U.S. patent application number 12/326112 was filed with the patent office on 2010-02-04 for heat dissipation device.
This patent application is currently assigned to FU ZHUN PRECISION INDUSTRY (SHEN ZHEN) CO., LTD.. Invention is credited to XIN-XIANG ZHA.
Application Number | 20100025013 12/326112 |
Document ID | / |
Family ID | 41607144 |
Filed Date | 2010-02-04 |
United States Patent
Application |
20100025013 |
Kind Code |
A1 |
ZHA; XIN-XIANG |
February 4, 2010 |
HEAT DISSIPATION DEVICE
Abstract
An exemplary heat dissipation device includes a plurality of
parallel fins, a heat pipe extending through the fins, and a
guiding structure formed on each of the fins. An airflow channel is
formed between every two neighboring fins for an airflow flowing
therethough. The guiding structure is formed for guiding the
airflow to flow to the heat pipe. A space is defined within the
guiding structure and has a width decreasing gradually along a
flowing direction of the airflow. An opening is defined in the
guiding structure for communicating airflow at two opposite sides
of each fin. A height of the guiding structure decreases gradually
from the opening towards other sides of the guiding structure.
Inventors: |
ZHA; XIN-XIANG; (Shenzhen
City, CN) |
Correspondence
Address: |
PCE INDUSTRY, INC.;ATT. Steven Reiss
288 SOUTH MAYO AVENUE
CITY OF INDUSTRY
CA
91789
US
|
Assignee: |
FU ZHUN PRECISION INDUSTRY (SHEN
ZHEN) CO., LTD.
Shenzhen City
CN
FOXCONN TECHNOLOGY CO., LTD.
Tu-Cheng
TW
|
Family ID: |
41607144 |
Appl. No.: |
12/326112 |
Filed: |
December 2, 2008 |
Current U.S.
Class: |
165/80.3 |
Current CPC
Class: |
H01L 23/3672 20130101;
H01L 2924/0002 20130101; F28F 1/32 20130101; H01L 23/427 20130101;
H01L 23/467 20130101; F28F 13/06 20130101; F28D 15/0275 20130101;
F28D 15/0266 20130101; H01L 2924/0002 20130101; H01L 2924/00
20130101 |
Class at
Publication: |
165/80.3 |
International
Class: |
F28F 7/00 20060101
F28F007/00 |
Foreign Application Data
Date |
Code |
Application Number |
Jul 31, 2008 |
CN |
200810303275.7 |
Claims
1. A heat dissipation device comprising: a plurality of parallel
fins with an airflow channel formed between every two neighboring
fins for an airflow flowing therethough; a heat pipe extending
through the fins; and a guiding structure being formed on each of
the fins for guiding the airflow flowing to the heat pipe, a space
being defined within the guiding structure and having a width
decreasing gradually along a flowing direction of the airflow, at
least one opening being defined in the guiding structure for
communicating airflow at two opposite sides of each fin, a height
of the guiding structure decreasing gradually from the at least one
opening towards other sides of the guiding structure.
2. The heat dissipation device of claim 1, wherein the guiding
structure comprises two guiding members protruding from a reference
surface of each fin, the two guiding members arranged symmetrically
to the heat pipe.
3. The heat dissipation device of claim 2, wherein each of the
guiding members comprises a linear inner side facing the space and
an opposite curved outer side, the at least one opening having two
in number, the openings being defined in the inner sides of the two
guiding members respectively, the height of each guiding member
with respect to the reference surface of the each fin decreasing
gradually from the inner side towards the outer side.
4. The heat dissipation device of claim 3, wherein the outer sides
of the guiding members smoothly connect with the reference surface
of each fin.
5. The heat dissipation device of claim 3, wherein the guiding
members cooperatively form a converged side adjacent to the heat
pipe and a diverged side facing the airflow, the airflow flowing
first into the space via the diverged side, then being guided
towards the converged side, and finally being concentrated at an
area of each fin near to the heat pipe.
