U.S. patent application number 12/326938 was filed with the patent office on 2010-03-04 for polishing pad.
Invention is credited to Shao-Yu Chen, Allen CHIU, Yu-Lung Jeng.
Application Number | 20100056031 12/326938 |
Document ID | / |
Family ID | 41726160 |
Filed Date | 2010-03-04 |
United States Patent
Application |
20100056031 |
Kind Code |
A1 |
CHIU; Allen ; et
al. |
March 4, 2010 |
Polishing Pad
Abstract
The present invention provides a polishing pad, and is more
particularly related to a polishing pad, the width of groove bottom
of polishing surface of which is 0 mm. The polishing pad includes a
polishing surface on which comprises a plurality of grooves,
wherein each groove includes a groove opening and a groove bottom,
the characteristic of which being that the width of groove bottom
of polishing surface is 0 mm. Therefore, when the polishing step is
performed, it is not easy for polishing particles suspended in the
slurry to deposit on the groove bottom and the deposits can be
prevented from scratching the concerned work piece to avoid damage
of work piece.
Inventors: |
CHIU; Allen; (Lung-Tan
Hsiang, TW) ; Chen; Shao-Yu; (Lung-Tan Hsiang,
TW) ; Jeng; Yu-Lung; (Lung-Tan Hsiang, TW) |
Correspondence
Address: |
SINORICA, LLC
2275 Research Blvd., Suite 500
ROCKVILLE
MD
20850
US
|
Family ID: |
41726160 |
Appl. No.: |
12/326938 |
Filed: |
December 3, 2008 |
Current U.S.
Class: |
451/527 |
Current CPC
Class: |
B24B 37/26 20130101 |
Class at
Publication: |
451/527 |
International
Class: |
B24D 11/00 20060101
B24D011/00 |
Foreign Application Data
Date |
Code |
Application Number |
Aug 29, 2008 |
TW |
097215520 |
Claims
1. A polishing pad, said polishing pad including a polishing
surface, said polishing surface comprising a plurality of grooves
on it, wherein said each groove includes a groove opening and a
groove bottom, the characteristic of said polishing pad being in
that width of said groove bottom of said polishing surface is 0
mm.
2. The polishing pad according to claim 1, wherein between said
groove opening and said groove bottom of said polishing pad
comprises at least one section.
3. The polishing pad according to claim 2, wherein said section is
V-shaped.
4. The polishing pad according to claim 2, wherein said section is
U-shaped.
5. The polishing pad according to claim 2, wherein between each
said section comprises a bend to form an included angle.
6. The polishing pad according to claim 2, wherein between said
polishing surface and said section comprises a bend to form an
included angle.
7. The polishing pad according to claim 6, wherein degree of said
included angle is about 90.about.120 degrees.
8. The polishing pad according to claim 2, wherein said section is
a plane surface perpendicular to said groove bottom.
9. The polishing pad according to claim 2, wherein said section is
an inclined plane not perpendicular to said groove bottom.
10. The polishing pad according to claim 2, wherein said section is
an irregular curved surface.
11. The polishing pad according to claim 1, wherein width of said
groove opening and width of said groove bottom of said polishing
pad are different.
12. The polishing pad according to claim 1, wherein said polishing
pad further includes a connecting surface for being connected to
polishing surface of another polishing pad.
Description
BACKGROUND OF THE INVENTION
[0001] 1. Field of the Invention
[0002] The present invention is related to a polishing pad, and
more particularly, to a polishing pad, the width of groove bottom
of polishing surface of which is 0 mm.
[0003] 2. Description of the Prior Art
[0004] Electrical chips are formed by deposition of various
laminate materials, for example, a silicon wafer is one of the
substrates of laminate materials. Whenever a new laminate is
deposited, a polishing or scratching step is often needed for
removing excessive laminate materials to planarize the chip or to
achieve other purposes. Such process of polishing is generally
called chemical mechanical polishing (CMP). Since chips are formed
by deposition of different thin film laminates, the CMP step needs
to be performed for multiple times for evenly removing excessive
laminate materials from the surface of a chip to achieve the
purpose of planarization.
[0005] And usually when the CMP step is performed, chemical slurry
is led in between the chip and the polishing pad for generating
chemical reaction between the deposited thin film laminates and the
chemical slurry or for generating mechanical reaction between the
deposited thin film laminates and the particles in the chemical
slurry to remove part of excessive thin film laminates on the
surface of chip. However, the slurry existing between the polishing
pad and the chip makes it easy for the polishing pad and the chip
to become fully attached to each other, which thus causes
disappearance of the force of friction between the polishing pad
and the chip. Therefore, in order to achieve better polishing
effect with the CMP step, the most common practice at present is to
install groove on the surface of the polishing pad not only for
increasing force of friction between the polishing pad and the chip
but also for ensuring that the slurry is evenly distributed on the
surface of the polishing pad and for letting polishing particles
suspended in the slurry and the scraps to flow out through the
groove.
[0006] However, in the common practice, when groove is installed on
the surface of the polishing pad, there will be near-90-degree
right-angle indentations on the bottom of the groove, as shown in
FIG. 1. Therefore when the CMP step is performed, it is easy for
the polishing particles in the slurry or the scraps produced by the
polishing process to deposit in the corners of indentations without
flowing out. The residual polishing particles or deposits will form
larger particles and lead to scratching or damaging of surface of
the polished object.
SUMMARY OF THE INVENTION
[0007] In order to solve the problems as described above, one
objective of the present invention is to provide a polishing pad,
the width of groove bottom of polishing surface of which is 0 mm to
prevent the concerned work piece from being scratched and thus
damaged by larger particles formed by polishing particles suspended
in the slurry or scraps produced after polishing depositing on the
bottom of groove.
