U.S. patent application number 12/399030 was filed with the patent office on 2010-03-11 for heat dissipation device.
This patent application is currently assigned to HONG FU JIN PRECISION INDUSTRY (ShenZhen) CO., LTD. Invention is credited to Ching-Hung Chu, Chang-Mu Li.
Application Number | 20100059203 12/399030 |
Document ID | / |
Family ID | 41798200 |
Filed Date | 2010-03-11 |
United States Patent
Application |
20100059203 |
Kind Code |
A1 |
Chu; Ching-Hung ; et
al. |
March 11, 2010 |
HEAT DISSIPATION DEVICE
Abstract
A heat dissipation device for an electronic component includes a
heat sink thermally contacting the electronic component and a label
member fixed on the heat sink for providing information. The heat
sink includes a base and a plurality of fins extending upwardly
from a top surface of the base. Two engaging portions protrude from
two spaced fins, towards each other. Two flanges angle outwardly
from two opposite lateral sides of the label member and clasp the
two engaging portions of the heat sink, respectively.
Inventors: |
Chu; Ching-Hung; (Tu-Cheng,
TW) ; Li; Chang-Mu; (Shenzhen City, CN) |
Correspondence
Address: |
PCE INDUSTRY, INC.;ATT. Steven Reiss
288 SOUTH MAYO AVENUE
CITY OF INDUSTRY
CA
91789
US
|
Assignee: |
HONG FU JIN PRECISION INDUSTRY
(ShenZhen) CO., LTD
Shenzhen City
CN
HON HAI PRECISION INDUSTRY CO., LTD.
Tu-Cheng
TW
|
Family ID: |
41798200 |
Appl. No.: |
12/399030 |
Filed: |
March 6, 2009 |
Current U.S.
Class: |
165/80.3 |
Current CPC
Class: |
H01L 2924/0002 20130101;
H01L 2924/0002 20130101; H01L 23/4093 20130101; G06F 1/20 20130101;
H01L 23/3672 20130101; H01L 2924/00 20130101 |
Class at
Publication: |
165/80.3 |
International
Class: |
F28F 13/00 20060101
F28F013/00 |
Foreign Application Data
Date |
Code |
Application Number |
Sep 11, 2008 |
CN |
200810304472.0 |
Claims
1. A heat dissipation device comprising: a heat sink comprising a
base and a plurality of fins extending upwardly from a top surface
of the base, and two engaging portions protruding from two fins,
respectively, and towards each other; and an elongated label member
fixed on the fins of the heat sink, two flanges angling outwardly
from two opposite lateral sides of the label member and clasping
the two engaging portions of the heat sink, respectively.
2. The heat dissipation device as claimed in claim 1, wherein the
fins comprise a plurality of first fins divided into two parts
located at two opposite lateral sides of the base, respectively,
and a plurality of second fins located at a center of the base and
between the two parts of the first fins.
3. The heat dissipation device as claimed in claim 2, wherein the
two flanges protrude inwardly and horizontally from two inmost
first fins located adjacent to the second fins, respectively.
4. The heat dissipation device as claimed in claim 3, wherein each
of the two flanges protrudes from a top end of each of the two
inmost first fins.
5. The heat dissipation device as claimed in claim 2, wherein
height of the second fins gradually decreases from a middle second
fin to two outmost second fins, whereby top ends of the second fins
cooperatively form a curved surface.
6. The heat dissipation device as claimed in claim 5, wherein the
label member spans the top ends of the second fins.
7. The heat dissipation device as claimed in claim 6, wherein a
bottom surface of the label member is received on the top ends of
the second fins.
8. The heat dissipation device as claimed in claim 1, wherein a
central portion of the label member arches upwardly, such that the
label member presents a curved configuration.
9. The heat dissipation device as claimed in claim 1, wherein the
base of the heat sink is rectangular, and the fins of the heat sink
extend along a width of the base.
10. The heat dissipation device as claimed in claim 1, wherein
characters and images are formed on the label member by stamping,
etching or carving.
11. The heat dissipation device as claimed in claim 1, wherein each
of the engaging portions has a top inclined guide face and a bottom
engaging face, and the flanges of the label member clasp the bottom
engaging faces of the engaging portions.
12. A heat dissipation device comprising: a heat sink comprising a
base and a plurality of fins extending upwardly from a top surface
of the base, the fins comprising two spaced first fins and a
plurality of second fins located between the two first fins, two
elongated engaging portions extending from the two first fins,
respectively, and towards each other; and an elongated label member
disposed on the second fins of the heat sink, the two engaging
portions pressing two opposite lateral ends of the label member
downward, respectively.
13. The heat dissipation device as claimed in claim 12, wherein
each of the two engaging portions protrudes from a top end of each
of the two first fins.
14. The heat dissipation device as claimed in claim 12, wherein
each of the engaging portions has an engaging face parallel to the
base, the engaging faces of the engaging portions pressing the two
lateral ends of the label member downward, respectively.
15. The heat dissipation device as claimed in claim 12, wherein the
label member spans top ends of the second fins.
16. The heat dissipation device as claimed in claim 12, wherein top
ends of the second fins cooperatively form a curved surface.
17. The heat dissipation device as claimed in claim 12, wherein the
label member further comprises two flanges angling upwardly from
two opposite lateral sides thereof to clasp the two engaging
portions, respectively.
18. The heat dissipation device as claimed in claim 14, wherein
each of the engaging portions has a top inclined guide face above
the engaging face, and the engaging face is located at a bottom of
the each of the engaging portions.
