U.S. patent application number 12/607858 was filed with the patent office on 2010-03-18 for multi-layer electronic component and method for manufacturing the same, multi-layer piezoelectric element.
This patent application is currently assigned to KYOCERA CORPORATION. Invention is credited to Takaaki HIRA, Takeshi OKAMURA, Susumu ONO, Katsushi SAKAUE, Masaki TERAZONO.
Application Number | 20100066211 12/607858 |
Document ID | / |
Family ID | 34108565 |
Filed Date | 2010-03-18 |
United States Patent
Application |
20100066211 |
Kind Code |
A1 |
ONO; Susumu ; et
al. |
March 18, 2010 |
Multi-Layer Electronic Component and Method for Manufacturing the
Same, Multi-Layer Piezoelectric Element
Abstract
In order to provide a multi-layer electronic component in which
the occurrence of delamination between the ceramic layer and the
internal electrode is restricted and a method for manufacturing the
same, the multi-layer electronic component of the present invention
comprises a stack formed by stacking piezoelectric layers and
internal electrodes one on another alternately and a pair of
external electrodes formed on two opposing side faces of the stack,
wherein the internal electrode consists of a first internal
electrode connected to the external electrode formed on one of the
two side faces and a second internal electrode located between the
first internal electrode and connected to the external electrode
formed on the other one of the two side faces, and wherein the
internal electrodes and the piezoelectric layers are faced in
proximity so that a space between them is 2 .mu.m or less over an
area occupying 50% or more of the active region where the first
internal electrode and the second internal electrode oppose each
other.
Inventors: |
ONO; Susumu; (Kokubu-shi,
JP) ; OKAMURA; Takeshi; (Kokubu-shi, JP) ;
SAKAUE; Katsushi; (Kokubu-shi, JP) ; HIRA;
Takaaki; (Kokubu-shi, JP) ; TERAZONO; Masaki;
(Kokubu-shi, JP) |
Correspondence
Address: |
HOGAN & HARTSON L.L.P.
1999 AVENUE OF THE STARS, SUITE 1400
LOS ANGELES
CA
90067
US
|
Assignee: |
KYOCERA CORPORATION
Kyoto-shi
JP
|
Family ID: |
34108565 |
Appl. No.: |
12/607858 |
Filed: |
October 28, 2009 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
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|
10566044 |
Nov 29, 2006 |
7633210 |
|
|
PCT/JP04/11130 |
Jul 28, 2004 |
|
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12607858 |
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Current U.S.
Class: |
310/358 ;
310/366 |
Current CPC
Class: |
H01L 41/083 20130101;
H01L 41/0471 20130101; H01L 41/273 20130101 |
Class at
Publication: |
310/358 ;
310/366 |
International
Class: |
H01L 41/083 20060101
H01L041/083; H01L 41/04 20060101 H01L041/04 |
Foreign Application Data
Date |
Code |
Application Number |
Jul 28, 2003 |
JP |
2003-202735 |
Dec 24, 2003 |
JP |
2003-426901 |
Jan 19, 2004 |
JP |
2004-010936 |
Claims
1. A multi-layer electronic component comprising; a stack formed by
stacking piezoelectric layers and internal electrodes one on
another alternately and, a pair of external electrodes formed on
two opposing side faces of the stack, wherein the internal
electrode has a first internal electrode connected to the external
electrode formed on one of the two side faces and a second internal
electrode located between the first internal electrode and
connected to the external electrode formed on the other one of the
two side faces, and wherein the internal electrodes and the
piezoelectric layers are faced in proximity so that a space between
them is 2 .mu.m or less over an area occupying 50% or more of the
active region where the first internal electrode and the second
internal electrode oppose each other.
2. The multi-layer electronic component according to claim 1,
wherein a change in a degree of orientation of the crystal grains
that constitute the piezoelectric layer is within 5%.
3. The multi-layer electronic component according to claim 2,
wherein an average grain size of the crystal grains of the
piezoelectric layer is 5 .mu.m or less.
4. The multi-layer electronic component according to claim 3,
wherein thicknesses of the piezoelectric layers are 200 .mu.m or
less.
5. The multi-layer electronic component according to claim 1,
wherein thicknesses of the internal electrodes are 5 .mu.m or
less.
6. The multi-layer electronic component according to claim 1, the
internal electrode including an inorganic component different from
the metal which is main component, wherein an average particle size
of the inorganic component is smaller than an average grain size of
the crystal grains of the piezoelectric layer.
7-25. (canceled)
Description
TECHNICAL FIELD
[0001] The present invention relates to a multi-layer electronic
component and a method for manufacturing the same, and particularly
to a multi-layer piezoelectric element and an injection apparatus
constituted by using the element. More particularly, the present
invention relates to a multi-layer piezoelectric element used for
fuel injection apparatus of automobile engine, liquid ejecting
apparatus of ink jet printer or the like or a drive unit used in
precision positioning device or vibration preventing device for an
optical apparatus, or to a multi-layer piezoelectric element used
as a sensor element mounted in combustion pressure sensor, knocking
sensor, acceleration sensor, load sensor, ultrasonic sensor,
pressure sensor, yaw rate sensor or the like, or used as a circuit
component mounted in piezoelectric gyro, piezoelectric switch,
piezoelectric transformer, piezoelectric breaker or the like.
BACKGROUND ART
[0002] Use of multi-layer piezoelectric element made by alternately
stacking piezoelectric layers and internal electrodes, for example,
has been proposed for constituting a multi-layer electronic
component in order to achieve a large displacement by making use of
electrostrictive effect. The multi-layer piezoelectric element can
be divided into two categories: fired-at-once type and stacked type
where piezoelectric porcelain and internal electrode sheet are
stacked one on another alternately. When the requirement to reduce
the voltage and manufacturing cost are taken into consideration,
the multi-layer piezoelectric element of fired-at-once type is more
advantageous in order to decrease the layer thickness.
[0003] The multi-layer piezoelectric element of fired-at-once type
is made similarly to a multi-layer ceramic capacitor by forming an
active section by stacking green sheets that include a
piezoelectric material and internal electrode sheet that includes
an internal electrode material, forming an inactive section by
stacking a plurality of the ceramic green sheets on the top and
bottom surfaces of the active section, and degreasing and firing
the stack.
[0004] In recent years, such a practice has been becoming common
that a compact multi-layer piezoelectric actuator is operated
continuously over an extended period of time with an electric field
of higher intensity being applied thereto, in order to obtain a
larger displacement under a high pressure.
[0005] In order to meet such a requirement, a multi-layer
electronic component disclosed in Japanese Unexamined Patent
Publication (Kokai) No. 4-299588 has column-like portion formed in
an internal electrode layer from a material, that includes 10 to
20% of piezoelectric ceramic powder of which particle size is
controlled within a range form to 1 times the thickness of the
internal electrode, so as to bridge between ceramic layers, thereby
to prevent delamination of the internal electrode and the ceramic
layer after firing.
[0006] However, in the multi-layer electronic component disclosed
in Japanese Unexamined Patent Publication (Kokai) No. 4-299588,
because of slow rate of cooling down after heat treatment in the
process of connecting the internal electrode and an external
electrode, there is a gap generated between the internal electrode
and the ceramic layer over substantially the entire interface
thereof in an area where column-like portion 51 is not formed, due
to a difference in thermal expansion between the internal electrode
102 and the ceramic layer 101 as shown in FIG. 5, with the gap T
larger than 2 .mu.m in 50% or more of the entire interface. As a
result, there has been such a problem that continuous operation
over a long period in high electric field leads to
delamination.
[0007] In a multi-layer electronic component disclosed in Japanese
Unexamined Patent Publication (Kokai) No. 5-217796, occurrence of
micro cracks that are generated during cutting and may cause
shorting is prevented by subjecting a cut surface (external
electrode forming surface) formed by mechanical processing of the
device to a heat treatment that is applied at a temperature higher
than that of the first firing.
[0008] However, because of a slow rate of cooling down carried out
after the heat treatment applied at a temperature higher than the
firing temperature, there has been peel-off occurring over
substantially the entire interface thereof due to a difference in
thermal expansion between the internal electrode and the ceramic
layer. As a result, there has been such a problem that continuous
operation over a long period in high electric field leads to
delamination.
[0009] FIG. 7 shows a multi-layer piezoelectric element disclosed
in Japanese Unexamined Patent Publication (Kokai) No. 61-133715,
which is constituted from a stack 200 and external electrodes 223
formed on a pair of side faces that oppose each other. While the
stack 200 is formed by stacking piezoelectric material 221 and
internal electrode 222 one on another, the internal electrode 222
is not formed over the entire principal surface of the
piezoelectric material 221, in a so-called partial electrode
structure. The piezoelectric material is stacked such that the
internal electrode 222 is placed in every other layer in a
staggered manner so as to be exposed alternately at the left then
at the right on different side faces of the stack 200. Then the
external electrodes 223 are formed so that the internal electrodes
222 that are exposed to the pair of opposing side faces of the
stack 200 are connected to each other, thereby connecting the
internal electrodes 222 in every other layer.
[0010] The multi-layer piezoelectric element of the prior art may
be manufactured by printing an internal electrode paste in the
pattern of a predetermined electrode structure on a ceramic green
sheet that includes the material of the piezoelectric material 221,
stacking a plurality of the green sheets coated with the internal
electrode paste so as to form a multi-layer green compact and
firing the green compact thereby to make the stack 200. Then the
external electrodes 23 are formed by firing on a pair of side faces
of the stack 200, thereby to make the multi-layer piezoelectric
element.
[0011] The internal electrode 222 is formed from an alloy of silver
and palladium and, in order to fire the piezoelectric material 221
and the internal electrode 222 at the same time, composition of
metals included in the internal electrode 222 was set to 70% by
weight of silver and 30% by weight of palladium (refer to, for
example, Japanese Unexamined Utility Model Publication (Kokai) No.
1-130568).
[0012] The internal electrode 222 is made of metal composition that
includes silver-palladium alloy instead of pure silver because,
when a voltage is applied between the pair of opposing internal
electrodes 222 that are made of silver without palladium content,
the so-called silver migration occurs in which silver atoms of the
pair of internal electrodes 222 propagate along the device surface
from the positive electrode to the negative electrode. Silver
migration occurs conspicuously in an atmosphere of high temperature
and high humidity.
[0013] In case a multi-layer piezoelectric element of the prior art
is used as a piezoelectric actuator, it may be provided with lead
wires (not shown) soldered onto the external electrodes 223 and
operated by applying a predetermined voltage between the external
electrodes 223. In recent years, since it is required to make a
compact multi-layer piezoelectric element capable of achieving a
large amount of displacement under a high pressure, continuous
operation is carried out over a long period with a higher electric
field applied.
[0014] Such a multi-layer piezoelectric element of fired-at-once
type as described above is required to equalize the temperature at
which the internal electrode 222 is sintered and the temperature at
which the piezoelectric material 221 is sintered, and compositions
of the materials used to form the internal electrode 222 and the
piezoelectric material 221 have been studied. However, since this
allows residual stress caused by the difference in thermal
expansion between the internal electrode and the ceramic layer to
be concentration in the crystal grains of the piezoelectric
material 221 that faces the internal electrode 222, there has been
such a problem that delamination occurs in which the internal
electrode 222 peels off the piezoelectric material 221 during
operation when the device is used as an actuator.
