U.S. patent application number 12/189880 was filed with the patent office on 2010-02-18 for flat panel display package method.
Invention is credited to Jung-Hsiu Chen, Ming-Chih Chien.
Application Number | 20100037564 12/189880 |
Document ID | / |
Family ID | 41680305 |
Filed Date | 2010-02-18 |
United States Patent
Application |
20100037564 |
Kind Code |
A1 |
Chien; Ming-Chih ; et
al. |
February 18, 2010 |
FLAT PANEL DISPLAY PACKAGE METHOD
Abstract
The present invention discloses a flat panel display package
method. Firstly, a flat panel display and an electronic baseplate
are prepared; the electronic baseplate is assembled to the flat
panel display to provide a driving signal for the flat panel
display and form a display module, and the display module defines a
module package plane. Next, a first package film and a second
package film are respectively provided for the flat panel display
and electronic baseplate; the first package film and the second
package film both outside the module package plane are respectively
defined to be a first join region and a second join region. Next, a
hot-pressing machine is used to apply a hot-pressing temperature
and a hot-pressing pressure to the first and second join regions
and seal them airtightly. Thereby, the present invention can
prevent external humidity entering and damaging the flat panel
display and the electronic baseplate.
Inventors: |
Chien; Ming-Chih; (Taoyuan
County, TW) ; Chen; Jung-Hsiu; (Taoyuan County,
TW) |
Correspondence
Address: |
Muncy, Geissler, Olds & Lowe, PLLC
P.O. BOX 1364
FAIRFAX
VA
22038-1364
US
|
Family ID: |
41680305 |
Appl. No.: |
12/189880 |
Filed: |
August 12, 2008 |
Current U.S.
Class: |
53/463 |
Current CPC
Class: |
B29C 66/91421 20130101;
B29C 66/433 20130101; B29C 66/723 20130101; B29C 66/849 20130101;
B65B 11/50 20130101; B29C 65/5092 20130101; B29C 66/8322 20130101;
B65D 2585/6837 20130101; B29C 66/919 20130101; B29K 2305/12
20130101; B29L 2009/00 20130101; B29C 66/8362 20130101; B29K
2305/00 20130101; B29K 2305/02 20130101; B29C 66/71 20130101; B29K
2077/00 20130101; B29C 66/929 20130101; B29K 2305/10 20130101; B29C
66/71 20130101; B29C 66/43 20130101; B29C 65/18 20130101; B29K
2075/00 20130101; B29C 66/71 20130101; B29C 66/72321 20130101; B29C
66/71 20130101; B29K 2029/04 20130101; B29C 65/5057 20130101; B29C
66/133 20130101; B29C 66/849 20130101; B29K 2067/00 20130101; B29L
2031/3475 20130101; B29C 63/02 20130101; B29C 66/71 20130101; B29C
66/949 20130101; B29K 2023/06 20130101; B29L 2009/003 20130101;
B29C 66/1122 20130101; B29C 66/71 20130101; B29C 65/02 20130101;
B29C 66/71 20130101; B29K 2023/06 20130101; B29K 2025/06 20130101;
B29K 2075/00 20130101; B29K 2075/00 20130101; B29K 2029/04
20130101; B29K 2077/00 20130101; B29K 2023/06 20130101; B29K
2029/04 20130101; B29K 2067/003 20130101; B29C 65/00 20130101; B29K
2067/003 20130101; B65D 75/30 20130101; B29C 65/524 20130101; B29C
65/524 20130101; B29C 65/00 20130101; B29K 2025/06 20130101 |
Class at
Publication: |
53/463 |
International
Class: |
B65B 51/10 20060101
B65B051/10 |
Claims
1. A flat panel display package method comprising steps: preparing
a display module: fabricating a flat panel display and an
electronic baseplate, wherein said electronic baseplate is
assembled to said flat panel display and provides a driving signal
for said flat panel display, and wherein the combination of said
flat panel display and said electronic baseplate forms the display
module and defines a module package plane; covering said display
module: respectively providing a first package film and a second
package film for said flat panel display and said electronic
baseplate, wherein said first package film outside said module
package plane and said second package film outside said module
package plane are respectively defined to be a first join region
and a second join region; and hot-pressing and packaging: using a
hot-pressing machine to apply a hot-pressing temperature and a
hot-pressing pressure to bond said first join region and said
second join region to prevent from external humidity.
2. The flat panel display package method according to claim 1,
wherein said flat panel display is an electrophoretic display.
3. The flat panel display package method according to claim 1,
wherein said first package film has a metal layer.
4. The flat panel display package method according to claim 3,
wherein said metal layer of said first package film contains
aluminum.
5. The flat panel display package method according to claim 1,
wherein said first package film has a light transmittance of over
70%.
6. The flat panel display package method according to claim 1,
wherein said second package film has a metal layer.
7. The flat panel display package method according to claim 6,
wherein said metal layer of said second package film contains
aluminum.
8. The flat panel display package method according to claim 6,
wherein said metal layer of said second package film contains
copper.
