U.S. patent application number 12/191414 was filed with the patent office on 2010-02-04 for wafer container with constraints.
Invention is credited to Chin-Ming LIN, Kuan-Lun Pan.
Application Number | 20100025288 12/191414 |
Document ID | / |
Family ID | 41607234 |
Filed Date | 2010-02-04 |
United States Patent
Application |
20100025288 |
Kind Code |
A1 |
LIN; Chin-Ming ; et
al. |
February 4, 2010 |
Wafer container with constraints
Abstract
A wafer container includes a container body with an opening on
one side, and the inside with slots for placing the wafers. The
door joined with the opening of the container body to protect the
wafer therein, the characteristic in that: two rows of the
plurality of wafer restraint components with a spaced at interval
is located on the inner surface of the door and adjacent to the
central of the door, in which the each wafer restraint component
includes a base portion, which one end is fixed on the inner
surface of the door, and another end is joined with a bent arm. The
bent arm includes a first contact head and a second contact head to
restrict the wafer moving toward the opening of the door.
Inventors: |
LIN; Chin-Ming; (Shulin
City, TW) ; Pan; Kuan-Lun; (Shulin City, TW) |
Correspondence
Address: |
SINORICA, LLC
2275 Research Blvd., Suite 500
ROCKVILLE
MD
20850
US
|
Family ID: |
41607234 |
Appl. No.: |
12/191414 |
Filed: |
August 14, 2008 |
Current U.S.
Class: |
206/711 |
Current CPC
Class: |
H01L 21/67369
20130101 |
Class at
Publication: |
206/711 |
International
Class: |
B65D 85/00 20060101
B65D085/00 |
Foreign Application Data
Date |
Code |
Application Number |
Jul 31, 2008 |
TW |
097128928 |
Claims
1. A wafer container including a container body that having a
plurality of slots therein for placing a plurality of wafers; an
opening, is formed on a sidewall of said wafer container for
exporting said plurality of wafers or importing said plurality of
wafers; and a door including an outer surface and an inner surface,
wherein said inner surface of said door is joined with said opening
of said container body for protecting said plurality of wafers
therein, the characteristic in that: two rows of restraint modules
are disposed on said inner surface of said door and adjacent to
said central of said door, each restraint module consist a
plurality of restraint components with a spaced at interval, and
one restraint component aligned said restraint component of said
restraint module, wherein each said restraint component includes a
base portion, one end of said base portion is fixed on said inner
surface of said door, and another end of said base portion is
joined with a bent arm, and said bent arm includes a first contact
head and a second contact head.
2. The wafer container according to claim 1, wherein said restraint
module is an integrated structure.
3. The wafer container according to claim 1, wherein said restraint
module is integrated with said inner surface of said door.
4. The wafer container according to claim 1, wherein said restraint
component is an integrated structure.
5. The wafer container according to claim 1, wherein said restraint
component is integrated with said inner surface of said door.
6. The wafer container according to claim 1, wherein said restraint
component is an elastic component.
7. The wafer container according to claim 1, wherein said restraint
component is a thermoplastic elastomer.
8. The wafer container according to claim 1, wherein said base
portion of said restraint component is an elastic component.
9. The wafer container according to claim 1, wherein said base
portion of said restraint component is a thermoplastic
elastomer.
10. The wafer container according to claim 1, where the material is
different between said base portion of said restraint component and
said bent arm.
11. The wafer container according to claim 1, wherein the plastic
material is different between said base portion of said restraint
and said bent arm.
12. The wafer container according to claim 1, wherein said first
contact head and said second contact head of said bent arm include
a recess to restrict said wafer from moving.
13. The wafer container according to claim 1, wherein a connecting
line between said first contact head and said second contact head
is parallelled said inner surface of said door before said door
joined with said container body.
14. The wafer container according to claim 1, wherein an included
angle is formed between a connecting line of said first contact
head and said second contact head and said inner surface of said
door when said door in joined with said container body.
15. The wafer container according to claim 1, wherein said base
portion of said restraint component is curved so as to said first
contact head and said second contact head contacted said wafer.
16. The wafer container according to claim 1, wherein said wafer
contacted said first contact head to deform said base portion so
that said second contact head is contacted said wafer.
17. The wafer container according to claim 1, wherein said wafer
contacted said first contact head to doform said base portion and
lever said bent arm so that said second contact head is contacted
said wafer.
18. The wafer container according to claim 1, wherein said base
portion of said restraint component includes at least a curve
portion.
