Heat Sink Assembly

YANG; YUN-ZHI ;   et al.

Patent Application Summary

U.S. patent application number 12/237233 was filed with the patent office on 2010-02-11 for heat sink assembly. This patent application is currently assigned to HONG FU JIN PRECISION INDUSTRY(ShenZhen) CO., LTD.. Invention is credited to NING-YU WANG, YUN-ZHI YANG, ZHI-JIANG YAO.

Application Number20100032134 12/237233
Document ID /
Family ID40809761
Filed Date2010-02-11

United States Patent Application 20100032134
Kind Code A1
YANG; YUN-ZHI ;   et al. February 11, 2010

HEAT SINK ASSEMBLY

Abstract

An assembly includes a circuit board and a heat sink apparatus attached to the motherboard. The heat sink apparatus has at least two screws, and a first mistake-proof structure. A plurality of screw holes are defined in the circuit board corresponding to the screws. The circuit board has a second mistake-proof structure corresponding to the first mistake-proof structure. The first mistake-proof structure engages with the second mistake-proof structure to align the heat sink apparatus to the circuit board in only one configuration.


Inventors: YANG; YUN-ZHI; (Shenzhen City, CN) ; YAO; ZHI-JIANG; (Shenzhen City, CN) ; WANG; NING-YU; (Shenzhen City, CN)
Correspondence Address:
    PCE INDUSTRY, INC.;ATT. Steven Reiss
    288 SOUTH MAYO AVENUE
    CITY OF INDUSTRY
    CA
    91789
    US
Assignee: HONG FU JIN PRECISION INDUSTRY(ShenZhen) CO., LTD.
Shenzhen City
CN

HON HAI PRECISION INDUSTRY CO., LTD.
Tu-Cheng
TW

Family ID: 40809761
Appl. No.: 12/237233
Filed: September 24, 2008

Current U.S. Class: 165/80.2
Current CPC Class: H01L 2924/0002 20130101; H01L 23/4006 20130101; H01L 2924/0002 20130101; H01L 2924/00 20130101
Class at Publication: 165/80.2
International Class: F28F 7/00 20060101 F28F007/00

Foreign Application Data

Date Code Application Number
Aug 8, 2008 CN 200820301792.6

Claims



1. An assembly comprising: a heat sink apparatus comprising at least two screws and a first mistake-proof structure; and a circuit board comprising a second mistake-proof structure corresponding to the first mistake-proof structure, wherein at least two screw holes corresponding to the at least two screws are defined in the circuit board; wherein the first mistake-proof structure engages with the second mistake-proof structure to align the heat sink apparatus to the circuit board.

2. The assembly of claim 1, wherein the at least two screws comprises four screws arranged symmetrically; the first mistake-proof structure is adjacent to one of the four screws.

3. The assembly of claim 2, wherein the heat sink apparatus has four corners; a supporting piece extends from each corner of the heat sink apparatus; each of the four screws are attached to each of the supporting pieces; the first mistake-proof structure is attached to a first of the supporting pieces.

4. The assembly of claim 3, wherein the first mistake-proof structure is a mistake-proof member; a mounting hole is defined in the first of the supporting pieces for receiving the mistake-proof member.

5. The assembly of claim 4, wherein the second mistake-proof structure is a mistake-proof hole defined in the circuit board for receiving the mistake-proof member.

6. The assembly of claim 4, wherein the mistake-proof member comprises a cap resisting against a top surface of the first of the supporting pieces, and a ring resisting against a bottom surface of the first of the supporting pieces.

7. The assembly of claim 6, wherein the cap is frustoconical shaped; a diameter of a top side of the cap is less than a diameter of a bottom side of the cap; a diameter of the mounting hole is greater than the diameter of the top side of the cap, but less than the diameter of the bottom side of the cap.

8. The assembly of claim 7, wherein the diameter of the mounting hole is less than an outer diameter of the ring.

9. The assembly of claim 7, wherein a groove is defined in the cap and divides the cap symmetrically.

10. An assembly comprising: a heat sink apparatus comprising a plurality of screws arranged at corners of the heat sink apparatus and a mistake-proof member attached at one of the corners; and a circuit board defining a plurality of screw holes corresponding to the plurality of screws and a mistake-proof hole corresponding to the mistake-proof member; wherein the plurality of screws are capable of threadedly engaging with the plurality of screws holes only if the mistake-proof member is aligned with the mistake-proof hole, thereby preventing the heat sink apparatus to be attached to the circuit board in an incorrect configuration.

11. The assembly of claim 10, wherein a plurality of supporting pieces extend from the corners of the heat sink apparatus; the plurality of screws are attached to the supporting pieces; the mistake-proof member is attached to a first of the supporting pieces.

