U.S. patent application number 12/507378 was filed with the patent office on 2010-02-11 for cantilever microprobes for contacting electronic components and methods for making such probes.
This patent application is currently assigned to Microfabrica Inc.. Invention is credited to Vacit Arat, Richard T. Chen, Adam L. Cohen, Christopher R. Folk.
Application Number | 20100033202 12/507378 |
Document ID | / |
Family ID | 46326760 |
Filed Date | 2010-02-11 |
United States Patent
Application |
20100033202 |
Kind Code |
A1 |
Chen; Richard T. ; et
al. |
February 11, 2010 |
Cantilever Microprobes for Contacting Electronic Components and
Methods for Making Such Probes
Abstract
Embodiments disclosed herein are directed to compliant probe
structures for making temporary or permanent contact with
electronic circuits and the like. In particular, embodiments are
directed to various designs of two-part probe elements, socket-able
probes and their mounts. Some embodiments are directed to methods
for fabricating such probes and mounts. In some embodiments, for
example, probes have slide in mounting structures, twist in
mounting structures, mounting structures that include compliant
elements, and the like.
Inventors: |
Chen; Richard T.; (Woodland
Hills, CA) ; Arat; Vacit; (La Canada Flintridge,
CA) ; Folk; Christopher R.; (Los Angeles, CA)
; Cohen; Adam L.; (Los Angeles, CA) |
Correspondence
Address: |
MICROFABRICA INC.;ATT: DENNIS R. SMALLEY
7911 HASKELL AVENUE
VAN NUYS
CA
91406
US
|
Assignee: |
Microfabrica Inc.
|
Family ID: |
46326760 |
Appl. No.: |
12/507378 |
Filed: |
July 22, 2009 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
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11636147 |
Dec 7, 2006 |
7567089 |
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12507378 |
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11028960 |
Jan 3, 2005 |
7265565 |
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11636147 |
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11029219 |
Jan 3, 2005 |
7265562 |
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11028960 |
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11029171 |
Jan 3, 2005 |
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11029219 |
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10949738 |
Sep 24, 2004 |
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11029171 |
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10772943 |
Feb 4, 2004 |
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10949738 |
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10949738 |
Sep 24, 2004 |
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10772943 |
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10772943 |
Feb 4, 2004 |
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10949738 |
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10949738 |
Sep 24, 2004 |
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11029171 |
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10772943 |
Feb 4, 2004 |
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10949738 |
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60748015 |
Dec 8, 2005 |
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60582689 |
Jun 23, 2004 |
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Jun 23, 2004 |
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60609719 |
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60611789 |
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Dec 31, 2003 |
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60533933 |
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60536865 |
Jan 15, 2004 |
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60582689 |
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Jun 23, 2004 |
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60609719 |
Sep 13, 2004 |
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60611789 |
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60540511 |
Jan 29, 2004 |
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60533933 |
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60536865 |
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60533947 |
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60445186 |
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60506015 |
Sep 24, 2003 |
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60533933 |
Dec 31, 2003 |
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60536865 |
Jan 15, 2004 |
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60445186 |
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60506015 |
Sep 24, 2003 |
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60533933 |
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60536865 |
Jan 15, 2004 |
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60533933 |
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Current U.S.
Class: |
324/750.16 ;
324/755.07 |
Current CPC
Class: |
G01R 1/06727 20130101;
G01R 3/00 20130101; G01R 31/2886 20130101; G01R 1/0483 20130101;
G01R 1/06733 20130101; G01R 1/07357 20130101; G01R 1/07342
20130101 |
Class at
Publication: |
324/762 |
International
Class: |
G01R 31/02 20060101
G01R031/02 |
Claims
1. An array of cantilever probes for making contact with an
electronic circuit element, comprising: a plurality of independent
cantilever probes, each having a base portion, a support
functionally connected to the base portion, a cantilever portion
functionally connected to the support, and a contact portion
functionally connected to the cantilever portion for making contact
with the electronic circuit element; a substrate containing at
least two bonding location for each of the plurality of cantilever
probes; and a bonding material functionally attaching base portions
of the cantilever probes to their respective bonding locations on
said substrate, wherein for at least a plurality of pairs of first
and second cantilever probes, an opening is provided in a base of
the first probe between the at least two bonding locations such
that the opening provides a space for bonding for the second probe
to be used in bonding the second probe to the substrate without the
bonding material for the second probe shorting to the base of first
probe whereby interlaced bonding locations for a plurality of
probes are provide.
2. A probe mounted to a substrate for testing semiconductor
devices, comprising: (a) a substrate; (b) a mounting element
mounted to the substrate; (c) a probe element comprising a body
portion, having a distal end connected to a tip portion, and a
proximal end connected to a base portion; wherein the base portion
and the mounting element have at least some substantially
complementary elements which allow aligned and retained mating of
the probe to the mount.
3. The probe of claim 2 wherein the probe and mounting element are
engaged with one another through at least two non-parallel
motions.
4. The probe of claim 3 wherein the components are not parallel to
the X or Y axes.
5. The probe of claim 3 wherein the components are parallel to the
X and Y axes.
6. The probe of claim 3 wherein at least one of the motions
comprises a rotation about an axis parallel to a plane of the
substrate.
7. The probe of claim 3 wherein at least one of the motions
comprises a rotation about an axis that is perpendicular to a plane
of the substrate
8. The probe of claim 3 wherein either the mount or the probe
includes a compliant element that engages the other of the probe or
mount when the positioning of the mount and the probe place that in
a desired relationship.
9. The probe of claim 3 wherein either the mount or the probe
includes a plurality of compliant fingers that ensure interlocking
of the probe and the mount.
Description
RELATED APPLICATIONS
[0001] This application is a continuation of U.S. patent
application Ser. No. 11/636,147 (Microfabrica Docket No.
P-US169-A-MF) filed on Dec. 7, 2006. The '147 application in turn
claims benefit of U.S. Provisional Patent Application No.
60/748,015 and is a continuation-in-part of U.S. patent application
Ser. Nos. 11/028,960 (Microfabrica Docket No. P-US140-A-MF),
11/029,219 (Microfabrica Docket No. P-US140-B-MF), and 11/029,171
(Microfabrica Docket No. P-US140-C-MF), which were filed on January
3, 2005 and which in turn claim benefit of U.S. Provisional
Application Nos. 60/582,689, 60/582,690, 60/609,719, 60/611,789,
60/540,511, 60/533,933, 60/536,865, and 60/533,947. The '960, '219,
and '171 applications are also continuations-in-part of U.S.
application Ser. No. 10/949,738 (Microfabrica docket P-US119-A-MF)
which in turn is a continuation-in-part of U.S. patent application
Ser. No. 10/772,943 (Microfabrica docket P-US097-A-MF), which in
turn claims benefit of U.S. Provisional Application Nos.
60/445,186; 60/506,015; 60/533,933, and 60/536,865; furthermore the
'738 application claims benefit of U.S. application Ser. Nos.:
60/506,015; 60/533,933; and 60/536,865. Each of these applications
is incorporated herein by reference as if set forth in full herein
including any appendices attached thereto.
FIELD OF THE INVENTION
[0002] Embodiments of the present invention relate to microprobes
(e.g. for use in the wafer level testing of integrated circuits,
such as memory or logic devices), and more particularly related to
two-part microprobes. In some embodiments, microprobes are
fabricated using electrochemical fabrication methods (e.g.
EFAB.RTM. fabrication processes).
BACKGROUND OF THE INVENTION
[0003] A technique for forming three-dimensional structures (e.g.
parts, components, devices, and the like) from a plurality of
adhered layers was invented by Adam L. Cohen and is known as
Electrochemical Fabrication. It is being commercially pursued by
Microfabrica Inc..RTM. of Van Nuys, Calif., under the name
EFAB.RTM.. This technique was described in U.S. Pat. No. 6,027,630,
issued on Feb. 22, 2000. This electrochemical deposition technique
allows the selective deposition of a material using a unique
masking technique that involves the use of a mask that includes
patterned conformable material on a support structure that is
independent of the substrate onto which plating will occur. When
desiring to perform an electrodeposition using the mask, the
conformable portion of the mask is brought into contact with a
substrate while in the presence of a plating solution such that the
contact of the conformable portion of the mask to the substrate
inhibits deposition at selected locations. For convenience, these
masks might be generically called conformable contact masks; the
masking technique may be generically called a conformable contact
mask plating process. More specifically, in the terminology of
Microfabrica Inc..RTM. of Van Nuys, Calif. such masks have come to
be known as INSTANT MASKS.TM. and the process known as INSTANT
MASKING.TM. or INSTANT MASK.TM. plating. Selective depositions
using conformable contact mask plating may be used to form single
layers of material or may be used to form multi-layer structures.
