U.S. patent application number 12/350101 was filed with the patent office on 2010-01-14 for organic light emitting display device.
Invention is credited to Brent Jang.
Application Number | 20100007616 12/350101 |
Document ID | / |
Family ID | 41226436 |
Filed Date | 2010-01-14 |
United States Patent
Application |
20100007616 |
Kind Code |
A1 |
Jang; Brent |
January 14, 2010 |
ORGANIC LIGHT EMITTING DISPLAY DEVICE
Abstract
An organic light emitting display device having an electrostatic
capacitive type touch panel function. In one embodiment, the
organic light emitting display device includes a substrate, a
display unit on the substrate, an encapsulation substrate having a
side facing the substrate, a touch unit facing the display unit and
including a plurality of first sensors electrically coupled with
each other and extending in parallel rows along a first direction,
and a plurality of second sensors electrically coupled with each
other and extending in parallel columns along a second direction
crossing the first direction, and an insulation layer on at least a
portion of the first sensors and second sensors.
Inventors: |
Jang; Brent; (Suwon-si,
KR) |
Correspondence
Address: |
CHRISTIE, PARKER & HALE, LLP
PO BOX 7068
PASADENA
CA
91109-7068
US
|
Family ID: |
41226436 |
Appl. No.: |
12/350101 |
Filed: |
January 7, 2009 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
|
|
61080179 |
Jul 11, 2008 |
|
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|
Current U.S.
Class: |
345/173 ;
345/76 |
Current CPC
Class: |
H01L 27/323 20130101;
G06F 2203/04111 20130101; G06F 3/0412 20130101; G06F 3/0445
20190501; G06F 3/0446 20190501 |
Class at
Publication: |
345/173 ;
345/76 |
International
Class: |
G06F 3/041 20060101
G06F003/041; G09G 3/30 20060101 G09G003/30 |
Claims
1. An organic light emitting display device comprising: a substrate
(100); a display unit (200) on the substrate (100); an
encapsulation substrate (300) having a side facing the substrate
(100); a touch unit facing the display unit (200) and comprising: a
plurality of first sensors (311a) electrically coupled with each
other and extending in parallel rows along a first direction, and a
plurality of second sensors (312a) electrically coupled with each
other and extending in parallel columns along a second direction
crossing the first direction; and an insulation layer (340) on at
least a portion of the first sensors (311a) and second sensors
(312a).
2. The organic light emitting display device of claim 1, wherein
the plurality of first sensors and the plurality of second sensors
are on the side of the encapsulation substrate.
3. The organic light emitting display device of claim 1, wherein
the plurality of first sensors and the plurality of second sensors
are alternately arranged.
4. The organic light emitting display device of claim 1, wherein a
projection of the plurality of first sensors in a plane parallel to
the substrate is offset from a projection of the plurality of
second sensors in the plane.
5. The organic light emitting display device of claim 1, further
comprising a flexible printed circuit board electrically coupled to
the plurality of first sensors and to the plurality of second
sensors.
6. The organic light emitting display device of claim 5, further
comprising a data line at a periphery of the display unit on the
substrate, the data line for delivering electrical signals
generated by the touch unit to the flexible printed circuit board;
and wherein the data line is electrically coupled to the plurality
of first sensors and to the plurality of second sensors.
7. The organic light emitting display device of claim 6, further
comprising an electrical conductor between the data line and at
least one of the first sensors and at least one of the second
sensors, the electrical conductor for providing a conductive path
between the data line and the at least one of the first sensors and
the at least one of the second sensors.
8. The organic light emitting display device of claim 6, further
comprising contact units at a periphery of an area comprising the
plurality of first sensors and the second sensors; and an
electrical conductor between the data line and the contact units to
electrically couple the data line with the contact units.
9. The organic light emitting display device of claim 5, wherein
the flexible printed circuit board comprises circuitry for driving
and controlling the display unit and for driving and controlling
the touch unit.
10. The organic light emitting display device of claim 5, wherein a
display drive integrated circuit comprises a touch unit drive
integrated circuit.
11. The organic light emitting display device of claim 1, wherein
the display unit (200) comprises: a thin film transistor (220) on
the substrate (100); and an organic light emitting diode (230)
coupled to the thin film transistor (220), the organic light
emitting diode (230) comprising a counter electrode (235), a pixel
electrode (231), and an intermediate layer (233) between the
counter electrode (235) and the pixel electrode (231).
12. The organic light emitting display device of claim 11, wherein
the pixel electrode (231) is in contact with the thin film
transistor (220), wherein the intermediate layer (233) is in
contact with at least a portion of the pixel electrode (231), and
wherein the counter electrode (235) is in contact with at least a
portion of the intermediate layer (233).
13. The organic light emitting display device of claim 1, wherein
the plurality of first sensors and the plurality of second sensors
comprise indium tin oxide.
14. The organic light emitting display device of claim 1, wherein
the touch panel is within a space between the substrate (100) and
the encapsulation substrate (300).
15. The organic light emitting display device of claim 1, wherein
the plurality of first sensors and the plurality of second sensors
are configured to generate electrical signals indicative of a
touch.
16. The organic light emitting display device of claim 1: wherein
each of the plurality of first sensors (311a) comprises a first
diamond shaped pad; and wherein each of the plurality of second
sensors (312a) comprises a second diamond shaped pad in a position
adjacent to one of the first diamond shaped pads.
17. The organic light emitting display device of claim 1, wherein
the first direction is perpendicular to the second direction.
18. The organic light emitting display device of claim 1, wherein
the touch unit is an electrostatic capacitive type touch unit.
19. The organic light emitting display device of claim 1, further
comprising: a first pattern layer on the side of the encapsulation
substrate comprising: the plurality of first sensors, and the
plurality of second sensors; a second pattern layer on at least a
portion of the insulation layer, the second pattern layer
comprising a plurality of pattern units (325), each pattern unit
configured to couple two of the plurality of second sensor (312a)
on the first pattern layer (310).
20. The organic light emitting display device of claim 19, further
comprising a second insulation layer on at least a portion of the
second pattern layer.
21. The organic light emitting display device of claim 19, wherein
the insulation layer (330) comprises a plurality of contact holes
through which the pattern units (325) are electrically coupled to
the plurality of second sensors (312a).
