U.S. patent application number 12/237233 was filed with the patent office on 2010-02-11 for heat sink assembly.
This patent application is currently assigned to HONG FU JIN PRECISION INDUSTRY(ShenZhen) CO., LTD.. Invention is credited to NING-YU WANG, YUN-ZHI YANG, ZHI-JIANG YAO.
Application Number | 20100032134 12/237233 |
Document ID | / |
Family ID | 40809761 |
Filed Date | 2010-02-11 |
United States Patent
Application |
20100032134 |
Kind Code |
A1 |
YANG; YUN-ZHI ; et
al. |
February 11, 2010 |
HEAT SINK ASSEMBLY
Abstract
An assembly includes a circuit board and a heat sink apparatus
attached to the motherboard. The heat sink apparatus has at least
two screws, and a first mistake-proof structure. A plurality of
screw holes are defined in the circuit board corresponding to the
screws. The circuit board has a second mistake-proof structure
corresponding to the first mistake-proof structure. The first
mistake-proof structure engages with the second mistake-proof
structure to align the heat sink apparatus to the circuit board in
only one configuration.
Inventors: |
YANG; YUN-ZHI; (Shenzhen
City, CN) ; YAO; ZHI-JIANG; (Shenzhen City, CN)
; WANG; NING-YU; (Shenzhen City, CN) |
Correspondence
Address: |
PCE INDUSTRY, INC.;ATT. Steven Reiss
288 SOUTH MAYO AVENUE
CITY OF INDUSTRY
CA
91789
US
|
Assignee: |
HONG FU JIN PRECISION
INDUSTRY(ShenZhen) CO., LTD.
Shenzhen City
CN
HON HAI PRECISION INDUSTRY CO., LTD.
Tu-Cheng
TW
|
Family ID: |
40809761 |
Appl. No.: |
12/237233 |
Filed: |
September 24, 2008 |
Current U.S.
Class: |
165/80.2 |
Current CPC
Class: |
H01L 2924/0002 20130101;
H01L 23/4006 20130101; H01L 2924/0002 20130101; H01L 2924/00
20130101 |
Class at
Publication: |
165/80.2 |
International
Class: |
F28F 7/00 20060101
F28F007/00 |
Foreign Application Data
Date |
Code |
Application Number |
Aug 8, 2008 |
CN |
200820301792.6 |
Claims
1. An assembly comprising: a heat sink apparatus comprising at
least two screws and a first mistake-proof structure; and a circuit
board comprising a second mistake-proof structure corresponding to
the first mistake-proof structure, wherein at least two screw holes
corresponding to the at least two screws are defined in the circuit
board; wherein the first mistake-proof structure engages with the
second mistake-proof structure to align the heat sink apparatus to
the circuit board.
2. The assembly of claim 1, wherein the at least two screws
comprises four screws arranged symmetrically; the first
mistake-proof structure is adjacent to one of the four screws.
3. The assembly of claim 2, wherein the heat sink apparatus has
four corners; a supporting piece extends from each corner of the
heat sink apparatus; each of the four screws are attached to each
of the supporting pieces; the first mistake-proof structure is
attached to a first of the supporting pieces.
4. The assembly of claim 3, wherein the first mistake-proof
structure is a mistake-proof member; a mounting hole is defined in
the first of the supporting pieces for receiving the mistake-proof
member.
5. The assembly of claim 4, wherein the second mistake-proof
structure is a mistake-proof hole defined in the circuit board for
receiving the mistake-proof member.
6. The assembly of claim 4, wherein the mistake-proof member
comprises a cap resisting against a top surface of the first of the
supporting pieces, and a ring resisting against a bottom surface of
the first of the supporting pieces.
7. The assembly of claim 6, wherein the cap is frustoconical
shaped; a diameter of a top side of the cap is less than a diameter
of a bottom side of the cap; a diameter of the mounting hole is
greater than the diameter of the top side of the cap, but less than
the diameter of the bottom side of the cap.
8. The assembly of claim 7, wherein the diameter of the mounting
hole is less than an outer diameter of the ring.
9. The assembly of claim 7, wherein a groove is defined in the cap
and divides the cap symmetrically.
10. An assembly comprising: a heat sink apparatus comprising a
plurality of screws arranged at corners of the heat sink apparatus
and a mistake-proof member attached at one of the corners; and a
circuit board defining a plurality of screw holes corresponding to
the plurality of screws and a mistake-proof hole corresponding to
the mistake-proof member; wherein the plurality of screws are
capable of threadedly engaging with the plurality of screws holes
only if the mistake-proof member is aligned with the mistake-proof
hole, thereby preventing the heat sink apparatus to be attached to
the circuit board in an incorrect configuration.
11. The assembly of claim 10, wherein a plurality of supporting
pieces extend from the corners of the heat sink apparatus; the
plurality of screws are attached to the supporting pieces; the
mistake-proof member is attached to a first of the supporting
pieces.
