U.S. patent application number 12/457563 was filed with the patent office on 2010-03-25 for lead frame, and light emitting diode module having the same.
Invention is credited to Meng-Sung Chou, Shih-Chung Huang, Chen-Hsiu Lin.
Application Number | 20100072507 12/457563 |
Document ID | / |
Family ID | 40390858 |
Filed Date | 2010-03-25 |
United States Patent
Application |
20100072507 |
Kind Code |
A1 |
Huang; Shih-Chung ; et
al. |
March 25, 2010 |
Lead frame, and light emitting diode module having the same
Abstract
A light emitting diode (LED) module includes a lead frame having
a number (N) of conducting arms spaced apart from each other, where
N.gtoreq.3, and at least one LED die mounted on one of any two
neighbor conducting arms. Any two neighbor conducting arms are
electrically coupled each other.
Inventors: |
Huang; Shih-Chung; (Taipei,
TW) ; Lin; Chen-Hsiu; (Taipei, TW) ; Chou;
Meng-Sung; (Taipei, TW) |
Correspondence
Address: |
ROSENBERG, KLEIN & LEE
3458 ELLICOTT CENTER DRIVE-SUITE 101
ELLICOTT CITY
MD
21043
US
|
Family ID: |
40390858 |
Appl. No.: |
12/457563 |
Filed: |
June 16, 2009 |
Current U.S.
Class: |
257/99 ; 257/666;
257/E23.031; 257/E33.066 |
Current CPC
Class: |
H01L 2924/01013
20130101; H01L 2924/01006 20130101; H01L 2924/12041 20130101; H01L
2924/01015 20130101; F21Y 2103/10 20160801; H01L 24/97 20130101;
H01L 2924/01082 20130101; H01L 2224/97 20130101; H01L 2924/01029
20130101; H01L 2924/01047 20130101; H01L 2224/48091 20130101; H01L
2924/01033 20130101; H01L 2924/01075 20130101; H01L 2224/85
20130101; H01L 2924/00014 20130101; F21K 9/00 20130101; H01L
2924/01005 20130101; F21Y 2115/10 20160801; H01L 2224/97 20130101;
H01L 33/62 20130101; H01L 2224/48091 20130101; H01L 2924/01078
20130101 |
Class at
Publication: |
257/99 ; 257/666;
257/E23.031; 257/E33.066 |
International
Class: |
H01L 33/00 20060101
H01L033/00; H01L 23/495 20060101 H01L023/495 |
Foreign Application Data
Date |
Code |
Application Number |
Sep 25, 2008 |
CN |
200810198897.8 |
Claims
1. A lead frame adapted for mounting light emitting diode (LED)
dice thereon, said lead frame comprising: a first conducting arm; a
second conducting arm spaced apart from said first conducting arm;
and a third conducting arm spaced apart from said first and second
conducting arms; wherein a first area provided by one of said first
and third conducting arms and a second area provided by one of said
second and third conductive arms are used for mounting LED
dice.
2. The lead frame as claimed in claim 1, wherein said first and
second conducting arms are elongate and parallel, said third
conducting arm being disposed between said first and second
conducting arms.
3. The lead frame as claimed in claim 1, wherein said third
conducting arm comprises at least two third conducting arm units,
any two said third conducting arm units being provided with a third
area for mounting at least one LED die.
4. A light emitting diode (LED) module including the lead frame as
claimed in claim 1 comprising: at least one first LED die mounted
on one of said first and third conducting arms; and at least one
second LED die mounted on one of said second and third conducting
arms; wherein each of said first and second LED dice has two
conductive contacts, and said two conductive contacts of said first
LED die are coupled to said first and third conducting arms, said
two conductive contacts of said second LED die being coupled to
said second and third arms.
5. The LED module as claimed in claim 4, wherein said first
conducting arm has a first projection extending toward said second
conducting arm, and said second conducting arm has a second
projection extending toward said first conducting arm so that said
third conducting arm is disposed between said first and second
projections.
6. The LED module as claimed in claim 4, wherein said third
conducting arm comprises at least two third conducting arm units,
at least one third LED die being mounted on one of any two said
third conducting arms units.
