U.S. patent application number 12/501612 was filed with the patent office on 2010-01-14 for cooling system.
This patent application is currently assigned to JOHNSON CONTROLS TECHNOLOGY COMPANY. Invention is credited to Lars Skovlund ANDERSEN, Paul Marie DE LARMINAT, Ivan JADRIC, Koman B. NAMBIAR.
Application Number | 20100006265 12/501612 |
Document ID | / |
Family ID | 43020404 |
Filed Date | 2010-01-14 |
United States Patent
Application |
20100006265 |
Kind Code |
A1 |
DE LARMINAT; Paul Marie ; et
al. |
January 14, 2010 |
COOLING SYSTEM
Abstract
A cooling system to cool an electronic component is disclosed.
The cooling system includes a first connection to receive
refrigerant, a region to transfer heat from an electronic component
to the refrigerant from the first connection, at least one of a
cooling coil, a cooling tube, or a cooling block positioned in the
region and in fluid communication with the first connection, and a
second connection to return refrigerant from the region to an
evaporator.
Inventors: |
DE LARMINAT; Paul Marie;
(Nantes, FR) ; JADRIC; Ivan; (York, PA) ;
ANDERSEN; Lars Skovlund; (Maarslet, DK) ; NAMBIAR;
Koman B.; (Frederick, MD) |
Correspondence
Address: |
MCNEES WALLACE & NURICK LLC
100 PINE STREET, P.O. BOX 1166
HARRISBURG
PA
17108-1166
US
|
Assignee: |
JOHNSON CONTROLS TECHNOLOGY
COMPANY
Holland
MI
|
Family ID: |
43020404 |
Appl. No.: |
12/501612 |
Filed: |
July 13, 2009 |
Related U.S. Patent Documents
|
|
|
|
|
|
Application
Number |
Filing Date |
Patent Number |
|
|
61080658 |
Jul 14, 2008 |
|
|
|
Current U.S.
Class: |
165/104.21 ;
165/104.33; 62/259.2; 62/291 |
Current CPC
Class: |
H02K 9/10 20130101; H02K
9/20 20130101; F25B 31/008 20130101; H05K 7/20936 20130101 |
Class at
Publication: |
165/104.21 ;
62/259.2; 62/291; 165/104.33 |
International
Class: |
F28D 15/00 20060101
F28D015/00; F25D 23/12 20060101 F25D023/12; F25D 21/14 20060101
F25D021/14 |
Claims
1. A cooling system to cool electronic components, the cooling
system comprising: a first connection to receive refrigerant; a
region to transfer heat from an electronic component to the
refrigerant from the first connection; at least one of a cooling
coil, a cooling tube, or a cooling block positioned in the region
and in fluid communication with the first connection; and a second
connection to return refrigerant from the region to an
evaporator.
2. The cooling system of claim 1, wherein the region comprises the
cooling coil.
3. The cooling system of claim 1, wherein the region comprises the
cooling tube.
4. The cooling system of claim 1, wherein the region comprises the
cooling block, the region being positioned within an enclosure of a
variable speed drive.
5. The cooling system of claim 1, wherein the region comprises the
cooling block, the region being positioned adjacent to an enclosure
of a variable speed drive.
6. The cooling system of claim 1, wherein the electronic component
is an electrical switching component of a variable speed drive.
7. The cooling system of claim 1, further comprising a variable
speed drive, the variable speed drive comprising the electronic
component and an enclosure.
8. The cooling system of claim 7, further comprising insulation
positioned between the enclosure and the evaporator, the insulation
being configured to prevent, reduce, or eliminate conduction
between the enclosure and the evaporator.
9. The cooling system of claim 7, further comprising a moisture
drain positioned between the enclosure and the evaporator, the
moisture drain being configured to drain condensed moisture from
the enclosure.
10. The cooling system of claim 7, further comprising at least one
gap in the enclosure.