19. The wafer container according to claim 1, wherein said wafer
contacted said first contact head to change said included angle of
said curve portion of said base portion so that said second contact
head is contacted said wafer.
20. The wafer container according to claim 1, wherein said wafer
contacted said first contact head to change said included angle of
said curved portion of said base portion and lever said curved arm
so that said second contact arm is contacted said wafer.
21. The wafer container according to claim 1, wherein said outer
door includes at least a latch component thereon.
22. A wafer container including a container body that having a
plurality of slots therein for placing a plurality of wafers; an
opening, is formed on a sidewall of said wafer container for
exporting said plurality of wafers or importing said plurality of
wafers; and a door including an outer surface and an inner surface,
wherein said inner surface of said door is joined with said opening
of said container body for protecting said plurality of wafers
therein, the characteristic in that: two row restraint modules are
disposed on said inner surface of said door and adjacent to said
central of said door, each restraint module consist a plurality of
restraint components with a spaced at interval, and one restraint
component aligned said restraint component of said restraint
module, wherein each said restraint component includes a base
portion, one end of said base portion is joined with a first bent
arm and said first bent arm includes two free-ends, a first contact
head is formed on one of two free-ends which is related to said
inner surface of said door and adjacent to said central portion,
and another free-end is related to said first contact head that is
joined with a second bent arm, and said second bent arm includes a
second contact head and a third contact head.
23. The wafer container according to claim 22, wherein said first
bent arm is located between said two free-ends and a pivot is
formed and adjacent to a sidewall of said inner surface.
24. The wafer container according to claim 23, wherein said pivot
is fixed on said inner surface.
25. The wafer container according to claim 22, wherein said
restraint module is an integrated structure.
26. The wafer container according to claim 22, wherein said
restraint module is integrated with said inner surface of said
door.
27. The wafer container according to claim 22, wherein said
restraint component is an integrated structure.
28. The wafer container according to claim 22, wherein said
restraint component is integrated with said inner surface of said
door.
29. The wafer container according to claim 22, wherein said
restraint component is an elastic component.
30. The wafer container according to claim 22, wherein said
restraint component is a thermoplastic elastomer.
31. The wafer container according to claim 22, wherein said base
portion of said restraint component is an elastic component.
32. The wafer container according to claim 22, wherein said base
portion of said restraint component is a thermoplastic
elastomer.
33. The wafer container according to claim 22, wherein the material
is different between said base portion of said restraint component
and said first bent arm.
34. The wafer container according to claim 22, wherein the material
is different between said base portion of said restraint component
and said second bent arm.
35. The wafer container according to claim 22, wherein the plastic
material is different between said base portion of said restraint
component and said first bent arm.
36. The wafer container according to claim 22, wherein the plastic
material is different between said base portion of said restraint
material and said second bent arm.
37. The wafer container according to claim 22, wherein said first
contact head, said second contact head, and said third contact head
of said restraint component include a recess to restrict said wafer
from moving.
38. The wafer container according to claim 22, wherein a connecting
line between said first contact head, said second contact head, and
said third contact head is parallelled said inner surface of said
door before said door joined with said container body.
39. The wafer container according to claim 22, wherein an included
angle is formed between a connecting line of said first contact
head, said second contact head, and said third contact head and
said inner surface of said door when said door joined with said
container body.
40. The wafer container according to claim 22, wherein said base
portion of said restraint component is curved so as to said first
contact head, said second contact head, and said third contact head
contacted said wafer.
41. The wafer container according to claim 22, wherein said wafer
contacted said first contact head to deform said base portion, so
that said second contact head and said third contact head is
contacted said wafer.
42. The wafer container according to claim 22, wherein said wafer
contacted said first contact head to curve said base portion and
lever said first bent arm and said second bent arm, so that said
second contact head and said third contact head is contacted said
wafer.
43. The wafer container according to claim 22, wherein said base
portion of said restraint component includes at least a curved
portion.
44. The wafer container according to claim 22, wherein said wafer
is contacted said first contact head to change said included angle
of said curved portion of said base portion, so that said second
contact head and said third contact head contacted said wafer.
45. The wafer container according to claim 22, wherein said wafer
contacted said first contact head to change said included angle of
said curved portion of said base portion and lever said first bent
arm and said second bent arm, so that said second contact head and
said third contact head contacted said wafer.
46. The wafer container according to claim 22, wherein said outer
surface includes at least a latch component.