6. The heat dissipation device of claim 2, wherein each of the
guiding members comprises a curved inner side facing the space, an
opposite curved outer side away from the space, a windward side
interconnected between ends of the inner side and the outer side
facing the airflow, and a leeward side interconnected between ends
of the inner side and the outer side away from the airflow, the at
least one opening having two in number, the openings being defined
in the windward sides of the guiding members respectively.
7. The heat dissipation device of claim 6, wherein the height of
each guiding member with respect to the reference surface of each
fin decreases gradually from the windward side towards the leeward
side.
8. The heat dissipation device of claim 7, wherein the leeward
sides of the guiding members smoothly connect with the reference
surface of each fin.
9. The heat dissipation device of claim 6, wherein the guiding
members cooperatively form a diverged side facing the airflow and a
converged side in rear of the heat pipe, and the airflow flows into
the space via the diverged side and then is concentrated at the
converged side after flowing through the heat pipe.
10. The heat dissipation device of claim 1, wherein the guiding
structure comprises a middle portion and two sloping side portions
extending from the middle portion, and the middle portion is curved
and forms a converged side in rear of the heat pipe, the two
sloping side portions each comprising a linear windward side facing
the airflow, the at least one opening having two in number, the
openings being defined in the windward sides of the sloping side
portions, respectively, a diverged side being formed between the
linear windward sides of the sloping side portions.
11. The heat dissipation device of claim 10, wherein the guiding
structure protrudes from a reference surface of each fin, the
height of the guiding structure decreasing gradually from the
windward sides of the sloping side portions towards the middle
portion.
12. A heat dissipation device comprising: a plurality of fins
arranged side by side, each fin defining a hole, a flange extending
from a reference surface of the each fin around the hole, an
airflow channel being formed between every two neighboring fins for
an airflow flowing therethough; a heat pipe extending through the
hole and thermally connecting with the flange; and two guiding
members protruding from the reference surface for guiding the
airflow flowing to the heat pipe, a space being defined between the
two guiding members and having a width decreasing gradually along a
flowing direction of the airflow, each of the guiding members
comprising a linear windward side facing the airflow, two openings
being defined in the windward sides of the two guiding members
respectively, the openings being configured for communicating the
airflow at two opposite sides of each fin.
13. The heat dissipation device of claim 12, wherein the two
guiding members are arranged symmetrically to the heat pipe, each
of the guiding members comprising a linear inner side functioning
as the windward side and an opposite curved outer side, the
openings being defined in the inner sides of the two guiding
members respectively, a height of each guiding member decreasing
gradually from the inner side towards the outer side.
14. The heat dissipation device of claim 12, wherein the two
guiding members are arranged symmetrically to the heat pipe, each
of the guiding members comprising a curved inner side facing the
space, an opposite curved outer side away from the space, the
windward side interconnected between ends of the inner side and the
outer side facing the airflow, and a leeward side interconnected
between ends of the inner side and the outer side away from the
airflow, a height of each guiding member decreasing gradually from
the windward side towards the leeward side.
Description
BACKGROUND
[0001] 1. Technical Field
[0002] The disclosure relates to heat dissipation devices, and
particularly to a heat dissipation device with improved fin
structure for achieving a high heat-dissipation efficiency.
[0003] 2. Description of related art
[0004] With the advance of large scale integrated circuit
technology, and the wide spread of use of computers in all trades
and occupations, in order to meet the required improvement in data
processing load and request-response times, high speed processors
have become faster and faster, which causes the processors to
generate redundant heat. Redundant heat which is not quickly
removed will have tremendous influence on the system security and
performance. Usually, people install a heat sink on the central
processor to assist its heat dissipation, whilst also installing a
fan on the heat sink, to provide a forced airflow to increase the
heat dissipation.
