U.S. patent application number 12/521094 was filed with the patent office on 2010-04-22 for component-recognizing apparatus, surface-mounting apparatus, and component-inspecting apparatus.
This patent application is currently assigned to YAMAHA HATSUDOKI KABUSHIKI KAISHA. Invention is credited to Naoki Hanamura, Hiroshi Kobayashi, Tomoyoshi Utsumi.
Application Number | 20100097461 12/521094 |
Document ID | / |
Family ID | 39588479 |
Filed Date | 2010-04-22 |
United States Patent
Application |
20100097461 |
Kind Code |
A1 |
Utsumi; Tomoyoshi ; et
al. |
April 22, 2010 |
COMPONENT-RECOGNIZING APPARATUS, SURFACE-MOUNTING APPARATUS, AND
COMPONENT-INSPECTING APPARATUS
Abstract
In an apparatus adapted to scan a lower side of an electronic
component being suction-held by a suction-holding nozzle, to
perform image recognition of suction-held conditions of the
electronic component, this invention is intended to perform a
transfer operation under a condition that the suction-holding
nozzle is arranged closer to an upper surface of a base, wherein
the optical path directed downwardly from the suction-holding
nozzle is bended in a lateral direction by a first optical path
changing member and then further bended in another direction by a
second optical path changing member to allow image-sensing means to
capture an image of a lower surface of the suction-holding nozzle,
and the electronic component being suction-held by the
suction-holding nozzle is illuminated along the lateral optical
path changed by the first optical path changing member.
Inventors: |
Utsumi; Tomoyoshi;
(Iwata-shi, JP) ; Kobayashi; Hiroshi; (Iwata-shi,
JP) ; Hanamura; Naoki; (Iwata-shi, JP) |
Correspondence
Address: |
Studebaker & Brackett PC
One Fountain Square, 11911 Freedom Drive, Suite 750
Reston
VA
20190
US
|
Assignee: |
YAMAHA HATSUDOKI KABUSHIKI
KAISHA
Shizuoka
JP
|
Family ID: |
39588479 |
Appl. No.: |
12/521094 |
Filed: |
December 26, 2007 |
PCT Filed: |
December 26, 2007 |
PCT NO: |
PCT/JP2007/074897 |
371 Date: |
June 24, 2009 |
Current U.S.
Class: |
348/143 ;
348/E7.085 |
Current CPC
Class: |
H04N 5/2252 20130101;
H04N 7/18 20130101; H05K 13/041 20180801; H05K 13/0812 20180801;
G06T 7/0004 20130101 |
Class at
Publication: |
348/143 ;
348/E07.085 |
International
Class: |
H04N 7/18 20060101
H04N007/18 |
Foreign Application Data
Date |
Code |
Application Number |
Dec 28, 2006 |
JP |
2006-355295 |
Dec 28, 2006 |
JP |
2006-355296 |
Dec 28, 2006 |
JP |
2006-355297 |
Claims
1. A component-recognizing apparatus comprising a movable head unit
having a suction-holding nozzle capable of suction-holding an
electronic component and a scanning unit which is installed to the
head unit in relatively displaceable with respect to the
suction-holding nozzle, the scanning unit being operable to capture
an image for image recognition of suction-held conditions of the
electronic component being suction-held by the suction-holding
nozzle, said scanning unit including: a first optical path changing
member which is adapted to be located beneath the suction-holding
nozzle and is operable to bend the optical path directed downwardly
from the suction-holding nozzle in a lateral direction during the
image-sensing operation; a second optical path changing member
operable to further bend the bended optical path in another
direction; lower-surface image-sensing means disposed in the
optical path changed by the second optical path changing member,
the lower-surface image-sensing means is operable to capture an
image of a lower surface of the electronic component being
suction-held by the suction-holding nozzle through the first and
second optical path changing members; and illumination means
operable to emit illumination light onto the lower surface of the
electronic component being suction-held by the suction-holding
nozzle, along at least the lateral optical path changed by the
first optical path changing member.
2. The component-recognizing apparatus as defined in claim 1,
wherein the illumination means is provided approximately on an
extension line of the light directed from the first optical path
changing member toward the second optical path changing member, so
as to emit the illumination light from behind an optical path
changing surface of the second optical path changing member toward
the first optical path changing member, the optical path changing
surface of the second optical path changing member is a translucent
surface formed as operable to allow the light of the illumination
means provided behind an optical path changing surface to pass
therethrough forwardly, and the illumination means is adapted to
illuminate the lower surface of the electronic component being
suction-held by the suction-holding nozzle, with the illumination
light bended by the first optical path changing member after
passing through the optical path changing surface of the second
optical path changing member.
3. The component-recognizing apparatus as defined in claim 2,
wherein the optical path changing surface of the second optical
path changing member is in the form of a half mirror as the
translucent surface.
4. The component-recognizing apparatus as defined in claim 2,
wherein the optical path changing surface of the second optical
path changing member is in the form of a reflecting prism as the
translucent surface.
5. A component-recognizing apparatus comprising a movable head unit
having a suction-holding nozzle capable of suction-holding an
electronic component and a scanning unit which is installed to the
head unit in relatively displaceable with respect to the
suction-holding nozzle, the scanning unit being operable to capture
an image for image recognition of suction-held conditions of the
electronic component being suction-held by the suction-holding
nozzle, said scanning unit including: a first optical path changing
member which is adapted to be located beneath the suction-holding
nozzle and is operable to bend the optical path directed downwardly
from the suction-holding nozzle in a lateral direction during the
image-sensing operation; a second optical path changing member
operable to further bend the bended optical path in another
direction so that the bended optical path directs upwardly at a
given elevation angle relative to a horizontal plane; and
image-sensing means disposed in the optical path changed by the
second optical path changing member, the image-sensing means is
operable to capture an image of a lower surface of the electronic
component being suction-held by the suction-holding nozzle through
the first and second optical path changing members.
6. The component-recognizing apparatus as defined in claim 5,
wherein the first optical path changing member is operable to
reflect the optical path striking from beneath the nozzle to the
base on approximately horizontally lateral side by about 90
degrees.
7. The component-recognizing apparatus as defined in claim 5,
wherein the first optical path changing member is in the form of a
mirror.
8. The component-recognizing apparatus as defined in claim 5,
wherein the first optical path changing member is in the form of a
prism.
9. The component-recognizing apparatus as defined in claim 5,
wherein the second optical path changing member is in the form of a
mirror.
10. The component-recognizing apparatus as defined in claim 5,
wherein the second optical path changing member is in the form of a
prism.
11. The component-recognizing apparatus as defined in claim 5,
wherein the image-sensing means is in the form of a line sensor, an
image sensor of the line sensor are arranged to be inclined with
respect to a horizontal direction in such a manner that a direction
of the image sensor is set approximately perpendicular to a
movement direction along which an image of the electronic component
is moved on the image sensor as the scanning unit moves along a row
of the suction-holding nozzles.
12. The component-recognizing apparatus as defined in claim 1,
wherein the head unit includes a row of the suction-holding
nozzles; and the scanning unit is adapted to be moved along the row
of suction-holding nozzles to capture an image of suction-held
conditions of the electronic component being suction-held by each
of the suction-holding nozzles, in a sequential manner.
13. A component-recognizing apparatus comprising a row of
suction-holding nozzles each capable of suction-holding an
electronic component and a scanning unit which is installed to the
head unit, the scanning unit is adapted to be relatively displaced
with respect to the suction-holding nozzles to perform sequential
scanning so as to capture an image for image recognition of
suction-held conditions of the electronic component being
suction-held by each of the suction-holding nozzles, the scanning
unit including: a lower-surface image taking section operable to
take an image of a lower surface of the electronic component being
suction-held by the suction-holding nozzle when the lower-surface
image taking section passes beneath each of the suction-holding
nozzles during the scanning operation of the scanning unit; and
lower-surface image-sensing means operable to capture an image of
the lower surface of the electronic component introduced through
the lower-surface image taking section, wherein the scanning unit
has a shape configured, in terms of a large-size electronic
component having a size exceeding an image-capturing region
determined by the lower-surface image taking section and the
lower-surface image-sensing means, to be spaced apart from each of
the suction-holding nozzles by a given distance, to avoid
interference with the large-size electronic component being
suction-held by at least one of the suction-holding nozzles, during
the scanning operation of the scanning unit.
14. The component-recognizing apparatus as defined in claim 13,
wherein the scanning unit has a recess which allows for taking an
image of any electronic component falling within an image-capturing
region determined by the lower-surface image taking section and the
lower-surface image-sensing means, and allows to have a given
distance from each of the suction-holding nozzles to avoid
interference with the large-size electronic component, in the given
region thereof.
