U.S. patent application number 12/244668 was filed with the patent office on 2010-04-08 for cooling system for rack-mounted electronics equipment.
This patent application is currently assigned to Environmental Container Systems, Inc., d/b/a ECS Composites, Environmental Container Systems, Inc., d/b/a ECS Composites. Invention is credited to Dennis M. Becklin.
Application Number | 20100085709 12/244668 |
Document ID | / |
Family ID | 42044613 |
Filed Date | 2010-04-08 |
United States Patent
Application |
20100085709 |
Kind Code |
A1 |
Becklin; Dennis M. |
April 8, 2010 |
COOLING SYSTEM FOR RACK-MOUNTED ELECTRONICS EQUIPMENT
Abstract
A rack-mount case system for receiving, supporting and storing
electronics equipment includes a slide-out frame closely received
and shock mounted in a case. The system includes a cooling unit
having at least one heat sink in fluid communication with a first
blower and a manifold in fluid communication with a second blower.
A thermoelectric unit is located between the heat sink and the
manifold to provide a compact cooling unit that may be secured to a
side of the slide-out frame with a bracket, for example.
Inventors: |
Becklin; Dennis M.; (Grants
Pass, OR) |
Correspondence
Address: |
BLACK LOWE & GRAHAM, PLLC
701 FIFTH AVENUE, SUITE 4800
SEATTLE
WA
98104
US
|
Assignee: |
Environmental Container Systems,
Inc., d/b/a ECS Composites
Grants Pass
OR
|
Family ID: |
42044613 |
Appl. No.: |
12/244668 |
Filed: |
October 2, 2008 |
Current U.S.
Class: |
361/697 |
Current CPC
Class: |
H05K 7/202 20130101;
H05K 7/20563 20130101 |
Class at
Publication: |
361/697 |
International
Class: |
H05K 7/20 20060101
H05K007/20 |
Claims
1. A rack-mount case system comprising: a case; a frame located
within the case and configured to receivably secure electronics
equipment; a cooling unit coupled to the frame, the cooling unit
having at least one heat sink in fluid communication with a first
blower and at least one manifold in fluid communication with a
second blower; a thermoelectric component located between the at
least one heat sink and the manifold; and a first vent opening
located in at least one portion of the case, the first vent opening
in fluid communication with the cooling unit, wherein at least the
second blower is configured to move air at a desired flow rate
within the case.
2. The case of claim 1, wherein the second blower is configured to
move higher temperature air out of the case.
3. The case of claim 1, wherein the first blower is configured to
move ambient air over the at least one heat sink.
4. The case of claim 1, wherein the at least one heat sink unit is
arranged in series with another heat sink unit.
5. The case of claim 1, wherein the first vent opening is aligned
with the at least one of the blowers of the cooling unit.
6. The case of claim 1, further comprising: a second vent opening
extending through the case and substantially aligned with the at
least one heat sink of the cooling unit.
7. The system of claim 1, wherein the cooling unit operates to
reduce a heat load within the case.
8. A rack-mount case system comprising: means for slideably
receiving electronics equipment within an interior region of a
rack-mount case; means for cooling the interior region by drawing
air over a heat sink unit and through a manifold; and means for
exchanging air from the interior region with an ambient
environment.
9. The case of claim 8, wherein the means for cooling includes a
first blower for drawing the air over the heat sink.
10. The case of claim 8, wherein the means for cooling includes a
second blower for drawing the air through the manifold.
11. The case of claim 8, wherein the means for cooling includes at
least one thermoelectric component.
12. The case of claim 11, wherein the thermoelectric component is
located between the heat sink and the manifold.
13. The case of claim 8, wherein the means for exchanging air
includes an opening formed in a portion of the case and permitting
fluid communication between the interior region and the ambient
environment.
14. The case of claim 8, wherein the means for cooling
substantially reduces a heat load within the interior region of the
case.
Description
BACKGROUND OF THE INVENTION
[0001] Various types of transit and rack-mount cases for receiving
and supporting electronics equipment have been employed in military
and commercial environments since their introduction around 1965.
In one aspect, a rack-mount case allows electronics equipment to be
slide mounted within a frame or rack, which in turn may be coupled
to the case using shock absorbing devices. The entire set of
electronics equipment may be removed from the shock mounted rack
and installed into racks in military shelters or other systems. The
rack-mount case may be fully enclosed, water tight, and sealed from
sand, dust and chemical warfare agents.
[0002] Preferably, the rack-mount case permits installation of the
electronics equipment without modification and takes up a minimum
amount of space. In addition, the rack-mount case may be configured
to permit operation of the electronics equipment without its
removal from the case. As a result of the above features and
depending on the environment, the rack-mount case and the
electronics equipment inside may be subject to high temperatures
during transportation, operation or both.
SUMMARY OF THE INVENTION
[0003] A rack-mount case system for receiving, supporting and
storing electronics equipment includes a slide-out frame closely
received and shock mounted in a case. The system includes a cooling
unit having at least one heat sink in fluid communication with a
first blower and a manifold in fluid communication with a second
blower. A thermoelectric unit is located between the heat sink and
the manifold to provide a compact cooling unit that may be secured
to a side of the slide-out frame with a bracket, for example.
