U.S. patent application number 12/400011 was filed with the patent office on 2010-04-08 for structure of heat sink.
Invention is credited to Shyh-Ming Chen.
Application Number | 20100084116 12/400011 |
Document ID | / |
Family ID | 42074866 |
Filed Date | 2010-04-08 |
United States Patent
Application |
20100084116 |
Kind Code |
A1 |
Chen; Shyh-Ming |
April 8, 2010 |
Structure of heat sink
Abstract
An improved structure of a heat sink is disclosed. The heat sink
is composed of a ring body, fins and a bottom plate. The fins are
radially arranged on the ring body. The bottom plate is fixed in
the ring body for being placed a heat source. The heat sink can
effectively dissipate the heat from the heat source.
Inventors: |
Chen; Shyh-Ming; (Taipei
County, TW) |
Correspondence
Address: |
SHOU - HSIN YIN
P.O. BOX 90-3 Taipei
TAIPEI City
10699
TW
|
Family ID: |
42074866 |
Appl. No.: |
12/400011 |
Filed: |
March 9, 2009 |
Current U.S.
Class: |
165/80.3 |
Current CPC
Class: |
F21V 29/77 20150115;
F21V 29/51 20150115; F21K 9/00 20130101; F21V 29/89 20150115; F28F
1/20 20130101; F21V 29/70 20150115; F21V 29/773 20150115 |
Class at
Publication: |
165/80.3 |
International
Class: |
F28F 7/00 20060101
F28F007/00 |
Foreign Application Data
Date |
Code |
Application Number |
Oct 7, 2008 |
TW |
097217916 |
Claims
1. A heat sink comprising: a ring body; a plurality of fins
radially disposed on an outer surface of the ring body; and a
bottom plate fixed in the ring body for being placed a heat
source.
2. The heat sink of claim 1, wherein the ring body is provided with
a plurality of thin grooves and taper slot, both of which are
alternatively arranged.
3. The heat sink of claim 2, wherein the thin grooves separately
grip the fins by using a punch to extrude the taper slot.
4. The heat sink of claim 1, wherein the ring body is one of
circle, semicircle, oval, rectangle or cone.
5. The heat sink of claim 1, wherein the ring body is of an
irregular shape.
6. The heat sink of claim 1, wherein a diameter of the bottom plate
is equal to or slightly smaller than an inner diameter of the ring
body.
7. The heat sink of claim 6, wherein the bottom plate is connected
to the ring body by soldering, welding or infusing thermal
grease.
8. The heat sink of claim 6, wherein the bottom plate is connected
to the ring body by pressing the bottom plate to deform.
9. The heat sink of claim 1, wherein a diameter of the bottom plate
is slightly larger than an inner diameter of the ring body.
10. The heat sink of claim 9, wherein the bottom plate is connected
to the ring body by using a molding machine to press the bottom
plate.
11. The heat sink of claim 1, wherein the bottom plate is made of
copper, aluminum or iron.
12. The heat sink of claim 1, wherein the bottom plate is composed
of two elements with different materials.
13. The heat sink of claim 1, wherein the ring body and bottom
plate are made of different materials.
14. The heat sink of claim 1, wherein a junction between the bottom
plate and the ring body is provided with at least one gap for air
flow.
15. The heat sink of claim 1, wherein the bottom plate is a heat
spreader having a working fluid.
16. The heat sink of claim 1, wherein both the ring body and the
fins are integratedly formed into a single module.
Description
BACKGROUND OF THE INVENTION
[0001] 1. Technical Field
[0002] The invention generally relates heat sinks, more
particularly to annular heat sinks.
[0003] 2. Related Arts
[0004] Technology of heat dissipation plays an important role in
the field of electronic apparatuses. With continuous development of
consumer electronic apparatuses, the requirement and challenge of
heat dissipation also increase. For example, tungsten lamps and
halogen lamps have been replaced by light emitting diodes (LEDs).
The main features of the LEDs are less power consumption, long
service time, compact size and light weight. The LEDs also can emit
various light so they can be extensively applied in many fields for
indication and illumination. Although the LEDs generate less heat
than conventional lighting devices, the problem of heat dissipation
accompanied with high power LEDs still should be dealt with
carefully.