22. The organic light emitting display device of claim 21: wherein
each of the plurality of first sensors (311a) comprises a first
diamond shaped pad; wherein each of the plurality of second sensors
(312a) comprises a second diamond shaped pad in a position adjacent
to one of the first diamond shaped pads; and wherein the plurality
of contact holes are disposed at positions corresponding to corners
of the second diamond shaped pads of the plurality of second
sensors (312a), where adjacent second sensors are coupled each
other.
23. The organic light emitting display device of claim 21, wherein
the pattern units (325) are configured to fill the plurality of
contact holes to electrically connect the second sensors that are
adjacent to each other on the first pattern layer (310).
24. The organic light emitting display device of claim 19: wherein
the display unit (200) comprises: a thin film transistor (220) on
the substrate (100); and an organic light emitting diode (230)
coupled to the thin film transistor (220), the organic light
emitting diode (230) comprising a counter electrode (235), a pixel
electrode (231), and an intermediate layer (233) between the
counter electrode (235) and the pixel electrode (231); and wherein
the counter electrode (235) and the first pattern layer (310) are
configured to form a first capacitor.
25. The organic light emitting display device of claim 24: wherein
the first pattern layer (310) is further configured to form a
second capacitor with an object approaching the encapsulation
substrate (300); and wherein the first capacitor is electrically
coupled in series with the second capacitor.
26. The organic light emitting display device of claim 19: further
comprising a flexible printed circuit board (130) coupled to the
plurality of first sensors (311a) and to the plurality of second
sensors (312a); and wherein the flexible printed circuit board
(130) comprises circuitry for driving and controlling the touch
unit.
27. The organic light emitting display of claim 26, further
comprising: a data line (110) at a periphery of the display unit
(200) on the substrate (100), the data line for delivering
electrical signals generated by the touch unit to the flexible
printed circuit board (130); and an electrical conductor (120)
between the substrate (100) and the encapsulation substrate (300)
and for providing a conductive path between the touch unit on the
encapsulation substrate (300) to the data line (110).
28. The organic light emitting display of claim 27: wherein the
flexible printed circuit board (130) further comprises a first PCB
connecting unit (115) and a second PCB connecting unit (113); and
wherein the first PCB connecting unit 115 links the display unit
(200) to the flexible printed circuit board (130) and the second
PCB connecting unit (115) links the data line (110) to the flexible
printed circuit board (130).
29. The organic light emitting display of claim 1, further
comprising: a first pattern layer (410) on the side of the
encapsulation substrate, the first pattern layer comprising the
plurality of first sensors (411a); the insulation layer (430) on at
least a portion of the first pattern layer (410); a second pattern
layer (420) on at least a portion of the insulation layer (430),
the second pattern layer (420) comprising the plurality of second
sensors (421a); and a second insulation layer (440) on at least a
portion of the second pattern layer (420).
30. The organic light emitting display device of claim 29: wherein
each of the plurality of first sensors (411a) comprises a first
diamond shaped pad; and wherein each of the plurality of second
sensors (321a) comprises a second diamond shaped pad in a position
adjacent to one of the first diamond shaped pads.
31. The organic light emitting display device of claim 29: wherein
a plurality of first connecting units (411b) are configured to
electrically connect the first sensors (411a) that are adjacent to
each other on the first pattern layer (410); and wherein a
plurality of second connecting units (421b) are configured to
electrically connect the second sensors (421a) that are adjacent to
each other on the second pattern layer (420).
32. The organic light emitting display device of claim 29: wherein
the display unit (200) comprises: a thin film transistor (220) on
the substrate (100); and an organic light emitting diode (230)
coupled to the thin film transistor (220), the organic light
emitting diode (230) comprising a counter electrode (235), a pixel
electrode (231), and an intermediate layer (233) between the
counter electrode (235) and the pixel electrode (231); and wherein
the counter electrode (235) and the first pattern layer (410) are
configured to form a first capacitor.
33. The organic light emitting display device of claim 32: wherein
the first pattern layer (410) is further configured to form a
second capacitor with an object approaching the encapsulation
substrate (400); and wherein the first capacitor is electrically
coupled in series with the second capacitor.
34. The organic light emitting display device of claim 29: further
comprising a flexible printed circuit board (130) coupled to the
plurality of first sensors (411a) and to the plurality of second
sensors (421a); and wherein the flexible printed circuit board
(130) comprises circuitry for driving and controlling the touch
unit.
35. The organic light emitting display of claim 34, further
comprising: a data line (110) at a periphery of the display unit
(200) on the substrate (100), the data line for delivering
electrical signals generated by the touch unit to the flexible
printed circuit board (130); and an electrical conductor (120)
between the substrate (100) and the encapsulation substrate (400)
and for providing a conductive path between the touch unit on the
encapsulation substrate (400) to the data line (110).
36. The organic light emitting display of claim 35, wherein the
flexible printed circuit board (130) further comprises a first PCB
connecting unit (115) and a second PCB connecting unit (113),
wherein the first PCB connecting unit (115) links the display unit
(200) to the flexible printed circuit board (130) and the second
PCB connecting unit (115) links the data line (110) to the flexible
printed circuit board (130).
Description
CROSS-REFERENCE TO RELATED APPLICATION
[0001] This application claims priority to and the benefit of U.S.
Provisional Patent Application No. 61/080,179, filed on Jul. 11,
2008, the entire content of which is incorporated by reference
herein.
BACKGROUND OF THE INVENTION
[0002] 1. Field of the Invention
[0003] The present invention relates to an organic light emitting
display device, and more particularly, to an organic light emitting
display device having an electrostatic capacitive type touch
panel.
[0004] 2. Description of the Related Art
[0005] Recently, the use of portable thin flat display devices has
increased considerably. A representative example of a flat display
devices is an electroluminescent display device, which is an active
matrix type display device expected to become the next generation
display device due to its wide viewing angle, high contrast, and
fast response speed. Also, compared to an inorganic light emitting
display device, an organic light emitting display device having an
emissive layer formed of an organic material has better luminance,
driving voltage, and response speed, and is capable of realizing
multi-colors.
[0006] In order to allow a user to input a command via a finger or
a pen-type pointer, many studies have been conducted to obtain an
organic light emitting display device having a touch panel
function, such as an internal electrostatic capacitive type touch
panel display device.
