U.S. patent application number 12/222676 was filed with the patent office on 2010-02-18 for thermal conducting principle and device for prestressed clamping type multi-layered structure.
Invention is credited to Tai-Her Yang.
Application Number | 20100038065 12/222676 |
Document ID | / |
Family ID | 41680466 |
Filed Date | 2010-02-18 |
United States Patent
Application |
20100038065 |
Kind Code |
A1 |
Yang; Tai-Her |
February 18, 2010 |
Thermal conducting principle and device for prestressed clamping
type multi-layered structure
Abstract
The present invention discloses that the relay thermal conductor
being made of material having better thermal conductivity
coefficient is heat transfer coupled with the heating or cooling
first thermal body at one end or face thereof, and is coupled with
interface thermal conductor having higher specific heat capacity at
the other end or face thereof, wherein the interface thermal
conductor having higher specific heat capacity is the heat transfer
carrier between relay thermal conductor and second thermal
body.
Inventors: |
Yang; Tai-Her; (Dzan-Hwa,
TW) |
Correspondence
Address: |
BACON & THOMAS, PLLC
625 SLATERS LANE, FOURTH FLOOR
ALEXANDRIA
VA
22314-1176
US
|
Family ID: |
41680466 |
Appl. No.: |
12/222676 |
Filed: |
August 14, 2008 |
Current U.S.
Class: |
165/185 |
Current CPC
Class: |
H01L 2924/0002 20130101;
H01L 23/367 20130101; H01L 2924/0002 20130101; F28D 15/02 20130101;
H01L 23/4006 20130101; H01L 2023/4056 20130101; F28F 13/00
20130101; F28F 2013/006 20130101; H01L 2924/00 20130101 |
Class at
Publication: |
165/185 |
International
Class: |
F28F 7/00 20060101
F28F007/00 |
Claims
1. A thermal conducting principle and device for
prestressed-clamping type multi-layered structure, wherein the
multi-layered thermal conducting or heat dissipating structure is
made of materials with different thermal characteristics and is
different from the conventional thermal conducting or heat
dissipating structure being made of single material, wherein for
the thermal conducting principle and device for
prestressed-clamping type multi-layered structure of present
invention, the relay thermal conductor being made of material with
better thermal conductivity coefficient is heat conductively
coupled with the heating or cooling first thermal body at one end
or surface thereof, and is coupled with the interface thermal
conductor at the other end or surface thereof, and the interface
thermal conductor having the thermal conducting characteristics
with both or at least one of the 1) higher specific heat capacity
relative to relay thermal conductor, or 2) better thermal
emissivity to second thermal body relative to relay thermal
conductor is used as the heat conducting carrier between relay
thermal conductor and second thermal body, and is favorable for
thermal energy conduction when there is temperature difference
between first thermal body and second thermal body; in addition,
the present invention further discloses that each structure layer
being in prestressed-clamping type combined structure to reduce
volume has the prestressed clearance (500) for producing clamping
or outwardly expanding prestressing force to ensure good thermal
conducting contact and avoid loosening or deformation of the
multi-layer structure material due to different coefficients of
thermal expansion to result in poor thermal conducting surface
unfavorable for thermal conduction.
2. A thermal conducting principle and device for
prestressed-clamping type multi-layered structure as claimed in
claim 1, wherein it mainly comprises: The thermal conducting or
heat dissipating assembled structure (100) being constituted by at
least two layers of thermal conducting material having different
thermal characteristics, wherein the relay thermal conductor (102)
having better thermal conductivity coefficient is coupled with the
first thermal body (101), and the interface thermal conductor (103)
having higher thermal capacity is coupled between the relay thermal
conductor (102) and the second thermal body (104) thereby
constituting the thermal conducting or heat dissipating assembled
structure (100); The thermal conducting or heat dissipating
assembled structure (100) is installed between first thermal body
(101) and second thermal body (104); wherein thermal conducting or
heat dissipating assembled structure (100) is constituted by relay
thermal conductor (102) and interface thermal conductor (103),
wherein The first thermal body (101): It is an active cooling or
heating, or passive heat absorbing or releasing thermal body
constituted by non-closed solid, gaseous, liquid state material or
colloidal or powder type matters; or the thermal body being
constituted by thermal conducting casing at the heat release end or
heat absorbing end of heat pipe; The relay thermal conductor (102):
The relay thermal conductor is constituted by at least one layer of
solid, gaseous, liquid state material or colloidal or powder type
matters having a better thermal conductivity coefficient, wherein
the relay thermal conductor (102) is contact combined with the open
first thermal body (101) at one end or surface thereof, and is
combined with the interface thermal conductor (103) at the other
end or surface thereof for thermal energy conduction includes that
the relay thermal conductor (102) is installed between the first
thermal body (101) being constituted by the thermal conducting
casing at heat release end or heat absorbing end of heat pipe and
the interface thermal conductor (103) for thermal energy
conduction, or the relay thermal conductor (102) in
prestressed-clamping combination is installed between the first
thermal body (101) constituted by thermal conducting casing of
thermal fluid conducting pipe and the interface thermal conductor
(103) for thermal energy conduction; the thermal conductivity
coefficient of the relay thermal conductor and the first thermal
body (101) is better than the one of the interface thermal
conductor (103), i.e. its thermal conducting rate is faster than
the one of interface thermal conductor (103), and the thermal
conduction coupling surface areas of relay thermal conductor (102)
and interface thermal conductor (103) are larger or equal to the
thermal conduction coupling surface area of relay thermal conductor
(102) and first thermal body (101); The interface thermal conductor
(103): It is constituted by at least one layer of solid, gaseous,
liquid state material or colloidal or powder type matters having
the thermal conducting characteristics with both or at least one of
the 1) specific heat capacity, or 2) thermal emissivity to second
thermal body (104), better than the one of the relay thermal
conductor (102), wherein the interface thermal conductor (103)
being installed between the relay thermal conductor (102) and the
second thermal body (104) for thermal energy conduction includes
that the first thermal body (101) being constituted by the thermal
conducting casing at heat release end or heat absorbing end of heat
pipe is installed with the relay thermal conductor (102) in
prestressed-clamping combination, and the interface thermal
conductor (103) is installed between the relay thermal conductor
(102) and the second thermal body (104) for thermal energy
conduction; or the first thermal body (101) being constituted by
the thermal conducting casing of thermal energy fluid piping is
installed with the relay thermal conductor (102), and the interface
thermal conductor (103) is installed between the relay thermal
conductor (102) and the second thermal body (104) for thermal
energy conduction (refer to FIG. 3); the thermal conduction
coupling surface area between the interface thermal conductor (103)
and the second thermal body (104) is larger or equal to the thermal
conduction coupling surface area between the relay thermal
conductor (102) and the interface thermal conductor (103); Each
structure layer is in prestressed-clamping type combined structure
to reduce volume and has a prestressed clearance (500) to produce
clamping or outwardly expanding prestressing force to ensure good
thermal conducting contact, and to avoid loosening or deformation
of the multi-layer structure material due to different coefficients
of thermal expansion to result in poor thermal conducting surface
unfavorable for thermal conduction; The second thermal body (104):
It is the active cooling or heating thermal body or passive heat
absorbing or releasing thermal body constituted by solid, gaseous,
liquid state material or colloidal or powder type matters; For the
thermal conducting principle and device for prestressed-clamping
type multi-layered structure of present invention, geometric shapes
of the thermal conduction coupling surface between first thermal
body (101) and relay thermal conductor (102) as well as the thermal
conduction coupling surface between interface thermal conductor
(103) and second thermal body (104) can be optionally selected as
needed; The heat resistance between first thermal body (101) and
second thermal body (104) is lowered down through said particular
structures.