The teachings of the '630 patent are hereby incorporated herein by
reference as if set forth in full herein. Since the filing of the
patent application that led to the above noted patent, various
papers about conformable contact mask plating (i.e. INSTANT
MASKING) and electrochemical fabrication have been published:
[0004] (1) A. Cohen, G. Zhang, F. Tseng, F. Mansfeld, U. Frodis and
P. Will, "EFAB: Batch production of functional, fully-dense metal
parts with micro-scale features", Proc. 9th Solid Freeform
Fabrication, The University of Texas at Austin, p161, August 1998.
[0005] (2) A. Cohen, G. Zhang, F. Tseng, F. Mansfeld, U. Frodis and
P. Will, "EFAB: Rapid, Low-Cost Desktop Micromachining of High
Aspect Ratio True 3-D MEMS", Proc. 12th IEEE Micro Electro
Mechanical Systems Workshop, IEEE, p244, January 1999. [0006] (3)
A. Cohen, "3-D Micromachining by Electrochemical Fabrication",
Micromachine Devices, March 1999. [0007] (4) G. Zhang, A. Cohen, U.
Frodis, F. Tseng, F. Mansfeld, and P. Will, "EFAB: Rapid Desktop
Manufacturing of True 3-D Microstructures", Proc. 2nd International
Conference on Integrated MicroNanotechnology for Space
Applications, The Aerospace Co., April 1999. [0008] (5) F. Tseng,
U. Frodis, G. Zhang, A. Cohen, F. Mansfeld, and P. Will, "EFAB:
High Aspect Ratio, Arbitrary 3-D Metal Microstructures using a
Low-Cost Automated Batch Process", 3rd International Workshop on
High Aspect Ratio MicroStructure Technology (HARMST'99), June 1999.
[0009] (6) A. Cohen, U. Frodis, F. Tseng, G. Zhang, F. Mansfeld,
and P. Will, "EFAB: Low-Cost, Automated Electrochemical Batch
Fabrication of Arbitrary 3-D Microstructures", Micromachining and
Microfabrication Process Technology, SPIE 1999 Symposium on
Micromachining and Microfabrication, September 1999. [0010] (7) F.
Tseng, G. Zhang, U. Frodis, A. Cohen, F. Mansfeld, and P. Will,
"EFAB: High Aspect Ratio, Arbitrary 3-D Metal Microstructures using
a Low-Cost Automated Batch Process", MEMS Symposium, ASME 1999
International Mechanical Engineering Congress and Exposition,
November, 1999. [0011] (8) A. Cohen, "Electrochemical Fabrication
(EFAB.TM.)", Chapter 19 of The MEMS Handbook, edited by Mohamed
Gad-EI-Hak, CRC Press, 2002. [0012] (9) Microfabrication--Rapid
Prototyping's Killer Application", pages 1-5 of the Rapid
Prototyping Report, CAD/CAM Publishing, Inc., June 1999.
[0013] The disclosures of these nine publications are hereby
incorporated herein by reference as if set forth in full
herein.
[0014] The electrochemical deposition process may be carried out in
a number of different ways as set forth in the above patent and
publications. In one form, this process involves the execution of
three separate operations during the formation of each layer of the
structure that is to be formed: [0015] 1. Selectively depositing at
least one material by electrodeposition upon one or more desired
regions of a substrate. [0016] 2. Then, blanket depositing at least
one additional material by electrodeposition so that the additional
deposit covers both the regions that were previously selectively
deposited onto, and the regions of the substrate that did not
receive any previously applied selective depositions. [0017] 3.
Finally, planarizing the materials deposited during the first and
second operations to produce a smoothed surface of a first layer of
desired thickness having at least one region containing the at
least one material and at least one region containing at least the
one additional material.
[0018] After formation of the first layer, one or more additional
layers may be formed adjacent to the immediately preceding layer
and adhered to the smoothed surface of that preceding layer. These
additional layers are formed by repeating the first through third
operations one or more times wherein the formation of each
subsequent layer treats the previously formed layers and the
initial substrate as a new and thickening substrate.
[0019] Once the formation of all layers has been completed, at
least a portion of at least one of the materials deposited is
generally removed by an etching process to expose or release the
three-dimensional structure that was intended to be formed.
[0020] The preferred method of performing the selective
electrodeposition involved in the first operation is by conformable
contact mask plating. In this type of plating, one or more
conformable contact (CC) masks are first formed. The CC masks
include a support structure onto which a patterned conformable
dielectric material is adhered or formed. The conformable material
for each mask is shaped in accordance with a particular
cross-section of material to be plated. At least one CC mask is
needed for each unique cross-sectional pattern that is to be
plated.
[0021] The support for a CC mask is typically a plate-like
structure formed of a metal that is to be selectively electroplated
and from which material to be plated will be dissolved. In this
typical approach, the support will act as an anode in an
electroplating process. In an alternative approach, the support may
instead be a porous or otherwise perforated material through which
deposition material will pass during an electroplating operation on
its way from a distal anode to a deposition surface. In either
approach, it is possible for CC masks to share a common support,
i.e. the patterns of conformable dielectric material for plating
multiple layers of material may be located in different areas of a
single support structure. When a single support structure contains
multiple plating patterns, the entire structure is referred to as
the CC mask while the individual plating masks may be referred to
as "submasks". In the present application such a distinction will
be made only when relevant to a specific point being made.
[0022] In preparation for performing the selective deposition of
the first operation, the conformable portion of the CC mask is
placed in registration with and pressed against a selected portion
of the substrate (or onto a previously formed layer or onto a
previously deposited portion of a layer) on which deposition is to
occur. The pressing together of the CC mask and substrate occur in
such a way that all openings, in the conformable portions of the CC
mask contain plating solution. The conformable material of the CC
mask that contacts the substrate acts as a barrier to
electrodeposition while the openings in the CC mask that are filled
with electroplating solution act as pathways for transferring
material from an anode (e.g. the CC mask support) to the
non-contacted portions of the substrate (which act as a cathode
during the plating operation) when an appropriate potential and/or
current are supplied.
[0023] An example of a CC mask and CC mask plating are shown in
FIG. 1A-1C. FIG. 1A shows a side view of a CC mask 8 consisting of
a conformable or deformable (e.g. elastomeric) insulator 10
patterned on an anode 12. The anode has two functions. One is as a
supporting material for the patterned insulator 10 to maintain its
integrity and alignment since the pattern may be topologically
complex (e.g., involving isolated "islands" of insulator material).
The other function is as an anode for the electroplating operation.
FIG. 1A also depicts a substrate 6 separated from mask 8. CC mask
plating selectively deposits material 22 onto a substrate 6 by
simply pressing the insulator against the substrate then
electrodepositing material through apertures 26a and 26b in the
insulator as shown in FIG. 1B. After deposition, the CC mask is
separated, preferably non-destructively, from the substrate 6 as
shown in FIG. 1C. The CC mask plating process is distinct from a
"through-mask" plating process in that in a through-mask plating
process the separation of the masking material from the substrate
would occur destructively. As with through-mask plating, CC mask
plating deposits material selectively and simultaneously over the
entire layer. The plated region may consist of one or more isolated
plating regions where these isolated plating regions may belong to
a single structure that is being formed or may belong to multiple
structures that are being formed simultaneously. In CC mask plating
as individual masks are not intentionally destroyed in the removal
process, they may be usable in multiple plating operations.