15. The component-recognizing apparatus as defined in claim 1,
wherein: the first optical path changing member is operable to
change by about 90 degrees the optical path directed from a lower
side of the nozzle toward the base on approximately horizontally
lateral side; and the second optical path changing member is
operable to change further the optical path from the first optical
path changing member, by about 90 degrees.
16. The component-recognizing apparatus as defined in claim 1,
comprising a slit formed between the suction-holding nozzle and the
first optical path changing member to restrict a light-passing
area.
17. The component-recognizing apparatus as defined in claim 13,
comprising: an optical path changing member operable to bend the
light along a lateral side, after the light taken from the lower
surface of the electronic component through the lower-surface image
taking section, wherein a support member which supports the optical
path changing member has an upper surface located below an upper
surface of in conformity to an undulating shape of the large-size
electronic component.
18. The component-recognizing apparatus as defined in claim 17,
wherein the scanning unit includes: side-area image-sensing means
disposed lateral to and in side-by-side relation to the
lower-surface image-sensing means, to capture an image of an
electronic component from a lateral side of the electronic
component; and a side-image taking section oriented toward a
lateral region of the electronic component, to introduce the image
into the side-area image-sensing means, wherein the side-image
taking section has a lower end located below an upper surface of
the optical path changing member.
19. A surface-mounting apparatus comprising a movable head unit
having a suction-holding nozzle capable of suction-holding an
electronic component, the surface-mounting apparatus being adapted
to pick up an electronic component from a component feed section by
the suction-holding nozzle, and to mount the electronic component
onto a board, after taking an image of the electronic component
being suction-held by the suction-holding nozzle to perform image
recognition of suction-held conditions of the electronic component
relative to the suction-holding nozzle, wherein the
surface-mounting apparatus is equipped with the
component-recognizing apparatus as defined in claim 1 as a means to
perform the image recognition of the conditions of electronic
component being suction-held by the suction-holding nozzle.
20. A component-inspecting apparatus comprising a movable head unit
having a suction-holding nozzle capable of suction-holding an
electronic component, the component-inspecting apparatus being
adapted to pick up an electronic component from a component feed
section by the suction-holding nozzle, and to transfer the
electronic component to inspection means to carry out various
inspections, after taking an image of the electronic component
being suction-held by the suction-holding nozzle to perform image
recognition of suction-held conditions of the electronic component
relative to the suction-holding nozzle, wherein the
component-inspecting apparatus is equipped with the
component-recognizing apparatus as defined in claim 1, as a means
to perform the image recognition of the conditions of electronic
component being suction-held by the suction-holding nozzle.
Description
TECHNICAL FIELD
[0001] The present invention relates to a component-recognizing
apparatus for image recognition of a state of an electronic
component being suction-held by a suction-holding nozzle, to a
surface-mounting apparatus, and to a component-inspecting apparatus
having the component-recognizing apparatus.
BACKGROUND ART
[0002] Generally, a surface-mounting apparatus or a
component-inspecting apparatus for electronic components comprises
a head unit which is movable apart from a base by a given distance,
and a suction-holding nozzle installed in the head unit, wherein
the surface-mounting apparatus or the component-inspecting
apparatus is adapted to transfer an electronic component to a
target position while suction-holding the electronic component by
the suction-holding nozzle. The head unit is provided with a
component-recognizing apparatus for performing image recognition of
suction-held conditions being suction-held by the suction-holding
nozzle.
[0003] For example, the following Patent Document 1 discloses an
art designed for a component-recognizing apparatus in a
surface-mounting apparatus to allow lower-surface image-sensing
means to capture an image of a lower surface of an electronic
component being suction-held by a suction-holding nozzle, wherein
the component-recognizing apparatus comprises: a first optical path
changing member operable to change a direction of light directed
downwardly from a suction-holding nozzle to a direction directed
laterally from beneath the suction-holding nozzle; a second optical
path changing member operable to change further the light direction
directed laterally; and illumination means provided beneath the
first optical path changing member.
[0004] This component-recognizing apparatus is a mechanism
advantageous in reducing a mounting time, because of its ability to
perform component recognition in concurrence with an X-Y movement
from a component pickup position to a mounting position.
[0005] Patent Document 1: JP 8-32299A
DISCLOSURE OF THE INVENTION
[0006] The component-recognizing apparatus disclosed in the Patent
Document 1 is a mechanism advantageous in reducing a mounting time,
because of its ability to perform component recognition in
concurrence with an X-Y movement from a component pickup position
to a mounting position. Nonetheless, it is necessary to reduce a
vertical height dimension of a scanning unit of the
component-recognizing apparatus as much as possible, in order to
allow a transfer operation to be performed under a condition the
suction-holding nozzle is arranged closer to an upper surface of a
base.
[0007] For example, with a view to solving this problem, if it is
attempted to reduce a size of an optical system and a lens to
reduce a thickness of a portion of the optical system and the
illumination means located beneath the suction-holding nozzle,
there arises a problem of performance degradation, such as
narrowing in field of view of the lower-surface image-sensing
means, and reduction in lens brightness.
[0008] It is therefore an object of the present invention to reduce
a thickness of a place for a scanning camera beneath a
suction-holding nozzle so as to lower a height of a head unit and
downsize intended equipment in its entirety, without performance
degradation, such as narrowing in field of view of lower-surface
image-sensing means and reduction in lens brightness due to
downsizing of an optical system and a lens.
[0009] In order to achieve this object, the present invention
provides a component-recognizing apparatus comprising a movable
head unit having a suction-holding nozzle capable of
suction-holding an electronic component and a scanning unit which
is installed to the head unit in relatively displaceable with
respect to the suction-holding nozzle, the scanning unit being
operable to capture an image for image recognition of suction-held
conditions of the electronic component being suction-held by the
suction-holding nozzle, said scanning unit including: a first
optical path changing member which is adapted to be located beneath
the suction-holding nozzle and is operable to bend the optical path
directed downwardly from the suction-holding nozzle in a lateral
direction during the image-sensing operation; a second optical path
changing member operable to further bend the bended optical path in
another direction; lower-surface image-sensing means disposed in
the optical path changed by the second optical path changing
member, the lower-surface image-sensing means is operable to
capture an image of a lower surface of the electronic component
being suction-held by the suction-holding nozzle through the first
and second optical path changing members; and illumination means
operable to emit illumination light onto the lower surface of the
electronic component being suction-held by the suction-holding
nozzle, along at least a lateral optical path changed by the first
optical path changing member.
[0010] According to the component-recognizing apparatus of the
present invention, the illumination means is operable to emit
illumination light onto the lower surface of the electronic
component being suction-held by the suction-holding nozzle, along
at least the lateral optical path changed by the first optical path
changing member. This makes it possible to eliminate a need for
providing the illumination means beneath the suction-holding
nozzle. Therefore, a thickness of the scanning unit can be reduced
without performance degradation, such as narrowing in field of view
of the lower-surface image-sensing means and reduction in lens
brightness due to downsizing of an optical system and a lens. In
addition, an opposed distance between the head unit and a base can
be reduced to downsize intended equipment in its entirety and
facilitate a reduction in installation space of the equipment.
[0011] In accordance with another aspect of the present invention,
there is provided a component-recognizing apparatus comprising a
movable head unit having a suction-holding nozzle capable of
suction-holding an electronic component and a scanning unit which
is installed to the head unit in relatively displaceable with
respect to the suction-holding nozzle, the scanning unit being
operable to capture an image for image recognition of suction-held
conditions of the electronic component being suction-held by the
suction-holding nozzle, said scanning unit including: a first
optical path changing member which is adapted to be located beneath
the suction-holding nozzle and is operable to bend the optical path
directed downwardly from the suction-holding nozzle in a lateral
direction during the image-sensing operation; a second optical path
changing member operable to further bend the bended optical path in
another direction so that the bended optical path directs upwardly
at a given elevation angle relative to a horizontal plane; and
image-sensing means disposed in the optical path changed by the
second optical path changing member, the image-sensing means is
operable to capture an image of a lower surface of the electronic
component being suction-held by the suction-holding nozzle through
the first and second optical path changing members.
[0012] In this aspect, the image-sensing means is disposed in the
optical path which is changed by the second optical path changing
member in such a manner as to be directed upwardly at a given
elevation angle relative to a horizontal plane. This makes it
possible to avoid a situation where the image-sensing means is
provided to extend below the second optical path changing
member.
