U.S. patent application number 12/517344 was filed with the patent office on 2010-03-11 for heat control device and method of manufacturing the same.
This patent application is currently assigned to Electronics and Telecommunications Research Institute. Invention is credited to Gunn Hwang, Seok-Hwan Moon.
Application Number | 20100059212 12/517344 |
Document ID | / |
Family ID | 38738200 |
Filed Date | 2010-03-11 |
United States Patent
Application |
20100059212 |
Kind Code |
A1 |
Moon; Seok-Hwan ; et
al. |
March 11, 2010 |
HEAT CONTROL DEVICE AND METHOD OF MANUFACTURING THE SAME
Abstract
Provided are a heat control device and a method of manufacturing
a heat control device. The method of manufacturing a heat control
device having an envelope used as a path of a working fluid that
absorbs/dissipates heat by a latent heat transfer and a groove
formed in an inner wall of the envelope and generating a capillary
force moving the working fluid, wherein the method includes:
providing first and second templates each including a protruding
portion having a shape corresponding to the groove; forming first
and second deposition films by depositing metal on the first and
second templates; stacking first and second metal plates
respectively on the first and second deposition films; burning out
the first and second templates from the first and second metal
plates; and forming the envelope by combining the first and second
metal plates.
Inventors: |
Moon; Seok-Hwan;
(Daejeon-city, KR) ; Hwang; Gunn; (Seoul,
KR) |
Correspondence
Address: |
AMPACC Law Group
3500 188th Street S.W., SUITE 103
Lynnwood
WA
98037
US
|
Assignee: |
Electronics and Telecommunications
Research Institute
Daejeon-city
KR
|
Family ID: |
38738200 |
Appl. No.: |
12/517344 |
Filed: |
October 31, 2007 |
PCT Filed: |
October 31, 2007 |
PCT NO: |
PCT/KR2007/005459 |
371 Date: |
June 2, 2009 |
Current U.S.
Class: |
165/133 ;
29/890.03 |
Current CPC
Class: |
F28D 15/0233 20130101;
H01L 23/427 20130101; B23P 2700/09 20130101; Y10T 29/4935 20150115;
H01L 2924/0002 20130101; H01L 2924/0002 20130101; F28D 15/046
20130101; H01L 2924/00 20130101 |
Class at
Publication: |
165/133 ;
29/890.03 |
International
Class: |
F28F 13/00 20060101
F28F013/00; B21D 53/02 20060101 B21D053/02 |
Foreign Application Data
Date |
Code |
Application Number |
Dec 7, 2006 |
KR |
10-2006-0124119 |
Claims
1. A method of manufacturing a heat control device having an
envelope used as a path of a working fluid that absorbs/dissipates
heat by a latent heat transfer and a groove formed in an inner wall
of the envelope and generating a capillary force moving the working
fluid, the method comprising: providing first and second templates
each including a protruding portion having a shape corresponding to
the groove; forming first and second deposition films by depositing
metal on the first and second templates; stacking first and second
metal plates respectively on the first and second deposition films;
burning out the first and second templates from the first and
second metal plates; and forming the envelope by combining the
first and second metal plates.
2. The method of claim 1, wherein, in the providing of the first
and second templates each including a protruding portion having a
shape corresponding to the groove, each of the first and second
templates is provided using a mold having a concave portion
corresponding to the protruding portion.
3. The method of claim 2, wherein the first and second templates
are formed of a polymer.
4. The method of claim 3, wherein the polymer includes at least
polymethly methacrylate (PMMA).
5. The method of claim 2, wherein, in the stacking of the first and
second metal plates respectively on the first and second deposition
films, the first and second metal plates are respectively stacked
by plating a metal forming the envelope on the first and second
deposition films.
6. A method of manufacturing a heat control device having an
envelope used as a path of a working fluid that absorbs/dissipates
heat by a latent heat transfer and a groove formed in an inner wall
of the envelope and generating a capillary force moving the working
fluid, the method comprising: providing an integrated single
template including a protruding portion having a shape
corresponding to the groove; forming a deposition film by
depositing metal on the integrated single template; stacking an
integrated single metal plate surrounding the deposition film; and
burning out the integrated single template from the integrated
single metal plate.
