens barrel (second holding
member) PK2 holds the optical group MPL2. The lens cell LS2 and the
lens barrel PK2 are isolated.
[0085] An outer circumferential part of the lens barrel PK2 is
provided with a flange part FLG2. In addition, a lens barrel base
plate 108 is supported via a vibration isolating unit 107 on the
lower side step part 103B of the main column 103. Furthermore,
engaging the flange part FLG2 to the lens barrel base plate 108
causes the lens barrel PK2, which holds the optical group MPL2, to
be supported by the lens barrel base plate (frame member) 108.
[0086] The lens cell LS2 that holds the lens element 102 is coupled
to the lens barrel base plate 108 by a coupling apparatus 160,
which is discussed in detail later, and supported by the lens
barrel base plate 108 via the coupling apparatus 160. The lens
element 102 held by the lens cell LS2 is movable by the coupling
apparatus 160 with respect to the optical group MPL2 held by the
lens barrel PK2.
[0087] Each of the plurality of optical elements that constitutes
the projection optical system PL2 is made of fluorite or quartz,
and aspherical surface polishing process is applied to the curved
surface of a part of the optical elements. In particular, if the
lens element 102 is made of fluorite, then this fluorite will
unfortunately corrode due to water if left as is over a long period
of time, and it is therefore coated beforehand with an appropriate
thin film to increase its affinity. Thereby, the liquid 101 can be
made to closely contact the substantially entire surface of the
liquid contact surface of the lens element 102, and the optical
path between the lens element 102 and the substrate P2 can thereby
be reliably filled with the liquid 101. Furthermore, the lens
element 102 may also be made of quartz, which has a high affinity
for water. In addition, if the liquid contact surface of the lens
element 102 is treated to make it hydrophilic (lyophilic), such as
with a coating, and its affinity for water is thereby increased,
then it may have a special film structure (for example, a film that
changes its molecular arrangement if an electric field is applied,
or a film that increases in temperature if a minute electric
current flows) so that, in a dried state wherein the water has been
removed from the immersion area AR2, moisture from the liquid
contact surface of the lens element 102 rapidly escapes.
[0088] The substrate stage PST2 is movable while holding the
substrate P2 by suction via a substrate holder PH2, and a plurality
of gas bearings (air bearing) 142, which are non-contact bearings,
is provided at the lower surface thereof. A substrate base plate
141 is supported on a base plate 104 via a vibration isolating unit
109. A substrate stage PST2 is supported by the air bearings 142 in
a non-contact manner with respect to an upper surface (guide
surface) 141A of the substrate base plate 141, and is finely
rotatable in the .theta.Z direction and two dimensionally movable
within a plane perpendicular to the optical axis AX2 of the
projection optical system PL2, i.e., within the XY plane, by a
substrate stage drive mechanism, such as a linear motor.
Furthermore, the substrate stage PST2 is also movable in the Z
axial direction, the .theta.X direction, and the .theta.Y
direction. The control apparatus CONT2 controls the substrate stage
drive mechanism. The substrate stage PST2 aligns the surface of the
substrate P2 with the image plane of the projection optical system
PL2 by an auto focus system and an auto leveling system, by
controlling the focus position (Z position) and the inclination
angle of the substrate P2, and also positions the substrate P2 in
the X axial direction and the Y axial direction.
[0089] A movable minor 180 that moves integrally with the substrate
stage PST2 is provided at a predetermined position on the +X side
on the substrate stage PST2 (substrate holder PH2), and a reference
mirror (fixed minor) 181 is provided at a predetermined position on
the +X side of the lens barrel PK2. In addition, a laser
interferometer 182 is provided at a position opposing the movable
mirror 180. The laser interferometer 182 irradiates the movable
mirror 180 with a measuring beam (measuring light), and also
irradiates the reference mirror 181 with a reference beam
(reference light) via minors 183A, 183B. The reflected light of
each of the movable mirror 180 and the reference mirror 181 based
on the irradiated measuring beam and the reference beam is received
by a light receiving part of the laser interferometer 182. The
laser interferometer 182 causes these light beams to interfere, and
measures the amount of change in the optical path length of the
measuring beam, using the optical path length of the reference beam
as a reference, and the position (coordinate) and/or displacement
of the movable mirror 180, using the reference minor 181 as a
reference. The lens barrel PK2 supports the reference minor 181,
and the substrate holder PH2 (substrate stage PST2) supports the
movable mirror 180. Likewise, although not shown, a movable mirror
and a reference mirror are also provided on the +Y side of the lens
barrel PK2 on the substrate stage PST2 respectively, and a laser
interferometer is provided at a position opposing thereto. The
laser interferometer 182 measures in real time the position in the
two dimensional direction and the rotational angle of the substrate
P2, and the measurement results are outputted to the control
apparatus CONT2. The control apparatus CONT2 moves and positions
the substrate P2 supported by the substrate stage PST2 by driving
the substrate stage drive mechanism, which includes a linear motor,
based on the measurement results of the laser interferometer
182.
[0090] In addition, an auxiliary plate 143 that surrounds the
substrate P2 is provided on the substrate stage PST2 (substrate
holder PH2). The auxiliary plate 143 has a flat surface of
substantially the same height as the surface of the substrate P2
held by the substrate holder PH2. The liquid 101 can be held below
the projection optical system PL2 using the auxiliary plate 143
even when exposing the edge area of the substrate P2.
[0091] The substrate stage PST2 is supported freely movable in the
X axial direction by an X guide stage 144. The substrate stage PST2
is movable by a predetermined stroke in the X axial direction by an
X linear motor 147 while being guided by the X guide stage 144. The
X linear motor 147 includes a stator 147A provided in the X guide
stage 144 extending in the X axial direction, and a slider 147B
provided corresponding to the stator 147A and fixed to the
substrate stage PST2. Furthermore, the substrate stage PST2 moves
in the X axial direction by driving the slider 147B with respect to
the stator 147A. Here, the substrate stage PST2 is supported, in a
non-contact manner, by a magnetic guide including an actuator and a
magnet that maintains a gap of a predetermined size in the Z axial
direction with respect to the X guide stage 144. The X linear motor
147 moves the substrate stage PST2 in the X axial direction in a
state supported by the X guide stage 144 in a non-contact
manner.
[0092] The ends of the X guide stage 144 in the longitudinal
direction are each provided with one of the pair of Y linear motors
148 capable of moving this X guide stage 144 along with the
substrate stage PST2 in the Y axial direction. The Y linear motors
148 respectively include sliders 148B, provided at both ends of the
X guide stage 144 in the longitudinal direction, and stators 148A
provided corresponding to these sliders 148B.
[0093] Furthermore, the X guide stage 144 along with the substrate
stage PST2 moves in the Y axial direction by driving the sliders
148B with respect to the stators 148A. In addition, the X guide
stage 144 can also be rotated in the OZ direction by adjusting the
respective drives of the Y linear motors 148. Accordingly, the
substrate stage PST2 is movable substantially integrally with the X
guide stage 144 in the Y axial direction and the OZ direction by
these linear motors 148.
[0094] Guides 149 that guide the movement of the X guide stage 144
in the Y axial direction are provided respectively on both sides of
the substrate base plate 141 in the X axial direction. Each guide
part 149 is supported on the base plate 104. Further, a U-shaped
guided member 145 is provided on the lower surface of the X guide
stage 144 at each end of the X guide stage 144 in the longitudinal
direction. Each guide part 149 is provided so that it engages with
the respective guided member 145, and so that the upper surface
(the guide surface) of each guide part 149 opposes the inner
surface of the guided member 145. The guide surface of each guide
part 149 is provided with a gas bearing (air bearing) 146, which is
a non-contact bearing, and the X guide stage 144 is supported by
the guide surfaces of the guide parts 149 in a non-contact
manner.