[0015] Particularly when those among the crystal grains of the
piezoelectric material 221 that face the internal electrode 222 are
small, such troubles occur as the value of dielectric constant
becomes smaller than that of larger grains of the same composition
due to the size effect, and the amount of piezoelectric
displacement becomes smaller. Even when average crystal grain size
of the crystal grains of the piezoelectric material 221 is made
larger, if there are grains having small amount of piezoelectric
displacement among the crystal grains of the piezoelectric material
221 that faces the internal electrode 222, smaller amount of
displacement than that of the crystal grains of the piezoelectric
material 221 during operation causes the residual stress generated
due to the difference in thermal expansion between the internal
electrode 222 and the ceramic layer 221 to be concentrated at one
point thus making an initiating point for cracks and
delamination.
[0016] There has also been such a problem that the mount of
displacement varies due to the occurrence of delamination. When the
rate of occurrence of delamination becomes higher, temperature of
the device increases. When the heat generated by the device exceeds
the heat that can be removed by dissipation, thermal excursion
occurs, resulting in breakage and sudden failure to achieve the
required amount of displacement. Therefore, there has been a demand
for internal electrodes having lower specific resistance in order
to suppress the device temperature from rising.
[0017] However, specific resistance of the silver-palladium alloy
that has been used in the prior art is higher than that of a
single-element metal such as silver or palladium depending on the
composition of the alloy. For example, silver-palladium alloy
including 70% by weight of silver and 30% by weight of palladium
has specific resistance 1.5 times as high as that of palladium.
Moreover, lower sintering density of the internal electrode 222
results in even higher resistance, thus posing a limitation to
decreasing the specific resistance of the internal electrode
222.
[0018] When the conventional multi-layer piezoelectric element is
used as an actuator for driving a fuel injection apparatus or the
like as described above, there is a problem that the amount of
displacement gradually changes resulting in malfunction of the
apparatus. Therefore, it has been called for to suppress the amount
of displacement from changing and improve durability during
continuous operation over a long period.
[0019] For a multi-layer piezoelectric element, it is a common
practice to carry out polarization treatment by applying a voltage
of about 1 kV (refer to, for example, Japanese Unexamined Patent
Publication (Kokai) No 2002-293625). Specifically, in the
polarization treatment disclosed in Japanese Unexamined Patent
Publication (Kokai) No. 2002-293625, the multi-layer piezoelectric
element having the external electrodes formed thereon is (1)
immersed in a heated oil bath, (2) subjected to a voltage applied
thereto, and (3) cooled down after decreasing the voltage.
[0020] However, in the polarization treatment disclosed in Japanese
Unexamined Patent Publication (Kokai) No. 2002-293625, there is a
problem that the crystal grains that constitute the piezoelectric
material cannot undergo fully saturated polarization and, for
example, particularly the amount of displacement among the
piezoelectric characteristics decreases in an operation test
conducted over a long period of time. This is because the degree of
orientation of the crystal grains of the piezoelectric material
changes more significantly through operation.
DISCLOSURE OF THE INVENTION
[0021] The present invention has been made to solve the problems
described above, and has an object of providing a multi-layer
electronic component in which the occurrence of delamination
between the ceramic layer and the internal electrode is restricted
and a method for manufacturing the same.
[0022] Particularly, it is an object of the present invention is to
provide a multi-layer piezoelectric element that has excellent
durability in which delamination is restricted from occurring
during operation and the amount of displacement does not vary even
when the piezoelectric actuator is subjected to continuous
operation over a long period under a high voltage and a high
pressure, and an injection apparatus using the same.
[0023] Another object of the present invention is to provide a
multi-layer piezoelectric element wherein crystal grains of the
piezoelectric material experience less change in the degree of
orientation through operation so that the piezoelectric
characteristics undergo less degradation in an operation test over
a long period of time and a method for manufacturing the same, and
an injection apparatus using the same.
[0024] In order to achieve the objects described above, the
multi-layer electronic component of the present invention comprises
a stack formed by stacking piezoelectric layers and internal
electrodes one on another alternately and a pair of external
electrodes formed on two opposing side faces of the stack, wherein
the internal electrode consists of a first internal electrode
connected to the external electrode formed on one of the two side
faces and a second internal electrode located between the first
internal electrode and connected to the external electrode formed
on the other one of the two side faces, and wherein the internal
electrodes and the piezoelectric layers are faced in proximity so
that a space between them is 2 .mu.m or less over an area occupying
50% or more of the active region where the first internal electrode
and the second internal electrode oppose each other.
[0025] The region where the first internal electrode and the second
internal electrode oppose each other is a portion which performs
the function of the multi-layer electronic component, and will be
referred to as an active region or active section in this
specification. One of the first internal electrode and the second
internal electrode is a positive electrode and the other is a
negative electrode.
[0026] In the multi-layer electronic component of the present
invention, it is preferable that change in the degree of
orientation of the crystal grains that constitute the piezoelectric
layer is limited to within 5% after repeated operations.
[0027] By restricting the change in the degree of orientation of
the crystal grains that constitute the piezoelectric layer through
operation to not more than 5%, degradation in piezoelectric
characteristics, particularly the amount of displacement, can be
made small after operation over a long period of time, thus
ensuring high reliability.
[0028] In case the ceramic layer is formed from the piezoelectric
material, the crystal grains of the piezoelectric layer preferably
have average grain size of 2.5 .mu.m or less. The crystal grains
that constitute the piezoelectric layer having average grain size
of 2.5 .mu.m or less can have the degree of orientation of the
crystal grains increased by the polarization treatment, and the
change in polarizability can be further decreased.
[0029] The multi-layer piezoelectric element of the present
invention wherein the ceramic layer is formed from a piezoelectric
material experiences less deterioration after repetitive operations
of more than 10.sup.9 cycles under such conditions as, for example,
load of 150 kgf, temperature of 150.degree. C. and frequency of 50
Hz, and has sufficient performance applicable to an injection
apparatus that requires high reliability in continuous
operation.
[0030] In case the ceramic layer is formed from the piezoelectric
material, thickness of the piezoelectric layer is preferably 200
.mu.m or less, which enables it to apply sufficiently high electric
field in the direction of thickness, thus allowing it to carry out
saturation polarization.
[0031] Thickness of the internal electrode is preferably 5 .mu.m or
less in order to achieve higher conductivity in the direction of
thickness of the internal electrode, which enables it to further
improve the degree of orientation and polarizability of the crystal
grains of the piezoelectric material.
[0032] The internal electrode may also include an inorganic
component other than the metal included as the major component.
[0033] When an inorganic component is included in the internal
electrode of the multi-layer piezoelectric element, the inorganic
component is preferably the same as that of the piezoelectric
layer, and average particle size of the inorganic component is
preferably smaller than that of the piezoelectric layer.
[0034] According to the present invention, by including the same
inorganic component as that of the piezoelectric particles that
constitute the piezoelectric layer in the internal electrode, and
making the average particle size of the inorganic component
included in the internal electrode smaller than that of the
piezoelectric layer, it is made possible to increase the effective
area of the internal electrode as the particles of the
piezoelectric material that make contact with the internal
electrode become smaller, while suppressing the rigidity of the
internal electrode from increasing due to the addition of the
inorganic component, thereby increasing the bonding strength with
the piezoelectric layer and allowing it to apply electric field of
higher intensity.
[0035] The method of manufacturing the multi-layer electronic
component of the present invention comprises a process of forming a
column-like stack by stacking a plurality of ceramic layers and a
plurality of internal electrodes alternately one on another, a
process of trimming the column-like stack to desired dimensions, a
process of applying heat treatment to the column-like stack, a
process of applying an electrically conductive paste on the side
face of the column-like stack, a process of applying heat treatment
to the electrically conductive paste and form a pair of external
electrodes that are connected to the internal electrode alternately
in every other layer, and a process of applying a voltage to the
external electrodes and carrying out polarization treatment so that
the change in the ratio of lattice constants c/a becomes 0.5% or
less.
[0036] In the method of manufacturing the multi-layer electronic
component of the present invention, it is preferable that the rate
of cooling down from the maximum temperature of heat treatment is
set to t/3 (.degree. C./minute) or less in the process of applying
heat treatment to the electrically conductive paste, where t
(.degree. C.) is Curie temperature of the ceramic layer.
[0037] In the method of manufacturing the multi-layer electronic
component of the present invention, it is also preferable that the
rate of cooling down in a temperature range from 1.2t to 0.8t in
the heat treatment is set to t/3 (.degree. C./minute) or less in
the process of applying heat treatment to the electrically
conductive paste.
[0038] According to the present invention, as described above, the
multi-layer electronic component of high reliability where
delamination is suppressed from occurring can be provided.
[0039] A second multi-layer piezoelectric element of the present
invention comprises a stack formed by stacking piezoelectric layers
and internal electrodes alternately, wherein average crystal grain
size of a portion of the piezoelectric material that makes contact
with the internal electrode is larger than the average crystal
grain size of the other portion.
[0040] A third multi-layer piezoelectric element of the present
invention comprises a stack formed by stacking piezoelectric layers
and internal electrodes alternately, wherein minimum crystal grain
size of a portion of the piezoelectric material that makes contact
with the internal electrode is larger than the minimum crystal
grain size of other portion.
[0041] An injection apparatus according to the present invention
comprises a container that has an injection hole leading to a fuel
passage, a piston that is housed in the container for opening and
closing the communication between the fuel passage and the
injection hole, and the multi-layer piezoelectric element that is
housed in the container and drives the piston, wherein the
multi-layer piezoelectric element comprises a stack formed by
stacking the piezoelectric layers and the internal electrodes
alternately, while the average crystal grain size of a portion of
the piezoelectric material that makes contact with the internal
electrode is larger than the average crystal grain size of the
other portion.
[0042] In the second and third multi-layer piezoelectric elements
of the present invention constituted as described above, by making
the average crystal grain size or the minimum crystal grain size of
a portion of the piezoelectric material that makes contact with the
internal electrode is made larger than the average crystal grain
size or the minimum crystal grain size of the other portion, it is
made possible to distribute the residual stress cased by difference
in thermal expansion between the internal electrode and the
piezoelectric layer uniformly throughout the piezoelectric
particles in the interface of electrodes. This enables it to
increase the bonding strength of the internal electrode and the
piezoelectric material in the interface thereof, thereby enabling
it to suppress delamination from occurring and provide a
piezoelectric actuator of excellent durability and high reliability
where the amount of displacement is suppressed from decreasing
during operation.
[0043] The multi-layer piezoelectric element of the present
invention, since the amount of displacement does not substantially
change in continuous operation, enables it to constitute the
injection apparatus of excellent durability and high reliability
that includes the multi-layer piezoelectric element and is capable
of operating without failure.
BRIEF DESCRIPTION OF THE DRAWINGS
[0044] FIG. 1 is a side view of a multi-layer electronic component
according to the first embodiment of the present invention.
[0045] FIG. 2 is a plan view of a ceramic sheet that constitutes
the multi-layer electronic component of the first embodiment.
[0046] FIG. 3 is an exploded perspective view of a multi-layer
green compact that constitutes the multi-layer electronic component
of the first embodiment.
[0047] FIG. 4 is a sectional view of a stacked structure that
constitutes the multi-layer electronic component of the first
embodiment.
[0048] FIG. 5 shows defects formed between a ceramic layer and an
internal electrode of a multi-layer electronic component of the
prior art.