[0007] However, in the case of an organic light emitting display
device having a internal electrostatic capacitive type touch panel,
the thickness of the touch panel is increased in order to embed the
touch panel function. In addition, a display drive integrated
circuit (DDI) and a touch panel drive IC have to be separately
arranged resulting in compatibility issues between the products.
Also, it is difficult to attach the touch panel drive IC to a
flexible printed circuit board (PCB).
SUMMARY OF THE INVENTION
[0008] An aspect of an embodiment of the present invention is
directed towards an organic light emitting display device. In one
embodiment, the display device includes an encapsulation substrate,
an inner surface of which is patterned using indium tin oxide (ITO)
pattern so that a touch panel function can be provided without
increasing the thickness of the display device.
[0009] In one embodiment, an organic light emitting display device
includes a substrate, a display unit on the substrate, an
encapsulation substrate having a side facing the substrate, a touch
unit facing the display unit and including a plurality of first
sensors electrically coupled with each other and extending in
parallel rows along a first direction, and a plurality of second
sensors electrically coupled with each other and extending in
parallel columns along a second direction crossing the first
direction, and an insulation layer on at least a portion of the
first sensors and second sensors.
[0010] In a further embodiment, the plurality of first sensors and
the plurality of second sensors are on the side of the
encapsulation substrate.
[0011] In a another embodiment, the plurality of first sensors and
the plurality of second sensors are alternately arranged.
[0012] In a yet another embodiment, a projection of the plurality
of first sensors in a plane parallel to the substrate is offset
from a projection of the plurality of second sensors in the
plane.
[0013] In a further embodiment, the organic light emitting display
device further includes a flexible printed circuit board
electrically coupled to the plurality of first sensors and to the
plurality of second sensors.
[0014] In another embodiment, the organic light emitting display
device further includes a data line at a periphery of the display
unit on the substrate, the data line for delivering electrical
signals generated by the touch unit to the flexible printed circuit
board, and wherein the data line is electrically coupled to the
plurality of first sensors and to the plurality of second
sensors.
[0015] In still another embodiment, the organic light emitting
display device further includes an electrical conductor between the
data line and at least one of the first sensors and at least one of
the second sensors, the electrical conductor for providing a
conductive path between the data line and the at least one of the
first sensors and the at least one of the second sensors.
[0016] In one embodiment, the organic light emitting display device
further includes contact units at a periphery of an area including
the plurality of first sensors and the second sensors, and an
electrical conductor between the data line and the contact units to
electrically couple the data line with the contact units.
[0017] In a further embodiment, the flexible printed circuit board
includes circuitry for driving and controlling the display unit and
for driving and controlling the touch unit.
[0018] In another embodiment, a display drive integrated circuit
includes a touch unit drive integrated circuit.
[0019] In yet another embodiment, the display unit includes a thin
film transistor on the substrate, and an organic light emitting
diode coupled to the thin film transistor, the organic light
emitting diode including a counter electrode, a pixel electrode,
and an intermediate layer between the counter electrode and the
pixel electrode.
[0020] In a further embodiment, the pixel electrode is in contact
with the thin film transistor, wherein the intermediate layer is in
contact with at least a portion of the pixel electrode, and wherein
the counter electrode is in contact with at least a portion of the
intermediate layer.
[0021] In one embodiment, the plurality of first sensors and the
plurality of second sensors include indium tin oxide.
[0022] In a further embodiment, the touch panel is within a space
between the substrate and the encapsulation substrate.
[0023] In an additional embodiment, the plurality of first sensors
and the plurality of second sensors are configured to generate
electrical signals indicative of a touch.
[0024] In one embodiment, each of the plurality of first sensors
includes a first diamond shaped pad, and wherein each of the
plurality of second sensors includes a second diamond shaped pad in
a position adjacent to one of the first diamond shaped pads.
[0025] In a further embodiment, the first direction is
perpendicular to the second direction.
[0026] In another embodiment, the touch unit is an electrostatic
capacitive type touch unit.
[0027] In one embodiment, the organic light emitting display device
further includes a first pattern layer on the side of the
encapsulation substrate including the plurality of first sensors,
and the plurality of second sensors, a second pattern layer on at
least a portion of the insulation layer, the second pattern layer
including a plurality of pattern units, each pattern unit
configured to couple two of the plurality of second sensor on the
first pattern layer.
[0028] In a further embodiment, the organic light emitting display
device further includes a second insulation layer on at least a
portion of the second pattern layer.
[0029] In one embodiment, the insulation layer includes a plurality
of contact holes through which the pattern units are electrically
coupled to the plurality of second sensors.
[0030] In another embodiment, each of the plurality of first
sensors includes a first diamond shaped pad, wherein each of the
plurality of second sensors includes a second diamond shaped pad in
a position adjacent to one of the first diamond shaped pads, and
wherein the plurality of contact holes are disposed at positions
corresponding to corners of the second diamond shaped pads of the
plurality of second sensors, where adjacent second sensors are
coupled each other.
[0031] In a further embodiment, the pattern units are configured to
fill the plurality of contact holes to electrically connect the
second sensors that are adjacent to each other on the first pattern
layer.
[0032] In one embodiment, the display unit includes a thin film
transistor on the substrate, and an organic light emitting diode
coupled to the thin film transistor, the organic light emitting
diode including a counter electrode, a pixel electrode, and an
intermediate layer between the counter electrode and the pixel
electrode, and wherein the counter electrode and the first pattern
layer are configured to form a first capacitor.
[0033] In another embodiment, the first pattern layer is further
configured to form a second capacitor with an object approaching
the encapsulation substrate, and wherein the first capacitor is
electrically coupled in series with the second capacitor.
[0034] In still another embodiment, the organic light emitting
display device further includes a flexible printed circuit board
coupled to the plurality of first sensors and to the plurality of
second sensors, and wherein the flexible printed circuit board
includes circuitry for driving and controlling the touch unit.
[0035] In a further embodiment, the organic light emitting display
further includes a data line at a periphery of the display unit on
the substrate, the data line for delivering electrical signals
generated by the touch unit to the flexible printed circuit board,
and an electrical conductor between the substrate and the
encapsulation substrate and for providing a conductive path between
the touch unit on the encapsulation substrate to the data line.