[0095] FIG. 8 is an enlarged view that depicts the vicinity of the
liquid supply mechanism 110, the liquid recovery mechanism 120, and
the tip portion of the projection optical system PL2.
[0096] The liquid supply mechanism 110 supplies the liquid 101
between the projection optical system PL2 and the substrate P2, and
includes a liquid supply section 111 capable of feeding the liquid
101; and supply nozzles 114, which are connected to the liquid
supply section 111 via a supply pipe 115, that supply the liquid
101 fed from this liquid supply section 111 onto the substrate P2.
The supply nozzles 114 are disposed proximate to the surface of the
substrate P2. The liquid supply section 111 includes a tank that
stores the liquid 101, a pressurizing pump, a temperature regulator
that adjusts the temperature of the liquid 101 to be supplied, and
the like, and supplies the liquid 101 onto the substrate P2 via the
supply pipe 115 and the supply nozzles 114. The control apparatus
CONT2 controls the operation by which the liquid supply section 111
supplies the liquid, and can control the amount of liquid supplied
per unit of time onto the substrate P2 by the liquid supply section
111.
[0097] The liquid recovery mechanism 120 recovers the liquid 101 on
the substrate P2 supplied by the liquid supply mechanism 110, and
includes recovery nozzles 121 disposed proximate to the surface of
the substrate P2, and a liquid recovery section 125 connected to
the recovery nozzles 121 via a recovery pipe 124. The liquid
recovery section 125 includes a suction pump, and a tank that can
store the recovered liquid 101. The liquid 101 recovered by the
liquid recovery section 125 is, for example, discharged, or cleaned
and returned to the liquid supply section 111, and the like, for
reuse.
[0098] When forming the immersion area AR2 on the substrate P2, the
control apparatus CONT2 drives the liquid supply section 111 to
supply a predetermined amount of the liquid 101 per unit of time
via the supply pipe 115 and the supply nozzles 114, and also drives
the liquid recovery section 125 to recover a predetermined amount
of the liquid 101 per unit of time via the recovery nozzles 121 and
the recovery pipe 124. Thereby, an immersion area AR2 of the liquid
101 is formed between the lens element 102 of the terminal end part
of the projection optical system PL2 and the substrate P2.
[0099] Furthermore, as depicted in the partial cross sectional
views of FIG. 7 and FIG. 8, the liquid supply mechanism 110 and the
liquid recovery mechanism 120 are supported and isolated from the
lens barrel base plate 108. Thereby, vibrations produced by the
liquid supply mechanism 110 and the liquid recovery mechanism 120
do not transmit to the projection optical system PL2 via the lens
barrel base plate 108.
[0100] FIG. 9 is plan view that depicts the positional relationship
between the liquid supply mechanism 110, the liquid recovery
mechanism 120, and the projection area AR1 of the projection
optical system PL2. The projection area AR1 of the projection
optical system PL2 is a rectangular shape (slit shape) that is long
in the Y axial direction; further, the three supply nozzles
114A-114C are disposed on the +X side and the two recovery nozzles
121A, 121B are disposed on the X side so that the projection area
AR1 is interposed therebetween in the X axial direction.
Furthermore, the supply nozzles 114A-114C are connected to the
liquid supply section 111 via the supply pipe 115, and the recovery
nozzles 121A, 121B are connected to the liquid recovery section 125
via the recovery pipe 124. In addition, supply nozzles 114'-114C'
and recovery nozzles 121A', 121a are disposed in an arrangement
substantially 180.degree. rotated from the supply nozzles 114A-114C
and the recovery nozzles 121A, 121B. The supply nozzles 114A-114C
and the recovery nozzles 121A', 121B' are alternately arrayed in
the Y axial direction, the supply nozzles 114A'-114C' and the
recovery nozzles 121A, 121B are alternately arrayed in the Y axial
direction, the supply nozzles 114A'-114C' are connected to the
liquid supply section 111 via a supply pipe 115', and the recovery
nozzles 121A', 121B' are connected to the liquid recovery section
125 via a recovery pipe 124'.
[0101] FIG. 10 is an oblique view that depicts the coupling
apparatus 160 that couples the lens cell LS2 and the lens barrel
base plate 108.
[0102] The coupling apparatus 160 includes a parallel link
mechanism provided with a plurality of link parts 161 arranged in a
row and each having an actuator unit 162. In the present
embodiment, the coupling apparatus 160 is a six degrees of freedom
parallel link mechanism including six link parts 161, and the lens
cell LS2 is kinematically supported. In the present embodiment, the
link parts 161 are disposed at substantially 120.degree. intervals,
two at a time as pairs. Furthermore, the six link parts 161 may be
arranged at equal intervals, or may be arranged at unequal
intervals.
[0103] Each link part 161 includes a first linking member 164
linked to the lens cell LS2 via a spherical bearing 163, and a
second linking member 166 linked to the lens barrel base plate 108
via a spherical bearing 165. The first and second linking members
164, 166 are shaft shaped members, and are provided movable in the
axial direction with respect to a tubular member 167 that
constitutes the actuator unit 162. Furthermore, the first and
second linking members 164, 166 can be moved in the axial direction
with respect to the tubular member 167 of the actuator unit 162 by
driving the actuator unit 162, and thereby the link part 161 can
maintain or change (expand or contract) the spacing between the
spherical bearing 163 and the spherical bearing 165.
[0104] By expanding and contracting each of the link parts 161, the
coupling apparatus 160 can maintain or adjust the attitude of the
lens cell LS2 with respect to the lens barrel base plate 108.
Because the lens barrel PK2 that holds the optical group MPL2 is
supported by the lens barrel base plate 108, and the lens element
102 is held by the lens cell LS2, the coupling apparatus 160 can
substantially maintain or adjust the attitude of the lens element
102 with respect to the optical group MPL2 by expanding or
contracting each of the link parts 161.
[0105] FIG. 11 is a cross sectional view of the link part 161.
[0106] In FIG. 11, the link part 161 includes the tubular member
167, and the first and second linking members 164, 166, which are
shaft shaped members provided movable (retractable) with respect to
the tubular member 167. The spherical bearings 163, 165 are
provided respectively at tip parts 164A, 166A of the first and
second linking members 164, 166. Gas bearings (air bearings) 168,
169, which are non-contact bearings, are disposed respectively
between the tubular member 167 and the first and second linking
members 164, 166. Furthermore, other systems of bearings that use
magnetism and the like can also be used as the non-contact
bearings. Two air bearings 168 are provided arranged in a row in
the axial direction at a position opposing the first linking member
164 on the inner surface of the tubular member 167. Likewise, two
air bearings 169 are provided lined up in the axial direction at a
position opposing the second linking member 166 on the inner
surface of the tubular member 167. These air bearings 168, 169 are
tubularly provided along the inner surface of the tubular member
167. A gas supply source 171 supplies compressed gas (air) to the
air bearings 168, 169 via a passageway 170 formed inside the
tubular member 167. The first and second linking members 164, 166
are supported by the air bearings 168, 169 in a non-contact manner
with respect to the tubular member 167.
