U.S. patent application number 12/257808 was filed with the patent office on 2010-04-15 for liquid-cooling type thermal module.
This patent application is currently assigned to ASIA VITAL COMPONENTS CO., LTD.. Invention is credited to Chih-Peng Chen.
Application Number | 20100089555 12/257808 |
Document ID | / |
Family ID | 42097818 |
Filed Date | 2010-04-15 |
United States Patent
Application |
20100089555 |
Kind Code |
A1 |
Chen; Chih-Peng |
April 15, 2010 |
LIQUID-COOLING TYPE THERMAL MODULE
Abstract
A liquid-cooling type thermal module includes a liquid cooling
unit and at least one heat pipe. The heat pipe has a heat-absorbing
end and a heat-dissipating end. The heat-absorbing end is connected
to at least one heat-producing element. The heat-producing element
is located inside a system while the liquid cooling unit is located
outside the system. The heat pipe connects the heat-producing
element to the liquid cooling unit. Heat produced by the
heat-producing element is absorbed by the heat-absorbing end and
transferred to the remote liquid cooling unit via the
heat-dissipating end to be dissipated. With the heat pipe being
used as a medium for conducting heat, the problem of fluid leak can
be eliminated, and the heat produced by the heat-producing element
can be effectively carried away from the system without stagnating
around the heat-producing element, enabling the thermal module to
provide excellent heat dissipating effect.
Inventors: |
Chen; Chih-Peng; (Sinjhuang
City, TW) |
Correspondence
Address: |
NIKOLAI & MERSEREAU, P.A.
900 SECOND AVENUE SOUTH, SUITE 820
MINNEAPOLIS
MN
55402
US
|
Assignee: |
ASIA VITAL COMPONENTS CO.,
LTD.
Sinjhuang City
TW
|
Family ID: |
42097818 |
Appl. No.: |
12/257808 |
Filed: |
October 24, 2008 |
Current U.S.
Class: |
165/104.31 |
Current CPC
Class: |
H01L 23/473 20130101;
F28D 15/00 20130101; H01L 2924/0002 20130101; F28D 15/0266
20130101; H01L 2924/00 20130101; H01L 2924/0002 20130101 |
Class at
Publication: |
165/104.31 |
International
Class: |
F28D 15/00 20060101
F28D015/00 |
Foreign Application Data
Date |
Code |
Application Number |
Oct 14, 2008 |
TW |
097218342 |
Claims
1. A liquid-cooling type thermal module, comprising a liquid
cooling unit and at least one heat pipe; the heat pipe having a
heat-absorbing end and a heat-dissipating end, the heat-absorbing
end being connected to at least one heat-producing element, and the
heat-dissipating end being connected to the liquid cooling unit,
whereby heat produced by the heat-producing element is absorbed by
the heat-absorbing end and transferred by the heat pipe to the
liquid cooling unit via the heat-dissipating end to be
dissipated.
2. The liquid-cooling type thermal module as claimed in claim 1,
wherein the heat-producing element is located inside a system while
the liquid cooling unit is located outside the system, and the heat
pipe is extended into the system to connect the heat-producing
element to the liquid cooling unit.
3. The liquid-cooling type thermal module as claimed in claim 1,
wherein the liquid cooling unit internally defines a dissipating
space and includes a pump, a type of fluid being filled in the
dissipating space, and the pump driving the fluid to flow in the
dissipating space.
4. The liquid-cooling type thermal module as claimed in claim 1,
wherein at least one cooling fan is mounted to one side of the
liquid cooling unit.
5. The liquid-cooling type thermal module as claimed in claim 1,
wherein the heat-absorbing end has a flat configuration for bearing
on the heat-producing element.
6. The liquid-cooling type thermal module as claimed in claim 1,
wherein the heat-absorbing end is connected to at least one heat
sink, and the heat sink is attached to the heat-producing
element.
7. The liquid-cooling type thermal module as claimed in claim 3,
wherein the liquid cooling unit further internally defines at least
one flow way in the dissipating space, and the flow way being
communicable with the pump.
8. The liquid-cooling type thermal module as claimed in claim 3,
wherein the heat-dissipating end is inserted into the dissipating
space.
9. The liquid-cooling type thermal module as claimed in claim 1,
wherein the liquid cooling unit includes a plurality of radiating
fins protruded from one side of the liquid cooling unit.
10. The liquid-cooling type thermal module as claimed in claim 2,
wherein the liquid cooling unit internally defines a dissipating
space and includes a pump, a type of fluid being filled in the
dissipating space, and the pump driving the fluid to flow in the
dissipating space.
11. The liquid-cooling type thermal module as claimed in claim 2,
wherein the system is selected from the group consisting of a case
of an electronic device, a telecommunication cabinet, a computer
case, and an LED lamp lens.