[0024] Another example of a CC mask and CC mask plating is shown in
FIGS. 1D-1F. FIG. 1D shows an anode 12' separated from a mask 8'
that includes a patterned conformable material 10' and a support
structure 20. FIG. 1D also depicts substrate 6 separated from the
mask 8'. FIG. 1E illustrates the mask 8' being brought into contact
with the substrate 6. FIG. 1F illustrates the deposit 22' that
results from conducting a current from the anode 12' to the
substrate 6. FIG. 1G illustrates the deposit 22' on substrate 6
after separation from mask 8'. In this example, an appropriate
electrolyte is located between the substrate 6 and the anode 12'
and a current of ions coming from one or both of the solution and
the anode are conducted through the opening in the mask to the
substrate where material is deposited. This type of mask may be
referred to as an anodeless INSTANT MASK.TM. (AIM) or as an
anodeless conformable contact (ACC) mask.
[0025] Unlike through-mask plating, CC mask plating allows CC masks
to be formed completely separate from the fabrication of the
substrate on which plating is to occur (e.g. separate from a
three-dimensional (3D) structure that is being formed). CC masks
may be formed in a variety of ways, for example, a
photolithographic process may be used. All masks can be generated
simultaneously, prior to structure fabrication rather than during
it. This separation makes possible a simple, low-cost, automated,
self-contained, and internally-clean "desktop factory" that can be
installed almost anywhere to fabricate 3D structures, leaving any
required clean room processes, such as photolithography to be
performed by service bureaus or the like.
[0026] An example of the electrochemical fabrication process
discussed above is illustrated in FIGS. 2A-2F. These figures show
that the process involves deposition of a first material 2 which is
a sacrificial material and a second material 4 which is a
structural material. The CC mask 8, in this example, includes a
patterned conformable material (e.g. an elastomeric dielectric
material) 10 and a support 12 which is made from deposition
material 2. The conformal portion of the CC mask is pressed against
substrate 6 with a plating solution 14 located within the openings
16 in the conformable material 10. An electric current, from power
supply 18, is then passed through the plating solution 14 via (a)
support 12 which doubles as an anode and (b) substrate 6 which
doubles as a cathode. FIG. 2A, illustrates that the passing of
current causes material 2 within the plating solution and material
2 from the anode 12 to be selectively transferred to and plated on
the substrate 6. After electroplating the first deposition material
2 onto the substrate 6 using CC mask 8, the CC mask 8 is removed as
shown in FIG. 2B. FIG. 2C depicts the second deposition material 4
as having been blanket-deposited (i.e. non-selectively deposited)
over the previously deposited first deposition material 2 as well
as over the other portions of the substrate 6. The blanket
deposition occurs by electroplating from an anode (not shown),
composed of the second material, through an appropriate plating
solution (not shown), and to the cathode/substrate 6. The entire
two-material layer is then planarized to achieve precise thickness
and flatness as shown in FIG. 2D. After repetition of this process
for all layers, the multi-layer structure 20 formed of the second
material 4 (i.e. structural material) is embedded in first material
2 (i.e. sacrificial material) as shown in FIG. 2E. The embedded
structure is etched to yield the desired device, i.e. structure 20,
as shown in FIG. 2F.
[0027] Various components of an exemplary manual electrochemical
fabrication system 32 are shown in FIGS. 3A-3C. The system 32
consists of several subsystems 34, 36, 38, and 40. The substrate
holding subsystem 34 is depicted in the upper portions of each of
FIGS. 3A to 3C and includes several components: (1) a carrier 48,
(2) a metal substrate 6 onto which the layers are deposited, and
(3) a linear slide 42 capable of moving the substrate 6 up and down
relative to the carrier 48 in response to drive force from actuator
44. Subsystem 34 also includes an indicator 46 for measuring
differences in vertical position of the substrate which may be used
in setting or determining layer thicknesses and/or deposition
thicknesses. The subsystem 34 further includes feet 68 for carrier
48 which can be precisely mounted on subsystem 36.
[0028] The CC mask subsystem 36 shown in the lower portion of FIG.
3A includes several components: (1) a CC mask 8 that is actually
made up of a number of CC masks (i.e. submasks) that share a common
support/anode 12, (2) precision X-stage stage 54, (3) precision
Y-stage 56, (4) frame 72 on which the feet 68 of subsystem 34 can
mount, and (5) a tank 58 for containing the electrolyte 16.
Subsystems 34 and 36 also include appropriate electrical
connections (not shown) for connecting to an appropriate power
source (not shown) for driving the CC masking process.
[0029] The blanket deposition subsystem 38 is shown in the lower
portion of FIG. 3B and includes several components: (1) an anode
62, (2) an electrolyte tank 64 for holding plating solution 66, and
(3) frame 74 on which the feet 68 of subsystem 34 may sit.
Subsystem 38 also includes appropriate electrical connections (not
shown) for connecting the anode to an appropriate power supply (not
shown) for driving the blanket deposition process.
[0030] The planarization subsystem 40 is shown in the lower portion
of FIG. 3C and includes a lapping plate 52 and associated motion
and control systems (not shown) for planarizing the
depositions.
[0031] Another method for forming microstructures from
electroplated metals (i.e. using electrochemical fabrication
techniques) is taught in U.S. Pat. No. 5,190,637 to Henry Guckel,
entitled "Formation of Microstructures by Multiple Level Deep X-ray
Lithography with Sacrificial Metal layers". This patent teaches the
formation of metal structure utilizing mask exposures. A first
layer of a primary metal is electroplated onto an exposed plating
base to fill a void in a photoresist, the photoresist is then
removed and a secondary metal is electroplated over the first layer
and over the plating base. The exposed surface of the secondary
metal is then machined down to a height which exposes the first
metal to produce a flat uniform surface extending across the both
the primary and secondary metals. Formation of a second layer may
then begin by applying a photoresist layer over the first layer and
then repeating the process used to produce the first layer. The
process is then repeated until the entire structure is formed and
the secondary metal is removed by etching. The photoresist is
formed over the plating base or previous layer by casting and the
voids in the photoresist are formed by exposure of the photoresist
through a patterned mask via X-rays or UV radiation.
[0032] Electrochemical fabrication provides the ability to form
prototypes and commercial quantities of miniature objects, parts,
structures, devices, and the like at reasonable costs and in
reasonable times. In fact, electrochemical fabrication is an
enabler for the formation of many structures that were hitherto
impossible to produce. Electrochemical fabrication opens the
spectrum for new designs and products in many industrial fields.
Even though electrochemical fabrication offers this new capability
and it is understood that electrochemical fabrication techniques
can be combined with designs and structures known within various
fields to produce new structures, certain uses for electrochemical
fabrication provide designs, structures, capabilities and/or
features not known or obvious in view of the state of the art.
[0033] A need exists in various fields for miniature devices having
improved characteristics, reduced fabrication times, reduced
fabrication costs, simplified fabrication processes, and/or more
independence between geometric configuration and the selected
fabrication process. A need also exists in the field of miniature
device fabrication for improved fabrication methods and
apparatus.
SUMMARY OF THE INVENTION
[0034] It is an object of some embodiments of the invention to
provide two-part probes with improved characteristics.
[0035] It is an object of some embodiments of the invention to
provide two-part probes that are more reliable.
[0036] It is an object of some embodiments of the invention to
provide improved methods for fabricating probes.
[0037] Other objects and advantages of various embodiments of the
invention will be apparent to those of skill in the art upon review
of the teachings herein. The various embodiments of the invention,
set forth explicitly herein or otherwise ascertained from the
teachings herein, may address one or more of the above objects
alone or in combination, or alternatively may address some other
object of the invention ascertained from the teachings herein. It
is not necessarily intended that all objects be addressed by any
single aspect of the invention even though that may be the case
with regard to some aspects.
[0038] In a first aspect of the invention a probe assembly for
making electric contact with an electronic circuit element,
including: a substrate including at least one structure; at least
one probe including: a contact tip portion; a compliant portion
functionally attached to the tip portion; and a base portion
functionally attached to the compliant portion, wherein the base
portion is configured to mate with and be at least partially
mechanically constrained by its physical configuration and the
physical configuration of the at least one structure on the
substrate.