[0036] In one embodiment, the flexible printed circuit board
further includes a first PCB connecting unit and a second PCB
connecting unit, and wherein the first PCB connecting unit links
the display unit to the flexible printed circuit board and the
second PCB connecting unit links the data line to the flexible
printed circuit board.
[0037] In another embodiment, the organic light emitting display
further includes a first pattern layer on the side of the
encapsulation substrate, the first pattern layer including the
plurality of first sensors, the insulation layer on at least a
portion of the first pattern layer, a second pattern layer on at
least a portion of the insulation layer, the second pattern layer
including the plurality of second sensors, and a second insulation
layer on at least a portion of the second pattern layer.
[0038] In a further embodiment, each of the plurality of first
sensors includes a first diamond shaped pad, and wherein each of
the plurality of second sensors includes a second diamond shaped
pad in a position adjacent to one of the first diamond shaped
pads.
[0039] In yet another embodiment, a plurality of first connecting
units are configured to electrically connect the first sensors that
are adjacent to each other on the first pattern layer, and wherein
a plurality of second connecting units are configured to
electrically connect the second sensors that are adjacent to each
other on the second pattern layer.
[0040] In some embodiments, the display unit includes a thin film
transistor on the substrate, and an organic light emitting diode
coupled to the thin film transistor, the organic light emitting
diode including a counter electrode, a pixel electrode, and an
intermediate layer between the counter electrode and the pixel
electrode, and wherein the counter electrode and the first pattern
layer are configured to form a first capacitor.
[0041] In one embodiment, the first pattern layer is further
configured to form a second capacitor with an object approaching
the encapsulation substrate, and wherein the first capacitor is
electrically coupled in series with the second capacitor.
[0042] In a further embodiment, the organic light emitting display
device further includes a flexible printed circuit board coupled to
the plurality of first sensors and to the plurality of second
sensors, and wherein the flexible printed circuit board includes
circuitry for driving and controlling the touch unit.
[0043] In another embodiment, the organic light emitting display
further includes a data line at a periphery of the display unit on
the substrate, the data line for delivering electrical signals
generated by the touch unit to the flexible printed circuit board,
and an electrical conductor between the substrate and the
encapsulation substrate and for providing a conductive path between
the touch unit on the encapsulation substrate to the data line.
[0044] In one embodiment, the flexible printed circuit board
further includes a first PCB connecting unit and a second PCB
connecting unit, wherein the first PCB connecting unit links the
display unit to the flexible printed circuit board and the second
PCB connecting unit links the data line to the flexible printed
circuit board.
BRIEF DESCRIPTION OF THE DRAWINGS
[0045] The accompanying drawings, together with the specification,
illustrate exemplary embodiments of the present invention, and,
together with the description, serve to explain the principles of
the present invention.
[0046] FIG. 1 is a cross-sectional schematic view of a portion of
an organic light emitting display device according to one
embodiment of the present invention;
[0047] FIG. 2 is a plan schematic view of the organic light
emitting display device of FIG. 1;
[0048] FIGS. 3A and 3B are bottom schematic views of an
encapsulation substrate and a first pattern layer formed on a
surface of the encapsulation substrate in the organic light
emitting display device of FIG. 1;
[0049] FIG. 3C is a bottom schematic view of the first pattern
layer of FIGS. 3A and 3B, and a second pattern layer on the first
pattern layer;
[0050] FIG. 3D is a cross-sectional view taken along line III-III
in FIG. 3C;
[0051] FIG. 3E is a bottom perspective schematic view of the first
pattern layer and the second pattern layer of FIG. 3C;
[0052] FIG. 4 is a detailed plan schematic view of the organic
light emitting display device of FIG. 1;
[0053] FIG. 5 is a cross-sectional view of the organic light
emitting display device of FIG. 4;
[0054] FIG. 6 is a cross-sectional schematic view of a portion of
the organic light emitting display device of FIG. 1;
[0055] FIG. 7A is a bottom schematic view of an encapsulation
substrate and a first pattern layer formed on a surface of the
encapsulation substrate in an organic light emitting display device
according to one embodiment of the present invention;
[0056] FIG. 7B is a bottom schematic view of the first pattern
layer of FIG. 7A, and a second pattern layer on the first pattern
layer;
[0057] FIG. 7C is a cross-sectional schematic view taken along line
VII-VII in FIG. 7B; and
[0058] FIG. 7D is a bottom perspective schematic view of the first
pattern layer and the second pattern layer of FIG. 7B.
DETAILED DESCRIPTION
[0059] In the following detailed description, only certain
exemplary embodiments of the present invention are shown and
described, by way of illustration. As those skilled in the art
would recognize, the invention may be embodied in many different
forms and should not be construed as being limited to the
embodiments set forth herein. Also, in the context of the present
application, when an element is referred to as being "on" another
element, it can be directly on the another element or be indirectly
on the another element with one or more intervening elements
interposed there between. Like reference numerals designate like
elements throughout the specification.
[0060] FIG. 1 is a cross-sectional schematic view of a portion of
an organic light emitting display device according to one
embodiment of the present invention, and FIG. 2 is a plan schematic
view of the organic light emitting display device of FIG. 1. In
FIG. 2, the encapsulation substrate 300 illustrated in FIG. 1 is
not shown.
[0061] Referring to FIGS. 1 and 2, a display unit 200 including a
plurality of organic light emitting diodes (OLEDs) is formed on a
substrate 100.
[0062] The substrate 100 may be formed of transparent glass
containing SiO2 as a main component, but is not limited thereto,
and thus may also be formed of a transparent plastic material that
may be an insulating organic material selected from the group
consisting of polyethersulphone (PES), polyacrylate (PAR),
polyetherimide (PEI), polyethyelene napthalate (PEN), polyethyelene
terephthalate (PET), polyphenylene sulfide (PPS), polyallylate,
polyimide, polycarbonate (PC), triacetate cellulose (TAC),
cellulose acetate propionate (CAP), and combinations thereof.