[0107] A first voice coil motor 172 is disposed between the first
linking member 164 and the tubular member 167 as a drive mechanism
that drives the first linking member 164. In the present
embodiment, a coil 172A is provided along the inner surface of the
tubular member 167 and a magnet 172B is provided along an outer
circumferential surface of the first linking member 164, both
constituting the first voice coil motor 172. Furthermore, driving
the first voice coil motor 172 generates Lorentz's force, and the
first linking member 164 supported by the tubular member 167 in a
non-contact manner is movable in the axial direction thereof.
[0108] Likewise, a second voice coil motor 173 is disposed between
the second linking member 166 and the tubular member 167 as a drive
mechanism that drives the second linking member 166. A coil 173A is
provided along the inner surface of the tubular member 167 and a
magnet 173B is provided along the outer circumferential surface of
the second linking member 166, both constituting the second voice
coil motor 173. Furthermore, driving the second voice coil motor
173 generates Lorentz's force, and the second linking member 166
supported by the tubular member 167 in a non-contact manner is
movable in the axial direction thereof.
[0109] The link part 161 uses Lorentz's force produced by the voice
coil motors 172, 173 to move the first and second linking members
164, 166, and the distance between the tip part 164A of the first
linking member 164 and the tip part 166A of the second linking
member 166 can thereby be changed. In other words, the link part
161 is expandable and contractible.
[0110] The first linking member 164 and the second linking member
166 are linked in a non-contact manner, and a space 174
therebetween is connected to a vacuum apparatus 176 via a
passageway 175 formed in the tubular member 167.
[0111] By driving the vacuum apparatus 176, a negative pressure is
applied to the space 174. Thereby, in a state wherein the lens cell
LS2 is linked to the first linking member 164 and the lens barrel
base plate 108 is linked to the second linking member 166, even if
the first linking member 164 receives a force, such as the weight
of the lens cell LS2 and its own weight of the first linking member
164, in a direction away from the second linking member 166, a
counterforce acts to pull together the first linking member 164 and
second linking member 166 which are linked in a non-contact manner.
Furthermore, if the lens cell LS2 is held with the projection
optical system PL2 turned upside down, then a positive pressure may
be applied to the space 174 between the first linking member 164
and the second linking member 166.
[0112] A first encoder 177, which is a position measuring apparatus
that measures the position information of the first linking member
164 with respect to the tubular member 167, is provided at a
predetermined position disposed at a rear end part 164B of the
first linking member 164, i.e., at the space 174 of the first
linking member 164. Likewise, a second encoder 178, which is a
position measuring apparatus that measures the position information
of the second linking member 166 with respect to the tubular member
167, is provided at a predetermined position disposed at the rear
end part 166B of the second linking member 166, i.e., at the space
174 of the second linking member 166. The measurement result of
each of the first and second encoders 177, 178 is outputted to the
control apparatus CONT2. Further, because the relative position
information between the first linking member 164 and the tubular
member 167 is measured by the first encoder 177, and the relative
position information between the second linking member 166 and the
tubular member 167 is measured by the second encoder 178, the
control apparatus CONT2 can obtain the position information of the
first linking member 164 with respect to the second linking member
166 based on the measurement results of these first and second
encoders 177, 178. The first linking member 164 is linked to the
lens cell LS2 that holds the lens element 102, and the second
linking member 166 is linked to the lens barrel base plate 108 that
supports the lens barrel PK2 that holds the optical group MPL2.
Accordingly, by obtaining the position information of the first
linking member 164 with respect to the second linking member 166,
the control apparatus CONT2 can substantially obtain the position
information of the lens cell LS2 (the lens element 102) with
respect to the lens barrel base plate 108 (the optical group
MPL2).
[0113] Further, based on the measurement results of the first and
second encoders 177, 178 provided in each of the six link parts
161, the control apparatus CONT2 obtains the attitude information
of the lens cell LS2 (lens element 102) with respect to the lens
barrel base plate 108 (optical group MPL2).
[0114] When expanding and contracting each of the link parts 161 in
the present embodiment (when changing the distance between the tip
part 164A of the first linking member 164 and the tip part 166A of
the second linking member 166), only the first voice coil motor 172
is driven, and the second voice coil motor 173 is not driven.
Further, because the air bearing 168 supports the first linking
member 164 in a non-contact manner with respect to the tubular
member 167, when driving the voice coil motor 172 in order to
change the distance between the tip part 164A of the first linking
member 164 and the tip part 166A of the second linking member 166,
the tubular member 167 moves in a direction the opposite of the
movement direction of the first linking member 164 by just the
amount of that applied drive impulse divided by the mass of the
tubular member 167. This movement of the tubular member 167 offsets
the reaction force which is generated with the drive of the voice
coil motor 172 in order to move the first linking member 164, or in
order to maintain the attitude of the first linking member 164
after the movement. In other words, this tubular member 167
functions as a so-called counter mass. The action of the tubular
member 167 as a counter mass absorbs the vibrations produced by the
movement of the lens cell LS2 via the first linking member 164, and
those vibrations therefore do not transmit to the lens barrel base
plate 108.
[0115] In addition, when, for example, a force is applied to the
lens cell LS2 by the liquid 101, the voice coil motor 172 drives to
maintain the attitude of the lens cell LS2, i.e., so that the first
linking member 164 does not move. At this time, the tubular member
167 moves in the direction the reverse of the direction in which
the voice coil motor 172 applied a force to the first linking
member 164, and the reaction force which is generated with the
drive of the voice coil motor 172 is thereby offset. In this case
as well, the action of the tubular member 167 absorbs the
vibrations produced by the lens cell LS2, and it is therefore
possible to prevent the transmission of those vibrations to the
lens barrel base plate 108.
[0116] The following explains the procedure for using the exposure
apparatus EX2 discussed above to expose the pattern of the mask M2
onto the substrate P2.
[0117] After the mask M2 is loaded onto the mask stage MST2 and the
substrate P2 is loaded onto the substrate stage PST2, the control
apparatus CONT2 drives the liquid supply section 111 of the liquid
supply mechanism 110, and supplies a predetermined amount of liquid
101 per unit of time onto the substrate P2 via the supply pipe 115
and the supply nozzles 114. In addition, the control apparatus
CONT2 drives the liquid recovery section 125 of the liquid recovery
mechanism 120 as the liquid supply mechanism 110 supplies the
liquid 101, and recovers a predetermined amount of the liquid 101
per unit of time via the recovery nozzles 121 and the recovery pipe
124. Thereby, the immersion area AR2 of the liquid 101 is formed
between the lens element 102 of the tip part of the projection
optical system PL2 and the substrate P2. Furthermore, the control
apparatus CONT2 illuminates the mask M2 with the exposure light EL2
by the illumination optical system 1L2, and projects an image of
the pattern of the mask M2 onto the substrate P2 via the projection
optical system PL2 and the liquid 101.
[0118] During a scanning exposure, the pattern image of part of the
mask M2 is projected onto the projection area AR1, and the
substrate P2 moves in the +X direction (or -X direction) at a speed
.beta.V (where .beta. is the projection magnification) via the
substrate stage PST2 synchronized to the movement of the mask M2 at
the speed V in the -X direction (or +X direction) with respect to
the projection optical system PL2. Further, after the exposure of
one shot region is completed, the next shot region moves to the
scanning start position by the stepping of the substrate P2, and
the exposure process is successively performed subsequently for
each shot region by the step-and-scan system. In the present
embodiment, the liquid 101 is flowed in a direction parallel to and
identical to the movement direction of the substrate P2. In other
words, if the scanning exposure is performed by moving the
substrate P2 in the scanning direction (the -X direction) depicted
by an arrow Xa2 (refer to FIG. 9), then the liquid supply mechanism
110 and the liquid recovery mechanism 120 use the supply pipe 115,
the supply nozzles 114A-114C, the recovery pipe 124, and the
recovery nozzles 121A, 121B to supply and recover the liquid 101.