[0005] Taiwan Patent Application Publication No. 200716911
discloses a heat dissipating device for LED lamp. '911 connects a
high power LED lamp to a heat spreader via a heat pipe so that the
heat from the LED lamp can be conducted to the heat spreader.
However, '911's structure is considerably complicated and
bulky.
[0006] Taiwan Utility Model Patent No. M317539 discloses an LED
lamp. '539 employs a heat conducting post and a plurality of fins
annularly connected thereto to constitute a heat dissipating
module. The fins are radially disposed on the heat conducting post
and form a recess at a top end of the heat conducting post for
accommodating an LED.
[0007] In '539, however, the fins and heat conducting post can not
be tightly connected so that the heat from the LED can not be
effectively conducted to the fins through the heat conducting post.
Thus, the heat dissipating efficiency of '539 is not good enough,
and the LED tends to be damaged because of overheating.
Furthermore, '539 has too many components and lacks secure
positioning and connecting arrangement. Therefore, '539 is hard to
be assembled and is uneconomical for manufacture.
SUMMARY OF THE INVENTION
[0008] A primary object of the invention is to provide an improved
heat sink having a ring body and a seat plate, which can be
securely and tightly connected to each other.
[0009] Another object of the invention is to simplify a structure
of heat sink and to shorten production time in manufacturing
process.
[0010] Another object of the invention is to enhance heat
dissipation performance.
[0011] To accomplish the objects abovementioned, the heat sink is
composed of a ring body, fins and a bottom plate. The fins are
radially arranged on the ring body. The bottom plate is fixed in
the ring body for being placed a heat source.
BRIEF DESCRIPTION OF THE DRAWINGS
[0012] FIG. 1 is an exploded view of a preferred embodiment
according to the invention;
[0013] FIG. 2 is a perspective view of the assembly of FIG. 1;
[0014] FIG. 3 shows a detailed status before the taper slot is
pressed FIG. 4 shows a detailed status after the taper slot is
pressed;
[0015] FIGS. 5A and 5B shows a process of the bottom plate being
pressed;
[0016] FIG. 6 is a perspective view of a finished product shown in
FIG. 1;
[0017] FIGS. 7A and 7B show another type of the bottom plate and
how it connects the ring body;
[0018] FIGS. 8A and 8B show another type of the bottom plate and
how it connects the ring body;
[0019] FIGS. 9A and 9B show another type of the bottom plate and
how it connects the ring body;
[0020] FIG. 10 shows another embodiment of the bottom plate;
[0021] FIG. 11 shows a connection between the bottom plate and ring
body;
[0022] FIGS. 12 and 13 show another connection of the bottom plate
and ring body;
[0023] FIG. 14 shows another embodiment of the ring body;
[0024] FIGS. 15 and 16 show another embodiment of the bottom plate
having a working fluid;
[0025] FIG. 17 is an exploded view of another embodiment of the
ring body; and
[0026] FIG. 18 is a perspective view of assembly of FIG. 17.
DETAILED DESCRIPTION OF THE INVENTION
[0027] Referring to FIG. 1, the first preferred embodiment in
accordance with the invention is shown. The cylindrical heat sink 1
is composed of a ring body 10, a bottom plate 20 disposed in the
ring body 10 and a plurality of fins radially disposed on the ring
body 10. The ring body 10 is, but not limited to, a hollow
cylinder. There are a plurality of longitudinally thin grooves 14
and taper slots 12 on an outer surface of the ring body 10. Both
the thin grooves 14 and taper slot 12 are alternatively arranged.
The bottom plate 20, which is made of copper, aluminum or iron, can
be a single component or be composed of two components with
different materials. A diameter of the bottom plate 20 is
approximately equal to an inner diameter of the ring body 10 so
that the bottom plate 20 can be fixed within the ring body 10. In a
preproduction process, the fins 30 are arranged outside the ring
body 10 and directed at the thin grooves 14 separately, and then
the fins 30 can be fixedly embedded in the thin grooves 14.
[0028] In the shown embodiment, ring body 10 and fins 30 are
fixedly connected by an extrusion process. Referring to FIGS. 3 and
4, each of the fins 30 is inserted in a thin groove 14. By using a
punch 40 to extrude the taper slot 12, the thin groove 14 can grip
the fin 30. As shown in FIG. 2, fins 30 are fixedly arranged
outside the ring body 10. The taper slots 12 are extruded by the
punch 40 to deform. Thin grooves 14 are pressed to tightly grip
fins 30 as shown in FIGS. 3 and 4. Thus, both fins 30 and ring body
10 are fixed to be integrated as shown in FIG. 6.