7. The LED module as claimed in claim 6, wherein said first
conducting arm has a first projection extending toward said second
conducting arm, and said second conducting arm has a second
projection extending toward said first conducting arm so that said
third conducting arm units are disposed between said first and
second projections.
8. The LED module as claimed in claim 7, further comprising an
insulating casing for partly covering said lead frame so that
opposite ends of each of said first and second conducting arms are
exposed.
9. The LED module as claimed in claim 8, wherein said insulating
casing is formed with a plurality of openings corresponding
respectively to said LED dice such that said LED dice are exposed
through said openings.
10. The LED module as claimed in claim 9, further comprising
light-transmissive resin filled in said openings in said insulating
casing.
11. The LED module as claimed in claim 10, wherein each of said
openings in said insulating casing is defined by an inner
surrounding light reflecting wall.
12. A light emitting diode (LED) module comprising: a lead frame
having a number (N) of conducting arms spaced apart from each
other, where N.gtoreq.3; and at least one LED die mounted on one of
any two neighbor said conducting arms; wherein any two neighbor
said conducting arms are electrically coupled each other.
13. The LED module as claimed in claim 12, wherein each of said LED
dice has two conductive contacts, and any two neighbor said
conducting arms are electrically coupled each other by said two
conductive contacts of said LED die.
14. The LED module as claimed in claim 12, further comprising an
insulating casing for partly covering said lead frame, wherein said
insulating casing is formed with a plurality of openings
corresponding respectively to said LED dice such that said LED dice
are exposed through said openings.
15. The LED module as claimed in claim 14, further comprising
light-transmissive resin filled in said openings in said insulating
casing.
16. The LED module as claimed in claim 12, wherein two of said
conducting arms have a projection extending toward each other so
that the other (N-2) ones of said conducting arms are disposed
between said two projections.
17. The LED module as claimed in claim 16, further comprising an
insulating casing for partly covering said lead frame, wherein said
insulating casing is formed with a plurality of openings
corresponding respectively to said LED dice such that said LED dice
are exposed through said openings.
18. The LED module as claimed in claim 17, further comprising
light-transmissive resin filled in said openings in said insulating
casing.
Description
CROSS-REFERENCE TO RELATED APPLICATION
[0001] This application claims priority of Chinese Application No.
200810198897.8, filed on Sep. 25, 2008.
BACKGROUND OF THE INVENTION
[0002] 1. Field of the Invention
[0003] The invention relates to a lead frame for light emitting
diode (LED), more particularly to an LED module having a lead
frame.
[0004] 2. Description of the Related Art
[0005] A conventional lighting device includes a plurality of LED
devices surface-mounted on a circuit board through known surface
mounting techniques (SMT). Since the LED devices have a small size,
positioning and processing of the LED devices are difficult during
mounting of the LED devices. As such, the greater the number of the
LED devices, the longer will be processing time. Furthermore, the
circuit board has a fixed mounting surface such that the
conventional lighting device has a fixed lighting area. As a
result, the conventional lighting device cannot conform to
requirements for different lighting areas.
SUMMARY OF THE INVENTION
[0006] Therefore, an object of the present invention is to provide
a light emitting diode module having a lead frame that can be
applied to constitute a lighting surface having a desired size and
that can easily conform to requirements for different lighting
areas.
[0007] According to one aspect of the present invention, a light
emitting diode (LED) module comprises a lead frame, and at least
one LED die.
[0008] The lead frame has a number (N) of conducting arms spaced
apart from each other, where N.gtoreq.3.
[0009] The at least one LED die is mounted on one of any two
neighbor conducting arms.
[0010] Any two neighbor conducting arms are electrically coupled
each other.
[0011] Preferably, each of the LED dies has two conductive
contacts, and any two neighbor conducting arms are electrically
coupled each other by the two conductive contacts of the LED
die.
[0012] Preferably, two of the conducting arms have a projection
extending toward each other so that the other (N-2) ones of the
conducting arms are disposed between the two projections.