[0049] FIG. 6A is a perspective view of the constitution of a
multi-layer piezoelectric element according to the second
embodiment of the present invention.
[0050] FIG. 6B is an exploded perspective view of stacked structure
of piezoelectric layer and internal electrode according to the
second embodiment.
[0051] FIG. 7 is a perspective view of a multi-layer capacitor of
the prior art.
[0052] FIG. 8 is a sectional view showing the constitution of an
injection apparatus of the present invention.
[0053] FIG. 9 is a partial sectional view of a multi-layer
piezoelectric element according to the third embodiment of the
present invention.
[0054] FIG. 10A through 10C show processes for manufacturing the
multi-layer piezoelectric element of the third embodiment.
[0055] FIG. 11 is a flow chart showing the sequence of polarization
treatment processes according to the third embodiment.
BEST MODE FOR CARRYING OUT THE INVENTION
First Embodiment
[0056] FIG. 1 is a longitudinal sectional view showing the
constitution of a multi-layer electronic component (multi-layer
piezoelectric actuator) according to the first embodiment of the
present invention.
[0057] The multi-layer electronic component of the first embodiment
has a column-like stack 3 of a rectangular prism shape comprising
an active section 8 formed by stacking a plurality of ceramic
layers 1 and a plurality of internal electrodes 2 alternately one
on another, and inactive sections 9 provided on both ends of the
active section 8 in the direction of stacking, as shown in FIG.
1.
[0058] The ceramic layer 1 is made of a piezoelectric ceramic
material of which main component is lead zirconate titanate Pb(Zr,
Ti)O.sub.3 (hereinafter abbreviated as PZT) or barium titanate
BaTiO.sub.3, for example, but is not limited to this composition
and may be made of any ceramic material that has piezoelectric
property. The piezoelectric material preferably has a high value of
piezoelectric strain constant d33.
[0059] The thickness of the ceramic layer 1, namely the distance
between the internal electrodes 2, is preferably in a range from
0.05 to 0.25 mm in order to make the construction smaller and apply
high electric field. This is because, while a larger displacement
of the multi-layer piezoelectric element under a given voltage is
achieved by stacking a larger number of piezoelectric layers, thick
ceramic layers 1 stacked in the active section 8 make it impossible
to make an actuator of smaller size and lower profile when the
number of stacked layers is increased, but insulation breakdown may
be caused when the ceramic layers 1 stacked in the active section 8
are too thin.
[0060] The internal electrodes 2 are formed in a rectangular shape
a little smaller than the ceramic layer, and are disposed so that
one side thereof is exposed on either one of opposite side faces
(external electrode forming surface) of the column-like stack every
other layer as shown in FIG. 1, while the external electrode 4 is
connected on the opposing side faces of the column-like stack 3
whereon one side of the internal electrode 2 is exposed. As a
result, the internal electrodes 2 are electrically connected to the
external electrodes 4 alternately on every other layer.
[0061] In the multi-layer electronic component of the first
embodiment, gap between the internal electrode 2 and the ceramic
layer 1 of 2 .mu.m or less is controlled over an area of 50% or
more of the interface between the internal electrode 2 and the
ceramic layer 1. In this way it is important in the multi-layer
electronic component of the first embodiment, that gap between the
internal electrode 2 and the ceramic layer 1 is controlled to 2
.mu.m or less over an area of 50% or more of the effectively active
region. This enables it to suppress the occurrence of delamination,
cracks or the like, thereby to achieve high reliability.
[0062] When the gap between the internal electrode 2 and the
ceramic layer 1 is controlled to 2 .mu.m or less over an area of
less than 50% of the effectively active region, cracks may occur in
the gap when operated with an electric field of high intensity,
thus resulting in low reliability. In order to reduce crack
initiating points and improve the reliability, the gap between the
internal electrode 2 and the ceramic layer 1 is more preferably
controlled to 2 .mu.m or less over an area of 70% or more of the
effectively active region.
[0063] According to the method of manufacturing the multi-layer
electronic component of the present invention, a slurry is prepared
by mixing a calcinated powder of piezoelectric ceramics (ceramic
powder) such as lead zirconate titanate Pb(Zr, Ti)O.sub.3, an
organic binder made of an organic polymer such as acrylic resin or
butyral resin and a plasticizer, and the slurry is formed into a
ceramic green sheet 21 having thickness of 50 to 250 .mu.m as shown
in FIG. 2 by, for example, slip casting method.
[0064] According to the present invention, average grain size of
calcinated ceramic powder that constitutes the ceramic layer 2
(included in the ceramic green sheet 21) is preferably in a range
from 0.3 to 0.9 .mu.m. By controlling the average grain size of the
calcinated ceramic powder to 0.3 .mu.m or larger, it is made
possible to reduce the quantity of the organic binder required to
prevent drying crack from occurring when making the ceramic green
sheet 21.
[0065] By controlling the average grain size of calcinated ceramic
powder to 0.9 .mu.m or smaller, it is made possible to have the
sintering process progress sufficiently and increase the strength
of porcelain, thereby to suppress the occurrence of cracks due to
stress generated by the electric field, for example, in the
multi-layer piezoelectric element.
[0066] Thickness of the ceramic green sheet 21 is preferably 90
.mu.m or larger, more preferably 100 .mu.m or larger, in order to
ensure a high dielectric breakdown voltage of the ceramic layer 1
after firing. In order to prevent cracks from occurring in the
ceramic green sheet 21 during handling, it is preferable to use
butyral resin that has high tensile strength for the organic
binder.
[0067] Then after punching through the ceramic green sheet 21 into
predetermined dimensions, an electrically conductive paste, that
includes silver-palladium alloy which makes the internal electrode
2 and a solvent, is applied to one side of the ceramic green sheet
21 to a thickness of 1 to 10 .mu.m as shown in FIG. 2 by screen
printing process, and is dried to form the internal conductor
pattern 22.
[0068] The internal conductor pattern 22 has a shape of rectangle
having an area a little smaller than the ceramic green sheet 21 of
rectangular shape. One side of the internal conductor pattern 22 is
aligned with one side of the ceramic green sheet 21, while the
other side is not.
[0069] Then as shown in FIG. 3, a predetermined number of the
ceramic green sheets 21 whereon the internal conductor pattern 22
is formed are stacked so that one side of the internal conductor
pattern 22 is exposed on one side of the multi-layer green compact
23 in one layer and the opposite side of the internal conductor
pattern 22 is exposed on the opposite side of the multi-layer green
compact 23 in the next layer, so as to form an active section
multi-layer green compact 23a. Then an inactive section green
compact 23b formed by stacking a plurality of ceramic green sheets
21 without electrically conductive paste printed thereon are
stacked on the top and bottom surfaces of the active section
multi-layer green compact 23a, thereby making the multi-layer green
compact 23.
[0070] The multi-layer green compact 23 may also be made by, after
making the lower inactive section multi-layer green compact 23b by
stacking the plurality of ceramic green sheets 21 without
electrically conductive paste printed thereon, stacking a plurality
of ceramic green sheets 21 having the internal conductor pattern 22
formed thereon on the lower inactive section multi-layer green
compact 23b to form the active section multi-layer green compact
23a, and stacking a plurality of ceramic green sheets 21 without
electrically conductive paste printed thereon on the active section
multi-layer green compact 23a thereby to form the upper inactive
section multi-layer green compact 23b.
[0071] There is no limitation to the method of manufacturing the
multi-layer green compact 23, as long as the multi-layer green
compact 23 comprising the ceramic green sheets 21 and the internal
conductor pattern 22 being stacked one on another is obtained.
[0072] The multi-layer green compact 23 is pressurized while being
heated so as to integrate the multi-layer green compact 23 and
obtain a column-like multi-layer stack.
[0073] Pressure is preferably applied by isostatic pressing in
order to ensure high precision of stacking, with the pressure
preferably in a range from 20 to 120 MPa.
[0074] The column-like multi-layer stack that has been integrated
is cut into a predetermined size and degreased in atmosphere at a
temperature from 400 to 800.degree. C. for a period of 5 to 40
hours. Then the column-like stack is fired at a temperature from
900 to 1200.degree. C. for a period of 2 to 5 hours, so as to
obtain the column-like stack 3 as shown in FIG. 4. The column-like
stack 33 has the active section formed by stacking the ceramic
layers (piezoelectric material layers) 1 and the internal
electrodes 2 alternately, with one side of the internal electrode 2
being exposed alternately on the opposing side faces of the
stack.
[0075] A DC voltage of 0.1 to 3 kV/mm is applied between a pair of
external electrodes 4 so as to apply polarization treatment to the
column-like stack, thereby to complete the multi-layer electronic
component as the final product. It is important that the change in
ratio of lattice constants c/a after the polarization is not larger
than 0.5%. This is because the internal electrode 2 may be peeled
off the ceramic layer 1 due to the stress generated during the
polarization treatment when the change in the ratio c/a is larger
than 0.5%. According to the present invention, in order to prevent
peel-off due to the stress generated during the polarization, the
change in the ratio c/a is more preferably less than 0.2%. The
ratio of lattice constants c/a is determined by calculating the
lattice constant a from a peak of plane (200) from XRD diffraction
pattern and calculating the lattice constant c similarly from a
peak of plane (002).
[0076] The manufacturing method described above enables it to
control the gap between the internal electrode 2 and the ceramic
layer 1 to 2 .mu.m or less. When the gap between the internal
electrode 2 and the ceramic layer 1 is larger than 2 .mu.m, such
troubles may occur as cracks occur in the gap when a high voltage
is applied or during continuous operation over a long period, thus
resulting in low reliability. While the constitution of the present
invention is capable of preventing peel-off from occurring in the
multi-layer electronic component, a gap larger than 2 .mu.m may be
generated in part of the interface due to mixing of foreign matter
in the process. However, satisfactory reliability can be maintained
if the gap is not larger than 2 .mu.m over 50% or more of the
active section.
[0077] Then a silver-palladium alloy that includes silver as a main
component is applied to the side face of the column-like stack 3
where the end of the internal electrode 2 is exposed as shown in
FIG. 1, and such a heat treatment is carried out as the temperature
is lowered from the maximum temperature of heat treatment in a
range from 500 to 900.degree. C. at a rate of t/3 (.degree.
C./minute) or less where t (.degree. C.) is Curie temperature of
the ceramic layer 1, thereby to form the external electrode 4. Thus
the internal electrodes 2 are connected to the external electrodes
4 in a staggered manner in every other layer.
[0078] A cooling rate faster than t/3 (.degree. C./minute) may lead
to stress generated in the interface between the internal electrode
2 and the ceramic layer 1 due to the difference in thermal
expansion between the two materials, thus resulting in delamination
or cracks.
[0079] The cooling rate in a temperature range from 1.2t to 0.8t
(.degree. C.) is preferably t/3 (.degree. C./minute) or lower. The
ceramic layer 1 is formed in cubic crystal system when the
temperature is higher than the Curie temperature, and is formed in
rhombohedral crystal system or tetragonal crystal system when the
temperature is lower than the Curie temperature, and therefore
delamination is more likely to occur due to the internal stress as
the crystal layer changes when the cooling rate is made faster over
the temperature range in which the crystal layer changes.