[0039] In a first aspect of the invention an array of cantilever
probes for making contact with an electronic circuit element,
include: a plurality of independent cantilever probes, each having
a base portion, a support functionally connected to the base
portion, a cantilever portion functionally connected to the
support, and a contact portion functionally connected to the
cantilever portion for making contact with the electronic circuit
element; a substrate containing at least two bonding location for
each of the plurality of cantilever probes; and a bonding material
functionally attaching base portions of the cantilever probes to
their respective bonding locations on said substrate, wherein for
at least a plurality of pairs of first and second cantilever
probes, an opening is provided in a base of the first probe between
the at least two bonding locations such that the opening provides a
space for bonding for the second probe to be used in bonding the
second probe to the substrate without the bonding material for the
second probe shorting to the base of first probe whereby interlaced
bonding locations for a plurality of probes are provide.
[0040] In a second aspect of the invention, a probe mounted to a
substrate for testing semiconductor devices, includes: (a) a
substrate; (b) a mounting element mounted to the substrate; (c) a
probe element comprising a body portion, having a distal end
connected to a tip portion, and a proximal end connected to a base
portion; wherein the base portion and the mounting element have at
least some substantially complementary elements which allow aligned
and retained mating of the probe to the mount.
[0041] Further aspects of the invention will be understood by those
of skill in the art upon reviewing the teachings herein. Other
aspects of the invention may involve apparatus and methods used in
implementing one or more of the above noted aspects of the
invention or involve methods for fabricating structures according
to various apparatus aspects set forth above. These other aspects
of the invention may provide various combinations of the aspects,
embodiments, and associated alternatives explicitly set forth
herein as well as provide other configurations, structures,
functional relationships, and processes that have not been
specifically set forth above.
BRIEF DESCRIPTION OF THE DRAWINGS
[0042] FIGS. 1A-1C schematically depict side views of various
stages of a CC mask plating process, while FIGS. 1D-1G
schematically depict a side views of various stages of a CC mask
plating process using a different type of CC mask.
[0043] FIGS. 2A-2F schematically depict side views of various
stages of an electrochemical fabrication process as applied to the
formation of a particular structure where a sacrificial material is
selectively deposited while a structural material is blanket
deposited.
[0044] FIGS. 3A-3C schematically depict side views of various
example apparatus subassemblies that may be used in manually
implementing the electrochemical fabrication method depicted in
FIGS. 2A-2F.
[0045] FIGS. 4A-4F schematically depict the formation of a first
layer of a structure using adhered mask plating where the blanket
deposition of a second material overlays both the openings between
deposition locations of a first material and the first material
itself
[0046] FIG. 4G depicts the completion of formation of the first
layer resulting from planarizing the deposited materials to a
desired level.
[0047] FIGS. 4H and 4I respectively depict the state of the process
after formation of the multiple layers of the structure and after
release of the structure from the sacrificial material.
[0048] FIGS. 5A-5C depict perspective views of cantilever
structures having base elements with `L" shaped structures that can
slide into and interlock with appropriate base structures affixed
to or forming part of a substrate.
[0049] FIG. 6A depicts a slotted mounting structure on a substrate
into which a probe with an "L" or "T" shaped base may be inserted
while FIG. 6B depicts a perspective view of such a probe slid into
the slotted mounting structure.
[0050] FIG. 7A depicts an alternative mounting structure
configuration while FIGS. 7B and 7C depict two alternative
configurations for locating the mounting structures in forming
arrays of various pitch.
[0051] FIG. 8 depicts a perspective view of a plurality of probe
elements lying in a sideways orientation and stacked one above the
other as they may be formed according to some embodiments of the
invention.
[0052] FIG. 9 depicts a perspective view of an example of an
alternative embodiment where probe elements are separated from
other probe elements by shields.
[0053] FIGS. 10A-10C provide perspective views of an example of a
probe element having a protrusion on its base which may be slid
into retention structure on a substrate and locked in place by a
locking element.
[0054] FIGS. 11A-11D depict a probe and mount where the probe and
mount are shown as separated and engaged in the various figures and
where the mount includes a sideways deflectable cantilever arm that
includes a protrusion that is capable of locking a probe into a
desired position and further includes recesses for constraining the
vertical motion of a probe once it is loaded into the mount.
[0055] FIGS. 12A-12D depict a probe and mount according to another
alternative embodiment of the invention where the probe and mount
are shown in various separated and engaged positions and where the
probe includes a post element that includes elastic finger that can
be slide past similar fingers located within a rcess in the
mount.
[0056] FIGS. 13A-13C depict a probe and mount according to another
alternative embodiment of the invention where the probe and mount
are shown in various separated and engaged positions and where the
probe includes a post configuration that may be loaded into a
corresponding mount using motions that are orientated at angles
offset from the vertical and horizontal.
[0057] FIGS. 14A-14C depict a base structure similar to that shown
in FIG. 7A along with a probe element that is configured to mate
with the mount where the mating process uses a vertical motion
followed by a small horizontal motion to cause loading.
[0058] FIG. 15-17 depicts side views of additional embodiments of
probe mounts and probes that can be mated and locked together where
FIG. 15 shows a probe as having a plurality of elastic fingers that
can mat with a corresponding recession in a mount and FIGS. 16 and
17 show bases containing openings for receiving probe legs or posts
and where the base includes compliant elements for holding the
probe and base together.
[0059] FIGS. 18A and 18B depict separate and mounted views of a
probe and a base according to another embodiments of the invention
where the probe includes a bonding material on a rear surface of
its post and an extension on its forward surface for locking into a
recession in the base.
[0060] FIG. 19A and 19B depict a similar alternative embodiment to
that of FIGS. 18A and 18B with the exception that the bonding
material is on a forward surface of the post of the probe while an
extension is on its rear surface for locking into a recession in
the base.
[0061] FIG. 20 shows another embodiment where the probe and base
are shown separated and where the probe includes an extended base
element having a locking tap which can engage with an opening in a
cantilevered retention arm on the mount.
[0062] FIG. 21A-21C depict various mount elements that include
multiple recessions, i.e. sockets for receiving probes where the
inside portions of the sockets are coated with a conductive
material.
[0063] FIG. 22 depicts an alternative probe and mount configuration
that may be used in some embodiments where the probe as a more
verticial configuration.
[0064] FIG. 23 depicts an alternative probe post and mount
configuration that may be used according to some embodiments of the
invention.
[0065] FIG. 24 includes a probe base/post configuration and mount
configuration that allows for vertical loading followed by a
twisting motion that locks the probe and the mount together.
[0066] FIG. 25 depicts a further alternative embodiments where a
base structure is provided with multiple probe mounting locations
which may be selected between when a particular probe is to be
loaded into the mount.
DETAILED DESCRIPTION OF PREFERRED EMBODIMENTS OF THE INVENTION
[0067] FIGS. 1A-1 G, 2A-2F, and 3A-3C illustrate various features
of one form of electrochemical fabrication. Other electrochemical
fabrication techniques are set forth in the '630 patent referenced
above, in the various previously incorporated publications, in
various other patents and patent applications incorporated herein
by reference. Still others may be derived from combinations of
various approaches described in these publications, patents, and
applications, or are otherwise known or ascertainable by those of
skill in the art from the teachings set forth herein. All of these
techniques may be combined with those of the various embodiments of
various aspects of the invention to yield enhanced embodiments.
Still other embodiments may be derived from combinations of the
various embodiments explicitly set forth herein.
[0068] FIGS. 4A-4G illustrate various stages in the formation of a
single layer of a multi-layer fabrication process where a second
metal is deposited on a first metal as well as in openings in the
first metal where its deposition forms part of the layer. In FIG.
4A, a side view of a substrate 82 is shown, onto which patternable
photoresist 84 is cast as shown in FIG. 4B. In FIG. 4C, a pattern
of resist is shown that results from the curing, exposing, and
developing of the resist. The patterning of the photoresist 84
results in openings or apertures 92(a)-92(c) extending from a
surface 86 of the photoresist through the thickness of the
photoresist to surface 88 of the substrate 82. In FIG. 4D, a metal
94 (e.g. nickel) is shown as having been electroplated into the
openings 92(a)-92(c). In FIG. 4E, the photoresist has been removed
(i.e. chemically stripped) from the substrate to expose regions of
the substrate 82 which are not covered with the first metal 94. In
FIG. 4F, a second metal 96 (e.g., silver) is shown as having been
blanket electroplated over the entire exposed portions of the
substrate 82 (which is conductive) and over the first metal 94
(which is also conductive). FIG. 4G depicts the completed first
layer of the structure which has resulted from the planarization of
the first and second metals down to a height that exposes the first
metal and sets a thickness for the first layer. In FIG. 4H the
result of repeating the process steps shown in FIGS. 4B-4G several
times to form a multi-layer structure are shown where each layer
consists of two materials. For most applications, one of these
materials is removed as shown in FIG. 4I to yield a desired 3-D
structure 98 (e.g. component or device).