3. A thermal conducting principle and device for
prestressed-clamping type multi-layered structure as claimed in
claim 1, wherein the relative relationships between first thermal
body (101), relay thermal conductor (102), interface thermal
conductor (103), and second thermal body (104) are the following:
The thermal conducting or heat dissipating assembled structure
(100) is installed between first thermal body (101) and second
thermal body (104); The thermal conducting or heat dissipating
assembled structure (100) comprises the thermal conductor being
constituted by at least two layers of materials with different
thermal characteristics, wherein the relay thermal conductor (102)
having a better thermal conductivity coefficient to first thermal
body (101) relative to interface thermal conductor (103) is coupled
with first thermal body (101), and the interface thermal conductor
(103) is coupled between relay thermal conductor (102) and second
thermal body (104); the interface thermal conductor (103) has the
thermal conducting characteristics with both or one of the 1)
higher specific heat capacity relative to relay thermal conductor
(102), or 2) better thermal emissivity to second thermal body (104)
relative to relay thermal conductor (102); The relay thermal
conductor (102) is made of the material having thermal conductivity
coefficient better than interface thermal conductor (103); The
interface thermal conductor (103) is made of the material having
both or one of thermal conducting characteristic of the specific
heat capacity or the thermal emissivity to second thermal body
(104) better than the one of relay thermal conductor (102); The
thermal conduction coupling surface area of relay thermal conductor
(102) to interface thermal conductor (103) is larger or equal to
the thermal conduction coupling surface area between relay thermal
conductor (102) and first thermal body (101) thereby reducing the
heat resistance; The thermal conduction coupling surface area of
interface thermal conductor (103) to second thermal body (104) is
larger or equal to thermal conduction coupling surface area between
relay thermal conductor (102) and interface thermal conductor (103)
thereby reducing the heat resistance; In above said structures, if
temperature of first thermal body (101) is higher than the one of
second thermal body (104), the thermal energy of first thermal body
(101) is through the smaller area thermal conduction coupling
surface between first thermal body (101) and relay thermal
conductor (102) to externally execute diffusive thermal conduction
to relay thermal conductor (102) having better thermal conductivity
coefficient, thereby by at least one of the following functions to
assist the thermal energy conduction, including that: 1) It is
through the larger area thermal conduction coupling surface between
relay thermal conductor (102) and interface thermal conductor (103)
to diffuse thermal energy to interface thermal conductor (103)
having larger specific heat capacity; or 2) It is further through
the equal or larger area thermal conduction coupling surface of
interface thermal conductor (103) to second thermal body (104) to
release thermal energy; or 3) It is though the characteristic of
better thermal emissivity to release thermal energy to second
thermal body (104); In above said structure, if the temperature of
first thermal body (101) is lower than the one of second thermal
body (104), the thermal energy of second thermal body (104) is
through the larger area thermal conduction coupling surface between
second thermal body (104) and interface thermal conductor (103) to
diffusely conduct to interface thermal conductor (103) having
larger specific heat capacity, and further through the smaller area
thermal conduction coupling surface between interface thermal
conductor (103) and relay thermal conductor (102) to conduct the
thermal energy to relay thermal conductor (102), and further
through the smaller area thermal conduction coupling surface of
relay thermal conductor (102) having better thermal conductivity
coefficient to release thermal energy to first thermal body
(101).
4. A thermal conducting principle and device for
prestressed-clamping type multi-layered structure as claimed in
claim 1, wherein its constitution can be further made to the
following structures including: If at least one of the first
thermal body (101), or relay thermal conductor (102), or interface
thermal conductor (103), or second thermal body (104) is gaseous or
liquid state material or colloidal or powder type matters, they can
be contained in the container structure, wherein the container
structure can be good thermal conductor or non-thermal conductor or
the container can be made of material having better thermal
conductivity coefficient to constitute relay thermal conductor
(102), or the container can be made of material having larger
specific heat capacity to constitute the function of interface
thermal conductor (103).
5. A thermal conducting principle and device for
prestressed-clamping type multi-layered structure as claimed in
claim 1, wherein the thermal conduction coupling and combined
surface between the relay thermal conductor (102) and the interface
thermal conductor (103) can be optionally selected as needed to be
one or more than one combined methods as follows including
concavely and convexly prestressed-clampingly combined, or
prestressed-clampingly dovetailed, or T-slot prestressed-clampingly
combined, or prestressed-clampingly combined by stud/hole
fastening, or concavely and convexly prestressed-clampingly
combined by multi-fins, or prestressed-clampingly combined methods
by other conventional heat conducting surface etc. to enlarge the
conducting area.
6. A thermal conducting principle and device for
prestressed-clamping type multi-layered structure, wherein at least
one layer of thermal conductive interlayer (110) can be installed
between the relay thermal conductor (102) and the interface thermal
conductor (103) to appear multi-layer structure, wherein the
relationships between the additionally installed thermal conductive
interlayer (110), relay thermal conductor (102) and interface
thermal conductor (103) are the following: The specific heat
capacity of thermal conductive interlayer (110) is larger than the
one of relay thermal conductor (102), but is smaller than the one
of interface thermal conductor (103), and if the multi-layered
structure of thermal conductive interlayer (110) is adopted, then
the specific heat capacity of thermal conductive interlayer (110)
is smaller as it is closer to the relay thermal conductor (102),
but still larger than the one of relay thermal conductor (102); The
thermal conductivity coefficient of thermal conductive interlayer
(110) is better than the one of interface thermal conductor (103),
and the thermal conductivity coefficient of relay thermal conductor
(102) is better than the one of thermal conductive interlayer
(110); when multiple layered structure of thermal conductive
interlayer (110) is optionally adopted, wherein thermal
conductivity coefficient of thermal conductive interlayer (110) is
better as it is closer to the relay thermal conductor (102), but is
still less than the one of relay thermal conductor (102); The
thermal conduction coupling surface between relay thermal conductor
(102) and thermal conductive interlayer (110) is larger than the
thermal conduction coupling surface area between the thermal
conductive interlayer (110) and the interface thermal conductor
(103), when multi-layered structure of thermal conductive
interlayer (110) is optionally adopted, the thermal conduction
coupling surface area between the inter-layers are the same or
larger as they are closer to the interface thermal conductor (103);
If there are two or more than two of said thermal conductive
interlayers (110), then selection of the thermal conductivity
coefficient and the specific heat capacity in the thermal
characteristics, and selection of the size of thermal conduction
coupling area at the two sides of thermal conductive interlayer
(110) are based on the structural principle of that thermal
conduction area of each layer being combined from first thermal
body (101) to relay thermal conductor (102), thermal conductive
interlayer (110), interface thermal conductor (103), and to second
thermal body (104) are sequentially the same or increased; Each
structure layer is in prestressed-clamping type combined structure
to reduce volume and has a prestressed clearance (500) to produce
clamping or outwardly expanding prestressing force to ensure good
thermal conducting contact, and to avoid loosening or deformation
of the multi-layer structure material due to different coefficients
of thermal expansion to result in poor thermal conducting surface
unfavorable for thermal conduction.
7. A thermal conducting principle and device for
prestressed-clamping type multi-layered structure as claimed in
claim 6, wherein the thermal conduction coupling and combined
surface between the relay thermal conductor (102) and the thermal
conductive interlayer (110) can be optionally selected as needed to
be one or more than one combined methods as follows including
concavely and convexly prestressed-clampingly combined, or
prestressed-clampingly dovetailed, or T-slot prestressed-clampingly
combined, or prestressed-clampingly combined by stud/hole
fastening, or concavely and convexly prestressed-clampingly
combined by multi-fins, or prestressed-clampingly combined methods
by other conventional heat conducting surface etc. to enlarge the
conducting area.
8. A thermal conducting principle and device for
prestressed-clamping type multi-layered structure as claimed in
claim 6, wherein the thermal conduction coupling and combined
surface between thermal conductive interlayer (110) and interface
thermal conductor (103) can be optionally selected as needed to be
one or more than one combined methods as follows including
concavely and convexly prestressed-clampingly combined, or
prestressed-clampingly dovetailed, or T-slot prestressed-clampingly
combined, or prestressed-clampingly combined by stud/hole
fastening, or concavely and convexly prestressed-clampingly
combined by multi-fins, or prestressed-clampingly combined methods
by other conventional heat conducting surface etc. to enlarge the
conducting area.