47. A wafer container including a container body that having a
plurality of slots therein for placing a plurality of wafers; an
opening, is formed on a sidewall of said wafer container for
exporting said plurality of wafers or importing said plurality of
wafers; and a door including an outer surface and an inner surface,
wherein said inner surface of said door is joined with said opening
of said container body for protecting said plurality of wafers
therein, the characteristic in that: a restraint module is located
on said inner surface of said door and adjacent to a central
portion of said door, and a plurality of restraint components with
a spaced at interval is located on a central portion of said base
portion, each curved portion are formed on a central portion of
said base portion and toward two sides of said central portion, and
a free-end of each said curved portion is formed a semicircle-like
protruding portion to contact so as to a central portion of said
semicircle-like protruding portion is contacted said wafers.
48. The wafer container according to claim 47, wherein said wafer
restraint module is an integrated structure.
49. The wafer container according to claim 47, wherein said wafer
restraint module is integrated with said inner surface of said
door.
50. The wafer container according to claim 47, wherein a
wear-resisting material is located on the contact surface between
said guide notch of said protruding portion and said wafer.
51. The wafer container according to claim 50, wherein the material
of said wear-resisting material is PEEK material.
52. The wafer container according to claim 47, wherein the width of
said guide notch of said protruding portion is same as the
thickness of said wafer to restrict said wafer from moving.
53. The wafer container according to claim 47, wherein an included
angle is located between said base portion and said curve
portion.
54. The wafer container according to claim 53, wherein said
included angle is about 10 to 60 degree.
55. The wafer container according to claim 47, wherein said base
portion of said restraint module includes a plurality of snap holes
to snap said wafer restraint module on said inner surface of said
door.
56. The wafer container according to claim 55, wherein said inner
surface of said door corresponding to said plurality of snap holes
includes a snap pillar to wedge said wafer restraint module on said
inner surface of said door.
57. The wafer container according to claim 47, wherein said
restraint component is ability of elasticity.
58. The wafer container according to claim 47, wherein said outer
surface includes at least a latch component.
Description
BACKGROUND OF THE INVENTION
[0001] 1. Field of the Invention
[0002] The present invention is related to a front opening unified
pod (FOUP), more particularly to the wafer container with the wafer
restraint modules. The wafer restraint having a plurality of
contact heads to restrict the wafer from moving.
[0003] 2. Description of the Prior Art
[0004] The semiconductor wafers are transferred to different
stations to apply the various processes in the required equipments.
A sealed container is provided for automatic transfer to prevent
the pollution. FIG. 1 shows the views of wafer container of the
conventional prior art. The wafer container is a front opening
unified pod (FOUP) which includes a container body 10 and a door
20. The container body 10 is disposed a plurality of slots for
placing the plurality of wafers, and an opening 12 is located on
the sidewall of the container body 10 for loading or unloading.
Further, the door 20 includes an outer surface 21 and an inner
surface 22, in which the door 20 is joined the opening 12 of the
container body 10 to protect the plurality of wafers within the
container body 10. Furthermore, at least one latch component 23 is
disposed on the outer surface 21 of the door 20 for opening or
closing the wafer container. According to aforementioned, due to
the wafer is placed in the container body 10 in horizontal, thus,
the FOUP needs a wafer restraint component to avoid from movement
during the wafer transportation. FIG. 2 is a view of a front
opening unified pod (FOUP) as described in U.S. Pat. No. 6,736,268.
As shown in FIG. 2, the inner surface 22 of the door 20 is disposed
with a recess 24 and the recess 24 is extended from the top 221 of
the inner surface 22 to the bottom 222, and is located between two
locking components 230 (inside of the door 200). The wafer
restraint module (not shown) further includes the recess 24, in
which the wafer restraint module consists two wafer restraint
components 100, and each wafer restraint component 100 includes a
plurality of wafer contact heads 110 to sustain the wafers, so as
to prevent the wafer from the movement toward the door opening due
to the wafer transportation procedure. However, the wafer restraint
module is disposed on the recess 24 of the inner surface 22 of the
door 20, and the wafer merely is attached to the inner surface 22
of the door 20 or the wafer is partially settled down within the
recess 24. The wafers either sit adjacent to the inner surface 22
of the door 20 or only slightly enter into the recess 24. As
resulted, the wafers do not securely and fully settle into the
recess 24 in order to effectively shorten the length between the
front side and the back side of the FOUP. In addition, the tiny
dust particles are generated due to the friction between the wafer
restraint module and the wafers can be easily accumulated in the
recess 24. In the process of cleaning the accumulated dust
particles, it is necessary to separate the wafer restraint module
from the recess 24 on the inner surface 22 of the door 20. By
frequently separation and assembly of the wafer restraint module
due to the cleaning process, the wafer restraint module is easily
slackened.