[0004] In one example of the invention, a rack-mount case system
includes a case; a frame located within the case and configured to
receivably secure electronics equipment; a cooling unit coupled to
the frame, the cooling unit having at least one heat sink in fluid
communication with a first blower and at least one manifold in
fluid communication with a second blower; a thermoelectric
component located between the at least one heat sink and the
manifold; and a first vent opening located in at least one portion
of the case, the first vent opening in fluid communication with the
cooling unit, wherein at least the second blower is configured to
move air at a desired flow rate within the case.
[0005] In another example of the invention, a rack-mount case
system includes means for slideably receiving electronics equipment
within an interior region of a rack-mount case; means for cooling
the interior region by drawing air over a heat sink unit and
through a manifold; and means for exchanging air from the interior
region with an ambient environment.
BRIEF DESCRIPTION OF THE DRAWINGS
[0006] The preferred and alternative embodiments of the present
invention are described in detail below with reference to the
following drawings.
[0007] FIG. 1 shows a rack-mount case system having a frame
slideably coupled to a case and a heat exchanger unit coupled to
the frame according to an embodiment of the present invention;
[0008] FIG. 2 shows a hot-side of a cooling system having blowers
in fluid communication with heat sink units and a manifold
according to an embodiment of the present invention; and
[0009] FIG. 3 shows a cold-side of the cooling system of FIG. 2
having blowers in fluid communication with heat sink units and the
manifold.
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT
[0010] In an example of the present invention, a rack-mount case
system includes a frame shock-mounted within a case. The frame may
take the form of a slide-out rack located on rails while the case
may be made from a fiber-reinforced composite material. The frame
is sized to receive electronics equipment such as servers,
processors, and other types of electronics equipment. Although the
term electronics equipment is used herein, it is appreciated that
electronics equipment may include, but is not limited to,
electrical, electro-magnetic, electro-optical, optical, computer
equipment such as computer networking or computer processing
equipment, and electro-mechanical equipment. In addition, the
present invention includes a cooling system for maintaining an
interior region within the case at a desired temperature or at
least within a desired temperature range with respect to a
temperature of an ambient environment (i.e., the ambient
temperature).
[0011] FIG. 1 shows a rack-mount case system 100 having a case 102
and a frame 104 slideably received by the case 102. The case 102
and the frame 104 may take a variety of forms, such as a system
with a slide-out platform in a rack mount case having a slide-out
platform configured to secure electronic equipment. The platform is
slideably attached to the rack mount case using rails. The first
and second rails have a series of indexing holes in order to allow
a detent member, such as a dagger pin, to secure the platform in
place with respect to the case. The rack mount case may be
stackable with other cases and has a front and rear cover. The
front and rear covers may be attached to the case to prevent
ingress of undesirable water, dust, chemical agents or other
debris. In one embodiment, the front and rear covers are attached
to the case with seals that are located around a peripheral edge of
the case and an engaging region of the front and rear covers.
Compression of the seals may be accomplished with one or more
latches used to couple the front and rear covers to the case.
[0012] The frame 100 may be supported by shock isolating members
(not shown) within the case 102. By way of example, the shock
isolating members may take the form of visco-elastic or elastomeric
members that are deformable, yet able to recover to its original
shape after being shock loaded. The shock isolating members are
positioned between the case 102 and the frame 104.
[0013] FIGS. 2 and 3 show a cooling system 106 of the rack-mount
case system 100 that cooperates with openings 108, 110 (FIG. 1) in
the case 102 (FIG. 1) to exchange air between an interior region
112 (FIG. 1) within the case 102 and an ambient environment 114
(FIG. 1) and/or circulate air within the interior region 112. The
cooling system 106 includes a heat exchanger unit 116 that is in
fluid communication with both the interior region 112 and the
ambient environment 114. The heat exchanger unit 116 may take the
form of an air cooled heat exchanger. In one embodiment, the
cooling system 106 includes one or more cold-side blowers 118 and
one or more hot-side blowers 120. The cold-side blower 118 moves
air through a cold-side manifold 122 while the hot-side blowers 120
move air over one or more heat sink units 124. One or more
thermoelectric components 126 are located between the cold-side
manifold 122 and the heat sink units 124. A bracket 128 secures the
cooling system 106 to the case 102. The openings 108, 110 (FIG. 1)
in the case 102 are configured to substantially align with the
cold-side blowers 118 and the hot-side blowers 120,
respectively.
[0014] During operation, ambient air enters the hot-side blowers
120 and flows over the heat sink units 124, which cools the heat
sink units 124 as they draw heat from the thermoelectric components
126. The thermoelectric components 126 generate cold air and remove
hot air from the case 102. Accordingly, one side of the cooling
system 106 gets hot while the other side gets cold.
[0015] Within the case 102, air enters the cold-side blowers 118
and flows through the cold-side manifold 122. The cold-side
manifold 122 is chilled by the thermoelectric components 126, which
causes chilling of the air flowing through the cold-side manifold
122.
[0016] While the preferred embodiment of the invention has been
illustrated and described, as noted above, many changes can be made
without departing from the spirit and scope of the invention.
Accordingly, the scope of the invention is not limited by the
disclosure of the preferred embodiment. Instead, the invention
should be determined entirely by reference to the claims that
follow.
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