[0063] In one embodiment, if the organic light emitting display
device of FIGS. 1 and 2 is a bottom emission type organic light
emitting display device in which an image is realized toward the
substrate 100, the substrate 100 is formed of a transparent
material. However, in another embodiment, if the organic light
emitting display device of FIGS. 1 and 2 is a top emission type
organic light-emitting display device in which an image is realized
away from the substrate 100, the substrate 100 may not be
necessarily formed of a transparent material, and, in this case,
the substrate 100 may be formed of a metal. When the substrate 100
is formed of a metal, the substrate 100 may include at least one
material selected from the group consisting of carbon, iron,
chromium, manganese, nickel, titanium, molybdenum, stainless steel
(SUS), Invar alloys, Inconel alloys, and Kovar alloys, but is not
limited thereto. In addition, the substrate 100 may also be formed
of a metal foil.
[0064] Moreover, a buffer layer may be further formed on a top
surface of the substrate 100 to planarize the substrate 100 and
prevent or reduce impurities from penetrating into the bottom
emission type organic light emitting display device.
[0065] The substrate 100, which includes a display unit 200 formed
thereon, is attached to the encapsulation substrate 300 that is
disposed above the display unit 200. The encapsulation substrate
300 may be formed of not only a glass material but also of various
suitable plastic materials such as acryl, and furthermore, a metal.
The encapsulation substrate 300 and touch panel related members
formed on a surface of the encapsulation substrate 300 will be
described later in more detail with reference to subsequent FIGS.
3A-3E.
[0066] Also, the substrate 100 and the encapsulation substrate 300
are attached to each other by using a sealant 250. The sealant 250
may be any suitable sealing glass frit. Also, the sealant 250 may
be formed of an organic sealant, an inorganic sealant, or of a
mixture of the organic and inorganic sealants.
[0067] Hereinafter, the encapsulation substrate 300, and the touch
panel related members formed on the surface of the encapsulation
substrate 300 in the organic light emitting display device
according to an embodiment of the present invention will now be
described in more detail.
[0068] FIGS. 3A and 3B are bottom schematic views of the
encapsulation substrate 300 and a first pattern layer formed on a
surface of the encapsulation substrate 300 in the organic light
emitting display device of FIG. 1. FIG. 3C is a bottom schematic
view of the first pattern layer of FIGS. 3A and 3B, and a second
pattern layer on the first pattern layer. FIG. 3D is a
cross-sectional view taken along line III-III in FIG. 3C. FIG. 3E
is a bottom perspective schematic view of the first pattern layer
and the second pattern layer of FIG. 3C.
[0069] Referring to FIGS. 3A through 3E, a first pattern layer 310,
a first insulating layer 330, a second pattern layer 320, and a
second insulating layer 340 (see FIG. 5) are sequentially formed on
a surface of the encapsulation substrate 300, respectively, to face
the substrate 100.
[0070] An issue with a conventional organic light emitting display
device having an internal electrostatic capacitive type touch panel
is that the thickness of the display device is increased in order
to realize a touch panel function. In order to address this issue,
an indium tin oxide (ITO) pattern is formed on an inner surface of
the encapsulation substrate 300 of the organic light emitting
display device according to one embodiment of the present
invention.
[0071] To be more specific, the first pattern layer 310 is formed
on the surface of the encapsulation substrate 300 to face the
substrate 100 (see FIG. 1). The first pattern layer 310 includes a
plurality of first direction pattern units 311 formed in parallel
rows along a first direction (the X direction in FIG. 3A), and a
plurality of second direction pattern units 312 formed in parallel
columns along a second direction (the Y direction in FIG. 3B) that
crosses (or is substantially perpendicular to) the first direction.
As illustrated in FIGS. 3A and 3B, the first direction pattern
units 311 and the second direction pattern units 312 are
alternately disposed. That is, the first direction pattern units
311, each having a square shaped body rotated 45 degrees like a
baseball diamond, are formed in parallel rows where horizontally
opposite corners of each diamond are adjacent and coupled along the
first direction (the X direction in FIG. 3A) on the surface of the
encapsulation substrate 300. Similarly, the second direction
pattern units 312, each having a square shaped body rotated 45
degrees like a baseball diamond, are formed in parallel columns
where vertically opposite corners of each diamond are adjacent and
coupled along the second direction (the Y direction in FIG. 3B)
between each of the first direction pattern units 311. Here, in a
number of embodiments, the pattern units (311 and 312) are utilized
as sensors (or sensor pads).
[0072] Reference character A refers to one row of first direction
pattern units 311 of FIG. 3A, where each row of first direction
pattern units 311 includes a plurality of main bodies 311a, a
plurality of connecting units 311b, an extending unit 311c, and a
contact unit 311d. The main bodies 311a have a diamond shape, and
are formed in a row along the first direction, i.e., the X
direction in FIG. 3A. The connecting units 311b are formed between
each of the main bodies 311a, and respectively connect the main
bodies 311a that are adjacent to each other. The extending unit
311c extends from an end of each of the first direction pattern
units 311. The extending unit 311c may be formed to extend in a
direction, e.g., the Y direction in FIG. 3A, so that the plurality
of extending units 311c may be arranged at one end (or end portion)
of the encapsulation substrate 300, that is, an upper end of the
encapsulation substrate 300 in FIG. 3A. The contact unit 311d is
formed at an end (or upper end portion) of the extending unit 311c,
and is electrically connected to a substrate contact unit 112 of a
data line 110 (see FIG. 5) on the substrate 100 (see FIG. 5) via a
conductive member 120 (see FIG. 5).
[0073] In FIG. 3B, reference character B refers to one column of
second direction pattern units 312. Each column of second direction
pattern units 312 includes a plurality of main bodies 312a, an
extending unit 312c, and a contact unit 312d. The main bodies 312a
have a diamond shape, and are formed in a column along the second
direction, i.e., the Y direction in FIG. 3B. Unlike the first
direction pattern units 311, none of the second direction pattern
units 312 includes a connecting unit. The main bodies 312a are
connected to each other not by a connecting unit but by the second
pattern layer 320 having, e.g., a plurality of third pattern units
325 for connecting the main bodies 312a to each other (see FIG.
3E). The extending unit 312c extends from a contact unit 312d to a
point in close proximity to a corner of a diamond shaped main body
312a closest to an upper end of the encapsulation substrate 300.