[0080] The gap between the internal electrode 2 and the ceramic
layer 1 can be checked by inspecting a fracture surface by
ultrasonic flaw detection or SEM observation. It is preferable to
employ the ultrasonic flaw detection technique because it enables
it to determine the distribution of gaps throughout the multi-layer
electronic component easily without destructing it, although size
of the gap can also be determined by SEM observation of a fracture
surface. In case the fracture surface that is polished to mirror
finish is observed with SEM, the internal electrode 2 extends into
a gap due to the ductility of the internal electrode 2, and
therefore it is important to observe a fracture surface. Based on
the observation of a surface perpendicular to the stacking
direction by ultrasonic flaw detection, ratio of peel off is
determined from the ratio of the area where peel-off of 2 .mu.m or
larger to the area where there is no such large peel-off.
[0081] When ultrasonic flaw detection is employed, cross sections
of a plurality of layers may be observed at the same time.
Sensitivity of the ultrasonic flaw detection technique generally
becomes lower when the depth of focus is increased. Therefore,
samples that are constituted from a large number of stacked layers
and have height of 5 mm or more are preferably divided by cutting
to a height of 2 to 5 mm in a direction perpendicular to the
stacking direction, so that each of the divided portions is
subjected to ultrasonic flaw detection to determine the peel-off
ratio. It suffices that portions, where the gap between the
internal electrode 2 and the ceramic layer 1 is not larger than 2
.mu.m, occupy 50% or more of the effectively active region in
portions where fracture can easily initiate due to stress generated
by operation, stress generated by electric field and stress
generated by buckling, particularly in the vicinity of the top and
bottom portions in the stacking direction and at least in a portion
near the center.
[0082] In the form described above, one column-like stack is made
from one multi-layer green compact 23 as shown in FIG. 3. However,
it needs not to say that the present invention can be applied to
the manufacture of the multi-layer electronic component in which a
plurality of internal electrode patterns are formed on one ceramic
green sheet 21, a plurality of the ceramic green sheets 21 are
stacked one on another so as to make the multi-layer green compact
from which a number of column-like stacks can be made, the stacked
green compact is cut into pieces of predetermined dimensions and
make a number of the column-like stacks shown in FIG. 2 at the same
time.
[0083] For the multi-layer electronic component of the present
invention, proportion of cross section of the stacked layer
occupied by the internal electrode 2 is preferably as high as
possible in order to prevent the internal electrode 2 and the
ceramic layer 1 from peeling off in the interface thereof.
Proportion of the internal electrode 2 is preferably 70% or more,
in particular.
[0084] The method of manufacturing the multi-layer electronic
component of the present invention is preferably used in the
manufacture of multi-layer electronic component such as multi-layer
piezoelectric transformer, multi-layer capacitor or multi-layer
piezoelectric actuator. The method of manufacturing the multi-layer
electronic component of the present invention is particularly
preferable for the manufacture of multi-layer piezoelectric
actuator formed from piezoelectric ceramics that is continuously
operated by applying a high electric field.
Second Embodiment
[0085] The multi-layer piezoelectric element according to the
second embodiment of the present invention will be described in
detail below.
[0086] FIG. 6A is a perspective view showing the structure of a
multi-layer piezoelectric element according to the second
embodiment. FIG. 6B is an exploded perspective view of the inner
structure of the multi-layer piezoelectric element according to the
second embodiment, showing the stacked structure of the
piezoelectric layers and the internal electrodes.
[0087] In the multi-layer piezoelectric element according to the
second embodiment, as shown in FIG. 6A, B, external electrodes 15
are connected so as to establish electrical continuity with the
ends of the internal electrodes 12 that are exposed in every other
layer on a pair of opposing side faces of the stack 13 that is
formed by alternately stacking the piezoelectric layers 11 and the
internal electrodes 12 one on another. Layers on both ends in the
stacking direction of the stack 13 are the layers formed by
stacking a plurality of piezoelectric layers 11 without interposing
any electrode layer therein, and are called inactive layers 14
since they are not subjected to voltage and do not expand or shrink
during operation. When the multi-layer piezoelectric element
according to the second embodiment constituted as described above
is used as a multi-layer piezoelectric actuator, lead wires may be
soldered to the external electrodes 15 and connected to an external
voltage source.
[0088] In an active region in which the internal electrodes 12 made
of a metallic material such as silver-palladium alloy are disposed
between the piezoelectric layers 11, a predetermined voltage is
applied to the piezoelectric layers 11 via the internal electrodes
12, so that the piezoelectric layers 11 undergo displacement
through reverse piezoelectric effect.
[0089] The inactive layer 14, in contrast, is constituted from a
plurality of piezoelectric layers 11 without internal electrode 12
provided therein, and therefore does not undergo displacement even
when a voltage is applied.
[0090] The multi-layer piezoelectric element of the second
embodiment is characterized in that the average crystal grain size
of the piezoelectric layer 11 that faces the internal electrode 12
is larger than the average crystal grain size of the other
portions, so that the characteristic effects to be described later
can be achieved. The region of the piezoelectric layer 11 that
faces the internal electrode 12 herein refers to a region in the
vicinity of the interface that is in contact with the internal
electrode 12, and includes the region located near the periphery of
the internal electrode 12.
[0091] In the second embodiment, the average crystal grain size of
the piezoelectric layer 11 that faces the internal electrode 12 is
preferably in a range from 1 to 8 .mu.m.
[0092] When the average crystal grain size is smaller than 1 .mu.m,
the amount of piezoelectric displacement decreases due to the size
effect, and bending strength or the so-called porcelain strength
decreases. When minimum crystal grain size is larger than 8 .mu.m,
fracture mode changes from intergranular fracture to intragranular
fracture, thus resulting in smaller bending strength or the
so-called porcelain strength.
[0093] Also in the second embodiment, the minimum crystal grain
size of the piezoelectric layer 11 that faces the internal
electrode 12 may be made larger than the minimum crystal grain size
of the other portions.
[0094] Reference is made here to the minimum crystal grain size
because residual stress caused by the difference in thermal
expansion between the internal electrode 12 and the ceramic layer
11 is concentrated in small crystal grains among the crystal grains
located in the interface of the internal electrode 12.
[0095] According to the second embodiment, the minimum crystal
grain size in the region that makes contact with the internal
electrode 12 is preferably in a range from 0.5 to 5 .mu.m. When the
minimum crystal grain size is less than 0.5 .mu.m, the amount of
piezoelectric displacement becomes smaller due to the size effect
and bending strength or the so-called porcelain strength becomes
smaller. When the minimum crystal grain size is larger than 5
.mu.m, fracture mode changes from intergranular fracture to
intragranular fracture, thus resulting in smaller bending strength
or the so-called porcelain strength.
[0096] The average crystal grain size and the minimum crystal grain
size can be measured by means of SEM (scanning electron
microscope). Specifically, the average crystal grain size of the
piezoelectric layer 11 that faces the internal electrode 12 can be
measured by drawing a straight line over the image of the crystal
grains of the piezoelectric layer 11 that faces the internal
electrode 12 captured by the SEM, measuring the length of line
segment enclosed within the boundary of each of randomly selected
50 crystal grains and averaging the measurements. The present
invention defines the average crystal grain size in the other
portion of the piezoelectric layer 11 that faces the internal
electrode 12. The average crystal grain size of the other portion
is also determined similarly to the above except for drawing a
straight line at an arbitrary position in a region other than the
piezoelectric layer 11 that faces the internal electrode 12.
[0097] The minimum crystal grain size is defined as the smallest
grain size among the crystal grains shown in the same area of the
image where the average crystal grain size was measured at the two
positions described above (the region of the piezoelectric layer
that faces the internal electrode 12 and other region).
[0098] In the second embodiment, the average crystal grain size of
the piezoelectric layer 11 that faces the internal electrode 12 is
made larger than the average crystal grain size of the other
portions by adjusting the composition of the material such that
sintering starting temperature at which sintering of the internal
electrode 12 begins is lower than sintering starting temperature at
which sintering of the piezoelectric material 11 begins in the
manufacturing process.
[0099] Specifically, the electrode pattern is printed with a paste
that includes a powder of the metal that constitutes the internal
electrode 12 and oxide of that metal as well, so that a liquid
phase can be formed in the interface between the piezoelectric
layer 11 and the internal electrode 12 at a temperature lower than
the sintering starting temperature at which sintering of the
piezoelectric material 11 begins.
[0100] By controlling the sintering starting temperature at which
sintering of the internal electrode 12 begins lower than the
sintering starting temperature at which sintering of the
piezoelectric material 11 begins; it is made possible that liquid
phase is formed first in the internal electrode 12 so that
sintering of the internal electrode 12 proceeds.
[0101] In addition, the piezoelectric layer 11 and the internal
electrode 12 are caused to be sintered in liquid phase as the
liquid phase is created when the internal electrode 12 is
sintered.
[0102] That is, liquid phase is intentionally foisted in the
interface of the electrode and sintering of the piezoelectric
porcelain proceeds in a portion that makes contact with the
internal electrode 12 so that portions that have smaller grain size
disappear from the interface of the electrode with the progress of
sintering, thus resulting in growing grain size in the portion that
makes contact with the internal electrode 12 and increasing
strength of bonding of the interface of the electrode.
[0103] According to the manufacturing method described above, the
minimum crystal grain size of piezoelectric layer 11 that faces the
internal electrode 12 can also be made larger than that of the
other portions. However, in order to make the minimum crystal grain
size of the piezoelectric layer 11 that faces the internal
electrode 12 larger, it is necessary to diffuse the liquid phase,
that is formed when sintering the electrode, into the piezoelectric
material 11. For this reason, temperature is raised to that of
sintering the piezoelectric material 11 after holding the firing
temperature at the liquid phase forming temperature.
[0104] According to the second embodiment, metal composition in the
internal electrode preferably includes group VIII metal and/or
group Ib metal as the main component. Such a metal composition has
high heat resistance and therefore allows it to sinter the
piezoelectric material 11 that has a high sintering temperature and
the internal electrode 12 at the same time.
[0105] When the metal composition in the internal electrode 12
includes group VIII metal and/or group Ib metal as the main
component, proportion M1 (% by weight) of group VIII metal and
proportion M2 of group Ib metal preferably satisfy the relations
0<M1.ltoreq.15, 85.ltoreq.M2<100 and M1+M2=100.
[0106] This is because a proportion of group VIII metal higher than
15% by weight leads to a high specific resistance of the internal
electrode 12, resulting in heat generated by the internal
electrodes 12 when the multi-layer piezoelectric element is
operated continuously. In order to prevent group Ib metal included
in the internal electrode 12 from diffusing into the piezoelectric
material 11, concentration of group VIII metal is preferably
controlled in a range from 0.001% by weight to 15% by weight. In
view of higher durability of the multi-layer piezoelectric element,
concentration of group VIII metal is preferably in a range from
0.1% by weight to 10% by weight. When high heat conductivity and
extra high durability are required, concentration of group VIII
metal is preferably in a range from 0.5% by weight to 9.5% by
weight. Moreover, for the maximum durability, concentration of
group VIII metal is preferably in a range from 2% by weight to 8%
by weight.
[0107] When concentration of group Ib metal is less than 85% by
weight, it leads to a high specific resistance of the internal
electrode 12, resulting in heat generated by the internal
electrodes 12 when the multi-layer piezoelectric element is
operated continuously. In order to prevent group Ib metal included
in the internal electrode 12 from diffusing into the piezoelectric
material 11, concentration of group Ib metal is preferably in a
range from 85% by weight to 99.999% by weight. In view of higher
durability of the multi-layer piezoelectric element, concentration
of group Ib metal is preferably in a range from 90% by weight to
99.9% by weight. When extra high durability is required,
concentration of group Ib metal is preferably in a range from 90.5%
by weight to 99.5% by weight. Moreover, for the maximum durability,
concentration of group Ib metal is preferably in a range from 92%
by weight to 98% by weight.