[0013] In accordance with yet another aspect of the present
invention, there is provided a component-recognizing apparatus
comprising a row of suction-holding nozzles each capable of
suction-holding an electronic component and a scanning unit which
is installed to the head unit, the scanning unit is adapted to be
relatively displaced with respect to the suction-holding nozzles to
perform sequential scanning so as to capture an image for image
recognition of suction-held conditions of the electronic component
being suction-held by each of the suction-holding nozzles, the
scanning unit including: a lower-surface image taking section
operable to take an image of a lower surface of the electronic
component being suction-held by the suction-holding nozzle when the
lower-surface image taking section passes beneath each of the
suction-holding nozzles during the scanning operation of the
scanning unit; and lower-surface image-sensing means operable to
capture an image of the lower surface of the electronic component
introduced through the lower-surface image taking section, wherein
the scanning unit has a shape configured, in terms of a large-size
electronic component having a size exceeding an image-capturing
region determined by the lower-surface image taking section and the
lower-surface image-sensing means, to be spaced apart from each of
the suction-holding nozzles by a given distance, to avoid
interference with the large-size electronic component being
suction-held by at least one of the suction-holding nozzles, during
the scanning operation of the scanning unit.
[0014] In this aspect, even in case where the large-size electronic
component requiring image recognition using a fixed camera is
attached to at least one of the suction-holding nozzles, the
scanning operation for the electronic components attached to the
remaining suction-holding nozzles can be performed under a
condition that the scanning unit is arranged adjacent to a lower
surface of each of the remaining suction-holding nozzles as close
as possible, while avoiding interference with the large-size
electronic component. Thus, the large-size electronic component can
be mixedly transferred together with the electronic components to
be subjected to the image-sensing operation using the scanning
unit. This makes it possible to allow the component-recognizing
apparatus to achieve high flexibility in terms of sequence during
transfer of the electronic components, and excellent transfer
efficiency.
[0015] The present invention also provides a surface-mounting
apparatus equipped with the component-recognizing apparatus in
accordance with any one of the above aspects.
[0016] The present invention further provides a
component-inspecting apparatus equipped with the
component-recognizing apparatus in accordance with any one of the
above aspects.
[0017] These and other objects, features and advantages of the
present invention will become more apparent upon reading the
following detailed description along with the accompanying
drawings.
BRIEF DESCRIPTION OF DRAWINGS
[0018] FIG. 1 is a top plan view showing a schematic structure of a
surface-mounting apparatus according to one embodiment of the
present invention.
[0019] FIG. 2 is a side view showing the schematic structure of the
surface-mounting apparatus.
[0020] FIG. 3 is a side view showing a structure of a
component-recognizing apparatus according to one embodiment of the
present invention.
[0021] FIG. 4 is a front view showing the structure of the
component-recognizing apparatus.
[0022] FIG. 5 is a top plan view showing the structure of the
component-recognizing apparatus.
[0023] FIG. 6 is a fragmentary side view enlargedly showing a
substantial part of the component-recognizing apparatus.
[0024] FIG. 7 is a block diagram showing a schematic configuration
of a control unit of the component-recognizing apparatus.
[0025] FIG. 8 is a side view showing a structure of a
component-recognizing apparatus according to another embodiment of
the present invention.
[0026] FIG. 9 is a front view showing the structure of the
component-recognizing apparatus according to the embodiment in FIG.
8.
[0027] FIG. 10 is a top plan view showing the structure of the
component-recognizing apparatus according to the embodiment in FIG.
8.
[0028] FIG. 11A is an explanatory diagram showing a relationship
between an arrangement of an image sensor of a line sensor and an
image of an electronic component obtained on the image sensor via a
lens, in case where the image sensor is arranged to be inclined
with respect to a horizontal direction in such a manner that an
arrangement direction of the image sensor is set approximately
perpendicular to a movement direction of the image of the
electronic component according to the embodiment in FIG. 8.
[0029] FIG. 11B is an explanatory diagram showing that a taken
image is formed as a non-distorted image in case of FIG. 11A.
[0030] FIG. 12A is an explanatory diagram for case where the image
sensor of line sensor in the embodiment in FIG. 8 are arranged in a
horizontal direction.
[0031] FIG. 12B is an explanatory diagram showing that a taken
image is formed as a distorted image in the case where the image
sensor of the line sensor in the embodiment in FIG. 8 are arranged
in a horizontal direction.
[0032] FIG. 13 is a front view showing a structure of a
component-recognizing apparatus according to yet another embodiment
of the present invention.
[0033] FIG. 14 is a side view showing a structure of a
component-recognizing apparatus according to still another
embodiment of the present invention.
BEST MODE FOR CARRYING OUT THE INVENTION
[0034] With reference to the drawings, the best mode for carrying
out the present invention will now be specifically described.
[0035] As shown in FIGS. 1 and 2, a surface-mounting apparatus 1
according to one embodiment of the present invention is equipment
for mounting a small-size electronic component 2 (FIG. 3) and a
large-size electronic component 2a (FIG. 3) onto a board 3, wherein
the surface-mounting apparatus 1 comprises board-conveying means 4
disposed on a base 1a to convey the board 3, a component feed
section 5 operable to feed a plurality of the electronic components
2 and a plurality of the large-size electronic components 2a, and a
head unit 7 adapted to be movable between the component feed
section 5 and the board 3, while supporting a suction-holding
nozzle 6a (FIG. 2) capable of picking up and holding one of the
electronic components 2 and the large-size electronic components 2a
from the component feed section 5, by suction.
[0036] The surface-mounting apparatus 1 is further equipped with a
component-recognizing apparatus 8 according to the present
invention, as a means to perform image recognition of suction-held
conditions of the electronic component 2 being suction-held by the
suction-holding nozzle 6a of the head unit 7, and a fixed camera 1b
disposed on the base 1a, as a means to perform image recognition of
suction-held conditions of the large-size electronic component 2a
being suction-held by the suction-holding nozzle 6a.
[0037] Specifically, the board-conveying means 4 has a pair of
conveyers 4a and 4a operable to convey the board 3 along an upper
surface of the base 1a in a direction from a right side to a left
side in FIG. 1, wherein the board 3 carried by the conveyers 4a and
4a is temporarily stopped at a given mounting position (position of
the board 3 illustrated in FIG. 1) where the electronic component 2
and the large-size electronic component 2a are mounted onto the
board 3.
[0038] The component feed section 5 is provided with a large number
of tape feeders 5a operable to feed the plurality of electronic
components 2, and a tray feeder 5b operable to feed the plurality
of large-size electronic components 2a, on both sides of the
board-conveying means 4.
[0039] Each of the tape feeders 5a has a reel wound by a tape which
contains and holds the small-piece or chip-shaped electronic
components 2, such as ICs, transistors or capacitors, at given
intervals, wherein the tape feeder 5a is adapted to allow the
electronic components 2 to be intermittently fed out from the reel
and picked up by the suction-holding nozzle 6a of the head unit
7.
[0040] The tray feeder 5b internally houses a rectangular-shaped
tray 5c on which the large-size electronic components, such as
QFPs, are placed, wherein tray feeder 5b is adapted to slidably
eject the tray 5c so as to allow one of the large-size electronic
components to be picked up by the suction-holding nozzle 6a of the
head unit 7. Although not illustrated in detail, the tray 5c has an
upper surface provided with a plurality of component receiving
portions in a matrix arrangement, and the large-size electronic
components 2a are received in respective ones of the component
receiving portions.
[0041] An image for image recognition of suction-held conditions of
the large-size electronic component 2a being suction-held by the
suction-holding nozzle 6a is taken by the fixed camera 1b disposed
on the base 1a, from below the large-size electronic component
2a.
[0042] The head unit 7 is designed to transport the electronic
component 2 picked up from the tape feeders 5a or the large-size
electronic component 2a picked up from the tray feeder 5b to the
board 3, while suction-holding it by the suction-holding nozzle 6a.
In this embodiment, the head unit 7 includes six mounting heads 6
each provided with the suction-holding nozzle 6a and arranged in a
row at even intervals along an X-axis direction (a conveyance
direction of the board-conveying means 4).
[0043] Each of the suction-holding nozzles 6a is adapted to be
selectively connected to a vacuum generator (not shown) to create a
vacuum state at a tip thereof so as to detachably suction-hold the
electronic component 2 by the resulting vacuum suction force.
[0044] Each of the suction-holding nozzles 6a is also adapted to be
movable up and down (movable in a Z-axis direction) relative to the
head unit 7 according to nozzle up-down movement driving means (not
shown), and rotatable about a central axis thereof (rotatable about
an R axis) according to nozzle-rotation driving means (not
shown).