The extending unit 312c may be formed to extend in a direction,
e.g., the Y direction in FIG. 3B, so that a plurality of extending
units 312c may be arranged at one end of the encapsulation
substrate 300, that is, an upper end of the encapsulation substrate
300 in FIG. 3B. The contact unit 312d is formed at an end of the
extending unit 312c, and is electrically connected to a substrate
contact unit of the data line 110 (see FIG. 5) on the substrate 100
(see FIG. 5) via the conductive member 120 (see FIG. 5).
[0074] Referring to FIGS. 3D and 3E, the first insulating layer 330
is formed on the surface of the encapsulation substrate 300 such
that it faces the substrate 100 (see FIG. 1) and covers the first
pattern layer 310. The first insulating layer 330 insulates the
first pattern layer 310 from the second pattern layer 320. A
plurality of contact holes (or vias) 331 may be formed at
predetermined positions in the first insulating layer 330, e.g., at
positions that correspond to adjacent corners of the diamond shaped
main bodies 312a of the second direction pattern units 312. The
second pattern layer 320 and the main bodies 312a of the second
direction pattern units 312 are electrically connected via the
contact holes 331.
[0075] As illustrated in FIGS. 3C through 3E, the second pattern
layer 320 is formed on a surface of the first insulating layer 330
to face the substrate 100 (see FIG.1). The second pattern layer
320, a conductive layer, is formed such that it fills the contact
holes 331 of the first insulating layer 330, thereby electrically
connecting (e.g. by vias and third pattern units 325) the main
bodies 312a of second direction pattern units 312, that are
adjacent to each other.
[0076] In this manner, the first direction pattern units 311 and
the second direction pattern units 312, which are alternately
disposed, do not intersect (or electrically couple) each other, so
that a short circuit between the first direction pattern units 311
and the second direction pattern units 312 is prevented.
[0077] The first pattern layer 310 and the second pattern layer 320
may be formed of suitable transparent materials such as ITO, IZO,
ZnO, and/or In2O3. Also, the first pattern layer 310 and the second
pattern layer 320 may be formed by using a photolithography
process. That is, an ITO layer formed by using a suitable
deposition method, a spin coating method, a sputtering method, or
an inkjet method may be used to form the first pattern layer 310
and the second pattern layer 320.
[0078] Referring now to FIG. 5, a second insulating layer 340 is
formed both on the surface of the first insulating layer 330 to
face the substrate 100 and on the surface of the second pattern
layer 320. An opposite side of the second insulating layer 340
abuts the display unit 200. The second insulating layer 340
insulates the second pattern layer 320 from a display unit 200.
[0079] In this manner, according to one embodiment of the present
invention, it is possible to realize a touch panel function without
increasing the thickness of a display device. Also, because an
electrostatic capacitive pattern is formed on the inner surface of
the encapsulation substrate 300, slim (or thin) etching is
possible.
[0080] Hereinafter, the connection relationship between a pattern
layer of an encapsulation substrate, and a printed circuit board
(PCB) of a substrate will now be described in more detail.
[0081] FIG. 4 is a detailed plan schematic view of the organic
light emitting display device of FIG. 1, and FIG. 5 is a
cross-sectional view of the organic light emitting display device
of FIG. 4.
[0082] Referring to FIGS. 4 and 5, a contact unit 311d of a first
direction pattern unit 311, and a contact unit 312d of a second
direction pattern unit 312, which are formed on an encapsulation
substrate 300, are electrically connected to a data line 110 formed
on the substrate 100. To make this connection, the organic light
emitting display device according to one embodiment of the present
invention includes a conductive member 120.
[0083] To be more specific, a display unit 200 for displaying an
image is formed above the substrate 100 (the display unit 200 will
be described later in more detail with reference to FIG. 6). A
flexible PCB 130, on which various suitable electrical components
for driving and controlling the display unit 200 are disposed, is
arranged with the display unit 200. A display drive integrated
circuit (DDI) 111 is arranged between the display unit 200 and the
flexible PCB 130 to drive the display unit 200. The DDI 111 and the
flexible PCB 130 may be connected by a plurality of input/output
lines 115.
[0084] The data line 110 is formed around the display unit 200 and
above the substrate 100. The data line 110 is used to deliver
electrical signals, which are generated by the first and second
pattern layers (310 and 320) formed on the inner surface of the
encapsulation substrate 300, to the flexible PCB 130. For delivery
of these electrical signals, the data line 110 further includes a
plurality of substrate contact units 112 located on the substrate
(see FIG. 5).
[0085] The substrate contact units 112 are formed on the substrate
at positions corresponding to positions of the contact units 311d
of the first direction pattern units 311, and corresponding to
positions of the contact units 312d of the second direction pattern
unit 312. The substrate contact units 112 are formed on the
substrate 100, and the contact units 311d and 312d are formed on
the encapsulation substrate 300 and both are electrically connected
by the conductive member 120. Various conductive materials
including a silver paste may be used for the conductive member 120.
The substrate contact units 112 are individually connected to data
line 110 which is connected to the flexible PCB 130.
[0086] A touch panel drive IC (TDI) 113 configured to receive the
electrical signals to drive and control the touch panel is disposed
on the flexible PCB 130, where the electrical signals are generated
by the first and second pattern layers 310 and 320 formed on the
inner surface of the encapsulation substrate 300.
[0087] In this manner, the organic light emitting display device
according to one embodiment of the present invention includes a
conventional flexible PCB used in a display device to provide an
integrated interface for enabling a touch panel function. By doing
so, it is possible to effectively reduce manufacturing costs, and
to improve the ease of manufacture and the user's convenience.
[0088] Also, referring to FIG. 4, the DDI 111 and the TDI 113 are
shown to be separately arranged but the present invention is not
limited thereto. That is, although not illustrated in the drawing,
the DD1 111 may be implemented to include the functions of the TDI
113 in some embodiments. In this case, the data line 110 may be
configured to be directly connected to the DD1 111. By doing so, it
is possible to effectively further reduce the manufacturing costs,
and to improve the manufacture and user's convenience.
[0089] Hereinafter, a structure of a display unit in the organic
light emitting display device according to one embodiment of the
present invention will now be described in detail.
[0090] FIG. 6 is a cross-sectional view of a portion of the organic
light emitting display device of FIG. 1, showing a detailed
configuration of the display unit 200.