12. The liquid-cooling type thermal module as claimed in claim 10,
wherein the liquid cooling unit further internally defines at least
one flow way in the dissipating space, and the flow way being
communicable with the pump.
Description
FIELD OF THE INVENTION
[0001] The present invention relates to a liquid-cooling type
thermal module, and more particularly to a thermal module that
employs a heat pipe as a heat conducting medium and uses a liquid
cooling unit to cool the heat pipe and dissipate heat.
BACKGROUND OF THE INVENTION
[0002] While an electronic device operates at constantly increased
high speed, electronic elements inside the electronic device also
produce a large amount of heat during the operation thereof. In
general, a heat sink or a radiating fin assembly is arranged on the
electronic elements to provide increased heat-dissipating area and
thereby enhanced heat-dissipating efficiency. However, the heat
sink or the radiating fin assembly can only radiates heat and
provides very limited heat-dissipating effect. In order to solve
the above problem, liquid-cooling type thermal modules have been
developed for providing better heat-dissipating effect.
[0003] Please refer to FIG. 1, which shows a conventional
water-cooling type thermal module 1 including a dissipating unit
11, a pump 14, a first water pipe 12, a heat sink 13, and a second
water pipe 15. The dissipating unit 11 has an inner receiving space
(not shown), a flow way (not shown), a water outlet (not shown),
and a water inlet 111. A fluid is filled in the receiving space.
The pump 14 is connected to the water outlet of the dissipating
unit 11 to pressurize the fluid, so that the fluid flows in the
receiving space and the flow way. The heat sink 13 has a hollow
case with a water inlet 132 and a water outlet 131 provided on a
top thereof. The hollow case has a bottom defining a contact face
133 for contacting with at least one heat-producing source (not
shown) to absorb heat produced by the heat-producing source. The
heat sink 13 has an internal receiving space (not shown)
communicating with the water inlet 132 and the water outlet 131.
The fluid can flow in the receiving space of the heat sink 13 to
circulate between the heat sink 13 and the dissipating unit 11, so
that the heat absorbed by the heat sink 13 can be carried away from
the heat sink 13 by the fluid. The first water pipe 12 is connected
at an end to the pump 14 and at the other end to the water inlet
132 on the heat sink 13. The second water pipe 15 is connected at
an end to the water inlet 111 on the dissipating unit 11 and at the
other end to the water outlet 131 on the heat sink 13. When the
pump 14 operates, the fluid is driven to flow in and circulate
between the above components of the thermal module 1 for
dissipating heat. However, since joints between the internal
components of the electronic device are not always watertight, the
fluid tends to leak to cause damage to the electronic device.
Moreover, the components of the conventional water-cooling type
thermal module 1 are complicate to occupy a large room and can not
be easily installed. Therefore, the conventional thermal module 1
requires a relatively high manufacturing cost.
[0004] In conclusion, the conventional water-cooling thermal module
has the following disadvantages: (1) having complicated components;
(2) uneasy to install; (3) being subject to water leak; (4)
occupying a relatively large room; and (5) requiring relatively
high manufacturing cost.
SUMMARY OF THE INVENTION
[0005] A primary object of the present invention is to provide a
liquid-cooling type thermal module, which has simple structure and
eliminates the problem of fluid leak.
[0006] Another object of the present invention is to provide a
liquid-cooling type thermal module that can be easily
assembled.
[0007] A further object of the present invention is to provide a
liquid-cooling type thermal module that is able to effectively
remove heat produced by a heat-producing element from a system and
thereby prevent heat from accumulating in the system.
[0008] To achieve the above and other objects, the liquid-cooling
type thermal module according to the present invention includes a
liquid cooling unit and at least one heat pipe. The heat pipe has a
heat-absorbing end and a heat-dissipating end. The heat-absorbing
end is connected to at least one heat-producing element. The
heat-producing element is located inside a system while the liquid
cooling unit is located outside the system. The heat pipe connects
the heat-producing element to the liquid cooling unit. The
heat-dissipating end of the heat pipe is connected to the liquid
cooling unit located outside the system. Heat produced by the
heat-producing element is absorbed by the heat-absorbing end and
transferred by the heat pipe to the remote heat-dissipating end via
the heat-dissipating end and be dissipated. With the heat pipe
being used as a medium for conducting heat, the problem of fluid
leak can be eliminated, and the heat produced by the heat-producing
element can be effectively carried by the heat pipe away from the
system without accumulating therein, enabling the thermal module to
provide excellent heat dissipating effect.
[0009] With the above arrangements, the liquid-cooling type thermal
module of the present invention has the following advantages: (1)
having simple structure; (2) eliminating the problem of fluid leak;
(3) easy to assemble without occupying too much room; and (4)
preventing heat from accumulating in the case of an electronic
device.