[0045] The nozzle up-down movement driving means is designed to
move the suction-holding nozzle 6a up and down between a lowermost
position for a pickup operation and a mounting operation, and an
uppermost position for a transfer operation and an image-sensing
operation. The nozzle-rotation driving means is designed to rotate
the suction-holding nozzle 6a according to need to adjust a
conditions of the electronic component 2. Each of the nozzle
up-down movement driving means and the nozzle-rotation driving
means is in the form of a servomotor and a given driving-force
transmitting mechanism.
[0046] Further, the head unit 7 is operable to transfer two or more
electronic components 2 and at least one large-size electronic
component 2a being suction-held by the respective suction-holding
nozzles 6a between the component feed section 5 and the board 3,
and mount the electronic components 2 and the large-size electronic
component 2a onto the board 3 one-by-one. For this purpose, the
head unit 7 is adapted to be movable over a given region of the
base 1a, in the X-axis direction and a Y-axis direction (direction
perpendicular to the X-axis direction).
[0047] More specifically, the head unit 7 is supported relative to
a mounting-head support member 7a extending in the X-axis
direction, in such a manner as to be movable along the X-axis. The
mounting-head support member 7a has opposite ends each supported by
a fixed rail 9 extending in the Y-axis direction, so that it is
movable in the X-axis direction along the fixed rails 9. Further,
the head unit 7 is adapted to be drivenly moved in the X-axis
direction by an X-axis servomotor 11, and the mounting-head support
member 7a is adapted to be drivenly moved in the Y-axis direction
by a Y-axis servomotor 13 through a ball screw 14.
[0048] As shown in FIGS. 3 to 5, the component-recognizing
apparatus 8 comprises, as a main element, a scanning unit 8a which
is installed to the head unit 7 to capture an image for image
recognition of suction-held conditions of each of the electronic
components 2 being suction-held by the suction-holding nozzles 6a,
in a sequential manner, during a course of transferring the
electronic components 2 from the component feed section 5 to a
target position by the head unit 7. The scanning unit 8a is formed
with a lower-surface image taking section 8b, and internally
provided with a first optical path changing member 8c, a second
optical path changing member 8d, lower-surface illumination means
8e, and lower-surface image-sensing means 8f operable to capture an
image of a lower surface of each of the electronic components 2
which strikes through the lower-surface image taking section 8b.
The first optical path changing member 8c and the second optical
path changing member 8d are supported by a support member 8m of the
scanning unit 8a.
[0049] The component-recognizing apparatus 8 further comprises
side-area image-sensing means 9g and side illumination means 8h
which are integrated with the scanning unit 8a.
[0050] The scanning unit 8a is a module installed to the head unit
7 and adapted to be movable approximately parallel to a row
direction of the suction-holding nozzles 6a by a servomotor (not
shown) through a ball screw 8j. For scanning an image of the
electronic component 2 falling within an image-capturing region
(i.e., a field of view) determined by the lower-surface image
taking section 8b and the lower-surface image-sensing means 8f in a
given region equal to or greater than a region to be opposed to the
large-size electronic component, the scanning unit 8a has a recess
that maintains a given distance from each of the suction-holding
nozzles 6a to avoid interference with the large-size electronic
component 2a.
[0051] As above, in this embodiment, the scanning unit 8a has a
particular shape configured, in terms of the large-size electronic
component 2a having a size exceeding the image-capturing region
determined by the lower-surface image taking section 8b and the
lower-surface image-sensing means 8f, to be spaced apart from each
of the suction-holding nozzles 6a by a given distance, to avoid
interference with the large-size electronic component 2a being
suction-held by the suction-holding nozzle 6a, during the movement
of the scanning unit 8a.
[0052] The lower-surface image taking section 8b is a portion of
the scanning unit 8a, which is operable, when it passes beneath
each of the suction-holding nozzles 6a during the movement of the
scanning unit 8a, to capture an image of a lower surface of the
electronic component 2 being suction-held by the suction-holding
nozzle 6a. In this embodiment, the lower-surface image taking
section 8b is embodied by an oblong or rectangular-shaped slit
formed in the scanning unit 8a. The slit as the lower-surface image
taking section 8b is located between the first optical path
changing member 8c and the suction-holding nozzle 6a, to prevent
disturbance light from entering the lower-surface image-sensing
means 8f (see FIG. 6).
[0053] The first optical path changing member 8c is adapted to be
located beneath each of the suction-holding nozzles 6a, wherein the
first optical path changing member 8c is operable to change the
optical path directed downwardly from the suction-holding nozzle
6a, approximately horizontally/laterally by about 90 degrees, so as
to change the optical path in a lateral direction from beneath the
suction-holding nozzle 6a. In this embodiment, the first optical
path changing member 8c is in the form of a reflecting prism.
[0054] The second optical path changing member 8d is an optical
device operable to change further the optical path from the first
optical path changing member 8c by about 90 degrees, so as to
further bend the optical path bended by the first optical path
changing member 8c, in another direction. In this embodiment, the
second optical path changing member 8d is in the form of a half
mirror. Thus, the optical path changing surface 8k functions as a
translucent surface with respect to light from behind an optical
path changing surface 8k, to allow the light of the illumination
means 8e provided behind an optical path changing surface 8k, to
pass therethrough forwardly.
[0055] Further, as shown in FIG. 4, the support member 8m
supporting the first optical path changing member 8c and the second
optical path changing member 8d is formed and arranged such that an
upper surface 8p thereof is located below an upper surface 8q of
the first optical path changing member 8c and an upper surface 8s
of the second optical path changing member 8d.
[0056] The lower-surface illumination means 8e is a device operable
to emit illumination light toward the electronic component 2 being
suction-held by the suction-held nozzle 6a, through the first
optical path changing member 8c and the second optical path
changing member 8d, so as to illuminate the lower surface of the
electronic component 2, and embodied by a plurality of
light-emitting diodes. In this embodiment, the lower-surface
illumination means 8e is provided approximately on an extension
line of the light directed from the first optical path changing
member 8c toward the second optical path changing member 8d, so as
to emit the illumination light from behind an optical path changing
surface 8k of the second optical path changing member 8d, toward
the first optical path changing member 8c. As above, the
lower-surface illumination means 8e is adapted to illuminate the
lower surface of the electronic component 2 being suction-held by
the suction-holding nozzle 6a, with the illumination light bended
by the first optical path changing member 8c after passing through
the optical path changing surface 8k of the second optical path
changing member 8d.
[0057] The lower-surface image-sensing means 8f is a camera adapted
to capture an image of the electronic component 2 being
suction-held by the suction-holding nozzle 6a and illuminated by
the lower-surface illumination means 8e, through the first optical
path changing member 8c and the second optical path changing member
8d. For example, the lower-surface image-sensing means 8f may be in
the form of a CCD line sensor camera. The lower-surface
image-sensing means 8f is disposed such that an image-taking
direction thereof is oriented laterally to face the optical path
changed by the second optical path changing member 8d.
[0058] The side-area image-sensing means 8g is a camera disposed
lateral to the lower-surface image-sensing means 8f and adapted to
capture an image of the electronic component 2 from a lateral side
of the electronic component 2. For example, the side-area
image-sensing means 8g may be in the form of a CCD line sensor
camera, as with the lower-surface image-sensing means 8f.
[0059] A lower end 8r of a side-image taking section 8n for the
side-area image-sensing means 8g is located below the upper surface
8q of the first optical path changing member 8c and the upper
surface 8s of the second optical path changing member 8d.
[0060] The side illumination means 8h is a device operable to
illuminate a side surface of the electronic component 2, wherein a
plurality of light-emitting diodes is employed. The plurality of
light-emitting diodes are disposed on the side of a distal end of
the scanning unit 8a formed in a concave shape to avoid
interference with the large-size electronic component 2a.
[0061] During a course of transferring the electronic component 2
from the component feed section 5 to the board 5 after picking up
the electronic component 2 in the component feed section 5 by the
suction-holding nozzle 6a, the lower-surface image-sensing means 8f
and the side-area image-sensing means 8g take images of the
electronic component 2 being suction-held by the suction-holding
nozzle 6a, and the taken images (a reflection image of the lower
surface of the electronic component 2, and a transmitted image of
the lateral surface of the electronic component 2) are subjected to
an image processing using an image processing device 23 of a
control unit 20 (FIG. 7).
[0062] An image of suction-held conditions of the large-size
electronic component 2a being suction-held by the suction-holding
nozzle 6a is taken by the fixed camera 1b disposed on the base 1a.