[0091] Referring to FIG. 6, a plurality of thin film transistors
220 are formed on the substrate 100, and an organic light emitting
diode (OLED) 230 is formed on (or with) each of the thin film
transistors 220. The OLED 230 includes a pixel electrode 231
electrically connected to the thin film transistor 220, a counter
electrode 235 disposed entirely on the substrate 100, and an
intermediate layer 233 disposed between the pixel electrode 231 and
the counter electrode 235 that includes a light emitting layer.
[0092] The thin film transistors 220, each of which includes a gate
electrode 221, source and drain electrodes 223, a semiconductor
layer 227, a gate insulating layer 213, and an interlayer
insulating layer 215, are formed on the substrate 100. The current
embodiment is not limited to the thin film transistors 220 of FIG.
3D. Thus other thin film transistors such as an organic thin film
transistor including a semiconductor layer formed of an organic
material or a silicon thin film transistor formed of silicon may
also be used. In some embodiments, a buffer layer 211 formed of a
silicon oxide or a silicon nitride may be further included between
the thin film transistors 220 and the substrate 100.
[0093] The OLED 230 includes the pixel electrode 231 and the
counter electrode 235 which effectively face each other. The OLED
further includes the intermediate layer 233 formed of an organic
material and disposed between the pixel electrode 231 and the
counter electrode 235. The intermediate layer 233, which includes
the light emitting layer, may also include a plurality of
layers.
[0094] The pixel electrode 231 functions as an anode electrode, and
the counter 235 functions as a cathode electrode. However, the
polarity of the pixel electrode 231 and the counter electrode 235
may be switched.
[0095] The pixel electrode 231 may be formed as a transparent
electrode or a reflective electrode. When formed as a transparent
electrode, the pixel electrode 231 may be formed of ITO, IZO, ZnO,
and/or In2O3. When formed as a reflective electrode, the pixel
electrode 231 may include a reflection layer formed of Ag, Mg, Al,
Pt, Pd, Au, Ni, Nd, Ir, Cr or combinations thereof, and a layer
including ITO, IZO, ZnO, and/or In2O3, formed on the reflection
layer.
[0096] The counter electrode 235 may also be formed as a
transparent electrode or a reflective electrode. When formed as a
transparent electrode, the counter electrode 235 may include a
layer in which Li, Ca, LiF/Ca, LiF/Al, Al, Mg, or combinations
thereof, is deposited on the intermediate layer 233 between the
pixel electrode 231 and the counter electrode 235. In some
embodiments, the counter electrode layer may also include a bus
electrode line and an auxiliary electrode formed of ITO, IZO, ZnO,
and/or In2O3. When formed as a reflective electrode, the counter
electrode 235 may be formed by depositing Li, Ca, LiF/Ca, LiF/Al,
Al, Mg or combinations thereof.
[0097] A pixel defining layer (PDL) 219 is formed to cover an edge
(or edge portion) of the pixel electrode 231 and to have a
thickness (or a predetermined thickness) measured from the pixel
electrode 231 to the counter electrode 235. The PDL 219 defines a
light emitting region, and provides a wide gap between the edge of
the pixel electrode 231 and the counter electrode 235 to prevent an
electric field from being concentrated on the edge of the pixel
electrode 231, and thereby preventing (or protecting from) a
potential short circuit between the pixel electrode 231 and the
counter electrode 235.
[0098] A plurality of intermediate layers 233 each including at
least a light emitting layer, may be formed between each respective
pixel electrode 231 and each respective counter electrode 235. In
FIG. 6, the intermediate layer 233 may be formed of a low molecule
organic material or a polymer organic material.
[0099] When formed of a low molecule organic material, the
intermediate layer 233 may have a single-layer or multiple-layer
structure in which a hole injection layer (HIL), a hole transport
layer (HTL), an organic light emission layer (EML), an electron
transport layer (ETL), and an electron injection layer (EIL) are
stacked. Examples of the organic material include copper
phthalocyanine (CuPc),
N,N'-Di(naphthalene-1-yl)-N,N'-diphenyl-benzidine (NPB),
tris-8-hydroxyquinoline aluminum (Alq3), etc. The low molecule
organic material may be formed using a vacuum deposition method and
a mask.
[0100] When formed of a polymer organic material, the intermediate
layer 233 may have a structure formed of an HTL and an EML; the HTL
may be formed of poly(3,4-ethylenedioxythiophene) (PEDOT), and the
EML may be formed of poly-phenylenevinylene (PPV) and
polyfluorene.
[0101] The OLED 230 is electrically connected to the thin film
transistor 220 disposed there below. When a planarization layer 217
covering the thin film transistor 220 is formed, the OLED 230 is
disposed on top of the planarization layer 217, and the pixel
electrode 231 is electrically connected to the thin film transistor
220 via contact holes formed in the planarization layer 217.
[0102] In the embodiment illustrated in FIG. 6, the OLED 230 formed
on the substrate 100 is sealed by the encapsulation substrate 300.
The encapsulation substrate 300 may be formed of various suitable
materials such as glass or plastic, as described above. Also, as
described above, pattern layers (refer to as the first pattern
layer 310 and the second pattern layer 320 in FIG. 5), and
insulating layers (refer to as the first insulating layer 330 and
the second insulating layer 340 in FIG. 5) are sequentially formed
on the inner surface of the encapsulation substrate 300, thereby
making it possible to provide a touch panel function.
[0103] A method of driving the organic light emitting display
device according to one embodiment of the present invention will
now be briefly described.
[0104] Referring back to FIGS. 4 and 5, when a finger, a conductive
object, or a high dielectric object approaches or touches a surface
of the organic light emitting display device according to one
embodiment of the present invention, the organic light emitting
display device interprets a change of an electrostatic charge
(capacitance) of conductors caused by such approach, thereby
sensing a touch. Based on the touch, an output is generated that
includes the coordinates of the touch on the surface, and the
pressing value.
[0105] To be more specific, as a constant voltage, a cathode
voltage flows in the counter electrode 235 (see FIG. 6) of the
display unit 200 which contacts the second insulating layer 340.