9. A thermal conducting principle and device for
prestressed-clamping type multi-layered structure as claimed in
claim 6, wherein if two or more than two layers of thermal
conductive interlayer (110) are installed, the thermal conduction
coupling and combined surface between the at least two layers of
thermal conductive interlayer (110) and thermal conductive
interlayer (110) can be optionally selected as needed to be one or
more than one combined methods as follows including concavely and
convexly prestressed-clampingly combined, or prestressed-clampingly
dovetailed, or T-slot prestressed-clampingly combined, or
prestressed-clampingly combined by stud/hole fastening, or
concavely and convexly prestressed-clampingly combined by
multi-fins, or prestressed-clampingly combined methods by other
conventional heat conducting surface etc. to enlarge the conducting
area.
10. A thermal conducting principle and device for
prestressed-clamping type multi-layered structure as claimed in
claim 2 or 6, wherein the thermal conducting or heat dissipating
assembled structure (100) is constituted by first thermal body
(101), relay thermal conductor (102), interface thermal conductor
(103), second thermal body (104), and/or the thermal conductive
interlayer (110) being optionally installed as needed, wherein if
all or partially neighboring thermal conductors constituting the
thermal conducting or heat dissipating assembled structure (100)
are solid state material, and each structure layer is in
prestressed-clamping type combined structure to reduce volume and
has a prestressed clearance (500) to produce clamping or outwardly
expanding prestressing force to ensure good thermal conducting
contact and to avoid loosening or deformation of the multi-layer
structure material due to different coefficients of thermal
expansion to result in poor thermal conducting surface unfavorable
for thermal conduction, then the combining methods between the two
neighboring thermal conductors include one or more than one of the
following: 1. Lockingly combined by external screws and nuts; or 2.
Mutually threadly combined by spiral post and spiral hole
structure; or 3. Mutually threadly combined by spiral post and
spiral hole structure, and is installed with prestressed clearance
(500) for prestressed-clamping combination; or 4. Rivetingly
fastened; or 5. Pressingly combined; or 6. Clampingly fastened; or
7. Adhesively combined; or 8. Weldingly combined; or 9.
Frictionally fusionly combined; or 10. Neighboring thermal
conductors are castedly combined; or 11. Neighboring thermal
conductors are electroplatedly combined; or 12. The thermal
conducting structure between neighboring thermal conductors and
another thermal conductor are fixedly attachingly combined or
translationally attachingly combined; or 13. Neighboring thermal
conductors are tightly touchingly combined by gravity; or 14.
Neighboring thermal conductors are tightly touchingly combined by
attraction of magnet device; or 15. Neighboring thermal conductors
are combined as an enclosed structure.
11. A thermal conducting principle and device for
prestressed-clamping type multi-layered structure as claimed in
claim 2 or 6, wherein the thermal conduction coupling surface
between first thermal body (101) and relay thermal conductor (102);
or between relay thermal conductor (102) and thermal conductive
interlayer (110) if thermal conductive interlayer (110) is
installed; or between thermal conductive interlayer (110) and
thermal conductive interlayer (110) if multi-layered thermal
conductive interlayer (110) is installed; or between thermal
conductive interlayer (110) and interface thermal conductor (103);
or between relay thermal conductor (102) and interface thermal
conductor (103) if thermal conductive interlayer (110) is not
installed; or between interface thermal conductor (103) and second
thermal body (104) can be combined by one or more than one of the
following methods, and each structure layer of neighboring thermal
conductors is in prestressed-clamping type combined structure to
reduce volume and has a prestressed clearance (500) to produce
clamping or outwardly expanding prestressing force to ensure good
thermal conducting contact, and to avoid loosening or deformation
of the multi-layer structure material due to different coefficients
of thermal expansion to result in poor thermal conducting surface
unfavorable for thermal conduction as well as combined by one or
more than one of the following methods, including: 1. Lockingly
combined by external screws and nuts; or 2. Mutually threadly
combined by spiral post and spiral hole structure; or 3. Mutually
threadly combined by spiral post and spiral hole structure, and is
installed with prestressed clearance (500) for elastic combination;
or 4. Rivetingly fastened; or 5. Pressingly combined; or 6.
Clampingly fastened; or 7. Adhesively combined; or 8. Weldingly
combined; or 9. Frictionally fusionly combined; or 10. Neighboring
thermal conductors are castedly combined; or 11. Neighboring
thermal conductors are electroplatedly combined; or 12. The thermal
conducting structure between neighboring thermal conductors and
another thermal conductor are fixedly attachingly combined or
translationally attachingly combined; or 13. Neighboring thermal
conductors are tightly touchingly combined by gravity; or 14.
Neighboring thermal conductors are tightly touchingly combined by
attraction of magnet device; or 15. Neighboring thermal conductors
are combined as an enclosed structure; If the neighboring thermal
conductor of the solid state thermal conductor is constituted by
gaseous or liquid state material, or colloidal or powder type
matters, then the thermal energy conduction of its thermal
conduction coupling surface includes one or more one methods of the
following: 1. The solid state thermal conductor transfers thermal
energy of neighboring gaseous or liquid state material, or
colloidal or powder type matters via the heat receiving surface
thereof; or 2. The gaseous or liquid state material, or colloidal
or powder type matters of higher temperature is pumped by liquid
pump or fan to randomly contact with the solid state thermal
conductor surface so as to transfer thermal energy to the
neighboring solid state thermal conductor.
12. A thermal conducting principle and device for
prestressed-clamping type multi-layered structure as claimed in
claim 2 or 6, wherein if first thermal body (101) or second thermal
body (104) is a combustion state heat source, then heat conducting
methods between it and neighboring solid state thermal conducting
structure include: the solid state thermal conductor is through its
heat receiving surface to transfer thermal energy to neighboring
combustion type heat generator.
13. A thermal conducting principle and device for
prestressed-clamping type multi-layered structure as claimed in
claim 2 or 6, wherein if first thermal body (101) is made of
gaseous, liquid state material or colloidal or powder type matters,
then its heat conducting methods include: the colloidal or powder
type matters being stirred by the stirring mechanism driven by
manual, electric or machine power is randomly transfer the thermal
energy of colloidal or powder type matters to neighboring solid
state thermal conductors.
14. A thermal conducting principle and device for
prestressed-clamping type multi-layered structure as claimed in
claim 2 or 6, wherein the thermal conducting methods between
interface thermal conductor (103) and second thermal body (104)
include the following: If the second thermal body (104) is a solid
state heat receiver, then the thermal conductive coupling surface
between it and the solid state interface thermal conductor (103)
can be combined by one or more than one of the following methods;
further, each structure layer of the neighboring thermal conductors
is in prestressed-clamping combined structure to reduce volume and
has a prestressed clearance (500) to produce clamping or outwardly
expanding prestressing force to ensure good thermal conducting
contact and to avoid loosening or deformation of the multi-layer
structure material due to different thermal conductivity
coefficients to result in poor thermal conducting surface
unfavorable for thermal conduction as well as combined by one or
more than one of the following methods, including: 1. Lockingly
combined by external screws and nuts; or 2. Mutually threadly
combined by spiral post and spiral hole structure; or 3. Mutually
threadly combined by spiral post and spiral hole structure, and is
installed with prestressed clearance (500) for elastic combination;
or 4. Rivetingly fastened; or 5. Pressingly combined; or 6.
Clampingly fastened; or 7. Adhesively combined; or 8. Weldingly
combined; or 9. Frictionally fusionly combined; or 10. The second
thermal body (104) is castedly combined; or 11. The second thermal
body (104) is electroplatedly combined to interface thermal
conductor (103); or 12. The thermal conducting structure between
second thermal body (104) and interface thermal conductor (103) are
fixedly attachingly combined or translationally attachingly
combined; or 13. Neighboring thermal conductors are tightly
touchingly combined by gravity; or 14. Neighboring thermal
conductors are tightly touchingly combined by attraction of magnet
device; or 15. Neighboring thermal conductors are combined as an
enclosed structure; If second thermal body (104) is gaseous state
material, then thermal conductive coupling method between it and
the solid state interface thermal conductor (103) include one or
more one method of the following: 1. The thermal energy is
transferred by heat receiving surface of solid state interface
thermal conductor (103) to gaseous state second thermal body (104);
or 2. The thermal energy is transferred to gaseous state second
thermal body (104) blown by fans via interface thermal conductor
(103); If second thermal body (104) is liquid state material, then
thermal conductive coupling methods between it and interface
thermal conductor (103) include one or more than one methods of the
following: 1. The interface thermal conductor (103) is immersed in
liquid state second thermal body (104) for thermal energy
conduction by free convection; or 2. The liquid state second
thermal body (104) is conveyed by the pump to pass through the
surface of interface thermal conductor (103) for thermal energy
conduction with interface thermal conductor (103); If second
thermal body (104) is colloidal or powder type matter, then thermal
conductive coupling methods between it and solid state interface
thermal conductor (103) include: the colloidal or powder type
matters being stirred by the stirring mechanism driven by manual,
electric or machine power is randomly passed through interface
thermal conductor (103) to transfer thermal energy.