SUMMARY OF THE INVENTION
[0005] According to the drawbacks of the aforementioned, one
objective of the present invention is thus to provide a wafer
container with wafer restraint modules, which is disposed on the
inner surface of the door and adjacent two sides of central of
door, in which each wafer restraint includes a plurality of contact
head to restrict the wafer from moving toward the opening of the
wafer container and toward the two sides of the opening. As
results, the tiny dust particles can be prevented formed from the
friction between the wafer and the wafer restraint component to
contaminate.
[0006] Another objective of the present invention is to provide a
wafer container with wafer restraint module, where the wafer
restraint module is disposed on the two sides of the inner surface
of the door and adjacent to the two sides of the central of the
door. Each wafer restraint component includes a plurality of
contact heads to contact the wafer sequentially, thereby, the
contact heads can sustain the wafer to restrict the tiny dust
particles are formed from the friction between the wafer and the
wafer restraint component to contaminate the wafers.
[0007] Still another objective of present invention is to provide a
wafer container with a wafer restraint component. The wafer
restraint component is located on the inner surface of the door and
adjacent to the two sides of the central of the door, in which the
wafer restraint component is integrated with the inner surface of
the door. Thus, the structure of the wafer container is simple and
has lower manufacturing cost.
[0008] According to above objectives, the present invention
provides a wafer container with a wafer restraint module, which
includes a container body, and a door. The inner surface of the
container body includes a plurality of slots for sustain a
plurality of wafers therein; a side-wall of the container body
includes an opening for exporting or importing the plurality of
wafers; a plurality of restraint components with a spaced at
interval is located on the inner surface of the door and adjacent
to the central of the door, in which each wafer restraint component
includes a base portion, which one end of the base portion is fixed
on the inner surface of the door, and anther end is joined with the
bent arm. The bent arm includes a first contact head and a second
contact head which are provided for the wafer restraint component
to restrict the wafer from moving toward the opening and two sides
of the opening of the door.
BRIEF DESCRIPTION OF THE DRAWINGS
[0009] The foregoing aspects and many of the attendant advantages
of this invention will become more readily appreciated as the same
becomes better understood by reference to the following detailed
description, when taken in conjunction with the accompanying
drawings, wherein:
[0010] FIG. 1 is a sectional view of the wafer container of the
prior art;
[0011] FIG. 2 is a sectional view of the wafer restraint component
of the prior art;
[0012] FIG. 3 is a view of the wafer container of the first
embodiment of the present invention;
[0013] FIG. 4A is a view of the wafer restraint component contacted
the wafer container of the first embodiment of the present
invention;
[0014] FIG. 4B is a view of the wafer restraint component restricts
the wafer of the first embodiment of the present invention;
[0015] FIG. 5 is a view of the another wafer container of second
embodiment of the present invention;
[0016] FIG. 6A is a view of the wafer restraint component contacted
the wafer container of the second embodiment of the present
invention;
[0017] FIG. 6B is a view of the wafer restraint component restricts
the wafer of the second embodiment of the present invention;
[0018] FIG. 7 is a view of the wafer container of the third
embodiment of the present invention;
[0019] FIG. 8A is a view of the wafer restraint component contacted
the wafer container of the third embodiment of the present
invention;
[0020] FIG. 8B is a view of the wafer restraint component restricts
the wafer of the of the third embodiment of the present
invention;
[0021] FIG. 9 is a view of the wafer restraint component fixed on
the door of the present invention; and
[0022] FIG. 10 is a view of the wafer restraint component of the
third embodiment of the present invention.