Thus, the first pattern layer 310 and the counter electrode 235
form one capacitor, and an electrostatic charge between the first
pattern layer 310 and the counter electrode 235 is maintained
constant. If a finger, a conductive object, or a high dielectric
object approaches or touches a surface above the encapsulation
substrate 300, the finger and the first pattern layer 310 form a
second capacitor. These two capacitors are effectively connected in
serial, and an entire electrostatic charge changes with a touch. By
using the position where the change of the electrostatic charge
occurs, and a magnitude of the change, a touch sensing system can
sense a touch, including the magnitude, and locate the position of
the touch.
[0106] FIG. 7A is a bottom schematic view of an encapsulation
substrate 400 and a first pattern layer 410 formed on a surface of
the encapsulation substrate 400 in an organic light emitting
display device according to another embodiment of the present
invention. FIG. 7B is a bottom schematic view of the first pattern
layer 410 of FIG. 7A, and a second pattern layer 420 on top of the
first pattern layer. FIG. 7C is a cross-sectional view taken along
line VII-VII in FIG. 7B. FIG. 7D is a bottom perspective schematic
view of the first pattern layer 410 and the second pattern layer
420 of FIG. 7B.
[0107] Referring to FIGS. 7A through 7D, the first pattern layer
410, a first insulating layer 430, the second pattern layer 420,
and a second insulating layer 440 are sequentially formed on a
surface of the encapsulation substrate 400, respectively, to face a
substrate.
[0108] In the embodiment illustrated in FIGS. 7A through 7D, the
first and second direction pattern units are not formed using a
single pattern layer. Instead, the first direction pattern units
411 are formed using the first pattern layer 410, while the second
direction pattern units 421 are formed using the second pattern
layer 420.
[0109] To be more specific, the first pattern layer 410 is formed
on the surface of the encapsulation substrate 400 to face the
substrate 100 (see FIG. 1). The first pattern layer 410 includes a
plurality of first direction pattern units 411 formed in parallel
rows along a first direction (the X direction in FIG. 7A).
Reference character A illustrated in FIG. 7A refers to one row of
first direction pattern units 411. As illustrated in FIG. 7A, the
first direction pattern units 411 are formed in parallel rows.
Here, in a number of embodiments, the pattern units (411 and 421)
are used as sensors (or sensor pads).
[0110] Reference character A in FIG. 7A, refers to one row of first
direction pattern units 411, where each row of first direction
pattern units 411 includes a plurality of main bodies 411a, a
plurality of connecting units 411b, an extending unit 411c, and a
contact unit 411d. The main bodies 411a have a diamond shape, and
are formed in parallel rows along the first direction, i.e., the X
direction in FIG. 7A. The connecting units 411b are formed between
each of the main bodies 411a, thereby connecting the main bodies
411a which are adjacent to each other. The extending unit 411c
extends from an end of each of the first direction pattern units
411. The extending unit 411c may be formed to extend in a
direction, e.g., a Y direction in FIG. 7A, so that a plurality of
extending units 411c may be arranged at one end of the
encapsulation substrate 400, that is, an upper end of the
encapsulation substrate 400 in FIG. 7A. The contact unit 411d is
formed at an end of the extending unit 411c, and is electrically
connected to a substrate contact unit of the data line of the
substrate via a conductive member.
[0111] Referring to FIGS. 7C and 7D, the first insulating layer 430
is formed on the surface of the encapsulation substrate 400 to face
the substrate and to cover the first pattern layer 410. The first
insulating layer 430 insulates the first pattern layer 410 from the
second pattern layer 420.
[0112] As illustrated in FIGS. 7B through 7D, the second pattern
layer 420 is formed on top of the first insulating layer 430 to
face the substrate 100 (see FIG. 1).
[0113] To be more specific, the second pattern layer 420 includes
the second direction pattern units 421 formed in parallel columns
along a second direction (the Y direction in FIG. 7B). Reference
character B illustrated in FIG. 7B indicates one column of second
direction pattern units 421. As illustrated in FIG. 7B, the second
direction pattern units 421 are formed in parallel columns. In FIG.
7B, dashed or hidden lines indicate the first pattern layer 410
illustrated in FIG. 7A.
[0114] In FIG. 7B, reference character B refers to one column of
second direction pattern units 421. Each column of second direction
pattern units 421 includes a plurality of main bodies 421a, an
extending unit 421c, and a contact unit 421d. The main bodies 421a
have a diamond shape, and are formed in a column along the second
direction, i.e., the Y direction in FIG. 7B. The connecting units
421b are formed between each of the main bodies 421a, thereby
connecting the main bodies 421a which are adjacent to each other.
The extending unit 421c extends from an end of each of the second
direction pattern units 421. The extending unit 421c may be formed
to extend in a direction, e.g., the Y direction in FIG. 7B, so that
a plurality of extending units 421c may be arranged at one end of
the encapsulation substrate 400, that is, an upper end of the
encapsulation substrate 400 in FIG. 7B. The contact unit 421d is
formed at an end of the extending unit 421c, and is electrically
connected to a substrate of the data line of the substrate via the
conductive member.
[0115] The first pattern layer 410 and the second pattern layer 420
may be formed of transparent materials such as ITO, IZO, ZnO, or
In2O3. Also, the first pattern layer 410 and the second pattern
layer 420 may be formed by using a photolithography process. That
is, an ITO layer formed by using a deposition method, a spin
coating method, a sputtering method, and/or an inkjet method may be
used to form the first pattern layer 410 and the second pattern
layer 420.
[0116] Referring now to FIG. 7C, a second insulating layer 440 is
formed on both the first insulating layer 430 to face the substrate
and on the second pattern layer 420. An opposite side of the second
insulating layer 440 faces (e.g., abuts) the display unit. The
second insulating layer 440 insulates the second pattern layer 420
from a display unit 200 (see FIG. 5).
[0117] In this manner, according to the embodiments of the present
invention, it is possible to provide a display panel with a touch
panel function without increasing the thickness of the display
panel. Also, because an electrostatic capacitive pattern is formed
on an inner surface of the encapsulation substrate, slim (or thin)
etching is possible.
[0118] While the present invention has been described in connection
with certain exemplary embodiments, it is to be understood that the
invention is not limited to the disclosed embodiments, but, on the
contrary, is intended to cover various modifications and equivalent
arrangements included within the spirit and scope of the appended
claims, and equivalents thereof.
* * * * *