15. A thermal conducting principle and device for
prestressed-clamping type multi-layered structure as claimed in
claim 2 or 6, wherein one or more than one auxiliary thermal
conducting method can be optionally selected to be installed
between first thermal body (101) and relay thermal conductor (102);
or between relay thermal conductor (102) and interface thermal
conductor (103); or between interface thermal conductor (103) and
second thermal body (104); or between relay thermal conductor (102)
and thermal conductive interlayer (110) if thermal conductive
inter-layer (110) installed, or between thermal conductive
interlayer (110) and thermal conductive interlayer (110) if
multiple layered thermal conductive interlayer (110) is installed;
or between thermal conductive interlayer (110) and interface
thermal conductor (103), including: 1. To be installed with
electrically insulated heat conductive piece; or 2. To be coated
with thermally conductive grease; or 3. To be installed with
electrically insulated thermal conductive piece and coated with
thermally conductive grease.
16. A thermal conducting principle and device for
prestressed-clamping type multi-layered structure as claimed in
claim 2 or 6, wherein it can be applied for various heat absorbing
or dissipating, or cooling thermal conductive application devices,
such as heat absorption and dissipation of various machine casings,
heat pipe structures, structure casings, semiconductor components,
ventilation devices, or the heat absorption, heat dissipation or
thermal energy conduction of information, audio or image devices,
or heat dissipation of various lamp or LED devices, or the heat
absorption or dissipation or thermal energy conduction of air
conditioning devices, electrical machines or engine, or heat
dissipation of thermal energy conduction from frictional heat loss
of the mechanical devices, or heat dissipation or thermal energy
conduction of electric heater or other electric heating home
appliances or cooking devices, or heat absorption or thermal energy
conduction of flame heating stoves or cooking devices, or heat
absorption, heat dissipation or thermal energy conduction of earth
layer or water thermal energy, plant or housing building or
building material or building structure devices, heat absorbing or
dissipation of water tower, or heat absorption, heat dissipation or
thermal energy conduction of batteries of fuel cells, etc; As well
as applied for thermal energy conduction in home appliances,
industrial products, electronic products, electrical machines or
mechanical devices, power generation equipments, buildings, air
conditioning devices, industrial equipments or industrial
manufacturing process.
Description
BACKGROUND OF THE INVENTION
[0001] (a) Field of the invention
[0002] The invention discloses that the relay thermal conductor
with better thermal conductivity coefficient and the interface
thermal conductor having both or at least one of the specific heat
capacity or thermal emissivity better than the relay thermal
conductor are commonly integrated to form a prestressed clamping
thermal conducting or heat dissipating structure having at least
two layers in particular combination type thereby promoting the
thermal conducting effect and avoiding loosening or deformation of
the multi-layer structure material due to different coefficients of
thermal expansion to result in poor thermal conducting surface
unfavorable for thermal conduction.
[0003] (b) Description of the Prior Art
[0004] Except for the cooling or heating interior of heat pipe or
other enclosed space having overall area for thermal conducting
contacts, the cooling or heating source of the first thermal body
of the conventional thermal conducting structure constituted by a
single material is usually limited by the smaller thermally
conducting area of the thermal conducting device, such as that if
the heat source of first thermal body is the thermal energy of the
heat loss in CPU of computer, power semiconductor or light emitting
diode (LED), then if it is coupled with said thermal bodies or heat
dissipating structural bodies for heat dissipating operation, if
the thermal conducting or heat dissipating structure is made of
single material, and even if the thermal conductivity coefficient
of the single material is better, its specific heat capacity is
usually not the best, such as that if the heat dissipater of CPU,
power semiconductor, or light emitting diodes being made of copper
material is heavier and expensive, and although it has a better
thermal conductivity coefficient, its specific heat capacity and
thermal emissivity is lower than aluminum;
[0005] If single material of better specific heat capacity and/or
thermal emissivity with lighter weight and lower price is adopted,
such as the heat dissipater being made of aluminum, though it has a
higher specific heat capacity and thermal emissivity, its thermal
conductivity coefficient is lower than copper material, therefore
the thermal conducting effect for thermal conducting structure made
of single material is more limited and it shall be further
considered to avoid loosening or deformation of the multi-layer
structure material due to different thermal conductivity
coefficients to result in poor thermal conducting surface
unfavorable for thermal conduction.
SUMMARY OF THE INVENTION
[0006] The invention innovatively discloses a thermal conducting
principle and device for prestressed-clamping type multi-layered
structure, wherein the multi-layered thermal conducting or heat
dissipating structure is made of materials with different thermal
characteristics and is different from the conventional thermal
conducting or heat dissipating structure being made of single
material, wherein for the thermal conducting principle and device
for prestressed-clamping type multi-layered structure of present
invention, the relay thermal conductor being made of material with
better thermal conductivity coefficient is heat conductively
coupled with the heating or cooling first thermal body at one end
or surface thereof, and is coupled with the interface thermal
conductor at the other end or surface thereof, and the interface
thermal conductor having the thermal conducting characteristics
with both or at least one of the 1) higher specific heat capacity
relative to relay thermal conductor, or 2) better thermal
emissivity to second thermal body relative to relay thermal
conductor is used as the heat conducting carrier between relay
thermal conductor and second thermal body, and is favorable for
thermal energy conduction when there is temperature difference
between first thermal body and second thermal body; in addition,
the present invention further discloses that each structure layer
being in prestressed-clamping type combined structure to reduce
volume has the prestressed clearance (500) for producing clamping
or outwardly expanding prestressing force to ensure good thermal
conducting contact and avoid loosening or deformation of the
multi-layer structure material due to different coefficients of
thermal expansion to result in poor thermal conducting surface
unfavorable for thermal conduction.
BRIEF DESCRIPTION OF THE DRAWINGS
[0007] FIG. 1 is a structural schematic view of the present
invention showing that the first thermal body being constituted by
the thermal conducting casing at heat release end or heat absorbing
end of heat pipe is prestressed-clampingly combined.
[0008] FIG. 2 is a top schematic view of FIG. 1.
[0009] FIG. 3 is a structural schematic view of the present
invention showing that the thermal conduction coupling and combined
surface between relay thermal conductor (102) and interface thermal
conductor (103) is concavely and convexly prestressed-clampingly
combined.
[0010] FIG. 4 is a structural schematic view of the present
invention showing that the thermal conduction coupling and combined
surface between relay thermal conductor (102) and interface thermal
conductor (103) is prestressed-clampingly combined.
[0011] FIG. 5 is a structural schematic view of the present
invention showing that the thermal conduction coupling and combined
surface between relay thermal conductor (102) and interface thermal
conductor (103) is prestressed-clampingly dovetailed.
[0012] FIG. 6 is a structural schematic view of the present
invention showing that the thermal conduction coupling and combined
surface between relay thermal conductor (102) and interface thermal
conductor (103) is T-slot prestressed-clampingly combined.
[0013] FIG. 7 is a structural schematic view of the present
invention showing that the thermal conduction coupling and combined
surface between relay thermal conductor (102) and interface thermal
conductor (103) is prestressed-clampingly combined by stud/hole
fastening.
[0014] FIG. 8 is a structural schematic view of the present
invention showing that the thermal conduction coupling and combined
surface between relay thermal conductor (102) and interface thermal
conductor (103) is concavely and convexly prestressed-clampingly
combined by multi-fins.