For example, the fixed camera 1b is in the form of a CCD camera
adapted to perform image recognition of the large-size electronic
component 2a from below the suction-holding nozzle 6a, during a
course of transferring the large-size electronic component 2a from
the tray feeder 5b to the board 3 after picking up the large-size
electronic component 2a by the suction-holding nozzle 6a.
[0063] With reference to FIG. 7, the control unit 20 of the
surface-mounting apparatus 1 will be described below.
[0064] As shown in FIG. 7, in terms of a functional configuration,
the control unit 20 comprises a main control section 21, an axis
control section 22, an illumination control section 23, a camera
control section 24, and an image processing section 25.
[0065] The main control section 21 is designed to generally control
an operation of the surface-mounting apparatus 1, and comprises a
commonly-known CPU for executing logical operations, a ROM
pre-storing various programs for controlling the CPU, and a RAM for
temporarily storing various data during an operation of the
surface-mounting apparatus 1. The main control section 21 is
operable to control various devices, such as the board-conveying
means 4, the component feed section 5, the mounting heads 6, the
head unit 7 and the component-recognizing apparatus, according to
the pre-stored programs.
[0066] The axis control section 22 is operable to control driving
of various servomotors 31, such as the X-axis servomotor 11, the
Y-axis servomotor 13, and the servomotor for the scanning unit 8a,
while communicating control signals with the main control section
21. Each of the servomotors 31 is provided with an encoder 32 which
is operable to detect a movement position of the associated unit or
member, and feed back the detected position to the axis control
section 22 as a control signal.
[0067] The illumination control section 23 is operable to control
the lower-surface illumination means 8e for the lower-surface
image-sensing means 8f in conjunction with the operation of taking
an image of the electronic component 2 by the lower-surface
image-sensing means 8f, while communicating control signals with
the main control section 21.
[0068] The camera control section 24 is operable to control the
lower-surface image-sensing means 8f of the component-recognizing
apparatus 8, while communicating control signals with the main
control section 21.
[0069] The image processing section 25 is operable to subject an
image signal output from the lower-surface image-sensing means 8f,
to a given processing to create image data suitable for component
recognition, and output the image data to the main control section
21. Then, the main control section 21 is operable to perform an
arithmetical operation, such as calculation of deviation in
suction-held conditions (pickup error) based on the image data
output from the image processing section 25.
[0070] With reference to FIGS. 1 to 7, functions of the
surface-mounting apparatus 1 according to this embodiment will be
described below.
[0071] In the surface-mounting apparatus 1 according to this
embodiment, the control unit 20 generally controls an operation of
each section of the surface-mounting apparatus.
[0072] First, as shown in FIG. 1, the pair of conveyers 4a and 4a
of the board-conveying means 4 carry the board 3 to the given
mounting position (position of the board 3 illustrated in FIG. 1)
on the base 1a. The board 3 is temporarily stopped at the mounting
position.
[0073] Further, the head unit 7 is moved from the component feed
section 5 to the board 3, while suction-holding the electronic
components 2 fed from the component feed section 5 by the
respective suction-holding nozzles 6a, to mount the electronic
components 2 onto the board 3.
[0074] During a course of transferring the electronic components 2
being suction-held by the respective suction-holding nozzles 6a,
from the component feed section 5 to the target position by the
head unit 7, the scanning unit 8a of the component-recognizing
apparatus 8 is moved along the row of suction-holding nozzles 6a,
so that the lower-surface image-sensing means 8f and the side-area
image-sensing means 8g take images of suction-held conditions of
the electronic component 2 in each of the suction-holding nozzles
6a in a sequential manner to perform image recognition.
[0075] An image-taking procedure of the lower-surface image-sensing
means 8f is as follows.
[0076] When the illumination means 8e controlled by the
illumination control section 23 emits illumination light from
behind an optical path changing surface 8k of the second optical
path changing member 8d, toward the first optical path changing
member 8c, the illumination light is reflected by the first optical
path changing member 8c after passing through the optical path
changing surface 8k of the second optical path changing member 8d,
to illuminate a lower surface of the electronic component 2 being
suction-held by the suction-holding nozzle 6a.
[0077] During this process, the slit as the lower-surface image
taking section 8b narrows a light-passing area to limit the
illumination light from the illumination means 8e, to an
image-capturing region.
[0078] Then, during an image-sensing operation, the first optical
path changing member 8c provided beneath the suction-holding nozzle
6a changes the optical path directed downwardly from the
suction-holding nozzle 6a to approximately horizontally lateral
side by about 90 degrees, so as to change the optical path in a
lateral direction from beneath the suction-holding nozzle 6a, and
then the second optical path changing member 8d further changes the
optical path from the first optical path changing member 8c by
about 90 degrees, to bend the bended optical path in another
direction. Then, the lower-surface image-sensing means 8f provided
in the scanning unit 8a and controlled by the camera control
section 24 receives the resulting light to capture an image of the
lower surface of the electronic component 2.
[0079] As above, the lower-surface image-sensing means 8f is
adapted to take a reflection image of a lower surface of the
electronic component 2 being suction-held by the suction-holding
nozzle 6a and illuminated by the lower-surface illumination means
8e, through the first optical path changing member 8c and the
second optical path changing member 8d.
[0080] Further, the side-area image-sensing means 8g is disposed
lateral to the lower-surface image-sensing means 8f, and adapted to
take a transmitted image of the electronic component 2 from a
lateral side of the electronic component 2.
[0081] Then, the taken images (the reflection image of the lower
surface of the electronic component 2, and the transmitted image of
the lateral surface of the electronic component 2) are subjected to
an image processing using the image processing device 23 (FIG. 3)
provided in the control unit 20, to create image data suitable for
component recognition. Then, the main control section 21 performs
an arithmetical operation, such as calculation of deviation in
suction-held conditions (pickup error) based on the image data
output from the image processing section 25.
[0082] In case where the large-size electronic component 2a is
suction-held by some of the suction-holding nozzles 6a, and the
small-size electronic components 2 are suction-held by the rest of
the suction-holding nozzles 6a, to transfer the electronic
components 2 and 2a in a mixed manner, the small-size electronic
components 2 are subjected to component recognition using the
scanning unit 8a in the above manner after the component pickup
operation, and, before or after the component recognition, an image
of the large-size electronic component 2a is taken by the fixed
camera 1b to perform image recognition. Then, the components 2 and
2a are sequentially mounted onto the board 3.
[0083] In this embodiment, the scanning unit 8a has a shape
configured to be spaced apart from each of the suction-holding
nozzles by a given distance, to avoid interference with the
large-size electronic component 2a being suction-held by the
suction-holding nozzle 6a, during movement of the scanning unit 8a,
in a given region equal to or greater than a region to be opposed
to the large-size electronic component 2a. Thus, even in the case
where the small-size electronic components 2 and the large-size
electronic component 2a requiring image recognition using the fixed
camera 1b are mixedly transferred by the head unit 7, the two types
of electronic components can be transferred while avoiding
interference between the scanning unit 8a and the large-size
electronic component 2a being suction-held by the suction-holding
nozzle 6a. This makes it possible to allow the
component-recognizing apparatus to achieve high flexibility in
terms of transfer sequence, and excellent transfer efficiency.
[0084] Further, the scanning unit 8a has a recess that maintains a
given distance from each of the suction-holding nozzles 6a to avoid
interference with the large-size electronic component 2a. This
makes it possible to more reliably avoid interference between the
scanning unit 8a and the large-size electronic component 2a being
suction-held by the suction-holding nozzle 6a.
[0085] As described above, in the surface-mounting apparatus 1
according to the above embodiment of the present invention, the
illumination means is operable to emit illumination light onto the
lower surface of the electronic component being suction-held by the
suction-holding nozzle, along at least the lateral optical path
changed by the first optical path changing member. This makes it
possible to eliminate a need for providing the lower-surface
illumination means 8e beneath the suction-holding nozzle 6a.
Therefore, a thickness of the component-recognizing apparatus 8
including the lower-surface illumination means 8e and an optical
system can be reduced without performance degradation, such as
narrowing in field of view of the lower-surface image-sensing means
8f and reduction in lens brightness due to downsizing of the
optical system and a lens. In addition, a height dimension of the
head unit 7 can be reduced to downsize intended equipment in its
entirety and facilitate a reduction in installation space of the
equipment.
[0086] The optical path changing surface 8k of the second optical
path changing member 8d is made as a translucent surface, to allow
the lower surface of the electronic component 2 being suction-held
by the suction-holding nozzle 6a to be illuminated with
illumination light from the lower-surface illumination means 8e
provided behind an optical path changing surface 8k. This makes it
possible to package the lower-surface illumination means 8e behind
an optical path changing surface 8k to further downsize the
component-recognizing apparatus 8.