11. A cooling system to cool an electronic component, the cooling
system comprising: a first connection to receive a liquid
refrigerant via a supply line; a region to transfer heat from the
electronic component to the refrigerant from the first connection;
a cooling coil positioned in the region and in fluid communication
with the first connection; a second connection to return vapor
refrigerant from the region to an evaporator via a return line; the
cooling coil being positioned to transfer heat from the electronic
component to the liquid refrigerant, the liquid refrigerant being
supplied from within the evaporator by the supply line; the cooling
coil further being positioned to phase change the liquid
refrigerant into the vapor refrigerant; and the cooling coil
further being positioned to supply the vapor refrigerant to the
return line; and, wherein the heat transferred from the electronic
component cools the electronic component.
12. The cooling system of claim 11, wherein the electronic
component is an electrical switching component.
13. The cooling system of claim 11, further comprising a variable
speed drive, the variable speed drive comprising the electronic
component and the enclosure.
14. The cooling system of claim 13, further comprising at least one
gap in the enclosure configured to prevent, reduce, or eliminate
moisture condensation.
15. A cooling system to cool an electronic component, the cooling
system comprising: a first connection to receive a liquid
refrigerant via a supply line; a region to transfer heat from the
electronic component to the refrigerant from the first connection;
at least one cooling tube or at least one cooling block positioned
in the region and in fluid communication with the first connection;
a second connection to return vapor refrigerant from the region to
an evaporator via a return line; the at least one cooling tube or
the at least one cooling block being positioned to transfer heat
from the electronic component to the liquid refrigerant, the liquid
refrigerant being supplied from within the evaporator by the supply
line; the at least one cooling tube or the at least one cooling
block further being positioned to phase change the liquid
refrigerant into the vapor refrigerant; and the at least one
cooling tube or the at least one cooling block further being
positioned to supply the vapor refrigerant to the return line; and,
wherein the heat transferred from the electronic component cools
the electronic component.
16. The cooling system of claim 15, comprising the at least one
cooling block, the at least one cooling block being disposed within
the enclosure.
17. The cooling system of claim 15, comprising the at least one
cooling block, the at least one cooling block being disposed
adjacent to the enclosure.
18. The cooling system of claim 15, wherein the electronic
component is an electrical switching component.
19. The cooling system of claim 15, further comprising insulation
positioned between the enclosure and the evaporator, the insulation
being configured to prevent, reduce, or eliminate conduction
between the enclosure and the evaporator.
20. The cooling system of claim 15, further comprising a moisture
drain positioned between the enclosure and the evaporator, the
moisture drain being configured to drain condensed moisture from
the enclosure.
Description
CROSS-REFERENCE TO RELATED APPLICATIONS
[0001] This application claims priority from and the benefit of
U.S. Provisional Application No. 61/080,658, entitled "MOTOR
APPLICATIONS," filed Jul. 14, 2008, which is hereby incorporated by
reference.
BACKGROUND
[0002] The application relates generally to cooling systems. The
application relates more specifically to cooling of at least one
component in a variable speed drive.
[0003] A Variable Speed Drive (VSD) is a system that can control
the speed of an alternating current (AC) electric motor by
controlling the frequency and voltage of the electrical power
supplied to the motor. For example, VSDs may be used in various
applications, such as with motors for fans in ventilation systems
with motors for compressors or pumps, and in machine tool drives.
Operation of VSDs can generate heat. Heat can be generated by
electronic components of VSDs. During operation, the heat can
continue to build up within the VSDs. Ultimately, a build up of too
much heat can result in substantial operational issues.