12. The assembly of claim 11, wherein a mounting hole is defined in the first of the supporting pieces for receiving the mistake-proof member.

13. The assembly of claim 12, wherein the mistake-proof member comprises a cap resisting against a top surface of the first of the supporting pieces, and a ring resisting against a bottom surface of the first of the supporting pieces.

14. The assembly of claim 13, wherein the cap is frustoconical shaped; a diameter of a top side of the cap is less than a diameter of a bottom side of the cap, a diameter of the mounting hole is greater than the diameter of the top side of the cap, but less than the diameter of the bottom side of the cap.

15. The assembly of claim 14, wherein the diameter of the mounting hole is less than an outer diameter of the ring.

16. The assembly of claim 14, wherein a groove is defined in the cap and divides the cap symmetrically.
Description



BACKGROUND

[0001] 1. Technical Field

[0002] The present invention relates to a heat sink assembly which is mistake proof in assembly.

[0003] 2. Description of Related Art

[0004] A typical heat sink assembly includes a motherboard having a plurality of threaded holes, and a heat sink fastened to the motherboard. Screws are threadedly engaged in the screw holes to secure the heat sink apparatus to the motherboard to dissipate heat generated by a heat generating component, such as a CPU on the motherboard. Since the screws of the heat sink apparatus are arranged symmetrically, the heat sink apparatus can be secured to the motherboard in various orientations, such that the heat sink apparatus may be attached incorrectly, thereby impairing heat dissipation efficiency.

[0005] Therefore, a mistake proof heat sink assembly is desired to overcome the above-described shortcomings.

BRIEF DESCRIPTION OF THE DRAWINGS

[0006] FIG. 1 is an exploded view of an embodiment of a heat sink assembly, the assembly including a motherboard, a heat sink apparatus, and a mistake-proof member;

[0007] FIG. 2 is another view of the mistake-proof member of FIG. 1;

[0008] FIG. 3 is an assembly view of FIG. 1;

DETAILED DESCRIPTION OF THE EMBODIMENTS

[0009] Referring to FIG. 1, an embodiment of a heat sink assembly includes a motherboard 10, a heat sink apparatus 20 configured for dissipating heat generated by a heat generating component on the motherboard 10, and a mistake-proof member 30.

[0010] The heat sink apparatus 20 includes four supporting pieces 22 at four corners thereof and four screws 24 attached to distal ends of the supporting pieces 22. A mounting hole 26 is defined in one of the four supporting pieces 22 for receiving the mistake-proof member 30. Four screw holes 12 are defined in the motherboard 10 corresponding to the screws 24 of the heat sink apparatus 20. A mistake-proof hole 14 is defined in the motherboard 30 corresponding to the mounting hole 26 for receiving the mistake-proof member 30.

[0011] Referring to FIG. 2, the mistake-proof member 30 includes a post 32, a cap 34 formed at a top of the post 32, and a ring 36 formed under the cap 34. A distance between the cap 34 and the ring 36 is approximately equal to a thickness of the supporting piece 22. A groove 341 is defined in the cap 34 and an upper portion of the post 32 for increasing the elasticity of the cap 34. The cap 34 is frustoconical shaped such that a diameter of a top side is less than a diameter of a bottom side. A diameter of the mounting hole 26 greater than the diameter of the top side of the cap 34, but less than that of the bottom side of the cap 34 and the outer diameter of the ring 36. The cap 34 is symmetrically divided by the groove 341.

[0012] Referring to FIG. 3, in assembly, the mistake-proof member 30 is attached to the mounting hole 26 of the supporting piece 22. The top side of the cap 34 of the mistake-proof member 30 is inserted into the mounting hole 26 upwardly from a back side of the supporting piece 22 toward a top side of the supporting piece 22. The cap 34 is elastically compressed in the mounting hole 26 and returns to its original shape and size when the bottom side of the cap extends through the mounting hole 26 and resists against the top side of the supporting piece 22. The ring 36 of the mistake-proof member 30 is resisted against the back side of the supporting piece 22. The mistake-proof member 30 is aligned with the mistake-proof hole 14 and the screws 24 of the heat sink apparatus 20 are secured in the screw holes 12 of the motherboard 10 in only one configuration with the mistake-proof member 30 engaged in the mistake-proof hole 14.

[0013] It is to be understood, however, that even though numerous characteristics and advantages of the present embodiments have been set forth in the foregoing description, together with details of the structure and function of the embodiments, the disclosure is illustrative only, and changes may be made in detail, especially in matters of shape, size, and arrangement of parts within the principles of the embodiments to the full extent indicated by the broad general meaning of the terms in which the appended claims are expressed.

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