[0015] FIG. 9 is a structural schematic view showing the
prestressed-clamping structure of the present invention which is
installed with thermal conductive interlayer (110), relay thermal
conductor (102) and interface thermal conductor (103), and uses the
thermal conducting casing at heat release or heat absorbing end of
the heat pipe as the first thermal body.
[0016] FIG. 10 is a top view of FIG. 9.
[0017] FIG. 11 is a structural schematic view of the present
invention showing that the thermal conduction coupling and combined
surfaces between thermal conductive interlayer (110) and relay
thermal conductor (102) and interface thermal conductor (103) are
concavely and convexly prestressed-clampingly combined.
[0018] FIG. 12 is a structural schematic view of the present
invention showing that the thermal conduction coupling and combined
surfaces between thermal conductive interlayer (110) and relay
thermal conductor (102) and interface thermal conductor (103) are
prestressed-clampingly combined.
[0019] FIG. 13 is a structural schematic view of the present
invention showing that the thermal conduction coupling and combined
surfaces between thermal conductive interlayer (110) and relay
thermal conductor (102) and interface thermal conductor (103) are
prestressed-clampingly dovetailed.
[0020] FIG. 14 is a structural schematic view of the present
invention showing that the thermal conduction coupling and combined
surfaces between thermal conductive interlayer (110) and relay
thermal conductor (102) and interface thermal conductor (103) are
T-slot prestressed-clampingly combined.
[0021] FIG. 15 is a structural schematic view of the present
invention showing that the thermal conduction coupling and combined
surfaces between thermal conductive interlayer (110) and relay
thermal conductor (102) and interface thermal conductor (103) are
prestressed-clampingly combined by stud/hole fastening.
[0022] FIG. 16 is a structural schematic view of the present
invention showing that the thermal conduction coupling and combined
surfaces between thermal conductive interlayer (110) and relay
thermal conductor (102) and interface thermal conductor (103) are
concavely and convexly prestressed-clampingly combined by
multi-fins.
[0023] FIG. 17 is a schematic view of the application example
showing that heat receiving surface of relay thermal conductor
(102) transfers neighboring cooking device of combustion state heat
generator.
DESCRIPTION OF MAIN COMPONENT SYMBOLS
[0024] 100: Thermal conducting or heat dissipating assembled
structure [0025] 101: First thermal body [0026] 102: Relay thermal
conductor [0027] 103: Interface thermal conductor [0028] 104:
Second thermal body [0029] 110: Thermal conductive interlayer
[0030] 500: Clearance
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS
[0031] The present invention discloses a relay thermal conductor
made of good thermal conducting characteristics with the first
thermal body for executing non-closed type thermal conducting
coupling with the first thermal body, and an interface thermal
conductor is installed between relay thermal conductor and second
thermal body for coupling between second thermal body and relay
thermal conductor for conducting thermal energy between the two.
The interface thermal conductor having the thermal conducting
characteristics with both or one of the 1) higher specific heat
capacity relative to relay thermal conductor, or 2) better thermal
emissivity to second thermal body relative to relay thermal
conductor is used as the heat conducting carrier between relay
thermal conductor and second thermal body, as well as to avoid
loosening or deformation of the multi-layer structure material due
to different coefficients of thermal expansion to result in poor
thermal conducting surface unfavorable for thermal conduction.
[0032] The thermal conducting principle and device for
prestressed-clamping type multi-layered structure of present
invention is as shown in FIG. 1, wherein FIG. 1 is a structural
schematic view of the present invention showing that the first
thermal body being constituted by the thermal conducting casing at
heat release end or heat absorbing end of heat pipe is
prestressed-clampingly combined, wherein it mainly comprises:
[0033] The thermal conducting or heat dissipating assembled
structure (100) being constituted by at least two layers of thermal
conducting material having different thermal characteristics,
wherein the relay thermal conductor (102) having better thermal
conductivity coefficient is coupled with the first thermal body
(101), and the interface thermal conductor (103) having higher
thermal capacity is coupled between the relay thermal conductor
(102) and the second thermal body (104) thereby constituting the
thermal conducting or heat dissipating assembled structure
(100);
[0034] The thermal conducting or heat dissipating assembled
structure (100) is installed between first thermal body (101) and
second thermal body (104); wherein thermal conducting or heat
dissipating assembled structure (100) is constituted by relay
thermal conductor (102) and interface thermal conductor (103),
wherein
[0035] The first thermal body (101): It is an active cooling or
heating, or passive heat absorbing or releasing thermal body
constituted by non-closed solid, gaseous, liquid state material or
colloidal or powder type matters; or the thermal body being
constituted by thermal conducting casing at the heat release end or
heat absorbing end of heat pipe;
[0036] The relay thermal conductor (102): The relay thermal
conductor is constituted by at least one layer of solid, gaseous,
liquid state material or colloidal or powder type matters having a
better thermal conductivity coefficient, wherein the relay thermal
conductor (102) is contact combined with the open first thermal
body (101) at one end or surface thereof, and is combined with the
interface thermal conductor (103) at the other end or surface
thereof for thermal energy conduction includes that the relay
thermal conductor (102) is installed between the first thermal body
(101) being constituted by the thermal conducting casing at heat
release end or heat absorbing end of heat pipe and the interface
thermal conductor (103) for thermal energy conduction (refer to
FIGS. 1, 2), or the relay thermal conductor (102) in
prestressed-clamping combination is installed between the first
thermal body (101) constituted by thermal conducting casing of
thermal fluid conducting pipe and the interface thermal conductor
(103) for thermal energy conduction (Refer to FIG. 3); the thermal
conductivity coefficient of the relay thermal conductor and the
first thermal body (101) is better than the one of the interface
thermal conductor (103), i.e. its thermal conducting rate is faster
than the one of interface thermal conductor (103), and the thermal
conduction coupling surface areas of relay thermal conductor (102)
and interface thermal conductor (103) are larger or equal to the
thermal conduction coupling surface area of relay thermal conductor
(102) and first thermal body (101);
[0037] The interface thermal conductor (103): It is constituted by
at least one layer of solid, gaseous, liquid state material or
colloidal or powder type matters having the thermal conducting
characteristics with both or at least one of the 1) specific heat
capacity, or 2) thermal emissivity to second thermal body (104),
better than the one of the relay thermal conductor (102), wherein
the interface thermal conductor (103) being installed between the
relay thermal conductor (102) and the second thermal body (104) for
thermal energy conduction includes that the first thermal body
(101) being constituted by the thermal conducting casing at heat
release end or heat absorbing end of heat pipe is installed with
the relay thermal conductor (102) in prestressed-clamping
combination, and the interface thermal conductor (103) is installed
between the relay thermal conductor (102) and the second thermal
body (104) for thermal energy conduction (refer to FIGS. 1, 2); or
the first thermal body (101) being constituted by the thermal
conducting casing of thermal energy fluid piping is installed with
the relay thermal conductor (102), and the interface thermal
conductor (103) is installed between the relay thermal conductor
(102) and the second thermal body (104) for thermal energy
conduction (refer to FIG. 3); the thermal conduction coupling
surface area between the interface thermal conductor (103) and the
second thermal body (104) is larger or equal to the thermal
conduction coupling surface area between the relay thermal
conductor (102) and the interface thermal conductor (103);
[0038] Each structure layer is in prestressed-clamping type
combined structure to reduce volume and has a prestressed clearance
(500) to produce clamping or outwardly expanding prestressing force
to ensure good thermal conducting contact, and to avoid loosening
or deformation of the multi-layer structure material due to
different coefficients of thermal expansion to result in poor
thermal conducting surface unfavorable for thermal conduction;
[0039] The second thermal body (104): It is the active cooling or
heating thermal body or passive heat absorbing or releasing thermal
body constituted by solid, gaseous, liquid state material or
colloidal or powder type matters;
[0040] For the thermal conducting principle and device for
prestressed-clamping type multi-layered structure of present
invention, geometric shapes of the thermal conduction coupling
surface between first thermal body (101) and relay thermal
conductor (102) as well as the thermal conduction coupling surface
between interface thermal conductor (103) and second thermal body
(104) can be optionally selected as needed;
[0041] The heat resistance between first thermal body (101) and
second thermal body (104) is lowered down through said particular
structures.