[0069] The various embodiments, alternatives, and techniques
disclosed herein may be combined with or be implemented via
electrochemical fabrication techniques. Such combinations or
implementations may be used to form multi-layer structures using a
single patterning technique on all layers or using different
patterning techniques on different layers. For example, different
types of patterning masks and masking techniques may be used or
even techniques that perform direct selective depositions may be
used without the need for masking. For example, conformable contact
masks may be used during the formation of some layers or during
some selective deposition or etching operations while
non-conformable contact masks may be used in association with the
formation of other layers or during other selective deposition or
etching operations. Proximity masks and masking operations (i.e.
operations that use masks that at least partially selectively
shield a substrate by their proximity to the substrate even if
contact is not made) may be used, and adhered masks and masking
operations (masks and operations that use masks that are adhered to
a substrate onto which selective deposition or etching is to occur
as opposed to only being contacted to it) may be used.
[0070] In many embodiments, cantilever probes offer good compliance
and may be formable from fewer layers than is required for forming
vertically extending probes (see for example U.S. patent
application Ser. Nos. 60/603,030, 10/772,943 and 60/641,341 ,each
of which is incorporated herein by reference) but at the cost of
consuming more substrate area. In some situations cantilevered
probes may be more preferred than vertically extending probes while
in other situations the reverse may be true.
[0071] In some embodiments, the simple cantilever structures
depicted may be replaced by more complex or sophisticated
structures. Cantilever elements may have more complex
configurations. In some embodiments the cantilever elements may be
replaced by vertical probe elements (i.e. probes that have bases
and tips that are substantially aligned along the primary axis of
the movement of the probe tip during compression or elongation of
the compliant element or elements of the probe.
[0072] Some embodiments of the present invention provide cantilever
structures that have base elements which can be made to interlock
with structures on a substrate so as to limit or restrain movement
between the base and the substrate in a Z direction and to limit or
restrain movement of the base relative to the substrate along a
dimension which is perpendicular to the Z direction. These
interlocking base structures may or may no have portions which
extend beyond the riser portion of the cantilever probe.
[0073] FIGS. 5A-5C depict examples of cantilever structures
502A-502C which have base elements 504A-504C which have "L" shapes
and which may be made to slide into a slotted structure on a
substrate and particularly a slotted structure that has an undercut
into which the base of the "L" may slide into. Such a base
structure is depicted in FIG. 6A while FIG. 6B depicts probe
structure 502A which has been slid into slotted structure 512 of
FIG. 6A.
[0074] Slotted structure 512 of FIG. 6A includes a cantilever
element 514 which offers some compliance and a snug fit as a probe
element is slid into place. In some embodiments, the base structure
of a probe element may take on an "L" shape configuration while in
other embodiments the base structure may have an upside down "T"
configuration such that when slid into a base element the structure
is locked into place on each side of the cantilever element. A "T"
shaped configuration is more clearly seen on the base elements of
probe elements 602A, 602B and 602C of FIG. 8.
[0075] Once slid into place the probe elements may be held in
position and in electrical contact with the substrate by frictional
forces or alternatively they may be locked into place by an
appropriate mechanical mechanism. In still other embodiments the
probe elements may be bonded to the base structures by solder or
conductive epoxy or the like. In some embodiments the probe
elements may be removable (if damaged) so that a replacement
element may be inserted. Such replacement may occur by simply
reversing the motion that led to mating in the first place, or by
releasing locking elements or by heating to melt a bonding material
or controlled etching to remove a bonding material or the like.
[0076] FIG. 7A depicts a perspective view of a mounting structure
that includes four clips 522A-522D as opposed to the two slots of
FIG. 6A. FIG. 7A shows where a slotted base structure like 512 of
FIG. 6A would be located using dashed outlines 524. In the
embodiment of FIG. 7A, two clips hold down each side of a "T"
shaped base structure. In some alternative embodiments, it may be
sufficient to have a single pair of clips hold a probe having an
"L" or "T" shaped base structure or having a base structure having
tabs that extend from an elongated base in those locations where
clips are to be located.
[0077] FIG. 7B depicts a top view of two sets of clip elements
522A-522D for two adjacent cantilever probes that are to be located
with a pitch corresponding to distance P.sub.1. With the clips
aligned with one another for holding adjacent probes, the probes
can not be formed any closer together because of a minimum feature
size limitation. FIG. 7C depicts a top view of two sets of clip
elements 522A-522D for two adjacent cantilever probes where the
locations of the clips have been shifted so that they may be
located closer together thereby allowing probes held by the sets of
clips to be located at a distance P.sub.2 from one another which is
smaller than distance P.sub.1.
[0078] The probe elements of FIGS. 5A-5C or other probe elements of
some embodiments of the present invention may be formed in an
upright position (i.e. with the height extending in the vertical or
Z direction and with layers being formed parallel to the XY plane.
In other embodiments the structures may be formed lying sideways
such that fewer layers are necessary to form the structures. If
formed on their sides multiple probes may be formed above one
another and interlacing of probe elements may occur to greatly
improve fabrication efficiency and yield.
[0079] Clip or retention elements into which probe elements will
have their bases inserted may be formed directly on space
transformers or other desired substrates or may alternatively be
transferred to space transformers or other desired substrates using
transfer techniques disclosed in a number of the applications set
forth below.
[0080] FIG. 8 depicts probe elements 602A-602C lying in a sideways
orientation and stacked one above the other as they may be formed
according to some embodiments of the invention.
[0081] In some embodiments, it may be possible to form and transfer
probe elements in groups while in other embodiments, transfer of
probe structures to space transformers or other desired substrates
may occur manually or by pick-and-place machines.
[0082] FIG. 9 depicts an alternative embodiment of the invention
where each probe element 602 or selected probe elements 602 are
separated from other probe elements by shields 604A and 604B. These
shield elements may provide improved impedance characteristics for
the signals that will be carried by probes 602. Shield elements
604A and 604B may be formed by techniques similar to those used in
forming probe elements 602. In some embodiments as previously
noted, probe elements may be made to mechanically lock into
position on base structures.
[0083] FIGS. 10A-10C show an example of a probe element 702, having
a protrusion 710 on its base, which may be slid into retention
structure 704 on a substrate 700 and locked in place by locking
element 706 which may be rotated up and down. When locking element
706 is in the down position probe element 402 may be slid into
position causing arms 708A and 708B to split apart and then reseat
around protrusion 710. If the probe element 702 needs to be
replaced, locking mechanism 708 may be rotated to an upper position
which releases element 710 and allows probe 702 to be removed from
base 704. In another alternative embodiment the cantilever element
514 of base 512 of FIG. 6A may have a locking element located at
its distal end which may be used to engage a hole or notch in a
base element, thus locking the probe and base together once the
desired mating position is reached.
[0084] Release of the probe element may occur by a tab or other
mechanism which would allow cantilever portion 514 to rotate upward
(not shown). It should be understood that other locking elements
may be used in fixing probe elements in desired positions relative
to otherwise unrestrained directions of motion. Such elements may
exist on the base structure itself as discussed with regard to FIG.
6A may exist on the backside of base structure as discussed in
association with FIGS. 10A-10C, or alternatively, they may be
located on the entry side of the base structure. Such locking
elements on the entry side might be spring-loaded elements that may
be momentarily pushed aside to allow the probe element to be mated
with the base and thereafter may be allowed to move back into a
locking position.