BRIEF DESCRIPTION OF THE DRAWINGS
[0013] Other features and advantages of the present invention will
become apparent in the following detailed description of the
preferred embodiments with reference to the accompanying drawings,
of which:
[0014] FIG. 1 is a perspective view showing the first preferred
embodiment of an LED module according to the present invention;
[0015] FIG. 2 is a perspective view showing the first preferred
embodiment without an insulating casing;
[0016] FIG. 3 is a perspective view showing a lead frame of the
first preferred embodiment;
[0017] FIG. 4 is a perspective view showing an array of the lead
frames of the first preferred embodiment;
[0018] FIG. 5 is a perspective view showing an array of the LED
modules of the first preferred embodiment;
[0019] FIGS. 6 to 8 are perspective views illustrating different
combinations of the LED modules of the first preferred embodiment;
and
[0020] FIG. 9 is a perspective view showing the second preferred
embodiment of an LED module according to the present invention.
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS
[0021] Before the present invention is described in greater detail,
it should be noted that like elements are denoted by the same
reference numerals throughout the disclosure.
[0022] Referring to FIGS. 1 to 3, an LED module 1 according to the
present invention is shown to include a lead frame 10, at least one
LED die 30, and an insulating casing 20.
[0023] The lead frame 10 has a number (N) of conducting arms spaced
apart from each other, where N.gtoreq.3. In the first preferred
embodiment, the lead frame 10 has a first conducting arm 11, a
second conducting arm 12 spaced apart from the first conducting arm
11, and a third conducting arm spaced apart from the first and
second conducting arms 11, 12. As shown in FIG. 3, the first and
second conducting arms 11, 12 are elongate and parallel, and the
third conducting arm is disposed between the first and second
conducting arms 11, 12. The third conducting arm further includes
two third conducting arm units 13 that are aligned with and spaced
apart from each other. In addition, the first, second and third
conducting arms 11, 12, 13 are made of a flexible conductive
material, such as copper, platinum, aluminum, iron, etc. It is
noted that the first conducting arm 11 has opposite ends 111, and a
first projection 112 extending toward the second conducting arm 12.
The second conducting arm 12 has opposite ends 121, and a second
projection 122 extending toward the first conducting arm 11 so that
the third conducting arm units 13 are disposed between the first
and second projections 112, 122. In other words, two of said
conducting arms (such as 11 and 12) have a projection extending
toward each other so that the other (N-2) ones of said conducting
arms are disposed between said two projections.
[0024] As shown in FIG. 2, at least one LED die 30 is mounted on
one of any two neighbor conducting arms. That is to say that one of
said first and third conducting arms provided with a first area and
one of said second and third conductive arms provided with a second
area for mounting the LED dice 30. Furthermore, when the third
conducting arm has at least two third conducting arm units 13, any
two said third conducting arm units 13 is provided with a third
area for mounting at least one LED die 30. In this embodiment, one
of the LED dice 30 is mounted on the second projection 122 of the
second conducting arm 12. Two of the LED dice 30 are mounted
respectively on the third conducting arm units 13.
[0025] Each LED die 30 has two conductive contacts (not shown), and
any two neighbor conducting arms are electrically coupled each
other via the two conductive contacts of the LED die (30). Thus,
two conductive contacts of the at least one LED die (30) mounted on
one of the first and third conducting arms are coupled the first
and third conducting arms, and two conductive contacts of the at
least one LED die (30) mounted on one of the second and third
conducting arms are coupled to said second and third arms. In this
embodiment, the conductive contacts of the LED die 30 mounted on
the second projection 122 of the second conducting arm 12 are
coupled respectively to the second conducting arm 12 and one of the
third conducting arm units 13 adjacent to the second conducting arm
12 via known wire bonding techniques by means of two conductive
wires 40. Similarly, the conductive contacts of the LED die 30
mounted on said one of the third conducting arm units 13 are
coupled respectively to said one of the third conducting arm units
13 and the other third conducting arm unit 13 by means of two
conductive wires 40. The conductive contacts of the LED die 30
mounted on the other third conducting arm unit 13 are coupled
respectively to the first conducting arm 11 and the other third
conducting arm unit 13. As a result, the LED dice 30 are coupled in
series in this LED module.