Description
BACKGROUND OF THE INVENTION
[0001] 1. Field of the Invention
[0002] The present disclosure relates to heat dissipation, and,
more particularly, to a heat dissipation device providing product
information of the heat dissipation device.
[0003] 2. Description of Related Art
[0004] Electronic components, such as central processing units
(CPUs) comprise numerous circuits operating at high speed and
generating substantial heat. Under most circumstances, it is
necessary to cool the CPUs in order to maintain safe operating
conditions and assure that the CPUs function properly and reliably.
In the past, various approaches have been used to cool electronic
components. Typically, a finned metal heat sink is attached to an
outer surface of the CPU to remove the heat therefrom. The heat
absorbed by the heat sink is then dissipated to ambient air. The
related finned metal heat sink is made of highly heat-conductive
metal, such as copper or aluminum, and generally comprises a base
contacting the CPU to absorb the heat therefrom and a plurality of
fins formed on the base for dissipating the heat.
[0005] Conventionally, the heat sink is further provided with an
adhesive label directly attached thereon, adapted for showing
product information, such as product logo, product name, and other
information. However, the adhesive label is prone to accidental
removal in whole or part, with such removal having the potential
for unremoved adhesive to remain, contaminating the heat sink and
environs. In addition, the adhesive label is aesthetically
unpleasing.
[0006] What is needed, therefore, is a heat dissipation device
incorporating a label member which can overcome the described
limitations.
BRIEF DESCRIPTION OF THE DRAWINGS
[0007] Many aspects of the present embodiments can be better
understood with reference to the following drawings. The components
in the drawings are not necessarily drawn to scale, the emphasis
instead being placed upon clearly illustrating the principles of
the present embodiments. Moreover, in the drawings, like reference
numerals designate corresponding parts throughout the several
views.
[0008] FIG. 1 is an assembled, isometric view of a heat dissipation
device in accordance with the disclosure.
[0009] FIG. 2 is an exploded view of the heat dissipation device of
FIG. 1.
DETAILED DESCRIPTION OF THE DISCLOSURE
[0010] Referring to FIG. 1, a heat dissipation device in accordance
with the disclosure is provided to dissipate heat generated by an
electronic component (not shown) mounted on a printed circuit board
(not shown). The heat dissipation device comprises a heat sink 10
thermally contacting the electronic component and a label member 20
securely disposed on the heat sink 10.
[0011] Also referring to FIG. 2, the heat sink 10 is integrally
formed of metal with good heat conductivity, such as aluminum,
copper, or alloys thereof. The heat sink 10 comprises a rectangular
base 12 and a plurality of fins 14 extending upwardly from a top
surface thereof. The fins 14 are spaced from each other and extend
along a width of the base 12. Between each two adjacent fins 14 a
passage (not labeled) therebetween allows airflow therethrough. The
fins 14 comprise a plurality of first fins 141 divided into two
parts located at opposite lateral sides of the base 12,
respectively, and a plurality of second fins 142 at a center of the
base 12 and between the two parts of the first fins 141. Height of
the second fins 142 gradually decreases from a middle second fin
142 to two outmost second fins 142, respectively, whereby top ends
of the second fins 142 cooperatively form a curved surface. Each of
the two outmost second fins 142 is shorter than a corresponding
inmost first fin 141 close to the outmost second fin 142. Two
engaging portions 140 protrude inwardly from top ends of the two
inmost first fins 141, respectively, and towards each other. The
two engaging portions 140 are two hooks each having a top inclined
guide face and a bottom engaging face substantially parallel to the
base 12. Each of the two engaging portions 140 has a triangular
cross-section created by the guide face and the engaging face. The
guide faces of the two engaging portions 140 substantially face
each other. Two mounting portions 16 extend horizontally and
outwardly from two diagonally opposite corners of the base 12,
respectively. Each of the two mounting portions 16 defines a
mounting hole 160 at a center thereof. Two mounting members (not
shown) extend through the two mounting holes 160 and engage the
printed circuit board, such that the heat sink 10 snugly contacts
the electronic component mounted on the printed circuit board.
[0012] The label member 20 is an elongated plaque integrally formed
of resilient metal or other material. A central portion of the
label member 20 arches upwardly, whereby the label member 20 has a
curved configuration. Two elongated flanges 22 angle upwardly from
two opposite lateral sides of the label member 20, respectively. A
span of the label member 20 along a length thereof is approximately
equal to an interval between the two engaging portions 140 of the
heat sink 10.
[0013] In assembly of the heat dissipation device, the two flanges
22 of the label member 20 securely clasp the bottom engaging faces
of the two engaging portions 140 of the heat sink 10, respectively,
by having one of the flanges 22 clasping the bottom engaging face
of one of the engaging portions 140 and the other flange 22 moving
downwardly along the top inclined guide face of the other engaging
portion 140 until the other flange 22 also clasps the bottom
engaging face of the other engaging portion 140. The label member
20 spans the second fins 142 of the heat sink 10, wherein a bottom
surface of the label member 20 is snugly received on the top ends
of the second fins 142. To release the label member 20, a lateral
portion of the label member 20 is depressed until a corresponding
flange 22 located there disengages from a corresponding engaging
portion 140, then moves another flange 22 away from another
engaging portion 140. Thus, the label member 20 can be easily
removed.
[0014] In use, characters or images are formed on the label member
20 by stamping, etching or carving or other means, showing product
information such as logo, product name or product ID, or other
information.
[0015] It is believed that the disclosure and its advantages will
be understood from the foregoing description, and it will be
apparent that various changes may be made thereto without departing
from the spirit and scope of the invention or sacrificing all of
its material advantages, the examples hereinbefore described merely
being exemplary or exemplary embodiments of the invention.
* * * * *