[0108] Concentrations by weight of group VIII metal and group Ib
metal in the metal composition in the internal electrode 12 can be
measured by EPMA (Electron Probe Micro Analysis) or the like.
[0109] It is preferable that the group VIII metal included in the
metal composition in the internal electrode 12 of the present
invention is at least one kind selected from among Ni, Pt, Pd, Rh,
Ir, Ru and Os, and Tb metal is at least one kind selected from
among Cu, Ag and Au, because such a composition can be favorably
manufactured in mass production by the alloy powder manufacturing
technology currently in practice.
[0110] It is more preferable that the group VIII metal included in
the metal composition in the internal electrode 12 is at least one
kind selected from among Pt and Pd, and Ib metal is at least one
kind selected from among Ag and Au, because such a composition
enables it to form the internal electrode 12 having excellent heat
resistance and low specific resistance.
[0111] It is further preferable that the group VIII metal included
in the metal composition in the internal electrode 12 is Ni,
because such a composition enables it to form the internal
electrode 12 having excellent heat resistance.
[0112] It is further preferable that the group Ib metal included in
the metal composition in the internal electrode 12 is Cu, because
such a composition enables it to form the internal electrode 12
having excellent heat conductivity.
[0113] Moreover, it is preferable that the internal electrode 12
includes an inorganic compound added to the metal composition. This
enables strong bonding between the internal electrode 12 and the
piezoelectric material 11. The inorganic compound preferably
includes a perovskite type oxide constituted from
PbZrO.sub.3--PbTiO.sub.3 as the main component.
[0114] In addition, the piezoelectric material 11 preferably
includes a perovskite type oxide as the main component. When the
piezoelectric material 11 is formed from a perovskite type
piezoelectric ceramic material represented by barium titanate
(BaTiO.sub.3), for example, high piezoelectric strain constant
d.sub.33 that represents the piezoelectric characteristic of the
material increases the amount of displacement and allows it to
sinter the piezoelectric material 11 and the internal electrode 12
at the same time. The piezoelectric material 11 is preferably
constituted from a material that includes perovskite type oxide
constituted from PbZrO.sub.3--PbTiO.sub.3 that has relatively high
value of high piezoelectric strain constant d.sub.33 as the main
component.
[0115] The piezoelectric material 11 is preferably sintered at a
temperature in a range from 900 to 1000.degree. C. This is because
the material cannot be fully sintered at a temperature below
900.degree. C., thus making it difficult to make the piezoelectric
material 11 with high density. When the sintering temperature is
higher than 1000.degree. C., on the other hand, large stress is
generated due to the difference in shrinkage between the internal
electrode 12 and the piezoelectric material 11 when fired, thus
resulting in cracks generated during continuous operation of the
multi-layer piezoelectric element.
[0116] Change in the composition of the internal electrode 12
caused by firing is preferably not more than 5%. When the change in
the composition of the internal electrode 12 caused by firing
exceeds 5%, much metal composition in the internal electrode
diffuses into the piezoelectric material 11 thus making it
impossible for the internal electrode 12 to accommodate the
contraction and expansion of the multi-layer piezoelectric element
during operation.
[0117] Change in the composition of the internal electrode 12
refers to a change in the composition of the internal electrode 12
caused by evaporation of the metal composition that constitutes the
internal electrode 12 during firing or diffusion thereof into the
piezoelectric material 11.
[0118] In the multi-layer piezoelectric element of the second
embodiment, one end of the internal electrode is exposed on the
side face of the stack alternately at every other layer while the
other end of the internal electrode is located inside from one side
face. It is preferable that a groove is formed toward the end that
is located inside and the groove is filled with a dielectric
material of which Young's modulus is lower than that of the
piezoelectric material. This constitution enables it to mitigate
the stress generated by the displacement of the multi-layer
piezoelectric element during operation, so that heat generation
from the internal electrode 12 can be suppressed during continuous
operation.
[0119] Now the method for manufacturing the multi-layer
piezoelectric element of the present invention will be
described.
[0120] Calcinated powder of piezoelectric ceramic material
constituted from perovskite type oxide such as
PbZrO.sub.3--PbTiO.sub.3, a binder made of an organic polymer such
as acrylic resin or butyral resin and a plasticizer such as DBP
(dibutyl phthalate) or DOP (dioctyl phthalate) are mixed to form a
slurry which is formed into a ceramic green sheet that would become
the piezoelectric material 11 by a known method such as doctor
blade process or tape molding method such as calender roll
process.
[0121] Then a metal oxide such as silver oxide, a binder and a
plasticizer are mixed with the metal composition that constitutes
the internal electrode 12 such as silver-palladium alloy to prepare
an electrically conductive paste which is applied onto the top
surface of the ceramic green sheet by screen printing or the like
to a thickness of 1 to 40 .mu.m.
[0122] A plurality of the green sheets having the electrically
conductive paste printed thereon are stacked one on another, with
the stack being heated at a predetermined temperature to remove the
binder and fired at a temperature in a range from 900 to
1200.degree. C. thereby to make the stack 13.
[0123] At this time, a dense stack can be made by adding metal
powder that constitutes the internal electrode such as
silver-palladium alloy in the green sheet in the portion of the
inactive layer 14, or printing a slurry consisting of the metal
powder that constitutes in the internal electrode such as
silver-palladium alloy, an inorganic compound, a binder and a
plasticizer onto the green sheets, which enables it to match the
inactive layer 14 and the other portions in the behavior of
shrinking and the shrinking ratio during the sintering process.
[0124] The method of making the stack 13 is not limited to that
described above, and any manufacturing method may be employed as
long as the stack 13 can be made in such a constitution as a
plurality of the piezoelectric layers 11 and a plurality of the
internal electrodes 12 are stacked alternately one on another.
[0125] Then the internal electrode 12 of which one end is exposed
on the side face of the multi-layer piezoelectric element and the
internal electrode 12 of which one end is not exposed are formed
alternately, and a groove is formed in the portion of the
piezoelectric material located between the internal electrode 12 of
which one end is not exposed and the external electrodes 15, with
the groove being filled with a dielectric material such as resin or
rubber of which Young's modulus is lower than that of the
piezoelectric material 11. The groove is formed on the side face of
the stack 13 by means of a dicing apparatus or the like.
[0126] The electrically conductive material that constitutes the
external electrode 15 is preferably silver or an alloy based on
silver that has a low value of Young's modulus, so as to absorb the
stress generated by the contraction and expansion of the
actuator.
[0127] The external electrode 15 may be formed as follows. An
electrically conductive silver-glass paste is prepared by adding a
binder to a glass powder and formed into a sheet that is dried to
remove solvent while controlling the density of the sheet in a
range from 6 to 9 g/cm.sup.3. The sheet is transferred onto the
external electrode forming surface of the column-like stack 13, and
is baked at a temperature that is higher than the softening point
of the glass and is not higher than the melting point (965.degree.
C.) of silver and is 4/5 of the firing temperature (.degree. C.) or
lower. In this process, the binder included in the sheet formed
from the electrically conductive silver-glass paste is removed and
the external electrode 15 is formed from a porous electrical
conductor having 3-dimensional mesh structure.
[0128] The temperature at which the electrically conductive
silver-glass paste is baked is preferably in a range from 550 to
700.degree. C. for the purpose of effectively forming a neck,
joining silver that is included in the electrically conductive
silver-glass paste and the internal electrode 12 through diffusion,
effectively causing the voids in the external electrode 15 to
remain and partially joining the external electrode 15 and the side
face of the column-like stack 13. Softening point of the glass
component included in the electrically conductive silver-glass
paste is preferably in a range from 500 to 700.degree. C.
[0129] When the baking temperature is higher than 700.degree. C.,
sintering of the silver powder of the electrically conductive
silver-glass paste proceeds excessively, such that the porous
electrical conductor of 3-dimensional mesh structure cannot be
effectively formed. That is, the external electrode 15 becomes too
dense, resulting in Young's modulus of the external electrode 15
that is too high to effectively absorb the stress generated during
operation, eventually leading to breakage of the external electrode
15. Baking is preferably carried out at a temperature that is not
higher than 1.2 times the softening point of the glass.
[0130] When the baking temperature is lower than 550.degree. C.,
end of the internal electrode 12 and the external electrode 15
cannot be joined sufficiently through diffusion, and therefore the
neck cannot be formed thus resulting in spark occurring between the
internal electrode 12 and the external electrode 15 during
operation.
[0131] Thickness of the sheet formed from the electrically
conductive silver-glass paste is preferably smaller than the
thickness of the piezoelectric layer 11. More preferably, the
thickness is 50 .mu.m or less in order to accommodate the
contraction and expansion of the actuator.
[0132] Then the stack 13 in which the external electrode 15 is
formed is immersed in a silicone rubber solution while deaerating
the silicone rubber solution by evacuation, so as to fill the
groove of the stack 13 with the silicone rubber. The stack 13 is
pulled out of the silicone rubber solution and is coated with the
silicone rubber on the side faces thereof. Then the silicon rubber
that fills the groove and covers the side faces of the column-like
stack 13 is hardened thereby completing the multi-layer
piezoelectric element of the present invention.
[0133] Lead wires are connected to the external electrodes 15, a DC
voltage of 0.1 to 3 kV/mm is applied between the pair of external
electrodes 15 via the lead wires so as to apply polarization
treatment to the stack 13, thereby to complete the multi-layer
piezoelectric actuator comprising the multi-layer piezoelectric
element of the present invention. When the lead wires are connected
to an external voltage source and the voltage is supplied via the
lead wires and the external electrodes 15 to the internal
electrodes 12, the piezoelectric layers 11 of the multi-layer
piezoelectric element of the present invention undergoes a
significant amount of displacement by the reverse piezoelectric
effect, so as to drive, for example, an automobile fuel injection
valve that supplies fuel to the engine.
[0134] An electrical conductivity assisting member made of an
electrically conductive adhesive with a metal mesh or a mesh-like
metal sheet embedded therein may be formed on the external surface
of the external electrode 15. In this case, the electrical
conductivity assisting member provided on the external surface of
the external electrode 15 allows it to supply a large electric
current to the actuator, thereby enabling it to draw a large
current through the electrical conductivity assisting member even
when operated at a high speed, thus reducing the current flowing in
the external electrode 15. This makes it possible to prevent the
external electrodes 15 from breaking due to localized heat
generation, thus resulting in greatly improved reliability.
Moreover, because the metal mesh or the mesh-like metal sheet is
embedded in the electrically conductive adhesive, cracks can be
prevented from occurring in the electrically conductive
adhesive.
[0135] The metal mesh refers to a structure of entwined metal
wires, and the mesh-like metal sheet refers to a metal sheet with a
number of holes punched therethrough.