[0087] Particularly in the above embodiment, the first optical path
changing member 8c, the second optical path changing member 8d, the
lower-surface image-sensing means 8f, and the lower-surface
illumination means 8e are integrally provided in the scanning unit
8a, and the scanning unit 8a is adapted to be movable approximately
parallel to the row of suction-holding nozzles 6a. This makes it
possible to allow the component-recognizing apparatus 8 to take
respective images of the plurality of suction-holding nozzles 6a
arranged in a row, and achieve a reduced thickness and a reduced
installation space.
[0088] Each of the first optical path changing member 8c and the
second optical path changing member 8d is operable to change the
optical path by about 90 degrees, so that an appropriate angular
change in optical path and an appropriate width in field of view
can be obtained.
[0089] Further, in the above embodiment, the optical path changing
surface 8k of the second optical path changing member 8d is in the
form of a half mirror which is relatively low in cost, so that a
cost of the optical system can be reduced.
[0090] The lower-surface image taking section 8b is likewise
embodied by the slit which is provided between the suction-holding
nozzle 6a and the first optical path changing member 8c to restrict
a light-passing area. This makes it possible to prevent excess
light from entering the lower-surface image-sensing means 8f from a
region other than the image-capturing region, so as to obtain a
clear image free of flare.
[0091] As above, the surface-mounting apparatus 1 of the present
invention is equipped with the above component-recognizing
apparatus 8, as a means to perform the image recognition of the
conditions of electronic component 2 being suction-held by the
suction-holding nozzle 6a. This makes it possible to allow the
surface-mounting apparatus to transfer the small-size electronic
components 2 and the large-size electronic component 2a being
suction-held by the respective suction-holding nozzles 6a, while
avoiding interference between the scanning unit 8a and the
large-size electronic component 2a, so as to achieve high
flexibility in terms of transfer sequence, and excellent transfer
efficiency.
[0092] Further, as shown in FIG. 4, the upper surface 8p of the
support member 8m supporting the first optical path changing member
8c is located below the upper surface 8q of the first optical path
changing member 8c, so that, when each of the suction-holding
nozzles 6a passes above the upper surface 8q of the first optical
path changing member 8c during the scanning operation, no
interference with the support member 8m occurs. Thus, a position of
each of the suction-holding nozzles 6a during the scanning
operation can be set closer to the target position and the
component feed section in a vertical direction by just the margin,
and therefore a mounting time in the target position and a pickup
time in the component feed section can be cut down.
[0093] In addition, the scanning unit 8a is provided with the
side-area image-sensing means 8g, so that suction-held conditions
can be detected based on a lateral-surface image. In case of adding
this function, the lower end 8r of the side-image taking section 8n
is located below the upper surface 8q of the first optical path
changing member 8c, so that the mounting time in the target
position and the pickup time in the component feed section are
never increased.
[0094] The above embodiment has been shown simply by way of one
illustrative embodiment of the present invention, and the present
invention is not limited to the above embodiment.
[0095] Referring to FIGS. 8 to 10, each of the first and second
optical path changing members 8c and 8d illustrated in FIGS. 8 to
10 is in the form of a reflecting prism. The second optical path
changing member 8d is an optical device operable to further bend a
bended optical path from the suction-holding nozzle 6a through the
first optical path changing member 8c in another direction, in such
a manner as to be changed to the optical path directed upwardly at
a given elevation angle relative to a horizontal plane S. In this
embodiment, the optical path changing surface 8k is formed to be
inclined with respect to the horizontal plane S. Further, the
side-area image-sensing means 8f is provided in the scanning unit
8a in such a manner that an image-taking direction thereof is
inclined to face the optical path changed by the second optical
path changing member 8d.
[0096] Referring to FIGS. 11 and 12, in this embodiment,
considering that an image 2c of the electronic component 2 is
inclined with respect to a horizontal direction, an arrangement
direction of a plurality of image sensor 8t is inclined with
respect to the horizontal direction in such a manner that the image
sensor 8t is arranged in a direction approximately perpendicular to
a movement direction CN along which the image 2c of the electronic
component 2 is moved on the image sensor 8t as the scanning unit
moves 8a along the row of the suction-holding nozzles, as shown in
FIG. 11A. If the arrangement of image sensor 8t of a line sensor is
set to be horizontal (FIG. 12A), a taken image is distorted as an
image 2e (FIG. 12B). In contrast, in this embodiment, a
non-distorted image can be formed as an image 2d in FIG. 11B.
[0097] An image-taking procedure of the side-area image-sensing
means 8f in the embodiment illustrated in FIGS. 8 to 10 is as
follows.
[0098] The lower-surface illumination means 8e controlled by the
illumination control section 23 illuminates a lower surface of the
electronic component 2 being suction-held by the suction-holding
nozzle 6a.
[0099] Then, during an image-sensing operation, the first optical
path changing member 8c located beneath the suction-holding nozzle
6a changes the optical path directed downwardly from the
suction-holding nozzle 6a to approximately horizontally lateral
side by about 90 degrees, so as to change the optical path in a
lateral direction from beneath the suction-holding nozzle 6a.
[0100] Then, the second optical path changing member 8d further
bends the bended optical path from the suction-holding nozzle 6a
through the first optical path changing member 8c, in another
direction, in such a manner as to be changed to the optical path
directed upwardly at the given elevation angle relative to the
horizontal plane S.
[0101] Then, the side-area image-sensing means 8f provided in the
scanning unit 8a and controlled by the camera control section 24
receives the resulting light to capture an image of the lower
surface of the electronic component 2.
[0102] As above, the side-area image-sensing means 8f is adapted to
capture an image of a lower surface of the electronic component 2
being suction-held by the suction-holding nozzle 6a and illuminated
by the lower-surface illumination means 8e, through the first
optical path changing member 8c and the second optical path
changing member 8d.
[0103] As described above, in the component-recognizing apparatus 8
according to the above embodiment of the present invention, the
lower-surface image-sensing means is disposed in the optical path
which is changed by the second optical path changing member in such
a manner as to be directed upwardly at the given elevation angle
relative to the horizontal plane S. This makes it possible to avoid
a situation where the lower-surface image-sensing means is provided
to extend below the second optical path changing member. Therefore,
an opposed distance between the head unit and the base can be
reduced to downsize intended equipment in its entirety and
facilitate a reduction in installation space of the equipment,
while employing a lens of normal size, without performance
degradation, such as narrowing in field of view of the
lower-surface image-sensing means and reduction in lens brightness
due to downsizing of the optical system and the lens.
[0104] Each of the first optical path changing member and the
second optical path changing member is operable to change the
optical path by about 90 degrees, so that an appropriate angular
change in optical path and an appropriate width in field of view
can be obtained.
[0105] Further, the first optical path changing member is in the
form of a prism, so that a low-cost optical system can be achieved
in terms of the first optical path changing member.
[0106] The second optical path changing member is also in the form
of a prism, so that a low-cost optical system can also be achieved
in terms of the second optical path changing member.
[0107] The image sensor of image sensor 8t of the line sensor of
the side-area image-sensing means 8f are arranged to be inclined
with respect to a horizontal direction in such a manner that a
direction of the image sensor is set approximately perpendicular to
a movement direction along which the image 2c of the electronic
component 2 is moved on the image sensor 8t as the scanning unit
moves 8a along the row of the suction-holding nozzles. Therefore, a
need for taking time to perform an image processing for a taken
image 2d can be eliminated to prevent deterioration in mounting
efficiency.
[0108] [Other Modifications]
[0109] In the above embodiments, each of the components, such as
the board-conveying means 4, the component feed section 5, and the
X-axis/Y-axis driving mechanism of the head unit 7, is not intended
to limit the present invention, but various design changes may be
made therein.
[0110] Further, as shown in FIG. 13, the first optical path
changing member 8c may be in the form of a mirror.
[0111] Alternatively, as shown in FIG. 14, the second optical path
changing member 8d may be in the form of a prism.
[0112] Further, the first optical path changing member 8c and the
second optical path changing member 8d are not necessarily limited
to a type operable to change the optical path to approximately
horizontally lateral side by about 90 degrees. As long as it is a
type provided beneath the suction-holding nozzle 6a and operable to
change the optical path directed downwardly from the
suction-holding nozzle 6a, in a lateral direction from beneath the
suction-holding nozzle 6a, the optical path may be changed in
various other ways.