[0042] For the thermal conducting principle and device for
prestressed-clamping type multi-layered structure relative
relationships between first thermal body (101), relay thermal
conductor (102), interface thermal conductor (103), and second
thermal body (104) are the following:
[0043] The thermal conducting or heat dissipating assembled
structure (100) is installed between first thermal body (101) and
second thermal body (104);
[0044] The thermal conducting or heat dissipating assembled
structure (100) comprises the thermal conductor being constituted
by at least two layers of materials with different thermal
characteristics, wherein the relay thermal conductor (102) having a
better thermal conductivity coefficient to first thermal body (101)
relative to interface thermal conductor (103) is coupled with first
thermal body (101), and the interface thermal conductor (103) is
coupled between relay thermal conductor (102) and second thermal
body (104); the interface thermal conductor (103) has the thermal
conducting characteristics with both or one of the 1) higher
specific heat capacity relative to relay thermal conductor (102),
or 2) better thermal emissivity to second thermal body (104)
relative to relay thermal conductor (102);
[0045] The relay thermal conductor (102) is made of the material
having thermal conductivity coefficient better than interface
thermal conductor (103);
[0046] The interface thermal conductor (103) is made of the
material having both or one of thermal conducting characteristic of
the specific heat capacity or the thermal emissivity to second
thermal body (104) better than the one of relay thermal conductor
(102);
[0047] The thermal conduction coupling surface area of relay
thermal conductor (102) to interface thermal conductor (103) is
larger or equal to the thermal conduction coupling surface area
between relay thermal conductor (102) and first thermal body (101)
thereby reducing the heat resistance;
[0048] The thermal conduction coupling surface area of interface
thermal conductor (103) to second thermal body (104) is larger or
equal to thermal conduction coupling surface area between relay
thermal conductor (102) and interface thermal conductor (103)
thereby reducing the heat resistance;
[0049] In above said structures, if temperature of first thermal
body (101) is higher than the one of second thermal body (104), the
thermal energy of first thermal body (101) is through the smaller
area thermal conduction coupling surface between first thermal body
(101) and relay thermal conductor (102) to externally execute
diffusive thermal conduction to relay thermal conductor (102)
having better thermal conductivity coefficient, thereby by at least
one of the following functions to assist the thermal energy
conduction, including that: 1) It is through the larger area
thermal conduction coupling surface between relay thermal conductor
(102) and interface thermal conductor (103) to diffuse thermal
energy to interface thermal conductor (103) having larger specific
heat capacity; or 2) It is further through the equal or larger area
thermal conduction coupling surface of interface thermal conductor
(103) to second thermal body (104) to release thermal energy; or 3)
It is though the characteristic of better thermal emissivity to
release thermal energy to second thermal body (104);
[0050] In above said structure, if the temperature of first thermal
body (101) is lower than the one of second thermal body (104), the
thermal energy of second thermal body (104) is through the larger
area thermal conduction coupling surface between second thermal
body (104) and interface thermal conductor (103) to diffusely
conduct to interface thermal conductor (103) having larger specific
heat capacity, and further through the smaller area thermal
conduction coupling surface between interface thermal conductor
(103) and relay thermal conductor (102) to conduct the thermal
energy to relay thermal conductor (102), and further through the
smaller area thermal conduction coupling surface of relay thermal
conductor (102) having better thermal conductivity coefficient to
release thermal energy to first thermal body (101).
[0051] For thermal conducting principle and device for
prestressed-clamping type multi-layered structure of present
invention, its constitution can be further made to the following
structures including:
[0052] If at least one of the first thermal body (101), or relay
thermal conductor (102), or interface thermal conductor (103), or
second thermal body (104) is gaseous or liquid state material or
colloidal or powder type matters, they can be contained in the
container structure, wherein the container structure can be good
thermal conductor or non-thermal conductor or the container can be
made of material having better thermal conductivity coefficient to
constitute relay thermal conductor (102), or the container can be
made of material having larger specific heat capacity to constitute
the function of interface thermal conductor (103).
[0053] For the thermal conducting principle and device for
prestressed-clamping type multi-layered structure of present
invention, the thermal conduction coupling and combined surface
between the relay thermal conductor (102) and the interface thermal
conductor (103) can be optionally selected as needed to be one or
more than one combined methods as follows including concavely and
convexly prestressed-clampingly combined, or prestressed-clampingly
dovetailed, or T-slot prestressed-clampingly combined, or
prestressed-clampingly combined by stud/hole fastening, or
concavely and convexly prestressed-clampingly combined by
multi-fins, or prestressed-clampingly combined methods by other
conventional heat conducting surface etc. to enlarge the conducting
area;
[0054] FIG. 1 is a structural schematic view of the present
invention showing that the first thermal body being constituted by
the thermal conducting casing at heat release end or heat absorbing
end of heat pipe is prestressed-clampingly combined.
[0055] FIG. 2 is a top schematic view of FIG. 1.
[0056] FIG. 3 is a structural schematic view of the present
invention showing that the thermal conduction coupling and combined
surface between relay thermal conductor (102) and interface thermal
conductor (103) is concavely and convexly prestressed-clampingly
combined.
[0057] FIG. 4 is a structural schematic view of the present
invention showing that the thermal conduction coupling and combined
surface between relay thermal conductor (102) and interface thermal
conductor (103) is prestressed-clampingly combined.
[0058] FIG. 5 is a structural schematic view of the present
invention showing that the thermal conduction coupling and combined
surface between relay thermal conductor (102) and interface thermal
conductor (103) is prestressed-clampingly dovetailed.
[0059] FIG. 6 is a structural schematic view of the present
invention showing that the thermal conduction coupling and combined
surface between relay thermal conductor (102) and interface thermal
conductor (103) is T-slot prestressed-clampingly combined.
[0060] FIG. 7 is a structural schematic view of the present
invention showing that the thermal conduction coupling and combined
surface between relay thermal conductor (102) and interface thermal
conductor (103) is prestressed-clampingly combined by stud/hole
fastening.
[0061] FIG. 8 is a structural schematic view of the present
invention showing that the thermal conduction coupling and combined
surface between relay thermal conductor (102) and interface thermal
conductor (103) is concavely and convexly prestressed-clampingly
combined by multi-fins.
[0062] For said thermal conducting principle and device for
prestressed-clamping type multi-layered structure, at least one
layer of thermal conductive interlayer (110) can be installed
between the relay thermal conductor (102) and the interface thermal
conductor (103) to appear multi-layer structure, wherein the
relationships between the additionally installed thermal conductive
interlayer (110), relay thermal conductor (102) and interface
thermal conductor (103) are the following:
[0063] The specific heat capacity of thermal conductive interlayer
(110) is larger than the one of relay thermal conductor (102), but
is smaller than the one of interface thermal conductor (103), and
if the multi-layered structure of thermal conductive interlayer
(110) is adopted, then the specific heat capacity of thermal
conductive interlayer (110) is smaller as it is closer to the relay
thermal conductor (102), but still larger than the one of relay
thermal conductor (102);
[0064] The thermal conductivity coefficient of thermal conductive
interlayer (110) is better than the one of interface thermal
conductor (103), and the thermal conductivity coefficient of relay
thermal conductor (102) is better than the one of thermal
conductive interlayer (110); when multiple layered structure of
thermal conductive interlayer (110) is optionally adopted, wherein
thermal conductivity coefficient of thermal conductive interlayer
(110) is better as it is closer to the relay thermal conductor
(102), but is still less than the one of relay thermal conductor
(102);
[0065] The thermal conduction coupling surface between relay
thermal conductor (102) and thermal conductive interlayer (110) is
larger than the thermal conduction coupling surface area between
the thermal conductive interlayer (110) and the interface thermal
conductor (103), when multi-layered structure of thermal conductive
interlayer (110) is optionally adopted, the thermal conduction
coupling surface area between the inter-layers are the same or
larger as they are closer to the interface thermal conductor
(103);
[0066] If there are two or more than two of said thermal conductive
interlayers (110), then selection of the thermal conductivity
coefficient and the specific heat capacity in the thermal
characteristics, and selection of the size of thermal conduction
coupling area at the two sides of thermal conductive interlayer
(110) are based on the structural principle of that thermal
conduction area of each layer being combined from first thermal
body (101) to relay thermal conductor (102), thermal conductive
interlayer (110), interface thermal conductor (103), and to second
thermal body (104) are sequentially the same or increased;
[0067] Each structure layer is in prestressed-clamping type
combined structure to reduce volume and has a prestressed clearance
(500) to produce clamping or outwardly expanding prestressing force
to ensure good thermal conducting contact, and to avoid loosening
or deformation of the multi-layer structure material due to
different coefficients of thermal expansion to result in poor
thermal conducting surface unfavorable for thermal conduction.