9. The flat panel display package method according to claim 6,
wherein said metal layer of said second package film is a
stainless-steel layer.
10. The flat panel display package method according to claim 1,
wherein a first joiner adhesive is disposed between said first
package film and said flat panel display.
11. The flat panel display package method according to claim 1,
wherein a second joiner adhesive is disposed between said second
package film and said electronic baseplate.
12. The flat panel display package method according to claim 1,
wherein each of said first join region and said second join region
has a width of at least 1 mm.
13. The flat panel display package method according to claim 1,
wherein said hot-pressing temperature is between 75 and 95.degree.
C.
14. The flat panel display package method according to claim 1,
wherein said hot-pressing pressure is between 0.8 and 1.2
kg/cm.sup.2.
15. The flat panel display package method according to claim 1,
wherein time for said hot-pressing is between 7 and 13 seconds.
16. The flat panel display package method according to claim 1,
wherein said hot-pressing machine is a roller-type hot-pressing
machine.
17. The flat panel display package method according to claim 1,
wherein said hot-pressing machine is a bar-type hot-pressing
machine.
Description
FIELD OF THE INVENTION
[0001] The present invention relates to a flat panel display,
particularly to a flat panel display package method.
BACKGROUND OF THE INVENTION
[0002] Compared with the traditional CRT (Cathode Ray Tube), FPD
(Flat Panel Display), such as LCD (Liquid Crystal Display) and OLED
(Organic Light Emitting Diode) displays, has the advantages of
lightweight and high brightness and has been widely accepted by
users. Among them, EPD (ElectroPhoretic Display) is an outstanding
one and features flexibility, bistability, self-luminescence and
power efficiency. At present, EPD has been applied to electronic
tags, electronic signboards, smart cards, e-books, and time display
devices. However, EPD is very sensitive to humidity. Once humidity
permeates EPD, the electrodes cannot normally drive the ink
particles thereinside, which will decrease the mobility and degrade
the picture quality. In such a case, the stability and lifetime of
EPD is unlikely to satisfy the requirements of the market, and the
popularization of EPD should be handicapped. The traditional
solution to the humidity damage on EPD is applying a water-proof
film onto the surface of EPD. However, humidity permeation is
omnidirectional. Thus, humidity can still permeate EPD from the
lateral and back sides. Therefore, the traditional solution cannot
effectively protect EPD from humidity damage.
SUMMARY OF THE INVENTION
[0003] The primary objective of the present invention is to
completely prevent external humidity from permeating a flat panel
display. To achieve the abovementioned objective, the present
invention proposes a flat panel display package method comprising
steps: [0004] (a) preparing a display module: fabricating a flat
panel display and an electronic baseplate, wherein the electronic
baseplate is assembled to the flat panel display and provides a
driving signal for the flat panel display, and wherein the
combination of the flat panel display and the electronic baseplate
forms a display module and defines a module package plane; [0005]
(b) covering the display module: respectively providing a first
package film and a second package film for the flat panel display
and the electronic baseplate, wherein the first package film
outside the module package plane and the second package film
outside the module package plane are respectively defined to be a
first join region and a second join region; and [0006] (c) hot
pressing and packaging: a hot-pressing machine applying a
hot-pressing temperature and a hot-pressing pressure to bond the
first and second join regions to prevent from external
humidity.
[0007] The flat panel display may be an EPD (ElectroPhoretic
Display). The first package film covering the flat panel display
needs a light transmittance of over 70% to present the pictures of
the flat panel display. Each of the first and second package films
is a multi-layer film containing a metal layer. The metal layer of
the second package film contains aluminum or copper, or the metal
layer of the second package film is a stainless-steel layer. A
first joiner adhesive is disposed between the first package film
and the flat panel display, and a second joiner adhesive is
disposed between the second package film and the electronic
baseplate, whereby the first package film and the second package
film are respectively firmly stuck onto the flat panel display and
the electronic baseplate.
[0008] In step (b), the first and second join regions have a width
of at least 1 mm to attain a better bonding. In step (c), the
hot-pressing temperature is between 75 and 95.degree. C., and the
hot-pressing pressure is between 0.8 and 1.2 kg/cm.sup.2, and the
time for hot-pressing is between 7 and 13 seconds. The hot-pressing
machine can be a roller-type or bar-type hot-pressing machine.
[0009] Via the flat panel display package method of the present
invention, the first and second package films are airtightly sealed
by hot pressing the first and second join regions. Thus, external
humidity is impossible to enter the space formed by the first and
second package films. Thereby, the flat panel display and the
electronic baseplate are protected.
BRIEF DESCRIPTION OF THE DRAWINGS
[0010] FIG. 1 is a flowchart showing a FPD package method according
to a preferred embodiment of the present invention; and
[0011] FIGS. 2A-2D are diagrams schematically showing the steps of
a FPD package method according to a preferred embodiment of the
present invention.
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS
[0012] Below are described in detailed the technical contents of
the preset invention in cooperation with the drawings.