[0113] Similarly, each of the lower-surface illumination means 8e
and the side illumination means 8h is not limited to light-emitting
diodes. Any other conventional illumination means may be
employed.
[0114] Further, each of the lower-surface image-sensing means 8f
and the side-area image-sensing means 8g is not limited to a CCD
camera, but various other types of cameras may be employed.
[0115] The image-taking direction is not necessarily limited to the
illustrated direction. Depending on a relationship with a
surrounding device, a design change may be made to set it in
various directions.
[0116] Further, an application of the component-recognizing
apparatus according to the present invention is not limited to a
surface-mounting apparatus. It may also be applied to a
component-inspecting apparatus comprising a movable head unit
having a suction-holding nozzle capable of suction-holding an
electronic component, wherein the component-inspecting apparatus is
adapted to pick up an electronic component from a component feed
section by the suction-holding nozzle, and, after taking an image
of the electronic component being suction-held by the
suction-holding nozzle, to perform image recognition of
suction-held conditions of the electronic component relative to the
suction-holding nozzle, transfer the electronic component to
inspection means to carry out various inspections.
[0117] The component-recognizing apparatus may be provided in a
line for supplying only the same type of electronic component
2a.
[0118] The above component-inspecting apparatus is equipped with
the component-recognizing apparatus according to the present
invention, as a means to perform the image recognition of the
conditions of electronic component being suction-held by the
suction-holding nozzle. This makes it possible to allow the
component-inspecting apparatus to transfer the small-size
electronic components and the large-size electronic component, so
as to achieve high flexibility in terms of transfer sequence, and
excellent transfer efficiency.
[0119] It is understood that the component-inspecting apparatus may
be a type adapted to mixedly transfer the large-size electronic
component to be subjected to an image-sensing operation using a
fixed camera 1b, as with the surface-mounting apparatus 1 in FIG.
1. In this case, the component-recognizing apparatus according to
the first embodiment may be employed to allow the
component-inspecting apparatus to transfer the small-size
electronic components and the large-size electronic component while
avoiding interference between the scanning unit and the large-size
electronic component being suction-held by the suction-holding
nozzle 6a, so as to achieve high flexibility in terms of transfer
sequence, and excellent transfer efficiency.
[0120] As above, in summary, the present invention provides a
component-recognizing apparatus comprising a movable head unit
having a suction-holding nozzle capable of suction-holding an
electronic component and a scanning unit which is installed to the
head unit in relatively displaceable with respect to the
suction-holding nozzle, the scanning unit being operable to capture
an image for image recognition of suction-held conditions of the
electronic component being suction-held by the suction-holding
nozzle, said scanning unit including: a first optical path changing
member which is adapted to be located beneath the suction-holding
nozzle and is operable to bend the optical path directed downwardly
from the suction-holding nozzle in a lateral direction during the
image-sensing operation; a second optical path changing member
operable to further bend the bended optical path in another
direction; lower-surface image-sensing means disposed in the
optical path changed by the second optical path changing member,
the lower-surface image-sensing means is operable to capture an
image of a lower surface of the electronic component being
suction-held by the suction-holding nozzle through the first and
second optical path changing members; and illumination means
operable to emit illumination light onto the lower surface of the
electronic component being suction-held by the suction-holding
nozzle, along at least the lateral optical path changed by the
first optical path changing member.
[0121] According to the component-recognizing apparatus of the
present invention, the illumination means is operable to emit
illumination light onto the lower surface of the electronic
component being suction-held by the suction-holding nozzle, along
at least the lateral optical path changed by the first optical path
changing member. This makes it possible to eliminate a need for
providing the illumination means beneath the suction-holding
nozzle. Therefore, a thickness of the scanning unit can be reduced
without performance degradation, such as narrowing in field of view
of the lower-surface image-sensing means and reduction in lens
brightness due to downsizing of an optical system and a lens. In
addition, an opposed distance between the head unit and a base can
be reduced to downsize intended equipment in its entirety and
facilitate a reduction in installation space of the equipment.
[0122] Preferably, in the component-recognizing apparatus of the
present invention, the illumination means is provided approximately
on an extension line of the light directed from the first optical
path changing member toward the second optical path changing
member, so as to emit the illumination light from behind an optical
path changing surface of the second optical path changing member
toward the first optical path changing member, the optical path
changing surface of the second optical path changing member is a
translucent surface formed as operable to allow the light of the
illumination means provided behind an optical path changing surface
to pass therethrough forwardly, and the illumination means is
adapted to illuminate the lower surface of the electronic component
being suction-held by the suction-holding nozzle, with the
illumination light bended by the first optical path changing member
after passing through the optical path changing surface of the
second optical path changing member.
[0123] According to this feature, because the optical path changing
surface of the second optical path changing member is a translucent
surface, it allows the lower surface of the electronic component
being suction-held by the suction-holding nozzle to be illuminated
with illumination light from the illumination means provided behind
an optical path changing surface. This makes it possible to package
the illumination means behind an optical path changing surface to
further downsize the component-recognizing apparatus.
[0124] Preferably, the optical path changing surface of the second
optical path changing member is in the form of a half mirror as the
translucent surface.
[0125] According to this feature, the optical path changing surface
of the second optical path changing member is in the form of a half
mirror which is relatively low in cost, so that a cost of the
optical system can be reduced.
[0126] Alternatively, the optical path changing surface of the
second optical path changing member is preferably in the form of a
reflecting prism as the translucent surface.
[0127] According to this feature, the optical path changing surface
of the second optical path changing member is in the form of a
reflecting prism, so that the optical path changing surface can be
used for a long period of time without distortion and peeling of a
reflective material, as compared with the optical path changing
surface in the form of a half mirror.
[0128] In accordance with another aspect of the present invention,
there is provided a component-recognizing apparatus comprising a
movable head unit having a suction-holding nozzle capable of
suction-holding an electronic component and a scanning unit which
is installed to the head unit in relatively displaceable with
respect to the suction-holding nozzle, the scanning unit being
operable to capture an image for image recognition of suction-held
conditions of the electronic component being suction-held by the
suction-holding nozzle, said scanning unit including: a first
optical path changing member which is adapted to be located beneath
the suction-holding nozzle and is operable to bend the optical path
directed downwardly from the suction-holding nozzle in a lateral
direction during the image-sensing operation; a second optical path
changing member operable to further bend the bended optical path in
another direction so that the bended optical path directs upwardly
at a given elevation angle relative to a horizontal plane; and
image-sensing means disposed in the optical path changed by the
second optical path changing member, the image-sensing means is
operable to capture an image of a lower surface of the electronic
component being suction-held by the suction-holding nozzle through
the first and second optical path changing members.
[0129] In this aspect, the image-sensing means is disposed in the
optical path which is changed by the second optical path changing
member in such a manner as to be directed upwardly at a given
elevation angle relative to a horizontal plane. This makes it
possible to avoid a situation where the image-sensing means is
provided to extend below the second optical path changing
member.
[0130] Preferably, in the component-recognizing apparatus in
accordance with this aspect of the present invention, the first
optical path changing member is operable to reflect the optical
path striking from beneath the nozzle to the base on approximately
horizontally lateral side by about 90 degrees.
[0131] According to this feature, each of the first optical path
changing member and the second optical path changing member is
operable to change the optical path by about 90 degrees, so that an
appropriate angular change in optical path and an appropriate width
in field of view can be obtained.
[0132] Preferably, the first optical path changing member is in the
form of a mirror or a prism.
[0133] According to this feature, a low-cost optical system can be
achieved in terms of the first optical path changing member.
[0134] Preferably, the second optical path changing member is in
the form of a mirror or a prism.
[0135] According to this feature, a low-cost optical system can be
achieved in terms of the second optical path changing member.
[0136] Preferably, the image-sensing means is in the form of a line
sensor, an image sensor of the line sensor are arranged to be
inclined with respect to a horizontal direction in such a manner
that a direction of the image sensor is set approximately
perpendicular to a movement direction along which an image of the
electronic component is moved on the image sensor as the scanning
unit moves along a row of the suction-holding nozzles.
[0137] According to this feature, the image sensor of the line
sensor are arranged to be inclined with respect to a horizontal
direction in such a manner that a direction of the image sensor is
set approximately perpendicular to a movement direction along which
an image of the electronic component is moved on the image sensor
as the scanning unit moves along the row of the suction-holding
nozzles, so that a taken image is formed as a non-distorted image.
Therefore, a need for taking time to perform an image processing
for a taken image can be eliminated to prevent deterioration in
mounting efficiency.