[0068] For thermal conducting principle and device for
prestressed-clamping type multi-layered structure of present
invention, the thermal conduction coupling and combined surface
between the relay thermal conductor (102) and the thermal
conductive interlayer (110) can be optionally selected as needed to
be one or more than one combined methods as follows including
concavely and convexly prestressed-clampingly combined, or
prestressed-clampingly dovetailed, or T-slot prestressed-clampingly
combined, or prestressed-clampingly combined by stud/hole
fastening, or concavely and convexly prestressed-clampingly
combined by multi-fins, or prestressed-clampingly combined methods
by other conventional heat conducting surface etc. to enlarge the
conducting area.
[0069] For the thermal conducting principle and device for
prestressed-clamping type multi-layered structure, the thermal
conduction coupling and combined surface between thermal conductive
interlayer (110) and interface thermal conductor (103) can be
optionally selected as needed to be one or more than one combined
methods as follows including concavely and convexly
prestressed-clampingly combined, or prestressed-clampingly
dovetailed, or T-slot prestressed-clampingly combined, or
prestressed-clampingly combined by stud/hole fastening, or
concavely and convexly prestressed-clampingly combined by
multi-fins, or prestressed-clampingly combined methods by other
conventional heat conducting surface etc. to enlarge the conducting
area.
[0070] FIG. 9 is a structural schematic view showing the
prestressed-clamping structure of the present invention which is
installed with thermal conductive interlayer (110), relay thermal
conductor (102) and interface thermal conductor (103), and uses the
thermal conducting casing at heat release or heat absorbing end of
the heat pipe as the first thermal body.
[0071] FIG. 10 is a top view of FIG. 9.
[0072] FIG. 11 is a structural schematic view of the present
invention showing that the thermal conduction coupling and combined
surfaces between thermal conductive interlayer (110) and relay
thermal conductor (102) and interface thermal conductor (103) are
concavely and convexly prestressed-clampingly combined.
[0073] FIG. 12 is a structural schematic view of the present
invention showing that the thermal conduction coupling and combined
surfaces between thermal conductive interlayer (110) and relay
thermal conductor (102) and interface thermal conductor (103) are
prestressed-clampingly combined.
[0074] FIG. 13 is a structural schematic view of the present
invention showing that the thermal conduction coupling and combined
surfaces between thermal conductive interlayer (110) and relay
thermal conductor (102) and interface thermal conductor (103) are
prestressed-clampingly dovetailed.
[0075] FIG. 14 is a structural schematic view of the present
invention showing that the thermal conduction coupling and combined
surfaces between thermal conductive interlayer (110) and relay
thermal conductor (102) and interface thermal conductor (103) are
T-slot prestressed-clampingly combined.
[0076] FIG. 15 is a structural schematic view of the present
invention showing that the thermal conduction coupling and combined
surfaces between thermal conductive interlayer (110) and relay
thermal conductor (102) and interface thermal conductor (103) are
prestressed-clampingly combined by stud/hole fastening.
[0077] FIG. 16 is a structural schematic view of the present
invention showing that the thermal conduction coupling and combined
surfaces between thermal conductive interlayer (110) and relay
thermal conductor (102) and interface thermal conductor (103) are
concavely and convexly prestressed-clampingly combined by
multi-fins.
[0078] For the thermal conducting principle and device for
prestressed-clamping type multi-layered structure of the present
invention, if two or more than two layers of thermal conductive
interlayer (110) are installed, as shown in the afore FIGS.
1.about.16, the thermal conduction coupling and combined surface
between the at least two layers of thermal conductive interlayer
(110) and thermal conductive interlayer (110) can be optionally
selected as needed to be one or more than one combined methods as
follows including concavely and convexly prestressed-clampingly
combined, or prestressed-clampingly dovetailed, or T-slot
prestressed-clampingly combined, or prestressed-clampingly combined
by stud/hole fastening, or concavely and convexly
prestressed-clampingly combined by multi-fins, or
prestressed-clampingly combined methods by other conventional heat
conducting surface etc. to enlarge the conducting area.
[0079] For the thermal conducting principle and device for
prestressed-clamping type multi-layered structure of present
invention, the thermal conducting or heat dissipating assembled
structure (100) is constituted by first thermal body (101), relay
thermal conductor (102), interface thermal conductor (103), second
thermal body (104), and/or the thermal conductive interlayer (110)
being optionally installed as needed, wherein if all or partially
neighboring thermal conductors constituting the thermal conducting
or heat dissipating assembled structure (100) are solid state
material, and each structure layer is in prestressed-clamping type
combined structure to reduce volume and has a prestressed clearance
(500) to produce clamping or outwardly expanding prestressing force
to ensure good thermal conducting contact and to avoid loosening or
deformation of the multi-layer structure material due to different
coefficients of thermal expansion to result in poor thermal
conducting surface unfavorable for thermal conduction, then the
combining methods between the two neighboring thermal conductors
include one or more than one of the following:
[0080] 1. Lockingly combined by external screws and nuts; or
[0081] 2. Mutually threadly combined by spiral post and spiral hole
structure; or
[0082] 3. Mutually threadly combined by spiral post and spiral hole
structure, and is installed with prestressed clearance (500) for
prestressed-clamping combination; or
[0083] 4. Rivetingly fastened; or
[0084] 5. Pressingly combined; or
[0085] 6. Clampingly fastened; or
[0086] 7. Adhesively combined; or
[0087] 8. Weldingly combined; or
[0088] 9. Frictionally fusionly combined; or
[0089] 10. Neighboring thermal conductors are castedly combined;
or
[0090] 11. Neighboring thermal conductors are electroplatedly
combined; or
[0091] 12. The thermal conducting structure between neighboring
thermal conductors and another thermal conductor are fixedly
attachingly combined or translationally attachingly combined;
or
[0092] 13. Neighboring thermal conductors are tightly touchingly
combined by gravity; or
[0093] 14. Neighboring thermal conductors are tightly touchingly
combined by attraction of magnet device; or
[0094] 15. Neighboring thermal conductors are combined as an
enclosed structure.
[0095] For the thermal conducting principle and device for
prestressed-clamping type multi-layered structure of the present
invention, the thermal conduction coupling surface between first
thermal body (101) and relay thermal conductor (102); or between
relay thermal conductor (102) and thermal conductive interlayer
(110) if thermal conductive interlayer (110) is installed; or
between thermal conductive interlayer (110) and thermal conductive
interlayer (110) if multi-layered thermal conductive interlayer
(110) is installed; or between thermal conductive interlayer (110)
and interface thermal conductor (103); or between relay thermal
conductor (102) and interface thermal conductor (103) if thermal
conductive interlayer (110) is not installed; or between interface
thermal conductor (103) and second thermal body (104) can be
combined by one or more than one of the following methods, and each
structure layer of neighboring thermal conductors is in
prestressed-clamping type combined structure to reduce volume and
has a prestressed clearance (500) to produce clamping or outwardly
expanding prestressing force to ensure good thermal conducting
contact, and to avoid loosening or deformation of the multi-layer
structure material due to different coefficients of thermal
expansion to result in poor thermal conducting surface unfavorable
for thermal conduction as well as combined by one or more than one
of the following methods, including:
[0096] 1. Lockingly combined by external screws and nuts; or
[0097] 2. Mutually threadly combined by spiral post and spiral hole
structure; or
[0098] 3. Mutually threadly combined by spiral post and spiral hole
structure, and is installed with prestressed clearance (500) for
elastic combination; or
[0099] 4. Rivetingly fastened; or
[0100] 5. Pressingly combined; or
[0101] 6. Clampingly fastened; or
[0102] 7. Adhesively combined; or
[0103] 8. Weldingly combined; or
[0104] 9. Frictionally fusionly combined; or
[0105] 10. Neighboring thermal conductors are castedly combined;
or
[0106] 11. Neighboring thermal conductors are electroplatedly
combined; or
[0107] 12. The thermal conducting structure between neighboring
thermal conductors and another thermal conductor are fixedly
attachingly combined or translationally attachingly combined;
or
[0108] 13. Neighboring thermal conductors are tightly touchingly
combined by gravity; or
[0109] 14. Neighboring thermal conductors are tightly touchingly
combined by attraction of magnet device; or
[0110] 15. Neighboring thermal conductors are combined as an
enclosed structure.