DESCRIPTION OF THE PREFERRED EMBODIMENT
[0023] Referring to FIG. 3 shows a view of the wafer container of
the first embodiment. The wafer container is a front opening
unified pod (FOUP) which includes a container body 10 and a door
20. A plurality of slots 11 is disposed in the inside of the
container body 10 to place a plurality of wafers therein, and an
opening is located on one of sidewalls of the container body 10
that is provided for loading or exporting a plurality of wafers or
importing a plurality of wafers. The door 20 includes an outer
surface 21 and an inner surface 22, in which at least one latch
component (not shown) is disposed on the outer surface 21 for
opening or closing the front opening unified pod. Two rows of wafer
restraint modules 400 is disposed on the inner surface 22 of the
door 20 and adjacent to the central portion of the door 20, and
each wafer restraint module 400 consists of a plurality of wafer
restraint components with a spaced at interval. Each wafer
restraint component 40 is aligned and adjacent to the each wafer
restraint component 40 of the wafer restraint module 40.
[0024] Referring to FIG. 4 and according to abovementioned, each
wafer restraint component 40 of the plurality of wafer restraint
components 40 includes a base portion 41, which one end of the base
portion 41 is fixed on the inner surface 22 of the door 20, and
another end of the base portion 41 is joined with a bent arm 42, in
which the bent arm 42 includes a first contact head 43 and a second
contact head 44. Each wafer restraint component 40 can be formed as
an elastic integrated structure (such as thermoplastic elastomer).
Before the door 20 joined with the container 10, a connecting line
for the first contact head 43 and the second contact head 44 of the
wafer restraint component 40 is paralleled the inner surface 22 of
the door 20. When the wafer is contacted the first contact head 43
to deform the base portion 41 to lever the bent arm 42, so that
second contact head 44 of the bent arm 42 is contacted
sequentially. Referring to FIG. 4B, an included angle is formed on
the connecting line which is located between the first contact head
43 and the second contact head 44 and the inner surface 22 of the
door 20. Obviously, the wafer restraint component 40 contacted the
wafer via two contact heads, which can restrict the wafer from
moving toward the central of the opening of the door 20 and toward
the two sides of the opening of the door 20.
[0025] The base portion 41 of the wafer restraint component 40 and
the bent arm 42 of the abovementioned can be made of two different
materials or different elastic structures (such as thermoplastic
elastomer), for example, the plastic with different hardness. Thus,
the deformation of the base portion 41 is formed easily, and the
bent arm 42 is difficult being deformed. With such, the one-half
portion of the wafer restraint component 40 can provide a fine
deformation, and another half can provide a lever bent arm 42. Not
only the material of the wafer restraint component 40 or base
portion 41 of the wafer restraint component 40 is an elasticity
structure (such as thermoplastic elastomer) which is provided for
deforming, so that the first contact head 43 and the second contact
head 44 are contacted the wafer sequentially, but also the
elasticity structure is capability of shockproof to prevent the
wafer from moving toward the opening of the container body 10.
Also, the base portion 41 includes at least one curved portion,
which the angle of the curved portion would be changed to drive the
movement of the bent arm 42 to cause the second contact head 44 is
contacted the wafer when the wafer is contacted the first contact
head 43. The first contact head 43 and the second contact head 44
also include a recess which is provided for fall within the wafer
to restrict the wafer from moving. The plurality of wafer restraint
components 40 can form as pedestal which is fixed on the inner
surface 20 of the door 20. Alternatively, the plurality of wafer
restraint components 40 is integrated with the inner surface 22 of
the door 20, thus, the manufacturing cost can be reduced.
[0026] FIG. 5 shows view of a second wafer container of the present
invention. The structure of the wafer container is similar to the
wafer container of the first embodiment according to
aforementioned. The wafer container includes a container body 10
and a door 20. The different between the first embodiment and the
second embodiment is that the wafer restraint component of the
wafer restraint module 500 includes three contact heads, in which
the wafer restraint component is fixed on the two sides of the
central portion of the inner surface 22 of the door 20.
[0027] As shown in FIG. 6A, each wafer restraint component 50
includes a base portion 51, which one end is fixed on the inner
surface 22 of the door 20, and another end of the base portion 51
is joined with the first bent arm 52 which includes two free-ends,
in which the one free-end is located adjacent to said central
portion and is formed as a first contact head 54, and another
free-end is located far away from the central portion and is joined
with the second bent arm 53. The second bent arm 53 includes a
second contact head 55 and a third contact head 56. In this
embodiment, the material, structural, and the action of the
structure are similar to aforementioned. Before the door 20 joined
with the container body 10, a connecting line (54-55-56) for the
first contact head 54, the second contact head 55, and the third
contact head 56 is paralleled the inner surface 22 of the door 20.