[0138] Preferably, the head unit includes a row of the
suction-holding nozzles; and the scanning unit is adapted to be
moved along the row of suction-holding nozzles to capture an image
of suction-held conditions of the electronic component being
suction-held by each of the suction-holding nozzles, in a
sequential manner.
[0139] This feature makes it possible to allow the
component-recognizing apparatus to take respective images of the
plurality of suction-holding nozzles 6a arranged in a row, and
achieve a reduced thickness and a reduced installation space.
[0140] In accordance with yet another aspect of the present
invention, there is provided a component-recognizing apparatus
comprising a row of suction-holding nozzles each capable of
suction-holding an electronic component and a scanning unit which
is installed to the head unit, the scanning unit is adapted to be
relatively displaced with respect to the suction-holding nozzles to
perform sequential scanning so as to capture an image for image
recognition of suction-held conditions of the electronic component
being suction-held by each of the suction-holding nozzles, the
scanning unit including: a lower-surface image taking section
operable to take an image of a lower surface of the electronic
component being suction-held by the suction-holding nozzle when the
lower-surface image taking section passes beneath each of the
suction-holding nozzles during the scanning operation of the
scanning unit; and
[0141] lower-surface image-sensing means operable to capture an
image of the lower surface of the electronic component introduced
through the lower-surface image taking section, wherein the
scanning unit has a shape configured, in terms of a large-size
electronic component having a size exceeding an image-capturing
region determined by the lower-surface image taking section and the
lower-surface image-sensing means, to be spaced apart from each of
the suction-holding nozzles by a given distance, to avoid
interference with the large-size electronic component being
suction-held by at least one of the suction-holding nozzles, during
the scanning operation of the scanning unit.
[0142] In this aspect, even in case where the large-size electronic
component requiring image recognition using a fixed camera is
attached to at least one of the suction-holding nozzles, the
scanning operation for the electronic components attached to the
remaining suction-holding nozzles can be performed under a
condition that the scanning unit is arranged adjacent to a lower
surface of each of the remaining suction-holding nozzles as close
as possible, while avoiding interference with the large-size
electronic component. Thus, the large-size electronic component can
be mixedly transferred together with the electronic components to
be subjected to the image-sensing operation using the scanning
unit. This makes it possible to allow the component-recognizing
apparatus to achieve high flexibility in terms of sequence during
transfer of the electronic components, and excellent transfer
efficiency.
[0143] Preferably, in the component-recognizing apparatus in
accordance with this aspect of the present invention, the scanning
unit has a recess which allows for taking an image of any
electronic component falling within an image-capturing region
determined by the lower-surface image taking section and the
lower-surface image-sensing means, and allows to have a given
distance from each of the suction-holding nozzles to avoid
interference with the large-size electronic component, in the given
region thereof.
[0144] According to this feature, the scanning unit has a recess
that maintains a given distance from each of the suction-holding
nozzles to avoid interference with the large-size electronic
component. This makes it possible to more reliably avoid
interference between the scanning unit and the large-size
electronic component being suction-held by the suction-holding
nozzle.
[0145] Preferably, the first optical path changing member is
operable to change by about 90 degrees the optical path directed
from a lower side of the nozzle toward the base on approximately
horizontally lateral side; and the second optical path changing
member is operable to change further the optical path from the
first optical path changing member, by about 90 degrees.
[0146] According to this feature, each of the first optical path
changing member and the second optical path changing member is
operable to change the optical path by about 90 degrees, so that an
appropriate angular change in optical path and an appropriate width
in field of view can be obtained.
[0147] Preferably, the above component-recognizing apparatus
comprises a slit formed between the suction-holding nozzle and the
first optical path changing member to restrict a light-passing
area.
[0148] According to this feature, the slit is formed between the
suction-holding nozzle and the first optical path changing member
to restrict a light-passing area. This makes it possible to prevent
excess light from entering the lower-surface image-sensing means
from a region other than the image-capturing region, so as to
obtain a clear image free of flare.
[0149] Preferably, the above component-recognizing apparatus
comprises an optical path changing member operable to bend the
light along a lateral side, after the light taken from the lower
surface of the electronic component through the lower-surface image
taking section, wherein a support member which supports the optical
path changing member has an upper surface located below an upper
surface of in conformity to an undulating shape of the large-size
electronic component.
[0150] According to this feature, the upper surface of the support
member supporting the optical path changing member is located below
the upper surface of the optical path changing member, so that,
when each of the suction-holding nozzles passes above the upper
surface of the optical path changing member during the scanning
operation, no interference with the support member occurs. Thus, a
position of each of the suction-holding nozzles during the scanning
operation can be set closer to a target position and a component
feed section in a vertical direction by just the margin, and
therefore a mounting time in the target position and a pickup time
in the component feed section can be cut down.
[0151] Preferably, the scanning unit includes: side-area
image-sensing means disposed lateral to and in side-by-side
relation to the lower-surface image-sensing means, to capture an
image of an electronic component from a lateral side of the
electronic component; and a side-image taking section oriented
toward a lateral region of the electronic component, to introduce
the image into the side-area image-sensing means, wherein the
side-image taking section has a lower end located below an upper
surface of the optical path changing member.
[0152] According to this feature, the scanning unit is provided
with the side-area image-sensing means, so that suction-held
conditions can be detected based on a lateral-surface image. In
case of adding this function, the lower end of the side-image
taking section is located below the upper surface of the optical
path changing member, so that the mounting time in the target
position and the pickup time in the component feed section are
never increased.
[0153] A surface-mounting apparatus according to the present
invention comprises a movable head unit having a suction-holding
nozzle capable of suction-holding an electronic component, the
surface-mounting apparatus being adapted to pick up an electronic
component from a component feed section by the suction-holding
nozzle, and to mount the electronic component onto a board, after
taking an image of the electronic component being suction-held by
the suction-holding nozzle to perform image recognition of
suction-held conditions of the electronic component relative to the
suction-holding nozzle. The surface-mounting apparatus is equipped
with the above component-recognizing apparatus, as a means to
perform the image recognition of the conditions of electronic
component being suction-held by the suction-holding nozzle.
[0154] The surface-mounting apparatus of the present invention is
equipped with the above component-recognizing apparatus, as a means
to perform the image recognition of the conditions of electronic
component being suction-held by the suction-holding nozzle. Thus,
an opposed distance between the head unit and a base can be reduced
to downsize the surface-mounting apparatus in its entirety and
facilitate a reduction in installation space of the
surface-mounting apparatus. Further, in case where the scanning
unit has a shape configured to be spaced apart from each of the
suction-holding nozzles by a given distance, the surface-mounting
apparatus can transfer the small-size electronic components and the
large-size electronic component being suction-held by the
respective suction-holding nozzles, while avoiding interference
between the scanning unit and the large-size electronic component,
so as to achieve high flexibility in terms of transfer sequence,
and excellent transfer efficiency.
[0155] A component-inspecting apparatus according to the present
invention comprises a movable head unit having a suction-holding
nozzle capable of suction-holding an electronic component, the
component-inspecting apparatus being adapted to pick up an
electronic component from a component feed section by the
suction-holding nozzle, and to transfer the electronic component to
inspection means to carry out various inspections, after taking an
image of the electronic component being suction-held by the
suction-holding nozzle to perform image recognition of suction-held
conditions of the electronic component relative to the
suction-holding nozzle. The component-inspecting apparatus is
equipped with the component-recognizing apparatus as defined in any
one of claims 1 to 18, as a means to perform the image recognition
of the conditions of electronic component being suction-held by the
suction-holding nozzle.
[0156] The component-inspecting apparatus of the present invention
is equipped with the above component-recognizing apparatus, as a
means to perform the image recognition of the conditions of
electronic component being suction-held by the suction-holding
nozzle. Thus, an opposed distance between the head unit and a base
can be reduced to downsize the component-inspecting apparatus in
its entirety and facilitate a reduction in installation space of
the component-inspecting apparatus. Further, in case where the
scanning unit has a shape configured to be spaced apart from each
of the suction-holding nozzles by a given distance, the
component-inspecting apparatus can transfer the small-size
electronic components and the large-size electronic component being
suction-held by the respective suction-holding nozzles, while
avoiding interference between the scanning unit and the large-size
electronic component, so as to achieve high flexibility in terms of
transfer sequence, and excellent transfer efficiency.
[0157] Although the present invention has been fully described by
way of example with reference to the accompanying drawings, it is
to be understood that various changes and modifications will be
apparent to those skilled in the art. Therefore, unless otherwise
such changes and modifications depart from the scope of the present
invention hereinafter defined, they should be construed as being
included therein.
* * * * *