[0004] Conventional chilled liquid systems used in heating,
ventilation, air conditioning, and refrigeration systems include an
evaporator to effect or implement a transfer of thermal energy
between the refrigerant of the system and another fluid, generally
a liquid to be cooled. One type of evaporator includes a shell with
a plurality of tubes forming a tube bundle(s) inside the shell. The
fluid to be cooled is circulated inside the tubes and the
refrigerant is brought into contact with the outer or exterior
surfaces of the tubes, resulting in a transfer of thermal energy
between the fluid to be cooled and the refrigerant. The heat
transferred to the refrigerant from the fluid to be cooled causes
the refrigerant to undergo a phase change to a vapor, that is, the
refrigerant is boiled on the outside of the tubes. For example,
refrigerant can be deposited onto the exterior surfaces of the
tubes by spraying or other similar techniques in what is commonly
referred to as a "falling film" evaporator. In a further example,
the exterior surfaces of the tubes can be fully or partially
immersed in liquid refrigerant in what is commonly referred to as a
"flooded" evaporator. In yet another example, a portion of the
tubes can have refrigerant deposited on the exterior surfaces and
another portion of the tube bundle can be immersed in liquid
refrigerant in what is commonly referred to as a "hybrid falling
film" evaporator.
[0005] As a result of the transfer of thermal energy from the fluid
being cooled, the refrigerant is heated and converted to a vapor
state, which is then returned to a compressor where the vapor is
compressed, to begin another refrigerant cycle. The cooled fluid
can be circulated to a plurality of heat exchangers located
throughout a building. Warmer air from the building is passed over
the heat exchangers where the cooled fluid is warmed while cooling
the air for the building. The fluid warmed by the building air is
returned to the evaporator to repeat the process.
SUMMARY
[0006] The present invention relates to a cooling system to cool an
electronic component. The cooling system includes a first
connection to receive refrigerant, a region to transfer heat from
an electronic component to the refrigerant from the first
connection, at least one of a cooling coil, a cooling tube, or a
cooling block positioned in the region and in fluid communication
with the first connection, and a second connection to return
refrigerant from the region to an evaporator.
[0007] The present invention also relates to a cooling system to
cool an electronic component. The cooling system includes a first
connection to receive a liquid refrigerant via a supply line, a
region to transfer heat from the electronic component to the
refrigerant from the first connection, a cooling coil positioned in
the region and in fluid communication with the first connection, a
second connection to return vapor refrigerant from the region to an
evaporator via a return line, the cooling coil being positioned to
transfer heat from the electronic component to the liquid
refrigerant, the liquid refrigerant being supplied from within the
evaporator by the supply line, the cooling coil further being
positioned to phase change the liquid refrigerant into the vapor
refrigerant, and the cooling coil further being positioned to
supply the vapor refrigerant to the return line. In the exemplary
embodiment, the heat transferred from the electronic component
cools the electronic component.
[0008] The present invention also relates to a cooling system to
cool an electronic component. The cooling system includes a first
connection to receive a liquid refrigerant via a supply line, a
region to transfer heat from the electronic component to the
refrigerant from the first connection, at least one cooling tube or
at least one cooling block positioned in the region and in fluid
communication with the first connection, a second connection to
return vapor refrigerant from the region to an evaporator via a
return line, the at least one cooling tube or the at least one
cooling block being positioned to transfer heat from the electronic
component to the liquid refrigerant, the liquid refrigerant being
supplied from within the evaporator by the supply line, the at
least one cooling tube or the at least one cooling block further
being positioned to phase change the liquid refrigerant into the
vapor refrigerant, and the at least one cooling tube or the at
least one cooling block further being positioned to supply the
vapor refrigerant to the return line. In the exemplary embodiment,
the heat transferred from the electronic component cools the
electronic component.
BRIEF DESCRIPTION OF THE FIGURES
[0009] FIG. 1 shows an exemplary embodiment for a heating,
ventilation and air conditioning system in a commercial
setting.
[0010] FIG. 2 shows an isometric view of an exemplary vapor
compression system.
[0011] FIG. 3 schematically illustrates an exemplary embodiment of
a HVAC system.
[0012] FIG. 4 shows an exemplary embodiment of a cooling system at
least one component of a variable speed drive.
[0013] FIG. 5 shows an exemplary cooling coil for the exemplary
embodiment of FIG. 4.