[0005] FIG. 8 shows a conventional heat dissipation device 1. The
heat dissipation device 1 includes a fin unit 2, a heat pipe 4
extending through the fin unit 2, and a cooling fan (not shown)
arranged at a side of the fin unit 2 so as to generate an airflow
towards the fin unit 2. The fin unit 2 includes a plurality of fins
stacked together. Each fin is planar and parallel to each other. A
flow channel 3 is formed between two adjacent fins. The heat pipe 4
includes an evaporating section for thermally connecting with a
heat-generating component and condensing sections extending into
through holes of the fin unit 2 and thermally connecting with the
fins.
[0006] During operation of the heat-generating component, the heat
pipe 4 absorbs heat generated by the heat-generating component. The
heat is transferred from the evaporating section to the condensing
sections and then on to the fins of the fin unit 2. At the same
time, the airflow generated by the cooling fan flows through the
flow channels 3 to exchange heat with the fins. The heat is
dissipated to the surrounding environment by the airflow. Thus,
heat dissipation of the heat-generating component is
accomplished.
[0007] For enhancing the heat dissipation effectiveness of this
heat dissipation device 1, the heat dissipation area of the fin
unit 2 needs to be increased. One way to increase the heat
dissipation area of the fin unit 2 is to accommodate more fins or
to increase the size of each fin. However, this increases the
weight of the heat dissipation device 1, which conflicts with the
requirement for light weight and compactness. Another way to
increase the heat dissipation area of the fin unit 2 is reducing
the spacing distance of two adjacent fins, so that the fin unit 2
can accommodate more fins. This way may avoid increasing the volume
of heat dissipation device 1; however, reducing the spacing between
two adjacent fins of the fin unit 2 will increase the flow
resistance, which not only influences the heat dissipation effect
but also increases the noise. Also, due to the planar shape of each
fin of the fin unit 2, the airflow flows evenly through every part
of the fin. However, such an even airflow distribution on the fin
cannot effectively take heat from the fin which usually is
concentrated at a particular portion of the fin. Thus, the airflow
of the conventional heat dissipation device 1 cannot effectively
dissipate the heat in the fins of the fin unit 2. Therefore, the
airflow flowing through the fin unit 2 cannot sufficiently assist
the heat dissipation of the heat-generating component. Furthermore,
due to the influence of viscosity, a laminar air envelope may form
at lateral sides of each fin, when the airflow flows through the
fin unit 2. The flowing speed of the airflow in the laminar
envelope is nearly zero; in the laminar envelope, the main way of
heat dissipation of the fins is by heat radiation and the heat
exchange effect between the fin unit 2 and the airflow is thus
greatly reduced. Accordingly, the heat dissipation effectiveness of
the conventional heat dissipation device 1 is limited.
[0008] It is thus desirable to provide a heat dissipation device
which can overcome the described limitations.
SUMMARY
[0009] The present invention relates to a heat dissipation device.
According to an exemplary embodiment of the present invention, the
heat dissipation device includes a plurality of parallel fins, a
heat pipe extending through the fins, and a guiding structure. An
airflow channel is formed between every two neighboring fins for an
airflow flowing therethough. The guiding structure is formed on
each of the fins for guiding the airflow flowing to the heat pipe.
A space is defined between the guiding structure and has a width
decreasing gradually along a flowing direction of the airflow. At
least one opening is defined in the guiding structure for
communicating airflow at two opposite sides of each fin. A height
of the guiding structure decreases gradually from the at least one
opening towards other sides of the guiding structure.
[0010] Other advantages and novel features of the present invention
will become more apparent from the following detailed description
of embodiment when taken in conjunction with the accompanying
drawings.
BRIEF DESCRIPTION OF THE DRAWINGS
[0011] FIG. 1 is an assembled, isometric view of a heat dissipation
device in accordance with a first embodiment.
[0012] FIG. 2 is an isometric view of a fin of the heat dissipation
device of FIG. 1.
[0013] FIG. 3 is a view similar to FIG. 2, but shown from a
different aspect.