[0026] As shown in FIG. 1, the insulating casing 20 is partly
covers the lead frame 10 so that the opposite ends 111, 121 of the
first and second conducting arms 11, 12 are exposed. The insulating
casing 20 is formed with a plurality openings 201 corresponding
respectively to the LED dice 30 such that the LED dice 30 are
exposed through the openings 201. Each opening 201 is filled with
light-transmissive resin 21 for covering a corresponding one of the
LED dice 30, wherein the light-transmissive resin 21 with
fluorescent powder is preferred. In this embodiment, each opening
201 is defined by an inner surrounding wall 202 surrounding the
corresponding one of the LED dice 30. Preferably, each opening 201
gradually converges toward the corresponding one of the LED dice
30, and each inner surrounding wall 202 is formed with a light
reflecting layer (not shown), such as a metal layer, a fluorescent
layer, a ceramic layer, etc., for light reflection. Furthermore,
the insulating casing 20 is further formed with a plurality of
auxiliary openings 203, each disposed between two adjacent ones of
the openings 201. Due to the presence of the auxiliary openings
203, flexibility of the LED module 1 can be ensured. In addition,
the insulating casing 20 is made of plastic, ceramics, BN, AlN or
SiCAl.
[0027] In this embodiment, the lead frame 10 can be formed by
pressing a material piece. It is noted that, in this stage, the
first and second conducting arms 11, 12 are connected each other
through first connecting sections 15, and the third conducting arm
units 13 are connected respectively to the first and second
conducting arms 11, 12 through second connecting sections 16, as
shown in FIG. 3. Thereafter, subsequent process, such as molding
and die mounting are performed, wherein the first and second
connecting sections 15, 16 can be removed after any process of
molding. Finally, package is performed to obtain the LED module 1
shown in FIG. 1.
[0028] Referring to FIG. 4, an array (2.times.2) of the lead frames
10 can be formed by pressing a material piece 5. It is-noted that,
in this stage, the lead frames 10 are connected to each other, and
the first, second and third conducting arms of each lead frame 10
are connected to each other. Then, an array (2.times.2) of the LED
modules 1 can be produced using the array of the lead frames 10 of
FIG. 4, as shown in FIG. 5. In this case, the LED modules 1 are
still connected to each other. Finally, the array of the LED
modules 1 is divided to obtain separate LED modules 1.
[0029] FIGS. 6 to 8 illustrate different combinations of the LED
modules 1, wherein any two neighbor LED modules are coupled
electrically in parallel. Therefore, the LED module 1 of the
present invention can be applied to constitute a lighting surface
having a desired size. Furthermore, as compared to a conventional
LED module wherein LED device are directly soldered on a circuit
board to decide a light area, the present invention can easily
provide a set of the LED modules 1 having a desired lighting
area.
[0030] FIG. 9 illustrates the second preferred embodiment of an LED
module 1' according to this invention, which is a modification of
the first preferred embodiment. In this embodiment, the insulating
casing 20' is formed with a plurality of recesses 204 disposed
between two adjacent ones of the openings 201 for ensuring
flexibility of the LED module 1'.
[0031] However, in other embodiments, when the third conducting arm
has one third conducting arm unit and the number of the LED dice is
at least equal to 2, one LED die is mounted on one of the first and
second conducting arms, and the other LED die is mounted on the
third conducting arm. Alternatively, when the third conducting arm
unit includes three third conducting arms and the number of the LED
dice is at least equal to 4, one LED die is mounted on one of the
first and second conducting arms, and the other three LED dice are
mounted respectively on the third conducting arms. In short,
preferably, the number of the LED dice is at least equal to the
number of the third conducting arms plus one. Therefore, when the
number of the third conducting arms is increased, the number of the
LED dice connected in series can be increased.
[0032] In sum, the present invention can provide the LED module 1
formed by mounting the LED dice 30 on the lead frame 10. Then, a
desired lighting area can be obtained by arranging a set of the LED
modules 1. Furthermore, since the number of the LED dice 30 is
directly mounted on the lead frame 10, difficulty in positioning
and processing of the LED device during mounting encountered in the
prior art can be avoided and the processing time can be
shorten.
[0033] While the present invention has been described in connection
with what are considered the most practical and preferred
embodiments, it is understood that this invention is not limited to
the disclosed embodiments but is intended to cover various
arrangements included within the spirit and scope of the broadest
interpretation so as to encompass all such modifications and
equivalent arrangements.
* * * * *