7. The method of claim 6, wherein, in the providing of the
integrated single template including a protruding portion having a
shape corresponding to the groove, each of the first and second
templates is provided using a mold having a concave portion
corresponding to the protruding portion.
8. The method of claim 7, wherein the integrated single template is
formed of a polymer.
9. The method of claim 8, wherein the polymer includes at least
polymethly methacrylate (PMMA).
10. The method of claim 7, wherein, in the stacking of the
integrated single metal plate surrounding the deposition film, the
integrated single metal plate is stacked by plating a metal forming
the envelope on the deposition film.
11. A method of manufacturing a heat control device having an
envelope used as a path of a working fluid that absorbs/dissipates
heat by a latent heat transfer and a groove formed in an inner wall
of the envelope and generating a capillary force moving the working
fluid, the method comprising: providing a pair of reinforcement
templates, each having a reinforcement film at one side and a
groove formed at the other side; pairing the reinforcement
templates to contact each other; and forming the envelope by
stacking an integrated single metal plate on a pair of the
reinforcement templates.
12. The method of claim 11, wherein, in the providing a pair of
reinforcement templates, each of the reinforcement templates is
provided using a mold having a protruding portion having a shape
corresponding to the groove.
13. The method of claim 12, wherein the reinforcement template is
formed by stacking a polymer on the reinforcement films.
14. The method of claim 13, wherein the polymer includes at least
polymethly methacrylate (PMMA).
15. The method of claim 12, wherein, in the forming of the envelope
by stacking an integrated single metal plate on a pair of the
reinforcement templates, the integrated single metal plate is
stacked by plating a metal forming the envelope on the
reinforcement film.
16. A heat control device comprising: an envelope used as a path of
a working fluid that absorbs/dissipates heat by a latent heat
transfer; and a groove formed in an inner wall of the envelope and
generating a capillary force moving the working fluid, wherein the
groove or a protruding portion having a shape corresponding to the
groove is formed on a template formed of a polymer, a metal
deposition film is deposited on the template, metal forming the
envelope is stacked on the deposition film and the template is
burned out, thus forming the envelope.
Description
TECHNICAL FIELD
[0001] The present invention relates to a heat control device and a
method of manufacturing the same, and more particularly, to a heat
control device which controls heat generated by an electronic
device using the latent heat of a working fluid, and a method of
manufacturing the same.
BACKGROUND ART
[0002] As the performance of personal computers and the integration
of semiconductor increases, heat generated by electronic parts such
as CPUs significantly increases. Also, as cutting edge processing
technology used for computer CPUs gradually finds it way into other
electronic products, the dissipation of heat becomes an important
matter to solve in a variety of electronic devices. Typically, for
mobile phones which require compact designs more than notebook PCs,
the heat problem would be more serious if the performance of mobile
phones develops at the present speed.
[0003] Mobile phone technology is mainly being developed in the
area of data services such as color displays, multimedia, VOD
(video on demand), video phone, and mobile games. Accordingly, the
amount of processes performed in a system considerably increases.
Also, it is expected that the amount of heat generated by such
systems continue to increase. Considering the stability of mobile
phones, heat dissipation technology for such systems needs to be
developed. In addition, since portability is regarded important
specially for mobile phones, technology for miniaturization is
important together as is technology for lightness.
[0004] To efficiently process heat generated in the above-described
environment, the development of a heat control device that is
particularly thin and exhibits superior heat transfer
characteristics is needed. Typically, a heat generation portion of
an electronic device is in the form of a hot spot having a
relatively small area. For the heat control of an electronic device
having an insufficient packaging space, the problem of the hot spot
has been solved using a substance having a low conductive heat
resistance. Alternatively, there has been a solution of attaching a
heat transfer device such as a heat sink or a Peltier effect device
for heat dissipation. However, these solutions have problems in
that an installation space over a certain area is needed or
operation power needs to be supplied. Thus, it is essential to
develop a heat control device that has a superior heat control
characteristic, that does not need a power supply and that is small
and thin, to cope with the light and compact packaging trend.