[0014] FIG. 4 is an isometric view of a fin in accordance with a
second embodiment.
[0015] FIG. 5 is a view similar to FIG. 4, but shown from a
different aspect.
[0016] FIG. 6 is an isometric view of a fin in accordance with a
third embodiment.
[0017] FIG. 7 is a view similar to FIG. 6, but shown from a
different aspect.
[0018] FIG. 8 is a side view of a conventional heat dissipation
device.
DETAILED DESCRIPTION OF THE EMBODIMENTS
[0019] Reference will now be made to the drawings to describe the
various embodiments in detail.
[0020] Referring to FIG. 1, a heat dissipation device according to
a first embodiment includes a heat sink 10 and a heat pipe 12. The
heat pipe 12 includes an evaporation section 121 thermally
contacting with an electronic component 14 and a condenser section
122 extending through a central portion of the heat sink 10. The
evaporation section 121 absorbs heat generated by the electronic
component 14. The heat is transferred from the evaporation section
121 to the condenser section 122, and then on to the heat sink 10.
A cooling fan (not shown) is arranged at one side (i.e., right side
of this embodiment) of the heat sink 10 for generating an airflow
towards the heat sink 10 as indicated by arrows F.
[0021] The heat sink 10 includes a plurality of fins 11 arranged
side by side and parallel to each other. Referring to FIG. 2 and
FIG. 3, each of the fins 11 includes a rectangular main body 110
which has a reference surface 1101 and a base surface 1102. A flow
channel 13 is formed between every two neighboring fins 11 to
channel the airflow generated by the fan. A through hole 1104 is
defined in each of the main body 110 of the fins 11 for receiving
the condenser section 122 of the heat pipe 12. The shape and size
of the through hole 1104 can change according to the heat pipe 12.
A circular flange 1105 extends outwardly from a border of the
through hole 1104 of the reference surface 1101 of each fin 11
towards the base surface 1102 of an adjacent fin 11, and a length
of the flange 1105 is nearly equal to a distance between the two
adjacent fins 11. When the heat sink 10 is assembled together, the
flanges 1105 of each fin 11 contact the border of the through hole
1104 of the base surface 1102 of the adjacent fin 11. Thus, the
through holes 1104 cooperatively form a columned space for the heat
pipe 12 extending through, and the flanges 1105 enclose and contact
with the heat pipe 12, which enlarges the contacting surface area
between the heat pipe 12 and the fins 11. So, heat absorbed by the
heat pipe 12 can be quickly transferred to the fins 11 for further
dissipation.
[0022] A guiding structure 113 includes two spaced first and second
guiding members 1131, 1132 located adjacent the through hole 1104
and protruding from the reference surface 1101 of each fin 11. Two
concave hollows 1151, 1152 corresponding to the two guiding members
1131, 1132 are formed in the base surface 1102 of the fin 11. The
first guiding member 1131 and the second guiding member 1132 locate
at a top side and a bottom side of the through hole 1104,
respectively. The first and second guiding members 1131, 1132 are
substantially symmetric to a horizontal axis X-X (FIG. 3) which
extends through a center of the through hole 1104 of the fin 11.
Each of the first guiding member 1131 and the second guiding member
1132 is substantially straight, and extends aslant from a position
adjacent to the flange 1105 towards a corner of the main body 110,
i.e., the first guiding member 1131 extending upward and rightward
towards a top corner located at a right side of the fin 11 adjacent
to the fan, the second guiding member 1132 extending downward and
rightward towards a bottom corner located at the right side of the
fin 11 adjacent to the fan. A distance between the first guiding
member 1131 and the axis X-X decreases gradually along the
direction of the airflow (as indicated by the arrows F). Similarly,
a distance between the second guiding member 1132 and the axis X-X
also decreases gradually along the direction of the airflow. Thus,
the first guiding member 1131 and the second guiding member 1132
cooperatively define a tapered space 1133 therebetween.