[0014] FIG. 6 shows another exemplary embodiment of cooling system
at least one component of a variable speed drive.
[0015] FIG. 7 shows a partial isometric view of a shield and
variable speed drive components from the exemplary embodiment of
FIG. 6.
[0016] FIG. 8 shows a partial view of another exemplary embodiment
of a cooling system for at least one component of a variable speed
drive.
[0017] FIG. 9 shows a partial view of another exemplary embodiment
of cooling system for at least one component of a variable speed
drive.
[0018] FIG. 10 shows an exemplary cooling coil for the exemplary
embodiment of FIG. 8 or FIG. 9.
DETAILED DESCRIPTION OF THE EXEMPLARY EMBODIMENTS
[0019] FIG. 1 shows an exemplary environment for a heating,
ventilation and air conditioning (HVAC) system 10 incorporating a
chilled liquid system in a building 12 for a typical commercial
setting. System 10 can include a vapor compression system 14 that
can supply a chilled liquid which may be used to cool building 12.
System 10 can include a boiler 16 to supply a heated liquid that
may be used to heat building 12, and an air distribution system
which circulates air through building 12. The air distribution
system can also include an air return duct 18, an air supply duct
20 and an air handler 22. Air handler 22 can include a heat
exchanger that is connected to boiler 16 and vapor compression
system 14 by conduits 24. The heat exchanger in air handler 22 may
receive either heated liquid from boiler 16 or chilled liquid from
vapor compression system 14, depending on the mode of operation of
system 10. System 10 is shown with a separate air handler on each
floor of building 12, but it is appreciated that the components may
be shared between or among floors.
[0020] FIGS. 2 and 3 show an exemplary vapor compression system 14
that can be used in an HVAC system, such as HVAC system 10. Vapor
compression system 14 can circulate a refrigerant through a
compressor 32 driven by a motor 50, a condenser 34, expansion
device(s) 36, and a liquid chiller or evaporator 38. Vapor
compression system 14 can also include a control panel 40 that can
include an analog to digital (A/D) converter 42, a microprocessor
44, a non-volatile memory 46, and an interface board 48. Some
examples of fluids that may be used as refrigerants in vapor
compression system 14 are: hydrofluorocarbon (HFC) based
refrigerants, for example, R-410A, R-407C, R-134a; hydrofluoro
olefin (HFO); "natural" refrigerants like ammonia (NH.sub.3),
R-717, carbon dioxide (CO.sub.2), R-744, or hydrocarbon based
refrigerants; water vapor or any other suitable type of
refrigerant. In an exemplary embodiment, vapor compression system
14 may use one or more of each of variable speed drives (VSDs) 52,
motors 50, compressors 32, condensers 34 and/or evaporators 38.
[0021] Motor 50 used with compressor 32 can be powered by VSD 52.
VSD 52 receives AC power having a particular fixed line voltage and
fixed line frequency from the AC power source and provides power
having a variable voltage and frequency to motor 50. Motor 50 can
include any type of electric motor that can be powered by VSD 52.
For example, motor 50 can be a switched reluctance motor, an
induction motor, an electronically commutated permanent magnet
motor or any other suitable motor type. VSD 52 incorporates several
stages to provide speed control to motor 50. VSD 52 may include a
rectifier or converter stage, a DC link stage, and an inverter
stage. The rectifier or converter stage, also known as the
converter, converts the fixed line frequency, fixed line voltage AC
power from an AC power source into DC power. The DC link stage,
also known as the DC link, filters the DC power from the converter.
Finally, the inverter stage, also known as the inverter, is
connected in parallel with the DC link and converts the DC power
from the DC link into a variable frequency, variable voltage AC
power.
[0022] Compressor 32 compresses a refrigerant vapor and delivers
the vapor to condenser 34 through a discharge line. Compressor 32
can be a centrifugal compressor, screw compressor, reciprocating
compressor, rotary compressor, swing link compressor, scroll
compressor, turbine compressor, or any other suitable compressor.