[0111] If the neighboring thermal conductor of the solid state
thermal conductor is constituted by gaseous or liquid state
material or colloidal or powder type matters, then the thermal
energy conduction of its thermal conduction coupling surface
includes one or more one methods of the following:
[0112] 1. The solid state thermal conductor transfers thermal
energy of neighboring gaseous or liquid state material, or
colloidal or powder type matters via the heat receiving surface
thereof; or
[0113] 2. The gaseous or liquid state material, or colloidal or
powder type matters of higher temperature is pumped by liquid pump
or fan to randomly contact with the solid state thermal conductor
surface so as to transfer thermal energy to the neighboring solid
state thermal conductor;
[0114] For the thermal conducting principle and device for
prestressed-clamping type multi-layered structure of the present
invention, if first thermal body (101) or second thermal body (104)
is a combustion state heat source, then heat conducting methods
between it and neighboring solid state thermal conducting structure
include: the solid state thermal conductor is through its heat
receiving surface to transfer thermal energy to neighboring
combustion type heat generator.
[0115] FIG. 17 is a schematic view of the application example
showing that heat receiving surface of relay thermal conductor
(102) transfers neighboring cooking device of combustion state heat
generator.
[0116] For the thermal conducting principle and device for
prestressed-clamping type multi-layered structure of present
invention, if first thermal body (101) is made of gaseous, liquid
state material or colloidal or powder type matters, then its heat
conducting methods include: The colloidal or powder type matters
being stirred by the stirring mechanism driven by manual, electric
or machine power is randomly transfer the thermal energy of
colloidal or powder type matters to neighboring solid state thermal
conductors.
[0117] For the thermal conducting principle and device for
prestressed-clamping type multi-layered structure of present
invention, the thermal conducting methods between interface thermal
conductor (103) and second thermal body (104) include the
following:
[0118] If the second thermal body (104) is a solid state heat
receiver, then the thermal conductive coupling surface between it
and the solid state interface thermal conductor (103) can be
combined by one or more than one of the following methods; further,
each structure layer of the neighboring thermal conductors is in
prestressed-clamping combined structure to reduce volume and has a
prestressed clearance (500) to produce clamping or outwardly
expanding prestressing force to ensure good thermal conducting
contact and to avoid loosening or deformation of the multi-layer
structure material due to different thermal conductivity
coefficients to result in poor thermal conducting surface
unfavorable for thermal conduction as well as combined by one or
more than one of the following methods, including:
[0119] 1. Lockingly combined by external screws and nuts; or
[0120] 2. Mutually threadly combined by spiral post and spiral hole
structure; or
[0121] 3. Mutually threadly combined by spiral post and spiral hole
structure, and is installed with prestressed clearance (500) for
elastic combination; or
[0122] 4. Rivetingly fastened; or
[0123] 5. Pressingly combined; or
[0124] 6. Clampingly fastened; or
[0125] 7. Adhesively combined; or
[0126] 8. Weldingly combined; or
[0127] 9. Frictionally fusionly combined; or
[0128] 10. The second thermal body (104) is castedly combined;
or
[0129] 11. The second thermal body (104) is electroplatedly
combined to interface thermal conductor (103); or
[0130] 12. The thermal conducting structure between second thermal
body (104) and interface thermal conductor (103) are fixedly
attachingly combined or translationally attachingly combined;
or
[0131] 13. Neighboring thermal conductors are tightly touchingly
combined by gravity; or
[0132] 14. Neighboring thermal conductors are tightly touchingly
combined by attraction of magnet device; or
[0133] 15. Neighboring thermal conductors are combined as an
enclosed structure;
[0134] If second thermal body (104) is gaseous state material, then
thermal conductive coupling method between it and the solid state
interface thermal conductor (103) include one or more one method of
the following:
[0135] 1. The thermal energy is transferred by heat receiving
surface of solid state interface thermal conductor (103) to gaseous
state second thermal body (104); or
[0136] 2. The thermal energy is transferred to gaseous state second
thermal body (104) blown by fans via interface thermal conductor
(103);
[0137] If second thermal body (104) is liquid state material, then
thermal conductive coupling methods between it and interface
thermal conductor (103) include one or more than one methods of the
following:
[0138] 1. The interface thermal conductor (103) is immersed in
liquid state second thermal body (104) for thermal energy
conduction by free convection; or
[0139] 2. The liquid state second thermal body (104) is conveyed by
the pump to pass through the surface of interface thermal conductor
(103) for thermal energy conduction with interface thermal
conductor (103);
[0140] If second thermal body (104) is colloidal or powder type
matter, then thermal conductive coupling methods between it and
solid state interface thermal conductor (103) include: the
colloidal or powder type matters being stirred by the stirring
mechanism driven by manual, electric or machine power is randomly
passed through interface thermal conductor (103) to transfer
thermal energy.
[0141] For the Thermal conducting principle and device for
prestressed-clamping type multi-layered structure of present
invention, one or more than one auxiliary thermal conducting method
can be optionally selected to be installed between first thermal
body (101) and relay thermal conductor (102); or between relay
thermal conductor (102) and interface thermal conductor (103); or
between interface thermal conductor (103) and second thermal body
(104); or between relay thermal conductor (102) and thermal
conductive interlayer (110) if thermal conductive inter-layer (110)
installed, or between thermal conductive interlayer (110) and
thermal conductive interlayer (110) if multiple layered thermal
conductive interlayer (110) is installed; or between thermal
conductive interlayer (110) and interface thermal conductor (103),
including:
[0142] 1. To be installed with electrically insulated heat
conductive piece; or
[0143] 2. To be coated with thermally conductive grease; or
[0144] 3. To be installed with electrically insulated thermal
conductive piece and coated with thermally conductive grease.
[0145] The thermal conducting principle and device for
prestressed-clamping type multi-layered structure of present
invention can be applied for various heat absorbing or dissipating,
or cooling thermal conductive application devices, such as heat
absorption and dissipation of various machine casings, heat pipe
structures, structure casings, semiconductor components,
ventilation devices, or the heat absorption, heat dissipation or
thermal energy conduction of information, audio or image devices,
or heat dissipation of various lamp or LED devices, or the heat
absorption or dissipation or thermal energy conduction of air
conditioning devices, electrical machines or engine, or heat
dissipation of thermal energy conduction from frictional heat loss
of the mechanical devices, or heat dissipation or thermal energy
conduction of electric heater or other electric heating home
appliances or cooking devices, or heat absorption or thermal energy
conduction of flame heating stoves or cooking devices, or heat
absorption, heat dissipation or thermal energy conduction of earth
layer or water thermal energy, plant or housing building or
building material or building structure devices, heat absorbing or
dissipation of water tower, or heat absorption, heat dissipation or
thermal energy conduction of batteries of fuel cells, etc;
[0146] As well as applied for thermal energy conduction in home
appliances, industrial products, electronic products, electrical
machines or mechanical devices, power generation equipments,
buildings, air conditioning devices, industrial equipments or
industrial manufacturing process.
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