[0085] FIGS. 11A-11D depict a probe 812 and mount 802 where the
probe and mount are shown as separated and engaged in the various
figures and where the mount 802 includes a sideways deflectable
cantilever arm 804 having a distal protrusion that is capable of
locking a probe 812 into a desired position and further includes
recesses 806 for constraining the vertical motion of a probe once
it is loaded into the mount. As can be seen in the FIGS. probe 812
includes recess 814 for receiving the distal protrusion when it is
properly loaded into the mount and further more includes wings 816
for engaging recesses 806.
[0086] FIGS. 12A-12D depict a probe912 and mount 902 according to
another alternative embodiment of the invention where the probe and
mount are shown in various separated and engaged positions and
where the probe includes a post element 916 that includes elastic
fingers 914 that can be slid past similar fingers 904 located
within a recess 906 in mount 902. Loading of the probe into the
mount occurs by relative motion in the direction indicated by arrow
922.
[0087] FIGS. 13A-13C depict a probe 1012 and mount 1002 according
to another alternative embodiment of the invention where the probe
1012 and mount 1002 are shown in various separated and engaged
positions and where the probe 1012 includes a post configuration
1014 that may be loaded into a corresponding mount recess 1004
using motions that are orientated at angles 1022 and 1024 which are
not parallel to the vertical (Y) and horizontal (X) axes.
[0088] FIGS. 14A-14C depict a base structure 522A-522D similar to
that shown in FIG. 7A along with a probe element 552 having a
contact tip 554 and that is configured to mate, via feet 532A-532D,
(532D is not visible) with the mount 522A-522D where the mating
process uses a vertical motion 562 followed by a small horizontal
motion 564 where the horizontal motion is substantially less than
the horizontal length of the probe (e.g. less than 50% the length
of the probe, more preferably less than 25% of the length of the
probe, and more preferably less than 10% of the length of the
probe. The required horizontal loading distance is preferrrably
less than a distance that would significant interfere with the
loading of all probes into all mounts particularly as the loading
density of the probes increases.
[0089] FIG. 15-17 depicts side views of additional embodiments of
probe mounts and probes that can be mated and locked together where
FIG. 15 shows a probe as having a plurality of elastic fingers that
can mat with a corresponding recession in a mount and FIGS. 16 and
17 show bases containing openings for receiving probe legs or posts
and where the base includes compliant elements for holding the
probe and base together. The probe 112 of FIG. 15 includes lower
post portions 1114 (elastic fingers) and 1118 (guide bar) along
with a gap 1116 between them to mate with mount 1102 including
recesses 1104, guide opening 1108, and separating post 1106.
[0090] The probe 1152 of FIG. 16 includes post extensions 1154 and
1156 separated by a gap which respectively interface with openings
1144 and 1146 in mount 1142. Mount 1142 also include a retention
element 1148 which may for example be a spring-like structure.
[0091] The probe 1172 of FIG. 17 includes post extensions 1174 and
1178. From extension 1174 a finger 1176 which can engage in a slot
1166 in opening 1164 in mount 1162. Mount 1162 also includes a
second opening 1166 for engaging post extension 1178. As can be
seen in FIGS. 16 and 17, the compliant elements 1168 and 1148 may
be located on the rear portion of a mount or on a forward portion.
In alternative embodiments the compliant elements 1148 and 1168 may
be located in other areas of the mount or even located on the probe
itself.
[0092] FIGS. 18A and 18B depict separate and mounted views of a
probe 1212 and a mount 1202 according to another embodiment of the
invention where the probe 1212 includes a bonding material 1216
(such as solder) on a rear surface of its post 1218 and an
extension 1214 on its forward surface for locking into a recession
i1204 n the mount 1202.
[0093] FIGS. 19A and 19B depict a similar alternative embodiment to
that of FIGS. 18A and 18B with the exception that the bonding
material 1318 is on a forward surface of the post 1322 of the probe
1312 while an extension 1320 is on its rear surface for locking
into a recession 1310 in the base. As indicated the prove also
includes a tip 1314 and a cantilever element 1318
[0094] FIG. 20 shows another embodiment where probe 1412 and mount
1402 are shown separated and where the probe includes an extended
base element 1414 connected to a post 1412 which connects to a
cantilever portion which in turns connects to a tip 1418. The
extended base element has a locking tab 1416 which can engage with
an opening in a cantilevered retention arm on the mount.
[0095] FIG. 21A-21C depict various mount elements that include
multiple recessions, i.e. sockets for receiving probes where the
inside portions of the sockets are coated with a conductive
material.
[0096] FIG. 22 depicts an alternative probe and mount configuration
that may be used in some embodiments where the probe as a more
verticial configuration.
[0097] FIG. 23 depicts an alternative probe post and mount
configuration that may be used according to some embodiments of the
invention.
[0098] FIG. 24 includes a probe base/post configuration and mount
configuration that allows for vertical loading followed by a
twisting motion that locks the probe and the mount together.
[0099] FIG. 25 depicts further alternative embodiments where a base
structure is provided with multiple probe mounting locations which
may be selected between when a particular probe is to be loaded
into the mount.
[0100] In still other embodiments, contact between the base
structure and the probe element may occur by spring-like elements
that may be forced into compression or tension during the loading
of the probe element and which force may be used to constrain the
probe element from further motion once located in its desired
position.
[0101] In still other embodiments no locking elements may be
necessary but it may be desirable to include fixed stop elements
located on the probe and or base element that can interact with the
other components and which may be used to fix and/or detect proper
seating position once the probe is loaded into the base. In the
various embodiments of the invention discussed above, loading of
probe elements into base structures occurs by linear motion by the
mating of a slot or clips and a rail-like element.
[0102] In other embodiments, however, probe structures and base
structures may be designed to allow insertion and retention by
rotational motion with or without linear motion. Such rotational
motion may occur along an axis parallel to the Z direction or
alternatively it may occur along an axis of rotation perpendicular
to the Z direction (e.g. a 30.degree.-90.degree. rotation along the
X- or Y-axis). An example of such a mount and corresponding probe
base/post is shown in FIG. 24.
[0103] In still other embodiments, the rail-like structure forming
or on the base of the probe may be replaced by tabs. In still other
embodiments, the rail-like structure on or forming the base of the
probe may be moved to the substrate while clips or retention
structures may be moved to the base of the probe.
[0104] As with other embodiments of probe structures, the contact
portion of the probe structure may be formed from a different
material than the rest of the structure or it may alternatively be
formed from the same material. The configuration of the tip may
occur via the same process that is used to form the rest of the
probe structure or alternatively may involve the use of a different
process which may occur before, after, or in parallel to the
formation of the rest of the structure and which may be bonded to
the rest of the structure during formation or may be transferred
after formation of both the tip element and the rest of the probe
structure. In use of the probe elements of some embodiments, it
will typically be desired to have arrays of probe elements which
may be located in close proximity to one another and for which
different properties may be desired. As such, it may be
preferential in some embodiments to mix and match probe designs
with one another to achieve various results such as desired spacing
between elements or desired probe tip location in a given plane or
desired probe tip locations in multiple planes.
[0105] In some embodiments of the invention special tip structures
may be bonded to fabricated probe bodies or alternatively probe
bodies may be formed upside down and the probe bodies (e.g.
structurally compliant portion of the probes) may be formed on the
tip as build up begins. In still other embodiments, tip coating
material may be deposited onto the tip portion of the probe or onto
the whole probe after it is formed. In still other embodiments,
material deposited and patterned during formation of the probe may
be used as tip material. For example the layer or layers of the
probe may be considered the tip and these layers may simply be made
from tip material.
[0106] Additional two part probe embodiments are possible. In some
such embodiments, the probes may take a cantilever form or a more
vertical form. Cantilever probes may take on a variety of
configurations including probes with one or more post elements,
probes with one or more joined or un-joined cantilever segments, or
with one or more contact tips. The various cantilever designs
presented herein
[0107] In some embodiments, probes may be formed in an upright
position, an upside-down position, or on their sides.