BRIEF DESCRIPTION OF THE DRAWINGS
[0010] The structure and the technical means adopted by the present
invention to achieve the above and other objects can be best
understood by referring to the following detailed description of
the preferred embodiments and the accompanying drawings,
wherein:
[0011] FIG. 1 is an assembled perspective view of a conventional
water-cooling type thermal module;
[0012] FIG. 2 is an assembled perspective view of a liquid-cooling
type thermal module according to a first embodiment of the present
invention;
[0013] FIG. 3 is a cutaway view of a liquid cooling unit for the
liquid-cooling type thermal module of FIG. 2; and
[0014] FIG. 4 is an assembled perspective view of a liquid-cooling
type thermal module according to a second embodiment of the present
invention.
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS
[0015] Please refer to FIGS. 2 and 3. A liquid-cooling type thermal
module according to a first embodiment of the present invention
includes a liquid cooling unit 2 and at least one heat pipe 3. The
heat pipe 3 has a heat-absorbing end 31 and a heat-dissipating end
32. The heat-absorbing end 31 has a flat configuration and is
connected to and bearing on at least one heat-producing element 41.
The heat-producing element 41 is located inside a system 4 while
the liquid cooling unit 2 is located outside the system 4. The heat
pipe 3 is extended from the liquid cooling unit 2 into the system 4
with the heat-absorbing end 31 bearing on the heat-producing
element 41 and the heat-dissipating end 32 connected to the liquid
cooling unit 2. Heat produced by the heat-producing element 41 is
absorbed by the heat pipe 3 at the heat-absorbing end 31 and then
transferred via the heat-dissipating end 32 to the liquid cooling
unit 2, and is finally dissipated into ambient air. Since the heat
pipe 3 is able to absorb and exactly transfer heat to the remote
liquid cooling unit 2 for dissipation, the heat produced by the
heat-producing element 41 would not stagnate around the
heat-producing element 41, but can be effectively removed from an
interior of the system 4.
[0016] The liquid cooling unit 2 includes a plurality of radiating
fins 22 protruded from one side of the liquid cooling unit 2. The
radiating fins 22 are connected to at least one cooling fan 5. The
liquid cooling unit 2 further includes a pump 21 and internally
defines a dissipating space 23 and a flow way 24 communicating with
the pump 21. A type of fluid is filled in the dissipating space 23.
The pump 21 drives the fluid to flow in the dissipating space 23
and thereby cool the heat-dissipating end 32 of the heat pipe
3.
[0017] FIG. 4 is an assembled perspective view of a liquid-cooling
type thermal module according to a second embodiment of the present
invention. Please refer to FIGS. 3 and 4. It is noted parts that
are the same in the first and the second embodiment are denoted by
the same reference numerals herein. As in the first embodiment, the
liquid-cooling type thermal module 2 in the second embodiment is
connected to a system 4 for dissipating heat produced by at least
one heat-producing element 41 located inside the system 4. The
liquid-cooling type thermal module 2 of the second embodiment
includes a liquid cooling unit 2 located outside the system 4. The
liquid cooling unit 2 is connected to the heat-producing element 41
via at least one heat pipe 3. The liquid cooling unit 2 defines an
internal dissipating space 23 and a flow way 24, and includes a
pump 21 communicable with the flow way 24. A type of fluid is
filled in the dissipating space 23. The pump 21 drives the fluid to
flow in the dissipating space 23.
[0018] In the second embodiment, the heat pipe 3 also has a
heat-absorbing end 31 and a heat-dissipating end 32. The
heat-absorbing end 31 is bearing on the heat-producing element 41.
When the heat-producing element 41 produces heat, the
heat-absorbing end 31 of the heat pipe 3 absorbs and transfers the
produced heat to the remote heat-dissipating end 32. The
heat-dissipating end 32 is inserted into the dissipating space 23
of the liquid cooling unit 2, which is located outside the system
4, so that the fluid in the dissipating space 23 can cool the
heat-dissipating end 32 to achieve the purpose of dissipating
heat.
[0019] In the present invention, by using the heat pipe 3 as a
medium for conducting heat, the heat produced by the heat-producing
element 41 can be exactly transferred to an outer side of the
system 4 without accumulating therein. Moreover, with the heat pipe
3 being used as the medium of conducting heat, the problem of fluid
leak is eliminated and damage to electronic components inside the
system 4 caused by the fluid leak can be prevented.
[0020] In the second embodiment, the heat-absorbing end 31 of the
heat pipe 3 is further connected to at least one heat sink 6. The
heat sink 6 is attached to the heat-producing element 41 to give
the heat-producing element 41 an increased heat-dissipating
area.
[0021] The system 4 can be a case of an electronic device, a
telecommunication cabinet, a computer case, or an LED lamp lens. In
the illustrated embodiments of the present invention, the system 4
is a computer case.
[0022] The present invention has been described with some preferred
embodiments thereof and it is understood that many changes and
modifications in the described embodiments can be carried out
without departing from the scope and the spirit of the invention
that is intended to be limited only by the appended claims.
* * * * *