12. The assembly of claim 11, wherein a mounting hole is defined in
the first of the supporting pieces for receiving the mistake-proof
member.
13. The assembly of claim 12, wherein the mistake-proof member
comprises a cap resisting against a top surface of the first of the
supporting pieces, and a ring resisting against a bottom surface of
the first of the supporting pieces.
14. The assembly of claim 13, wherein the cap is frustoconical
shaped; a diameter of a top side of the cap is less than a diameter
of a bottom side of the cap, a diameter of the mounting hole is
greater than the diameter of the top side of the cap, but less than
the diameter of the bottom side of the cap.
15. The assembly of claim 14, wherein the diameter of the mounting
hole is less than an outer diameter of the ring.
16. The assembly of claim 14, wherein a groove is defined in the
cap and divides the cap symmetrically.
Description
BACKGROUND
[0001] 1. Technical Field
[0002] The present invention relates to a heat sink assembly which
is mistake proof in assembly.
[0003] 2. Description of Related Art
[0004] A typical heat sink assembly includes a motherboard having a
plurality of threaded holes, and a heat sink fastened to the
motherboard. Screws are threadedly engaged in the screw holes to
secure the heat sink apparatus to the motherboard to dissipate heat
generated by a heat generating component, such as a CPU on the
motherboard. Since the screws of the heat sink apparatus are
arranged symmetrically, the heat sink apparatus can be secured to
the motherboard in various orientations, such that the heat sink
apparatus may be attached incorrectly, thereby impairing heat
dissipation efficiency.
[0005] Therefore, a mistake proof heat sink assembly is desired to
overcome the above-described shortcomings.
BRIEF DESCRIPTION OF THE DRAWINGS
[0006] FIG. 1 is an exploded view of an embodiment of a heat sink
assembly, the assembly including a motherboard, a heat sink
apparatus, and a mistake-proof member;
[0007] FIG. 2 is another view of the mistake-proof member of FIG.
1;
[0008] FIG. 3 is an assembly view of FIG. 1;
DETAILED DESCRIPTION OF THE EMBODIMENTS
[0009] Referring to FIG. 1, an embodiment of a heat sink assembly
includes a motherboard 10, a heat sink apparatus 20 configured for
dissipating heat generated by a heat generating component on the
motherboard 10, and a mistake-proof member 30.
[0010] The heat sink apparatus 20 includes four supporting pieces
22 at four corners thereof and four screws 24 attached to distal
ends of the supporting pieces 22. A mounting hole 26 is defined in
one of the four supporting pieces 22 for receiving the
mistake-proof member 30. Four screw holes 12 are defined in the
motherboard 10 corresponding to the screws 24 of the heat sink
apparatus 20. A mistake-proof hole 14 is defined in the motherboard
30 corresponding to the mounting hole 26 for receiving the
mistake-proof member 30.
[0011] Referring to FIG. 2, the mistake-proof member 30 includes a
post 32, a cap 34 formed at a top of the post 32, and a ring 36
formed under the cap 34. A distance between the cap 34 and the ring
36 is approximately equal to a thickness of the supporting piece
22. A groove 341 is defined in the cap 34 and an upper portion of
the post 32 for increasing the elasticity of the cap 34. The cap 34
is frustoconical shaped such that a diameter of a top side is less
than a diameter of a bottom side. A diameter of the mounting hole
26 greater than the diameter of the top side of the cap 34, but
less than that of the bottom side of the cap 34 and the outer
diameter of the ring 36. The cap 34 is symmetrically divided by the
groove 341.
[0012] Referring to FIG. 3, in assembly, the mistake-proof member
30 is attached to the mounting hole 26 of the supporting piece 22.
The top side of the cap 34 of the mistake-proof member 30 is
inserted into the mounting hole 26 upwardly from a back side of the
supporting piece 22 toward a top side of the supporting piece 22.
The cap 34 is elastically compressed in the mounting hole 26 and
returns to its original shape and size when the bottom side of the
cap extends through the mounting hole 26 and resists against the
top side of the supporting piece 22. The ring 36 of the
mistake-proof member 30 is resisted against the back side of the
supporting piece 22. The mistake-proof member 30 is aligned with
the mistake-proof hole 14 and the screws 24 of the heat sink
apparatus 20 are secured in the screw holes 12 of the motherboard
10 in only one configuration with the mistake-proof member 30
engaged in the mistake-proof hole 14.
[0013] It is to be understood, however, that even though numerous
characteristics and advantages of the present embodiments have been
set forth in the foregoing description, together with details of
the structure and function of the embodiments, the disclosure is
illustrative only, and changes may be made in detail, especially in
matters of shape, size, and arrangement of parts within the
principles of the embodiments to the full extent indicated by the
broad general meaning of the terms in which the appended claims are
expressed.
* * * * *