In other words, when the substrate P moves in the -X direction, the
supply nozzles 114 (114A-114C) supply the liquid 101 between the
projection optical system PL2 and the substrate P2, the recovery
nozzles 121 (121A, 121B) recover the liquid 101 on the substrate
P2, and the liquid 101 thereby flows in the -X direction so that it
fills between the lens element 102 at the tip portion of the
projection optical system PL2 and the substrate P2. On the other
hand, if the scanning exposure is performed by moving the substrate
P2 in the scanning direction (the +X direction) depicted by an
arrow Xb2 (refer to FIG. 9), then the liquid supply mechanism 110
and the liquid recovery mechanism 120 use the supply pipe 115', the
supply nozzles 114A'-114C', the recovery pipe 124', and the
recovery nozzles 121A', 121B' to supply and recover the liquid 101.
In other words, when the substrate P moves in the +X direction, the
supply nozzles 114' (114A'-114C') supply the liquid 101 between the
projection optical system PL2 and the substrate P2, the recovery
nozzles 121' (121A', 121B') recover the liquid 101, and the
surrounding gas, on the substrate P2, and the liquid 101 thereby
flows in the +X direction so that it fills between the lens element
102 at the tip portion of the projection optical system PL2 and the
substrate P2. In this case, the liquid 101 can be easily supplied
between the lens element 102 and the substrate P2, even if the
supplied energy of the liquid supply mechanism 110 (liquid supply
part 111) is small, because the liquid 101 supplied, for example,
via the supply nozzles 114, flows so that it is drawn between the
lens element 102 and the substrate P2 as the substrate P2 moves in
the -X direction. Further, even if the substrate P2 is scanned in
either the +X direction or the -X direction by switching the
direction in which the liquid 101 flows in accordance with the
scanning direction, the liquid 101 can be filled between the lens
element 102 and the substrate P2, and a high resolution and large
depth of focus can thereby be obtained.
[0119] Here, the vibration component produced by the substrate P2
side due to the movement of the substrate stage PST2 in the XY
direction to perform scanning and exposure, and/or due to the
movement in the Z axial direction and the inclined directions
(.theta.X, .theta.Y directions) to perform focus-leveling
adjustment, may be transmitted to the lens element 102 via the
liquid 101 of the immersion area AR2. In addition, it is also
conceivable that the viscous resistance of the liquid 101 in the
immersion area AR2 may move the lens element 102 when scanning the
substrate P2. In that case, there is a possibility that the pattern
image projected onto the substrate P2 via the projection optical
system PL2 and the liquid 101 will unfortunately degrade.
[0120] Incidentally, because the lens element 102, which contacts
the liquid 101, and the optical group MPL2 are isolated and held by
the lens cell LS2 and the lens barrel PK2, respectively, the lens
element 102 and the optical group MPL2 can be vibrationally
isolated. Accordingly, it is possible to suppress the transmission
to the optical group MPL2 of vibrations transmitted to the lens
element 102.
[0121] When vibrations act upon the lens element 102, the lens
element 102 moves, and changes its relative position with the
optical group MPL2, and there is consequently a possibility of
inviting degradation of the pattern image therewith. At this time,
the control apparatus CONT2 obtains the attitude information of the
lens element 102 with respect to the optical group MPL2 based on
the measurement results of the first and second encoders 177, 178
provided in each of the link parts 161 that constitute the coupling
apparatus 160.
[0122] The control apparatus CONT2 can maintain in a desired state
the position (attitude) of the lens element 102 with respect to the
optical group MPL2 by driving the first voice coil motor 172 of
each of the link parts 161 based on the obtained attitude
information. In other words, the control apparatus CONT2 performs
feedback control wherein the first voice coil motor 172 is driven
to maintain in a desired state the attitude of the lens element 102
with respect to the optical group MPL2 based on the measurement
results of the first and second encoders 177, 178. Thereby, even if
vibrations act upon the lens element 102, the lens element 102
moves, and thereby the relative position with respect to the
optical group MPL2 is made to change, the positional relationship
between the optical group MPL2 and the lens element 102 can be
constantly maintained, and it is therefore possible to ensure that
vibrations of the lens element 102 do not transmit to the optical
group MPL2.
[0123] At this time, the control apparatus CONT2 obtains the
position information of the lens element 102 with respect to the
optical group MPL2 in each of the X axial, Y axial, Z axial,
.theta.X, .theta.Y and AZ directions by performing arithmetic
processing based on the measurement results of the encoders 177,
178 provided in each of the six link parts 161. In addition, the
control apparatus CONT2 controls the position of the lens element
102 with respect to the optical group MPL2 in each of the X axial,
Y axial, Z axial, .theta.X, .theta.Y and .theta.Z directions by
expanding and contracting each of the six link parts 161.
[0124] Furthermore, because vibrations produced when driving the
first voice coil motor 172 are absorbed by the action of the
tubular member 167 as a counter mass, which is a vibration
isolating mechanism built in the link part 161, it is possible to
ensure that the vibrations are not transmitted to the optical group
MPL2 via the lens barrel base plate 108 and the lens barrel PK2.
Accordingly, it is possible to prevent degradation of the pattern
image projected onto the substrate P2.
[0125] In addition, by preventing the transmission of the
vibrations to the optical group MPL2 and to the lens barrel PK2
that holds the optical group MPL2, the measurement of the position
information of the substrate stage PST2 and the control of its
position based on those measurement results can be performed with
good accuracy, even if the reference mirror (fixed mirror) 181 of
the interferometer system for measuring the position information of
the substrate stage PST2 is affixed to the lens barrel PK2.
[0126] In the present embodiment, when each link part 161 is
expanded and contracted, and the attitude of the lens element 102
held by the lens cell LS2 is controlled, only the first voice coil
motor 172 is driven, and the second voice coil motor 173 is not
driven, as discussed above. In other words, when controlling the
attitude of the lens element 102, electric power for its control is
supplied only to the first voice coil motor 172, and hardly any (or
no) electric power is supplied to the second voice coil motor 173.
Furthermore, when moving the first voice coil motor 172 for
controlling the attitude of the lens element 102, for example,
toward the arrow J1 side in FIG. 11, then the tubular member 167
moves toward the arrow J2 side. At this time, the second linking
member 166 linked to the lens barrel base plate 108 does not move.
Depending on the scanning exposure conditions, there is a
possibility that the tubular member 167 will continue to move only
in, for example, the arrow J2 direction. In that case, there is a
possibility that the first linking member 164 will disconnect from
the tubular member 167 if the relative position gap between the
tubular member 167 and the first and second linking members 164,
166 increases. Therefore, when the relative position between the
tubular member 167 and the first and second linking members 164,
166 exceeds a permissible value, the control apparatus CONT2
corrects the position of the tubular member 167 by driving the
second voice coil motor 173. Furthermore, the second voice coil
motor 173 may be driven with a timing other than the exposure
operation, such as, for example, during replacement of the
substrate, and/or the time from after the exposure of the first
shot region until before the exposure of the next second shot
region. Furthermore, when the attitude of the lens element 102 (the
lens cell LS2) is controlled by the first voice coil motor 172
during exposure, the vacuum apparatus 176 maintains the space 174
at a constant pressure.