Meanwhile, when the wafer is contacted the first contact head 54,
the base portion 51 would be deformed to drive the movement of
first bent arm 52 and the second bent arm 53, so that the second
contact head 55 and the third contact head 56 of the second bent
arm 53 are contacted the wafer sequentially. Meanwhile, as shown in
FIG. 6B, the door 20 is joined with the container body 10 and the
first contact head 54, an included angle is located between the
connecting line for the second contact head 55, and the third
contact head 56 and the inner surface 22 of the door 20. Obviously,
due to each wafer restraint component 50 provides the contact head
for the wafer to restrict the wafer from moving toward the center
of the opening or toward the two sides of the opening. In addition,
a pivot 57 is located in the middle of the two free-ends of the
first bent arm 52 and adjacent to one side of the inner surface 22
of the door 20, thereby, the pivot 57 is fixed on the inner surface
22 of the door 20. When the base portion 51 is deformed to lever
the movement of the first bent arm 52 and the second bent arm 53,
and the first contact head 54, the second contact head 55, and the
third contact head 56 is contacted the wafer tightly. As
aforementioned, each wafer restraint component 50 of the plurality
of wafer restraint component 50 is an integrated structure with
elasticity (such as thermoplastic elastomer). The base portion 51
and the first bent arm 52 or second bent arm 53 are made of
different material or different elasticity structure (such as
thermoplastic elastomer), for example, the plastic material with
different hardness. Thus, the base portion 51 can be deformed
easily, but the deformation is difficult to the bent arms. The
first contact head 54, the second contact head 55, and the third
contact head 56 also include a recess to fall within the wafer to
prevent the wafer from moving. In addition, the plurality of wafer
restraint components 50 is formed on the pedestal, which is fixed
on the inner surface 22 of the door 20 or the plurality of wafer
restraint component 50 is integrated with the inner surface 22 of
the door 20 directly.
[0028] Then, FIG. 7 shows a view of the wafer container of third
embodiment of the present invention. The inner surface 22 of the
door 20 is arranged a restraint module 600 and adjacent to the
center of the inner surface 22 of the door 20. The restraint module
600 consists a plurality of wafer restraint components 60 with a
spaced at interval. As shown in FIG. 8A and FIG. 8B, each wafer
restraint component 60 of the plurality of wafer restraint
components 60 is ability of elasticity. When the wafer is contacted
the wafer restraint component 60 (as shown in FIG. 8A), the
slightly area of the wafer restraint component 60 is contacted the
wafer; after the door 20 is joined with the container body 10 (as
shown in FIG. 8B), the wafer restraint component 60 is deformed to
increase the contact area between the wafer and the wafer restraint
component 60.
[0029] As shown in FIG. 9 and FIG. 10, the plurality of wafer
restraint components 60 with a spaced at interval is formed on the
pedestal 61, so that a wafer restraint module 600 is formed. The
pedestal 61 includes a plurality of snap holes 63, which includes a
snap pillar 24 that is formed relate to the inner surface 22, so
that the wafer restraint module 600 is snapped on the middle of the
inner surface of the door 20. The center of the pedestal 61
includes a plurality of wafer restraint components 60 and a gap is
formed in the middle of the wafer restraint components 60 so that
the wafer restraint component 60 is corresponding to the wafer that
is related to the container body 10. Each curved portion 62 is
formed on two sides of the center of the pedestal 61, and a
free-end of the curved portion 62 is formed as a semicircle-like
protruding portion 62C, so that the guide notch 62G of the
semicircle-like protruding portion 62C is contacted the wafer. The
wear-resisting material (such as PEEK material) is coated on the
contact portion between the guide notch 62G and the wafer to reduce
the friction and the generation of the dust particles. Furthermore,
the width of the guide notch 62G is same as the thickness of the
wafer to restrict the wafer from the moving and the wafer is full
within the guide notch 62G. Obviously, an included angle .theta. is
located between the pedestal 61 and the curved portion, in which
the included angle .theta. is about 10 to 60 degree. When the
included angle is smaller to increase the distance of the guide
notch 62G, the wafer is moved toward the outside of the opening;
when the included angle is larger, the wafer is moved toward the
center of the opening.
[0030] While the invention has been described by way of examples
and in terms of the preferred embodiments, it is to be understood
that the invention is not limited to the disclosed embodiments. To
the contrary, it is intended to cover various modifications and
similar arrangements as would be apparent to those skilled in the
art. Therefore, the scope of the appended claims should be accorded
the broadest interpretation so as to encompass all such
modifications and similar arrangements.
* * * * *