[0136] It is also preferable that the electrically conductive
adhesive that constitutes the electrical conductivity assisting
member is formed from polyimide resin including silver powder
dispersed therein. By dispersing the silver powder that has low
specific resistance in the polyimide resin that has high heat
resistance, the electrical conductivity assisting member can
maintain low resistivity and high bonding strength even when used
at high temperatures. More preferably, the electrically conductive
particles are non-spherical particles such as flakes or acicular
particles. When the electrically conductive particles are
non-spherical particles such as flakes or acicular particles, the
electrically conductive particles can be firmly entwined with each
other, thereby increasing the shear strength of the electrically
conductive adhesive.
[0137] The multi-layer piezoelectric element of the present
invention is not limited to the constitution of the second
embodiment described above, and various modifications can be made
to an extent that does not deviate from the scope of the present
invention.
[0138] While an example where the external electrodes 15 are formed
on the opposing side faces of the stack 13 has been described
above, a pair of external electrodes may be formed on, for example,
adjacent side faces according to the present invention.
[0139] FIG. 8 shows the injection apparatus according to the
present invention, where an injection hole 33 is provided on one
end of a container 31 and a needle valve 35 that can open and close
the injection hole 33 is housed in the container 31.
[0140] A fuel passage 37 is provided so as to be capable of
communicating with the injection hole 33, and is connected to a
fuel source that is provided outside of the apparatus, so as to
supply the fuel through the fuel passage 37 at a high pressure that
is maintained constant. When the needle valve 35 opens the
injection hole 33, the fuel supplied to the fuel passage 37 is
injected into a fuel chamber (not shown) of an internal combustion
engine at a high pressure that is maintained constant.
[0141] Diameter of the needle valve 35 is made larger at the top
end to become a piston 41 that is movable while sliding in a
cylinder 39 formed in the container 31. The piezoelectric actuator
43 is housed in the container 31.
[0142] In the injection apparatus having the constitution described
above, when the piezoelectric actuator 43 expands under a voltage
applied thereto, the piston 41 is pressed so that the needle valve
35 closes the injection hole 33 thereby stopping the fuel supply.
When application of the voltage is stopped, piezoelectric actuator
43 contracts and a belleville spring pushes back the piston 41 so
that the injection hole 33 communicates with the fuel passage 37
and the fuel is injected.
[0143] While FIG. 8 relates to the multi-layer piezoelectric
element and the injection apparatus, the present invention is not
limited to the constitution shown in FIG. 8. For example, the
present invention can be applied to a fuel injection apparatus of
automobile engine, liquid ejecting apparatus of ink jet printer or
the like or a drive unit used in precision positioning device or
vibration preventing device for an optical apparatus, or to sensor
devices such as a sensor element mounted in combustion pressure
sensor, knocking sensor, acceleration sensor, load sensor,
ultrasonic sensor, pressure sensor, yaw rate sensor or the like, or
used as a circuit component mounted in piezoelectric gyro,
piezoelectric switch, piezoelectric transformer, piezoelectric
breaker or the like, and is also applicable to other purposes, as
long as the piezoelectric characteristic is utilized.
Third Embodiment
[0144] The piezoelectric electronic component according to the
third embodiment of the present invention is a multi-layer
piezoelectric actuator of similar constitution as that of the first
embodiment, with a part of the manufacturing process different from
that of the first embodiment.
[0145] FIG. 9 is an enlarged sectional view of a part of the
multi-layer piezoelectric actuator of the third embodiment, with
similar components identified with similar reference numerals as in
the first embodiment.
[0146] Thickness of the piezoelectric layer 1, namely the distance
between the internal electrodes 2, is preferably not larger than
200 .mu.m, or more preferably not larger than 150 .mu.m, in order
to make the construction smaller and apply high electric field. On
the other hand, thickness of the piezoelectric layer 1 is set not
smaller than 50 .mu.m, preferably not smaller than 70 .mu.m, in
order to reduce the transient time of applying a voltage to the
piezoelectric layer 1 and enable faster response. Thus the number
of stacked layers is preferably 200 or more. While larger
displacement of the multi-layer piezoelectric element under a given
voltage is achieved by stacking a larger number of piezoelectric
layers, stacking a larger number of thick piezoelectric layers 1 in
the multi-layer piezoelectric body 3 makes it impossible to make an
actuator of smaller size and lower profile. On the other hand,
insulation breakdown may be caused when thickness of the
piezoelectric layers 1 in the multi-layer piezoelectric body 3 is
too small. Therefore, the thickness is preferably in the range
described above.
[0147] Average crystal grain size of crystal grains that constitute
the piezoelectric material according to the third embodiment is
preferably 5 .mu.m or less, and more preferably 3 .mu.m or
less.
[0148] In the multi-layer piezoelectric element of the first
embodiment, it is important that change in the degree of
orientation f of the crystal grains of the piezoelectric material
is controlled to within 5% after operation, by employing the
manufacturing method described below. In order to enable continuous
operation of more than 10.sup.9 cycles, degree of orientation f is
preferably controlled to within 3%. An injection apparatus of high
reliability can be made by employing the multi-layer piezoelectric
element that is capable of repetitive operations of more than
10.sup.9 cycles under such conditions as load of 150 kgf,
temperature of 150.degree. C. and frequency of 50 Hz.
[0149] When change in the degree of orientation f of the crystal
grains of the piezoelectric material exceeds 5% after operation,
constant piezoelectric characteristic cannot be obtained during
continuous operation and, moreover, service life becomes
shorter.
[0150] FIG. 10 is a flow chart showing the sequence of processes to
manufacture the multi-layer piezoelectric element of the present
invention. The manufacturing method will now be described below
taking a multi-layer piezoelectric actuator as a representative
example of the multi-layer piezoelectric element of the third
embodiment.
[0151] In the manufacturing method for the multi-layer
piezoelectric element of the third embodiment, for example, a
ceramic green sheet 21 having thickness in a range from 50 to 250
.mu.m is made similarly to the first embodiment (FIG. 10A).
[0152] In the manufacturing method according to the third
embodiment, preferable range of the average particle size of the
piezoelectric powder that is calcinated powder that makes the
piezoelectric layer 1 and preferable range of thickness of the
green sheet 21 are similar to those of the first embodiment.
[0153] A conductor pattern 22 is formed on one side of the green
sheet 21 that has been punched through to predetermined dimensions
similarly to the first embodiment. In this case, it is preferable
to mix a ceramic powder in the electrically conductive paste
similarly to the second embodiment.
[0154] Then a multi-layer piezoelectric green compact 23 is made
similarly to the first embodiment and is cut into predetermined
dimensions, before being degreased in air atmosphere and fired so
as to make the multi-layer piezoelectric stack 3.
[0155] In the third embodiment, firing is carried out preferably at
a temperature not higher than 1000.degree. C., especially at
980.degree. C. or lower in order to increase the proportion of Ag
in the internal electrode 2 and reduce the manufacturing cost.
[0156] Then similarly to the first embodiment, the external
electrode paste that includes Ag-glass is applied to the end face
of the piezoelectric stack 3, and is heated at a temperature in a
range from 500.degree. C. to 900.degree. C., so as to form the
external electrode 4 shown in FIG. 10. In this case, cooling rate
from the maximum temperature of heat treatment is preferably in the
same range as that of the first embodiment.
[0157] The multi-layer piezoelectric element made as described
above is subjected to polarization treatment according to the
procedure shown in FIG. 11.
[0158] Specifically, the multi-layer piezoelectric element is
immersed in an oil bath that is heated to a temperature from
100.degree. C. to 400.degree. C., and a DC voltage of 0.1 to 3
kV/mm is applied between a pair of the external electrodes 4 that
are formed on the device so as to fully polarize the crystal grains
that constitute the piezoelectric layer.
[0159] After the polarization treatment, the device is cooled down
to room temperature below Curie temperature while maintaining the
applied voltage. Then after cooling down to the room temperature,
electric field is reduced. With this polarization treatment, the
multi-layer piezoelectric element of the third embodiment is
completed.
[0160] It is important to apply the polarization treatment to the
multi-layer piezoelectric element of the third embodiment in the
procedure described above.
[0161] When the internal electrode 2 includes Ag, for example, Ag
normally diffuses toward the piezoelectric layer during firing.
When Ag diffuses, oxygen defects are formed in the porcelain due to
mutual diffusion with the porcelain of the piezoelectric layer. The
oxygen defects become oxygen hole ions during continuous operation,
affecting the moving direction of ions at B site (Zr, Ti)
constituting the piezoelectric layer, so that the preferred
orientation of the porcelain changes with time. According to the
present invention, in contrast, sufficient polarization is carried
out under the conditions described above, and therefore the change
in preferred orientation of the porcelain with time is
suppressed.
[0162] According to the third embodiment, the rate of cooling down
after the polarization treatment is preferably set to t/3 (.degree.
C./minute) or less, where t (.degree. C.) is Curie temperature of
the piezoelectric layer. Such a cooling rate enables it to more
effectively suppress the piezoelectric characteristic from changing
after operation.
[0163] The change in the ratio of lattice constants c/a of the
piezoelectric material that constitutes the piezoelectric layer
after polarization is preferably 0.5% or less. This is because,
when the change in c/a is larger than 0.5%, stress generated during
polarization causes peel-off between the internal electrode 2 and
the piezoelectric layer 1. In the third embodiment, in order to
effectively prevent peel-off due to polarization from occurring,
change in c/a is more preferably 0.2% or less. The ratio of lattice
constants c/a is determined by calculating the lattice constant a
from a peak of plane (200) from XRD diffraction pattern and
calculating the lattice constant c from a peak of plane (002).
[0164] In the third embodiment, it is made possible to control the
change in the preferred orientation of the crystal grains that
constitutes the piezoelectric layer 1 after operation to within 5%
by employing the manufacturing method described above.
[0165] The method of manufacturing the multi-layer electronic
component of the third embodiment is preferably used in the
manufacture of multi-layer electronic component such as multi-layer
piezoelectric transformer, multi-layer capacitor or multi-layer
piezoelectric actuator. The method of manufacturing the multi-layer
electronic component of the present invention is particularly
preferable or the manufacture of multi-layer piezoelectric actuator
formed from piezoelectric ceramics that is continuously operated by
applying high electric field. Operation test is preferably carried
out by conducting repetitive operations of more than 10.sup.9
cycles under such conditions as load of 150 kgf, temperature of
150.degree. C. and frequency of 50 Hz.
[0166] An injection apparatus similar to that described in the
second embodiment can be made by using the multi-layer
piezoelectric element of the third embodiment that has the
constitution described above.
[0167] While the third embodiment has been described by way of an
example where the internal electrode 2 is made of Ag--Pd, the
present invention is not limited to this constitution and the
internal electrode 2 may be formed by using various materials.
[0168] However, the metal composition that constitutes the internal
electrode 2 preferably consists of either the group VIII metal or
the group Ib metal, or both the group VIII metal and the group Ib
metal as the main component. Particularly, proportion M1 (% by
weight) of the group VIII metal and proportion M2 of the group Ib
metal preferably satisfy the relations 0.001.ltoreq.M1.ltoreq.15,
85.ltoreq.M2.ltoreq.99.999 and M1+M2=100, more preferably
3.ltoreq.M1.ltoreq.8 and 92.ltoreq.M2.ltoreq.97.
[0169] It is preferable that the group VIII metal is at least one
kind selected from among Ni, Pt, Pd, Rh, Ir, Ru and Os, and the
group Ib metal is at least one kind selected from among Cu, Ag and
Au. It is more preferable that the group VIII metal is at least one
kind selected from among Pt and Pd, and the group Ib metal is at
least one kind selected from among Ag and Au. It is furthermore
preferable that the group VIII metal is Ni, the group Ib metal is
Cu.