[0108] In some embodiments, probe mounts (i.e. the portion of the
probe that is initially separated from the probe body and to which
the probe body will be attached after alignment and mounting) may
be formed on their side, right side up or upside-down, they maybe
formed on a permanent substrate or a temporary substrate and then
transferred to a permanent substrate. That may be formed in groups
which have desired relative positions for batch mounting or they
may be formed and thereafter placed in relative alignment for batch
mounting, or they may be during mounting. In various embodiments,
probe mounts may be made from one or more materials which may be
the same as or different from the materials from which the probe is
made. In some embodiments both the probes and the mounts will be
formed using electrochemical fabrication methods while in other
embodiments they may be formed using other techniques.
[0109] In some embodiments, the probes will be permanently mounted
in their sockets while in other cases they will be releasably
mounted. In some cases a combination of mounting methods may be
employed. In the case of releasably mounted probes it will probably
be easier to replace those than permanently mounted probes as
well.
[0110] The mounting approaches of the invention may be applied to
each of cantilever probes, vertical probes, and pin probes. Loading
of probes into bases may occur by horizontally sliding in (assuming
the substrate surface is horizontally orientated), tilting and
sliding in, heating the base or cooling the probe and sliding in,
vertical insertion, vertical insertion and twisting, vertical
insert and horizontal jog (e.g. small horizontal movement relative
to the dimension of the probe in the direction of movement).
[0111] Holding of probes to bases may occur by mechanical
interlocking, interference fitting (e.g. where loading occurs by
establishing a temperature differential), solder, gold-gold
bonding, adhesive, laser welding, ultrasonic bonding, thermo-sonic
bonding, thermo-pressure bonding embodiments, or the like.
[0112] Mounts and/or probes may include locking mechanisms,
alignment mechanisms, release mechanisms, or the like.
[0113] Some embodiments may employ diffusion bonding or the like to
enhance adhesion between successive layers of material. Various
teachings concerning the use of diffusion bonding in
electrochemical fabrication processes are set forth in U.S. patent
application Ser. No. 10/841,384, now abandoned, which was filed May
7, 2004 by Cohen et al. which is entitled "Method of
Electrochemically Fabricating Multilayer Structures Having Improved
Interlayer Adhesion" and which is hereby incorporated herein by
reference as if set forth in full.
[0114] Further teachings about microprobes and electrochemical
fabrication techniques are set forth in a number of U.S. Patent
Applications: (1) U.S. patent application Ser. No. 60/533,975 by
Kim et al., which was filed on Dec. 31, 2003, and which is entitled
"Microprobe Tips and Methods for Making"; (2) U.S. patent
application Ser. No. 60/533,947 by Kumar et al., which was filed on
Dec. 31, 2003, and which is entitled "Probe Arrays and Method for
Making"; (3) U.S. patent application Ser. No. 60/574,737 by Cohen
et al., which was filed May 26, 2004, and which is entitled
"Electrochemical Fabrication Method for Fabricating Space
Transformers or Co-Fabricating Probes and Space Transformers",; (4)
U.S. patent application Ser. No. 60/533,897 by Cohen et al. which
was filed on Dec. 31, 2003, and which is entitled "Electrochemical
Fabrication Process for Forming Multilayer Multimaterial Microprobe
structures"; (5) U.S. patent application Ser. No. 60/540,511 by
Kruglick et al, which was filed on Jan. 29, 2004, and which is
entitled "Electrochemically Fabricated Microprobes", (6) U.S.
patent application Ser. No. 10/772,943, by Arat et al., which was
filed Feb. 4, 2004, and which is entitled "Electrochemically
Fabricated Microprobes"; (7) U.S. patent application Ser. No.
60/582,690, filed Jun. 23, 2004, by Kruglick, and which is entitled
"Cantilever Microprobes with Base Structures Configured for
Mechanical Interlocking to a Substrate"; and (8) U.S. patent
application Ser. No. 60/582,689, filed Jun. 23, 2004 by Kruglick,
and which is entitled "Cantilever Microprobes with Improved Base
Structures and Methods for Making the Same". These patent filings
are each hereby incorporated herein by reference as if set forth in
full herein.
[0115] The techniques disclosed explicitly herein may also benefit
by combining them with the techniques disclosed in U.S. patent
application Ser. No.11/029,180, now abandoned, filed Jan. 3, 2005
by Chen et al. and entitled "Pin-Type Probes for Contacting
Electronic Circuits and Methods for Making Such Probes"; U.S.
patent application Ser. No. 60/641,341 filed Jan. 3, 2005 by Chen
et al. and entitled "Vertical Microprobes for Contacting Electronic
Components and Method for Making Such Probes"; U.S. patent
application Ser. No. 11/029,217, now U.S. Pat. No. 7,412,767, filed
Jan. 3, 2005 by Kim et al. and entitled "Microprobe Tips and
Methods For Making"; U.S. patent application Ser. No. 11/028,958,
now abandoned, filed Jan. 3, 2005 by Kumar et al. and entitled
"Probe Arrays and Methods for Making"; and U.S. patent application
Ser. No. 11/029,221 filed Jan. 3, 2005 by Cohen et al. and entitled
"Electrochemical Fabrication Process for Forming Multilayer
Multimaterial Microprobe Structures".
[0116] Further teachings about planarizing layers and setting
layers thicknesses and the like are set forth in the following U.S.
Patent Applications which were filed Dec. 31, 2003: (1) U.S. patent
application Ser. No. 60/534,159 by Cohen et al. and which is
entitled "Electrochemical Fabrication Methods for Producing
Multilayer Structures Including the use of Diamond Machining in the
Planarization of Deposits of Material" and (2) U.S. patent
application Ser. No. 60/534,183 by Cohen et al. and which is
entitled "Method and Apparatus for Maintaining Parallelism of
Layers and/or Achieving Desired Thicknesses of Layers During the
Electrochemical Fabrication of Structures". These patent filings
are each hereby incorporated herein by reference as if set forth in
full herein.
[0117] The techniques disclosed explicitly herein may benefit by
combining them with the techniques disclosed in U.S. patent
application Ser. No. 11/029,220, now U.S. Pat. No. 7,271,888, filed
Jan. 3, 2005 by Frodis et al. and entitled "Method and Apparatus
for Maintaining Parallelism of Layers and/or Achieving Desired
Thicknesses of Layers During the Electrochemical Fabrication of
Structures".
[0118] Additional teachings concerning the formation of structures
on dielectric substrates and/or the formation of structures that
incorporate dielectric materials into the formation process and
possibility into the final structures as formed are set forth in a
number of patent applications: (1) U.S. patent application Ser. No.
60/534,184, by Cohen, which as filed on Dec. 31, 2003, and which is
entitled "Electrochemical Fabrication Methods Incorporating
Dielectric Materials and/or Using Dielectric Substrates"; (2) U.S.
patent application Ser. No. 60/533,932, by Cohen, which was filed
on Dec. 31, 2003, and which is entitled "Electrochemical
Fabrication Methods Using Dielectric Substrates"; (3) U.S. patent
application Ser. No. 60/534,157, by Lockard et al., which was filed
on Dec. 31, 2004, and which is entitled "Electrochemical
Fabrication Methods Incorporating Dielectric Materials"; (4) U.S.
patent application Ser. No. 60/574,733, by Lockard et al., which
was filed on May 26, 2004, and which is entitled "Methods for
Electrochemically Fabricating Structures Using Adhered Masks,
Incorporating Dielectric Sheets, and/or Seed Layers that are
Partially Removed Via Planarization"; and U.S. patent application
Ser. No. 60/533,895, by Lembrikov et al., which was filed on Dec.
31, 2003, and which is entitled "Electrochemical Fabrication Method
for Producing Multi-layer Three-Dimensional Structures on a Porous
Dielectric". These patent filings are each hereby incorporated
herein by reference as if set forth in full herein.
[0119] The techniques disclosed explicitly herein may benefit by
combining them with the techniques disclosed in U.S. patent
application Ser. No. 11/029,216, now abandoned, filed Jan. 3, 2005
by Cohen et al. and entitled "Electrochemical Fabrication Methods
Incorporating Dielectric Materials and/or Using Dielectric
Substrates" and U.S. patent application Ser. No. 60/641,292 filed
Jan. 3, 2005 by Dennis R. Smalley and entitled "Method of Forming
Electrically Isolated Structures Using Thin Dielectric
Coatings".
[0120] The patent applications and patents set forth below are
hereby incorporated by reference herein as if set forth in full.