[0005] A heat control device using the latent heat property of a
working fluid is a typical example of a compact heat control
device. Heat transfer devices or heat dissipation devices by a
latent heat transfer effectively transfer heat without power when
there is a small temperature difference using the evaporation
pressure of a working fluid. FIG. 1 explains the operating
principle of a heat control device using a latent heat method.
Referring to FIG. 1, an envelope 90 made of metal and used as a
path for a working fluid 40 and 50 is filled with the working fluid
40 and 50. Heat is absorbed as the working fluid 40 and 50 are
vaporized at a vaporization unit 10 adjacent to a heat source of an
electronic device. The working fluid 40 that is vaporized is
concentrated at a concentration unit 30 and dissipates the heat
while passing through a transfer unit 20. The working fluid 50 that
is liquidized at the concentration unit 30 moves toward the
vaporization unit 10 by a capillary force. To generate the
capillary force, a wick (not shown) or a groove (not shown) is
provided in the envelope 90.
DISCLOSURE OF INVENTION
Technical Problem
[0006] However, as the thickness and size of electronic devices
decrease, the envelope, wick, and groove are formed to have a micro
structure. Thus, a new method is needed by which an envelope, wick,
and groove having a micro structure can be manufactured with high
precision. For example, there may be a method of forming a groove
having a fine structure by etching silicon or glass. However, a new
heat control device which is simpler and economical, and a method
of manufacturing the same, are needed.
Technical Solution
[0007] To solve the above and/or other problems, the present
invention provides a heat control device which has a simple
structure, can be simply manufactured, can be formed into a variety
of shapes, can form an envelope, a wick, and a groove, each having
a micro structure, can be easily installed in a limited space, and
can improve the performance of heat unification and the dissipation
of heat using the latent heat of a working fluid, and a method of
manufacturing the heat control device.
[0008] According to an aspect of the present invention, there is
provided a method of manufacturing a heat control device having an
envelope used as a path of a working fluid that absorbs/dissipates
heat by a latent heat transfer and a groove formed in an inner wall
of the envelope and generating a capillary force moving the working
fluid, wherein the method includes: providing first and second
templates each including a protruding portion having a shape
corresponding to the groove; forming first and second deposition
films by depositing metal on the first and second templates;
stacking first and second metal plates respectively on the first
and second deposition films; burning out the first and second
templates from the first and second metal plates; and forming the
envelope by combining the first and second metal plates.
[0009] In the providing of the first and second templates each
including a protruding portion having a shape corresponding to the
groove, each of the first and second templates may be provided
using a mold having a concave portion corresponding to the
protruding portion. The first and second templates may be formed of
a polymer. The polymer may include at least polymethly methacrylate
(PMMA). In the stacking of the first and second metal plates
respectively on the first and second deposition films, the first
and second metal plates may be respectively stacked by plating a
metal forming the envelope on the first and second deposition
films.
[0010] According to another aspect of the present invention, there
is provided a method of manufacturing a heat control device having
an envelope used as a path of a working fluid that
absorbs/dissipates heat by a latent heat transfer and a groove
formed in an inner wall of the envelope and generating a capillary
force moving the working fluid, wherein the method includes:
providing an integrated single template including a protruding
portion having a shape corresponding to the groove; forming a
deposition film by depositing metal on the integrated single
template; stacking an integrated single metal plate surrounding the
deposition film; and burning out the integrated single template
from the integrated single metal plate.
[0011] In the providing of the integrated single template including
a protruding portion having a shape corresponding to the groove,
each of the first and second templates may be provided using a mold
having a concave portion corresponding to the protruding
portion.
[0012] The integrated single template may be formed of a polymer.
The polymer may include at least polymethly methacrylate (PMMA). In
the stacking of the integrated single metal plate surrounding the
deposition film, the integrated single metal plate may be stacked
by plating a metal forming the envelope on the deposition film.
[0013] According to another aspect of the present invention, there
is provided a method of manufacturing a heat control device having
an envelope used as a path of a working fluid that
absorbs/dissipates heat by a latent heat transfer and a groove
formed in an inner wall of the envelope and generating a capillary
force moving the working fluid, wherein the method may include:
providing a pair of reinforcement templates, each having a
reinforcement film at one side and a groove formed at the other
side; pairing the reinforcement templates to contact each other;
and forming the envelope by stacking an integrated single metal
plate on a pair of the reinforcement templates.