The refrigerant vapor delivered by compressor 32 to condenser 34
transfers heat to a fluid, for example, water or air. The
refrigerant vapor condenses to a refrigerant liquid in condenser 34
as a result of the heat transfer with the fluid. The liquid
refrigerant from condenser 34 flows through expansion device 36 to
evaporator 38. In the exemplary embodiment shown in FIG. 3,
condenser 34 is water cooled and includes a tube bundle 54
connected to a cooling tower 56.
[0023] The liquid refrigerant delivered to evaporator 38 absorbs
heat from another fluid, which may or may not be the same type of
fluid used for condenser 34, and undergoes a phase change to a
refrigerant vapor. In the exemplary embodiment shown in FIG. 3,
evaporator 38 includes a tube bundle having a supply line 60S and a
return line 60R connected to a cooling load 62. A process fluid,
for example, water, ethylene glycol, calcium chloride brine, sodium
chloride brine, or any other suitable fluid, enters evaporator 38
via return line 60R and exits evaporator 38 via supply line 60S.
Evaporator 38 lowers the temperature of the process fluid in the
tubes. The tube bundle in evaporator 38 can include a plurality of
tubes and/or a plurality of tube bundles. The vapor refrigerant
exits evaporator 38 and returns to compressor 32 by a suction line
to complete the cycle or loop.
[0024] FIG. 4 shows an exemplary embodiment of a cooling system for
cooling at least one electronic component 64 of VSD 52 by
transferring heat from VSD 52 to evaporator 38. In an exemplary
embodiment, electronic components 64 can be high frequency
electrical switching components (for example, insulated gate
bipolar transistors), which generate heat within VSD 52. In another
exemplary embodiment, the cooling system may be used to cool other
systems, subsystems, or components of the HVAC system, such as the
motor and/or control panel and associated electronic components. In
one embodiment, components 64 may be cooled by a thermosiphon. In
the thermosiphon, convective movement of a liquid can begin when
liquid in a loop is heated. The heating of the liquid causes the
liquid to expand and become less dense. This results in heated
liquid being at the top of the loop and cooler liquid being at the
bottom of the loop. Convection can move the heated liquid upwards
as it is replaced by cooler liquid returning by gravity. Increased
flow of the liquid in such a thermosiphon can decrease hydraulic
resistance.
[0025] Referring back to FIG. 4, refrigerant from evaporator 38 is
directed by gravity toward VSD 52 via supply line 60S with the
heated refrigerant expanding upon heat being transferred from
components 64 to the refrigerant. In an exemplary embodiment, the
refrigerant phase changes to gas. Heated refrigerant can be
returned to evaporator 38 via return line 60R. FIG. 5 shows an
exemplary cooling coil 60 for VSD 52 cooling. In an exemplary
embodiment, cooling coils 60 may be at or near a thermal interface
region 68. Thermal interface region 68 is where most, if not all,
of the heat transfer from electrical components 64 occurs. Cooling
coils 60 increase heat transfer by increasing surface area of coils
in contact with or proximal to thermal interface region 68. In one
embodiment, cooling coils 60 are external to an enclosure 70 (for
example, a box) to avoid moisture condensation within the
enclosure. In a further embodiment, enclosure 70 includes gaps,
spacings, other breathable features, or a desiccant to prevent
moisture condensation. Additionally or alternatively, refrigerant
from condenser 34 may be used to cool components 64 of VSD 52. In a
further embodiment, refrigerant at condenser pressure may be pumped
by making use of thermosiphon systems.
[0026] FIGS. 6 and 7 illustrate an exemplary embodiment of a
cooling system for cooling at least one electronic component 64 of
VSD 52 by transferring heat from the component to evaporator 38.