[0013] Refer to FIG. 1 a flowchart of a preferred embodiment of the
present invention. The present invention proposes a flat panel
display package method comprising steps: [0014] (a) preparing a
display module (S1): fabricating a flat panel display and an
electronic baseplate, wherein the electronic baseplate is assembled
to the flat panel display and provides a driving signal for the
flat panel display, and wherein the combination of the flat panel
display and the electronic baseplate forms a display module and
defines a module package plane; [0015] (b) covering the display
module (S2): respectively providing a first package film and a
second package film for the flat panel display and the electronic
baseplate, wherein the first package film and the second package
film outside the module package plane are respectively defined to
be a first join region and a second join region; and [0016] (c) hot
pressing and packaging (S3): a hot-pressing machine applying a
hot-pressing temperature and a hot-pressing pressure to bond the
first and second join regions to prevent from external
humidity.
[0017] The flat panel display may be an EPD (ElectroPhoretic
display). The first package film covering the flat panel display
needs a light transmittance of over 70% to present the pictures of
the flat panel display. A first joiner adhesive is disposed between
the first package film and the flat panel display, and a second
joiner adhesive is disposed between the second package film and the
electronic baseplate, whereby the first package film and the second
package film are respectively firmly stuck onto the flat panel
display and the electronic baseplate.
[0018] In this preferred embodiment, each of the first and second
package films is a multi-layer film containing a soft plastic
layer, a metal layer, etc. The soft plastic layer is made of PE
(polyethylene), PA (polyamide), PET (polyethylene terephthalate),
PU (polyurethane), PVA (polyvinyl alcohol), or polyester. The metal
layer contains aluminum or copper, or the metal layer is a
stainless-steel layer.
[0019] Refer to FIGS. 2A-2D diagrams schematically showing the
package steps according to a preferred embodiment of the present
invention. Refer to FIG. 1 also. As shown in FIG. 2A, in the step
S1 of preparing a display module, the finished flat panel display
10 and the finished electronic baseplate 20 are assembled together
to form the display module and electrically coupled to each other,
and the display module defines a module package plane. As shown in
FIG. 2B and FIG. 2C, in the step S2 of covering the display module,
a roller 30 is used to respectively apply a first package film 11
and a second package film 21 uniformly onto the flat panel display
10 and the electronic baseplate 20 of the display module. Before
the step S2, a first joiner adhesive 12 is coated onto a portion of
the first package film 11 corresponding to the flat panel display
10, and a second joiner adhesive 22 is coated onto a portion of the
second package film 21 corresponding to the electronic baseplate
20, whereby the first package film 11 and the second package film
21 are respectively stuck onto the flat panel display 10 and the
electronic baseplate 20 firmly. The first joiner adhesive 12 is
selected from the adhesives appropriate for the first package film
11 and the flat panel display 10, and the second joiner adhesive 22
is selected from the adhesives appropriate for the second package
film 21 and the electronic baseplate 20. The second joiner adhesive
22 may be identical to or different from the first joiner adhesive
12. The size of each of the first and second package films 11 and
21 is greater than the module package plane. The portion of the
first package film 11 outside the module package plane is defined
to be a first join region 111, and the portion of the second
package film 21 outside the module package plane is defined to be a
second join region 211. Each of the first and second join regions
111 and 211 has a width of at least 1 mm.
[0020] As shown in FIG. 2D, in the step S3 of hot pressing and
packaging, the semi-product of the step S2 is placed in a
hot-pressing machine, and the hot-pressing machine may be a
roller-type hot-pressing machine or a bar-type hot-pressing
machine. In this preferred embodiment, the bar-type hot-pressing
machine is adopted. The hot-pressing machine has a hot-pressing
unit 40 arranged corresponding to the first join region 111 of the
first package film 11 and the second join region 211 of the second
package film 21. The hot-pressing unit 40 applies a hot-pressing
temperature and a hot-pressing pressure to the first and second
join regions 111 and 211. The hot-pressing temperature is between
75 and 95.degree. C., and the hot-pressing pressure is between 0.8
and 1.2 kg/cm.sup.2, and the time for hot-pressing is between 7 and
13 seconds. Thereby, the first and second join regions 111 and 211
are sealed airtightly, and the flat panel display 10 and the
electronic baseplate 20 are packaged inside the first and second
package films 11 and 21.
[0021] In conclusion, the first package film and the second package
film respectively cover the flat panel display and the electronic
baseplate, whereby external humidity cannot enter the display
module from the front side and back side of the display module.
Further, the first and second join regions along the circumference
of the display module are sealed airtightly with a hot-pressing
method, whereby external humidity cannot enter the display module
from the lateral sides. Thus, the flat panel display and electronic
baseplate packaged inside the first and second package films are
fully protected from the damage of external humidity.
[0022] From the abovementioned description, it is known that the
present invention indeed possesses novelty and non-obviousness and
meets the conditions for a patent. Thus, the Inventor files the
application for a patent. It will be appreciated if the patent is
approved fast.
[0023] The embodiments described above are only to exemplify the
present invention but not to limit the scope of the present
invention. Therefore, any equivalent modification or variation
according to the spirit of the present invention is to be also
included within the scope of the present invention.
* * * * *