[0029] Referring to FIGS. 5A and 5B, bottom plate 20 is pressed by
a molding machine 4 from an originally smaller diameter to an
extendedly larger diameter, so that bottom plate 20 can be fixed at
a predetermined position in the ring body 10 to form an integrated
module. As shown in FIG. 6, a space 200 is arranged in ring body 10
and bottom plate 20 for accommodating additionally electronic
components.
[0030] On the other side, ring body 10, bottom plate 20 and fins
can be made of different materials such as iron, copper, aluminum
or alloy of previous metals to satisfy requirement of various
circumstances as shown in FIG. 10. By using metal or alloy with
better extensibility, the extrusion process can be performed more
smoothly.
[0031] The junction between bottom plate 20 and ring body 10 can be
noncomplete to retain air gaps. As shown in FIG. 7A, an outer side
of bottom plate 22 can be of a regularly or irregularly lumpy
shape. After being extruded, the extrusive portions 220 can be
tightly connected to an inner wall of the ring body having thin
grooves 14 and taper slots 12 as shown in FIG. 7B. Another
available shape of the bottom plate 20 is shown in FIGS. 8A and 8B.
In this embodiment, bottom plate 24 is of a flower shape with
multiple petal. By these arrangements, gaps 222 or 242 can be
retained after bottom plate 22 or 24 is pressed. The bottom plate
22 or 24 can provide not only to be placed additionally electronic
components but also to enhance air convection through the gaps 222
or 242.
[0032] On the other side, ring body 100 can be rectangular as shown
in FIGS. 9A and 9B. The rectangular ring body 100, which still has
taper slots 12 and thin grooves 14, can match a rectangular bottom
plate 26 with a regularly or irregularly lumpy peripheral. As the
round ring body 10 abovementioned, rectangular bottom plate 26 also
can be pressed to tightly connect the inner wall of the rectangular
ring body 100. Additionally, ring body 10 or 100 also can be
configured in a shape of semicircle, triangle, oval, cone, or
irregularity. They can match corresponding bottom plates to form
various outlines.
[0033] Referring to FIG. 11, besides the abovementioned manner, the
connection between bottom plate 20 and ring body 10 also can adopt
other processing approaches. A diameter of the bottom plate 20 can
be approximately equal to or slightly smaller than an inner
diameter of the ring body 10. The junction between bottom plate 20
and ring body 10 can be soldered or welded together, or infused
thermal grease.
[0034] Referring to FIGS. 12 and 13, which shows other preferred
embodiments according to the invention, cylindrical heat sink 1
includes a ring body 10 and a bottom plate 20 whose diameter is
slightly larger than the inner diameter of the ring body 10. First,
bottom plate 20 is aslant placed on an end of the ring body 10.
Molding machine 4 presses bottom plate 20 to fix at a predetermined
position as shown in FIG. 12. Alternatively, the inner wall of the
ring body 10 can be provided with a step 20a on a top end thereof.
Bottom plate 20 is pressed by the molding machine 4 to insert into
ring body 10 along the step 20a.
[0035] Ring body 10a is not limited to a hollow cylinder, it also
can be configured into a shape shown in FIG. 14. The ring body 10a
has a bell at an end thereof. Bottom plate 20 is pressed by the
molding machine 4 to be gripped at a predetermined position in the
bell. A heat source (not shown), such as an LED lamp, can be placed
on the bottom plate 20.
[0036] Furthermore, as shown in FIGS. 15 and 16, the bottom plate
also can be a heat spreader having a working fluid 280 therein. The
bottom plate 28 is fixed at in the ring body 10 and the heat source
is placed on one side of the bottom plate 28. The heat dissipating
efficiency can be increased by delivering heat of working fluid
280.
[0037] FIG. 17 shows another embodiment of the invention. In this
embodiment, both ring body 50 and fins 60 are integratedly formed
into a single element, and bottom plate 20 is fixed in ring body 50
as shown in FIG. 18. Similarly, bottom plate 20 can be placed by a
heat source and the heat from the heat source can be dissipated by
bottom plate 20, ring body 50 and fins 60.
* * * * *