[0127] In the present embodiment, by negatively pressurizing the
space 174 between the first linking member 164 and the second
linking member 166, the relative position (distance) between the
first linking member 164 and second linking member 166 which are
linked in anon-contact manner is maintained, even if the first
linking member 164 receives a force, due to, for example, the
weight of the lens cell LS2 and its own weight of the first linking
member 164, in a direction away from the second linking member 166.
Further, by continuing to supply electric power to the voice coil
motors 172, 173, it is also possible that they will be subject to
the weight of the lens cell LS2 and its own weight of the first
linking member 164; in that case, there is a possibility that the
amount of electric power supplied to the voice coil motors will
increase, and it cause the generation of heat. Because the link
parts 161 are disposed in the vicinity of the image plane of the
projection optical system PL2, there is a possibility that the
generation of heat will cause degradation of the pattern image
projected onto the substrate P2.
[0128] Furthermore, because the weight of the lens cell LS2 and its
own weight of the first linking member 164 are supported by
applying a negative pressure to the space 174, the electric power
supplied to the voice coil motors may be just the electric power
for controlling the attitude of the lens cell LS2 (the lens element
102). Accordingly, the amount of electric power supplied to the
voice coil motors can be curbed, and the problems associated with
the generation of heat can be suppressed.
[0129] Furthermore, a temperature regulator may be provided for
adjusting the temperature of (for cooling) these voice coil motors
172, 173 in order to suppress the impact on the pattern image due
to the generation of heat by the voice coil motors 172, 173.
[0130] By providing the space 174, the elastic action of the gas of
that space 174 can reduce the high frequency component of the
vibrations that attempt to transmit from the lens cell LS2 side to
the lens barrel base plate 108 side.
[0131] Furthermore, because the relatively low frequency component
of the vibrations is reduced by the voice coil motors, the link
parts 161 (the coupling apparatus 160) can achieve the affect of
eliminating the vibrations over a broad frequency band. Thus, by
combining active vibration isolation (dynamic vibration isolation)
using the voice coil motors with passive vibration isolation
(passive vibration isolation) using the elastic action of the gas
of the space 174, it is possible to effectively suppress the
transmission to the optical group MPL2 of the vibrations that act
upon the lens element 102.
[0132] Furthermore, instead of a constitution wherein the weight of
the lens cell LS2 and its own weight of the first linking member
164 are received by the space 174 negatively pressurized, the first
linking member 164 and the second linking member 166 may be linked
by, for example, a spring member.
[0133] Furthermore, in the present embodiment, the lens cell LS2 is
constituted so that it holds only one lens element 102, but may be
constituted so that it holds a plurality of lens elements (optical
elements).
[0134] In addition, in the exposure apparatus of the second
embodiment as well, the projection optical system PL2 is divided
into two groups: the optical element 102, and the projection
optical system main body MPL2 between the mask M2 and the optical
element 102; however, it may be divided into three or more
groups.
[0135] Furthermore, in the abovementioned embodiment, the second
linking member 166 of the link part 161 is linked to the lens
barrel base plate 108, but may be linked to another member, e.g.,
the column 103 (the lower side step part 103B).
[0136] Furthermore, in the abovementioned embodiment, the attitude
control (the control of the active vibration isolation from the
optical group MPL2) of the lens element 102 is accomplished by
feedback control based on the result of measuring the position of
the lens element 102 by the encoders 177, 178; however, in that
case, there is the possibility of control delays. Therefore, it is
also possible to perform active vibration isolation with
feedforward control, wherein, physical quantities related to the
behavior of the exposure apparatus EX2 and/or the liquid 101 during
scanning exposure are obtained prior to performing the exposure,
and the attitude of the lens element 102 is controlled by driving
the link part 161 (voice coil motor 172) during the exposure based
on those obtained physical quantities. Furthermore, it is also
possible to combine feedback control and feedforward control.
[0137] If performing feedforward control, then a test exposure is
performed beforehand and a plurality of physical quantities are
obtained. Namely, an identification test is performed on the system
of the exposure apparatus EX2, and the dynamic characteristics,
including the physical quantities of that system, are obtained. In
the identification test, the substrate stage PST2 is scanned in a
state wherein the immersion area AR2 is formed between the lens
element 102 and the substrate P2 using the liquid supply mechanism
110 and the liquid recovery mechanism 120, and the physical
quantities are detected using the abovementioned encoders 177, 178
and/or the laser interferometer 182. Furthermore, the voice coil
motors 172, 173 are, of course, not driven during the
identification test. The detected physical quantities include: the
time during the exposure sequence; the position, speed, and
acceleration of the substrate P2; the position, speed, and
acceleration of the lens element 102; the relative position, the
relative speed, and the relative acceleration between the lens
element 102 and the substrate P2; and the like. The position,
speed, and acceleration values are detected for all X axial, Y
axial, Z axial, .theta.X, .theta.Y and .theta.Z directions (six
degrees of freedom). Furthermore, the detected physical quantities
include the amount (volume and mass), for example, of the liquid 1
to be supplied. The plurality of physical quantities detected by
the identification test are stored in the control apparatus CONT2.
Based on the detected physical quantities, the control apparatus
CONT2 determines the control quantities (electric power for
control) for driving the voice coil motors 172 (173), and performs
the exposure while driving the voice coil motor 172 based on those
determined physical quantities so that it vibrationally isolates
the optical group MPL2. Thus, the control apparatus CONT2 can use
the voice coil motor 172 to perform vibration isolation in
accordance with the dynamic characteristics (operation) of the
exposure apparatus EX2 itself, and can maintain the positional
relationship between the optical group MPL2 and the lens element
102 in the desired state.
[0138] Incidentally, as discussed above, the control apparatus
CONT2 can control the attitude of the lens element 102 by expanding
and contracting each of the plurality of link parts 161. Therefore,
by actively controlling the attitude of the lens element 102 with
respect to the optical group MPL2 by expanding and contracting the
link parts 161, the control apparatus CONT2 can adjust the pattern
image to be formed on the substrate P2 via the projection optical
system PL2. Furthermore, by driving the lens element 102, at least
one of the image plane, the image position, and the distortion can
be controlled. By employing the constitution wherein the pattern
image is adjusted by driving the lens element 102, a high speed
response can be achieved compared to the constitution wherein the
heavy substrate stage PST2 is driven, because the relatively
lightweight lens element 102 is driven, for example, when aligning
the image plane of the projection optical system PL2 to the surface
of the substrate P2. Of course, in that case, both the substrate
stage PST2 and the lens element 102 may be driven.
[0139] The abovementioned embodiment is constituted to obtain the
attitude of the lens element 102 based on the measurement results
of the encoders 177, 178 provided in each of the six link parts
161. In this case, because the control apparatus CONT2 obtains the
attitude information of the lens element 102 by performing
arithmetic processing based on the measurement results of the
encoders 177, 178 of the six link parts 161, errors in the position
measurement (arithmetic errors) may arise due to errors in the
attachment and the installation of the link parts 161, and the
like. Therefore, as shown in FIG. 12, the position information of
the lens element 102 with respect to the optical group MPL2 may be
measured by a measuring apparatus 190 including a laser
interferometer system. The control apparatus CONT2 controls the
attitude of the lens element 102 by expanding and contracting each
of the link parts 161 based on the measurement result of that
measuring apparatus 190. Because the position information of the
lens element 102 with respect to the optical group MPL2 can be
directly derived by the laser interferometer system without going
through arithmetic processing, the position information of the lens
element 102 can be derived with good accuracy.