[0023] The first guiding member 1131 and the second guiding member
1132 cooperatively form a converged side 114 adjacent to the flange
1105 and a diverged side 118 facing the airflow. The airflow flows
into the tapered space 1133 via the diverged side 118 of the
guiding members 1131, 1132. The first guiding member 1131 and the
second guiding member 1132 guide the airflow towards the converged
side 114. Thus, the airflow is concentrated at the area of each fin
11 near to the heat pipe 12. That is, the airflow first flows
through the diverged side 118 of the guiding members 1131, 1132,
then the converged side 114 and finally the heat pipe 12.
[0024] Each of the first and second guiding members 1131, 1132
includes a linear inner side 116 facing the space 1133 and an
opposite curved outer side 117 away from the space 1133. The inner
sides 116 of the guiding members 1131, 1132 extend aslant along the
main body 110 and face the airflow to guide the airflow to the
flange 1105 and the through hole 1104. The inner sides 116 function
as windward sides of the guiding members 1131, 1132. The outer side
117 is about C-shaped and smoothly connects with the main body 110
of each fin 11. Each of the first and second guiding members 1131,
1132 defines an opening 112 in the inner side 116 for communicating
with the space 1131. Airflow channels 13 at opposite sides of each
fin 11 communicate with each other via the openings 112. A height
of each of the guiding members 1131, 1132 decrease from the inner
side 116 towards the outer side 117. A maximal height of each of
the guiding members 1131, 1132 is smaller than the distance between
two adjacent fins 11. When the heat sink 10 is assembled together,
the guiding members 1131, 1132 are spaced from the adjacent fin 11.
In this embodiment, the maximal height of each of the guiding
members 1131, 1132 equals to a half of the distance between two
adjacent fins 11, and an outmost surface of each of the guiding
members 1131, 1132 is located at a middle of the airflow channel 13
between the two adjacent fins 11.
[0025] During operation of the heat dissipation device, the
evaporation section 121 of the heat pipe 12 absorbs heat generated
by the heat-generating component 14. Working fluid contained in the
heat pipe 12 absorbs heat and evaporates substantially and moves to
the condenser section 122. Evaporated working fluid at the
condenser section 122 releases the heat to the fins 11 and thus is
condensed. Finally, the condensed working fluid flows back to the
evaporation section 121 to begin another cycle. By this way, the
working fluid absorbs/releases amounts of heat. The heat generated
by the heat-generating component 14 is thus transferred by the heat
pipe 12 to the fins 11 almost immediately.
[0026] As the fins 11 are likely to have significant heat
resistance, a hot area is formed around the through holes 1104,
which is adjacent to condenser section 122 of the heat pipe 12 in
the fins 11. The temperature in this hot area is higher compared to
the rest of the fins 11. After the forced airflow generated by the
fan flows into the airflow channel 13, the first guiding member
1131 and the second guiding member 1132 guide a part of the
airflow, which is closer to the reference surface 1101 of each fin
11, to flow to the hot area around the heat pipe 12. Thus, the heat
in this area can be efficiently carried away by the portion of
airflow. Width of the space 1133 formed between the first guiding
member 1131 and the second guiding member 1132 decreases gradually
along the direction of the airflow, which results in the speed of
the airflow being increased to thereby increasing heat dissipation
efficiency of the heat sink 10. Due to the influence of viscosity,
a laminar air envelope will be formed on the reference surface 1101
of each fin 11, when the airflow passes through the flow channel
13, but if the airflow meets a barrier during its flowing process,
a vortex is formed around the barrier. The guiding members 1131,
1132 act as a barrier arranged in the airflow channel 13, which
cause the airflow to form turbulences, thereby destroying the
laminar air envelope possibly formed on the reference surface 1101
of each fin 11. The other part of the airflow, which is closer to
the base surface 1102 of each fin 11, passes through the airflow
channel 13 near the base surface 1102. Arrangement of the concave
hollows 1151, 1152, which function as the guiding members 1131,
1132, causes the other part of the airflow to generate turbulences,
thereby to prevent the possible laminar air envelop from forming on
the base surface 1102. Heat exchange effect between the airflow and
the fins 11 is therefore improved. The heat dissipation efficiency
of the heat sink 10 is thus increased. The concave hollows 1151,
1152 are formed when the fin 11 is stamped to form the first and
second guiding members 1131, 1132.