[0014] In the providing a pair of reinforcement templates, each of
the reinforcement templates may be provided using a mold having a
protruding portion having a shape corresponding to the groove.
[0015] The reinforcement template may be formed by stacking a
polymer on the reinforcement films. The polymer may include at
least polymethly methacrylate (PMMA). In the forming of the
envelope by stacking an integrated single metal plate on a pair of
the reinforcement templates, the integrated single metal plate may
be stacked by plating a metal forming the envelope on the
reinforcement film.
[0016] According to another aspect of the present invention, there
is provided a heat control device including: an envelope used as a
path of a working fluid that absorbs/dissipates heat by a latent
heat transfer; and a groove formed in an inner wall of the envelope
and generating a capillary force moving the working fluid, wherein
the groove or a protruding portion having a shape corresponding to
the groove is formed on a template formed of a polymer, a metal
deposition film is deposited on the template, metal forming the
envelope is stacked on the deposition film and the template is
burned out, thus forming the envelope.
Advantageous Effects
[0017] The heat control device and a method of manufacturing the
heat control device are to form a groove having a fine structure
capable of generating a superior capillary force. A template formed
of a polymer having a superior molding characteristic is processed
using a mold so that a groove or a protruding portion relief-type
groove can be easily processed. The groove shape formed on the
template can be transferred to the metal plate with high precision
in a simple plating process. The envelope can be finally formed by
a simple process of burning out the template.
BRIEF DESCRIPTION OF THE DRAWINGS
[0018] The above and other features and advantages of the present
invention will become more apparent by describing in detail
preferred embodiments thereof with reference to the attached
drawings in which:
[0019] FIG. 1 illustrates the operating principle of a general heat
control device;
[0020] FIG. 2 is a perspective view of a heat control device
according to an embodiment of the present invention;
[0021] FIGS. 3A through 3E illustrate a method of manufacturing a
heat control device according to an embodiment of the present
invention;
[0022] FIGS. 4A through 4D illustrate a method of manufacturing a
heat control device according to another embodiment of the present
invention step by step; and
[0023] FIGS. 5A through 5D illustrate a method of manufacturing a
heat control device according to yet another embodiment of the
present invention step by step.
MODE FOR THE INVENTION
[0024] The attached drawings for illustrating preferred embodiments
of the present invention are referred to in order to gain a
sufficient understanding of the present invention, the merits
thereof, and the objectives accomplished by the implementation of
the present invention. Hereinafter, the present invention will be
described in detail by explaining preferred embodiments of the
invention with reference to the attached drawings. Like reference
numerals in the drawings denote like elements.
[0025] FIG. 2 is a perspective view of a heat control device
according to an embodiment of the present invention. In FIG. 2, a
groove 301 is formed in an inner wall 401 of an envelope 400. The
envelope 400 is filled with a working fluid and heat is
absorbed/dissipated by a latent heat transfer. The working fluid,
which is liquidized as it dissipates heat, is moved along the
groove 301 by a capillary force so as to cool down an electronic
device which needs cooling.
[0026] FIGS. 3A through 3E illustrate a method of manufacturing a
heat control device according to an embodiment of the present
invention step by step. According to the present method, a
protruding portion 201 is formed by pressing a first template 200a
using a mold 100. A first deposition film 202a is deposited on the
first template 200a to provide suitable conditions for coating the
first template 200a with a metal. Metal forming the envelope 400 is
plated on the first deposition film 202a to a desired thickness to
stack a first metal plate 300a. The inner wall 401 of the envelope
400 is exposed by applying heat to the first metal plate 300a to
burn out the first template 200a.
[0027] Likewise, a second template 200b is formed using the mold
100 and a second deposition film 202b is deposited on the second
template 200b to provide suitable conditions for coating the second
template 200b with a metal. Metal forming the envelope 400 is
plated on the second deposition film 202b to a desired thickness to
stack a second metal plate 300b. The inner wall 401 of the envelope
400 is exposed by applying heat to the second metal plate 300b to
burn out the second template 200b.