[0170] Thickness of the internal electrode of the present invention
is preferably 5 .mu.m or less, and more preferably 4 .mu.m or
less.
[0171] The internal electrode 2 of the present invention includes
an inorganic component, and the inorganic component is preferably
the same as that of the piezoelectric layer 1 and has average
particle size smaller than that of the piezoelectric layer 1.
Example 1
[0172] In Example 1, the multi-layer electronic component of the
first embodiment shown in FIG. 1 was made and was evaluated for the
size of the gap between the internal electrode and the ceramic
layer.
[0173] First, a slurry was prepared by mixing a calcinated powder
of piezoelectric ceramics such as lead zirconate titanate Pb(Zr,
Ti)O.sub.3 having Curie temperature of 300.degree. C. and particle
size of 0.7 .mu.m, an organic binder made of butyral resin and a
plasticizer, and the slurry was formed into a ceramic green sheet
21 having thickness of 150 .mu.m by slip casting method.
[0174] Then an electrically conductive paste, that includes
silver-palladium alloy which makes the internal electrode 2 and a
solvent, is applied to one side of the ceramic green sheet 21 to a
thickness of 4 .mu.m as shown in FIG. 2 by screen printing process,
so as to form the internal conductor pattern 22.
[0175] Then 30 pieces of the ceramic green sheets 21 whereon the
internal conductor pattern 22 was formed were stacked. Then 5
pieces of the ceramic green sheet 21 without electrically
conductive paste printed thereon were stacked on the top and bottom
surfaces of the stack, thereby making the multi-layer green compact
23 having the construction shown in FIG. 3.
[0176] The multi-layer green compact 23 was put into a die and was
heated to 90.degree. C. while applying pressure of 100 MPa by means
of an isostatic press so as to be integrated.
[0177] The multi-layer green compact 23 that was integrated was cut
into 10 mm square and was heated to 800.degree. C. for 10 hours to
remove the binder, followed by firing at 1130.degree. C. for 2
hours, thereby to obtain the column-like stack 3.
[0178] Ag-glass paste including Ag as the main component was
applied to a pair of opposing side faces of the active section and
was heated at 750.degree. C. for 1 hour before being cooled down at
the rate shown in Table 1 thereby to form the external electrode
4.
[0179] Then a DC voltage of 3 kV/mm was applied between the
positive and negative external electrodes 4 so as to apply
polarization treatment for 15 minutes, thereby to make the
multi-layer piezoelectric element. The change in ratio of lattice
constants c/a after the polarization is shown in Table 1.
TABLE-US-00001 TABLE 1 Proportion of area with Change Gap in
distance Cooling rate in c/a interface 2 .mu.m No (.degree.
C./minute) (%) .mu.m or less % Delamination *1-1 150 Curie 0.60 2.8
5 Occurred temperature/2 1-2 100 Curie 0.45 1.6 52 No temperature/3
1-3 50 Curie 0.20 1.0 71 No temperature/6 1-4 10 Curie 0.05 0.3 86
No temperature/30 1-5 5 Curie 0.05 0.3 98 No temperature/60
[0180] As shown in Table 1, samples Nos. 1-2 through 1-5 within the
scope of the present invention showed no delamination in the
interface, as the internal electrode and the piezoelectric layer
are located near to each other with distance not larger than 2
.mu.m in 50% or more of the active region where two adjacent
internal electrodes oppose each other. In sample No. 1-1 that was
made by cooling down at a rate out of the scope of the present
invention, in contrast, since the gap is as large as 2.8 .mu.m in
the interface and the proportion of area where the gap is 2 .mu.m
or less is only 5% due to the fast cooling rate, occurrence of
delamination was confirmed by observation of the appearance with a
binocular microscope.
Example 2
[0181] In Example 2, the multi-layer piezoelectric actuator of the
second embodiment was made and was evaluated as described
below.
[0182] First, a slurry was prepared by mixing a calcinated powder
of piezoelectric ceramics including lead zirconate titanate
(PbZrO.sub.3--PbTiO.sub.3) having average particle size of 0.4
.mu.m as the main component, a binder and a plasticizer, and the
slurry was formed into a ceramic green sheet that would become the
piezoelectric layer 11 having thickness of 150 .mu.m by doctor
blade method.
[0183] Then an electrically conductive paste was applied to one
side of the ceramic green sheet to a thickness of 3 .mu.m by screen
printing process. Then 300 pieces of the ceramic green sheets were
stacked and fired at 1000.degree. C. after hold the temperature at
800.degree. C. The electrically conductive paste was made by adding
silver oxide and a binder to the silver-palladium alloy, and the
proportion of the silver-palladium alloy can be determined
arbitrarily.
[0184] After firing, a groove measuring 50 .mu.m in depth and 50
.mu.m in width was formed at the end of the internal electrode
located on the side face of the stack in every other layer, by
means of a dicing apparatus.
[0185] Then 90% by volume of silver powder of flake-like particle
shape having average particle size of 2 .mu.m and 10% by volume of
amorphous glass powder having softening point of 640.degree. C.
including silicon as the main component having average particle
size of 2 .mu.m were mixed, and 8 parts by weight of a binder is
added for 100 parts by weight in total of the silver powder and the
glass powder, so as to prepare the electrically conductive
silver-glass paste by fully mixing the powders. The electrically
conductive silver-glass paste thus prepared was screen printed onto
a release film. After drying, the paste film was peeled off the
release film to obtain a sheet of electrically conductive
silver-glass paste. Density of the green sheet as measured by
Archimedes method was 6.5 g/cm.sup.3.
[0186] The sheet of the electrically conductive silver-glass paste
was transferred onto the surface of the external electrode 15 of
the stack 13, and was baked at 650.degree. C. for 30 minutes so as
to form the external electrode 15 made of a porous electrically
conductive material having 3-dimensional mesh structure. Void ratio
of the external electrode 15 measured by analyzing a photograph of
a cross section of the external electrode 15 with an image analyzer
was 40%.
[0187] Lead wires were connected to the external electrodes 15, and
a DC electric field of 3 kV/mm was applied via the lead wires
between the positive and negative external electrodes 15 so as to
apply polarization treatment for 15 minutes, thereby to make the
multi-layer piezoelectric actuator comprising the multi-layer
piezoelectric element shown in FIG. 1.
[0188] When a DC voltage of 170 V was applied across the
multi-layer piezoelectric element obtained as described above, the
multi-layer piezoelectric element underwent displacement of 45
.mu.m in the stacking direction. The multi-layer piezoelectric
element was then subjected to an AC voltage varying between 0 V and
+170 V at frequency of 150 Hz for operation test at the room
temperature.
[0189] The multi-layer piezoelectric element shown in Tables 2 and
3 that were operated for 1.times.10.sup.9 cycles were cut into
pieces measuring 3 mm.times.4 mm.times.36 mm, that were tested for
bending strength by 4-point bending test according to JIS R1601.
When the electrode surface of the internal electrode 12 was
disposed substantially at right angles to the longitudinal
direction of the test piece, all test pieces fractured in the
interface between the internal electrode 12 and the piezoelectric
layer 11.
[0190] The samples shown in Table 2 were observed with SEM to
measure the average crystal grain size of the piezoelectric layer
11 in a portion making contact with the internal electrode 12 and
the average crystal grain size of other portion, so as to
investigate the relationship between the average crystal grain size
and the bending strength. Specifically, the average crystal grain
size was measured by drawing a straight line over the image of the
piezoelectric grains that face the internal electrode captured by
the SEM, measuring the length of line segment enclosed within the
boundary of each of randomly selected 50 crystal grains and
averaging the measurements.
[0191] The average crystal grain size in the other portion was
determined by drawing a straight line at an arbitrary position of
the image in a region other than the piezoelectric layer that faces
the internal electrode and measuring the length of line segment
enclosed within the boundary of each of randomly selected 50
crystal grains and averaging the measurements.
[0192] The minimum crystal grain size is defined as the smallest
grain size among the crystal grains shown in the same area of the
image where the average crystal grain size was measured.
[0193] For the purpose of comparison, relationship between the
average crystal grain size and the bending strength was also
investigated when average crystal grain size of the piezoelectric
layer 11 of a portion making contact with the internal electrode 12
was made the same as or larger than the average crystal grain size
of other portion by the conventional manufacturing method.
[0194] The samples shown in Table 3 were observed with SEM to
measure the minimum crystal grain size and the maximum crystal
grain size of the piezoelectric layer 11 of a portion that makes
contact with the internal electrode 12, and the minimum crystal
grain size and the maximum crystal grain size of the other portion,
so as to investigate the relationship between these values and the
bending strength. The measuring method was similar to that shown in
Table 2. For the purpose of comparison, relationship between the
minimum crystal grain size and the maximum crystal grain size and
the bending strength was also investigated when the minimum crystal
grain size and the maximum crystal grain size of the piezoelectric
layer 11 of a portion making contact with the internal electrode 12
were made substantially the same as or larger than the minimum
crystal grain size and the maximum crystal grain size of the other
portion. The results are shown in Tables 2 and 3.
TABLE-US-00002 TABLE 2 Average crystal Bending Average crystal
grain strength No grain size 1 (.mu.m) size 2 (.mu.m) (MPa) *2-1
0.4 0.4 34.3 2-2 1.0 0.8 84.6 2-3 1.9 1.7 90.2 2-4 2.7 2.4 92.4 2-5
3.8 3.5 103.6 2-6 5.7 5.2 99.6 2-7 8.0 7.9 83.0 *2-8 9.2 9.8
40.2
[0195] The average crystal grain size 1 shown in Table 2 represents
the average crystal grain size (.mu.m) of the piezoelectric layer
in the vicinity of the internal electrode, and the average crystal
grain size 2 represents the average crystal grain size (.mu.m) of
the piezoelectric layer in a portion other than the vicinity of the
internal electrode.
TABLE-US-00003 TABLE 3 Maximum Minimum Maximum Minimum crystal
crystal crystal crystal Bending grain size grain size grain size
grain size strength No 1 (.mu.m) 1 (.mu.m) 2 (.mu.m) 2 (.mu.m) MPa
*2-9 1.2 0.1 1.3 0.2 34.3 2-10 2.4 0.5 2.3 0.3 84.6 2-11 2.6 1.0
2.8 0.3 90.2 2-12 3.1 2.7 3.0 0.3 92.4 2-13 4.5 3.8 4.6 0.3 103.6
2-14 6.2 5.0 6.8 0.2 99.6 2-15 8.4 4.6 8.1 0.4 83.0 *2-16 10.1 5.0
11.2 5.2 40.2
[0196] The maximum crystal grain size 1 shown in Table 3 represents
the maximum crystal grain size (.mu.m) of the piezoelectric layer
in the vicinity of the internal electrode, and the minimum crystal
grain size 1 represents the minimum crystal grain size (.mu.m) of
the piezoelectric layer in the vicinity of the internal
electrode.
[0197] The maximum crystal grain size 2 shown in Table 3 represents
the maximum crystal grain size (.mu.m) of the piezoelectric layer
in a portion other than the vicinity of the internal electrode, and
the minimum crystal grain size 2 represents the minimum crystal
grain size (.mu.m) of the piezoelectric layer in a portion other
than the vicinity of the internal electrode.