[0027] FIG. 4 and FIG. 5 illustrate a fin 11a in accordance with an
alternative embodiment. The difference of the second embodiment
over the first embodiment is that the first and the second guiding
members 1131a, 1132a are curved, and surround a part of the through
hole 1104. Two concave hollows 1151a, 1152a corresponding to the
two guiding members 1131a, 1132a are formed in the base surface
1102 of the fin 11a. Each of the first and second guiding members
1131a, 1132a includes an curved inner side 116a facing the space
1133a, an opposite curved outer side 117a away from the space
1133a, a linear windward side 111 interconnected between ends of
the inner side 116a and the outer side 117a adjacent to the fan,
and a linear leeward side 119 interconnected between ends of the
inner side 116a and the outer side 117a away from the fan. A
distance between the inner sides 116a of the first and the second
guiding members 1131a, 1132a decreases from the windward sides 111
towards the leeward sides 119. The height of each of the first and
the second guiding members 1131a, 1132a also decreases from the
windward side 111 towards the leeward side 119. The leeward sides
119 of the first and the second guiding members 1131a, 1132a
connect smoothly with the main body 110 of each fin 11a. An opening
112a is defined in the windward side 111 of each of the first and
the second guiding members 1131a, 1132a and faces the airflow.
Airflow channels 13 at opposite sides of each fin 11 communicate
with each other via the openings 112a.
[0028] The first guiding member 1131a and the second guiding member
1132a cooperatively form a converged side 114a in rear of the
flange 1105 and a diverged side 118a facing the airflow. The
airflow first flows through the diverged sides 118a of the guiding
members 1131a, 1132a, then the heat pipe 12 and finally the
converged sides 114a. That is, the first guiding member 1131a and
the second guiding member 1132a are capable of guiding the airflow
to flow to and concentrate at the area near the heat pipe 12 in
each fin 11a. When the airflow flows through the space 1133a, the
airflow is concentrated. The concentrated airflow with a higher
speed flows through the flanges 1105 to take the heat away from
condenser section 122 the heat pipe 12 timely.
[0029] FIG. 6 and FIG. 7 illustrate a fin 11b in accordance with
another alternative embodiment. The difference of the third
embodiment over the second embodiment is that the first guiding
member 1131a and the second guiding member 1132a are integrated
together at the leeward sides 119 of the second embodiment to form
an integral guiding structure 113b of the third embodiment. A
concave hollow 115b corresponding to the guiding structure 113b is
formed in the base surface 1102 of each fin 11b. The guiding
structure 113b is generally arc-shaped, and includes a middle
portion 1131b and two sloping side portions 1132b extending
forwardly from the middle portion 1131b. The middle portion 1131b
is curved and forms a converged side 114b in rear of the heat pipe
12. The two sloping side portions 1132b each including a linear
windward side 111b facing the airflow. A diverged side 118b is
defined between the windward sides 11 lb. Two openings 112b are
defined in the windward sides 111b of the sloping side portions
1132b respectively. The height of the guiding structure 113b
decreases gradually from the windward sides 111b of the sloping
side portions 1132b towards the middle portion 1131a.
[0030] It is to be understood, however, that even though numerous
characteristics and advantages of the present invention have been
set forth in the foregoing description, together with details of
the structure and function of the embodiments, the disclosure is
illustrative only, and changes may be made in detail, especially in
matters of shape, size, and arrangement of parts within the
principles of the invention to the full extent indicated by the
broad general meaning of the terms in which the appended claims are
expressed.
* * * * *