[0008] Another objective of the present invention is to provide a
polishing pad, the design of bottom of groove of polishing surface
of which facilitates the flow of the slurry.
[0009] Still another objective of the present invention is to
provide a polishing pad, the groove of which ensures that the
slurry is evenly distributed on the polishing surface.
[0010] According to the above objectives, the present invention
provides a polishing pad, the width of bottom of groove of
polishing surface of which is 0 mm. The polishing pad includes a
polishing surface on which comprises a plurality of grooves,
wherein each groove includes a groove opening and a groove bottom,
the characteristic of which being that the width of groove bottom
of polishing surface is 0 mm. Therefore, when the polishing step is
performed, it is not easy for polishing particles suspended in the
slurry to deposit on the groove bottom and the deposits can be
prevented from scratching the concerned work piece to avoid damage
of work piece.
[0011] Therefore, with the design of width of groove bottom being 0
mm of the polishing pad provided by the present invention, not only
can the deposition of polishing particles or scraps produced after
polishing on the bottom of groove that may lead to scratching and
damaging of work piece be prevented, but the flow of slurry can
also be facilitated since the design of groove bottom prevents too
much slurry from accumulating in the groove and thus achieves
better polishing effect.
BRIEF DESCRIPTION OF THE DRAWINGS
[0012] The invention as well as a preferred mode of use, further
objectives and advantages thereof will best be understood by
reference to the following detailed description of illustrative
embodiments when read in conjunction with the accompanying
drawings, wherein:
[0013] FIG. 1 is a sectional view of a polishing pad (prior
art);
[0014] FIG. 2 is a front view of a polishing pad;
[0015] FIG. 3A is a sectional view of groove of a polishing
pad;
[0016] FIG. 3B is a sectional view of groove of a polishing
pad;
[0017] FIG. 3C is a sectional view of groove of a polishing pad;
and
[0018] FIG. 3D is a sectional view of groove of a polishing
pad.
DESCRIPTION OF THE PREFERRED EMBODIMENTS
[0019] The present invention discloses a polishing pad, and more
particularly, a polishing pad with the width of groove bottom of
polishing surface of which being 0 mm. In the present invention,
some details for manufacturing or processing polishing pad are
achieved by applying conventional art, and therefore are not
completely depicted in below description. And the drawings referred
to in the following are not made according to the actual related
sizes, the function of which is only to express and illustrate
characteristics of the present invention.
[0020] FIG. 2 is a view of a preferred embodiment of polishing pad
of the present invention. The polishing pad 20 includes a polishing
surface 21 and a plurality of grooves 22 are disposed on the
polishing surface 21, wherein each groove 22 includes a groove
opening 221 and a groove bottom 222, as shown in FIG. 3A taken
along section line a-a' in FIG. 2, the characteristic of which
being that the width of groove bottom 222 of polishing surface 21
is 0 mm.
[0021] FIG. 3A is a view of a preferred embodiment of groove of
polishing pad according to the present invention. Between the
groove opening 221 and the groove bottom 222 of the polishing pad
20 comprises at least one section 223, and the width of groove
opening 221 and the width of groove bottom 222 are different,
wherein between each section 223 comprises a bend to form an
included angle. Thus part of section 223 can be a plane surface
perpendicular to the groove bottom 222, and part of section 223 can
be an inclined plane that is not perpendicular to the groove bottom
222.
[0022] FIG. 3B is a view of another preferred embodiment of groove
of polishing pad according to the present invention. Between the
groove opening 221 and the groove bottom 222 of the polishing pad
20 comprises at least one section 223, and the width of groove
opening 221 and the width of groove bottom 222 are different,
wherein the section 223 is V-shaped and is thus an inclined plane
that is not perpendicular to the groove bottom 222.
[0023] FIG. 3C is a view of still another preferred embodiment of
groove of polishing pad according to the present invention. Between
the groove opening 221 and the groove bottom 222 of the polishing
pad 20 comprises at least one section 223, and the width of groove
opening and the width of groove bottom are different, wherein
between the polishing surface 21 and the section 223 comprises a
bent to form an included angle A1, degree of angle A1 being between
90 to 120 degrees.
[0024] FIG. 3D is a view of yet another preferred embodiment of
groove of polishing pad according to the present invention. Between
the groove opening 221 and the groove bottom 222 of the polishing
pad 20 comprises at least one section 223, and the width of groove
opening and the width of groove bottom are different, wherein the
section 223 is U-shaped and the curved groove bottom thus
facilitates the flow of slurry.
[0025] The present invention further provides still another
preferred embodiment of groove of a polishing pad. Between the
groove opening and the groove bottom of the polishing pad comprises
at least one section, and the width of groove opening 221 and the
width of groove bottom 222 are different, wherein the section is an
irregular curved surface.
[0026] The aforementioned polishing pad can further include a
connecting surface for being connected to a polishing surface of
another polishing pad to form a two-layer polishing pad.
[0027] With the design of width of groove bottom of the polishing
pad provided by the present invention being 0 mm, not only can the
polishing particles or scraps produced after polishing be prevented
from depositing on the groove bottom and thus leading to scrap and
damage of work piece by the deposits, but the design of groove
bottom also facilitates the flow of slurry so that excessive amount
of slurry will not accumulate in the groove and better polishing
effect can be achieved.
[0028] What are described above are only preferred embodiments of
the present invention and are not for limiting the scope of the
present invention; and the above description can be understood and
put into practice by those who are skilled in the art. Therefore
any equivalent modifications and arrangements made without
departing from the spirit disclosed by the present invention should
be encompassed by the appended claims accorded with the broadest
interpretation.
* * * * *