[0028] The first metal plate 300a forms one surface of the envelope
400 while the second metal plate 300b forms the other surface of
the envelope 400. When the first and second metal plates 300a and
300b where the groove 301 is formed are combined at a combination
portion 303, the envelope 400 is completed. The present embodiment
in which the first and second templates 200a and 200b are formed
using the mold 100, may be more advantageous and simpler than
forming a micro structure using an etching process using a
photolithography process. The first and second templates 200a and
200b are formed of polymer in a manner which facilitates molding of
the protruding portion 201 and burning out. In one possible
embodiment, the polymer preferably includes at least polymethly
methacrylate (PMMA).
[0029] Referring to FIG. 3A, the mold 100, which has a concave
portion 101 corresponding to the protruding portion 201, is used to
provide the protruding portion 201 having a shape corresponding to
the groove 301. The first template 200a initially having a flat
panel shape is pressed by the mold 100. As shown in FIG. 3B, the
first deposition film 202a is formed by depositing metal on the
surface of the first template 200a. As shown in FIG. 3C, the first
metal plate 300a is stacked by plating a metal forming the envelope
400 on the surface of the first template 200a. Although it is
preferable that the metal forming the first deposition film 202a
and the first metal plate 300a is the same, different types of
metal can be used. The first metal plate 300a is put into an
electric furnace and heated to remove the first template 200a
formed of a polymer substance.
[0030] Next, by repeating the steps of FIGS. 3A through 3C, the
second metal plate 300b is stacked and the second template 200b is
burned out. When the first and second metal plates 300a and 300b
are welded to each other at the combination portion 303, the
envelope 400 of FIG. 3E is completed. When the inner wall of the
envelope 400 is rinsed and made vacuous and then sealed by filling
the envelope 400 with working fluid, a micro heat control device
which can be used as a heat transfer or heat dissipation device is
obtained. In the heat control device according to the present
embodiment, the shape of the section of the envelope is not limited
to the above-described shape and an envelope having a polygonal or
circular section can be manufactured. Also, the size of the
envelope is not limited.
[0031] FIGS. 4A through 4D illustrate a method of manufacturing a
heat control device according to another embodiment of the present
invention step by step. Referring to FIGS. 4A through 4D, an
integrated single template 200c is formed using a pair of molds
100a and 100b. Suitable conditions for coating the integrated
single template 200c with a metal are set by depositing the
deposition film 202c on the integrated single template 200c. Then,
metal forming the envelope 400 is plated on the deposition film
202c to a desired thickness to stack an integrated single metal
plate 300c. When the integrated single template 200c is burned out
by applying heat to the integrated single metal plate 300c, the
inner wall 401 of the envelope 400 is exposed.
[0032] When the integrated single template 200c is formed using the
molds 100a and 100b, the micro structure can be formed more simply
than by an etching process using a photolithography process. Also,
process precision can be improved and the number of steps can be
reduced. The integrated single template 200c is formed of a polymer
in a manner which facilitates molding of the protruding portion 201
and burning out. The polymer preferably includes at least
polymethly methacrylate (PMMA).
[0033] Referring to FIG. 4A, the integrated single template 200c,
which initially has a flat panel shape, is pressed using the molds
100a and 100b having a concave portion 101 to produce the
protruding portion 201 having a shape corresponding to the groove
301. The deposition film 202c is formed by depositing the metal on
the surface of the integrated single template 200c as shown in FIG.
4B. The integrated single metal plate 300c is stacked by plating
the metal forming the envelope 400 on the surface of the deposition
film 202c as shown in FIG. 4C. When the integrated single template
200c formed of a polymer is removed by putting the integrated
single metal plate 300c in an electric furnace and heating the
same, the integral envelope 400 of FIG. 4D is completed. When the
inner wall of the envelope 400 is rinsed and made vacuous and
sealed by filling the envelope 400 with the working fluid, a micro
thermal control device which can be used as a heat transfer or heat
dissipation device is obtained. According to another embodiment, as
the molds 100a and 100b are simultaneously used to mold the
envelope 400, the envelope 400 can be integrally manufactured
without a seam. Also, a separate welding process to combine a pair
of metal plates is not needed.