Evaporator 38 includes a shield 72 provided to separate liquid
refrigerant entrained in vapor. For example, when refrigerant vapor
with entrained liquid, such as from a splash from a pool of boiling
refrigerant comes into contact with shield 72, the entrained liquid
can separate from the vapor thereby allowing the vapor to continue
around the shield 72. Components 64 of VSD 52 are enclosed within
enclosure 70. Components 64 include cooling tubes 74, which extend
through enclosure 70 into shell 76 of evaporator 38. Cooling tubes
74 act as thermal interface region 68 facilitating heat transfer
from components 64 of VSD 52 to refrigerant fluid in evaporator 38.
In one embodiment, shield 72 includes openings 78 that operate as a
demister to aggregate liquid droplets into larger particles that
can return by gravity to a sump of evaporator 38, improving the
distribution of the flow of refrigerant fluid inside evaporator 38.
In addition, shield 72 can restrict flow of refrigerant liquid into
the compressor suction line (not shown) at the top of shell 76. In
one embodiment, enclosure 70, tubes 74, and/or tube bundles may be
attached to shell 76 by insulation 80. Positioning of insulation 80
may permit prevention, reduction, and/or elimination of thermal
conduction between enclosure 70 and evaporator 38. As will be
appreciated, other heat transfer surfaces suitable for transferring
heat from components 64 of VSD 52 may be used.
[0027] FIG. 8 shows a partial view of an embodiment for cooling VSD
52 by transferring heat to evaporator 38. VSD 52 can include a
thermal interface region 68 having a cooling block 82 for
transferring heat from components 64 of VSD 52 to evaporator 38. In
an exemplary embodiment, refrigerant may be provided as in the
other embodiments disclosed herein or any other suitable source. In
an exemplary embodiment, cooling block 82 may surround a coil.
Cooling block 82 may be made of a material and have a design
configured to increase the conduction of heat from the dissipation
in components 64 to the refrigerant. In one embodiment, cooling
block 82 is positioned within the interior of enclosure 70.
Condensation, which occurs predominantly on shell 76 of evaporator
38, can be drained away from the electrical components of VSD 52
via a moisture drain 84 positioned between enclosure 70 and
evaporator 38. Referring to FIG. 9, alternatively, cooling block 82
is positioned adjacent to enclosure 70. Cooling block 82 being
located adjacent to enclosure 70 may permit prevention, reduction,
and/or elimination of leaks in non-pressure vessel enclosures
because the location of cooling block 82 outside of enclosure 70
can limit any leaking refrigerant from cooling block 82 from
entering enclosure. FIG. 10 shows an exemplary cooling coil 60 and
cooling block 82 for VSD 52 cooling. Cooling coil 60 and cooling
block 82 shown in FIG. 10 can be included in the embodiment shown
in FIG. 8 or FIG. 9. Cooling coil 60 and cooling block 82 can form
a portion or all of thermal interface region 68.
[0028] While only certain features and embodiments of the invention
have been shown and described, many modifications and changes may
occur to those skilled in the art (for example, variations in
sizes, dimensions, structures, shapes and proportions of the
various elements, values of parameters (for example, temperatures,
pressures, etc.), mounting arrangements, use of materials, colors,
orientations, etc.) without materially departing from the novel
teachings and advantages of the subject matter recited in the
claims. The order or sequence of any process or method steps may be
varied or re-sequenced according to alternative embodiments. It is,
therefore, to be understood that the appended claims are intended
to cover all such modifications and changes as fall within the true
spirit of the invention. Furthermore, in an effort to provide a
concise description of the exemplary embodiments, all features of
an actual implementation may not have been described (that is,
those unrelated to the presently contemplated best mode of carrying
out the invention, or those unrelated to enabling the claimed
invention). It should be appreciated that in the development of any
such actual implementation, as in any engineering or design
project, numerous implementation specific decisions may be made.
Such a development effort might be complex and time consuming, but
would nevertheless be a routine undertaking of design, fabrication,
and manufacture for those of ordinary skill having the benefit of
this disclosure, without undue experimentation.
* * * * *