[0140] In FIG. 12, the measuring apparatus (laser interferometer
system) 190 includes a movable mirror 191 provided at a
predetermined position on the +X side of the lens cell LS2, a
reference mirror (fixed mirror) 192 provided at a predetermined
position on the +X side of the lens barrel PK2, and a laser
interferometer 193 provided at a position opposing the movable
mirror 191 and the reference mirror 192. The laser interferometer
193 irradiates the movable mirror 191 with a measuring beam
(measuring light), and irradiates the reference mirror 192 with a
reference beam (reference light). The reflected lights respectively
from the movable mirror 191 and the reference minor 192 based on
the radiated measuring beam and the reference beam are received by
the light receiving portion of the laser interferometer 193, the
laser interferometer 193 causes these lights to interfere, and
measures the amount of change of the optical path length of the
measuring beam using the optical path length of the reference beam
as a reference, and consequently measures the position (coordinate)
of the movable minor 191 using the reference minor 192 as a
reference. Because the reference minor 192 is provided on the lens
barrel PK2 and the movable mirror 191 is provided on the lens cell
LS2, the laser interferometer 193 can measure the position in the X
axial direction of the lens cell LS2 with respect to the lens
barrel PK2. Likewise, although not shown, a movable minor and a
reference minor are also provided on the +Y side of the lens cell
LS2 and the lens barrel PK2, a laser interferometer is provided at
a position opposing thereto, and this laser interferometer can
measure the position in the Y axial direction of the lens cell LS2
with respect to the lens barrel PK2. In addition, the position in
the .theta.Z direction of the lens cell LS2 with respect to the
lens barrel PK2 can be measured by, for example, the laser
interferometer 193 irradiating the movable minor 191 and the
reference mirror 192 with at least two beams lined up in a row in
the Y axial direction.
[0141] Furthermore, laser interferometers 194 (194A-194C) are
respectively affixed to the lens barrel PK2 at a plurality of
mutually differing predetermined locations (three locations) in the
circumferential direction of the lens barrel PK2. However, FIG. 12
representatively depicts just the one laser interferometer 194A of
the three laser interferometers 194A-194C. In addition, a movable
minor 195 is affixed at a position opposing each of the laser
interferometers 194 on the upper surface of the lens cell LS2, and
each movable mirror 195 is irradiated by a measuring beam from each
of the laser interferometers 194 parallel to the Z axial direction.
Furthermore, the reference minor corresponding to each laser
interferometer 194 is affixed to the lens barrel PK2 or built in
the laser interferometer 194, but is not depicted in FIG. 12. The
laser interferometer 194 can measure the position in the Z axial
direction of the lens cell LS2 with respect to the lens barrel PK2.
In addition, the position in the .theta.X, .theta.Y directions of
the lens cell LS2 with respect to the lens barrel PK2 can be
measured based on the measurement result of each of the three laser
interferometers 194.
[0142] The measurement result of each of the abovementioned laser
interferometers is outputted to the control apparatus CONT2. The
control apparatus CONT2 expands and contracts each of the plurality
of link parts 161 based on the measurement result of each of the
abovementioned laser interferometers, i.e., based on the position
information of the lens cell LS2 with respect to the lens barrel
PK2 in each of the X axial, Y axial, Z axial, .theta.X, .theta.Y
and .theta.Z directions, thereby enabling control of the position
of the lens cell LS2 with respect to the lens barrel PK2 in each of
the X axial, Y axial, Z axial, .theta.X, .theta.Y and .theta.Z
directions.
[0143] Furthermore, in the present embodiment, the measuring
apparatus 190 measures the positional relationship between the lens
cell LS2 and the lens barrel PK2; however, because the lens cell
LS2 holds the lens element 102 and the lens barrel PK2 holds the
optical group MPL2, the measurement of the positional relationship
between the lens cell LS2 and the lens barrel PK2 and the
measurement of the positional relationship between the lens element
102 and the optical group MPL2 are substantially equivalent.
Accordingly, the control apparatus CONT2 can obtain the positional
relationship between the lens element 102 and the optical group
MPL2 based on the measurement result of the measuring apparatus
190.
[0144] The laser interferometer in the present embodiment is a
so-called double pass interferometer.
[0145] FIG. 13 is a schematic block diagram of the interferometer
193. Furthermore, the other interferometers 194, 182 and the like
also have a constitution equivalent to the interferometer depicted
in FIG. 13. The interferometer 193 includes a light source 220 that
radiates a light beam; a polarizing beam splitter 224 that divides
the light beam that is irradiated from the light source 220 and
enters via a reflecting minor 223 into a measuring beam 191A and a
reference beam 192A; quarter-wave plates 225 (225A, 225B) disposed
between the polarizing beam splitter 224 and the movable mirror 191
and through which passes the measuring beam 191A from the
polarizing beam splitter 224; quarter-wave plates 226 (226A, 226B)
disposed between the polarizing beam splitter 224 and the reference
minor 192 and through which passes the reference beam 192A from the
polarizing beam splitter 224 via a reflecting minor 227; a corner
cube 228 to which the measuring beam 191A reflected by the movable
mirror 191 and the reference beam 192A reflected by the reference
mirror 192 enters via the polarizing beam splitter 224; and a light
receiving portion 230 that receives the synthesized light
(interference light) of the reflected light of the measuring beam
191A and the reflected light of the reference beam 192A synthesized
by the polarizing beam splitter 224.
[0146] The light beam that enters the polarizing beam splitter 224
from the light source 220 is divided into the measuring beam 191A
and the reference beam 192A. The measuring beam 191A passes through
the quarter-wave plate 225A, and then irradiates the movable minor
191. By passing through the quarter-wave plate 225A, the linearly
polarized measuring beam 191A is converted to circularly polarized
light, and then irradiates the movable minor 191. The reflected
light of the measuring beam 191A that irradiated the movable mirror
191 once again passes through the quarter-wave plate 225A, then
enters the polarizing beam splitter 224 and is sent to the corner
cube 228. The measuring beam 191A from the corner cube 228 once
again enters the polarizing beam splitter 224, passes through the
quarter-wave plate 225B, and then irradiates the movable mirror
191. That reflected light once again passes through the
quarter-wave plate 225B, and enters the polarizing beam splitter
224. The reference beam 192A emitted from the polarizing beam
splitter 224 passes through the quarter-wave plate 226A via the
reflecting minor 227, and then irradiates the reference minor 192.
The reference beam 192A irradiates the reference minor 192 with
circularly polarized light. The reflected light once again passes
through the quarter-wave plate 226A, then enters the polarizing
beam splitter 224 and is sent to the corner cube 228. The reference
beam 192A from the corner cube 228 once again enters the polarizing
beam splitter 224, passes through the quarter-wave plate 226B, and
then irradiates the reference minor 192. The reflected light once
again passes through the quarter-wave plate 226B, and then enters
the polarizing beam splitter 224. The measuring beam 191A that
passed through the quarter-wave plate 225B and the reference beam
192A that passed through the quarter-wave plate 226B are
synthesized by the polarizing beam splitter 224, and then received
by the light receiving portion 230. Thus, the interferometer 193 of
the present embodiment includes a so-called double pass
interferometer that twice irradiates a movable mirror (reference
minor) with a measuring beam (reference beam); even if the movable
minor 191 is, for example, inclined, the interferometer 193 has a
characteristic in that there is no change in the travel direction
of the reflected light of the measuring beam from that movable
minor 191.