The teachings in these incorporated applications can be combined
with the teachings of the instant application in many ways: For
example, enhanced methods of producing structures may be derived
from some combinations of teachings, enhanced structures may be
obtainable, enhanced apparatus may be derived, and the like.
TABLE-US-00001 US Pat App No., Filing Date US App Pub No., Pub Date
US Patent No., Pub Date Inventor, Title 09/493,496 - Jan. 28, 2000
Cohen, "Method For Electrochemical Fabrication" U.S. Pat. No.
6,790,377 - Sep. 14, 2004 10/677,556 - Oct. 1, 2003 Cohen,
"Monolithic Structures Including Alignment and/or 2004-0134772 -
Jul. 15, 2004 Retention Fixtures for Accepting Components"
10/830,262 - Apr. 21, 2004 Cohen, "Methods of Reducing Interlayer
Discontinuities in 2004-0251142A - Dec. 16, 2004 Electrochemically
Fabricated Three-Dimensional Structures" U.S. Pat. No. 7,198,704 -
Apr. 3, 2007 10/271,574 - Oct. 15, 2002 Cohen, "Methods of and
Apparatus for Making High Aspect 2003-0127336A - Jul. 10, 2003
Ratio Microelectromechanical Structures" U.S. Pat. No. 7,288,178 -
Oct. 30, 2007 10/697,597 - Dec. 20, 2002 Lockard, "EFAB Methods and
Apparatus Including Spray 2004-0146650A - Jul. 29, 2004 Metal or
Powder Coating Processes" 10/677,498 - Oct. 1, 2003 Cohen,
"Multi-cell Masks and Methods and Apparatus for 2004-0134788 - Jul.
15, 2004 Using Such Masks To Form Three-Dimensional Structures"
U.S. Pat. No. 7,235,166 - Jun. 26, 2007 10/724,513 - Nov. 26, 2003
Cohen, "Non-Conformable Masks and Methods and 2004-0147124 - Jul.
29, 2004 Apparatus for Forming Three-Dimensional Structures" U.S.
Pat. No. 7,368,044 - May 6, 2008 10/607,931 - Jun. 27, 2003 Brown,
"Miniature RF and Microwave Components and 2004-0140862 - Jul. 22,
2004 Methods for Fabricating Such Components" U.S. Pat. No.
7,239,219 - Jul. 3, 2007 10/841,100 - May 7, 2004 Cohen,
"Electrochemical Fabrication Methods Including Use 2005-0032362 -
Feb. 10, 2005 of Surface Treatments to Reduce Overplating and/or
U.S. Pat. No. 7,109,118 - Sep. 19, 2006 Planarization During
Formation of Multi-layer Three- Dimensional Structures" 10/387,958
- Mar. 13, 2003 Cohen, "Electrochemical Fabrication Method and
2003-022168A - Dec. 4, 2003 Application for Producing
Three-Dimensional Structures Having Improved Surface Finish"
10/434,494 - May 7, 2003 Zhang, "Methods and Apparatus for
Monitoring Deposition 2004-0000489A - Jan. 1, 2004 Quality During
Conformable Contact Mask Plating Operations" 10/434,289 - May 7,
2003 Zhang, "Conformable Contact Masking Methods and 20040065555A -
Apr. 8, 2004 Apparatus Utilizing In Situ Cathodic Activation of a
Substrate" 10/434,294 - May 7, 2003 Zhang, "Electrochemical
Fabrication Methods With 2004-0065550A - Apr. 8, 2004 Enhanced Post
Deposition Processing" 10/434,295 - May 7, 2003 Cohen, "Method of
and Apparatus for Forming Three- 2004-0004001A - Jan. 8, 2004
Dimensional Structures Integral With Semiconductor Based Circuitry"
10/434,315 - May 7, 2003 Bang, "Methods of and Apparatus for
Molding Structures 2003-0234179 A - Dec. 25, 2003 Using Sacrificial
Metal Patterns" U.S. Pat. No. 7,229,542 - Jun. 12, 2007 10/434,103
- May 7, 2004 Cohen, "Electrochemically Fabricated Hermetically
Sealed 2004-0020782A - Feb. 5, 2004 Microstructures and Methods of
and Apparatus for U.S. Pat. No. 7,160,429 - Jan. 9, 2007 Producing
Such Structures" 10/841,006 - May 7, 2004 Thompson,
"Electrochemically Fabricated Structures Having 2005-0067292 - May
31, 2005 Dielectric or Active Bases and Methods of and Apparatus
for Producing Such Structures" 10/434,519 - May 7, 2003 Smalley,
"Methods of and Apparatus for Electrochemically 2004-0007470A -
Jan. 15, 2004 Fabricating Structures Via Interlaced Layers or Via
Selective U.S. Pat. No. 7,252,861 - Aug. 7, 2007 Etching and
Filling of Voids" 10/724,515 - Nov. 26, 2003 Cohen, "Method for
Electrochemically Forming Structures 2004-0182716 - Sep. 23, 2004
Including Non-Parallel Mating of Contact Masks and U.S. Pat. No.
7,291,254 - Nov. 6, 2007 Substrates" 10/841,347 - May 7, 2004
Cohen, "Multi-step Release Method for Electrochemically
2005-0072681 - Apr. 7, 2005 Fabricated Structures" 60/533,947 -
Dec. 31, 2003 Kumar, "Probe Arrays and Method for Making"
60/534,183 - Dec. 31, 2003 Cohen, "Method and Apparatus for
Maintaining Parallelism of Layers and/or Achieving Desired
Thicknesses of Layers During the Electrochemical Fabrication of
Structures" 11/733,195 - Apr. 9, 2007 Kumar, "Methods of Forming
Three-Dimensional Structures 2008-0050524 - Feb. 28, 2008 Having
Reduced Stress and/or Curvature" 11/506,586 - Aug. 8, 2006 Cohen,
"Mesoscale and Microscale Device Fabrication 2007-0039828 - Feb.
22, 2007 Methods Using Split Structures and Alignment Elements"
10/949,744 - Sep. 24, 2004 Lockard, "Three-Dimensional Structures
Having Feature 2005-0126916 - Jun. 16,2005 Sizes Smaller Than a
Minimum Feature Size and Methods U.S. Pat. No. 7,498,714 - Mar. 3,
2009 for Fabricating"
[0121] Various other embodiments of the present invention exist.
Some embodiments may not use any blanket deposition process and/or
they may not use a planarization process. Some embodiments may use
selective deposition processes or blanket deposition processes on
some layers that are not electrodeposition processes. Some
embodiments, for example, may use nickel, nickel-phosphorous,
nickel-cobalt, gold, copper, tin, silver, zinc, solder, rhodium,
rhenium as structural materials while other embodiments may use
different materials. Some embodiments, for example, may use copper,
tin, zinc, solder or other materials as sacrificial materials. Some
embodiments may use different structural materials on different
layers or on different portions of single layers. Some embodiments
may use photoresist, polyimide, glass, ceramics, other polymers,
and the like as dielectric structural materials.
[0122] It will be understood by those of skill in the art that
additional operations may be used in variations of the above
presented fabrication embodiments. These additional operations may,
for example, perform cleaning functions (e.g. between the primary
operations discussed above), they may perform activation functions
and monitoring functions.
[0123] It will also be understood that the probe elements of some
aspects of the invention may be formed with processes which are
very different from the processes set forth herein and it is not
intended that structural aspects of the invention need to be formed
by only those processes taught herein or by processes made obvious
by those taught herein.
[0124] Many other alternative embodiments will be apparent to those
of skill in the art upon reviewing the teachings herein. Further
embodiments may be formed from a combination of the various
teachings explicitly set forth in the body of this application.
Even further embodiments may be formed by combining the teachings
set forth explicitly herein with teachings set forth in the various
applications and patents referenced herein, each of which is
incorporated herein by reference.
[0125] In view of the teachings herein, many further embodiments,
alternatives in design and uses of the instant invention will be
apparent to those of skill in the art. As such, it is not intended
that the invention be limited to the particular illustrative
embodiments, alternatives, and uses described above but instead
that it be solely limited by the claims presented hereafter.
* * * * *