[0198] From Table 2, it can be seen that sufficient bending
strength cannot be obtained when the average crystal grain size of
the piezoelectric layer 11 of a portion facing the internal
electrode 12 is smaller than or the same as the average crystal
grain size of the other portion (samples Nos. 2-1, 2-8), while
bending strength can be improved when the average crystal grain
size of the piezoelectric layer 11 of a portion facing the internal
electrode 12 is larger than the average crystal grain size of the
other portion (samples Nos. 2-2 through 2-7).
[0199] From Table 3, it can be seen that the maximum crystal grain
size of the piezoelectric layer 11 of a portion facing the internal
electrode 12 is the same as or larger than the maximum crystal
grain size of the other portion. However, when the minimum crystal
grain size is compared, it can be seen that sufficient bending
strength cannot be obtained when the minimum crystal grain size of
the piezoelectric layer 11 of a portion facing the internal
electrode 12 was smaller than minimum crystal grain size of the
other portion (samples Nos. 2-9, 2-16), while bending strength can
be improved when the minimum crystal grain size of the
piezoelectric layer 11 of a portion facing the internal electrode
12 is larger than the minimum crystal grain size of the other
portion (samples Nos. 2-10 through 2-14).
[0200] From Table 3, it can also be seen that bending strength can
be improved by setting the minimum crystal grain size of the
piezoelectric layer 11 facing the internal electrode 12 in a range
from 0.5 to 5 .mu.m.
[0201] In any case, since all test pieces fractured in the
interface between the internal electrode 12 and the piezoelectric
layer 11, it can be seen that bonding strength in the interface
between the internal electrode 12 and the piezoelectric layer 11
can be improved by making the crystal grain size (average crystal
grain size, minimum crystal grain size) of the piezoelectric layer
11 of a portion facing the internal electrode 12 larger than the
crystal grain size (average crystal grain size, minimum crystal
grain size) of the other portion.
Example 3
[0202] As Example 3 related to the second embodiment, multi-layer
piezoelectric elements having different compositions of the
internal electrode 12 were made and evaluated for the relation with
the bending strength by measuring the minimum crystal grain size
and the maximum crystal grain size of the piezoelectric layer
making contact with the electrode, and measuring the minimum
crystal grain size and the maximum crystal grain size of the other
portion under the same conditions as those of Example 2. The
results are shown in Table 4. Change in the amount of displacement
was also measured on each test piece. Change in the amount of
displacement is the decrease in displacement of the multi-layer
piezoelectric element determined by comparing the displacement
(.mu.m) of the multi-layer piezoelectric element after undergoing
1.times.10.sup.9 cycles of operation and the initial displacement
(.mu.m) of the multi-layer piezoelectric element before the
continuous operation. The results are also shown in Table 4.
TABLE-US-00004 TABLE 4 Content of other metals in internal Pd
content Pt content Ag content electrode No (% by weight) (% by
weight) (% by weight) (% by weight) 3-17 0 0 100 0 3-18 0.001 0
99.999 0 3-19 0.01 0 99.99 0 3-20 0.1 0 99.9 0 3-21 0.5 0 99.5 0
3-22 1 0 99 0 3-23 2 0 98 0 3-24 4 1 95 0 3-25 5 0 95 0 3-26 8 0 92
0 3-27 9 0 91 0 3-28 9.5 0 90.5 0 3-29 10 0 90 0 3-30 15 0 85 0
3-31 20 0 80 0 3-32 30 0 70 0 3-33 0 0 0 Cu 100% 3-34 0.1 0 0 Cu
99.9% 3-35 0 0 0 Ni 100% Average Average Bending grain size grain
size Change in strength No 1 (.mu.m) 2 (.mu.m) displacement (%)
(MPa) 3-17 Fractured due to migration -- during operation. 3-18 4.2
3.5 0.7 96.8 3-19 4.2 3.6 0.7 97.1 3-20 4.1 3.6 0.4 98.0 3-21 4.0
3.6 0.2 99.8 3-22 4.0 3.6 0.2 100.4 3-23 3.9 3.6 0 102.5 3-24 3.8
3.5 0 105.1 3-25 3.8 3.5 0 107.2 3-26 3.7 3.4 0 104.2 3-27 3.6 3.4
0.2 100.7 3-28 3.5 3.3 0.2 99.2 3-29 3.4 3.3 0.4 98.2 3-30 3.3 3.2
0.7 97.2 3-31 2.7 2.5 0.9 90.5 3-32 2.5 2.3 0.9 90.3 3-33 3.8 3.5
0.2 102.1 3-34 3.8 3.5 0 103.1 3-35 3.7 3.4 0.4 100.9
[0203] The average crystal grain size 1 shown in Table 4 represents
the average grain size (.mu.m) of the piezoelectric layer in the
vicinity of the internal electrode, and the average crystal grain
size 2 represents the average grain size (.mu.m) of the
piezoelectric layer in a portion other than the vicinity of the
internal electrode.
[0204] Change in the amount of displacement shown in Table 4 is the
difference between the initial displacement and the displacement
after continuous operation test.
[0205] Table 4 shows that continuous operation became impossible as
the multi-layer piezoelectric element broke due to silver
migration, when the internal electrode 12 was made of 100% silver
in sample No. 3-17. In samples other than No. 3-17, the average
grain size of the piezoelectric layer 11 facing the internal
electrode 12 was larger than the average crystal grain size of the
piezoelectric layer 11 in the other portion. In samples Nos. 3-31
and 3-32, the content of the group VIII metal was higher than 15%
by weight and the content of the group Ib metal was less than 85%
by weight in the metal composition in the internal electrode 12,
and therefore the multi-layer piezoelectric element deteriorates
through continuous operation and durability of the multi-layer
piezoelectric actuator decreases. Thus bending strength decreases
in this case.
[0206] In samples Nos. 3-18 through 3-30 and 33 through 35, where
the average grain size of the piezoelectric layer 11 facing the
internal electrode 12 was larger than the average crystal grain
size of the piezoelectric layer 11 in the other portion, and
proportion M1 (% by weight) of the group VIII metal and proportion
M2 of the group Ib metal in metal composition in the internal
electrode preferably satisfy the relations 0.ltoreq.M1.ltoreq.15,
85.ltoreq.M2.ltoreq.100 and M1+M2=100, sufficient bending strength
is achieved and the bonding strength between the internal electrode
12 and the piezoelectric layer 11 is improved, while specific
resistance of the internal electrode 12 can be decreased so as to
suppress the heat generation from the internal electrode 12 during
continuous operation, thus making it possible to make the
multi-layer piezoelectric actuator having stable displacement of
the device.
[0207] The present invention is not limited to the examples
described above, and various modifications can be made to an extent
that does not deviate from the scope of the present invention.
Example 4
[0208] Piezoelectric material powder constituted from lead
zirconate titanate Pb(Zr, Ti)O.sub.3, having Curie temperature of
300.degree. C. and particle size of 0.7 .mu.m, an organic binder
made of butyral resin and a plasticizer were mixed to form a slurry
which was formed into a green sheet 150 .mu.m thick by slip casting
method.
[0209] An electrically conductive paste, that included metal powder
having predetermined composition of Ag--Pd component which would
make the internal electrode, an organic resin and a solvent, was
applied to one side of the green sheet to a thickness of 4 .mu.m as
shown in FIG. 2 by screen printing process, so as to form the
conductor pattern. Then 30 pieces of the ceramic green sheet
whereon the conductor pattern was formed were stacked one on
another. Then 5 pieces of the green sheet without electrically
conductive paste printed thereon were stacked on the top and bottom
surfaces of the stack, thereby making the multi-layer green compact
having the construction shown in FIG. 2.
[0210] The multi-layer green compact was put into a die and was
heated to 90.degree. C. while applying a pressure of 100 MPa by
means of an isostatic press so as to be integrated.
[0211] The multi-layer green compact that had been integrated was
cut into 10 mm square and was heated to 800.degree. C. for 10 hours
to remove the binder, followed by firing at 1130.degree. C. for 2
hours, thereby to obtain the piezoelectric stack. Thickness of the
piezoelectric layer that constituted the piezoelectric stack was
120 .mu.m and thickness of the internal electrode was 3 .mu.m. The
rate of cooling down from the maximum temperature was set to t/3
(.degree. C./minute) during firing, where t (.degree. C.) is Curie
temperature.
[0212] Then Ag-glass paste including Ag as the main component was
applied to a pair of opposing side faces of the active section and
was heated at 750.degree. C. for 1 hour before being cooled down at
the rate shown in Table 5 thereby to complete the heat treatment
and form the external electrode.
[0213] Then the stack was immersed in an oil bath heated to
400.degree. C. and a DC voltage of 3 kV/mm was applied between a
pair of external electrodes of this device for 1 hour so as to
apply sufficient polarization treatment to the crystal grains that
constituted the piezoelectric layer and, while maintaining the
voltage applied thereto, was cooled down to the room temperature
below Curie temperature, thereby to make the multi-layer
piezoelectric element. Proportion of preferred orientation of the
crystal grains was measured by X-ray diffraction method immediately
after the polarization treatment and after continuous operation of
10.sup.9 cycles. The change in the ratio of lattice constants c/a
is shown in Table 5. Effective piezoelectric strain constant was
evaluated by applying voltage of 0 to 200 V to a sample of the
multi-layer piezoelectric element that was fastened onto a
vibration-isolated test bench with a load of 150 kgf applied
thereto in the stacking direction. Change in the length of the
multi-layer piezoelectric element was measured and was divided by
the number of stacked layers and the applied voltage. Curie
temperature was determined by measuring the temperature
characteristic of the capacitance of the piezoelectric porcelain.
High-temperature durability test was conducted by using a
thermostat and operating the device to undergo 10.sup.9 cycles
under conditions of load of 150 kgf applied thereto at temperature
of 150.degree. C. and frequency of 50 Hz.
[0214] Comparative example was made by applying the conventional
polarization treatment to the multi-layer piezoelectric element
described above. Crystal grain size was determined through
observation under electron microscope.
TABLE-US-00005 TABLE 5 Effective High- Composition Average Change
in piezoelectric Curie temperature of internal Polarizing grain
degree of strain constant temperature durability test No electrode
condition size .mu.m orientation (%) d.sub.33 pm/V .degree. C.
10.sup.19 cycles *4-1 95/5 2 2.5 7 880 331 B 4-2 95/5 1 2.0 3 870
330 A 4-3 95/5 1 2.5 4 880 330 A 4-4 95/5 1 3.0 5 890 330 A 4-5
85/15 1 2.5 4 910 330 A 4-6 90/10 1 2.5 4 900 331 A Note) A:
Excellent, B: Good
[0215] Table 5 shows that samples Nos. 4-2 through 4-6 that were
subjected to the polarization treatment according to the present
invention and showed changes in the degree of orientation of
crystal grains of the piezoelectric material not larger than 5%
demonstrated satisfactory results in the operation test of the
present invention with changes in displacement after continuous
operation within 10%.
[0216] In sample No. 4-1, where the change in the degree of
orientation was larger than 5% after operation, change in
displacement after continuous operation exceeded 10% and reached
15%.
INDUSTRIAL APPLICABILITY
[0217] The present invention provides the multi-layer electronic
component and the method for manufacturing the same that are
capable of suppressing delamination from occurring between the
ceramic layer and the internal electrode, so as to provide the
multi-layer piezoelectric element and the injection apparatus that
are excellent in durability.
* * * * *