[0147] FIG. 14 is a schematic view of the double pass
interferometer.
[0148] FIG. 14 depicts only the measuring beam 191A that irradiates
the movable mirror 191, and omits the quarter-waveplates, and the
like.
[0149] In FIG. 14, the light beam emitted from the light source 220
enters the polarizing beam splitter 224 via the reflecting mirror
223. The length measuring beam 191A is reflected by the reflecting
surface of the polarizing beam splitter 224, and then irradiates
the reflecting surface of the movable mirror 191; after the
reflected light twice irradiates the reflecting surface of the
movable mirror 191 via the polarizing beam splitter 224 and the
corner cube 228, it is received by the light receiving portion 230.
At that time, if the reflecting surface of the movable mirror 191
is not inclined (if the angle with the Y axis is 0.degree., then
the measuring beam 191A travels as depicted by the broken line in
FIG. 14, and the exit light beam emitted from the polarizing beam
splitter 224 towards the light receiving portion 230 becomes
parallel to the incident light beam that enters the polarizing beam
splitter 224. On the other hand, if the reflecting surface of the
movable mirror 191 is inclined at an angle .theta., then the
measuring beam travels as depicted by the chain line 191A' in FIG.
14. In this case as well, the exit light beam from the polarizing
beam splitter 224 becomes parallel to the incident light beam. In
other words, the travel directions of each of the exit light beams
are the same regardless of whether the reflecting surface of the
movable mirror 191 is inclined. Accordingly, if the constitution is
such that the measuring beam 191A irradiates the movable minor 191
one time, as in the schematic view depicted in FIG. 15, then, if
the movable minor 191 is inclined, the travel direction of that
reflected light with respect to the uninclined state changes,
causing a problem wherein the light is not received by the light
receiving portion 230. However, as explained referencing FIG. 14,
even if the movable minor 191 is, for example, inclined, a double
pass interferometer can receive that reflected light by the light
receiving portion 230.
[0150] Furthermore, in the present embodiment explained referencing
FIG. 12, the measuring apparatus 190 including the laser
interferometers 193, 194 measures the positional relationship
between the lens barrel PK2 and the lens cell LS2; however, a
reflecting member having a reflecting surface capable of reflecting
the radiated measuring beam may be provided at a predetermined
position of the lens element 102, and the laser interferometer may
irradiate that reflecting surface with the measuring beam. For
example, as depicted in FIG. 16, a mirror member having a
reflecting surface may be affixed at a position on the lens element
102 where the measuring beam from the laser interferometer 193 will
be irradiated, a vacuum metallized film may be provided at a
position where the measuring beam from the laser interferometer 194
will be irradiated, and that film surface may be a reflecting
surface. For example, if it is constituted so that a spring
mechanism (flexure) is interposed between the lens cell LS2 and the
lens element 102, and if the lens cell LS2 and the lens element 102
are temporarily mispositioned, then if an attempt is made to
control the attitude of the lens element 102 in order to adjust the
pattern image based on the position measurement result of the lens
cell LS2, as in the embodiment explained referencing FIG. 12, then
there is a possibility that the pattern image cannot be controlled
to achieve the desired state; however, the position information of
the lens element 102 can be accurately derived by forming the
reflecting surface on the lens element 102 itself and measuring the
position of the lens element 102 using that reflecting surface, as
depicted in FIG. 16.
[0151] Furthermore, in the present embodiment discussed above, an
interferometer system is used as the measuring apparatus 190, but a
measuring apparatus that employs another system may be used. For
example, instead of the interferometer system discussed above, it
is possible to use a measuring apparatus that optically measures
the position information of a measurement mark formed on the lens
cell LS2.
[0152] In addition, because the coupling apparatus 160 can move the
lens element 102, it is possible to form the immersion area AR2
between the lens element 102 and the substrate P2 by sufficiently
enlarging the distance between the substrate P2 and the lens
element 102 by pre-raising the lens element 102 using the coupling
apparatus 160, disposing the liquid on the substrate P2, and
subsequently driving the coupling apparatus 160 to lower the lens
element 102 and bring the lens element 102 proximate to the
substrate P2, when, for example, filling the liquid 101 between the
lens element 102 and the substrate P2. In this case, when lowering
the lens element 102, by bringing the lens element 102 proximate
(lowering) to the substrate P2 from the inclined direction, it is
possible to remove any bubbles that may exist, for example, in the
liquid 101. In addition, when supplying the liquid 101 onto the
substrate P2 prior to exposure, it is possible to dispose the
liquid 101 onto the substrate P2 using, for example, a liquid
supply apparatus provided at a position separate from the liquid
supply mechanism 110, without using the liquid supply mechanism
110.
[0153] The above embodiments are not particularly limited to the
nozzle configurations discussed above, e.g., the liquid 101 may be
supplied and recovered by two pairs of nozzles on the long sides of
the projection area AR1. Furthermore, in this case, the supply
nozzles and the recovery nozzles may be disposed so that they are
arrayed vertically in order to enable the supply and recovery of
the liquid 101 from either the +X direction or the -X
direction.
[0154] In addition, in the embodiments discussed above, the two
object coupling apparatus used in the parallel link mechanism is
used to support the lens cell LS2, but the embodiments are not
limited thereto, and the coupling apparatus may be used, for
example, to support the substrate holder PH2.
[0155] As discussed above, the liquids 50, 101 in the above
embodiments include pure water. Pure water is advantageous because
it can be easily obtained in large quantities at a semiconductor
fabrication plant, and the like, and because pure water has no
adverse impact on the optical elements (lenses), the photoresist on
the substrates P, P2, and the like. In addition, because pure water
has no adverse impact on the environment and has an extremely low
impurity content, it can also be expected to have the effect of
cleaning the surfaces of the substrates P, P2, and the surfaces of
the optical element provided on the tip surfaces of the projection
optical systems PL, PL2.
[0156] Further, because the refractive index n of pure water
(water) for the exposure lights EL, EL2 having a wavelength of
approximately 193 nm is substantially 1.44, the use of ArF excimer
laser light (193 nm wavelength) as the light sources of the
exposure lights EL, EL2 would shorten the wavelength on the
substrates P, P2 to 1/n, i.e., approximately 134 nm, thereby
obtaining a high resolution. Furthermore, because the depth of
focus will increase approximately n times, i.e., approximately 1.44
times, that of in air, the numerical aperture of the projection
optical systems PL, PL2 can be further increased if it is
preferable to ensure a depth of focus approximately the same as
that when used in air, and the resolution is also improved from
this standpoint.
[0157] In the present embodiment, the lenses 60, 102 are affixed at
the tip of the projection optical systems PL, PL2. As an optical
element that is affixed at the tip of the projection optical
systems PL, PL2, it may be an optical plate used to adjust the
optical characteristics, e.g., aberrations (spherical aberration,
coma aberration, and the like), of the projection optical systems
PL, PL2. Alternatively, it may be a plane parallel plate capable of
transmitting the exposure light EL therethrough.
[0158] Furthermore, although the liquids 50, 101 in the above
embodiments are water, they may be a liquid other than water; for
example, if the light sources of the exposure lights EL, EL2 are
F.sub.2 lasers, then the F.sub.2 laser light will not transmit
through water, so it would be acceptable to use as the liquids 50,
101 a fluorine based liquid, such as perfluorinated polyether
(PFPE) or fluorine based oil, that is capable of transmitting
F.sub.2 laser light. In addition, it is also possible to use one as
the liquids 50, 101 (e.g., cedar oil) that is transparent to the
exposure lights EL, EL2, has the highest possible refractive index,
and is stable with respect to the projection optical systems PL,
PL2 and the photoresist coated on the surfaces of the substrates P,
P2.