[0034] According to FIGS. 3A through 4D, the heat control device
manufactured according to the present embodiment includes the
envelope 400 and the groove 301 included in the envelope 400. The
templates 200a, 200b, and 200c, the deposition films 202a, 202b,
and 202c, and the metal plates 300a, 300b, and 300c are
sequentially manufactured and these are used for molding the
envelope 400 and the groove 301. That is, the protruding portion
201 is formed on each of the templates 200a, 200b, and 200c formed
of a polymer and the deposition films 202a, 202b, and 202c are
formed thereon. The metal plates 300a, 300b, and 300c forming the
envelope 400 are plated and the templates 200a, 200b, and 200c are
burned out so that the envelope 400 and the groove 301 are
formed.
[0035] FIGS. 5A through 5D illustrate a method of manufacturing a
heat control device according to yet another embodiment of the
present invention step by step. The heat control device according
to the present embodiment, which initially has a flat panel shape,
needs a pair of reinforcement templates 200d and 200e, each having
a reinforcement film 203 formed of metal at one side and an
exposure area, at the opposite side to the reinforcement film 203
where the groove 301 is to be formed. The groove 301 is directly
formed using the mold 100 in the reinforcement templates 200d and
200e. The integrated single metal plate 300c is stacked by
performing metal plating after making the sides of the
reinforcement templates 200d and 200e where the groove 301 is
formed face each other. The reinforcement templates 200d and 200e
are not burned out and the groove 301 and the inner wall 401 of the
envelope 400 are formed without burning out. Although the
reinforcement templates 200d and 200e are not combined by a welding
process, they are combined by the integrated single metal plate
300c. Since the groove 301 is not formed by the integrated single
metal plate 300c, the integrated single metal plate 300c can be
stacked to a very thin thickness.
[0036] The reinforcement templates 200d and 200e are preferably
formed of a polymer to facilitate the molding of the groove 301. In
one possible embodiment, the polymer preferably includes at least
polymethyl methacrylate (PMMA). When the groove 301 is formed using
the mold 100, a micro structure can be formed more simply than by
an etching process using a photolithography process, which is an
advantage of the present invention.
[0037] Referring to FIG. 5A, the reinforcement templates 200d and
200e are formed using the mold 100 having the protruding portion
201 having a shape corresponding to the groove 301. As shown in
FIGS. 5B and 5C, the reinforcement templates 200d and 200e are
assembled to face each other and can be simply assembled using an
adhesive. As shown in FIG. 5D, the envelope 400 is completed by
stacking the metal plate 300c by plating the reinforcement
templates 200d and 200e. When the inner wall of the envelope 400 is
rinsed and made vacuous and then sealed by filling the envelope 400
with the working fluid, a micro heat control device which can be
used as a heat transfer or heat dissipation device is obtained.
According to the present embodiment, since the integrated single
metal plate 300c is stacked on the reinforcement film 203 that is
already provided, an additional welding process or a deposition
film for plating is not needed and the reinforcement templates 200d
and 200e do not need to be removed.
[0038] As described above, according to the heat control device
according to the present invention and a method of manufacturing
the heat control device, to form a groove having a fine structure
capable of generating a superior capillary force, a template formed
of a polymer having a superior molding characteristic is processed
using a mold so that a groove or a protruding portion relief-type
groove can be easily processed. The groove shape formed on the
template can be transferred to the metal plate with high precision
in a simple plating process. The envelope can be finally formed by
a simple process of burning out the template.
[0039] While this invention has been particularly shown and
described with reference to preferred embodiments thereof, it will
be understood by those skilled in the art that various changes in
form and details may be made therein without departing from the
spirit and scope of the invention as defined by the appended
claims. For example, when a layer exists on another layer, the
layer can contact directly a substrate or the other layer or a
third layer may exist between the two layers.
INDUSTRIAL APPLICABILITY
[0040] The present invention provides a heat control device and a
method of manufacturing the same. The present invention provides a
heat control device which controls heat generated by an electronic
device using the latent heat of a working fluid, and a method of
manufacturing the same.
* * * * *