[0159] Furthermore, the substrates P, P2 in each of the
abovementioned embodiments is not limited to a semiconductor wafer
for fabricating semiconductor devices, and is also applicable to a
glass substrate for a display device, a ceramic wafer for a thin
film magnetic head, or a mask or original plate of a reticle
(synthetic quartz, silicon wafer) used by an exposure apparatus,
and the like.
[0160] In addition, in the embodiments discussed above, an exposure
apparatus is used that locally fills liquid between the projection
optical systems PL, PL2 and the substrates P, P2, but the present
invention is also applicable to a liquid immersion exposure
apparatus that moves a stage, which holds the substrate to be
exposed, in a liquid bath, as disclosed in Japanese Unexamined
Patent Application, First Publication No. H06-124873, as well as to
a liquid immersion exposure apparatus that forms a liquid bath
having a predetermined depth on the stage, and holds the substrate
therein, as disclosed in Japanese Unexamined Patent Application,
First Publication No. H10-303114.
[0161] In addition to a step-and-scan system scanning type exposure
apparatus (scanning stepper) that scans and exposes the patterns of
the masks M, M2 while synchronously moving the masks M, M2 and the
substrates P, P2, a step-and-repeat system projection exposure
apparatus (stepper) that exposes the full patterns of the masks M,
M2 with the masks M, M2 and the substrates P, P2 in a stationary
state and sequentially steps the substrates P1, P2 is also
applicable to the exposure apparatuses EX, EX2. In addition, the
present invention is also applicable to a step-and-stitch system
exposure apparatus that partially and superimposingly transfers at
least two patterns onto the substrates P, P2.
[0162] In addition, the present invention is also applicable to
twin stage type exposure apparatuses that include two stages where
substrates to be processed, e.g., wafers, are mounted separately,
and that can move those substrates independently in the XY
directions. The structure and the exposure operation of a twin
stage type exposure apparatus is disclosed in, for example,
Japanese Unexamined Patent Application, First Publication No.
H10-163099 and Japanese Unexamined Patent Application, First
Publication No. H10-214783 (corresponding U.S. Pat. Nos. 6,341,007;
6,400,441; 6,549,269; and 6,590,634); Published Japanese
translation No. 2000-505958 of PCT International Publication
(corresponding U.S. Pat. No. 5,969,441); or U.S. Pat. No.
6,208,407; and the contents thereof are hereby incorporated by
reference in their entireties to the extent permitted by the laws
and regulations of the states designated or elected by the present
international patent application.
[0163] The types of exposure apparatuses EX, EX2 are not limited to
semiconductor device fabrication exposure apparatuses that expose
the pattern of a semiconductor device on the substrates P, P2, but
is also widely applicable to exposure apparatuses for fabricating
liquid crystal devices or displays, exposure apparatuses for
fabricating thin film magnetic heads, imaging devices (CCD),
reticles and masks, and the like.
[0164] If a linear motor is used in the substrate stage PST and/or
the mask stage MST, then either an air levitation type that uses an
air bearing or a magnetic levitation type that uses Lorentz's force
or reactance force may be used. In addition, each of the stages
PST, MST may be a type that moves along a guide, or may be a
guideless type not provided with a guide. An example of using a
linear motor in a stage is disclosed in U.S. Pat. Nos. 5,623,853
and 5,528,118, and the contents thereof are hereby incorporated by
reference in their entireties to the extent permitted by the laws
and regulations of the states designated or elected by the present
international patent application.
[0165] For the drive mechanism of each of the stages PST, PST2,
MST, MST2, a planar motor may be used that disposes a magnet unit,
wherein magnets are arranged two dimensionally, opposing an
armature unit, wherein coils are arranged two dimensionally, and
drives each of the stages PST, PST2, MST, MST2 by electromagnetic
force. In this case, any one among the magnet unit and the armature
unit is connected to the stages PST, PST2, MST, MST2, and the other
one of the magnet unit and the armature unit should be provided on
the moving surface side of the stages PST, PST2, MST, MST2.
[0166] The reaction force generated by the movement of the
substrate stage PST may be mechanically discharged to the floor
(ground) using a frame member so that it is not transmitted to the
projection optical system PL. A method of handling this reaction
force is disclosed in detail in, for example, U.S. Pat. No.
5,528,118 (Japanese Unexamined Patent Application, First
Publication No. H08-166475), and the contents thereof are hereby
incorporated by reference in their entireties to the extent
permitted by the laws and regulations of the states designated or
elected by the present international patent application.
[0167] The reaction force generated by the movement of the mask
stage MST may be mechanically discharged to the floor (ground)
using a frame member so that it is not transmitted to the
projection optical system PL. A method of handling this reaction
force is disclosed in detail in, for example, U.S. Pat. No.
5,874,820 (Japanese Unexamined Patent Application, First
Publication No. H08-330224), and the contents thereof are hereby
incorporated by reference in their entireties to the extent
permitted by the laws and regulations of the states designated or
elected by the present international patent application.
[0168] The exposure apparatuses EX, EX2 of the embodiments are
manufactured by assembling various subsystems, including each
constituent element recited in the claims of the present
application, so that a predetermined mechanical accuracy,
electrical accuracy, and optical accuracy are maintained. To ensure
these various accuracies, adjustments are performed before and
after this assembly, including an adjustment to achieve optical
accuracy for the various optical systems, an adjustment to achieve
mechanical accuracy for the various mechanical systems, and an
adjustment to achieve electrical accuracy for the various
electrical systems.
[0169] The assembly process, from the various subsystems to the
exposure apparatus includes the mutual mechanical connection of the
various subsystems, the wiring and connection of electrical
circuits, the piping and connection of the atmospheric pressure
circuit, and the like. Naturally, before the process of assembling
from these various subsystems to the exposure apparatus, there are
processes for assembling each of the individual subsystems. When
the assembly process ranging from various subsystems to the
exposure apparatus has been completed, a comprehensive adjustment
is performed to ensure the various accuracies of the exposure
apparatus as a whole. Furthermore, it is preferable to manufacture
the exposure apparatus in a clean room where the temperature, the
cleanliness level, and the like, are controlled.
[0170] As shown in FIG. 17, a micro-device, such as a semiconductor
device, is manufactured by: a step 201 that designs the functions
and performance of the micro-device; a step 202 that fabricates a
mask (reticle) based on this design step; a step 203 that
fabricates a substrate, which is the base material of the device; a
substrate processing step 204 wherein the exposure apparatus EX of
the embodiments discussed above exposes a pattern of the mask onto
the substrate; a device assembling step 205 (including a dicing
process, a bonding process, and a packaging process); a scanning
step 206; and the like.
[0171] The present invention is an exposure apparatus that exposes
a substrate by filling a liquid between a projection optical system
and a substrate and then projecting a pattern image onto the
substrate via the projection optical system and the liquid, wherein
the projection optical system includes a first group having an
optical member that contacts the liquid, and a second group
different from the first group; and, because that first group and
second group are supported vibrationally isolated, degradation of
the pattern image can be suppressed and a high precision device can
be manufactured, even in the state wherein the liquid is filled
between the projection optical system and the substrate.
* * * * *